Multi-orifice independent jetting electrofluidic chip and forming method

Abstract

This application relates to a multi-nozzle independently ejected electrochemical chip and its molding method, comprising: an ejection plate having multiple through-holes on its surface and multiple ejection grooves on its bottom surface, the ejection grooves communicating with the ejection holes; multiple bosses respectively arranged in the multiple ejection grooves, the bottom surface of the bosses having through holes communicating with the ejection holes; an electrode structure including multiple first electrodes and multiple second electrodes, the multiple first electrodes being arranged on the top of the ejection plate and the multiple second electrodes being arranged on the bottom of the ejection plate; an electric field is formed between the first electrodes and their corresponding second electrodes, and the multiple ejection holes are located in independent electric fields. This application, by arranging multiple vertically aligned electrode pairs, ensures that each ejection hole is located within an independently formed electric field region, eliminating electric field crosstalk between ejection holes, achieving completely independent control of the ejection of each ejection hole, and improving printing accuracy.

Description

Technical Field

[0001] This application relates to the field of inkjet printing technology, and in particular to a multi-nozzle independently ejected electrothermal chip and its forming method. Background Technology

[0002] Inkjet printing, as a direct-write additive manufacturing technology, boasts advantages such as no need for masks, flexible production, and high material utilization, showing promising application prospects in fields such as printed displays, printed circuits, and printed solar cells. Electrohydraulic inkjet printing, in particular, uses an electric field as the primary driving force, significantly enhancing the ink's driving power and enabling the printing of high-viscosity inks. Furthermore, because the ink is ejected locally from the meniscus, the resulting droplet size can be much smaller than the nozzle diameter, thus significantly improving printing resolution. Electrohydraulic inkjet printing technology overcomes two major drawbacks of traditional inkjet printing technologies and has broad application prospects.

[0003] In related technologies, a boss is formed by machining an annular groove on the bottom surface of a substrate, and then the boss is thinned so that the bottom surface of the boss is higher than the bottom surface of the substrate. A through-hole is formed on the boss, and then electrodes are arranged on the bottom surface of the substrate, thereby applying voltage and using an electric field to spray out the functional liquid.

[0004] Electrodes are arranged on the bottom surface of the substrate, forming an electric field between the electrodes and the substrate. This electric field force is used to eject the functional liquid from the nozzles. However, the nozzles are close together, and the electrodes at each nozzle will generate relatively divergent electric fields. Therefore, the electric field generated by the corresponding electrode at the nozzle can easily exert an electric field force on the functional liquid in adjacent nozzles, resulting in crosstalk between electric fields. This adversely affects printing accuracy and independent control of the nozzles. Summary of the Invention

[0005] This application provides a multi-nozzle independently ejected electrochemical chip and its molding method to solve the technical problem in related technologies where crosstalk between electric fields at the nozzles adversely affects printing accuracy and independent control of the nozzles.

[0006] Firstly, a multi-orifice independently ejected current-carrying chip is provided, comprising: A spray plate, wherein a plurality of through-holes are formed on the surface of the spray plate and a plurality of spray grooves are formed on the bottom surface of the spray plate, wherein each of the plurality of spray grooves corresponds one-to-one with a plurality of spray holes and the spray grooves are connected to the spray holes; Multiple protrusions are arranged in multiple spray grooves, and the protrusions are arranged at the bottom of the spray grooves. The bottom surface of each protrusion has a through hole that communicates with the spray hole. The electrode structure includes a plurality of first electrodes and a plurality of second electrodes. The plurality of first electrodes are arranged on the top of the spray plate and are respectively located at a plurality of spray holes. The plurality of second electrodes are arranged on the bottom of the spray plate and are respectively located at a plurality of spray grooves. In this configuration, multiple first electrodes are connected to an external power supply device, multiple second electrodes are grounded, an electric field is formed between the first electrode and the corresponding second electrode, and multiple nozzles are located in independent electric fields.

[0007] In some embodiments, the first electrode includes a first electrode ring, the second electrode includes a second electrode ring, the first electrode ring surrounds the nozzle, and the second electrode ring surrounds the spray groove.

