Non-contact transport apparatus and method for microelectronic assembly

Abstract

This invention provides a contactless transmission device and method for microelectronic assembly. The device includes a cellular array module, an ultrasonic control unit, an airflow control unit, and a data acquisition module. The cellular array module is composed of multiple connectable cellular units. Each cellular unit integrates an ultrasonic standing wave module that generates ultrasonic standing waves to suspend components, and a micro-airflow module that provides driving micro-airflow. The ultrasonic control unit is responsible for establishing and adjusting the sound field within each cellular unit to ensure stable suspension of the components. The airflow control unit guides the micro-airflow to propel the components between cellular units. The data acquisition module monitors the component position in real time and dynamically coordinates the ultrasonic control unit and / or the airflow control unit. During cross-unit transmission, the sound field at the target position is pre-activated to ensure that the components are always suspended and can be transferred accurately and flexibly. This invention overcomes the problems of inaccurate positioning, rigid paths, and complex control caused by airflow interference, thereby improving the efficiency and accuracy of microelectronic assembly.

Description

Technical Field

[0001] This invention relates to the fields of microelectronics manufacturing and precision testing technology, and in particular to a contactless transmission device and method for microelectronics assembly. Background Technology

[0002] In the fields of microelectronics manufacturing and precision inspection, traditional contact-based transmission methods face severe challenges as component sizes continue to shrink. During chip packaging, MEMS sensor assembly, and the processing of micro-optical components, mechanical contact can easily lead to surface scratches, particulate contamination, and even irreversible mechanical damage. Simultaneously, microelectronic components are extremely sensitive to static electricity; triboelectric charging or charge transfer during contact operations can directly damage circuit functionality. Furthermore, in assembly and inspection processes, the requirements for component positioning accuracy have increased to the micrometer level, making it difficult for traditional robotic arms to simultaneously achieve non-contact operation, high precision, and high stability.

[0003] To address the aforementioned issues, existing technologies have primarily developed three types of non-contact transmission technologies: acoustic levitation, air levitation, and purely mechanical transmission. While acoustic levitation technology can achieve contactless levitation, it requires complex sound field phase switching to control the motion trajectory, resulting in high system control difficulty, slow response speed, and poor adaptability to complex paths. Pure air levitation technology offers flexible control, but often relies on a pre-set rigid track, lacking path freedom, and the continuous airflow impact can easily disturb small components, affecting positioning accuracy. Traditional mechanical transmission, on the other hand, has always struggled to overcome the wear and contamination problems associated with contact.

[0004] Therefore, there is an urgent need for a contactless transmission device and method for microelectronic assembly that can simultaneously solve the problems of low positioning accuracy, inflexible path adjustment, and complex system control caused by airflow disturbance, while achieving contactless and wear-free transmission. Summary of the Invention

[0005] The purpose of this invention is to provide a contactless transmission device and method for microelectronic assembly, aiming to solve the technical problems of path limitation, airflow disturbance positioning and speed control difficulties in contactless transmission of microelectronics, and to achieve high-precision and stable transmission.

[0006] To achieve the above objectives, in a first aspect, the present invention provides a contactless transmission device for microelectronic assembly, comprising a cellular array module, an ultrasonic control unit, an airflow control unit, and a data acquisition module;

[0007] The cellular array module is composed of multiple interconnected cellular units. Each cellular unit is provided with a levitation area, an ultrasonic standing wave module for applying ultrasonic levitation force to the microelectronic components located in the levitation area, and a micro airflow module for applying directional driving force to the microelectronic components in the levitation state.

[0008] The ultrasonic control unit is connected to the ultrasonic standing wave module in each cellular unit, and is used to control the formation or adjustment of the ultrasonic standing wave field required for levitation in the corresponding cellular unit, so that the microelectronic components are levied in the levitation area of ​​the corresponding cellular unit.

[0009] The airflow control unit is connected to the micro-airflow module in each cellular unit and is used to control the corresponding cellular unit to output directional micro-airflow toward the suspended area, so as to drive the microelectronic component to move from the current cellular unit to the adjacent cellular unit;

[0010] The acquisition module is used to acquire the position information of the microelectronic components in the cellular array module, and to control the ultrasonic control unit and / or the airflow control unit to make adjustments based on the acquired position information;

[0011] When the microelectronic component is transmitted from the current cellular unit to the adjacent cellular unit, the ultrasonic control unit controls the adjacent cellular unit to pre-form an ultrasonic standing wave field to receive the microelectronic component, thereby enabling the microelectronic component to achieve contactless transmission and positioning between cellular array modules in a suspended state.

[0012] As a further improvement to the above solution, the cellular unit includes a regular hexagonal cellular unit body, and multiple regular hexagonal cellular unit bodies are closely spliced ​​together to form the cellular array module. Furthermore, the splicing walls of the regular hexagonal cellular unit body are densely covered with a number of regular hexagonal through holes to form an array structure for cross-unit transmission of microelectronic components.

[0013] As a further improvement to the above scheme, each of the honeycomb cells has a plurality of micro piezoelectric ceramic vibrators arranged circumferentially on the inner wall, and the plurality of micro piezoelectric ceramic vibrators are distributed around the suspension area to form the ultrasonic standing wave module within the corresponding honeycomb cell;

[0014] Preferably, six micro piezoelectric ceramic oscillators are evenly distributed on the inner wall of each of the honeycomb units, with a 60° interval between adjacent micro piezoelectric ceramic oscillators.

[0015] As a further improvement to the above solution, each of the cellular cells has multiple airflow channels on its sidewalls facing the suspended region. These multiple airflow channels constitute the micro airflow module, which applies directional driving force to the suspended microelectronic components from different directions.

[0016] Preferably, each of the cellular units has three airflow channels inside, and the three airflow channels are arranged at 120° intervals along the circumference;

[0017] The three airflow channels are respectively located near the midpoint of the three opposite sides of the regular hexagonal honeycomb cell body, and each airflow channel is arranged towards the center of the honeycomb cell.

