Display panel and preparation method thereof

Abstract

Embodiments of the present application disclose a display panel and a preparation method thereof, and relate to the technical field of display. The display panel comprises a substrate and a plurality of light-emitting pixels, and the plurality of light-emitting pixels are arranged at one side of the substrate. Any one of the light-emitting pixels comprises a conductive connecting piece and a plurality of light-emitting units, and the plurality of light-emitting units are arranged in a stacking manner along the thickness direction of the substrate. The conductive connecting piece is arranged between two light-emitting units along the thickness direction of the substrate, and the conductive connecting piece connects an anode layer of one of the two light-emitting units and a cathode layer of the other light-emitting unit arranged adjacently along the thickness direction of the substrate. In the embodiments of the present application, the conductive connecting piece can connect the two light-emitting units arranged adjacently along the thickness direction of the substrate in series, so that the current can drive the plurality of light-emitting units arranged in the stacking manner in the light-emitting pixel to emit light together, thereby a smaller current value can make the light-emitting pixel reach a set light-emitting brightness, and the heat loss of the display panel is reduced.

Description

Technical Field

[0001] The embodiments of this application relate to the field of display technology, and more particularly to a display panel and a method for manufacturing the same. Background Technology

[0002] The display panel includes a substrate and multiple light-emitting units, which are spaced apart on one side of the substrate to emit light. The light-emitting units are typically driven by current; within a certain current range, the greater the current flowing through the light-emitting unit, the greater its brightness. To increase the brightness of the light-emitting units, a larger current is usually required to drive them.

[0003] However, when a large current flows through the substrate, the heat loss is greater, which leads to an increase in the power consumption of the display panel. In addition, the greater heat loss will also increase the heat generated by the display panel, which will shorten the lifespan of other components (such as driver chips). Summary of the Invention

[0004] The embodiments of this application provide a display panel and a method for manufacturing the same, which can reduce the heat loss of the display panel.

[0005] On one hand, embodiments of this application provide a display panel. The display panel includes a substrate and a plurality of light-emitting pixels. The plurality of light-emitting pixels are disposed on one side of the substrate along the thickness direction of the substrate, and are spaced apart. Each light-emitting pixel includes a conductive connector and a plurality of light-emitting units. The plurality of light-emitting units are stacked along the thickness direction of the substrate, and each light-emitting unit includes a light-emitting layer, an anode layer, and a cathode layer. The anode layer is stacked along the thickness direction of the substrate on one side of the light-emitting layer, and is used to provide holes for the light-emitting layer. The cathode layer is stacked along the thickness direction of the substrate on the side of the light-emitting layer away from the anode layer, and is used to provide electrons for the light-emitting layer. Electrons and holes recombine in the light-emitting layer to make the light-emitting layer emit light. The conductive connector is disposed between two light-emitting units along the thickness direction of the substrate. The conductive connector connects the anode layer of one light-emitting unit and the cathode layer of another light-emitting unit that are adjacent to each other along the thickness direction of the substrate. The conductive connector avoids the light emission path of the light-emitting unit in the normal direction.

[0006] In the embodiments of this application, the conductive connector is located between two light-emitting units that are adjacent to each other along the thickness direction of the substrate, and the conductive connector extends along the thickness direction of the substrate, so that the conductive connector can connect the anode layer of one light-emitting unit and the cathode layer of the other light-emitting unit among the two light-emitting units that are adjacent to each other along the thickness direction of the substrate.

[0007] In other words, two light-emitting units arranged adjacent to each other along the thickness direction of the substrate can be connected in series through conductive connectors. Multiple conductive connectors can be used, and different light-emitting units arranged adjacent to each other along the thickness direction of the substrate can be connected in series through different conductive connectors.

[0008] In this way, multiple light-emitting units stacked along the thickness direction of the substrate in the light-emitting pixel can be connected in series, so that the current can drive the multiple light-emitting units stacked in the light-emitting pixel to emit light together.

[0009] Understandably, when the current value is constant, the brightness of the light-emitting pixel can be increased by having multiple light-emitting units stacked in the light-emitting pixel emit light together; when the brightness of the light-emitting pixel is constant, a smaller current can be set to drive the multiple light-emitting units stacked in the light-emitting pixel.

[0010] By using the above setting method, a smaller current value can make the light-emitting pixels reach the set brightness. This reduces the current driving the light-emitting unit while ensuring the brightness of the light-emitting pixels, thereby reducing heat loss and power consumption of the display panel. Furthermore, reducing heat loss also reduces the heat generated by the display panel, minimizing the impact of heat on other components (such as the driver chip), and thus extending the lifespan of the display panel.

[0011] Furthermore, by setting a smaller current value to drive multiple stacked light-emitting units while keeping the parasitic resistance of the substrate constant, the voltage drop of the substrate can be reduced, thereby improving the reliability of the substrate driving the light-emitting units to emit light.

[0012] The conductive connector avoids the light-emitting path of the light-emitting unit in the normal direction, thus preventing the conductive connector from blocking the light emitted by the light-emitting unit in the normal direction.

[0013] In some possible implementations, there are two light-emitting units, including a first light-emitting unit and a second light-emitting unit, with the first light-emitting unit closer to the substrate than the second light-emitting unit. The first light-emitting unit also includes a first transparent conductive layer, which includes a first conductive portion connected to the cathode layer of the first light-emitting unit, and extending beyond the normal light-emitting path of the first light-emitting unit. One end of a conductive connector is connected to the first conductive portion, and the other end of the conductive connector is connected to the anode layer of the second light-emitting unit.

[0014] Understandably, the first transparent conductive layer is constructed as a transparent material, which reduces the obstruction of light emitted by the light-emitting layer of the first light-emitting unit caused by the first transparent conductive layer.

[0015] Furthermore, the first conductive part is connected to the cathode layer of the first light-emitting unit and extends beyond the light-emitting path of the first light-emitting unit in the normal direction, so that the conductive connector connected to the first conductive part can avoid the light-emitting path of the first light-emitting unit in the normal direction, thereby reducing the impact of the conductive connector on the light emission of the first light-emitting unit in the normal direction.

[0016] In some possible implementations, the anode layer, cathode layer, and light-emitting layer constitute a light-emitting stack, and the first conductive portion surrounds the light-emitting stack of the first light-emitting unit. The conductive connector is located on the side of the first conductive portion away from the substrate, and the orthographic projection of the conductive connector on the substrate surrounds the orthographic projection of the light-emitting stack of the first light-emitting unit on the substrate.

[0017] A light-emitting stack body is provided with a first conductive part surrounding the first light-emitting unit, such that the first conductive part can be located outside the light-emitting path of the first light-emitting unit in the normal direction.

[0018] The conductive connector's orthographic projection on the substrate surrounds the orthographic projection of the light-emitting stack of the first light-emitting unit on the substrate, allowing the conductive connector to avoid the light emission path of the first light-emitting unit in the normal direction. Furthermore, this arrangement increases the contact area between the conductive connector and the first conductive portion, thereby reducing the contact resistance between them and helping to minimize heat loss of the light-emitting pixel.

[0019] In some possible implementations, the first light-emitting unit further includes a first transparent insulating layer, which includes a first insulating portion and surrounds a light-emitting stack of the first light-emitting unit. A first conductive portion is stacked and disposed on the side of the first insulating portion away from the substrate. The first conductive portion and the first insulating portion are connected; or, the display panel further includes a first transparent dielectric layer, a portion of which is stacked and disposed between the first conductive portion and the first insulating portion.

[0020] Understandably, the first transparent insulating layer serves as an electrical isolation layer. Furthermore, the first transparent insulating layer is constructed of a transparent material, which reduces the obstruction of light emitted by the light-emitting layer of the first light-emitting unit.

[0021] When the first conductive portion and the first insulating portion are connected, the first conductive portion can be close to the substrate, allowing the conductive member located on the side of the first conductive portion away from the substrate to surround the light-emitting stack of the first light-emitting unit. In this way, the conductive connector not only functions as a conductor but also isolates the first light-emitting units in two adjacent light-emitting pixels, reducing mutual interference between the two adjacent light-emitting pixels and suppressing optical crosstalk.

[0022] Furthermore, when the light emitted by the first light-emitting unit shines on the conductive connector, it can be reflected by the conductive connector, thereby improving the light extraction rate and thus improving the brightness of the first light-emitting unit in the normal direction, which is to say, improving the brightness of the light-emitting pixel.

[0023] When a portion of the first transparent dielectric layer is stacked between the first conductive portion and the first insulating portion, the first sublayer can elevate the first conductive portion, which means it can reduce the distance between the first conductive portion and the second light-emitting unit in the thickness direction of the substrate.

[0024] This shortens the length of the conductive connector between the anode layer of the first conductive part and the second light-emitting unit. On the one hand, it reduces the resistance of the conductive connector, thereby reducing the heat loss of the light-emitting pixels. On the other hand, it reduces the difficulty of manufacturing the conductive connector, thereby improving the production efficiency of the display panel.

[0025] In some possible implementations, the second light-emitting unit further includes a second transparent conductive layer. The second transparent conductive layer is stacked on the side of the light-emitting layer of the second light-emitting unit closer to the first light-emitting unit and is connected to the anode layer of the second light-emitting unit. The orthographic projection of the second transparent conductive layer on the substrate covers the orthographic projection of the light-emitting stack of the first light-emitting unit on the substrate. The end of the conductive connector away from the first conductive portion is connected to the second transparent conductive layer.

[0026] The second transparent conductive layer is stacked on the side of the light-emitting layer of the second light-emitting unit that is close to the first light-emitting unit and is connected to the anode layer of the second light-emitting unit, so that the conductive connector can be connected to the anode layer of the second light-emitting unit through the second transparent conductive layer.

[0027] The orthographic projection of the second transparent conductive layer on the substrate covers the orthographic projection of the light-emitting stack of the first light-emitting unit on the substrate, so that the orthographic projection of the edge region of the second transparent conductive layer on the substrate can surround the orthographic projection of the light-emitting stack of the first light-emitting unit on the substrate.

[0028] In this way, the end of the conductive connector extending along the thickness direction of the substrate away from the first conductive part can be connected to the edge region of the second transparent conductive layer, so that the conductive connector does not need to extend between the light-emitting layer of the first light-emitting unit and the light-emitting layer of the second light-emitting unit, thereby avoiding the conductive connector from blocking the light emission path of the first light-emitting unit in the normal direction.

[0029] In some possible implementations, the end of the conductive connector away from the first conductive portion of the first light-emitting unit covers the edge region of the second transparent conductive layer.

[0030] This configuration improves the connection reliability of the conductive connector and the second transparent conductive layer, thereby improving the series connection reliability between the first light-emitting unit and the second light-emitting unit.

[0031] In some possible implementations, the conductive connector includes a first sub-conductive element and a second sub-conductive element. The first sub-conductive element is connected to a first conductive portion. The second sub-conductive element is disposed along the thickness direction of the substrate on the side of the first sub-conductive element away from the substrate, and the second sub-conductive element connects the first sub-conductive element and the second transparent conductive layer. The orthographic projection of the second sub-conductive element onto the substrate falls within the range of the orthographic projection of the first sub-conductive element onto the substrate.

