A pin adjustment device for integrated circuit manufacturing
By designing a pin adjustment device, which utilizes magnetic attraction and a rubber plate to provide constant pressure and buffer protection, the problem of uneven force during pin shaping is solved, thereby improving the pin's lifespan and shaping quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUANGSHI KEJIA ELECTRONIC CO LTD
- Filing Date
- 2026-04-10
- Publication Date
- 2026-07-21
AI Technical Summary
Existing pin adjustment devices are prone to uneven force on the pins during the shaping process, causing internal stress damage, shortening the pin lifespan and making them more susceptible to breakage.
A pin adjustment device is designed, which includes a mounting bracket, a support plate, a constant pressure component, and a shaping fixture. It provides constant pressure and buffer protection through magnetic attraction and a rubber plate, and combines negative pressure adsorption fixation to ensure uniform force on the pins.
It effectively protects the pins during the shaping process, reduces damage caused by rigid pressing, and improves the pin lifespan and shaping quality.
Smart Images
Figure CN122425142A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of integrated circuit manufacturing technology, and in particular to a pin adjustment device for integrated circuit manufacturing. Background Technology
[0002] Integrated circuits (ICs) are miniature electronic devices or components that integrate the necessary circuit components and interconnects onto a semiconductor wafer or substrate using specific processes. After packaging, multiple sets of pins extend from the outside, which are used to solder to the motherboard or circuit board for installation. Therefore, specialized pin adjustment devices are required. Since the pins are located on the outside of the IC and are in a flat state, the adjustment device is needed to bend the pins so that one end of the pin is vertically downward and soldered to the motherboard or circuit board. In order to avoid rigid pressure damage to the IC by the shaping tool pressing the pins, the existing pin adjustment devices often use a slot clearance method in the space directly above the IC body. That is, the shaping tool only presses the part that contacts the pin, thus creating a misalignment with the IC body to protect the IC body. However, this design is not conducive to the shaping and protection of the pins. Compared with the IC body, the pins are more likely to break if the force is uneven. The slot clearance design of the existing shaping device will generate uneven pressure on the pins, which will easily cause internal stress damage to the pins, resulting in problems such as reduced pin life and breakage. This needs to be solved urgently. Summary of the Invention
[0003] This application proposes a pin adjustment device for integrated circuit manufacturing, which has the advantages of protecting pins and providing good buffering effect, thereby solving the problems in the prior art.
[0004] To achieve the above objectives, this application adopts the following technical solution: a pin adjustment device for integrated circuit manufacturing, comprising: The mounting frame has a telescopic rod installed at its top. A fixing plate is installed at the telescopic end of the telescopic rod. Two sets of shaping clamps are fixedly installed at the bottom of the fixing plate. A shaping groove is opened on the inner side of the shaping clamp. A support plate is slidably mounted in the middle of the mounting frame. A placement frame and a support block are fixedly mounted on the top of the support plate. A workpiece is placed inside the placement frame, and a pump is connected to the bottom of the support block. A constant pressure assembly includes multiple sets of connecting columns fitted inside a fixed plate. A pressure plate is fixedly connected to the bottom of each connecting column. Limiting strips are fixedly connected to the left and right sides of the bottom of the pressure plate. Multiple limiting grooves are opened at the bottom of each limiting strip. Connecting plates are fixedly connected to the front and rear sides of the pressure plate. A magnet is installed at the bottom of each connecting plate. Two sets of magnets are installed on the outside of the placement frame. This redesigned device effectively protects the workpiece during pin shaping, offering excellent cushioning. To achieve this, the device incorporates a support block embedded within a placement frame, positioning the workpiece on top of the support block. A rubber plate on top of the support block provides cushioning. The outer top of the placement frame features an arc that perfectly matches the bending curvature of the workpiece's outer pins during shaping. In addition to shaping fixtures on both sides of the bottom of the fixed plate for pressing the outer pins, a constant pressure assembly provides cushioned fixation of the workpiece. This constant pressure assembly is supported by a connecting column in a limiting hole on the top of the fixed plate. When the fixed plate moves the constant pressure assembly downwards, the constant magnetic force generated by magnets two and one pulls the entire pressure plate downwards, pressing down on the top of the workpiece. Rubber pads and plates provide cushioning protection for the workpiece surface, while the top of the support block provides rigid support. Because the pressure force exerted by the pressure plate on the workpiece is constant, the damage caused by rigid pressing is significantly reduced when the workpiece is assisted in being fixed.
