Packaging structure

Abstract

This invention provides a packaging structure. The packaging structure includes a first photonic component, a second photonic component, and an optical connector. The optical connector includes a first metasurface and a second metasurface opposite to the first metasurface. The optical connector is configured to optically couple the first photonic component to the second photonic component.

Description

Technical Field

[0001] This disclosure generally relates to a packaging structure. Background Technology

[0002] Currently, optical signals are transmitted to or from photonic components via optical connectors, which contain waveguides fabricated in a glass plate and various mechanical connecting elements. Such optical connectors involve complex structures. Therefore, miniaturization of optical connectors is difficult, and their manufacturing process is highly complex. Summary of the Invention

[0003] In one or more arrangements, a packaging structure includes a first photonic component, a second photonic component, and an optical connector. The optical connector includes a first metasurface and a second metasurface opposite to the first metasurface. The optical connector is configured to optically couple the first photonic component to the second photonic component.

[0004] In one or more arrangements, a packaging structure includes a first photonic component, a second photonic component, and an optical connector. The first photonic component includes a first optical channel. The second photonic component includes a second optical channel that is not aligned with the first optical channel. The optical connector includes a first optical structure and a second optical structure. Each optical structure is configured to focus or collimate an optical signal transmitted between the first and second optical channels.

[0005] In one or more arrangements, a packaging structure includes a first optical component, a second optical component, and an optical connector. The optical connector includes a homogeneous medium. The homogeneous medium is configured to transmit multiple optical signals between the first and second optical components. Attached Figure Description

[0006] The aspects of this disclosure are better understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that various features may not be drawn to scale, and the dimensions of various features may be arbitrarily increased or decreased for clarity of discussion.

[0007] Figure 1A It is a cross-section of an encapsulation structure arranged according to some of the present disclosure.

[0008] Figure 1B This is a top view of the encapsulation structure according to some arrangements of this disclosure.

[0009] Figure 2A It is a cross-section of a portion of an encapsulation structure arranged according to some of the present disclosure.

[0010] Figure 2B This is a top view of a portion of the encapsulation structure according to some arrangements of this disclosure.

[0011] Figure 2C It is a cross-section of a portion of an encapsulation structure arranged according to some of the present disclosure.

[0012] Figure 2D This is a top view of a portion of the encapsulation structure according to some arrangements of this disclosure.

[0013] Figure 3A It is a cross-section of an encapsulation structure arranged according to some of the present disclosure.

[0014] Figure 3B This is a top view of the encapsulation structure according to some arrangements of this disclosure.

[0015] Figure 4A It is a cross-section of an encapsulation structure arranged according to some of the present disclosure.

[0016] Figure 4B This is a top view of the encapsulation structure according to some arrangements of this disclosure.

[0017] Figure 5A It is a cross-section of an encapsulation structure arranged according to some of the present disclosure.

[0018] Figure 5B This is a top view of the encapsulation structure according to some arrangements of this disclosure.

[0019] Figure 6A It is a cross-section of an encapsulation structure arranged according to some of the present disclosure.

[0020] Figure 6B This is a top view of the encapsulation structure according to some arrangements of this disclosure.

[0021] Figure 7A It is a cross-section of an encapsulation structure arranged according to some of the present disclosure.

[0022] Figure 7B This is a top view of the encapsulation structure according to some arrangements of this disclosure.

[0023] The same or similar elements are indicated using common reference numerals throughout the drawings and detailed description. This disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Detailed Implementation

[0024] Figure 1A It is a cross-section of the encapsulation structure 1 according to some arrangement of the present disclosure. Figure 1B This is a top view of the encapsulation structure 1 according to some arrangements of this disclosure. In some arrangements, Figure 1A It is along Figure 1B The cross-section of line 1A-1A' in the diagram. The package structure 1 may include a substrate 10, optical components (e.g., photonic components 21 and 22), and an optical connector 30.

[0025] Substrate 10 may comprise, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate. Substrate 10 may comprise interconnect structures, such as multiple conductive traces and / or multiple conductive vias. In some arrangements, substrate 10 comprises a ceramic material, a metal plate, an organic substrate, or a lead frame. In some arrangements, substrate 10 may comprise a bilayer substrate comprising a core layer and conductive material and / or structures disposed on the upper and lower surfaces of substrate 10. The conductive material and / or structures may comprise multiple conductive traces. Substrate 10 may be referred to as a carrier. Substrate 10 may comprise one or more electronic components, such as electronic integrated circuits (EICs).

[0026] Photonic components 21 and 22 may be disposed above substrate 10. In some arrangements, photonic components 21 and 22 are electrically connected to substrate 10, such as electronic components (or EICs) of substrate 10.

