A temperature and pressure sensor

Abstract

This application discloses a temperature and pressure sensor having a first chamber and a second chamber. The sensor includes an isolation element 26, with the first chamber and the second chamber located on opposite sides of the isolation element 26. The sensor includes a circuit board, a temperature sensing unit, and a pressure measuring unit electrically connected to the circuit board. The circuit board is located in the first chamber, and the temperature sensing unit and pressure measuring unit are located in the second chamber. The second chamber is filled with heat-conducting oil, and the corresponding portion of the chamber wall is a diaphragm. In this temperature and pressure sensor, both the temperature sensing unit and the pressure measuring unit are located in the second chamber filled with heat-conducting oil, thus protecting the temperature sensing unit and the pressure measuring unit and extending their service life.

Description

Technical Field

[0001] This invention relates to the field of fluid detection technology, particularly to the field of refrigerant detection technology, and especially to a temperature and pressure sensor. Background Technology

[0002] Temperature and pressure sensors are important components for acquiring temperature and pressure signals in refrigeration and air conditioning systems. The working principle of a temperature and pressure sensor is to convert the pressure signal and temperature signal of the fluid being measured into electrical signals. These two converted temperature and pressure electrical signals are used as input signals to the control system. After being acquired, processed, and analyzed by the control system, they serve as the basis for adjusting the operating conditions of other components, thereby realizing the automatic adjustment of the system.

[0003] In one type of temperature and pressure sensor, the temperature and pressure probes are located in the flow channel of the fluid, and impurities that may be carried in the fluid can easily affect the temperature and pressure probes. Summary of the Invention

[0004] The purpose of this invention is to at least solve one of the problems in the prior art by providing a temperature and pressure sensor.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A temperature and pressure sensor has a first chamber and a second chamber. The temperature and pressure sensor includes an isolation element 26. The first chamber and the second chamber are respectively located on both sides of the isolation element 26. The temperature and pressure sensor includes a circuit board, a temperature sensing unit and a pressure measuring unit electrically connected to the circuit board. The circuit board is located in the first chamber, and the temperature sensing unit and the pressure measuring unit are located in the second chamber. The second chamber is filled with heat-conducting oil, and the corresponding part of the chamber wall of the second chamber is a diaphragm.

[0007] In the temperature and pressure sensor described above, both the temperature sensing unit and the pressure measuring unit are located in the second chamber filled with heat-conducting oil, which protects the temperature sensing unit and the pressure measuring unit and extends their service life. Attached Figure Description

[0008] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:

[0009] Figure 1 This is a schematic diagram of the temperature and pressure sensor according to the first embodiment;

[0010] Figure 2 This is a schematic diagram showing the housing and mounting bracket structure in the first embodiment;

[0011] Figure 3This is a structural schematic diagram showing the ceramic plate, temperature sensing unit, and pressure measuring unit in the first embodiment;

[0012] Figure 4 This is a schematic diagram of the structure of the temperature and pressure sensor according to the second embodiment;

[0013] Figure 5 This is a schematic diagram illustrating the membrane structure in the second embodiment;

[0014] Figure 6 This is a schematic diagram illustrating the membrane structure in the third embodiment;

[0015] Figure 7 This is a schematic diagram of the temperature and pressure sensor according to the fourth embodiment;

[0016] Figure 8 This is a schematic diagram illustrating the mounting bracket structure in the fourth embodiment;

[0017] Figure 9 This is a schematic diagram illustrating the structure of the second conductive rod, the third conductive rod, and the temperature sensing unit in the fourth embodiment;

[0018] Figure 10 This is a schematic diagram illustrating the circuit board structure in the fourth embodiment;

[0019] Figure 11 This is a schematic diagram of the temperature and pressure sensor in the fifth embodiment.

