Method of manufacturing a biasing probe module
By first adsorbing the unattached areas and fixing the circuit connection substrate during the fabrication process of the bias detector module, the problems of material spillage and poor mounting accuracy were solved, the imaging quality and yield of the detector module were improved, and low-cost manufacturing was achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NEUSOFT MEDICAL SYST CO LTD
- Filing Date
- 2026-01-13
- Publication Date
- 2026-05-29
AI Technical Summary
In the fabrication process of the bias detector module, problems with material pouring and mounting accuracy led to a decrease in imaging quality.
By first adsorbing the area of the unattached circuit connection substrate on the back of the mounting substrate and fixing the circuit connection substrate before chip mounting, the bias analog-to-digital converter area is connected to the pads on the circuit connection substrate using conductive leads, ensuring the precise positioning of each layer of materials.
This improved the mounting accuracy and yield of the bias detector module, reduced the impact of pixel size differences on imaging, and lowered the manufacturing cost.
Smart Images
Figure CN122121308A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of medical device technology, and in particular to a method for fabricating a biased detector module. Background Technology
[0002] In CT (Computed Tomography) technology, the detector module is the core component of the computed tomography system, responsible for converting X-rays that penetrate the human body into electrical signals in real time, thereby reconstructing tomographic images.
[0003] By creating clearance spaces to accommodate adjacent bias detector modules, bias detector modules can reduce the thickness accumulation of components such as substrates, bias analog-to-digital converters, protective tungsten sheets, and thermally conductive adhesives, thereby reducing the impact of pixel size differences on imaging.
[0004] Traditional overlay detector modules are assembled by placing smaller areas of material on top of larger areas, layer by layer, to form the detector module. When fabricating offset detector modules using the aforementioned assembly process, the difference in the center of gravity of each layer of material in the offset detector module can cause material tipping and inaccuracy issues during the assembly process.
[0005] In summary, how to avoid material tipping during the fabrication of bias detector modules and improve mounting accuracy is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention
[0006] In view of this, the purpose of this application is to provide a method for fabricating a bias detector module, which avoids material tipping during the fabrication process of the bias detector module and improves the mounting accuracy.
[0007] To achieve the above objectives, this application provides the following technical solution: A method for fabricating a biased detector module includes: mounting a circuit connection substrate onto a mounting area on the back side of a mounting substrate; the circuit connection substrate partially overlaps with the mounting substrate; adsorbing the area on the back side of the mounting substrate where the circuit connection substrate is not mounted onto the surface of a first mounting platform; mounting a chip onto the mounting area on the front side of the mounting substrate; fixing the circuit connection substrate and supporting the area on the back side of the mounting substrate where the circuit connection substrate is not mounted; and connecting the biased analog-to-digital converter area on the chip to the pads on the circuit connection substrate using conductive leads.
[0008] Optionally, mounting the circuit connection substrate to the back mounting area of the mounting substrate includes: if the center of gravity of the circuit connection substrate is not located in the back mounting area of the mounting substrate, then mounting the circuit connection substrate to the back mounting area of the mounting substrate using a first auxiliary workpiece; wherein: the first auxiliary workpiece acts on the circuit connection substrate to make the center of the first auxiliary workpiece and the circuit connection substrate located in the back mounting area of the mounting substrate, or, when mounting the circuit connection substrate in the back mounting area of the mounting substrate, the center of gravity of the circuit connection substrate is located on the first auxiliary workpiece; if the center of gravity of the circuit connection substrate is located in the back mounting area of the mounting substrate, then applying adhesive to the back mounting area of the mounting substrate, and mounting the circuit connection substrate in the back mounting area of the mounting substrate.
[0009] Optionally, mounting the circuit connection substrate to the back mounting area of the mounting substrate using a first auxiliary workpiece includes: installing a counterweight material on a target area of the circuit connection substrate using a double-sided adhesive sheet, such that the center of gravity of the circuit connection substrate and the counterweight material is located within the back mounting area of the mounting substrate; the target area is the area on the circuit connection substrate opposite to the area mounted on the mounting substrate; applying adhesive to the back mounting area of the mounting substrate; mounting the circuit connection substrate with the counterweight material on the back mounting area of the mounting substrate; curing the adhesive; and removing the counterweight material and the double-sided adhesive sheet.
[0010] Optionally, before adsorbing the area on the back of the mounting substrate where the circuit connection substrate is not attached to the surface of the first mounting platform, the method further includes: using a second auxiliary workpiece to place the mounting substrate on the first mounting platform, and making the area on the back of the mounting substrate where the circuit connection substrate is not attached to the surface of the first mounting platform adhere to the surface of the first mounting platform.
[0011] Optionally, the second auxiliary workpiece is provided with a first through hole, the size of which is larger than the size of the first mounting platform and smaller than the size of the mounting substrate, so that the second auxiliary workpiece can carry the mounting substrate and can move along the height direction on the first mounting platform through the first through hole; before mounting the chip in the mounting area on the front side of the mounting substrate, the method further includes: controlling the second auxiliary workpiece to descend along the height direction of the first mounting platform to avoid mounting space.
[0012] Optionally, the second auxiliary workpiece is further provided with a first groove, which matches the circuit connection substrate and is used to accommodate the circuit connection substrate.
[0013] Optionally, fixing the circuit connection substrate and supporting the area on the back of the mounting substrate where the circuit connection substrate is not attached includes: fixing the circuit connection substrate with a fixing base and supporting the area on the back of the mounting substrate where the circuit connection substrate is not attached.
[0014] Optionally, the fixing base is a vacuum adsorption base, which includes a vacuum through hole and a boss. The size of the vacuum through hole is smaller than the size of the circuit connection substrate. Fixing the circuit connection substrate using the fixing base and supporting the area on the back of the mounting substrate where the circuit connection substrate is not attached includes: using the vacuum through hole of the vacuum adsorption base to adsorb the circuit connection substrate to fix it, and using the boss to support the area on the back of the mounting substrate where the circuit connection substrate is not attached.
[0015] Optionally, connecting the bias analog-to-digital converter region on the chip to the pads on the circuit connection substrate using conductive leads includes: connecting the bias analog-to-digital converter region on the chip to the pads on the circuit connection substrate using the conductive leads via a wire bonding process; applying potting compound to the conductive leads using a dispensing machine to cover the conductive leads with the potting compound and then curing the potting compound.
[0016] Optionally, after connecting the bias analog-to-digital converter region on the chip to the pads on the circuit connection substrate using conductive leads, the method further includes: adsorbing the area on the back of the mounting substrate where the circuit connection substrate is not mounted onto the surface of a second mounting platform, and mounting a scintillator on the photoelectric conversion array region on the chip.
[0017] Optionally, before adsorbing the area on the back of the mounting substrate where the circuit connection substrate is not attached to the second mounting platform surface, the method further includes: using a third auxiliary workpiece to place the mounting substrate on the second mounting platform, and making the area on the back of the mounting substrate where the circuit connection substrate is not attached to the second mounting platform surface adhere to the second mounting platform surface.