[0018] Each of the airflow channels is arranged at an angle to the inner wall of the honeycomb unit, and the angle is 30°.

[0019] As a further improvement to the above scheme, the ultrasonic control unit includes a multi-channel signal generator array and a power amplifier array. The multi-channel signal generator array is used to output high-frequency vibration signals, and the power amplifier array is used to amplify the high-frequency vibration signals and input them to the micro piezoelectric ceramic oscillators in the corresponding cellular unit, so as to realize independent control of multiple micro piezoelectric ceramic oscillators in a single cellular unit and support synchronous adjustment of multiple cellular units.

[0020] As a further improvement to the above solution, the acquisition module includes a laser displacement sensor and a high-speed camera. The laser displacement sensor is used to monitor the forward and backward movement of the suspended object, and the high-speed camera is used to acquire the image position information of the suspended object. The acquisition module is connected to the ultrasonic control unit and the airflow control unit to adjust the ultrasonic parameters and / or airflow parameters according to the real-time position of the suspended object.

[0021] In a second aspect, the present invention also provides a contactless transmission method based on the contactless transmission device for microelectronic assembly described in the first aspect, comprising the following steps:

[0022] S1. Control the ultrasonic standing wave module of the target cellular unit to output an ultrasonic excitation signal to form an ultrasonic standing wave field in the levitation area of ​​the target cellular unit, so that the microelectronic component to be transmitted is levitated.

[0023] S2. According to the preset transmission direction, control the micro-airflow module of the current cellular unit to output directional micro-airflow to drive the microelectronic component in the suspended state to move toward the adjacent cellular unit.

[0024] S3. Before the microelectronic component enters the adjacent cellular unit, the ultrasonic standing wave module of the adjacent cellular unit is controlled to pre-establish an ultrasonic standing wave field for receiving the microelectronic component.

[0025] S4. The acquisition module is used to obtain the real-time position information of the microelectronic component, and the ultrasonic control unit and / or airflow control unit are adjusted according to the real-time position information to keep the microelectronic component stably suspended and transmitted along a predetermined path.

[0026] S5. After the microelectronic component reaches the target position, maintain or adjust the ultrasonic standing wave field of the corresponding cellular unit to achieve the positioning or assembly of the microelectronic component.

[0027] As a further improvement to the above scheme, in step S1, the ultrasonic excitation signal is output by a multi-channel signal generator array and amplified by a power amplifier array before being input to the micro piezoelectric ceramic oscillator in the corresponding cellular unit to form an ultrasonic standing wave field that suspends the microelectronic components.

[0028] As a further improvement to the above scheme, in step S2, the directional micro-airflow is output by the three airflow channels in the current cellular unit in a coordinated manner. By adjusting the airflow output state of each airflow channel, the microelectronic component moves along a preset direction.

[0029] As a further improvement to the above scheme, in step S4, the real-time position information includes forward and backward displacement information and image position information, wherein the forward and backward displacement information is collected by a laser displacement sensor and the image position information is collected by a high-speed camera.

[0030] As a further improvement to the above scheme, in step S4, when the microelectronic component is detected to deviate from the preset transmission path, the ultrasonic parameters and airflow parameters of the current cellular unit and / or adjacent cellular units are adjusted according to the real-time position information obtained by the acquisition module, so as to correct the deviation of the microelectronic component and complete the positioning.

[0031] Because the present invention adopts the above technical solutions, the beneficial effects of this application are as follows:

[0032] This invention provides a contactless transmission device for microelectronic assembly. By configuring a cellular array module as multiple interconnected cellular cells, and by setting a levitation area, an ultrasonic standing wave module, and a micro-airflow module within each cellular cell, microelectronic components can be switched and transmitted between multiple adjacent cells. Since the transmission basis no longer relies on a single linear track or a fixed-direction transport channel, but is established based on the transfer relationships between arrayed cells, this invention can provide a more flexible transmission path within a planar range, thereby helping to improve the path-limited problem in existing contactless microelectronic transmission.

[0033] In this invention, an ultrasonic standing wave module applies ultrasonic levitation force to microelectronic components located within the levitation region, while a micro-airflow module applies directional driving force to the levied microelectronic components. Since the ultrasonic standing wave module primarily performs the levitation and holding function, and the micro-airflow module primarily performs the directional migration function, this invention separates the two functions of "stabilizing support" and "driving motion." Based on this division of labor, on the one hand, the ultrasonic levitation field can be used to maintain the non-contact support state of the microelectronic components; on the other hand, the micro-airflow can be used to apply a driving force in the direction of motion to the components. This helps to reduce the drift, sway, and positioning instability problems that easily occur when relying solely on airflow delivery, thereby improving the situation of airflow-induced positioning disturbances.

[0034] In this invention, the ultrasonic control unit controls each cellular unit to form or adjust the ultrasonic standing wave field, and the airflow control unit controls each cellular unit to output directional micro-airflow toward the suspension region. Since the ultrasonic and airflow parameters can be independently adjusted for different cellular units, targeted control of the local suspension state and local driving force can be achieved when the microelectronic component is in different positions or at different transmission stages, without the need for uniform parameters to act simultaneously on the entire system. Based on this unit-based control method, the movement direction and speed of the microelectronic component can be adjusted more precisely, thereby helping to improve the problem of difficult speed control in existing technologies.

[0035] This invention further includes a data acquisition module for acquiring the position information of microelectronic components within the cellular array module, and controlling the ultrasonic control unit and / or airflow control unit to adjust based on the acquisition results. Since this device does not rely solely on preset parameters for open-loop transmission, but can correct the ultrasonic levitation state and micro-airflow output state based on real-time position changes, compensation can be achieved through feedback adjustment when microelectronic components deviate from the predetermined path, experience speed changes, or exhibit unstable attitudes during transmission. Based on this, this invention helps reduce the impact of external disturbances, individual component differences, or local airflow fluctuations on transmission accuracy, thereby improving the stability of the transmission process and the consistency of repeated positioning.