[0008] In some embodiments, the orthographic projection of the first electrode ring onto the plane containing the bottom of the spray groove falls entirely within the bottom of the spray groove.

[0009] In some embodiments, the electrode structure further includes a plurality of leads, each of the first electrode rings and each of the second electrode rings being connected to the leads, the leads being connected to an external flexible circuit board.

[0010] In some embodiments, the bottom surface of the boss is higher than the bottom surface of the spray plate.

[0011] In some embodiments, the spray plate includes: A first substrate, wherein a plurality of spray holes are formed on the surface of the first substrate, and the boss is formed on the bottom of the first substrate; The second substrate is fixed to the bottom surface of the first substrate, and a through-hole spray groove is formed on the second substrate.

[0012] In some embodiments, the first substrate includes a glass substrate, and the second substrate includes a silicon substrate.

[0013] In some embodiments, the multi-aperture independently ejected current-carrying chip further includes a passivation layer covering the first electrode ring, the second electrode ring, and the lead surface.

[0014] In some embodiments, the multi-orifice independently ejected current-carrying chip further includes a hydrophobic layer covering the passivation layer, the bottom surface of the boss, and the bottom surface of the ejection plate.

[0015] The beneficial effects of the technical solution provided in this application include: This application provides a multi-nozzle independent jetting electrochemical chip. By arranging a first electrode corresponding to each nozzle on the top of the jetting plate and a second electrode corresponding to each first electrode on the bottom of the jetting plate, multiple vertically aligned electrode pairs are formed, ensuring that each nozzle is located within an independently formed electric field region. Compared to traditional solutions where the divergent electric fields generated by electrodes at adjacent nozzles superimpose and interfere with each other, this method eliminates electric field crosstalk between nozzles by confining the electric field within a specific space between the first and second electrodes. This achieves completely independent control of the jetting from each nozzle, providing a reliable guarantee for high-precision parallel printing with multiple nozzles.

[0016] By eliminating electric field crosstalk, the droplet ejection process of each nozzle is no longer affected by changes in the electric field of adjacent nozzles. The ejection threshold, droplet volume, and flight trajectory of each nozzle can be precisely and stably controlled. This significantly improves the uniformity, positioning accuracy, and edge sharpness of the printed dot matrix, avoiding problems such as inconsistent droplet volume and landing point offset caused by electric field interference in traditional technologies. It can meet the manufacturing needs of sub-micron or even nanometer-level high-resolution patterns in fields such as printed displays and printed circuits, significantly improving the printing quality of electrohydraulic inkjet printing technology.

[0017] By arranging the first and second electrodes to form a vertical electrode pair, this arrangement allows the electric field lines to pass through the nozzle and through-hole areas more concentratedly, and the electric field intensity distribution to be more uniform and controllable. This enables the stable injection of functional liquid with a lower driving voltage, reducing the system's energy consumption and the design difficulty of the high-voltage circuit, while improving the utilization efficiency of electric field energy.

[0018] Secondly, a method for forming a multi-orifice independently jetted current fluid chip is provided, for forming the multi-orifice independently jetted current fluid chip as described above, comprising the following steps: A glass substrate is obtained as the first substrate, and multiple spray holes are processed on the surface of the first substrate; A silicon substrate is obtained as a second substrate, and the second substrate is bonded to the bottom surface of the first substrate. A sink groove is etched on the bottom surface of the second substrate, and multiple sink grooves correspond one-to-one with multiple nozzles; A through-hole is machined at the bottom of the settling tank to form a boss and a spraying groove. Simultaneously, a through hole communicating with the spraying hole is machined on the surface of the boss. A first electrode is patterned on the top surface of a first substrate; A second electrode is patterned on the bottom surface of the second substrate; A passivation layer is deposited on the surfaces of the first and second electrodes; A hydrophobic layer is formed on the surface of the passivation layer, the bottom surface of the boss, and the bottom surface of the second substrate.

[0019] Another embodiment of this application provides a method for forming a multi-hole independently jetted current fluid chip. Since this method is used to form the aforementioned multi-hole independently jetted current fluid chip, the beneficial effects of this method are the same as those of the aforementioned multi-hole independently jetted current fluid chip, and will not be repeated here. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram of a multi-hole independently jetting current fluid chip provided in an embodiment of this application; Figure 2 This is a schematic diagram of the second substrate provided in an embodiment of this application.

