Electronic load-based power device testing apparatus and method of use

The power device testing device based on electronic load solves the problem that existing technologies cannot evaluate the dynamic reliability of GaN devices, and realizes the simulation of real application scenarios and high-precision testing of GaN devices, with good applicability and stability.

CN122131106APending Publication Date: 2026-06-02CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO LTD
Filing Date
2024-12-02
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing power device testing equipment cannot effectively evaluate the dynamic reliability of GaN devices. Traditional testing methods cannot simulate real-world application scenarios and cannot perform unidirectional, bidirectional HTOL/LTOL, and DHTOL/DLTOL tests.

Method used

Design a power device testing device based on an electronic load, including an adjustable temperature test container, a test circuit, and a drive circuit. By controlling the switching unit and the electronic load to form a power loop, it can realize unidirectional and bidirectional HTOL/LTOL and DHTOL/DLTOL testing, simulating the real application scenarios of the device.

Benefits of technology

It realizes the simulation of real application scenarios for GaN devices, and can perform unidirectional and bidirectional HTOL/LTOL tests, which improves the test accuracy and reliability, protects the electronic load, extends the device life, and has clear logic that is easy to implement.

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Abstract

This invention provides a power device testing apparatus and method based on an electronic load. The apparatus includes an adjustable temperature test container, a test circuit, and a drive circuit. The test circuit includes a first power supply and one or at least two test sub-circuits connected in parallel. Each test sub-circuit includes a first switching unit, a second switching unit, and an electronic load. The drive circuit can apply a drive signal to the control terminal of the power device under test (DUT) and, based on the conductivity direction of the DUT in the test sub-circuit, control the connection and disconnection states of the first, second, and third terminals of the first switching unit and the first, second, and third terminals of the second switching unit, so that the first power supply, the first switching unit, the DUT, the second switching unit, and the electronic load form a power loop. This invention can effectively simulate real-world application scenarios of power devices and can realize unidirectional, bidirectional HTOL / LTOL, and DHTOL / DLOTL testing of power devices.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and in particular to a power device testing apparatus and method based on electronic load. Background Technology

[0002] The research and application of GaN (gallium nitride) materials are currently at the forefront and a hot topic in semiconductor research. As a novel semiconductor material for developing microelectronic and optoelectronic devices, GaN is gradually becoming an important component of strategic emerging industries. However, due to the differences in physical properties (such as bandgap and electron mobility) between GaN and Si (silicon), traditional testing and reliability testing of Si-based devices cannot fully characterize and screen GaN devices. Therefore, dynamic reliability testing is necessary for GaN devices.

[0003] Currently, reliability testing of power devices (such as Si-based devices) often involves HTOL (High Temperature Operating Life Test) and LTOL (Low Temperature Operating Life Test). These tests are conducted under simulated high / low temperature operating environments, typically applying the maximum operating voltage or slightly higher to the power device under test to assess its durability under high / low temperature and overvoltage conditions. However, existing HTOL / LTOL tests primarily target the characteristics of logic and memory chips themselves and do not address the operating state of the power device under test. As mentioned earlier, some failures in GaN devices require dynamic testing to characterize; therefore, existing power device testing equipment is not suitable for GaN devices.

[0004] It should be noted that the information disclosed in the background section of this invention is intended only to enhance the understanding of the general background of this invention, and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a power device testing apparatus and method based on electronic load. This invention can well simulate the real application scenarios of power devices and can realize the testing of parasitic components, test boards and the characteristics of the power device under test (such as GaN devices). Furthermore, it can also realize unidirectional and bidirectional HTOL / LTOL testing of power devices as well as DHTOL (Dynamic High Temperature Operating Life Test) / DLTOL (Dynamic Low Temperature Operating Life Test) testing, so as to comprehensively and realistically evaluate the switching behavior and stability of the power device under test.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a power device testing device based on an electronic load, comprising: an adjustable temperature testing container for accommodating the power device under test, a testing circuit, and a driving circuit; the testing circuit includes a first power supply and one or at least two test sub-circuits connected in parallel; the test sub-circuit includes a first switching unit, a second switching unit, and an electronic load, wherein a first terminal of the first switching unit and a first terminal of the second switching unit are coupled to the positive terminal of the first power supply, a second terminal of the first switching unit and a second terminal of the second switching unit are coupled to the first terminal of the electronic load, the second terminal of the electronic load is coupled to the negative terminal of the first power supply, a third terminal of the first switching unit is used to couple to the first terminal of the power device under test, and a third terminal of the second switching unit is used to couple to the second terminal of the power device under test;

[0007] The driving circuit is configured to apply a driving signal to the control terminal of the power device under test and, based on the conductivity direction of the power device under test in the test sub-circuit, control the connection and disconnection states of the first, second, and third terminals of the first switching unit and the first, second, and third terminals of the second switching unit, so that the first power supply, the first switching unit, the power device under test, the second switching unit, and the electronic load form a power loop.

[0008] Optionally, the first switching unit includes a first switch, a second switch, and a third switch; the second switching unit includes a fourth switch, a fifth switch, and a sixth switch; the first terminal of the first switch and the first terminal of the fourth switch are coupled to the positive terminal of the first power supply; the second terminal of the first switch, the first terminal of the second switch, and the first terminal of the third switch are coupled to a first node; the first node is used to connect to the first terminal of the power device under test; the second terminal of the second switch and the first terminal of the fifth switch are coupled to the first terminal of the electronic load; the second terminal of the fourth switch, the second terminal of the fifth switch, and the first terminal of the sixth switch are coupled to a second node; the second node is used to connect to the second terminal of the power device under test; and the second terminal of the third switch and the second terminal of the sixth switch are coupled to a first reference ground.

[0009] The control terminals of the first switch, the second switch, the third switch, the fourth switch, the fifth switch, and the sixth switch are coupled to the drive circuit.

[0010] Optionally, the driving circuit is configured to control the connection and disconnection states of the first, second, and third terminals of the first switching unit and the first, second, and third terminals of the second switching unit according to the conductivity direction of the power device under test in the test sub-circuit, so that the first power supply, the first switching unit, the power device under test, the second switching unit, and the electronic load form a power loop, including:

[0011] The driving circuit is configured to, when the first terminal of the power device under test is the drain and the second terminal is the source, control the third switch to be open and the sixth switch to be open, and control the first switch and the fifth switch to be open and the second switch and the fourth switch to be open; when the first terminal of the power device under test is the source and the second terminal is the drain, control the third switch to be open and the sixth switch to be open, and control the second switch and the fourth switch to be open and the first switch and the fifth switch to be open.

