A double-core integrated micro LED chip for a lighting and projecting integrated intelligent vehicle lamp and a preparation method thereof

Abstract

The application relates to the technical field of automobile lighting and display integration, and particularly provides a double-core integrated MicroLED chip for a lighting and projection integrated intelligent car lamp and a preparation method, the integrated chip comprising two completely same MicroLED light-emitting arrays, a driving chip, an optical projection module, a control unit and a copper substrate PCB packaging structure; the two MicroLED light-emitting arrays serve as core light-emitting components, are interconnected with the driving chip through die-to-die or die-to-wafer bonding technology, are collectively packaged on the copper substrate PCB, and the driving chip presents a single chip control interface to the outside; the two chips can realize independent work or cooperative work through software configuration, and cooperate with the optical projection module to complete multi-mode efficient switching; the application can solve the problems of poor function compatibility, large heat dissipation pressure, a complex control system and limited high beam brightness improvement of a traditional single-core architecture.

Description

Technical Field

[0001] This invention relates to the field of automotive lighting and display integration technology, specifically to a dual-core integrated MicroLED chip for integrated lighting and projection smart vehicle lights and its fabrication method. Background Technology

[0002] With the development of intelligent vehicle technology, integrated lighting and projection intelligent vehicle lights have become a key component for improving driving safety and intelligence. They need to meet the dual requirements of high-brightness lighting such as high beams and low beams, as well as high-precision projection for navigation guidance and warning signs.

[0003] Traditional automotive headlights mostly employ a single-light source architecture, offering limited functionality and failing to balance illumination intensity and projection accuracy. While existing integrated headlights utilize MicroLED light arrays, they are generally single-chip designs. Simultaneously meeting the high brightness requirements of high beams and the high grayscale control demands of projection results in complex chip structures, difficult driving, and high control system costs. Furthermore, the high power density of the single-chip architecture concentrates heat dissipation pressure, necessitating complex cooling structures, further increasing the headlight's size and cost.

[0004] MicroLEDs have advantages such as high brightness and fast response speed, but when applied to integrated lighting and projection vehicle lights, the design bottleneck of single-core multi-functionality is significant: there is an inherent contradiction between the high power required for high beams and the high precision required for projection, and it is difficult for a single core to optimize both performance at the same time; at the same time, the thermal decay problem caused by concentrated heat generation in a single core will simultaneously affect the lighting brightness and projection accuracy, which seriously restricts the performance improvement and industrial application of integrated lighting and projection vehicle lights. Summary of the Invention

[0005] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a dual-core integrated MicroLED chip and its preparation method for integrated lighting and projection intelligent vehicle lights, in order to solve the problems of difficulty in simultaneously optimizing both high power and high precision performance in a single-core integrated lighting and projection vehicle light array, and thermal attenuation caused by concentrated heat generation in a single core.

[0006] To achieve the above and other related objectives, the present invention provides a dual-chip integrated MicroLED chip for integrated intelligent vehicle lighting, comprising: Two identical MicroLED light-emitting arrays serve as the core light-emitting components; A driver chip is used to drive and control the operation of the two MicroLED light-emitting arrays; A copper-based PCB package structure is provided, on which two MicroLED light-emitting arrays and a driver chip are fixed; the driver chip is interconnected with the two MicroLED light-emitting arrays by bonding technology, and the driver chip enables the two MicroLED light-emitting arrays to work in independent mode or collaborative mode. A control unit is connected in communication with the drive chip and the vehicle ECU.

[0007] In one embodiment of the present invention, the driver chip is interconnected with the two MicroLED light-emitting arrays via bonding technology, including: The driver chip is independently interconnected with a single MicroLED light-emitting array via die-to-die bonding technology, or... The driver chip achieves mass interconnection with the two chips through die-to-wafer bonding technology.

[0008] In one embodiment of the present invention, the driver chip includes a software configuration module configured to support multiple operating modes, including: In low beam mode, one chip works as the "lighting chip," while the other is in standby or provides auxiliary compensation. In projection mode, one of the chips functions as the "projection core". In the enhanced high beam mode, both chips are configured as "lighting cores" and driven synchronously to improve the overall output brightness; The functions of the two MicroLED light-emitting arrays are defined and switched through the software configuration of the driver chip; when one or two chips are configured as "illumination chips", the high-brightness driving module is activated; when one or two chips are configured as "projection chips", the high-precision grayscale control module is activated.