[0027] In some arrangements, the photonic component 21 includes a substrate layer 210s, a dielectric structure 210d, and one or more optical channels 210. The photonic component 21 may further include one or more circuit layers and one or more conductive pads electrically connected to the circuit layers. The circuit layers may include various photonic devices, such as PICs, photodetectors, photodiodes, SOAs, optical modulators, or combinations thereof. In some arrangements, the substrate layer 210s may be or include a semiconductor substrate, such as a silicon substrate. In some arrangements, the dielectric structure 210d includes multiple dielectric layers. In some arrangements, the optical channels 210 are or include optical waveguides. The optical channels 210 may be embedded in the dielectric structure 210d and disposed between the dielectric layers. In some arrangements, the ends or terminals of the optical channels 210 are exposed from the dielectric structure 210d. In some arrangements, the ends or terminals of the optical channels 210 are exposed by a lateral surface of the photonic component 21. The optical channels 210 may extend in a direction DR2 generally parallel to the upper surface 211. Optical channels 210 can be arranged in a row in a direction DR1 that is generally perpendicular to direction DR2. Photonic component 21 can have an upper surface 211 facing away from substrate 10.

[0028] In some arrangements, the photonic component 22 includes a substrate layer 220s, a dielectric structure 220d, and one or more optical channels 220. The photonic component 22 may further include one or more circuit layers and one or more conductive pads electrically connected to the circuit layers. The circuit layers may include various photonic devices, such as PICs, photodetectors, photodiodes, SOAs, optical modulators, or combinations thereof. In some arrangements, the substrate layer 220s may be or include a semiconductor substrate, such as a silicon substrate. In some arrangements, the dielectric structure 220d includes multiple dielectric layers. In some arrangements, the optical channels 220 are or include optical waveguides. The optical channels 220 may be embedded in the dielectric structure 220d and disposed between the dielectric layers. In some arrangements, the ends or terminals of the optical channels 220 are exposed from the dielectric structure 220d. In some arrangements, the ends or terminals of the optical channels 220 are exposed by a lateral surface of the photonic component 22. The photonic component 22 may have an upper surface 221 facing away from the substrate 10.

[0029] An optical connector 30 may be disposed between photonic components 21 and 22. The optical connector 30 may be referred to as an optical guide or optical interconnect. The optical connector 30 may be configured to optically couple photonic component 21 to photonic component 22 or vice versa. The optical connector 30 may have an upper surface 301 (or top surface), a lower surface 302 (or bottom surface), and lateral surfaces 303 and 304. In some arrangements, the optical connector 30 includes a substrate 300s and extensions 330 and 340.

[0030] In some arrangements, substrate 300s is or comprises a transparent substrate. Substrate 300s may be configured to transmit one or more optical signals L between photonic components 21 and 22. Optical signals L may be light or a beam of light. Optical signals L may be substantially collimated light, substantially collimated beam of light, diverging light, diverging beam of light, converging light, and / or converging beam of light. Substrate 300s may be transparent to optical signals L (e.g., having about 80% or higher transmittance). In some arrangements, substrate 300s is or comprises a homogeneous medium configured to transmit one or more optical signals L between photonic components 21 and 22. In some arrangements, optical channels 210 and 220 are configured to transmit optical signals L to or from a homogeneous medium (e.g., substrate 300s). In some arrangements, substrate 300s has a substantially uniform refractive index within substrate 300s (or homogeneous medium). In some arrangements, the substrate 300s (or homogeneous medium) is an integral layer and does not contain any optical waveguides. In some arrangements, the substrate 300s (or homogeneous medium) has a generally flat coupling surface (e.g., lateral surface 303) facing the photonic component 21 and a generally flat coupling surface (e.g., lateral surface 304) facing the photonic component 22.

[0031] In some arrangements, extension 330 is supported by photonic component 21, and extension 340 is supported by photonic component 22. In some arrangements, extension 330 has an upper surface 301 and is supported by the upper surface 201 of photonic component 21. In some arrangements, extension 340 has an upper surface 301 and is supported by the upper surface 221 of photonic component 22. In some arrangements, extensions 330 and 340 are connected to substrate 300s. The optical connector 30 comprising substrate 300s and extensions 330 and 340 can be a monolithic structure or an integral piece, for example, integrally formed. In some arrangements, substrate 300s and extensions 330 and 340 as a whole can have a substantially uniform refractive index. In some arrangements, substrate 300s and extensions 330 and 340 as a whole can be an integral layer (or monolithic structure) and does not contain any optical waveguides formed or disposed therein. In some arrangements, the extension 330 overlaps with the optical channel 210 in a direction DR3 that is generally perpendicular to the upper surface 211 of the photonic assembly 21. In some arrangements, the extension 340 overlaps with the optical channel 220 in the direction DR3.

