Circuit board structure and method of manufacturing the same

Abstract

A circuit board structure and its manufacturing method are disclosed. The circuit board structure includes a glass substrate, electronic components, and a first circuit layer. The glass substrate includes a first surface and a second surface disposed opposite to each other. A receiving cavity is provided on the glass substrate, with the opening of the receiving cavity located on the first surface. A first through-hole is provided through the bottom surface and the second surface of the receiving cavity. The electronic component includes an electronic element and a conductive post. The electronic element is located within the receiving cavity, and the conductive post extends into the first through-hole and is exposed on the second surface. The first circuit layer is located on the second surface and is electrically connected to the conductive post. The circuit board structure and its manufacturing method of this application can reduce the thickness and weight of the circuit board structure, improve space utilization, and increase the integration of the circuit board structure by embedding the electronic component within the glass substrate. The conductive post enables the electronic component to conduct to external circuits, simplifies the electrical lead-out process, and reduces the difficulty of forming micro-holes on the glass.

Description

Technical Field

[0001] This application relates to the field of packaging technology, and in particular to a circuit board structure and its manufacturing method. Background Technology

[0002] Because glass substrates have high thermal conductivity and better heat dissipation, they can meet the more complex wiring requirements of higher-density soldered products. Furthermore, glass substrates have higher flatness, are less prone to deformation and warping, and are more likely to achieve breakthroughs in chip transfer technology. Therefore, with the advancement of display technology, glass substrates are increasingly being used in integrated circuit design, especially in emerging display technology fields such as Mini / Micro LED.

[0003] To prevent accidental breakage of the glass substrate during manufacturing, the commonly used glass substrates are usually quite thick, which increases the thickness and weight of the circuit board. In addition, after installing electronic components on the glass substrate, the overall thickness and weight of the circuit board will be further increased, making it difficult to meet the requirements of thin and light electronic devices. Summary of the Invention

[0004] In view of this, in order to solve at least one of the above problems, it is necessary to provide a circuit board structure.

[0005] In addition, this application also needs to provide a method for manufacturing a circuit board structure.

[0006] This application provides a circuit board structure comprising: a glass substrate, an electronic component, and a first circuit layer. The glass substrate includes a first surface and a second surface disposed opposite to each other. A receiving cavity is provided on the glass substrate, the opening of which is located on the first surface, and a first through hole is provided through the bottom surface and the second surface of the receiving cavity. The electronic component includes an electronic element and a conductive post disposed on and electrically connected to the electronic element. The electronic element is located within the receiving cavity, and the conductive post extends into the first through hole and is exposed on the second surface. The first circuit layer is located on the second surface and is electrically connected to the conductive post.

[0007] In some possible embodiments, there is a gap between the sidewall of the glass substrate corresponding to the first through hole and the conductive post, and a filling layer is provided in the gap.

[0008] In some possible embodiments, the circuit board structure further includes a second wiring layer located on the first surface, the second wiring layer extending to the surface of the electronic component away from the conduction post, and the second wiring layer being electrically connected to the first wiring layer.

[0009] In some possible embodiments, a second through hole is provided through the first surface and the second surface, and a connecting portion is provided in the second through hole, through which the second circuit layer is electrically connected to the first circuit layer.

[0010] In some possible embodiments, the conductive post is made of metal and is soldered onto the electronic component.

[0011] In some possible embodiments, the surface of the conductive post away from the electronic component is flush with the second surface; and / or, the surface of the electronic component away from the conductive post is flush with the first surface.

[0012] This application also provides a method for manufacturing a circuit board structure, the method comprising: forming a receiving cavity on a glass substrate, the glass substrate including a first surface and a second surface disposed opposite to each other, the opening of the receiving cavity being located on the first surface; forming a first through hole penetrating the bottom surface and the second surface of the receiving cavity; disposing an electronic component within the receiving cavity, the electronic component including an electronic element and a conductive post disposed on the electronic element and electrically connected to the electronic element, the electronic element being located within the receiving cavity, the conductive post extending into the first through hole and exposed on the second surface; and forming a first circuit layer on the second surface, the first circuit layer being electrically connected to the conductive post, thereby obtaining the circuit board structure.