[0032] Understandably, including a first sub-conductive component and a second sub-conductive component in the conductive component configuration simplifies the manufacturing process of the conductive connector and helps improve the production yield of the display panel. Furthermore, the orthographic projection of the second sub-conductive component onto the substrate falls within the range of the orthographic projection of the first sub-conductive component onto the substrate, which improves the connection reliability between the second and first sub-conductive components.

[0033] In some possible implementations, the display panel further includes a bonding layer located between two adjacent light-emitting units disposed along the thickness direction of the substrate, and the two adjacent light-emitting units disposed along the thickness direction of the substrate are bonded together by the bonding layer.

[0034] Understandably, setting the first and second light-emitting units to be bonded together via a bonding layer simplifies the process and helps improve the production efficiency of the display panel.

[0035] On the other hand, embodiments of this application provide a method for fabricating a display panel. The method includes: forming a first light-emitting unit on one side of a substrate along its thickness direction; forming a first sub-conductive element on the side of the substrate close to the first light-emitting unit, the first sub-conductive element avoiding the light emission path of the first light-emitting unit in the normal direction and connected to the cathode layer of the first light-emitting unit; forming a second light-emitting unit on the side of the first light-emitting unit away from the substrate; and forming a second sub-conductive element on the side of the first sub-conductive element away from the substrate, the second sub-conductive element connecting the anode layers of the first sub-conductive element and the second light-emitting unit.

[0036] Understandably, two adjacent light-emitting units arranged along the thickness direction of the substrate can be connected in series via conductive connectors. This allows multiple light-emitting units stacked along the thickness direction of the substrate in the light-emitting pixel to be connected in series, thereby enabling current to drive the multiple stacked light-emitting units in the light-emitting pixel to emit light together.

[0037] When the current value is constant, the brightness of the light-emitting pixel can be increased by having multiple light-emitting units stacked in the pixel emit light together. When the brightness of the light-emitting pixel is constant, a smaller current can be set to drive the multiple light-emitting units stacked in the pixel.

[0038] By using the above setting method, a smaller current value can make the light-emitting pixels reach the set brightness. This reduces the current driving the light-emitting unit while ensuring the brightness of the light-emitting pixels, thereby reducing heat loss and power consumption of the display panel. Furthermore, reducing heat loss also reduces the heat generated by the display panel, minimizing the impact of heat on other components (such as the driver chip), and thus extending the lifespan of the display panel.

[0039] Furthermore, by setting a smaller current value to drive multiple stacked light-emitting units while keeping the parasitic resistance of the substrate constant, the voltage drop of the substrate can be reduced, thereby improving the reliability of the substrate driving the light-emitting units to emit light.

[0040] Furthermore, by adopting the above-mentioned configuration, the first and second sub-conductive components of the conductive connector can be fabricated in different steps, which simplifies the process and eliminates the need to fabricate excessively long conductive components in a single step, thereby improving the production yield of the display panel.

[0041] In some possible implementations, forming a first light-emitting unit on one side of the substrate along the thickness direction of the substrate includes: forming a light-emitting stack of the first light-emitting unit, the light-emitting stack including an anode layer, a cathode layer and a light-emitting layer, the anode layer and the cathode layer being located on opposite sides of the light-emitting layer along the thickness direction of the substrate, and the anode layer being closer to the substrate than the cathode layer; forming a first transparent insulating layer, the first transparent insulating layer including a first insulating portion, the first insulating portion surrounding the light-emitting stack of the first light-emitting unit; forming a first transparent conductive layer, the first transparent conductive layer including a first conductive portion, the first conductive portion extending beyond the light emission path of the first light-emitting unit in the normal direction, and the first conductive portion being connected to the cathode layer of the first light-emitting unit; before forming the first transparent conductive layer, the method of manufacturing the display panel further includes: forming a first transparent dielectric layer on the side of the first insulating portion away from the substrate, the first transparent dielectric layer surrounding the stack of the first light-emitting unit, and the first conductive portion being stacked on the side of the first transparent dielectric layer away from the first insulating portion.

[0042] A first sublayer of the first transparent dielectric layer is formed before the first transparent conductive layer is formed, so that the first sublayer can raise the first conductive part, that is, can reduce the distance between the first conductive part and the second light-emitting unit in the thickness direction of the substrate.

[0043] This shortens the length of the conductive connector between the anode layer of the first conductive part and the second light-emitting unit. On the one hand, it reduces the resistance of the conductive connector, thereby reducing the heat loss of the light-emitting pixels. On the other hand, it reduces the difficulty of manufacturing the conductive connector, thereby improving the production efficiency and yield of the display panel. Attached Figure Description

[0044] Figure 1This is a schematic diagram of the structure of a display device provided in some embodiments of this application; Figure 2 This is a schematic diagram of the display panel under some possible conditions; Figure 3 This is a schematic diagram of the structure of a display panel provided in some embodiments of this application; Figure 4 This is a schematic diagram of the structure of a display panel provided in other embodiments of this application; Figure 5 This application provides schematic diagrams of the structure of a display panel according to some other embodiments. Figure 6 A schematic diagram showing the positional relationship between the substrate, the first light-emitting unit, and the conductive connector provided in some embodiments of this application; Figure 7 A schematic diagram showing the positional relationship between the substrate, the first light-emitting unit, and the conductive connector provided in other embodiments of this application; Figure 8 A schematic diagram showing the positional relationship between the substrate, the first light-emitting unit, and the conductive connector provided in some embodiments of this application; Figure 9 A flowchart illustrating the steps of a method for manufacturing a display panel according to some embodiments of this application; Figure 10 A schematic diagram showing the positional relationship between the stack of the first light-emitting unit, the bonding metal, and the substrate provided in some embodiments of this application; Figure 11 A flowchart illustrating the steps of a method for manufacturing a display panel according to other embodiments of this application; Figure 12 This is a schematic diagram showing the positional relationship between the first transparent insulating layer, the light-emitting stack, and the substrate provided in some embodiments of this application; Figure 13 A schematic diagram showing the positional relationship between the first transparent conductive layer, the first transparent insulating layer, the light-emitting stack, and the substrate provided in some embodiments of this application; Figure 14 A schematic diagram showing the positional relationship between the first sublayer, the first transparent insulating layer, the light-emitting stack, and the substrate provided in some embodiments of this application; Figure 15 A schematic diagram showing the positional relationship between the first light-emitting unit and the first sub-conductive component provided in some embodiments of this application; Figure 16 A schematic diagram showing the positional relationship between the first light-emitting unit, the first sub-conductive element, and the first dielectric layer provided in some embodiments of this application; Figure 17 A schematic diagram showing the positional relationship between the second stacked structure, the substrate, the first light-emitting unit, and the substrate provided in some embodiments of this application; Figure 18This is a schematic diagram showing the positional relationship between the second stacked structure, the first light-emitting unit, and the substrate provided in some embodiments of this application; Figure 19 This is a schematic diagram showing the positional relationship between the light-emitting stack of the second light-emitting unit, the first light-emitting unit, and the substrate provided in some embodiments of this application; Figure 20 This is a schematic diagram showing the location of the receiving hole provided in some embodiments of this application; Figure 21 This is a schematic diagram showing the positional relationship between the second sub-conductive element and the first sub-conductive element provided in some embodiments of this application; Figure 22 This is a schematic diagram showing the positional relationship between the second transparent insulating layer and the light-emitting stack of the second light-emitting unit provided in some embodiments of this application; Figure 23 A schematic diagram showing the positional relationship of the second transparent conductive layer, the second transparent insulating layer, and the light-emitting unit stack provided in some embodiments of this application; Figure 24 This is a schematic diagram showing the positional relationship between the cathode metal and the third transparent conductive layer provided in some embodiments of this application; Figure 25 This is a schematic diagram showing the positional relationship between the second dielectric layer and the second light-emitting unit provided in some embodiments of this application.

[0045] Explanation of icon numbers: 200 - Display panel, 201 - First transparent dielectric layer, 2011 - First sub-layer, 2012 - Second sub-layer, 202 - Second transparent dielectric layer, 203 - Cathode metal, 204 - Microlens, 205 - Bonding layer, 210 - Substrate, 211 - Anode contact, 220 - Light-emitting pixel, 221 - Bonding metal, 230 - Light-emitting unit, 230a - First light-emitting unit, 230b - Second light-emitting unit, 231 - Anode layer, 231a - Second initial anode layer, 232 - Cathode layer, 232a - Second initial cathode layer, 233 - Light-emitting layer, 233a - Second initial light-emitting layer, 234 - First transparent conductive layer, 2341 - First conductive part, 2342 - Second conductive part, 2343 - Third conductive part, 235 - First transparent insulating layer, 2351 - First insulating part, 2352 - Second insulating part, 2353 - Third insulating layer, 236-Second transparent conductive layer, 236a-Second initial transparent conductive layer, 237-Anode ohmic contact layer, 237a-Second initial anode ohmic contact layer, 238-Cathode ohmic contact layer, 238a-Second initial cathode ohmic contact layer, 251-Third transparent conductive layer, 2511-Fourth conductive layer, 2512-Fifth conductive layer, 2513-Sixth conductive layer, 252-Second transparent insulating layer, 2521-Fourth insulating layer, 2522-Fifth insulating layer, 2523-Sixth insulating layer, 260-Light-emitting stack, 262-Second stacked structure, 240-Conductive connector, 241-First sub-conductive component, 242-Second sub-conductive component, 300-Display device, 310-Housing, 320-Support, 401-Substrate, Z-Thickness direction, P1-First through hole, P2-Second through hole, M-Receiving hole. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all possible embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0047] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0048] As used herein, terms such as “equal,” “parallel,” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equal items less than or equal to 5% of either one.

[0049] In the embodiments of this application, the directional indications used to explain the structure and movement of different components, such as up, down, left, right, front, and back, are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component positions changes, these directional indications will also change accordingly.

[0050] Figure 1 This is a schematic diagram of the structure of a display device provided in some embodiments of this application. For example... Figure 1 As shown, an embodiment of this application provides a display device 300, which has an image display function.

[0051] The display device 300 can be a television, laptop computer, tablet computer, in-vehicle computer, smartphone, smartwatch, projection device, head-up display (HDU), augmented reality (AR) glasses, etc. The embodiments of this application do not further limit the specific form of the display device 300.

[0052] like Figure 1 As shown, the display device 300 may include a display panel 200 and a housing 310, wherein the display panel 200 is used to display image information.

[0053] The display panel 200 can be a light-emitting diode (LED) display panel, for example, it can be one of a micro light-emitting diode (Micro LED) display panel and a mini light-emitting diode (Mini LED) display panel.

[0054] Understandably, Mini LED display panels and Micro LED display panels have advantages such as self-illumination, high brightness, high contrast, high resolution, high color saturation, long lifespan, and fast response speed. This application uses a Micro LED display panel 200 as an example for illustration.

[0055] The display panel 200 includes a light-emitting side and a backlight side that are arranged opposite to each other. The housing 310 can be disposed on the backlight side and connected to the display panel 200, so that the housing 310 can protect the display panel 200 and reduce the impact of the housing 310 on the light emitting side of the display panel 200.

