Power module mounting jig and power module assembly method
By using a power module mounting fixture with an elastomer and drive unit, the problems of pin stress concentration and high production cost were solved, and compatibility and stable connection of multi-specification housings were achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIGUANG SEMICON (SHAOXING) CO LTD
- Filing Date
- 2026-04-21
- Publication Date
- 2026-06-23
Smart Images
Figure CN122269562A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor technology, and in particular to a power module mounting fixture and a power module assembly method. Background Technology
[0002] A power module is a device that integrates multiple power semiconductor chips (such as IGBTs, MOSFETs, and diodes), auxiliary circuits (such as drivers, protection devices, and sensors), and a heat dissipation substrate into a compact housing using advanced packaging technology. Power modules can efficiently convert, regulate, and switch electrical energy. They convert direct current (DC) to alternating current (AC) and control parameters such as voltage, current, and frequency. Their core advantages are high power density, high reliability, and ease of installation.
[0003] With the rapid development of semiconductor technology, highly integrated power modules are becoming increasingly common; among them, pinned modules are widely used. During the assembly process at the application end, these power modules typically need to be connected to heat sinks and circuit boards (such as PCBs). There are generally two approaches to assembling these power modules with heat sinks and circuit boards.
[0004] Option 1 involves soldering the power module's pins to the circuit board first, then mounting it onto the heatsink. This mounting method is suitable for all types of power module housings. However, the installation process after pin soldering can easily lead to stress concentration between the pins and the circuit board. For example, during the transport of the power module to the heatsink, relative displacement or a tendency for relative displacement may occur between the pins and the circuit board, resulting in stress concentration between the pins and the circuit board and affecting the lifespan of the power module.
[0005] Option two involves first securing the circuit board and power module with screws before mounting them onto the heatsink, and finally soldering the power module's pins to the circuit board. In this mounting method, the pins are connected to the circuit board last, thus eliminating stress concentration between them. However, this mounting method is only suitable for power module housings with pre-locking holes. These pre-locking holes are used to secure the circuit board and power module with screws, and the location of these holes varies depending on the circuit board. Therefore, the power module housing needs to be redesigned specifically to match the pre-locking holes on the power module, increasing production costs.
[0006] Based on this, the present invention requires a power module mounting fixture and a power module assembly method. By improving the power module mounting fixture, it is possible to accommodate the housings of semiconductor power modules of different specifications, and at the same time, it can also improve the stress concentration phenomenon between the pins of the power module and the circuit board. Summary of the Invention
[0007] This invention provides a power module mounting fixture and a power module assembly method. The power module mounting fixture can be used with standard holes on the power module housing, accommodating housings of different specifications of semiconductor power modules. Furthermore, the use of this power module mounting fixture can improve the power module assembly process, reducing stress concentration between the power module pins and the circuit board.
[0008] This invention provides a power module mounting fixture, comprising: a fixture unit and a drive unit;
[0009] The fixture unit includes an elastic body;
[0010] The fixture unit is used to pass through the second process hole on the circuit board and to place at least a portion of the elastomer within the first process hole on the power module.
[0011] The driving unit is used to cause the elastomer to elastically deform, so that the elastomer expands or contracts;
[0012] When the elastomer expands, the radial outer dimension of the portion of the elastomer located within the first process hole is greater than the diameter of the first process hole; when the elastomer contracts, the radial outer dimension of the portion of the elastomer located within the first process hole is less than or equal to the diameter of the first process hole.
[0013] Optionally, the drive unit includes a moving member, which has a variable diameter section;
[0014] The moving member moves along the first direction through the elastic body, and the moving member has at least an expansion position and a contraction position when it moves along the first direction;
[0015] When the moving part is in the expanded position, at least a portion of the variable diameter part moves into the elastic body, causing the elastic body to expand.
[0016] When the moving part is in the contracted position, the variable diameter part is located outside the elastic body, causing the elastic body to contract.
[0017] Optionally, the elastomer includes a first segment and a second segment connected end to end along a first direction;
[0018] The radial outer dimension of the second segment is greater than the radial outer dimension of the first segment and greater than the inner diameter of the first process hole;
[0019] The second segment is used to pass through the second process hole, and the first segment is used to pass through the first process hole.
[0020] Optionally, the elastomer further includes a third segment;
[0021] The third segment and the first segment are respectively connected to the two ends of the second segment along the first direction;
[0022] The radial outer dimension of the third segment is greater than the radial outer dimension of the second segment and greater than the inner diameter of the second process hole.
[0023] Optionally, the driving unit further includes a driving element;
[0024] The fixture unit further includes a fixture body, and the elastic body and the driving member are disposed on the fixture body;
[0025] The driving component is connected to the moving component and is used to drive the moving component to move along the first direction.
[0026] Optionally, the drive member is threadedly connected to the fixture body to convert rotational motion relative to the fixture body into linear motion relative to the fixture body along the first direction.
[0027] Optionally, the elastomer and the driving member are respectively disposed at both ends of the fixture body along the first direction;
[0028] One end of the moving component along the first direction passes through the fixture body and is connected to the driving component.