[0020] Figure label:

[0021] 1. Pressure measuring unit; 2. Temperature sensing unit; 3. Diaphragm; 31. Peripheral area; 32. Deformation area; 321. Crest; 322. Trough; 33. Central area; 4. Heat transfer oil; 5. Mounting bracket; 51. Main body; 52. Third through hole; 53. Fourth through hole; 54. Inner mounting ring; 55. First protrusion; 56. Second protrusion; 6. Ceramic plate; 7. Circuit board; 71. First circuit board; 72. Connector; 73. Second circuit board; 8. Outer shell; 81. Annular side 82. Wall portion; 83. Bottom end portion; 84. Mounting groove; 85. Opening portion; 9. Oil filling channel; 10. Sealing ball; 11. First cavity; 12. Second cavity; 13. Groove; 14. First conductive rod; 15. Second conductive rod; 16. Second connecting wire; 17. Electrical receiving part; 18. Upper shell; 19. Third conductive rod; 20. First through hole; 21. First connecting wire; 22. Second through hole; 23. Conductive component; 24. First sealing component; 25. Second sealing component; 26. Isolating component. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Other technical solutions obtained by those skilled in the art without creative effort are all within the protection scope of the present invention. In addition, it should be understood that the following terms such as "upper," "lower," "left," "right," "longitudinal," "lateral," "inner," "outer," "vertical," "horizontal," "top," and "bottom," which indicate orientation or positional relationship, are based only on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device / component referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0023] like Figures 1-11 As shown, a temperature and pressure sensor is characterized in that it has a first chamber 11 and a second chamber 12, and includes an isolation member 26. The first chamber 11 and the second chamber 12 are respectively located on both sides of the isolation member 26. The temperature and pressure sensor includes a circuit board 7, a temperature sensing unit 2 and a pressure measuring unit 1 electrically connected to the circuit board 7. The circuit board 7 is located in the first chamber 11, and the temperature sensing unit 2 and the pressure measuring unit 1 are located in the second chamber 12. The second chamber 12 is filled with heat-conducting oil 4, and the corresponding part of the chamber wall of the second chamber 12 is a diaphragm 3.

[0024] The temperature and pressure sensor can be installed in the fluid pipeline. In operation, the fluid comes into contact with the diaphragm 3. The high-pressure fluid squeezes and deforms the diaphragm 3, further squeezing the heat transfer oil 4 and applying pressure to the pressure measuring unit 1, thereby detecting the fluid pressure. The fluid temperature is conducted to the temperature sensing unit 2 through the heat transfer oil 4, enabling the temperature sensing unit 2 to detect the fluid temperature. The heat transfer oil 4 can be made of materials such as silicone oil, and the diaphragm 3 can be made of a thin metal film, such as an aluminum film, which also has excellent thermal conductivity and can deform under the action of high-pressure fluid.

[0025] The first chamber 11 and the second chamber 12 can be distributed horizontally or vertically, and the two chambers are isolated and sealed from each other. The second chamber 12 is filled with heat-conducting oil 4. The original value of the pressure measuring unit 1 in the initial state where the diaphragm 3 of the temperature and pressure sensor is not subjected to fluid pressure is set as the initial reference value. When subjected to fluid pressure, the change in the pressure measuring unit 1 relative to the initial reference value is the fluid pressure value. The circuit board 7 is located in the first chamber 11 to reduce the influence of the high-temperature and high-pressure heat-conducting oil 4 on the circuit board 7 when the temperature and pressure sensor detects high-temperature and high-pressure fluids.

[0026] In one embodiment, the temperature and pressure sensor includes a housing 8 having an opening 84 facing an external fluid, and a diaphragm 3 sealing the opening 84. When the temperature and pressure sensor is installed in a fluid line, at least a portion of the temperature and pressure sensor can be inserted into the fluid line or a mounting portion can be extended from the fluid line, allowing the fluid to contact the diaphragm 3 at the opening 84 through the mounting portion.