[0056] like Figure 1 As shown, the display device 300 may also include a bracket 320, which is connected to the side of the housing 310 that is close to the ground when in use, and serves to support the housing 310 and the display panel 200.

[0057] The embodiments of this application do not further limit other components of the display device 300; the display panel 200 is described below as an example.

[0058] Figure 2 This is a schematic diagram of the display panel structure under some possible conditions. In some examples, such as... Figure 2 As shown, the display panel 200 may include a substrate 210 and a plurality of light-emitting pixels 220. The plurality of light-emitting pixels 220 are disposed on one side of the substrate 210 along the thickness direction Z of the substrate 210, and the plurality of light-emitting pixels 220 are spaced apart.

[0059] Understandably, each light-emitting pixel 220 can emit light independently. Multiple light-emitting pixels 220 may include red, green, and blue light-emitting pixels, with the red pixels emitting red light, the green pixels emitting green light, and the blue pixels emitting blue light. By adjusting the brightness of the red, green, and blue light-emitting pixels, the display panel 200 can achieve full-color display.

[0060] The substrate 210 can be one of a printed circuit board (PCB), a flexible printed circuit (FPC), a glass substrate, or a complementary metal-oxide-semiconductor (CMOS) driving backplane. The embodiments of this application do not further limit the specific form of the substrate 210.

[0061] The substrate 210 is provided with an anode contact 211 and a cathode contact (not shown in the figure), which are respectively connected to the light-emitting pixel 220. This allows current to flow through the light-emitting pixel 220, thereby enabling the light-emitting pixel 220 to emit light. The substrate 210 may also be provided with a driver chip or other control devices for driving the light-emitting pixel 220 to emit light.

[0062] The embodiments of this application do not further limit other devices disposed on the substrate 210. The light-emitting pixel 220 is described below as an example.

[0063] Continue to refer to Figure 2 In some examples, the light-emitting pixel 220 includes a light-emitting unit 230, which may include an anode layer 231, a cathode layer 232, and a light-emitting layer 233.

[0064] The light-emitting layer 233 can be a multiple quantum well (MQW) structure. When the light-emitting pixel 220 is a blue or green light-emitting pixel, the material of the light-emitting layer 233 can include indium gallium nitride (InGaN). When the light-emitting pixel 220 is a red light-emitting pixel, the material of the light-emitting layer 233 can include aluminum gallium indium phosphide (AlGaInP). Alternatively, the light-emitting layer 233 can also include other materials; the embodiments of this application do not further limit the material of the light-emitting layer 233.

[0065] The anode layer 231 is stacked along the thickness direction Z of the substrate 210 on one side of the light-emitting layer 233, and the anode layer 231 is used to provide holes for the light-emitting layer 233.

[0066] For example, the anode layer 231 can be a P-type semiconductor layer, enabling it to provide holes for the light-emitting layer 233. When the light-emitting pixel 220 is a blue or green light-emitting pixel, the material of the anode layer 231 can include P-type gallium nitride. When the light-emitting pixel 220 is a red light-emitting pixel, the material of the anode layer 231 can include P-type aluminum gallium indium phosphide. Alternatively, the anode layer 231 can also include other materials; the embodiments of this application do not further limit the material of the anode layer 231.

[0067] The cathode layer 232 is stacked along the thickness direction Z of the substrate 210 on the side of the light-emitting layer 233 away from the anode layer 231. The cathode layer 232 is used to provide electrons to the light-emitting layer 233. Electrons and holes recombine in the light-emitting layer 233 to make the light-emitting layer 233 emit light.

[0068] For example, the cathode layer 232 can be an N-type semiconductor layer, enabling it to provide electrons to the light-emitting layer 233. When the light-emitting pixel 220 is a blue or green light-emitting pixel, the material of the cathode layer 232 can include N-type gallium nitride. When the light-emitting pixel 220 is a red light-emitting pixel, the material of the cathode layer 232 can include N-type aluminum gallium indium phosphide. Alternatively, the cathode layer 232 can also include other materials; the embodiments of this application do not further limit the material of the cathode layer 232.

[0069] The anode layer 231 can be connected to the anode contact 211 of the substrate 210, and the cathode layer 232 can be connected to the cathode contact of the substrate 210, so that the holes in the anode layer 231 and the electrons in the cathode layer 232 can move to the light-emitting layer 233, and the electrons and holes recombine to emit light in the light-emitting layer 233, thereby enabling the light-emitting pixel 220 to emit light.

[0070] For example, the light-emitting unit 230 can be driven digitally, that is, the pulse width modulation (PWM) method can be used to adjust the pulse width of the light-emitting unit 230's turn-on time, thereby adjusting the intensity of the light emitted by the light-emitting pixel 220.

[0071] Understandably, the light-emitting unit 230 is driven by current. Within a certain current range, the greater the current flowing through the light-emitting unit 230, the greater its luminous brightness. To increase the luminous brightness of the light-emitting unit, a larger current is usually required to drive the light-emitting unit 230.

[0072] However, when a large current flows through the substrate 210, the heat loss is greater, which leads to an increase in the power consumption of the display panel 200. In addition, the greater heat loss will also increase the heat generated by the display panel 200, which will shorten the lifespan of other components (such as the driver chip disposed on the substrate 210).

[0073] Furthermore, due to the parasitic resistance of the substrate 210, an increase in current will lead to an increase in the voltage drop of the substrate 210, affecting the reliability of the substrate 210 in driving the light-emitting unit 230 to emit light.

[0074] For example, when the area of ​​the display panel 200 is 1 square centimeter and the current density is 10 amperes per square centimeter, a parasitic resistance of 0.1 ohms will produce a voltage drop of 1 volt. If the power supply voltage of the display panel 200 is 5V, the voltage drop will account for 20% of the power supply voltage, affecting the light-emitting reliability of the light-emitting unit 230.

[0075] Furthermore, as the size of the light-emitting unit 230 increases, the current density will increase further, and the voltage drop caused by parasitic resistance will also be greater, which will have a more significant impact on the light emission of the light-emitting unit 230.

[0076] Figure 3 This is a schematic diagram of the structure of a display panel provided in some embodiments of this application. Figure 4 This is a schematic diagram of the structure of a display panel provided in some other embodiments of this application. Figure 5 This is a schematic diagram of the structure of a display panel provided in some embodiments of this application.

[0077] To reduce heat loss and voltage drop of substrate 210 while ensuring the luminous brightness of light-emitting pixel 220, such as Figure 3 , Figure 4 and Figure 5 As shown, the light-emitting pixel 220 provided in the embodiment of this application includes a plurality of light-emitting units 230, which are stacked along the thickness direction Z of the substrate 210.

[0078] For example, the number of light-emitting units 230 in the light-emitting pixel 220 can be two, three, or more. The embodiments of this application do not further limit the number of light-emitting units 230 in the light-emitting pixel 220. The light-emitting colors of different light-emitting units 230 in the same light-emitting pixel 220 can be the same, so that the light-emitting pixel 220 can emit a single monochromatic light.

[0079] Continue to refer to Figure 3 , Figure 4 and Figure 5 The light-emitting pixel 220 also includes a conductive connector 240, which is disposed between two light-emitting units 230 along the thickness direction Z of the substrate 210. The conductive connector 240 connects the anode layer 231 of one light-emitting unit 230 and the cathode layer 232 of the other light-emitting unit 230, which are adjacent to each other along the thickness direction Z of the substrate 210. Furthermore, the conductive connector 240 avoids the light-emitting path of the light-emitting unit 230 in the normal direction.

[0080] For example, the conductive connector 240 can be made of metal to ensure its conductivity. For example, the material of the conductive connector 240 may include gold, silver, copper, etc., and the embodiments of this application do not further limit the material of the conductive connector 240.

[0081] The conductive connector 240 is located between two adjacent light-emitting units 230 arranged along the thickness direction Z of the substrate 210, and the conductive connector 240 extends along the thickness direction Z of the substrate 210, so that the conductive connector 240 can connect the anode layer 231 of one light-emitting unit 230 and the cathode layer 232 of the other light-emitting unit 230 arranged adjacent to each other along the thickness direction of the substrate 210.

[0082] In other words, two light-emitting units 230 arranged adjacent to each other along the thickness direction Z of the substrate 210 can be connected in series through conductive connectors 240. There can be multiple conductive connectors 240, and different light-emitting units 230 arranged adjacent to each other along the thickness direction Z of the substrate 210 can be connected in series through different conductive connectors 240.

[0083] In this way, the multiple light-emitting units 230 stacked along the thickness direction Z of the substrate 210 in the light-emitting pixel 220 can be connected in series, so that the current can drive the multiple light-emitting units 230 stacked in the light-emitting pixel 220 to emit light together.

[0084] Understandably, when the current value is constant, the brightness of the light-emitting pixel 220 can be increased by the multiple light-emitting units 230 stacked in the light-emitting pixel 220 emitting light together; when the brightness of the light-emitting pixel 220 is constant, a smaller current can be set to drive the multiple light-emitting units 230 stacked in the light-emitting pixel 220.

[0085] By using the above setting method, a smaller current value can make the light-emitting pixel 220 reach the set light-emitting brightness. While ensuring the light-emitting brightness of the light-emitting pixel 220, the current driving the light-emitting unit 230 can be reduced, thereby reducing heat loss and helping to reduce the power consumption of the display panel 200. In addition, reducing heat loss can also reduce the heat generated by the display panel 200, reduce the impact of heat on other devices (such as the driver chip), and help to extend the service life of the display panel 200.

[0086] Furthermore, by setting a smaller current value to drive the stacked light-emitting units 230 while keeping the parasitic resistance of the substrate 210 constant, the voltage drop of the substrate 210 can be reduced, thereby improving the reliability of the substrate 210 in driving the light-emitting units 230 to emit light.

[0087] In other words, the embodiments of this application, through a vertically stacked and cascaded pixel structure, enable the light-emitting pixel 220 to achieve low-power, high-brightness light emission without increasing the driving difficulty of the light-emitting pixel 220 or increasing the space occupied by the light-emitting pixel 220 on the substrate 210. For example, the light-emitting pixel 220 can be referred to as a high-voltage light-emitting pixel.

[0088] The conductive connector 240 avoids the light-emitting path of the light-emitting unit 230 in the normal direction, thus preventing the conductive connector 240 from blocking the light of the light-emitting unit 230 in the normal direction.

[0089] Continue to refer to Figure 3 , Figure 4 and Figure 5 In some examples, there are two light-emitting units 230, including a first light-emitting unit 230a and a second light-emitting unit 230b, with the first light-emitting unit 230a closer to the substrate 210 than the second light-emitting unit 230b.

[0090] For example, the anode layer 231 of the first light-emitting unit 230a can be connected to the anode contact 211 of the substrate 210, the cathode layer 232 of the first light-emitting unit 230a can be connected to the anode layer 231 of the second light-emitting unit 230b through the conductive connector 240, and the cathode layer 232 of the second light-emitting unit 230b can be connected to the anode contact 211 of the substrate 210.

