switching device

Abstract

A switching device includes a lower cover, an upper cover, a slider, at least one elastic element, and a high-impedance conductive plate. The lower cover is disposed on a circuit board. The upper cover is disposed on the lower cover. The upper and lower covers form an accommodating space. The slider passes through the upper cover and is configured to slide relative to the upper cover in one direction. At least one elastic element is located in the accommodating space. The high-impedance conductive plate is connected to one end of the at least one elastic element. The high-impedance conductive plate deforms upon receiving pressure from the slider. The deformation causes a change in the resistance value of the high-impedance conductive plate. The high-impedance conductive plate generates a switching signal in response to the deformation. The deformation is associated with the resistance value of the high-impedance conductive plate. The switching device of the present invention can generate a switching signal between a pressed state and a non-pressed state, thereby increasing the flexibility and possibilities of keyboard key applications in the e-sports field.

Description

Technical Field

[0001] This invention relates to a switching device. Background Technology

[0002] Keyboard keys can be composed of Hall effect switches, optical switches, or mechanical switches. However, mechanical switches cannot provide a switching signal for states other than the pressed state and the unpressed state.

[0003] Therefore, how to propose a switching device that can solve the above problems is one of the issues that the industry is currently eager to invest research and development resources to address. Summary of the Invention

[0004] In view of this, the object of the present invention is to provide a switching device that can solve the above-mentioned problems.

[0005] To achieve the above objectives, according to one embodiment of the present invention, a switching device includes a lower cover, an upper cover, a slider, at least one elastic member, and a high-impedance conductive plate. The lower cover is disposed on a circuit board. The upper cover is disposed on the lower cover. The upper and lower covers form an accommodating space. The slider passes through the upper cover and is configured to slide relative to the upper cover in one direction. At least one elastic member is located in the accommodating space. The high-impedance conductive plate is connected to one end of the at least one elastic member. The high-impedance conductive plate deforms upon receiving pressure from the slider. The deformation causes a change in the resistance value of the high-impedance conductive plate. The high-impedance conductive plate generates a switching signal in response to the deformation. The deformation is associated with the resistance value of the high-impedance conductive plate.

[0006] In one or more embodiments of the present invention, the switching device further includes a light-emitting unit located on the circuit board.

[0007] In one or more embodiments of the present invention, the other end of at least one elastic member is connected to the lower cover.

[0008] In one or more embodiments of the present invention, the slider includes a pressing portion and a contact portion connected to the pressing portion. The contact portion is configured to abut against a high-resistivity conductive plate, causing the high-resistivity conductive plate to deform.

[0009] In one or more embodiments of the present invention, the pressing portion passes through a through hole in the high-resistivity conductive plate. The abutting portion is located above the high-resistivity conductive plate.

[0010] In one or more embodiments of the present invention, at least one elastic element comprises two springs. A through hole is located between the two springs.

[0011] In one or more embodiments of the present invention, a high-impedance conductive plate is located between at least one elastic member and a sliding member.

[0012] In one or more embodiments of the present invention, at least one elastic member is connected to a sliding member at the other end.

[0013] In one or more embodiments of the present invention, the slider includes a pressing portion and an abutting portion connected to the pressing portion. The abutting portion is configured to abut against a high-resistivity conductive plate by at least one elastic member, causing the high-resistivity conductive plate to deform.

[0014] In one or more embodiments of the present invention, the abutment portion is located above the high-impedance conductive plate.

[0015] In one or more embodiments of the present invention, the slider further includes a shaft, the shaft being connected to an abutment portion. The shaft passes through at least one elastic member.

[0016] In one or more embodiments of the present invention, the high-resistivity conductive plate includes two support portions disposed on the lower cover and a deformable portion connected between the two support portions. A sliding member abuts against the deformable portion via at least one elastic member.

[0017] In one or more embodiments of the present invention, the deformable portion is connected to the top of the two support portions.

[0018] In summary, in the switching device of the present invention, since the resistance value of the high-impedance conductive plate changes with deformation, a switching signal corresponding to the resistance value can be generated when the high-impedance conductive plate deforms under pressure. In the switching device of the present invention, since the high-impedance conductive plate has a through-hole through which the pressing portion of the slider passes, when the slider slides downwards under pressure and the abutting portion abuts against the high-impedance conductive plate, the slider can slide more stably relative to the top cover without detaching from it. In the switching device of the present invention, since the deformable portion is connected to the top of the two support portions, when the slider deforms the deformable portion through the elastic member, the deformable portion can have a larger deformation space, thereby generating a more varied switching signal. Therefore, compared to conventional mechanical switches, the switching device of the present invention can generate all-on or all-off switching signals (pressed and unpressed states), and can also generate switching signals between the pressed and unpressed states, thereby increasing the flexibility and possibilities of keyboard key applications in the e-sports field.

