Package structure and method of manufacturing the same

Abstract

The application provides a manufacturing method of a packaging structure, comprising the following steps: providing a packaging plate, wherein the packaging plate comprises a plurality of connecting pads, and the packaging plate is provided with at least one slot, and the connecting pads are exposed at the bottom of the slot; arranging a heat dissipation fin at the bottom of the slot, wherein the heat dissipation fin is provided with a plurality of openings, and the connecting pads are exposed at the bottom of the openings; arranging an electronic component on the heat dissipation fin, wherein the electronic component is connected with the connecting pads exposed at the bottom of the openings to obtain an intermediate product; and stacking at least two intermediate products, wherein the packaging plate covers the electronic components to obtain the packaging structure. In addition, the application also provides a packaging structure.

Description

Technical Field

[0001] This invention relates to the field of electronic component packaging, and more particularly to a packaging structure and its manufacturing method. Background Technology

[0002] Current packaging structures typically involve packaging electronic components on a carrier board, and the packaging is limited to the front or back of the carrier board. This method can only package electronic components on a two-dimensional plane, which greatly limits the number of electronic components that can be packaged on a single carrier board.

[0003] However, with the rapid development of electronic technology, the requirements for the performance and integration of electronic components are constantly increasing, and the traditional two-dimensional packaging substrate structure can no longer meet the growing demands. For example, in fields such as high-performance computing, artificial intelligence, and 5G communication, it is necessary to integrate more electronic components within a limited space to achieve higher processing power and faster data transmission speeds. Summary of the Invention

[0004] In view of this, it is necessary to provide a packaging structure that can solve the above-mentioned technical problems.

[0005] Additionally, it is necessary to provide a method for manufacturing the packaging structure.

[0006] A method for manufacturing a package structure includes the following steps: providing a package board, the package board including a plurality of connecting pads, the package board having at least one slot, the plurality of connecting pads being exposed at the bottom of the slot; providing a heat sink at the bottom of the slot, the heat sink having a plurality of openings through it, the connecting pads being exposed at the bottom of the openings; providing electronic components on the heat sink, the electronic components connecting to the connecting pads exposed at the bottom of the openings to obtain an intermediate body; stacking at least two of the intermediate bodies, the package board covering the electronic components to obtain the package structure.

[0007] In some possible embodiments, the method of manufacturing the package board includes the steps of: providing a package substrate, the package substrate including an insulating substrate and a conductive structure embedded in the insulating substrate; forming a slot in the package substrate, with a portion of the conductive structure exposed at the bottom of the slot; etching the portion of the conductive structure exposed at the bottom of the slot to form a plurality of connection pads and a plurality of thermal pads, thereby obtaining the package board.

[0008] In some possible implementations, the connecting pad includes a plurality of first connecting pads and a plurality of second connecting pads, the thermal pad includes a plurality of first thermal pads and a plurality of second thermal pads, the slot is stepped, the slot includes a first slot and a second slot communicating with the first slot, and the step "setting the slot on the packaging substrate" includes: setting a first slot on the packaging substrate, the first connecting pad and the first thermal pad being exposed at the bottom of the first slot; setting a second slot at the bottom of the first slot, the second connecting pad and the second thermal pad being exposed at the bottom of the second slot, wherein the cross-sectional width of the second slot is smaller than the cross-sectional width of the first slot, and the second slot and the first slot are communicating.

[0009] In some possible implementations, the step "to form the slot in the packaging substrate" further includes: forming a third slot at the bottom of the second slot.

[0010] In some possible implementations, the heat sink includes a first heat sink and a second heat sink, the opening includes a first opening and a second opening, and the step of "dealing a heat sink at the bottom of the slot" includes: setting a first heat sink substrate at the bottom of the first slot, the first heat sink substrate covering a plurality of first connecting pads and a plurality of first thermally conductive pads; setting a plurality of first openings on the first heat sink substrate, the first openings corresponding to and offset from the first connecting pads, to form the first heat sink; and setting a second heat sink substrate at the bottom of the second slot, the second heat sink substrate covering a plurality of second connecting pads and a plurality of second thermally conductive pads; setting a plurality of second openings on the second heat sink substrate, the second openings corresponding to and offset from the second connecting pads, to form the second heat sink.

