Transmission electron microscope based measurement system
By mounting a chip and testing circuit with a double-suspended thin film and cantilever structure in a transmission electron microscope (TEM), the problem that TEM cannot simultaneously measure physical structure and thermal transport properties was solved, realizing in-situ thermal transport measurement and structural characterization at the nanoscale, and improving the accuracy and stability of the measurement.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- PEKING UNIV
- Filing Date
- 2026-02-13
- Publication Date
- 2026-06-23
Smart Images
Figure CN122259618A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of transmission electron microscopy (TEM) technology, and more particularly to a measurement system based on TEM. Background Technology
[0002] Transmission electron microscopy (TEM) is an important scientific instrument for materials science research. It has a high spatial resolution and, combined with electron energy loss spectroscopy, can obtain a wealth of information about the structure and properties of materials.
[0003] In related technologies, scanning transmission electron microscopy (STEM) with ultra-high energy resolution electron energy loss spectroscopy (UHESE) is used to measure the correlation between the atomic structure and electronic and phonon structures of materials. However, this method can only detect the physical properties of materials and cannot directly reflect the true transport performance of materials. It also has the problem that it is impossible to simultaneously measure the physical properties and thermal transport performance of the same sample. Summary of the Invention
[0004] This application aims to at least partially address one of the technical problems in the related art. To this end, the first objective of this application is to propose a measurement system based on transmission electron microscopy (TEM). This system, by incorporating a chip with a double-suspended thin film and a cantilever structure, a customized electron microscope sample holder with multiple test circuits, and a measurement module connected to the test circuits, enables the simultaneous measurement of the physical properties, structure, and thermal transport properties of the same sample in a TEM.
[0005] To achieve the above objectives, the first aspect of this application proposes a measurement system based on a transmission electron microscope (TEM). The system includes a chip, an electron microscope sample holder, and a measurement module. The chip comprises two suspended thin films arranged side-by-side, each supported by multiple cantilever beams. The two ends of the sample to be tested rest on the two suspended thin films. The electron microscope sample holder carries the chip and includes multiple test circuits, each connected to a corresponding cantilever beam. The measurement module is connected to the multiple test circuits and measures the sample to obtain the heat transfer measurement results of the sample. One end of the electron microscope sample holder carrying the chip is positioned within the TEM.
[0006] The transmission electron microscope (TEM)-based measurement system according to an embodiment of this application includes a chip, an electron microscope sample holder, and a measurement module. The chip comprises two suspended thin films arranged side by side, each supported by multiple cantilever beams. The two ends of the sample to be tested rest on the two suspended thin films. The electron microscope sample holder carries the chip and includes multiple test circuits, each connected to a corresponding cantilever beam. The measurement module is connected to the multiple test circuits to measure the sample to obtain the thermal transport measurement results. One end of the electron microscope sample holder carrying the chip is positioned within the TEM. Thus, by using a chip with a double suspended thin film and cantilever structure, a customized electron microscope sample holder with multiple test circuits, and a measurement module connected to the test circuits, this system enables simultaneous measurement of the physical properties and thermal transport performance of the same sample within a TEM.
[0007] In addition, the transmission electron microscope-based measurement system according to the above embodiments of this application may also have the following additional technical features: According to one embodiment of this application, the two suspended films include a first suspended film and a second suspended film. A first heating unit is provided on the first suspended film, and a second heating unit is provided on the second suspended film. A first connecting seat is provided on the first suspended film, and a second connecting seat is provided on the second suspended film. The two ends of the sample to be tested are respectively placed on the first connecting seat and the second connecting seat. A conductive layer is plated on the first connecting seat, the second connecting seat, and the multiple suspension beams.
[0008] Through the above-mentioned technical means, the embodiments of this application can functionally differentiate and structurally design two suspended films, and use the first and second heating units to achieve integrated heating and temperature measurement. The first and second connecting seats ensure the stability and contact reliability of the nanoscale sample to be tested. At the same time, by depositing a conductive layer on the connecting seats and the suspension beam as a whole, a low-loss and high-stability electrical signal transmission path is constructed. This not only allows for the regulation and detection of the temperature field at both ends of the sample, realizing bidirectional verification of heat transfer performance and improving measurement accuracy, but also avoids problems such as poor contact or positional displacement of the sample during the test. This ensures the accuracy and consistency of the microstructure characterization and heat transport performance measurement data of the nanosample in the in-situ environment of transmission electron microscopy.
[0009] According to one embodiment of this application, the multiple cantilever beams include a first cantilever beam, a second cantilever beam, a third cantilever beam, and a fourth cantilever beam supporting a first suspended film. The multiple test circuits include a first test circuit and a second test circuit. One end of the first and second cantilever beams is connected to a first heating unit, and the other end of the first and second cantilever beams is connected to the first test circuit to form a first test circuit. One end of the third and fourth cantilever beams is connected to the first heating unit, and the other end of the third and fourth cantilever beams is connected to the second test circuit to form a second test circuit.
[0010] Through the above-mentioned technical means, the embodiments of this application can configure four independent suspension beams for the first suspended film and divide them into two independent test circuits. The first suspension beam, the second suspension beam and the first test circuit form the first test circuit, and the third suspension beam, the fourth suspension beam and the second test circuit form the second test circuit. This improves the stability of electrical signal transmission and the reliability of circuit conduction. At the same time, both independent test circuits are connected to the first heating unit, realizing the separation of the path for electrical signal input and detection of the first heating unit. This improves the accuracy of detecting electrical signals such as current and voltage of the first heating unit, and can more accurately reflect the temperature state of the first heating unit through changes in electrical signals. This makes the signal control and data acquisition of in-situ heat transport measurement in transmission electron microscopy more stable and accurate.
[0011] According to one embodiment of this application, a first ammeter is connected in series in the first test circuit, and a first lock-in amplifier is connected in series in the second test circuit.