[0019] The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings. Attached Figure Description

[0020] To make the above and other objects, features, advantages and embodiments of the present invention more apparent and understandable, the accompanying drawings are described below:

[0021] Figure 1An exploded perspective view of a switching device according to an embodiment of the present invention is shown.

[0022] Figure 2 A cross-sectional schematic diagram of a switching device according to an embodiment of the present invention is shown.

[0023] Figure 3 A cross-sectional schematic diagram of a switching device according to an embodiment of the present invention is shown.

[0024] Figure 4 An exploded perspective view of a switching device according to an embodiment of the present invention is shown.

[0025] Figure 5 A cross-sectional schematic diagram of a switching device according to an embodiment of the present invention is shown.

[0026] Figure 6 A cross-sectional schematic diagram of a switching device according to an embodiment of the present invention is shown.

[0027] Figure 7 An exploded perspective view of a switching device according to an embodiment of the present invention is shown.

[0028] Figure 8 A cross-sectional schematic diagram of a switching device according to an embodiment of the present invention is shown.

[0029] Figure 9 A cross-sectional schematic diagram of a switching device according to an embodiment of the present invention is shown.

[0030] Explanation of icon numbers 100, 200, 300: Switching devices 110, 210, 310: Bottom cover 120A, 120B, 220, 320: Elastic components 130, 230, 330: High-impedance conductive plates 130a, 234a, 244a, 334a, 344a, Pa: Top surface 130b,234b,244b,334b,344b: Bottom surface 140, 240, 340: Slider 142, 242, 342: Pressing part 144,244,344: Recessed Area 150, 250, 350: Top cover 232,332: Support section 234, 334: Deformation parts 312: Sleeve 346: Shaft AS: Storage Space H: Opening LU: Light-emitting unit OP: Open PCB1, PCB2, PCB3: Circuit boards SL: Slotting TH: Through hole X, Y, Z: Direction Detailed Implementation

[0031] The following describes several embodiments of the present invention with reference to the accompanying drawings. For clarity, details of many embodiments will be described in the following description. However, it should be understood that these details are not intended to limit the invention. That is, in some embodiments of the invention, these details are not essential. Furthermore, for the sake of simplicity, some existing conventional structures and components will be illustrated in a simple schematic manner in the drawings. The same reference numerals will be used to denote the same or similar components in all drawings.

[0032] The following will describe in detail the structure, function, and switching relationship between the components included in the switching device 100 of this embodiment.

[0033] Please refer to Figure 1 . Figure 1 This is an exploded perspective view of a switching device 100 according to an embodiment of the present invention. Figure 1 As shown, in this embodiment, the switching device 100 includes a circuit board PCB1, a lower cover 110, a light-emitting unit LU, elastic elements 120A and 120B, a high-resistance conductive plate 130, a sliding element 140, and an upper cover 150. The circuit board PCB1 has a slot SL. The light-emitting unit LU is located on the circuit board PCB1. Specifically, the light-emitting unit LU is located in the slot SL of the circuit board PCB1, and the light-emitting unit LU is electrically connected to the circuit board PCB1. The lower cover 110 is disposed on the circuit board PCB1. Figure 1 As shown, the circuit board PCB1, lower cover 110, elastic elements 120A and 120B, high-resistance conductive plate 130, sliding member 140, and upper cover 150 are arranged generally from bottom to top. For example, the circuit board PCB1, lower cover 110, elastic elements 120A and 120B, high-resistance conductive plate 130, sliding member 140, and upper cover 150 are arranged sequentially along direction Z. Figure 1 As shown, the high-impedance conductive plate 130 has a through hole TH.

[0034] like Figure 1 As shown, in some embodiments, elastic elements 120A and 120B are arranged in one direction (e.g., direction X).

[0035] In some embodiments, the switch device 100 is configured to form the keys of a keyboard and to generate switch signals corresponding to two states: unpressed and pressed.

[0036] In some implementations, the circuit board PCB1 may be, for example, a printed circuit board (PCB).

[0037] In some implementations, the slider 140 is configured to accept a user's pressing action. Specifically, the user can apply pressure to the slider 140 to actuate it.

