A computing device, computing node and method of assembling the same

Abstract

This application discloses a computing device, a computing node, and an assembly method thereof. Specifically, the computing node can be a server node, including a handle and a motherboard assembly. The motherboard assembly includes a motherboard component and a first bracket. The first bracket and the handle are separate structures. The first bracket includes a first support portion and a connecting post. The first support portion is located between the handle and the motherboard component, and the first support portion and the motherboard component are bonded and fixed together. The connecting post is located on the side of the first support portion opposite to the handle and can pass through the motherboard component. The motherboard component and the handle are connected. In the above solution, this application embodiment separates the first bracket from the handle. During specific installation, the first bracket and the motherboard component can be connected first to form the motherboard assembly, and then the motherboard component and the handle can be connected. This avoids installation interference between the motherboard component and the connecting post of the first bracket, and improves the ease of connection between the motherboard component and the handle.

Description

Technical Field

[0001] This application relates to the field of communication equipment technology, and in particular to a computing device, a computing node, and a method for assembling the same. Background Technology

[0002] In computing devices such as high-density servers and blade servers, the motherboards are often quite large, and direct installation within the mounting bracket can easily cause interference, making motherboard installation difficult. Therefore, providing a solution to overcome or mitigate these drawbacks remains a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0003] This application provides a computing device, a computing node, and a method for assembling the same, wherein the installation between the handle bar and the motherboard component in the computing node is relatively convenient.

[0004] In a first aspect, embodiments of this application also provide a computing node, specifically a server node, including a handle and a motherboard assembly. The motherboard assembly includes a motherboard component and a first bracket. The first bracket and the handle are separate structures. The first bracket includes a first support portion and a connecting post. The first support portion is located between the handle and the motherboard component, and the first support portion and the motherboard component are bonded and fixed. The connecting post is located on the side of the first support portion opposite to the handle, and the connecting post can pass through the motherboard component. The motherboard component and the handle are connected.

[0005] In the above-described solution, this embodiment separates the first bracket from the handle strip, thus creating a separate structure for the first bracket and the handle strip. This allows for easier installation of the computing node by first connecting the first bracket and the motherboard component to form the motherboard assembly, and then connecting the motherboard component and the handle strip. This effectively avoids installation interference between the connecting posts of the motherboard component and the first bracket, and facilitates a relatively convenient connection between the motherboard component and the handle strip.

[0006] Furthermore, the first bracket and the main board component are bonded together. In this way, the main board component and the first bracket can be reliably connected together without the need for specific clamping fixtures. The first bracket is less likely to detach from the main board component, which facilitates the subsequent connection of the main board component and the handle strip. This simplifies the installation process, improves installation efficiency, and reduces installation costs.

[0007] In this embodiment, the first support and the connecting post can be an integrally formed structure. Alternatively, the first support and the connecting post can be prepared separately and then assembled. The specific assembly method can be welding, interference fit, riveting, threaded connection, etc., which are not limited here, as long as they can meet the requirements of use.

[0008] In one possible implementation, the first support portion has at least two adhesive portions, which can be spaced apart and located at different positions on the first support portion. The first support portion can be connected to the motherboard component through the adhesive portions. With this configuration, the adhesive portions do not need to be located on the motherboard component, which can reduce the impact on the processing and fabrication of the motherboard component.

[0009] The aforementioned adhesive portion can be an adhesive backing, and its surface can be covered with a release film to facilitate the preparation, packaging, and transportation of the first bracket. When it is necessary to connect the first bracket and the motherboard component, the operator can peel off the release film to expose the adhesive portion, and then connect the first bracket and the motherboard component. Alternatively, the adhesive portion can also be a liquid colloid such as glue. The first bracket may not initially have the aforementioned adhesive portion; it will only be applied to the first bracket when preparing to connect it to the motherboard component.

[0010] In one possible implementation, the first support portion is provided with at least one first clearance portion, which can specifically be a slot-shaped structure or a hole-shaped structure. The main board component includes a main board body and setting electronic devices. The setting electronic devices can be, for example, resistor-capacitor components, which can be located on the side of the main board body facing the handle strip. At least a portion of the setting electronic devices can be located in the first clearance portion, which can reduce installation interference between the first support and the setting electronic devices.

[0011] The first support portion can be a one-piece ring, which provides relatively high structural strength. The inner side of the first support portion can form the aforementioned first clearance portion. Alternatively, the first support portion can also adopt a split structure, comprising at least two first sections, which can be connected or spaced apart. In short, as long as the first support portion can form the aforementioned first clearance portion, it is acceptable.

