Single board and electronic device

Abstract

This application provides a single-board and electronic device, belonging to the field of electronic technology. The first circuit board has a first surface and a second surface facing away from each other, and a heat-conducting structure is disposed within a through hole in the first circuit board. The heat-generating device of the functional module is disposed on the first surface, and the magnetic core of the magnetic element is disposed on the second surface. By making full use of the space on the first surface side, the layout area of ​​the heat-generating device on the second surface side is saved, allowing the magnetic core to occupy a larger space in the thickness direction, increasing the volume of the magnetic core, and significantly improving the power density and power consumption of the functional module. The winding is inserted into the magnetic core, and the winding, heat-conducting structure, and heat-generating device are thermally connected. Part of the winding is exposed on the outer surface of the magnetic core. The winding can be used to dissipate heat from the heat-generating device and the magnetic element without the need for an additional heat sink, further saving board space. Moreover, the high thermal conductivity of the winding and the heat-conducting structure achieves high heat dissipation performance, meeting the high heat dissipation requirements of the functional module in high power consumption and high power density scenarios.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a single-board computer and electronic device. Background Technology

[0002] With the rapid development of electronic technology, the computing performance of electronic devices such as computers and servers has been greatly improved, and the power of electronic devices is getting higher and higher. As a result, the heat generation of the internal components of electronic devices is also constantly increasing. How to solve the heat dissipation problem of the devices has become an urgent problem to be solved in the design of electronic devices.

[0003] Electronic devices typically consist of a casing and several circuit boards. The circuit boards are housed within the casing and can contain chips, power modules, and other electronic components. The power modules provide power to the chips and other electronic components. Current chips are increasingly trending towards higher power consumption and larger sizes, correspondingly placing higher demands on the power density and energy efficiency of power modules. However, in high-power, high-power-density scenarios, the heat dissipation of power modules faces significant challenges. Therefore, there is an urgent need for a circuit board that can both meet the high power density layout requirements of power modules and achieve excellent heat dissipation. Summary of the Invention

[0004] This application provides a single-board and electronic device that improves the heat dissipation performance of functional modules while meeting the high power density and high power consumption layout requirements of functional modules such as power modules.

[0005] A first aspect of this application provides a single board, including: a first circuit board, a heat-conducting structure, and a functional module. The first circuit board includes a first surface and a second surface facing away from each other. A through hole is formed on the first circuit board that penetrates the first surface and the second surface. The heat-conducting structure is disposed in the through hole.

[0006] The functional module includes a magnetic element and a heating device, with the heating device disposed on a first surface. The magnetic element includes a magnetic core and a winding. The magnetic core includes a first end face and an outer side face, and is disposed on a second surface. The first end face is adjacent to and opposite to the second surface, and the outer side face is located on the side of the first end face facing away from the second surface. The winding is at least partially inserted within the magnetic core.

[0007] The winding is connected to the heat-generating device through a heat-conducting structure, thereby achieving heat conduction between the heat-generating device and the winding. Part of the winding extends to the outer surface of the magnetic core and is exposed, meaning that part of the winding can be exposed to the external environment, enabling heat exchange with the external environment and achieving a heat dissipation effect.

[0008] By utilizing the windings of magnetic components to dissipate heat from both the heat-generating devices and the magnetic components themselves, no additional heat sink is needed. This reduces the number of structural components on the board, lowers layout complexity and manufacturing costs, and saves board space, facilitating high-power-density layout designs. Furthermore, the windings can be made of metals with good electrical and thermal conductivity. The high thermal conductivity of the windings and the heat-conducting structure enables heat dissipation from the heat-generating devices, achieving high heat dissipation performance. This meets the high heat dissipation requirements of functional modules such as power supply modules in high-power-consumption and high-power-density design scenarios.

[0009] In one possible implementation, the outer surface of the magnetic core includes a second end face that is opposite to the first end face, such as in a device where the first and second end faces are opposite to each other along the thickness direction.

[0010] One end of the winding is connected to the heat-conducting structure, and the other end of the winding extends to and is exposed on the second end face. On the outer surface of the magnetic core, the second end face is far away from the first end face of the magnetic core and the first circuit board. The heat on the first circuit board is relatively high. Exposing the other end of the winding on the second end face can reduce the concentration of heat and keep it relatively away from the heat-generating first circuit board, which is beneficial to improving the heat dissipation effect.

[0011] In one possible implementation, the winding includes a main structure and a heat dissipation structure, with the main structure passing through the magnetic core and one end of the main structure connected to the heat-conducting structure.

[0012] The heat dissipation structure is located at one end of the main structure away from the heat-conducting structure, with at least a portion of the heat dissipation structure exposed on the second end face. Heat generated by the heat-generating components can be conducted through the heat-conducting structure and the main structure to the exposed heat dissipation structure, achieving heat exchange with the external environment. This heat dissipation structure enhances the cooling capacity of the windings. For example, by designing the shape and size of the heat dissipation structure, it can be made to facilitate heat dissipation, improving the heat exchange between the structure and the external environment, further enhancing the cooling capacity of the windings, improving the cooling effect on magnetic components and heat-generating components, and further improving the heat dissipation performance of the functional modules.

[0013] In one possible implementation, the heat dissipation structure includes multiple heat dissipation teeth spaced apart. One end of each heat dissipation tooth is connected to the main structure, and the other end extends away from the main structure. This multiple heat dissipation tooth design increases the thermal contact area between the exposed heat dissipation structure and the external environment, thereby improving heat dissipation performance.

[0014] In one possible implementation, the heat dissipation structure includes a heat sink, which can be a flat plate-like structure. The vertical projection of the heat sink on the second end face is larger than the vertical projection of the main structure on the second end face. The heat sink has a relatively large area, and heat exchange is achieved with the external environment through the exposed heat sink, which can increase the thermal contact area with the external environment and improve heat dissipation performance.

[0015] In one possible implementation, the vertical projection of the heat sink onto the second end face completely covers the second end face. This gives the heat sink a large area, enabling effective heat dissipation from magnetic components and heat-generating devices, thus ensuring high heat dissipation performance of the functional module.

[0016] In one possible implementation, the winding further includes an extension structure disposed at one end of the main structure of the winding adjacent to the first circuit board. The extension structure passes through a through-hole and extends to the first surface side, forming a heat-conducting structure.

[0017] By utilizing the extended structure of the winding to form a heat-conducting structure, thermal contact connection with the heat-generating device is achieved. This eliminates the need for additional heat-conducting structures within the through-holes of the first circuit board, reducing the thermal resistance between the winding and the heat-generating device and improving heat dissipation performance. Furthermore, it reduces the number of structural components on a single board, improving assembly efficiency.

[0018] In one possible implementation, one end of the winding extends to the first end face of the magnetic core, and the vertical projection of one end of the winding on the first circuit board at least partially overlaps with the heat-conducting structure. By adding a heat-conducting structure within the through hole to achieve heat conduction between the winding and the heat-generating device, the precision requirements for assembly between the winding and the first circuit board are reduced, the flexibility of assembly between the winding and the first circuit board is improved, and assembly is facilitated.

[0019] In one possible implementation, there are multiple through holes, each containing a heat-conducting structure. The heat-conducting structure fills a portion of each through hole along its radial direction and surrounds the inner wall of the through hole. This ensures good heat dissipation for the functional module in high-power, high-power-density scenarios, exhibits good general applicability, is easy to implement, and helps reduce costs.

[0020] Alternatively, along the radial direction of each through hole, the heat-conducting structure fills the entire area of ​​each through hole, increasing the volume of the heat-conducting structure, reducing the thermal resistance between the heat-generating device and the winding, improving the heat conduction effect, and thus improving the heat dissipation capacity of the heat-generating device.

[0021] In one possible implementation, there is one through-hole, and the heat-conducting structure fills the entire area of ​​the through-hole along its radial direction. Compared with multiple through-holes spaced apart, this method allows for the formation of a single through-hole with a larger capacity within a limited space, effectively increasing the volume of the heat-conducting structure, which is more conducive to reducing thermal resistance, improving heat conduction, and achieving higher heat dissipation performance.

[0022] In one possible implementation, the thermally conductive structure includes a metal plating covering the inner sidewall of the through-hole. And / or, the thermally conductive structure includes a metal block filling the through-hole.

[0023] In one possible implementation, the single board also includes a chip disposed on the second surface of the first circuit board. The chip is electrically connected to the functional module. Taking the functional module as a power supply module as an example, the functional module can supply power to the chip. The first circuit board can be the main circuit board of the single board, enabling the functional module to function as a tertiary power supply module, which can meet the high heat dissipation performance requirements of the tertiary power supply module under high power density and high power consumption design.

[0024] In one possible implementation, the single board further includes a chip and a second circuit board. The chip is disposed on the third surface of the second circuit board and electrically connected to the second circuit board. A first circuit board is disposed on the third surface of the second circuit board and electrically connected to the second circuit board, with the first surface of the first circuit board adjacent to and opposite to the third surface of the second circuit board. Taking a power module as an example, the functional module on the first circuit board can supply power to the chip through the connection path between the first and second circuit boards. The second circuit board can be the main circuit board of the single board, allowing the functional module to function as a secondary power module, which can meet the high heat dissipation performance requirements of the secondary power module under high power density and high power consumption design.

[0025] In one possible implementation, the magnetic components include a transformer and / or an inductor. The heat-generating devices include at least one of a switching transistor, an integrated drive switching transistor, or a controller, offering high design flexibility and facilitating improved heat dissipation.

[0026] A second aspect of this application provides an electronic device, including a housing and any of the aforementioned single circuit boards, wherein the single circuit boards are at least partially disposed within the housing.