[0022] In the figure: 1. Spray plate; 11. First substrate; 11a. Spray hole; 12. Second substrate; 121. Top silicon layer; 122. Buried oxide layer; 123. Bottom silicon layer; 12a. Spray groove; 2. Boss; 3. Electrode structure; 31. First electrode; 32. Second electrode; 33. Lead wire; 4. Passivation layer; 5. Hydrophobic layer. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] This application provides a multi-nozzle independently ejected electrochemical chip and its molding method. By arranging multiple vertically aligned electrode pairs, each nozzle is located within an independently formed electric field region, eliminating electric field crosstalk between nozzles and achieving completely independent control of each nozzle's ejection, thus improving printing accuracy. This application solves the technical problem in related technologies where mutual electric field crosstalk at the nozzles adversely affects printing accuracy and independent nozzle control.

[0025] Reference Figure 1A multi-orifice independently ejected current fluid chip includes an ejection plate 1, an electrode structure 3, and multiple bosses 2. The ejection plate 1 has multiple through-holes 11a on its surface and multiple ejection grooves 12a on its bottom surface. Each ejection groove 12a corresponds to one of the ejection holes 11a and is connected to the ejection holes 11a. Functional fluid enters the ejection holes 11a from the top of the ejection plate 1, and the electrode structure 3 applies an electric field to eject the functional fluid from the bottom of the ejection plate 1.

[0026] The bosses 2 are arranged at the bottom of the spray tank 12a, and multiple bosses 2 correspond to multiple spray holes 11a respectively. The bottom surface of the bosses 2 has a through hole that communicates with the spray holes 11a. The electrode structure 3 applies an electric field to make the functional liquid flow from the spray holes 11a to the bottom surface of the bosses 2 to form a Taylor cone. Then, by controlling the electric field strength, the functional liquid is sprayed out.

[0027] Specifically, the electrode structure 3 includes a plurality of first electrodes 31 and a plurality of second electrodes 32. The plurality of first electrodes 31 are arranged on the top of the spray plate 1 and are respectively located at a plurality of spray holes 11a. The plurality of second electrodes 32 are arranged on the bottom of the spray plate 1 and are respectively located at a plurality of spray grooves 12a.

[0028] Multiple first electrodes 31 are connected to an external power supply device, multiple second electrodes 32 are grounded, an electric field is formed between the first electrode 31 and the corresponding second electrode 32, and multiple nozzles 11a are located in independent electric fields.

[0029] This configuration, by arranging first electrodes 31 corresponding one-to-one with nozzles 11a at the top of the spray plate 1 and second electrodes 32 corresponding one-to-one with the first electrodes 31 at the bottom of the spray plate 1, forms multiple vertically aligned electrode pairs, ensuring that each nozzle 11a is located within an independently formed electric field region. Compared to the traditional scheme where the divergent electric fields generated by the electrodes at adjacent nozzles 11a superimpose and interfere with each other, by confining the electric field within a specific space between the first electrode 31 and the second electrode 32, crosstalk between nozzles 11a is eliminated, achieving completely independent control of the ejection of each nozzle 11a and providing a reliable guarantee for high-precision parallel printing of multiple nozzles 11a.

[0030] By eliminating electric field crosstalk, the droplet ejection process of each nozzle 11a is no longer affected by changes in the electric field of adjacent nozzles 11a. The ejection threshold, droplet volume, and flight trajectory of each nozzle 11a can be precisely and stably controlled. This significantly improves the uniformity, positioning accuracy, and edge sharpness of the printed dot matrix, avoiding problems such as inconsistent droplet volume and landing point offset caused by electric field interference in traditional technologies. It can meet the manufacturing needs of sub-micron or even nanometer-level high-resolution patterns in fields such as printed displays and printed circuits, and significantly improves the printing quality of electrohydraulic inkjet printing technology.