[0036] Furthermore, when a microelectronic component is transferred from the current cellular cell to an adjacent cellular cell, this invention controls the adjacent cellular cells to pre-form an ultrasonic standing wave field to receive the microelectronic component. Since the target cellular cell already possesses the conditions for levitation and reception before the component enters, the microelectronic component can remain suspended during the inter-cell transition phase, without experiencing landing, collision, or re-levitation at the cell boundary. This reduces the possibility of instability, displacement, or contact damage to the microelectronic component during cell switching, thereby contributing to improved continuity and smoothness of inter-cell transmission.

[0037] This invention enables microelectronic components to achieve arrayed, controllable, contactless transmission and positioning in a suspended state through the coordinated use of a cellular array structure, ultrasonic levitation, and micro-airflow actuation, along with closed-loop adjustment based on data acquisition feedback and pre-receiving control of adjacent units. Based on these technical features and their synergistic relationship, this invention effectively solves the problems of path limitation, airflow disturbance positioning, and speed control difficulties in contactless microelectronic transmission, and is applicable to the transmission and assembly of microelectronic devices such as millimeter-scale silicon wafers, micro-sensors, and micro-optical components. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of the structure of a contactless transmission device for microelectronic assembly disclosed in this invention;

[0040] Figure 2 This is a three-dimensional structural diagram of the cellular unit disclosed in this invention;

[0041] Figure 3 This is a cross-sectional schematic diagram of the cellular unit disclosed in this invention;

[0042] Figure 4 This is a top view schematic diagram of the cellular unit disclosed in this invention;

[0043] Figure 5 This is a top view of the mounting plate disclosed in this invention.

[0044] Figure label:

[0045] 1. Cellular array module; 11. Cellular cell; 111. Suspended region; 112. Ultrasonic standing wave module; 113. Micro airflow module; 114. Regular hexagonal cell body; 115. Regular hexagonal through hole; 12. Miniature piezoelectric ceramic vibrator; 13. Airflow channel;

[0046] 2. Ultrasonic control unit; 21. Multi-channel signal generator array; 22. Power amplifier array;

[0047] 3. Airflow control unit; 31. Solenoid valve array; 32. External air supply system; 33. Control cabinet; 4. Data acquisition module; 41. Laser displacement sensor; 42. High-speed camera; 5. Mounting plate; 6. Processor.

[0048] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0049] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] It should be noted that all directional indicators (such as up, down, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0051] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0052] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0053] Example 1

[0054] See Figures 1-5 This invention provides a contactless transmission device for microelectronic assembly, used for contactless transmission and positioning of microelectronic components such as millimeter-scale silicon wafers, microsensors, and micro-optical elements. The contactless transmission device includes a cellular array module 1, an ultrasonic control unit 2, an airflow control unit 3, and a data acquisition module 4. These components work together to achieve levitation, directional migration, cross-unit transfer, and position correction of the microelectronic components, thus providing a solution to the problems of path limitation, airflow disturbance positioning, and speed control difficulties in contactless microelectronic transmission.

[0055] The cellular array module 1 is composed of multiple interconnected cellular units 11, forming the levitation and transmission base area for microelectronic components. Compared with traditional linear track-type or single-channel contactless transmission structures, this embodiment does not limit the movement of components to a single direction, but rather forms an arrayed transmission base by splicing multiple cellular units 11. Since components can switch between multiple adjacent cellular units 11, the transmission path is no longer limited to a fixed linear direction, enabling more flexible path planning within a planar range.

[0056] Preferably, the cellular unit 11 includes a regular hexagonal cellular unit body 114, and multiple regular hexagonal cellular unit bodies 114 are closely spliced ​​together to form the cellular array module 1. The use of regular hexagonal cellular unit bodies 114 allows for a regular and close splicing relationship on a plane. Simultaneously, a single cellular unit 11 can directly communicate with multiple adjacent cellular units 11. Therefore, during transmission, microelectronic components can select adjacent units in different directions for transfer according to the target location. Compared to structures only suitable for unidirectional transmission, this is more conducive to expanding transmission paths and improving the flexibility of path switching.

[0057] Furthermore, the splicing wall region of the hexagonal honeycomb cell body 114 is provided with an open-type connecting structure, preferably a plurality of hexagonal through holes 115 distributed in the upper sidewall region. These through holes are not intended to allow microelectronic components to pass directly through a single hole, but rather to reduce the obstruction of the local flow field and suspension transition space at the boundaries of adjacent honeycomb cells 11, thus forming a connecting transition region between adjacent honeycomb cells 11 in the upper part. In this way, when a microelectronic component is suspended within the current honeycomb cell 11 and moves towards an adjacent honeycomb cell 11 under the action of directional micro-airflow, it can complete a lateral transition within the connecting transition region and be received by the ultrasonic standing wave field pre-established in the adjacent honeycomb cell 11. Therefore, the splicing wall structure not only retains the overall supporting function of the honeycomb cell body 11, but also provides a transition space for cross-cell transmission through the upper open-type boundary structure, thereby improving the continuity and stability of cross-cell transmission.

[0058] In practice, each regular hexagonal honeycomb cell body 114 can be formed by 3D printing. The regular hexagonal honeycomb cell bodies 114 are tightly spliced ​​together by the flat side walls. The splicing gap is preferably controlled within a small range to reduce the adverse effects of the cell boundary on the transmission process of microelectronic components.