[0029] Optionally, the moving member has an elongated strip structure extending along a first direction, and the radial outer dimension of the moving member increases at a certain position to form the variable diameter section.
[0030] Optionally, the power module mounting fixture further includes a limiting unit;
[0031] The limiting unit is used to limit the movement stroke of the moving part along the first direction.
[0032] Optionally, the limiting unit is disposed on the moving part;
[0033] The fixture unit has a first blocking surface and a second blocking surface arranged along the first direction, and at least a portion of the limiting unit is located between the first blocking surface and the second blocking surface.
[0034] The present invention also provides a power module assembly method, which is performed based on the power module mounting fixture described above; the power module assembly method includes the following steps:
[0035] S1: The circuit board is mounted on top of the power module, and each pin of the power module passes through the pin vias of the circuit board.
[0036] S2: The fixture unit passes through the second process hole on the circuit board, such that at least a portion of the elastomer is located within the first process hole on the power module;
[0037] S3: Drive the portion of the elastomer located within the first process hole to expand;
[0038] S4: The heat sink is mounted on the bottom of the power module, causing the portion of the elastomer located in the first process hole to contract;
[0039] S5: Secure the heat sink to the power module, and then solder the pins of the power module to the circuit board.
[0040] The power module mounting fixture of the present invention can penetrate into a second process hole on the circuit board and a first process hole on the power module housing, thereby locking the relative position of the circuit board and the power module in the radial direction. When the elastomer expands, the elastomer connects with the power module housing, thus fixing the relative position of the power module mounting fixture. The power module mounting fixture constrains both the power module and the circuit board, thus ensuring that the relative position of the circuit board and the power module is fixed.
[0041] The power module mounting fixture of the present invention can fix the circuit board and the power module, and only involves the first process hole (standard hole) of the power module, so there is no need to add a pre-locking hole on the power module housing. The power module mounting fixture can be used in conjunction with the standard hole (first process hole) on the power module housing, and can accommodate housings of different specifications of semiconductor power modules.
[0042] The power module mounting fixture of the present invention can change the assembly process of the power module. The assembly process is as follows:
[0043] During the power module assembly process, the circuit board is first assembled on top of the power module, with each pin of the power module passing through the pin vias of the circuit board. At this point, the second process hole on the circuit board and the first process hole on the power module housing are aligned in a first direction. A jig unit is then passed through the second process hole on the circuit board, ensuring that at least a portion of the elastomer is located within the first process hole on the power module. The portion of the elastomer located within the first process hole expands, fixing the elastomer within the first process hole. This jig provides a rigid constraint on the relative position of the circuit board and the power module, ensuring their relative positioning. Therefore, moving the combination of the circuit board and the power module will not cause relative displacement that could damage the pins. Next, the heat sink is assembled at the bottom of the power module, ensuring that the heat sink's connection hole is aligned with the first process hole. The portion of the elastomer located within the first process hole contracts, and the power module mounting jig is removed from the circuit board and the power module (the jig unit is pulled out of the first and second process holes). At this point, the relative position of the circuit board and the power module is no longer rigidly constrained, and the first process hole is released. The heatsink and power module are then secured with bolts passing through the first process hole and the connection hole. After the heatsink and power module are tightened, the pins of the power module are soldered to the circuit board, ensuring that stress concentration is avoided during the final pin soldering process.
[0044] This power module mounting fixture allows the first process hole on the power module housing to accommodate both the positioning of the power module and the circuit board, as well as the connection and fixation of the power module and the heat sink. It also helps to improve the power module assembly process and can reduce stress concentration between the power module pins and the circuit board. Attached Figure Description
[0045] Figure 1 This is a schematic diagram of a conventional power module assembly scheme of the present invention. Figure 1 ;
[0046] Figure 2 This is a schematic diagram of a conventional power module assembly scheme of the present invention. Figure 2 ;
[0047] Figure 3 This is a schematic diagram of the second existing power module assembly scheme of the present invention. Figure 1 ;
[0048] Figure 4 This is a schematic diagram of the second existing power module assembly scheme of the present invention. Figure 2 ;
[0049] Figure 5 This is a schematic diagram of the second existing power module assembly scheme of the present invention. Figure 3 ;
[0050] Figure 6This is a schematic diagram of the structure of a power module mounting fixture according to an embodiment of the present invention;
[0051] Figure 7 This is a schematic diagram of the power module assembly process of the present invention. Figure 1 ;
[0052] Figure 8 This is a schematic diagram of the power module assembly process of the present invention. Figure 2 ;
[0053] Figure 9 This is a schematic diagram of the power module assembly process of the present invention. Figure 3 ;
[0054] Figure 10 A three-dimensional structural schematic diagram of a power module mounting fixture according to another embodiment of the present invention;
[0055] Figure 11 A cross-sectional view of a power module mounting fixture according to another embodiment of the present invention;
[0056] Figure 12 This is a partial structural schematic diagram of a power module mounting fixture according to another embodiment of the present invention.
