Display device
By employing a double-sided circuit film-on-chip bonding method with the cover component in the organic light-emitting diode display panel, the problem of excessively large non-active area is solved, achieving the effects of cost reduction and energy consumption reduction.
CN122290499APending Publication Date: 2026-06-26LG DISPLAY CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- LG DISPLAY CO LTD
- Filing Date
- 2025-10-28
- Publication Date
- 2026-06-26
Smart Images
Figure CN122290499A_ABST
Abstract
A display device, according to an embodiment of this specification, includes: a display panel including an active region and a pad region disposed on one side of the active region; a cover member disposed on the display panel and having a plurality of connecting lines on its lower surface; and a chip-on-film (COP) coupled to the lower surface of the cover member and having a driver chip mounted on the COP. Here, one end of each of the plurality of connecting lines of the cover member can be connected to a pad in the pad region of the display panel, and the other end of each of the plurality of connecting lines of the cover member can be connected to a pad on the COP.
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