[0018] Optionally, the third auxiliary workpiece is provided with a second through hole, the size of which is larger than the size of the second mounting platform and smaller than the size of the mounting substrate, so that the third auxiliary workpiece can carry the mounting substrate and can move along the height direction on the second mounting platform through the second through hole; before mounting the scintillator in the photoelectric conversion array region on the chip, the method further includes: controlling the third auxiliary workpiece to descend along the height direction of the second mounting platform to avoid mounting space.
[0019] Optionally, the third auxiliary workpiece is further provided with a second groove, which matches the circuit connection substrate and is used to accommodate the circuit connection substrate.
[0020] Optionally, mounting a scintillator on the photoelectric conversion array region of the chip includes: applying UV adhesive at multiple locations in the photoelectric conversion array region, using the UV adhesive to mount the scintillator onto the surface of the photoelectric conversion array region; the gap between the scintillator and the photoelectric conversion array region is within a preset range; filling the gap between the scintillator and the photoelectric conversion array region with optical adhesive, and curing the optical adhesive.
[0021] This application provides a method for fabricating a biased detector module, comprising: mounting a circuit connection substrate to a mounting area on the back of a mounting substrate; the circuit connection substrate and the mounting substrate partially overlap; adsorbing the area on the back of the mounting substrate where the circuit connection substrate is not mounted onto the surface of a first mounting platform; mounting a chip on the mounting area on the front of the mounting substrate; fixing the circuit connection substrate and supporting the area on the back of the mounting substrate where the circuit connection substrate is not mounted; and connecting the biased analog-to-digital converter area on the chip to the pads on the circuit connection substrate using conductive leads.
[0022] The above-disclosed technical solution solves the problem of material misalignment in bias detector modules by first adsorbing the area of the back of the mounting substrate without a circuit connection substrate onto the first mounting platform before mounting the chip on the front mounting area of the mounting substrate, and by fixing the circuit connection substrate before connecting the bias analog-to-digital converter area on the chip to the pads on the circuit connection substrate using wire leads, and by supporting the area of the back of the mounting substrate without a circuit connection substrate. This avoids material tilting during the fabrication of bias detector modules, ensures the positional accuracy and function of each material, improves the yield of bias detector modules, and enables the fabrication of bias detector modules with lower process costs.
[0023] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0024] Figure 1 A flowchart illustrating a method for fabricating a biased detector module according to some embodiments of this application; Figure 2 This is a schematic diagram illustrating the mounting of a circuit connection substrate in the mounting area on the back of a mounting substrate, as provided in some embodiments of this application. Figure 3 This is a schematic diagram illustrating the mounting of a circuit connection substrate in the mounting area on the back of a mounting substrate, as provided in some embodiments of this application. Figure 4 This is a schematic diagram illustrating the mounting of a circuit connection substrate in the mounting area on the back of a mounting substrate, as provided in some embodiments of this application. Figure 5 A schematic diagram illustrating the placement of a mounting substrate on a first mounting platform using a second auxiliary workpiece, provided for some embodiments of this application; Figure 6 This is a schematic diagram illustrating the mounting of chips in the front mounting area of a mounting substrate, provided for some embodiments of this application. Figure 7 This is a schematic diagram showing the chip mounted on the front mounting area of a mounting substrate, provided in some embodiments of this application. Figure 8 A schematic diagram illustrating the use of conductive leads to connect the bias analog-to-digital converter region on a chip to pads on a circuit connection substrate, as provided in some embodiments of this application. Figure 9 This is a schematic diagram illustrating the encapsulation of conductive leads using potting compound, provided for some embodiments of this application. Figure 10 A schematic diagram of mounting a scintillator on a photoelectric conversion array region on a chip, provided in some embodiments of this application; Figure 11 This is a schematic diagram of the structure of a biased detector module prepared according to some embodiments of this application. Detailed Implementation
[0025] In CT technology, the detector module is the core component of the computed tomography (CT) system, responsible for converting X-rays penetrating the human body into electrical signals in real time, thereby reconstructing tomographic images. Because offset detector modules aim to effectively reduce the thickness accumulation of components such as the substrate, offset analog-to-digital converter, protective tungsten sheet, and thermally conductive adhesive, the thickness of the overlapping area during module assembly is compressed, increasing the manufacturing difficulty of this type of module.
[0026] Traditional overlay detector modules use a direct stacking method, encapsulating each layer from the bottom up. Specifically, smaller materials are placed on top of larger materials, stacked layer by layer, without any issue of center of gravity shift. However, offset detector modules, due to the difference in the center of gravity of each layer, exhibit eccentricity during mounting. Using traditional mounting methods can lead to material tilting and inaccurate results.
[0027] To address this, this application provides a method for fabricating a biased detector module. A circuit connection substrate is mounted onto the back mounting area of a mounting substrate, with the circuit connection substrate partially overlapping the mounting substrate. This creates a clearance space between the non-overlapping areas of the circuit connection substrate and the mounting substrate, allowing the module to be stacked on top of adjacent biased detector modules, thereby reducing the height difference between the two stacked modules. Before mounting the chip on the front mounting area of the mounting substrate, the area on the back of the mounting substrate where the circuit connection substrate is not mounted is first attached to a first mounting platform. This platform is used to mount the chip, preventing tilting due to material eccentricity during chip mounting and improving chip mounting accuracy. Then, before connecting the biased analog-to-digital converter area on the chip to the pads on the circuit connection substrate using conductive leads, the circuit connection substrate is fixed, and the area on the back of the mounting substrate where the circuit connection substrate is not mounted is supported. This prevents tilting when connecting the analog-to-digital converter area to the pads on the circuit connection substrate using conductive leads, improving the accuracy of conductive lead placement and packaging. Therefore, this application can solve the problem of material eccentricity caused by the bias detector module, avoid material tilting during the fabrication of the bias detector module, ensure the positional accuracy and function of each material, improve the yield of the bias detector module, and realize the fabrication of the bias detector module with lower process cost.
[0028] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.
