Three-dimensional conductive electrode integrated capacitor

Abstract

This invention discloses a three-dimensional conductive electrode integrated capacitor, relating to the field of capacitor technology. The capacitor's first electrode includes multiple parallel-arranged first horizontal electrode plates and a first vertical electrode plate, with one end of the first vertical electrode plate perpendicularly connected to one end of the multiple first horizontal electrode plates. The second electrode includes multiple parallel-arranged second horizontal electrode plates and a second vertical electrode plate, with one end of the second vertical electrode plate perpendicularly connected to one end of the multiple second horizontal electrode plates. The surfaces of the first and second vertical electrode plates are positioned opposite each other, and the multiple first and second horizontal electrode plates are arranged in a staggered, interleaved manner. An electrical isolation distance exists between the other end of each first horizontal electrode plate and the surface of the second vertical electrode plate, and an electrical isolation distance also exists between the other end of each second horizontal electrode plate and the surface of the first vertical electrode plate. This invention can increase energy storage density within a limited space while ensuring electrical safety.

Description

Technical Field

[0001] This invention relates to the field of capacitor technology, and more specifically to a three-dimensional integrated conductive electrode capacitor. Background Technology

[0002] As an indispensable energy storage component in electronic devices, the performance of capacitors directly affects the stability, power density, and lifespan of these devices. With the miniaturization, high density, and high power of electronic devices, the structural design of traditional capacitors has gradually revealed many shortcomings, making it difficult to meet current application requirements.

[0003] Currently, most capacitors on the market use a planar multilayer structure, which makes it difficult to increase capacitance and results in low energy density per unit volume, failing to meet the high-capacity requirements of miniaturized devices. Furthermore, the electrode structure design of traditional capacitors is unreasonable, leading to poor electrical isolation between electrodes, which can easily cause short circuits and reduce the capacitor's voltage withstand performance and safety performance. Summary of the Invention

[0004] This invention provides a three-dimensional conductive electrode integrated capacitor, which aims to overcome the above-mentioned problems, improve energy storage density within a limited space, and ensure electrical safety.

[0005] To address the aforementioned problems, embodiments of the present invention disclose a three-dimensional conductive electrode integrated capacitor, comprising: The first electrode includes a plurality of parallel first horizontal electrode plates and a first vertical electrode plate, wherein the first vertical electrode plate is perpendicularly connected to one end of the plurality of first horizontal electrode plates. The second electrode includes a plurality of parallel second horizontal electrode plates and a second vertical electrode plate, wherein the second vertical electrode plate is perpendicularly connected to one end of the plurality of second horizontal electrode plates. The surface of the first vertical electrode plate is arranged opposite to the surface of the second vertical electrode plate, and multiple first horizontal electrode plates and multiple second horizontal electrode plates are arranged in a staggered manner. There is an electrical isolation distance between the other end of each first horizontal electrode plate and the surface of the second vertical electrode plate, and an electrical isolation distance between the other end of each second horizontal electrode plate and the surface of the first vertical electrode plate. A dielectric layer is located at least between the first horizontal electrode plate and the second horizontal electrode plate, and between the first vertical electrode plate and the second vertical electrode plate; An insulating encapsulation layer completely encapsulates the first and second electrodes. The first electrode terminal extends from the first electrode to the outside of the insulating encapsulation layer; The second electrode terminal extends from the second electrode to the outside of the insulating encapsulation layer.

[0006] In one embodiment of the present invention, both the first and second transverse electrode plates have an L-shaped cross-section structure. Each of the first and second transverse electrode plates includes mutually perpendicular transverse sub-plate surfaces and vertical sub-plate surfaces. The transverse sub-plate surfaces of the first and second transverse electrode plates are opposite to each other in the X direction of the capacitor, with a dielectric layer sandwiched in between to form a sub-capacitor in the X direction. The vertical sub-plate surfaces of the first and second transverse electrode plates are opposite to each other in the Z direction of the capacitor, with a dielectric layer sandwiched in between to form a sub-capacitor in the Z direction. The surfaces of the first and second vertical electrode plates are opposite to each other in the Y direction of the capacitor, with a dielectric layer sandwiched in between to form a sub-capacitor in the Y direction.

[0007] In one embodiment of the present invention, a plurality of parallel first horizontal electrode plates and a plurality of parallel second horizontal electrode plates and a plurality of parallel second vertical electrode plates are integrally formed.

[0008] In one embodiment of the present invention, the intersection of the first horizontal electrode plate and the first vertical electrode plate, and the intersection of the second horizontal electrode plate and the second vertical electrode plate, are both arc-shaped transition structures.

[0009] In one embodiment of the present invention, the radius of curvature of the arc-shaped transition structure at the intersection of the first horizontal electrode plate and the first vertical electrode plate is not less than 1 / 5 of the thickness of the first horizontal electrode plate; the radius of curvature of the arc-shaped transition structure at the intersection of the second horizontal electrode plate and the second vertical electrode plate is not less than 1 / 5 of the thickness of the second horizontal electrode plate; wherein, the thickness of the first horizontal electrode plate and the thickness of the second horizontal electrode plate are the same or different.

[0010] In one embodiment of the present invention, each of the plurality of first horizontal electrode plates is provided with an arc-shaped guide portion at one end away from the first vertical electrode plate, and each of the plurality of second horizontal electrode plates is also provided with an arc-shaped guide portion at one end away from the second vertical electrode plate, and the surface of the arc-shaped guide portion is covered with a dielectric layer.