[0057] In the attached diagram:
[0058] 100 - Power module; 110 - First process hole;
[0059] 200 - Circuit board; 210 - Second process hole;
[0060] 300-Radiator;
[0061] 400-Power Module Mounting Fixture;
[0062] 10-Jig unit; 11-Elastomer; 11a-First segment; 11b-Second segment; 11c-Third segment; 12-Jig body; 12a-First sleeve; 12b-Second sleeve; 13-First blocking surface; 14-Second blocking surface; 15-Accommodation groove;
[0063] 20-Drive unit; 21-Moving component; 22-Variable diameter part; 23-Drive component; 24-Cover; 25-Groove; 26-Protrusion; 27-First handle; 28-Second handle;
[0064] 30 - Limiting unit;
[0065] a - First direction. Detailed Implementation
[0066] The power module mounting fixture and power module assembly method proposed in this invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this invention.
[0067] In this invention, "outer diameter" and "inner diameter" refer to the diameter of a circular structure, while for a non-circular structure, the inner diameter refers to the diameter of its inscribed circle and the outer diameter refers to the diameter of its circumscribed circle. "Axial direction" refers to the direction of the central axis of a cylindrical rod, while for a non-cylindrical rod, the axial direction refers to the length direction of the rod.
[0068] As used in this invention, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the term “at least two” is generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. Additionally, as used in this invention, “installed,” “connected,” “linked,” and “set” on one element from another should be interpreted broadly, generally indicating only a connection, coupling, mating, or transmission relationship between the two elements, which can be direct or indirect through an intermediate element. This connection, coupling, mating, or transmission should not be construed as indicating or implying a spatial positional relationship between the two elements, i.e., one element can be located arbitrarily inside, outside, above, below, or to one side of another element, unless otherwise explicitly stated. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances. Furthermore, directional terms such as above, below, up, down, upward, downward, left, right, etc., are used relative to exemplary embodiments as shown in the figures, with upward or up direction pointing towards the top of the corresponding figure, and downward or down direction pointing towards the bottom of the corresponding figure.
[0069] Combination Figure 1 and Figure 2 The diagram shows Scheme 1 for the assembly process of the power module 100.
[0070] like Figure 1As shown, circuit board 200 is first assembled on top of power module 100, with each pin of power module 100 passing through its respective pin via on circuit board 200. Then, each pin is soldered to circuit board 200, connecting circuit board 200 and power module 100, fixing their relative positions. Because power module 100 has a large number of pins (dozens or even hundreds), circuit board 200 also has a large number of pin vias. Since the pins and vias are relatively small, even a slight misalignment between circuit board 200 and power module 100 could lead to assembly failure. Therefore, circuit board 200 and power module 100 are assembled first to ensure successful assembly.
[0071] like Figure 2 As shown, the heat sink 300 is then assembled on the bottom of the power module 100. It should be ensured that the first process hole (not shown in the figure) on the housing of the power module is aligned with the connection hole (not shown in the figure) on the heat sink 300. The power module and the heat sink 300 can then be fixedly connected by screws passing through the first process hole and the connection hole.
[0072] During the above connection process, the circuit board 200 and the power module 100 do not require additional process holes to form a connection. The entire assembly process only involves the first process hole on the housing of the power module 100. Since the first process hole on the housing of the power module 100 is a standard hole for connecting to the heat sink, this assembly process is applicable to all types of housings of the power module 100.
[0073] However, since the pins of the power module 100 are soldered to the circuit board 200 before being connected to the heat sink 300, the relative displacement between the pins and the circuit board 200 can easily occur during the transfer of the power module 100 to the heat sink 300, leading to stress concentration between the pins and the circuit board 200. Alternatively, slight deformation of the power module 100 during the connection process with the heat sink 300 can also cause stress concentration between the pins and the circuit board 200, affecting the connection strength and stability of the pins and thus the service life of the power module 100.
[0074] Combination Figures 3 to 5 As shown, this is Scheme 2 for the assembly process of power module 100.
[0075] like Figure 3As shown, the circuit board 200 is first assembled on the top of the power module 100. Each pin of the power module 100 passes through the pin via of the circuit board 200. Then, the circuit board 200 and the power module 100 are fixed with screws. The screws need to pass through the locking hole (not shown in the figure) on the circuit board 200 and the pre-locking hole (not shown in the figure) on the housing of the power module 100. At this time, the relative position relationship between the circuit board 200 and the power module 100 is locked.
[0076] Combination Figure 4 As shown, the heat sink 300 is then assembled on the bottom of the power module 100. It should be ensured that the first process hole 110 on the housing of the power module 100 is aligned with the connection hole on the heat sink 300. The power module 100 and the heat sink 300 can then be fixedly connected by screws passing through the first process hole 110 and the connection hole.
[0077] Combination Figure 5 As shown, the pins are finally soldered to the circuit board 200. Since the relative positions of the circuit board 200 and the power module 100 are fixed during the pin soldering process, and the relative positions of the heat sink 300 and the power module 100 are positioned, there will be no stress concentration on the pins.