[0012] In one possible implementation, the first support includes a tray and an insulating film. Specifically, the insulating film can be an inorganic film such as a silicon oxide film, silicon nitride film, aluminum oxide film, or aluminum nitride film; or, it can be an organic film such as a polyimide film, polyethylene film, polyvinylidene fluoride film, or polytetrafluoroethylene film. The insulating film can be located on the side of the tray facing the mainboard component. Along the mating direction between the first support and the mainboard component, the projection of the insulating film can cover the projection of the tray. In this way, the insulating film can provide relatively comprehensive isolation of the tray, reducing the risk of contact and ensuring the safe and reliable operation of the mainboard component.

[0013] The size of the insulating film can be exactly the same as that of the first support portion. Alternatively, the size of the insulating film can be slightly larger than that of the first support portion. For example, when the insulating film covers the first support portion, the insulating film can have an excess portion that extends beyond the first support portion in all directions. The size of this excess portion can be approximately between 1.8 mm and 2.2 mm, and can be specifically set to 2 mm.

[0014] In one possible implementation, the handle bar includes a body and a reinforcing part. The reinforcing part is located in the body. The reinforcing part and the first support are disposed opposite to each other along the mating direction of the first support and the main board component. The reinforcing part can strengthen the handle bar, reducing the strength reduction of the handle bar caused by the separation of the first support and the handle bar, thereby improving the structural strength of the entire computing node.

[0015] The main body here can specifically refer to the base plate of the handle strip, which can be a one-piece structure integrally formed with the main body for easy processing. Alternatively, the reinforcing part and the main body can be separate structures, in which case they can be processed and manufactured separately and then assembled. Specific assembly methods can include welding, interference fit, riveting, threaded connection, etc., which are not limited here, as long as they meet the requirements of use. In this solution, the reinforcing part and the main body can be made of the same material, or they can be made of different materials, so that the material of the main body can be adjusted according to the reinforcement requirements.

[0016] In one possible implementation, at least a portion of the reinforcing part may protrude from the body portion in the direction toward the main board component. The reinforcing part also includes a second clearance portion, which may be a hole or a groove. The main board component includes a main board body and setting electronic components, which may specifically be resistors and capacitors, etc., and may be located on the side of the main board body facing the handle strip. Along the mating direction between the first support portion and the main board component, the second clearance portion and the setting electronic components are disposed opposite each other. Alternatively, a portion of the setting electronic components may be located within the second clearance portion.

[0017] During actual assembly, the portion of the electronic component can be located within the second clearance section to avoid installation interference between the reinforcement and the electronic component. Alternatively, the electronic component can be positioned opposite the reinforcement section without extending into it. In this case, the second clearance section can serve as a damage prevention function. During the application of the computing node, if the handle bar is recessed towards the inside of the computing node due to handling, installation, or use, the second clearance section reduces the likelihood of the handle bar directly colliding with or contacting the electronic component, thus minimizing the possibility of damage to the electronic component and ensuring the reliable installation and operation of the motherboard components.

[0018] In one possible implementation, the computing node further includes a heat sink and a second bracket. The second bracket has positioning posts and is mounted on connecting posts. The heat sink is mounted on both the positioning posts and the connecting posts.

[0019] With this configuration, both the second bracket and the heatsink can be installed after the motherboard components and the handle strip are connected. This avoids stress damage to the motherboard components caused by installing the relatively heavy heatsink along with them, thus ensuring the installation quality of the computing node provided in this embodiment. Furthermore, the heatsink can be positioned and installed simultaneously using both positioning posts and connecting posts, resulting in relatively high installation reliability.

[0020] Specifically, the radiator can be provided with a hole-shaped or groove-shaped positioning mating part, through which the radiator can be inserted into the positioning post to achieve positioning and assembly of the radiator and the second bracket; furthermore, the radiator can also be provided with a third through hole through which the connecting post can pass. In this way, the radiator can have dual positioning: positioning by the matching of the positioning post and the positioning mating part, and positioning by the connecting post and the third through hole, which is more conducive to improving the installation reliability of the radiator.

[0021] The portion of the connecting post that passes through and extends beyond the third through hole may be provided with external threads. During installation, threaded connectors such as nuts or bolts can also be used. These threaded connectors can be connected to the connecting post, thus achieving a secure connection between the radiator and the connecting post.

[0022] Secondly, embodiments of this application also provide a computing device, specifically a server, including a rack and computing nodes. The computing nodes are installed in the rack, and the computing nodes are any of the computing nodes involved in the first aspect and its various implementations. Since the aforementioned computing nodes already have the above-mentioned technical effects, the computing device having such computing nodes should also have similar technical effects, which will not be elaborated here.

[0023] Thirdly, embodiments of this application also provide a method for assembling a computing node. Specifically, the computing node can be a server node, including a handle and a motherboard assembly. The motherboard assembly includes a motherboard component and a first bracket. The first bracket and the handle are separate structures. The first bracket includes a first support portion and a connecting post. The assembly method includes: controlling the connecting post to pass through the motherboard component, and controlling the first support portion and the motherboard component to be bonded and fixed; controlling the motherboard component and the handle to be connected.