[0031] By arranging the first electrode 31 and the second electrode 32 to form a vertical electrode pair, this arrangement allows the electric field lines to pass through the nozzle 11a and the through-hole area more concentratedly, and the electric field intensity distribution to be more uniform and controllable. This enables the stable injection of functional liquid with a lower driving voltage, reduces the system's energy consumption and the design difficulty of the high-voltage circuit, and improves the utilization efficiency of electric field energy.

[0032] Specifically, the first electrode 31 includes a first electrode ring, and the second electrode 32 includes a second electrode ring. The first electrode ring surrounds the nozzle 11a, and the second electrode ring surrounds the spray groove 12a. The first electrode ring is electrically connected to an external flexible circuit board for connection to an external power supply device, and the second electrode ring is grounded through connection to the flexible circuit board. This achieves the formation of an electric field between the first and second electrode rings.

[0033] This configuration ensures that each nozzle 11a is within an independent electric field formed by the first and second electrode rings, preventing the electric field force from easily diverging and avoiding electric field crosstalk to the functional liquid in adjacent nozzles 11a. This improves the spray control accuracy of each nozzle 11a and guarantees printing accuracy.

[0034] Reference Figure 1 The electrode structure 3 also includes multiple leads 33, each first electrode ring and each second electrode ring is connected to a lead 33, and the lead 33 is connected to an external flexible circuit board.

[0035] Understandably, each first electrode ring and each second electrode ring are connected to an external flexible circuit board via lead 33.

[0036] Specifically, the first electrode ring, the second electrode ring, and the lead wire 33 are all formed by deposition, and the materials of the first electrode ring, the second electrode ring, and the lead wire 33 include one or more of gold, silver, copper, aluminum, and chromium.

[0037] The orthographic projection of the first electrode ring onto the plane of the bottom of the spray groove 12a falls entirely within the bottom of the spray groove 12a.

[0038] This configuration limits the electric field range at each nozzle 11a by restricting the size and arrangement of the first electrode ring, thus preventing the electric field range from becoming too large and affecting adjacent nozzles 11a.

[0039] The spray plate 1 includes a first substrate 11 and a second substrate 12. The surface of the first substrate 11 has a plurality of spray holes 11a, and a boss 2 is formed on the bottom of the first substrate 11. The second substrate 12 is fixed to the bottom surface of the first substrate 11, and a through spray groove 12a is formed on the second substrate 12.

[0040] This configuration reduces the processing difficulty of the nozzles 11a and the spray grooves 12a by forming the nozzles 11a and the spray grooves 12a on different substrates, and makes it easier to ensure the forming accuracy of the nozzles 11a and the spray grooves 12a.

[0041] Furthermore, the first substrate 11 includes a glass substrate, and the second substrate 12 includes a silicon substrate. The first substrate 11 and the second substrate 12 are fixed together by anodic bonding.

[0042] With this configuration, since a voltage is applied to the first electrode 31, the glass substrate 11 acts as an insulating layer, preventing voltage breakdown of the first substrate 11 and ensuring normal chip operation. A silicon substrate 12 is used as the second substrate. Due to its high conductivity and equipotential with the grounded second electrode 32, the silicon substrate provides shielding, further preventing electric field crosstalk. Simulation of the electric field has proven that crosstalk between the nozzles 11a is under control, ensuring the spray control accuracy of each nozzle 11a.

[0043] In this embodiment, the bottom surface of the boss 2 is higher than the bottom surface of the spray plate 1.

[0044] Reference Figure 1 By fully arranging the boss 2 within the spray groove 12a and increasing the height difference between the bottom surface of the boss 2 and the second electrode 32, the spray position of the functional liquid at the bottom surface of the boss 2 is ensured to be in the middle of the electric field formed by the first electrode 31 and the second electrode 32. Therefore, the electric field strength at the spray point of the functional liquid is more stable, and it is easier to accurately and sensitively control the spray of each spray hole 11a.

[0045] Due to the arrangement of the spray groove 12a, the boss 2 is isolated, ensuring that the functional liquid forms a stable Taylor cone on the bottom surface of the boss 2. Furthermore, the distance between the boss 2 and the groove wall of the spray groove 12a can accommodate the functional liquid overflowing from the boss 2, preventing the functional liquid from spreading to the second electrode 32, thereby protecting the second electrode 32.

