Component carrier assembly and method for manufacturing a component carrier assembly

Abstract

The present invention relates to a component carrier assembly (1), the component carrier assembly (1) comprising: a component carrier (2), and an electronic component (10) at least partially embedded within the component carrier (2), wherein at least one electrically insulating layer structure (3) covers at least a first surface (11) of the electronic component (10), wherein the electronic component (10) includes at least one electrically conductive portion (12) at its first surface (11), wherein at least one feedthrough (5) is formed in the electrically insulating layer structure (3), the at least one feedthrough (5) being positionally matched with at least one electrically conductive portion (12), wherein an electrically conductive path (6) originates from at least one electrically conductive portion (12). Extending through the feedthrough (5), the electrical conduction path (6) includes a first part (7) and a second part (8), the first part (7) covering at least a portion of the electrical conduction portion (12) and also covering at least a portion of the stack (4); the second part (8) covering the first part (7) and separated from the electrical conduction portion (12) by the first part (7), wherein the first part (7) is formed of a first material, the second part (8) is formed of a second material, and the electrical conduction portion (12) of the electronic component (10) is formed of a third material, wherein the first material, the second material and the third material are different from each other.

Description

Technical Field

[0001] This invention relates to a component carrier assembly, comprising a component carrier and an electronic component, wherein the electronic component is at least partially embedded within the component carrier, preferably completely embedded within the component carrier. The component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the at least one electrically insulating layer structure covers at least a first surface of the electronic component. The electronic component includes at least one electrically conductive portion at its first surface, preferably multiple electrically conductive portions at its first surface for establishing electrical connections with functional portions of the electronic component. This invention also relates to a method for manufacturing a component carrier assembly. Background Technology

[0002] For certain applications, the exposed electrically conductive portions of electronic components (e.g., pads) are made of materials that are difficult to access and / or susceptible to corrosion and / or cannot be contacted with acidic or alkaline wet chemicals and / or cannot be processed by etching. One such component is one with aluminum pads. Currently, there is no manufacturing method for embedding such components while simultaneously establishing durable and reliable electrical contacts with these pads.

[0003] KR101061792B1 discloses a printed circuit board with an embedded chip. In one embodiment, an upper carrier and a lower carrier are bonded together, such that the chip is embedded in an intermediate insulating layer. The resin in the intermediate insulating layer is cured and bonded to the upper and lower carriers by pressing and heating. An electrical connection is established with the chip via chip connection portions. Disadvantages of this type of PCB include unreliable electrical contacts and the inability to guarantee that the chip pads are protected from adverse effects.

[0004] US9978677 discloses a method for manufacturing contact via structures. However, the document does not include any teachings on making reliable contacts for embedded electronic components. Summary of the Invention

[0005] The object of this invention is to overcome the shortcomings of the prior art and provide a component carrier assembly and method by means of which a durable and reliable electrical contact can be established with the exposed electrically conductive portions of electronic components. Furthermore, the electrically conductive portions of the electronic components should be protected from adverse effects during the manufacturing process, both in the assembled and contact state. The structure and method of the component carrier assembly should ensure efficient and economical production.

[0006] This objective is achieved by a component carrier assembly, which includes: - Component carriers, and - An electronic component, wherein the electronic component is at least partially embedded within a component carrier, preferably, the electronic component is completely embedded within the component carrier. The component carrier includes a stacked component, which includes at least one electrically conductive layer structure and at least one electrically insulating layer structure. In this embodiment, at least one electrically insulating layer structure covers at least the first surface of the electronic component. The electronic component includes at least one electrically conductive portion on its first surface; preferably, the electronic component includes multiple electrically conductive portions on its first surface for establishing electrical connections with functional portions of the electronic component. In this structure, at least one feedthrough is formed in the electrical insulating layer, and at least one feedthrough is positionally matched with at least one electrically conductive portion of the electronic component. The electrical conduction path extends from at least one electrically conductive portion of the electronic component through the feedthrough, and the electrical conduction path includes: - A first portion, preferably formed as a layer, covering (and preferably attached to) at least a portion of the electrically conductive portion of the electronic component, further covering at least a portion of the stack, preferably also covering at least a portion of the electrically insulating layer structure, and - The second part, preferably formed as a layer, covers (and preferably attaches to) the first part, and the second part is separated from the electrically conductive portion of the electronic component by the first part. The first part is formed of a first material, the second part is formed of a second material, and the electrically conductive part of the electronic component is formed of a third material. The first material and the third material are different. Preferably, the first material is different from the second material and different from the third material. Preferably, the second material and the third material are different from each other.

[0007] The first part ensures reliable protection of the electrically conductive portion of the electronic component. This first part covers not only a portion of the electrically conductive portion of the electronic component but also at least a portion of the stack surrounding the electronic component. Preferably, the first part (formed of a first material) seals the electrically conductive portion of the electronic component relative to the exterior of the component carrier assembly with at least a portion of the stack (e.g., at least a portion of the electrically insulating layer structure) – preferably in an hermetically sealed manner. Furthermore, the adhesion between materials can be improved and optimized by using different materials. In other words, the first part forms an intermediate (layer) portion between the electrically conductive portion (third material) of the electronic component and the second part (second material). The first part serves as the mating portion between the material of the first part, which is the electrically conductive portion of the electronic component, and the second material within the stack, which is typically used for the electrically conductive layer structure.

[0008] It is understood that, for the purposes of this application, "material" may include one or more types of elements. It should also be understood that even if two of the materials (first, second, and third) contain the same elements, but differ in other elements and / or composition and / or element ratios, the two materials (first, second, and third) are considered different from each other. For example, if the first material is a titanium-tungsten alloy and the second material is titanium, then the first material and the second material are obviously different from each other.

[0009] In the context of this application, the term "component carrier assembly" should be understood as a combination of a component carrier and at least one electronic component.

[0010] In the context of this application, the term "component carrier" may specifically refer to any support structure capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, a component carrier can be constructed as a mechanical and / or electronic carrier for components. In particular, a component carrier can be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. A component carrier can also be a hybrid board combining different component carriers of the types described above.

[0011] In the context of this application, the term "stacked structure" may specifically refer to an arrangement in which multiple planar layer structures are installed in a manner that is stacked in parallel with each other.

[0012] In the context of this application, the term "layer structure" may specifically refer to a continuous layer, a patterned layer, or a plurality of discontinuous islands in a common plane.

[0013] In the context of this application, the term "main surface" of a body may specifically refer to one of the two opposing largest surfaces of the body. The main surfaces may be connected by circumferential sidewalls. The thickness of the body (e.g., a stacked component) may be defined by the distance between the two opposing main surfaces.

[0014] Preferably, the component carrier assembly is a printed circuit board (PCB) and / or a substrate (e.g., an integrated circuit substrate) and / or an interposer.

[0015] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a plate-shaped component carrier formed by laminating several electrically conductive layer structures with several electrically insulating layer structures, for example, by applying pressure and / or by providing heat to laminate several electrically conductive layer structures with several electrically insulating layer structures. As a preferred material for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may include resin and / or glass fiber, i.e., so-called prepreg or FR4 material. Various electrically conductive layer structures can be interconnected in the desired manner by forming through-holes through the laminate, for example by laser drilling or mechanical drilling, and by partially or completely filling the through-holes with an electrically conductive material (partially copper), thereby forming vias or arbitrary through-hole connectors. A filled via connects the entire stack (the through-hole connector extends through multiple layers or the entire stack), or a filled via connects at least two electrically conductive layers. Similarly, optical interconnect structures can be formed through the layers of the stack to receive an electro-optical circuit board (EOCB). In addition to embedding one or more components within the printed circuit board, printed circuit boards are typically constructed to house one or more components on one or two opposite surfaces of a sheet-like printed circuit board. One or more components can be soldered to their respective main surfaces. The dielectric portions of the PCB can be constructed from resin and reinforcing fibers (e.g., glass fiber).

[0016] In the context of this application, the term "substrate" can specifically refer to a small component carrier. A substrate can be a relatively small component carrier associated with a PCB, on which one or more components can be mounted, and can act as a connection medium between one or more chips and another PCB. For example, a substrate can have approximately the same size as the components (especially electronic components) to be mounted thereon (e.g., in the case of chip-scale packages (CSP)). More specifically, a substrate can be understood as a carrier for electrical connections or electrical networks, and a component carrier equivalent to a printed circuit board (PCB), but with a considerably higher density of lateral and / or vertically arranged connectors. For example, lateral connectors are conductive paths, while vertical connectors can be, for example, drilled holes. These lateral and / or vertical connectors are arranged within the substrate and can be used to provide electrical, thermal, and / or mechanical connections between accommodating or non-accommodating components (e.g., bare wafers), particularly IC chips, and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes "IC substrate." The dielectric portion of the substrate can be made of resin with reinforcing particles (e.g., reinforcing spheres, particularly glass spheres).

[0017] The substrate or interlayer may include or consist of at least one layer of glass, silicon (Si) and / or photo-imageable or dry-etchable organic material, such as epoxy-based stacked material (e.g., epoxy-based stacked film) or polymer compound (which may include photosensitive molecules and / or thermosensitive molecules, or may not include photosensitive molecules and / or thermosensitive molecules), such as polyimide or polybenzoxazole.

[0018] In embodiments, at least one electrically insulating layer structure comprises at least one of the following: resins or polymers, such as epoxy resins, cyanate ester resins, benzocyclobutene resins, bismaleimide triazine resins, polyphenylene derivatives (e.g., polyphenylene ether-based, PPE), polyimide (PI), polyamide (PA), liquid crystal polymers (LCP), polytetrafluoroethylene (PTFE), and / or combinations thereof. Reinforcing structures, such as meshes, fibers, spherical elements, or other types of filler particles, such as reinforcing structures made of glass (multilayer glass), may also be used to form a composite. The combination of a semi-cured resin and a reinforcing agent is referred to as a prepreg, such as fibers impregnated with the aforementioned resins. These prepregs are typically named according to their properties, such as FR4 or FR5, which describe the flame-retardant properties of the prepreg. While prepregs, particularly FR4, are generally preferred for rigid printed circuit boards, other materials may also be used, particularly epoxy-based stacking materials (e.g., stacked films) or photo-imageable dielectric materials. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate ester resins may be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other materials with low, very low, or ultra-low dielectric constants can be used as electrical insulation structures in component carriers.