[0024] With this configuration, the first bracket and the main board component are first connected by adhesive bonding, allowing the main board component and the first bracket to be reliably connected without the need for specific fixtures. The first bracket is less likely to detach from the main board component, facilitating the subsequent connection of the main board component and the handle strip, simplifying the installation process and improving installation efficiency. It also reduces installation costs.

[0025] In one possible implementation, the computing node further includes a second bracket and a heatsink, the second bracket having positioning posts. The assembly method described above, after controlling the connection of the motherboard components and the handle strip, further includes: controlling the second bracket to be mounted on the connecting posts; and controlling the heatsink to be mounted on the positioning posts and the connecting posts.

[0026] With this configuration, the second bracket and heat sink in this embodiment are not installed together with the motherboard assembly. When the motherboard assembly and the handle are installed, the weight of the motherboard assembly itself is relatively small, and the motherboard assembly is less prone to stress damage, which is more conducive to ensuring the installation quality of the computing node provided in this embodiment. Attached Figure Description

[0027] Figure 1 This is an exploded view of the computing device provided in the embodiments of this application;

[0028] Figure 2 This is a simplified structural diagram of the computing node provided in the embodiments of this application;

[0029] Figure 3 This is a diagram illustrating the installation process of the motherboard assembly and the handle strip in an embodiment of this application.

[0030] Figure 4 This is a connection structure diagram of the motherboard assembly, the pull handle, and the heat sink in the embodiments of this application;

[0031] Figure 5 A diagram showing the relative positions of the first bracket and the electronic components;

[0032] Figure 6 Here is a simplified structural diagram of the first support section;

[0033] Figure 7 This is a partial structural diagram of the handle bar;

[0034] Figure 8 This is a diagram showing the connection structure between the second bracket and the main board component;

[0035] Figure 9 This is a flowchart illustrating the assembly method of the computing node provided in the embodiments of this application.

[0036] Figure label:

[0037] 1000 - Server rack; 1100 - Mounting slot; 1200 - Shelf;

[0038] 2000 - Compute Nodes;

[0039] 2100 - Handle bar; 2110 - Main body; 2120 - Reinforcing part; 2121 - Second avoidance part;

[0040] 2200 - Mainboard assembly; 2210 - Mainboard component; 2210A - First via; 2211 - Mainboard body; 2212 - Device to be cooled; 2213 - Setting electronic components; 2220 - First bracket; 2221 - First support portion; 2221A - Adhesive portion; 2221B - First clearance portion; 2221C - Support plate; 2221D - Insulating film; 2222 - Connecting post;

[0041] 2300-Cover plate; 2400-Second bracket; 2410-Second support; 2411-Third clearance section; 2412-Second through hole; 2420-Positioning post; 2500-Radiator. Detailed Implementation

[0042] To enable those skilled in the art to better understand the technical solutions of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0043] In the description of the embodiments of this application, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," and "third" may explicitly or implicitly include one or more of that feature.

[0044] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0045] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0046] Please refer to Figure 1 , Figure 1 An exploded view of the computing device provided in the embodiments of this application.

[0047] This application provides a computing device, specifically a server, such as a high-density server or a blade server, for data storage, computation, and transmission. Figure 1 As shown, the computing device includes a rack 1000 and computing nodes 2000.

[0048] The rack 1000 is the external structure for computing equipment, used to house computing nodes 2000, etc. It allows for the integrated assembly of two or more computing nodes 2000, thereby improving the structural compactness of the computing equipment. Specifically, such as... Figure 1 As shown, the rack 1000 can have at least two mounting slots 1100, and each computing node 2000 can be installed in a different mounting slot 1100. A partition 1200 can be provided between two adjacent mounting slots 1100 to separate them. Of course, the partition 1200 can also have a perforated structure such as openings to connect the two adjacent mounting slots 1100. In this case, the computing nodes 2000 in the two adjacent mounting slots 1100 can share some of the heat dissipation air, which can effectively improve the utilization efficiency of the heat dissipation air and thus improve the cooling effect of the computing nodes 2000.

[0049] For ease of description, embodiments of this application can define a first direction X, a second direction Y, and a third direction Z. The first direction X specifically refers to the insertion / removal direction of the computing node 2000 in the mounting slot 1100. Both the second direction Y and the third direction Z can be set at an angle to the first direction X, and the angle can be 90 degrees, etc. (Refer to...) Figure 1 In the orientation and positional relationship, the third direction Z can specifically be the vertical direction, that is, the up and down direction.

[0050] In actual manufacturing, the mounting slots 1100 within the cabinet 1000 can be arranged along the third direction Z to form a row. This implementation method can be found in [reference needed]. Figure 1 Alternatively, the mounting slots 1100 within the rack 1000 can be arranged along the second direction Y to form a row. Or, some of the mounting slots 1100 within the rack 1000 can be arranged along the third direction Z to form a column, and then multiple columns of mounting slots 1100 can be arranged along the second direction Y. In other words, the embodiments of this application do not limit the layout of the mounting slots 1100 within the rack 1000. In practical applications, those skilled in the art can design according to specific needs, as long as the requirements for use are met.