[0012] Optionally, the first switch, the second switch, the fourth switch, and the fifth switch include power relays or power switches; the third switch and the sixth switch include optocoupler relays.

[0013] Optionally, the driving signal applied by the driving circuit to the control terminal of the power device under test includes a pulse width modulation signal;

[0014] The power of the first power supply is greater than or equal to the number of test sub-circuits, the product of the preset test voltage value and the preset current value.

[0015] Optionally, the driving circuit includes a main control unit, a driving unit, and a power supply unit for supplying power to the main control unit and the driving unit. The first terminal of the main control unit is coupled to the first terminal of the driving unit, and the main control unit is also coupled to the first switching unit and the second switching unit respectively.

[0016] The second end of the driving unit is coupled to the control end of the power device under test;

[0017] The main control unit is configured to send an initial drive signal to the drive unit, and to control the connection and disconnection states of the first, second and third terminals of the first switch unit and the first, second and third terminals of the second switch unit according to the conductivity direction of the power device under test in the test sub-circuit.

[0018] The driving unit is configured to amplify the initial driving signal to obtain the driving signal, and send the driving signal to the power device under test.

[0019] Optionally, the power supply unit includes a second power supply, a first isolation power supply, and a second isolation power supply. The first end of the second power supply is coupled to the first end of the first isolation power supply via a wire, and the second end of the first isolation power supply is coupled to the second end of the main control unit. The second end of the second power supply is electromagnetically coupled to the first end of the second isolation power supply, and the second end of the second isolation power supply is coupled to the third end of the drive unit.

[0020] Optionally, the main control unit is further coupled to the first switching unit and the second switching unit, respectively, including:

[0021] The third, fourth, and fifth terminals of the main control unit are respectively coupled to the first, second, and third switches of the first switch unit, and the sixth, seventh, and eighth terminals of the main control unit are respectively coupled to the fourth, fifth, and sixth switches of the second switch unit.

[0022] When the first terminal of the power device under test is the drain and the second terminal is the source, the main control unit is configured to control the third switch to be open and the sixth switch to be closed, and to control the first switch and the fifth switch to be closed and the second switch and the fourth switch to be open.

[0023] When the first terminal of the power device under test is the source and the second terminal is the drain, the main control unit is configured to control the third switch to be turned on and the sixth switch to be turned off, and to control the second switch and the fourth switch to be turned on and the first switch and the fifth switch to be turned off.

[0024] Optionally, the power device under test includes a GaN device.

[0025] To achieve the above objectives, the present invention also provides a method of using the power device testing apparatus based on electronic load as described in any of the preceding claims, the method comprising:

[0026] The first terminal of the power device under test is coupled to the third terminal of the first switching unit, the second terminal of the power device under test is coupled to the third terminal of the second switching unit, and the control terminal of the power device under test is coupled to the output terminal of the driving unit.

[0027] Set the temperature of the adjustable temperature test container to the preset test temperature;

[0028] Based on the preset test voltage value and the preset current value, determine the output voltage of the first power supply and / or the load current value of the electronic load;

[0029] The driving circuit is activated according to the conductivity direction of the power device under test in the test sub-circuit and the preset test parameters, so that the power device under test is in a conducting or turning-off state.

[0030] Compared with the prior art, the power device testing device and its usage method based on electronic load provided by the present invention have the following advantages:

[0031] The present invention provides a power device testing apparatus based on an electronic load, comprising an adjustable temperature test container for accommodating the power device under test, a test circuit, and a drive circuit. The adjustable temperature test container enables the temperature of the power device under test located within it to be stabilized at the test temperature (e.g., a set high temperature value or a set low temperature value), thereby enabling not only HTOL / LTOL testing of the power device under test but also effectively simulating the temperature scenario of the power device under test in real-world applications. Furthermore, the test circuit may include at least two test sub-circuits connected in parallel. This configuration allows for parallel testing of multiple groups of power devices under test, and the parallel connection design of each test sub-circuit ensures that each test sub-circuit operates independently without interference. Even if one test sub-circuit fails, it will not affect the other test sub-circuits, thus making the test results more accurate. Further still, each test sub-circuit includes a first switching unit and a second switching unit, thereby controlling the first, second, and third terminals of the first switching unit and the second... The connection and disconnection states of the first, second, and third terminals of the switching unit can realize both unidirectional and bidirectional HTOL / LTOL and DHTOL / DLOTL testing of the power device under test, thus making the power device testing device based on electronic load provided by the present invention highly applicable. Furthermore, each of the test sub-circuits has an independent electronic load, which can precisely control the preset current value required for testing the power device under test, ensuring high testing accuracy. Moreover, in the power circuit, the power device under test is positioned close to the positive terminal of the first power supply while the electronic load is positioned close to the negative terminal of the first power supply, thereby better protecting the electronic load and effectively extending the service life of the power device testing device based on electronic load. In addition, the driving circuit provides a stable driving signal to the power device under test, ensuring the stability and reliability of the power device testing device based on electronic load provided by the present invention. Finally, the power device testing apparatus based on electronic load provided by this invention includes an adjustable temperature test container, a test circuit, and a drive circuit. This modular design also has the advantages of clear logic and ease of implementation. In summary, this invention can effectively simulate real-world application scenarios of power devices, enabling testing of parasitic components, the test board, and the characteristics of the power device under test (e.g., GaN devices). Furthermore, it can also perform unidirectional, bidirectional HTOL / LTOL, and DHTOL / DLOTL tests on power devices to comprehensively and realistically evaluate the switching behavior and stability of the power device under test.

[0032] Since the method of using the power device testing apparatus based on electronic load provided by this invention belongs to the same inventive concept as the power device testing apparatus based on electronic load provided by this invention, the method of using the power device testing apparatus provided by this invention has at least all the advantages of the power device testing apparatus based on electronic load provided by this invention. For details on the beneficial effects of the method of using the power device testing apparatus provided by this invention, please refer to the above description of the beneficial effects of the power device testing apparatus based on electronic load provided by this invention, which will not be repeated here. Attached Figure Description

[0033] Figure 1 A block diagram of the power device testing device based on electronic load provided by the present invention;

[0034] Figure 2 A schematic diagram of the circuit topology of the power device testing device based on electronic load provided in Embodiment 1 of the present invention;

[0035] Figure 3 A schematic diagram of the circuit topology of the driving circuit of the power device testing device based on electronic load provided in Embodiment 1 of the present invention;

[0036] Figure 4 This is a schematic diagram of the circuit topology of the power device testing device based on electronic load provided in Embodiment 2 of the present invention.

[0037] Figure 5 This is a schematic diagram of the circuit topology of the driving circuit of the power device testing device based on electronic load provided in Embodiment 2 of the present invention;

[0038] Figure 6 This is a schematic diagram of the overall process for using the power device testing apparatus based on electronic load, as provided in Embodiment 3 of the present invention.