[0027] In one possible implementation, the electronic device also includes a heat dissipation device located within the housing, which is mounted on the housing itself, or it is mounted on a heat sink on the circuit board. The heat dissipation device improves the heat exchange efficiency between the exposed windings on the circuit board and the external environment, further enhancing the heat dissipation performance of the functional modules. Attached Figure Description

[0028] Figure 1A side view of a single board structure provided in an embodiment of this application;

[0029] Figure 2 This is a side view of a three-stage power supply module in the related technology.

[0030] Figure 3 This is a side view of a secondary power supply module in the related technology.

[0031] Figure 4 This is a partial structural diagram of a single board provided in an embodiment of this application;

[0032] Figure 5 for Figure 4 A front view schematic diagram of a partial structure of the first surface of the first circuit board;

[0033] Figure 6 for Figure 4 A schematic diagram of the cross-sectional structure of the single-layer veneer along surface AA;

[0034] Figure 7 for Figure 4 Schematic diagram of the structure of the magnetic element;

[0035] Figure 8 A cross-sectional structural diagram of another single board provided in an embodiment of this application;

[0036] Figure 9 A cross-sectional structural diagram of another single board provided in an embodiment of this application;

[0037] Figure 10 A front view structural diagram of the first surface of a first circuit board in a single board provided in an embodiment of this application;

[0038] Figure 11 A cross-sectional structural diagram of another single board provided in an embodiment of this application;

[0039] Figure 12 for Figure 11 A cross-sectional structural diagram of the assembly of the first circuit board and functional modules in a single board;

[0040] Figure 13 This is a cross-sectional structural diagram of the assembly of a first circuit board and functional modules in another single board provided in an embodiment of this application.

[0041] Explanation of reference numerals in the attached figures:

[0042] 100-Single board;

[0043] 10 - Main circuit board; 20 - Chip;

[0044] 30 - Functional modules;

[0045] 31-Heating device;

[0046] 32-Magnetic element; 321-Magnetic core; 322-Winding; 3221-Main structure; 3222-Heat dissipation structure; 3223-Extension structure;

[0047] 33-Capacitor;

[0048] 40 - First circuit board; 41 - First surface; 42 - Second surface; 43 - Through hole;

[0049] 50 - Thermally conductive structure;

[0050] 60 - Second circuit board; 61 - Third surface; 62 - Fourth surface;

[0051] 70 - First electrical connector; 80 - Second electrical connector. Detailed Implementation

[0052] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0053] This application provides an electronic device, which can be a computer device with a power supply system. For example, the electronic device can be a server, such as a blade server or a rack server.

[0054] For example, the electronic device can also be a desktop computer, tablet computer, laptop computer, ultra-mobile personal computer (UMPC), personal digital assistant (PDA), handheld computer, netbook, wearable device, in-vehicle device, and other personal computing devices.

[0055] For example, the electronic device can also be a communication device, such as a router or switch.

[0056] Taking a server as an example, an electronic device can include a chassis and multiple circuit boards. These circuit boards can be server motherboards, power management boards, network data exchange boards, etc., to meet the functional requirements of the server. The chassis can be the main load-bearing structure of the electronic device. For example, the chassis can have cavities inside, and multiple circuit boards can be respectively housed and assembled in the cavities of the chassis. For instance, multiple circuit boards can be assembled in the cavities of the chassis by being arranged side by side.

[0057] In some examples, the electronic device may also include a heat sink located within a cavity of the housing. The heat sink can dissipate heat from multiple circuit boards and other components housed within the housing.

[0058] Figure 1 This is a side view of a single board structure provided in an embodiment of this application.

[0059] For example, see Figure 1 As shown, the single board 100 may include a main board 10 (mother board, abbreviated as MB), a chip 20 and a functional module 30. The chip 20 and the functional module 30 may be disposed on the main board 10 and may be electrically connected.

[0060] Functional module 30 can realize and / or improve the functions of board 100. For example, functional module 30 can be a power module (PM), which can have functions such as power conversion, voltage regulation, and overcurrent protection to ensure that the output power is stable and reliable within a certain voltage and current range. The power module can provide power to chips such as 20.

[0061] The board 100 may also include other electronic components, such as communication devices, storage devices, etc. These other electronic components may also be electrically connected to the power module, which can provide power to them. Alternatively, in some examples, the functional module 30 may also be other electronic components in the board 100, such as communication devices.

[0062] In this embodiment, the power module is used as an example for illustration. The specific components and circuit structure of the power module are not limited, as long as they can achieve the aforementioned functions. For example, in some examples, the power module may include a switching transistor (MOS), an integrated driver MOS, capacitors, inductors, transformers, voltage regulators / rectifiers, controllers, etc.

[0063] It should be noted that the functional module 30 on the single board 100 can be one or more.

[0064] Taking the power module as an example, the power module on the single board 100 may include a secondary power module (SP). For example, the secondary power module can realize the conversion between DC and DC voltages. For instance, the secondary power module can convert the initial voltage (such as a higher voltage, such as 48V) received from the power supply to a medium voltage (such as a lower voltage, such as 12V).

[0065] The power module on board 100 may also include a third power module (TP). For example, the third power module can also realize the conversion between DC and DC voltages. For instance, the third power module can further reduce the medium voltage converted by the secondary power module. For example, the medium voltage can be converted to a low voltage (e.g., less than 2V) to meet the low voltage power supply requirements of chips such as chip 20.

[0066] To meet ever-increasing performance demands, the power consumption and size of chips integrated on single boards are gradually increasing, which in turn increases the power density and power consumption requirements of power modules. The size of power modules and the required layout space are also getting larger and larger. In application scenarios with high power consumption and high power density, the heat dissipation of power modules faces great challenges.

[0067] Figure 2 This is a side view of a three-stage power supply module in the related technology.

[0068] For example, see Figure 2 As shown, a typical tertiary power supply module 200 may include a main circuit board 201, an integrated driver switch 202, and an inductor 203. The main circuit board 201 may include a top surface 2011 (T-surface) and a bottom surface 2012 (B-surface). The integrated driver switch 202, inductor 203, and other electronic components may be mounted on the top surface 2011 of the main circuit board 201. During the use of the tertiary power supply module 200 (such as when powering other electronic components), the integrated driver switch 202, inductor 203, and other electronic components will generate a significant amount of heat.

[0069] To dissipate heat from the integrated driver switch 202, a heat sink 204 can be installed on the side of the integrated driver switch 202 facing away from the main circuit board 201. For example, the heat sink 204 can be fitted to the integrated driver switch 202 via a thermal pad 205. The heat sink 204 is typically fixedly mounted on the main circuit board 201. For example, mounting holes (not shown in the figure) can be provided on the main circuit board 201, and the heat sink 204 can be mounted on the main circuit board 201 by using screws, rivets, or other connectors that engage with the mounting holes on the heat sink 204 and the main circuit board 201.

[0070] The integrated driver switch 202, inductor 203, and other components are located on the top surface 2011 of the main circuit board 201, occupying a large area and hindering the implementation of high power density and high power consumption layout designs for the power module. Furthermore, due to the limited packaging structure of the integrated driver switch 202, heat dissipation through the heatsink 204 on the side of the integrated driver switch 202 facing away from the main circuit board 201 results in high thermal resistance, requiring further improvement in heat dissipation efficiency. Additionally, mounting holes on the main circuit board 201 are needed to secure the heatsink 204, further reducing the usable area of ​​the main circuit board 201 and hindering high power consumption and high-density layout designs.

[0071] Figure 3 This is a side view of a secondary power supply module in the related technology.

[0072] For example, to increase the power density of power modules and achieve high power consumption. See also Figure 3 As shown, a typical secondary power supply module 300 may include a circuit board 301, a switching transistor 302, a capacitor 303, and an inductor 304. Switching transistors (such as switching transistors 302a and 302b), capacitors (such as capacitors 303a and 303b), and inductors (such as inductors 304a and 304b) are integrated on the top surface 3011 and bottom surface 3012 of the circuit board 301 to increase the layout area of ​​the inductor 304, etc. The circuit board 301, switching transistor 302, capacitor 303, and inductor 304 can be first integrated into a single structural component, and then this component is placed on the top surface of the main circuit board 305. For example, the bottom surface 3012 of the circuit board 301 can be adjacent to and opposite the top surface 3051 of the main circuit board 305.

[0073] Taking the thickness direction (z-direction) of the circuit board 301 as the height direction (as shown by z1 in the figure), the core height of the inductor 304 differs significantly from the heights of electronic components such as the switch 302 and capacitor 303. For example, the core height of the inductor 304 is approximately 3.5 mm, the height of the capacitor 303 is approximately 2.7 mm, and the height of the switch 302 is approximately 1.1 mm. This uneven height results in low space utilization in the height direction (z-direction), and the power density of the power module needs further improvement. Furthermore, the heat dissipation of the switch 302, located on the bottom surface 3012 of the circuit board 301, is mainly achieved through the main circuit board 305. The main circuit board 305 integrates many electronic components, resulting in high heat generation and high thermal resistance, leading to poor heat dissipation.