[0027] In one embodiment, such as Figure 4 As shown, the diaphragm 3 includes a metal film, which comprises a central region 33, a peripheral region 31, and a deformation region 32 connecting the central region 33 and the peripheral region 31. The deformation region 32 has alternating peaks 321 and troughs 322. The alternating peaks 321 and troughs 322 give the metal film a certain deformation margin and, to some extent, reduce the impact of the metal's deformation force on the detection accuracy of the pressure measuring unit 1. For example, if the deformation force of the metal film is too large, even greater than the pressure of the high-pressure fluid, it may cause the detection of the pressure measuring unit 1 to be distorted. When the deformation force of the metal is small, the high-pressure fluid can be transferred to the heat transfer oil 4, and the actual pressure of the fluid can be determined by compensating for the specific deformation force of the metal with the detection value of the pressure measuring unit 1. In other embodiments, the diaphragm 3 may also be planar, thin, and easily deformable.

[0028] Furthermore, since the pressure measuring unit 1 is opposite to the central region 33, when the fluid pressure acts on the diaphragm 3, the displacement of the central region 33 due to the pressure is relatively large, so the pressure measuring unit 1 can measure the pressure quickly and accurately.

[0029] In one embodiment, such as Figure 5 As shown, peaks 321 and troughs 322 are pulse-shaped. In other embodiments, such as... Figure 6 As shown, the crests 321 and troughs 322 can also be wavy or folded, which facilitates the deformation of the metal film under the action of high-pressure fluid.

[0030] In one embodiment, the isolation element 26 includes a mounting bracket 5 and a ceramic plate 6. The mounting bracket 5 is fixed to the housing 8 of the temperature and pressure sensor, the ceramic plate 6 is fixed to the mounting bracket 5, and the pressure measuring unit 1 is fixed to the ceramic plate 6.

[0031] The ceramic plate 6 has good insulation properties, which can provide insulation protection for the installation of the circuit board 7. Furthermore, the pressure measuring unit 1 utilizes the piezoresistive effect of the monocrystalline silicon wafer and uses integrated circuits on the monocrystalline silicon wafer. The monocrystalline silicon wafer and the ceramic plate 6 have relatively close coefficients of thermal expansion. Especially when the temperature and pressure sensor is used in high temperature and high pressure scenarios, the installation of the pressure measuring unit 1 with the ceramic plate 6 and the monocrystalline silicon wafer has strong durability.

[0032] Mounting bracket 5 facilitates the installation of ceramic plate 6. During installation, circuit board 7, temperature sensing unit 2, and pressure measuring unit 1 can be first installed with mounting bracket 5 to form an installation unit, and then this installation unit can be installed with housing 8. Then, heat-conducting oil 4 is filled into the second chamber 12. Of course, in another embodiment, the isolator 26 can also be ceramic plate 6, which is directly installed with housing 8. In this case, an installation structure needs to be arranged on the inner wall of housing 8, such as a support platform on housing 8.

[0033] In one embodiment, such as Figure 1 , Figure 3 As shown, the ceramic plate 6 has a first through hole 20. The pressure measuring unit 1 seals and covers the first through hole 20. The temperature and pressure sensor includes a first connecting line 21, at least a portion of which is located in the first through hole 20. The first connecting line 21 electrically connects the pressure measuring unit 1 and the circuit board 7. When the high-pressure fluid flows through the temperature and pressure sensor, the pressure-bearing surface of the pressure measuring unit 1 is subjected to the pressure of the heat transfer oil 4. The other side of the pressure measuring unit 1 covers and seals the first through hole 20, which penetrates the ceramic plate 6, thus allowing the pressure measuring unit 1 to experience a pressure difference. The pressure of the fluid can be obtained through this pressure difference. At the same time, the connecting line of the pressure measuring unit 1 can be connected to the circuit board 7 through the first through hole 20. The first connecting line 21 includes two independent connecting wires, which are respectively connected to the positive and negative terminals of the pressure measuring unit 1, and then connected to the circuit board 7 through the first through hole 20. The two connecting wires connecting the positive and negative terminals of the pressure measuring unit 1 can be wrapped with enameled wire into a single wire and passed through the first through hole 20 before branching to connect to the circuit board 7 or plugged in through a connector. Of course, the two connecting wires connecting the positive and negative terminals of the pressure measuring unit 1 can also pass through the first through hole 20 and then connect to the circuit board 7 or plug in through a connector.