[0046] In this embodiment, a boss 2 is formed by machining a sinking groove on the bottom surface of the spray plate 1 and opening an annular groove at the bottom of the sinking groove.

[0047] With this setting, boss 2 can be quickly formed.

[0048] Reference Figure 1 and Figure 2 Specifically, the second substrate 12 includes an SOI silicon wafer, which, from bottom to top, includes a top silicon layer 121, a buried oxide layer 122, and a bottom silicon layer 123. The first substrate 11 is bonded to the top surface of the bottom silicon layer 123. In this embodiment, the first substrate 11 is bonded to the bottom silicon layer 123. A groove is formed in the top silicon layer 121, and the bottom surface of the boss 2 is flush with the bottom surface of the buried oxide layer 122.

[0049] With this setup, during the etching process to form the sump, due to the multi-layered structure of the SOI silicon wafer and the different materials of the top silicon layer 121 and the buried oxide layer 122, the etching selectivity ratios for the top silicon layer 121 and the buried oxide layer 122 are different. Therefore, after removing the top silicon layer 121 by etching, the buried oxide layer 122 can be completely preserved, thus ensuring the flatness of the sump bottom. Since the sump bottom serves as the bottom surface of the boss 2, the flatness of the jetting surface of the boss 2 is even higher, resulting in a more stable Taylor cone formed by the functional fluid on the bottom surface of the boss 2, ensuring printing quality and consistency.

[0050] It is important to note that when etching away material to form a groove structure, the etching depth accuracy and flatness are limited. If the smoothness of the jetting surface of boss 2 is insufficient, it will affect the formation of the Taylor cone and negatively impact the printing effect.

[0051] After the sink is formed, an annular groove and a through hole are then simultaneously machined at the bottom of the sink. Both the annular groove and the through hole penetrate the second substrate 12, so the etching depth can be guaranteed, which can ensure the processing accuracy and reduce the processing difficulty.

[0052] Reference Figure 1 The multi-hole independently jetting current-carrying chip also includes a passivation layer 4, which covers the surfaces of the first electrode ring, the second electrode ring, and the lead 33.

[0053] In this embodiment, the passivation layer 4 is made of silicon dioxide. It is formed by patterning the surfaces of the first electrode ring, the second electrode ring, and the lead 33 using a spray adhesive and metal stripping process to protect these components. In this embodiment, the ends of the lead 33 furthest from the first and second electrode rings are not covered by the passivation layer 4, leaving space for connection to the flexible circuit board.

[0054] Reference Figure 1 The multi-hole independently sprayed current-carrying chip also includes a hydrophobic layer 5, which covers the passivation layer 4, the bottom surface of the boss 2, and the bottom surface of the spraying plate 1. In this embodiment, the hydrophobic layer 5 covers the bottom surface of the second substrate 12.

[0055] Specifically, the hydrophobic layer 5 is made of materials including phenelzine or Teflon, and is applied to the bottom of the second substrate 12 by sputtering to cover the structure of the bottom surface of the second substrate 12, namely, the passivation layer 4 surface, the bottom surface of the second substrate 12, and the bottom surface of the boss 2. In this embodiment, the hydrophobic layer 5 can be formed by sputtering by blocking the ends of the leads 33 away from the first and second electrode rings with a mask. The ends of the leads 33 are not covered by the hydrophobic layer 5 to leave space for connection with the flexible circuit board.

[0056] This arrangement of the hydrophobic layer 5 allows the functional liquid to form a more stable meniscus on the bottom surface of the boss 2, preventing the functional liquid from overflowing.

[0057] This application provides a multi-orifice independently ejected electrofluid chip. By arranging first electrodes 31 corresponding one-to-one with the nozzles 11a on the top of the ejection plate 1 and second electrodes 32 corresponding one-to-one with the first electrodes 31 on the bottom of the ejection plate 1, multiple vertically aligned electrode pairs are formed, so that each nozzle 11a is located in an independently formed electric field region. Compared with the traditional solution where the divergent electric fields generated by the electrodes at adjacent nozzles 11a superimpose and interfere with each other, by confining the electric field within a specific space between the first electrode 31 and the second electrode 32, electric field crosstalk between nozzles 11a is eliminated, and complete independent control of the ejection of each nozzle 11a is achieved, providing a reliable guarantee for high-precision parallel printing of multiple nozzles 11a.