[0074] Based on this, this application provides a single-board assembly comprising a first circuit board, a heat-conducting structure, and a functional module. The first circuit board has a through-hole penetrating a first surface and a second surface facing away from each other, and the heat-conducting structure is disposed within the through-hole. The heating element of the functional module is disposed on the first surface, and the magnetic core of the magnetic element of the functional module is disposed on the second surface. The winding is at least partially disposed within the magnetic core, and the magnetic element is fixed integrally on the second surface by the magnetic core. By separately arranging the heating element and the magnetic element on the first surface and the second surface facing away from each other on the first circuit board (e.g., facing away from each other along the thickness direction), the space on the first surface of the first circuit board can be fully utilized, saving the layout area of ​​the heating element on the second surface. This allows the magnetic elements such as inductors located on the second surface to have a larger layout area and board area, which is beneficial for improving the power density and power consumption of the functional module. Furthermore, by distributing the heating element and the magnetic core, which have a large height difference, on opposite sides of the first circuit board, the heating element on the first surface occupies less space in the thickness direction, allowing the second surface to occupy more space in the thickness direction. For example, the size of the magnetic core along the thickness direction can be increased, increasing the volume of the magnetic core, thus making reasonable use of the space in the thickness direction and further increasing the power density and power consumption of the functional module. The windings can be connected to the heat-generating devices via a thermally conductive structure. Part of the winding extends to the outer surface of the magnetic core and is exposed. Heat from the heat-generating devices can be conducted to the windings through the thermally conductive structure. The exposed portion of the windings exchanges heat with the external environment, achieving heat dissipation for the heat-generating devices. Heat generated by the magnetic components themselves can also be dissipated through the exposed windings. Utilizing the windings of the magnetic components to dissipate heat from both the heat-generating devices and the magnetic components themselves eliminates the need for additional heat sinks, reducing the number of structural components on the board, lowering layout complexity and manufacturing costs, and further saving board space. Furthermore, the windings can be made of metals with good electrical and thermal conductivity. The high thermal conductivity of the windings and the thermally conductive structure ensures excellent heat dissipation performance, meeting the high heat dissipation requirements of functional modules such as power modules in high-power, high-power-density design scenarios.

[0075] Figure 4 This is a partial structural diagram of a single board provided in an embodiment of this application.

[0076] For example, see Figure 4 As shown, the single board 100 includes a first circuit board 40 and a functional module 30. For example, the first circuit board 40 can be a printed circuit board (PCB), and the functional module 30 can be disposed on the first circuit board 40.

[0077] In some examples, the first circuit board 40 can be the main circuit board described above. Alternatively, in some examples, the first circuit board 40 can also be a circuit board additionally provided in the single board 100, and the first circuit board 40 can be disposed on the main circuit board of the single board 100 and electrically connected to the main circuit board.

[0078] like Figure 4 As shown in the figure, taking the first circuit board 40 as the main circuit board 10 of the single board 100 and the functional module 30 as the power supply module as an example, the chip 20 and other electronic devices (not shown in the figure) of the single board 100 can be set on the first circuit board 40 and electrically connected to the functional module 30 on the first circuit board 40, so that the power supply to the chip 20 and other electronic devices can be realized through the functional module 30.

[0079] The first circuit board 40 may include a first surface 41 and a second surface 42 facing away from each other (combined) Figure 6 As shown), for example, such as in the thickness direction of the first circuit board 40. Figure 4 As shown in the z-direction, the first circuit board 40 may include a first surface 41 and a second surface 42 that are opposite to each other in the thickness direction (z-direction). That is, along the thickness direction (z-direction), the first surface 41 and the second surface 42 may be located on opposite sides of the first circuit board 40. The thickness direction (z-direction) may be perpendicular to the first surface 41 and the second surface 42, respectively.

[0080] The first surface 41 can serve as the bottom surface (B surface) of the first circuit board 40, and the second surface 42 can serve as the top surface (T surface) of the first circuit board 40. Taking the first circuit board 40 as the main circuit board 10 of the single board 100 as an example, the chip 20 can be disposed on the second surface 42 of the first circuit board 40.

[0081] Figure 5 for Figure 4 A front view schematic diagram of a partial structure of the first surface of the first circuit board.

[0082] See Figure 5 As shown, a through hole 43 may be provided on the first circuit board 40, which can penetrate the first surface 41 and the second surface 42 of the first circuit board 40 (see reference). Figure 6 (As shown). For example, along the thickness direction (z direction), the through hole 43 can extend from the first surface 41 of the first circuit board 40 to the second surface 42 of the first circuit board 40, and the through hole 43 can have openings formed on the first surface 41 and the second surface 42.

[0083] See also Figure 5As shown, the single-board 100 may further include a heat-conducting structure 50, which may include a material with a high thermal conductivity. For example, the molding material of the heat-conducting structure 50 may include metals such as copper and aluminum. The heat-conducting structure 50 may be disposed within the through-holes 43, and the heat-conducting structure 50 may fill at least a portion of each through-hole 43.

[0084] For example, the heat-conducting structure 50 can be a metal plating layer formed on the inner sidewall of the through hole 43. The heat-conducting structure 50 can also be a metal block filling the through hole 43. In this embodiment, the shape and size of the metal block are not limited. For example, the metal block can be a metal cylinder, a metal cube, etc. Alternatively, the metal block can also be a metal structure with other regular or irregular shapes on its outer contour.

[0085] Figure 6 for Figure 4 A schematic diagram of the cross-sectional structure of the single-layer veneer along surface AA.

[0086] See Figure 6 As shown, the functional module 30 may include a magnetic element 32. Taking the functional module 30 as a power supply module as an example, the magnetic element 32 can be a device based on characteristics such as electromagnetic induction and magnetic field, and can realize one or more functions such as energy storage, filtering, voltage conversion, and electrical isolation.

[0087] The magnetic element 32 may include a magnetic core 321 and a winding 322. In some examples, the forming material of the winding 322 may include a conductive and thermally conductive material. For example, the forming material of the winding 322 may include metals such as copper, silver, and aluminum, which have high electrical and thermal conductivity, giving the winding 322 good electrical and thermal conductivity. Exemplarily, the winding 322 may be formed by bending and winding a strip of conductive material. For example, the winding 322 may be a structural component formed by bending and winding a copper sheet or the like.

[0088] The winding 322 can be energized. When current passes through the winding 322, a magnetic field is generated around the winding 322. The electromagnetic function of the magnetic element 32 can be realized by utilizing the generated magnetic field and the changes in the magnetic field.

[0089] The magnetic core 321 may include materials with high magnetic permeability, such as ferrite or iron powder core. The magnetic core 321 can concentrate and guide the magnetic field, such as enhancing the magnetic field generated by the winding 322 and reducing magnetic flux leakage, thereby improving the performance of the magnetic core 321 component.

[0090] In this embodiment of the application, the outer contour shape of the magnetic core 321 is not limited. For example, the outer contour shape of the magnetic core 321 can be a cuboid, or the outer contour shape of the magnetic core 321 can also be a trapezoid, column, or other regular or irregular shape.

[0091] The magnetic element 32 can be any device in the functional module 30 that is based on characteristics such as electromagnetic induction and magnetic field. For example, the magnetic element 32 can be an inductor or transformer in the power supply module.

[0092] The functional module 30 may also include a heat-generating device 31, which may be an electronic device that generates a significant amount of heat during the use of the functional module 30 (such as during power supply). For example, the heat-generating device 31 may be a switching transistor, an integrated drive switching transistor, a controller, etc., in the power supply module. It is understood that the magnetic element 32 itself will also generate heat during the use of the functional module 30. In this embodiment, the heat-generating device 31 does not include the magnetic element 32.

[0093] like Figure 6 As shown, the heating element 31 of the functional module 30 is disposed on the first surface 41 of the first circuit board 40, that is, the heating element 31 can be disposed on the B surface of the first circuit board 40, and the heating element 31 can be in contact with the heat-conducting structure 50 to achieve heat conduction. For example, along the thickness direction (z direction), the vertical projection of the heating element 31 on the first circuit board 40 can at least partially overlap with one end of the heat-conducting structure 50 adjacent to the first surface 41, so that the heat-conducting structure 50 can be in contact with the heating element 31 and achieve heat conduction.

[0094] For example, one end of the heat-conducting structure 50 adjacent to the first surface 41 can be at least partially attached to the heating device 31 and fixedly connected together by means of welding or the like, to ensure the heat conduction path between the heat-conducting structure 50 and the heating device 31.

[0095] The magnetic core 321 of the magnetic element 32 can be disposed on the second surface 42 of the first circuit board 40. For example, the magnetic core 321 can be fixed on the second surface 42 of the first circuit board 40 by means of threaded connection, snap-fit ​​connection, adhesive connection, etc.

[0096] The magnetic core 321 may include a first end face 3211 and an outer side face 321a, which together form the outer surface of the magnetic core 321. The first end face 3211 of the magnetic core 321 may be adjacent to and opposite to the second surface 42 of the first circuit board 40. For example, along the thickness direction (z direction), the first end face 3211 of the magnetic core 321 may face the second surface 42 of the first circuit board 40 and be attached and fixed to the second surface 42.

[0097] Of course, in some other examples, along the thickness direction (z direction), the first end face 3211 of the magnetic core 321 can face the second surface 42, and there can be a certain distance between the first end face 3211 and the second surface 42.

[0098] The outer surface 321a of the magnetic core 321 can be located on the side of the first end face 3211 that is away from the first circuit board 40. For example, if the outer contour shape of the magnetic core 321 is a cuboid, the outer surface of the cuboid magnetic core 321 can include six faces, one of which can serve as the first end face 3211 of the magnetic core 321, and the other five faces can together form the outer surface 321a of the magnetic core 321.

[0099] At least a portion of the winding 322 can be inserted into the magnetic core 321. For example, the magnetic core 321 may have mounting holes (not shown in the figure) inside, and at least a portion of the winding 322 can be accommodated and fixed in the mounting holes, thereby fixing the winding 322 to the magnetic core 321. This allows the magnetic element 32 to be integrally fixed to the first circuit board 40 via the magnetic core 321. Specifically, the magnetic element 32 is mounted and fixed on the T-surface of the first circuit board 40, with at least a portion of the magnetic element 32 located on the second surface 42 side of the first circuit board 40.