[0012] Through the aforementioned technical means, this embodiment of the application can connect a first ammeter in series in the first test circuit and a lock-in amplifier in series in the second test circuit to achieve real-time acquisition of the input current of the first heating unit, providing basic parameters for heat flow calculation. By utilizing the noise reduction and amplification function of the lock-in amplifier, the influence of external electromagnetic interference on the electrical signal is filtered out, and the voltage of the first heating unit is measured. The coordinated acquisition of current and voltage data, combined with the resistance of the first heating unit, can accurately deduce the real-time temperature of the first heating unit, improving the accuracy of the temperature monitoring of the first suspended thin film. This provides key data for the control of the temperature difference between the two ends of the sample under test and the calculation of heat transfer performance. At the same time, the circuit configuration is adapted to the complex electromagnetic environment of the transmission electron microscope, ensuring the stability and reliability of the electrical signal acquisition during the measurement process and improving the heat transport measurement accuracy of the system.
[0013] According to one embodiment of this application, the multiple suspension beams further include a sixth, seventh, eighth, and ninth suspension beam supporting the second suspended film, and the multiple test circuits further include a third and fourth test circuit. One end of the sixth and seventh suspension beams is connected to the second heating unit, and the other end of the sixth and seventh suspension beams is connected to the third test circuit to form a third test loop. One end of the eighth and ninth suspension beams is connected to the second heating unit, and the other end of the eighth and ninth suspension beams is connected to the fourth test circuit to form a fourth test loop.
[0014] Through the above-mentioned technical means, the embodiments of this application can configure four independent suspension beams for the second suspended film and construct two independent test circuits, namely the third and fourth. The sixth and seventh suspension beams and the third test circuit form the power supply / signal transmission circuit of the second heating unit, and the eighth and ninth suspension beams and the fourth test circuit form the detection circuit of the second heating unit. This realizes the separation of the path for electrical signal input and detection of the second heating unit, effectively avoiding signal interference. At the same time, it forms a symmetrical complement with the dual-circuit design of the first suspended film, so that both ends of the sample under test have electrical signal control and detection capabilities, ensuring the consistency of temperature field regulation at both ends of the sample and the accuracy of temperature data acquisition, and improving the measurement stability and data reliability of the system in the in-situ environment of transmission electron microscopy.
[0015] According to one embodiment of this application, a second ammeter is connected in series in the third test circuit, and a second lock-in amplifier is connected in series in the fourth test circuit.
[0016] Through the above-mentioned technical means, the embodiments of this application can connect a second ammeter in series in the third test circuit and a second lock-in amplifier in series in the fourth test circuit, thereby realizing the current acquisition of the second heating unit and the noise reduction, amplification and high-precision measurement of weak voltage signals. In addition, combined with the resistance of the second heating unit, the temperature information of the second heating unit can be accurately obtained. This forms a symmetrical cooperation with the detection structure of the first heating unit, ensuring that the accuracy and stability of temperature detection at both ends of the sample are consistent, improving the accuracy of temperature difference measurement at both ends of the sample, and enhancing the anti-interference ability and reliability of measurement in the complex environment of transmission electron microscopy.
[0017] According to one embodiment of this application, the measurement module includes a control unit, wherein the control unit is specifically configured to: input a first DC heating current to a first heating unit through a first test circuit, and input a second DC heating current to a second heating unit through a third test circuit; obtain a first actual heating current of the first heating unit through a first ammeter, and obtain a second actual heating current of the second heating unit through a second ammeter; apply a first AC test voltage to the first heating unit through a first lock-in amplifier, and apply a second AC test voltage to the second heating unit through a second lock-in amplifier; calculate a first temperature of the first heating unit and a second temperature of the second heating unit based on the first actual heating current, the second actual heating current, the first resistance of the first heating unit, the second resistance of the second heating unit, the first AC test voltage, and the second AC test voltage; and control the magnitudes of the first DC heating current and the second DC heating current based on the first temperature and the second temperature, respectively, so that the temperature difference between the first temperature and the second temperature is maintained at a preset temperature.
[0018] Through the above-mentioned technical means, the embodiments of this application can realize the integrated control of the entire process of DC heating, real-time temperature measurement, automatic temperature control and AC testing of the first and second heating units through the control unit. It can calculate the temperature of the heating units at both ends based on the collected current, voltage and resistance of the heating units, and dynamically adjust the heating current to stably maintain the preset temperature difference, ensuring the stable temperature conditions required for heat transfer performance measurement, improving the automation level, control accuracy and data accuracy of the entire measurement process, avoiding the interference of temperature fluctuations on the test results, and enabling the system to complete high-precision and repeatable synchronous heat transport measurement in the in-situ environment of transmission electron microscopy.
[0019] According to one embodiment of this application, the measurement module further includes a testing unit, wherein the testing unit is specifically configured to: while maintaining the temperature difference between the first temperature and the second temperature at a preset temperature, adjust the amplitude, frequency, and / or phase of the first AC test voltage and the second AC test voltage respectively based on a preset measurement strategy; obtain a first test current of the first heating unit through the first ammeter and a second test current of the second heating unit through the second ammeter; obtain a first test voltage of the first heating unit through the first lock-in amplifier and a second test voltage of the second heating unit through the second lock-in amplifier; and generate a heat transfer measurement result of the sample under test based on the preset measurement strategy, the first temperature, the second temperature, the first test current, the second test current, the first test voltage, and the second test voltage.
[0020] Through the above-mentioned technical means, the embodiments of this application can flexibly adjust the amplitude, frequency and phase of the two AC test voltages according to the preset measurement strategy through the test unit, and collect the current and voltage of the heating unit with the help of the ammeter and lock-in amplifier. Combined with the stable temperature parameters for comprehensive calculation, it is possible to measure the heat transfer performance of the sample under test, ensuring that the measurement process is controllable and the results are reliable.
[0021] According to one embodiment of this application, a transmission electron microscope is used to measure the atomic structure and physical properties of a sample.