[0032] In some arrangements, the optical connector 30 includes metasurface structures 311 and 321. Metasurface structures 311 and 321 may be referred to as metasurfaces or optical structures. In some arrangements, metasurface structure 311 is opposite to metasurface structure 321. In some arrangements, metasurface structures 311 and 321 are configured to optically couple photonic component 21 to photonic component 22 or to optically couple photonic component 22 to photonic component 21. In some arrangements, metasurface structure 311 faces photonic component 21, and metasurface structure 321 faces photonic component 22. In some arrangements, the substrate 300s (or homogeneous medium) has a generally flat coupling surface facing photonic component 21 (e.g., metasurface structure 311) and a generally flat coupling surface facing photonic component 22 (e.g., metasurface structure 321). In some arrangements, the substrate 300s does not have convex coupling surfaces facing photonic components 21 and 22.

[0033] In some arrangements, the metasurface structure 311 (or optical structure) includes collimating optics, focusing optics, or a combination thereof. In some arrangements, the metasurface structure 311 can be configured to switch divergent light to substantially collimated light. In some arrangements, the metasurface structure 311 can be configured to switch a scattered beam or divergent beam to a substantially collimated beam. In some arrangements, the metasurface structure 311 can be configured to switch substantially collimated light to divergent light. In some arrangements, the metasurface structure 311 can be configured to switch a substantially collimated beam or substantially collimated beam to a scattered beam or divergent beam. In some arrangements, the metasurface structure 311 can be configured to switch substantially collimated light to convergent light. In some arrangements, the metasurface structure 311 can be configured to switch a substantially collimated beam or substantially collimated beam to a convergent beam or convergent beam. In some arrangements, the metasurface structure 311 may be configured to switch the focused light to substantially collimated light. In some arrangements, the metasurface structure 311 may be configured to switch the focusing beam or focusing beam to substantially collimated beam or substantially collimated beam.

[0034] In some arrangements, the metasurface structure 311 (or metasurface) comprises a plurality of nanostructures 311n protruding toward the photonic component 21. The nanostructures 311n may be or comprise nanopillars. The nanostructures 311n may have different dimensions (e.g., diameter, width, surface area, etc.). The nanostructures 311n may be formed or disposed on the lateral surface 303. The nanostructures 311n may protrude from the lateral surface 303. In some arrangements, a nanofilm may be deposited on the outer surface of the substrate 300s, and the nanofilm may be etched to form a plurality of nanostructures 311n. The nanostructures 311n may be disposed on and / or partially embedded in the substrate 300s. The nanostructures 311n may have different dimensions. The dimensions of the nanostructures 311n may depend on the light radius received by or transmitted from the optical channel 210. For example, the arrangement of features of the metasurface structure 311 (or nanostructure 311n) may be matched to the wavelength of the optical signal. In some arrangements, the metasurface structure 311 and the substrate 300s may contain the same material or be made of the same material, such as silicon oxide, glass, or other suitable materials. In some arrangements, the dimensions of the internal portions of the nanostructure 311n may be larger than the dimensions of the external portions of the nanostructure 311n. In some arrangements, the spacing between the internal portions of the nanostructure 311n may be equal to the spacing between the external portions of the nanostructure 311n. In some arrangements, the space between the internal portions of the nanostructure 311n may be smaller than the space between the external portions of the nanostructure 311n.

[0035] In some arrangements, the metasurface structure 321 (or optical structure) includes collimating optics, focusing optics, or a combination thereof. In some arrangements, the metasurface structure 321 may be configured to switch divergent light to substantially collimated light. In some arrangements, the metasurface structure 321 may be configured to switch a scattered beam or divergent beam to a substantially collimated beam. In some arrangements, the metasurface structure 321 may be configured to switch substantially collimated light to divergent light. In some arrangements, the metasurface structure 321 may be configured to switch a substantially collimated beam or substantially collimated beam to a scattered beam or divergent beam. In some arrangements, the metasurface structure 321 may be configured to switch substantially collimated light to convergent light. In some arrangements, the metasurface structure 321 may be configured to switch a substantially collimated beam or substantially collimated beam to a convergent beam or convergent beam. In some arrangements, the metasurface structure 321 may be configured to switch the focused light to substantially collimated light. In some arrangements, the metasurface structure 321 may be configured to switch the focusing beam or focusing beam to substantially collimated beam or substantially collimated beam.