[0100] By placing the heating element 31 and the magnetic element 32 on opposite surfaces 41 and 42 of the first circuit board 40, the space on the first surface 41 side (B-side) of the first circuit board 40 can be fully utilized, saving the layout area of ​​the heating element 31 on the second surface 42 side (T-side). This allows the magnetic elements 32, such as inductors, located on the second surface side to have a larger layout area and board area, which is beneficial to improving the power density and power consumption of the functional module 30, and realizing the high power density and high power consumption design of the functional module 30.

[0101] Furthermore, the heat-generating devices 31, such as the switching transistor, integrated drive switching transistor, and controller, which have a lower height (thickness along the z-direction), are respectively disposed on the first surface 41 and the second surface 42 of the first circuit board 40, along with the magnetic core 321 (magnetic element 32), which has a higher height. This means that the heat-generating devices 31 and the magnetic core 321, with their significant height difference, are distributed on both sides of the first circuit board 40 along the thickness direction (z-direction). The heat-generating devices 31 on the first surface 41 side occupy less space in the thickness direction (z-direction), allowing the second surface 42 side to occupy more space in the thickness direction (z-direction). For example, the dimensions of the magnetic core 321 along the thickness direction (z-direction) can be increased, thus increasing the volume of the magnetic core 321. This makes reasonable use of the space in the thickness direction (z-direction), further increasing the power density and power consumption of the functional module 30, and improving the performance of the functional module 30.

[0102] The winding 322 of the magnetic element 32 is at least partially inserted within the magnetic core 321. The winding 322 can be connected to the heating device 31 via a heat-conducting structure 50, thereby achieving heat conduction between the heating device 31 and the winding 322. For example, in some examples, the winding 322 can have an extension structure 3223, which can be inserted into the through hole 43 to form the heat-conducting structure 50. The heat-conducting structure 50 can contact and connect with the heating device 31, achieving heat conduction, thus realizing a heat conduction path between the heating device 31, the heat-conducting structure 50, and the winding 322.

[0103] Part of the winding 322 can extend to the outer side 321a of the magnetic core 321 and be exposed. It should be noted that, in the embodiments of this application, the partial exposure of the winding 322 means that part of the winding 322 is exposed to the external environment (such as the external environment where the single board 100 is located). The partial exposure of the winding 322 to the external environment can achieve heat exchange with the external environment and achieve the effect of heat dissipation.

[0104] During the use of functional module 30, the heat generated by the heating device 31 can be conducted to the winding 322 through the heat-conducting structure 50, and then exchanged with the external environment through the portion of the winding 322 exposed on the outer surface 321a of the magnetic core 321, thus achieving the effect of heat dissipation for the heating device 31. The heat generated by the magnetic element 32 itself can also be exchanged through the portion of the winding 322 exposed on the outer surface 321a of the magnetic core 321, thus achieving the effect of heat dissipation for the magnetic element 32.

[0105] The winding 322 of the magnetic element 32 can dissipate heat from the heat-generating device 31 and the magnetic element 32 itself without the need for an additional heat sink. This reduces the number of structural components on the single board 100, lowers layout complexity and manufacturing costs, and saves board space on the first circuit board 40, facilitating high power density layout designs. Furthermore, the winding 322 can be made of a metal material with good electrical and thermal conductivity. The high thermal conductivity of the winding 322 and the heat-conducting structure 50 enables heat conduction to the heat-generating device 31, thereby achieving heat dissipation. This provides high heat dissipation performance, meeting the high heat dissipation requirements of functional modules 30 in high-power, high-power-density design scenarios such as power modules.

[0106] In some examples, the outer surface 321a of the magnetic core 321 may include a second end face 3212, which may be opposite to the first end face 3211. For example, along the thickness direction (z-direction), the first end face 3211 and the second end face 3212 may be arranged opposite to each other. The first end face 3211 and the second end face 3212 may be the end faces of the magnetic core 321 at opposite ends along the thickness direction (z-direction).

[0107] One end of the winding 322 can be connected to the heat-conducting structure 50 on the first circuit board 40, and the other end of the winding 322 can extend to and be exposed on the second end face 3212 of the magnetic core 321, thereby dissipating the heat generated by the heat-generating device 31 to the external environment through the heat-conducting structure 50 and the winding 322. For example, the winding 322 may include two ends distributed along the thickness direction (z direction), one end of which can be disposed closer to the first circuit board 40 and can be connected to the heat-conducting structure 50, and the other end of which can be disposed further away from the first circuit board 40 and can extend to and be exposed on the second end face 3212 of the magnetic core 321.

[0108] In particular, on the outer side 321a of the magnetic core 321, the second end face 3212 is far away from the first end face 3211 of the magnetic core 321 and the first circuit board 40. The heat on the first circuit board 40 is high, so the other end of the winding 322 is exposed on the second end face 3212, which can reduce the concentration of heat and keep it relatively away from the first circuit board 40 with high heat, which is conducive to improving the heat dissipation effect.

[0109] Of course, in some other examples, a portion of the winding 322 may also extend to and be exposed on other outer surfaces 321a of the magnetic core 321. For example, taking the outer contour shape of the magnetic core 321 as a cube, the outer surface 321a of the magnetic core 321 may also include a third end face and a fourth end face. For example, as... Figure 6 As shown, with the width direction of the first circuit board 40 as the x-direction, the width direction can be perpendicular to the thickness direction. Along the width direction (x-direction), the third end face 3213 and the fourth end face 3214 can be arranged opposite to each other. The other end of the winding 322 can also extend to the third end face 3213 or the fourth end face 3214 and be exposed.

[0110] The outer surface 321a of the magnetic core 321 may also include a fifth end face and a sixth end face (not shown in the figure). For example, the length direction of the first circuit board 40 may be perpendicular to the width direction and the thickness direction, respectively. Along the length direction, the fifth end face and the sixth end face may be arranged opposite to each other. The other end of the winding 322 may extend to the fifth end face or the sixth end face and be exposed.

[0111] Alternatively, in some other examples, a portion of the winding 322 may extend to and be exposed on multiple end faces of the outer surface 321a of the magnetic core 321. For example, the outer surface 321a of the magnetic core 321 may include the second end face 3212, the third end face 3213, the fourth end face 3214, the fifth end face, and the sixth end face described above. The other end of the winding 322 may extend to and be exposed on multiple end faces of the second end face 3212, the third end face 3213, the fourth end face 3214, the fifth end face, and the sixth end face, thereby achieving heat dissipation. This increases the available heat dissipation area and improves heat dissipation performance.

[0112] In some examples, a portion of the winding 322 may protrude from the outer surface 321a of the magnetic core 321. For instance, taking the case where the other end of the winding 322 extends to the second end face 3212 of the magnetic core 321, the other end of the winding 322 may protrude beyond the second end face 3212. For example, along the thickness direction (z-direction), the distance from the other end face of the winding 322 to the first surface 41 of the first circuit board 40 may be greater than the distance from the second end face 3212 to the first circuit board 40, thus exposing the other end of the winding 322 to the external environment. This increases the exposed area of ​​the winding 322, increases the heat exchange area between the winding 322 and the external environment, and thereby improves the heat dissipation effect.

[0113] Of course, in some examples, a portion of the winding 322 may not protrude from the outer surface 321a of the magnetic core 321. For example, the other end face of the winding 322 may be flush with the second end face 3212. Along the thickness direction (z direction), the distance from the other end face of the winding 322 to the first surface 41 may be approximately equal to the distance from the second end face 3212 to the first surface 41 of the first circuit board 40, so that the other end face of the winding 322 may be exposed to the external environment.

[0114] Alternatively, in some examples, the other end face of the winding 322 may be recessed into the second end face 3212. For example, along the thickness direction (z direction), the distance from the other end face of the winding 322 to the first surface 41 of the first circuit board 40 is less than the distance from the second end face 3212 to the first surface 41. A notch structure may be formed on the second end face 3212, and the other end face of the winding 322 may be located on the bottom surface of the notch structure, so that at least the other end face of the winding 322 can be exposed to the external environment.

[0115] The following example illustrates the structure of the winding 322 on the single board 100, with one end of the winding 322 extending to the second end face 3212 and protruding from the second end face 3212. In the example where part of the winding 322 extends to other end faces of the outer side 321a, the structure of the winding 322 can be referred to this embodiment.

[0116] For example, such as Figure 6As shown, the winding 322 may include a main structure 3221 and a heat dissipation structure 3222. The main structure 3221 may be disposed within the magnetic core 321, and one end of the main structure 3221 may be thermally connected to the heat-conducting structure 50. The heat dissipation structure 3222 may be disposed on the other end of the main structure 3221, for example, along the thickness direction (z direction). The heat dissipation structure 3222 may be disposed on the end of the main structure 3221 facing away from the heat-conducting structure 50, and the heat dissipation structure 3222 may serve as at least a portion of the other end of the winding 322. At least a portion of the heat dissipation structure 3222 may be exposed on the second end face 3212, such as at least a portion of the heat dissipation structure 3222 protruding from the second end face 3212.

[0117] The other end of the winding 322 has a heat dissipation structure 3222 that is at least partially exposed. The heat generated by the heat-generating device 31 can be conducted to the exposed heat dissipation structure 3222 through the heat-conducting structure 50 and the main structure 3221, so as to achieve heat exchange with the external environment. The heat dissipation structure 3222 can enhance the heat dissipation capacity of the winding 322.

[0118] The molding material of the heat dissipation structure 3222 may include a material with high thermal conductivity, possessing high thermal conductivity performance, thereby enabling good heat exchange with the external environment. For example, the molding material of the heat dissipation structure 3222 may include metal materials such as copper and aluminum. The molding material of the heat dissipation structure 3222 may be at least partially the same as the molding material of the winding 322, or the molding material of the heat dissipation structure 3222 may be different from the molding material of the winding 322.