[0011] In one embodiment of the present invention, an insulating limiting rib is provided between the arc-shaped guide portion of a plurality of first horizontal electrode plates and the plate surface of the second vertical electrode plate; an insulating limiting rib is provided between the arc-shaped guide portion of a plurality of second horizontal electrode plates and the plate surface of the first vertical electrode plate; the two ends of the insulating limiting rib are respectively fixed to their contact surfaces, and the material of the insulating limiting rib is the same as that of the dielectric layer.

[0012] In one embodiment of the present invention, the first transverse electrode plate and the second transverse electrode plate are both shallow groove-type three-dimensional planar structures. The groove opening of the first transverse electrode plate is disposed facing the second transverse electrode plate, and the groove opening of the second transverse electrode plate is disposed facing the first transverse electrode plate. The dielectric layer fills the inside of the groove and the gap between the first transverse electrode plate and the second transverse electrode plate.

[0013] In one embodiment of the present invention, a three-dimensional mesh heat dissipation structure is embedded inside the insulating encapsulation layer. The three-dimensional mesh heat dissipation structure is in contact with the first horizontal electrode plate, the second horizontal electrode plate, the first vertical electrode plate, and the second vertical electrode plate. The material of the three-dimensional mesh heat dissipation structure is insulating and thermally conductive ceramic.

[0014] In one embodiment of the present invention, an insulating sealing sleeve is provided at the connection between the insulating encapsulation layer and the first electrode terminal and the second electrode terminal, and the insulating sealing sleeve is tightly fitted to the first electrode terminal, the second electrode terminal and the insulating encapsulation layer.

[0015] The embodiments of the present invention have the following advantages: This invention discloses a three-dimensional integrated conductive electrode capacitor. Its first electrode includes multiple parallel-arranged first horizontal electrode plates and a first vertical electrode plate, with one end of the first vertical electrode plate perpendicularly connected to one end of the multiple first horizontal electrode plates. The second electrode includes multiple parallel-arranged second horizontal electrode plates and a second vertical electrode plate, with one end of the second vertical electrode plate perpendicularly connected to one end of the multiple second horizontal electrode plates. The surfaces of the first vertical electrode plates and the second vertical electrode plates are arranged opposite each other, and the multiple first horizontal electrode plates and the multiple second horizontal electrode plates are arranged in a staggered manner. On one hand, this invention can form sub-capacitors in at least the X and Y directions of the capacitor, and these sub-capacitors are electrically connected in parallel, achieving a significant increase in the electrode facing area within a limited package volume. On the other hand, the capacitor structure of this invention has mutually supporting mechanical properties. The vertical connection between the horizontal electrode plates and the vertical electrode plates forms a stable mechanical framework, avoiding the problem of easy breakage or collapse of traditional columnar electrodes, and its mechanical strength is far superior to multi-layer stacked structures. Meanwhile, there is an electrical isolation distance between the other end of the first horizontal electrode plate and the second vertical electrode plate, and an electrical isolation distance between the other end of the second horizontal electrode plate and the first vertical electrode plate; the dielectric layer is located at least between the first horizontal electrode plate and the second horizontal electrode plate, and between the first vertical electrode plate and the second vertical electrode plate. The electrical isolation distance avoids short circuits and cross-current problems caused by electrode contact, and ensures electrical safety. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the first electrode in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a three-dimensional conductive electrode integrated capacitor according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the first transverse electrode plate in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of a three-dimensional conductive electrode integrated capacitor according to another embodiment of the present invention.

[0018] Explanation of reference numerals in the attached figures: 100-First electrode, 200-Second electrode, 300-Dielectric layer, 400-Insulating encapsulation layer, 500-First electrode terminal, 600-Second electrode terminal, 700-Insulating limiting rib, 800-Insulating sealing sleeve; 101-First horizontal electrode plate, 102-First vertical electrode plate, 201-Second horizontal electrode plate, 202-Second vertical electrode plate, 301-Arc-shaped guide part, 401-Arc-shaped corner transition structure; A-Horizontal sub-plate surface, B-Vertical sub-plate surface. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] This invention discloses a three-dimensional conductive electrode integrated capacitor, referenced Figure 1 and Figure 2 The capacitor includes: a first electrode 100, a second electrode 200, a dielectric layer 300, an insulating encapsulation layer 400, a first electrode terminal 500, and a second electrode terminal 600.

[0021] The first electrode 100 includes a plurality of parallel-arranged first horizontal electrode plates 101 and a first vertical electrode plate 102, with the first vertical electrode plate 102 perpendicularly connected to one end of the plurality of first horizontal electrode plates 101. The second electrode 200 includes a plurality of parallel-arranged second horizontal electrode plates 201 and a second vertical electrode plate 202, with the second vertical electrode plate 202 perpendicularly connected to one end of the plurality of second horizontal electrode plates 201. The surfaces of the first vertical electrode plates 102 and the second vertical electrode plates 202 are arranged opposite to each other, and the plurality of first horizontal electrode plates 101 and the plurality of second horizontal electrode plates 201 are arranged in a staggered manner. Each first horizontal electrode plate 101 has its other... One end of each second horizontal electrode plate 201 has an electrical isolation distance from the surface of the second vertical electrode plate 202, and the other end of each second horizontal electrode plate 201 has an electrical isolation distance from the surface of the first vertical electrode plate 102; the dielectric layer 300 is located at least between the first horizontal electrode plate 101 and the second horizontal electrode plate 201, and between the first vertical electrode plate 102 and the second vertical electrode plate 202; the insulating encapsulation layer 400 is used to completely encapsulate the first electrode 100 and the second electrode 200; the first electrode terminal 500 is led out from the first electrode 100 and extends to the outside of the insulating encapsulation layer 400; the second electrode terminal 600 is led out from the second electrode 200 and extends to the outside of the insulating encapsulation layer 400.

