A gas spraying plate for improving wafer film uniformity

Abstract

The application is suitable for the technical field of semiconductor manufacturing equipment, and provides a gas spraying disc for improving wafer film uniformity, which comprises a shell, a gas inlet and a micropore array plate arranged at the top and bottom of the shell respectively, a multilayer flow guide assembly arranged between the gas inlet and the micropore array plate, the multilayer flow guide assembly comprising three layers of flow guide plates arranged in sequence along the direction of the gas flow, and the three layers of flow guide plates being a first flow guide plate, a second flow guide plate and a third flow guide plate respectively, a plurality of through holes being formed in the first flow guide plate, the second flow guide plate and the third flow guide plate, and the opening rate of each layer of flow guide plate being in an increasing distribution along the radial direction from the central area to the edge area, and the problem of the center being thick and the edge being thin caused by the gas inertia in the traditional design being effectively solved through the synergistic effect of the three-layer series flow guide structure.

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