Speaker and electronic device

Abstract

The embodiment of the present application provides a kind of loudspeaker and electronic equipment.The loudspeaker includes frame, vibration component and magnetic circuit system.Vibration component includes diaphragm and voice coil.The periphery of diaphragm is connected to frame.The voice coil is connected to diaphragm.The magnetic circuit system includes first magnetic circuit component and second magnetic circuit component.The first magnetic circuit component and the second magnetic circuit component are stacked along the thickness direction of diaphragm.The first magnetic circuit component is spaced apart from diaphragm.The first magnetic circuit component has magnetic gap.The voice coil is inserted into the magnetic gap.The second magnetic circuit component is arranged on the side of the first magnetic circuit component facing the diaphragm.The second magnetic circuit component and the diaphragm are arranged along the first direction perpendicular to the thickness direction.The loudspeaker of the embodiment of the present application can ensure that the loudspeaker has good sound quality and improves the sound experience.

Description

[0001] This application is a divisional application. The original application has the application number 202311169860.3 and the original application date is September 8, 2023. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of terminal technology, and in particular to a speaker and an electronic device. Background Technology

[0003] Speakers are commonly used electroacoustic transducers. They are typically found in electronic devices such as mobile phones, laptops, and tablets. Speakers are used to output sound signals. Electronic devices can play music or ringtones through their speakers. Because electronic devices need to be portable and user-friendly, they tend to be designed to be thin and light. However, in these thin and light electronic devices, the sound quality of the speakers can sometimes be subpar, affecting the overall user experience. Summary of the Invention

[0004] This application provides a speaker and an electronic device that can ensure the speaker has good sound quality and improve the sound experience.

[0005] The first aspect of this application provides a loudspeaker, which includes a frame, a vibrating component, and a magnetic circuit system.

[0006] The vibrating assembly includes a diaphragm and a voice coil. The periphery of the diaphragm is connected to the frame. The voice coil is connected to the diaphragm. The magnetic circuit system includes a first magnetic circuit assembly and a second magnetic circuit assembly. The first and second magnetic circuit assemblies are stacked along the thickness direction of the diaphragm. The first magnetic circuit assembly is spaced apart from the diaphragm. The first magnetic circuit assembly has a magnetic gap. The voice coil is inserted into the magnetic gap. The second magnetic circuit assembly is disposed on the side of the first magnetic circuit assembly facing the diaphragm. The second magnetic circuit assembly and the diaphragm are arranged along a first direction perpendicular to the thickness direction.

[0007] The loudspeaker of this embodiment includes a vibrating component and a magnetic circuit system. The magnetic circuit system is a driving system for driving the diaphragm to vibrate. The vibrating component is a vibrating system for generating sound signals. The magnetic circuit system includes a first magnetic circuit component and a second magnetic circuit component. The first and second magnetic circuit components are stacked along the thickness direction of the diaphragm, and the second magnetic circuit component is disposed along a first direction perpendicular to the thickness direction. Since the diaphragm and the second magnetic circuit component are distributed along the first direction, rather than being stacked along the thickness direction of the diaphragm, the diaphragm and the second magnetic circuit component can share the space above the first magnetic circuit component. Therefore, the space occupied by the second magnetic circuit component is relatively small in the thickness direction of the diaphragm, which is beneficial to achieving a relatively small overall thickness of the loudspeaker. The overall volume of the magnetic circuit system formed by the first and second magnetic circuit components is relatively large, resulting in a relatively large magnetic field strength generated by the first and second magnetic circuit components together. The first and second magnetic circuit components can respectively concentrate the magnetic field to the magnetic gap to enhance the magnetic field strength at the magnetic gap. The first and second magnetic circuit components can jointly apply a large driving force to the diaphragm and the voice coil, which is beneficial to ensure that the loudspeaker has a large output power. Therefore, the speaker in this application embodiment can achieve miniaturization while having the ability to apply a large driving force to the diaphragm, thereby ensuring that the speaker has good sound quality and improving the sound experience.

[0008] In one possible implementation, along the thickness direction, the second magnetic circuit assembly is flush with the surface of the diaphragm facing away from the first magnetic circuit assembly. This allows for a reduction in the overall size of the speaker in the thickness direction, facilitating speaker miniaturization, provided that both the first and second magnetic circuit assemblies meet the magnetic field strength requirements.

[0009] In one possible implementation, along the thickness direction, the second magnetic circuit assembly extends beyond the surface of the diaphragm facing away from the first magnetic circuit assembly, making the overall volume of the second magnetic circuit assembly relatively large. This allows the first and second magnetic circuit assemblies to generate a relatively large magnetic field strength, which is beneficial for increasing the driving force applied to the diaphragm and improving the sound quality produced by the diaphragm.

[0010] In one possible implementation, the second magnetic circuit assembly is alternately arranged with the diaphragm along the first direction.

[0011] In one possible implementation, diaphragms are respectively disposed on both sides of the second magnetic circuit assembly along the first direction.

[0012] The effective radiation area (Sd) of each diaphragm is relatively small, so the arrangement of multiple diaphragms is beneficial for the speaker to achieve good low-frequency output sensitivity.

[0013] In one possible implementation, a voice coil connects the diaphragms on both sides of the second magnetic circuit assembly.

[0014] The voice coil is situated within the magnetic field jointly generated by the first and second magnetic circuit components. When a changing current is input to the voice coil within this magnetic field, it moves under the influence of the magnetic force, simultaneously driving the diaphragms on both sides of the second magnetic circuit component to vibrate. The diaphragms on both sides of the second magnetic circuit component reciprocate simultaneously, causing the air to vibrate and produce sound. This arrangement, where the diaphragms on both sides of the second magnetic circuit component share a single voice coil, improves the synchronicity of the diaphragm drive, ensuring good vibration synchronization and thus contributing to high-quality sound from the loudspeaker.

[0015] In one possible implementation, the diaphragm includes an annular outer frame and spacers. The spacers are located within the annular outer frame. Along a first direction, a second magnetic circuit assembly is disposed between two adjacent spacers, and the periphery of the diaphragm is connected to the annular outer frame and the spacers.

[0016] In one possible implementation, the spacer includes a first connecting segment and a second connecting segment spaced apart. A clearance notch is formed between the first connecting segment and the second connecting segment. The clearance notch avoids the voice coil. The first connecting segment is connected to an annular outer frame. At least one of a first magnetic circuit assembly and a second magnetic circuit assembly is connected to the second connecting segment.

[0017] The clearance notch of the spacer avoids the voice coil of the vibrating component, so that the voice coil will not interfere with the frame position during the movement of the voice coil cutting the magnetic field lines in the thickness direction of the diaphragm.

[0018] In one possible implementation, the second magnetic circuit assembly has a clearance slot. The clearance slot is provided corresponding to a clearance notch. The clearance slot clears the voice coil.

[0019] The clearance slot of the second magnetic circuit assembly avoids the voice coil, so that the voice coil will not interfere with the position of the second magnetic circuit assembly during the movement of the voice coil cutting the magnetic field lines in the thickness direction of the diaphragm.

[0020] In one possible implementation, voice coils are respectively disposed on both sides of the second magnetic circuit assembly along a first direction. The voice coils located on the same side of the second magnetic circuit assembly are connected to the diaphragm.