[0022] In this embodiment of the invention, the first electrode 100 and the second electrode 200 are the two polarity electrodes of a capacitor, serving as the anode and cathode, respectively. This application does not limit which of the first electrode 100 and the second electrode 200 is the anode and which is the cathode. The first electrode 100 includes multiple parallel-arranged first horizontal electrode plates 101 and a first vertical electrode plate 102. The surface of the first vertical electrode plate 102 is connected to one end of the first horizontal electrode plate 101, meaning the surface of the first horizontal electrode plate 101 is perpendicular to the surface of the first vertical electrode plate 102. The second electrode 200 includes multiple parallel-arranged second horizontal electrode plates 201 and a second vertical electrode plate 202. The surface of the second vertical electrode plate 202 is connected to one end of the second horizontal electrode plate 201, meaning the surface of the second horizontal electrode plate 201 is perpendicular to the surface of the second vertical electrode plate 202. Understandably, the first horizontal electrode plate 101 and the second horizontal electrode plate 201 are electrode sheets extending in a horizontal direction, used to increase the area of ​​the electrodes facing each other, and multiple parallel arrangements can further increase the capacitance of the capacitor. The first vertical electrode plate 102 and the second vertical electrode plate 202 are electrode sheets extending in a vertical direction.

[0023] The first vertical electrode plate 102 and the second vertical electrode plate 202 are arranged opposite each other, that is, the two vertical electrode plates are in a parallel and opposing state; multiple first horizontal electrode plates 101 and multiple second horizontal electrode plates 201 are arranged in a staggered manner, that is, the first horizontal electrode plates 101 and the second horizontal electrode plates 201 interpenetrate each other and are located on different horizontal planes, forming a three-dimensional cross structure. At the same time, the other end of each first horizontal electrode plate 101 away from the first vertical electrode plate 102 maintains a certain electrical isolation distance from the surface of the second vertical electrode plate 202, and the other end of each second horizontal electrode plate 201 away from the second vertical electrode plate 202 also maintains the same electrical isolation distance from the surface of the first vertical electrode plate 102, ensuring that no short circuit occurs between the two electrodes.

[0024] The dielectric layer 300 covers at least the area between the first horizontal electrode plate 101 and the second horizontal electrode plate 201, and between the first vertical electrode plate 102 and the second vertical electrode plate 202, for electrical isolation and charge storage between the two electrodes. The insulating encapsulation layer 400 completely encloses the first electrode 100, the second electrode 200, and the dielectric layer 300, forming a closed protective structure. The first electrode terminal 500 extends from the first electrode 100 (which may extend from the first vertical electrode plate 102 or any one of the first horizontal electrode plates 101), and the second electrode terminal 600 extends from the second electrode 200 (which may extend from the second vertical electrode plate 202 or any one of the second horizontal electrode plates 201). Both terminals extend outside the insulating encapsulation layer 400 for connection to external circuitry. Optionally, the first electrode terminal 500 extends from the end of the first vertical electrode plate 102 away from the first horizontal electrode plate 101, and the second electrode terminal 600 extends from the end of the second vertical electrode plate 202 away from the second horizontal electrode plate 201.

[0025] When different potentials are applied to the first electrode terminal 500 and the second electrode terminal 600 respectively, multiple sub-capacitors are formed in the following regions: (1) Between the first horizontal electrode plate 101 and the adjacent second horizontal electrode plate 201, multiple sub-capacitors are formed along the height direction of the capacitor (which can be defined as the X direction) through the dielectric layer 300 between the two. Since the multiple first horizontal electrode plates 101 and the multiple second horizontal electrode plates 201 are arranged in a staggered manner, a sub-capacitor unit is formed between each pair of adjacent first horizontal electrode plates 101 and second horizontal electrode plates 201. These sub-capacitor units are connected in parallel in the circuit, and their total capacitance is the sum of the individual sub-capacitors. (2) Between the first vertical electrode plate 102 and the second vertical electrode plate 202, a sub-capacitor is formed along the width direction of the capacitor (which can be defined as the Y direction) through the dielectric layer 300 between the two.

[0026] The X-direction and Y-direction sub-capacitors mentioned above are electrically connected in parallel, with the total capacitance being the sum of the two. On one hand, this three-dimensional spatial layout fully utilizes the internal space of the device, achieving a significant increase in the electrode facing area within a limited package volume. On the other hand, this three-dimensional spatial layout frame capacitor structure possesses mutually supporting mechanical properties. The vertical connection between the horizontal and vertical electrode plates forms a stable mechanical framework, avoiding the problem of easy breakage or collapse of traditional columnar electrodes, and its mechanical strength is far superior to multi-layer stacked structures.