[0022] Through the above-mentioned technical means, the embodiments of this application can use transmission electron microscopy to detect the atomic structure and physical properties of the sample under test. Under the same test conditions, in-situ synchronous characterization with heat transfer performance measurement can be achieved. This can obtain both macroscopic heat transport performance data of the sample and microscopic structural information such as atomic arrangement, crystal structure, and interface, realizing the correlation between macroscopic performance and microscopic structure. This provides comprehensive, accurate, and reliable data for the mechanism study of the relationship between material structure and heat transfer characteristics, and enhances the scientific research value and application scenarios of the entire measurement system. Attached Figure Description
[0023] Figure 1 This is a block diagram of a transmission electron microscope-based measurement system according to some embodiments of this application; Figure 2 This is a schematic diagram of a suspended film according to a specific embodiment of this application; Figure 3 This is a schematic diagram illustrating the working principle of a transmission electron microscope-based measurement system according to a specific embodiment of this application. Detailed Implementation
[0024] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.
[0025] The measurement system based on transmission electron microscopy according to embodiments of this application will now be described in detail with reference to the accompanying drawings.
[0026] Transmission electron microscopy (TEM) is an important scientific instrument in materials science research, possessing high spatial resolution. Combined with electron energy loss spectroscopy (EES), it can obtain a wealth of structural and property information about materials. TEM utilizes electrons as the detection method; electrons interact with materials through elastic and inelastic scattering. Elastic scattering often reveals structural information, i.e., spatial resolution, while inelastic scattering typically reveals material properties, including electronic and phonon structures. If the spatial resolution of an electron microscope reflects the sharpness of the image, then its energy resolution reflects the color of the image; higher energy resolution results in more vivid and richer colors.
[0027] In related technologies, scanning transmission electron microscopy (STEM) with spatial resolution combined with ultra-high energy resolution (UHEP), specifically UHEP electron energy loss spectroscopy, can correlate the atomic structure of a material with its electronic and phonon structures, thus establishing a relationship between material structure and physical properties. However, this technology currently only allows for the measurement of the atomic and physical property structures of materials and cannot directly reflect the true physical properties of the material.
[0028] Taking the measurement of phonon structure of materials using ultra-high energy-resolution electron energy loss spectroscopy (UHES) with scanning transmission electron microscopy as an example, the experiment measures the electron energy loss spectrum at different spatial locations of the material, reflecting its phonon structure characteristics. For non-metallic materials, phonons are closely related to their thermal transport properties, but the phonon structure of materials is often very complex, and the measured phonon structure often cannot reflect the thermal transport properties of the nanostructure sample. In current experimental techniques, measuring the thermal transport of materials usually requires a bulk sample with a size on the order of centimeters or even larger, while the size of the sample characterized by transmission electron microscopy is a standard micrograting with a diameter of 3 millimeters. The specific size difference between the two creates a huge gap between the phonon structure and thermal transport properties of the correlated material, making it difficult to simultaneously measure the phonon structure and thermal transport properties of a Wiener-scale sample.
[0029] To address at least one of the aforementioned technical problems, this application proposes a measurement system based on a transmission electron microscope (TEM). By incorporating a chip with a double-suspended thin film and a cantilever structure, a customized TEM sample holder with multiple test circuits, and a measurement module connected to the test circuits, the system enables simultaneous measurement of the physical properties, structure, and thermal transport performance of the same sample within the TEM.
[0030] The measurement system based on transmission electron microscopy according to the embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0031] Reference Figure 1The measurement system 100 based on transmission electron microscopy (TEM) of this application includes: a chip 10, an electron microscope sample rod 20, and a measurement module 30. The chip 10 includes two suspended thin films arranged side-by-side, each supported by multiple cantilever beams. The two ends of the sample to be tested rest on the two suspended thin films. The electron microscope sample rod 20 is used to mount the chip 10 and includes multiple test circuits, each connected to a corresponding cantilever beam. The measurement module 30 is connected to the multiple test circuits and is used to measure the sample to obtain the heat transfer measurement results of the sample. One end of the electron microscope sample rod 20 carrying the chip 10 is disposed within the TEM.
[0032] Specifically, chip 10 is the core component that carries the sample to be tested and realizes thermal field control and electrical signal transmission. It can be a micro-nano in-situ testing chip adapted to the requirements of transmission electron microscopy (TEM) characterization. The sample to be tested can be a TEM sample processed by focused ion beam or a sample suitable for TEM characterization, such as one-dimensional nanowires. The materials of the sample to be tested are diverse, such as metals, ceramics, semiconductors, powder / nanoparticle materials, proteins, cells, and polymers. Chip 10 includes two suspended thin films arranged side by side. The suspended thin films can be low thermal conductivity films made of silicon nitride or silicon dioxide, which can effectively reduce heat loss and ensure the accuracy of thermal transport measurement. The two suspended thin films are supported by multiple cantilever beams. The multiple cantilever beams and the suspended thin films are micro-fabricated as a whole, with one end connected to the chip substrate and the other end connected to the suspended thin film, realizing the mechanical support of the suspended thin film and also serving as the channel for electrical signal transmission. The two ends of the sample to be tested are placed on the two suspended thin films, so that the middle section of the sample being tested is in a suspended state, avoiding interference from the substrate to the thermal transport process of the sample.
[0033] The electron microscope sample holder 20 is a modified sample holder adapted to the sample chamber of a transmission electron microscope (TEM). Its structure can be specifically adjusted to suit the original structure of different brands of TEMs. The functions of the electron microscope sample holder 20 include mounting the chip 10, fixing it, and transmitting electrical signals. The sample holder 20 has an interface for measuring the thermal transport properties of the sample. Internally, the electron microscope sample holder 20 includes multiple test circuits. One end of each test circuit is connected to the corresponding cantilever beam, and the other end is connected to the measurement module 30. This established signal path enables the transmission of external electrical signals to the chip 10 and the feedback of test signals from the chip 10 to the measurement module 30.
[0034] The measurement module 30 is an electronic control unit that integrates signal output, data acquisition, and calculation analysis. It is connected to multiple test circuits through the interface of the electron microscope sample rod 20 to form a complete electrical signal transmission loop. During operation, it applies a controllable DC heating current and AC test voltage to the suspended thin film of the chip 10 through the test circuit. At the same time, it collects physical signals such as current and voltage in the loop. Then, through a preset measurement strategy, combined with the collected data such as heat flow and temperature difference, it calculates the thermal conductivity, thermal conductivity and other heat transfer measurement results of the sample under test.