[0013] In some possible embodiments, there is a gap between the sidewall of the glass substrate corresponding to the first through hole and the conductive post, and before the step of forming the first circuit layer on the second surface, the manufacturing method further includes filling the gap with encapsulation material to form a filling layer.

[0014] In some possible embodiments, the step of forming a first circuit layer on the second surface further includes: forming a second circuit layer on the first surface, the second circuit layer extending to the surface of the electronic component away from the conductive post, the second circuit layer being electrically connected to the first circuit layer.

[0015] In some possible embodiments, the conductive post is made of metal and is disposed on the electronic component by welding.

[0016] Compared to existing technologies, the circuit board structure and its manufacturing method provided in this application effectively reduce the thickness and weight of the circuit board structure by embedding electronic components within a glass substrate, achieving a thinner and more compact circuit board structure. Simultaneously, it improves the space utilization of the glass substrate and enhances the integration of the circuit board structure. By directly setting conductive posts on the electronic components to achieve electrical connection between the electronic components and external circuits, electrical lead-out is more convenient, operation is more flexible and simple, and the process of electrical lead-out of electronic components is simplified. It eliminates the need for traditional glass via forming processes, reducing the difficulty of forming micro-holes on glass. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the circuit board structure provided in an embodiment of this application.

[0018] Figure 2 This is a schematic diagram of the structure of a glass substrate composed of multiple glass plates, provided in an embodiment of this application.

[0019] Figure 3 This is a schematic diagram of the structure of an electronic component provided in an embodiment of this application.

[0020] Figure 4 A process flow diagram illustrating the fabrication method of a circuit board structure provided in an embodiment of this application.

[0021] Figure 5 This is a schematic diagram of a cavity formed on a glass substrate according to an embodiment of this application.

[0022] Figure 6 In order to be in Figure 5 A schematic diagram of the structure in which the first through hole is formed on the glass substrate.

[0023] Figure 7 In order to be in Figure 6 A schematic diagram of the structure in which electronic components are installed inside the cavity.

[0024] Figure 8 In order to be in Figure 7 A schematic diagram of the structure on the second surface where the encapsulation material is formed.

[0025] Figure 9 For located Figure 8 A schematic diagram of the structure in which the encapsulation material on the second surface enters the gaps and crevices through capillary action.

[0026] Figure 10 To remove Figure 9 A schematic diagram of the encapsulation material on the second surface.

[0027] Figure 11 In order to be in Figure 10 A schematic diagram of the structure in which a second through hole is formed on a glass substrate.

[0028] Figure 12 In order to be in Figure 11 A schematic diagram of the structure of the second through hole wall and the first surface and the first metal layer formed on the second surface.

[0029] Figure 13 In order to be in Figure 12 A schematic diagram of a structure in which a connecting portion is formed in the second through hole, and a second metal layer and a third metal layer are formed on the first surface and the second surface, respectively.

[0030] Figure 14 To reduce thinning Figure 13 A schematic diagram of the structure of the second and third metal layers.

[0031] Figure 15 To be Figure 14 The second and third metal layers in the diagram form the first and second circuit layers, respectively.

[0032] Explanation of main component symbols

[0033] Circuit board structure 100, gap 4

[0034] Glass substrate 1, 1' Filling layer 5

[0035] First surface 11 Encapsulation layer 6

[0036] Second surface 12 Second circuit layer 7

[0037] Receiving cavity 13, connecting part 8

[0038] Bottom surface 14 Third circuit layer 9

[0039] First through-hole 15, encapsulation material 10

[0040] Gap 16 First metal layer 20

[0041] Second through-hole 17 Second metal layer 30

[0042] Electronic component 2 Third metal layer 40

[0043] Electronic component 21 Glass plate 1a

[0044] Conductor post 22, adhesive layer 1b

[0045] First Line Layer 3

[0046] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0047] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0048] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component.