[0039] The accompanying figure is labeled as follows:

[0040] Adjustable temperature test container -100;

[0041] Test circuit-200, first power supply-210, test sub-circuit-220, first switching unit-221, first switch-K1, second switch-K2, third switch-K3, second switching unit-222, fourth switch-K4, fifth switch-K5, sixth switch-K6, electronic load-230.

[0042] Drive signal - PWM, first reference ground - GND1, second reference ground - GND2, third reference ground - GND3, fourth reference ground - GND4;

[0043] Drive circuit-300, main control unit-MCU, drive unit-310, power supply unit-320; second power supply-321, first isolation power supply-322, second isolation power supply-323;

[0044] Power device under test (DUT); control terminal of DUT - G, first terminal of DUT - D1, second terminal of DUT - D2. Detailed Implementation

[0045] The following detailed description, in conjunction with the accompanying drawings, provides a further detailed account of the power device testing apparatus and its usage method based on electronic load proposed in this invention. The advantages and features of this invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, intended only to facilitate and clearly illustrate the embodiments of this invention. Please refer to the drawings to make the objectives, features, and advantages of this invention more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes and to enable those skilled in the art to understand and read them, and are not intended to limit the implementation conditions of this invention. Any modifications to the structure, changes in proportions, or adjustments to the size, provided they produce the same or similar effects and achieve the same objectives as this invention, should still fall within the scope of the technical content disclosed in this invention. Specific design features of the invention disclosed herein, including, for example, specific dimensions, orientations, positions, and shapes, will be determined in part by the specific application and usage environment. Furthermore, in the embodiments described below, the same reference numerals are sometimes used across different drawings to denote the same parts or parts with the same function, omitting repeated descriptions. In this specification, similar reference numerals and letters are used to denote similar items; therefore, once an item is defined in one figure, it need not be discussed further in subsequent figures. Furthermore, if the methods described herein involve a series of steps, and the order of these steps presented herein is not necessarily the only possible order in which they can be performed, some of the described steps may be omitted and / or other steps not described herein may be added to the method.

[0046] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The singular forms “a,” “an,” and “the” include plural objects. The term “or” is generally used to mean “and / or,” the term “several” is generally used to mean “at least one,” and the term “at least two” is generally used to mean “two or more.” Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0047] Additionally, unless specifically stated or obvious from the context, as used herein, the term “about” is understood to mean within the normal tolerance range in the field, such as within 2 standard deviations of the mean. “About” can be understood as within 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0.5%, 0.1%, 0.05%, or 0.01% of the stated value. Unless otherwise specified from the context, all numerical values ​​provided herein are modified by the term “about”.

[0048] It should be understood that when a component is referred to as "connected," "connected to," or "coupled to" other components, it may be directly connected to other components, or there may be intermediary components. Conversely, when a component is referred to as "directly connected" or "directly connected to" other components, there are no intermediary components.

[0049] The core idea of ​​this invention is to provide a power device testing device and method based on electronic load. This invention can well simulate the real application scenarios of power devices and can realize the testing of parasitic elements, test board and the characteristics of the power device under test (such as GaN device) itself. Furthermore, it can also realize unidirectional, bidirectional HTOL / LTOL testing and DHTOL / DLTOL testing of power devices to comprehensively and realistically evaluate the switching behavior and stability of the power device under test.

[0050] To achieve the above-mentioned goals, this invention provides a power device testing apparatus based on an electronic load. For example, please refer to... Figure 1 , Figure 1 This is a block diagram of the power device testing apparatus based on an electronic load provided by the present invention. Figure 1 As can be seen, the power device testing apparatus based on an electronic load provided by the present invention includes: an adjustable temperature test container 100 for accommodating the power device under test (DUT), a test circuit 200, and a drive circuit 300; the test circuit 200 includes a first power supply 210 and one or at least two test sub-circuits 220 connected in parallel; the test sub-circuit 220 includes a first switching unit 221, a second switching unit 222, and an electronic load 223, wherein the first end of the first switching unit 221 and the first end of the second switching unit 222 are coupled to the first power supply 210. The positive terminal of 0, the second terminal of the first switching unit 221 and the second terminal of the second switching unit 222 are coupled to the first terminal of the electronic load 223, the second terminal of the electronic load 223 is coupled to the negative terminal of the first power supply 210, the third terminal of the first switching unit 221 is used to couple to the first terminal D1 of the power device under test (DUT), the third terminal of the second switching unit 222 is used to couple to the second terminal D2 of the power device under test (DUT), and the fourth terminal of the first switching unit 221 and the fourth terminal of the second switching unit 222 are coupled to the first reference ground GND1. More specifically, the driving circuit 300 is configured to apply a driving signal PWM to the control terminal G of the power device under test (DUT) and control the connection and disconnection states of the first, second, and third terminals of the first switching unit 221 and the first, second, and third terminals of the second switching unit 222 according to the conductivity direction of the DUT in the test sub-circuit 220, so that the first power supply 210, the first switching unit 221, the DUT, the second switching unit 222, and the electronic load 223 form a power loop.

[0051] Therefore, the power device testing apparatus based on electronic load provided by the present invention includes an adjustable temperature test container 100 for accommodating the power device under test (DUT), a test circuit 200, and a drive circuit 300. The adjustable temperature test container 100 can stabilize the temperature of the DUT located within it at the test temperature (for example, by setting a high temperature value or a low temperature value), thereby not only enabling HTOL / LTOL testing of the DUT, but also effectively simulating the temperature scenario of the DUT in real-world applications. Furthermore, the test circuit 200 can include... The test circuit includes at least two parallel-connected test sub-circuits 220. This configuration not only allows for parallel testing of multiple power devices under test (DUTs), but the parallel connection design also ensures that each test sub-circuit 220 operates independently without interfering with the others. Even if one test sub-circuit 220 fails, it will not affect the others, thus making the test results more accurate. Furthermore, each test sub-circuit 220 includes a first switching unit 221 and a second switching unit 222. This allows for control of the first switching unit 221... The connection and disconnection states of the first, second, and third terminals of 1 and the first, second, and third terminals of the second switching unit 222 can realize unidirectional, bidirectional HTOL / LTOL testing and DHTOL / DLOTL testing of the power device under test (which can be a unidirectional or bidirectional device) DUT, thereby making the power device testing device based on electronic load provided by the present invention have good applicability. Furthermore, each of the test sub-circuits 220 has an independent electronic load 223, through which the preset current value required for testing the power device under test DUT can be precisely controlled, which can ensure high test accuracy. Furthermore, in the power circuit, the power device under test DUT is located close to the positive terminal of the first power supply 210 and the electronic load 223 is located close to the negative terminal of the first power supply 210, thereby better protecting the electronic load 223 and effectively improving the service life of the power device testing device based on electronic load. In addition, the driving circuit 300 can provide a stable driving signal PWM to the power device under test DUT, which well ensures the stability and reliability of the power device testing device based on electronic load provided by the present invention. Finally, the power device testing device based on electronic load provided by the present invention includes an adjustable temperature test container 100, a test circuit 200 and a drive circuit 300. This modular design also has the advantages of clear logic and ease of implementation.In summary, this invention can effectively simulate real-world application scenarios of power devices, enabling the testing of parasitic components, test boards, and the characteristics of the power device under test (DUT) itself (such as GaN devices). Furthermore, it can also perform unidirectional, bidirectional HTOL / LTOL, and DHTOL / DLOTL tests on power devices to comprehensively and realistically evaluate the switching behavior and stability of the power device under test (DUT).