[0058] By eliminating electric field crosstalk, the droplet ejection process of each nozzle 11a is no longer affected by changes in the electric field of adjacent nozzles 11a. The ejection threshold, droplet volume, and flight trajectory of each nozzle 11a can be precisely and stably controlled. This significantly improves the uniformity, positioning accuracy, and edge sharpness of the printed dot matrix, avoiding problems such as inconsistent droplet volume and landing point offset caused by electric field interference in traditional technologies. It can meet the manufacturing needs of sub-micron or even nanometer-level high-resolution patterns in fields such as printed displays and printed circuits, and significantly improves the printing quality of electrohydraulic inkjet printing technology.

[0059] By arranging the first electrode 31 and the second electrode 32 to form a vertical electrode pair, this arrangement allows the electric field lines to pass through the nozzle 11a and the through-hole area more concentratedly, and the electric field intensity distribution to be more uniform and controllable. This enables the stable injection of functional liquid with a lower driving voltage, reduces the system's energy consumption and the design difficulty of the high-voltage circuit, and improves the utilization efficiency of electric field energy.

[0060] Another embodiment of this application provides a method for forming a multi-hole independently sprayed current fluid chip, which is used to form the multi-hole independently sprayed current fluid chip as described above, including steps S100-S800.

[0061] S100: Obtain a glass substrate as a first substrate 11, and process a plurality of spray holes 11a on the surface of the first substrate 11.

[0062] S200: Obtain a silicon plate as a second substrate 12, and bond the second substrate 12 to the bottom surface of the first substrate 11.

[0063] S300, etching grooves on the bottom surface of the second substrate 12, with each groove corresponding to a different nozzle 11a.

[0064] S400. A through annular groove is machined at the bottom of the settling tank to form a boss 2 and a spray groove 12a. Simultaneously, a through hole communicating with the spray hole 11a is machined on the surface of the boss 2.

[0065] S500, a first electrode 31 is patterned on the top surface of the first substrate 11.

[0066] S600, a second electrode 32 is patterned on the bottom surface of the second substrate 12.

[0067] S700, a passivation layer 4 is deposited on the surfaces of the first electrode 31 and the second electrode 32.

[0068] S800, a hydrophobic layer 5 is formed on the surface of the passivation layer 4, the bottom surface of the boss 2, and the bottom surface of the second substrate 12.

[0069] In step S100, a glass substrate is obtained as the first substrate 11, and a plurality of spray holes 11a are processed on the surface of the first substrate 11.

[0070] Specifically, a glass substrate is used as the first substrate 11, and multiple through-holes 11a are processed on the surface of the first substrate 11 by laser-induced etching process.

[0071] With this configuration, since the first electrode 31 for applying voltage is arranged on the surface of the first substrate 11, the insulation effect of the glass substrate is used to prevent the chip from being damaged and to ensure the normal operation of the chip.

[0072] In step S200, a silicon plate is obtained as the second substrate 12, and the second substrate 12 is bonded to the bottom surface of the first substrate 11.

[0073] Specifically, a silicon substrate is used as the second substrate 12. Preferably, an SOI silicon wafer is used, which includes a top silicon layer 121, a buried oxide layer 122, and a bottom silicon layer 123 from bottom to top.

[0074] The first substrate 11 is bonded to the top surface of the bottom silicon layer 123. In this embodiment, the first substrate 11 is bonded to the bottom silicon layer 123. A sink is formed in the top silicon layer 121, and the bottom surface of the boss 2 is flush with the bottom surface of the buried oxide layer 122.

[0075] With this configuration, due to the multi-layered nature of SOI silicon wafers, it is easier to precisely etch the spray groove 12a and boss 2 to the specified thickness during subsequent processing, thereby improving the forming accuracy of boss 2 and ensuring the flatness of the bottom surface of boss 2.

[0076] In step S300, a sink is etched on the bottom surface of the second substrate 12, and the sinks correspond one-to-one with the multiple nozzles 11a.