[0005] Then, the device is also equipped with a pump located at the bottom of the support plate, which works in conjunction with the support block to achieve negative pressure adsorption and fixation of the workpiece. When the workpiece is pressed by the constant pressure component, the pressure it receives can be applied downward to the support block through the placement groove. While providing buffer protection for the workpiece, it also presses the rubber plate to deform it and forms a seal between the workpiece and the rubber plate. After the pump is turned on, it can form negative pressure adsorption and fixation of the workpiece through the inner cavity and the port of the support block, without relying solely on the fixing effect of the constant pressure component, which has high reliability.
[0006] Finally, this device utilizes a shaping fixture with a shaping groove on its inner side in conjunction with a constant pressure component to solve the problem of uneven force on the workpiece pins caused by the empty groove at the top of the workpiece when the shaping fixture is pressing down on the workpiece pins for shaping work. This results in a shortened service life and easy breakage. The sequential movement of the pressure plate and the shaping fixture ensures that the workpiece pins are subjected to reasonable force, effectively improving the shaping quality of the device.
[0007] Preferably, the mounting frame consists of a bottom plate at the bottom, a top plate at the top, and multiple sets of guide columns connecting the bottom plate and the top plate. The support plate is slidably mounted on the outer surface of the guide columns, and a movable plate is slidably mounted on the top of the outer surface of the guide columns. The fixed plate is fixedly mounted inside the movable plate. like Figure 1 As shown, the mounting frame consists of a base plate, guide columns, and a top plate. It serves as a support component for the entire device, providing guidance and support for the support plate, moving plate, and fixed plate.
[0008] Preferably, a spring is movably sleeved on the outer surface of the guide post, and the two ends of the spring are elastically connected to the support plate and the base plate respectively. Two sets of limiting posts are fixedly installed on the top of the floor. like Figure 1 As shown, the spring is sleeved on the outer surface of the guide post and is responsible for providing elastic support for the support plate. When the telescopic rod drives the fixed plate to apply pressure to the workpiece and the support plate, the support plate provides buffer by moving downward and compressing the spring, so as to avoid damage to the workpiece and the workpiece pins without buffer distance after being subjected to the pressing force.
[0009] Preferably, the two sets of shaping fixtures are symmetrically distributed on both sides of the bottom of the fixing plate, and the curvature of the top of the outer side of the placement frame is consistent with the curvature of the top of the shaping groove. like Figure 1 As shown, the shaping groove on the inner side of the shaping fixture is adapted to the outer side of the top of the placement frame, so as to press and shape the pins of the workpiece during the downward movement.
[0010] Preferably, the top of the connecting column is provided with a protrusion, and the top of the fixing plate is provided with multiple sets of limiting holes extending downward to the bottom, and the protrusion of the connecting column is fitted into the limiting holes. like Figure 5 As shown, the protrusion at the top of the connecting column cooperates with the limiting hole to ensure that the entire constant pressure assembly only receives the limiting support force from the fixed plate, and does not receive the synchronous pressing force from the fixed plate. The pressure of the constant pressure assembly is generated by the mutual magnetic attraction between magnet 2 and magnet 1, which is not only constant but also stable.
[0011] Preferably, the first magnet and the second magnet are arranged vertically aligned, and the first magnet and the second magnet exhibit a tendency to attract each other due to their opposite polarities; like Figure 2 As shown, magnet one and magnet two are arranged vertically. This design allows the connecting plate of magnet one and magnet two to attract each other magnetically after moving downwards.
[0012] Preferably, the top of the support block is provided with a placement groove, and a rubber plate is glued inside the placement groove. The bottom of the workpiece abuts against the top of the support block and the rubber plate. The top of the rubber plate and the support block are provided with multiple sets of overlapping openings. like Figure 5 and Figure 7 As shown, the rubber sheet is located in the placement groove, which can provide flexible support and cushioning for the bottom of the workpiece, and the top outer side of the support block can also provide rigid support for the workpiece, keeping the installation height of the workpiece unchanged.