[0052] Preferably, in some exemplary embodiments, the test circuit 200 and the drive circuit 300 are located outside the adjustable temperature test container 100. This avoids the high or low temperature environment during testing from affecting the performance stability of the test circuit 200 and the drive circuit 300, or even damaging the test circuit 200 and / or the drive circuit 300, thereby effectively improving the service life of the power device test device based on the electronic load. Furthermore, the adjustable temperature test container 100 includes an insulated box. Thus, the insulated box is not only readily available, but also allows for setting the test temperature (high or low temperature) according to testing needs and maintaining a constant temperature after setting, thereby laying a solid foundation for realizing HTOL and LTOL testing.

[0053] It should be noted that the present invention does not impose excessive limitations on the number of adjustable temperature test containers 100. For example, in some embodiments, the number of adjustable temperature test containers 100 may be the same as the number of test sub-circuits 220, that is, the adjustable temperature test containers 100 and the test sub-circuits 220 correspond one-to-one; in other embodiments, the number of adjustable temperature test containers 100 may be less than the number of test sub-circuits 220. In this scenario, by sharing the same adjustable temperature test container 100 with power devices under test (DUTs) that have the same preset test temperature, the cost of power device testing equipment based on electronic load can be reduced.

[0054] Preferably, in some exemplary embodiments, the power device under test (DUT) comprises a GaN device. Therefore, the electronic load-based power device testing apparatus provided by this invention can effectively perform dynamic testing, unidirectional and bidirectional HTOL / LTOL testing, and DHTOL / DLOTL testing on GaN devices. In particular, it should be noted that, as those skilled in the art will understand, the electronic load-based power device testing apparatus provided by this invention does not impose excessive limitations on the power device under test (DUT). For example, the DUT can be a bidirectional device or a unidirectional device. Furthermore, this invention does not limit the material of the DUT; the power device can also be other devices besides GaN. For example, the DUT can also be, but is not limited to, a SiC device, etc.

[0055] Furthermore, the present invention does not impose excessive limitations on the electronic load 223, as long as it can simulate the characteristics of a real load. For example, the electronic load 223 can be composed of power devices (such as MOSFETs or transistors), and the electronic load 223 includes, but is not limited to, resistive, inductive, and capacitive loads. For more detailed information on the electronic load 223, please refer to related technologies known to those skilled in the art; due to space limitations, this document will not elaborate on it.

[0056] To facilitate understanding and explanation of the present invention, Embodiments 1 and 2 below illustrate the power device testing apparatus based on electronic load provided by the present invention, and Embodiment 3 illustrates the method of using the power device testing apparatus provided by the present invention. Embodiment 1 uses an example where the test circuit 200 of the power device testing apparatus based on electronic load has one test sub-circuit 220, and Embodiment 2 uses an example where the test circuit 200 of the power device testing apparatus based on electronic load has three test sub-circuits 220.

[0057] It should be understood that although this article describes the test circuit 200 of the power device test device based on electronic load with one test sub-circuit 220 and three test sub-circuits 220 as examples, it is obvious that the present invention does not impose too much limitation on the number of the test sub-circuits 220. The number of the test sub-circuits 220 can be reasonably set according to actual needs. For example, the test sub-circuit 220 can be 1, 2, 3, 4 or more.

[0058] Example 1

[0059] This embodiment provides a power device testing apparatus based on an electronic load. For an example, please refer to... Figure 2 , Figure 2 This is a schematic diagram of the circuit topology of the test circuit 200 of the power device test apparatus based on an electronic load provided in this embodiment. From... Figure 2 As can be seen, the test circuit 200 of the power device test apparatus based on electronic load provided in this embodiment includes a test sub-circuit 220. The first switching unit 221 of the test sub-circuit 220 includes a first switch K1, a second switch K2, and a third switch K3; the second switching unit 222 includes a fourth switch K4, a fifth switch K5, and a sixth switch K6; the first terminal of the first switch K1 and the first terminal of the fourth switch K4 are coupled to the positive terminal of the first power supply 210; the second terminal of the first switch K1, the first terminal of the second switch K2, and the first terminal of the third switch K3 are coupled to a first node (…). Figure 2(Not shown in the image, this node is also the third terminal of the first switching unit 221), the second node is used to connect to the first terminal D1 of the power device under test (DUT); the second terminal of the second switch K2 and the first terminal of the fifth switch K5 are coupled to the first terminal of the electronic load 223, and the second terminal of the fourth switch K4, the second terminal of the fifth switch K5, and the first terminal of the sixth switch K6 are coupled to the second node ( Figure 2 (Not shown in the diagram, this node is also the third terminal of the second switching unit 222). The second node is used to connect to the second terminal D2 of the power device under test (DUT). The second terminals of the third switch K3 and the sixth switch K6 are coupled to the first reference ground GND1. The control terminals of the first switch K1, the second switch K2, the third switch K3, the fourth switch K4, the fifth switch K5, and the sixth switch K6 are coupled to the drive circuit 300.

[0060] Therefore, the power device testing device based on electronic load provided by the present invention, with the first switching unit 221 including a first switch K1, a second switch K2, and a third switch K3, and the second switching unit 222 including a fourth switch K4, a fifth switch K5, and a sixth switch K6, has a clear logic and is easy to implement. Furthermore, the control terminals of the first switch K1, the second switch K2, the third switch K3, the fourth switch K4, the fifth switch K5, and the sixth switch K6 are coupled to the drive circuit 300, laying a good foundation for the automatic control of the power device testing device based on electronic load, thereby effectively improving the testing efficiency of the power device testing device based on electronic load provided by the present invention.