[0029] See Figures 1 to 11 ,in, Figure 1 The flowchart illustrates a method for fabricating a biased detector module according to some embodiments of this application. Figure 2 This is a schematic diagram illustrating the mounting of a circuit connection substrate in the mounting area on the back of a mounting substrate, as provided in some embodiments of this application. Figure 3 This is a schematic diagram illustrating the mounting of a circuit connection substrate in the mounting area on the back of a mounting substrate, as provided in some embodiments of this application. Figure 4 This is a schematic diagram illustrating the mounting of a circuit connection substrate in the mounting area on the back of a mounting substrate, as provided in some embodiments of this application. Figure 5 This is a schematic diagram illustrating the placement of a mounting substrate on a first mounting platform using a second auxiliary workpiece, as provided in some embodiments of this application. Figure 6 This is a schematic diagram illustrating the mounting of chips in the front mounting area of a mounting substrate, provided in some embodiments of this application. Figure 7 This is a schematic diagram showing the chip mounted on the front mounting area of a mounting substrate, provided in some embodiments of this application. Figure 8This is a schematic diagram illustrating the use of conductive leads to connect the bias analog-to-digital converter region on a chip to pads on a circuit connection substrate, as provided in some embodiments of this application. Figure 9 This is a schematic diagram illustrating the encapsulation of conductive leads using potting compound, provided in some embodiments of this application. Figure 10 This is a schematic diagram illustrating the mounting of a scintillator on a photoelectric conversion array region on a chip, provided in some embodiments of this application. Figure 11 This is a schematic diagram of the structure of a biased detector module prepared according to some embodiments of this application.
[0030] This application provides a method for fabricating a biased detector module, which may include the following steps: S11: Mount the circuit connection substrate onto the mounting area on the back of the mounting substrate; the circuit connection substrate and the mounting substrate partially overlap.
[0031] In some embodiments of this application, the circuit connection substrate 2 can be first mounted on the mounting area on the back of the mounting substrate 1. Specifically, the mounting area on the back of the mounting substrate 1 is the area used to mount the circuit connection substrate 2. It should be noted that a connector 3 can be provided on the back of the circuit connection substrate 2. The connector 3 collects data received from the circuit connection substrate 2 and transmits it to an external device. The connector 3 and the circuit connection substrate 2 can be an integral structure, or the connector 3 can be first provided on the circuit connection substrate 2, and then the circuit connection substrate 2 with the connector 3 is mounted to the back of the mounting substrate 1.
[0032] Specifically, the circuit connection substrate 2 can be attached to the back mounting area of the mounting substrate 1 using adhesive. The adhesive can be cured by heating or moisture. After the circuit connection substrate 2 is attached to the back mounting area of the mounting substrate 1, the circuit connection substrate 2 and the mounting substrate 1 partially overlap. The non-overlapping areas of the circuit connection substrate 2 and the mounting substrate 1 form a clearance space. This clearance space is used to stack on top of adjacent bias detector modules. That is, this clearance space provides a partial accommodating space for adjacent bias detector modules, facilitating the stacking and connection between bias detector modules. This reduces the height difference between the two bias detector modules after stacking, making the radii of the detector modules in different layers to the X-ray tube focal point closer, thereby reducing the impact of pixel size differences on imaging.
[0033] S12: The area on the back of the mounting substrate where the circuit connection substrate is not mounted is adsorbed onto the surface of the first mounting platform, and the chip is mounted on the mounting area on the front of the mounting substrate.
[0034] After mounting the circuit connection substrate 2 on the back mounting area of the mounting substrate 1, in the mounter, the area of the back of the mounting substrate 1 where the circuit connection substrate is not mounted can be adsorbed on the surface of the first mounting platform 30, so as to fix the mounting substrate 1 with the circuit connection substrate 2 mounted on the back mounting area by using the first mounting platform 30, thereby avoiding the material tilt caused by the eccentricity of the mounted material when mounting the chip 4 on the front mounting area of the mounting substrate 1 and improving the chip mounting accuracy.
[0035] Among them, the first mounting platform 30 can specifically be a first vacuum mounting platform, and the first vacuum mounting platform can include a first vacuum through hole 301. The size of the first vacuum through hole 301 is smaller than the size of the mounting substrate 1. As Figure 5 shown, the size of the first vacuum through hole 301 is L1 (as Figure 5 shown, the length of the first vacuum through hole 301 in the x direction is L1), and the size of the mounting substrate 1 is L2 (as Figure 5 shown, the length of the mounting substrate 1 in the x direction is L2), L1 < L2. Specifically, the size of the area of the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted is L3 (as Figure 5 shown, the length of the area of the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted in the x direction is L3), L1 < L3. The area of the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted is fitted at the first vacuum through hole 301, and the mounting substrate 1 is adsorbed and fixed on the first vacuum mounting platform by using the first vacuum through hole 301.
[0036] After adsorbing the area of the back of the mounting substrate 1 where the circuit connection substrate is not mounted on the surface of the first mounting platform 30, an adhesive can be coated on the front mounting area of the mounting substrate 1. Then, the chip 4 is mounted on the front mounting area of the mounting substrate 1 by using the mounting head, and the adhesive is cured by heating or moisture or other means. Among them, the front mounting area of the mounting substrate 1 is the area for mounting the chip 4. The chip 4 includes a bias analog-to-digital converter area (for performing analog-to-digital conversion) and a photoelectric conversion array area (for performing photoelectric conversion). The bias analog-to-digital converter area is close to the circuit connection substrate 2, and the photoelectric conversion array area is far from the circuit connection substrate 2. It should be noted that the adhesive can be coated on the front mounting area of the mounting substrate 1 after mounting the circuit connection substrate 2 on the back mounting area of the mounting substrate 1, or the adhesive can be coated on the front mounting area of the mounting substrate 1 after fitting the area of the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted with the surface of the first mounting platform 30.
[0037] After mounting the chip 4 on the front mounting area of the mounting substrate 1, the mounting substrate 1 with the circuit connection substrate 2 mounted on the back and the chip 4 mounted on the front can be removed from the mounter for the next preparation process.
[0038] The first mounting platform 30 can prevent tilting due to eccentricity when mounting chip 4 on the front side of the mounting substrate 1, thereby improving the mounting accuracy of chip 4 and ensuring the functionality of chip 4.
[0039] S13: Fix the circuit connection substrate and support the area on the back of the mounting substrate where the circuit connection substrate is not attached. Use conductive leads to connect the bias analog-to-digital converter area on the chip to the pads on the circuit connection substrate.
[0040] After mounting the chip 4 on the front side of the mounting substrate 1, the mounting substrate 1, with the chip 4 mounted on the front and the circuit connection substrate 2 mounted on the back, can be transferred to a gold wire ball soldering machine. Then, the circuit connection substrate 2 is fixed and the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted is supported to prevent tilting due to eccentricity during the connection of the bias analog-to-digital converter area on the chip 4 to the pads on the circuit connection substrate 2 using conductive leads 5. This improves the connection accuracy of the conductive leads 5 and ensures the function of the wire leads.
[0041] Based on the above, one end of the conductive lead 5 (specifically, a metal lead) is connected to the bias analog-to-digital converter area on the chip 4, and the other end is connected to the pad on the circuit connection substrate 2, so as to connect the bias analog-to-digital converter area on the chip 4 and the pad on the circuit connection substrate 2 using the conductive lead 5. Afterwards, potting compound 6 can be used to cover the pins and cured to encapsulate the conductive lead 5, thereby providing mechanical protection, isolation from the external environment, and electrical insulation for the conductive lead 5, thus improving the reliability, stability, and environmental adaptability of the bias detector module.