[0034] Furthermore, the ceramic plate 6 has a second through hole 22. The temperature and pressure sensor includes a conductive element 23, which passes through the second through hole 22 and is sealed by a sealing material such as sealant or sealing glass. The conductive element 23 is made of a rigid material. The conductive element 23 connects the temperature sensing unit 2 and the circuit board 7, and fixes the temperature sensing unit 2. The conductive element 23 extends into the heat-conducting oil 4 in the second chamber 12 to prevent the temperature sensing unit 2 from being blocked by the high pressure difference between the heat-conducting oil 4 and the second through hole 22 and damaged. Furthermore, the conductive element 23 is positioned as close as possible to the diaphragm 3 so that the temperature sensing unit 2 is as close as possible to the diaphragm 3, thereby enabling timely and relatively accurate measurement of the fluid temperature. In one embodiment, the conductive element 23 can be configured similarly to the first connecting line 21, which will not be described in detail here. Furthermore, the conductive element 23 is made of a material with a certain degree of hardness, such as an aluminum rod, and can also serve as a fixing element to fix the temperature sensing unit 2 so that the temperature sensing unit 2 is as close as possible to the diaphragm 3.

[0035] In one embodiment, such as Figure 7As shown, the ceramic plate 6 has a groove 13, the pressure measuring unit 1 seals and covers the groove 13, the mounting bracket 5 includes a third through hole 52, the temperature and pressure sensor includes a first conductive rod 14, at least a portion of the first conductive rod 14 is located in the third through hole 52, the temperature and pressure sensor includes a second connecting line 16, the second connecting line 16 electrically connects the pressure measuring unit 1 and the first conductive rod 14, and the first conductive rod 14 is electrically connected to the circuit board 7.

[0036] The pressure measuring unit 1 is sealed and covers the groove 13 to form a pressure region of normal pressure or different from that of high pressure fluid. When the high pressure fluid flows through the temperature and pressure sensor, the pressure-bearing surface of the pressure measuring unit 1 is subjected to the pressure of the heat transfer oil 4, and the other side of the pressure measuring unit 1 is opposite to the groove 13. Therefore, the pressure measuring unit 1 is subjected to pressure difference and can further detect the fluid pressure.

[0037] There are two second connecting wires 16 and two first conductive rods 14. The two second connecting wires 16 and the two first conductive rods 14 are connected one-to-one. The two second connecting wires 16 are electrically connected to the positive and negative terminals of the voltage measuring unit 1, and then electrically connected to the circuit board 7 through the first conductive rods 14. The second connecting wires 16 can be connected to the first conductive rods 14 by winding or by soldering. In another embodiment, two wires can be combined into one second connecting wire 16, and then their ends can be separated and electrically connected to the two first conductive rods 14 respectively.

[0038] The two first conductive rods 14 can be located in the same third through hole 52 or in two different third through holes 52. When the two first conductive rods 14 are located in the same third through hole 52, the first conductive rods 14 are wrapped with an insulating layer. When the two first conductive rods 14 are located in different third through holes 52, and the mounting bracket 5 is made of insulating material such as plastic, the first conductive rods 14 may not be wrapped with an insulating layer.

[0039] In one embodiment, such as Figure 8 , Figure 9 As shown, the mounting bracket 5 includes a fourth through hole 53, the temperature and pressure sensor includes a second conductive rod 15, at least a portion of the second conductive rod 15 is located in the fourth through hole 53, the temperature and pressure sensor includes a third conductive rod 19, the third conductive rod 19 is electrically connected to the temperature sensing unit 2 and the second conductive rod 15, the second conductive rod 15 is electrically connected to the circuit board 7, one end of the third conductive rod 19 is fixed to the second conductive rod 15, and the other end of the third conductive rod 19 is fixed to the temperature sensing unit 2 and close to the diaphragm 3.