[0036] In some arrangements, the metasurface structure 321 (or metasurface) comprises a plurality of nanostructures 321n protruding toward the photonic component 22. The nanostructures 321n may be or comprise nanopillars. The nanostructures 321n may have different dimensions (e.g., diameter, width, surface area, etc.). The nanostructures 321n may be formed or disposed on the lateral surface 304. The nanostructures 321n may protrude from the lateral surface 304. In some arrangements, a nanofilm may be deposited on the outer surface of the substrate 300s, and the nanofilm may be etched to form a plurality of nanostructures 321n. The nanostructures 321n may be disposed on and / or partially embedded in the substrate 300s. The nanostructures 321n may have different dimensions. The dimensions of the nanostructures 321n may depend on the light radius received by or transmitted from the optical channel 220. For example, the arrangement of features of the metasurface structure 321 (or nanostructure 321n) may be matched to the wavelength of the optical signal. In some arrangements, the metasurface structure 321 and the substrate 300s may contain the same material or be made of the same material, such as silicon oxide, glass, or other suitable materials. In some arrangements, the dimensions of the internal portions of the nanostructure 321n may be larger than the dimensions of the external portions of the nanostructure 321n. In some arrangements, the spacing between the internal portions of the nanostructure 321n may be equal to the spacing between the external portions of the nanostructure 321n. In some arrangements, the space between the internal portions of the nanostructure 321n may be smaller than the space between the external portions of the nanostructure 321n.

[0037] According to some arrangements of this disclosure, the metasurface structures 311 and 321 of the optical connector 30 face the photonic components 21 and 22 and are configured to optically couple the photonic components 21 and 22. Compared to a convex curved lens, the optical coupling surfaces formed by the metasurface structures 311 and 321 are generally flat, the distance between the photonic components 21 and 22 can be reduced, and therefore the optical transmission path between the photonic components 21 and 22 can be reduced, which is beneficial for increasing transmission speed.

[0038] Furthermore, according to some arrangements of this disclosure, the optical connector 30 does not contain any optical waveguides, and multiple optical signals L are transmitted via a homogeneous medium (e.g., substrate 300s). Therefore, the structure of the optical connector 30 for optically coupling photonic components 21 and 22 is simplified, the manufacturing process of the optical connector 30 is simplified, and the cost is reduced.

[0039] Furthermore, according to some arrangements of this disclosure, metasurface structures 311 and 321 and the substrate 300s are integrally formed. This simplifies the process and allows for the placement of optical coupling structures (e.g., metasurface structures 311 and 321) for photonic components 21 and 22 in a single operation. The process can be further simplified.

[0040] Figure 2A It is a cross-section of part 2 of the encapsulation structure 1 arranged according to some of the present disclosure. Figure 2B This is a top view of portion 2 of the encapsulation structure 1 according to some arrangements of this disclosure. Figure 2A It is along Figure 2B The cross section of line 2A-2A' in the diagram.

[0041] In some arrangements, the extension 330 includes a protrusion 330P, and the photonic assembly 21 includes a recess 210r configured to engage with the protrusion 330P. A dielectric structure 210d may define the recess 210r. In some arrangements, the thickness T1 of the protrusion 330P is less than the depth T2 of the recess 210r. In some arrangements, the length L1 of the protrusion 330P is less than the length L2 of the recess 210r. In some arrangements, the recess 210r is defined by surfaces 210r1 and 210r2. The protrusion 330P may be guided by surfaces 210r1 and / or 210r2 to slide into the recess 210r and thus engage with it. In some arrangements, the protrusion 330P is disposed on one of the surfaces 210r1 and 210r2 and contacts the one of the surfaces to engage with the recess 210r, and allows the bottom surface of the protrusion 330P to contact and abut the upper surface 211 of the photonic assembly 21.

[0042] The extension 340 may include a protrusion similar to the protrusion 330P, and the photonic assembly 22 may include a recess similar to the recess 210r to engage with the protrusion of the extension 340.

[0043] According to some arrangements of this disclosure, by utilizing the aforementioned design where the protrusion 330P engages with the recess 210r, the optical connector 30 can be passively aligned with the optical channels 210 and 220 without performing active alignment. Furthermore, according to some arrangements of this disclosure, the protrusion 330P is integrally formed with the base 300s of the optical connector 30. Therefore, the manufacturing process is simplified.

[0044] Figure 2C It is a cross-section of part 2 of the encapsulation structure 1 arranged according to some of the present disclosure. Figure 2D This is a top view of portion 2 of the encapsulation structure 1 according to some arrangements of this disclosure. Figure 2C It is along Figure 2D The cross section of line 2C-2C' in the diagram.

[0045] In some arrangements, the extension 330 defines an opening 330r (also referred to as a "through-hole"), and the photonic assembly 21 includes a protrusion 210P configured to engage with the opening 330r. In some arrangements, the depth T4 of the opening 330r is less than the thickness T3 of the protrusion 210P. The depth T4 may be substantially equal to or greater than the thickness T3 of the protrusion 210P. In some arrangements, the length L3 of the protrusion 210P is less than the length L4 of the opening 330r. In some arrangements, the opening 330r, viewed from a cross-sectional view, is defined at least by surfaces 330r1 and 330r2. The protrusion 210P may be guided by surfaces 330r1 and / or 330r2 to slide into the opening 330r and engage with it. In some arrangements, the protrusion 330P is disposed on one of surfaces 330r1 and / or 330r2 and contacts said one of said surfaces to engage with the opening 330r, allowing the bottom surface of the protrusion 330P to contact and abut against the upper surface 211 of the photonic assembly 21. The protrusion 330P may be made of the same or different material as the substrate 300s. In some arrangements, the substrate 300s is made of or contains glass, and the protrusion 330P is made of or contains a photoresist material.