[0011] In some possible implementations, the steps "to provide a plurality of first openings on the first heat sink substrate" and "to provide a plurality of second openings on the second heat sink substrate" include: forming a plurality of first openings on the first heat sink substrate by laser ablation, and forming a plurality of second openings on the second heat sink substrate by laser ablation.

[0012] In some possible implementations, the electronic component includes a first electronic component and a second electronic component, and the step "deploying the electronic component on the heat sink" includes: deploying the first electronic component on the first heat sink, wherein the first electronic component is connected to the first connection pad; and deploying the second electronic component on the second heat sink, wherein the second electronic component is connected to the second connection pad.

[0013] In some possible implementations, the step "stack at least two of the intermediates" includes: providing an encapsulating colloid between two adjacent intermediates; providing solder to each intermediate; and heat-connecting the adjacent intermediates.

[0014] An encapsulation structure includes: an electronic component, a heat sink, and at least two encapsulation plates. The electronic component is disposed on the heat sink. Each encapsulation plate includes a plurality of connection pads, each encapsulation plate has a slot, the plurality of connection pads are exposed at the bottom of the slot, the heat sink is disposed in the slot, the heat sink has openings, the connection pads are disposed corresponding to the openings, and at least two encapsulation plates are stacked to encapsulate the electronic component.

[0015] In some possible implementations, an encapsulating colloid is also included, which is filled between each two adjacent encapsulation plates.

[0016] Compared to existing technologies, the manufacturing method of the packaging structure provided in this application increases the heat dissipation path and area by setting a heat sink at the bottom of the slot in the packaging board. The through-holes in the heat sink expose the connector pads. This design ensures the connection between electronic components and connector pads while facilitating rapid heat dissipation through the heat sink. Compared to traditional packaging structures without dedicated heat dissipation design, this method more effectively controls the operating temperature of electronic components, reduces performance degradation or malfunctions caused by overheating, extends the lifespan of electronic components, and improves the overall thermal management performance of the packaging structure.

[0017] Furthermore, this manufacturing method allows electronic components to be first placed on a heat sink to form intermediates, and then at least two intermediates are stacked to form a package structure. This approach can integrate more electronic components within a limited space. Compared to traditional single-layer packaging methods that place electronic components, it makes full use of three-dimensional space, enabling a single package structure to accommodate more electronic components, thereby increasing the functional density and complexity of the package structure and meeting the high performance and multifunctionality requirements of modern electronic devices.

[0018] Furthermore, the method of stacking intermediate components and encapsulating electronic components within the package structure provides better protection and stability for these components. This structural design increases the overall integrity of the package structure, reduces the likelihood of displacement or damage to electronic components when subjected to external mechanical stresses (such as vibration and impact), and improves the stability and reliability of the package structure in complex environments compared to traditional structures, ensuring the normal operation of electronic devices. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments / methods of the present invention, the drawings used in the description of the embodiments / methods will be briefly introduced below. Obviously, the drawings described below are some embodiments / methods of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a cross-sectional schematic diagram of a packaging substrate provided in an embodiment of this application.

[0021] Figure 2 for Figure 1 The diagram shows a cross-sectional view of the encapsulation board formed after slotting the encapsulation substrate.

[0022] Figure 3 for Figure 2 The diagram shows a cross-sectional view of the heat dissipation substrate formed after a heat dissipation substrate is installed inside the encapsulation board.

[0023] Figure 4 for Figure 3 The diagram shows a cross-sectional view of the heat sink substrate after it has been processed into a heat sink.

[0024] Figure 5 for Figure 4 The diagram shows a cross-sectional view of the intermediate body obtained after installing electronic components on the heat sink.

[0025] Figure 6 for Figure 5 The diagram shows a cross-sectional view of the encapsulation structure obtained after the two intermediate bodies are connected by an inverted connection.

