Automobile battery positive and negative copper plate step injection molding process
By employing a step-by-step injection molding process and balanced injection at both ends, the problems of misalignment and short circuits in the positive and negative copper plates of automotive batteries during the injection molding process were solved, achieving efficient insulation encapsulation and improving product qualification rate and safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- XIAMEN XUANLU MOLDING TECH CO LTD
- Filing Date
- 2026-06-04
- Publication Date
- 2026-07-24
AI Technical Summary
In the existing technology, the copper plates of the positive and negative electrodes of automobile batteries are prone to displacement and short circuits during the injection molding process due to the impact of injection pressure, which leads to short circuits and breakdowns during the pressure resistance test. In addition, the single-piece separator has problems such as shrinkage due to thick walls and insufficient connection strength.
The process employs a step-by-step injection molding process. Two isolation pieces are independently injection molded in the first mold to form a copper plate isolation assembly. A second injection molding process is then performed in the second mold. Combined with balanced injection at both ends and a multi-positioning structure, the copper plate is stably fixed.
It completely solves the problems of copper plate misalignment and short circuit, eliminates defects such as shrinkage and porosity, reduces the risk of component displacement, and improves the pass rate of withstand voltage test to over 98%, meeting the reliability and safety requirements of automotive battery components.
Smart Images

Figure CN122442869A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of positive and negative electrode copper plate manufacturing technology, and in particular to a step-by-step injection molding process for positive and negative electrode copper plates of automotive batteries. Background Technology
[0002] In automotive battery plug-in connectors, positive and negative copper plates are typically used as conductive components. These copper plates are only 0.5-1.5 mm thick, with a spacing of only 1-2 mm between adjacent plates. Currently, the industry commonly uses a one-time in-mold injection molding process for the insulation encapsulation of these thin, small-pitch copper plates. This involves setting various complex positioning structures (such as locating pins and slots) on the mold, attempting to fix the copper plates through the mold's own positioning, and then injection molding the insulation layer in one step. However, extensive production experience has proven that this approach has fundamental flaws: During injection molding, molten plastic is injected into the mold cavity under high pressure and high speed. The impact force is enormous and concentrated. No matter how precise the mold positioning structure is, the copper plates will inevitably be deviated or misaligned, resulting in insufficient contact or spacing between the positive and negative copper plates. Ultimately, this leads to short circuits and breakdowns during pressure resistance testing. This is the core reason why most injection molding companies and mold companies in the industry have been unable to overcome this technical challenge for a long time. Summary of the Invention
[0003] The main objective of this invention is to address the shortcomings of existing technologies by providing a step-by-step injection molding process for the positive and negative copper plates of automotive batteries, thereby solving the technical problem of short circuits in copper plates caused by injection pressure impact during direct injection molding in existing technologies.
[0004] The objective of this invention can be achieved through the following technical solutions: A step-by-step injection molding process for positive and negative copper plates in automotive batteries, characterized by the fact that the process is based on a first mold and a second mold, and includes the following steps: S1. Prepare positive and negative copper plates; S2. Open the first mold, and use the first mold to injection mold the first isolation component and the second isolation component; S3. Install and fix the positive copper plate, negative copper plate, first isolator and second isolator to form copper plate isolation assembly; S4. Open a second mold, put the copper plate isolation component into the second mold, and injection mold the insulating shell so that the copper plate isolation component and the insulating shell are solidified as a whole to form an insulating package.
[0005] Furthermore, the molding process also includes the following step: performing a withstand voltage test on the insulating package.
[0006] Furthermore, the positive copper plate, the first insulating element, the negative copper plate, and the second insulating element are arranged in sequence; the positive copper plate and the negative copper plate are respectively attached to the first insulating element and the second insulating element.
[0007] Furthermore, both the positive and negative copper plates include a plate body and several side plates perpendicular to the plate body; the first and second isolation members are respectively provided with mounting blocks corresponding to the positions of the side plates; the side plates of the positive and negative copper plates are respectively attached to the mounting blocks of the first and second isolation members.