[0038] In some embodiments, the materials of the lower cover 110, the slider 140, and the upper cover 150 may include, for example, plastic or other suitable insulating materials.

[0039] In some embodiments, the materials of elastic elements 120A and 120B may include, for example, metals or other suitable conductive materials.

[0040] In some embodiments, elastic elements 120A and 120B can be, for example, springs or other suitable elastic materials. In other words, the switching device 100 of the present invention employs a double-spring configuration.

[0041] In some embodiments, the material of the high-resistance conductive plate 130 may comprise, for example, an insulating material doped with metal ions or other suitable high-resistance conductive materials. In some embodiments, the material of the high-resistance conductive plate 130 may be a piezoresistive material (e.g., a carbon / graphene / carbon nanotube composite, polycrystalline silicon, or other suitable piezoresistive material), a conductive polymer material, a metal oxide thin film, a piezoelectric / piezoresistive hybrid material (e.g., a piezoelectric ceramic), a liquid metal and mixtures thereof (e.g., a mixture of gallium alloys and elastomers), or other suitable materials.

[0042] Please refer to Figure 2 . Figure 2 This is a cross-sectional schematic diagram of a switching device 100 according to an embodiment of the present invention. Figure 2As shown, in this embodiment, the lower cover 110 is disposed on the circuit board PCB1. Specifically, the circuit board PCB1 has a top surface Pa. The lower cover 110 is disposed on the top surface Pa of the circuit board PCB1. The upper cover 150 is disposed on the lower cover 110. In some embodiments, the lower cover 110 engages with the upper cover 150. The upper cover 150 and the lower cover 110 are combined with each other to form an accommodating space AS. A slider 140 passes through the upper cover 150. Specifically, the upper cover 150 has an opening OP. The slider 140 passes through the opening OP. In some embodiments, the slider 140 is partially located in the accommodating space AS formed by the upper cover 150 and the lower cover 110. The slider 140 is configured to slide relative to the upper cover 150 in one direction. For example, the slider 140 slides relative to the upper cover 150 in the direction Z. Elastic members 120A and 120B are located in the accommodating space AS. In some embodiments, elastic elements 120A and 120B are elastically stretched in one direction (e.g., direction Z). A high-impedance conductive plate 130 connects one end of elastic element 120A and one end of elastic element 120B. Specifically, elastic elements 120A and 120B each have an upper end and a lower end. The high-impedance conductive plate 130 connects the upper end of elastic element 120A and the upper end of elastic element 120B. The lower ends of elastic elements 120A and 120B are connected to the circuit board PCB1. In some embodiments, the lower cover 110 has several openings H corresponding to elastic elements 120A and 120B. For example, the lower end of elastic element 120A passes through one opening H of the lower cover 110, while the lower end of elastic element 120B passes through another opening H of the lower cover 110. In other words, both ends of elastic element 120A are connected to the lower cover 110 and the high-impedance conductive plate 130, respectively. Similarly, the two ends of the elastic element 120B are also connected to the lower cover 110 and the high-resistance conductive plate 130, respectively.

[0043] Please continue to refer to this. Figure 2 .like Figure 2As shown, in this embodiment, the high-resistance conductive plate 130 is located between the elastic member 120A and the sliding member 140, and the high-resistance conductive plate 130 is located between the elastic member 120B and the sliding member 140. Both the elastic members 120A and 120B are located between the high-resistance conductive plate 130 and the lower cover 110. The through hole TH of the high-resistance conductive plate 130 is located between the elastic members 120A and 120B. The sliding member 140 is disposed on the high-resistance conductive plate 130. Specifically, the sliding member 140 includes a pressing portion 142 and a stop portion 144. The pressing portion 142 is configured to couple with an additional keycap (not shown). The stop portion 144 connects to the pressing portion 142. In some embodiments, the stop portion 144 is flat, and the pressing portion 142 is located approximately at the center of the stop portion 144. The abutment part 144 is configured to abut against the high-resistivity conductive plate 130, causing the high-resistivity conductive plate 130 to deform.

[0044] In some embodiments, the pressing part 142 passes through the through hole TH of the high-resistivity conductive plate 130, and the abutting part 144 is located above the high-resistivity conductive plate 130.