[0091] In this way, the first light-emitting unit 230a and the second light-emitting unit 230b connected in series can be connected to the anode contact 211 and the cathode contact of the substrate 210, so that current can flow through the first light-emitting unit 230a and the second light-emitting unit 230b connected in series to drive the first light-emitting unit 230a and the second light-emitting unit 230b to emit light.

[0092] Understandably, when the current value is constant, the first light-emitting unit 230a and the second light-emitting unit 230b emit light together, making the brightness of the light-emitting pixel 220 twice as high. When the brightness is constant, the current value can be reduced by half to drive the light-emitting pixel 220, thereby reducing heat loss.

[0093] Continue to refer to Figure 3 , Figure 4 and Figure 5 For example, the anode layer 231 of the first light-emitting unit 230a is closer to the substrate 210 than the cathode layer 232 of the first light-emitting unit 230a. The light-emitting pixel 220 also includes a bonding metal 221 disposed between the anode layer 231 of the first light-emitting unit 230a and the anode contact 211 of the substrate 210, and the anode layer 231 of the first light-emitting unit 230a is bonded to the anode contact 211 of the substrate 210 through the bonding metal 221.

[0094] For example, the material of the bonding metal 221 may include gold, silver or copper, etc. The embodiments of this application do not further limit the material of the bonding metal 221.

[0095] The bonding metal 221 and the anode contact 211 of the substrate 210 can be connected by hybrid bonding (HB), or the bonding metal 221 and the anode contact 211 of the substrate 210 can be connected by other means. The embodiments of this application do not further limit this.

[0096] Understandably, there are multiple bonding metals 221, which are spaced apart. The first light-emitting unit 230a in the multiple light-emitting pixels 220 is connected to the multiple anode contacts 211 on the substrate 210 one by one through the multiple bonding metals 221, so as to reduce the mutual influence between the first light-emitting units 230a in different light-emitting pixels 220.

[0097] In some examples, such as Figure 3 , Figure 4 and Figure 5 As shown, the anode layer 231, cathode layer 232, and light-emitting layer 233 can form a light-emitting stack 260. The light-emitting stack 260 may also include an ohmic contact layer, which includes an anode ohmic contact layer 237 and a cathode ohmic contact layer 238. The anode ohmic contact layer 237 is stacked on the side of the anode layer 231 away from the cathode layer 232, and the cathode ohmic contact layer 238 is stacked on the layer of the cathode layer 232 away from the anode layer 231.

[0098] Understandably, the ohmic contact layer (including the anode ohmic contact layer 237 and the cathode ohmic contact layer 238) has good conductivity and can reduce the resistance between the anode layer 231 and the cathode layer 232 and other film layers.

[0099] Alternatively, the light-emitting stack 260 may not include an ohmic contact layer. The embodiments of this application use an example where the light-emitting stack 260 includes an ohmic contact layer, and will be further illustrated below.

[0100] For example, such as Figure 3 , Figure 4 and Figure 5 As shown, the anode ohmic contact layer 237 of the first light-emitting unit 230a can be stacked between the anode layer 231 and the bonding metal 221 of the first light-emitting unit 230a. The anode layer 231 of the first light-emitting unit 230a is connected to the bonding metal 221 through the anode ohmic contact layer 237, so as to reduce the resistance between the anode layer 231 and the bonding metal 221 of the first light-emitting unit 230a, thereby reducing the heat loss of the light-emitting pixel 220.

[0101] For example, the bonding metal 221 protrudes from the light-emitting stack 260 of the first light-emitting unit 230a to ensure the reliability of the connection between the bonding metal 221 and the light-emitting stack 260 of the first light-emitting unit 230a and the anode contact 211 of the substrate 210.

[0102] Figure 6 This is a schematic diagram showing the positional relationship between the substrate, the first light-emitting unit, and the conductive connector provided in some embodiments of this application. Figure 7 This is a schematic diagram showing the positional relationship between the substrate, the first light-emitting unit, and the conductive connector provided in other embodiments of this application. Figure 8 This is a schematic diagram showing the positional relationship between the substrate, the first light-emitting unit, and the conductive connector provided in some embodiments of this application.

[0103] Understandably, in order to simplify the structure of the accompanying drawings, Figure 6 , Figure 7 and Figure 8 Only one first light-emitting unit 230a disposed on the substrate 210 is shown.

[0104] In some examples, such as Figure 6 , Figure 7 and Figure 8 As shown, the first light-emitting unit 230a also includes a first transparent conductive layer 234. For example, the material of the first transparent conductive layer 234 may include indium tin oxide (ITO) or indium zinc oxide (IZO). The embodiments of this application do not further limit the material of the first transparent conductive layer 234.

[0105] For example, such as Figure 3 , Figure 4 and Figure 5 As shown, the first transparent conductive layer 234 of the first light-emitting unit 230a in different light-emitting pixels 220 can be disconnected to avoid short circuits between the first light-emitting units 230a of multiple light-emitting pixels 220.

[0106] The first transparent conductive layer 234 includes a first conductive portion 2341, which is connected to the cathode layer 232 of the first light-emitting unit 230a, and the first conductive portion 2341 extends beyond the light-emitting path of the first light-emitting unit 230a in the normal direction.

[0107] One end of the conductive connector 240 is connected to the first conductive part 2341, and the other end of the conductive connector 240 is connected to the anode layer 231 of the second light-emitting unit 230b. The conductive connector 240 avoids the light-emitting path of the first light-emitting unit 230a in the normal direction.

[0108] The first transparent conductive layer 234 is constructed as a transparent material, which reduces the obstruction of light emitted by the light-emitting layer 233 of the first light-emitting unit 230a by the first transparent conductive layer 234.

[0109] Furthermore, the first conductive part 2341 is connected to the cathode layer 232 of the first light-emitting unit 230a and extends beyond the light emission path of the first light-emitting unit 230a in the normal direction, so that the conductive connector 240 connected to the first conductive part 2341 can avoid the light emission path of the first light-emitting unit 230a in the normal direction, thereby reducing the impact of the conductive connector 240 on the light emission of the first light-emitting unit 230a in the normal direction.

[0110] Understandably, the light emission path of the first light-emitting unit 230a in the normal direction is the same as or approximately the same as the thickness direction Z of the substrate 210. The light emission path of the first light-emitting unit 230a in the normal direction is the main light emission path of the first light-emitting unit 230a.

[0111] For example, such as Figure 6 , Figure 7 and Figure 8 As shown, the first transparent conductive layer 234 may further include a second conductive portion 2342 and a third conductive portion 2343. The second conductive portion 2342 is connected to the cathode layer 232 of the first light-emitting unit 230a, and the third conductive portion 2343 is connected to the first conductive portion 2341 and the second conductive portion 2342.

[0112] For example, the second conductive portion 2342 can be stacked along the thickness direction Z of the substrate 210 on the side of the cathode ohmic contact layer 238 of the first light-emitting unit 230a away from the cathode layer 232 of the first light-emitting unit 230a, so that the second conductive portion 2342 can be connected to the cathode layer 232 of the first light-emitting unit 230a through the cathode ohmic contact layer 238 of the first light-emitting unit 230a, thereby reducing the contact resistance between the cathode layer 232 of the first light-emitting unit 230a and the second conductive portion 2342, thereby reducing the heat loss of the light-emitting pixel 220.

[0113] The third conductive portion 2343 connects the first conductive portion 2341 and the second conductive portion 2342, allowing the first conductive portion 2341 to extend beyond the light emission path of the first light-emitting unit 230a in the normal direction. For example, the third conductive portion 2343 may surround the side of the light-emitting stack 260.

[0114] In some examples, the first conductive portion 2341 surrounds the light-emitting stack 260 of the first light-emitting unit 230a. In this way, the first conductive portion 2341 can be located outside the light-emitting path of the first light-emitting unit 230a in the normal direction.

[0115] The conductive connector 240 is located on the side of the first conductive portion 2341 away from the substrate 210, and the orthographic projection of the conductive connector 240 on the substrate 210 surrounds the orthographic projection of the light-emitting stack 260 of the first light-emitting unit 230a on the substrate 210.

[0116] Understandably, the conductive connector 240 is located on the side of the first conductive portion 2341 away from the substrate 210, so that the conductive connector 240 can be connected to the first conductive portion 2341.

[0117] For example, the conductive connector 240 may be located on the outer periphery of the light-emitting stack 260 of the first light-emitting unit 230a, such that the orthographic projection of the conductive connector 240 on the substrate 210 can surround the orthographic projection of the light-emitting stack 260 of the first light-emitting unit 230a on the substrate 210.

[0118] Alternatively, the conductive connector 240 may be located on the side of the light-emitting stack 260 of the first light-emitting unit 230a away from the substrate 210, and the orthographic projection of the conductive connector 240 on the substrate 210 surrounds the orthographic projection of the light-emitting stack 260 of the first light-emitting unit 230a on the substrate 210.

[0119] The conductive connector 240 is positioned such that its orthographic projection on the substrate 210 surrounds the orthographic projection of the light-emitting stack 260 of the first light-emitting unit 230a on the substrate 210, allowing the conductive connector 240 to avoid the light emission path of the first light-emitting unit 230a in the normal direction. Furthermore, this arrangement increases the contact area between the conductive connector 240 and the first conductive portion 2341, thereby reducing the contact resistance between them and helping to reduce heat loss of the light-emitting pixel 220.

[0120] Continue to refer to Figure 6 , Figure 7 and Figure 8 The first light-emitting unit 230a may further include a first transparent insulating layer 235. For example, the material of the first transparent insulating layer 235 may include an oxide, such as silicon oxide. Alternatively, the material of the first transparent insulating layer 235 may also include a nitride, such as silicon nitride. It is understood that the first transparent insulating layer 235 may also include other materials besides oxides and nitrides, and the embodiments of this application do not further limit the material of the first transparent insulating layer 235.

[0121] Understandably, the first transparent insulating layer 235 can serve as an electrical isolation layer. For example, the first transparent insulating layer 235 can cover the surface of the light-emitting stack 260 of the first light-emitting unit 230a away from the substrate 210, so that the first transparent insulating layer 235 can electrically isolate the light-emitting stack 260 of the first light-emitting unit 230a from other film layers.

[0122] Furthermore, the first transparent insulating layer 235 is constructed as a transparent material, which reduces the obstruction of light emitted by the light-emitting layer 233 of the first light-emitting unit 230a caused by the first transparent insulating layer 235.

[0123] In some examples, such as Figure 6 , Figure 7 and Figure 8 As shown, the first transparent insulating layer 235 may include a first insulating portion 2351, the first insulating portion 2351 surrounds the light-emitting stack 260 of the first light-emitting unit 230a, and the first conductive portion 2341 is stacked on the side of the first insulating portion 2351 away from the substrate 210.

[0124] For example, the first insulating portion 2351 can cover the portion of the bonding metal 221 that protrudes from the light-emitting stack 260 of the first light-emitting unit 230a, thereby electrically isolating the bonding metal 221 from other film layers (e.g., the first conductive portion 2341 of the first transparent conductive layer 234).