[0027] Meanwhile, each first horizontal electrode plate 101 has an electrical isolation distance between its other end and the surface of the second vertical electrode plate 202, and each second horizontal electrode plate 201 has an electrical isolation distance between its other end and the surface of the first vertical electrode plate 102. It is understood that the first horizontal electrode plate 101 is only connected to the first vertical electrode plate 102 and does not contact the second horizontal electrode plate 201 or the second vertical electrode plate 202; the second horizontal electrode plate 201 is only connected to the second vertical electrode plate 202 and does not contact the first horizontal electrode plate 101 or the first vertical electrode plate 102. This achieves effective structural isolation between the electrodes, avoiding short circuits and cross-current problems caused by electrode contact and ensuring electrical safety.

[0028] Optional, see reference Figure 2 Both the first transverse electrode plate 101 and the second transverse electrode plate 201 are planar structures. In this case, the capacitor based on the present invention can only form a capacitor with sub-capacitance along the X-direction and sub-capacitance along the Y-direction.

[0029] Optional, see reference Figure 3 The first horizontal electrode plate 101 and the second horizontal electrode plate 201 are both L-shaped cross-section structures. Each of the first horizontal electrode plate 101 and the second horizontal electrode plate 201 includes mutually perpendicular horizontal sub-plate surfaces A and vertical sub-plate surfaces B. The horizontal sub-plate surfaces of the first horizontal electrode plate 101 and the horizontal sub-plate surfaces A of the second horizontal electrode plate 201 are opposite to each other in the X direction of the capacitor, with a dielectric layer 300 sandwiched in between to form a sub-capacitor in the X direction. The vertical sub-plate surfaces B of the first horizontal electrode plate 101 and the second horizontal electrode plate 201 are opposite to each other in the Z direction of the capacitor, with a dielectric layer 300 sandwiched in between to form a sub-capacitor in the Z direction. The surfaces of the first vertical electrode plate 102 and the second vertical electrode plate 202 are opposite to each other in the Y direction of the capacitor, with a dielectric layer 300 sandwiched in between to form a sub-capacitor in the Y direction.

[0030] Among them, reference Figure 2 and Figure 4The directions shown are: X-direction is the height direction of the capacitor, Y-direction is the width direction of the capacitor, and Z-direction is the thickness direction of the capacitor. When different potentials are applied to the first electrode terminal 500 and the second electrode terminal 600, multiple sub-capacitors are formed in the following regions: (1) X direction: The transverse sub-plate surface A of the first transverse electrode plate 101 and the transverse sub-plate surface A of the second transverse electrode plate 201 are directly opposite each other in the X direction, and an electric field in the X direction is formed through the dielectric layer 300 between them. Since multiple transverse electrode plates are arranged in a staggered manner in the X direction, an X-direction sub-capacitor unit is formed between each pair of adjacent transverse sub-plate surfaces A, and each sub-capacitor unit is connected in parallel in the circuit.

[0031] (2) Z direction: The vertical sub-plate surface B of the first horizontal electrode plate 101 and the vertical sub-plate surface B of the second horizontal electrode plate 201 are opposite each other in the Z direction (thickness direction) of the capacitor. A dielectric layer 300 is also sandwiched between the two opposite vertical sub-plate surfaces B. The dielectric layer 300 completely covers the opposite area of ​​the two vertical sub-plate surfaces B, forming a sub-capacitor in the Z direction, which stores energy in conjunction with the sub-capacitor in the X direction. Similarly, a Z-direction sub-capacitor unit (not shown in the figure) is formed between each pair of adjacent vertical sub-plate surfaces B, and each sub-capacitor unit is connected in parallel in the circuit.

[0032] (3) Y direction: The surface of the first vertical electrode plate 102 and the surface of the second vertical electrode plate 202 located in the gap between the horizontal sub-plate surface A of the adjacent first horizontal electrode plate 101 and the horizontal sub-plate surface A of the second horizontal electrode plate 201 are opposite to each other in the Y direction (width direction) of the capacitor. A dielectric layer 300 is sandwiched between the opposite surfaces of the two vertical electrode plates to form a sub-capacitor in the Y direction. This sub-capacitor together with the sub-capacitors in the X and Z directions constitutes a three-dimensional energy storage structure.

[0033] The aforementioned X-direction, Y-direction, and Z-direction sub-capacitor groups are electrically connected in parallel because they share the same pair of first electrodes 100 and second electrodes 200, and their total capacitance is the sum of the three. In this embodiment of the invention, the L-shaped transverse electrode plate design, through the introduction of the vertical sub-plate surface B, on the one hand, opens an additional capacitor coupling channel in the Z-direction, and the sub-capacitors in the X, Y, and Z directions are connected in parallel and superimposed, significantly increasing the total capacitance per unit volume compared to a single-direction capacitor structure. On the other hand, the L-shaped cross-section effectively improves the bending section modulus of the transverse electrode plate in the Z and Y directions. The transverse sub-plate surface A and the vertical sub-plate surface B form a reinforcing structure similar to angle steel, reducing the flexural deformation of the electrode plate under encapsulation pressure, thermal stress, or vibration, and helping to maintain the stability of the capacitor spacing in each direction.