[0078] However, this assembly method involves not only the standard holes (first process holes) on the housing of the power module 100, but also pre-locking holes. Therefore, the above assembly method is only applicable to the housing of the power module 100 with pre-locking holes. The pre-locking holes are used to fix the circuit board 200 to the power module 100 with screws, and the locking hole positions are different for different circuit boards 200. Based on the locking hole positions of the circuit board 200, the housing of the power module 100 needs to be redesigned specifically so that the pre-locking holes of the power module 100 correspond to the locking holes of the circuit board 200, resulting in increased production costs.
[0079] Based on this, this embodiment provides a power module mounting fixture, which can be used in conjunction with the standard holes on the housing of the power module 100 for fixing the circuit board 200 and the power module 100. It can accommodate housings of semiconductor power modules 100 of different specifications. At the same time, the use of this power module mounting fixture can also improve the assembly process of the power module 100 and reduce stress concentration between the pins of the power module 100 and the circuit board 200.
[0080] Combination Figure 6 As shown, the power module mounting fixture 400 includes: fixture unit 10 and drive unit 20;
[0081] The fixture unit 10 includes an elastic body 11, which can be made of rubber or other elastically deformable materials. Preferably, the elastic body 11 has elastic deformation capability and a certain rigid support capability.
[0082] The fixture unit 10 is used to pass through the second process hole 210 on the circuit board 200 and to make the elastomer 11 at least partly located in the first process hole 110 on the housing of the power module 100.
[0083] The driving unit 20 is used to cause the elastic body 11 to elastically deform, so that the elastic body 11 expands or contracts.
[0084] When the elastic body 11 expands, the radial outer dimension of the portion of the elastic body 11 located within the first process hole 110 is larger than the diameter of the first process hole 110; here, the radial outer dimension refers to the size of the elastic body 11 in its natural state without external force constraint. When the elastic body 11 expands within the first process hole 110, it is constrained by the inner wall of the first process hole 110. Therefore, after expansion, the elastic body 11 presses against the inner wall of the first process hole 110 to increase the friction between the elastic body 11 and the inner wall of the first process hole 110, thereby fixing the elastic body 11 within the first process hole 110.
[0085] When the elastic body 11 contracts, the radial outer dimension of the portion of the elastic body 11 located within the first process hole 110 is less than or equal to the diameter of the first process hole 110. Here, the radial outer dimension also refers to the dimension of the elastic body 11 in its natural state without external force constraint.
[0086] The aforementioned radial outer dimension refers to the circumscribed circle diameter of the elastic body 11. If the elastic body 11 is a cylindrical structure, the radial outer dimension corresponds to its outer diameter. If the elastic body 11 is a non-cylindrical structure, its radial outer dimension is its circumscribed circle diameter. The radial direction is based on the first process hole 110 and is perpendicular to the first direction a. During the assembly of the power module 100, the first direction a is perpendicular to the circuit board 200.
[0087] The aforementioned power module mounting fixture can penetrate the second process hole 210 on the circuit board 200 and the first process hole 110 on the housing of the power module 100, thereby locking the relative position of the circuit board 200 and the power module 100 in the radial direction (perpendicular to the first direction a). When the elastic body 11 expands, the elastic body 11 connects with the housing of the power module 100, thus fixing the relative position of the power module mounting fixture 400. The power module mounting fixture 400 constrains the power module 100 and the circuit board 200, thus ensuring that the relative position of the circuit board 200 and the power module 100 is fixed.
[0088] The aforementioned power module mounting fixture can fix the circuit board 200 and the power module 100, and only involves the first process hole 110 (standard hole) of the power module, so there is no need to add a pre-locking hole on the housing of the power module 100. The power module mounting fixture can be used in conjunction with the standard hole (first process hole 110) on the housing of the power module 100, and can accommodate housings of semiconductor power modules 100 of different specifications.
[0089] The aforementioned power module mounting fixture can alter the assembly process of the power module 100, as follows:
[0090] Combination Figures 7 to 9 As shown, during the assembly of the power module 100, the circuit board 200 is first assembled on top of the power module 100, with each pin of the power module 100 passing through the pin vias of the circuit board 200. At this time, the second process hole 210 on the circuit board 200 and the first process hole 110 on the housing of the power module 100 are aligned along the first direction a. The jig unit 10 is passed through the second process hole 210 on the circuit board 200, with at least a portion of the elastic body 11 located within the first process hole 110 on the power module 100. The portion of the elastic body 11 located within the first process hole 110 expands, thus fixing the elastic body 11 within the first process hole 110. The jig provides a hard constraint on the relative position of the circuit board 200 and the power module 100, ensuring their relative positioning. Therefore, moving the combination of the circuit board 200 and the power module 100 will not cause relative displacement that could damage the pins. Then, the heat sink 300 is assembled onto the bottom of the power module 100, ensuring that the connection hole of the heat sink 300 is aligned with the first process hole 110. The portion of the elastomer 11 located within the first process hole 110 retracts, removing the power module mounting fixture from the circuit board 200 and the power module 100 (pulling the fixture unit 10 out of the first process hole 110 and the second process hole 210). At this point, the relative position of the circuit board 200 and the power module 100 is not rigidly constrained, and the first process hole 110 is released. The heat sink 300 and the power module 100 are then secured with bolts passing through the first process hole 110 and the connection hole. After the heat sink 300 and the power module 100 are tightened, the pins of the power module 100 are soldered to the circuit board 200, ensuring that the final pin soldering operation avoids stress concentration.