[0046] The extension 340 may define an opening similar to the opening 330r, and the photonic assembly 22 may include a protrusion similar to the protrusion 210P to engage with the opening of the extension 340.

[0047] Figure 3A It is a cross-section of the encapsulation structure 3 according to some arrangement of this disclosure. Figure 3BThis is a top view of the encapsulation structure 3 according to some arrangements of this disclosure. In some arrangements, Figure 3A It is along Figure 3B The cross-section of line 3A-3A' in the middle. Package structure 3 is similar to Figure 1A-1B The encapsulation structure 1 in the text is described below, and the differences between them are described as follows.

[0048] In some arrangements, the package structure 3 includes doped regions 350 and 370 integrated within a homogeneous medium (e.g., substrate 300s). Doped regions 350 and 370 may be referred to as the optical structure of the optical connector 30. In some arrangements, the refractive index of doped regions 350 and 370 is higher than the refractive index of the homogeneous medium (e.g., substrate 300s). In some arrangements, the difference in refractive index between doped regions 350 and 370 and substrate 300s is greater than 0.018. The difference in refractive index between doped regions 350 and 370 and substrate 300s is approximately 0.018 to approximately 0.08. In some arrangements, doped region 350 (or the optical structure) includes collimating optics, focusing optics, or a combination thereof. In some arrangements, doped region 370 (or the optical structure) includes collimating optics, focusing optics, or a combination thereof. In some arrangements, doped regions 350 and 370 are configured to focus an optical signal L from a homogeneous medium (e.g., substrate 300s) to transmit the focused optical signal L to optical channels 210 and 220, respectively. In some arrangements, doped regions 350 and 370 are configured to collimate the optical signals L from optical channels 210 and 220, respectively, to transmit the collimated optical signals L to the homogeneous medium (e.g., substrate 300s).

[0049] In some arrangements, the substrate 300s is or comprises glass, and the doped regions 350 and 370 comprise silver ions (Ag+), potassium ions (K+), thallium ions (Tl+), or combinations thereof. The substrate 300s may be made of an amorphous material comprising SiO2, GeO2, or P2O5 and sodium ions (Na+), and portions of the substrate 300s may be ion-exchanged to replace sodium ions (Na+) with silver ions (Ag+), potassium ions (K+), and / or thallium ions (Tl+), thereby forming the doped regions 350 and 370. In some arrangements, a masking layer may be disposed above the surface of the substrate 300s to partially expose regions that allow silver ions (Ag+), potassium ions (K+), and / or thallium ions (Tl+) to diffuse into the substrate 300s. The masking layer may be removed after the ion exchange is complete. In some arrangements, an electric field is applied to drive the dopant ions to diffuse further into the substrate 300s, forming doped regions 350 and 370 embedded within the substrate 300s. The exact locations of the doped regions 350 and 370 can depend on the parameters of the applied electric field. The doped regions 350 and 370 can be detected or observed using an optical microscope, where the substrate 300s and the doped regions 350 and 370 exhibit different colors. For example, the substrate 300s made of glass is light blue, while the doped regions 350 and 370 containing silver ions (Ag+) are pink. Images can be observed using an InGaAs camera at λ=1.5 μm.

[0050] In some arrangements, doped regions 350 and 370 have a spherical shape. In some arrangements, doped regions 350 and 370 are or contain spherical lenses. Doped regions 350 and 370 are arranged in a row along direction DR1. In some arrangements, an optical channel 210, a doped region 350, a doped region 370, and an optical channel 220 are aligned along direction DR2. In some arrangements, when viewed along direction DR2, an optical channel 210, a doped region 350, a doped region 370, and an optical channel 220 overlap.

[0051] According to some arrangements of this disclosure, the optical structure of the optical connector 30 includes doped regions 350 and 370 facing the photonic components 21 and 22 respectively, and is configured to optically couple the photonic components 21 and 22. Compared to a convex curved lens, the optical coupling surfaces of the optical connector 30 are generally flat transverse surfaces 303 and 304, which can reduce the distance between the photonic components 21 and 22, and therefore reduce the optical transmission path between the photonic components 21 and 22, which is beneficial for increasing the transmission speed.

[0052] Figure 4A It is a cross-section of the encapsulation structure 4 according to some arrangement of this disclosure. Figure 4BThis is a top view of the encapsulation structure 4 according to some arrangements of this disclosure. In some arrangements, Figure 4A It is along Figure 4B The cross-section of line 4A-4A' in the package. Package structure 4 is similar to... Figure 1A-1B The encapsulation structure 1 and / or Figures 3A-3B The encapsulation structure 3 in the text is described below, and the differences between them are described as follows.