[0051] It should be understood that a single mounting slot 1100 can be installed within rack 1000, meaning that a single compute node 2000 can also be installed within rack 1000, which is also feasible.

[0052] Please refer to Figures 2-8 , Figure 2 This is a simplified structural diagram of the computing node provided in the embodiments of this application; Figure 3 This is a diagram illustrating the installation process of the motherboard assembly and the handle strip in an embodiment of this application. Figure 4 This is a connection structure diagram of the motherboard assembly, the pull handle, and the heat sink in the embodiments of this application; Figure 5 A diagram showing the relative positions of the first bracket and the electronic components; Figure 6 Here is a simplified structural diagram of the first support section; Figure 7 This is a partial structural diagram of the handle bar; Figure 8 This is a diagram showing the connection structure between the second bracket and the main board component.

[0053] like Figures 2-4 As shown, the computing node 2000 provided in this embodiment includes a handle bar 2100, a motherboard assembly 2200, a cover plate 2300, a second bracket 2400, and a heat sink 2500.

[0054] The handle 2100 and the cover plate 2300 can be arranged opposite each other along a third direction Z, and the handle 2100 and the cover plate 2300 can be connected to form the outer shell of the computing node 2000. The connection method between the handle 2100 and the cover plate 2300 can be, for example, welding, screw connection, snap-fit, etc., and is not limited here, as long as it meets the relevant requirements such as connection reliability. In conjunction with the foregoing... Figure 1 The outer shell can basically be in the shape of a cuboid. Of course, the outer shell can also be in other structural shapes. There are no restrictions here, as long as it can meet the requirements of use.

[0055] Combination Figure 3 The motherboard assembly 2200 includes a motherboard component 2210 and a first bracket 2220. The first bracket 2220 includes a first support portion 2221 and a connecting post 2222. The first support portion 2221 and the connecting post 2222 can be a one-piece structure. Alternatively, the first support portion 2221 and the connecting post 2222 can be manufactured separately and then assembled. Specific assembly methods can include welding, interference fit, riveting, threaded connection, etc., which are not limited here, as long as they meet the requirements of use.

[0056] In related technologies, the first bracket is located on the handle strip. When installing the motherboard component on the handle strip, if it is installed directly along the third direction (direct insertion scheme), some structural components at the two ends of the handle strip in the first direction will interfere with the motherboard component, preventing the motherboard component from being directly assembled with the handle strip along the third direction. If the motherboard component is inserted into the handle strip at an angle to the third direction (oblique insertion scheme), the motherboard component will interfere with the connecting posts of the first bracket, causing the motherboard component to be unable to be accurately inserted into place. This results in difficulties in installing the motherboard component in the computing node.

[0057] To address this, in this embodiment, the first bracket 2220 is separated from the handle strip 2100, thus creating a separate structure for the first bracket 2220 and the handle strip 2100. During installation, the first bracket 2220 and the motherboard component 2210 can be connected first to form the motherboard assembly 2200, and then the motherboard component 2210 and the handle strip 2100 can be connected. This avoids installation interference between the connecting posts 2222 of the motherboard component 2210 and the first bracket 2220, and allows for relatively convenient connection between the motherboard component 2210 and the handle strip 2100. The motherboard assembly 2200 can be installed using the aforementioned angled insertion method.

[0058] Detailed explanation, combined with Figure 3 The motherboard component 2210 may be provided with a first through hole 2210A. The connecting post 2222 of the first bracket 2220 can pass through the first through hole 2210A, and then the first bracket 2221 and the motherboard component 2210 can be bonded and fixed. In this way, the motherboard component 2210 and the first bracket 2220 can be reliably connected together without the need for specific fixtures. The first bracket 2220 is not easy to fall off the motherboard component 2210, which facilitates the subsequent connection of the motherboard component 2210 and the handle strip 2100, which helps to simplify the installation process, improve installation efficiency, and reduce installation costs. The connection method between the motherboard component 2210 and the handle strip 2100 can be screw connection, snap-fit, riveting, etc., which is not limited here, as long as it can meet the relevant requirements such as the reliability of the connection.

[0059] After the motherboard assembly 2200 and the handle bar 2100 are connected, the first support 2221 may be located between the handle bar 2100 and the motherboard assembly 2210.