[0125] For example, the first transparent insulating layer 235 may further include a second insulating portion 2352 and a third insulating portion 2353. The second insulating portion 2352 is stacked along the thickness direction Z of the substrate 210 between the second conductive portion 2342 and the light-emitting stack 260 of the first light-emitting unit 230a. A first through hole P1 is formed on the second insulating portion 2352, and a portion of the second conductive portion 2342 is located in the first through hole P1.

[0126] Understandably, the first via P1 exposes the light-emitting stack 260 of the first light-emitting unit 230a (e.g., the cathode ohmic contact layer 238 of the first light-emitting unit 230a). A portion of the second conductive part 2342 is located within the first via P1, allowing the second conductive part 2342 to connect with the cathode ohmic contact layer 238 of the first light-emitting unit 230a, thereby enabling the second conductive part 2342 to connect with the cathode layer 232 of the first light-emitting unit 230a through the cathode ohmic contact layer 238 of the first light-emitting unit 230a.

[0127] The third insulating portion 2353 connects the second insulating portion 2352 and the first insulating portion 2351. For example, the third insulating portion 2353 may cover the side of the light-emitting stack 260 and is located between the light-emitting stack 260 and the third conductive portion 2343.

[0128] like Figure 6 , Figure 7 and Figure 8 As shown, the first conductive portion 2341 is stacked on the side of the first insulating portion 2351 away from the substrate 210. In some examples, such as Figure 6 As shown, the first conductive part 2341 and the first insulating part 2351 are connected.

[0129] Understandably, the first insulating portion 2351 covers the portion of the bonding metal 221 that protrudes from the light-emitting stack 260 of the first light-emitting unit 230a. The first conductive portion 2341 is connected to the first insulating portion 2351, so that the first conductive portion 2341 can approach the substrate 210, thereby enabling the conductive connector 240 located on the side of the first conductive portion 2341 away from the substrate 210 to surround the light-emitting stack 260 of the first light-emitting unit 230a.

[0130] In this way, the conductive connector 240 can not only conduct electricity, but also isolate the first light-emitting unit 230a in two adjacent light-emitting pixels 220, thereby reducing the mutual interference between the two adjacent light-emitting pixels 220 and suppressing optical crosstalk.

[0131] Furthermore, when the light emitted by the first light-emitting unit 230a shines on the conductive connector 240, it can be reflected by the conductive connector 240, thereby improving the light extraction rate and thus improving the brightness of the first light-emitting unit 230a in the normal direction, which is to say, improving the brightness of the light-emitting pixel 220.

[0132] In some examples, the display panel 200 further includes a first transparent dielectric layer 201. For instance, the material of the first transparent dielectric layer 201 may include an oxide, such as silicon oxide. Alternatively, the material of the first transparent dielectric layer 201 may also include a nitride, such as silicon nitride. It is understood that the first transparent dielectric layer 201 may also include other materials besides oxides and nitrides, and the embodiments of this application do not further limit the material of the first transparent dielectric layer 201.

[0133] like Figure 3 As shown, when the first conductive portion 2341 is stacked on the side of the first insulating portion 2351 away from the substrate 210 and connected to the first insulating portion 2351, the first transparent dielectric layer 201 can be stacked on the side of the first insulating portion 2351 away from the substrate 210 to cover the first light-emitting unit 230a, so as to protect the first light-emitting unit 230a.

[0134] like Figure 7 and Figure 8 As shown, in some other examples, a portion of the first transparent dielectric layer 201 is stacked between the first conductive portion 2341 and the first insulating portion 2351.

[0135] Combination Figure 4 , Figure 5 , Figure 7 and Figure 8The first transparent dielectric layer 201 may include a first sublayer 2011 and a second sublayer 2012. The first sublayer 2011 may be stacked between the first conductive portion 2341 and the first insulating portion 2351, and the second sublayer 2012 may be stacked on the side of the first conductive portion 2341 away from the first sublayer 2011.

[0136] For example, the materials of the first sublayer 2011 and the second sublayer 2012 may be the same or different, and the embodiments of this application do not further limit this.

[0137] Understandably, one side of the first transparent dielectric layer 201 is stacked between the first conductive portion 2341 and the first insulating portion 2351, so that the first sublayer 2011 can raise the first conductive portion 2341, that is, it can reduce the distance between the first conductive portion 2341 and the second light-emitting unit 230b in the thickness direction Z of the substrate 210.

[0138] In this way, the length of the conductive connector 240 connecting the first conductive part 2341 and the anode layer 231 of the second light-emitting unit 230b can be shortened. On the one hand, the resistance of the conductive connector 240 can be reduced, thereby reducing the heat loss of the light-emitting pixel 220. On the other hand, the difficulty of manufacturing the conductive connector 240 can be reduced, thereby improving the production efficiency and yield of the display panel 200.

[0139] For example, such as Figure 4 As shown, when a portion of the first transparent dielectric layer 201 is stacked between the first conductive portion 2341 and the first insulating portion 2351, along the thickness direction Z of the substrate 210, the end face of the conductive connector 240 away from the second light-emitting unit 230b can be flush with or approximately flush with the light-emitting layer 233 of the first light-emitting unit 230a.

[0140] In this way, the conductive connector 240 can reflect a portion of the light emitted by the first light-emitting unit 230a, thereby the conductive connector 240 can suppress light crosstalk between two adjacent light-emitting pixels 220 and ensure the light mixing effect between the first light-emitting units 230a of the two adjacent light-emitting pixels 220.

[0141] Or, such as Figure 5 As shown, when a portion of the first transparent dielectric layer 201 is stacked between the first conductive portion 2341 and the first insulating portion 2351, along the thickness direction Z of the substrate 210, the end face of the conductive connector 240 away from the second light-emitting unit 230b can be flush with or approximately flush with the side surface of the light-emitting stack 260 of the first light-emitting unit 230a away from the substrate 210.

[0142] This reduces the impact of the conductive connector 240 on the light emitted by the first light-emitting unit 230a, thus improving the light mixing effect between the first light-emitting units 230a of two adjacent light-emitting pixels 220. Furthermore, it allows for a shorter length of the conductive connector 240, reducing its resistance and manufacturing difficulty, thereby improving the production efficiency and yield of the display panel 200.

[0143] In some examples, such as Figure 3 , Figure 4 and Figure 5 As shown, the second light-emitting unit 230b also includes a second transparent conductive layer 236.

[0144] For example, the material of the second transparent conductive layer 236 may include indium tin oxide (ITO) or indium zinc oxide (IZO). The embodiments of this application do not further limit the material of the second transparent conductive layer 236. It is understood that the materials of the second transparent conductive layer 236 and the first transparent conductive layer 234 may be the same or different.

[0145] Understandably, the second transparent conductive layer 236 is constructed as a transparent material, which can reduce the obstruction of light emitted by the first light-emitting unit 230a by the second transparent conductive layer 236.

[0146] The second transparent conductive layer 236 is stacked on the side of the light-emitting layer 233 of the second light-emitting unit 230b that is close to the first light-emitting unit 230a, and is connected to the anode layer 231 of the second light-emitting unit 230b.

[0147] For example, the anode layer 231 of the second light-emitting unit 230b can be close to the first light-emitting unit 230a relative to the cathode layer 232 of the second light-emitting unit 230b, so that the second transparent conductive layer 236 can be connected to the anode layer 231 of the second light-emitting unit 230b.

[0148] In this way, the conductive connector 240 can be connected to the anode layer 231 of the second light-emitting unit 230b through the second transparent conductive layer 236.

[0149] like Figure 3 , Figure 4 and Figure 5 As shown, the orthographic projection of the second transparent conductive layer 236 on the substrate 210 covers the orthographic projection of the light-emitting stack 260 of the first light-emitting unit 230a on the substrate 210. One end of the conductive connector 240 away from the first conductive portion 2341 is connected to the second transparent conductive layer 236.

[0150] Understandably, the orthographic projection of the second transparent conductive layer 236 on the substrate 210 covers the orthographic projection of the light-emitting stack 260 of the first light-emitting unit 230a on the substrate 210, so that the orthographic projection of the edge region of the second transparent conductive layer 236 on the substrate 210 can surround the orthographic projection of the light-emitting stack 260 of the first light-emitting unit 230a on the substrate 210.

[0151] In this way, the end of the conductive connector 240 extending along the thickness direction Z of the substrate 210 away from the first conductive portion 2341 can be connected to the edge region of the second transparent conductive layer 236, so that the conductive connector 240 does not need to extend between the light-emitting layer 233 of the first light-emitting unit 230a and the light-emitting layer 233 of the second light-emitting unit 230b, thereby avoiding the conductive connector 240 from blocking the light emission path of the first light-emitting unit 230a in the normal direction.

[0152] In some examples, such as Figure 3 , Figure 4 and Figure 5 As shown, the display panel 200 also includes a bonding layer 205, which is located between two light-emitting units 230 that are adjacent to each other along the thickness direction Z of the substrate 210. The two light-emitting units 230 that are adjacent to each other along the thickness direction Z of the substrate 210 are bonded together by the bonding layer 205.

[0153] For example, the material of the bonding layer 205 may include silicon dioxide, polyimide (PI), or epoxy-based negative thick-film etchant (e.g., SU-8 etchant), etc. The embodiments of this application do not further limit the material of the bonding layer 205. The materials of the bonding layer 205 and the transparent dielectric layer (including the first transparent dielectric layer 201 and the second transparent dielectric layer 202) may be the same or different.

[0154] The bonding layer 205 can be stacked between the second transparent conductive layer 236 and the first transparent dielectric layer 201. The second transparent conductive layer 236 can be bonded to the first transparent dielectric layer 201 through the bonding layer 205, thereby enabling the first light-emitting unit 230a and the second light-emitting unit 230b to be bonded through the bonding layer 205.

[0155] Understandably, setting the first light-emitting unit 230a and the second light-emitting unit 230b to be bonded through the bonding layer 205 is a simple process that helps improve the production efficiency of the display panel 200.

[0156] Continue to refer to Figure 3 , Figure 4 and Figure 5 In some examples, the end of the conductive connector 240 away from the first conductive portion 2341 of the first light-emitting unit 230a covers the edge region of the second transparent conductive layer 236.

[0157] This configuration improves the connection reliability of the conductive connector 240 and the second transparent conductive layer 236, thereby improving the series connection reliability between the first light-emitting unit 230a and the second light-emitting unit 230b.

[0158] Continue to refer to Figure 3 , Figure 4 and Figure 5 In some examples, the conductive connector 240 includes a first sub-conductive element 241 and a second sub-conductive element 242, with the first sub-conductive element 241 connected to the first conductive portion 2341. The second sub-conductive element 242 is disposed along the thickness direction Z of the substrate 210 on the side of the first sub-conductive element 241 away from the substrate 210, and the second sub-conductive element 242 connects the first sub-conductive element 241 and the second transparent conductive layer 236.

[0159] The orthographic projection of the second sub-conductive element 242 on the substrate 210 falls within the range of the orthographic projection of the first sub-conductive element 241 on the substrate 210.