[0053] In some arrangements, the doped region 370 comprises a pillar shape and extends in direction DR1. In some arrangements, each of the doped regions 380 comprises a pillar shape, and the doped region 380 extends in direction DR3, which is generally perpendicular to direction DR1. In some arrangements, when viewed in direction DR2, the doped region 370 overlaps with optical channel 210 and doped region 380. In some arrangements, when viewed in direction DR2, each of the doped regions 380 overlaps with a corresponding optical channel 220.

[0054] Figure 5A It is a cross-section of the encapsulation structure 5 according to some arrangement of this disclosure. Figure 5B This is a top view of the encapsulation structure 5 according to some arrangements of this disclosure. In some arrangements, Figure 5A It is along Figure 5B The cross-section of line 5A-5A' in the middle. Package structure 5 is similar to Figure 1A-1B The encapsulation structure in the middle 1, Figures 3A-3B The encapsulation structure 3 and / or Figures 4A-4B The encapsulation structure 4 in the text is described below, and the differences between them are described as follows.

[0055] In some arrangements, photonic component 21 and photonic component 22 are misaligned. In some arrangements, at least one of optical channels 210 and at least one of optical channels 220 are misaligned. In some arrangements, optical channels 210 and optical channels 220 are misaligned.

[0056] In some arrangements, the optical connector 30 includes a portion 30A and a portion 30B spaced apart from the portion 30A. In some arrangements, portion 30A includes an optical structure (e.g., metasurface structure 311) facing the photonic component 21, and portion 30B includes an optical structure (e.g., metasurface structure 321) facing the photonic component 22. In some arrangements, portion 30A is configured to focus or collimate the optical signal L between optical channels 210 and 220. In some arrangements, portion 30B is configured to focus or collimate the optical signal L between optical channels 210 and 220. In some arrangements, each of the optical structures of portions 30A and 30B (e.g., metasurface structures 311 and 321) includes a collimating optics, a focusing optics, or a combination thereof.

[0057] In some arrangements, portion 30A includes a surface 305 facing portion 30B, and portion 30B includes a surface 306 facing and generally parallel to surface 305. In some arrangements, a metasurface of portion 30A (e.g., metasurface structure 311) is not parallel to surface 305. In some arrangements, an optical coupling surface of portion 30A (e.g., lateral surface 303) is not parallel to surface 305. In some arrangements, surfaces 305 and 306 extend in a direction DR1A that is not parallel to directions DR1 and DR2. In some arrangements, a metasurface of portion 30B (e.g., metasurface structure 321) is not parallel to surface 306. In some arrangements, an optical coupling surface of portion 30B (e.g., lateral surface 304) is not parallel to surface 306.

[0058] In some arrangements, portion 30A includes a homogeneous substrate 300s1 connected to metasurface structure 311, and portion 30B includes a homogeneous substrate 300s2 connected to metasurface structure 321. In some arrangements, extension 330 is connected to homogeneous substrate 300s1, and extension 340 is connected to homogeneous substrate 300s2. Portion 30A, including homogeneous substrate 300s1 and extension 330, can be a monolithic structure or a single piece, for example, integrally formed. Portion 30B, including homogeneous substrate 300s2 and extension 340, can be a monolithic structure or a single piece, for example, integrally formed. In some arrangements, homogeneous substrate 300s1 and extension 330 as a whole can have a substantially uniform refractive index. In some arrangements, homogeneous substrate 300s2 and extension 340 as a whole can have a substantially uniform refractive index. In some arrangements, the homogeneous substrate 300s1 and the extension 330 as a whole may be a monolithic layer (or a single-piece structure) and do not contain any optical waveguides formed or disposed therein. In some arrangements, the homogeneous substrate 300s2 and the extension 340 as a whole may be a monolithic layer (or a single-piece structure) and do not contain any optical waveguides formed or disposed therein.

[0059] In some arrangements, refer to Figure 5B The extension 340 includes a protrusion 340P, and the photonic assembly 22 includes a recess 220r configured to engage with the protrusion 340P. A dielectric structure 220d may define the recess 220r. In some arrangements, the length L5 of the protrusion 340P is less than the length L6 of the recess 220r. In some arrangements, the difference between the length L6 of the recess 220r and the length L5 of the protrusion 340P is greater than the difference between the length L2 of the recess 210r and the length L1 of the protrusion 330P. In some arrangements, the lateral side of the recess 220r is not parallel to the metasurface (e.g., metasurface structure 321). In some arrangements, the lateral side of the recess 220r is not parallel to the lateral surface 304.

