A metal substrate thin film deposition device with adaptive conformal cooling

Abstract

This invention discloses an adaptive bonding and cooling metal substrate thin film deposition apparatus, relating to the field of coating technology. It includes a coating chamber, a first movable frame, and a second movable frame. A vacuum system is installed outside the coating chamber, and a coating system is installed inside the coating chamber. Compared to current metal substrate thin film deposition apparatuses, this invention includes an adjustment component and a pressure roller. The adjustment component can adjust the distance and bonding pressure between the pressure roller and the coating roller in real time according to the thickness, tension, and temperature distribution of the substrate, so as to adaptively bond to the substrate surface and circulate cooling it. The pressure roller consists of a cooling section and two feeding sections. During the bonding process, the cooling section and the substrate form a rolling contact rather than sliding friction. This avoids damage to the substrate due to sliding friction when moving on the roller surface and improves the heat exchange efficiency between the outer wall of the cooling section and the substrate.

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