[0160] The conductive element 240 includes a first sub-conductive element 241 and a second sub-conductive element 242, which simplifies the manufacturing process of the conductive connector 240 and helps improve the production yield of the display panel 200. Furthermore, the orthographic projection of the second sub-conductive element 242 onto the substrate 210 falls within the range of the orthographic projection of the first sub-conductive element 241 onto the substrate 210, thereby improving the connection reliability between the second sub-conductive element 242 and the first sub-conductive element 241.

[0161] Understandably, the materials of the first sub-conductive element 241 and the second sub-conductive element 242 may be the same or different, and the embodiments of this application do not further limit this.

[0162] For example, such as Figure 3 , Figure 4 and Figure 5 As shown, the second light-emitting unit 230b may further include a third transparent conductive layer 251. For example, the material of the third transparent conductive layer 251 may include indium tin oxide (ITO) or indium zinc oxide (IZO). The embodiments of this application do not further limit the material of the third transparent conductive layer 251. The materials of the first transparent conductive layer 234, the second transparent conductive layer 236, and the third transparent conductive layer 251 may be the same or different. The embodiments of this application do not further limit this.

[0163] For example, such as Figure 3 , Figure 4 and Figure 5As shown, the third transparent conductive layer 251 of the second light-emitting unit 230b in different light-emitting pixels 220 can be connected, that is, the cathode layer 232 of the second light-emitting unit 230b in different light-emitting pixels 220 can be connected, so that different light-emitting pixels 220 can share a common cathode, thereby simplifying the connection structure between the light-emitting pixels 220 and the substrate 210.

[0164] The third transparent conductive layer 251 is constructed as a transparent material, which reduces the obstruction of light emitted by the light-emitting layer 233 of the second light-emitting unit 230b by the third transparent conductive layer 251.

[0165] The third transparent conductive layer 251 includes a fourth conductive portion 2511, which is connected to the cathode layer 232 of the second light-emitting unit 230b, and the fourth conductive portion 2511 surrounds the light-emitting stack 260 of the second light-emitting unit 230b.

[0166] For example, such as Figure 3 , Figure 4 and Figure 5 As shown, the light-emitting pixel 220 also includes a cathode metal 203, which is disposed on the side of the fourth conductive portion 2511 away from the first light-emitting unit 230a. The cathode metal 203 is used to connect with the cathode contact of the substrate 210. The cathode metal 203 can surround the light-emitting stack 260 of the second light-emitting unit 230b.

[0167] By adopting the above configuration, the cathode metal 203 can avoid the light emission path of the second light-emitting unit 230b in the normal direction.

[0168] Understandably, the light emission path of the second light-emitting unit 230b in the normal direction is the same as or approximately the same as the thickness direction Z of the substrate 210. The light emission path of the second light-emitting unit 230b in the normal direction is the main light emission path of the second light-emitting unit 230b.

[0169] For example, such as Figure 3 , Figure 4 and Figure 5 As shown, the third transparent conductive layer 251 may further include a fifth conductive portion 2512 and a sixth conductive portion 2513. The fifth conductive portion 2512 is connected to the cathode layer 232 of the second light-emitting unit 230b, and the sixth conductive portion 2513 is connected to the first conductive portion 2341 and the fifth conductive portion 2512.

[0170] For example, the fifth conductive portion 2512 can be stacked along the thickness direction Z of the substrate 210 on the side of the cathode ohmic contact layer 238 of the second light-emitting unit 230b away from the cathode layer 232 of the second light-emitting unit 230b, so that the fifth conductive portion 2512 can be connected to the cathode ohmic contact layer 238 of the second light-emitting unit 230b and the cathode layer 232 of the second light-emitting unit 230b, thereby reducing the contact resistance between the cathode layer 232 of the second light-emitting unit 230b and the fifth conductive portion 2512, thereby reducing the heat loss of the light-emitting pixel 220.

[0171] The sixth conductive portion 2513 connects the first conductive portion 2341 and the fifth conductive portion 2512, so that the fourth conductive portion 2511 can surround the light-emitting stack 260 of the second light-emitting unit 230b. For example, the sixth conductive portion 2513 can surround the side of the light-emitting stack 260.

[0172] Continue to refer to Figure 3 , Figure 4 and Figure 5 The second light-emitting unit 230b may also include a second transparent insulating layer 252. For example, the material of the second transparent insulating layer 252 may include an oxide, such as silicon oxide. Alternatively, the material of the second transparent insulating layer 252 may also include a nitride, such as silicon nitride.

[0173] Understandably, the second transparent insulating layer 252 may also include materials other than oxides and nitrides, and the embodiments of this application do not further limit the material of the second transparent insulating layer 252. The material of the second transparent insulating layer 252 and the material of the first transparent insulating layer 235 may be the same or different.

[0174] The second transparent insulating layer 252 can serve as an electrical isolation layer. For example, the second transparent insulating layer 252 can cover the surface of the light-emitting stack 260 of the second light-emitting unit 230b away from the substrate 210, so that the second transparent insulating layer 252 can electrically isolate the light-emitting stack 260 of the second light-emitting unit 230b from other film layers.

[0175] Furthermore, the second transparent insulating layer 252 is constructed as a transparent material, which reduces the obstruction of light emitted by the light-emitting layer 233 of the second light-emitting unit 230b by the second transparent insulating layer 252.

[0176] For example, such as Figure 3 , Figure 4 and Figure 5As shown, the second transparent insulating layer 252 may include a fourth insulating portion 2521, the fourth insulating portion 2521 surrounds the light-emitting stack 260 of the second light-emitting unit 230b, and the fourth conductive portion 2511 is stacked on the side of the first insulating portion 2351 away from the substrate 210, so that the fourth insulating portion 2521 can electrically isolate the conductive connector 240 and the fourth conductive portion 2511.

[0177] For example, the second transparent insulating layer 252 may further include a fifth insulating portion 2522 and a sixth insulating portion 2523. The fifth insulating portion 2522 is stacked along the thickness direction Z of the substrate 210 between the fifth conductive portion 2512 and the light-emitting stack 260 of the second light-emitting unit 230b. A second through hole P2 is formed on the fifth insulating portion 2522, and a portion of the fifth conductive portion 2512 is located in the second through hole P2.

[0178] Understandably, the second via P2 exposes the light-emitting stack 260 of the second light-emitting unit 230b (e.g., the cathode ohmic contact layer 238 of the second light-emitting unit 230b). A portion of the fifth conductive part 2512 is located within the second via P2, allowing the fifth conductive part 2512 to connect to the cathode ohmic contact layer 238 of the second light-emitting unit 230b, thereby enabling the fifth conductive part 2512 to connect to the cathode layer 232 of the second light-emitting unit 230b via the cathode ohmic contact layer 238 of the second light-emitting unit 230b.

[0179] The sixth insulating portion 2523 connects the fifth insulating portion 2522 and the fourth insulating portion 2521. For example, the sixth insulating portion 2523 may cover the side of the light-emitting stack 260 and is located between the light-emitting stack 260 and the sixth conductive portion 2513.

[0180] For example, such as Figure 3 , Figure 4 and Figure 5 As shown, the display panel 200 also includes a second transparent dielectric layer 202. For example, the material of the second transparent dielectric layer 202 may include oxides, such as silicon oxide. Alternatively, the material of the second transparent dielectric layer 202 may also include nitrides, such as silicon nitride. It is understood that the second transparent dielectric layer 202 may also include materials other than oxides and nitrides; the embodiments of this application do not further limit the material of the second transparent dielectric layer 202. The materials of the first transparent dielectric layer 201 and the second transparent dielectric layer 202 may be the same or different; the embodiments of this application do not further limit this.

[0181] The second transparent dielectric layer 202 can be stacked on the side of the second transparent conductive layer 236 away from the first light-emitting unit 230a and cover the second light-emitting unit 230b, thereby protecting the second light-emitting unit 230b.

[0182] Continue to refer to Figure 3 , Figure 4 and Figure 5 For example, the display panel 200 may also include a microlens 204, which may be a convex lens and serve to focus light. The microlens 204 is disposed on the side of the light-emitting pixel 220 away from the substrate 210 to improve the brightness of the light-emitting pixel 220 in the normal direction.

[0183] For example, the material of the microlens 204 may include glass or other transparent materials. The embodiments of this application do not further limit the material of the microlens.

[0184] The following is an example illustrating the fabrication method of the display panel. For example, the fabrication method of the display panel 200 can be used to fabricate the display panel 200 as described above.

[0185] Figure 9 This is a flowchart illustrating the steps of a method for manufacturing a display panel according to some embodiments of this application.

[0186] In some examples, such as Figure 9 As shown, the method for manufacturing the display panel 200 includes: Step S1: A first light-emitting unit is formed on one side of the substrate along the thickness direction of the substrate.

[0187] Figure 10 This is a schematic diagram showing the positional relationship between the stack of the first light-emitting unit, the bonding metal, and the substrate provided in some embodiments of this application.

[0188] For example, such as Figure 10 As shown, before forming the first light-emitting unit 230a on the substrate 210, a bonding metal layer (not shown in the figure) can be formed by chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes, or other processes can be used to form the bonding metal layer. The embodiments of this application do not further limit this.

[0189] After the bonding metal layer is formed, an etching process can be used to pattern the bonding metal layer to form multiple bonding metals 221 spaced apart. The multiple bonding metals 221 are respectively connected to multiple anode contacts 211 of the substrate 210.

[0190] For example, the bonding metal layer can be patterned using processes such as photolithography or ion beam etching, and the embodiments of this application do not further limit this.

[0191] After the bonding metal 221 is formed, a first light-emitting unit 230a can be formed on the side of the bonding metal 221 away from the substrate 210, so that the anode layer 231 of the multiple first light-emitting units 230a can be connected to the substrate 210 through the multiple bonding metals 221 respectively, so as to avoid short circuit between the anodes of the multiple first light-emitting units 230a.

[0192] Figure 11 A flowchart illustrating the steps of a method for fabricating a display panel according to other embodiments of this application.

[0193] In some examples, such as Figure 11 As shown, forming a first light-emitting unit on one side of the substrate along the thickness direction of the substrate (i.e., step S1) includes: Step S11: Form a light-emitting stack of the first light-emitting unit.

[0194] For example, a first stacked structure (not shown in the figure) can be formed on the side of the bonding metal layer away from the substrate 210. The first stacked structure includes a first initial anode layer, a first initial cathode layer, a first initial light-emitting layer, a first initial anode ohmic contact layer, and a first initial cathode ohmic contact layer stacked together. The first initial anode ohmic contact layer, the first initial anode layer, the first initial light-emitting layer, the first initial cathode layer, and the first initial cathode ohmic contact layer are arranged sequentially along the direction from the substrate 210 to the bonding metal layer.

[0195] The first layered structure can be formed using chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes, or other processes can be used to form the first layered structure. The embodiments of this application do not further limit this.

[0196] After the first stacked structure is formed, an etching process can be used to separate the first stacked structure and the bonding metal layer. Figure 1 The process is initiated to form a light-emitting stack 260 consisting of a bonding metal 221 and a first light-emitting unit 230a located on the side of the bonding metal 221 away from the substrate 210.

[0197] Alternatively, an etching process can be used to pattern the first stacked structure and the bonding metal layer separately, and the embodiments of this application do not further limit this.