[0034] It is worth noting that the vertical sub-plate surface B constituting the Z-direction sub-capacitor does not affect the formation of the Y-direction sub-capacitor, because the vertical sub-plate surface B of the first horizontal electrode plate 101 and the vertical sub-plate surface B of the second horizontal electrode plate 201 are not located between the surfaces of the two first vertical electrode plates 102 and the second vertical electrode plate 202, and are not parallel to the surfaces of the first vertical electrode plate 102 and the second vertical electrode plate 202. The multiple L-shaped cross-sections of the first horizontal electrode plates 101 and the second horizontal electrode plates 201 maintain a staggered arrangement. The electrode spacing (i.e., the distance between relative plate surfaces) corresponding to the sub-capacitors in the three directions all meet the electrical isolation distance, and all dielectric layers 300 are connected as a single unit, ensuring the continuity and reliability of the insulation. The L-shaped cross-section of the first horizontal electrode plate 101 is perpendicularly connected to the first vertical electrode plate 102, and the L-shaped cross-section of the second horizontal electrode plate 201 is perpendicularly connected to the second vertical electrode plate 202. The connection method can be integral molding, welding, etc., to ensure smooth current flow. In this embodiment of the invention, the vertical sub-plate B can be bent from the upper or lower edge of the horizontal sub-plate A, or it can be bent at the middle of the horizontal sub-plate A; this application does not limit this. Furthermore, as... Figure 3 As shown, based on a similar concept to the arc-shaped corner transition structure 401, there are no sharp edges at the junction of the two sub-plate surfaces of the L-shaped section.

[0035] In one embodiment of the present invention, multiple parallel-arranged first horizontal electrode plates 101 and first vertical electrode plates 102 are integrally formed, as are multiple parallel-arranged second horizontal electrode plates 201 and second vertical electrode plates 202. Integral forming means that multiple first horizontal electrode plates 101 and first vertical electrode plates 102 are formed into a single structure through the same processing technology, without subsequent splicing or welding; similarly, multiple second horizontal electrode plates 201 and second vertical electrode plates 202 are also integrally formed to form a single structure. Integral forming processes include, but are not limited to, stamping, etching, 3D printing, and casting, etc., and this application does not limit them. The embodiment of the present invention, through its integrally formed structure design, can eliminate contact resistance at the connection points, making the current flow inside the electrode smoother and reducing energy loss; at the same time, the integrally formed structure has stronger integrity, which can improve the structural strength of the electrode, avoid structural defects caused by splicing and welding, and can adapt to harsh working environments such as vibration and impact, extending its service life; in addition, the integral forming process can ensure the arrangement accuracy and spacing consistency of multiple horizontal electrode plates, ensuring that the facing area of ​​each horizontal electrode plate and its corresponding electrode is consistent, improving the performance consistency of the capacitor.

[0036] In one embodiment of the present invention, reference is made to... Figure 2 and Figure 4The junctions of the first horizontal electrode plate 101 and the first vertical electrode plate 102, and the junctions of the second horizontal electrode plate 201 and the second vertical electrode plate 202, are all arc-shaped corner transition structures 401. Traditional electrode junctions use right-angle structures, which easily lead to stress concentration during assembly and use. When subjected to vibration, impact, or temperature changes, the stress at the right angles accumulates, causing cracks and fractures in the electrodes. Simultaneously, the electric field intensity at the right angles is abnormally concentrated, easily triggering partial discharge, accelerating the aging of the dielectric layer 300, and affecting the capacitor's withstand voltage performance and service life. In this embodiment, the junctions of the first horizontal electrode plate 101 and the first vertical electrode plate 102, and the junctions of the second horizontal electrode plate 201 and the second vertical electrode plate 202, use arc-shaped surfaces instead of the traditional right-angle structures. This achieves a smooth transition between the horizontal and vertical electrode plates, dispersing stress, avoiding stress concentration, and mitigating the problem of electric field intensity concentration, thus protecting the electrodes and the dielectric layer 300. In practice, the curvature of the arc angle can be flexibly adjusted according to the electrode thickness and material. The better the material's toughness, the smaller the curvature can be; the greater the material's brittleness, the larger the curvature can be, ensuring stress dispersion. For integrally formed electrodes, the arc angle can be directly formed during processing such as stamping, etching, and 3D printing; for separately connected electrodes, the arc angle can be processed after welding through grinding, polishing, or other methods.

[0037] In one embodiment of the present invention, the radius of curvature of the arc-shaped transition structure 401 at the intersection of the first horizontal electrode plate 101 and the first vertical electrode plate 102 is not less than 1 / 5 of the thickness of the first horizontal electrode plate 101; the radius of curvature of the arc-shaped transition structure 401 at the intersection of the second horizontal electrode plate 201 and the second vertical electrode plate 202 is not less than 1 / 5 of the thickness of the second horizontal electrode plate 201; wherein, the thickness of the first horizontal electrode plate 101 and the thickness of the second horizontal electrode plate 201 are the same or different. The radius of curvature of the arc-shaped corner directly affects the stress dispersion effect and the electric field concentration mitigation effect: if the radius of curvature is too small, the arc-shaped corner is close to a right angle, which cannot effectively disperse stress and alleviate electric field concentration; if the radius of curvature is too large, it will occupy too much space, affect the compactness of the electrode, and reduce the energy storage density per unit volume. The inventors have found that by limiting the radius of curvature to not less than 1 / 5 of the thickness of the horizontal electrode plate, the stress dispersion and electric field mitigation effects of the arc-shaped corner can be fully utilized while ensuring the compactness of the electrode, and the capacitance and structural stability of the capacitor can also be taken into account. The thicknesses of the first transverse electrode plate 101 and the second transverse electrode plate 201 can be adjusted according to conductivity requirements: when improved conductivity is needed, the electrode thickness can be increased; when reduced volume is needed, the electrode thickness can be decreased. The thicknesses can be the same (simplifying the manufacturing process) or different (adapting to different current distribution requirements). For example, for a high-frequency capacitor, the radius of curvature can be set to 1 / 4 to 1 / 3 of the electrode thickness, balancing compactness and electric field mitigation.