[0045] In some embodiments, the high-impedance conductive plate 130 has a top surface 130a and a bottom surface 130b. For example... Figure 2 As shown, the upper ends of elastic member 120A and elastic member 120B abut against the bottom surface 130b of high-resistivity conductive plate 130. The abutting portion 144 of sliding member 140 is configured to abut against the top surface 130a of high-resistivity conductive plate 130.

[0046] Please refer to Figure 3 . Figure 3 This is a cross-sectional schematic diagram of a switching device 100 according to an embodiment of the present invention. Figure 3 This is viewed from the perspective of the Y direction. For example... Figure 3 As shown, in this embodiment, the high-impedance conductive plate 130 undergoes the aforementioned deformation due to the pressing pressure from the slider 140. This deformation causes a change in the resistance value of the high-impedance conductive plate 130. Therefore, the high-impedance conductive plate 130 generates a switch signal in response to the deformation, and the deformation is associated with the resistance value of the high-impedance conductive plate 130. More specifically, if the high-impedance conductive plate 130 is stretched under pressure, its resistance value increases. Conversely, if the high-impedance conductive plate 130 retracts after the pressure is released, its resistance value decreases. Therefore, different degrees of deformation of the high-impedance conductive plate 130 can be used to generate switch signals of different magnitudes between the unpressed and pressed states.

[0047] In one usage scenario, when the user does not press the slider 140, the high-resistivity conductive plate 130 does not deform because it does not receive pressure from the slider 140, and therefore its resistance remains constant. Thus, the switch device 100 does not generate a switching signal when the user does not press the slider 140. In another usage scenario, when the user presses the slider 140, the slider 140 slides downwards relative to the top cover 150 in one direction (e.g., direction Z). Because the high-resistivity conductive plate 130 receives pressure from the slider 140, it deforms, causing a change in its resistance. Specifically, when the high-resistivity conductive plate 130 receives pressure from the slider 140, the periphery of the high-resistivity conductive plate 130 will therefore lift up (i.e., the portion of the high-resistivity conductive plate 130 extending beyond the abutment portion 144), thereby increasing the resistance value of the high-resistivity conductive plate 130. Therefore, when the user presses the slider 140, the switching device 100 will generate a switching signal.

[0048] In some embodiments, the slider 140 further includes a bump (not shown) located between the abutment 144 and the high-resistivity conductive plate 130. In some embodiments, the diameter of the bump is larger than the diameter of the through hole TH. The bump facilitates deformation of the high-resistivity conductive plate 130 when pressed.

[0049] The following will describe in detail the structure, function, and switching relationship between the components included in the switching device 200 of this embodiment.

[0050] Please refer to Figure 4 . Figure 4 This is an exploded perspective view of a switching device 200 according to an embodiment of the present invention. Figure 4 As shown, in this embodiment, the switching device 200 includes a circuit board PCB2, a lower cover 210, a light-emitting unit LU, an elastic element 220, a high-resistance conductive plate 230, a sliding element 240, and an upper cover 250. The circuit board PCB2 has a slot SL. The light-emitting unit LU is located on the circuit board PCB2. Specifically, the light-emitting unit LU is located in the slot SL of the circuit board PCB2, and the light-emitting unit LU is electrically connected to the circuit board PCB2. The lower cover 210 is disposed on the circuit board PCB2. Figure 4 As shown, the circuit board PCB2, lower cover 210, high-impedance conductive plate 230, elastic element 220, sliding element 240, and upper cover 250 are arranged in a generally bottom-to-top sequence. For example, the circuit board PCB2, lower cover 210, high-impedance conductive plate 230, elastic element 220, sliding element 240, and upper cover 250 are arranged in sequence along direction Z.

[0051] In some implementations, the switch device 200 is configured to form the keys of a keyboard and to generate switch signals corresponding to the two states of being unpressed and pressed.

[0052] In some implementations, the circuit board PCB2 may be, for example, a printed circuit board (PCB).

[0053] In some implementations, the slider 240 is configured to accept a user's pressing action. Specifically, the user can apply pressure to the slider 240 to actuate it.

[0054] In some embodiments, the materials of the lower cover 210, the slider 240, and the upper cover 250 may include, for example, plastic or other suitable insulating materials.

[0055] In some embodiments, the material of the elastic element 220 may include, for example, metal or other suitable conductive materials.

[0056] In some embodiments, the elastic element 220 may be, for example, a spring or other suitable elastic material. In other words, the switching device 200 of the present invention employs a single spring configuration.