[0021] The diaphragms on both sides of the second magnetic circuit assembly are each equipped with a voice coil. Therefore, the voice coil does not need to cross the second magnetic circuit assembly and the spacer. As a result, the second magnetic circuit assembly and the spacer do not need to be equipped with an additional avoidance structure, which helps to simplify the structure of the second magnetic circuit assembly and the spacer and reduce the processing difficulty of the second magnetic circuit assembly and the spacer.

[0022] In one possible implementation, both the voice coil and the diaphragm are symmetrically arranged relative to the second magnetic circuit assembly, ensuring that their respective structures and dimensions are identical. When two identical voice coils drive two identical diaphragms to vibrate, the vibration states of the two identical diaphragms tend to be similar, which helps to ensure that the loudspeaker has good sound quality.

[0023] In one possible implementation, second magnetic circuit components are respectively disposed on both sides of the diaphragm along the first direction.

[0024] The arrangement of multiple second magnetic circuit components is beneficial to enhance the magnetic field strength generated jointly by the first and second magnetic circuit components, thereby improving the driving capability of the magnetic circuit system.

[0025] In one possible implementation, the second magnetic circuit assemblies on both sides of the diaphragm are arranged symmetrically with respect to the diaphragm.

[0026] The symmetrical arrangement of the second magnetic circuit components helps to ensure good consistency of magnetic field strength at various positions of the magnetic gap in the magnetic circuit system, thereby ensuring good consistency of the magnetic force on the voice coil, improving the stability of the diaphragm vibration process, ensuring the stability of the vibration direction of the diaphragm center, and reducing the possibility of the diaphragm center deviating from the thickness direction of the diaphragm.

[0027] In one possible implementation, the frame includes an annular outer frame and spacers. The spacers are located within the annular outer frame. A diaphragm is disposed between two adjacent spacers. The periphery of the diaphragm is connected to the annular outer frame and the spacers. A second magnetic circuit assembly is disposed between the spacers and the annular outer frame.

[0028] In one possible implementation, the first magnetic circuit assembly includes a first magnetically conductive plate, a first magnet, and a second magnetically conductive plate. Along the thickness direction, the first magnet is disposed between the first and second magnetically conductive plates. A magnetic gap is formed between the first magnetically conductive plate and the first magnet. Magnetic gaps are formed between adjacent first magnets. Magnetic gaps are formed between adjacent second magnetically conductive plates. The second magnetic circuit assembly is disposed on the second magnetically conductive plate.

[0029] In one possible implementation, the second magnetic circuit assembly includes a second magnet. The second magnet is disposed corresponding to the second magnetic plate. The magnetization direction of the first magnet is opposite to that of the corresponding second magnet, thereby facilitating the first and second magnetic circuit assemblies to concentrate the magnetic field into the magnetic gap, thereby enhancing the magnetic field strength at the magnetic gap. After the voice coil disposed in the corresponding magnetic gap is energized, the voice coil is subjected to a magnetic field force (i.e., Lorentz force) along the thickness direction of the diaphragm, so that the voice coil moves to cut magnetic field lines in the thickness direction of the diaphragm, thereby driving the diaphragm to vibrate.

[0030] In one possible implementation, the vibrating assembly further includes an adapter. The adapter connects the voice coil and the diaphragm. The voice coil is located on the side of the adapter facing away from the diaphragm.

[0031] Adapters can increase the distance between the voice coil and the diaphragm. Adapters can elevate the voice coil, allowing it to insert more into the magnetic gap, ensuring that the voice coil does not completely exit the magnetic gap as it moves along the thickness of the diaphragm, cutting through the magnetic field lines.

[0032] In one possible implementation, the adapter is a ring-shaped structure. At least a portion of the adapter is disposed between the voice coil and the diaphragm.

[0033] In one possible implementation, the loudspeaker also includes a flexible circuit board. The flexible circuit board is connected to the frame. The flexible circuit board is electrically connected to the voice coil.

[0034] Compared to connecting the voice coil to the main board via external wires or leads from the voice coil itself, using a flexible circuit board to electrically connect the voice coil and the main board helps ensure the overall electrical reliability of the vibrating assembly. Flexible circuit boards are easily deformed under stress. Because the voice coil reciprocates along the thickness of the diaphragm after being energized, the flexible circuit board does not exert significant resistance on the voice coil, thus helping to ensure the stability of the voice coil and diaphragm's vibration direction.

[0035] In one possible implementation, the loudspeaker also includes a housing. A frame, a resonating assembly, and a magnetic circuit system are disposed within the housing. The frame is connected to the housing. A first magnetic circuit assembly is connected to the housing.

[0036] A second aspect of this application provides an electronic device including a housing and a speaker as described in the above embodiment. The housing includes a sound outlet. The speaker is disposed within the housing. The speaker is positioned corresponding to the sound outlet. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0038] Figure 2 A partially exploded view of the electronic device provided in an embodiment of this application;

[0039] Figure 3 A partial cross-sectional view of the electronic device provided in an embodiment of this application;

[0040] Figure 4 A partial structural schematic diagram of a loudspeaker provided in an embodiment of this application;

[0041] Figure 5 This is a partially exploded view of a loudspeaker provided in an embodiment of this application;

[0042] Figure 6 for Figure 4A schematic diagram of the cross-sectional structure along the WW direction;

[0043] Figure 7 for Figure 4 A schematic diagram of the cross-sectional structure along the KK direction;

[0044] Figure 8 for Figure 7 Enlarged view of point P in the middle;

[0045] Figure 9 A partially exploded view of a loudspeaker provided in another embodiment of this application;

[0046] Figure 10 for Figure 6 Enlarged view of point M in the middle;

[0047] Figure 11 A partially exploded view of a loudspeaker provided in another embodiment of this application;

[0048] Figure 12 A partially exploded view of a loudspeaker provided in another embodiment of this application;

[0049] Figure 13 This is a partial cross-sectional view of a loudspeaker provided in an embodiment of this application.

[0050] Figure label:

[0051] 10. Electronic devices;

[0052] 20. Display screen;

[0053] 30. Outer shell; 31. Mid-frame; 32. Back cover;

[0054] 40. Motherboard;

[0055] 50. Electronic components;

[0056] 60. Battery;

[0057] 70. Loudspeaker;

[0058] 80. Sink stand; 81. Circular outer frame; 82. Spacer strip; 82a. Clearance notch; 821. First connecting section; 822. Second connecting section;

[0059] 90. Vibration components;

[0060] 91. Diaphragm; 911. Periphery; 912. Bending section; 913. Center section;

[0061] 92. Voice coil;

[0062] 93. Reinforcing plate;

[0063] 94. Adapter; 941. Recess;

[0064] 100. Magnetic circuit system; 100a. Magnetic gap;

[0065] 110. First magnetic circuit assembly; 111. First magnetic conductive plate; 111a. Base plate; 111b. Side plate; 112. First magnet; 113. Second magnetic conductive plate;

[0066] 120. Second magnetic circuit assembly; 120a. Clearance slot; 121. Second magnet;

[0067] 200. Flexible circuit board;

[0068] 300, Housing; 300a, Sound outlet; 300b, Pressure relief vent; 310, Receiving frame; 320, Cover plate;

[0069] X, first direction;

[0070] Y, the second direction;

[0071] Z, thickness direction. Detailed Implementation

[0072] The electronic devices in this application embodiment can be referred to as user equipment (UE) or terminals, etc. For example, electronic devices can be portable Android devices (PADs), personal digital assistants (PDAs), handheld devices with wireless communication capabilities, computing devices, in-vehicle devices, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical care, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, wireless terminals in smart homes, and other mobile or fixed terminals. This application embodiment does not specifically limit the form of the terminal device.