[0077] Specifically, multiple grooves are etched on the bottom surface of the second substrate 12, and the multiple grooves correspond to multiple nozzles 11a respectively. Preferably, the center lines of the grooves and their corresponding nozzles 11a are collinear.

[0078] The sink is located in the top silicon layer, and the bottom surface of the boss 2 is flush with the bottom surface of the buried oxide layer 122.

[0079] With this setup, during the etching process to form the sump, due to the multi-layered structure of the SOI silicon wafer and the different materials of the top silicon layer 121 and the buried oxide layer 122, the etching selectivity ratios for the top silicon layer 121 and the buried oxide layer 122 are different. Therefore, after removing the top silicon layer 121 by etching, the buried oxide layer 122 can be completely preserved, thus ensuring the flatness of the sump bottom. Since the sump bottom serves as the bottom surface of the boss 2, the flatness of the jetting surface of the boss 2 is even higher, resulting in a more stable Taylor cone formed by the functional fluid on the bottom surface of the boss 2, ensuring printing quality and consistency.

[0080] In step S400, a through annular groove is machined at the bottom of the settling tank to form a boss 2 and a spray groove 12a, and a through hole communicating with the spray hole 11a is machined on the surface of the boss 2 simultaneously.

[0081] Specifically, an annular groove is machined at the bottom of the sink, and through holes are simultaneously etched and machined. The annular groove and through holes penetrating the second substrate 12 are machined together to form the boss 2 and the spray groove 12a.

[0082] Preferably, the distance between the outer circumferential surface of the boss 2 and the spray groove 12a is not less than 70 micrometers.

[0083] This configuration allows the boss 2 to be directly formed by machining the annular groove, and the spray hole 11a to be connected by machining the through hole, making the process simpler and more efficient.

[0084] In step S500, the first electrode 31 is patterned on the top surface of the first substrate 11.

[0085] Specifically, a deposition process is used to pattern the first electrode 31 and simultaneously form the lead wire 33. That is, multiple first electrode rings are formed on the top of the first substrate 11, and the multiple first electrode rings and multiple nozzles 11a are coaxially corresponding. And the lead wire 33, which is electrically connected to the first electrode rings, is formed.

[0086] In step S600, the second electrode 32 is patterned on the bottom surface of the second substrate 12.

[0087] Specifically, a deposition process is used to pattern the second electrode 32 and simultaneously form the lead wire 33. That is, multiple second electrode rings are formed on the bottom of the second substrate 12, and the multiple second electrode rings and multiple spray grooves 12a are coaxially corresponding. And the lead wire 33, which is electrically connected to the second electrode rings, is formed.

[0088] In step S700, a passivation layer 4 is deposited on the surface of the first electrode 31 and the second electrode 32.

[0089] Specifically, a passivation layer 4 is deposited on the surfaces of the first electrode ring, the second electrode ring, and the lead 33. The passivation layer 4 is preferably silicon dioxide, and its thickness is preferably 300-500 nanometers. The passivation layer 4 is then applied to the surfaces of the first electrode ring, the second electrode ring, and the lead 33 using a spray adhesive and metal stripping process to protect them. In this embodiment, each lead 33 is not covered with the passivation layer 4 away from the first or second electrode ring it is connected to, to leave space for connection to the flexible circuit board.

[0090] In step S800, a hydrophobic layer 5 is formed on the surface of the passivation layer 4, the bottom surface of the boss 2, and the bottom surface of the second substrate 12.

[0091] Specifically, the hydrophobic layer 5 is made of materials including phenelzine or Teflon, and is applied to the bottom surface of the second substrate 12 by a sputtering process to cover the structure of the bottom surface of the second substrate 12, namely, covering the surface of the passivation layer 4 at the bottom of the second substrate 12 and the bottom surface of the second substrate 12. It also covers the bottom surface of the boss 2. Preferably, the thickness of the hydrophobic layer 5 is 1-5 micrometers. In this embodiment, the hydrophobic layer 5 is formed by sputtering by masking the ends of the leads 33.

[0092] This arrangement of the hydrophobic layer 5 allows the functional liquid to form a Taylor cone on the bottom surface of the boss 2, preventing the functional liquid from overflowing.