[0057] In some embodiments, the material of the high-resistivity conductive plate 230 may comprise, for example, an insulating material doped with metal ions or other suitable high-resistivity conductive materials. In some embodiments, the material of the high-resistivity conductive plate 230 may be a piezoresistive material (e.g., a carbon / graphene / carbon nanotube composite, polycrystalline silicon, or other suitable piezoresistive material), a conductive polymer material, a metal oxide thin film, a piezoelectric / piezoresistive hybrid material (e.g., a piezoelectric ceramic), a liquid metal and mixtures thereof (e.g., a mixture of gallium alloys and elastomers), or other suitable materials.

[0058] Please refer to Figure 5 . Figure 5 This is a cross-sectional schematic diagram of a switching device 200 according to an embodiment of the present invention. Figure 5As shown, in this embodiment, the lower cover 210 is disposed on the circuit board PCB2. Specifically, the circuit board PCB2 has a top surface Pa. The lower cover 210 is disposed on the top surface Pa of the circuit board PCB2. The upper cover 250 is disposed on the lower cover 210. In some embodiments, the lower cover 210 engages with the upper cover 250. The upper cover 250 and the lower cover 210 are combined with each other to form an accommodating space AS. A slider 240 passes through the upper cover 250. Specifically, the upper cover 250 has an opening OP. The slider 240 passes through the opening OP. In some embodiments, the slider 240 is partially located in the accommodating space AS formed by the upper cover 250 and the lower cover 210. The slider 240 is configured to slide relative to the upper cover 250 in one direction. For example, the slider 240 slides relative to the upper cover 250 in the direction Z. An elastic member 220 is located in the accommodating space AS. In some embodiments, the elastic member 220 is elastically stretched in one direction (e.g., direction Z). A high-impedance conductive plate 230 is disposed on the lower cover 210. The high-impedance conductive plate 230 is connected to one end of the elastic member 220. Specifically, the elastic member 220 has an upper end and a lower end. The high-impedance conductive plate 230 is connected to the lower end of the elastic member 220. The upper end of the elastic member 220 is connected to the sliding member 240. In other words, the two ends of the elastic member 220 are respectively connected to the high-impedance conductive plate 230 and the sliding member 240.

[0059] Please continue to refer to this. Figure 5 .like Figure 5As shown, in this embodiment, the high-resistivity conductive plate 230 includes a support portion 232 and a deformable portion 234. Specifically, the high-resistivity conductive plate 230 includes two support portions 232. The two support portions 232 are disposed on the lower cover 210. The deformable portion 234 is connected between the two support portions 232. In some embodiments, the deformable portion 234 is connected to the top of the two support portions 232. An elastic member 220 is located between the high-resistivity conductive plate 230 and the slider 240. The slider 240 abuts against the deformable portion 234 via the elastic member 220. In some embodiments, the deformable portion 234 has a top surface 234a and a bottom surface 234b, and the lower end of the elastic member 220 abuts against the top surface 234a of the deformable portion 234. The slider 240 includes a pressing portion 242 and abutting portion 244. The pressing portion 242 is configured to couple with an additional keycap (not shown). The abutting portion 244 connects to the pressing portion 242. In some embodiments, the abutment portion 244 has a top surface 244a and a bottom surface 244b, and the upper end of the elastic member 220 abuts against the bottom surface 244b of the abutment portion 244. The abutment portion 244 of the slider 240 abuts against the deformable portion 234 of the high-resistance conductive plate 230 through the elastic member 220, causing the high-resistance conductive plate 230 to deform. Specifically, the deformable portion 234 is suspended relative to the lower cover 210. The bottom surface 234b of the deformable portion 234 is separated from the portion of the lower cover 210 that connects to the circuit board PCB 2 by a certain distance. Therefore, when the slider 240 abuts against the deformable portion 234 through the elastic member 220, the deformable portion 234 can have a larger deformation space.

[0060] Please refer to Figure 6 . Figure 6 This is a cross-sectional schematic diagram of a switching device 200 according to an embodiment of the present invention. Figure 6 This is viewed from the perspective of the Y direction. For example... Figure 6 As shown, in this embodiment, the high-impedance conductive plate 230 undergoes the aforementioned deformation due to the pressing pressure from the slider 240. This deformation causes a change in the resistance value of the high-impedance conductive plate 230. Therefore, the high-impedance conductive plate 230 generates a switching signal in response to the deformation, and the deformation is associated with the resistance value of the high-impedance conductive plate 230. More specifically, if the deformable portion 234 of the high-impedance conductive plate 230 is pressed and bends and elongates, the resistance value of the high-impedance conductive plate 230 will increase. Conversely, if the high-impedance conductive plate 230 retracts after the pressure is released, the resistance value of the high-impedance conductive plate 230 will decrease. Therefore, different degrees of deformation of the high-impedance conductive plate 230 can be used to generate switching signals of different magnitudes located between the unpressed state and the pressed state.