[0019] In embodiments, at least one electrically conductive layer structure comprises at least one of copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. Although copper is generally preferred, other materials or coated versions of other materials may also be used, particularly those coated with superconducting materials or conductive polymers, such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT).

[0020] Preferably, the electronic component is a chip and / or an integrated circuit (IC), and / or includes a chip and / or an integrated circuit (IC). The electronic component can be an active device, but it can also be a passive device (e.g., a capacitor, inductor, or resistor), or a combination of active and passive devices.

[0021] In addition, the components can be active electronic components (implemented to have at least one pn junction), passive electronic components such as resistors, inductors or capacitors, electronic chips, storage devices (such as DRAM or other data memories), filters, integrated circuits (such as field-programmable gate arrays (FPGAs), programmable array logic (PALs), general-purpose array logic (GALs) and complex programmable logic devices (CPLDs)), signal processing components, power management components (such as field-effect transistors (FETs), metal-oxide-semiconductor field-effect transistors (MOSFETs), complementary metal-oxide-semiconductor (CMOS) transistors, junction field-effect transistors (JFETs) or insulators). Gate field-effect transistors (IGFETs), all of which are based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), and / or any other suitable inorganic compounds; optoelectronic interface elements; light-emitting diodes; optocouplers; voltage converters (e.g., DC / DC or AC / DC converters); encryption components; transmitters and / or receivers; electromechanical transducers; sensors; actuators; microelectromechanical systems (MEMS); microprocessors; capacitors; resistors; inductors; batteries; switches; cameras; antennas; logic chips; and energy harvesting units. However, other components can be embedded in component carriers. Furthermore, other components can also be used as components, particularly those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment.

[0022] In one embodiment, the component carrier is a laminated component carrier. In such embodiments, the component carrier is a composite of multiple layers, which are stacked and connected together by applying pressure and / or heat.

[0023] After the internal layer structure of the component carrier is processed, one or more additional electrically insulating and / or electrically conductive layer structures can be symmetrically or asymmetrically (particularly by lamination) on one main surface or two opposite main surfaces of the processed layer structure. In other words, stacking can continue until the desired number of layers is obtained.

[0024] After the stacked components of the electrical insulation layer structure and the electrical conductivity layer structure are formed, the obtained layer structure or component carrier can be surface treated.

[0025] Specifically, in terms of surface treatment, electrically insulating solder resist can be applied to one or two opposite main surfaces of a laminate or component carrier. For example, a solder resist can be formed over the entire main surface, and the solder resist layer can then be patterned to expose one or more electrically conductive surface portions that should be used to electrically connect the component carrier to electronic peripherals. The surface portions of the component carrier still covered by the solder resist, particularly those containing copper, can be effectively protected against oxidation or corrosion.

[0026] Regarding surface treatment, a surface treatment portion can also be selectively applied to the exposed electrically conductive surface portion of the component carrier. Such a surface treatment portion can be an electrically conductive covering material on the exposed electrically conductive layer structure (e.g., pads, conductive tracks, etc., particularly including or made of copper) on the surface of the component carrier. If this exposed electrically conductive layer structure is unprotected, the exposed electrically conductive component carrier material (especially copper) may oxidize, making the component carrier less reliable. The surface treatment portion can then be formed, for example, as a mating portion between a surface-mounted component and the component carrier. The surface treatment portion protects the exposed electrically conductive layer structure (especially copper circuitry) and enables a process of bonding with one or more components, for example, by soldering. Examples of suitable materials for the surface treatment portion include organic solderable corrosion inhibitors (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (especially hard gold), electroless tin, nickel-gold, nickel-palladium, etc.

[0027] In the context of this application, the term "inorganic layer structure" may specifically refer to a layer structure comprising inorganic materials, such as inorganic compounds. In particular, the dielectric material of the inorganic layer structure, or even the entire inorganic layer structure, may be made entirely or at least substantially entirely of inorganic materials. In another embodiment, the inorganic layer structure may include an inorganic dielectric material and an additional dielectric material. The inorganic compound may be a compound without carbon-hydrogen bonds or a chemical compound without organic compounds. For example, the inorganic layer structure may include glass, such as silicon-based glass, particularly soda-lime glass and / or borosilicate glass and / or aluminosilicate glass and / or lithium silicate glass and / or alkali-free glass. In another example, the inorganic layer structure may include ceramic materials, such as ceramic materials comprising aluminum nitride and / or alumina and / or silicon nitride and / or boron nitride and / or tungsten. In yet another example, the inorganic layer structure may include semiconductor materials, such as silicon and / or germanium and / or silicon oxide and / or germanium oxide and / or silicon carbide and / or gallium nitride. In another embodiment, the inorganic layer structure may include (elemental) metals and / or metal alloys, such as copper and / or tin and / or bronze. In yet another embodiment, the inorganic layer structure may include inorganic materials not listed in the above examples, such as: molybdenum disulfide (MoS2), copper gallium oxide (CuGaO2), silver aluminum oxide (AgAlO2), lithium gallium telluride (LiGaTe2), silver indium selenide (AgInSe2), copper iron sulfide (CuFeS2), and beryllium oxide (BeO).

[0028] Preferably, the conductive layer structure is a combination of traces and / or includes traces, such as horizontal traces and / or vertical traces (vias), and / or (patterned) traces and / or pads and / or islands and / or connecting lips. The conductive layer structure may include inorganic materials (e.g., metals such as copper or nickel), and / or metal salts (e.g., silver oxide), and / or ceramic materials (e.g., indium tin oxide), and / or glass materials, and / or carbon materials including materials (e.g., graphene). Additionally and / or alternatively, the conductive layer structure may include organic materials, such as electrically conductive polymers, such as poly(3,4-ethylenedioxythiophene) (PEDOT).

[0029] Preferably, the electrical insulating layer structure comprises an organic material, which may optionally be reinforced by a reinforcing material. The reinforcing material may comprise fibers and / or spherical elements. Preferably, the reinforcing material may comprise or be made of glass. In examples, the electrical insulating layer structure comprises one of the following materials: epoxy resin, polyimide resin, polyamide resin, polyacrylate resin, or polymethyl methacrylate resin. In other examples, the electrical insulating layer structure comprises or is made of glass and / or ceramic materials.

[0030] Preferably, the stack comprises a plurality of electrically conductive layer structures and / or electrically insulating layer structures, which are arranged adjacent to each other along the thickness direction of the stack perpendicular to the main extension direction. Preferably, the layers of the stack are aligned in parallel. Thus, at least one additional layer can be sandwiched between the first layer and the second layer of the stack.

[0031] A feedthrough, sometimes also called a via, can be an opening, hole, or channel extending through an electrically insulating layer structure (and excluding the material of the electrically insulating layer structure). The feedthrough can extend transversely to the surface plane of the electrically insulating layer structure; preferably, it can extend perpendicularly to the surface plane of the electrically insulating layer structure. In particular, the feedthrough can be a vertical via, used to form a so-called (vertical) through-hole internally. The feedthrough can be partially filled with a first material of a first portion of the electrical conduction path and / or a second material of a second portion of the electrical conduction path; preferably, it can be completely filled with the first material of the first portion of the electrical conduction path and / or the second material of the second portion of the electrical conduction path.

[0032] The first portion of the electrical conduction path can cover at least a portion of the electrically conductive portion of the electronic component, thereby establishing an electrical contact between the first portion and the electrically conductive portion of the electronic component. Preferably, the first portion is attached to at least a portion of the electrically conductive portion of the electronic component. In addition to providing electrical conductivity, this also offers the advantage of ensuring a reliable mechanical connection.

[0033] The second portion of the electrical conduction path covers the first portion, thereby establishing an electrical contact between the second portion and the first portion. In a preferred embodiment, the second portion covers at least 80%, preferably at least 90%, of the first portion, and preferably, one side of the first portion. Preferably, the second portion is attached to the first portion. Therefore, even if the material between the electrical conduction portions is not suitable for a reliable connection with the material of the second portion (e.g., the material of the second portion is the same as and / or compatible with the material of the connection portion of the electrical conduction layer structure), the first portion can serve as a mating part and / or bridge between the electrical conduction portion of the electronic component and the second portion, and thus the first portion serves as a mating part and / or bridge between the electrical conduction portion and other portions of the electrical conduction layer structure of the component carrier.

[0034] According to a preferred embodiment, at least one feedthrough and electrical conduction path extend to the outer side of the component carrier. Alternatively, the feedthrough may extend to (another) electrical conduction layer structure. This allows for electrical connection with externally exposed portions of the electrical conduction layer structure and / or with other portions of the electrical conduction layer structure of the component carrier. The outer side (to which the feedthrough and electrical conduction path extend) may be the outer side facing the first surface of the electronic component. However, the outer side may also be an opposing outer side, where a connection may be established via (additional) through-connection. Alternatively, the outer side may be the main surface of the (intermediate) layer of the stack.

[0035] According to a preferred embodiment, the first portion extends at least partially through the feedthrough, preferably the first portion extends completely through the feedthrough, preferably the first portion extends to the outer side of the component carrier, and / or the first portion extends to one of the main surfaces of the layered structure of the stack constituting the component carrier, wherein preferably, the first portion forms a partial or complete lining of the inner wall of the feedthrough. Because the first portion (which already covers the electrically conductive portion of the electronic component) also covers the inner wall of the feedthrough, the separation / protection of the electrically conductive portion of the electronic component becomes more efficient and reliable. In other words, the electrically conductive portion of the electronic component is optimally sealed relative to the outside. Alternatively, the first portion extends at least partially through the feedthrough, preferably the first portion extends completely through the feedthrough, preferably the first portion extends through the feedthrough to one of the main surfaces of the layered structure of the stack constituting the component carrier.