[0060] According to some arrangements of this disclosure, when photonic components 21 and 22 are misaligned due to alignment errors during the manufacturing process of the packaging structure 5, the optical connector 30 includes portions 30A and 30B spaced apart from each other and having surfaces 305 and 306 that are substantially parallel to each other. Surfaces 305 and 306 are inclined relative to the optical coupling surfaces (e.g., metasurfaces or lateral surfaces 303 and 304) of the optical connector 30, and the optical signal L from the optical channel 210 can be refracted at and exit from surface 305, and then enters surface 306 and is refracted again. Thus, after portion 30A is placed on the photonic component 21, portion 30B can be shifted along direction DR1 to an adjusted position so that the optical signal L from the optical channel 210 is refracted twice during its passage through surfaces 305 and 306, thereby being transmitted to the optical channel 220 which is misaligned with the optical channel 210. Therefore, with the above design, the optical signal L can be transmitted between the misaligned optical channels 210 and 220.

[0061] Furthermore, according to some arrangements of this disclosure, the difference between the length L6 of the recess 220r and the length L5 of the protrusion 340P is greater than the difference between the length L2 of the recess 210r and the length L1 of the protrusion 330P. Therefore, the protrusion 340P has relatively large space to move or shift along the direction DR1A, thereby allowing the portion 30B to move to an adjusted position to guide the optical signal L from the optical channel 210 to the optical channel 220.

[0062] Figure 6A It is a cross-section of the encapsulation structure 6 arranged according to some of the present disclosure. Figure 6B This is a top view of the encapsulation structure 6 according to some arrangements of this disclosure. In some arrangements, Figure 6A It is along Figure 6B The cross-section of line 6A-6A' in the middle. Package structure 6 is similar to Figure 1A-1B The encapsulation structure in the middle 1, Figures 3A-3B 3. Packaging structure in Figures 4A-4B The encapsulation structure 4 and / or Figures 5A-5B The encapsulation structure 5 in the text is described below, and the differences between them are described as follows.

[0063] In some arrangements, package structure 6 includes doped regions 350 and 370, and doped region 350 and doped region 370 are not aligned. In some arrangements, optical channel 220 and optical channel 210 are not aligned, doped region 350 and optical channel 210 are substantially aligned, and doped region 370 and optical channel 220 are substantially aligned.

[0064] Figure 7A It is a cross-section of the encapsulation structure 7 according to some arrangement of the present disclosure. Figure 7BThis is a top view of the encapsulation structure 7 according to some arrangements of this disclosure. In some arrangements, Figure 7A It is along Figure 7B The cross-section of line 7A-7A' in the diagram. Package structure 7 is similar to... Figure 1A-1B The encapsulation structure in the middle 1, Figures 3A-3B 3. Packaging structure in Figures 4A-4B 4. Packaging structure in the middle Figures 5A-5B The encapsulation structure 5 and / or Figures 6A-6B The encapsulation structures in section 6 are described below, and the differences between them are described as follows.

[0065] In some arrangements, the encapsulation structure 7 includes an optical component 24 configured for optical coupling to the photonic component 21. In some arrangements, the optical component 24 includes a substrate 240s and a plurality of optical channels 240s partially disposed within the substrate 240s. In some arrangements, an extension 340 of the optical connector 30 is supported by an upper surface 241 of the optical component 24. In some arrangements, the width W1 of the optical channel 210 is smaller than the width W2 of the optical channel 240. In some arrangements, the spacing P1 of the optical channels 210 is smaller than the spacing P2 of the optical channels 220. In some arrangements, the optical channels 240 are or include optical fibers, and the optical component 24 is or includes a fiber array unit (FAU).

[0066] Unless otherwise specified, spatial descriptions such as “above,” “below,” “up,” “left,” “right,” “lower,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “above,” “below,” “upper,” “above,” and “below” are relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and embodiments of the structures described herein can be arranged in space in any orientation or manner, provided that the advantages of the embodiments of this disclosure are not compromised by such arrangement.

[0067] As used herein, the terms “approximately,” “generally,” “roughly,” “about,” and “approximately” are used to describe and explain minor variations. When used in conjunction with an event or situation, these terms may refer to examples where the event or situation occurred precisely or very approximately. For example, when used in conjunction with a numerical value, these terms may refer to a range of variation less than or equal to ±10% of the stated value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first value is within a range of variation less than or equal to ±10% of a second value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first value may be considered “generally” the same as or equal to the second value. For example, "roughly" vertical can refer to an angle variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0068] If the displacement between two surfaces is no greater than 5 µm, 2 µm, 1 µm, or 0.5 µm, then the two surfaces are considered coplanar or substantially coplanar. If the displacement between the highest and lowest points of a surface is no greater than 5 µm, 2 µm, 1 µm, or 0.5 µm, then the surface is considered substantially flat.

[0069] As used herein, unless the context clearly indicates otherwise, the singular forms “a / an” and “the” may contain a plural or multiple indicators.