[0040] The third conductive rod 19 is made of a rigid material, such as an aluminum rod. The temperature sensing unit 2 can be fixed to the third conductive rod 19, and the third conductive rod 19 can be bent to position the temperature sensing unit 2 in a suitable position.

[0041] The outer ring of each of the above conductive rods can be wrapped with an insulating layer, with the two ends exposed to form the electrical connection structure; alternatively, the mounting bracket 5 can be made of insulating materials such as plastic, in which case the outer ring of each conductive rod does not need to be wrapped with an insulating layer.

[0042] Both the fourth through hole 53 and the third through hole 52 are located on the mounting bracket 5, which avoids drilling holes in the ceramic plate 6 and thus effectively improves the structural stability of the ceramic plate 6. Especially when the high-pressure fluid continuously applies high pressure to the ceramic plate 6 through the heat transfer oil 4, the ceramic plate 6 is not easily damaged, thus extending the service life of the temperature and pressure sensor.

[0043] Under the concept of this invention, those skilled in the art can set the number of each through hole, conductive rod, and connecting wire by reading this specification. The embodiments in this specification will not be listed one by one.

[0044] In one embodiment, such as Figure 8 As shown, the mounting bracket 5 includes a main body 51, which has an inner mounting ring 54. At least a portion of the ceramic plate 6 is located within the area enclosed by the inner mounting ring 54. The mounting bracket 5 includes a first protrusion 55, which is located on the inner wall of the inner mounting ring 54 facing the ceramic plate 6. The first protrusion 55 is located on the side of the ceramic plate 6 away from the heat transfer oil 4. A first seal 24 is provided between the inner mounting ring 54 and the ceramic plate 6.

[0045] The first protrusion 55 is located on the side of the ceramic plate 6 away from the heat transfer oil 4, so that the first protrusion 55 can limit the ceramic plate 6 and prevent the ceramic plate 6 from moving due to the pressure of the heat transfer oil 4.

[0046] The ceramic plate 6 and the mounting inner ring portion 54 can be fixed by an interference fit and by a first seal 24. The first seal 24 can be a silicone sealing ring. Specifically, a sealing ring fixing groove can be opened in the mounting inner ring portion 54 for installing the first seal 24.

[0047] In one embodiment, such as Figure 2 As shown, the housing 8 of the temperature and pressure sensor includes an annular sidewall portion 81 and a bottom end portion 82. The bottom end portion 82 protrudes from the inner ring portion of the annular sidewall portion 81. An opening portion 84 is located at the bottom end portion 82. The bottom end portion 82 has a mounting groove 83. The mounting bracket 5 has a second protrusion 56. The second protrusion 56 is located at one end of the main body portion 51 of the mounting bracket 5 facing the mounting groove 83. At least a portion of the second protrusion 56 is located in the mounting groove 83. A second seal 25 is provided between the second protrusion 56 and the mounting groove 83.

[0048] The annular sidewall portion 81 and the bottom end portion 82 are integrally formed. The second protrusion 56 and the mounting groove 83 can be fixed by snap-fit ​​or interference fit. Alternatively, in a typical embodiment, the second protrusion 56 and the groove wall corresponding to the mounting groove 83 are welded to improve their fixing strength and ensure that they maintain structural stability under the high pressure of the heat transfer oil 4.

[0049] The engagement of the second protrusion 56 with the mounting groove 83 creates a gap between the main body 51 of the mounting bracket 5 and the bottom end 82 of the outer casing 8. This gap facilitates the placement of the first conductive rod 14 and the second conductive rod 15, allowing them to extend through the through hole of the mounting bracket 5 as mounting points for connection with the temperature sensing unit 2 and the pressure measuring unit 1. Furthermore, the third through hole 52 and the fourth through hole 53 on the mounting bracket 5 are both vertical holes, facilitating drilling, and the gap between the main body 51 of the mounting bracket 5 and the bottom end 82 of the outer casing 8 is located below these vertical holes.