[0009] In one embodiment of the present invention, the driving chip has a dual-core architecture, comprising two independent driving channels and a collaborative control module; each driving channel drives a MicroLED light-emitting array, and the collaborative control module is used to synchronize the working timing of the two chips and monitor the working parameters.

[0010] In one embodiment of the present invention, the copper substrate PCB packaging structure includes a copper substrate, an insulating and thermally conductive layer formed on the surface of the copper substrate, and a PCB circuit layer; the driving chip is mounted on the copper substrate, and two MicroLED light-emitting arrays are arranged on the copper substrate at a spacing of 0.5-2mm and bonded to the circuit layer by flip-chip bonding technology; both the driving chip and the MicroLED light-emitting arrays are covered by a high thermal conductivity encapsulant.

[0011] In one embodiment of the present invention, an optical projection module is further included, the optical projection module comprising a microlens array, a condenser lens and an adjustable projection lens connected in series according to a specific optical path sequence; the microlens array corresponds to the light-emitting area of ​​the MicroLED light-emitting array.

[0012] This invention provides a method for fabricating a dual-core integrated MicroLED chip for integrated intelligent vehicle lighting, comprising the following steps: S1. Prepare a MicroLED light-emitting array, wherein the MicroLED light-emitting arrays in the array have the same core structure; S2. The MicroLED light-emitting array and the driver chip are interconnected through a bonding process to form a chip unit; S3. Provide a copper-based PCB and fabricate an insulating layer and conductive lines on it; S4. Transfer and fix the chip unit to a preset position on the copper substrate PCB, so that the two MicroLED light-emitting arrays, which are the core light-emitting components, maintain a spacing of 0.5-2mm; use encapsulation material to encapsulate the chip fixed on the copper substrate PCB. S5. Configure and calibrate the functions of the packaged integrated chip.

[0013] In one embodiment of the present invention, in step S2, the bonding process is either die-to-die bonding or die-to-wafer bonding. In die-to-die bonding, the bonding pressure is controlled at 10-20 MPa, the bonding temperature is 200-250°C, and the contact resistance is ≤50 mΩ. In die-to-wafer bonding, the bonding accuracy is ≤1 μm.

[0014] In one embodiment of the present invention, in step S5, the function configuration and performance calibration includes: writing a configuration program to the driver chip to define the functional roles of each chip; and testing and calibrating the brightness matching degree and timing synchronization of the dual chips in the collaborative working mode.

[0015] In one embodiment of the present invention, the step of preparing the MicroLED light-emitting array further includes the step of forming a white light conversion layer on the chip, wherein the white light conversion layer comprises quantum dot material.

[0016] As described above, the dual-core integrated MicroLED chip and its fabrication method for integrated intelligent vehicle lights of the present invention have the following beneficial effects: This invention fundamentally solves the contradiction between high brightness and high precision in a single chip through a dual-chip functional discrete design. It enhances overall brightness in high-beam mode and significantly increases illumination distance. Software configuration allows for dynamic adjustment of lighting and projection allocation based on the scene, supporting parallel functions, improving product performance and increasing application flexibility. The dual-chip discrete layout, combined with a high thermal conductivity copper substrate package, effectively disperses heat sources, reduces local heat density, and significantly lowers chip operating temperature, improving system stability and lifespan. The identical core structure of the two chips simplifies production and inventory management. Software-defined functions reduce reliance on dedicated hardware circuits, lowering the complexity and cost of control system development. The highly integrated packaging also simplifies the assembly of the vehicle lighting module. It offers superior reliability and maintainability: the dual-chip design provides redundancy, meaning a single chip failure does not affect basic functionality. Because the chips are identical, replacement and repair are more convenient, reducing subsequent maintenance costs. Attached Figure Description

[0017] Figure 1 The diagram shown is a schematic representation of the dual-core integrated MicroLED light-emitting array in this invention.

[0018] Figure 2 The diagram shown is a schematic of the dual-core integrated MicroLED light-emitting array structure in this invention.