[0091] The power module mounting fixture enables the first process hole 110 on the power module housing to accommodate both the positioning of the power module 100 and the circuit board 200 and the connection and fixation of the power module 100 and the heat sink 300. It also helps to improve the assembly process of the power module 100 and can reduce stress concentration between the pins of the power module 100 and the circuit board 200.
[0092] Combination Figure 6 As shown, the drive unit 20 includes a moving member 21, which has a variable diameter portion 22. The outer diameter of the variable diameter portion 22 is larger than the inner diameter of the inner cavity of the elastic body 11.
[0093] The moving part 21 moves along the first direction a through the elastic body 11, and the moving part 21 has at least an expansion position and a contraction position when it moves along the first direction a.
[0094] When the moving part 21 is in the expanded position, at least a portion of the variable diameter part 22 moves into the elastic body 11, causing the elastic body 11 to expand in a direction perpendicular to the first direction a;
[0095] When the moving part 21 is in the contracted position, the variable diameter part 22 is located outside the elastic body 11, causing the elastic body 11 to contract in a direction perpendicular to the first direction a.
[0096] like Figure 6 As shown, Figure 6 The variable diameter section 22 is located outside the elastic body 11, and the moving part 21 is in the contracted position at this time. The variable diameter section 22 does not apply a force to the elastic body 11 to expand it, and the elastic body 11 is in a natural contracted state at this time. There is no connection between the elastic body 11 and the first process hole 110, and the elastic body 11 can move freely along the first direction a.
[0097] exist Figure 6 Based on this, if the moving part 21 moves upward along the first direction a and reaches the expansion position, the expansion position is, for example, the position corresponding to the moving part 21 when the variable diameter part 22 moves to the middle position of the first process hole 110. At this time, the variable diameter part 22 enters the interior of the elastic body 11, and the elastic body 11 is pressed against the outer wall of the first process hole 110, causing the elastic body 11 to expand. The elastic body 11 and the first process hole 110 form a connection relationship, and the elastic body 11 cannot move freely along the first direction a. At this time, the relative position of the power module 100 and the circuit board 200 is locked.
[0098] In this embodiment, the elastic body 11 is a sleeve structure, and the driving unit 20 adopts a rigid moving component 21. The moving component 21 provides rigidity to the elastic body 11, causing the elastic body 11 to expand or contract. In other alternative embodiments, the elastic body 11 can be, for example, a balloon, which is a long strip structure in its natural state. The driving unit 20 can be, for example, an air pump, which inflates or contracts the balloon by injecting air into it. The specific structure of the driving unit 20 can be adapted based on the specific structure of the elastic body 11 and the expansion and contraction requirements.
[0099] For further information, please refer to the following: Figure 6As shown, the elastic body 11 includes a first segment 11a, a second segment 11b, and a third segment 11c connected end to end along a first direction a;
[0100] The radial outer dimension of the second segment 11b is greater than the radial outer dimension of the first segment 11a and greater than the inner diameter of the first process hole 110;
[0101] The second segment 11b is used to pass through the second process hole 210. The first segment 11a is used to pass through the first process hole 110.
[0102] The third segment 11c and the first segment 11a are respectively connected to the two ends of the second segment 11b along the first direction a;
[0103] The radial outer dimension of the third segment 11c is greater than the radial outer dimension of the second segment 11b and greater than the inner diameter of the second process hole 210.
[0104] Since the outer diameters of the first segment 11a, the second segment 11b, and the third segment 11c increase sequentially, the connection between the first segment 11a and the second segment 11b has a shoulder surface that can abut against the upper surface of the housing of the power module 100. The connection between the second segment 11b and the third segment 11c also has a shoulder surface that can abut against the upper surface of the circuit board 200. Preferably, the distance between the two shoulder surfaces along the first direction a is equal to the distance between the upper surfaces of the power module 100 and the circuit board 200 after assembly.
[0105] The variable diameter design of the elastic body 11 facilitates a high-precision fit between the elastic body 11, the power module 100, and the circuit board 200 in the first direction a. On the one hand, the power module 100 and the circuit board 200 can be positioned radially, and on the other hand, the power module 100 and the circuit board 200 can be positioned axially (in the first direction a).
[0106] In this embodiment, the elastomer 11 is an overall variable-diameter cylindrical structure, and the first segment 11a, the second segment 11b, and the third segment 11c are coaxial cylindrical structures. In other alternative embodiments, the specific shapes of the first segment 11a, the second segment 11b, and the third segment 11c can be set based on actual needs. Preferably, the cross-sectional shapes of the first segment 11a and the second segment 11b are adapted to the shapes of the first process hole 110 and the second process hole 210, respectively.