[0026] Explanation of main component symbols

[0027] Packaging structure 100

[0028] Package board 10

[0029] Connecting pad 11

[0030] Slotting 12

[0031] Insulating substrate 101

[0032] Conductive structure 102

[0033] Insulation layer 101a

[0034] Conductive layer 102a

[0035] First slot 121

[0036] Second slot 122

[0037] Third slot 123

[0038] First connecting pad 111

[0039] Second connecting pad 112

[0040] Solder pad 102b

[0041] Thermal pad 13

[0042] First thermal pad 131

[0043] Second thermal pad 132

[0044] Packaging substrate 20

[0045] Heatsink 30

[0046] First heat sink 301

[0047] Second heat sink 302

[0048] Opening 31

[0049] First opening 311

[0050] Second opening 312

[0051] Second heat sink 321

[0052] Second through hole 321a

[0053] First heat sink 322

[0054] First through hole 322a

[0055] Electronic Components 40

[0056] First electronic component 41

[0057] Second electronic component 42

[0058] Intermediate 50

[0059] Solder 52

[0060] Cross-sectional widths W1 and W2

[0061] Thickness direction A

[0062] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0063] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0064] Numerous specific details are set forth in the following description to provide a thorough understanding of the invention. The described embodiments are only a part of, and not all, of the embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0065] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0066] Please see Figures 1 to 6 One embodiment of this application provides a method for manufacturing a packaging structure 100, including the following steps:

[0067] S1: Please see Figures 1 to 2 A packaging plate 10 is provided, the packaging plate 10 including a plurality of connecting pads 11, the packaging plate 10 being provided with at least one slot 12, the plurality of connecting pads 11 being exposed at the bottom of the slot 12.

[0068] In this embodiment, the encapsulation board 10 is a multilayer laminated board, comprising an insulating substrate 101 and conductive structures 102 embedded in the insulating substrate 101. Both the insulating substrate 101 and the conductive structures 102 are layered structures. Specifically, the insulating substrate 101 comprises a plurality of spaced-apart insulating layers 101a. The conductive structures 102 comprise a plurality of spaced-apart conductive layers 102a. Each conductive layer 102a is disposed between every two adjacent insulating layers 101a. The encapsulation board 10 further comprises a plurality of interlayer conductors 103, which are embedded in the insulating layers 101a to connect every two adjacent conductive layers 102a.

[0069] In this embodiment, the encapsulation plate 10 has a thickness direction A. Along the thickness direction A, the cross-section of the slot 12 is generally stepped. The slot 12 includes a first slot 121 and a second slot 122 communicating with the first slot 121. The connecting pad 11 includes a first connecting pad 111 and a second connecting pad 112. The first connecting pad 111 is exposed at the bottom of the first slot 121. The second connecting pad 112 is exposed at the bottom of the second slot 122. Specifically, the first connecting pad 111 is located in one of the conductive layers 102a, and the second connecting pad 112 is located in an adjacent conductive layer 102a.

[0070] In this embodiment, the manufacturing method of the packaging board 10 includes the following steps:

[0071] S11: Please refer to Figure 1 A packaging substrate 20 is provided, the packaging substrate 20 including the insulating substrate 101 and the conductive structure 102 embedded in the insulating substrate 101. A portion of the conductive structure 102 is exposed outside the insulating substrate 101, forming a plurality of solder pads 102b.

[0072] S12: Please refer to Figure 2 The slot 12 is formed on the packaging substrate 20, and a portion of the conductive structure 102 is exposed at the bottom of the slot 12. Specifically, step S12 includes:

[0073] S121: The first slot 121 is formed on one side of the packaging substrate 20 by mechanical drilling. A conductive layer 102a in the conductive structure 102 is exposed at the bottom of the first slot 121.

[0074] S122: A second groove 122 is formed at the bottom of the first groove 121 by mechanical drilling. Another conductive layer 102a in the conductive structure 102 is exposed at the bottom of the second groove 122. When viewed along the thickness direction A, the cross-sectional width W2 of the second groove 122 is smaller than the cross-sectional width W1 of the first groove 121, and the second groove 122 corresponds to approximately the middle position of the bottom of the first groove 121. That is, a conductive layer 102a is exposed on both sides of the bottom of the first groove 121, thereby forming a stepped groove 12.

[0075] In this embodiment, step S12 further includes: S123: forming a third groove 123 at the bottom of the second groove 122 by mechanical drilling.

[0076] S13: Please continue to see Figure 2 The conductive layer 102a exposed at the bottom of the slot 12 is etched to form a plurality of connection pads 11 and a plurality of thermal pads 13, thereby obtaining the package board 10. Specifically, step S13 includes:

[0077] S131: A conductive layer 102a exposed at the bottom of the first slot 121 is etched by laser ablation to form a plurality of first connecting pads 111 and a plurality of first thermal pads 131.