[0093] Another embodiment of this application provides a method for forming a multi-hole independently jetted current fluid chip. Since this method is used to form the aforementioned multi-hole independently jetted current fluid chip, the beneficial effects of this method are the same as those of the aforementioned multi-hole independently jetted current fluid chip, and will not be repeated here.

[0094] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0095] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0096] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A multi-orifice independently ejected current-carrying chip, characterized in that, It includes: A spray plate, wherein a plurality of through-holes are formed on the surface of the spray plate and a plurality of spray grooves are formed on the bottom surface of the spray plate, wherein each of the plurality of spray grooves corresponds one-to-one with a plurality of spray holes and the spray grooves are connected to the spray holes; Multiple protrusions are arranged in multiple spray grooves, and the protrusions are arranged at the bottom of the spray grooves. The bottom surface of each protrusion has a through hole that communicates with the spray hole. The electrode structure includes a plurality of first electrodes and a plurality of second electrodes. The plurality of first electrodes are arranged on the top of the spray plate and are respectively located at a plurality of spray holes. The plurality of second electrodes are arranged on the bottom of the spray plate and are respectively located at a plurality of spray grooves. In this configuration, multiple first electrodes are connected to an external power supply device, multiple second electrodes are grounded, an electric field is formed between the first electrode and the corresponding second electrode, and multiple nozzles are located in independent electric fields.

2. The multi-orifice independently jetting current-carrying chip according to claim 1, characterized in that, The first electrode includes a first electrode ring, and the second electrode includes a second electrode ring. The first electrode ring surrounds the nozzle, and the second electrode ring surrounds the spray groove.

3. The multi-orifice independently jetting current-carrying chip according to claim 2, characterized in that, The orthographic projection of the first electrode ring onto the plane containing the bottom of the spray groove falls entirely within the bottom of the spray groove.

4. The multi-orifice independently jetting current-carrying chip according to claim 2, characterized in that, The electrode structure also includes multiple leads, each of the first electrode rings and each of the second electrode rings is connected to the leads, and the leads are connected to an external flexible circuit board.

5. The multi-orifice independently jetting current-carrying chip according to claim 1, characterized in that, The bottom surface of the boss is higher than the bottom surface of the spray plate.

6. The multi-orifice independently jetting current-carrying chip according to claim 1, characterized in that, The spray plate includes: A first substrate, wherein a plurality of spray holes are formed on the surface of the first substrate, and the boss is formed on the bottom of the first substrate; The second substrate is fixed to the bottom surface of the first substrate, and a through-hole spray groove is formed on the second substrate.

7. The multi-orifice independently jetting current-carrying chip according to claim 6, characterized in that, The first substrate includes a glass substrate, and the second substrate includes a silicon substrate.

8. The multi-orifice independently jetting current-carrying chip according to claim 4, characterized in that, It also includes a passivation layer that covers the first electrode ring, the second electrode ring, and the lead surface.

9. The multi-orifice independently jetting current-carrying chip according to claim 8, characterized in that, It also includes a hydrophobic layer that covers the passivation layer, the bottom surface of the boss, and the bottom surface of the spray plate.

10. A method for forming a current-carrying chip using independent jetting from multiple nozzles, characterized in that, The method for forming a multi-hole independently jetted electrofluid chip as described in any one of claims 1 to 9 includes the following steps: A glass substrate is obtained as the first substrate, and multiple spray holes are processed on the surface of the first substrate; A silicon substrate is obtained as a second substrate, and the second substrate is bonded to the bottom surface of the first substrate. A sink groove is etched on the bottom surface of the second substrate, and multiple sink grooves correspond one-to-one with multiple nozzles; A through-hole is machined at the bottom of the settling tank to form a boss and a spraying groove. Simultaneously, a through hole communicating with the spraying hole is machined on the surface of the boss. A first electrode is patterned on the top surface of a first substrate; A second electrode is patterned on the bottom surface of the second substrate; A passivation layer is deposited on the surfaces of the first and second electrodes; A hydrophobic layer is formed on the surface of the passivation layer, the bottom surface of the boss, and the bottom surface of the second substrate.

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