[0036] According to a preferred embodiment, the second portion extends at least partially through the feedthrough, preferably completely through the feedthrough, and preferably extends through the feedthrough to the outer side of the component carrier. Alternatively, the second portion extends through the feedthrough to one of the main surfaces of the main surfaces of the layered structure constituting the component carrier. The second portion can further enhance the protection of one or more electrically conductive portions of the electronic component, while simultaneously ensuring reliable electrical connections. Furthermore, the lining of the outer side of the component carrier can be a footprint of layers formed in a panel-level construction, stacking one layer on top of another, and then forming a second portion that extends along the plane with other layers and is manufactured in a known, optimized, and economical manner (and then finally patterned).

[0037] In a preferred embodiment, the second portion has a protrusion that extends beyond the surface of the electrical insulation structure. This improves the interconnectivity with other parts, components, printed circuit boards, etc.

[0038] According to a preferred embodiment, the first portion covers the outer surface of the electrically insulating layer structure at least in the region of the feedthrough. The first portion extends from the bottom of the feedthrough (i.e., from the electrically conductive portion of the component) to the outer surface of the electrically insulating layer structure, effectively improving the sealing function / efficiency of the first portion (to protect the electrically conductive portion of the component).

[0039] In another embodiment, the first portion may be exposed through its sidewalls; this could be a case where the first portion extends to one of the main surfaces of the layers constituting the component carrier, wherein the first portion is covered by another layer structure, thus exposing only the sidewalls; according to another or alternative embodiment, the main surface of the first portion having an area less than 500 µm² is exposed. This can provide the advantage of reducing the risk of decomposition (especially oxidation) of the first portion, thereby ensuring high mechanical reliability. The exposure of the first portion having an area less than 500 µm² can be produced by the methods involved, and thus can be a fingerprint feature.

[0040] According to a preferred embodiment, the first material is an element selected from or includes an element selected from the following elements: Sc, Y, La, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Tc, or Re. Preferably, the first material is titanium, chromium, or tungsten, or the first material includes titanium, chromium, or tungsten. In other words, the first material is an element from Groups 3 to 7 of the periodic table, or the first material includes elements from Groups 3 to 7 of the periodic table, and / or the first material includes at least one element from Groups 3 to 7 of the periodic table.

[0041] Specifically, the first material can be: - Alloys between these elements / metals, such as TiW, VW, TiNb, NbTa, CrW, or TiCr; - One or more oxides of these elements / metals, such as: TiO, TiO2, Sc2O3, ZrO2, VO, V2O5, Nb2O5, Ta2O5, CrO, Cr2O3, MoO, Mo2O3, MoO2, WO, W2O3, or WO2; - Nitrides of one or more of these elements / metals, such as: Ti3N2, Ti3N4, ScN, Zr3N4, V3N2, V3N5, Nb3N5, Ta3N5, Cr3N2, CrN, Mo3N2, MoN, Mo3N4, W3N2, WN, W3N4; - One or more selenides from these elements / metals, such as: TiSe, TiSe2, Sc2Se3, ZrSe2, VSe, V2Se5, Nb2Se5, Ta2Se5, CrSe, Cr2Se3, MoSe, Mo2Se3, MoSe2, WSe, W2Se3, or WSe2; - Antimonides from one or more of these elements / metals, such as: Ti3Sb2, Ti3Sb4, ScSb, Zr3Sb4, V3Sb2, V3Sb5, Nb3Sb5, Ta3Sb5, Cr3Sb2, CrSb, Mo3Sb2, MoSb, Mo3Sb4, W3Sb2, WSb, or W3Sb4; or - One or more arsenides from these elements / metals, such as: Ti3As2, Ti3As4, ScAs, Zr3As4, V3As2, V3As5, Nb3As5, Ta3As5, Cr3As2, CrAs, Mo3As2, MoAs, Mo3As4, W3As2, WAs, or W3As4.

[0042] Due to their chemical affinity, all these materials can offer the advantage of good adhesion to second and / or third materials.

[0043] Additionally, these materials can be used as a barrier layer that inhibits the diffusion and / or migration of the materials in the second and / or third parts.

[0044] Furthermore, the first material may include at least two of the materials listed above (which may be any combination). A combination of Ti and TiW would be a very preferred choice for the first material.

[0045] Titanium, chromium, or tungsten are preferred elements for use in the first material.

[0046] According to a preferred embodiment, the second material is an element selected from or includes an element selected from the following elements: Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, Cd, Os, Ir, Pt, Au, or Hg. Preferably, the second material is an element selected from or includes an element selected from the following elements: Ti, Cr, Ni, Cu, Pd, Ag, Ir, or Au. In addition, the second material is copper, or the second material includes copper.

[0047] In other words, the second material is a transition metal or includes a transition metal, particularly transition metals from groups 3 to 12 of the periodic table. A further preferred second material is a non-metallic compound, such as a compound that does not contain oxides or nitrides (thus forming only metals or alloys). Preferably, the second material may have a concentration higher than 10. 5 The electrical conductivity is S / m and / or higher than 10 W / mK. Alternatively, the second material can have an electrical conductivity of less than 10 W / mK. 5 Electrical conductivity of S / m and / or thermal conductivity below 10 W / mK. This can provide the advantage of endowing specific physical and / or chemical properties to the electrical conduction path, such as Young's modulus, CTE (coefficient of thermal expansion), electrical resistance, and / or thermal resistance. Furthermore, a wide variety of materials offers the advantage of producing / manufacturing component carrier assemblies and / or component carriers with desired properties, and allows for flexible manufacturing using the described methods.

[0048] According to a preferred embodiment, the third material is different from and / or does not contain copper, and / or the third material is an element selected from or includes an element selected from the following elements: Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Al, Ga, In, Tl, Sn, or Pb, or the third material is carbon (e.g., graphene) or an electrically conductive polymer (e.g., PEDOT), preferably aluminum, or the third material includes aluminum. This can provide the advantage of achieving a reliable physical and / or electrical connection with electronic components via a feedthrough, and the third material of the electronic components can be composed of a variety of different materials with different physical and / or chemical properties. Such customized connections can ensure the long-term performance of electronic components because the method can be adapted to the required environment.

[0049] According to a preferred embodiment, the surface of the first portion facing the electrically conductive portion of the electronic component defines a protective surface interface, which is free of carbon and / or oxygen and / or oxides based at least on atoms of a third material; preferably, the surface interface is free of any oxides. Preferably, the carbon / oxygen / oxide-free surface interface is flush with the remainder of the conductive portion. This can reduce resistivity and / or thermal resistivity, thereby ensuring fast signal transmission and / or good heat transfer. Furthermore, reliable adhesion or cohesion can be achieved between the first portion and the third material of the electrically conductive portion.

[0050] According to a preferred embodiment, at least one electrically conductive portion of the electronic component is a component pad, or at least one electrically conductive portion of the electronic component is a layer overlapping the pad, preferably preventing the component pad from being exposed. This can provide the advantage of shortening the electrical conduction path and / or thermal conduction path, thereby enabling rapid signal transmission or reliable thermal conduction between at least one electrically conductive portion and the outer side of the component carrier.

[0051] In a preferred embodiment, the feedthrough portion is eccentric (off-center) relative to the corresponding electrically conductive portion (i.e., the electrically conductive portion whose position matches the feedthrough portion), wherein preferably, the cross-sectional area of ​​the feedthrough portion is smaller than the total surface area of ​​the electrically conductive portion. In other words, the center of the cross-sectional area of ​​the feedthrough portion is not aligned with the center of the total surface area of ​​the electrically conductive portion (which matches the position of the feedthrough portion). This embodiment allows for deviations in central alignment without reducing the quality of the electrical contact. This embodiment allows for greater tolerances in manufacturing methods (e.g., laser drilling of the feedthrough portion) and makes the manufacturing method more cost-effective.

[0052] According to a preferred embodiment, the contact area between the electrically conductive portion and the first portion corresponds to at least 60% of the total surface area of ​​the electrically conductive portion, preferably at least 80% of the total surface area of ​​the electrically conductive portion. The remaining portion is preferably covered and protected by an electrically insulating layer structure. Since the first portion of the electrical conduction path extends not only on the surface of the electrically conductive portion of the component but also on a portion of the stacked component, and also covers the inner wall of the feedthrough portion (at least in the bottom region), a gapless seal is achieved.

[0053] According to a preferred embodiment, the contact area between the electrically conductive portion and the first portion corresponds to the cross-sectional area of ​​the feedthrough portion, wherein preferably, the cross-sectional area of ​​the feedthrough portion is smaller than the total surface area of ​​the electrically conductive portion. The cross-sectional area of ​​the feedthrough portion can be substantially constant; alternatively, in the case of a non-constant cross-sectional area, "the cross-sectional area of ​​the feedthrough portion" refers to the cross-sectional area at the end of the feedthrough portion facing the electronic component. This can provide the advantage that the entire (lower) end of the feedthrough portion is covered by the first portion.

[0054] According to a preferred embodiment, the first portion includes at least two layer portions extending on at least two different levels, wherein the at least two different levels are separated from each other by at least one electrically insulating layer of an electrically insulating layer structure. Preferably, the at least two layer portions extending on at least two different levels are interconnected by at least one portion extending transversely to the planes of the at least two levels, and preferably, the at least one portion extending perpendicularly to the planes of the at least two levels. This fingerprint feature can be implemented using the manufacturing method described, which relates to an economical and reliable panel-level construction. Therefore, the transversely extending at least one portion prevents material from diffusing from the at least one electrically insulating layer structure into the electrical conduction path.

[0055] According to a preferred embodiment, an electrically conductive layer of an electrically conductive layer structure is provided on the outer side of at least one electrically insulating layer structure, wherein a first portion at least partially covers and / or attaches to the electrically conductive layer. This provides the advantages of easy-to-manufacture connections to exposed surfaces, and additionally has electrically conductive portions and / or surfaces extending perpendicular to the stacking direction. This simplifies the design of electrical connections from at least one electrically conductive portion to the exposed surface or intermediate surface of the component carrier.