[0019] Figure 3 The diagram shown is a partial cross-sectional view of the dual-core integrated MicroLED light-emitting array in this invention.

[0020] Figure 4 The diagram shows the fabrication process flow of the dual-core integrated MicroLED light-emitting array of this invention. Detailed Implementation

[0021] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0022] Please see Figures 1 to 4 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only used to complement the content disclosed in the specification for those skilled in the art to understand and read, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should fall within the scope of the technical content disclosed in the present invention.

[0023] Please see Figures 1 to 3Example 1: This example provides a dual-core integrated MicroLED chip for integrated intelligent vehicle lighting, including two MicroLED light-emitting arrays with identical structures, a driver chip, a copper substrate PCB package structure, a control unit, and an optical projection module; the two MicroLED light-emitting arrays are the core light-emitting components, both using GaN-based materials, with a chip size of 20μm×20μm, and their core epitaxial structures and electrode designs are completely identical, arranged with a horizontal spacing of 1mm. A driver chip employs a dual-core architecture application-specific integrated circuit (ASIC) and is interconnected with two MicroLED light-emitting arrays via copper bumps using a die-to-die method. The driver chip integrates two independent driving channels, a collaborative control module, and a temperature sensing circuit. Each driving channel drives one MicroLED light-emitting array. The collaborative control module synchronizes the operating timing of the two chips and monitors operating parameters. Both MicroLED light-emitting arrays and the driver chip are fixed on a copper-based PCB package structure. The driver chip interconnects with the two MicroLED light-emitting arrays via bonding technology, enabling the two MicroLED light-emitting arrays to operate in independent or collaborative modes. The optical projection module includes a microlens array, a condenser lens, and an adjustable-focus projection lens connected in series according to a specific optical path sequence. The microlens array corresponds to the light-emitting area of ​​the MicroLED light-emitting array. The control unit, serving as an interface for communication with an automotive bus such as CAN, receives ECU commands and converts them into specific configuration commands for the driver chip, storing them in an internal mode configuration library. The focal length of the projection lens can be adjusted according to low beam, high beam, or projection mode. More specifically, the interconnection of the driver chip with the two MicroLED light-emitting arrays via bonding technology includes: the driver chip being independently interconnected with a single MicroLED light-emitting array via die-to-die bonding technology, or the driver chip being batch interconnected with the two chips via die-to-wafer bonding technology; the driver chip has a dual-core architecture, containing two independent driving channels and a collaborative control module; The driver chip includes a software configuration module configured to support multiple operating modes, including: low beam mode, where one chip operates as the "illumination chip" while the other is in standby or for auxiliary compensation; projection mode, where one chip operates as the "projection chip"; and enhanced high beam mode, where both chips are configured as "illumination chips" and driven synchronously to increase the total output brightness. The functions of the two MicroLED light-emitting arrays are defined and switched through the software configuration of the driver chip. When one or both chips are configured as "illumination chips," the high-brightness driving module is activated; when one or both chips are configured as "projection chips," the high-precision grayscale control module is activated.

[0024] The copper-based PCB packaging structure includes a copper substrate, an insulating and thermally conductive layer formed on the surface of the copper substrate, and a PCB circuit layer. The driver chip is mounted on the copper substrate, and two MicroLED light-emitting arrays are arranged on the copper substrate at a spacing of 0.5-2mm and bonded to the circuit layer using flip-chip bonding technology. Both the driver chip and the MicroLED light-emitting arrays are encapsulated with a high thermal conductivity encapsulant. The packaging structure can be either a copper-based PCB package or an AlN substrate package: when using a copper-based PCB package, the thermal conductivity of the copper substrate is ≥380W / (m·K), and the surface is provided with an insulating and thermally conductive layer and a circuit layer, with the chip array and driver chip packaged on the copper substrate; when using an AlN substrate package, the thermal conductivity of the AlN substrate is ≥170W / (m·K), and the insulation resistance is ≥10¹. 4 Ω, no additional insulating and thermally conductive layer is required; both packages use high thermal conductivity silicone with a thermal conductivity of ≥2.0W / (m·K), and the bottom of the substrate is provided with heat dissipation fin mounting slots to ensure that the chip operating temperature is ≤75℃.