[0060] Then, the second bracket 2400 and the radiator 2500 can be installed. For example... Figure 4As shown, the second bracket 2400 can be entirely located on the side of the motherboard component 2210 facing away from the first bracket 2221 in the third direction Z. The second bracket 2400 can be installed on the connecting post 2222, and the heat sink 2500 can be assembled on the second bracket 2400 and fixed by the connecting post 2222. In this way, both the second bracket 2400 and the heat sink 2500 can be installed after the motherboard component 2200 and the handle strip 2100 are connected. This can avoid stress damage to the motherboard component 2210 when the relatively heavy heat sink 2500 is installed together with the motherboard component 2210, which is beneficial to ensuring the installation quality of the computing node 2000 provided in this embodiment.

[0061] Combination Figure 8 The motherboard component 2210 may include a motherboard body 2211, on which a heatsink device 2212 may be mounted. Based on the second bracket 2400, a predetermined gap (not shown in the figure) may exist between the heatsink 2500 and the motherboard body 2211 in the third direction Z. This gap can accommodate the heatsink device 2212 to avoid installation interference between the heatsink 2500 and the heatsink device 2212. Simultaneously, the second bracket 2400 can also support the heatsink 2500, reducing the pressure exerted by the heatsink 2500 on the heatsink device 2212, thereby reducing the possibility of damage to the heatsink device 2212 due to pressure.

[0062] Here, the embodiments of this application do not limit the specific type of the heat dissipation device 2212 described above. In practical applications, those skilled in the art can select according to specific needs. For example, the heat dissipation device 2212 can be a processor, memory, storage, etc. Among them, the core of the processor can be, for example, a central processing unit (CPU), other application-specific integrated circuits (ASICs), etc.; of course, the processor can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0063] In addition, during actual assembly, a thermal interface material can be provided between the heat sink 2500 and the device to be cooled 2212. This thermal interface material can be, for example, silicone, thermal grease, or thermally conductive adhesive, to eliminate the air gap between the heat sink 2500 and the device to be cooled 2212, thereby reducing the contact thermal resistance between the heat sink 2500 and the device to be cooled 2212, and thus improving the heat dissipation effect of the heat sink 2500 on the device to be cooled 2212.

[0064] The second bracket 2400 may include a second support portion 2410 and a positioning post 2420.

[0065] The second support portion 2410 can be an integral ring, thus providing relatively high structural strength. A third clearance portion 2411 with a hole can be formed on the inner side of the second support portion 2410, which can accommodate the aforementioned heat dissipation device 2212. The second support portion 2410 can also be provided with a second through hole 2412, through which the connecting post 2222 of the first bracket 2220 can pass, avoiding installation interference between the second bracket 2400 and the connecting post 2222. Simultaneously, the cooperation between the connecting post 2222 and the second through hole 2412 can also position the second bracket 2400 during installation, ensuring the installation position of the second bracket 2400 relative to the motherboard component 2210, and facilitating subsequent installation and fixation of the heatsink 2500.

[0066] The positioning post 2420 may be located on the second support portion 2410, specifically on the side of the second support portion 2410 opposite to the main board component 2210. The second support portion 2410 and the positioning post 2420 may be an integrally formed structure. Alternatively, the second support portion 2410 and the positioning post 2420 may be manufactured separately and then assembled. Specific assembly methods may include welding, interference fit, riveting, threaded connection, etc., which are not limited here, as long as they meet the requirements of use.

[0067] The radiator 2500 may be provided with a hole-shaped or slot-shaped positioning and mating part (not shown in the figure). The radiator 2500 can be inserted into the positioning post 2420 through its positioning and mating part to realize the positioning and assembly of the radiator 2500 and the second bracket 2400, thereby improving the installation reliability of the radiator 2500. In the embodiments of this application, "hole-shaped" refers to a through structure. Taking the above-mentioned positioning and mating part as an example, the hole-shaped positioning and mating part specifically means that the positioning and mating part can penetrate the radiator 2500 along its axial direction; "slot-shaped" refers to a non-through structure. Again, taking the above-mentioned positioning and mating part as an example, the slot-shaped positioning and mating part specifically means that the positioning and mating part does not penetrate the radiator 2500 along its axial direction.

[0068] The radiator 2500 may also be provided with a third through hole (not shown in the figure). The connecting post 2222 can pass through this third through hole. In this way, the radiator 2500 can have dual positioning: positioning by the engagement of the positioning post 2420 and the positioning mating part, and positioning by the connecting post 2222 and the third through hole, which is more conducive to improving the installation reliability of the radiator 2500. At least the part of the connecting post 2222 that passes through and extends out of the third through hole may be provided with external threads. In actual installation, threaded fasteners such as nuts and bolts can also be configured; the threaded fasteners can be connected to the connecting post 2222, thus realizing the connection and fixation of the radiator 2500 and the connecting post 2222.