[0035] One end of the electron microscope sample holder 20, which carries the chip 10, is located inside the sample chamber of the transmission electron microscope (TEM) and fixed within the effective focusing field of view of the electron beam. The sample holder body cooperates with the vacuum sealing structure of the TEM to ensure a high vacuum environment in the sample chamber without changing the original structure and working mode of the TEM. This allows the sample to be tested on the chip 10 to be within the characterization range of the TEM, enabling in-situ measurement of the atomic structure and physical properties of the sample. Simultaneously, through the test circuit outside the sample holder and in cooperation with the measurement module 30, the thermal transport performance of the same sample is measured, achieving in-situ synchronous measurement of the structural characterization and thermal transport performance of nanoscale samples.
[0036] This embodiment, through the collaborative design of a chip, an electron microscope sample holder, and a measurement module, integrates a chip adapted to nanoscale samples into a transmission electron microscope (TEM). This achieves circuit connectivity between the measurement module and the chip, as well as thermal transfer performance detection. It solves the problem in related technologies where thermal transfer performance measurement and structural characterization of the same sample cannot be performed simultaneously. This system enables the measurement of thermal transfer performance of the same sample at the nanoscale, while simultaneously achieving in-situ characterization of the sample's atomic and physical properties using the TEM. It establishes the correlation between the sample's thermal transfer performance and microstructure. The system is integrated into the TEM as an accessory, requiring no changes to the original TEM structure. It can be adapted to different brands of TEM by simply adjusting the sample holder structure, demonstrating strong adaptability. This provides a new in-situ measurement scheme for studying the intrinsic relationship between sample microstructure and thermal transport properties in materials science, improving the efficiency and accuracy of structure-property relationship studies in nanomaterials.
[0037] In some embodiments of this application, the two suspended films include a first suspended film and a second suspended film. The first suspended film is provided with a first heating unit, and the second suspended film is provided with a second heating unit. The first suspended film is provided with a first connecting seat, and the second suspended film is provided with a second connecting seat. The two ends of the sample to be tested are respectively placed on the first connecting seat and the second connecting seat. The first connecting seat, the second connecting seat, and the multiple suspension beams are all coated with a conductive layer.
[0038] Specifically, the two suspended films include a first suspended film and a second suspended film, such as... Figure 2 The diagram shows a schematic of the suspended thin film. As can be seen, the first and second suspended thin films are arranged symmetrically side by side on the chip, with a gap between them to accommodate the nanoscale test sample (one-dimensional nanowire). This allows the test section to be suspended after the sample is overlapped. The first suspended thin film is equipped with a first heating unit (heat source R). h The second suspended film is equipped with a second heating unit (heat sink R). s Both the first and second heating units are serpentine platinum electrode thermometer structures, fabricated on the surface of the corresponding suspended thin film. They can function as heating elements to generate Joule heating and as temperature sensing elements to reflect the real-time temperature of the corresponding suspended thin film through their own resistance-temperature characteristics, thus achieving integrated heating and temperature measurement functions. Specifically, when an electric current is applied to the heat source, heat is transferred to the heat sink through the one-dimensional nanowire. By measuring the temperature difference between the heat source and the heat sink, as well as the heat flow through the nanowire, the thermal conductivity of the nanowire can be calculated according to Fourier's law.
[0039] A first connecting seat is provided on the first suspended film, and a second connecting seat is provided on the second suspended film. The first and second connecting seats are pre-fabricated metal protrusion structures on the surfaces of the first and second suspended films, respectively, serving as overlap sites for the sample under test. This improves the stability of the physical contact and electrical connection between the sample under test and the suspended film. The two ends of the sample under test can be overlapped on the first and second connecting seats respectively through electron beam induced deposition, micro-welding, or other methods, ensuring that the sample does not shift its position during the test.
[0040] The surfaces of the first connecting seat, the second connecting seat, and multiple cantilever beams can be coated with a metal conductive layer using processes such as magnetron sputtering and vapor deposition. The conductive layer can preferably be made of metal materials with excellent conductivity and oxidation resistance, such as platinum and gold. All conductive layers form interconnected conductive paths, with one end electrically connected to the first heating unit and the second heating unit, and the other end connected to the test circuit on the electron microscope sample rod. This ensures that external electrical signals can be stably transmitted to the heating unit, while also allowing the test signals on the suspended thin film and the sample to be tested to be fed back to the external measurement module without loss.
[0041] This embodiment integrates heating and temperature measurement by functionally differentiating and structurally designing two suspended films and utilizing first and second heating units. The first and second connecting seats ensure the stability and reliability of the nanoscale sample overlap. Furthermore, by integrally depositing a conductive layer on the connecting seats and the suspension beam, a low-loss, high-stability electrical signal transmission path is constructed. This not only allows for the regulation and detection of the temperature fields at both ends of the sample, enabling bidirectional verification of heat transfer performance and improving measurement accuracy, but also avoids problems such as poor contact or positional shift of the sample during testing. This ensures the accuracy and consistency of the nanoscale sample microstructure characterization and heat transport performance measurement data under in-situ transmission electron microscopy conditions.
[0042] In some embodiments of this application, the multiple cantilever beams include a first cantilever beam, a second cantilever beam, a third cantilever beam, and a fourth cantilever beam supporting the first suspended film, and the multiple test circuits include a first test circuit and a second test circuit. One end of the first and second cantilever beams is connected to the first heating unit, and the other end of the first and second cantilever beams is connected to the first test circuit to form a first test loop. One end of the third and fourth cantilever beams is connected to the first heating unit, and the other end of the third and fourth cantilever beams is connected to the second test circuit to form a second test loop.
[0043] Specifically, the multiple suspension beams include a first suspension beam, a second suspension beam, a third suspension beam, and a fourth suspension beam that support the first suspended film. The first, second, third, and fourth suspension beams are symmetrically distributed on both sides of the first suspended film, providing stable mechanical support for the first suspended film. At the same time, they serve as conductive carriers connecting the first heating unit to the external test circuit. All four suspension beams are electrically connected to the first heating unit to ensure the stability of electrical signal transmission.