[0049] Please see Figure 1 As shown, this application embodiment provides a circuit board structure 100, which includes a glass substrate 1, an electronic component 2, and a first circuit layer 3. The glass substrate 1 includes a first surface 11 and a second surface 12 disposed opposite to each other. A receiving cavity 13 is provided on the glass substrate 1, with the opening of the receiving cavity 13 located on the first surface 11. A first through-hole 15 is provided penetrating the bottom surface 14 of the receiving cavity 13 and the second surface 12. The electronic component 2 includes an electronic element 21 and a conductive post 22 disposed on and electrically connected to the electronic element 21. The electronic element 21 is located within the receiving cavity 13, and the conductive post 22 extends into the first through-hole 15 and protrudes from the second surface 12. The first circuit layer 3 is located on the second surface 12 and is electrically connected to the conductive post 22, thereby realizing the electrical lead-out of the electronic element 21.

[0050] The circuit board structure 100 uses a glass substrate. Since glass itself has low dielectric loss (Df), the glass substrate 1 helps reduce signal transmission loss between the electronic component 2 and the first circuit layer 3, especially for high-speed signal transmission. Furthermore, the glass substrate 1 has high flatness, low warpage, good impact resistance, high mechanical strength, and a low coefficient of thermal expansion, which is beneficial for the molding of large-size circuit board structures 100. It also has low residual stress inside the circuit board structure 100, which helps improve the reliability of internal electrical connections and the connection between the electronic component 2 and the first circuit layer 3. The glass substrate 1 has better high-temperature resistance than traditional plastic substrates, allowing it to be used in higher temperature environments without deformation or damage. Its smooth surface does not easily attract dirt and moisture, thus providing strong corrosion resistance, making it suitable for applications with high environmental requirements. In addition, the glass substrate 1 has high transparency, allowing a clear view of the internal structure of the circuit board structure 100, making it suitable for applications requiring high transparency.

[0051] The thickness of the glass substrate 1 can be adjusted as needed. Since the glass substrate 1 can form through holes with a small diameter-to-depth ratio, and thus form a circuit conduction structure with a small diameter-to-height ratio, wiring density can be increased in scenarios where a thick glass substrate 1 is used.

[0052] In some embodiments, the glass substrate 1 is a thick glass plate.

[0053] It is understood that in other embodiments, such as Figure 2 As shown, the glass substrate 1' can be formed by stacking multiple glass plates 1a, with adjacent glass plates 1a connected by an adhesive layer 1b. The thickness of the glass plates 1a can be selected as needed, and any two glass plates 1a can have the same or different thicknesses. By forming the glass substrate 1' by stacking glass plates 1a and adhesive layers 1b, the toughness of the glass substrate 1' can be improved while reducing the overall thickness of the glass substrate 1'.

[0054] Please refer to it again. Figure 1 As shown, the receiving cavity 13 on the glass substrate 1 can be formed by a molding die. Depending on actual needs, receiving cavities 13 of various specifications and sizes can be formed to match the electronic components 2 of corresponding sizes embedded inside.

[0055] The depth of the receiving cavity 13 is substantially the same as the thickness of the electronic component 21, allowing the electronic component 21 to be embedded within the glass substrate 1. In some embodiments, a gap 16 exists between the sidewall of the receiving cavity 13 and the electronic component 21. Encapsulation material can be filled into the gap 16 to form an encapsulation layer 6, encapsulating the electronic component 21 within the receiving cavity 13 to improve the stability of the electronic component 21. The surfaces of the encapsulation layer 6 and the electronic component 21 furthest from the conductive post 22 are flush with the first surface 11.

[0056] In some embodiments, the encapsulation layer 6 may be made of a resin encapsulation material capable of fully filling the gap 16, such as at least one of polyimide (PI), prepreg (PP), ajinomoto laminate (ABF), liquid crystal polymer (LCP), Teflon, polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the encapsulation layer 6 may be made of ABF.

[0057] A plurality of first through holes 15 are provided through the bottom surface 14 and the second surface 12, and a plurality of conductive posts 22 are provided on the electronic component 21. Each conductive post 22 extends out of the glass substrate 1 through a first through hole 15 so as to realize the electrical lead-out of the electronic component 2 from one side of the second surface 12.