[0073] In the embodiments of this application, Figure 1 The structure of electronic device 10 is shown schematically. See also Figure 1As shown, the example described is a handheld device with wireless communication capabilities, specifically electronic device 10. A handheld device with wireless communication capabilities could be, for example, a mobile phone.

[0074] Figure 2 The partial exploded structure of the electronic device 10 is shown schematically. Figure 3 A partial cross-sectional view of the electronic device 10 is shown schematically. See also Figure 2 and Figure 3 As shown, the electronic device 10 of this application embodiment includes a display screen 20, a housing 30, a motherboard 40, and electronic components 50.

[0075] The display screen 20 has a display area for displaying image information. The display screen 20 is mounted on the housing 30, and the display area of ​​the display screen 20 is exposed to facilitate the presentation of image information to the user. The motherboard 40 is connected to the housing 30 and is located inside the display screen 20, so that the motherboard 40 is not easily visible to the user from the outside of the electronic device 10.

[0076] Electronic device 50 is mounted on motherboard 40. Motherboard 40 can be a printed circuit board (PCB). Electronic device 50 is soldered to motherboard 40 using a soldering process. Electronic device 50 includes, but is not limited to, a central processing unit (CPU), an intelligent algorithm chip, or a power management IC (PMIC). Because the internal space of electronic device 10 is relatively small, electronic device 50 can be integrated on motherboard 40 to significantly reduce the size of motherboard 40 and lower its space occupancy rate.

[0077] This application describes an embodiment of an electronic device 10 including a display screen 20 as an example. The housing 30 includes a mid-frame 31 and a back cover 32. The display screen 20 is disposed on the mid-frame 31. The mid-frame 31 has a receiving space. A motherboard 40 can be disposed within the receiving space. The back cover 32 is connected to the mid-frame 31. The display screen 20 and the back cover 32 are respectively disposed on opposite sides of the mid-frame 31. Along the thickness direction of the electronic device 10, the mid-frame 31 is located between the display screen 20 and the back cover 32.

[0078] The electronic device 10 also includes a battery 60. A back cover 32 is located on one side of the battery 60. The back cover 32 is a cover that can cover the battery 60 on one side to shield it. The back cover 32 can be seen from the outside of the electronic device 10, but the battery 60 is not easily visible. The battery 60 is a structural component that can convert chemical energy into electrical energy. The battery 60 is used to provide power to the electronic device 10 to ensure its normal operation. For example, the battery 60 can provide power to the display screen 20 to display image information or complete corresponding operation commands, or the battery 60 can provide power to the motherboard 40 to ensure the normal operation of the electronic devices 50 on the motherboard 40. Exemplarily, the battery 60 can be a lithium-ion battery 60, such as a lithium iron phosphate battery 60. Exemplarily, the battery 60 can be disposed within the receiving space of the middle frame 31.

[0079] The electronic device 10 also includes a speaker 70. The speaker 70 is a transducer that converts electrical signals into sound signals. The speaker 70 can be a moving-coil speaker. The housing 30 of the electronic device 10 may be provided with a sound outlet. Exemplarily, the sound outlet may be provided on the mid-frame 31 of the electronic device 10. The speaker 70 is positioned corresponding to the sound outlet. The speaker 70 includes a diaphragm and a magnetic circuit system for driving the diaphragm to vibrate. The speaker 70 generates sound by driving the diaphragm to vibrate through the magnetic circuit system. The sound waves generated by the speaker 70 can propagate to the outside of the electronic device 10 through the sound outlet of the housing 30 for listening by a user. In the thickness direction of the electronic device 10, the speaker 70 occupies the internal space of the electronic device 10.

[0080] In related technologies, the magnetic circuit system of the speaker 70 is located below the diaphragm. The diaphragm covers the magnetic circuit system, so that the magnetic circuit system is not visible when viewed from the side of the diaphragm facing away from it. The magnetic circuit system is spaced apart from the diaphragm along its thickness direction. The magnetic circuit system includes a magnet. The magnet can be a permanent magnet. As the overall thickness of the electronic device 10 decreases, the space of the electronic device 10 in the thickness direction is compressed. In order to install the speaker 70 within the electronic device 10, the thickness of the speaker 70 itself also needs to be reduced. After the thickness of the speaker 70 itself is reduced, the thickness of the magnet in the magnetic circuit system will decrease accordingly. Therefore, the magnetic field strength generated by the magnetic circuit system decreases, which reduces the driving force exerted by the magnetic circuit system on the diaphragm, resulting in a decrease in the vibration amplitude of the diaphragm, thereby reducing the sound quality of the speaker 70 and resulting in a relatively poor sound experience.

[0081] In the loudspeaker 70 provided in this embodiment, the magnetic circuit system includes a first magnetic circuit assembly and a second magnetic circuit assembly. The first and second magnetic circuit assemblies work together to generate a relatively large magnetic field strength, which helps to increase the driving force applied to the diaphragm. The first magnetic circuit assembly and the diaphragm are stacked along the thickness direction of the diaphragm. The second magnetic circuit assembly and the diaphragm are distributed sequentially along a direction perpendicular to the thickness direction, so that the second magnetic circuit assembly and the diaphragm are arranged side-by-side, preventing the second magnetic circuit assembly from occupying excessive space in the thickness direction. Therefore, while ensuring a relatively small overall thickness of the loudspeaker 70, the magnetic circuit system can also apply a large driving force to the diaphragm, thereby ensuring that the loudspeaker 70 has good sound quality and improving the audio experience.

[0082] Figure 4 A partial structure of the speaker 70 is shown schematically. Figure 5 The partial exploded structure of the speaker 70 is shown schematically. Figure 6 for Figure 4 Cross-sectional view along the WW direction. See also Figure 4 , Figure 5 and Figure 6 As shown, the speaker 70 of this embodiment includes a frame 80 and a vibration assembly 90. The vibration assembly 90 is connected to the frame 80. The frame 80 supports the vibration assembly 90.

[0083] The vibrating assembly 90 includes a diaphragm 91 and a voice coil 92. The periphery 911 of the diaphragm 91 is connected to the frame 80 to fix the diaphragm 91 in a predetermined position. The periphery 911 of the diaphragm 91 may overlap the frame 80. Exemplarily, the periphery 911 of the diaphragm 91 may be glued to the frame 80. The voice coil 92 is connected to the diaphragm 91. After a changing current is input to the voice coil 92, which is in a magnetic field, the voice coil 92 can move under the action of the magnetic force, thereby causing the voice coil 92 to drive the diaphragm 91 to vibrate. The reciprocating motion of the diaphragm 91 drives the air to vibrate and produce sound, thus enabling the loudspeaker 70 to generate a sound signal.

[0084] The diaphragm 91 is a diaphragm structure with a relatively small thickness. Along the thickness direction of the diaphragm 91, the diaphragm 91 has opposing first and second surfaces. The voice coil 92 can be disposed on the second surface of the diaphragm 91. Exemplarily, the diaphragm 91 may include an annular bend 912. The cross-section of the bend 912 can be arc-shaped. The bend 912 can protrude towards the first magnetic circuit assembly. The periphery 911 of the diaphragm 91 is located outside the bend 912. The periphery 911 of the diaphragm 91 has a flat structure. The portion of the diaphragm 91 located inside the bend 912 is the central portion 913. The central portion 913 of the diaphragm 91 has a flat structure. The voice coil 92 is disposed on the central portion 913.