[0038] The inventors considered that if the end of the horizontal electrode plate furthest from the vertical electrode plate is a sharp structure, it could easily scratch the dielectric layer 300 during assembly, leading to insulation failure. Simultaneously, the electric field intensity at the sharp end would be concentrated, easily triggering partial discharge and accelerating the aging of the dielectric layer 300. Therefore, in one embodiment of the present invention, referring to… Figure 1 and Figure 2 as well as Figure 4 Each of the multiple first horizontal electrode plates 101 has an arc-shaped guide portion 301 at one end away from the first vertical electrode plate 102, and each of the multiple second horizontal electrode plates 201 also has an arc-shaped guide portion 301 at one end away from the second vertical electrode plate 202. The surface of the arc-shaped guide portion 301 is covered with a dielectric layer 300. The arc-shaped guide portion 301 eliminates sharp structures at the electrode ends, preventing scratches on the dielectric layer 300; simultaneously, the arc shape alleviates electric field concentration, protecting the dielectric layer 300. The dielectric layer 300 covering the surface of the arc-shaped guide portion 301 further improves insulation reliability, ensuring electrical isolation between the electrode ends and other components, and preventing short circuits. The arc-shaped guide portion 301 can be of the type of arc-shaped chamfer (end edge chamfer), arc-shaped protrusion (end with an arc-shaped protrusion), or spherical end (end with a spherical structure). The length and curvature of the arc-shaped guide portion 301 can be adjusted according to the size of the horizontal electrode plates and assembly requirements; this application does not limit this.

[0039] In one embodiment of the present invention, reference is made to... Figure 4 An insulating limiting rib is provided between the arc-shaped guide portion of the plurality of first horizontal electrode plates and the plate surface of the second vertical electrode plate; an insulating limiting rib is also provided between the arc-shaped guide portion of the plurality of second horizontal electrode plates and the plate surface of the first vertical electrode plate; both ends of the insulating limiting rib are fixed to their contact surfaces, and the material of the insulating limiting rib is the same as that of the dielectric layer. In this invention, the inventors further considered that one end of the first horizontal electrode plate connected to the first vertical electrode plate is a fixed end, and the other end (free end) is in a cantilever state in the X direction. Similarly, the free end of the second horizontal electrode plate is also in a cantilever state. Under conditions such as encapsulation injection molding, temperature cycling, and mechanical vibration, the cantilever free end may experience slight displacement or vibration in the X direction, resulting in changes in the electrode spacing of the sub-capacitor in the X direction, affecting the stability of the capacitance value, and in severe cases, it may even accidentally contact the opposite vertical electrode plate, causing a short circuit. Therefore, in one embodiment of the present invention, by placing insulating limiting ribs between the free end of the transverse electrode plate and the opposite vertical electrode plate, the originally free cantilever end is transformed into a simply supported beam or fixed beam structure supported at both ends. The insulating limiting ribs provide additional rigid support points at the free end, directly constraining the translational degree of freedom of the transverse electrode plate in the X direction, effectively suppressing the displacement and vibration of the cantilever end.

[0040] Specifically, the insulating limiting rib is positioned between the free end arc-shaped guide portion of the transverse electrode plate and the surface of the opposing vertical electrode plate. This area is a non-directly facing energy storage region—it does not participate in the formation of the X-direction capacitance between the first and second transverse electrode plates, nor in the formation of the Y-direction capacitance between the first and second vertical electrode plates (because the effective area of ​​the Y-direction capacitance is the directly facing area between the surfaces of the two vertical electrode plates, while the insulating limiting rib is located in the corner area between the free end of the transverse electrode plate and the vertical electrode plate, not on the main electric field path of the Y-direction capacitance). Simultaneously, the insulating limiting rib does not encroach on the directly facing space of the vertical plate surface of the Z-direction capacitance. Therefore, while providing mechanical support, the insulating limiting rib does not substantially affect the sub-capacitors in any of the three directions. Since the material of the insulating limiting rib is the same as the dielectric layer, its dielectric constant and insulation properties are identical to the surrounding dielectric layer, and even if it is located in the edge region of the electric field, it will not cause local electric field distortion or leakage paths.