[0056] According to a preferred embodiment, at least two adjacent feedthroughs of a plurality of feedthroughs are separated by a multilayer wall comprising at least an electrically insulating layer and an electrically conductive layer. This can provide the advantage of imparting additional physical properties (such as coefficient of thermal expansion or Young's modulus) to the component carrier, ensuring high-volume production using the described method.

[0057] According to a preferred embodiment, the feedthrough opening in at least one electrically insulating layer structure and the feedthrough opening provided in at least one electrically insulating layer structure (i.e., adjacent to / in contact with said electrically insulating layer structure) have a planar extension (from one side of said at least one electrically insulating layer structure) defining an undercut below the electrically conductive layer. This can provide the advantage of providing a good mechanical structure for additional electrically insulating layer structures or additional electrically conductive layer structures, because the undercut can be constructed as an anchoring structure. This anchoring structure can interweave with additional electrically insulating layer structures or additional electrically conductive layer structures. The undercut can be a footprint of a manufacturing method, such as the result of laser drilling in the electrically conductive layer and the electrically insulating layer structure forming the feedthrough.

[0058] According to a preferred embodiment, the first portion (covering and preferably attached to the electrically conductive portion of the electronic component) and the additional layers (covering and / or attached to the electrically conductive layer and formed of the same material as the first portion) do not form a continuous structure and / or are separated from each other and / or are not bonded to each other. The artifact produced by the provided method can create additional anchoring structures for the second portion of the electrically conductive path, providing good mechanical bonding and good electrical conduction.

[0059] According to a preferred embodiment, the electronic component includes a plurality of electrically conductive portions at its first surface for establishing an electrical connection with a functional portion of the electronic component, wherein a plurality of feedthroughs are formed in an electrically insulating layer structure, the feedthroughs being positionally matched with the plurality of electrically conductive portions of the electronic component, wherein an electrical conduction path extends from each of the electrically conductive portions of the electronic component through a corresponding feedthrough of the plurality of feedthroughs, wherein each electrical conduction path includes: - A first portion, preferably formed as a layer, covering at least a portion of the electrically conductive portion of the electronic component, further covering at least a portion of the stacked component, preferably also covering at least a portion of the electrically insulating layer structure, and - The second part, preferably formed as a layer, covers the first part and is separated from the electrically conductive portion of the electronic component by the first part.

[0060] This can provide the following advantages: using the described method to provide multiple physical and / or electrical connections for multiple electrically conductive parts of an electronic component in a simple and reliable manner.

[0061] According to a preferred embodiment, the first portion covers the electrically conductive portion of the electronic component and at least the wall portion of the feedthrough portion facing the electronic component. This can provide the advantage of orienting the electrical connection (i.e., guiding the electronic signal) in the desired direction, thereby reducing signal loss.

[0062] This objective is also achieved by a method for manufacturing a component carrier assembly, the component carrier assembly including a component carrier and electronic components, wherein the component carrier includes a stack, the stack including at least one electrically conductive layer structure and at least one electrically insulating layer structure, and wherein the electronic components include at least one electrically conductive portion at a first surface for establishing an electrical connection with a functional portion of the electronic components, the method comprising the following steps: (a) An electronic component is at least partially embedded within a component carrier, preferably, the electronic component is completely embedded within the component carrier, such that the at least one electrically insulating layer structure covers at least a first surface of the electronic component, and at least one feedthrough is formed in the electrically insulating layer structure, the at least one feedthrough being positionally matched with at least one electrically conductive portion of the electronic component. (b) Forming an electrical conduction path extending from at least one electrically conductive portion of the electronic component through the feedthrough, wherein step (b) includes the following sub-steps: (b1) A first portion forming an electrical conduction path, preferably a layer, the first portion covering at least a portion of the electrical conduction portion of the electronic component, the first portion also covering at least a portion of the stacked component, preferably, the first portion also covering at least a portion of the electrical insulating layer structure, and (b2) A second portion forming an electrical conduction path, preferably a layer, the second portion covering the first portion, the second portion being separated from the electrical conduction portion of the electronic component by the first portion. The first part is formed of a first material, the second part is formed of a second material, and the electrically conductive part of the electronic component is formed of a third material. The first material and the third material are different. Preferably, the first material is different from the second material and different from the third material. The second material and the third material are different from each other.

[0063] According to a preferred embodiment, this method is for manufacturing a component carrier assembly of the present invention, specifically according to one embodiment described above. The advantages of the component carrier of the present invention have been discussed above, and these arguments are also applied to the manufacturing method.

[0064] According to a preferred embodiment, at least one feedthrough portion of the electrically insulating layer structure is formed by material removal, preferably by laser drilling. More preferably, the at least one feedthrough portion of the electrically insulating layer structure is formed by material removal after the first surface of the electronic component has been covered by the at least one electrically insulating layer structure. The material removal must take into account the elasticity of the third material. In particular, when the third material is aluminum, laser drilling is a preferred option because chemical processing may cause corrosion. This offers the advantage of being able to use a third material that is easily decomposed (especially etched) during wet chemical manufacturing processes.

[0065] According to a preferred embodiment, sub-step (b1) is performed by material deposition, preferably by chemical vapor deposition or physical vapor deposition (e.g., sputtering), and / or sub-step (b2) is performed by material deposition, preferably by sputtering. In this way, reliable adhesion can be achieved, thereby achieving good electrical contact, and in particular, reliable adhesion of the first material to the third material can be achieved, thereby achieving good electrical contact.

[0066] According to a preferred embodiment, an electrically conductive layer is disposed on the outer side of the electrically insulating layer structure, wherein preferably, the outer electrically conductive layer is formed of a second material. This can provide the advantage of good physical, chemical, and / or mechanical interactions because the material of the outer electrically conductive layer can be similar to the second material, and in particular, the material of the outer electrically conductive layer can be the same as the second material. Furthermore, the manufacturing equipment does not necessarily need to be adapted, as the use of similar (especially identical) materials in the manufacturing process may enable higher throughput.

[0067] According to a preferred embodiment, the method includes the following steps prior to step (b): The electrically conductive layer (disposed on the outer side of at least one electrically insulating layer structure) is partially covered by a mask (preferably a peel-off mask), such that the feedthrough portion and the area adjacent to the feedthrough portion are covered by the mask. The electrically conductive layer in the area not covered by the mask is removed, preferably by etching or laser ablation. Remove the mask so that at least one electrically conductive portion of the electronic component can be accessed through the feedthrough.

[0068] Use a removable mask to protect the electrically conductive portion of the electronic components on the bottom of one or more feedthroughs (also known as one or more vias) during the step of removing the (outer) electrically conductive layer (especially if made of aluminum).

[0069] According to a preferred embodiment, in sub-step (b1), the remaining (external) electrically conductive portion is covered by the first material of the first part. This measure enhances the connection between the second part and the first part, both in terms of mechanical stability and electrical connection. Furthermore, the third material is effectively protected by the first part, thus allowing for possible wet chemical treatment steps without decomposing the third material.

[0070] According to a preferred embodiment, the method includes the steps of selectively removing electrically conductive material from the outer side of the electrically insulating layer structure, preferably by etching, such that adjacent electrically conductive paths extending to the electrically conductive portions of the electronic component are electrically separated from each other. This can provide the advantage of creating a plurality of laterally spaced electrical feedthroughs, wherein the spacing can be less than 20 µm, preferably less than 15 µm.

[0071] According to a preferred embodiment, the method includes a first step of cleaning at least one electrically conductive portion of the electronic component before step (b), and preferably, the method includes a first step of cleaning at least one electrically conductive portion of the electronic component before step (b) and after step (a). Preferably, the first cleaning step is configured to remove carbon material and / or carbon residue from at least one electrically conductive portion. Preferably, the first cleaning step includes plasma treatment, and more preferably, the first cleaning step includes oxygen-containing plasma treatment. This can provide the advantages of creating a residue-free connection between the electrical conduction path and the first portion, and / or creating a residue-free connection between the first portion and the second portion, and / or creating a residue-free connection between the first portion or the second portion and the electrical insulation layer structure.

[0072] According to a preferred embodiment, the method includes, before step (b) and preferably after step (a) and preferably after the first cleaning step, a second step of cleaning at least one electrically conductive portion of the electronic component, wherein the second cleaning step is configured to remove oxides from at least one electrically conductive portion, wherein preferably, the second cleaning step includes plasma treatment, and more preferably, the second cleaning step includes argon plasma treatment. This can provide the advantage of creating a connection between the first portion and the electrically conductive portion free of foreign material and / or voids. This can form a highly reliable connection with good thermal diffusion and / or electrical signal transmission capabilities.

[0073] To better understand the present invention, it will be explained in more detail below with the aid of the accompanying drawings. Attached Figure Description

[0074] The following is illustrated in a highly simplified schematic diagram: Figure 1 An implementation of an intermediate product, wherein the component is embedded within a component carrier; Figure 2 Implementation method of intermediate products having feedthrough section; Figure 3 An implementation of an intermediate product, wherein a mask covers the feedthrough portion; Figure 4 Implementation method of intermediate products in which the electrical conduction portion is removed; Figure 5 An implementation of the intermediate product in which the mask is removed; Figure 6 An embodiment of an intermediate product having a first part and a second part of an applied electrical conduction path; Figure 7 An implementation of the intermediate product, wherein the feedthrough portion is filled with a second material; Figure 8 An embodiment having an intermediate product with a mask applied to form a protrusion for the second part; Figure 9 Implementation method for intermediate products with the mask removed; Figure 10 Implementation of the intermediate product after removal of the (electrically conductive) layer generated by material deposition; Figure 11 An embodiment of the intermediate product after the removal of the layer generated by the material of the first part or the first material (excessive); Figure 12 Embodiments of the component carrier assembly of the present invention; and Figure 13 Implementation method of feedthrough structure.

[0075] Figure 14 Another implementation method.

[0076] Figure 15 Another implementation method.

[0077] Figure 16 Another implementation method. Detailed Implementation

[0078] As an introduction, it should be noted that in embodiments described in different ways, the same components or method steps are indicated by the same reference numerals or the same component names; at the same time, the disclosure included throughout the specification can be similarly applied to the same components having the same reference numerals or the same component names. Furthermore, the location indications selected in the specification—e.g., at the top, at the bottom, at the side, etc.—refer to the drawings that are directly shown and described; and if the location changes, the location indications can be similarly applied to the new location.