[0085] Exemplarily, the vibrating assembly 90 may further include a reinforcing plate 93. The reinforcing plate 93 covers the central portion 913 to increase the stiffness of the central portion 913 and improve its structural stability. Exemplarily, the reinforcing plate 93 may be bonded to the central portion 913. There may be one reinforcing plate 93. The reinforcing plate 93 and the voice coil 92 are respectively disposed on both sides of the diaphragm 91.

[0086] The loudspeaker 70 also includes a magnetic circuit system 100. The magnetic circuit system 100 includes a first magnetic circuit assembly 110 and a second magnetic circuit assembly 120. The first magnetic circuit assembly 110 and the second magnetic circuit assembly 120 are stacked along the thickness direction Z of the diaphragm 91. The first magnetic circuit assembly 110 is spaced apart from the diaphragm 91. A voice coil 92 is disposed on the side of the diaphragm 91 facing the first magnetic circuit assembly 110. The first magnetic circuit assembly 110 has a magnetic gap 100a. The voice coil 92 of the vibrating assembly 90 is inserted into the magnetic gap 100a. A gap exists between the voice coil 92 and the wall of the magnetic gap 100a, which helps to avoid positional interference caused by contact between the voice coil 92 and the first magnetic circuit assembly 110. The second magnetic circuit assembly 120 is disposed on the side of the first magnetic circuit assembly 110 facing the diaphragm 91. The second magnetic circuit assembly 120 and the diaphragm 91 are disposed along a first direction X perpendicular to the thickness direction Z. Exemplarily, the first direction X may be the length direction of the loudspeaker 70. Exemplarily, the second magnetic circuit assembly 120 is exposed outside the vibrating assembly 90. When viewed along the thickness direction Z of the diaphragm 91 on the side of the diaphragm 91 facing away from the first magnetic circuit assembly 110, the second magnetic circuit assembly 120 and the diaphragm 91 can be observed, but the first magnetic circuit assembly 110 and the voice coil 92 cannot be observed. Exemplarily, the vibrating assembly 90 does not cover the second magnetic circuit assembly 120, that is, along the thickness direction Z of the diaphragm 91, the orthographic projection of the second magnetic circuit assembly 120 does not overlap with the orthographic projection of the diaphragm 91.

[0087] The first magnetic circuit assembly 110 and the second magnetic circuit assembly 120 can respectively concentrate the magnetic field to the magnetic gap 100a to enhance the magnetic field strength at the magnetic gap 100a. After the voice coil 92 corresponding to the magnetic gap 100a is energized, the voice coil 92 is subjected to a magnetic field force (i.e., Lorentz force) along the thickness direction Z of the diaphragm 91, so that the voice coil 92 cuts the magnetic field lines along the thickness direction Z of the diaphragm 91, thereby driving the diaphragm 91 to vibrate.

[0088] The loudspeaker 70 of this embodiment includes a vibration assembly 90 and a magnetic circuit system 100. The magnetic circuit system 100 is a drive system for driving the diaphragm 91 to vibrate. The vibration assembly 90 is a vibration system for generating sound signals. The magnetic circuit system 100 includes a first magnetic circuit assembly 110 and a second magnetic circuit assembly 120. The first magnetic circuit assembly 110 and the second magnetic circuit assembly 120 are stacked along the thickness direction Z of the diaphragm 91, and the second magnetic circuit assembly 120 is disposed with the diaphragm 91 along a first direction X. The first direction X is perpendicular to the thickness direction Z. Since the diaphragm 91 and the second magnetic circuit assembly 120 are distributed along the first direction X, instead of being stacked along the thickness direction Z of the diaphragm 91, the diaphragm 91 and the second magnetic circuit assembly 120 can share the space above the first magnetic circuit assembly 110. Therefore, the space occupied by the second magnetic circuit assembly 120 in the thickness direction Z of the diaphragm 91 is relatively small, which is beneficial to achieving a relatively small overall thickness of the loudspeaker 70. The overall volume of the magnetic circuit system 100 formed by the first magnetic circuit assembly 110 and the second magnetic circuit assembly 120 is relatively large, resulting in a relatively large magnetic field strength generated jointly by the first magnetic circuit assembly 110 and the second magnetic circuit assembly 120. The first magnetic circuit assembly 110 and the second magnetic circuit assembly 120 can respectively concentrate the magnetic field to the magnetic gap 100a, thereby enhancing the magnetic field strength at the magnetic gap 100a. The first magnetic circuit assembly 110 and the second magnetic circuit assembly 120 can jointly apply a large driving force to the diaphragm 91 and the voice coil 92, which is beneficial to ensuring that the speaker 70 has a large output power. Therefore, the speaker 70 of this embodiment can achieve miniaturization while simultaneously having the ability to apply a large driving force to the diaphragm 91, thereby ensuring that the speaker 70 has good sound quality and improving the audio experience.

[0089] See also some of the possible implementation methods. Figure 6 As shown, along the thickness direction Z of the diaphragm 91, the second magnetic circuit assembly 120 extends beyond the surface of the diaphragm 91 facing away from the first magnetic circuit assembly 110. This results in a relatively large overall volume of the second magnetic circuit assembly 120, allowing both the first and second magnetic circuit assemblies 110 to generate a relatively large magnetic field strength. This is beneficial for increasing the driving force applied to the diaphragm 91 and improving the sound quality produced by the diaphragm 91. There is a height difference between the second magnetic circuit assembly 120 and the diaphragm 91. For example, the dimension of the second magnetic circuit assembly 120 extending beyond the diaphragm 91 can be greater than the maximum amplitude of the diaphragm 91.

[0090] In some examples, the diaphragm 91 includes a bend 912. The bend 912 protrudes toward the first magnetic circuit assembly 110. The second magnetic circuit assembly 120 extends beyond the center 913 of the diaphragm 91 and faces away from the surface of the first magnetic circuit assembly 110.

[0091] In some examples, the diaphragm 91 includes a bend 912. The bend 912 protrudes away from the first magnetic circuit assembly 110. The second magnetic circuit assembly 120 extends beyond the bend 912 of the diaphragm 91 onto the surface away from the first magnetic circuit assembly 110.

[0092] In some feasible ways, along the thickness direction Z of the diaphragm 91, the second magnetic circuit assembly 120 can be flush with the surface of the diaphragm 91 facing away from the first magnetic circuit assembly 110. This is beneficial for reducing the overall size of the speaker 70 in the thickness direction Z, and facilitates the miniaturization of the speaker 70, provided that the first magnetic circuit assembly 110 and the second magnetic circuit assembly 120 meet the magnetic field strength requirements.

[0093] In some examples, the diaphragm 91 includes a bend 912. The bend 912 protrudes toward the first magnetic circuit assembly 110. The second magnetic circuit assembly 120 may be flush with the surface of the center portion 913 of the diaphragm 91 facing away from the first magnetic circuit assembly 110.

[0094] In some examples, the diaphragm 91 includes a bend 912. The bend 912 protrudes away from the first magnetic circuit assembly 110. The second magnetic circuit assembly 120 may be flush with the surface of the bend 912 facing away from the first magnetic circuit assembly 110.

[0095] In some feasible implementations, the second magnetic circuit assembly 120 and the diaphragm 91 are alternately arranged along the first direction X. The second magnetic circuit assembly 120 and the diaphragm 91 are distributed sequentially along the first direction X. The second magnetic circuit assembly 120 and the diaphragm 91 are arranged adjacent to each other. In some examples, the total number of the second magnetic circuit assembly 120 and the diaphragm 91 can be more than three.