[0107] In this embodiment, it is preferable that the inner diameter of the first segment 11a in its natural state is equal to the inner diameter of the first process hole 110, and the inner diameter of the second segment 11b in its natural state is equal to the inner diameter of the second process hole 210.
[0108] In this embodiment, the elastomer 11 adopts a three-section variable diameter structure. In other alternative embodiments, the elastomer 11 may adopt a two-section variable diameter structure, for example, it may only include the first section 11a and the second section 11b, that is, the second section 11b and the third section 11c are of equal diameter.
[0109] Furthermore, the moving member 21 has an elongated strip structure extending along the first direction a, and the radial outer dimension of the moving member 21 increases at a certain position to form the variable diameter portion 22.
[0110] Combination Figure 6 As shown, in this embodiment, the moving member 21 is a round rod structure, and the elastic body 11 is a cylindrical sleeve structure. The variable diameter portion 22 is located at one end of the moving member 21 and is a spherical structure. The diameter of the variable diameter portion 22 is larger than the inner diameter of the elastic body 11 in its natural state. The outer diameter of the part of the moving member 21 excluding the variable diameter portion 22 is equal to the inner diameter of the elastic body 11 in its natural state. Figure 6 In the middle, the variable diameter part 22 extends beyond the first section 11a, and the other end of the moving part 21 ( Figure 6 The upper end of the movement 21 can pass through the third segment 11c and extend to the outside of the elastic body 11. When the moving part 21 is pulled upward, it can be moved to the expansion position.
[0111] In other alternative embodiments, the cross-sectional shape of the moving member 21 can be adjusted based on actual usage requirements. For example, the moving member 21 can be a square rod structure or a rod with other cross-sectional shapes. In other alternative embodiments, the variable diameter portion 22 can be a conical structure, a teardrop shape, or other shapes. The specific structure of the variable diameter portion 22 can be adjusted based on actual usage requirements.
[0112] Combination Figures 10 to 12 The image shows another embodiment of the power module mounting fixture 400.
[0113] In this embodiment, the driving unit 20 further includes a driving element 23;
[0114] The fixture unit 10 also includes a fixture body 12, and the elastic body 11 and the driving member 23 are disposed on the fixture body 12;
[0115] The driving component 23 is connected to the moving component 21 and is used to drive the moving component 21 to move along the first direction a and lock the position of the moving component 21.
[0116] Combination Figure 10 and Figure 11 As shown, in this embodiment, the elastic body 11 and the driving member 23 are respectively disposed at both ends of the fixture body 12 along the first direction a.
[0117] One end of the moving part 21 along the first direction a ( Figure 9The upper end of the fixture passes through the fixture body 12 and is connected to the drive member 23.
[0118] The drive component 23 is threadedly connected to the fixture body 12 and is used to convert the rotational motion relative to the fixture body 12 into linear motion relative to the fixture body 12 along the first direction a.
[0119] When the drive member 23 rotates in both directions relative to the fixture body 12, it can reciprocate linearly along the first direction a relative to the fixture body 12, thereby driving the moving member 21 to rotate while simultaneously reciprocating linearly along the first direction a. Therefore, the moving member 21 also rotates synchronously during its movement along the first direction a, facilitating the entry of the variable diameter part 22 into the first segment 11a of the elastic body 11 to apply an expansion force to the first segment 11a. Furthermore, the threaded connection between the drive member 23 and the fixture body 12 facilitates locking the position of the drive member 23, thereby locking the position of the moving member 21.
[0120] Combination Figure 11 As shown, in this embodiment, the fixture body 12 has a split structure. The fixture body 12 includes a first sleeve 12a and a second sleeve 12b coaxially connected. The upper end of the first sleeve 12a has an internal thread.
[0121] Combination Figure 11 As shown, the lower end of the drive member 23 has an external thread, and the lower end thread of the drive member 23 is screwed into the upper end of the first sleeve 12a.
[0122] Combination Figure 11 As shown, the drive unit 20 also includes a cover 24, which is fixed to one end of the drive member 23 away from the fixture body 12 along the first direction a. Figure 10 (the upper part).
[0123] The upper end of the moving component 21 passes through the middle of the fixture body 12 and enters the inner cavity of the driving component 23. The inner diameter of the inner cavity of the driving component 23 is the same as the outer diameter of the moving component 21. Figure 12 As shown, the upper end of the driving member 23 has a groove 25 along the first direction a, and the groove 25 communicates with the inner cavity of the driving member 23, so that the inner cavity side of the driving member 23 forms a cut. Correspondingly, the upper end of the moving member 21 has a tangential surface parallel to the first direction a.
