Brazed parts

Abstract

The application relates to a reflow soldering part, which comprises a conductive bearing layer, a mask located on at least one side surface of the conductive bearing layer, the mask being provided with a first patterned groove and a second patterned groove, any one of the first patterned groove and the second patterned groove penetrating through the mask along the thickness direction of the mask, and a plating-resistant layer located on the surface of the conductive bearing layer facing the mask and located in the first patterned groove, the second patterned groove being used for gathering electroplating matters. The reflow soldering part can improve the reuse frequency and the service life, and is beneficial to controlling the cost of battery piece manufacturing.

Description

Technical Field

[0001] This application relates to the field of battery cell manufacturing technology, and in particular to a transfer welding component. Background Technology

[0002] With the development of solar cell technology, setting grid lines on the surface of the cell is beneficial for collecting charge carriers generated by the cell body, which can improve the photoelectric conversion efficiency of the cell.

[0003] In related technologies, in order to reduce the cost of manufacturing solar cell grid lines and save on silver paste usage, the grid lines can be manufactured separately and then connected to the solar cells, which can shorten the solar cell manufacturing process and reduce production costs.

[0004] However, in related technologies, when fabricating grid lines separately, the lifespan of the transfer bonding components is limited, resulting in limited cost control in cell manufacturing. Summary of the Invention

[0005] Based on this, the present application provides a transfer bonding component that can increase the number of times the transfer bonding component can be reused, extend the service life of the transfer bonding component, and help control the cost of battery cell manufacturing.

[0006] On one hand, embodiments of this application provide a transfer soldering component, including:

[0007] Conductive carrier layer;

[0008] A mask is located on at least one side surface of a conductive carrier layer. The mask has a first patterned groove and a second patterned groove, and either the first patterned groove or the second patterned groove penetrates the mask along the thickness direction of the mask.

[0009] The anti-plating layer is located on the surface of the conductive carrier layer facing the mask, and the anti-plating layer is located in the first patterned groove, and the second patterned groove is used to collect the electroplated material.

[0010] In one implementation, the anti-coating material includes aluminum.

[0011] In one implementation, the conductive carrier layer includes an aluminum plate, and the anti-plating layer is an aluminum oxide film on the surface of the aluminum plate, the thickness of which is 0.01μm~0.03μm.

[0012] In one implementation, the conductive carrier layer includes:

[0013] Supporting substrate;

[0014] A conductive layer is located on at least one side of a carrier substrate, and a mask is located on the side of the conductive layer opposite to the carrier substrate.

[0015] In one implementation, the conductive layer includes at least one of a metallic conductive layer and a non-metallic conductive layer.

[0016] In one implementation, masks are provided on both opposite sides of the conductive carrier layer.

[0017] In one implementation, the transfer component further includes a conductive transition film located within a second patterned groove;

[0018] The adhesion of electroplated material to the conductive transition film is less than that to the conductive carrier layer.

[0019] In one implementation, the conductive transition film includes at least one of a transparent conductive oxide film, a tunneling oxide layer, silicon oxide, and titanium oxide.

[0020] In one implementation, the transfer component includes a patterned area and an edge area surrounding the outer periphery of the patterned area; a first patterned groove is provided in one of the patterned area and the edge area, and a second patterned groove is provided in the patterned area.

[0021] In one implementation, the first graphic groove is located in the edge region, and the first graphic groove includes a strip-shaped groove.

[0022] The transfer bonding component provided in this application embodiment has a mask formed on at least one side surface of the conductive carrier layer, and a first patterned groove and a second patterned groove formed on the mask, either the first patterned groove or the second patterned groove penetrating the mask along its thickness direction. Thus, when the transfer bonding component is placed in an electroplating solution for electroplating, the electroplated material can be deposited and accumulated in the second patterned groove, thereby forming the grid lines or solder ribbons of the solar cell. In this application embodiment, an anti-plating layer is formed on the side surface of the conductive carrier layer facing the mask, and the anti-plating layer is placed in the first patterned groove. Thus, when the transfer bonding component is placed in an electroplating solution for electroplating, the anti-plating layer can reduce or minimize the electroplating deposition in the first patterned groove and facilitate the cleaning of the electroplated material in the first patterned groove; thus, after the grid lines or solder ribbons formed in the second patterned groove are transferred to the surface of the solar cell, there is no electroplated material residue on the transfer bonding component, allowing the transfer bonding component to be used multiple times, increasing its reusability and lifespan, and helping to control the cost of solar cell manufacturing. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a transfer welding component provided in some embodiments of this application.