[0058] The diameter of the first through hole 15 is larger than the outer diameter of the conductive post 22 so that the conductive post 22 can extend through the first through hole 15. Since there is no need to electroplate in the first through hole 15 to form a conductive hole, the dimensional accuracy requirement of the first through hole 15 is lower, which makes it easier to form the first through hole 15 and the forming difficulty is lower.

[0059] To facilitate the passage of the conductive post 22 through the first through-hole 15, the diameter of the first through-hole 15 is typically designed to be larger than the outer diameter of the conductive post 22. This creates a gap 4 between the sidewall of the glass substrate 1 corresponding to the first through-hole 15 and the conductive post 22. A filling layer 5 is provided within this gap 4. The filling layer 5 has a strong bond with the sidewall of the glass substrate 1, which can stably fix the conductive post 22 in the first through-hole 15, improving the stability of the electrical lead-out of the conductive post 22. In addition, forming a filling layer 5 within the gap 4 can also increase the toughness of the glass substrate 1 at the receiving cavity 13, reducing the risk of accidental breakage of the glass substrate 1 caused by the first through-hole 15.

[0060] In some embodiments, the filling layer 5 may be made of resin, capable of fully filling the gap 4. For example, at least one of polyimide (PI), prepreg (PP), ajinomoto laminate (ABF), liquid crystal polymer (LCP), Teflon, polyethylene terephthalate (PET), and polyethylene naphthalate (PEN) may be used. In this embodiment, the filling layer 5 may be made of ABF.

[0061] The surface of the conductive post 22 away from the electronic component 21 is flush with the second surface 12. The first circuit layer 3 can be disposed on the second surface 12 and extend to the surface of the conductive post 22 to achieve electrical connection with the conductive post 22, thereby enabling the electronic component 21 to be electrically led out to the first circuit layer 3 through the conductive post 22.

[0062] Please see Figure 3 As shown, please refer to the following: Figure 1 As shown, a conductive post 22 is directly provided on the electronic component 21 to enable electrical connection between the electronic component 21 and external circuitry. The height of the conductive post 22 can be designed according to actual needs; any excess height can be removed by grinding. This allows for the electrical lead-out of the electronic component 21 within a cavity 13 with a relatively large hole depth, making electrical lead-out more convenient, flexible, and simple. It simplifies the process of electrical lead-out of the electronic component 21, eliminating the need for traditional through-hole forming processes, and resulting in a more stable electrical connection, thus avoiding the problem of poor conductivity.

[0063] In some embodiments, the conductive post 22 is made of metal and can be soldered onto the electronic component 21. Specifically, the electronic component 21 has an output terminal, and the conductive post 22 can be soldered onto the output terminal.

[0064] In some embodiments, the ratio of the diameter to the height of the conductive post 22 can be designed according to actual needs. The ratio of the diameter to the height of the conductive post 22 can be very small, that is, a slender conductive post 22 can be provided on the electronic component 21. Compared with the thickness of the overall glass substrate 1, the thickness between the bottom surface 14 and the second surface 12 is thinner, and there is no need to perform electroplating operation in the first through hole 15. The aperture of the first through hole 15 can be very small, thereby improving the wiring density.

[0065] Please refer to it again. Figure 1 As shown, the circuit board structure 100 further includes a second wiring layer 7 located on the first surface 11. The second wiring layer 7 extends to the surface of the electronic component 21 away from the conductive post 22, and the second wiring layer 7 is electrically connected to the first wiring layer 3. The second wiring layer 7 can be simultaneously arranged on the surface of the electronic component 21, meaning wiring can be implemented on the opening side of the receiving cavity 13. This significantly increases wiring density without increasing the volume of the circuit board structure 100, aligning with the miniaturization trend of electronic products.

[0066] In some embodiments, in order to enable the first circuit layer 3 and the second circuit layer 7 to conduct, a second through hole 17 can be provided through the first surface 11 and the second surface 12. The second through hole 17 is provided with a connecting portion 8, and the second circuit layer 7 is electrically connected to the first circuit layer 3 through the connecting portion 8.