[0041] Furthermore, in one embodiment of the present invention (not shown in the figures), both the first transverse electrode plate 101 and the second transverse electrode plate 201 are shallow groove-type three-dimensional planar structures. The groove opening of the first transverse electrode plate 101 faces the second transverse electrode plate 201, and the groove opening of the second transverse electrode plate 201 faces the first transverse electrode plate 101, that is, the grooves of the two transverse electrode plates are arranged opposite to each other. The dielectric layer 300 fills the inside of the grooves of the first transverse electrode plate 101, the inside of the grooves of the second transverse electrode plate 201, and the gap between the two transverse electrode plates, thereby achieving complete insulation and charge storage for the two electrode plates. For example, Figure 1 In the illustrated transverse electrode plate structure, the groove opening is provided on the surface of the transverse electrode plate, and the groove opening of the first transverse electrode plate 101 can face the groove opening of the second transverse electrode plate 201. For Figure 3 In the illustrated transverse electrode plate structure, the groove opening can be provided on at least one of the transverse sub-plate surface and the vertical sub-plate surface. The facing area of ​​a traditional planar electrode plate is only its surface area, while in the shallow groove-type transverse electrode plate, the inner sidewall of the groove can also form a facing area with the corresponding electrode plate, significantly increasing the electrode facing area and thus improving capacitance. Simultaneously, the dielectric layer 300 fills the groove, enabling more thorough contact with the electrode plate, reducing the gap between the electrode and the dielectric layer 300, preventing the formation of bubbles and impurities in the gap, and improving insulation reliability and charge storage efficiency. The opposing groove openings ensure that the inner sidewalls of the grooves of the two electrode plates can face each other, maximizing the facing area and further increasing capacitance.

[0042] During the charging and discharging of a capacitor, the current passing through the electrodes and electrode terminals generates Joule heat. Especially in high-frequency charging and discharging or high-power applications, significant heat is generated inside the electrodes. If heat cannot be dissipated in time, the increased temperature can lead to degradation of the dielectric properties of the dielectric layer 300, increased leakage current, shortened lifespan, and even thermal runaway. Traditional insulating encapsulation materials (such as epoxy resin) have low thermal conductivity (typically 0.2 to 2 W / m·K), resulting in limited heat dissipation. Therefore, in one embodiment of the present invention, a three-dimensional mesh heat dissipation structure (not shown) is embedded inside the insulating encapsulation layer 400. This three-dimensional mesh heat dissipation structure is in contact with the first horizontal electrode plate 101, the second horizontal electrode plate 201, the first vertical electrode plate 102, and the second vertical electrode plate 202, and the material of the three-dimensional mesh heat dissipation structure is insulating and thermally conductive ceramic. In this embodiment, the three-dimensional mesh heat dissipation structure has a large heat dissipation area, which can quickly absorb the heat generated by the electrodes and transfer the heat to the insulating encapsulation layer 400, and then dissipate it to the outside. The insulating and thermally conductive ceramic material has both good thermal conductivity, which can efficiently conduct heat, and good insulation properties, which can prevent short circuits caused by contact with the electrodes and ensure the safety performance of the capacitor. This heat dissipation structure is in contact with all electrodes, which can comprehensively absorb the heat generated by each electrode and achieve uniform heat dissipation, allowing the capacitor to operate safely at higher power densities.

[0043] The three-dimensional mesh heat dissipation structure can adopt honeycomb, sponge, or mesh grid structures. The thermally conductive ceramic material can be insulating thermally conductive ceramics such as alumina, aluminum nitride, or beryllium oxide. The three-dimensional mesh heat dissipation structure can be prepared by 3D printing, powder sintering, sol-gel method, template method, etc., and then embedded in the encapsulation layer. This application does not limit this aspect.

[0044] In one embodiment of the present invention, reference is made to... Figure 2 and Figure 4In this embodiment, insulating sealing sleeves 800 are provided at the connections between the insulating encapsulation layer 400 and the first electrode terminal 500 and the second electrode terminal 600, respectively. The insulating sealing sleeves 800 are tightly fitted to the first electrode terminal 500, the second electrode terminal 600, and the insulating encapsulation layer 400. In existing capacitors, there are tiny gaps at the connections between the insulating encapsulation layer 400 and the electrode terminals. External moisture, dust, and other impurities can easily enter the encapsulation layer through these gaps, corroding the electrodes and dielectric layer 300, leading to decreased insulation performance, electrode oxidation, and affecting the capacitor's lifespan and safety performance. Therefore, in this embodiment, insulating sealing sleeves 800 are provided at the connections between the insulating encapsulation layer 400 and the first electrode terminal 500, and at the connections between the insulating encapsulation layer 400 and the second electrode terminal 600. The insulating sealing sleeves 800 are fitted onto the electrode terminals, with one end tightly fitted to the insulating encapsulation layer 400 and the other end tightly fitted to the electrode terminal, completely covering the gaps at the connections to form a sealed structure and prevent external impurities from entering. Meanwhile, the insulating sealing sleeve 800 has insulating properties, which can further improve the insulation reliability of the connection, avoid problems such as leakage and short circuit caused by gaps, and ensure the safety performance of the capacitor. It is especially suitable for harsh environments such as humid and dusty environments.

[0045] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0046] It should also be noted that, in this document, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, relational terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor should they be construed as indicating or implying relative importance. Moreover, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes the element.

[0047] The technical solutions provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand this application, and the content of this specification should not be construed as a limitation of this application. Furthermore, for those skilled in the art, there will be different forms of changes in the specific implementation methods and application scope based on this application. It is neither necessary nor possible to exhaustively list all implementation methods here, and obvious changes or modifications derived therefrom are still within the protection scope of this application.