[0024] Figure 2 This is another structural schematic diagram of the transfer soldering component provided in some embodiments of this application.

[0025] Figure 3This is another structural schematic diagram of the transfer welding component provided in some embodiments of this application.

[0026] Figure 4 This is another structural schematic diagram of the transfer welding component provided in some embodiments of this application.

[0027] Figure 5 This is another structural schematic diagram of the transfer welding component provided in some embodiments of this application.

[0028] Figure 6 This is another structural schematic diagram of the transfer welding component provided in some embodiments of this application.

[0029] Figure 7 This is another structural schematic diagram of the transfer welding component provided in some embodiments of this application.

[0030] Figure 8 This is another structural schematic diagram of the transfer welding component provided in some embodiments of this application.

[0031] Figure 9 This is a top view of a transfer soldering component provided in some embodiments of this application.

[0032] Figure 10 This is another top view of the transfer component provided in some embodiments of this application.

[0033] Figure 11 This is a schematic diagram of a process for transferring electroplated material from a transfer component to a battery cell, according to some embodiments of this application.

[0034] Figure 12 This is a schematic diagram of another process for transferring electroplated material from a transfer component to a battery cell, according to some embodiments of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1-Transfer welding component; 2-Battery cell;

[0037] 10 - Conductive carrier layer; 20 - Mask; 30 - Anti-plating layer; 40 - Conductive transition film; 50 - Pattern area; 60 - Edge area;

[0038] 11-Substrate; 12-Conductive layer; 21-First patterned groove; 22-Second patterned groove. Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0041] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0045] Figure 1 This is a schematic diagram of a transfer welding component provided in some embodiments of this application.

[0046] In some examples, refer to Figure 1 As shown, in view of the technical problems existing in the related art, this application provides a transfer bonding component 1. The transfer bonding component 1 may include a conductive carrier layer 10.

[0047] In some examples, at least a portion of the conductive carrier layer 10 may be made of a conductive material. Thus, the conductive carrier layer 10 can be suspended in an electroplating bath, an electroplating solution can be added to the bath, and then an electric current can be applied to the conductive carrier layer 10 to electroplat the metal in the electroplating solution, forming the desired electroplated structure.

[0048] In some examples, refer to Figure 1 As shown, the transfer bonding component 1 may include a mask 20. The mask 20 may be located on at least one surface of the conductive carrier layer 10. For example, the mask 20 may be disposed on one of the surfaces of the conductive carrier layer 10 along the thickness direction.

[0049] In some examples, refer to Figure 1 As shown, a first patterned groove 21 may be provided on the mask 20. The first patterned groove 21 can penetrate the mask 20 along the thickness direction. That is to say, the first patterned groove 21 can expose the conductive carrier layer 10 corresponding to the first patterned groove 21, which facilitates the electrical connection between the conductive carrier layer 10 and the electroplating electrode.

[0050] In some examples, the mask 20 can be made of an insulating material. That is, the mask 20 can insulate and isolate the non-plating areas on the conductive carrier layer 10, facilitating selective plating on the conductive carrier layer 10 and enabling control over the shape of the plating.

[0051] In some examples, the mask 20 may be made of a material resistant to electroplating chemicals.

[0052] In some examples, the mask 20 can be made of materials such as photoresist, polyimide, polyetheretherketone, polyphenylene sulfide, polytetrafluoroethylene, or epoxy resin.

[0053] In some examples, the first patterned groove 21 can be formed on the mask 20 by means of exposure development, screen printing or physical grooving.

[0054] In some examples, refer to Figure 1 As shown, the mask 20 may be provided with a second patterned groove 22. The second patterned groove 22 may penetrate the mask 20 along the thickness direction of the mask 20.