[0198] For example, the bonding metal layer and the first stacked structure can be patterned using processes such as photolithography or ion beam etching, and the embodiments of this application do not further limit this.

[0199] Step S12: A first transparent insulating layer is formed. The first transparent insulating layer includes a first insulating portion, and the first insulating portion surrounds the light-emitting stack of the first light-emitting unit.

[0200] Figure 12 This is a schematic diagram showing the positional relationship between the first transparent insulating layer, the light-emitting stack, and the substrate provided in some embodiments of this application.

[0201] For example, a first initial transparent insulating layer can be formed over the light-emitting stack 260 covering the first light-emitting unit 230a. For example, the first initial transparent insulating layer can be formed using chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes, or other processes can be used to form the first initial transparent insulating layer. The embodiments of this application do not further limit this.

[0202] After the first initial transparent insulating layer is formed, an etching process can be used to create a first via P1 on the first initial transparent insulating layer to form the first transparent insulating layer 235. Understandably, the first via P1 can expose the light-emitting stack 260 of the first light-emitting unit 230a.

[0203] For example, the first transparent insulating layer 235 includes a first insulating portion 2351, a second insulating portion 2352, and a third insulating portion 2353. The first insulating portion 2351 surrounds the light-emitting stack 260 of the first light-emitting unit 230a and covers the portion of the bonding metal 221 that protrudes from the light-emitting stack 260 of the first light-emitting unit 230a. The second insulating portion 2352 is located on the side of the light-emitting stack 260 of the first light-emitting unit 230a away from the light-emitting substrate 210, and a first through-hole P1 is formed on the second insulating portion 2352. The third insulating portion 2353 connects the first insulating portion 2351 and the second insulating portion 2352.

[0204] Step S13: A first transparent conductive layer is formed. The first transparent conductive layer includes a first conductive portion that extends beyond the light emission path of the first light-emitting unit in the normal direction, and the first conductive portion is connected to the cathode layer of the first light-emitting unit.

[0205] Figure 13 This is a schematic diagram showing the positional relationship between the first transparent conductive layer, the first transparent insulating layer, the light-emitting stack, and the substrate provided in some embodiments of this application.

[0206] For example, the first initial transparent conductive layer can be formed using chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes, or other processes can be used to form the first initial transparent conductive layer. The embodiments of this application do not further limit this.

[0207] After the first initial transparent conductive layer is formed, an etching process can be used to pattern the first initial transparent conductive layer so that the first transparent conductive layers 234 in different first light-emitting units 230a can be disconnected to avoid short circuits between different first light-emitting units 230a.

[0208] For example, such as Figure 13 As shown, the second conductive portion 2342 of the first transparent conductive layer 234 can be disposed on the side of the first insulating portion 2351 away from the light-emitting stack 260 of the first light-emitting unit 230a, so that the second conductive portion 2342 can be connected to the cathode layer 232 of the first light-emitting unit 230a through the first through hole P1.

[0209] The first conductive portion 2341 of the first transparent conductive layer 234 can surround the light-emitting stack 260 of the first light-emitting unit 230a, so that the first conductive portion 2341 can extend beyond the light-emitting path of the first light-emitting unit 230a in the normal direction.

[0210] The first conductive part 2341 and the second conductive part 2342 are connected so that the first conductive part 2341 can be connected to the cathode layer 232 of the first light-emitting unit 230a.

[0211] Figure 14 This is a schematic diagram showing the positional relationship between the first sublayer, the first transparent insulating layer, the light-emitting stack, and the substrate provided in some embodiments of this application.

[0212] Before forming the first transparent conductive layer, the method for fabricating the display panel also includes: A first transparent dielectric layer is formed on the side of the first insulating portion away from the substrate. The first transparent dielectric layer surrounds the stack of the first light-emitting unit. A first conductive portion is stacked on the side of the first transparent dielectric layer away from the first insulating portion.

[0213] Understandably, the first transparent dielectric layer 201 formed on the first insulating portion 2351 away from the substrate 210 is the first sublayer 2011 of the first transparent dielectric layer 201. For example, the first sublayer 2011 can be formed using chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes, or other processes can be used to form the first sublayer 2011. The embodiments of this application do not further limit this.

[0214] Combination Figure 13 and Figure 14 Before forming the first transparent conductive layer 234, a first sub-layer 2011 of the first transparent dielectric layer 201 is formed, so that the first sub-layer 2011 can raise the first conductive part 2341, that is, can reduce the distance between the first conductive part 2341 and the second light-emitting unit 230b in the thickness direction Z of the substrate 210.

[0215] In this way, the length of the conductive connector 240 connecting the first conductive part 2341 and the anode layer 231 of the second light-emitting unit 230b can be shortened. On the one hand, the resistance of the conductive connector 240 can be reduced, thereby reducing the heat loss of the light-emitting pixel 220. On the other hand, the difficulty of manufacturing the conductive connector 240 can be reduced, thereby improving the production efficiency and yield of the display panel 200.

[0216] For example, after the first conductive part 2341 is raised in the first sublayer 2011, the end face of the conductive connector 240 away from the second light-emitting unit 230b along the thickness direction Z of the substrate 210 can be flush with or approximately flush with the light-emitting layer 233 of the first light-emitting unit 230a.

[0217] In this way, the conductive connector 240 can block a portion of the light emitted by the first light-emitting unit 230a, thereby suppressing light crosstalk between two adjacent light-emitting pixels 220 and ensuring the light mixing effect between the first light-emitting units 230a of the two adjacent light-emitting pixels 220.

[0218] Alternatively, after the first sublayer 2011 raises the first conductive part 2341, along the thickness direction Z of the substrate 210, the end face of the conductive connector 240 away from the second light-emitting unit 230b can be flush with or approximately flush with the side surface of the light-emitting stack 260 of the first light-emitting unit 230a away from the substrate 210.

[0219] This reduces the impact of the conductive connector 240 on the light emitted by the first light-emitting unit 230a, thus improving the light mixing effect between the first light-emitting units 230a of two adjacent light-emitting pixels 220. Furthermore, it allows for a shorter length of the conductive connector 240, reducing its resistance and simplifying its fabrication.

[0220] In other examples, the first sublayer 2011 may not be formed before the first transparent conductive layer 234 is formed. In this case, the first conductive portion 2341 and the first insulating portion 2351 are connected, so that the conductive connector 240 located on the side of the first conductive portion 2341 away from the substrate 210 can surround the light-emitting stack 260 of the first light-emitting unit 230a.

[0221] In this way, the conductive connector 240 can not only conduct electricity, but also isolate the first light-emitting unit 230a in two adjacent light-emitting pixels 220, thereby reducing the mutual interference between the two adjacent light-emitting pixels 220 and suppressing optical crosstalk.

[0222] Furthermore, when the light emitted by the first light-emitting unit 230a shines on the conductive connector 240, it can be reflected by the conductive connector 240, thereby improving the light extraction rate and thus improving the brightness of the first light-emitting unit 230a in the normal direction, which is to say, improving the brightness of the light-emitting pixel 220.

[0223] The embodiments of this application take the first conductive portion 2341 and the first insulating portion 2351 in the first sublayer 2011 as an example to continue to illustrate the manufacturing method of the display panel 200.

[0224] Figure 15 This is a schematic diagram showing the positional relationship between the first light-emitting unit and the first sub-conductive component provided in some embodiments of this application.

[0225] Step S2: A first sub-conductive element is formed on the side of the substrate near the first light-emitting unit. The first sub-conductive element avoids the light emission path of the first light-emitting unit in the normal direction and is connected to the cathode layer of the first light-emitting unit.

[0226] Understandably, the first sub-conductive element 241 is formed on the side of the first conductive portion 2341 away from the substrate 210. The first conductive portion 2341 surrounds the light-emitting stack 260 of the first light-emitting unit 230a, so that the first sub-conductive element 241 can avoid the light emission path of the first light-emitting unit 230a in the normal direction, and the first sub-conductive element 241 can be connected to the cathode layer 232 of the first light-emitting unit 230a through the first conductive portion 2341.

[0227] For example, a first conductive metal layer can be formed on the side of the first transparent conductive layer 234 away from the substrate 210 using chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes, and then the first conductive metal layer can be patterned by etching process to form the first sub-conductive element 241.

[0228] Figure 16 This is a schematic diagram showing the positional relationship between the first light-emitting unit, the first sub-conductive element, and the first transparent dielectric layer provided in some embodiments of this application.

[0229] For example, such as Figure 16 As shown, after the first conductive portion 2341 is formed, a second sublayer 2012 can be formed by chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes. The second sublayer 2012 is stacked on the side of the first transparent conductive layer 234 away from the substrate 210.

[0230] Step S3: A light-emitting stack of the second light-emitting unit is formed on the side of the first light-emitting unit away from the substrate. The light-emitting stack includes an anode layer, a cathode layer and a light-emitting layer. Along the thickness direction of the substrate, the anode layer and the cathode layer are located on both sides of the light-emitting layer.

[0231] Understandably, the light-emitting stack 260 of the second light-emitting unit 230b is located on the side of the second sublayer 2012 away from the substrate 210. The method of forming the light-emitting stack 260 of the second light-emitting unit 230b will be described below with an example.

[0232] Figure 17 This is a schematic diagram showing the positional relationship between the second stacked structure, the substrate, the first light-emitting unit, and the substrate provided in some embodiments of this application. Figure 18 This is a schematic diagram showing the positional relationship between the second stacked structure, the first light-emitting unit, and the substrate provided in some embodiments of this application. Figure 19 This is a schematic diagram showing the positional relationship between the light-emitting stack of the second light-emitting unit, the first light-emitting unit, and the substrate provided in some embodiments of this application.

[0233] In some examples, such as Figure 17As shown, a bonding layer 205 can be formed on the side of the second sublayer 2012 away from the substrate 210 using chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes. Then, the second stacked structure 262 and the bonding layer 205 are bonded together so that the second stacked structure 262 can be bonded to the second sublayer 2012 through the bonding layer 205.

[0234] Alternatively, a bonding layer 205 may be formed on the side of the second stacked structure 262 away from the substrate 401, and then the bonding layer 205 and the second sublayer 2012 may be bonded together, so that the second stacked structure 262 can be connected by bonding layer 205 and the second sublayer 2012.

[0235] For example, the second stacked structure 262 may include a second initial anode layer 231a, a second initial cathode layer 232a, a second initial light-emitting layer 233a, a second initial anode ohmic contact layer 237a and a second initial cathode ohmic contact layer 238a stacked on one side of the substrate 401.

[0236] Along the direction from the substrate 401 toward the second stacked structure 262, the second initial cathode ohmic contact layer 238a, the second initial cathode layer 232a, the second initial light-emitting layer 233a, the second initial anode layer 231a, and the second initial anode ohmic contact layer 237a are stacked sequentially.

[0237] A second initial transparent conductive layer 236a can also be formed on the side of the second stacked structure 262 away from the substrate 401. The second initial transparent conductive layer 236a is stacked on the side of the second initial anode ohmic contact layer 237a away from the second initial anode layer 231a, so that the second initial transparent conductive layer 236a can be connected to the second initial anode ohmic contact layer 237a and the second initial anode layer 231a. Furthermore, the second initial transparent conductive layer 236a can be bonded to the second sublayer 2012 through the bonding layer 205.