[0096] See in some examples Figure 4 and Figure 6 As shown, diaphragms 91 are respectively disposed on both sides of the second magnetic circuit assembly 120 along the first direction X. The number of diaphragms 91 can be greater than the number of second magnetic circuit assemblies 120. The effective radiation area (Sd) of each diaphragm 91 is relatively small, thus the arrangement of multiple diaphragms 91 is beneficial for the speaker 70 to achieve good low-frequency external discharge sensitivity. For example, the total number of second magnetic circuit assemblies 120 and diaphragms 91 can be three. The number of second magnetic circuit assemblies 120 can be one. The number of diaphragms 91 can be two. Along the first direction X, one diaphragm 91 is disposed on each side of one second magnetic circuit assembly 120.

[0097] See in some examples Figure 5 and Figure 6As shown, a voice coil 92 connects the diaphragms 91 on both sides of the second magnetic circuit assembly 120, meaning that the diaphragms 91 on both sides of the second magnetic circuit assembly 120 can share a single voice coil 92. One diaphragm 91 of the second magnetic circuit assembly 120 is connected to a portion of the voice coil 92, and the other diaphragm 91 is connected to a portion of the voice coil 92. The second magnetic circuit assembly 120 avoids the middle portion of the voice coil 92. Exemplarily, a diaphragm 91 is provided on each side of a second magnetic circuit assembly 120, and both diaphragms 91 are connected to the same voice coil 92.

[0098] In this embodiment, the voice coil 92 is located in the magnetic field jointly generated by the first magnetic circuit assembly 110 and the second magnetic circuit assembly 120. After a changing current is input to the voice coil 92 in the magnetic field, the voice coil 92 can move under the action of the magnetic force, thereby simultaneously driving the diaphragms 91 on both sides of the second magnetic circuit assembly 120 to vibrate. The diaphragms 91 on both sides of the second magnetic circuit assembly 120 move back and forth simultaneously to drive the air to vibrate and produce sound. The arrangement of the diaphragms 91 on both sides of the second magnetic circuit assembly 120 sharing a single voice coil 92 can help improve the synchronization of the driving of the diaphragms 91 on both sides of the second magnetic circuit assembly 120, ensuring good vibration synchronization of the diaphragms 91 on both sides of the second magnetic circuit assembly 120, thereby helping to ensure good sound quality of the speaker 70.

[0099] In some examples, the voice coil 92 and the diaphragm 91 are symmetrically arranged relative to the second magnetic circuit assembly 120, such that the diaphragms 91 on both sides of the second magnetic circuit assembly 120 have the same structure and size, and the connection portions of the voice coil 92 to the two diaphragms 91 have the same structure and size. When one voice coil 92 simultaneously drives two identical diaphragms 91 to vibrate, the vibration states of the two identical diaphragms 91 tend to be the same, which helps to ensure that the loudspeaker 70 has good sound quality.

[0100] See in some examples Figure 5 and Figure 6 As shown, the basin frame 80 includes an annular outer frame 81 and spacers 82. The spacers 82 are located inside the annular outer frame 81. Along the first direction X, a second magnetic circuit assembly 120 is disposed between two adjacent spacers 82, and the periphery 911 of the diaphragm 91 is connected to the annular outer frame 81 and the spacers 82. The distance between the diaphragm 91 connected to the basin frame 80 and the first magnetic circuit assembly 110 can be greater than the maximum amplitude of the diaphragm 91, so that the diaphragm 91 will not come into contact with the first magnetic circuit assembly 110 when it vibrates.

[0101] In some examples, the spacer 82 includes a first connecting segment 821 and a second connecting segment 822. A clearance notch 82a is formed between the first connecting segment 821 and the second connecting segment 822. The clearance notch 82a of the spacer 82 avoids the voice coil 92 of the vibrating assembly 90, so that the voice coil 92 will not interfere with the frame 80 during its movement cutting magnetic field lines in the thickness direction Z of the diaphragm 91. The first connecting segment 821 is connected to the annular outer frame 81. At least one of the first magnetic circuit assembly 110 and the second magnetic circuit assembly 120 is connected to the second connecting segment 822.

[0102] The first connecting segment 821 and the second connecting segment 822 of the spacer 82 can be spaced apart along the second direction Y. The first direction X can be perpendicular to the second direction Y. The second direction Y can be perpendicular to the thickness direction Z of the diaphragm 91.

[0103] Exemplarily, the first magnetic circuit assembly 110 can be connected to the spacer 82. During the assembly of the frame 80 and the magnetic circuit system 100, the spacer 82 can serve a positioning function, facilitating quick and accurate installation of the second magnetic circuit assembly 120. Exemplarily, the first magnetic circuit assembly 110 and the spacer 82 can be connected by adhesive bonding.

[0104] For example, a spacer 82 includes two first connecting segments 821 and a second connecting segment 822. Along the second direction Y, a second connecting segment 822 is located between the two first connecting segments 821.

[0105] In some examples, Figure 7 for Figure 4 Cross-sectional view along the KK direction. Figure 8 for Figure 7 Enlarged view of point P in the middle. See also Figure 5 , Figure 7 and Figure 8 As shown, the second magnetic circuit assembly 120 has a clearance groove 120a. Along the first direction X, the clearance groove 120a of the second magnetic circuit assembly 120 is provided corresponding to the clearance notch 82a of the spacer 82. Along the thickness direction Z, the clearance groove 120a of the second magnetic circuit assembly 120 is provided corresponding to the magnetic gap 100a of the first magnetic circuit assembly 110. The clearance groove 120a of the second magnetic circuit assembly 120 avoids the voice coil 92, so that during the movement of the voice coil 92 cutting the magnetic field lines in the thickness direction Z of the diaphragm 91, the voice coil 92 will not interfere with the position of the second magnetic circuit assembly 120.

[0106] By providing a clearance notch 82a in the spacer 82 and a clearance groove 120a in the second magnetic circuit assembly 120, the voice coil 92 can utilize the space formed by the clearance notch 82a and the clearance groove 120a in the thickness direction Z of the diaphragm 91. This helps to reduce the space occupied by the voice coil 92 in the thickness direction Z of the diaphragm 91, which in turn helps to reduce the overall thickness of the loudspeaker 70 and facilitates the miniaturization design of the loudspeaker 70.

[0107] In some examples, the resonant assembly 90 also includes an adapter 94. The adapter 94 connects the voice coil 92 and the diaphragm 91. The voice coil 92 is located on the side of the adapter 94 facing away from the diaphragm 91. The adapter 94 can increase the distance between the voice coil 92 and the diaphragm 91. The adapter 94 can elevate the voice coil 92, allowing it to be inserted more fully into the magnetic gap 100a, ensuring that the voice coil 92 does not completely exit the magnetic gap 100a during its movement cutting magnetic field lines in the thickness direction Z of the diaphragm 91.

[0108] For example, the voice coil 92 is bonded to the adapter 94. The adapter 94 is bonded to the diaphragm 91. The adapter 94 may be a metal component.

[0109] In some examples, the adapter 94 can be a ring structure. At least part of the adapter 94 is disposed between the voice coil 92 and the diaphragm 91.