[0055] In some examples, the second graphic groove 22 may be configured in the same, similar or similar way to the first graphic groove 21. For details, please refer to the detailed description of the first graphic groove 21 in the foregoing embodiments of this application. This application will not repeat the details in the embodiments.

[0056] In some examples, the second patterned groove 22 can expose the conductive carrier layer 10, making it easier for the conductive carrier layer 10 to come into contact with the electroplating solution in the second patterned groove 22, thereby depositing the electroplated material in the electroplating solution into the second patterned groove 22 through electroplating.

[0057] In some examples, the first patterned groove 21 can serve as the connection location for the electroplating electrode. It is also commonly referred to as the plating area.

[0058] In some examples, during electroplating, the electroplating electrode (usually a cathode) is typically connected to the first patterned groove 21 of the transfer component 1, and the entire transfer component 1 is immersed in the electroplating solution before energizing. At this time, electroplating deposits easily form in both the first and second patterned grooves 21 and 22. After the electroplated material is transferred to the surface of the battery cell 2 to form the grid lines or solder ribbons of the battery cell 2, electroplating residues easily remain in the first patterned groove 21, affecting the connection of the electroplating electrode, reducing the number of times the transfer component 1 can be reused, and resulting in a limited lifespan for the transfer component 1.

[0059] In some examples, refer to Figure 1 As shown, the transfer component 1 may include an anti-plating layer 30. The anti-plating layer 30 may be located on the surface of the conductive carrier layer 10 facing the mask 20. The anti-plating layer 30 may be located within the first patterned groove 21.

[0060] In some examples, the anti-plating layer 30 may be disposed on the surface of the conductive carrier layer 10 corresponding to the first patterned groove 21.

[0061] In some examples, the anti-plating layer 30 may be provided on the remaining surfaces of the conductive carrier layer 10, except for the surface corresponding to the second patterned groove 22.

[0062] In some examples, refer to Figure 1 As shown, the surface of the conductive carrier layer 10 facing away from the mask 20 can be uniformly provided with an anti-plating layer 30. That is, on the two surfaces of the conductive carrier layer 10 facing the second patterned groove 22, the side facing away from the mask 20 can be provided with an anti-plating layer 30. The surface facing the second patterned groove 22, and the area located within the second patterned groove 22, may not be provided with an anti-plating layer 30.

[0063] In some examples, the anti-plating layer 30 can serve as a masking film to shield the surface of the conductive carrier layer 10 corresponding to the first patterned groove 21, thereby reducing the deposition of electroplated material in the first patterned groove 21. This facilitates the removal of electroplated material deposited in the first patterned groove 21 after the electroplated material in the second patterned groove 22 is transferred to the surface of the battery cell 2, thus increasing the number of times the transfer component 1 can be reused.

[0064] The transfer bonding component 1 provided in this application embodiment has a mask 20 provided on at least one side surface of the conductive carrier layer 10, and a first patterned groove 21 and a second patterned groove 22 provided on the mask 20. Either the first patterned groove 21 or the second patterned groove 22 penetrates the mask 20 along its thickness direction. Thus, when the transfer bonding component 1 is placed in an electroplating solution for electroplating, the electroplated material can be deposited and accumulated in the second patterned groove 22, thereby forming the grid lines or solder ribbons of the solar cell 2. In this application embodiment, an anti-plating layer 30 is provided on the conductive layer 12 on the side facing the mask 20, and the anti-plating layer 30 is disposed within the first patterned groove 21. Thus, when the transfer component 1 is placed in the electroplating solution for electroplating, the anti-plating layer 30 can reduce or minimize the electroplating deposition in the first patterned groove 21 and facilitate the cleaning of the electroplated material in the first patterned groove 21. Thus, after the grid lines or solder strips formed by electroplating in the second patterned groove 22 are transferred to the surface of the battery cell 2, there is no electroplating residue on the transfer component 1, and the transfer component 1 can be used multiple times, which can increase the number of times the transfer component 1 can be reused, extend the service life of the transfer component 1, and help control the cost of manufacturing the battery cell 2.

[0065] Figure 2 This is another structural schematic diagram of the transfer soldering component provided in some embodiments of this application. Figure 3 This is another structural schematic diagram of the transfer welding component provided in some embodiments of this application.