[0061] In one usage scenario, when the user does not press the slider 240, the high-resistivity conductive plate 230 does not deform because it does not receive pressure from the slider 240, and its resistance remains constant. Therefore, the switch device 200 does not generate a switching signal when the user does not press the slider 240. In another usage scenario, when the user presses the slider 240, the slider 240 slides downward relative to the top cover 250 in one direction (e.g., direction Z). Because the deformable portion 234 of the high-resistivity conductive plate 230 receives pressure from the slider 240, the deformable portion 234 deforms, causing a change in the resistance of the high-resistivity conductive plate 230. Specifically, when the high-resistivity conductive plate 230 receives pressure from the slider 240, the deformable portion 234 bends and lengthens, thereby increasing the resistance of the high-resistivity conductive plate 230. Therefore, when the user presses the slider 240, the switch device 200 will generate a switch signal.

[0062] The following will describe in detail the structure, function, and switching relationship between the components included in the switching device 300 of this embodiment.

[0063] Please refer to Figure 7 . Figure 7 This is an exploded perspective view of a switching device 300 according to an embodiment of the present invention. Figure 7 As shown, in this embodiment, the switching device 300 includes a circuit board PCB 3, a lower cover 310, a light-emitting unit LU, a high-resistance conductive plate 330, an elastic element 320, a sliding element 340, and an upper cover 350. The circuit board PCB 3 has a slot SL. The light-emitting unit LU is located on the circuit board PCB 3. Specifically, the light-emitting unit LU is located in the slot SL of the circuit board PCB 3, and the light-emitting unit LU is electrically connected to the circuit board PCB 3. The lower cover 310 is disposed on the circuit board PCB 3. Figure 7 As shown, the circuit board PCB3, lower cover 310, high-impedance conductive plate 330, elastic element 320, sliding element 340, and upper cover 350 are arranged generally from bottom to top. For example, the circuit board PCB3, lower cover 310, high-impedance conductive plate 330, elastic element 320, sliding element 340, and upper cover 350 are arranged sequentially along direction Z. The structural configuration of the switching device 300 is generally similar to that of the switching device 200, except that the lower cover 310 includes a sleeve 312. The sleeve 312 is configured to accommodate the elastic element 320. Furthermore, the shape of the elastic element 320 differs from that of the elastic element 220. The structural configuration of the switching device 300 will be described in more detail below.

[0064] In some embodiments, the switch device 300 is configured to form the keys of a keyboard and to generate switch signals corresponding to the two states of being unpressed and pressed.

[0065] In some implementations, the circuit board PCB3 may be, for example, a printed circuit board (PCB).

[0066] In some implementations, the slider 340 is configured to accept a user's pressing action. Specifically, the user can apply pressure to the slider 340 to actuate it.

[0067] In some embodiments, the materials of the lower cover 310, the slider 340, and the upper cover 350 may include, for example, plastic or other suitable insulating materials.

[0068] In some embodiments, the material of the elastic element 320 may include, for example, metal or other suitable conductive materials.

[0069] In some embodiments, the elastic element 320 may be, for example, a spring or other suitable elastic material. In other words, the switching device 300 of the present invention, similar to the switching device 200, also employs a single spring configuration.

[0070] In some embodiments, the elastic element 320 has a funnel-shaped form. In some embodiments where the elastic element 320 is funnel-shaped, the pointed end of the elastic element 320 has a greater amount of extension and contraction than the blunt end. For example... Figure 8 As shown, the tip of the elastic element 320 refers to the lower end of the elastic element 320, while the blunt end of the elastic element 320 refers to the upper end of the elastic element 320.

[0071] In some embodiments, the material of the high-impedance conductive plate 330 may comprise, for example, an insulating material doped with metal ions or other suitable high-impedance conductive materials. In some embodiments, the material of the high-impedance conductive plate 330 may be a piezoresistive material (e.g., a carbon / graphene / carbon nanotube composite, polycrystalline silicon, or other suitable piezoresistive material), a conductive polymer material, a metal oxide thin film, a piezoelectric / piezoresistive hybrid material (e.g., a piezoelectric ceramic), a liquid metal and mixtures thereof (e.g., a mixture of gallium alloys and elastomers), or other suitable materials.