[0079] These embodiments illustrate possible variations; however, it should be noted that the invention is not limited to the specific variations shown; rather, various combinations of the various variations are possible, and the possibility of such variations depends on the skill of those skilled in the art, as provided by the technical information provided in this invention.

[0080] The scope of protection is defined by the claims. However, the specification and drawings are used to interpret the claims. Individual features or combinations of features from the different embodiments shown and described can themselves constitute independent solutions according to the invention. The purpose on which the independent solutions according to the invention are based can be understood from the specification.

[0081] Any indication of a numerical range in this specification shall be construed as including any subrange and all subranges of that numerical range; for example, an indication of 1 to 10 shall be construed as including all subranges from the lower limit of 1 to the upper limit of 10; that is, all subranges begin with a lower limit of 1 or greater and terminate with an upper limit of 10 or less, such as 1 to 1.7, or 3.2 to 8.1, or 5.5 to 10.

[0082] For the sake of clarity, it should finally be noted that, for better understanding, some facts shown in the accompanying drawings are not drawn to scale and / or are drawn enlarged and / or drawn at a reduced size.

[0083] Figure 12 An exemplary embodiment of component carrier assembly 1 is shown.

[0084] Figures 1 to 11 An exemplary embodiment of the manufacturing component carrier assembly 1 is shown.

[0085] from Figure 12 As can be seen, the component carrier assembly 1 includes a component carrier 2 and an electronic component 10 that is at least partially (completely in this embodiment) embedded in the component carrier 2.

[0086] The component carrier 2 includes a stack 4, which includes at least one electrically conductive layer structure 9 and at least one electrically insulating layer structure 3, wherein the at least one electrically insulating layer structure 3 (e.g., in the form of a resin sheet) covers at least a first surface 11 of the electronic component 10 and optionally covers at least a portion of at least one electrically conductive portion 12. The electrically conductive layer structure 9... Figure 12 The diagram is schematically shown, and the electrically conductive layer structure 9 may be electrically connected, for example, to at least one of the electrically conductive paths 6, or to other components, interfaces, or connections.

[0087] Electronic component 10 includes an electrically conductive portion 12 (in the form of a pad) on its first surface 11 for establishing an electrical connection with a functional portion 13 of the electronic component 10. Furthermore, in an exemplary embodiment, electronic component 10 also includes an electrically conductive portion 12 (in the form of a pad) on its opposite surface for establishing additional electrical connections with the functional portion 13 of the electronic component 10 and / or for heat distribution. The electrically conductive portion 12 may be a component pad or a layer overlapping the pad, preferably preventing the component pad from being exposed.

[0088] Feedthroughs 5 are formed in the electrically insulating layer structure 3, each feedthrough 5 being positionally matched with an electrically conductive portion 12 of the electronic component 10. Positional matching means that the feedthrough (section) and the electrically conductive portion 12 at least partially overlap. Deviations from perfect or complete overlap also fall within the term "positional matching," which allow the electrically conductive portion 12 to make electrical contact via the feedthrough (alternatively, it can be understood that at least one feedthrough can be positioned such that, due to some deviation from complete overlap, more than 1% of the area that should be in contact with the electrically conductive portion 12 is not in direct contact). An electrically conductive path 6 (which may be part of or electrically connected to at least one electrically conductive layer structure 9) extends from the electrically conductive portion 12 of the electronic component 10 through the feedthroughs 5.

[0089] The first portion 7 of the electrical conduction path 6 (preferably formed as a layer) covers at least a portion of the electrical conduction portion 12 of the electronic component 10, thereby establishing an electrical connection between the electrical conduction portion 12 and the electrical conduction path 6. Preferably, the first portion 7 of the electrical conduction path 6 can completely cover the conduction portion 12 of the electronic component 10. The first portion 7 also covers at least a portion of the stack 4. In this embodiment, the first portion covers (directly contacts) at least a portion of the electrical insulating layer structure 3, and in particular, the first portion covers the portion of the electrical insulating layer structure 3 that forms the sidewall of the feedthrough portion 5. For example, this can be achieved by the first portion 7 covering the electrical conduction portion 12 of the electronic component 10 and at least the wall portion of the feedthrough portion 5 facing the electronic component 10.

[0090] As can be seen from the accompanying drawings, the first portion 7 extends at least partially, and preferably completely, through the feedthrough 5, and preferably extends to the outer side of the component carrier 2. Preferably, the first portion 7 forms a partial or complete lining of the inner wall of the feedthrough 5. Alternatively, the first portion 7 may cover at least the outer surface of the electrical insulation layer structure 3 in the region of the feedthrough 5 (see...). Figure 12 At least one (horizontal and / or vertical) portion of Part 7 may be exposed to the external surface of the component carrier (assembly).

[0091] The second portion 8 (preferably formed as a layer) of the electrical conduction path 6 covers (directly contacts) the first portion 7, thereby establishing an electrical connection between the first portion 7 and the second portion 2. The second portion 8 is separated from the electrical conduction portion 12 of the electronic component 10 by the first portion 7. Alternatively, at least a portion of the second portion 8 may directly contact the electrical conduction portion 12 of the electronic component 10. Preferably, if the second portion 7 extends through the feedthrough 5, it preferably extends to the outer side of the component carrier 2 (see...). Figure 12 ).

[0092] Furthermore, according to a preferred embodiment, the second surface 22 of component 10 (opposite to the first surface 11) may also be covered by an electrically insulating layer structure 3 (preferably, the electrically insulating layer structure 3 has the same type and / or size as the electrically insulating layer structure 3 covering the first surface 11, or alternatively, the bottom electrically insulating layer structure may differ from the top electrically insulating layer structure in that at least one of the following characteristics is present: the composition of the resin, the composition of the included filler material, the amount of filler material, the shape of the filler material, and the size of the layer). One or more feedthroughs 5 and one or more electrical conduction paths 6 may be arranged in the same or similar manner, extending from one or more electrical conduction portions 12 located on the second surface 22 of component 10. Figure 12 ).

[0093] The first part 7 is formed of a first material (preferably including titanium), the second part 8 is formed of a second material (preferably including copper), and the electrically conductive part 12 of the electronic component 10 is formed of a third material (preferably including aluminum), wherein the first material and the third material are different, wherein preferably, the first material is different from both the second and third materials, and wherein preferably, the second material and the third material are different from each other.

[0094] The first material may be selected from the following elements or may include elements selected from the following elements: Sc, Y, La, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Tc, and Re. Preferably, the first material is titanium (Ti), chromium (Cr), or tungsten (W), or the first material includes titanium, chromium, or tungsten. Additionally and / or alternatively, the first material may include elements selected from the following elements: Na, K, Ca, Mg, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, Cd, Os, Ir, Pt, Au, Hg, Al, and Si.

[0095] The second material may be an element selected from or may include an element selected from the following elements: Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, Cd, Os, Ir, Pt, Au, Hg. Preferably, the second material may be an element selected from or may include an element selected from the following elements: Ti, Cr, Ni, Cu, Pd, Ag, Ir, Au. Preferably, the second material is copper or includes copper. Additionally or alternatively, the second material may be an element selected from or may include an element selected from the following elements: Na, K, Ca, Mg, Al, Sn, Pb.

[0096] The third material is preferably different from and / or does not contain copper. The third material may be an element selected from or may include an element selected from the following elements: Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Al, Ga, In, Tl, Sn, or Pb. The third material may be carbon (e.g., graphene) or an electrically conductive polymer (e.g., PEDOT), wherein preferably, the third material is aluminum, or the third material includes aluminum. Additionally or alternatively, the third material may be an element selected from or may include an element selected from the following elements: Na, K, Ca, Mg, Cr, Ni, Pd, Pt, Au, Ag.

[0097] from Figure 12 It can be seen that at least one feedthrough 5 and the electrical conduction path 6 extend to the outer side of the component carrier 2. Thus, preferably, at least one surface is exposed to the outer side of the component carrier 2.

[0098] In one embodiment, the surface of the first portion 7 facing the electrically conductive portion 12 of the electronic component 10 defines a protective surface interface, which is free of carbon and / or oxygen and / or oxides based at least on atoms of a third material; preferably, the surface interface is free of any oxides. Alternatively, the protective surface interface includes a carbon and / or oxygen content of less than 1000 ppm. Furthermore or alternatively, the surface interface is free of sulfur and / or nitrogen and / or phosphorus.

[0099] The following describes a preferred embodiment of the first part: The contact area between the electrically conductive portion 12 and the first portion 7 can correspond to at least 60% of the total surface area of ​​the electrically conductive portion 12, preferably at least 80% of the total surface area of ​​the electrically conductive portion 12. Alternatively, the contact area between the electrically conductive portion 12 and the first portion 7 can be between 30% and 60%. If the contact area is less than 100% of the total surface area of ​​the electrically conductive portion 12, it is preferable that the remaining area of ​​the electrically conductive portion 12 is covered by the electrically insulating layer structure 3. Alternatively, the remaining area of ​​the electrically conductive portion 12 is covered by another electrically insulating material (e.g., glass or ceramic).

[0100] For example, the contact area between the electrically conductive portion 12 and the first portion 7 can correspond to the cross-sectional area of ​​the feedthrough portion 5, wherein preferably, the cross-sectional area of ​​the feedthrough portion 5 is smaller than the total surface area of ​​the electrically conductive portion 12. Alternatively, the cross-sectional area of ​​the feedthrough portion 5 can have the same size as the total surface area of ​​the electrically conductive portion 12, or the cross-sectional area of ​​the feedthrough portion 5 can even be larger than the total surface area of ​​the electrically conductive portion 12.

[0101] from Figure 12 As can be seen from the preferred embodiment, the first part 7 may include at least two layer parts 7a, 7c extending on at least two different levels, wherein the at least two different levels are separated from each other by at least one electrically insulating layer of the electrically insulating layer structure 3.