[0061] It should be understood that the first switch unit 221, comprising a first switch K1, a second switch K2, and a third switch K3, and the second switch unit 222, comprising a fourth switch K4, a fifth switch K5, and a sixth switch K6, are merely illustrative examples of preferred embodiments and not limitations of the present invention. The present invention does not impose excessive limitations on the specific implementation of the first switch unit 221 and the second switch unit 222. Taking the first switch K1 and the second switch K2 in the first switch unit 221 as examples, in some exemplary embodiments, the first switch K1 and the second switch K2 may also be, but are not limited to, integrated into a single-pole double-throw switch, etc.

[0062] Correspondingly, the driving circuit 300 is configured to control the connection and disconnection states of the first, second, and third terminals of the first switching unit 221 and the first, second, and third terminals of the second switching unit 222 according to the conductivity direction of the power device under test (DUT) in the test sub-circuit 220, so that the first power supply 210, the first switching unit 221, the power device under test (DUT), the second switching unit 222, and the electronic load 223 form a power loop, including:

[0063] The driving circuit 300 is configured to, when the first terminal D1 of the power device under test (DUT) is the drain and the second terminal D2 is the source, control the third switch K3 to be open and the sixth switch K6 to be open, and control the first switch K1 and the fifth switch K5 to be open and the second switch K2 and the fourth switch K4 to be open; when the first terminal D1 of the power device under test (DUT) is the source and the second terminal D2 is the drain, control the third switch K3 to be open and the sixth switch K6 to be open, and control the second switch K2 and the fourth switch K4 to be open and the first switch K1 and the fifth switch K5 to be open.

[0064] Therefore, the power device testing device based on electronic load provided by the present invention controls the on and off states of the first switch K1, the second switch K2, the third switch K3, the fourth switch K4, the fifth switch K5 and the sixth switch K6 through the driving circuit 300. This not only enables unidirectional and bidirectional HTOL / LTOL testing and DHTOL / DLOTL testing of the power device under test (DUT), but also has a simple circuit structure and is easy to implement.

[0065] For example, please combine Figure 2When the first terminal D1 of the power device under test (DUT) is the drain and the second terminal D2 is the source: the driving circuit 300 drives the third switch K3 to turn off and the sixth switch K6 to turn on. The driving circuit consists of the driving signal PWM, the gate (i.e., control terminal G) of the power device under test (DUT), the source (i.e., the second terminal D2) of the power device under test (DUT), the sixth switch K6, and the first reference ground GND1; the driving circuit 300 drives the first switch K1 and the fifth switch K5 to turn on and the second switch K2 and the fourth switch K4 to turn off. The power circuit consists of the first power supply 210 (i.e., the positive terminal of the first power supply 210), the first switch K1, the drain (i.e., the first terminal D1) of the power device under test (DUT), the source (i.e., the second terminal D2) of the power device under test (DUT), the fifth switch K5, the electronic load 223, and the first power supply 210 (i.e., the negative terminal of the first power supply 210). Similarly, when the first terminal D1 of the power device under test (DUT) is the source and the second terminal is the drain D2: the driving circuit 300 drives the third switch K3 to turn on and the sixth switch K6 to turn off. The driving circuit consists of the driving signal PWM, the gate (i.e., control terminal G) of the power device under test (DUT), the source (i.e., the first terminal D1) of the power device under test (DUT), the third switch K3, and the first reference ground GND1; the driving circuit 300 drives the second switch K2 and the fourth switch K4 to turn on and the first switch K1 and the fifth switch K5 to turn off. The power circuit consists of the first power supply 210 (i.e., the positive terminal of the first power supply 210), the fourth switch K4, the drain (i.e., the second terminal D2) of the power device under test (DUT), the source (i.e., the first terminal) of the power device, the second switch K2, the electronic load 223, and the first power supply 210 (i.e., the negative terminal of the first power supply 210).

[0066] Preferably, in some exemplary embodiments, the first switch K1, the second switch K2, the fourth switch K4, and the fifth switch K5 comprise power relays or power switches; the third switch K3 and the sixth switch K6 comprise optocoupler relays. Thus, the present invention employs optocoupler relays as the third switch K3 and the sixth switch K6 for the drive circuit 300, fully utilizing the advantages of fast response time, low power consumption, miniaturized design, and high reliability of optocoupler relays. This results in the electronic load-based power device testing device provided by the present invention having good reliability and low power consumption. Using power relays or power switches as the first switch K1, the second switch K2, the fourth switch K4, and the fifth switch K5 for the power circuit leverages the advantages of power relays or power switches in carrying high current, high voltage, and high power, thereby better protecting the power device under test (DUT). Furthermore, the long service life and low failure rate of power relays or power switches are typically utilized, thereby extending the service life of the electronic load-based power device testing device.

[0067] It should be understood that the first switch K1, the second switch K2, the fourth switch K4, and the fifth switch K5 in this article include power relays or power switches, and the third switch K3 and the sixth switch K6 include optocoupler relays. These are merely illustrative examples of preferred embodiments and not limitations of the present invention. The present invention does not impose excessive limitations on the specific implementation of the first switch K1, the second switch K2, the third switch K3, the fourth switch K4, the fifth switch K5, and the sixth switch K6.

[0068] Preferably, in some exemplary embodiments, the drive signal PWM applied by the drive circuit 300 to the control terminal G of the power device under test (DUT) includes a pulse width modulation (PWM) signal. Therefore, by using a pulse width modulation signal for the drive signal PWM, the dynamic characteristics of the DUT can be better tested, thereby providing a more comprehensive and realistic evaluation of the switching behavior and stability of the DUT. Obviously, the use of a pulse width modulation signal for the drive signal PWM is merely an illustrative example of a preferred embodiment and not a limitation of the invention; it can be reasonably selected according to actual needs.

[0069] Preferably, in some exemplary embodiments, the power of the first power supply 210 is greater than or equal to the product of the number of test sub-circuits 220 and the preset test voltage and current values. Therefore, the power device testing apparatus based on electronic load provided by the present invention uses a first power supply 210 with sufficient driving capability, which not only ensures that the power device under test (DUT) can be driven, but also has wider applicability.

[0070] It should be understood that the present invention does not impose excessive limitations on the number of the test sub-circuits 220, the specific values ​​of the preset test voltage and the preset current. When implementing the present invention, these values ​​should be selected reasonably according to actual needs. For example, taking the preset test voltage as an example, the preset test voltage can be the maximum operating voltage of the power device under test (DUT), or it can be slightly higher than the maximum operating voltage of the DUT, in order to evaluate the durability of the DUT under high / low temperature and overvoltage conditions.

