Bonding method
By bringing the substrates into contact and applying pressure and temperature variations during the eutectic bonding process, the warping problem caused by temperature inconsistencies was solved, resulting in higher quality bonding.
CN122294860APending Publication Date: 2026-06-26SHANGHAI IND U TECH RES INST
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Patent Information
- Application Number
- CN202411917397.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2026-06-26
Smart Images
Figure CN122294860A_ABST
Abstract
This application provides a bonding method, comprising: feeding a first substrate and a second substrate aligned with each other into a bonding cavity; bringing the bonding surfaces of the first substrate and the second substrate into contact; applying a first pressure to the first substrate and the second substrate; heating the first substrate using an upper heater and the second substrate using a lower heater while applying the first pressure; applying a second pressure to the first substrate and the second substrate while heating the first substrate and the second substrate to a first temperature, the second pressure being greater than the first pressure; and subjecting the first substrate and the second substrate to a predetermined temperature change process while applying the second pressure. This application heats the substrates while they are in contact with each other, thereby ensuring that the temperatures and temperature distributions of the two substrates are consistent, reducing stress caused by temperature differences between the substrates, and thus significantly reducing the warpage of the bonded substrates.
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