[0067] In some embodiments, the connecting portion 8 may be made of metal or conductive paste.

[0068] Please refer to it again. Figure 1 As shown, the circuit board structure 100 may further include at least one third circuit layer 9 disposed on the surfaces of the first circuit layer 3 and the second circuit layer 7 to realize the multi-functionality of the circuit board structure 100.

[0069] The circuit board structure 100 provided in this application embodiment can effectively reduce the thickness and weight of the circuit board structure 100 by embedding the electronic component 2 within the glass substrate 1, thereby achieving a thin and compact circuit board structure 100. Furthermore, embedding the electronic component 2 within a relatively empty area of ​​the glass substrate 1 improves the space utilization of the glass substrate 1, increases the number of components on the surface of the glass substrate 1, and enhances the integration of the circuit board structure 100. By directly setting conductive posts 22 on the electronic component 2, the electronic component 21 can be electrically connected to external circuits, making electrical lead-out more convenient and flexible. This simplifies the electrical lead-out process of the electronic component 21, eliminating the need for traditional via forming processes. Moreover, the height and diameter of the conductive posts 22 can be designed according to actual needs, effectively increasing wiring density.

[0070] Moreover, the embedded electronic component 2 can effectively reduce electromagnetic interference, improve the reliability of the circuit board structure 100 and the stability of signal transmission, and also improve the heat dissipation performance of the electronic component 2, enabling the circuit board structure 100 to operate stably at higher operating temperatures.

[0071] In addition, wiring can be installed on the surface of electronic component 21 away from the conductive post 22 (i.e., the back side or non-working surface), which further increases the wiring density.

[0072] Please see Figure 4 As shown, please refer to the following: Figures 5 to 12 This application also provides a method for manufacturing a circuit board structure 100, which includes the following steps:

[0073] Step S1, as follows Figure 5 As shown, a receiving cavity 13 is formed on a glass substrate 1. The glass substrate 1 includes a first surface 11 and a second surface 12 disposed opposite to each other. The opening of the receiving cavity 13 is located on the first surface 11.

[0074] A glass substrate 1 with a receiving cavity 13 can be formed using a contour-following mold. The depth, width, and other dimensions of the receiving cavity 13 can be designed according to actual needs.

[0075] Step S2, as follows Figure 6 As shown, a first through hole 15 is formed through the bottom surface 14 and the second surface 12 of the receiving cavity 13.

[0076] A first through-hole 15 can be formed on the glass substrate 1 according to actual needs using through-glass via (TGV) technology. As mentioned earlier, there are no special requirements for the dimensional accuracy of the first through-hole 15, which reduces the difficulty of drilling.

[0077] Step S3, as follows Figures 7 to 10As shown, an electronic component 2 is disposed in the receiving cavity 13. The electronic component 2 includes an electronic element 21 and a conductive post 22 disposed on the electronic element 21 and electrically connected to the electronic element 21. The electronic element 21 is located in the receiving cavity 13, and the conductive post 22 extends into the first through hole 15 and is exposed on the second surface 12.

[0078] Specifically, the depth of the receiving cavity 13 can be designed according to the thickness of the electronic component 21 to embed the electronic component 21 within the glass substrate 1. The electronic component 21 is electrically led out of the glass substrate 1 directly through the conductive post 22, eliminating the need for electroplating to form a conductive hole within the first through hole 15. This reduces the dimensional precision requirements of the first through hole 15, facilitating its formation and lowering the forming difficulty. Because drilling micro-holes in glass substrates is difficult in the prior art, and the subsequent electroplating of copper or filling with copper paste is complex, the diameter of the first through hole 15 in this application can be larger than the diameter of the conductive post 22 with lower precision requirements, reducing the difficulty of the drilling process. Subsequently, the electronic component 21 is directly electrically led out to the first circuit layer 3 via the conductive post 22 without requiring an additional plating process.