[0042] The above method can avoid tilting of the mounting substrate 1 and the circuit connection substrate 2 when connecting the bias analog-to-digital converter area on the chip 4 with the pads on the circuit connection substrate 2 using conductive leads 5 and when encapsulating the conductive leads 5 with potting compound 6, thereby improving the accuracy and reliability of conductive lead 5 fabrication and conductive lead 5 encapsulation.
[0043] As described above, some embodiments of this application address the eccentricity problem during chip 4 mounting via a first mounting platform 30 during the fabrication of the bias detector module, thereby preventing chip 4 from tilting and improving chip 4 mounting accuracy. Furthermore, by fixing the circuit connection substrate 2 before connecting the bias analog-to-digital converter region on the chip 4 to the pads on the circuit connection substrate 2 using conductive leads 5, and by supporting the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted, tilting of the circuit connection substrate 2 and the mounting substrate 1 is prevented during the connection and encapsulation of the conductive leads 5, thus improving the accuracy of conductive lead 5 placement and encapsulation. Therefore, the fabrication method for the bias detector module provided by some embodiments of this application solves the problem of material eccentricity caused by the new structure, ensuring the positional accuracy and functionality of the mounted materials, improving the yield, fabrication reliability, and stability of the bias detector module, and achieving the manufacturing of the bias detector module with lower process costs.
[0044] This application provides a method for fabricating a biased detector module, which involves mounting a circuit connection substrate 2 onto the back mounting area of a mounting substrate 1. This method may include: If the center of gravity of the circuit connection substrate 2 is not located in the back mounting area of the mounting substrate 1, the circuit connection substrate 2 is mounted to the back mounting area of the mounting substrate 1 by the first auxiliary workpiece 10; wherein; the first auxiliary workpiece 10 acts on the circuit connection substrate 2 so that the center of the first auxiliary workpiece 10 and the circuit connection substrate 2 is located in the back mounting area of the mounting substrate 1, or, when mounting the circuit connection substrate 2 in the back mounting area of the mounting substrate 1, the center of gravity of the circuit connection substrate 2 is located on the first auxiliary workpiece 10. If the center of gravity of the circuit connection substrate 2 is located in the mounting area on the back of the mounting substrate 1, then adhesive is applied to the mounting area on the back of the mounting substrate 1, and the circuit connection substrate 2 is mounted in the mounting area on the back of the mounting substrate 1.
[0045] In some embodiments of this application, when mounting the circuit connection substrate 2 in the mounting area on the back of the mounting substrate 1, it can be determined first whether the center of gravity of the circuit connection substrate 2 is located in the mounting area on the back of the mounting substrate 1.
[0046] If the center of gravity of the circuit connection substrate 2 is not located in the mounting area on the back of the mounting substrate 1, the circuit connection substrate 2 can be mounted onto the mounting area on the back of the mounting substrate 1 using the first auxiliary workpiece 10. This prevents material tilting during mounting due to the center of gravity of the circuit connection substrate 2 not being located in the mounting area on the back of the mounting substrate 1, thereby improving the mounting accuracy of the circuit connection substrate 2 on the mounting substrate 1 and ensuring the function of the circuit connection substrate 2. The first auxiliary workpiece 10 can act on the circuit connection substrate 2 (e.g., ...). Figure 2As shown), so that the center of gravity of the first auxiliary workpiece 10 and the circuit connection substrate 2 is located in the mounting area on the back of the mounting substrate 1. Alternatively, the first auxiliary workpiece 10 can act on the mounting substrate 1 (e.g., Figure 3 As shown), in this case, the first auxiliary workpiece 10 can be placed side by side with the mounting substrate 1 (specifically, placed closer to the end of the circuit connection substrate 2 to be mounted), and the back of the first auxiliary workpiece 10 is flush with the back of the mounting substrate 1, so that when the circuit connection substrate 2 is mounted in the mounting area on the back of the mounting substrate 1, the center of gravity of the circuit connection substrate 2 is located on the first auxiliary workpiece 10 (e.g., Figure 3 (As shown). The first auxiliary workpiece 10 ensures that the center of gravity of the circuit connection substrate 2 is located in the back mounting area of the mounting substrate 1, or that the center of gravity of the circuit connection substrate 2 is located on the first auxiliary workpiece 10. This prevents tilting due to center of gravity shift when mounting the circuit connection substrate 2 in the back mounting area of the mounting substrate 1, improves the mounting accuracy of the circuit connection substrate 2 on the mounting substrate 1, and ensures the function of the circuit connection substrate 2. After the circuit connection substrate 2 is mounted to the back mounting area of the mounting substrate 1 using the first auxiliary workpiece 10, the first auxiliary workpiece 10 can be removed so that the mounting substrate 1 with the circuit connection substrate 2 mounted on the back can proceed to the next manufacturing process.
[0047] If the center of gravity of the circuit connection substrate 2 is located in the mounting area on the back of the mounting substrate 1, the circuit connection substrate 2 can be directly mounted in the mounting area on the back of the mounting substrate 1 (e.g., Figure 4 (As shown). Specifically, adhesive can be applied to the mounting area on the back of the mounting substrate 1. A vacuum suction head is used to pick up the circuit connection substrate 2 (the vacuum suction head needs to avoid the components on the circuit connection substrate 2 to form a stable suction) and mount it onto the mounting area on the back of the mounting substrate 1. The adhesive is then cured by heating or humidifying. This method allows for efficient and convenient mounting of the circuit connection substrate 2 on the back of the mounting substrate 1 without tilting, thus improving the reliability of the mounting of the circuit connection substrate 2.
[0048] See Figure 2 This application provides a method for fabricating a biased detector module, which involves mounting a circuit connection substrate 2 onto the back mounting area of a mounting substrate 1 using a first auxiliary workpiece 10. This method may include: By installing a counterweight material 102 on a target area of a circuit connection substrate 2 using a double-sided bonding sheet 101, the center of gravity of the circuit connection substrate 2 and the counterweight material 102 is located in the mounting area on the back of the mounting substrate 1; the target area is the area on the circuit connection substrate 2 opposite to the area mounted on the mounting substrate 1. Apply adhesive to the mounting area on the back of the mounting substrate 1, mount the circuit connection substrate 2 with the counterweight material 102 on the mounting area on the back of the mounting substrate 1, cure the adhesive, and remove the counterweight material 102 and the double-sided bonding sheet 101.