[0238] For example, the second stacked structure 262 and the second initial transparent conductive layer 236a can be formed using chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes. Alternatively, other processes can be used to form the second stacked structure 262 and the second initial transparent conductive layer 236a. The embodiments of this application do not further limit this.

[0239] like Figure 18As shown, after the second stacked structure 262 and the second sublayer 2012 are bonded together, the substrate 401 can be removed, as follows. Figure 19 As shown, the second stacked structure 262 and the second initial transparent conductive layer 236a are then patterned using an etching process to form a light-emitting stack 260 of the second transparent conductive layer 236 spaced apart and the second light-emitting unit 230b located on the side of the second transparent conductive layer 236 away from the second sub-layer 2012.

[0240] For example, the second stacked structure 262 and the second initial transparent conductive layer 236a can be patterned using processes such as photolithography or ion beam etching, and the embodiments of this application do not further limit this.

[0241] In step S4, a second sub-conductive element is formed on the side of the first sub-conductive element away from the substrate, and the second sub-conductive element is connected to the anode layer of the first sub-conductive element and the second light-emitting unit.

[0242] Figure 20 This is a schematic diagram showing the location of the receiving hole provided in some embodiments of this application. Figure 21 This is a schematic diagram showing the positional relationship between the second sub-conductive element and the first sub-conductive element provided in some embodiments of this application.

[0243] For example, such as Figure 20 As shown, after the light-emitting stack 260 of the second light-emitting unit 230b is formed, an etching process can be used to open a receiving hole M around the light-emitting stack 260 of the second light-emitting unit 230b. The receiving hole M penetrates the bonding layer 205 and extends to the second sub-layer 2012 to expose the end of the first sub-conductive member 241 away from the first conductive part 2341.

[0244] like Figure 21 As shown, metal can be filled into the receiving hole M to form a second sub-conductive element 242, so that the second sub-conductive element 242 can connect to the first sub-conductive element 241 and the second transparent conductive layer 236, that is, so that the second sub-conductive element 242 can connect to the first sub-conductive element 241 and the anode layer 231 of the second light-emitting unit 230b.

[0245] By adopting the above configuration, the first sub-conductive component 241 and the second sub-conductive component 242 of the conductive connector 240 can be prepared in different steps, which simplifies the process and eliminates the need to prepare an excessively long conductive component in one step, thereby improving the production yield of the display panel 200.

[0246] Figure 22 This is a schematic diagram showing the positional relationship between the second transparent insulating layer and the light-emitting stack of the second light-emitting unit, as provided in some embodiments of this application. Figure 23This is a schematic diagram showing the positional relationship of the second transparent conductive layer, the second transparent insulating layer, and the second light-emitting unit in some embodiments of this application.

[0247] For example, such as Figure 22 As shown, after the light-emitting stack 260 of the second light-emitting unit 230b is formed, a second initial transparent insulating layer can be formed by chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes.

[0248] After the second initial transparent insulating layer is formed, an etching process can be used to create a second via P2 on the second initial transparent insulating layer to form the second transparent insulating layer 252. Understandably, the second via P2 can expose the light-emitting stack 260 of the second light-emitting unit 230b.

[0249] For example, the second transparent insulating layer 252 includes a fourth insulating portion 2521, a fifth insulating portion 2522, and a sixth insulating portion 2523. The fourth insulating portion 2521 surrounds the light-emitting stack 260 of the second light-emitting unit 230b and covers the second sub-conductive element 242. The fifth insulating portion 2522 is located on the side of the light-emitting stack 260 of the second light-emitting unit 230b away from the light-emitting substrate 210, and the second through-hole P2 is formed on the fifth insulating portion 2522. The sixth insulating portion 2523 connects the fourth insulating portion 2521 and the fifth insulating portion 2522.

[0250] After the second transparent insulating layer 252 is formed, as Figure 23 As shown, a third transparent conductive layer 251 can be formed on the side of the second transparent insulating layer 252 away from the first light-emitting unit 230a using chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes. The third transparent conductive layer 251 can be connected to the cathode layer 232 of the second light-emitting unit 230b through the second via P2. Understandably, the third transparent conductive layer 251 is a continuous film structure, allowing multiple light-emitting pixels 220 to share a common cathode.

[0251] Figure 24 This is a schematic diagram showing the positional relationship between the cathode metal and the third transparent conductive layer provided in some embodiments of this application. Figure 25 This is a schematic diagram showing the positional relationship between the second transparent dielectric layer and the second light-emitting unit, provided for some embodiments of this application.

[0252] For example, such as Figure 25As shown, a cathode metal layer can be formed on the side of the third transparent conductive layer 251 away from the first light-emitting unit 230a using chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes. Then, an etching process is used to pattern the cathode metal layer to form cathode metal 203, so that cathode metal 203 can be connected to the third transparent conductive layer 251.

[0253] After the cathode metal 203 is formed, a second transparent dielectric layer 202 can be formed on the side of the third transparent conductive layer 251 away from the first light-emitting unit 230a by chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes, so that the second transparent dielectric layer 202 can cover the second light-emitting unit 230b.

[0254] After the second transparent dielectric layer 202 is formed, a microlens 204 can be formed. Along the thickness direction Z of the substrate 210, the microlens 204 and the light-emitting pixel 220 are arranged opposite to each other to concentrate light and improve the brightness of the light-emitting pixel 220 in the normal direction.

[0255] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or as many of the technical features as possible; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display panel, characterized in that, include: substrate; A plurality of light-emitting pixels are disposed on one side of the substrate along the thickness direction of the substrate, and the plurality of light-emitting pixels are spaced apart. Each light-emitting pixel includes: Multiple light-emitting units are stacked along the thickness direction of the substrate, and each light-emitting unit includes: Emissive layer; An anode layer is stacked along the thickness direction of the substrate on one side of the light-emitting layer, and the anode layer is used to provide holes for the light-emitting layer; A cathode layer is stacked along the thickness direction of the substrate on the side of the light-emitting layer away from the anode layer. The cathode layer is used to provide electrons to the light-emitting layer, and the electrons and holes recombine in the light-emitting layer to make the light-emitting layer emit light. A conductive connector is disposed between two light-emitting units along the thickness direction of the substrate. The conductive connector extends along the thickness direction of the substrate and connects the anode layer of one of the two light-emitting units disposed adjacent to each other along the thickness direction of the substrate and the cathode layer of the other light-emitting unit. The conductive connector avoids the light emission path of the light-emitting unit in the normal direction.

2. The display panel according to claim 1, characterized in that, The number of light-emitting units is two, and the two light-emitting units include a first light-emitting unit and a second light-emitting unit, with the first light-emitting unit being closer to the substrate than the second light-emitting unit; The first light-emitting unit further includes a first transparent conductive layer, the first transparent conductive layer comprising: A first conductive portion is connected to the cathode layer of the first light-emitting unit, and the first conductive portion extends beyond the light-emitting path of the first light-emitting unit in the normal direction. One end of the conductive connector is connected to the first conductive part, and the other end of the conductive connector is connected to the anode layer of the second light-emitting unit.

3. The display panel according to claim 2, characterized in that, The anode layer, the cathode layer, and the light-emitting layer constitute a light-emitting stack, and the first conductive part surrounds the light-emitting stack of the first light-emitting unit; The conductive connector is located on the side of the first conductive portion away from the substrate, and the orthographic projection of the conductive connector on the substrate surrounds the orthographic projection of the light-emitting stack of the first light-emitting unit on the substrate.

4. The display panel according to claim 3, characterized in that, The first light-emitting unit further includes: A first transparent insulating layer, comprising a first insulating portion, surrounds the light-emitting stack of the first light-emitting unit, and a first conductive portion is stacked on the side of the first insulating portion away from the substrate; The first conductive part and the first insulating part are connected; or, The display panel further includes a first transparent dielectric layer, a portion of which is stacked between the first conductive portion and the first insulating portion.

5. The display panel according to claim 3, characterized in that, The second light-emitting unit further includes: The second transparent conductive layer is stacked on the side of the light-emitting layer of the second light-emitting unit that is close to the first light-emitting unit and is connected to the anode layer of the second light-emitting unit. The orthographic projection of the second transparent conductive layer on the substrate covers the orthographic projection of the light-emitting stack of the first light-emitting unit on the substrate. The end of the conductive connector away from the first conductive part is connected to the second transparent conductive layer.

6. The display panel according to claim 5, characterized in that, The end of the conductive connector away from the first conductive part of the first light-emitting unit covers the edge region of the second transparent conductive layer.

7. The display panel according to claim 6, characterized in that, The conductive connector includes: The first conductive component is connected to the first conductive part; The second sub-conductive element is disposed along the thickness direction of the substrate on the side of the first sub-conductive element away from the substrate, and the second sub-conductive element connects the first sub-conductive element and the second transparent conductive layer. Wherein, the orthographic projection of the second sub-conductive element on the substrate falls within the range of the orthographic projection of the first sub-conductive element on the substrate.

8. The display panel according to any one of claims 1 to 7, characterized in that, Also includes: A bonding layer is located between two light-emitting units that are adjacent to each other along the thickness direction of the substrate, and the two light-emitting units that are adjacent to each other along the thickness direction of the substrate are bonded together by the bonding layer.

9. A method for manufacturing a display panel, characterized in that, include: A first light-emitting unit is formed on one side of the substrate along the thickness direction of the substrate; A first sub-conductive element is formed on the side of the substrate near the first light-emitting unit. The first sub-conductive element avoids the light emission path of the first light-emitting unit in the normal direction and is connected to the cathode layer of the first light-emitting unit. A light-emitting stack of a second light-emitting unit is formed on the side of the first light-emitting unit away from the substrate. The light-emitting stack includes an anode layer, a cathode layer, and a light-emitting layer. Along the thickness direction of the substrate, the anode layer and the cathode layer are located on both sides of the light-emitting layer. A second sub-conductive element is formed on the side of the first sub-conductive element away from the substrate, and the second sub-conductive element connects the first sub-conductive element and the anode layer of the second light-emitting unit.

10. The method for manufacturing a display panel according to claim 9, characterized in that, The first light-emitting unit is formed on one side of the substrate along the thickness direction of the substrate, including: The light-emitting stack that forms the first light-emitting unit; A first transparent insulating layer is formed, the first transparent insulating layer includes a first insulating portion, and the first insulating portion surrounds the light-emitting stack of the first light-emitting unit; A first transparent conductive layer is formed, the first transparent conductive layer includes a first conductive portion, the first conductive portion extends beyond the light emission path of the first light-emitting unit in the normal direction, and the first conductive portion is connected to the cathode layer of the first light-emitting unit; Before forming the first transparent conductive layer, the method for manufacturing the display panel further includes: A first transparent dielectric layer is formed on the side of the first insulating portion away from the substrate. The first transparent dielectric layer surrounds the stack of the first light-emitting unit. The first conductive portion is stacked on the side of the first transparent dielectric layer away from the first insulating portion.

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