[0102] from Figure 12 It can also be seen that the at least two layer portions 7a and 7c can be interconnected by at least one portion 7b, which extends transversely to the plane of the at least two layers. Preferably, at least one portion 7b extends perpendicularly to the plane of the at least two layers.

[0103] The electrically conductive layer 15 may also be disposed on the outer portion 14 of the electrically insulating layer structure 3. In this case, the first portion 7 may at least partially cover and / or attach to the electrically conductive layer 15. Alternatively, an additional electrically insulating layer may be disposed on the outer portion 14 of the electrically insulating layer structure 3. In this case, the first portion 7 may at least partially cover and / or attach to the additional electrically insulating layer. Alternatively, the additional electrically insulating layer may be removed before applying the first portion 7 (the layer).

[0104] According to another embodiment, at least two adjacent feedthroughs 5 of the plurality of feedthroughs 5 may be separated by a multilayer wall comprising at least an outer insulating layer and an outer electrically conductive layer 15. Alternatively, at least two adjacent feedthroughs 5 of the plurality of feedthroughs 5 may be separated by a layer comprising at least one electrically insulating layer structure. The feedthrough opening of the electrically insulating layer structure and (optionally) the feedthrough opening disposed on the electrically conductive layer 15 (in contact with / attached to the electrically insulating layer structure) may each have a planar extension defining an undercut portion below the outer electrically conductive layer 15 (see [link to other embodiments]). Figure 13 ).

[0105] Figure 12 An embodiment is shown in which the first portion 7 extends in such a way that it covers the electrically conductive portion 12 (forming the bottom of the feedthrough 5) and the lower portion of the inner wall of the (tapered) feedthrough 5. In other words, in this embodiment, the first portion 7 also covers at least a portion of the electrically conductive portion 12 of the electronic component 10 and at least a portion of the stack 4 (here: a portion of the inner wall of the electrically insulating layer structure 3 forming the feedthrough 5). Furthermore, the first portion 7 may extend beyond the thickness of the stack 2. Alternatively, the first portion 7 may be part of the stack.

[0106] According to another embodiment, the layer 7c of the first part 7 does not form a continuous structure with the other layer 17 and / or is separated from each other and / or is not bonded to each other. The layer 7c covers and is preferably attached to the electrically conductive portion 12 of the electronic component 10. The other layer 17 covers and / or is attached to the outer portion of the electrically conductive layer 15 and is formed of the same material as the first part 7.

[0107] Other optional features are described below: The stack 4 or component carrier 2 may include additional (electrically conductive and / or electrically insulating) layers to form a multilayer stack.

[0108] The exposed or outer surface of the component carrier 2 or component carrier assembly 1 may be provided with a "surface treatment section" or treatment layer (in the processing step), wherein preferably, solder resist and / or tin layer and / or gold layer (or the like) are applied to the outer surface.

[0109] The core 18 may be a multilayer core and / or a glass core or a ceramic core. The core 18 may be a core layer but does not have to be a core layer (it may be an incompletely cured layer).

[0110] The preferred dimensions of the layers or structural elements of the component carrier (assembly) are listed below: The core 18 may have a thickness of 50 µm to 600 µm, preferably, the core 18 may have a thickness of 60 µm to 250 µm.

[0111] The electrically conductive portion 12 of the electronic component 10 may have a thickness of 0.5 µm to 10 µm, and preferably, the electrically conductive portion 12 of the electronic component 10 may have a thickness of 1 µm to 5 µm.

[0112] The electrical insulation layer structure 3 can have a thickness of 5 µm to 250 µm, preferably, the electrical insulation layer structure 3 can have a thickness of 10 µm to 80 µm.

[0113] The electrically conductive layer 15 may have a thickness of 0.5 µm to 20 µm, preferably, the electrically conductive layer 15 may have a thickness of 1 µm to 10 µm.

[0114] The first part 7 (layer) may have a thickness of 20 nm to 2 µm, preferably, the first part 7 (layer) may have a thickness of 50 nm to 800 nm.

[0115] The feed passage 5 may have a diameter of 2 µm to 150 µm, preferably, the feed passage 5 may have a diameter of 10 µm to 70 µm.

[0116] The electrically conductive portion 12 of the electronic component 10 may protrude beyond the component surface (first surface 11 or second surface 12), the electrically conductive portion 12 of the electronic component 10 may be flush with the component surface, or the electrically conductive portion 12 of the electronic component 10 may be serrated (e.g., Figure 12 (As shown).

[0117] Through-connection sections can connect external electrically conductive layer structures and / or different metal layers to each other (through-holes for mechanical plating / laser drilling).

[0118] exist Figure 14 In the preferred embodiment shown, the feed passage 5 may be eccentric (off-center) relative to the corresponding electrical conductive portion 12 (i.e., the electrical conductive portion 12 that matches the position of the feed passage 5); or in other words, the center of the cross-sectional area of ​​the feed passage 5 is not aligned with the center of the total surface area of ​​the electrical conductive portion 12 (which matches the position of the feed passage).

[0119] In the following text about Figures 1 to 11 An exemplary method for manufacturing a component carrier assembly 1 is described. This method can be applied to manufacturing the component carrier assembly 1 according to embodiments of the present invention.

[0120] According to step (a), the electronic component 10 is at least partially (in this embodiment, completely) embedded in the component carrier 2 such that the at least one electrically insulating layer structure 3 (preferably having a thickness between 10 µm and 50 µm) covers at least the first surface 11 of the electronic component 10, preferably, the electrically insulating layer structure 3 is a resin sheet. Figure 1 A possible result is shown where a core 18 with embedded component 10 (on the same layer) is sandwiched between (upper and lower) electrically insulating layer structures 3. The core 18 and / or component 10 can have a thickness (i.e., vertical extension) between 30 µm and 200 µm, preferably between 30 µm and 100 µm. Alternatively, the electronic component 10 can be thinner than the core (layer) 18. Typically, the initial cavity (in which the electronic component 10 is embedded) is larger in the main extension (x, y; i.e., parallel to plane P) of the initial cavity. Preferably, after the electronic component 10 is placed inside the cavity, additional (filler) material is used to fill the gap (between the cavity and the component).

[0121] An electrically conductive layer 15 (preferably having a thickness between 1 µm and 5 µm) may be disposed on the top and / or bottom of the intermediate product. Preferably, the electrically conductive layer 15 is a foil, such as copper foil. The electrically conductive layer 15 may be formed of a second material. Of course, alternatively, the electrically conductive layer 15 may be formed of a material different from the second material.

[0122] After providing an intermediate product with embedded component 10, at least one feedthrough 5 is formed in the electrical insulating layer structure 3, the at least one feedthrough 5 being positioned to match at least one electrically conductive portion 12 of the electronic component 10. Figure 2 In this embodiment, a feedthrough 5 is formed for each electrically conductive portion 12 of component 10. Forming one or more feedthroughs 5 can be accomplished by material removal, preferably by laser drilling. Alternatively, material removal for forming one or more feedthroughs 5 can be accomplished by plasma etching, preferably by a RIE (Relative Inductively Coupled Electrode) process. Preferably, the material removal process can completely remove the material forming one or more portions of the feedthroughs. Thus, at least a portion of the electrically conductive layer 15 and at least a portion of the electrically insulating layer structure 3 can be removed to expose at least one electrically conductive portion 12.

[0123] When an electrically conductive layer 15 is provided on the top and / or bottom of an intermediate product, the material of the layer 15 is selectively removed at a position that matches the position of at least one electrically conductive portion 12 or feedthrough portion 5. Figure 2 Selective removal can be accomplished using a laser beam (especially an ultraviolet (UV) laser beam). When using a laser, [the desired effect] can be achieved. Figure 13 The shape shown is particularly the tapered shape of the feedthrough 5. Alternatively, selective removal can be accomplished by applying a mask (preferably a mask from a photoresist) and then etching. Optionally, after the material removal process, a cleaning or washing process can be performed, for example using a cleaning fluid, i.e., water or an organic solvent.

[0124] In an alternative embodiment, the electrically conductive portion 12 may be selectively covered with a material that serves as a mask for a subsequent step of applying the electrically insulating layer structure 3 by material deposition. The material used as the mask (e.g., a photoresist) will be removed after the electrically insulating layer structure 3 has been applied. The opening left in the electrically insulating layer structure 3 then forms the feedthrough portion 5.

[0125] The method may include the following steps after step (a) and before step (b): partially covering the electrically conductive layer 15 with a mask (preferably a peel-off mask 16), such that the feedthrough 5 and the region adjacent to the feedthrough 5 are covered by the mask. Figure 3 ); and removing the exposed electrically conductive layer 15 in areas not covered by the mask ( Figure 4 Preferably, the exposed electrically conductive layer 15 in the area not covered by the mask is removed by etching or laser ablation; and the mask 16 is removed so that at least one electrically conductive portion 12 of the electronic component 10 can be accessed through the feedthrough 5. Figure 5 The use of a mask protects the electrically conductive portion 12 (specifically, the electrically conductive portion is made of aluminum) on the bottom of one or more feedthroughs 5 (also referred to as one or more vias).

[0126] According to step (b), an electrical conduction path (6) is formed, which extends from at least one electrical conduction portion 12 of the electronic component 10 through the feedthrough portion 5. Step (b) includes sub-steps (b1) and (b2): According to sub-step (b1), a first portion 7 (preferably a layer) of the electrical conduction path 6 is formed, which covers at least a portion of the electrical conduction portion 12 of the electronic component 10. Figure 6The first portion 7 also covers at least a portion of the stack 4, preferably, the first portion 7 also covers at least a portion of the electrically insulating layer structure 3 (covering the first surface 11). Sub-step (b1) can be performed by material deposition, preferably by chemical vapor deposition or physical vapor deposition (e.g., sputtering). According to an embodiment, in sub-step (b1), the remaining electrically conductive layer 15 (i.e., the electrically conductive layer 15 after removing the mask 16) can be covered by the first material of the first portion 11. The sidewalls of the electrically insulating layer structure 3 can also be covered by the first material. As described above, the first portion 7 can be formed as a layer, preferably having a thickness of 20 nm to 2 µm, more preferably having a thickness of 50 nm to 800 nm.