[0044] The multiple test circuits include a first test circuit and a second test circuit. The first test circuit and the second test circuit are two independent circuits inside the electron microscope sample rod, which do not generate signal interference. One end of the first suspension beam and the second suspension beam are respectively connected to the first heating unit, and the other end of the first suspension beam and the second suspension beam are respectively connected to the first test circuit to form a first test loop. This loop is the power supply loop of the first heating unit, which is used to send electrical signals to the first heating unit to realize the heating function.
[0045] One end of the third and fourth suspension beams is connected to the first heating unit, and the other end of the third and fourth suspension beams is connected to the second test circuit to form a second test circuit. This circuit is the detection circuit of the first heating unit and is used to collect the changes in electrical signals during the operation of the first heating unit.
[0046] The two test circuits are set up independently and each performs its own function. The power supply and detection functions are separated, which can effectively avoid the interference of signal fluctuations during the power supply process on the test results. This allows the heating power regulation and electrical signal detection of the first heating unit to be carried out simultaneously, improving the accuracy of monitoring the working status of the first heating unit.
[0047] This embodiment configures four independent suspension beams for the first suspended film and divides them into two independent test circuits. The first and second suspension beams form the first test circuit with the first test circuit, and the third and fourth suspension beams form the second test circuit with the second test circuit. This improves the stability of electrical signal transmission and the reliability of circuit conduction. At the same time, both independent test circuits are connected to the first heating unit, realizing the separation of the path for electrical signal input and detection of the first heating unit. This improves the accuracy of detecting electrical signals such as current and voltage of the first heating unit, and can more accurately reflect the temperature state of the first heating unit through changes in electrical signals. This makes the signal control and data acquisition of in-situ heat transport measurement in transmission electron microscopy more stable and accurate.
[0048] In some embodiments of this application, a first ammeter is connected in series in the first test circuit, and a first lock-in amplifier is connected in series in the second test circuit.
[0049] Specifically, the first test circuit provides a stable current input to the first heating unit. A first ammeter, which can be a picoampere ammeter, is connected in series in the first test circuit to collect the DC heating current in the first test circuit in real time. The second test circuit is a detection circuit for detecting the electrical signal response of the first heating unit. A first lock-in amplifier is connected in series in the second test circuit. Because the first heating unit is affected by the electromagnetic environment of the transmission electron microscope sample cavity during operation, generating background noise signals, the first lock-in amplifier can extract the effective electrical signal of the first heating unit from the noise and amplify it by locking the frequency and phase of the input signal, thereby avoiding voltage measurement errors caused by noise. The voltage obtained by the first lock-in amplifier, combined with the current data of the first ammeter and the resistance of the first heating unit, can be used to calculate the temperature data of the first suspended film (i.e., the temperature data of the first heating unit), providing a basis for calculating the temperature difference between the two ends of the sample under test.
[0050] This embodiment achieves real-time acquisition of the input current of the first heating unit by connecting a first ammeter in series in the first test circuit and a lock-in amplifier in series in the second test circuit. This provides basic parameters for heat flow calculation. By utilizing the noise reduction and amplification function of the lock-in amplifier, the influence of external electromagnetic interference on the electrical signal is filtered out, enabling the measurement of the voltage of the first heating unit. The coordinated acquisition of current and voltage data, combined with the resistance of the first heating unit, can accurately deduce the real-time temperature of the first heating unit, improving the accuracy of the temperature monitoring of the first suspended thin film. This provides key data for the control of the temperature difference between the two ends of the sample under test and the calculation of heat transfer performance. At the same time, the circuit configuration is adapted to the complex electromagnetic environment of the transmission electron microscope, ensuring the stability and reliability of the electrical signal acquisition during the measurement process and improving the accuracy of the system's heat transport measurement.
[0051] In some embodiments of this application, the multiple cantilever beams further include a sixth, seventh, eighth, and ninth cantilever beam supporting the second suspended film, and the multiple test circuits further include a third and fourth test circuit. One end of the sixth and seventh cantilever beams is connected to the second heating unit, and the other end of the sixth and seventh cantilever beams is connected to the third test circuit to form a third test circuit. One end of the eighth and ninth cantilever beams is connected to the second heating unit, and the other end of the eighth and ninth cantilever beams is connected to the fourth test circuit to form a fourth test circuit.
[0052] Specifically, the multiple suspension beams also include a sixth, seventh, eighth, and ninth suspension beam that support the second suspended film. The sixth, seventh, eighth, and ninth suspension beams are four suspension beams that support the second suspended film and are symmetrically arranged on both sides of the second suspended film. The end of each of the four suspension beams closest to the second heating unit is electrically connected to the second heating unit, serving as a conductive transmission carrier between the second heating unit and the external test circuit.
[0053] The multiple test circuits also include a third and a fourth test circuit. These are two independent test circuits newly added inside the electron microscope sample holder, and they do not interfere with the first and second test circuits. One end of the sixth and seventh suspension beams is connected to the second heating unit, and the other end of each beam is connected to the third test circuit, forming the third test loop. The second heating unit is connected in series in this loop. One end of the eighth and ninth suspension beams is connected to the second heating unit, and the other end of each beam is connected to the fourth test circuit, forming the fourth test loop. The second heating unit is also connected in series in this loop.
[0054] The second heating unit also features dual independent test circuits. By using two suspension beams to form a single circuit, the stability of the electrical signal transmission of the second heating unit is improved. Furthermore, the independent setup of the third and fourth test circuits separates the electrical signal input and detection paths of the second heating unit, enabling simultaneous current input and voltage detection. This provides accurate data for temperature monitoring of the second suspended film and forms a symmetrical combination with the dual-circuit design of the first suspended film, ensuring the consistency of temperature field control and detection at both ends of the sample under test and improving the accuracy of heat transfer performance measurement.