[0069] It should be understood that the structural forms of the second bracket 2400 and the heat sink 2500 are not limited to those described above. In some other implementations of the embodiments of this application, the second bracket 2400 and the heat sink 2500 may also adopt other structural forms, as long as they can meet the usage requirements. For example, the second support portion 2410 may also adopt a split structure. The second support portion 2410 may include at least two second portions, which may be connected to each other, or the second portions may be arranged at intervals. In short, as long as the arrangement of the second support portion 2410 enables the heat sink 2500 and the motherboard component 2210 to form the aforementioned installation gap, it is acceptable. For example, the second support portion 2410 may not have the second through hole 2412. In this case, the shape of the second support portion 2410 can be adjusted so that the second support portion 2410 can avoid the connecting post 2222. Furthermore, the outer peripheral wall of the second support portion 2410 can be abutted against and fitted with the connecting post 2222 so that the connecting post 2222 can limit the second bracket 2400.

[0070] In some alternative implementations, such as Figure 5 As shown, the first support portion 2221 can be an integral ring, so that the structural strength of the first support portion 2221 can be relatively high.

[0071] A first clearance portion 2221B with a hole shape can be formed on the inner side of the first support portion 2221. The motherboard component 2210 may also include a setting electronic device 2213, which may be located on the side of the motherboard body 2211 facing the handle bar 2100, and at least a portion of the setting electronic device 2213 may be located in the first clearance portion 2221B. In this way, installation interference between the first support portion 2221 and the setting electronic device 2213 can be better avoided. Here, the embodiments of this application do not limit the specific type of the setting electronic device 2213. In practical applications, those skilled in the art can set it according to specific needs. For example, the setting electronic device 2213 may be a resistor-capacitor component of the processor, which can be used to ensure the power quality of the processor.

[0072] It should be understood that the number of the above-mentioned first avoidance portions 2221B is not limited to one, and it can also be two or more, which is specifically related to the number and distribution position of the set electronic devices 2213, etc. For example, there can also be two of the above-mentioned first avoidance portions 2221B, and the two first avoidance portions 2221B can be distributed at intervals. At this time, the first support portion 2221 can be roughly in the shape of a Chinese character 'Ri'. In addition, the above-mentioned first avoidance portion 2221B is not limited to the above-mentioned hole shape, and it can also be set as a groove shape, as long as it can effectively avoid the set electronic devices 2213.

[0073] In addition to the above-mentioned integrated ring design, in some other implementation manners of the embodiments of the present application, the first support portion 2221 can also adopt other structural forms. For example, the first support portion 2221 can adopt a split structure. The first support portion 2221 can include at least two first sub-portions, and each first sub-portion can be connected, or each first sub-portion can also be arranged at intervals; in short, as long as the first support portion 2221 can form the above-mentioned first avoidance portion 2221B.

[0074] In some optional implementation manners, the first support portion 2221 can be provided with at least two bonding portions 2221A. Each bonding portion 2221A can be arranged at intervals, and the first support portion 2221 can be specifically bonded and fixed to the main board component 2210 through the bonding portion 2221A.

[0075] In practical applications, the bonding portion 2221A can be a back glue, and a layer of anti-adhesive film can be provided on its surface to cover the bonding portion 2221A, so as to facilitate the preparation, packaging and transportation of the first bracket 2220. When it is necessary to connect the first bracket 2220 and the main board component 2210, an operator can tear off the above-mentioned anti-adhesive film to expose the bonding portion 2221A, and then connect the first support portion 2221 and the main board component 2210. Of course, the bonding portion 2221A can also be a liquid colloid such as glue. The bonding portion 2 such as glue. The bonding portion 2221A can not be provided on the first support portion 2221 first, and the bonding portion 2221A will only be coated on the first support portion 2221 when it is ready to connect the first support portion 2221 and the main board component 2210.

[0076] It should be understood that the aforementioned adhesive portion 2221A is not limited to being disposed on the first support portion 2221; it can also be disposed on the motherboard component 2210, as long as a reliable connection between the motherboard component 2210 and the first support portion 2221 can be achieved. Furthermore, this embodiment does not specify the distribution location or specific dimensions of the adhesive portion 2221A. In practical applications, those skilled in the art can determine its specific type and bonding reliability based on the adhesive portion 2221A.

[0077] In some alternative implementations, such as Figure 6 As shown, the first support portion 2221 may include a tray 2221C and an insulating film 2221D. Specifically, the insulating film 2221D may be located on the side of the tray 2221C facing the mainboard component 2210. Furthermore, along the mating direction between the first support portion 2221 and the mainboard component 2210, i.e., the aforementioned third direction Z, the projection of the insulating film 2221D can cover the projection of the tray 2221C. In this way, the insulating film 2221D can provide relatively comprehensive isolation for the tray 2221C, reducing the risk of contact and ensuring the safe and reliable operation of the mainboard component 2210.

[0078] The size of the insulating film 2221D can be exactly the same as that of the first support portion 2221. Alternatively, the size of the insulating film 2221D can be slightly larger than that of the first support portion 2221. For example, when the insulating film 2221D covers the first support portion 2221, the insulating film 2221D can have a portion that extends beyond the first support portion 2221 in all directions. The size of this portion can be approximately between 1.8 mm and 2.2 mm, and can be specifically set to 2 mm.