[0025] This invention fundamentally solves the contradiction between high brightness and high precision in a single chip through a dual-chip functional discrete design; it enhances overall brightness in high beam mode and significantly increases illumination distance; software configuration allows for dynamic adjustment of lighting and projection allocation according to the scene, supports parallel functions, improves product performance, and increases product application flexibility; the dual-chip discrete layout combined with a high thermal conductivity copper substrate package effectively disperses heat sources, reduces local heat density, and significantly lowers chip operating temperature, improving system stability and lifespan; the two chips have identical core structures, simplifying production and inventory management; software-defined functions reduce reliance on dedicated hardware circuits, lowering the complexity and cost of control system development; the highly integrated packaging also simplifies the assembly of the vehicle lighting module; and it offers superior reliability and maintainability: the dual-chip design provides redundancy, so a single chip failure does not affect basic functions; and because the chips are identical, replacement and repair are more convenient, reducing later maintenance costs.

[0026] Example 2: This example provides a method for fabricating a dual-core integrated MicroLED chip for a smart vehicle headlight with integrated illumination and projection, comprising the following steps: S1. Fabrication of a MicroLED light-emitting array, wherein the MicroLED light-emitting arrays in the array have the same core structure. Fabrication of the MicroLED light-emitting array includes the step of forming a white light conversion layer on the chip, wherein the white light conversion layer contains quantum dot material; specifically, GaN-based epitaxial structures are grown on a sapphire substrate using MOCVD technology, optimizing the well width of the multiple quantum wells to 2.5-3.5 nm and the barrier width to 1.5-2.0 nm, and controlling the peak wavelength of the epitaxial wafer to 450-460 nm; the chip array is defined using deep ultraviolet lithography. The array pattern is used to achieve chip isolation through ICP etching, with the etching rate controlled at 50-100nm / min. The size of a single chip is designed to be 1-50μm, and the array density is ≥200ppi. Yellow phosphor or quantum dot-silicone composite system is used as the white light conversion layer. Red quantum dots with a peak wavelength of 620-630nm and green quantum dots with a peak wavelength of 530-540nm are mixed at a mass ratio of 1:2-1:3 and dispersed in silicone to form a composite slurry. This slurry is then coated onto the chip's light-emitting surface through a spraying process and cured at 150℃ / 1h, with a color rendering index Ra≥85.

[0027] S2. The MicroLED light-emitting array and the driving chip are interconnected through a bonding process to form a chip unit. Specifically, a Ti / Al / Ni / Au multilayer electrode structure is adopted, and the chip array is bonded to a Si substrate with driving circuitry through flip-chip bonding technology. Then, it is separated into independent MicroLED light-emitting array units through a dicing process. The bonding process is either die-to-die bonding or die-to-wafer bonding. In die-to-die bonding, the bonding pressure is controlled at 10-20MPa, the bonding temperature is 200-250℃, and the contact resistance is ≤50mΩ. In die-to-wafer bonding, the bonding accuracy is ≤1μm.

[0028] S3. Provide a copper-based PCB and fabricate an insulating layer and conductive lines on it; specifically, deposit a 3-5μm Al2O3 insulating and thermally conductive layer on the surface of an oxygen-free copper substrate, form a circuit layer through photolithography and etching, reserve connection pads for the MicroLED light-emitting array, and match the pad spacing with the output pins of the driver chip.

[0029] S4. Transfer and fix the chip unit to a preset position on the copper substrate PCB, so that the two MicroLED light-emitting arrays, which are the core light-emitting components, maintain a spacing of 0.5-2mm; use encapsulation material to encapsulate the chip fixed on the copper substrate PCB; specifically, bond the completed MicroLED light-emitting array to a preset area on the copper substrate PCB, and control the spacing between the two MicroLED light-emitting arrays to 0.5-2mm; use high thermal conductivity silicone with a thermal conductivity ≥2.0W / (m・K) to completely encapsulate the chip and the driver chip, and then perform vacuum degassing and curing at 150℃ / 1.5h.