[0008] Furthermore, a plurality of first positioning posts are fixedly provided on the front side of the first isolation member, and a plurality of second positioning posts are fixedly provided on its back side; a first positioning hole corresponding to the position of the first positioning post is opened on the positive electrode copper plate, and a second positioning hole corresponding to the position of the second positioning post is opened on both the negative electrode copper plate and the second isolation member; the first positioning post is inserted into the first positioning hole of the positive electrode copper plate, and the second positioning post is sequentially inserted into the second positioning hole of the negative electrode copper plate and the second isolation member.
[0009] Furthermore, the front of the first insulating member is in contact with the positive copper plate, and a positioning groove is formed on its back. The second insulating member has a raised positioning part on the side facing the negative copper plate. The shape of the positioning part is adapted to the shape of the positioning groove. The positioning part is embedded in the positioning groove, and an independent partition cavity is formed between the positioning part and the first insulating member. The plate of the negative copper plate is placed in the partition cavity.
[0010] Furthermore, a limiting device is provided between the copper plate isolation component and the second mold to limit the horizontal displacement of the copper plate isolation component.
[0011] Furthermore, the limiting device includes a limiting groove formed on the first isolation member and a limiting member provided on the second mold; the limiting member is provided with a limiting part that matches the shape of the limiting groove, and the limiting part is inserted into the limiting groove.
[0012] Furthermore, the limiting device also includes a limiting slot formed on the limiting member, into which the first isolation member is inserted.
[0013] Furthermore, the second mold is provided with multiple cavities for molding the insulating shell, and each cavity has two glue inlets on the same side.
[0014] Furthermore, both the positive and negative copper plates are provided with side plates perpendicular to the plate body, the side plates being parallel to the side pieces and located at both ends of the plate body; the second mold has mounting slots corresponding to the positions of the side plates, and the side plates of the positive and negative copper plates are respectively inserted into the corresponding mounting slots; the negative copper plate is also provided with a vertical plate perpendicular to the side plates, and the second mold has mounting slots corresponding to the positions of the vertical plates, and the vertical plate is inserted into the mounting slots.
[0015] Compared with the prior art, the present invention has the following beneficial effects: I. This invention completely abandons the conventional approach of relying on molds to position the copper plate in the industry, and adopts a step-by-step injection molding process: first, the isolation component is independently injection molded using a first mold; then, the isolation component and the copper plate are manually pre-assembled to form a stable copper plate isolation assembly; finally, this assembly is placed into a second mold for secondary injection molding. This process path fundamentally avoids the direct impact of injection pressure on the copper plate, and completely solves the industry problems of copper plate misalignment, short circuits, and contact. II. Technicians attempted to separate the copper plates by placing an insulating component between the positive and negative electrodes. However, this solution still has two major fatal flaws in practical applications: 1. During injection molding, the insulation layer on the other side of the insulating component needs to be 8-9 mm thick, while the insulation layer on the other side of the copper plate is only about 1-2 mm thick. This severe unevenness in wall thickness leads to serious shrinkage, porosity, and other injection molding defects in the thick-walled area, and poses a high risk of cracking and detachment of the insulation layer; 2. A single insulating component is only fixed to one side of the copper plate by a positioning post, resulting in limited connection strength. It cannot withstand the high-speed impact of the plastic material during injection molding, and the copper plate is still prone to loosening and displacement. This invention innovatively adopts a two-piece insulating component to solve the problems of thick-walled shrinkage and unstable positioning: (1) The thick-walled area that originally needed to be molded was replaced by a second isolation part. During the second injection molding, the area no longer needed to be filled with a large amount of rubber material. The overall wall thickness was