[0079] The insulating film 2221D can be an inorganic film, such as a silicon oxide film, a silicon nitride film, an aluminum oxide film, an aluminum nitride film, etc. Alternatively, the insulating film 2221D can also be an organic film, such as a polyimide film, a polyethylene film, a polyvinylidene fluoride film, a polytetrafluoroethylene film, etc.

[0080] In some alternative implementations, such as Figure 7 As shown, the handle bar 2100 may include a body portion 2110 and a reinforcing portion 2120. The reinforcing portion 2120 may be located on the body portion 2110. Furthermore, along the mating direction of the first support portion 2221 and the main board component 2210, that is, the aforementioned third direction Z, the reinforcing portion 2120 and the first support portion 2221 may be arranged opposite to each other.

[0081] As mentioned above, the embodiment of this application uses a scheme where the first bracket 2220 is separated from the handle strip 2100. This may weaken the strength of the handle strip 2100 to some extent. To address this, the embodiment of this application chooses to provide a reinforcing part 2120 in the body part 2110 of the handle strip 2100 at a position corresponding to the first bracket 2220 to strengthen the handle strip 2100, thereby improving the structural strength of the entire computing node 2000.

[0082] like Figure 7 As shown, at least a portion of the reinforcing part 2120 may protrude from the main body 2110 in the direction toward the main board component 2210. The size of the portion of the reinforcing part 2120 protruding from the main body 2110 is not limited here, but can be determined by taking into account relevant parameters such as the height limit inside the computing node 2000. It is understandable that the larger the size of the portion of the reinforcing part 2120 protruding from the main board component 2210, the better its reinforcing effect on the handle strip 2100.

[0083] The reinforcing part 2120 may also be provided with a second clearance part 2121, which is used to clear the aforementioned setting electronic device 2213. Along the docking direction of the first support part 2221 and the motherboard component 2210, that is, the third direction Z, a part of the setting electronic device 2213 may be located in the second clearance part 2121. Alternatively, the setting electronic device 2213 may not extend into the second avoidance part 2121, but may only be positioned opposite to the setting electronic device 2213. In this case, the second avoidance part 2121 can serve as a damage prevention function. During the application of the computing node 2000, if the handle bar 2100 is recessed in the third direction Z towards the inside of the computing node 2000 due to handling, installation, or use, the possibility of the handle bar 2100 directly colliding with or contacting the setting electronic device 2213 is relatively low due to the setting of the second avoidance part 2121. This can reduce the possibility of damage to the setting electronic device 2213 and is more conducive to ensuring the installation and reliable operation of the motherboard assembly 2200.

[0084] The aforementioned second clearance portion 2121 can be a hole or a groove; no specific limitation is made here. Furthermore, this embodiment does not limit the specific material of the reinforcing portion 2120; it can be the same material as the main body portion 2110, or it can be a different material from the main body portion 2110.

[0085] Please refer to Figure 9 , Figure 9 This is a flowchart illustrating the assembly method of the computing node provided in the embodiments of this application.

[0086] like Figure 9As shown, this application embodiment also provides a method for assembling a computing node 2000. The computing node 2000 can be any of the computing nodes involved in the aforementioned implementations. The assembly method can include at least the following steps S100 and S200.

[0087] In step S100, the connecting post 2222 is controlled to pass through the main board component 2210, and the first support 2221 and the main board component 2210 are controlled to be bonded and fixed.

[0088] As mentioned above, the motherboard component 2210 is provided with a first through hole 2210A. When performing the above step S100, the connecting post 2222 can be controlled to pass through the first through hole 2210A, so that the connecting post 2222 passes through the motherboard component 2210. If the first support portion 2221 is already provided with an adhesive portion 2221A, the first support portion 2221 can be directly controlled to move towards the motherboard component 2210, thus achieving the connection between the first support portion 2221 and the motherboard component 2210. However, if the first support portion 2221 is not provided with an adhesive portion 2221A, then an adhesive portion 2221A needs to be provided for the first support portion 2221 first. This adhesive portion 2221A can specifically be adhesive, liquid colloid, etc., and then the first support portion 2221 is controlled to move towards the motherboard component 2210 and connect with the motherboard component 2210.

[0089] In step S200, the main board component 2210 and the handle bar 2100 are connected. The specific connection method can be, for example, screw connection, snap-fit, riveting, etc., which is not limited here, as long as it can meet the relevant requirements such as the reliability of the connection.

[0090] Using the above implementation method, the first bracket 2221 and the main board component 2210 are first connected by bonding, so that the main board component 2210 and the first bracket 2220 can be reliably connected together without the need for specific fixtures. The first bracket 2220 is not easy to fall off the main board component 2210, which facilitates the subsequent connection of the main board component 2210 and the handle strip 2100. This simplifies the installation process, improves installation efficiency, and reduces installation costs.