[0119] By designing the form of the heat dissipation structure 3222, such as designing the shape and size of the heat dissipation structure 3222, the heat dissipation structure 3222 can be made into a form that facilitates heat dissipation. For example, it can improve the heat exchange effect between the heat dissipation structure 3222 and the external environment, further enhance the heat dissipation capacity of the winding 322, improve the heat dissipation effect on the magnetic components 32, heat-generating devices 31, etc., and further improve the heat dissipation performance of the functional module 30.

[0120] In this embodiment, there are no restrictions on the molding method of the heat dissipation structure 3222 or the assembly method between the heat dissipation structure 3222 and the main structure 3221. For example, the heat dissipation structure 3222 can be integrally molded with the main structure 3221, making the winding 322 an integral structural component.

[0121] Alternatively, the heat dissipation structure 3222 can be formed separately from the main structure 3221. For example, the heat dissipation structure 3222 can be set on one end of the main structure 3221 by means of welding, snap-fit ​​connection, threaded connection, etc. Alternatively, the heat dissipation structure 3222 can be formed directly on one end of the already formed main structure 3221 by means of process control, etc.

[0122] For example, in some examples, such as Figure 6 As shown, the heat dissipation structure 3222 may include a plurality of heat dissipation teeth 3222a, which may be spaced apart. One end of each heat dissipation tooth 3222a may be connected to the main structure 3221, and the other end of each heat dissipation tooth 3222a may extend in a direction away from the main structure 3221. At least a portion of each heat dissipation tooth 3222a may protrude from the second end face 3212.

[0123] For example, the other end of each heat dissipation tooth 3222a can extend away from the main structure 3221 along the thickness direction (z direction), so that each heat dissipation tooth 3222a can have a certain extension length in the thickness direction (z direction). The structural design of multiple heat dissipation teeth 3222a can increase the thermal contact area between the exposed heat dissipation structure 3222 and the external environment, thereby improving heat dissipation performance.

[0124] In the example where the winding 322 is an integral structural component, the winding 322 can be formed by bending a strip-shaped or sheet-like metal structure (or other conductive structure). For example, taking the winding 322 as being formed by bending a copper sheet, before bending the copper sheet, multiple outwardly protruding tooth-like structures can be formed on both sides of the middle part of the copper sheet (such as both sides along the width direction of the copper sheet). When assembling the copper sheet with the magnetic core 321 and bending it to form the winding 322, the copper sheet can be bent so that both ends of the copper sheet (such as both ends along the length direction of the copper sheet) are inserted into the assembly holes of the magnetic core 321 to form the main structure 3221. Bending the tooth-like structures, such as making the tooth-like structures protrude along the thickness direction (z direction) on the second end face 3212, thereby forming multiple heat dissipation teeth 3222a.

[0125] Alternatively, in some examples, a metal material can be used as the substrate, and the winding 322 can be formed by 3D printing technology, molding, or other means. The winding 322 may include the main structure 3221 and multiple heat dissipation teeth 3222a.

[0126] In this embodiment, there are no restrictions on the arrangement of the multiple heat dissipation teeth 3222a on the winding 322, or the outer contour shape of the entire heat dissipation structure 3222 formed by the multiple heat dissipation teeth 3222a. The specific arrangement can be selected and set according to the layout design and heat dissipation requirements.

[0127] Figure 7 for Figure 4 A schematic diagram of the structure of the magnetic element.

[0128] For example, see Figure 7As shown, multiple heat dissipation fins 3222a can be arranged in a longitudinal and transverse array, forming multiple rows and columns. There are gaps between adjacent heat dissipation fins 3222a, and the overall outline of the heat dissipation structure 3222 can be rectangular. This allows for the placement of more heat dissipation fins 3222a within a limited space, achieving better heat exchange and improving heat dissipation performance.

[0129] Of course, in some other examples, the multiple heat dissipation teeth 3222a can also adopt other regular or irregular distribution methods. For example, the multiple heat dissipation teeth 3222a can be distributed sequentially in the length direction or the width direction, so that the outer contour shape of the entire heat dissipation structure 3222 can be linear, etc.

[0130] In this embodiment of the application, there are no restrictions on the size of each heat dissipation tooth 3222a, the shape of each heat dissipation tooth 3222a, and the size of the entire heat dissipation structure 3222 formed by multiple heat dissipation teeth 3222a. The specific settings can be selected according to the layout requirements and heat dissipation requirements.

[0131] It should be noted that at least a portion of the heat dissipation fins 3222a protrudes and is exposed on the second end face 3212 of the magnetic core 321, allowing at least a portion of the heat dissipation fins 3222a to be exposed to the external environment. The single-board is disposed within the housing, exposing at least a portion of the heat dissipation fins 3222a to the cavity environment of the housing. In the example where the heat dissipation structure 3222 includes multiple heat dissipation fins 3222a, a heat dissipation device can also be disposed within the housing of the electronic device. This heat dissipation device can be mounted on the inner side of the housing and can be an air-cooled device, such as a cooling fan. The heat dissipation device can accelerate the airflow within the cavity of the housing, thereby improving the heat exchange effect between the heat dissipation fins 3222a and the air within the cavity, and enhancing the heat dissipation of the functional module 30.

[0132] In some examples, the heat dissipation structure 3222 can also be a heat sink 3222b (see below) Figure 9 As shown, the heat sink 3222b can be a flat-plate-like heat dissipation structure, for example, it can be a metal plate such as a copper plate. The vertical projection of the heat sink 3222b on the second end face 3212 can be larger than the vertical projection of the main structure 3221 on the second end face 3212, that is, along the second direction, the projection of the heat sink 3222b on the second end face 3212 can be larger than the projection of the main structure 3221 on the second end face 3212. The heat sink 3222b has a relatively large area, and at least a portion of the heat sink 3222b can protrude from the second end face 3212. By exchanging heat with the external environment through the exposed heat sink 3222b, the thermal contact area with the external environment can be increased, thereby improving heat dissipation performance.

[0133] In the example where the winding 322 is an integral structural component, a metal material can be used as the base material, and the winding 322 can be formed by 3D printing technology, molding, or other means. The winding 322 may include the main structure 3221 and the heat sink 3222b mentioned above.

[0134] There are no restrictions on the size or shape of the heat sink 3222b. For example, the outer contour of the heat sink 3222b can be a regular or irregular shape such as a cuboid, trapezoid, or prism.

[0135] For example, in some examples, the vertical projection of the heat sink 3222b on the second end face 3212 can cover the entire second end face 3212, giving the heat sink 3222b a large area size. The heat sink 3222b can effectively dissipate heat from the magnetic component 32 and the heat-generating device 31, ensuring that the functional module 30 has high heat dissipation performance.

[0136] In the example where the heat dissipation structure 3222 includes a heat sink 3222b, the electronic device may also include a heat dissipation device, which can be a liquid-cooled heat dissipation device, such as a heat sink plate. The heat dissipation device can be disposed on the heat sink 3222b; for example, it can be attached to the side of the heat sink 3222b facing away from the first circuit board 40. The heat dissipation device can improve the heat exchange efficiency of the heat sink 3222b and enhance the heat dissipation of the functional module 30.

[0137] Alternatively, the heat dissipation device can also be an air-cooled heat dissipation device, such as a cooling fan. The heat dissipation device can be set inside the casing to accelerate the airflow inside the casing, which is also conducive to improving the heat exchange effect and strengthening the heat dissipation of the functional module 30.

[0138] Of course, in some examples, the winding 322 may not include the heat dissipation structure 3222. For example, the end of the main structure 3221 of the winding 322 that is away from the first circuit board 40 can be the other end of the winding 322. The end of the main structure 3221 that is away from the first circuit board 40 can extend to the outer side 321a of the magnetic core 321. For example, the end of the main structure 3221 that is away from the first circuit board 40 can extend to the second end face 3212 and be exposed. Heat exchange with the external environment is achieved through the exposed part of the main structure 3221, so as to achieve the purpose of heat dissipation.

[0139] The following is an example of the connection between winding 322 and heat-conducting structure 50.

[0140] See in some examples Figure 6 As shown, the winding 322 may also include an extension structure 3223, which may be disposed at one end of the main structure 3221 adjacent to the first circuit board 40, and the extension structure 3223 may serve as at least a part of one end of the winding 322.

[0141] The extension structure 3223 can be inserted into the through hole 43 of the first circuit board 40, and can extend to the first surface 41 side of the first circuit board 40, so that the extension structure 3223 can form a heat-conducting structure 50. The winding 322 is thermally connected to the heating device 31 through the extension structure 3223. For example, the end of the extension structure 3223 away from the main structure 3221 can be connected and assembled with the heating device 31 by means of welding or other methods.

[0142] By utilizing the extension structure 3223 of the winding 322 to form a heat-conducting structure 50, thermal contact connection with the heat-generating device 31 is achieved. This eliminates the need for an additional heat-conducting structure within the through hole 43 of the first circuit board 40, reducing the thermal resistance between the winding 322 and the heat-generating device 31 and improving heat dissipation performance. Furthermore, it reduces the number of structural components on the single board 100, thereby improving assembly efficiency.

[0143] For example, when assembling the winding 322 and the first circuit board 40, the extension structure 3223 of the winding 322 is inserted into the through hole 43 of the first circuit board 40, so that the extension structure 3223 is thermally connected to the heating device 31 located on the first surface 41. The assembly steps are simple and easy to operate, and have high assembly efficiency.

[0144] In some examples, the extension structure 3223 can extend to the first surface 41 of the first circuit board 40. For instance, the end face of the extension structure 3223 facing away from the main structure 3221 can be flush with the first surface 41. Along the thickness direction (z-direction), the distance from the end face of the extension structure 3223 facing away from the main structure 3221 to the second surface 42 can be approximately equal to the distance from the first surface 41 to the second surface 42. When the heating device 31 is mounted on the first surface 41, the heating device 31 can contact and connect with one end of the extension structure 3223 to achieve heat conduction.