evenly distributed, and defects such as shrinkage, air holes and rubber sleeves were completely eliminated. (2) The second isolation component presses the negative copper plate from the other side, forming a "clamping fixation" with the first isolation component. Combined with the insertion of the positioning post and the positioning hole, and the fitting of the positioning groove and the positioning part, a multi-fixation system is formed, which completely eliminates the possibility of the copper plate loosening and shifting. (3) An independent partition cavity is formed between the two isolation pieces, and the positive and negative copper plates are completely separated, thus completely eliminating the possibility of creepage and breakdown; Third, this invention innovatively adopts a balanced gating system: two gating ports are set on the same side of each cavity, and the molten glue flows into the cavity synchronously and evenly from the two gates, forming a balanced gating system. There is no need to open a gating hole, which completely avoids the problems of glue deviation and concentrated impact force caused by the gating hole in single-sided gating, and effectively reduces the risk of component displacement; the glue amount of the two gates is balanced and the cooling rate is consistent, eliminating warping deformation; at the same time, the design without a gating hole completely blocks the creepage channel. IV. The synergistic effect of the glue injection design and the isolation component structure design is specifically manifested in: (1) Structural positioning provides a prerequisite for balanced glue injection: The multi-positioning system of the two-piece isolation component (positioning pins and positioning holes are inserted, limiting grooves and limiting parts are engaged, side plates and mounting slots are inserted, etc.) clamps and fixes the copper plate into a rigid whole and positions it precisely in the mold. This provides a prerequisite for balanced glue injection to play a role. If the component itself is loose or offset, even if the glue injection is balanced, its positional accuracy cannot be guaranteed. (2) Balanced injection reduces pressure on structural positioning: simultaneous injection of two gates eliminates the need for glue passage holes, completely avoiding the problem of glue material deviation caused by glue passage holes in single-sided injection. At the same time, it disperses and balances the originally concentrated impact force, greatly reducing the load required for the positioning structure and eliminating the additional impact and creepage risk caused by glue passage holes. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the injection molding of the first and second isolation components of the present invention; Figure 2 This is a schematic diagram of the installation of the copper plate isolation component of the present invention; Figure 3 This is a schematic diagram of the installation of the copper plate isolation component of the present invention from another angle; Figure 4 This is a schematic diagram of the copper plate isolation component of the present invention after installation and fixation; Figure 5 This is a schematic diagram showing the installation of the copper plate isolation component and the second mold according to the present invention; Figure 6 This is a schematic diagram of the injection molding process for the insulating shell of the present invention; Figure 7 This is a schematic diagram of the structure of the insulating package of the present invention; In the diagram, 1. First mold; 2. Second mold; 3. Positive copper plate; 4. Negative copper plate; 5. First separator; 6. Second separator; 7. Plate; 8. Side plate; 9. Block; 10. First positioning post; 11. Second positioning post; 12. First positioning hole; 13. Second positioning hole; 14. Limiting groove; 15. Limiting part; 16. Limiting slot; 17. Side plate; 18. Mounting slot; 19. Vertical plate; 20. Mounting slot; 21. Insulating shell; 22. Positioning groove; 23. Positioning part. Detailed Implementation
[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0018] like Figures 1 to 7 As shown, this embodiment provides a step-by-step injection molding process for the positive and negative copper plates of an automotive battery, which includes the following steps: Step S1: Prepare the positive electrode copper plate 3 and the negative electrode copper plate 4: Both the positive copper plate 3 and the negative copper plate 4 are 1mm thick copper conductive sheets, with a designed spacing of 1.5mm between them. Both the positive copper plate 3 and the negative copper plate 4 include a plate body 7, multiple side plates 8 perpendicular to the plate body 7, and a side plate 17 perpendicular to the plate body 7. The side plate 17 is parallel to the side plates 8 and is located at both ends of the plate body 7. The negative copper plate 4 also has a vertical plate 19 perpendicular to the side plate 17.