[0127] According to sub-step (b2), a second part 8 (preferably, the second part is a layer) is formed in the electrical conduction path 6, and the second part 8 covers the first part 7. Figure 6 The second part 8 is separated from the electrically conductive part 12 of the electronic component 10 by the first part 7. Sub-step (b2) can be performed by material deposition, preferably by plating or electroless plating.

[0128] As already described, the first part 7 is formed of a first material, the second part 8 is formed of a second material, and the electrically conductive part 12 of the electronic component 10 is formed of a third material, wherein the first material and the third material are different, wherein preferably, the first material is different from both the second and third materials, and wherein preferably, the second material and the third material are different from each other.

[0129] Figure 7 Alternative or additional steps are shown, wherein the feedthrough 5 is completely filled with the second material (second part 8). This can preferably be accomplished by plating, and more preferably, by electroless plating and / or (by additional) electrochemical plating.

[0130] Figure 8 Alternative or additional steps are also shown, wherein the second part 8 is formed with a protrusion 20, so as to (in Figure 12 In the final product, the material extends beyond the surface of the electrical insulation structure 3. This can be accomplished by applying a mask 19, preferably a photoresist material (e.g., by lamination), followed by development, and then material deposition, preferably by plating (e.g., copper). In a next step, the mask 19 can be removed (e.g., by removing the photoresist), and the final product obtained according to... Figure 9 The intermediate product. In subsequent steps, preferably, the (electrically conductive) layer 21 formed by the deposition of this material can be removed by etching (e.g., rapid copper etching or plasma processing), and the desired product can be obtained according to... Figure 10 Intermediate products. In a further step, preferably, the (excess) first portion of material or the (exposed) conductive layer structure 23 formed by the first material can be removed by etching (e.g., titanium etching or other plasma processes), and the intermediate product obtained is obtained according to... Figure 12 The final product.

[0131] To summarize the steps of the above embodiments, the method may include the following steps: selectively removing electrically conductive material from the outer side of the electrically insulating layer structure 3, preferably by etching or plasma processing, such that adjacent electrically conductive paths 6 extending to the electrically conductive portions 12 of the electronic component 10 are electrically separated from each other. Figure 12 ).

[0132] Preferably, the method includes a first step of cleaning at least one electrically conductive portion 12 of the electronic component 10 before step (b) and preferably after step (a). The first cleaning step may be configured to remove carbon material and / or carbon residue from at least one electrically conductive portion 12. The first cleaning step may include plasma treatment, preferably oxygen-containing plasma treatment.

[0133] Preferably, the method includes, before step (b) and preferably after step (a) and preferably after the first cleaning step, a second step of cleaning at least one electrically conductive portion 12 of the electronic component 10, wherein the second cleaning step is configured to remove oxides from at least one electrically conductive portion 12, wherein preferably, the second cleaning step includes plasma treatment, and preferably, the second cleaning step includes argon plasma treatment.

[0134] at last, Figure 15 and Figure 16 Additional details of a preferred embodiment of the component carrier assembly are shown. Features shown and described below may be distinguishing features of the method used.

[0135] Figure 15 The contact structure at the upper right corner has the following structure on the left side: the sidewall of the feed passage 5 is not vertically flush with the left end of the first part 7. Below this end of the first part 7 (e.g., the titanium layer), layer 15 (in... Figure 11 The portion 7 (which is still visible; for example, the copper layer) has been removed. Due to this removal, a cavity is formed between the end of the first portion 7 and the electrical insulating layer structure 3. Furthermore, the end of the first portion 7 extends laterally beyond the second portion 8.

[0136] exist Figure 15The contact structure at the upper right corner has the following structure on the right side: the first part 7 extends laterally beyond the sidewall of the feedthrough 5, and even extends beyond layer 15 and beyond the second part 8. Furthermore, it can be seen that the first part 7 covers the top of layer 15 and the lateral sides of layer 15. The right end of the first part 7 can even contact the electrical insulation layer structure 3. Figure 15 In this embodiment, both (left and right) ends of the first part 7 are exposed.

[0137] exist Figure 15 The contact structure at the bottom has the following structure: the end of the first part 7 (e.g., titanium) is flush with the rest of the layer 15 (e.g., copper) in the vertical direction; however, the second part 8 is etched further, so the end of the first part 7 extends laterally beyond the second part 8.

[0138] refer to Figure 15 and Figure 16 The described contact structure can be associated with three distinct etching steps (etching the second part 8, etching the first part 7, and etching layer 15). The complex hydrodynamics during etching can allow for the etching of portions with a higher degree / amount of etching compared to other parts. Therefore, it is also possible to form (see reference) Figure 15 (Description of the depression)

[0139] It can be seen that each layer is completely etched in terms of its thickness.

[0140] In the illustrated embodiments, the sidewalls of these structures are drawn as vertically straight; however, alternatively, the sidewalls may also have inclined or tapered or convex or concave shaped portions, or the sidewalls may have irregular shapes.

[0141] All these variations can be implemented in combination or individually in the component carrier assembly of the present invention. These contact structures can form anchoring structures and can bring the advantage of good mechanical / physical / chemical interaction with the (electrically insulating) layer structure of other applications.

[0142] at last, Figure 16 A variation without layer 15 is shown in the final product. In this case, the first part 7 can directly cover the electrical insulation layer structure 3.

[0143] List of reference numerals in the attached figures 1. Component carrier assembly 2. Component carrier 3 Electrical insulation layer structure 4. Stacked components 5 feedthrough section 6. Electrical conduction path 7 Part 1 7a layer 7b (Layer) section 7c layer 8 Part Two 9 Electrically Conductive Layer Structure 10 Electronic components 11. First surface of electronic component 10 12 Electrically conductive portion of electronic component 10 13 Functional parts of electronic component 10 14. The outer part of the electrical insulation layer structure 3 15 Electrically Conductive Layer 16 Masks 17 Other layers 18 cores 19 Mask 20. Protrusion 21 Layers formed by material deposition 22 Second Surface 23rd floor.

Claims

1. A component carrier assembly (1), the component carrier assembly (1) comprising: - Component carrier (2), and - An electronic component (10), said electronic component (10) being at least partially embedded within the component carrier (2), preferably, said electronic component (10) being completely embedded within the component carrier (2). The component carrier (2) includes a stack (4), which includes at least one electrically conductive layer structure (9) and at least one electrically insulating layer structure (3). In this embodiment, at least one of the electrical insulating layer structures (3) covers at least the first surface (11) of the electronic component (10). The electronic component (10) includes at least one electrically conductive portion (12) on its first surface (11) for establishing an electrical connection with a functional portion (13) of the electronic component (10). Preferably, the electronic component (10) includes multiple electrically conductive portions (12) on its first surface (11) for establishing an electrical connection with a functional portion (13) of the electronic component (10). In the electrically insulating layer structure (3), at least one feedthrough (5) is formed, and at least one feedthrough (5) is positioned to match at least one electrically conductive portion (12) of the electronic component (10). The electrical conduction path (6) extends from at least one of the electrical conduction portions (12) of the electronic component (10) through the feedthrough portion (5), wherein the electrical conduction path (6) includes: - First part (7), preferably, the first part (7) is formed as a layer, the first part (7) covers at least a portion of the electrically conductive portion (12) of the electronic component (10), the first part (7) also covers at least a portion of the stack (4), preferably, the first part (7) also covers at least a portion of the electrically insulating layer structure (3), and - The second part (8), preferably, is formed as a layer, covering the first part (7), and is separated from the electrically conductive portion (12) of the electronic component (10) by the first part (7). The first part (7) is formed of a first material, the second part (8) is formed of a second material, and the electrically conductive part (12) of the electronic component (10) is formed of a third material, wherein the first material is different from the third material, wherein preferably, the first material is different from the second material and different from the third material, wherein preferably, the second material and the third material are different from each other.

2. The component carrier according to claim 1, wherein, At least one of the feedthrough portions (5) and the electrical conduction path (6) extends to the outer side of the component carrier (2) and / or to the electrical conduction layer structure (9).

3. The component carrier according to any one of the preceding claims, wherein, The first portion (7) extends at least partially through the feedthrough (5), preferably, the first portion (7) extends completely through the feedthrough (5), preferably, the first portion (7) extends through the feedthrough (5) to the outer side of the component carrier (2) and / or to one of the main surfaces of the layer structure (3, 9) of the stack (4) constituting the component carrier (2), wherein preferably, the first portion (7) forms a partial or complete lining of the inner wall of the feedthrough (5). And / or wherein the second part (7) extends through the feed passage (5), preferably the second part (7) extends through the feed passage (5) to the outer side of the component carrier (2) and / or to one of the main surfaces of the layer structure (3, 9) of the stack (4) constituting the component carrier (2).

4. The component carrier according to any one of the preceding claims, wherein, The first part (7) covers at least the outer surface of the electrical insulation layer structure (3) in the region of the feedthrough part (5).

5. The component carrier according to any one of the preceding claims, wherein, The first material is at least one element selected from Groups 3 to 7 of the periodic table, or the first material includes at least one element selected from Groups 3 to 7 of the periodic table, wherein preferably, the first material is titanium and / or chromium and / or tungsten, or the first material includes titanium and / or chromium and / or tungsten.

6. The component carrier according to any one of the preceding claims, wherein, The second material is at least one element selected from Groups 3 to 12 of the periodic table, or the second material includes at least one element selected from Groups 3 to 12 of the periodic table, wherein preferably, the second material is copper, or the second material includes copper.

7. The component carrier according to any one of the preceding claims, wherein, The third material is different from copper and / or does not contain copper, and / or wherein the third material is an element selected from or includes an element selected from the following elements: Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Al, Ga, In, Tl, Sn, Pb, or wherein the third material is carbon or an electrically conductive polymer, for example, the carbon is graphene, for example, the electrically conductive polymer is PEDOT, wherein preferably, the third material is aluminum, or the third material includes aluminum.

8. The component carrier according to any one of the preceding claims, wherein, The surface of the first portion (7) facing the electrically conductive portion (12) of the electronic component (10) defines a protective surface interface, which is free of carbon and / or oxygen and / or oxides based at least on the atoms of the third material, preferably free of any oxides.