[0059] Each cellular unit 11 is equipped with a levitation region 111, an ultrasonic standing wave module 112, and a micro-airflow module 113. The levitation region 111 is used to accommodate microelectronic components in a non-contact state; the ultrasonic standing wave module 112 is used to apply ultrasonic levitation force to the microelectronic components located in the levitation region 111; and the micro-airflow module 113 is used to apply directional driving force to the levitation microelectronic components. In other words, this embodiment assigns "lifting and levitation" and "planar driving" to two different types of modules for separate implementation, rather than relying on a single airflow to simultaneously complete support and transport. Since levitation and directional driving are functionally separated, on the one hand, the ultrasonic standing wave field can be used to provide relatively stable non-contact support, and on the other hand, the micro-airflow output can be used to achieve motion direction adjustment, thereby helping to reduce the drift, sway, and positioning instability that easily occur when relying solely on airflow transport.

[0060] The ultrasonic control unit 2 is connected to the ultrasonic standing wave module 112 in each cellular unit 11, and is used to control the formation or adjustment of the ultrasonic standing wave field required for levitation in the corresponding cellular unit 11, so that the microelectronic component is levied within the levitation region 111 of the corresponding cellular unit 11. Since the ultrasonic standing wave module 112 in each cellular unit 11 can be controlled independently, different cellular units 11 can establish different levitation conditions according to the location of the component, without the need for the entire array to use a uniform excitation method. Based on this, the levitation state of local cellular units 11 can be adjusted in a targeted manner at different stages of component levitation, transmission, reception, and positioning.

[0061] The airflow control unit 3 is connected to the micro-airflow module 113 in each cellular unit 11, and is used to control the corresponding cellular unit 11 to output a directional micro-airflow toward the suspended area 111, so as to drive the microelectronic component to move from the current cellular unit 11 to the adjacent cellular unit 11. Since the airflow control unit 3 can control different airflow channels 13 of different cellular units 11 separately, one or more airflow channels 13 can be selected to output micro-airflow according to the target path and real-time status during the transmission process, so as to adjust the direction and speed of movement. That is to say, this embodiment does not uniformly supply air to the entire array, but performs local and directional drive control according to the actual position of the component, which is beneficial to improve the speed control capability and reduce ineffective disturbances.

[0062] The acquisition module 4 is used to acquire the position information of the microelectronic components in the cellular array module 1, and to control the ultrasonic control unit 2 and / or the airflow control unit 3 to make adjustments based on the acquired position information. During levitation and migration, the microelectronic components may deviate from the predetermined path due to local airflow fluctuations, individual size differences, or instantaneous attitude changes. If open-loop control is performed solely based on preset parameters, it is difficult to balance transmission speed and positioning accuracy. By acquiring position information in real time and adjusting the ultrasonic and airflow parameters accordingly, deviations can be corrected, thereby improving the stability and repeatability of the transmission process.

[0063] In a preferred embodiment, each cell 11 has a plurality of miniature piezoelectric ceramic oscillators 12 circumferentially arranged on its inner wall. These miniature piezoelectric ceramic oscillators 12 are distributed around the levitation region 111 to form an ultrasonic standing wave module 112 within the corresponding cell 11. This arrangement allows the ultrasonic excitation source to be positioned around the levitation region 111, and under controlled excitation, an ultrasonic standing wave field for supporting the microelectronic component can be formed near the levitation region 111. Because the oscillators are distributed circumferentially on the inner wall of the cell 11, the levitation effect is concentrated in the levitation region 111, thereby improving the stability of the microelectronic component's levitation position.

[0064] Preferably, six miniature piezoelectric ceramic transducers 12 are evenly distributed on the inner wall of each honeycomb unit 11, with a 60° interval between adjacent miniature piezoelectric ceramic transducers 12. When installing the miniature piezoelectric ceramic transducers 12, marks must be made on the same horizontal plane of the inner wall of the regular hexagonal honeycomb unit body 114 beforehand. Then, thermally conductive silicone is applied to the back of the miniature piezoelectric ceramic transducer 12 and it is pasted onto the corresponding marked position to ensure that the six miniature piezoelectric ceramic transducers 12 are on the same horizontal plane. Their positive and negative poles are connected in parallel with copper wires, guided and embedded in the grooves for fixation, and pass through the wire holes at the bottom of the corresponding honeycomb unit 11. The even circumferential arrangement of six transducers allows for a more balanced distribution of ultrasonic action around the suspension area 111, and also facilitates refined adjustment of the local suspension state through multi-channel independent control. Compared to structures with too few or unevenly distributed transducers, this arrangement is more conducive to forming a more stable suspension condition in the central region of the honeycomb unit 11, thus providing a foundation for the subsequent directional migration of microelectronic components.

[0065] In a preferred embodiment, each cellular unit 11 has multiple airflow channels 13 on its sidewall facing the suspension region 111. These multiple airflow channels 13 constitute a micro-airflow module 113 to apply directional driving force to the suspended microelectronic components from different directions. Since the microelectronic components are already lifted to a non-contact state by the ultrasonic standing wave field before the airflow acts, the micro-airflow output from the airflow channels 13 mainly undertakes the in-plane driving function, without needing to simultaneously blow the components up. This avoids introducing large random disturbances due to excessively strong airflow, which is beneficial for ensuring both component movement and positioning stability.

[0066] Preferably, each cellular cell 11 has three airflow channels 13, which are arranged at 120° intervals circumferentially. Further, the three airflow channels 13 are respectively located near the midpoints of the three opposite sides of the hexagonal cellular cell body 11411, and each airflow channel 13 is arranged towards the center of the cellular cell 11. Through this arrangement, driving forces can be applied to the suspension region 111 from different directions, enabling the microelectronic components to move to different adjacent cellular cells 11 as needed. Since the airflow channels 13 are correspondingly located near the midpoints of opposite sides and oriented towards the center, their output direction has a clear relationship with the suspension region 111, facilitating the control of the movement trend of the microelectronic components.