[0013] Preferably, the number of limiting grooves is the same as the number of pins on the outside of the workpiece, and the limiting grooves and the pins on the outside of the workpiece are interlocked and engaged with each other. like Figure 3 and Figure 4 As shown, each set of limiting grooves can be locked onto the pins of a set of workpieces, and the limiting strip abuts against the pins of the workpieces to fix the pins, which facilitates subsequent pressing, bending and shaping.
[0014] The beneficial effects of this invention are as follows: 1. This device has been redesigned to effectively protect the workpiece body during the pin shaping process, offering excellent cushioning. To achieve this, the device incorporates a support block embedded within a placement frame, positioning the workpiece on top of the support block. A rubber plate on top of the support block provides cushioning. The outer top of the placement frame has an arc that perfectly matches the bending curvature of the workpiece's outer pins during shaping. In addition to the shaping fixtures located on both sides of the bottom of the fixed plate for shaping and pressing the outer pins of the workpiece, the device also features a constant pressure assembly for cushioned fixation of the workpiece. The constant pressure assembly is supported by a connecting column in a limiting hole on the top of the fixed plate. When the fixed plate moves the constant pressure assembly downwards, the constant magnetic attraction generated by magnets two and one pulls the entire pressure plate downwards, pressing down on the top of the workpiece. The rubber pad and rubber plate provide cushioning protection for the workpiece surface, while the top of the support block provides rigid support for the workpiece. Because the pressure force provided by the pressure plate is constant, the workpiece is significantly less susceptible to damage from rigid pressing when assisted in its fixation.
[0015] 2. Furthermore, this device is equipped with a pump located at the bottom of the support plate, which works in conjunction with the support block to achieve negative pressure adsorption and fixation of the workpiece. When the workpiece is pressed by the constant pressure component, the pressure it receives can be applied downwards to the support block through the placement groove. While providing buffer protection for the workpiece, it also presses the rubber plate to deform it and forms a seal between the workpiece and the rubber plate. After the pump is turned on, it can form negative pressure adsorption and fixation of the workpiece through the inner cavity and the port of the support block, without relying solely on the fixing effect of the constant pressure component, thus ensuring high reliability.
[0016] 3. Finally, this device utilizes a shaping fixture with a shaping groove on its inner side in conjunction with a constant pressure component to solve the problem of uneven force on the workpiece pins caused by the empty groove at the top of the workpiece when the shaping fixture is pressing down on the workpiece pins for shaping work. This results in a shortened service life and easy breakage. The sequential movement of the pressure plate and the shaping fixture ensures that the workpiece pins are subjected to reasonable force, effectively improving the shaping quality of the device. Attached Figure Description
[0017] The accompanying drawings, which form part of this specification, illustrate embodiments disclosed in this application and, together with the specification, serve to explain the principles of this application in a clear and understandable manner.
[0018] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein: Figure 1 This is a front view diagram of the overall structure of the present invention; Figure 2 This is a side view of the overall structure of the present invention; Figure 3 This is a schematic diagram showing the separation of the constant voltage component of the present invention; Figure 4 This is a schematic diagram showing the separation of the support plate, pump, placement frame, magnet II, and workpiece of the present invention; Figure 5 This is a front sectional view of the overall structure of the present invention; Figure 6 For the present invention Figure 5 Enlarged schematic diagram of the structure at point A; Figure 7 For the present invention Figure 5 Enlarged schematic diagram of the structure at point B; Figure 8 This is a frontal perspective view of the overall structure of the present invention.