[0049] In some embodiments of this application, if the center of gravity of the circuit connection substrate 2 is not located in the back mounting area of the mounting substrate 1, the circuit connection substrate 2 is mounted to the back mounting area of the mounting substrate 1 by means of the first auxiliary workpiece 10. The specific implementation of the first auxiliary workpiece 10 acting on the circuit connection substrate 2 to make the center of the first auxiliary workpiece 10 and the circuit connection substrate 2 located in the back mounting area of the mounting substrate 1 can be as follows: a counterweight material 102 is installed on the target area of the circuit connection substrate 2 (the target area is the area on the circuit connection substrate 2 opposite to the area used for mounting on the mounting substrate 1) by means of the double-sided bonding sheet 101. For example, the counterweight material 102 can be a glass sheet of a specific size. By installing the counterweight material 102 on the target area of the circuit connection substrate 2, the center of gravity of the circuit connection substrate 2 and the counterweight material 102 is located in the back mounting area of the mounting substrate 1. Next, adhesive can be applied to the mounting area on the back of the mounting substrate 1. The circuit connection substrate 2 with counterweight material 102 is then mounted on the mounting area on the back of the mounting substrate 1 (specifically, the area on the circuit connection substrate 2 intended for mounting on the mounting substrate 1 is mounted on the mounting area on the back of the mounting substrate 1). For example, a vacuum suction head can be used to pick up the circuit connection substrate 2 with counterweight material 102 (the vacuum suction head needs to avoid the components on the circuit connection substrate 2 to form a stable suction). The circuit connection substrate 2 with counterweight material 102 is then adsorbed onto the mounting area on the back of the mounting substrate 1. After mounting, the adhesive is cured by heating or humidifying. After the adhesive has cured, the counterweight material 102 and the double-sided bonding sheet 101 are removed, so that the circuit connection substrate 2 is mounted and cured on the back of the mounting substrate 1.
[0050] Alternatively, adhesive can be applied to the mounting area on the back of the mounting substrate 1 first, and the circuit connection substrate 2 can be mounted on the mounting area on the back of the mounting substrate 1. The counterweight material 102 can be installed on the target area of the circuit connection substrate 2 through the double-sided bonding sheet 101, so that the center of gravity of the circuit connection substrate 2 and the counterweight material 102 is located in the mounting area on the back of the mounting substrate 1. After the adhesive is cured, the counterweight material 102 and the double-sided bonding sheet 101 can be removed.
[0051] The above method can be used to change the center of gravity of the circuit connection substrate 2 and the counterweight material 102 when mounting the circuit connection substrate 2, so that the center of gravity of the circuit connection substrate 2 and the counterweight material 102 is located in the mounting area on the back of the mounting substrate 1, so as to avoid tilting when mounting the circuit connection substrate 2 on the mounting substrate 1, thereby improving the mounting accuracy of the circuit connection substrate 2 and ensuring the function of the circuit connection substrate 2.
[0052] For the specific implementation process of placing the circuit connection substrate 2 on the mounting area on the back of the mounting substrate 1, ensuring that the center of gravity of the circuit connection substrate 2 is located on the first auxiliary workpiece 10, please refer to [link to relevant documentation]. Figure 3 An auxiliary substrate 103 can be placed side-by-side with the mounting substrate 1 (specifically, the auxiliary substrate 103 is placed closer to the end of the circuit connection substrate 2 to be mounted). The back of the auxiliary substrate 103 is flush with the back of the mounting substrate 1, so that the center of gravity of the circuit connection substrate 2 is located on the auxiliary substrate 103. Adhesive is applied to the mounting area on the back of the mounting substrate 1, and a double-sided adhesive sheet 101 is placed on the back of the auxiliary substrate 103. The circuit connection substrate 2 is then mounted on the mounting area on the back of the mounting substrate 1. After the adhesive is cured, the auxiliary substrate 103 and the double-sided adhesive sheet 101 are removed. This method allows for the placement of the auxiliary substrate 103 side-by-side with the mounting substrate 1 during the mounting of the circuit connection substrate 2, ensuring that the center of gravity of the circuit connection substrate 2 is located on the auxiliary substrate 103. This prevents tilting when mounting the circuit connection substrate 2 on the mounting substrate 1, thereby improving the mounting accuracy of the circuit connection substrate 2 and ensuring its functionality.
[0053] See Figure 5 The method for fabricating a biased detector module provided in some embodiments of this application may further include, before adsorbing the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted onto the surface of the first mounting platform 30: The mounting substrate 1 is placed on the first mounting platform 30 using the second auxiliary workpiece 20, and the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted is bonded to the surface of the first mounting platform 30.
[0054] In some embodiments of this application, after mounting the circuit connection substrate 2 on the back mounting area of the mounting substrate 1, in a pick-and-place machine, the mounting substrate 1 with the circuit connection substrate 2 mounted on its back can be placed on a first mounting platform 30 using a second auxiliary workpiece 20, so that the area on the back of the mounting substrate 1 without the circuit connection substrate 2 mounted is in contact with the surface of the first mounting platform 30. Specifically, the mounting substrate 1 with the circuit connection substrate 2 mounted on its back can be placed on the second auxiliary workpiece 20, and the second auxiliary workpiece 20 can be used to smoothly drop the mounting substrate 1 with the circuit connection substrate 2 mounted on its back onto the surface of the first mounting platform 30, so that the area on the back of the mounting substrate 1 without the circuit connection substrate 2 mounted is in contact with the surface of the first mounting platform 30.
[0055] Specifically, when the first mounting platform 30 is a first vacuum mounting platform and includes a first vacuum through-hole 301, the above process can be as follows: In the pick-and-place machine, the mounting substrate 1 with the circuit connection substrate 2 mounted on its back side is smoothly lowered onto the surface of the first vacuum mounting platform using the second auxiliary workpiece 20. The area on the back side of the mounting substrate 1 without the circuit connection substrate 2 mounted is positioned at the first vacuum through-hole 301 on the first vacuum mounting platform, ensuring that this area adheres to the surface of the first mounting platform 30 and maintaining the vacuum level between the mounting substrate 1 and the surface of the first vacuum mounting platform. Afterward, the area on the back side of the mounting substrate 1 without the circuit connection substrate 2 mounted can be adsorbed onto the surface of the first vacuum mounting platform through the first vacuum mounting platform and its first vacuum through-hole 301.
[0056] The second auxiliary workpiece 20 can prevent the mounting substrate 1 with the circuit connection substrate 2 mounted on the back from tilting during the placement of the mounting substrate 1 on the first mounting platform 30 in the pick-and-place machine due to eccentricity, thus ensuring the fabrication accuracy and functionality of the bias detector module.
[0057] See Figures 5 to 7 This application provides a method for fabricating a biased detector module in some embodiments. A first through hole 201 is provided on the second auxiliary workpiece 20. The size of the first through hole 201 is larger than the size of the first mounting platform 30 and smaller than the size of the mounting substrate 1, so that the second auxiliary workpiece 20 can support the mounting substrate 1 and can move along the height direction on the first mounting platform 30 through the first through hole 201. Before mounting chip 4 in the front mounting area of mounting substrate 1, the following may also be included: The second auxiliary workpiece 20 is controlled to descend along the height direction of the first mounting platform 30 to avoid leaving mounting space.