[0055] This embodiment configures four independent suspension beams for the second suspended film and constructs two corresponding independent test circuits (the third and fourth). The sixth and seventh suspension beams and the third test circuit form the power supply / signal transmission circuit for the second heating unit, while the eighth and ninth suspension beams and the fourth test circuit form the detection circuit for the second heating unit. This achieves the separation of the electrical signal input and detection pathways for the second heating unit, effectively avoiding signal interference. At the same time, it forms a symmetrical and complementary design with the dual-circuit design of the first suspended film, enabling both ends of the sample to have electrical signal control and detection capabilities. This ensures the consistency of temperature field regulation at both ends of the sample and the accuracy of temperature data acquisition, improving the measurement stability and data reliability of the system in the in-situ environment of transmission electron microscopy.
[0056] In some embodiments of this application, a second ammeter is connected in series in the third test circuit, and a second lock-in amplifier is connected in series in the fourth test circuit.
[0057] Specifically, a second ammeter is connected in series in the third test circuit to collect and monitor the current input to the second heating unit in real time, providing current data for the temperature control and heat flow calculation of the second heating unit. The fourth test circuit, serving as the voltage signal detection loop for the second heating unit, is connected in series with a second lock-in amplifier. This second lock-in amplifier filters, reduces noise, and amplifies the weak electrical signal output from the second heating unit, suppressing interference signals in the environment and improving the signal-to-noise ratio. The actual voltage value across the second heating unit is obtained through the second lock-in amplifier. Combined with the current measured by the second ammeter and the resistance of the first heating unit, the temperature of the second heating unit (temperature data of the second suspended film) can be accurately calculated, providing stable and reliable data for measuring the temperature difference across the sample and calculating its heat transfer performance.
[0058] This embodiment achieves current acquisition of the second heating unit and noise reduction, amplification, and high-precision measurement of weak voltage signals by connecting a second ammeter in series in the third test circuit and a second lock-in amplifier in series in the fourth test circuit. In addition, by combining the resistance of the second heating unit, the temperature information of the second heating unit can be accurately obtained. It forms a symmetrical cooperation with the detection structure of the first heating unit, ensuring consistent accuracy and stability of temperature detection at both ends of the sample. This improves the accuracy of temperature difference measurement at both ends of the sample and enhances the anti-interference ability and reliability of measurement in the complex environment of transmission electron microscopy.
[0059] In some embodiments of this application, the measurement module includes a control unit, which is specifically configured to: input a first DC heating current to a first heating unit through a first test circuit, and input a second DC heating current to a second heating unit through a third test circuit; obtain a first actual heating current of the first heating unit through a first ammeter, and obtain a second actual heating current of the second heating unit through a second ammeter; apply a first AC test voltage to the first heating unit through a first lock-in amplifier, and apply a second AC test voltage to the second heating unit through a second lock-in amplifier; calculate a first temperature of the first heating unit and a second temperature of the second heating unit based on the first actual heating current, the second actual heating current, the first resistance of the first heating unit, the second resistance of the second heating unit, the first AC test voltage, and the second AC test voltage; and control the magnitudes of the first DC heating current and the second DC heating current based on the first temperature and the second temperature, respectively, so that the temperature difference between the first temperature and the second temperature is maintained at a preset temperature. The preset temperature can be calibrated according to actual conditions; for example, the preset temperature can be 5°C.
[0060] Specifically, the measurement module includes a control unit, which, as the core control component of the entire measurement module, is responsible for the automatic regulation and data processing of the entire heating, temperature measurement, and testing process. The control unit first supplies a first DC heating current to the first heating unit through the first test circuit, and simultaneously supplies a second DC heating current to the second heating unit through the third test circuit, providing basic heating for the first and second suspended films and creating a temperature difference between the two ends of the sample under test.
[0061] During the heating process, the control unit acquires the first actual heating current of the first heating unit in real time using a first ammeter, and the second actual heating current of the second heating unit in real time using a second ammeter. It then applies a first AC test voltage to the first heating unit via a first lock-in amplifier, and a second AC test voltage to the second heating unit via a second lock-in amplifier. Based on the acquired actual currents (first and second actual heating currents) and actual voltages (first and second AC test voltages), and in conjunction with the resistances (first and second resistances), the control unit calculates the first temperature corresponding to the first heating unit and the second temperature corresponding to the second heating unit.
[0062] It should be noted that the first resistor and the second resistor described in this embodiment can be the inherent resistance (i.e., resistance value) of the first heating unit and the second heating unit, respectively. This inherent resistance can be measured by the user in advance. The first temperature and the second temperature described in this embodiment can be calculated in the following way: First, based on Joule's law and using current and resistance, Joule heat is calculated. Then, based on Joule heat and the corresponding voltage, the corresponding temperature is calculated by calling the thermal resistance model. The thermal resistance model can be preset.
[0063] The control unit can compare the first temperature with the second temperature and adjust the magnitude of the first DC heating current and the second DC heating current in real time to keep the temperature difference between the first temperature and the second temperature stable, so that the temperature difference between the first temperature and the second temperature is maintained at the preset temperature (i.e., the temperature difference is stable at the preset temperature).
[0064] This embodiment achieves integrated control of the entire process of DC heating, real-time temperature measurement, automatic temperature control, and AC testing of the first and second heating units through the control unit. It can calculate the temperature of the heating units at both ends based on the collected current, voltage, and resistance of the heating units, and dynamically adjust the heating current to stably maintain the preset temperature difference. This ensures the stable temperature conditions required for heat transfer performance measurement, improves the automation level, control accuracy, and data accuracy of the entire measurement process, avoids interference from temperature fluctuations on the test results, and enables the system to complete high-precision and repeatable synchronous heat transport measurement in the in-situ environment of transmission electron microscopy.