[0019] Step S2: Open the first mold and injection mold the first separator 5 and the second separator 6: The first isolation member 5 has multiple first positioning posts 10 on its front side and multiple second positioning posts 11 on its back side. A positioning groove 22 is also provided on the back side of the first isolation member 5. A limiting groove 14 is also provided on the first isolation member 5. The first isolation member 5 and the second isolation member 6 each have a mounting block 9 corresponding to the position of the side plate 8. The side of the second isolation member 6 facing the negative electrode copper plate 4 has a raised positioning part 23, the shape of which matches the shape of the positioning groove 22.
[0020] It should be noted that the separate preforming of the second spacer 6 is one of the key innovations of this invention. For example... Figure 1 As shown, the present invention uses a first mold 1 to separately injection mold the first isolation member 5 and the second isolation member 6. The thick-walled area is pre-formed by the second isolation member 6, so that the overall wall thickness is uniform during the second injection molding, and the shrinkage defect is completely eliminated. At the same time, the second isolation member 6 and the first isolation member 5 form a clamping fixation, which fundamentally solves the problem of loosening and displacement of the copper plate.
[0021] Step S3: Install and fix to form the bronze isolation assembly: like Figures 2 to 4 As shown, the positive copper plate 3, negative copper plate 4, first isolator 5, and second isolator 6 are installed and fixed to form a copper plate isolation assembly. The specific installation method is as follows: Insert the first positioning post 10 on the front of the first isolation member 5 into the first positioning hole 12 on the positive copper plate 3, so that the positive copper plate 3 is attached and fixed to the first isolation member 5; insert the second positioning post 11 on the back of the first isolation member 5 into the second positioning hole 13 on the negative copper plate 4 and the second positioning hole 13 on the second isolation member 6 in sequence, so that the negative copper plate 4 and the second isolation member 6 are attached and fixed to the back of the first isolation member 5 in sequence. Meanwhile, the positioning part 23 of the second isolation member 6 is embedded in the positioning groove 22 of the first isolation member 5, and an independent partition cavity is formed between the positioning part 23 and the first isolation member 5. The plate 7 of the negative copper plate 4 is placed in the partition cavity to achieve double isolation and clamping fixation of the negative copper plate 4. At this time, the positive copper plate 3, the first isolation member 5, the negative copper plate 4, and the second isolation member 6 are arranged in sequence. The side piece 8 of the positive copper plate 3 is attached to the overlapping block 9 of the first isolation member 5, and the side piece 8 of the negative copper plate 4 is attached to the overlapping block 9 of the second isolation member 6.
[0022] Through the above installation method, the first isolation member 5 and the second isolation member 6 clamp and fix the negative copper plate 4 from both sides. With the insertion and positioning of the first positioning post 10 and the first positioning hole 12, the second positioning post 11 and the second positioning hole 13, and the fitting and positioning of the positioning groove 22 and the positioning part 23, a multi-fixing system is formed to ensure that the copper plate will not loosen or shift during the subsequent secondary injection molding process.
[0023] Step S4: Open the second mold and injection mold the insulating shell 21: The second mold 2 has multiple cavities for molding the insulating shell 21. Each cavity has two glue inlets on the same side to achieve balanced glue injection from both ends. The second mold 2 is provided with a limiting member, which has a limiting part 15 and a limiting slot 16. The second mold 2 also has mounting slots 18 corresponding to the side plate 17 and mounting slots 20 corresponding to the vertical plate 19.
[0024] like Figure 4 As shown, the copper plate isolation assembly obtained in step S3 is placed into the second mold 2: the limiting part 15 on the second mold 2 is inserted into the limiting groove 14 of the first isolation member 5, and at the same time, the edge of the first isolation member 5 is inserted into the limiting slot 16, thereby limiting the displacement of the copper plate isolation assembly in the horizontal direction; the side plates 17 of the positive copper plate 3 and the negative copper plate 4 are respectively inserted into the corresponding mounting slots 18; the vertical plate 19 of the negative copper plate 4 is inserted into the mounting slot 20.