[0145] Of course, in some examples, the end face of the extension structure 3223 facing away from the main structure 3221 may protrude from the first surface 41. Along the thickness direction (z direction), the distance from the end face of the extension structure 3223 facing away from the main structure 3221 to the second surface 42 is greater than the distance from the first surface 41 to the second surface 42. When the heating device 31 is assembled on the first surface 41, the heating device 31 can contact and connect with the protruding part of the extension structure 3223.

[0146] Alternatively, in some examples, the end face of the extension structure 3223 facing away from the main structure 3221 may be recessed into the first surface 41, and along the thickness direction (z direction), the distance from the end face of the extension structure 3223 facing away from the main structure 3221 to the second surface 42 is less than the distance from the first surface 41 to the second surface 42. For example, the heating device 31 may have a protruding heat-conducting component on the side facing the first surface 41. When the heating device 31 is mounted on the first surface 41, this heat-conducting component can be inserted into the through hole 43 and contact and connect with the extension structure 3223.

[0147] It should be noted that in the example where the winding 322 includes the aforementioned extension structure 3223, the winding 322 may also include the main structure 3221 and the aforementioned heat dissipation structure 3222, or the winding 322 may also include the main structure 3221 but not the aforementioned heat dissipation structure 3222.

[0148] For example, such as Figure 6 The single board 100 shown includes a winding 322 comprising a main structure 3221, a heat dissipation structure 3222, and an extension structure 3223. The heat dissipation structure 3222 may include the aforementioned plurality of heat dissipation teeth 3222a. Alternatively, in some examples, the heat dissipation structure 3222 may also include the aforementioned heat dissipation plate 3222b.

[0149] Figure 8 This is a cross-sectional structural diagram of another single board provided in an embodiment of this application.

[0150] In some examples, winding 322 may also not include extension structure 3223, see [reference needed] Figure 8 As shown, a heat-conducting structure 50 is provided inside the through hole 43. The heat-conducting structure 50 is in contact with the heating device 31 and realizes heat conduction. By adding a heat-conducting structure 50 inside the through hole 43 to realize heat conduction between the winding 322 and the heating device 31, it is beneficial to reduce the precision requirements of the assembly between the winding 322 and the first circuit board 40, improve the flexibility of the assembly between the winding 322 and the first circuit board 40, and facilitate the assembly.

[0151] One end of the winding 322 (such as the main structure 3221) can extend to the first end face 3211 side of the magnetic core 321. The vertical projection of one end of the winding 322 on the first circuit board 40 can at least partially overlap with one end of the heat-conducting structure 50 adjacent to the second surface 42 side. For example, along the thickness direction (z direction), the projection of one end of the winding 322 on the first circuit board 40 can completely cover one end of the heat-conducting structure 50 adjacent to the second surface 42 side.

[0152] When the first end face 3211 of the magnetic core 321 is attached and fixed to the first surface 41 of the first circuit board 40, one end of the winding 322 can be made to contact and connect with one end of the heat-conducting structure 50 adjacent to the second surface 42. One end of the heat-conducting structure 50 adjacent to the first surface 41 can be made to contact and connect with the heating device 31, thus realizing a heat conduction path between the winding 322, the heat-conducting structure 50 and the heating device 31.

[0153] For example, one end of the winding 322 can be connected and assembled with the heat-conducting structure 50 by means of welding or other methods to ensure heat conduction between the winding 322 and the heat-conducting structure 50.

[0154] It should be noted that the heat-conducting structure 50 can be integrally formed with the first circuit board 40, making the heat-conducting structure 50 and the first circuit board 40 a single integrated structural component. For example, the heat-conducting structure 50 and the first circuit board 40 can be formed into a single integrated structural component through injection molding or other methods. Alternatively, the heat-conducting structure 50 and the first circuit board 40 can be formed separately, and the heat-conducting structure 50 can be inserted into the through hole 43 of the first circuit board 40 through methods such as adhesive bonding, snap-fit ​​bonding, or threaded fixing. Alternatively, the heat-conducting structure 50 can be formed within the through hole 43 of the formed first circuit board 40 through processes such as electroplating.

[0155] In some examples, the end of the heat-conducting structure 50 connected to the winding 322 can extend to the second surface 42 of the first circuit board 40. For example, the end face of the end of the heat-conducting structure 50 connected to the winding 322 can be flush with the second surface 42. Along the thickness direction (z direction), the distance from the end face of the end of the heat-conducting structure 50 connected to the winding 322 to the first surface 41 can be approximately equal to the distance from the second surface 42 to the first surface 41.

[0156] The winding 322 can extend to the second end face 3212 of the magnetic core 321. For example, if one end face of the winding 322 is flush with the second end face 3212 of the magnetic core 321, the winding 322 will contact the heat-conducting structure 50 when the magnetic core 321 is mounted on the second surface 42. Alternatively, one end face of the winding 322 can protrude from the second end face 3212 of the magnetic core 321, and the protruding part of the winding 322 can contact the heat-conducting structure 50 when the magnetic core 321 is mounted on the second surface 42.

[0157] Alternatively, in some examples, the end face of the heat-conducting structure 50 that is connected to the winding 322 may protrude from the second surface 42, and the distance from the end face of the heat-conducting structure 50 that is connected to the winding 322 to the first surface 41 along the thickness direction (z direction) may be greater than the distance from the second surface 42 to the first surface 41.

[0158] One end face of the winding 322 can be flush with the second end face 3212 of the magnetic core 321. When the magnetic core 321 is mounted on the second surface 42, the protruding portion of the heat-conducting structure 50 can contact and connect with the winding 322. Alternatively, one end face of the winding 322 can also protrude from the second end face 3212 of the magnetic core 321. When the magnetic core 321 is mounted on the second surface 42, the protruding portion of the heat-conducting structure 50 can contact and connect with the protruding portion of the winding 322. Alternatively, one end face of the winding 322 can also be recessed into the second end face 3212 of the magnetic core 321. When the magnetic core 321 is mounted on the second surface 42, the protruding portion of the heat-conducting structure 50 can be inserted into the magnetic core 321 and contact and connect with the winding 322.

[0159] Alternatively, in some examples, the end face of the heat-conducting structure 50 that connects to the winding 322 can be recessed into the second surface 42. Along the thickness direction (z-direction), the distance from the end face of the heat-conducting structure 50 that connects to the winding 322 to the first surface 41 can be less than the distance from the second surface 42 to the first surface 41. One end of the winding 322 can protrude from the second end face 3212 of the magnetic core 321. When the magnetic core 321 is assembled on the second surface 42, the protruding portion of the winding 322 can be correspondingly inserted into the recessed structure formed by the heat-conducting structure 50 and the second surface 42, achieving contact connection between the winding 322 and the heat-conducting structure 50.

[0160] In some examples, the end of the thermally conductive structure 50 that connects to the heating device 31 can extend to the first surface 41 of the first circuit board 40. For instance, the end face of the thermally conductive structure 50 that connects to the heating device 31 can be flush with the first surface 41. Along the thickness direction (z-direction), the distance from the end face of the thermally conductive structure 50 that connects to the heating device 31 to the second surface 42 can be approximately equal to the distance from the first surface 41 to the second surface 42. When the heating device 31 is mounted on the first surface 41, the heating device 31 can contact and connect with the thermally conductive structure 50.

[0161] Alternatively, the end face of the heat-conducting structure 50 that connects to the heating device 31 can protrude from the first surface 41. Along the thickness direction (z-direction), the distance from the end face of the heat-conducting structure 50 that connects to the heating device 31 to the second surface 42 can be greater than the distance from the first surface 41 to the second surface 42. When the heating device 31 is fixed to the first circuit board 40, the heating device 31 can make contact with the protruding portion of the heat-conducting structure 50.

[0162] Alternatively, the end face of the heat-conducting structure 50 that connects to the heating device 31 can be recessed into the first surface 41. Along the thickness direction (z-direction), the distance from the end face of the heat-conducting structure 50 that connects to the heating device 31 to the second surface 42 can be less than the distance from the first surface 41 to the second surface 42. For example, the heating device 31 may have a protruding heat-conducting component on the side facing the first surface 41. When the heating device 31 is fixed to the first surface 41, this heat-conducting component can be inserted into the recessed structure formed by the heat-conducting structure 50 and the first surface 41, and contact and connect with the heat-conducting structure 50.

[0163] In the example where the winding 322 does not include the extension structure 3223, the winding 322 may include the main structure 3221 and the heat dissipation structure 3222 described above; or, the winding 322 may include only the main structure 3221.

[0164] For example, such as Figure 8 The single board 100 shown includes a winding 322 comprising a main structure 3221 and a heat dissipation structure 3222, with a heat-conducting structure 50 disposed within the through hole 43. The heat dissipation structure 3222 may include the aforementioned plurality of heat dissipation teeth 3222a.

[0165] Figure 9 This is a cross-sectional structural diagram of another single-board provided in an embodiment of this application.

[0166] Or, in some examples, such as Figure 9 As shown, the heat dissipation structure 3222 may include the heat dissipation plate 3222b described above. At least a portion of the heat dissipation plate 3222b may extend to the second end face 3212 of the magnetic core 321. For example, along the thickness direction (z direction), at least a portion of the heat dissipation plate 3222b may protrude from the second end face 3212 of the magnetic core 321.

[0167] The vertical projection of the heat sink 3222b on the second end face 3212 can be larger than the vertical projection of the main structure 3221 on the second end face 3212, ensuring that the heat sink 3222b can achieve good heat dissipation performance.