[0065] In some embodiments of this application, the measurement module further includes a testing unit, which is specifically configured to: maintain the temperature difference between the first temperature and the second temperature at a preset temperature, adjust the amplitude, frequency, and / or phase of the first AC test voltage and the second AC test voltage respectively based on a preset measurement strategy; obtain the first test current of the first heating unit through a first ammeter and the second test current of the second heating unit through a second ammeter; obtain the first test voltage of the first heating unit through a first lock-in amplifier and the second test voltage of the second heating unit through a second lock-in amplifier; and generate a heat transfer measurement result of the sample under test based on the preset measurement strategy, the first temperature, the second temperature, the first test current, the second test current, the first test voltage, and the second test voltage. The preset measurement strategy can be calibrated according to actual conditions.
[0066] Specifically, the measurement module also includes a testing unit, which is a functional unit within the measurement module responsible for performing tests, acquiring signals, and outputting final results. While maintaining the temperature difference between the first and second temperatures at a preset temperature (e.g., 5°C), the testing unit, based on a preset measurement strategy, adjusts the amplitude, frequency, and / or phase of the first AC test voltage applied to the first heating unit and the second AC test voltage applied to the second heating unit, respectively, to construct a test excitation signal suitable for the sample under test. Simultaneously, it acquires the first test current of the first heating unit through a first ammeter, the second test current of the second heating unit through a second ammeter, the first test voltage of the first heating unit through a first lock-in amplifier, and the second test voltage of the second heating unit through a second lock-in amplifier.
[0067] The testing unit combines a preset measurement strategy, a stable first and second temperature, and the acquired two-channel test current and test voltage to calculate and analyze the heat transfer of the sample under test, generating the heat transfer measurement results of the sample under test. The preset measurement strategy can adopt a chip heat transfer model. Through the chip heat transfer model, the thermal conductivity of the sample under test is analyzed. Combined with the in-situ measured transmission electron microscope image and energy dispersive spectroscopy measurement of the sample thickness information, the function of analyzing the thermal conductivity of the sample is realized, thereby realizing the quantitative testing and output of the thermal transport performance of the sample.
[0068] This embodiment uses a test unit to flexibly adjust the amplitude, frequency, and phase of two AC test voltages according to a preset measurement strategy. It also uses an ammeter and a lock-in amplifier to collect the current and voltage of the heating unit. Combined with stable temperature parameters, it can perform comprehensive calculations to measure the thermal transfer performance of the sample under test, ensuring that the measurement process is controllable and the results are reliable.
[0069] In some embodiments of this application, a transmission electron microscope is used to measure the atomic structure and physical properties of the sample to be tested.
[0070] Specifically, as an external characterization device, the transmission electron microscope (TEM) can apply its electron beam to the sample under test on the chip. While measuring the thermal transport performance of the sample under test using a TEM-based measurement system, in-situ characterization and detection of the sample's atomic arrangement, crystal defects, interface structure, electronic structure, and other physical properties and microstructure can be performed. Thus, under the same sample and experimental conditions, thermal transport performance data and corresponding microscopic atomic structure and physical property information of the sample can be obtained simultaneously, realizing the correlation analysis between macroscopic performance and microstructure. This provides a complete and accurate experimental basis for studying the relationship between the microstructure and thermal transport characteristics of materials.
[0071] This embodiment utilizes transmission electron microscopy to detect the atomic and physical properties of the sample under test. Under the same testing conditions, it can achieve in-situ synchronous characterization with thermal transfer performance measurement. It can obtain both macroscopic thermal transport performance data of the sample and microscopic structural information such as atomic arrangement, crystal structure, and interfaces, realizing the correlation between macroscopic performance and microscopic structure. This provides comprehensive, accurate, and reliable data for the mechanism study of the relationship between material structure and thermal transfer characteristics, enhancing the scientific research value and application scenarios of the entire measurement system.
[0072] Furthermore, the working principle diagram of the measurement system based on transmission electron microscopy is as follows: Figure 3 As shown in the figure, the working principle of the measurement system based on transmission electron microscopy is as follows: During the heating and temperature measurement stage, the control unit inputs a first DC heating current to the first heating unit through a first test circuit, and a second DC heating current to the second heating unit through a third test circuit. A first AC test voltage is applied to the first heating unit through a first lock-in amplifier, and a second AC test voltage is applied to the second heating unit through a second lock-in amplifier. Simultaneously, a first ammeter collects the first actual heating current of the first heating unit in real time, and a second ammeter collects the second actual heating current of the second heating unit in real time. Based on the first actual heating current, the second actual heating current, the first resistance of the first heating unit, the second resistance of the second heating unit, the first AC test voltage, and the second AC test voltage, the control unit calculates the first temperature of the first heating unit and the second temperature of the second heating unit.
[0073] During the constant temperature control stage, the control unit adjusts the magnitude of the first DC heating current and the second DC heating current according to the first temperature and the second temperature, respectively, so that the temperature difference between the first temperature and the second temperature is maintained at the preset temperature, providing a stable temperature field for subsequent measurements.
[0074] During the AC testing and data processing phase, after the temperature difference between the first and second temperatures stabilizes, the testing unit, based on a preset measurement strategy, adjusts the amplitude, frequency, and / or phase of the first and second AC test voltages, respectively. It then acquires the first test current of the first heating unit via a first ammeter, the second test current of the second heating unit via a second ammeter, the first test voltage of the first heating unit via a first lock-in amplifier, and the second test voltage of the second heating unit via a second lock-in amplifier. Based on the preset measurement strategy, the first temperature, the second temperature, the first test current, the second test current, the first test voltage, and the second test voltage, the testing unit generates the heat transfer measurement results of the sample under test.
[0075] Therefore, the measurement system based on transmission electron microscopy proposed in this embodiment has the following technical advantages: (1) A symmetrical dual-loop structure with double suspended thin film is adopted. The heating, temperature measurement and sample measurement paths are separated through multiple independent test circuits, which effectively avoids signal interference and improves the accuracy and stability of electrical signal and temperature detection.
[0076] (2) Through the coordinated control of the control unit and the test unit, the entire process of DC heating, real-time temperature measurement, automatic constant temperature, AC excitation, data acquisition and result calculation is automated, ensuring that the temperature field is stable and controllable, and improving the repeatability and reliability of the measurement.