[0110] For example, see Figure 5 and Figure 8 As shown, the adapter 94 matches the shape of the voice coil 92. Along the thickness direction Z of the diaphragm 91, one adapter 94 and one voice coil 92 are stacked. The adapter 94 is entirely disposed between the voice coil 92 and the diaphragm 91. Exemplarily, along the thickness direction Z of the diaphragm 91, the orthographic projection of the adapter 94 can be located within the orthographic projection of the voice coil 92. One adapter 94 connects the diaphragms 91 on both sides of the second magnetic circuit assembly 120; that is, the diaphragms 91 on both sides of the second magnetic circuit assembly 120 can share one adapter 94. The clearance notch 82a of the spacer 82 and the clearance groove 120a of the second magnetic circuit assembly 120 avoid the adapter 94.

[0111] By way of example, the adapter 94 has a recess 941. The recess 941 of the adapter 94 is provided corresponding to the bend 912 of the diaphragm 91. The recess 941 of the adapter 94 is used to avoid the bend 912.

[0112] For example, Figure 9 A partial exploded view of the loudspeaker 70 is schematically shown. See also Figure 9As shown, adapters 94 are respectively provided on both sides of the diaphragm 91 of the second magnetic circuit assembly 120. One adapter 94 is provided on the side of each diaphragm 91 facing the first magnetic circuit assembly 110. The adapter 94 is connected to the center 913 of the diaphragm 91. Both adapters 94 are connected to the same voice coil 92. The voice coil 92 synchronously drives the two diaphragms 91 to vibrate through the two adapters 94. The adapters 94 can transmit the force generated by the voice coil 92 to the center 913 of the diaphragm 91 in a relatively balanced manner, so that the diaphragm 91 is subjected to relatively balanced force, which helps to ensure the stability of the vibration direction of the center 913 of the diaphragm 91 and reduces the possibility of the center 913 of the diaphragm 91 being skewed relative to the thickness direction Z of the diaphragm 91. The adapter 94 is located between the spacer 82 and the annular outer frame 81. The adapter 94 is positioned within the space enclosed by the spacer 82 and the annular outer frame 81. A portion of the adapter 94 is located between the voice coil 92 and the diaphragm 91.

[0113] For example, the voice coil 92 can be rectangular. The adapter 94 can also be rectangular. Three sides of the adapter 94 are connected to the voice coil 92, while one side near the spacer 82 is not connected to the voice coil 92.

[0114] In some examples, Figure 10 for Figure 6 Enlarged view at point M. See also Figure 5 , Figure 8 and Figure 10 As shown, the first magnetic circuit assembly 110 includes a first magnetic plate 111, a first magnet 112, and a second magnetic plate 113. Along the thickness direction Z of the diaphragm 91, the first magnet 112 is disposed between the first magnetic plate 111 and the second magnetic plate 113. The second magnetic circuit assembly 120 is disposed on the second magnetic plate 113. A magnetic gap 100a is formed between the first magnetic plate 111 and the first magnet 112. A magnetic gap 100a is formed between adjacent first magnets 112. A magnetic gap 100a is formed between adjacent second magnetic plates 113. At least a portion of the voice coil 92 is located within the magnetic gap 100a.

[0115] The first magnetic plate 111 and the second magnetic plate 113 can conduct magnetism, which helps to increase the magnetic induction intensity at the magnetic gap 100a. At the same time, they cover the first magnet 112, which helps to prevent magnetic leakage and increase the magnetic flux. The first magnetic plate 111 and the second magnetic plate 113 can be magnetically conductive materials, which helps to enhance the overall magnetic field strength of the first magnetic circuit assembly 110. Therefore, while the first magnetic circuit assembly 110 generates the same magnetic field strength, the thickness of the first magnet 112 can be reduced, which helps to reduce the thickness of the speaker 70.

[0116] Exemplarily, the first magnetic plate 111 includes a connected base plate 111a and a side plate 111b. A first magnet 112 is disposed on the base plate 111a. The edge of the base plate 111a extends beyond the first magnet 112. A magnetic gap 100a is formed between the side plate 111b and the first magnet 112. The edge of the second magnetic plate 113 may be flush with the edge of the first magnet 112. The edge of the second magnetic plate 113 does not extend beyond the edge of the first magnet 112.

[0117] For example, the top surface of the side plate 111b of the first magnetic plate 111 facing the diaphragm 91 is flush with the surface of the second magnetic plate 113 facing the diaphragm 91.

[0118] For example, the first magnetic plate 111 is bonded to the first magnet 112. The second magnetic plate 113 is bonded to the first magnet 112. The second magnetic circuit assembly 120 is bonded to the second magnetic plate 113.

[0119] For example, the first magnet 112 may be a permanent magnet.

[0120] For example, in the first direction X, the second magnetic circuit assembly 120 is disposed in the middle region of the second magnetic plate 113. In the second direction Y, the edge of the second magnetic circuit assembly 120 is flush with the edge of the first magnetic circuit assembly 110. The second magnetic circuit assembly 120 does not extend beyond the edge of the first magnetic circuit assembly 110.

[0121] In some examples, the second magnetic circuit assembly 120 includes a second magnet 121. The second magnet 121 is disposed on the second magnetic plate 113. The magnetization direction of the first magnet 112 is opposite to that of the corresponding second magnet 121, which facilitates the first magnetic circuit assembly 110 and the second magnetic circuit assembly 120 to concentrate the magnetic field to the magnetic gap 100a, thereby enhancing the magnetic field strength at the magnetic gap 100a. After the voice coil 92 disposed in the corresponding magnetic gap 100a is energized, the voice coil 92 is subjected to a magnetic field force (i.e., Lorentz force) along the thickness direction Z of the diaphragm 91, so that the voice coil 92 cuts the magnetic field lines along the thickness direction Z of the diaphragm 91, thereby driving the diaphragm 91 to vibrate. The magnetization direction refers to the direction from one pole of the magnet to the other, for example, from the N pole to the S pole.

[0122] For example, the second magnetic circuit assembly 120 includes three second magnets 121. The three second magnets 121 are in contact with each other. The first magnetic circuit assembly 110 includes three second magnetic plates 113. One second magnet 121 is disposed corresponding to one second magnetic plate 113.

[0123] For example, the second magnet 121 can be a permanent magnet. The second magnet 121 is bonded to the second magnetic plate 113.

[0124] For example, the first magnet 112 can be a cuboid or a cube. The second magnet 121 can be a cuboid or a cube. The annular outer frame 81 of the frame 80 can be a rectangular structure. The diaphragm 91 can be a rectangular structure.

[0125] In some feasible ways, Figure 11 A partial exploded view of the loudspeaker 70 is schematically shown. See also Figure 11 As shown, voice coils 92 are respectively disposed on both sides of the second magnetic circuit assembly 120 along the first direction X. The voice coils 92 and diaphragms 91 located on the same side of the second magnetic circuit assembly 120 are connected. Since the diaphragms 91 on both sides of the second magnetic circuit assembly 120 are each provided with a separate voice coil 92, the voice coil 92 does not need to cross the second magnetic circuit assembly 120 and the spacer 82. Therefore, the second magnetic circuit assembly 120 and the spacer 82 do not require additional clearance structures, which simplifies the structure of the second magnetic circuit assembly 120 and the spacer 82 and reduces the processing difficulty of the second magnetic circuit assembly 120 and the spacer 82. For example, a diaphragm 91 is disposed on both sides of a second magnetic circuit assembly 120, and a voice coil 92 is disposed below each diaphragm 91.