[0058] In some embodiments of this application, a first through hole 201 may be provided on the second auxiliary workpiece 20, and the size of the first through hole 201 is larger than the size of the first mounting platform 30 and smaller than the size of the mounting substrate 1 (specifically, it may be smaller than the size of the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted). Figure 5 and Figure 6 As shown, the size of the first through hole 201 is L4 (e.g., Figure 5 and Figure 6 The length of the first through hole along the x-direction is L4), and the dimension of the first mounting platform 30 is L5 (e.g., Figure 5 and Figure 6, the length of the first mounting platform 30 in the x direction is L5), that is, L4 > L5 and L4 < L3. Through the above-mentioned dimension setting, the first through hole 201 can sleeve the first mounting platform 30 and enable the second auxiliary workpiece 20 to move along the height direction on the first mounting platform 30 through the first through hole 201, and enable the second auxiliary workpiece 20 to carry and mount the substrate 1 through the first through hole 201 and its surrounding area (specifically supported in the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted), place the mounting substrate 1 on the first mounting platform 30 and make the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted fit onto the first mounting platform 30.
[0059] On this basis, after placing the mounting substrate 1 on the first mounting platform 30 by using the second auxiliary workpiece 20 and making the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted fit onto the surface of the first mounting platform 30, before mounting the chip 4 on the front mounting area of the mounting substrate 1, as Figure 6 shown, the second auxiliary workpiece 20 can be controlled to descend along the height direction of the first mounting platform 30 through the first through hole 201 to avoid the mounting space and prevent it from affecting the mounting of the chip 4. After that, the chip 4 is mounted on the front mounting area of the mounting substrate 1 by using the mounting head, and the adhesive is cured by heating or moisture, etc., to obtain the structure after mounting the chip 4 as Figure 7 shown.
[0060] Through the above method, the mounting substrate 1 can be placed on the first mounting platform 30 with the help of the second auxiliary workpiece 20, and before mounting the chip 4 on the first mounting platform 30, the second auxiliary workpiece 20 can continue to descend to avoid the mounting space, so that the second auxiliary workpiece 20 does not affect the mounting of the chip 4.
[0061] In a method for preparing a bias detector module provided in some embodiments of the present application, a first groove 202 is further provided on the second auxiliary workpiece 20, and the first groove 202 is matched with the circuit connection substrate 2 for accommodating the circuit connection substrate 2.
[0062] In some embodiments of the present application, a first groove 202 is further provided on the second auxiliary workpiece 20, which is matched with the circuit connection substrate 2, and the first groove 202 is used to accommodate the circuit connection substrate 2 to further avoid tilting during the preparation of the bias detector module and protect the circuit connection substrate 2 by using the first groove 202 to improve the reliability of the circuit connection substrate 2.
[0063] A method for preparing a bias detector module provided in some embodiments of the present application for fixing the circuit connection substrate 2 and supporting the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted may include: The circuit connection substrate 2 is fixed by the fixed base 40 and the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not attached is supported.
[0064] In some embodiments of this application, the fixed base 40 can be used to fix the circuit connection substrate 2, and at the same time, the fixed base 40 can be used to support the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not attached, so as to avoid tilting due to eccentricity during the process of connecting the bias analog-to-digital converter area on the chip 4 and the pad on the circuit connection substrate 2 using conductive leads 5, thereby improving the connection accuracy of conductive leads 5 and ensuring the function of the wire leads.
[0065] See Figure 8 This application provides a method for fabricating a biased detector module in some embodiments. The fixed base 40 is a vacuum adsorption base. The vacuum adsorption base may include a vacuum through hole 401 and a boss 402. The size of the vacuum through hole 401 is smaller than the size of the circuit connection substrate 2. The method of using the fixing base 40 to fix the circuit connection substrate 2 and support the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not attached may include: The circuit connection substrate 2 is fixed by adsorbing the vacuum through hole 401 of the vacuum adsorption base, and the boss 402 is used to support the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not attached.
[0066] In some embodiments of this application, the fixed base 40 is a vacuum adsorption base, which includes a vacuum through-hole 401 (for distinction, the vacuum through-hole 401 in the vacuum adsorption base can be referred to as a second vacuum through-hole) and a boss 402. The size of the vacuum through-hole 401 on the vacuum adsorption base can be smaller than the size of the circuit connection substrate 2. Specifically, for example... Figure 8 As shown, the length of the circuit connection substrate 2 along the x-direction is L6, and the length of the vacuum through hole 401 on the vacuum adsorption base along the x-direction is L7. <L6。
[0067] Based on the above, specifically, the circuit connection substrate 2 can be fixed by vacuum adsorption using the vacuum through-hole 401 on the vacuum adsorption base, and the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not attached can be supported by the boss 402 on the vacuum adsorption base, so as to avoid tilting due to eccentricity during the process of connecting the bias analog-to-digital converter area on the chip 4 with the pads on the circuit connection substrate 2 using conductive leads 5, thereby improving the reliability and accuracy of the bias detector module fabrication.
[0068] This application provides a method for fabricating a biased detector module, which utilizes conductive leads 5 to connect the biased analog-to-digital converter region on chip 4 to the pads on the circuit connection substrate 2, and may include: The bias analog-to-digital converter area on chip 4 is connected to the pads on circuit connection substrate 2 by using conductive leads 5 through wire bonding process. A potting compound 6 is applied to the conductive lead 5 using a dispensing machine, so that the potting compound 6 covers the conductive lead 5 and is cured.
[0069] In some embodiments of this application, such as Figure 8 As shown, specifically, one end of the conductive lead 5 can be connected to the bias analog-to-digital converter area on chip 4, and the other end can be connected to the pad on the circuit connection substrate 2 using a wire bonding process. Furthermore, as... Figure 9 As shown, a dispensing machine can be used to encapsulate the lead wire area, and potting compound 6 can be used to cover the conductive lead wire 5 and then cured to encapsulate the lead wire using potting compound 6.
[0070] Connecting the conductive leads 5 to the bias analog-to-digital converter area on the chip 4 and the pads on the circuit connection substrate 2 through wire bonding can improve the flexibility and reliability of electrical connections and reduce costs. Applying potting compound 6 with a dispensing machine and encapsulating the conductive leads 5 with potting compound 6 can improve the reliability and performance stability of the bias detector module, and can simplify the production process and improve production efficiency.
[0071] A method for fabricating a biased detector module provided in some embodiments of this application, after connecting the biased analog-to-digital converter region on the chip 4 to the pads on the circuit connection substrate 2 using conductive leads 5, may further include: The area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted is attached to the surface of the second mounting platform, and a scintillator is mounted on the photoelectric conversion array area on the chip 4.