[0091] The assembly method described above may also include the following steps S300 and S400.

[0092] In step S300, the second bracket 2400 is installed on the connecting column 2222 so that the second bracket 2400 can be positioned by means of the connecting column 2222.

[0093] In combination with the above Figure 8The second bracket 2400 may include a second support portion 2410, and the second support portion 2410 may include a second through hole 2412. Thus, when performing step S300, the connecting post 2222 may be controlled to pass through the second through hole 2412 of the second support portion 2410, so as to realize the installation of the second bracket 2400 on the connecting post 2222.

[0094] In step S400, the radiator 2500 is installed on the positioning post 2420 and the connecting post 2222.

[0095] As mentioned above, the radiator 2500 can be provided with a hole-type or groove-type positioning mating part, and the radiator 2500 can also be provided with a third through hole. During step S400, the positioning mating part of the radiator 2500 can be controlled to insert into the positioning post 2420, and simultaneously the third through hole of the radiator 2500 can be controlled to insert into the connecting post 2222, so that the radiator 2500 can have dual positioning, resulting in a better positioning effect. Then, threaded connectors such as nuts or bolts can be configured, which can be threadedly connected to the connecting post 2222, thereby achieving the fixed assembly of the radiator 2500.

[0096] Steps S300 and S400 can be performed after step S200. Thus, in this embodiment, the second bracket 2400 and the heatsink 2500 are not installed together with the motherboard assembly 2200. When the motherboard assembly 2200 and the handle 2100 are installed, the motherboard assembly 2200 itself is relatively light, making it less prone to stress damage, which is more conducive to ensuring the installation quality of the computing node 2000 provided in this embodiment.

[0097] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A computing node, characterized by, The device includes a handle strip and a motherboard assembly. The motherboard assembly includes a motherboard component and a first bracket. The first bracket and the handle strip are separate structures. The first bracket includes a first support portion and a connecting post. The first support portion is located between the handle strip and the motherboard component, and the first support portion and the motherboard component are bonded and fixed. The connecting post is located on the side of the first support portion away from the handle strip. The connecting post can pass through the motherboard component, and the motherboard component and the handle strip are connected.

2. The computing node according to claim 1, characterized in that, The first support portion is provided with at least two adhesive portions, which are arranged at intervals. The first support portion is connected to the motherboard component through the adhesive portions.

3. The computing node according to claim 1, characterized in that, The first support portion is provided with at least one first clearance portion. The main board component includes a main board body and a setting electronic device. The setting electronic device is located on the side of the main board body facing the handle bar, and at least a portion of the setting electronic device is located in the first clearance portion.

4. The computing node according to claim 1, characterized in that, The first support includes a tray and an insulating film. The insulating film is located on the side of the tray facing the motherboard component. Along the docking direction between the first support and the motherboard component, the projection of the insulating film can cover the projection of the tray.

5. The computing node according to claim 1, characterized in that, The handle bar includes a body and a reinforcing part. The reinforcing part is located on the body and is disposed opposite to the first support and the main board component along the docking direction of the first support and the main board component.

6. The computing node according to claim 5, characterized in that, At least a portion of the reinforcing part protrudes from the body part in the direction toward the motherboard component, and the reinforcing part is also provided with a second clearance part. The motherboard component includes a motherboard body and a setting electronic device, and the setting electronic device is located on the side of the motherboard body facing the handle bar. Along the docking direction of the first support portion and the motherboard component, the second clearance portion and the setting electronic device are disposed opposite to each other; or, a portion of the setting electronic device is located in the second clearance portion.

7. The computing node according to any one of claims 1-6, characterized in that, It also includes a radiator and a second bracket, the second bracket having a positioning post, the second bracket being mounted on the connecting post, and the radiator being mounted on the positioning post and the connecting post.

8. A computing device, characterized in that, It includes a server rack and a computing node, wherein the computing node is installed in the server rack, and the computing node is the computing node described in any one of claims 1-7.

9. A method for assembling computing nodes, characterized in that, The computing node includes a handle and a motherboard assembly. The motherboard assembly includes a motherboard component and a first bracket. The first bracket and the handle are separate structures. The first bracket includes a first support portion and a connecting post. The assembly method includes: Control the connecting post to pass through the motherboard component, and control the first support portion to be bonded and fixed to the motherboard component; Control the connection between the mainboard component and the handle bar.

10. The method for assembling computing nodes according to claim 9, characterized in that, The computing node further includes a second bracket and a heat sink, the second bracket having positioning posts, and the assembly method, after connecting the motherboard component and the handle bar, further includes: Control the installation of the second bracket on the connecting column; Control the installation of the heat sink on the positioning post and the connecting post.

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