[0078] S132: Using laser ablation, another conductive layer 102a exposed at the bottom of the second slot 122 is etched to form a plurality of second connecting pads 112 and a plurality of second thermal pads 132.

[0079] S2: Please see Figure 3 and Figure 4A heat sink 30 is disposed at the bottom of the slot 12. Multiple openings 31 are provided through the heat sink 30, and the thermal pad 13 is exposed at the bottom of the openings 31. The heat sink 30 includes a first heat sink 301 and a second heat sink 302. The openings 31 include a first opening 311 and a second opening 312. The first heat sink 301 is obtained by processing a first heat dissipation substrate 322, and the second heat sink 302 is obtained by processing a second heat dissipation substrate 321.

[0080] In this embodiment, step S2 specifically includes:

[0081] S21: A second heat dissipation substrate 321 is disposed at the bottom of the second slot 122. The second heat dissipation substrate 321 covers a plurality of second connecting pads 112 and a plurality of second thermally conductive pads 132. The second heat dissipation substrate 321 is provided with a second through hole 321a, which corresponds to the third slot 123. The material of the second heat dissipation substrate 321 is silicone.

[0082] S22: A plurality of second openings 312 are formed on the second heat sink substrate 321 by laser ablation. The plurality of second openings 312 are disposed corresponding to the plurality of second thermal pads 132, and the second openings 312 are staggered from the second connecting pad 112 and the third slot 123 to obtain the second heat sink 302. That is, the second heat sink 302 covers the second connecting pad 112.

[0083] S23: A first heat dissipation substrate 322 is disposed at the bottom of the first slot 121. The first heat dissipation substrate 322 covers a plurality of first connecting pads 111 and a plurality of first thermally conductive pads 131. The first heat dissipation substrate 322 is provided with a first through hole 322a, which corresponds to the second slot 122. The first heat dissipation substrate 322 is made of silicone.

[0084] S24: Multiple first openings 311 are formed on the first heat sink substrate 322 by laser ablation. The first openings 311 are corresponding to the first thermal pad 131. The first openings 311 are staggered from the first connecting pad 111 and the second slot 122 to obtain the first heat sink 301. That is, the first heat sink 301 covers the first connecting pad 111.

[0085] S3: Please see Figure 5 An electronic component 40 is disposed on the heat sink 30. The electronic component 40 is connected to the thermal pad 13 exposed at the bottom of the opening 31 to obtain an intermediate body 50.

[0086] In this embodiment, the electronic component 40 includes a first electronic component 41 and a second electronic component 42. The first electronic component 41 is disposed on the first heat sink 301 and is connected to the first connecting pad 111. The second electronic component 42 is disposed on the second heat sink 302 and is connected to the second connecting pad 112. The first electronic component 41 and the second electronic component 42 may be processor chips, memory chips, power chips, sensor chips, etc.

[0087] In this embodiment, step S3 specifically includes:

[0088] S31: The second electronic component 42 is disposed on the second heat sink 302, covering the third slot 123. The second electronic component 42 includes a body and multiple second pins. The body of the second electronic component 42 rests against the second heat sink 302, and the multiple second pins pass through the second opening 312 and connect to the second connecting pad 112. The presence of the third slot 123 allows heat from the electronic component 40 to be conducted to the deeper layers of the encapsulation board 10 through the connecting pad 11 and the thermal pad 13. Thus, heat is no longer limited to surface dissipation but is conducted through a multi-layered structure, thereby rapidly reducing the temperature of the electronic component 40. Furthermore, the third slot 123 effectively reduces thermal resistance, allowing heat to be conducted away from the electronic component 40 more quickly. This is particularly important for high-power or high-heat-generating electronic components 40, preventing overheating and extending their lifespan.

[0089] In other embodiments of this application, the third slot 123 is filled with a thermally conductive material (such as thermally conductive adhesive, metal filler, etc.) to provide additional space for the encapsulation structure 100. These thermally conductive materials have a high thermal conductivity, which can accelerate the transfer of heat from the electronic component 40 to the interior of the encapsulation plate 10 and the heat sink 30.