[0072] In some embodiments of this application, after connecting the bias analog-to-digital converter region on the chip 4 to the pads on the circuit connection substrate 2 using conductive leads 5, the area on the back of the mounting substrate 1 without the circuit connection substrate can be adsorbed onto the surface of the second mounting platform in a pick-and-place machine. The second mounting platform is used to fix the mounting substrate 1 with the circuit connection substrate 2 mounted on the back mounting area, thereby avoiding material tilting due to material eccentricity when mounting the scintillator in the photoelectric conversion array region on the chip 4, and improving the chip mounting accuracy.
[0073] The structure of the second mounting platform can be similar to that of the first mounting platform 30. Specifically, the second mounting platform can be a second vacuum mounting platform, which may include a third vacuum via. The size of the third vacuum via is smaller than the size of the mounting substrate 1 (specifically, the size of the third vacuum via is smaller than the size of the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted, and can be similar to...). Figure 5 The area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted is attached to the third vacuum through hole, and the mounting substrate 1 is adsorbed and fixed on the second vacuum mounting platform using the second vacuum through hole.
[0074] After the area on the back of the mounting substrate 1 where the circuit connection substrate is not attached is adsorbed onto the surface of the second mounting platform, the scintillator 7 can be attached to the photoelectric conversion array area on the chip 4, and the adhesive between the photoelectric conversion array area and the scintillator 7 can be cured.
[0075] The second mounting platform can prevent tilting caused by eccentricity when mounting the scintillator 7 on the photoelectric conversion array area of the chip 4 on the front side of the mounting substrate 1, thereby improving the mounting accuracy of the scintillator 7 and ensuring its functionality.
[0076] A method for fabricating a biased detector module provided in some embodiments of this application may further include, before adsorbing the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted onto the surface of the second mounting platform: Using a third auxiliary workpiece, the mounting substrate 1 is placed on the second mounting platform, and the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted is bonded to the surface of the second mounting platform.
[0077] In some embodiments of this application, before adsorbing the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted onto the surface of the second mounting platform, the mounting substrate 1 can be placed on the second mounting platform in the pick-and-place machine using a third auxiliary workpiece, and the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted onto the surface of the second mounting platform can be brought into contact with the surface of the second mounting platform. Specifically, the mounting substrate 1 can be placed on the third auxiliary workpiece, and the third auxiliary workpiece can be used to smoothly drop the mounting substrate 1 with the circuit connection substrate 2 mounted on the back onto the surface of the second mounting platform, and the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted onto the back onto the surface of the second mounting platform can be brought into contact with the surface of the second mounting platform, specifically such that the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted onto the back is located at the third vacuum through-hole on the second vacuum mounting platform. Afterwards, the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted onto the back onto the surface of the second mounting platform can be adsorbed through the third vacuum through-hole.
[0078] The third auxiliary workpiece can prevent the mounting substrate 1, which has circuit connection substrate 2 mounted on the back, from tilting due to eccentricity during the placement of the mounting substrate 1 on the second mounting platform in the pick-and-place machine, thus ensuring the fabrication accuracy and functionality of the bias detector module.
[0079] This application provides a method for fabricating a biased detector module in some embodiments. A second through hole is provided on a third auxiliary workpiece. The size of the second through hole is larger than the size of the second mounting platform and smaller than the size of the mounting substrate 1, so that the third auxiliary workpiece can support the mounting substrate 1 and can move along the height direction on the second mounting platform through the second through hole. Before mounting the scintillator 7 on the photoelectric conversion array region of chip 4, it may also include: The third auxiliary workpiece is controlled to descend along the height direction of the second mounting platform to avoid leaving mounting space.
[0080] In some embodiments of this application, the structure of the third auxiliary workpiece can be similar to that of the second auxiliary workpiece 20. Specifically, the third auxiliary workpiece may be provided with a second through hole, and the size of the second through hole is larger than the size of the second mounting platform and smaller than the size of the mounting substrate 1 (specifically, it may be smaller than the size of the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted). This allows the second through hole to fit onto the second mounting platform and allows the third auxiliary workpiece to move along the height direction on the second mounting platform through the second through hole. It also allows the third auxiliary workpiece to support the mounting substrate 1 (specifically, to be supported on the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted) through the second through hole and its surrounding area, placing the mounting substrate 1 on the second mounting platform and allowing the area on the back of the mounting substrate 1 where the circuit connection substrate 2 is not mounted to be attached to the second mounting platform.
[0081] Based on the above, after placing the mounting substrate 1 on the second mounting platform using the third auxiliary workpiece, and ensuring that the area on the back of the mounting substrate 1 without the circuit connection substrate 2 is attached to the surface of the second mounting platform, before attaching the scintillator 7 to the photoelectric conversion array area on the chip 4, the third auxiliary workpiece can be controlled to descend along the height direction of the second mounting platform through the second through-hole to avoid creating mounting space and thus prevent interference with the mounting of the scintillator 7. Afterwards, the scintillator 7 is mounted on the photoelectric conversion array area on the chip 4, resulting in the following... Figure 11 The biased detector module shown.
[0082] This application provides a method for fabricating a biased detector module in some embodiments, wherein a second groove is provided on a third auxiliary workpiece, the second groove matching the circuit connection substrate 2 for accommodating the circuit connection substrate 2.
[0083] In some embodiments of this application, the third auxiliary workpiece is further provided with a second groove that matches the circuit connection substrate 2. The second groove is used to accommodate the circuit connection substrate 2 to further prevent tilting during the fabrication of the bias detector module, and to protect the circuit connection substrate 2 to improve the reliability of the circuit connection substrate 2.
[0084] See Figure 10 The present application provides a method for fabricating a biased detector module, in which a scintillator 7 is mounted on the photoelectric conversion array region of chip 4, which may include: UV adhesive is applied at multiple locations in the photoelectric conversion array region, and the scintillator 7 is attached to the surface of the photoelectric conversion array region using the UV adhesive; the gap between the scintillator 7 and the photoelectric conversion array region is within a preset range. Optical adhesive is filled into the gap between the scintillator 7 and the photoelectric conversion array region, and then the optical adhesive is cured.
[0085] In some embodiments of this application, the process of mounting the scintillator 7 on the photoelectric conversion array region of chip 4 can be specifically as follows: In a pick-and-place machine, UV adhesive (shadowless adhesive, also known as photosensitive adhesive) is applied to multiple locations on the surface of chip 4 (specifically the photoelectric conversion array region), i.e., UV adhesive dots are pre-applied to the surface of chip 4; the scintillator 7 is mounted on the surface of the photoelectric conversion array region using the UV adhesive, ensuring that the gap between the scintillator 7 and the photoelectric conversion array region is within a preset range. This preset range can be set according to the operational requirements of the bias detector module, etc. For example, the preset range can be 5μm-300μm. Figure 10 The diagram shows the structure after the scintillator 7 is mounted. Then, optical adhesive is filled into the gap between the scintillator 7 and the photoelectric conversion array region so that the optical adhesive fills the gap between the scintillator 7 and the chip 4, and the optical adhesive is cured to obtain the biased detector module.