[0072] Please refer to Figure 8 . Figure 8 This is a cross-sectional schematic diagram of a switching device 300 according to an embodiment of the present invention. Although the high-resistance conductive plate 330 is shown in cross-section, it is depicted in its entirety for simplicity. Figure 8As shown, in this embodiment, the lower cover 310 is disposed on the circuit board PCB 3. Specifically, the circuit board PCB 3 has a top surface Pa. The lower cover 310 is disposed on the top surface Pa of the circuit board PCB 3. The upper cover 350 is disposed on the lower cover 310. In some embodiments, the lower cover 310 engages with the upper cover 350. The upper cover 350 and the lower cover 310 are combined with each other to form an accommodating space AS. A slider 340 passes through the upper cover 350. Specifically, the upper cover 350 has an opening OP. The slider 340 passes through the opening OP. In some embodiments, the slider 340 is partially located in the accommodating space AS formed by the upper cover 350 and the lower cover 310. The slider 340 is configured to slide relative to the upper cover 350 in one direction. For example, the slider 340 slides relative to the upper cover 350 in the direction Z. An elastic member 320 is located in the accommodating space AS. In some embodiments, the elastic member 320 is elastically stretched in one direction (e.g., direction Z). More specifically, the upper end of the elastic element 320 is fixed to the top of the sleeve 312, causing the middle and lower ends of the sleeve 312 to be elastically stretched along the Z direction. A high-resistance conductive plate 330 is disposed on the lower cover 310. The high-resistance conductive plate 330 is connected to one end of the elastic element 320. Specifically, the high-resistance conductive plate 330 is connected to the lower end of the elastic element 320. The upper end of the elastic element 320 is connected to the sliding element 340. More specifically, the portion of the sliding element 340 passes through the elastic element 320 from the upper end of the elastic element 320. The lower end of the elastic element 320 abuts against the high-resistance conductive plate 330.

[0073] Please continue to refer to this. Figure 8 .like Figure 8As shown, in this embodiment, the high-resistivity conductive plate 330 includes a support portion 332 and a deformable portion 334. Specifically, the high-resistivity conductive plate 330 includes two support portions 332. The two support portions 332 are disposed on the lower cover 310. The deformable portion 334 is connected between the two support portions 332. In some embodiments, the deformable portion 334 is connected to the top of the two support portions 332. An elastic member 320 is located between the high-resistivity conductive plate 330 and the slider 340. The slider 340 abuts against the deformable portion 334 via the elastic member 320. In some embodiments, the deformable portion 334 has a top surface 334a and a bottom surface 334b, and the lower end of the elastic member 320 abuts against the top surface 334a of the deformable portion 334. The slider 340 includes a pressing portion 342, an abutting portion 344, and a shaft 346. The pressing portion 342 is configured to couple with an additional keycap (not shown). The abutment portion 344 is connected to the pressing portion 342. The shaft 346 is connected to the abutment portion 344. In other words, the pressing portion 342 and the shaft 346 are respectively disposed on opposite sides of the abutment portion 344. In some embodiments, the abutment portion 344 has a top surface 344a and a bottom surface 344b. In some embodiments, the pressing portion 342 is disposed on the top surface 344a of the abutment portion 344, and the shaft 346 is disposed on the bottom surface 344b of the abutment portion 344. In some embodiments, the shaft 346 protrudes from the abutment portion 344 and elongates in the sliding direction of the slider 340. Figure 8 As shown, the shaft 346 passes through the elastic member 320. The shaft 346 of the slider 340 abuts against the deformable portion 334 of the high-resistance conductive plate 330 via the elastic member 320, causing the high-resistance conductive plate 330 to deform. Specifically, the deformable portion 334 is suspended relative to the lower cover 310. The bottom surface 334b ​​of the deformable portion 334 is separated from the portion of the lower cover 310 connected to the circuit board PCB 3 by a certain distance. Therefore, when the slider 340 abuts against the deformable portion 334 via the elastic member 320, the deformable portion 334 can have a larger deformation space.