[0067] Specifically, the airflow control unit 3 includes a solenoid valve array 31, an external air supply system 32, and a control cabinet 33. The solenoid valve array 31 includes several solenoid valves, with one solenoid valve corresponding to each airflow channel 13, and each solenoid valve can be controlled independently. The external air supply system 32 is connected to the micro-airflow module 113 to deliver airflow to each airflow channel 13. The solenoid valves independently adjust the pressure and flow rate of the corresponding airflow channel 13.

[0068] More preferably, each airflow channel 13 is arranged at an angle of 30° to the inner wall of the honeycomb unit 11. This angle arrangement ensures that the output airflow, when acting towards the suspension region 111, provides the horizontal driving force required for the planar migration of the microelectronic component, without acting on the component in an overly vertical or overly close manner. This facilitates controlling the degree of airflow disturbance to the suspension state while driving the component's movement, thereby improving the problems of difficult airflow positioning and speed control.

[0069] In a preferred embodiment, the ultrasonic control unit 2 includes a multi-channel signal generator array 21 and a power amplifier array 22. The multi-channel signal generator array 21 outputs high-frequency vibration signals, and the power amplifier array 22 amplifies these high-frequency vibration signals and inputs the amplified signals to the corresponding miniature piezoelectric ceramic resonators 12 within the corresponding cellular unit 11. With this structure, the ultrasonic control unit 2 can provide corresponding drive signals to different cellular units 11 and adjust the operating state of the miniature piezoelectric ceramic resonators 12 within each cellular unit 11.

[0070] Furthermore, the multi-channel signal generator array 21 is correspondingly configured with multiple cellular units 11, enabling the micro piezoelectric ceramic oscillators 12 of different cellular units 11 to receive distinct high-frequency vibration signals. The power amplifier array 22 is used to perform power matching and amplification of the corresponding signals to meet the driving requirements for the micro piezoelectric ceramic oscillators 12 to form an ultrasonic standing wave field. Because the multi-channel signal generator array 21 and the power amplifier array 22 are used in conjunction, rather than a single signal source driving all cellular units 11, the multiple micro piezoelectric ceramic oscillators 12 within each cellular unit 11 can be controlled separately according to their location and transmission stage. Therefore, when the microelectronic component is in different stages such as initial levitation, cross-unit migration, target unit reception, or endpoint positioning, corresponding ultrasonic standing wave field conditions can be established for a local cellular unit 11, thus avoiding the problem of insufficient local adjustment capability under a unified overall excitation method.

[0071] In actual operation, when a microelectronic component is located within a cellular cell 11 and needs to maintain stable levitation, the ultrasonic control unit 2 can control multiple miniature piezoelectric ceramic vibrators 12 within that cellular cell 11 to output corresponding high-frequency vibrations, thereby forming the required ultrasonic standing wave field in the corresponding levitation region 111. When the microelectronic component is about to move to an adjacent cellular cell 11, the ultrasonic control unit 2 can not only maintain the levitation state of the current cellular cell 11, but also synchronously control the miniature piezoelectric ceramic vibrators 12 within the adjacent cellular cell 11 to establish the ultrasonic standing wave field required for reception in advance. Since the multi-channel signal generator array 21 supports synchronous adjustment of multiple cellular cells 11, the current cellular cell 11 and the target cellular cell 11 can be in different controlled states during the same transmission process, i.e., the current cellular cell 11 focuses on maintaining the existing levitation conditions, while the target cellular cell 11 focuses on forming the reception conditions. Based on this unit-based, stage-based ultrasonic control method, the microelectronic component can still maintain a relatively stable levitation state during the transition between units, thereby helping to reduce instability, offset, and positioning errors during unit switching.

[0072] Furthermore, since multiple micro piezoelectric ceramic oscillators 12 within a single cell 11 can be independently controlled, the local ultrasonic action can be finely adjusted based on the real-time state of the microelectronic component in the suspension region 111. Compared to a control strategy where all oscillators operate in the same manner, this setup is more conducive to targeted correction of the suspension state based on the actual position and motion trend of the microelectronic component. Especially when the microelectronic component is subjected to local airflow disturbances or slight displacement near the cell boundary, the controllability and stability of the suspension state can be improved by independently adjusting the driving state of multiple micro piezoelectric ceramic oscillators 12 within the corresponding cell 11, thereby forming a better synergistic relationship with the airflow drive.

[0073] In a preferred embodiment, the acquisition module 4 includes a laser displacement sensor 41, a high-speed camera 42, and a processor 6, and is communicatively connected to the ultrasonic control unit 2 and the airflow control unit 3, respectively. The laser displacement sensor 41 is used to monitor the forward and backward movement of the suspended object, and the high-speed camera 42 is used to acquire the image position information of the suspended object. Both are communicatively connected to the processor 6, transmitting the acquired forward and backward movement information and image position information to the processor 6 for analysis and processing. Based on the analysis and processing results, the processor 6 issues corresponding control commands to the ultrasonic control unit 2 and / or the airflow control unit 3 through a controller.

[0074] In this embodiment, the laser displacement sensor 41 is preferably mounted on the mounting plate 5 of the corresponding cellular unit 11, with its detection direction set along a preset main transmission direction, used to acquire the displacement change of the microelectronic component along the transmission path; the high-speed camera 42 is preferably positioned above or diagonally above the cellular array module 1, with its field of view covering the starting cellular unit 11, the target cellular unit 11, and the cross-unit transition area between them, used to acquire image position information of the microelectronic component within the suspended area 111 and during cross-unit transmission. Preferably, the laser displacement sensor 41 is fixed to the mounting plate 5 by bolts, the mounting plate 5 is disposed within the body of the corresponding cellular unit 11, and is kept stable by interference fit, with the sensor circuitry led out through the reserved portion of the mounting plate 5 and the bottom of the cellular unit 11. Through the above arrangement, the laser displacement sensor 41 and the high-speed camera 42 can respectively perform real-time detection of the microelectronic component from two dimensions: displacement change and spatial position, thereby providing a basis for the dynamic adjustment of ultrasonic parameters and airflow parameters, and helping to improve the accuracy of path correction and endpoint positioning.