Claims

1. A three-dimensional conductive electrode integrated capacitor, characterized in that, include: The first electrode includes a plurality of parallel first horizontal electrode plates and a first vertical electrode plate, wherein the first vertical electrode plate is perpendicularly connected to one end of the plurality of first horizontal electrode plates. The second electrode includes a plurality of parallel-arranged second horizontal electrode plates and a second vertical electrode plate, wherein the second vertical electrode plate is perpendicularly connected to one end of the plurality of second horizontal electrode plates. The surface of the first vertical electrode plate is disposed opposite to the surface of the second vertical electrode plate, and a plurality of first horizontal electrode plates and a plurality of second horizontal electrode plates are disposed in a staggered manner. There is an electrical isolation distance between the other end of each first horizontal electrode plate and the surface of the second vertical electrode plate, and an electrical isolation distance between the other end of each second horizontal electrode plate and the surface of the first vertical electrode plate. A dielectric layer is located at least between the first lateral electrode plate and the second lateral electrode plate, and between the first vertical electrode plate and the second vertical electrode plate; An insulating encapsulation layer completely encapsulates the first electrode and the second electrode; A first electrode terminal is led out from the first electrode and extends to the outside of the insulating encapsulation layer; The second electrode terminal extends from the second electrode to the outside of the insulating encapsulation layer.

2. The three-dimensional conductive electrode integrated capacitor according to claim 1, characterized in that, Both the first transverse electrode plate and the second transverse electrode plate have an L-shaped cross-section structure, and each of the first transverse electrode plate and the second transverse electrode plate includes a transverse sub-plate surface and a vertical sub-plate surface that are perpendicular to each other. The lateral sub-plate surfaces of the first lateral electrode plate and the second lateral electrode plate are opposite to each other in the X direction of the capacitor, with the dielectric layer sandwiched in between to form a sub-capacitor in the X direction. The vertical sub-plate surfaces of the first horizontal electrode plate and the second horizontal electrode plate are opposite to each other in the Z direction of the capacitor, with the dielectric layer sandwiched in between to form a sub-capacitor in the Z direction. The surfaces of the first vertical electrode plate and the second vertical electrode plate are opposite each other in the Y direction of the capacitor, with the dielectric layer sandwiched in between, to form a sub-capacitor in the Y direction.

3. A three-dimensional conductive electrode integrated capacitor according to claim 1 or 2, characterized in that, in, Multiple parallel first horizontal electrode plates and a first vertical electrode plate are integrally formed, and multiple parallel second horizontal electrode plates and a second vertical electrode plate are integrally formed.

4. A three-dimensional conductive electrode integrated capacitor according to claim 3, characterized in that, The intersection of the first horizontal electrode plate and the first vertical electrode plate, and the intersection of the second horizontal electrode plate and the second vertical electrode plate, are both arc-shaped transition structures.

5. A three-dimensional conductive electrode integrated capacitor according to claim 4, characterized in that, The radius of curvature of the arc-shaped transition structure at the intersection of the first horizontal electrode plate and the first vertical electrode plate is not less than 1 / 5 of the thickness of the first horizontal electrode plate. The radius of curvature of the arc-shaped transition structure at the intersection of the second horizontal electrode plate and the second vertical electrode plate is not less than 1 / 5 of the thickness of the second horizontal electrode plate; The thickness of the first transverse electrode plate may be the same as or different from the thickness of the second transverse electrode plate.

6. A three-dimensional conductive electrode integrated capacitor according to claim 1 or 2, characterized in that, Each of the first horizontal electrode plates has an arc-shaped guide portion at one end away from the first vertical electrode plate, and each of the second horizontal electrode plates also has an arc-shaped guide portion at one end away from the second vertical electrode plate, and the surface of the arc-shaped guide portion is covered with the dielectric layer.

7. A three-dimensional conductive electrode integrated capacitor according to claim 6, characterized in that, An insulating limiting rib is provided between the arc-shaped guide portion of the plurality of first horizontal electrode plates and the plate surface of the second vertical electrode plate; An insulating limiting rib is provided between the arc-shaped guide portion of the plurality of second horizontal electrode plates and the plate surface of the first vertical electrode plate; The two ends of the insulating limiting rib are fixed to its contact surface, and the material of the insulating limiting rib is the same as that of the dielectric layer.

8. A three-dimensional conductive electrode integrated capacitor according to claim 1 or 2, characterized in that, Both the first and second transverse electrode plates are shallow groove-type three-dimensional planar structures. The groove opening of the first transverse electrode plate faces the second transverse electrode plate, and the groove opening of the second transverse electrode plate faces the first transverse electrode plate. The dielectric layer fills the inside of the groove and the gap between the first and second transverse electrode plates.

9. A three-dimensional conductive electrode integrated capacitor according to claim 1 or 2, characterized in that, The insulating encapsulation layer is embedded with a three-dimensional mesh heat dissipation structure. The three-dimensional mesh heat dissipation structure is in contact with the first horizontal electrode plate, the second horizontal electrode plate, the first vertical electrode plate, and the second vertical electrode plate. The material of the three-dimensional mesh heat dissipation structure is insulating and thermally conductive ceramic.

10. A three-dimensional conductive electrode integrated capacitor according to claim 1 or 2, characterized in that, Insulating sealing sleeves are provided at the connection points between the insulating encapsulation layer and the first electrode terminal and the second electrode terminal, and the insulating sealing sleeves are tightly fitted to the first electrode terminal, the second electrode terminal, and the insulating encapsulation layer.

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