[0030] S5. Perform functional configuration and performance calibration on the packaged integrated chip. Specifically, the control unit writes a functional configuration program to the driver chip, defining the basic "lighting / projection" functions of the two chips; simulate various working modes for performance testing, calibrate the collaborative working timing, brightness matching degree, and grayscale control accuracy, ensuring activation delay difference ≤30ns, brightness matching degree deviation ≤5%, and smooth mode switching, resulting in a finished dual-core integrated MicroLED light-emitting array. The functional configuration and performance calibration include: writing a configuration program to the driver chip, defining the functional role of each chip; testing and calibrating the brightness matching degree and timing synchronization of the two chips in the collaborative working mode. Specifically, the control unit has a built-in chip functional configuration library and mode switching logic, and after receiving signals from the vehicle ECU, it implements multi-mode control through the driver chip. In low beam mode, the first chip is configured as the "illumination chip" and activates a local area, while the second chip is in standby mode; In projection mode, the second chip is configured as the "projection chip" and the entire area is activated, while the first chip is in standby mode; low light and projection modes can also be used simultaneously. In standard high beam mode, the first chip is configured as the "lighting chip" and activated across the entire area; The enhanced high beam mode configures both chips as "lighting chips" and activates them simultaneously; In emergency alert mode, the two chips are configured to flash as "lighting cores" alternately, with one chip simultaneously outputting an alert projection.

[0031] This embodiment employs MOCVD epitaxial growth and automated etching, white light conversion processes in the same batch to precisely drive the consistency of the chip's core structure and brightness deviation. Combined with two high-yield, high-precision bonding processes—die-to-die or die-to-wafer—and high-thermal-conductivity copper substrate packaging and vacuum degassing and curing, it effectively disperses heat sources and improves heat dissipation and protection performance. Simultaneously, standardized functional configuration and performance calibration processes ensure timing synchronization, brightness matching, and smooth mode switching during dual-chip collaborative operation. This enables flexible switching and parallel use of multiple modes, including low beam, projection, high beam, and emergency warning. Furthermore, standardized production processes improve production efficiency and reduce chip development costs. The consistent chip structure also simplifies production inventory management and subsequent repair and replacement, significantly enhancing the product's practicality, stability, and industrial value.

[0032] Please see Figure 4 Example 3, based on Example 2, provides a method for fabricating a dual-core integrated MicroLED chip for integrated lighting and projection smart vehicle lights, including the following steps: Epitaxy and Chip Fabrication: InGaN / GaN multi-quantum-well epitaxial wafers were grown on sapphire substrates using MOCVD. The sapphire substrates were c-plane sapphire with a thickness of 430 μm and a flatness of ≤0.5 μm. Independent 20 μm MicroLED light-emitting arrays were formed by photolithography and ICP etching. Photolithography was performed using a stepper lithography machine with an alignment accuracy of ≤1 μm. The ICP etching gas was a Cl2 / Ar mixture with a flow ratio of 4:1, an etching power of 700 W, a bias voltage of 120 V, and an etching depth of 2.5 μm. Subsequently, a mixture of red quantum dots, green quantum dots, and silicone was sprayed and cured to form a white light conversion layer. The quantum dot particle size was 2-5 nm, and the silicone was methyl vinyl silicone rubber. The slurry was mixed using a planetary mixer at a speed of 2000-3000 rpm for 30-60 min. The density of the cured coating was ≥95%.

[0033] Interconnection: This example uses die-to-wafer bonding. First, copper bumps are fabricated on the driver chip wafer. The copper bumps have a diameter of 80-100μm and a height of 50-80μm, and are prepared using an electroplating process with a current density of 10-20mA / cm² and a plating time of 30-60min. Then, the diced MicroLED light-emitting array is still on a temporary substrate and is aligned with the driver chip wafer with high precision using a vision alignment system, with an alignment accuracy of ≤0.5μm. Hot-press bonding is then performed under nitrogen protection, with nitrogen purity ≥99.99%, a bonding temperature of 220-240℃, a bonding pressure of 5-10MPa, and a holding time of 30-60s. After bonding, the original sapphire substrate of the MicroLED is removed by laser lift-off. The laser lift-off uses a KrF excimer laser with a wavelength of 248nm, a laser energy density of 500-800mJ / cm², a scanning speed of 100-200mm / s, and 1-2 scans. The surface roughness of the chip after lift-off is ≤0.1μm.