[0079] The length of the conductive post 22 can be made longer. Based on the actual depth of the first through hole 15, the part of the conductive post 22 that protrudes from the second surface 12 can be ground off, so that the surface of the conductive post 22 away from the electronic component 21 is flush with the second surface 12.

[0080] In some embodiments, the conductive post 22 is made of metal, and the conductive post 22 can be pre-installed on the electronic component 21 by welding.

[0081] In some embodiments, after the electronic component 2 is installed, there is a gap 4 between the sidewall of the glass substrate 1 corresponding to the first through hole 15 and the conductive post 22. The manufacturing method further includes:

[0082] like Figures 7 to 10 As shown, the gap 4 is filled with encapsulating material 10 to form a filling layer 5. Specifically, the filling material 10 is pressed onto the first surface 11. The encapsulating material 10 can fill the gap 4 through capillary action, filling the gap 4 completely. After the encapsulating material 10 is cured, the filling material 10 on the first surface 11 is ground off, exposing the first surface 11 and the conductive post 22, thereby forming a filling layer 5 in the gap 4.

[0083] In some embodiments, the encapsulation material 10 may be a resin encapsulation material capable of fully filling the gap 4, such as at least one selected from polyimide (PI), prepreg (PP), ajinomoto laminate (ABF), liquid crystal polymer (LCP), Teflon, polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the encapsulation material 10 may be ABF.

[0084] In some embodiments, after the electronic component 21 is installed in the receiving cavity 13, a gap 16 exists between the glass substrate 1 and the sidewall of the receiving cavity 13 and the electronic component 21. Encapsulation material can be filled into the gap 16 to form an encapsulation layer 6, encapsulating the electronic component 21 within the receiving cavity 13 to improve the stability of the electronic component 21. Specifically, the encapsulation layer 6 protruding from the first surface 11 can be removed by polishing to expose the first surface 11 and the electronic component 21. The encapsulation material filling the gap 16 can be the same as the encapsulation material 10 filling the gap 4.

[0085] During the filling of gap 4, there will also be some gaps 16 between electronic component 21 and bottom surface 14 of cavity 13. At this time, the encapsulation material 10 can overflow into the gaps 16 between electronic component 21 and bottom surface 14 and sidewall of cavity 13, thereby filling the gaps 16.

[0086] Step S4, as follows Figures 11 to 15 As shown, a first circuit layer 3 is formed on the second surface 12, and the first circuit layer 3 is electrically connected to the conductive post 22, thereby obtaining the circuit board structure 100.

[0087] In step S4, the method further includes forming a second circuit layer 7 on the first surface 11, the second circuit layer 7 extending to the surface of the electronic component 21 away from the conductive post 22, and the second circuit layer 7 being electrically connected to the first circuit layer 3.

[0088] The specific manufacturing methods for the first circuit layer 3 and the second circuit layer 7 include the following steps:

[0089] Step S41, as follows Figure 11 As shown, a second through hole 17 is formed through the first surface 11 and the second surface 12.

[0090] The second through-hole 17 can be formed by using TGV technology to penetrate the glass substrate 1.

[0091] Step S42, as follows Figure 12 and Figure 13As shown, a first metal layer 20 is electroplated on the wall of the second through hole 17, the first surface 11, and the second surface 12, and a connecting portion 8 located in the second through hole 17, a second metal layer 30 located on the first surface 11, and a third metal layer 40 located on the second surface 12 are formed by electroplating on the surface of the first metal layer 20.

[0092] Step S43, as follows Figure 14 and Figure 15 As shown, the second metal layer 30 and the third metal layer 40 are thinned, and the second metal layer 30 is patterned to form a first circuit layer 3 on the second surface 12, and the third metal layer 40 is patterned to form a second circuit layer 7 on the first surface 11. The second circuit layer 7 is electrically connected to the first circuit layer 3 through the connecting portion 8. The second circuit layer 7 is also located on the surface of the electronic component 21. This allows for a significant increase in wiring density without increasing the volume of the circuit board structure 100, aligning with the miniaturization trend of electronic products.

[0093] After step S43, refer to Figure 1 As shown, at least one third circuit layer 9 is formed on the surfaces of the first circuit layer 3 and the second circuit layer 7 by layering, so as to realize the multifunctionality of the circuit board structure 100.