[0168] In some examples, the vertical projection of the heat sink 3222b onto the second end face 3212 can cover only a portion of the second end face 3212, which helps to reduce costs while ensuring good heat dissipation.

[0169] Alternatively, in some examples, the vertical projection of the heat sink 3222b onto the second end face 3212 can completely cover the second end face 3212, giving the heat sink 3222b a larger area and achieving better heat dissipation.

[0170] The following example illustrates the layout of the through hole 43 and the heat-conducting structure 50, excluding the extension structure 3223 of the winding 322. The layout of the heat-conducting structure 50 and the through hole 43 can be referenced in the example where the extension structure 3223 of the winding 322 forms the heat-conducting structure 50.

[0171] In this embodiment of the application, the shape and size of the through hole 43 are not limited. For example, the outer contour shape of the through hole 43 can be a regular or irregular shape such as a circle, an ellipse, a square, or a trapezoid.

[0172] Figure 10 This is a front view structural diagram of the first surface of a first circuit board in a single board, provided as an embodiment of this application.

[0173] See in some examples Figure 10 As shown, the number of through holes 43 on the first circuit board 40 can be multiple, and the multiple through holes 43 can be arranged at intervals. A heat-conducting structure 50 can be provided within each through hole 43. It should be noted that... Figure 10 The dashed box shown can be the vertical projection area of ​​one end of the winding 322 (such as the main structure 3221) on the first circuit board 40. For example, the vertical projection of one end of the winding 322 on the first circuit board 40 can completely cover the heat-conducting structure 50.

[0174] Of course, in some other examples, the vertical projection of one end of the winding 322 onto the first circuit board 40 may only cover part of the heat-conducting structure 50.

[0175] In this embodiment, the arrangement of the multiple through holes 43 is not limited. For example, the multiple through holes 43 can be arranged in a horizontal and vertical array to form multiple rows and columns. Of course, in some other examples, the multiple through holes 43 can be distributed in other regular or irregular ways.

[0176] The first surface 41 of the first circuit board 40 may also have a first electrical connector 70. For example, the first electrical connector 70 may be an electrical connection pin, a conductive via (or conductive through-hole), a buried copper structure, etc. The heating device may be disposed on the first surface 41 and electrically connected to the first circuit board 40 through the first electrical connector 70, thereby enabling the heating device to be electrically connected to the magnetic element 32, etc., through the first circuit board 40.

[0177] In some examples, the thermally conductive structure 50 can be a conductive structure. For example, in examples where the molding material of the thermally conductive structure includes metal materials such as copper and aluminum, the thermally conductive structure 50 can achieve electrical conductivity, allowing the heating device 31 to be electrically connected to the magnetic element 32 through the thermally conductive structure 50 (see reference). Figure 9 (As shown).

[0178] In some examples, along the radial direction of each through hole 43, the heat-conducting structure 50 may only fill a portion of each through hole 43; for example, the heat-conducting structure 50 may be arranged around the inner wall of the through hole 43 (see reference). Figure 5 As shown, the heat-conducting structure 50 can be a metal plating layer formed on the inner wall of the through hole 43, so that the outer contour shape of the heat-conducting structure 50 can be annular, and the through hole 43 with the heat-conducting structure 50 can be a conductive via on the first circuit board 40. This ensures good heat dissipation for the functional module in high power consumption and high power density scenarios, has good general applicability, is easy to implement, and helps reduce costs.

[0179] Of course, in the example where the heat-conducting structure 50 only fills a portion of each through hole 43 in the radial direction, the outer contour shape of the heat-conducting structure 50 can also be other shapes, such as discontinuous rings, squares, cylinders, trapezoids, and other regular or irregular shapes.

[0180] In some examples, see further. Figure 10 As shown, along the radial direction of each through hole 43, the heat-conducting structure 50 can also fill the entire area of ​​each through hole 43. The outer contour shape of the heat-conducting structure 50 can match the shape of the through hole 43. This can increase the volume of the heat-conducting structure 50, reduce the thermal resistance between the heat-generating device and the winding, improve the heat conduction effect, and thus help improve the heat dissipation capacity of the heat-generating device.

[0181] Alternatively, in some examples, the number of through holes 43 on the first circuit board 40 can be one. Along the radial direction of the through hole 43, the heat-conducting structure 50 can fill the entire area of ​​the through hole 43. The heat-conducting structure 50 can be a single metal block, such as a cylindrical copper block, and its outer contour shape can match the shape of the through hole 43. Compared to opening multiple through holes 43 at intervals, this method allows for the formation of a larger through hole 43 within a limited space, effectively increasing the volume of the heat-conducting structure 50, which is more conducive to reducing thermal resistance, improving heat conduction, and achieving higher heat dissipation performance.

[0182] Of course, in an example where there is only one through hole 43, the heat-conducting structure 50 may fill only a portion of the through hole 43 along the radial direction of the through hole 43.

[0183] In this embodiment of the application, taking the functional module as a three-stage power supply module, the first circuit board as the main circuit board of a single board, and the chip as being disposed on the second surface of the first circuit board, an example is given to illustrate the thermal resistance of the heat-generating device through the heat-conducting structure to achieve heat dissipation.

[0184] For example, the first circuit board 40 can be a 16-layer board, the thickness of the first circuit board 40 can be 2.4 mm, the area of ​​the through holes 43 on the first circuit board 40 can be 5 mm × 1.4 mm, and the inner diameter of each through hole 43 can be 8 mil. The thermal conductive structure 50 can fill only a portion of each through hole 43, for example, the wall thickness of the annular thermal conductive structure 50 can be 1 oz, and the thermal conductivity of each thermal conductive structure 50 can be 222.33 W / mC. The spacing between two adjacent through holes 43 can be 0.6 mm, and the number of through holes 43 can be 18, such as according to... Figure 10 The array is arranged in a 2-column, 9-row configuration, and the equivalent thermal conductivity of the internal heat-conducting structure 50 with multiple through holes 43 can be 18.51 W / mC.

[0185] The equivalent thermal resistance of the heat-conducting structure 50 within the multiple through holes 43 is approximately 20.964 W / ℃, while the thermal resistance of the superimposed first circuit board 40 is approximately 1.5 W / ℃. The heat from the heat-generating devices located on the first surface 41 of the first circuit board is conducted to the main structure of the winding 322 through the heat-conducting structure 50, resulting in an equivalent thermal resistance of approximately 22.464 W / ℃. Compared to the tertiary power supply modules in the related technologies described above, this is roughly equivalent to the equivalent thermal resistance achieved by placing a heat sink on the integrated drive switch. This ensures good heat dissipation for the power supply module while improving its power density and power consumption.

[0186] The above example only illustrates the scenario where the first circuit board 40 has 18 through holes 43, and the thermally conductive structure 50 only fills a portion of each through hole 43, demonstrating the equivalent thermal resistance at which the heat-generating device dissipates heat through the thermally conductive structure 50. It is understandable that by designing the layout of the through holes 43 and the thermally conductive structure 50—for example, increasing the number of through holes 43, increasing the area of ​​the through holes 43, or increasing the filling volume of the thermally conductive structure 50 within the through holes 43—the thermal conductivity of the thermally conductive structure 50 for the heat-generating device can be improved, the equivalent thermal resistance reduced, and the heat dissipation capacity of the power module enhanced, enabling the power module to achieve better heat dissipation.

[0187] In this embodiment, the above-mentioned functional module can serve as a tertiary power supply module, which can meet the high heat dissipation performance requirements of the tertiary power supply module under high power density and high power consumption design.

[0188] For example, the first circuit board can be the main circuit board of a single board, and the chips of the single board can be disposed on the first circuit board. The heating device 31 and the magnetic core 321 are respectively disposed on the first surface 41 and the second surface 42 of the main circuit board (first circuit board 40) (see reference). Figure 8 and Figure 9 As shown, the winding 322 is thermally connected to the heating device 31 through the heat-conducting structure 50 on the first circuit board 40, and part of the winding 322 is exposed on the outer side 321a of the magnetic core 321.

[0189] Taking the winding 322 as including a heat dissipation structure 3222 and a main structure 3221, and adding a heat-conducting structure 50 inside the through hole 43 of the first circuit board 40 as an example, the heat dissipation structure 3222 may include multiple heat dissipation teeth 3222a (such as...). Figure 8 (as shown), or, the heat dissipation structure 3222 may include a heat sink 3222b (as shown). Figure 9 (As shown). The number of through holes on the first circuit board 40 can be one or more, and the thermally conductive structure 50 can fill part or all of the area of ​​each through hole.

[0190] Compared to the three-stage power module 200 described above, this design fully utilizes the space on the first surface 41 (B-side) and the second surface 42 (T-side) of the main circuit board (first circuit board 40), saving space occupied by the heat-generating device 31 on the second surface 42. This allows the magnetic element 32 on the second surface 42 to have a larger layout area and board area, improving the power density and power consumption of the power module. Furthermore, the winding 322 of the magnetic element 32 is used to dissipate heat from the heat-generating device 31, eliminating the need for an additional heat sink and achieving excellent heat dissipation. This also helps to further save board space and facilitates high power density and high power consumption design.

[0191] Figure 11 This is a cross-sectional structural diagram of another single-board provided in an embodiment of this application.

[0192] This functional module can also serve as a secondary power supply module, meeting the high heat dissipation performance requirements of secondary power supply modules under high power density and high power consumption designs.

[0193] For example, see Figure 11 As shown, the single board 100 may also include a second circuit board 60, which may be a printed circuit board or the main circuit board 10 of the single board 100.