[0066] In some examples, refer to Figure 2 As shown, the material of the anti-plating layer 30 may include aluminum. For example, see reference... Figure 2 As shown, a mask 20 is formed on the conductive carrier layer 10, and after a first patterned groove 21 is formed on the mask 20, an anti-plating layer 30 can be formed in aluminum within the first patterned groove 21. The anti-plating layer 30 can be electrically connected to the conductive carrier layer 10.

[0067] In some examples of embodiments of this application, aluminum is used as the anti-plating layer 30. In this way, the reactive nature of aluminum, and its tendency to oxidize easily in air and form a dense oxide film on its surface, can be utilized to prevent the reduction deposition of metal ions on the surface of the anti-plating layer 30. Even if a small amount of metal ion reduction deposition occurs, its adhesion to the anti-plating layer 30 is extremely poor, making it easy to remove. Thus, after the electroplated material formed in the second patterned groove 22 is transferred to the surface of the battery cell 2, the transfer component 1 can be reused to form electroplated material again, increasing the number of times the transfer component 1 can be reused.

[0068] In some examples, refer to Figure 3 As shown, the material of the anti-plating layer 30 can include aluminum and aluminum oxide. That is, when the anti-plating layer 30 is formed in the first patterned groove 21, an aluminum sheet can be disposed in the first patterned groove 21 as the anti-plating layer 30. The aluminum sheet is electrically connected to the conductive carrier layer 10. The aluminum oxide naturally formed on the surface of the aluminum sheet can also be used as part of the anti-plating layer 30. In this way, the manufacturing process of the anti-plating layer 30 is simplified, the production and processing difficulty of the transfer welding component 1 is reduced, and the production and processing cost of the transfer welding component 1 is saved.

[0069] In some examples, refer to Figure 1 As shown, the conductive carrier layer 10 may include an aluminum plate. The anti-plating layer 30 may be an aluminum oxide film on the surface of the aluminum plate.

[0070] In some examples, the thickness of the alumina film can be 0.002 μm to 0.03 μm.

[0071] In some examples, the thickness of the alumina film can be 0.005 μm to 0.025 μm.

[0072] In some examples, the thickness of the alumina film can be 0.01 μm to 0.02 μm.

[0073] It is understood that the numerical values ​​and ranges involved in some examples of the embodiments of this application are approximate values, and may have a certain range of errors due to the influence of the manufacturing process. These errors can be considered negligible by those skilled in the art. In some examples, the alumina film can be an alumina film formed by natural oxidation on the surface of an aluminum plate. That is to say, in some examples of the embodiments of this application, an aluminum plate can be used as the conductive carrier layer 10, and the anti-plating layer 30 can be formed by utilizing the properties of aluminum itself. In this way, the processing and production process of the anti-plating layer 30 can be simplified, the production process of the transfer welding component 1 can be simplified, and the production and processing cost of the transfer welding component 1 can be saved.

[0074] In some examples, a conductive transition film 40 may be provided in the second patterned groove 22 to facilitate the electroplating formation of an electroplated product within the second patterned groove 22. The conductive transition film 40 can be formed on the surface of the conductive carrier layer 10 corresponding to the first patterned groove 21 after the second patterned groove 22 is formed. The conductive transition film 40 can protect the surface of the aluminum plate, improve conductivity, and facilitate the deposition of an electroplated product within the second patterned groove 22.

[0075] In some examples of embodiments of this application, an aluminum plate is used as the conductive carrier layer 10. This allows the aluminum oxide film on the surface of the aluminum plate to serve as an anti-plating film, with the thickness of the aluminum oxide film set to 0.01 μm to 0.03 μm. Thus, the thickness of the aluminum oxide film is within a suitable range, and during electroplating, anodic electrons can tunnel through the aluminum oxide film, ensuring the conductivity of the conductive carrier layer 10. Furthermore, by utilizing the inherent properties of aluminum and aluminum oxide to form the anti-plating layer 30 within the first patterned groove 21, the processing steps of the anti-plating layer 30 are simplified, thereby simplifying the production process of the transfer soldering component 1 and saving on the production costs of the transfer soldering component 1.

[0076] Figure 4 This is another structural schematic diagram of the transfer welding component provided in some embodiments of this application.