[0086] The above methods can improve the reliability and stability of scintillator 7 mounting, thereby improving the yield, reliability and stability of the bias detector module.
[0087] It should be noted that the logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.
[0088] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.
[0089] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0090] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0091] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0092] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.
Claims
1. A method for fabricating a biased detector module, characterized in that, include: The circuit connection substrate is mounted onto the mounting area on the back of the mounting substrate. The circuit connection substrate partially overlaps with the mounting substrate; The area on the back of the mounting substrate where the circuit connection substrate is not attached is adsorbed onto the surface of the first mounting platform, and the chip is attached to the mounting area on the front of the mounting substrate. The circuit connection substrate is fixed and the area on the back of the mounting substrate where the circuit connection substrate is not attached is supported. The bias analog-to-digital converter area on the chip is connected to the pads on the circuit connection substrate using conductive leads.
2. The method for fabricating the biased detector module according to claim 1, characterized in that, Mounting the circuit connection substrate onto the mounting area on the back of the mounting substrate includes: If the center of gravity of the circuit connection substrate is not located in the back mounting area of the mounting substrate, the circuit connection substrate is mounted to the back mounting area of the mounting substrate using a first auxiliary workpiece; wherein, the first auxiliary workpiece acts on the circuit connection substrate to make the center of the first auxiliary workpiece and the circuit connection substrate located in the back mounting area of the mounting substrate, or, when mounting the circuit connection substrate in the back mounting area of the mounting substrate, the center of gravity of the circuit connection substrate is located on the first auxiliary workpiece. If the center of gravity of the circuit connection substrate is located in the mounting area on the back of the mounting substrate, then an adhesive is applied to the mounting area on the back of the mounting substrate, and the circuit connection substrate is mounted in the mounting area on the back of the mounting substrate.
3. The method for fabricating the biased detector module according to claim 2, characterized in that, Mounting the circuit connection substrate onto the back mounting area of the mounting substrate using a first auxiliary workpiece includes: A counterweight is mounted on a target area of the circuit connection substrate using a double-sided bonding sheet, such that the center of gravity of the circuit connection substrate and the counterweight is located in the mounting area on the back of the mounting substrate; the target area is the area on the circuit connection substrate opposite to the area mounted on the mounting substrate. An adhesive is applied to the mounting area on the back of the mounting substrate. The circuit connection substrate with the counterweight material is mounted on the mounting area on the back of the mounting substrate. The adhesive is cured, and the counterweight material and the double-sided bonding sheet are removed.
4. The method for fabricating a biased detector module according to claim 1, characterized in that, Before attaching the area on the back of the mounting substrate where the circuit connection substrate is not mounted to the surface of the first mounting platform, the method further includes: The mounting substrate is placed on the first mounting platform using a second auxiliary workpiece, and the area on the back of the mounting substrate where the circuit connection substrate is not mounted is bonded to the surface of the first mounting platform.
5. The method for fabricating the biased detector module according to claim 4, characterized in that, The second auxiliary workpiece is provided with a first through hole. The size of the first through hole is larger than the size of the first mounting platform and smaller than the size of the mounting substrate, so that the second auxiliary workpiece can carry the mounting substrate and can move along the height direction on the first mounting platform through the first through hole. Before mounting the chip in the mounting area on the front side of the mounting substrate, the following steps are also included: The second auxiliary workpiece is controlled to descend along the height direction of the first mounting platform to avoid creating mounting space.
6. The method for fabricating a biased detector module according to claim 4, characterized in that, The second auxiliary workpiece is also provided with a first groove, which matches the circuit connection substrate and is used to accommodate the circuit connection substrate.
7. The method for fabricating a biased detector module according to claim 1, characterized in that, Fixing the circuit connection substrate and supporting the area on the back of the mounting substrate where the circuit connection substrate is not attached includes: The circuit connection substrate is fixed using a fixed base, and the area on the back of the mounting substrate where the circuit connection substrate is not attached is supported.
8. The method for fabricating a biased detector module according to claim 7, characterized in that, The fixed base is a vacuum adsorption base, which includes a vacuum through hole and a boss. The size of the vacuum through hole is smaller than the size of the circuit connection substrate. The circuit connection substrate is fixed using a mounting base, and the area on the back of the mounting substrate where the circuit connection substrate is not attached is supported, including: The circuit connection substrate is fixed by adsorbing it through the vacuum through-hole of the vacuum adsorption base, and the boss is used to support the area on the back of the mounting substrate where the circuit connection substrate is not attached.
9. The method for fabricating a biased detector module according to claim 1, characterized in that, Connecting the bias analog-to-digital converter region on the chip to the pads on the circuit connection substrate using conductive leads includes: The bias analog-to-digital converter region on the chip is connected to the pads on the circuit connection substrate by means of conductive leads using a wire bonding process. A potting compound is applied to the conductive leads using a dispensing machine to cover the conductive leads and cure the potting compound.
10. The method for fabricating a biased detector module according to claim 1, characterized in that, After connecting the bias analog-to-digital converter region on the chip to the pads on the circuit connection substrate using conductive leads, the method further includes: The area on the back of the mounting substrate where the circuit connection substrate is not attached is adsorbed onto the surface of the second mounting platform, and a scintillator is attached to the photoelectric conversion array area on the chip.
11. The method for fabricating a biased detector module according to claim 10, characterized in that, Before attaching the area on the back of the mounting substrate where the circuit connection substrate is not mounted to the surface of the second mounting platform, the process further includes: The mounting substrate is placed on the second mounting platform using a third auxiliary workpiece, and the area on the back of the mounting substrate where the circuit connection substrate is not mounted is bonded to the surface of the second mounting platform.
12. The method for fabricating a biased detector module according to claim 11, characterized in that, The third auxiliary workpiece is provided with a second through hole. The size of the second through hole is larger than the size of the second mounting platform and smaller than the size of the mounting substrate, so that the third auxiliary workpiece can carry the mounting substrate and can move along the height direction on the second mounting platform through the second through hole. Before mounting the scintillator on the photoelectric conversion array region of the chip, the following is also included: The third auxiliary workpiece is controlled to descend along the height direction of the second mounting platform to avoid creating mounting space.
13. The method for fabricating a biased detector module according to claim 12, characterized in that, The third auxiliary workpiece is also provided with a second groove, which matches the circuit connection substrate and is used to accommodate the circuit connection substrate.
14. The method for fabricating a biased detector module according to claim 10, characterized in that, A scintillator is mounted on the photoelectric conversion array region of the chip, including: UV adhesive is applied at multiple locations in the photoelectric conversion array region, and the scintillator is attached to the surface of the photoelectric conversion array region using the UV adhesive; the gap between the scintillator and the photoelectric conversion array region is within a preset range; Optical adhesive is filled into the gap between the scintillator and the photoelectric conversion array region, and the optical adhesive is cured.