9. The component carrier according to any one of the preceding claims, wherein, At least one of the electrically conductive portions (12) of the electronic component (10) is a component pad, or at least one of the electrically conductive portions (12) of the electronic component (10) is a layer that prevents the component pad from being exposed.

10. The component carrier according to any one of the preceding claims, wherein, The contact area between the electrically conductive portion (12) and the first portion (7) corresponds to at least 60% of the total surface area of ​​the electrically conductive portion (12), preferably, the contact area between the electrically conductive portion (12) and the first portion (7) corresponds to at least 80% of the total surface area of ​​the electrically conductive portion (12).

11. The component carrier according to any one of the preceding claims, wherein, The contact area between the electrically conductive portion (12) and the first portion (7) corresponds to the cross-sectional area of ​​the feedthrough portion (5), wherein preferably, the cross-sectional area of ​​the feedthrough portion (5) is smaller than the total surface area of ​​the electrically conductive portion (12).

12. The component carrier according to any one of the preceding claims, wherein, The first part (7) includes at least two layer portions (7a, 7c) extending on at least two different levels, wherein the at least two different levels are separated from each other by at least one electrically insulating layer of the electrically insulating layer structure (3). Preferably, at least two layer portions (7a, 7c) extending on at least two different levels are interconnected by at least one portion (7b), which extends transversely to the plane of the at least two levels, or preferably, the at least one portion (7b) extends perpendicularly to the plane of the at least two levels.

13. The component carrier according to any one of the preceding claims, wherein, An electrically conductive layer (15) of the electrically conductive layer structure is provided on an outer portion (14) of at least one of the electrically insulating layer structures (3), wherein the first portion (7) at least partially covers and / or is attached to the external electrically conductive layer (15).

14. The component carrier according to any one of the preceding claims, wherein, At least two adjacent feed passages (5) of the plurality of feed passages (5) are separated by a multilayer wall, the multilayer wall including at least an insulating layer and the electrically conductive portion (15).

15. The component carrier according to any one of the preceding claims, wherein, The feedthrough opening in at least one of the electrically insulating layer structures and the feedthrough opening in at least one of the electrically conductive layers (15) provided on the outer side (14) of at least one of the electrically insulating layer structures (3) have a planar extension that defines the undercut portion below the electrically conductive layer (15).

16. The component carrier according to any one of the preceding claims, wherein, The first part (7) layer (7a) does not form a continuous structure with the other layer (17) and / or is separated from each other and / or is not bonded to each other. The first part (7) layer (7a) covers the electrically conductive portion (12) of the electronic component (10). Preferably, the first part (7) layer (7a) is attached to the electrically conductive portion (12) of the electronic component (10). The other layer (17) covers and / or is attached to the electrically conductive layer (15) and is formed of the same material as the first part (7).

17. The component carrier according to any one of the preceding claims, wherein, The electronic component (10) includes a plurality of electrically conductive portions (12) at a first surface (11) for establishing an electrical connection with the functional portion (13) of the electronic component (10), wherein a plurality of feedthroughs (5) are formed in the electrically insulating layer structure (3), the feedthroughs (5) being positionally matched with the plurality of electrically conductive portions (12) of the electronic component (10), wherein an electrical conduction path (6) extends from each of the electrically conductive portions (12) of the electronic component (10) through a corresponding feedthrough (5) of the plurality of feedthroughs (5), wherein each of the electrical conduction paths (6) includes: - First part (7), preferably, the first part (7) is formed as a layer, the first part (7) covers at least a portion of the electrically conductive portion (12) of the electronic component (10), the first part (7) also covers at least a portion of the stack (4), preferably, the first part (7) also covers at least a portion of the electrically insulating layer structure (3), and - Second part (8), preferably, the second part (8) is formed as a layer, the second part (8) covers the first part (7), and the second part (8) is separated from the electrically conductive part (12) of the electronic component (10) through the first part (7).

18. The component carrier according to any one of the preceding claims, wherein, The first part (7) covers the electrically conductive part (12) of the electronic component (10) and at least covers the wall portion of the feedthrough part (5) facing the component (10).

19. A method for manufacturing a component carrier assembly (1), the component carrier assembly (1) comprising a component carrier (2) and an electronic component (10), wherein, The component carrier (2) includes a stack (4), the stack (4) including at least one electrically conductive layer structure and at least one electrically insulating layer structure (3), wherein the electronic component (10) includes at least one electrically conductive portion (12) at a first surface (11) for establishing an electrical connection with a functional portion (13) of the electronic component (10), the method including the following steps: (a) The electronic component (10) is at least partially embedded in the component carrier (2), preferably, the electronic component (10) is completely embedded in the component carrier (2), such that at least one of the electrical insulating layer structures (3) covers at least the first surface (11) of the electronic component (10), and at least one feedthrough (5) is formed in the electrical insulating layer structure (3), the at least one feedthrough (5) being positionally matched with at least one of the electrically conductive portions (12) of the electronic component (10). (b) Forming an electrical conduction path (6) extending from at least one of the electrical conduction portions (12) of the electronic component (10) through the feedthrough (5), wherein step (b) includes the following sub-steps: (b1) A first portion (7) forming the electrical conduction path (6), preferably, the first portion (7) is formed as a layer, the first portion (7) covering at least a portion of the electrical conduction portion (12) of the electronic component (10), the first portion (7) also covering at least a portion of the stack (4), preferably, the first portion (7) also covering at least a portion of the electrical insulation layer structure (3), and (b2) A second portion (8) is formed of the electrical conduction path (6). Preferably, the second portion (8) is formed as a layer, covering the first portion (7), and the second portion (8) is separated from the electrical conduction portion (12) of the electronic component (10) through the first portion (7). The first part (7) is formed of a first material, the second part (8) is formed of a second material, and the electrically conductive part (12) of the electronic component (10) is formed of a third material. The first material is different from the third material. Preferably, the first material is different from both the second and third materials. Preferably, the second material and the third material are different from each other. Preferably, the method is a method for manufacturing a component carrier assembly (1) according to any one of claims 1 to 12.

20. The method according to claim 19, wherein, At least one feedthrough (5) in the electrically insulating layer structure (3) is formed by material removal, preferably by laser drilling. Preferably, at least one feedthrough (5) in the electrically insulating layer structure (3) is formed by material removal after the first surface (11) of the electronic component (10) is covered by at least one electrically insulating layer structure (3). Preferably, at least one feedthrough (5) in the electrically insulating layer structure (3) is formed by laser drilling after the first surface (11) of the electronic component (10) is covered by at least one electrically insulating layer structure (3).

21. The method according to any one of claims 19 or 20, wherein, The sub-step (b1) is performed by material deposition, preferably by sputtering, and / or the sub-step (b2) is performed by material deposition, preferably by sputtering.

22. The method according to any one of claims 19 to 21, wherein, An electrically conductive layer (15) is provided on the outer side of the electrically insulating layer structure (3), wherein preferably, the electrically conductive layer (15) is formed of the second material. Preferably, the method includes the following steps before step (b): The electrically conductive layer (15) is partially covered by a mask (16), such that the feedthrough portion (5) and the area adjacent to the feedthrough portion (5) are covered by the mask. Preferably, the electrically conductive layer (15) is partially covered by a peel-off mask, such that the feedthrough portion (5) and the area adjacent to the feedthrough portion (5) are covered by the mask. The electrically conductive layer (15) in the area not covered by the mask (16) is removed, preferably by etching. Remove the mask (16) so that at least one of the electrically conductive portions (12) of the electronic component (10) can be accessed through the feedthrough (5).

23. The method according to any one of claims 19 to 22, wherein, The method includes the following steps prior to step (b): - By partially covering the external electrically conductive portion (15) with a mask, the feedthrough portion (5) and the area adjacent to the feedthrough portion (5) are covered by the mask. Preferably, the external electrically conductive portion (15) is partially covered by a peelable mask (16), so that the feedthrough portion (5) and the area adjacent to the feedthrough portion (5) are covered by the mask. - Remove the external electrically conductive portion (15) in the area not covered by the mask, preferably by etching. - Remove the mask (16) so that at least one of the electrically conductive portions (12) of the electronic component (10) can be accessed through the feedthrough (5).

24. The method according to any one of claims 19 to 23, wherein, In the sub-step (b1), the remaining external electrically conductive portion (15) is covered by the first material of the first portion (11).

25. The method according to any one of claims 19 to 24, wherein, The method includes the following steps: selectively removing electrically conductive material from the outer side of the electrically insulating layer structure (3) such that adjacent electrically conductive paths (6) extending to the electrically conductive portions (12) of the electronic component (10) are electrically separated from each other; preferably, the electrically conductive material is selectively removed from the outer side of the electrically insulating layer structure (3) by etching such that adjacent electrically conductive paths (6) extending to the electrically conductive portions (12) of the electronic component (10) are electrically separated from each other.

26. The method according to claim 19 or 25, wherein, The method includes a first cleaning step prior to step (b) to cleaning at least one of the electrically conductive portions (12) of the electronic component (10), preferably, the method includes a first cleaning step prior to step (b) and after step (a) to cleaning at least one of the electrically conductive portions (12) of the electronic component (10). Preferably, the first cleaning step is configured to remove carbon material and / or carbon residue from at least one of the electrically conductive portions (12), and preferably, the first cleaning step includes plasma treatment, preferably, the first cleaning step includes oxygen-containing plasma treatment. And / or among them, The method includes a second cleaning step prior to step (b) to cleaning at least one of the electrically conductive portions (12) of the electronic component (10). Preferably, the method includes a second cleaning step prior to step (b) and after step (a) to cleaning at least one of the electrically conductive portions (12) of the electronic component (10). Preferably, the method includes a second cleaning step prior to step (b) and after step (a) and after the first cleaning step to cleaning at least one of the electrically conductive portions (12) of the electronic component (10). The second cleaning step is configured to remove oxides from at least one of the electrically conductive portions (12). Preferably, the second cleaning step includes plasma treatment. Preferably, the second cleaning step includes argon plasma treatment.

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