[0126] The two voice coils 92 are situated within the magnetic field jointly generated by the first magnetic circuit assembly 110 and the second magnetic circuit assembly 120. After a changing current is input to each of the two voice coils 92 within the magnetic field, the two voice coils 92 can move under the influence of the magnetic force, thereby simultaneously driving the diaphragms 91 on both sides of the second magnetic circuit assembly 120 to vibrate. The diaphragms 91 on both sides of the second magnetic circuit assembly 120 reciprocate simultaneously, driving air vibration to produce sound.

[0127] In some examples, the frame 80 includes an annular outer frame 81 and spacers 82. The spacers 82 are located within the annular outer frame 81. Both ends of the spacers 82 are connected to the annular outer frame 81. Along a first direction X, a second magnetic circuit assembly 120 is disposed between two adjacent spacers 82, and the periphery 911 of a diaphragm 91 located on one side of the second magnetic circuit assembly 120 is connected to the annular outer frame 81 and the spacers 82. The voice coil 92 is positioned corresponding to the space formed by the spacers 82 and the annular outer frame 81.

[0128] In some examples, the vibrating assembly 90 also includes an adapter 94. The adapter 94 can be a ring structure. The shape of the adapter 94 matches that of the voice coil 92. Along the thickness direction Z of the diaphragm 91, one adapter 94 and one voice coil 92 are stacked. Each diaphragm 91 corresponds to one adapter 94 and one voice coil 92.

[0129] In some examples, the first magnetic circuit assembly 110 includes a first magnetic plate 111, a first magnet 112, and a second magnetic plate 113. The first magnet 112 and the second magnetic plate 113 are correspondingly disposed below the voice coil 92. The first magnet 112 and the second magnetic plate 113 are correspondingly disposed below the second magnetic circuit assembly 120. Magnetic gaps 100a are formed between the first magnetic plate 111 and the first magnet 112, between two adjacent first magnets 112, and between two adjacent second magnetic plates 113. Voice coils 92 are respectively disposed on both sides of the second magnetic circuit assembly 120. A magnetic gap 100a is correspondingly disposed below each voice coil 92.

[0130] For example, three first magnets 112 may be disposed on a first magnetic plate 111. A second magnetic plate 113 may be disposed on each first magnet 112.

[0131] In some examples, both the voice coil 92 and the diaphragm 91 are symmetrically arranged relative to the second magnetic circuit assembly 120, so that the voice coil 92 and the diaphragm 91 have the same structure and size. When two identical voice coils 92 drive two identical diaphragms 91 to vibrate, the vibration states of the two identical diaphragms 91 tend to be the same, which helps to ensure that the loudspeaker 70 has good sound quality.

[0132] In some feasible ways, Figure 12 A partial exploded view of the loudspeaker 70 is schematically shown. See also Figure 12 As shown, along the first direction X, second magnetic circuit components 120 are respectively arranged on both sides of the diaphragm 91. The number of second magnetic circuit components 120 can be greater than the number of diaphragms 91. The arrangement of multiple second magnetic circuit components 120 is beneficial to enhance the magnetic field strength jointly generated by the first magnetic circuit component 110 and the second magnetic circuit component 120, thereby improving the driving capability of the magnetic circuit system 100. For example, the total number of second magnetic circuit components 120 and diaphragms 91 can be three. The number of second magnetic circuit components 120 can be two. The number of diaphragms 91 can be one. Along the first direction X, one second magnetic circuit component 120 is respectively arranged on both sides of a diaphragm 91.

[0133] In some examples, a voice coil 92 is disposed below the diaphragm 91. A first magnetic circuit assembly 110 has a magnetic gap 100a corresponding to the voice coil 92. Exemplarily, the voice coil 92 is connected to the diaphragm 91 via an adapter 94. An adapter 94 and a voice coil 92 are disposed below the diaphragm 91. The shape of the voice coil 92 matches the shape of the adapter 94. Exemplarily, the voice coil 92 may be rectangular. The adapter 94 may be rectangular.

[0134] In some examples, the second magnetic circuit assemblies 120 on both sides of the diaphragm 91 are symmetrically arranged with respect to the diaphragm 91. This symmetrical arrangement of the second magnetic circuit assemblies 120 helps ensure good consistency of the magnetic field strength at various positions of the magnetic gap 100a in the magnetic circuit system 100, thereby ensuring good consistency of the magnetic force on the voice coil 92, improving the stability of the diaphragm 91's vibration process, ensuring the stability of the vibration direction of the center portion 913 of the diaphragm 91, and reducing the possibility of the center portion 913 of the diaphragm 91 being skewed relative to the thickness direction Z of the diaphragm 91.

[0135] In some examples, the frame 80 includes an annular outer frame 81 and spacers 82. The spacers 82 are located within the annular outer frame 81. A diaphragm 91 is disposed between two adjacent spacers 82. The diaphragm 91 covers the space between two adjacent spacers 82. The periphery 911 of the diaphragm 91 is connected to the annular outer frame 81 and the spacers 82. A second magnetic circuit assembly 120 is disposed between the spacers 82 and the annular outer frame 81. The distance between the diaphragm 91 and the first magnetic circuit assembly 110 can be greater than the maximum amplitude of the diaphragm 91, so that the diaphragm 91 will not come into contact with the first magnetic circuit assembly 110 when it vibrates.

[0136] The second magnetic circuit assembly 120 can be connected to the spacer 82 and the annular outer frame 81. During the assembly of the frame 80 and the magnetic circuit system 100, the spacer 82 serves a positioning function, facilitating quick and accurate installation of the second magnetic circuit assembly 120. Exemplarily, the second magnetic circuit assembly 120 and the spacer 82, as well as the second magnetic circuit assembly 120 and the annular outer frame 81, can be connected by adhesive bonding. The first magnetic circuit assembly 110 and the spacer 82 can also be connected by adhesive bonding.

[0137] In some examples, the first magnetic circuit assembly 110 includes a first magnetic plate 111, a first magnet 112, and a second magnetic plate 113. The first magnet 112 and the second magnetic plate 113 are correspondingly disposed below the voice coil 92. The first magnet 112 and the second magnetic plate 113 are correspondingly disposed below the second magnetic circuit assembly 120. A magnetic gap 100a is provided in the first magnetic circuit assembly 110 corresponding to the voice coil 92. Magnetic gaps 100a are formed between adjacent first magnets 112 and between adjacent second magnetic plates 113.

[0138] For example, three first magnets 112 may be disposed on a first magnetic plate 111. A second magnetic plate 113 is disposed on each first magnet 112. A second magnetic circuit assembly 120 is disposed above the two outer second magnetic plates 113 respectively. The middle second magnetic plate 113 is disposed corresponding to the diaphragm 91.

[0139] For example, the second magnetic circuit assembly 120 includes a second magnet 121. The second magnet 121 is disposed on the second magnetic conductive plate 113. The magnetization direction of the first magnet 112 is opposite to that of the corresponding second magnet 121, which helps the first magnetic circuit assembly 110 and the second magnetic circuit assembly 120 to concentrate the magnetic field to the magnetic gap 100a, thereby enhancing the magnetic field strength at the magnetic gap 100a. After the voice coil 92 disposed in the corresponding magnetic gap 100a is energized, the voice coil 92 is subjected to a magnetic field force (i.e., Lorentz force) along the thickness direction Z of the diaphragm 91, so that the voice coil 92 cuts the magnetic field lines along the thickness direction Z of the diaphragm 91, thereby driving the diaphragm 91 to vibrate.