[0077] In some examples, refer to Figure 4 As shown, the transfer component 1 may include a conductive transition film 40. The conductive transition film 40 may be located within the second patterned groove 22.

[0078] In some examples, the conductive transition film 40 can be formed in the second patterned groove 22 by deposition after the second patterned groove 22 is formed.

[0079] In some examples of embodiments of this application, a conductive transition film 40 is provided within the second patterned groove 22. In this way, the conductive transition film 40 can protect the surface of the conductive carrier layer 10, improve conductivity, and facilitate the deposition of electroplated materials.

[0080] In some examples, the conductive transition film 40 located within the second patterned groove 22 is shown only as a specific example. In some examples, the conductive transition film 40 can be disposed in areas other than the region on the side surface corresponding to the first patterned groove 21 of the conductive carrier layer 10. For example, the conductive transition film 40 can be disposed entirely on the side surface of the conductive carrier layer 10 facing away from the mask 20, while the conductive transition film 40 can be disposed in all other regions on the side surface of the conductive carrier layer 10 facing the mask 20 except for the region corresponding to the first patterned groove 21. This facilitates the placement of the conductive transition film 40 and improves the production efficiency of the transfer bonding component 1.

[0081] In some examples, the adhesion of the electroplated material to the conductive transition film 40 may be less than that to the conductive carrier layer 10. Thus, after the electroplated material is formed in the second patterned groove 22, it is easier to separate the electroplated material from the transfer component 1 when it is transferred to the battery cell 2 via transfer soldering. This improves the success rate of transferring the electroplated material to the battery cell 2. It also ensures the integrity of the electroplated material transferred to the battery cell 2, thereby improving the yield of the battery cell 2.

[0082] In some examples, the conductive transition film 40 may include a transparent conductive oxide film. For example, the conductive transition film 40 may include at least one of indium tin oxide (ITO), indium tungsten oxide (IWO), indium cerium oxide (ICO), tin oxide (SnOx), and titanium nitride (TiNx).

[0083] In some examples, the conductive transition film 40 may include at least one of a tunneling oxide layer, silicon oxide, and titanium oxide.

[0084] It is understood that in some examples of the embodiments of this application, the specific type of conductive transition film 40 is only used as a specific example for illustration, and is not intended to limit the specific type of conductive transition film 40.

[0085] In some examples, the electroplated material may include at least one of the following materials: copper, nickel, titanium, silver, aluminum, etc.

[0086] In some examples, the plating material can be an alloy of nickel, copper, and tin.

[0087] Figure 5 This is another structural schematic diagram of the transfer welding component provided in some embodiments of this application. Figure 6 This is another structural schematic diagram of the transfer welding component provided in some embodiments of this application.

[0088] In some examples, refer to Figure 5 and Figure 6As shown, the conductive carrier layer 10 may include a carrier substrate 11. The carrier substrate 11 can serve as the carrier base for the transfer component 1, supporting other film layers. This ensures the hardness, flatness, and reusability of the entire transfer component 1.

[0089] In some examples, the substrate 11 may include at least one of a silicon wafer, glass, or a metal plate.

[0090] It is understood that in some examples of the embodiments of this application, the specific type of the carrier substrate 11 is only used as a specific example for illustration, and is not intended to limit the specific type of the carrier substrate 11.

[0091] In some examples, the conductive carrier layer 10 may include a conductive layer 12. The conductive layer 12 may be located on at least one side of the carrier substrate 11. The mask 20 may be located on the side of the conductive layer 12 opposite to the carrier substrate 11.

[0092] In other words, in some examples of the embodiments of this application, along the thickness direction of the transfer component 1 (e.g.) Figure 5 and Figure 6 (In the direction shown by the y-axis) The substrate 11, conductive layer 12 and mask 20 can be stacked sequentially.

[0093] In some examples, the conductive layer 12 provides electroplatability for the transfer component 1, ensuring the plating quality and thickness uniformity of each electroplated layer.

[0094] In some examples, conductive layer 12 may include a metallic conductive layer 12. For example, conductive layer 12 may include at least one of copper, nickel, titanium, silver, tin, and aluminum.