[0075] Specifically, the laser displacement sensor 41 is used to acquire the displacement change of the suspended object in the transmission direction, and to determine whether the suspended object is advancing along a predetermined path and whether its current position has reached a preset transmission stage. The high-speed camera 42 is used to acquire the image position information of the suspended object to reflect the actual spatial position of the suspended object within the cellular unit 11 or between adjacent cellular units 11. By combining the forward and backward displacement information acquired by the laser displacement sensor 41 with the image position information acquired by the high-speed camera 42, the motion state of the suspended object can be characterized from different dimensions. Compared with using only a single sensing method for position detection, this setup can reflect both the displacement change of the suspended object along the transmission direction and its spatial position deviation in the actual suspended state, thus improving the completeness and reliability of position determination.

[0076] In actual operation, when a microelectronic component is within the suspension area 111 of a certain cellular cell 11, the laser displacement sensor 41 continuously monitors its forward and backward movement, while the high-speed camera 42 simultaneously acquires its image position. If the detection results indicate that the microelectronic component remains stable within the suspension area 111, the control system can maintain the current ultrasonic and airflow parameters. If abnormal forward and backward displacement, positional deviation, or deviation from the predetermined path is detected during transmission, the acquisition module 4 feeds back the corresponding real-time position information to the ultrasonic control unit 2 and the airflow control unit 3. The ultrasonic control unit 2 adjusts the ultrasonic parameters of the corresponding cellular cell 11 accordingly to change the suspension state; the airflow control unit 3 adjusts the airflow parameters of the corresponding airflow channel 13 accordingly to correct the direction and magnitude of the driving force. Thus, the suspended object can be continuously corrected during transmission, rather than being passively processed after a significant deviation occurs.

[0077] Furthermore, the laser displacement sensor 41 and the high-speed camera 42 detect the suspended object from two perspectives: displacement monitoring and image positioning. This allows the acquisition module 4 to not only perform dynamic correction during transmission but also determine whether the suspended object has accurately entered the target cellular unit 11 and reached the predetermined positioning position. Thus, after the microelectronic component completes cross-unit transmission, the control system can continue to fine-tune the ultrasonic and airflow parameters based on the position information fed back by the acquisition module 4, ensuring that the microelectronic component remains stably within the target suspension area 111. Therefore, the acquisition module 4 is not merely a simple detection component but, together with the ultrasonic control unit 2 and the airflow control unit 3, constitutes a closed-loop adjustment system based on real-time position feedback, thereby improving the continuity, stability, and positioning accuracy of the contactless transmission process.

[0078] This embodiment incorporates a laser displacement sensor 41 and a high-speed camera 42 into the acquisition module 4, and connects the acquisition module 4 to the ultrasonic control unit 2 and the airflow control unit 3. This allows the device to adjust ultrasonic and / or airflow parameters based on the real-time position of the suspended object. This configuration transforms the contactless transmission device from an open-loop control method relying solely on preset parameters to a closed-loop control method based on real-time position feedback. This is more effective in addressing issues such as unstable positioning, significant airflow disturbance, and insufficient speed control during path switching in microelectronic contactless transmission.

[0079] It should be noted that the microelectronic components to be transferred can be released via vacuum adsorption or conveyed by a pre-feeding mechanism to a position above or near the suspension area 111 of the preset starting cell unit 11. Subsequently, the ultrasonic standing wave module 112 corresponding to the starting cell unit 11 is activated, causing the microelectronic components to enter a suspension state and execute the subsequent cross-unit contactless transfer process. The starting cell unit 11 can be pre-selected according to the target transfer path or automatically designated by the control system according to the target position. Through the above settings, a clear correspondence is formed between the loading position of the microelectronic components and the subsequent transfer starting point, thereby providing clear starting conditions for the contactless transfer process and improving the stability of the initial suspension state.

[0080] Example 2

[0081] This invention also provides a contactless transmission method based on the contactless transmission device for microelectronic assembly described in Embodiment 1. By utilizing the coordinated operation of the cellular array module 1, the ultrasonic control unit 2, the airflow control unit 3, and the acquisition module 4, stable transmission and positioning of microelectronic components in a suspended state are achieved.

[0082] Before executing step S1, the microelectronic component to be transferred is first conveyed to a position above or near the suspension area 111 of the preset starting cell unit 11. The conveying method can be manual placement, transfer by a robotic arm, vacuum adsorption release, or conveying by a pre-feeding mechanism. Subsequently, the ultrasonic standing wave module 112 of the starting cell unit 11 is controlled to output an ultrasonic excitation signal, causing the microelectronic component to be transferred to enter a suspension state. This provides a clear implementation basis for the initial suspension conditions in the method steps and facilitates connection with subsequent path control processes.

[0083] Specifically, the contactless transmission method includes the following steps:

[0084] S1. The ultrasonic standing wave module 112 of the target cellular unit 11 outputs an ultrasonic excitation signal to form an ultrasonic standing wave field in the levitation region 111 of the target cellular unit 11, so that the microelectronic component to be transmitted is levitated.

[0085] In this embodiment, step S1 does not directly use airflow to propel the microelectronic component, but first establishes a stable suspension state through the ultrasonic standing wave module 112. Before subsequent movement, the microelectronic component is separated from the mechanical support and rigid contact, which changes its transmission basis from contact support to non-contact suspension support, thereby reducing the impact of friction, collision and surface damage.