[0050] Furthermore, the bottom end portion 82 has an oil filling channel 9, which communicates with the second chamber 12. The temperature and pressure sensor includes a sealing ball 10, which seals the second chamber 12. Heat transfer oil 4 can be supplied into the second chamber 12 through the oil filling channel 9, and then the sealing ball 10 is used to seal the oil filling channel 9 to prevent leakage of the heat transfer oil 4 from the second chamber 12. The sealing ball 10 is fixed to the bottom end portion 82 by welding to ensure sealing strength under high pressure.

[0051] In one embodiment, such as Figure 11 As shown, the diaphragm 3 has an initial state. In the initial state, the diaphragm 3 is arc-shaped and protrudes outward. The initial state refers to the state in which the temperature and pressure sensor is normally placed and not in contact with the fluid. At this time, because the second chamber 12 is filled with heat-conducting oil 4, it has a certain micro-pressure, which makes the diaphragm 3 bulge outward in an arc shape. This makes it easier for the diaphragm 3 to be subjected to the pressure of the fluid and transmit the pressure to the pressure measuring unit 1 during operation, thus avoiding the detection distortion of the pressure measuring unit 1 caused by the relaxation of the diaphragm 3.

[0052] In one embodiment, the circuit board 7 includes a first circuit board 717, a second circuit board 737, and a connector 72 connecting the first circuit board 717 and the second circuit board 737. Both the first circuit board 717 and the second circuit board 737 have electronic components. In the height direction, the first circuit board 717 and the second circuit board 737 are located at different heights within the first cavity 11, effectively utilizing the space utilization of the first cavity 11 and reducing the length or width of the circuit board 7 to adapt to the length or width of the first cavity 11. Further, the first circuit board 717 is located below the second circuit board 737, that is, the first circuit board 717 is closer to the second cavity 12 than the second circuit board 737. The first circuit board 717 is fixed to the ceramic plate 6. The second circuit board 737 can be fixed to the first circuit board 717 through the connector 72, or the second circuit board 737 can be fixed to the upper shell 18 of the temperature and pressure sensor. The second circuit board 737 is connected to the power receiving part 17 of the temperature and pressure sensor, facilitating the connection of the circuit board 7 to the outside world.

[0053] The above examples illustrate the principles and implementation methods of the present invention. These embodiments are merely illustrative and intended to aid in understanding the method and core concepts of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A temperature and pressure sensor, characterized by, The temperature and pressure sensor has a first chamber (11) and a second chamber (12). The temperature and pressure sensor includes an isolation element (26). The first chamber (11) and the second chamber (12) are located on both sides of the isolation element (26). The temperature and pressure sensor includes a circuit board (7), a temperature sensing unit (2) and a pressure measuring unit (1) electrically connected to the circuit board (7). The circuit board (7) is located in the first chamber (11). The temperature sensing unit (2) and the pressure measuring unit (1) are located in the second chamber (12). The second chamber (12) is filled with heat-conducting oil (4). The part of the chamber wall corresponding to the second chamber (12) is a diaphragm (3).

2. The temperature and pressure sensor of claim 1, wherein, The diaphragm (3) includes a metal film, which includes a central region (33), a peripheral region (31), and a deformation region (32) connecting the central region (33) and the peripheral region (31). The deformation region (32) has alternating peaks (321) and troughs (322). The pressure measuring unit (1) is opposite to the central region (33).

3. The temperature and pressure sensor according to claim 1 or 2, characterized in that The isolation component (26) includes a mounting bracket (5) and a ceramic plate (6). The mounting bracket (5) is fixed to the housing (8) of the temperature and pressure sensor, the ceramic plate (6) is fixed to the mounting bracket (5), and the pressure measuring unit (1) is fixed to the ceramic plate (6).