[0090] S32: The first electronic component 41 is disposed on the first heat sink 301. The first electronic component 41 covers the second slot 122. The first electronic component 41 includes a first electronic component 41 body and a plurality of first pins. The first electronic component 41 body is attached to the first heat sink 301. The plurality of first pins pass through the first opening 311 and are connected to the first connecting pad 111.

[0091] S4: At least two of the intermediate bodies 50 are stacked, and the packaging plate 10 covers the electronic component 40 to obtain the packaging structure 100.

[0092] In this embodiment, two intermediate bodies 50 are inverted to enclose the electronic component 40 within the two intermediate bodies 50. In other embodiments of this application, three or more intermediate bodies 50 are stacked sequentially to enclose the electronic component 40 within a plurality of intermediate bodies 50.

[0093] In this embodiment, step S4 specifically includes:

[0094] S41: An encapsulating colloid (not shown) is disposed between two adjacent intermediate bodies 50. The encapsulating colloid is made of an epoxy resin-based material.

[0095] S42: Solder 52 is provided on the solder pad 102b of each of the intermediate bodies 50. The solder 52 is made of a lead-free tin-silver-copper alloy.

[0096] S43: By reflow soldering, two adjacent intermediate bodies 50 are heated and connected, thereby filling the space between the two first electronic components 41 with the encapsulating colloid. Simultaneously, the solder 52 connects the solder pads 102b of the two intermediate bodies 50.

[0097] Compared with the prior art, the manufacturing method of the packaging structure 100 provided in this application has the following advantages:

[0098] (I) Improved Heat Dissipation Performance: The manufacturing method of the packaging structure 100 in this application increases the heat dissipation area and heat dissipation path by setting a slot 12 on the packaging board 10 and setting a heat sink 30 at the bottom of the slot 12. In particular, the design of the opening 31 on the heat sink 30 and the third slot 123 in the slot 12 further optimizes the heat dissipation effect. Compared with the traditional packaging structure 100, it effectively solves the problem of performance degradation or shortened lifespan of electronic components 40 due to insufficient heat dissipation, ensures that electronic components 40 operate in a good temperature environment, and improves the stability and reliability of the entire packaging structure 100.

[0099] (II) Increased Integration of Electronic Components 40: This manufacturing method enables the placement of connection pads 11 on different conductive layers 102a of the package board 10, achieving the connection of electronic components 40 in three-dimensional space. Compared to the traditional method of placing electronic components 40 only on one side or a two-dimensional plane of the package board 10, this increases the number of electronic components 40 that can be integrated within a unit package structure 100. This is beneficial for improving the functional diversity and overall performance of the package structure 100, better meeting the high integration requirements of modern electronic devices, and providing the possibility for realizing more complex circuit functions.

[0100] (III) Enhancing the stability of the encapsulation structure 100: During the manufacturing process, an encapsulating colloid is placed between adjacent intermediates 50. The solder pads 102b of the intermediates 50 are connected by solder 52 and the connection is completed through a reflow soldering process. The encapsulating colloid not only fills the gaps between electronic components 40, playing a role in buffering and protecting the electronic components 40, but also enhances the mechanical stability of the entire encapsulation structure 100. This effectively prevents the electronic components 40 from loosening or being damaged due to external forces, vibrations, or other factors during use, thereby improving the reliability of the encapsulation structure 100 and ensuring the normal operation of electronic equipment in complex environments.

[0101] One embodiment of this application also provides a packaging structure 100, including an electronic component 40, a heat sink 30, and at least two packaging plates 10. The electronic component 40 is disposed on the heat sink 30. Each packaging plate 10 includes a plurality of connecting pads 11, and each packaging plate 10 has a slot 12, with the plurality of connecting pads 11 exposed at the bottom of the slot 12. The heat sink 30 is disposed in the slot 12, and the heat sink 30 has openings 31. The connecting pads 11 are disposed corresponding to the openings 31. At least two packaging plates 10 are stacked to cover the electronic component 40. The stacking method includes an inverted stacking.

[0102] In this embodiment, the encapsulation structure 100 further includes an encapsulation colloid, which fills the space between two adjacent encapsulation plates 10.