[0071] In some exemplary embodiments, please refer to Figure 3 , Figure 3 This is a schematic diagram of the circuit topology of the drive circuit for the power device testing device based on an electronic load provided in this embodiment. From... Figure 3 As can be seen, the driving circuit 300 includes a main control unit MCU, a driving unit 310, and a power supply unit 320 that supplies power to the main control unit MCU and the driving unit 310. The first terminal of the main control unit MCU is coupled to the first terminal of the driving unit 310. The main control unit MCU is also coupled to the first switching unit 221 and the second switching unit 222 respectively. More specifically, the second terminal of the driving unit 310 is coupled to the control terminal G of the power device under test (DUT), and the third terminal of the driving unit 310 is coupled to the second reference ground GND2; the main control unit (MCU) is configured to send an initial driving signal PWM to the driving unit 310, and to control the connection and disconnection states of the first, second, and third terminals of the first switching unit 221 and the first, second, and third terminals of the second switching unit 222 according to the conductivity direction of the power device under test (DUT) in the test sub-circuit 220; the driving unit 310 is configured to amplify the initial driving signal PWM to obtain the driving signal PWM, and send the driving signal PWM to the power device under test (DUT).

[0072] The power device testing device based on electronic load provided by this invention includes a driving circuit 300 comprising a main control unit (MCU). The MCU provides control signals to drive the test circuit 200 for automated testing. Furthermore, the driving circuit 300 includes a driving unit 310, capable of amplifying and enhancing the initial driving signal PWM to obtain the final driving signal PWM, thereby better driving the power device under test (DUT) and effectively improving the stability and reliability of the power device testing device based on electronic load provided by this invention. Moreover, the driving circuit 300 also includes an independent power supply unit 320. This independent power supply design between the driving circuit 300 and the test circuit 200 better avoids mutual interference between them, significantly improving the safety and reliability of the power device testing device based on electronic load provided by this invention.

[0073] Please continue reading Figure 3 ,like Figure 3 As shown, the power supply unit 320 includes a second power supply 321, a first isolation power supply 322, and a second isolation power supply 323. The first end of the second power supply 321 is coupled to the first end of the first isolation power supply 322 via a wire, and the second end of the first isolation power supply 322 is coupled to the second end of the main control unit MCU. The second end of the second power supply 321 is electromagnetically coupled to the first end of the second isolation power supply 323, and the second end of the second isolation power supply 323 is coupled to the third end of the drive unit 310. The third ends of the second power supply 321, the first isolation power supply 322, and the second isolation power supply 323 are coupled to a third reference ground GND3, and the fourth end of the second isolation power supply 323 is coupled to a fourth reference ground GND4.

[0074] The power device testing device based on electronic load provided by this invention has a main control unit (MCU) coupled to a second power supply (321) via a first isolation power supply (322), and a drive unit (310) coupled to the second power supply (321) via a second isolation power supply (323). Thus, the first isolation power supply (322) and the second isolation power supply (323) can not only convert the voltage provided by the second power supply (321), but also ensure that the power supply to the main control unit (MCU) and the drive unit (310) is independent, thereby improving the safety and reliability of the power device testing device based on electronic load provided by this invention. Furthermore, the second power supply (321) is coupled to the second isolation power supply (323) via electromagnetic coupling, which better protects the second power supply (321) and, consequently, the main control unit (MCU), effectively extending the service life of the power device testing device based on electronic load provided by this invention.

[0075] It should be understood that the present invention does not impose too many limitations on the voltage values ​​of the second power supply 321, the first isolation power supply 322, and the second isolation power supply 323. For example, the second power supply 321 can be a 12V power supply, the output voltage of the first isolation power supply 322 can be 5V, and the output voltage of the second isolation power supply 323 can be 5-6V.

[0076] For ease of understanding and explanation, Figure 3 In this context, EN1, EN2, EN3, EN4, EN5, and EN6 represent the control signals output from the third, fourth, fifth, sixth, seventh, and eighth terminals of the main control unit (MCU), respectively. Based on this, from... Figure 3 As can be seen, in some exemplary embodiments, the main control unit MCU is also coupled to the first switch unit 221 and the second switch unit 222 respectively, including: the third, fourth and fifth terminals of the main control unit MCU are respectively coupled to the first switch K1, the second switch K2 and the third switch K3 of the first switch unit 221, and the sixth, seventh and eighth terminals of the main control unit MCU are respectively coupled to the fourth switch K4, the fifth switch K5 and the sixth switch K6 of the second switch unit 222. Correspondingly, when the first terminal D1 of the power device under test (DUT) is the drain and the second terminal D2 is the source, the main control unit (MCU) is configured to control the third switch K3 to be open and the sixth switch K6 to be open, and to control the first switch K1 and the fifth switch K5 to be open and the second switch K2 and the fourth switch K4 to be open; when the first terminal D1 of the power device under test (DUT) is the source and the second terminal D2 is the drain, the main control unit (MCU) is configured to control the third switch K3 to be open and the sixth switch K6 to be open, and to control the second switch K2 and the fourth switch K4 to be open and the first switch K1 and the fifth switch K5 to be open.

[0077] It should be understood that this invention does not impose excessive limitations on the specific implementation of the main control unit (MCU). For example, the main control unit (MCU) can be a microcontroller unit, or it can be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0078] Example 2

[0079] This embodiment provides another power device testing apparatus based on an electronic load. For example, please refer to [link to relevant documentation]. Figure 4 and Figure 5 ,in, Figure 4 A schematic diagram of the circuit topology of the power device testing device based on electronic load provided in this embodiment; Figure 5 This is a simplified diagram of the circuit topology of the drive circuit for the power device testing device based on an electronic load provided in this embodiment. Compared with Embodiment 1, it is assumed that the first terminal D1 of each of the power devices under test (DUT1, DUT2, and DUT3) is the drain and the second terminal D2 is the source. Figure 4 and Figure 5 As can be seen, the power device testing device based on electronic load provided in this embodiment differs from that in Embodiment 1 in that the test circuit of the power device testing device based on electronic load provided in this embodiment includes three sets of test sub-circuits connected in parallel. To avoid redundancy, the following only describes the differences from Embodiment 1. For parts not mentioned in this embodiment, please refer to the relevant description in Embodiment 1 for an adaptive understanding.

[0080] from Figure 4 and Figure 5 As can be seen, these three test sub-circuits are connected in parallel, and each test sub-circuit has its own independent electronic load. This not only allows for parallel testing of multiple sets of power devices under test, thus improving testing efficiency, but also ensures that each test sub-circuit operates independently without interfering with the others. Even if one test sub-circuit fails, it will not affect the others, resulting in more accurate test results.