[0094] Compared to existing technologies, the method for manufacturing the circuit board structure 100 provided in this application embodiment effectively reduces the thickness and weight of the circuit board structure 100 by embedding the electronic component 2 within the glass substrate 1, achieving a thinner and more compact circuit board structure 100. Simultaneously, it improves the space utilization of the glass substrate 1 and increases the integration density of the circuit board structure 100. By directly setting the conductive post 22 on the electronic component 2 to achieve conductivity between the electronic component 21 and external circuits, electrical lead-out is more convenient, operation is more flexible and simple, and the process of electrical lead-out of the electronic component 21 is simplified, eliminating the need for traditional glass via forming processes and reducing the difficulty of forming micro-holes on the glass. Moreover, wiring can be performed on the surface of the electronic component 21 away from the conductive post 22 (i.e., the back side or non-working surface), further increasing wiring density. Furthermore, the manufacturing method of the circuit board structure 100 in this application embodiment is simple in process, easy to operate, low in cost, and facilitates large-scale mass production.

Claims

1. A circuit board structure, characterized in that, include: A glass substrate includes a first surface and a second surface disposed opposite to each other. A receiving cavity is provided on the glass substrate. The opening of the receiving cavity is located on the first surface. A first through hole is provided through the bottom surface and the second surface of the receiving cavity. An electronic component includes an electronic element and a conductive post disposed on and electrically connected to the electronic element, the electronic element being located within the receiving cavity, the conductive post extending into the first through hole and exposed on the second surface; as well as The first circuit layer is located on the second surface and is electrically connected to the conductive post.

2. The circuit board structure as described in claim 1, characterized in that, There is a gap between the sidewall of the glass substrate corresponding to the first through hole and the conductive post, and a filling layer is provided in the gap.

3. The circuit board structure as described in claim 1, characterized in that, It also includes a second circuit layer located on the first surface, the second circuit layer extending to the surface of the electronic component away from the conduction post, and the second circuit layer being electrically connected to the first circuit layer.

4. The circuit board structure as described in claim 3, characterized in that, A second through hole is provided through the first surface and the second surface, and a connecting portion is provided in the second through hole. The second circuit layer is electrically connected to the first circuit layer through the connecting portion.

5. The circuit board structure as described in claim 1, characterized in that, The conductive post is made of metal and is welded onto the electronic component.

6. The circuit board structure as described in claim 1, characterized in that, The surface of the conductive post furthest from the electronic component is flush with the second surface; and / or The surface of the electronic component away from the conductive post is flush with the first surface.

7. A method for manufacturing a circuit board structure, characterized in that, include: A receiving cavity is formed on a glass substrate, the glass substrate including a first surface and a second surface disposed opposite to each other, and the opening of the receiving cavity is located on the first surface; A first through hole is formed through the bottom surface and the second surface of the receiving cavity; An electronic component is disposed within the receiving cavity. The electronic component includes an electronic element and a conductive post disposed on and electrically connected to the electronic element. The electronic element is located within the receiving cavity, and the conductive post extends into the first through hole and is exposed on the second surface. as well as A first circuit layer is formed on the second surface, and the first circuit layer is electrically connected to the conductive post, thereby obtaining the circuit board structure.

8. The method for manufacturing the circuit board structure as described in claim 7, characterized in that, There is a gap between the sidewall of the glass substrate corresponding to the first through hole and the conductive post. Before the step of forming the first circuit layer on the second surface, the manufacturing method further includes: The gap is filled with encapsulating material to form a filling layer.

9. The method for manufacturing the circuit board structure as described in claim 7, characterized in that, The step of forming the first circuit layer on the second surface further includes: A second circuit layer is formed on the first surface, the second circuit layer extends to the surface of the electronic component away from the conduction post, and the second circuit layer is electrically connected to the first circuit layer.

10. The method for manufacturing the circuit board structure as described in claim 7, characterized in that, The conductive post is made of metal and is attached to the electronic component by welding.

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