[0070] As used herein, the terms “conductive,” “electrically conductive,” and “conductivity” refer to the ability to conduct electric current. A conductive material is one that exhibits little or no resistance to the flow of electric current. A unit of measurement for conductivity is Siemens per meter (S / m). Typically, a conductive material is one with a conductivity greater than about 10⁴ S / m, for example, at least 10⁵ S / m or at least 10⁶ S / m. The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0071] In addition, quantities, ratios, and other numerical values ​​are sometimes presented in range format in this document. It should be understood that such range format is used for convenience and brevity, and should be flexibly interpreted as including not only the numerical values ​​explicitly specified as the limits of the range, but also all individual numerical values ​​or subranges covered within the range, as if each numerical value and subrange were explicitly specified.

[0072] While this disclosure has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not limiting. Those skilled in the art will understand that various changes and alternative equivalents may be made without departing from the true spirit and scope of this disclosure as defined by the appended claims. Illustrations may not be drawn to scale. Due to manufacturing processes and tolerances, the process reproduction in this disclosure may differ from actual equipment. Other embodiments may exist that are not specifically described in this disclosure. The description and drawings should be considered illustrative rather than limiting. Modifications may be made to suit particular circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of this disclosure. All such modifications are considered to be included within the scope of the appended claims. Although the disclosed methods have been described herein with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of this disclosure.

Claims

1. A packaging structure comprising: First photonic component; Second photonic component; as well as An optical connector comprising a first metasurface and a second metasurface opposite to the first metasurface, configured to optically couple the first photonic component to the second photonic component.

2. The packaging structure of claim 1, wherein the optical connector includes a transparent substrate configured to transmit a plurality of optical signals between the first photonic component and the second photonic component.

3. The packaging structure according to claim 2, wherein the optical connector further includes a first extension supported by the first photonic component and a second extension supported by the second photonic component.

4. The packaging structure of claim 3, wherein the first extension includes a first protrusion, and the first photonic component includes a first recess configured to engage with the first protrusion.

5. The packaging structure of claim 4, wherein the second extension includes a second protrusion, and the second photonic component includes a second recess configured to engage with the first protrusion.

6. The packaging structure according to claim 5, wherein the difference between the length of the second recess and the length of the second protrusion is greater than the difference between the length of the first recess and the length of the first protrusion.

7. The packaging structure according to claim 4, wherein the lateral side of the first recess is not parallel to the first metasurface.

8. The packaging structure of claim 3, wherein the first extension defines an opening, and the first photonic component includes a protrusion configured to engage with the opening.

9. A packaging structure comprising: A first photonic component, which includes a first optical channel; The second photonic component includes a second optical channel that is not aligned with the first optical channel; as well as An optical connector includes a first optical structure and a second optical structure, each configured to focus or collimate an optical signal transmitted between the first optical channel and the second optical channel.

10. The packaging structure of claim 9, wherein the optical connector comprises a first portion and a second portion, the first portion comprising the first optical structure, and the second portion comprising the second optical structure and spaced apart from the first portion.

11. The packaging structure of claim 10, wherein the first portion further includes a first homogeneous substrate connected to the first optical structure, and the second portion includes a second homogeneous substrate connected to the second optical structure.

12. The packaging structure of claim 10, wherein the first surface of the first portion faces and is substantially parallel to the second surface of the second portion, and the first optical structure includes a metasurface facing the first photonic component and not parallel to the first surface.

13. The packaging structure of claim 10, wherein the first optical structure includes a first doped region configured to focus or collimate the optical signal, and the second optical structure includes a second doped region misaligned with the first doped region and configured to focus or collimate the optical signal.

14. The packaging structure of claim 10, wherein the first photonic component includes a plurality of first optical channels, the second photonic component includes a plurality of second optical channels misaligned with the first optical channels, the first optical structure includes a plurality of first doped regions substantially aligned with the first optical channels, and the second optical structure includes a plurality of second doped regions substantially aligned with the second optical channels.

15. A packaging structure comprising: First optical component; Second optical component; as well as An optical connector comprising a homogeneous medium configured to transmit a plurality of optical signals between a first optical component and a second optical component.

16. The packaging structure according to claim 15, wherein the homogeneous medium does not contain an optical waveguide.

17. The packaging structure of claim 15, wherein the homogeneous medium has a first generally flat coupling surface facing the first optical component and a second generally flat coupling surface facing the second optical component.

18. The packaging structure of claim 15, wherein the first optical component includes a plurality of first optical channels configured to transmit the optical signal to or from the homogeneous medium, and the second optical component includes a plurality of second optical channels configured to transmit the optical signal to or from the homogeneous medium.

19. The packaging structure according to claim 18, wherein the width of the first optical channel is smaller than the width of the second optical channel.

20. The packaging structure according to claim 18, wherein the spacing between the plurality of first optical channels is smaller than the spacing between the plurality of second optical channels.

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