[0194] Functional module 30, heat-conducting structure 50, etc., are disposed on the first circuit board 40. In some examples, functional module 30 may also include other electronic components to meet the functional requirements of functional module 30. For example Figure 11As shown, the functional module 30 may also include a capacitor 33, which may be disposed on the first circuit board 40. For example, the capacitor 33 may be disposed on the second surface 42 of the first circuit board 40, and the capacitor 33 and the magnetic core 321 may be disposed on the same side of the first circuit board 40.

[0195] Of course, in some other examples, capacitor 33 can also be disposed on the first surface 41 of the first circuit board 40, and capacitor 33 and heating device 31 can be disposed on the same side of the first circuit board 40.

[0196] The chip (not shown in the figure) and the first circuit board 40 can be respectively disposed on the second circuit board 60. The first circuit board 40, the functional module 30, the heat-conducting structure 50 and the capacitor 33 can be a module structure, and the module structure can be disposed together on the second circuit board 60 through the first circuit board 40.

[0197] For example, the second circuit board 60 may include a third surface 61 and a fourth surface 62 that are opposite to each other. For instance, the second circuit board 60 may include a third surface 61 and a fourth surface 62 that are opposite to each other in the thickness direction (z direction), that is, along the thickness direction (z direction), the third surface 61 and the fourth surface 62 may be located on opposite sides of the second circuit board 60. The third surface 61 may serve as the top surface (T-surface) of the second circuit board 60, and the fourth surface 62 may serve as the bottom surface (B-surface) of the second circuit board 60.

[0198] The modular structure, consisting of a first circuit board 40, a functional module 30, and a heat-conducting structure 50, can be disposed on the third surface 61 of the second circuit board 60. The first circuit board 40 can be fixed to the second circuit board 60. The first surface 41 (B-side) of the first circuit board 40 can be closer to the third surface 61 of the second circuit board 60, allowing the first surface 41 and the third surface 61 to be positioned relative to each other. The second surface 42 (T-side) of the first circuit board 40 can be further away from the third surface 61 of the second circuit board 60, and the second surface 42 can be located on the side of the first circuit board 40 facing away from the second circuit board 60.

[0199] The first circuit board 40 can be electrically connected to the second circuit board 60, thereby enabling the functional module 30, capacitor 33 and other electronic devices to be electrically connected to the second circuit board 60 (main circuit board).

[0200] The chip can also be disposed on the third surface 61 of the second circuit board 60. The chip can be electrically connected to the second circuit board 60, so that the chip can be electrically connected to the functional module 30 on the first circuit board 40 through the second circuit board 60 to meet the power supply requirements of the chip.

[0201] For example, such as Figure 11As shown, a second electrical connector 80 may be provided on the first surface 41 of the first circuit board 40. For example, the second electrical connector 80 may be an electrical connection pin. The second circuit board 60 may also be provided with electrical connectors such as electrical connection pins. When the entire module structure is set on the second circuit board 60 through the first circuit board 40, it can be fixed and electrically connected to the electrical connection pins on the second circuit board 60 through the electrical connection pins, thereby realizing electrical conduction between the first circuit board 40 and the second circuit board 60.

[0202] Figure 12 for Figure 11 A cross-sectional structural diagram of the assembly of the first circuit board and functional modules in a single-board unit. Figure 13 This is a cross-sectional structural diagram of the assembly of a first circuit board and functional modules in another single board provided in an embodiment of this application.

[0203] See Figure 12 As shown, taking the winding 322, which includes a heat dissipation structure 3222 and a main structure 3221, as an example, a heat-conducting structure 50 is added inside the through hole of the first circuit board 40. The heat dissipation structure 3222 may include a heat sink 3222b. Alternatively, see [link to relevant documentation]. Figure 13 As shown, the heat dissipation structure 3222 may also include multiple heat dissipation teeth 3222a. The number of through holes on the first circuit board 40 may be single or multiple, and the heat conduction structure 50 may fill part or all of the area of ​​each through hole.

[0204] Compared to the secondary power supply modules described above, this design fully utilizes the space on the first surface 41 of the first circuit board 40, allowing the magnetic components 32, such as inductors, on the second surface 42 to have a larger layout area and board area. Furthermore, by distributing the heat-generating devices 31 and magnetic cores 321 with significant height differences on both sides of the first circuit board 40, the magnetic components 32 can occupy a larger space in the thickness direction (z-direction), increasing the overall volume of the magnetic components 32 (magnetic cores 321) and significantly improving the power density and power consumption of the power module. The use of windings 322 with higher thermal conductivity and the heat-conducting structure 50 to conduct heat to the heat-generating devices 31, compared to the use of the main circuit board in related technologies, reduces heat concentration on the main circuit board and results in lower thermal resistance, effectively improving the heat dissipation capacity of the heat-generating devices 31 and the power module.

[0205] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0206] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A single board (100), characterized in that, include: A first circuit board (40) includes a first surface (41) and a second surface (42) facing away from each other, and a through hole (43) is provided on the first circuit board (40) through the first surface (41) and the second surface (42); A heat-conducting structure (50) is disposed within the through hole (43); Functional module (30), the functional module (30) includes a magnetic element (32) and a heating device (31), the heating device (31) being disposed on the first surface (41); The magnetic core (321) of the magnetic element (32) includes a first end face (3211) and an outer side face (321a). The magnetic core (321) is disposed on the second surface (42). The first end face (3211) is adjacent to and opposite to the second surface (42). The outer side face (321a) is located on the side of the first end face (3211) away from the second surface (42). The winding (322) of the magnetic element (32) is at least partially inserted inside the magnetic core (321). The winding (322) is connected to the heating device (31) through the heat-conducting structure (50). A portion of the winding (322) extends to and is exposed on the outer side (321a) of the magnetic core (321).

2. The single board (100) according to claim 1, characterized in that, The outer surface (321a) of the magnetic core (321) includes a second end face (3212), which is opposite to the first end face (3211). One end of the winding (322) is connected to the heat-conducting structure (50), and the other end of the winding (322) extends to and is exposed on the second end face (3212).

3. The single board (100) according to claim 2, characterized in that, The winding (322) includes a main structure (3221) and a heat dissipation structure (3222). The main structure (3221) is inserted inside the magnetic core (321), and one end of the main structure (3221) is connected to the heat-conducting structure (50). The heat dissipation structure (3222) is disposed on the main structure (3221) at one end away from the heat conduction structure (50), and at least part of the heat dissipation structure (3222) is exposed on the second end face (3212).

4. The single board (100) according to claim 3, characterized in that, The heat dissipation structure (3222) includes a plurality of heat dissipation teeth (3222a), which are spaced apart. One end of each heat dissipation tooth (3222a) is connected to the main body structure (3221), and the other end of each heat dissipation tooth (3222a) extends away from the main body structure (322a).

5. The single board (100) according to claim 3, characterized in that, The heat dissipation structure (3222) includes a heat dissipation plate (3222b), and the vertical projection of the heat dissipation plate (3222b) on the second end face (3212) is greater than the vertical projection of the main structure (3221) on the second end face (3212).

6. The single board (100) according to claim 5, characterized in that, The vertical projection of the heat sink (3222b) onto the second end face (3212) completely covers the second end face (3212).

7. The single board (100) according to any one of claims 1-6, characterized in that, One end of the winding (322) extends to the first end face (3211) side of the magnetic core (321), and the vertical projection of one end of the winding (322) on the first circuit board (40) at least partially overlaps with the heat-conducting structure (50).

8. The single board (100) according to any one of claims 1-6, characterized in that, The winding (322) further includes an extension structure (3223), which is disposed at one end of the main structure (3221) of the winding (322) adjacent to the first circuit board (40); The extension structure (3223) passes through the through hole (43) and extends to the side of the first surface (41), and the extension structure (3223) forms the heat-conducting structure (50).

9. The single board (100) according to any one of claims 1-8, characterized in that, The number of the through holes (43) is multiple, and each of the through holes (43) is provided with the heat-conducting structure (50); Along the radial direction of each of the through holes (43), the heat-conducting structure (50) fills a portion of each of the through holes (43), and the heat-conducting structure (50) is disposed around the inner sidewall of the through hole (43); Alternatively, the heat-conducting structure (50) fills the entire area of ​​each of the through holes (43) along the radial direction of each through hole (43).

10. The single board (100) according to any one of claims 1-8, characterized in that, The number of the through hole (43) is one, and the heat-conducting structure (50) fills the entire area of ​​the through hole (43) along the radial direction of the through hole (43).

11. The single board (100) according to any one of claims 1-10, characterized in that, The heat-conducting structure (50) includes a metal plating covering the inner wall of the through hole (43); and / or, the heat-conducting structure (50) includes a metal block filling the through hole (43).

12. The single board (100) according to any one of claims 1-11, characterized in that, It also includes a chip (20) disposed on the second surface (42) and electrically connected to the functional module (30).

13. The single board (100) according to any one of claims 1-11, characterized in that, It also includes a chip (20) and a second circuit board (60), wherein the chip (20) is disposed on a third surface (61) of the second circuit board (60) and is electrically connected to the second circuit board (60); The first circuit board (40) is disposed on the third surface (61) and electrically connected to the second circuit board (60). The first surface (41) is adjacent to and opposite to the third surface (61). The functional module (30) and the chip (20) are electrically connected through the first circuit board (40) and the second circuit board (60).

14. The single board (100) according to any one of claims 1-13, characterized in that, The magnetic element (32) includes a transformer and / or an inductor; The heating device (31) includes at least one of a switching transistor, an integrated drive switching transistor, or a controller.

15. An electronic device, characterized in that, It includes a housing and a single panel (100) as described in any one of claims 1-14, wherein the single panel (100) is at least partially disposed within the housing.

16. The electronic device according to claim 15, characterized in that, It also includes a heat dissipation device located inside the housing, the heat dissipation device being disposed on the housing, or the heat dissipation device being disposed on the heat dissipation plate (3222b) of the single board (100).

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