[0081] Specifically, Figure 5In this context, EN11, EN21, and EN31 represent the control signals output from the third terminal of the main control unit to the first switches K11, K21, and K31, respectively; EN14, EN24, and EN34 represent the control signals output from the sixth terminal of the main control unit MCU to the fourth switches K14, K24, and K34, respectively; and EN16, EN26, and EN36 represent the control signals output from the eighth terminal of the main control unit to the sixth switches K16, K26, and K36, respectively. Based on this, taking the first terminal D1 of the power devices under test (DUT1, DUT2, and DUT3) as the drain, the second terminal D1... Taking D2 as the source and testing these three sets of power devices under test simultaneously as an example, the main control unit MCU drives the first switch K11, K21, K31, the fourth switch K14, K24 and K34 and the sixth switch K16, K26 and K36 to close, and applies drive signals PWM1, PWM2 and PWM13 to each power device under test DUT1, DUT2 and DUT3 respectively, which can realize unidirectional, bidirectional HTOL / LTOL test and DHTOL / DLTOL test of the three sets of power devices under test DUT1, DUT2 and DUT3.

[0082] It should be noted that for a power device testing device based on an electronic load with multiple test sub-circuits, all the power devices under test can be tested simultaneously, or only some of the power devices under test can be tested. This invention does not impose too many limitations on this.

[0083] Example 3

[0084] This embodiment provides a method of using a power device testing apparatus based on an electronic load as described herein. For example, please refer to... Figure 6 , Figure 6 This is a schematic diagram illustrating the overall flow of the method for using the power device testing apparatus provided in this embodiment. From... Figure 6 As can be seen, the method of use includes:

[0085] S100: The first terminal D1 of the power device under test (DUT) is coupled to the third terminal of the first switching unit 221, the second terminal D2 of the power device under test (DUT) is coupled to the third terminal of the second switching unit 222, and the control terminal G of the power device under test (DUT) is coupled to the output terminal of the driving unit 310.

[0086] S200: Set the temperature of the adjustable temperature test container 100 to a preset test temperature;

[0087] S300: Determine the output voltage of the first power supply 210 and / or the load current value of the electronic load 223 based on the preset test voltage value and the preset current value;

[0088] S400: The drive circuit 300 is activated according to the conduction direction of the power device under test (DUT) in the test sub-circuit 220 and the preset test parameters, so that the power device under test (DUT) is in a conducting or turning-off state.

[0089] Since the method of using the power device testing apparatus based on electronic load provided by this invention belongs to the same inventive concept as the power device testing apparatus based on electronic load provided by this invention, the method of using the power device testing apparatus provided by this invention has at least all the advantages of the power device testing apparatus based on electronic load provided by this invention. For details on the beneficial effects of the method of using the power device testing apparatus provided by this invention, please refer to the above description of the beneficial effects of the power device testing apparatus based on electronic load provided by this invention, which will not be repeated here.

[0090] It should be noted that the present invention does not limit the execution steps of S200 and S300. For example, in some embodiments, step S200 can be executed first and then step S300; in other embodiments, step S300 can be executed first and then step S200. Furthermore, the present invention does not impose excessive limitations on the preset test parameters. For example, the preset test parameters include, but are not limited to, the Ton (output period) and Toff (stop output period) of the drive signal PWM, and the polarity (source or drain) connection method of the first terminal D1 and the second terminal D2 of the power device under test (DUT).

[0091] For example, the main control unit MCU can set the Ton (output period) and Toff (stop output period) of the drive signal PWM, and set the temperature of the adjustable temperature test container 100 (e.g., preset test temperature), the load current of the electronic load 223 (preset current value), and the output voltage of the first power supply 210 (e.g., preset test voltage value). During the time Toff, the power device under test (DUT) is turned off, and there is a voltage across the DUT (e.g., the voltage magnitude is the preset test voltage value). During the time Ton, the DUT is turned on, and current (e.g., the current magnitude is the preset current value) flows through the DUT. By repeatedly switching the test on and off, the DHTOL / DLTOL reliability of the power device under test (DUT) can be achieved.

[0092] Compared with the prior art, the power device testing device and its usage method based on electronic load provided by the present invention have the following advantages:

[0093] (1) The power device testing device based on electronic load provided by the present invention includes an adjustable temperature test container for accommodating the power device under test, a test circuit and a drive circuit. The adjustable temperature test container can stabilize the temperature of the power device under test located therein at the test temperature (for example, setting a high temperature value or setting a low temperature value), so that not only can the HTOL / LTOL test of the power device under test be realized, but also the temperature scenario of the power device under test in real application can be well simulated.

[0094] (2) The test circuit may include at least two test sub-circuits connected in parallel. With this configuration, not only can multiple groups of power devices under test be tested in parallel, but the parallel connection design between the test sub-circuits also allows each test sub-circuit to operate independently without interfering with each other. Even if one test sub-circuit fails, it will not affect the other test sub-circuits, thus making the test results more accurate.

[0095] (3) Each of the test sub-circuits includes a first switching unit and a second switching unit. By controlling the connection and disconnection states of the first, second and third ends of the first switching unit and the first, second and third ends of the second switching unit, both unidirectional HTOL / LTOL and DHTOL / DLOTL tests of the power device under test and bidirectional HTOL / LTOL and DHTOL / DLOTL tests of the power device under test can be realized, thereby making the power device test device based on electronic load provided by the present invention have good applicability.

[0096] (4) Each of the test sub-circuits has an independent electronic load. The preset current value required for testing the power device under test can be precisely controlled through the electronic load, which can ensure high test accuracy.

[0097] (5) In the power circuit, the power device under test is located near the positive terminal of the first power supply and the electronic load is located near the negative terminal of the first power supply. This can better protect the electronic load and effectively improve the service life of the power device test device based on the electronic load. In addition, the driving circuit can provide a stable driving signal for the power device under test, which can well ensure the stability and reliability of the power device test device based on the electronic load provided by the present invention.

[0098] (6) The power device testing device based on electronic load provided by the present invention includes an adjustable temperature test container, a test circuit and a drive circuit. This modular design also has the advantages of clear logic and easy implementation.

[0099] In summary, this invention can effectively simulate real-world application scenarios of power devices, enabling the testing of parasitic components, test boards, and the characteristics of the power device under test (such as GaN devices). Furthermore, it can also perform unidirectional, bidirectional HTOL / LTOL, and DHTOL / DLOTL tests on power devices to comprehensively and realistically evaluate the switching behavior and stability of the power device under test.