[0095] In some examples, the conductive layer 12 may include a non-metallic conductive layer 12. For example, the conductive layer 12 may include at least one of carbon nanotubes, graphene, ITO, titanium nitride (TiNx), and organic conductive polymer (PEDOT).

[0096] In some examples of embodiments of this application, the conductive layer 12 and the mask layer 20 are supported by a carrier substrate 11. This improves the hardness, flatness, and reusability of the transfer component 1 by adjusting the hardness and flatness of the carrier substrate 11. This increases the number of times the transfer component 1 can be reused and extends its service life.

[0097] Figure 7 This is another structural schematic diagram of the transfer welding component provided in some embodiments of this application. Figure 8 This is another structural schematic diagram of the transfer welding component provided in some embodiments of this application.

[0098] In some examples, refer to Figure 7 and Figure 8As shown, masks 20 can be provided on both sides of the conductive layer 12.

[0099] In other words, in some examples of embodiments of this application, the mask 20 may be provided with two layers, one of which may be located on one side of the conductive carrier layer 10, and the other of which may be located on the other side of the conductive carrier layer 10.

[0100] It is understood that in the embodiments of this application, the two layers of mask 20 may be set in the same, similar or similar ways. For details, please refer to the detailed description of the foregoing embodiments of this application. The embodiments of this application will not repeat the details.

[0101] In some examples of embodiments of this application, masks 20 are provided on both opposite sides of the conductive carrier layer 10. Thus, during electroplating, electroplating can be performed on both sides of the transfer bonding member 1 to form electroplated material. Therefore, when transferring the electroplated material to the surface of the battery cell 2, battery cells 2 can be provided on both sides of the same transfer bonding member 1, and transfer bonding members 1 can be provided on both sides of the same battery cell 2. Grid lines or solder ribbons can be transferred onto both surfaces of the same battery cell 2 simultaneously, or grid lines or solder ribbons can be transferred onto multiple battery cells 2 simultaneously. This improves the electroplating efficiency of the electroplated material and the transfer efficiency of the grid lines or solder ribbons on the battery cell 2, thereby improving the production efficiency of the battery cell 2.

[0102] Figure 9 This is a top view of a transfer soldering component provided in some embodiments of this application. Figure 10 This is another top view of the transfer component provided in some embodiments of this application.

[0103] In some examples, refer to Figure 9 and Figure 10 As shown, the transfer component 1 may include a pattern area 50 and an edge area 60 surrounding the outer periphery of the pattern area 50.

[0104] In some examples, the graphic area 50 may correspond to the location on the battery cell 2 where grid lines need to be set.

[0105] In some examples, the second graphic recess 22 may be located in the graphic area 50. The second graphic recess 22 may include... Figure 9 and Figure 10 The grid-shaped groove in the middle.

[0106] In some examples, the second patterned groove 22 may include a strip-shaped groove. It is understood that the specific configuration of the second patterned groove 22 can be tailored to the specific component 1 to be transferred. For example, if the electroplated material to be transferred to the battery cell 2 is a grid line, the second patterned groove 22 may be a grid-type patterned groove. If the electroplated material to be transferred to the battery cell 2 is a solder strip, the second patterned groove 22 may be a strip-shaped groove.

[0107] It is understood that the shape of the second graphic groove 22 is only used as an example to illustrate some specific examples, and is not intended to limit the specific shape of the second graphic groove 22.

[0108] In some examples, refer to Figure 9 and Figure 10 As shown, the first graphic groove 21 can be provided in either the graphic area 50 or the edge area 60.

[0109] In some examples, the first graphic groove 21 can be either a point groove or a surface groove. In some examples, refer to... Figure 10 As shown, when the first graphic groove 21 is provided in the graphic area 50, the first graphic groove 21 can be a dot groove, and the area of ​​the first graphic groove 21 can be smaller than the area between adjacent second graphic grooves 22. In this way, the situation where the first graphic groove 21 and the second graphic groove 22 are connected can be avoided, which makes it easier for the mask 20 to isolate the first graphic groove 21 and the second graphic groove 22.

[0110] In some examples, refer to Figure 9 As shown, the first graphic groove 21 may be located in the edge region 60. The first graphic groove 21 may include a strip-shaped groove.