[0019] The components are: 1. Mounting frame; 2. Telescopic rod; 3. Moving plate; 4. Fixed plate; 5. Connecting column; 6. Pressure plate; 7. Rubber pad; 8. Connecting plate; 9. Magnet one; 10. Limiting strip; 11. Shaping fixture; 12. Shaping groove; 13. Limiting column; 14. Support plate; 15. Pump; 16. Placement frame; 17. Magnet two; 18. Workpiece; 19. Limiting groove; 20. Limiting hole; 21. Spring; 22. Support block; 23. Placement groove; 24. Rubber plate; 25. Through port. Detailed Implementation
[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0021] Please see Figures 1-8 This embodiment discloses a pin adjustment device for integrated circuit manufacturing, comprising: Mounting frame 1, with a telescopic rod 2 installed at the top of its upper end, a fixing plate 4 installed at the telescopic end of the telescopic rod 2, and two sets of shaping clamps 11 fixedly installed at the bottom of the fixing plate 4, with shaping grooves 12 opened on the inner side of the shaping clamps 11. The support plate 14 is slidably installed in the middle of the mounting frame 1. The top of the support plate 14 is fixedly installed with a placement frame 16 and a support block 22. The workpiece 18 is placed inside the placement frame 16, and the bottom of the support block 22 is connected to and installed with a pump 15. The constant pressure assembly includes multiple sets of connecting columns 5 sleeved inside the fixed plate 4. The bottom end of the connecting column 5 is fixedly connected to the pressure plate 6. Limiting strips 10 are fixedly connected to the left and right sides of the bottom of the pressure plate 6. Multiple limiting grooves 19 are opened at the bottom of the limiting strips 10. Connecting plates 8 are fixedly connected to the front and rear sides of the pressure plate 6. Magnet 9 is installed at the bottom of the connecting plate 8. Two sets of magnets 17 are installed on the outside of the placement frame 16. This device has been redesigned to effectively protect the workpiece 18 during the pin shaping process, offering excellent cushioning. To achieve this, the device includes a placement frame 16 with an embedded support block 22, positioning the workpiece 18 on top of the support block 22. A rubber plate 24 on top of the support block 22 provides cushioning. The outer top of the placement frame 16 has an arc that perfectly matches the bending curvature of the outer pins of the workpiece 18 during shaping. In addition to the shaping fixtures 11 located on both sides of the bottom of the fixing plate 4 for shaping and pressing the outer pins of the workpiece 18, this device also includes a constant pressure assembly. To achieve buffered fixation of workpiece 18, the constant pressure assembly is supported by the limiting hole 20 opened on the top of the fixing plate 4 through the limiting sleeve of the connecting column 5. When the fixing plate 4 drives the constant pressure assembly to move downward, the constant magnetic attraction force generated by the second magnet 17 and the first magnet 9 will drive the pressure plate 6 downward as a whole and press the top of workpiece 18. The rubber pad 7 and the rubber plate 24 provide buffer protection for the surface of workpiece 18, and the top of the support block 22 provides rigid support for workpiece 18. Since the pressing force provided by the pressure plate 6 on workpiece 18 is constant, the damage caused by rigid pressing can be significantly reduced when workpiece 18 is assistedly fixed.
[0022] Then, the device is also equipped with a pump 15 located at the bottom of the support plate 14, which works in conjunction with the support block 22 to achieve negative pressure adsorption and fixation of the workpiece 18. When the workpiece 18 is pressed by the constant pressure component, the pressure it receives can be applied downward to the support block 22 through the placement groove 23. While providing buffer protection for the workpiece 18, it also presses the rubber plate 24 to deform it and forms a seal between the workpiece 18 and the rubber plate 24. After the pump 15 is turned on, it can form negative pressure adsorption and fixation of the workpiece 18 through the inner cavity of the support block 22 and the through port 25, without relying solely on the fixing effect of the constant pressure component on the workpiece 18, thus ensuring high reliability.
[0023] Finally, this device utilizes the shaping fixture 11 with a shaping groove 12 on its inner side to cooperate with the constant pressure component, which solves the problem of shortened service life and easy breakage caused by uneven force on the pins of the workpiece 18 due to the empty groove at the top of the workpiece 18 when the shaping fixture 11 presses down on the pins of the workpiece 18 for shaping work. The sequential movement of the pressure plate 6 and the shaping fixture 11 ensures that the pins of the workpiece 18 are subjected to reasonable force, effectively improving the shaping quality of the device.
[0024] In this embodiment, the mounting frame 1 consists of a bottom plate at the bottom, a top plate at the top, and multiple sets of guide columns connecting the bottom plate and the top plate. The support plate 14 is slidably mounted on the outer surface of the guide columns. A movable plate 3 is slidably mounted on the top of the outer surface of the guide columns, and a fixed plate 4 is fixedly mounted inside the movable plate 3. like Figure 1 As shown, the mounting frame 1 consists of a base plate, guide columns and a top plate. It serves as a support component for the entire device, providing guidance and support for the support plate 14, the movable plate 3 and the fixed plate 4.