[0100] It should be noted that the apparatus and methods disclosed in the embodiments herein can also be implemented in other ways. The apparatus embodiments described above are merely illustrative; for example, the flowcharts and block diagrams in the accompanying drawings show the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments herein. In this regard, each block in a flowchart or block diagram may represent a module, program, or part of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system to perform the specified function or action, or can be implemented using a combination of dedicated hardware and computer instructions.

[0101] In addition, the functional modules in the various embodiments of this article can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0102] The above description is merely a preferred embodiment of the power device testing apparatus and method based on electronic load provided by the present invention, and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure are within the protection scope of the present invention. Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Therefore, if these modifications and variations fall within the scope of the present invention and its equivalents, the present invention also intends to include these modifications and variations.

Claims

1. A power device testing device based on an electronic load, characterized in that, include: An adjustable temperature test container, test circuit, and drive circuit for accommodating the power device under test; The test circuit includes a first power supply and one or at least two test sub-circuits connected in parallel; the test sub-circuit includes a first switching unit, a second switching unit, and an electronic load. The first terminal of the first switching unit and the first terminal of the second switching unit are coupled to the positive terminal of the first power supply. The second terminal of the first switching unit and the second terminal of the second switching unit are coupled to the first terminal of the electronic load. The second terminal of the electronic load is coupled to the negative terminal of the first power supply. The third terminal of the first switching unit is used to couple to the first terminal of the power device under test, and the third terminal of the second switching unit is used to couple to the second terminal of the power device under test. The driving circuit is configured to apply a driving signal to the control terminal of the power device under test and, based on the conductivity direction of the power device under test in the test sub-circuit, control the connection and disconnection states of the first, second, and third terminals of the first switching unit and the first, second, and third terminals of the second switching unit, so that the first power supply, the first switching unit, the power device under test, the second switching unit, and the electronic load form a power loop.

2. The power device testing apparatus according to claim 1, characterized in that, The first switching unit includes a first switch, a second switch, and a third switch; the second switching unit includes a fourth switch, a fifth switch, and a sixth switch; the first terminal of the first switch and the first terminal of the fourth switch are coupled to the positive terminal of the first power supply; the second terminal of the first switch, the first terminal of the second switch, and the first terminal of the third switch are coupled to a first node, the first node being used to connect to the first terminal of the power device under test; the second terminal of the second switch and the first terminal of the fifth switch are coupled to the first terminal of the electronic load; the second terminal of the fourth switch, the second terminal of the fifth switch, and the first terminal of the sixth switch are coupled to a second node, the second node being used to connect to the second terminal of the power device under test; and the second terminal of the third switch and the second terminal of the sixth switch are coupled to a first reference ground. The control terminals of the first switch, the second switch, the third switch, the fourth switch, the fifth switch, and the sixth switch are coupled to the drive circuit.

3. The power device testing apparatus according to claim 2, characterized in that, The driving circuit is configured to control the connection and disconnection states of the first, second, and third terminals of the first switching unit and the first, second, and third terminals of the second switching unit according to the conductivity direction of the power device under test in the test sub-circuit, so that the first power supply, the first switching unit, the power device under test, the second switching unit, and the electronic load form a power loop, including: The driving circuit is configured to, when the first terminal of the power device under test is the drain and the second terminal is the source, control the third switch to be open and the sixth switch to be open, and control the first switch and the fifth switch to be open and the second switch and the fourth switch to be open; when the first terminal of the power device under test is the source and the second terminal is the drain, control the third switch to be open and the sixth switch to be open, and control the second switch and the fourth switch to be open and the first switch and the fifth switch to be open.

4. The power device testing apparatus according to claim 2, characterized in that, The first switch, the second switch, the fourth switch, and the fifth switch include power relays or power switches; the third switch and the sixth switch include optocoupler relays.

5. The power device testing apparatus according to claim 1, characterized in that, The driving signal applied by the driving circuit to the control terminal of the power device under test includes a pulse width modulation signal; The power of the first power supply is greater than or equal to the number of test sub-circuits, the product of the preset test voltage value and the preset current value.

6. The power device testing apparatus according to claim 1, characterized in that, The driving circuit includes a main control unit, a driving unit, and a power supply unit that supplies power to the main control unit and the driving unit. The first terminal of the main control unit is coupled to the first terminal of the driving unit. The main control unit is also coupled to the first switching unit and the second switching unit respectively. The second end of the driving unit is coupled to the control end of the power device under test; The main control unit is configured to send an initial drive signal to the drive unit, and to control the connection and disconnection states of the first, second and third terminals of the first switch unit and the first, second and third terminals of the second switch unit according to the conductivity direction of the power device under test in the test sub-circuit. The driving unit is configured to amplify the initial driving signal to obtain the driving signal, and send the driving signal to the power device under test.

7. The power device testing apparatus according to claim 6, characterized in that, The power supply unit includes a second power supply, a first isolation power supply and a second isolation power supply. The first end of the second power supply is coupled to the first end of the first isolation power supply through a wire, and the second end of the first isolation power supply is coupled to the second end of the main control unit. The second terminal of the second power supply is electromagnetically coupled to the first terminal of the second isolation power supply, and the second terminal of the second isolation power supply is coupled to the third terminal of the drive unit.

8. The power device testing apparatus according to claim 6, characterized in that, The main control unit is also coupled to the first switching unit and the second switching unit respectively, including: The third, fourth, and fifth terminals of the main control unit are respectively coupled to the first, second, and third switches of the first switch unit, and the sixth, seventh, and eighth terminals of the main control unit are respectively coupled to the fourth, fifth, and sixth switches of the second switch unit. When the first terminal of the power device under test is the drain and the second terminal is the source, the main control unit is configured to control the third switch to be open and the sixth switch to be closed, and to control the first switch and the fifth switch to be closed and the second switch and the fourth switch to be open. When the first terminal of the power device under test is the source and the second terminal is the drain, the main control unit is configured to control the third switch to be turned on and the sixth switch to be turned off, and to control the second switch and the fourth switch to be turned on and the first switch and the fifth switch to be turned off.

9. The power device testing apparatus according to claim 1, characterized in that, The power device under test includes GaN devices.

10. A method of using a power device testing apparatus based on an electronic load as described in any one of claims 1 to 9, characterized in that, The method of use includes: The first terminal of the power device under test is coupled to the third terminal of the first switching unit, the second terminal of the power device under test is coupled to the third terminal of the second switching unit, and the control terminal of the power device under test is coupled to the output terminal of the driving unit. Set the temperature of the adjustable temperature test container to the preset test temperature; Based on the preset test voltage value and the preset current value, determine the output voltage of the first power supply and / or the load current value of the electronic load; The driving circuit is activated according to the conductivity direction of the power device under test in the test sub-circuit and the preset test parameters, so that the power device under test is in a conducting or turning-off state.