[0077] (3) Combining in-situ characterization with transmission electron microscopy, the thermal transfer performance of the sample and the observation of atomic structure and physical properties are realized simultaneously under the same test environment, so as to realize the correlation between macroscopic performance and microstructure.
[0078] (4) The system has high integration and comprehensive testing functions. It can complete the synchronous measurement of multiple physical quantities under in-situ, accurate and stable conditions, which expands the applicability and scientific research value of the characterization of the thermal and electrical properties of materials under transmission electron microscopy.
[0079] In summary, the transmission electron microscope (TEM)-based measurement system according to the embodiments of this application includes a chip, an electron microscope sample holder, and a measurement module. The chip includes two suspended thin films arranged side by side, each supported by multiple cantilever beams. The two ends of the sample to be tested rest on the two suspended thin films. The electron microscope sample holder carries the chip and includes multiple test circuits, each connected to a corresponding cantilever beam. The measurement module is connected to the multiple test circuits to measure the sample to obtain the thermal transfer measurement results. One end of the electron microscope sample holder carrying the chip is positioned within the TEM. Therefore, this system, by using a chip with a double suspended thin film and cantilever structure, a customized electron microscope sample holder with multiple test circuits, and a measurement module connected to the test circuits, enables simultaneous measurement of the physical properties and transport performance of the same sample within a TEM.
[0080] It should be noted that the logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.
[0081] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.
[0082] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0083] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0084] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0085] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.
Claims
1. A measurement system based on a transmission electron microscope, characterized in that, include: The chip, electron microscope sample holder, and measurement module, among which, The chip includes two suspended thin films arranged side by side, each of which is supported by multiple suspension beams. The two ends of the sample to be tested are placed on the two suspended thin films respectively. The electron microscope sample holder is used to mount the chip, wherein the electron microscope sample holder includes multiple test circuits, and each test circuit is connected to the corresponding cantilever beam; The measurement module is connected to multiple test circuits respectively, and is used to measure the sample under test through the multiple test circuits to obtain the heat transfer measurement results of the sample under test; wherein, The end of the electron microscope sample holder that carries the chip is located in the transmission electron microscope.
2. The measurement system based on transmission electron microscopy according to claim 1, characterized in that, The two suspended films include a first suspended film and a second suspended film. The first suspended film is provided with a first heating unit, and the second suspended film is provided with a second heating unit. The first suspended film is provided with a first connecting seat, and the second suspended film is provided with a second connecting seat. The two ends of the sample to be tested are respectively placed on the first connecting seat and the second connecting seat; wherein, The first connecting seat, the second connecting seat, and the multiple cantilever beams are all coated with a conductive layer.
3. The measurement system based on transmission electron microscopy according to claim 2, characterized in that, The plurality of suspension beams include a first suspension beam, a second suspension beam, a third suspension beam, and a fourth suspension beam supporting the first suspended membrane; the plurality of test circuits include a first test circuit and a second test circuit, wherein, One end of the first suspension beam and the second suspension beam are respectively connected to the first heating unit, and the other end of the first suspension beam and the second suspension beam are respectively connected to the first test circuit to form a first test circuit; One end of the third and fourth suspension beams is connected to the first heating unit, and the other end of the third and fourth suspension beams is connected to the second test circuit to form a second test circuit.
4. The measurement system based on transmission electron microscopy according to claim 3, characterized in that, A first ammeter is connected in series in the first test circuit, and a first lock-in amplifier is connected in series in the second test circuit.
5. The measurement system based on transmission electron microscopy according to claim 4, characterized in that, The multiple suspension beams also include a sixth, seventh, eighth, and ninth suspension beam supporting the second suspended membrane, and the multiple test circuits also include a third and a fourth test circuit, wherein, One end of the sixth and seventh suspension beams is connected to the second heating unit, and the other end of the sixth and seventh suspension beams is connected to the third test circuit to form a third test circuit. One end of the eighth and ninth suspension beams is connected to the second heating unit, and the other end of the eighth and ninth suspension beams is connected to the fourth test circuit to form a fourth test circuit.
6. The measurement system based on transmission electron microscopy according to claim 5, characterized in that, A second ammeter is connected in series in the third test circuit, and a second lock-in amplifier is connected in series in the fourth test circuit.
7. The measurement system based on transmission electron microscopy according to claim 6, characterized in that, The measurement module includes a control unit, wherein the control unit is specifically used for: A first DC heating current is input to the first heating unit through the first test circuit, and a second DC heating current is input to the second heating unit through the third test circuit; The first actual heating current of the first heating unit is obtained through the first ammeter, and the second actual heating current of the second heating unit is obtained through the second ammeter. A first AC test voltage is applied to the first heating unit through the first lock-in amplifier, and a second AC test voltage is applied to the second heating unit through the second lock-in amplifier; The first temperature of the first heating unit and the second temperature of the second heating unit are calculated based on the first actual heating current, the second actual heating current, the first resistance of the first heating unit, the second resistance of the second heating unit, the first AC test voltage, and the second AC test voltage. The magnitudes of the first DC heating current and the second DC heating current are controlled according to the first temperature and the second temperature, respectively, so that the temperature difference between the first temperature and the second temperature is maintained at a preset temperature.
8. The measurement system based on transmission electron microscopy according to claim 7, characterized in that, The measurement module further includes a testing unit, wherein the testing unit is specifically used for: When the temperature difference between the first temperature and the second temperature is maintained at a preset temperature, the amplitude, frequency and / or phase of the first AC test voltage and the second AC test voltage are adjusted according to a preset measurement strategy. The first test current of the first heating unit is obtained through the first ammeter, and the second test current of the second heating unit is obtained through the second ammeter. The first test voltage of the first heating unit is obtained through the first lock-in amplifier, and the second test voltage of the second heating unit is obtained through the second lock-in amplifier. Based on the preset measurement strategy, the first temperature, the second temperature, the first test current, the second test current, the first test voltage, and the second test voltage, the heat transfer measurement results of the sample under test are generated.
9. The measurement system based on transmission electron microscopy according to claim 1, characterized in that, The transmission electron microscope is used to measure the atomic structure and physical properties of the sample under test.