[0025] In this embodiment, a spring 21 is movably sleeved on the outer surface of the guide post, and the two ends of the spring 21 are elastically connected to the support plate 14 and the bottom plate respectively. Two sets of limiting posts 13 are fixedly installed on the top of the floor. like Figure 1 As shown, the spring 21 is sleeved on the outer surface of the guide post and is responsible for providing elastic support for the support plate 14. When the telescopic rod 2 drives the fixed plate 4 to apply pressure to the workpiece 18 and the support plate 14, the support plate 14 provides buffer by moving downward and compressing the spring 21, so as to avoid damage to the workpiece 18 and the pins of the workpiece 18 without buffer distance after being subjected to the pressing force.
[0026] In this embodiment, two sets of shaping fixtures 11 are symmetrically distributed on both sides of the bottom of the fixing plate 4, and the curvature of the top of the outer side of the placement frame 16 is consistent with the curvature of the top of the shaping groove 12. like Figure 1 As shown, the shaping groove 12 opened on the inner side of the shaping fixture 11 is adapted to the outer side of the top of the placement frame 16, so as to press and shape the pins of the workpiece 18 during the downward movement.
[0027] In this embodiment, the top of the connecting column 5 is provided with a protrusion, and the top of the fixing plate 4 is provided with multiple sets of limiting holes 20 that extend downward to the bottom. The protrusion of the connecting column 5 is fitted into the limiting hole 20. like Figure 5 As shown, the protrusion at the top of the connecting column 5 cooperates with the limiting hole 20 to ensure that the entire constant pressure assembly only receives the limiting support force from the fixed plate 4, and does not receive the synchronous pressing force from the fixed plate 4. The pressure of the constant pressure assembly is generated by the mutual magnetic attraction between the second magnet 17 and the first magnet 9, which is not only constant but also stable.
[0028] In this embodiment, magnet 9 and magnet 17 are arranged vertically aligned, and there is a tendency for opposite poles to attract each other. like Figure 2 As shown, magnet 9 and magnet 17 are arranged vertically. This design allows magnet 9 and magnet 17 to attract each other after the connecting plate 8 moves downward.
[0029] In this embodiment, a placement groove 23 is provided on the top of the support block 22, and a rubber plate 24 is glued inside the placement groove 23. The bottom of the workpiece 18 abuts against the top of the support block 22 and the top of the rubber plate 24. Multiple sets of overlapping openings 25 are provided on the top of both the rubber plate 24 and the support block 22. like Figure 5 and Figure 7 As shown, the rubber plate 24 is located in the placement groove 23, which can provide flexible support and buffer for the bottom of the workpiece 18, and the top outer side of the support block 22 can also provide rigid support for the workpiece 18, keeping the installation height of the workpiece 18 unchanged.
[0030] In this embodiment, the number of limiting grooves 19 is the same as the number of pins on the outside of the workpiece 18, and the limiting grooves 19 and the pins on the outside of the workpiece 18 are interlocked. like Figure 3 and Figure 4 As shown, each set of limiting grooves 19 can be locked onto the pins of a set of workpieces 18, and the limiting strip 10 abuts against the pins of workpieces 18 to fix the pins, which facilitates subsequent pressing, bending and shaping.
[0031] Working principle: When this device is in operation: First, activate the telescopic rod 2, which will move the fixing plate 4, the shaping groove 12, and the pressure plate 6 to their highest positions. Figure 5 As shown, the workpiece 18 is placed inside the placement frame 16. The bottom of the workpiece 18 is supported by the rubber plate 24 and the support block 22, and the outer pin of the workpiece 18 is positioned at the top outer edge of the placement frame 16. Then, the telescopic rod 2 is activated, which drives the fixed plate 4 and the moving plate 3 to move downward. Magnet 9 first approaches magnet 17 on the outside of the placement frame 16 and generates attraction. When magnet 9 and magnet 17 come into contact and are magnetically connected, the connecting plate 8, pressure plate 6 and connecting column 5 connected to magnet 9 stop moving. At this time, the fixed plate 4 drives the shaping fixture 11 to continue moving downward relative to the connecting column 5. Under the constant magnetic attraction force generated by magnet 9 and magnet 17, the pressure plate 6 drives the rubber pad 7 to press the top of the workpiece 18. The upper and lower sides of the workpiece 18 are buffered and protected by the rubber pad 7 and the rubber plate 24 respectively, and the pressure creates a seal between the workpiece 18 and the rubber plate 24. The pump 15 is activated and negative pressure is generated in the port 25 to complete the fixation of the workpiece 18. Finally, when the shaping fixture 11 descends to the height of contact with the outer pin of the workpiece 18, the pin of the workpiece 18 begins to bend downward under the action of the shaping groove 12. At this time, the placement frame 16 and the support plate 14 are subjected to force and compress the limiting post 13 downward. Finally, the limiting post 13 provides the limit. When the shaping fixture 11 moves to the lowest point, the pin of the workpiece 18 is completely pressed between the inner side of the shaping groove 12 and the outer side of the placement frame 16, and the deformation bending is completed.