[0074] Please refer to Figure 9 . Figure 9 This is a cross-sectional schematic diagram of a switching device 300 according to an embodiment of the present invention. Figure 9 This is viewed from the perspective of the Y direction. For example... Figure 9As shown, in this embodiment, the high-impedance conductive plate 330 undergoes the aforementioned deformation due to the pressing pressure from the slider 340. This deformation causes a change in the resistance value of the high-impedance conductive plate 330. Therefore, the high-impedance conductive plate 330 generates a switching signal in response to the deformation, and the deformation is associated with the resistance value of the high-impedance conductive plate 330. More specifically, if the deformable portion 334 of the high-impedance conductive plate 330 is pressed and bends and elongates, the resistance value of the high-impedance conductive plate 330 will increase. Conversely, if the high-impedance conductive plate 330 recovers its contraction after the pressure is released, the resistance value of the high-impedance conductive plate 330 will decrease. Therefore, different degrees of deformation of the high-impedance conductive plate 330 can be used to generate switching signals of different magnitudes located between the unpressed state and the pressed state.

[0075] In one usage scenario, when the user does not press the slider 340, the high-resistivity conductive plate 330 does not deform because it does not receive pressure from the slider 340, and its resistance remains constant. Therefore, the switch device 300 does not generate a switching signal when the user does not press the slider 340. In another usage scenario, when the user presses the slider 340, the slider 340 slides downward relative to the top cover 350 in one direction (e.g., direction Z). Then, the shaft 346 of the slider 340, which passes through the elastic member 320, moves toward the high-resistivity conductive plate 330, causing the elastic member 320 to stretch downward. Specifically, when the shaft 346 pulls the elastic member 320 downward, since the upper end (i.e., the blunt end) of the elastic member 320 is fixed to the top of the sleeve 312, the middle section and the lower end (i.e., the pointed end) of the elastic member 320 will be pulled downward by the shaft 346. Because the deformable portion 334 of the high-resistivity conductive plate 330 receives pressure from the slider 340, the deformable portion 334 deforms, causing a change in the resistance value of the high-resistivity conductive plate 330. Specifically, when the high-resistivity conductive plate 330 receives pressure from the slider 340, the deformable portion 334 bends and lengthens, thereby increasing the resistance value of the high-resistivity conductive plate 330. Therefore, when the user presses the slider 340, the switching device 300 will generate a switching signal.

[0076] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the scope of the invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A switching device, characterized by Include: The bottom cover is mounted on the circuit board; An upper cover is disposed on the lower cover, and the upper cover and the lower cover form an accommodating space; A slider, passing through the top cover and configured to slide relative to the top cover in one direction; At least one elastic element is located in the accommodating space; as well as A high-resistance conductive plate is connected to one end of the at least one elastic member, and the high-resistance conductive plate deforms upon receiving pressure from the sliding member, wherein the deformation causes a change in the resistance value of the high-resistance conductive plate. The high-impedance conductive plate generates a switching signal in response to the deformation, and the deformation is associated with the resistance value of the high-impedance conductive plate.

2. The switching device of claim 1, wherein It further includes a light-emitting unit located on the circuit board.

3. The switching device of claim 1, wherein The other end of at least one elastic element is connected to the lower cover.

4. The switching device of claim 1, wherein The slider includes a pressing portion and an abutting portion connected to the pressing portion, and the abutting portion is configured to abut against the high-resistivity conductive plate, causing the high-resistivity conductive plate to undergo the deformation.

5. The switching device of claim 4, wherein The pressing part passes through the through hole of the high-resistivity conductive plate, and the abutting part is located above the high-resistivity conductive plate.

6. The switching device of claim 5, wherein The at least one elastic element comprises two springs, and the through hole is located between the two springs.

7. The switching device of claim 1, wherein The high-impedance conductive plate is located between the at least one elastic member and the sliding member.

8. The switching device of claim 1, wherein The other end of the at least one elastic element is connected to the sliding element.

9. The switching device of claim 1, wherein The slider includes a pressing portion and an abutting portion connected to the pressing portion, and the abutting portion is configured to abut against the high-resistivity conductive plate via the at least one elastic member, causing the high-resistivity conductive plate to undergo the deformation.

10. The switching device of claim 9, wherein The abutment portion is located above the high-impedance conductive plate.

11. The switching device of claim 9, wherein The slider further includes a shaft that connects to the abutment and passes through the at least one elastic member.

12. The switching device of claim 1, wherein The high-impedance conductive plate includes two support portions disposed on the lower cover and a deformable portion connected between the two support portions, and the sliding member abuts against the deformable portion through at least one elastic member.

13. The switching device of claim 12, wherein, The deformable part is connected to the top of the two support parts.

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