4. The temperature and pressure sensor of claim 3, wherein, The ceramic plate (6) has a first through hole (20), the pressure measuring unit (1) seals and covers the first through hole (20), the temperature and pressure sensor includes a first connecting line (21), at least a portion of the first connecting line (21) is located in the first through hole (20), and the first connecting line (21) is electrically connected to the pressure measuring unit (1) and the circuit board (7).

5. The temperature and pressure sensor of claim 3, wherein, The ceramic plate (6) has a groove (13), the pressure measuring unit (1) seals and covers the groove (13), the mounting bracket (5) includes a third through hole (52), the temperature and pressure sensor includes a first conductive rod (14), at least a portion of the first conductive rod (14) is located in the third through hole (52), the temperature and pressure sensor includes a second connecting line (16), the second connecting line (16) electrically connects the pressure measuring unit (1) and the first conductive rod (14), and the first conductive rod (14) is electrically connected to the circuit board (7).

6. The temperature and pressure sensor of claim 5, wherein, The mounting bracket (5) includes a fourth through hole (53), the temperature and pressure sensor includes a second conductive rod (15), at least a portion of the second conductive rod (15) is located in the fourth through hole (53), the temperature and pressure sensor includes a third conductive rod (19), the third conductive rod (19) is electrically connected to the temperature sensing unit (2) and the second conductive rod (15), the second conductive rod (15) is electrically connected to the circuit board (7), one end of the third conductive rod (19) is fixed to the second conductive rod (15), and the other end of the third conductive rod (19) is fixed to the temperature sensing unit (2) and close to the diaphragm (3).

7. The temperature and pressure sensor according to claim 4 or 5 or 6, characterized in that The mounting bracket (5) includes a main body (51) having an inner mounting ring (54), at least a portion of the ceramic plate (6) being located within the area enclosed by the inner mounting ring (54), the mounting bracket (5) including a first protrusion (55) located on the inner wall of the inner mounting ring (54) facing the ceramic plate (6), the first protrusion (55) being located on the side of the ceramic plate (6) away from the heat transfer oil (4), and a first seal (24) being provided between the inner mounting ring (54) and the ceramic plate (6).

8. The temperature and pressure sensor of claim 7, wherein, The housing (8) of the temperature and pressure sensor includes an annular sidewall portion (81) and a bottom end portion (82). The bottom end portion (82) protrudes from the inner ring portion of the annular sidewall portion (81). The opening portion (84) of the housing (8) is located at the bottom end portion (82). The bottom end portion (82) has a mounting groove (83). The mounting bracket (5) has a second protrusion (56). The second protrusion (56) is located at one end of the main body portion (51) of the mounting bracket (5) facing the mounting groove (83). At least a portion of the second protrusion (56) is located in the mounting groove (83). A second seal (25) is provided between the second protrusion (56) and the mounting groove (83).

9. The temperature and pressure sensor of claim 8, wherein, The bottom end (82) has an oil filling channel (9) that communicates with the second chamber (12). The temperature and pressure sensor includes a sealing ball (10) that is welded and fixed to the bottom end (82) and blocks the oil filling channel (9).

10. The temperature and pressure sensor according to claim 1 or 2 or 4 or 5 or 6 or 8 or 9, characterized in that, The diaphragm (3) has an initial state in which at least a portion of the diaphragm (3) is arc-shaped and the arc-shaped diaphragm (3) protrudes outward away from the pressure measuring unit (1); and / or, the circuit board (7) includes a first circuit board (71), a second circuit board (73), and a connector (72) connecting the first circuit board (71) and the second circuit board (73), both the first circuit board (71) and the second circuit board (73) having electronic components, and in the height direction, the first circuit board (71) and the second circuit board (73) are located at different heights within the first chamber (11).

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