[0025] It should be noted that this embodiment adopts a balanced gating method, which is another key innovation of this invention. If a conventional single-sided gating method (single gate) is used, the following problems exist: First, in order to ensure that the glue flows throughout the entire cavity, a gating hole must be opened on the isolation component. After the glue flows in from one side, it must pass through the gating hole to flow to the other side. The flow path is long and the resistance is uneven, causing the glue to deflect to one side. The impact force is concentrated and unidirectional, which can easily cause the copper isolation component to deviate and break apart. Second, single-sided gating results in a large difference in the amount of glue on both sides of the component and inconsistent cooling and shrinkage, causing warping, deformation, and cracking. Third, the insulation layer at the gating hole becomes thinner or has voids, forming a creepage channel, which causes the product to be broken down and burned during the withstand voltage test. In this embodiment, two inlets are provided on the same side of each cavity, and the glue flows in synchronously and evenly from the two gates, which effectively avoids the problem of concentrated and unidirectional impact of the glue and reduces the risk of component displacement. The glue inlet volume of the two gates is balanced and the cooling rate is consistent, eliminating warping deformation. At the same time, there is no need to open glue passages, which completely blocks the creepage channel.
[0026] In this embodiment, the injection design and the isolation component structure design work synergistically: on the one hand, the multi-positioning system of the two-piece isolation component (positioning pins and positioning holes interlocking, limiting grooves and limiting parts engaging, side plates and mounting slots interlocking, etc.) clamps and fixes the copper plate into a rigid whole and positions it precisely in the mold, providing a prerequisite for the balanced injection to function; on the other hand, the simultaneous injection of the two gates disperses and counterbalances the impact force, significantly reducing the load that the positioning structure needs to bear, while eliminating the need for injection holes and removing the risk of additional impact and creepage. The two complement each other, jointly achieving a dual guarantee of "static anti-displacement + dynamic anti-impact".
[0027] like Figure 6 As shown, after positioning, the insulating shell 21 is injection molded by simultaneously injecting glue through two gates on the second mold 2. The synchronous and balanced injection of glue from the two gates effectively reduces the concentrated impact force of the glue on the component, ensuring that the copper plate isolation component does not shift or deform during injection molding. The insulating shell 21 completely encapsulates the copper plate isolation component, and after curing, forms a complete insulating encapsulation (such as...). Figure 7 (As shown). Since the second separator 6 has been pre-formed separately, the overall wall thickness distribution is uniform during the second injection molding, and there are no defects such as shrinkage or overmolding.
[0028] Step S5, Pressure Resistance Test: The insulating package obtained in step S4 is subjected to a withstand voltage test to ensure that there are no short circuits or creepage phenomena. Mass production verification shows that the withstand voltage test pass rate of products manufactured using this process is over 98%, with no defects such as short circuits, creepage burning, shrinkage, encapsulation defects, or displacement, meeting the stringent reliability and safety requirements of automotive battery components.
[0029] Comparative Example To verify the significant advancements of this invention, comparative tests were conducted using the following comparative scheme under the same bronze medal specifications: Comparative Example 1: Conventional mold positioning + one-time injection molding. No separators are placed between the copper plates; only a positioning structure is set on the second mold to fix the positive and negative copper plates, and the insulating shell is formed by one-time injection molding. Test results: The injection impact caused the copper plates to deviate, resulting in insufficient contact or spacing between the positive and negative copper plates. A large number of products broke down and short-circuited during the withstand voltage test, with a pass rate of less than 10%.
[0030] Comparative Example 2: Single-piece separator + single-sided glue injection. A separator is placed between the positive and negative copper plates, using single-sided glue injection. To ensure the glue flows throughout the cavity, a glue passage hole needs to be made on the separator, causing glue misalignment, module displacement, and creepage channels formed at the glue passage hole. Test results: Severe shrinkage due to thick walls, module displacement, creepage and blackening, and a pass rate of less than 50%.