[0086] Furthermore, the ultrasonic excitation signal in step S1 is output by the multi-channel signal generator array 21, amplified by the power amplifier array 22, and then input to the miniature piezoelectric ceramic oscillator 12 in the corresponding cellular unit 11 to form an ultrasonic standing wave field that suspends the microelectronic components. Using the multi-channel signal generator array 21 and the power amplifier array 22 in conjunction to output the ultrasonic excitation signal can, on the one hand, meet the driving requirements for the miniature piezoelectric ceramic oscillator 12 to establish an ultrasonic standing wave field, and on the other hand, facilitate setting the ultrasonic operating state according to different cellular units 11 and different transmission stages.

[0087] S2. According to the preset transmission direction, control the micro airflow module 113 of the current cellular unit 11 to output directional micro airflow to drive the microelectronic component in the suspended state to move toward the adjacent cellular unit 11.

[0088] In this step, the microelectronic components are already in a suspended state after step S1. Therefore, the directional micro-airflow mainly undertakes the driving role in the planar direction, without having to simultaneously undertake the role of suspension support. Thus, suspension maintenance and directional migration can be achieved by different technical means, making the airflow effect more focused on path guidance and speed regulation.

[0089] Furthermore, in step S2, the directional micro-airflow is output collaboratively by three airflow channels 13 within the current cellular unit 11. By adjusting the airflow output state of each airflow channel 13, the microelectronic component moves along a preset direction. By employing the collaborative output of three airflow channels 13, driving forces can be applied to the suspended microelectronic component from different directions, thus preventing it from moving in a single direction. Simultaneously, by adjusting the output state of each airflow channel 13 individually, the movement direction and speed of the microelectronic component can be selectively controlled according to the target path.

[0090] S3. Before the microelectronic component enters the adjacent cellular unit 11, the ultrasonic standing wave module 112 of the adjacent cellular unit 11 is controlled to pre-establish an ultrasonic standing wave field for receiving the microelectronic component.

[0091] While the current cellular cell 11 drives the microelectronic component to move towards the adjacent cellular cell 11, instead of waiting for the microelectronic component to enter the target cell before establishing the levitation condition, the target cell forms the ultrasonic standing wave field required to receive it in advance. As a result of this setting, the microelectronic component can maintain a continuous levitation state when crossing the boundary of the cellular cell 11, without having to go through the process of landing, re-floating, or colliding with the sidewall.

[0092] S4. The acquisition module 4 is used to acquire the real-time position information of the microelectronic component, and the ultrasonic control unit 2 and / or airflow control unit 3 are adjusted according to the real-time position information to keep the microelectronic component stably suspended and transmitted along a predetermined path.

[0093] In this embodiment, step S4 transforms the entire transmission process from open-loop control under preset parameters to closed-loop control based on real-time position feedback. By continuously acquiring real-time position information during transmission and adjusting the working state of the ultrasonic control unit 2 and / or the airflow control unit 3 according to the detection results, the suspension conditions and driving force conditions can be dynamically corrected according to the actual movement of the microelectronic components, thereby improving path control capability and positioning stability.

[0094] Furthermore, the real-time position information in step S4 includes forward and backward displacement information and image position information. The forward and backward displacement information is acquired by the laser displacement sensor 41, and the image position information is acquired by the high-speed camera 42. By combining forward and backward displacement information with image position information, the motion state of the microelectronic component can be characterized from different dimensions.

[0095] Furthermore, in step S4, when the microelectronic component is detected to deviate from the preset transmission path, the ultrasonic parameters and airflow parameters of the current cellular unit 11 and / or adjacent cellular units 11 are adjusted according to the real-time position information obtained by the acquisition module 4 to correct the deviation of the microelectronic component and complete its positioning. Since the ultrasonic parameters mainly affect the suspension stability of the microelectronic component, and the airflow parameters mainly affect its direction of movement and speed, by simultaneously adjusting the above two types of parameters, the deviation correction process can take into account both stability and movement.

[0096] S5. After the microelectronic component reaches the target position, maintain or adjust the ultrasonic standing wave field of the corresponding cellular unit 11 to achieve the positioning or assembly of the microelectronic component.

[0097] In this step, after the microelectronic component completes the path transmission and enters the target position, the levitation condition is not immediately removed. Instead, the ultrasonic standing wave field of the target cellular unit 11 is maintained or adjusted to keep the microelectronic component stably in the corresponding levitation area 111 to meet the requirements of subsequent assembly, testing or re-transfer.

[0098] Once the microelectronic component reaches the target cellular unit 11 and is positioned, it can be picked up or connected to subsequent assembly, testing, or transfer mechanisms while maintaining or removing the corresponding ultrasonic standing wave field. In other words, the contactless transfer method in this embodiment not only enables stable transfer of microelectronic components within the cellular array module 1 but also allows for seamless integration with subsequent assembly, testing, or sorting stations, thereby improving the applicability of this method in microelectronic assembly scenarios.

[0099] This invention, through the coordinated steps S1 to S5, enables microelectronic components to sequentially undergo a control process of "levitation establishment—directional driving—pre-acceptance transition—real-time correction—stable positioning" throughout the entire transmission process. Specifically, ultrasonic levitation provides non-contact support, directional micro-airflow enables in-plane migration, pre-established receiving standing wave fields in adjacent cellular units 11 ensure cross-unit continuity, and real-time feedback from the acquisition module 4 enables dynamic correction. Therefore, this embodiment is not a simple superposition of existing contactless transmission methods, but rather addresses the challenges of path constraints, airflow disturbance positioning, and speed control in contactless microelectronic transmission, forming a phased, functional, and closed-loop adjustable transmission method. Compared to schemes relying solely on a single driving method or a single straight path, this method offers better adaptability in terms of path flexibility, cross-unit stability, anti-disturbance positioning capability, and speed adjustment capability, making it more suitable for the high-precision and stable transmission requirements in microelectronic assembly scenarios.

[0100] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present invention.