[0124] Combination Figure 11As shown, the lower end of the cover 24 has a protrusion 26, which is rectangular in shape and its shape is adapted to the groove 25. When the cover 24 is fixed to the upper end of the drive member 23, the protrusion 26 is fitted into the groove 25, and the side of the protrusion 26 abuts against the tangential surface of the upper end of the moving member 21 to restrict the rotation of the moving member 21 relative to the drive member 23, and to increase the friction between the cover 24 and the moving member 21, so that the moving member 21 follows the drive member 23 to move in the first direction a.
[0125] In this embodiment, the cover 24 is connected to the upper end of the drive member 23 by screws, and the drive member 23 is connected to the moving member 21 by the cover 24. In other alternative embodiments, the moving member 21 may be integrally formed with the drive member 23, or the moving member 21 may be fixedly connected to the drive member 23 by an interference fit.
[0126] Please continue to refer to this. Figure 11 and Figure 12 As shown, the drive component 23 is externally connected to a first handle 27, which facilitates the rotation of the drive component 23. The first sleeve 12a is externally connected to a second handle 28, which facilitates the straightening or holding of the fixture body 12.
[0127] In this embodiment, the fixture body 12 and the drive member 23 are cylindrical structures, and the fixture body 12, the drive member 23, and the elastic body 11 are coaxially arranged. In other alternative embodiments, the shapes of the fixture body 12, the drive member 23, and the elastic body 11 can be adjusted based on actual usage requirements.
[0128] In this embodiment, the driving component 23 uses a threaded connection to drive the moving component 21 along the first direction a. In other alternative embodiments, the driving component 23 can use a linear motor, a pneumatic structure, or a hydraulic structure to drive the moving component 21 along the first direction a.
[0129] Furthermore, the power module mounting fixture also includes a limiting unit 30;
[0130] The limiting unit 30 is used to limit the movement stroke of the moving part 21 along the first direction a.
[0131] The limiting unit 30 is disposed on the moving member 21;
[0132] The fixture unit 10 has a first blocking surface 13 and a second blocking surface 14 along the first direction a, and at least a portion of the limiting unit 30 is located between the first blocking surface 13 and the second blocking surface 14.
[0133] Combination Figure 11As shown, a receiving groove 15 is formed at the upper end of the second sleeve 12b. The inner diameter of the receiving groove 15 is larger than the outer diameter of the moving part 21, and the bottom of the receiving groove 15 serves as the first blocking surface 13. The first sleeve 12a is connected to the upper end of the second sleeve 12b, and the inner diameter of the first sleeve 12a is smaller than the inner diameter of the receiving groove 15. The lower end face of the first sleeve 12a serves as the second blocking surface 14.
[0134] The limiting unit 30 is located within the receiving groove 15 and is sleeved on the moving member 21. The radial outer dimension of the limiting unit 30 is larger than the inner diameter of the first sleeve 12a and smaller than the inner diameter of the receiving groove 15. Therefore, when the limiting unit 30 moves along the first direction a, it will interfere with the first blocking surface 13 and the second blocking surface 14. The limiting unit 30 can only move within the receiving groove 15 to limit the movement stroke of the moving member 21.
[0135] In this embodiment, the limiting unit 30 can be a washer, nut, or other structure. The limiting unit 30 can be connected to the moving part 21 by means of threaded connection or welding.
[0136] In this embodiment, the first sleeve 12a and the second sleeve 12b are preferably detachably connected. For example, the detachable connection can be achieved through threaded connection, snap-fit connection or other connection methods, so as to facilitate the installation of the limiting unit 30.
[0137] In this embodiment, both the first blocking surface 13 and the second blocking surface 14 are annular planes, and both are perpendicular to the first direction a. In other alternative embodiments, the first blocking surface 13 and the second blocking surface 14 can be curved surfaces or planar structures of other shapes. Furthermore, the first blocking surface 13 and the second blocking surface 14 can form an angle with the first direction a that is not 90°.
[0138] This embodiment also provides a power module assembly method, which is performed based on the power module mounting fixture described above.
[0139] Please refer to Figures 6 to 9 As shown, the power module assembly method includes the following steps:
[0140] S1: The circuit board 200 is mounted on top of the power module 100, and each pin of the power module 100 passes through the pin via of the circuit board 200.
[0141] S2: The fixture unit 10 passes through the second process hole 210 on the circuit board 200, and at least a portion of the elastic body 11 is located within the first process hole 110 on the power module 100. Since the circuit board 200 has multiple second process holes 210 and the power module 100 has multiple first process holes 110, and each first process hole 110 corresponds one-to-one with each second process hole 210, multiple power module mounting fixtures can be used. Each set of corresponding first process holes 110 and second process holes 210 is configured with one power module mounting fixture.
[0142] S3: The portion of the elastic body 11 located within the first process hole 110 expands, so that the elastic body 11 is fixedly connected within the first process hole 110. At this time, the entire fixture is fixedly connected to the housing of the power module. The fixture unit 10 constrains the relative positions of the power module 100 and the circuit board 200. The relative positions of the circuit board 200 and the power module 100 in the radial direction are positioned. At the same time, due to the variable diameter design of the elastic body 11, the power module 100 and the circuit board 200 can also be positioned in the axial direction (first direction a).