[0140] In some feasible ways, Figure 13 A partial cross-sectional view of the speaker 70 is shown schematically. See also Figure 13 As shown, the loudspeaker 70 also includes a flexible printed circuit board (FPCB) 200. The FPCB 200 is connected to the frame 80. The FPCB 200 is electrically connected to the voice coil 92. The voice coil 92 can be electrically connected to the main board 40 via the FPCB 200. Compared to connecting the voice coil 92 to the main board 40 via external wires or wires extending from the voice coil 92 itself, the method of electrically connecting the voice coil 92 to the main board 40 via the FPCB 200 helps ensure the overall electrical reliability of the vibrating assembly 90. The FPCB 200 is easily deformed under stress. Since the voice coil 92 reciprocates in the thickness direction Z of the diaphragm 91 after being energized, the FPCB 200 does not exert significant resistance on the voice coil 92, thus helping to ensure the stability of the vibration direction of the voice coil 92 and the diaphragm 91.

[0141] In some implementations, the loudspeaker 70 also includes a housing 300. A frame 80, a resonating assembly 90, and a magnetic circuit system 100 are disposed within the housing 300. The frame 80 is connected to the housing 300. A first magnetic circuit assembly 110 is connected to the housing 300. The housing 300 has a sound outlet 300a. Sound waves generated by the diaphragm 91 of the resonating assembly 90 can be transmitted to the outside of the housing 300 through the sound outlet 300a.

[0142] In some examples, the housing 300 includes a receiving frame 310 and a cover plate 320. A frame 80, a vibrating assembly 90, and a magnetic circuit system 100 are disposed within the receiving frame 310. The frame 80 and the receiving frame 310 can be connected by adhesive bonding. The receiving frame 310 and the cover plate 320 are detachably connected. The diaphragm 91 faces the cover plate 320. The cover plate 320 can contact the second magnetic circuit assembly 120. A sound outlet 300a can be provided on the cover plate 320. A pressure relief hole 300b can be provided on the receiving frame 310.

[0143] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0144] The embodiments described herein are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0145] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, systems, products, or devices.

[0146] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship between the preceding and following related objects.

[0147] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0148] It is understood that, in the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

1. A loudspeaker, characterized in that, include: Sink stand; A vibrating assembly includes a diaphragm and a voice coil, wherein the periphery of the diaphragm is connected to the frame and the voice coil is connected to the diaphragm; A magnetic circuit system includes a first magnetic circuit assembly and a second magnetic circuit assembly. The first magnetic circuit assembly and the second magnetic circuit assembly are stacked along the thickness direction of the diaphragm. The first magnetic circuit assembly and the diaphragm are spaced apart along the thickness direction. The second magnetic circuit assembly is disposed on the side of the first magnetic circuit assembly facing the diaphragm. The second magnetic circuit assembly and the diaphragm are disposed along a first direction perpendicular to the thickness direction.

2. The loudspeaker according to claim 1, characterized in that, Along the thickness direction, the second magnetic circuit assembly is flush with the surface of the diaphragm facing away from the first magnetic circuit assembly; or, along the thickness direction, the second magnetic circuit assembly extends beyond the surface of the diaphragm facing away from the first magnetic circuit assembly.

3. The loudspeaker according to claim 1 or 2, characterized in that, Along the first direction, the second magnetic circuit assembly is alternately arranged with the diaphragm.

4. The loudspeaker according to claim 3, characterized in that, Along the first direction, the diaphragms are respectively disposed on both sides of the second magnetic circuit assembly.

5. The loudspeaker according to claim 4, characterized in that, The first magnetic circuit assembly has a magnetic gap, and the voice coil is inserted into the magnetic gap; One of the voice coils connects the diaphragms on both sides of the second magnetic circuit assembly.

6. The loudspeaker according to claim 5, characterized in that, The diaphragm includes an annular outer frame and spacers, the spacers being located within the annular outer frame. Along the first direction, the second magnetic circuit assembly is disposed between two adjacent spacers, and the periphery of the diaphragm is connected to the annular outer frame and the spacers.

7. The loudspeaker according to claim 6, characterized in that, The spacer includes a first connecting segment and a second connecting segment spaced apart, with an avoidance gap between the first connecting segment and the second connecting segment, the avoidance gap avoiding the voice coil, the first connecting segment being connected to the annular outer frame, and at least one of the first magnetic circuit assembly and the second magnetic circuit assembly being connected to the second connecting segment.

8. The loudspeaker according to claim 7, characterized in that, The second magnetic circuit assembly has a clearance groove, which is provided corresponding to the clearance notch, and the clearance groove avoids the voice coil.

9. The loudspeaker according to claim 4, characterized in that, Along the first direction, the voice coils are respectively disposed on both sides of the second magnetic circuit assembly, and the voice coils and the diaphragm located on the same side of the second magnetic circuit assembly are connected.

10. The loudspeaker according to claim 5 or 9, characterized in that, Both the voice coil and the diaphragm are symmetrically arranged relative to the second magnetic circuit assembly.

11. The loudspeaker according to claim 3, characterized in that, Along the first direction, the second magnetic circuit assembly is respectively disposed on both sides of the diaphragm.

12. The loudspeaker according to claim 11, characterized in that, The second magnetic circuit assemblies on both sides of the diaphragm are symmetrically arranged with respect to the diaphragm.

13. The loudspeaker according to claim 11, characterized in that, The basin frame includes an annular outer frame and spacers. The spacers are located inside the annular outer frame. The diaphragm is disposed between two adjacent spacers. The periphery of the diaphragm is connected to the annular outer frame and the spacers. The second magnetic circuit assembly is disposed between the spacers and the annular outer frame.

14. The loudspeaker according to any one of claims 9 to 13, characterized in that, The first magnetic circuit assembly includes a first magnetic plate, a first magnet, and a second magnetic plate. Along the thickness direction, the first magnet is disposed between the first magnetic plate and the second magnetic plate, and a magnetic gap is formed between the first magnetic plate and the first magnet. A magnetic gap is formed between adjacent first magnets and between adjacent second magnetic plates. The second magnetic circuit assembly is disposed on the second magnetic plate.

15. The loudspeaker according to claim 14, characterized in that, The second magnetic circuit assembly includes a second magnet, which is disposed corresponding to the second magnetic plate, and the magnetization direction of the first magnet is opposite to the magnetization direction of the corresponding second magnet.

16. The loudspeaker according to any one of claims 5 to 15, characterized in that, The vibration assembly also includes an adapter that connects the voice coil and the diaphragm, with the voice coil located on the side of the adapter facing away from the diaphragm.

17. The loudspeaker according to claim 16, characterized in that, The adapter is a ring structure, and at least a portion of the adapter is disposed between the voice coil and the diaphragm.

18. The loudspeaker according to any one of claims 1 to 17, characterized in that, The loudspeaker also includes a flexible circuit board connected to the frame and electrically connected to the voice coil.

19. The loudspeaker according to any one of claims 1 to 18, characterized in that, The loudspeaker also includes a housing, in which the frame, the vibration assembly, and the magnetic circuit system are disposed. The frame is connected to the housing, and the first magnetic circuit assembly is connected to the housing.

20. An electronic device, characterized in that, include: The outer casing, including the sound outlet; The loudspeaker as described in any one of claims 1 to 19, wherein the loudspeaker is disposed within the housing and the loudspeaker is disposed corresponding to the sound outlet.

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