[0101] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A contactless transmission device for microelectronic assembly, characterized in that, It includes a cellular array module, an ultrasonic control unit, an airflow control unit, and a data acquisition module; The cellular array module is composed of multiple interconnected cellular units. Each cellular unit is provided with a levitation area, an ultrasonic standing wave module for applying ultrasonic levitation force to the microelectronic components located in the levitation area, and a micro airflow module for applying directional driving force to the microelectronic components in the levitation state. The ultrasonic control unit is connected to the ultrasonic standing wave module in each cellular unit, and is used to control the formation or adjustment of the ultrasonic standing wave field required for levitation of the corresponding cellular unit, so that the microelectronic components are stably levitated. The airflow control unit is connected to the micro-airflow module in each cellular unit and is used to control the output of the corresponding cellular unit toward the suspended area to drive the microelectronic component to move from the current cellular unit to the adjacent cellular unit; The acquisition module is used to acquire the position information of microelectronic components in real time, and to control the ultrasonic control unit and / or airflow control unit to make adjustments based on the position information; When microelectronic components are transmitted across cellular units, the ultrasonic control unit activates the ultrasonic standing wave field of the target cellular unit in advance to ensure that the microelectronic components complete contactless transmission and positioning across units while in a suspended state.

2. The contactless transmission device for microelectronic assembly according to claim 1, characterized in that, The cellular unit includes a regular hexagonal cellular unit body. Multiple regular hexagonal cellular unit bodies are closely spliced ​​together to form the cellular array module. The splicing walls of the regular hexagonal cellular unit bodies are densely covered with a number of regular hexagonal through holes to form an array structure for cross-unit transmission of microelectronic components.

3. The contactless transmission device for microelectronic assembly according to claim 1, characterized in that, Each of the cellular cells has multiple micro piezoelectric ceramic vibrators circumferentially arranged on its inner wall. These micro piezoelectric ceramic vibrators are distributed around the suspended region to form the ultrasonic standing wave module within the corresponding cellular cell.

4. The contactless transmission device for microelectronic assembly according to claim 2, characterized in that, Each of the cellular cells has multiple airflow channels on its sidewalls that face the suspending region. These multiple airflow channels constitute the micro-airflow module, which applies directional driving force to the suspended microelectronic components from different directions.

5. A contactless transmission device for microelectronic assembly according to claim 4, characterized in that, Each of the aforementioned cellular units has three airflow channels inside, and the three airflow channels are arranged at 120° intervals along the circumference; The three airflow channels are respectively located near the midpoint of the three opposite sides of the regular hexagonal honeycomb cell body, and each airflow channel is arranged towards the center of the honeycomb cell. Each of the airflow channels is arranged at an angle to the inner wall of the honeycomb unit, and the angle is 30°.

6. The contactless transmission device for microelectronic assembly according to claim 1, characterized in that, The ultrasonic control unit includes a multi-channel signal generator array and a power amplifier array. The multi-channel signal generator array is used to output high-frequency vibration signals, and the power amplifier array is used to amplify the high-frequency vibration signals and input them to the micro piezoelectric ceramic oscillators in the corresponding cellular unit, so as to realize independent control of multiple micro piezoelectric ceramic oscillators in a single cellular unit and support synchronous adjustment of multiple cellular units.

7. The contactless transmission device for microelectronic assembly according to claim 1, characterized in that, The acquisition module includes a laser displacement sensor and a high-speed camera. The laser displacement sensor is used to monitor the forward and backward movement of the suspended object, and the high-speed camera is used to acquire the image position information of the suspended object. The acquisition module is connected to the ultrasonic control unit and the airflow control unit to adjust the ultrasonic parameters and / or airflow parameters according to the real-time position of the suspended object.

8. A contactless transmission method based on the contactless transmission device for microelectronic assembly according to any one of claims 1-7, characterized in that, Includes the following steps: S1. Control the ultrasonic standing wave module of the target cellular unit to output an ultrasonic excitation signal to form an ultrasonic standing wave field in the levitation area of ​​the target cellular unit, so that the microelectronic component to be transmitted is levitated. S2. According to the preset transmission direction, control the micro-airflow module of the current cellular unit to output directional micro-airflow to drive the microelectronic component in the suspended state to move toward the adjacent cellular unit. S3. Before the microelectronic component enters the adjacent cellular unit, the ultrasonic standing wave module of the adjacent cellular unit is controlled to pre-establish an ultrasonic standing wave field for receiving the microelectronic component. S4. The acquisition module is used to obtain the real-time position information of the microelectronic component, and the ultrasonic control unit and / or airflow control unit are adjusted according to the real-time position information to keep the microelectronic component stably suspended and transmitted along a predetermined path. S5. After the microelectronic component reaches the target position, maintain or adjust the ultrasonic standing wave field of the corresponding cellular unit to achieve the positioning or assembly of the microelectronic component.

9. The contactless transmission method according to claim 8, characterized in that, In step S1, the ultrasonic excitation signal is output by a multi-channel signal generator array and amplified by a power amplifier array before being input to the micro piezoelectric ceramic oscillator in the corresponding cellular unit to form an ultrasonic standing wave field that suspends the microelectronic components. In step S2, the directional micro-airflow is output collaboratively by multiple airflow channels within the current cellular unit. By adjusting the airflow output state of each airflow channel, the microelectronic component moves along a preset direction.

10. The contactless transmission method according to claim 8 or 9, characterized in that, In step S4, the real-time position information includes forward and backward displacement information and image position information, wherein the forward and backward displacement information is collected by a laser displacement sensor and the image position information is collected by a high-speed camera; When the microelectronic component is detected to deviate from the preset transmission path, the ultrasonic parameters and airflow parameters of the current cellular unit and / or adjacent cellular units are adjusted according to the real-time position information obtained by the acquisition module in order to correct the deviation of the microelectronic component and complete the positioning.

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