[0111] It is understood that when the first graphic groove 21 is located in the edge region 60, the first graphic groove 21 can be a point groove or a surface groove. In some examples of embodiments of this application, the first graphic groove 21 includes a strip groove only as a specific example and is not intended to limit the shape of the first graphic groove 21.

[0112] In some examples of embodiments of this application, a second patterned groove 22 is formed in the patterned area 50 of the transfer component 1, and a first patterned groove 21 is formed in either the patterned area 50 or the edge area 60. This facilitates the arrangement of the first patterned groove 21 and the second patterned groove 22, and facilitates the electroplating of the transfer component 1 in the electroplating solution.

[0113] Figure 11 This is a schematic diagram of a process for transferring electroplated material from a transfer component to a battery cell, according to some embodiments of this application. Figure 12 This is a schematic diagram of another process for transferring electroplated material from a transfer component to a battery cell, according to some embodiments of this application.

[0114] In some examples, refer to Figure 11 and Figure 12 As shown, after electroplating is performed on the second patterned groove 22 of the transfer component 1 to form an electroplated material, the transfer component 1 can be aligned with the battery cell 2 (e.g., Figure 11 and Figure 12As shown in (a), the electroplated material is hot-pressed. During the hot-pressing process, the electroplated material is welded to the surface of the battery cell 2; after the transfer welding component 1 is removed, the electroplated material is welded to the surface of the battery cell 2 (e.g., as shown in (a)). Figure 11 and Figure 12 As shown in (b)). Figure 11 The diagram shown is a schematic of the process of transferring electroplated material to one side of the battery cell 2. Figure 12 The diagram shown is a schematic of the process of transferring electroplated material to both sides of the battery cell 2.

[0115] In some examples of embodiments of this application, by separately setting and fabricating the grid lines and directly connecting them to the surface of the solar cell 2 via transfer soldering, the manufacturing process and cost of copper electroplating in photovoltaic cells can be shortened. Furthermore, it can save on silver usage and cell metallization costs.

[0116] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0117] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A transfer welding component, characterized in that, include: Conductive carrier layer; A mask is located on at least one side surface of the conductive carrier layer. The mask has a first patterned groove and a second patterned groove, and either the first patterned groove or the second patterned groove penetrates the mask along the thickness direction of the mask. An anti-plating layer is located on the surface of the conductive carrier layer facing the mask, and the anti-plating layer is located within the first patterned groove, the second patterned groove being used to collect the electroplated material.

2. The transfer welding component according to claim 1, characterized in that, The anti-coating layer is made of aluminum.

3. The transfer welding component according to claim 1, characterized in that, The conductive carrier layer includes an aluminum plate, and the anti-plating layer is an aluminum oxide film on the surface of the aluminum plate, the thickness of the aluminum oxide film being 0.002μm~0.03μm.

4. The transfer welding component according to claim 1, characterized in that, The conductive carrier layer includes: Supporting substrate; A conductive layer is located on at least one side of the carrier substrate, and the mask is located on the side of the conductive layer opposite to the carrier substrate.

5. The transfer welding component according to claim 4, characterized in that, The conductive layer includes at least one of a metallic conductive layer and a non-metallic conductive layer.

6. The transfer welding component according to any one of claims 1-5, characterized in that, The conductive carrier layer has masks on both opposite sides.

7. The transfer welding component according to any one of claims 1-5, characterized in that, The transfer welding component also includes a conductive transition film, which is located within the second patterned groove; The adhesion of the electroplated material to the conductive transition film is less than that to the conductive carrier layer.

8. The transfer welding component according to claim 7, characterized in that, The conductive transition film includes at least one of a transparent conductive oxide film, a tunneling oxide layer, silicon oxide, and titanium oxide.

9. The transfer welding component according to any one of claims 1-5, characterized in that, The transfer component includes a patterned area and an edge area surrounding the outer periphery of the patterned area; the first patterned groove is disposed in one of the patterned area and the edge area, and the second patterned groove is disposed in the patterned area.

10. The transfer welding component according to claim 9, characterized in that, The first graphic groove is located in the edge area, and the first graphic groove includes a strip-shaped groove.

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