[0143] S4: The heat sink 300 is mounted on the bottom of the power module 100, causing the portion of the elastomer 11 located within the first process hole 110 to contract. At this time, the elastomer 11 is not fixedly connected to the first process hole 110, and the constraint of the fixture unit 10 on the relative position of the power module 100 and the circuit board 200 is released. Preferably, the power module mounting fixture can be removed to separate it from the circuit board 200 and the power module 100 (see details). Figure 8 ).
[0144] S5: Secure the heat sink 300 to the power module 100, then solder the pins of the power module 100 to the circuit board 200 (see details). Figure 9 ).
[0145] The above assembly method does not require the addition of pre-locking holes on the housing of the power module 100. The power module mounting fixture can be used in conjunction with the standard holes (first process holes 110) on the housing of the power module 100, which can accommodate housings of semiconductor power modules 100 of different specifications.
[0146] The above assembly method allows the first process hole 110 on the housing of the power module 100 to accommodate both the positioning of the power module 100 and the circuit board 200 and the connection and fixation of the power module 100 and the heat sink 300. It also helps to improve the assembly process of the power module 100 and can reduce the stress concentration phenomenon between the pins of the power module 100 and the circuit board 200.
[0147] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0148] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.
Claims
1. A power module mounting fixture, characterized in that, include: Fixture unit and drive unit; The fixture unit includes an elastic body; The fixture unit is used to pass through the second process hole on the circuit board and to place at least a portion of the elastomer within the first process hole on the power module. The driving unit is used to cause the elastomer to elastically deform, so that the elastomer expands or contracts; When the elastomer expands, the radial outer dimension of the portion of the elastomer located within the first process hole is greater than the diameter of the first process hole; when the elastomer contracts, the radial outer dimension of the portion of the elastomer located within the first process hole is less than or equal to the diameter of the first process hole.
2. The power module mounting fixture as described in claim 1, characterized in that, The drive unit includes a moving component, and the moving component has a variable diameter section; The moving member moves along the first direction through the elastic body, and the moving member has at least an expansion position and a contraction position when it moves along the first direction; When the moving part is in the expanded position, at least a portion of the variable diameter part moves into the elastic body, causing the elastic body to expand. When the moving part is in the contracted position, the variable diameter part is located outside the elastic body, causing the elastic body to contract.
3. The power module mounting fixture as described in claim 2, characterized in that, The elastomer includes a first segment and a second segment connected end to end along a first direction; The radial outer dimension of the second segment is greater than the radial outer dimension of the first segment and greater than the inner diameter of the first process hole; The second segment is used to pass through the second process hole, and the first segment is used to pass through the first process hole.
4. The power module mounting fixture as described in claim 3, characterized in that, The elastomer also includes a third segment; The third segment and the first segment are respectively connected to the two ends of the second segment along the first direction; The radial outer dimension of the third segment is greater than the radial outer dimension of the second segment and greater than the inner diameter of the second process hole.
5. The power module mounting fixture as described in claim 2, characterized in that, The drive unit also includes a drive component; The fixture unit further includes a fixture body, and the elastic body and the driving member are disposed on the fixture body; The driving component is connected to the moving component and is used to drive the moving component to move along the first direction.
6. The power module mounting fixture as described in claim 5, characterized in that, The drive component is threadedly connected to the fixture body and is used to convert the rotational motion relative to the fixture body into linear motion relative to the fixture body along the first direction.
7. The power module mounting fixture as described in claim 5, characterized in that, The elastic body and the driving member are respectively disposed at both ends of the fixture body along the first direction; One end of the moving component along the first direction passes through the fixture body and is connected to the driving component.
8. The power module mounting fixture as described in claim 3, characterized in that, The moving part has an elongated strip structure extending along a first direction, and the radial outer dimension of the moving part increases at a certain position to form the variable diameter section.
9. The power module mounting fixture as described in any one of claims 2 to 8, characterized in that, The power module mounting fixture also includes a limiting unit; The limiting unit is used to limit the movement stroke of the moving part along the first direction.
10. The power module mounting fixture as described in claim 9, characterized in that, The limiting unit is disposed on the moving part; The fixture unit has a first blocking surface and a second blocking surface arranged along the first direction, and at least a portion of the limiting unit is located between the first blocking surface and the second blocking surface.
11. A power module assembly method, characterized in that, The power module assembly method is performed based on the power module mounting fixture according to any one of claims 1 to 10; the power module assembly method includes the following steps: S1: The circuit board is mounted on top of the power module, and each pin of the power module passes through the pin vias of the circuit board. S2: The fixture unit passes through the second process hole on the circuit board, such that at least a portion of the elastomer is located within the first process hole on the power module; S3: Drive the portion of the elastomer located within the first process hole to expand; S4: The heat sink is mounted on the bottom of the power module, causing the portion of the elastomer located in the first process hole to contract; S5: Secure the heat sink to the power module, and then solder the pins of the power module to the circuit board.