[0034] Copper substrate packaging: An Al2O3 insulating layer is deposited on an oxygen-free copper substrate. The oxygen-free copper substrate has a purity of ≥99.9% and a thickness of 2.5 mm. The deposited Al2O3 insulating layer has a thickness of 40 μm. Plasma spraying is used, with a spraying power of 1500-2000 W and a spraying distance of 80-100 mm. Copper leads are then formed by photolithography. The copper lead width is 120 μm and the line spacing is 100 μm. Wet film photolithography is used, with a photoresist thickness of 20 μm and an exposure dose of 120 mJ / cm². 2 The MicroLED driver chip composite unit obtained in the previous step is cut into individual devices using laser cutting with a wavelength of 1064nm, a cutting power of 5-10W, and a cutting speed of 50-100mm / s. These devices are then transferred to designated pads on a copper substrate using flip-chip bonding technology, ensuring a 1mm spacing between the two MicroLED light-emitting arrays with a spacing deviation ≤±0.03mm. High thermal conductivity silicone is then applied, with a thermal conductivity ≥3.5W / (m・K). A syringe-type dispensing machine is used, with a dispensing pressure of 0.15-0.25MPa, a dispensing speed of 5-10mm / s, and a silicone amount controlled at 0.1-0.2g / chip. After vacuum degassing, the chips are heated for curing. The vacuum degassing pressure is ≤-0.095MPa, the degassing time is 20min, the curing temperature is 150℃, and the curing time is 2h.

[0035] Testing and Calibration: The packaged module was connected to the testing system, which consisted of a power supply with an output accuracy of ±0.1V / ±0.1A, a temperature control chamber with a temperature range of -40℃ to 120℃ and a temperature control accuracy of ±1℃, an optical testing dark chamber, and a data acquisition and analysis module. The test program was loaded through the control unit to verify the brightness, grayscale, response time, and dual-core synchronization in each mode. The coordination parameters in the driver chip were fine-tuned to ensure that the dual-core brightness deviation in the enhanced high beam mode was less than 5%, the timing synchronization met the standard, the dual-core working timing synchronization error was ≤20ns, the grayscale control accuracy was 16-bit, and the brightness repeatability error was ≤2%. At the same time, environmental reliability testing was performed. After 100 cycles of high and low temperature cycling tests at -40℃ / 30min to 120℃ / 30min, the chip brightness decay was ≤5%, and the change in electrical performance parameters was ≤10%. After 1000h of damp heat testing at 85℃ / 85%RH, the encapsulation adhesive showed no cracking or discoloration, and the chip showed no short circuit or open circuit.

[0036] In summary, this invention, through a unified dual-chip design and software-defined functionality, integrates two identical MicroLED light-emitting arrays onto a high thermal conductivity copper substrate, and achieves efficient separation and dynamic coordination of lighting and projection functions via a single driver chip. This solution fundamentally resolves the performance contradictions and heat dissipation bottlenecks of traditional single-chip architectures. While significantly increasing the overall brightness and illumination distance system performance in high beam mode and enhancing the flexibility of intelligent switching between low beam, projection, high beam, and various mixed modes, it effectively reduces chip development and manufacturing costs and system complexity through the standardization of core components, mass production, and integrated control. Furthermore, by dispersing heat sources and achieving efficient heat dissipation, it significantly improves the operational stability, reliability, and lifespan of the vehicle lights. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and possesses high industrial applicability.

[0037] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A dual-core integrated MicroLED chip for integrated intelligent vehicle lights, characterized in that, include: Two identical MicroLED light-emitting arrays serve as the core light-emitting components; A driver chip is used to drive and control the operation of the two MicroLED light-emitting arrays; A copper-based PCB package structure is provided, on which two MicroLED light-emitting arrays and a driver chip are fixed; the driver chip is interconnected with the two MicroLED light-emitting arrays by bonding technology, and the driver chip enables the two MicroLED light-emitting arrays to work in independent mode or collaborative mode. A control unit is connected in communication with the drive chip and the vehicle ECU.