[0103] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A method for manufacturing a packaging structure, characterized in that, Including the following steps: A packaging board is provided, the packaging board including a plurality of connection pads, the packaging board being provided with at least one slot, the plurality of connection pads being exposed at the bottom of the slot; A heat sink is provided at the bottom of the slot, and the heat sink has multiple openings through it, with the connecting pad exposed at the bottom of the openings; An electronic component is disposed on the heat sink, and the electronic component is connected to the connecting pad exposed at the bottom of the opening to obtain an intermediate body; At least two of the intermediate bodies are stacked, and the packaging board covers the electronic components to obtain the packaging structure.

2. The manufacturing method as described in claim 1, characterized in that, The method for manufacturing the encapsulation board includes the following steps: A packaging substrate is provided, the packaging substrate including an insulating substrate and a conductive structure embedded in the insulating substrate; The slot is provided on the packaging substrate, and part of the conductive structure is exposed at the bottom of the slot; The conductive structure exposed at the bottom of the slot is etched to form a plurality of the connection pads and a plurality of thermal pads to obtain the package board.

3. The manufacturing method as described in claim 2, characterized in that, The connecting pad includes a plurality of first connecting pads and a plurality of second connecting pads, the thermal pad includes a plurality of first thermal pads and a plurality of second thermal pads, the slot is stepped, the slot includes a first slot and a second slot communicating with the first slot, and the step "setting the slot on the packaging substrate" includes: A first slot is provided on the packaging substrate, and the first connecting pad and the first thermal pad are exposed at the bottom of the first slot; A second slot is provided at the bottom of the first slot, and the second connecting pad and the second thermal conductive pad are exposed at the bottom of the second slot. The cross-sectional width of the second slot is smaller than the cross-sectional width of the first slot, and the second slot and the first slot are connected.

4. The manufacturing method as described in claim 3, characterized in that, The step "to provide the slot on the packaging substrate" further includes: A third slot is provided at the bottom of the second slot.

5. The manufacturing method as described in claim 3, characterized in that, The heat sink includes a first heat sink and a second heat sink, the opening includes a first opening and a second opening, and the step of "setting a heat sink at the bottom of the slot" includes: A first heat dissipation substrate is disposed at the bottom of the first slot, and the first heat dissipation substrate covers a plurality of first connecting pads and a plurality of first thermal conductive pads; A plurality of first openings are provided on the first heat sink substrate, the first openings corresponding to and offset from the first connecting pads, to form the first heat sink; and A second heat dissipation substrate is disposed at the bottom of the second slot, and the second heat dissipation substrate covers a plurality of second connecting pads and a plurality of second thermal conductive pads; A plurality of second openings are provided on the second heat sink substrate, the second openings corresponding to the second connecting pads and offset from the second connecting pads, to form the second heat sink.

6. The manufacturing method as described in claim 5, characterized in that, The steps "providing multiple first openings on the first heat sink substrate" and "providing multiple second openings on the second heat sink substrate" include: Multiple openings are formed on the first heat sink substrate by laser ablation. Multiple second openings are formed on the second heat sink substrate by laser ablation.

7. The manufacturing method as described in claim 5, characterized in that, The electronic component includes a first electronic component and a second electronic component, and the step of "setting the electronic component on the heat sink" includes: The first electronic component is disposed on the first heat sink, and the first electronic component is connected to the first connecting pad; The second electronic component is disposed on the second heat sink, and the second electronic component is connected to the second connection pad.

8. The manufacturing method as described in claim 1, characterized in that, The step "overlaying at least two of the intermediate bodies" includes: An encapsulating colloid is disposed between two adjacent intermediate bodies; Solder is provided in each of the intermediates; Heating connects two adjacent intermediates.

9. A packaging structure, characterized in that, include: Electronic components A heat sink, on which the electronic components are disposed; At least two packaged plates, each packaged plate including multiple connecting pads, each packaged plate having a slot, the multiple connecting pads being exposed at the bottom of the slot, a heat sink being disposed in the slot, the heat sink having openings, the connecting pads being disposed in the corresponding openings, and at least two packaged plates being inverted to cover the electronic component.

10. The packaging structure as described in claim 9, characterized in that, It also includes an encapsulating colloid, which is filled between each two adjacent encapsulation plates.

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