[0032] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.
Claims
1. A pin adjustment device for integrated circuit manufacturing, characterized in that, include: Mounting frame (1), with a telescopic rod (2) installed at the top of its upper end. A fixing plate (4) is installed at the telescopic end of the telescopic rod (2). Two sets of shaping clamps (11) are fixedly installed at the bottom of the fixing plate (4). A shaping groove (12) is opened on the inner side of the shaping clamp (11). A support plate (14) is slidably mounted in the middle of the mounting frame (1). A placement frame (16) and a support block (22) are fixedly mounted on the top of the support plate (14). A workpiece (18) is placed inside the placement frame (16). A pump (15) is connected to the bottom of the support block (22). The constant pressure assembly includes multiple sets of connecting columns (5) sleeved inside the fixed plate (4). The bottom end of the connecting column (5) is fixedly connected to a pressure plate (6). Limiting strips (10) are fixedly connected to the left and right sides of the bottom of the pressure plate (6). Multiple limiting grooves (19) are opened at the bottom of the limiting strips (10). Connecting plates (8) are fixedly connected to the front and rear sides of the pressure plate (6). Magnet one (9) is installed at the bottom of the connecting plate (8). Two sets of magnet two (17) are installed on the outside of the placement frame (16).
2. The pin adjustment device for integrated circuit manufacturing according to claim 1, characterized in that, The mounting frame (1) consists of a bottom plate at the bottom, a top plate at the top, and multiple sets of guide columns connecting the bottom plate and the top plate. The support plate (14) is slidably mounted on the outer surface of the guide columns. A movable plate (3) is slidably mounted on the top of the outer surface of the guide columns. The fixed plate (4) is fixedly mounted inside the movable plate (3).
3. A pin adjustment device for integrated circuit manufacturing according to claim 2, characterized in that, A spring (21) is movably sleeved on the outer surface of the guide post. The two ends of the spring (21) are elastically connected to the support plate (14) and the bottom plate, respectively. Two sets of limiting posts (13) are fixedly installed on the top of the floor.
4. A pin adjustment device for integrated circuit manufacturing according to claim 3, characterized in that, The two sets of shaping fixtures (11) are symmetrically distributed on both sides of the bottom of the fixing plate (4), and the curvature of the top of the outer side of the placement frame (16) is consistent with the curvature of the top of the shaping groove (12).
5. A pin adjustment device for integrated circuit manufacturing according to claim 4, characterized in that, The top of the connecting column (5) is provided with a protrusion, and the top of the fixing plate (4) is provided with multiple sets of limiting holes (20) that extend downward to the bottom. The protrusion of the connecting column (5) is fitted into the limiting hole (20).
6. A pin adjustment device for integrated circuit manufacturing according to claim 5, characterized in that, The first magnet (9) and the second magnet (17) are arranged in a longitudinal alignment, and there is a tendency for opposite poles to attract each other.
7. A pin adjustment device for integrated circuit manufacturing according to claim 6, characterized in that, The top of the support block (22) is provided with a placement groove (23), and a rubber plate (24) is glued inside the placement groove (23). The bottom of the workpiece (18) abuts against the top of the support block (22) and the rubber plate (24). The top of the rubber plate (24) and the support block (22) are provided with multiple sets of overlapping openings (25).
8. A pin adjustment device for integrated circuit manufacturing according to claim 7, characterized in that, The number of the limiting grooves (19) is the same as the number of pins on the outside of the workpiece (18), and the limiting grooves (19) and the pins on the outside of the workpiece (18) are interlocked.