2. The dual-core integrated MicroLED chip for integrated lighting and projection intelligent vehicle lights according to claim 1, characterized in that, The driver chip is interconnected with the two MicroLED light-emitting arrays via bonding technology, including: The driver chip is independently interconnected with a single MicroLED light-emitting array via die-to-die bonding technology, or... The driver chip achieves mass interconnection with the two chips through die-to-wafer bonding technology.

3. The dual-core integrated MicroLED chip for integrated lighting and projection intelligent vehicle lights according to claim 1, characterized in that, The driver chip includes a software configuration module, which is configured to support multiple operating modes, including: In low beam mode, one chip works as the "lighting chip," while the other is in standby or provides auxiliary compensation. In projection mode, one of the chips functions as a "projection core". In the enhanced high beam mode, both chips are configured as "lighting cores" and driven synchronously to improve the overall output brightness; The functions of the two MicroLED light-emitting arrays are defined and switched through the software configuration of the driver chip; when one or two chips are configured as "illumination chips", the high-brightness driving module is activated; when one or two chips are configured as "projection chips", the high-precision grayscale control module is activated.

4. The dual-core integrated MicroLED chip for integrated lighting and projection intelligent vehicle lights according to claim 1, characterized in that: The driver chip has a dual-core architecture, including two independent driving channels and a collaborative control module; each driving channel drives a MicroLED light-emitting array, and the collaborative control module is used to synchronize the working timing of the two chips and monitor the working parameters.

5. The dual-core integrated MicroLED chip for integrated lighting and projection intelligent vehicle lights according to claim 1, characterized in that: The copper substrate PCB packaging structure includes a copper substrate, an insulating and thermally conductive layer formed on the surface of the copper substrate, and a PCB circuit layer; the driver chip is mounted on the copper substrate, and two MicroLED light-emitting arrays are arranged on the copper substrate at a spacing of 0.5-2mm and bonded to the circuit layer by flip-chip bonding technology. Both the driver chip and the MicroLED light-emitting arrays are covered by a high thermal conductivity encapsulant.

6. The dual-core integrated MicroLED chip for integrated lighting and projection intelligent vehicle lights according to claim 1, characterized in that: It also includes an optical projection module, which comprises a microlens array, a condenser lens, and an adjustable-focus projection lens connected in series according to a specific optical path sequence; the microlens array corresponds to the light-emitting area of ​​the MicroLED light-emitting array.

7. A method for fabricating a dual-core integrated MicroLED chip for a smart vehicle light with integrated illumination and projection, characterized in that, Includes the following steps: S1. Prepare a MicroLED light-emitting array, wherein the MicroLED light-emitting arrays in the array have the same core structure; S2. The MicroLED light-emitting array and the driver chip are interconnected through a bonding process to form a chip unit; S3. Provide a copper-based PCB and fabricate an insulating layer and conductive lines on it; S4. Transfer and fix the chip unit to a preset position on the copper substrate PCB, so that the two MicroLED light-emitting arrays, which are the core light-emitting components, maintain a spacing of 0.5-2mm. The chip fixed on the copper substrate PCB is encapsulated using encapsulation materials; S5. Configure and calibrate the functions of the packaged integrated chip.

8. The method for fabricating a dual-core integrated MicroLED chip for a smart vehicle light with integrated illumination and projection, as described in claim 7, is characterized in that: In step S2, the bonding process is either die-to-die bonding or die-to-wafer bonding. For die-to-die bonding, the bonding pressure is controlled at 10-20 MPa, the bonding temperature is 200-250℃, and the contact resistance is ≤50 mΩ. For die-to-wafer bonding, the bonding accuracy is ≤1 μm.

9. The method for fabricating a dual-core integrated MicroLED chip for a smart vehicle light with integrated illumination and projection, as described in claim 7, is characterized in that: In step S5, the function configuration and performance calibration include: writing a configuration program to the driver chip to define the functional roles of each chip; and testing and calibrating the brightness matching and timing synchronization of the dual chips in the collaborative working mode.

10. The method for fabricating a dual-core integrated MicroLED chip for a smart vehicle light with integrated illumination and projection, as described in claim 7, is characterized in that: The process of fabricating a MicroLED light-emitting array also includes forming a white light conversion layer on the chip, the white light conversion layer comprising quantum dot material.

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