[0031] Comparative Example 3: Two spacers + single-sided gluing. Two spacers were used, but the gluing method remained single-sided. A gluing hole was still required, leading to issues such as glue misalignment, module displacement, and creepage. Test results: The thick-wall shrinkage problem was resolved, but glue misalignment, module displacement, and creepage issues still existed, resulting in a pass rate of approximately 70%.
[0032] Embodiment of this invention: Two insulating pieces + balanced glue injection at both ends + multiple positioning. Using the process of this invention, test results show no short circuits, no creepage, no shrinkage, no displacement, and a withstand voltage test pass rate of over 98%, achieving stable mass production.
[0033] Results Analysis The above comparative test results fully demonstrate that the industry's conventional "mold positioning + one-time injection" approach cannot solve the fundamental problem of bronze plate displacement caused by injection impact. While two isolating parts can solve the problem of thick-walled shrinkage, if single-sided injection is still used, component displacement remains, and the yield rate cannot reach over 98%. This invention, through a technical combination of "two isolating parts + balanced injection at both ends + multiple positioning," creates a significant synergistic effect among the various features, achieving technical results far exceeding the simple superposition of individual features, demonstrating outstanding substantive characteristics and significant progress.
[0034] It should be understood that in the claims and description of this invention, all instances of "comprising..." should be understood as having an open meaning, that is, their meaning is equivalent to "containing at least...", and should not be understood as having a closed meaning, that is, their meaning should not be understood as "containing only...".
[0035] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.
Claims
1. A stepwise injection molding process for positive and negative copper plates of an automotive battery, characterized in that, This process is based on a first mold (1) and a second mold (2), and includes the following steps: S1. Prepare positive copper plate (3) and negative copper plate (4); S2. Open the first mold (1) and use the first mold (1) to injection mold the first isolation part (5) and the second isolation part (6); S3. Install and fix the positive copper plate (3), the negative copper plate (4), the first isolation component (5), and the second isolation component (6) to form a copper plate isolation assembly; S4. Open the second mold (2), put the copper plate isolation component into the second mold (2), and injection mold the insulating shell (21) so that the copper plate isolation component and the insulating shell (21) are solidified as a whole to form an insulating package.
2. The step-by-step injection molding process for positive and negative copper plates of an automotive battery according to claim 1, characterized in that, The molding process also includes the following step: performing a withstand voltage test on the insulating package.
3. The step-by-step injection molding process for positive and negative copper plates of an automotive battery according to claim 1, characterized in that, The positive electrode copper plate (3), the first isolation element (5), the negative electrode copper plate (4), and the second isolation element (6) are arranged in sequence; the positive electrode copper plate (3) and the negative electrode copper plate (4) are respectively attached to the first isolation element (5) and the second isolation element (6).
4. The step-by-step injection molding process for positive and negative copper plates of an automotive battery according to claim 1, characterized in that, The positive copper plate (3) and the negative copper plate (4) both include a plate (7) and several side pieces (8) perpendicular to the plate (7); the first isolation member (5) and the second isolation member (6) are respectively provided with mounting blocks (9) corresponding to the positions of the side pieces (8); the side pieces (8) of the positive copper plate (3) and the negative copper plate (4) are respectively attached to the mounting blocks (9) of the first isolation member (5) and the second isolation member (6).
5. The step-by-step injection molding process for positive and negative copper plates of an automotive battery according to claim 1, characterized in that, The first isolation member (5) has a plurality of first positioning posts (10) fixed on its front side and a plurality of second positioning posts (11) fixed on its back side; the positive electrode copper plate (3) has a first positioning hole (12) corresponding to the position of the first positioning post (10), and the negative electrode copper plate (4) and the second isolation member (6) have a second positioning hole (13) corresponding to the position of the second positioning post (11); the first positioning post (10) is inserted into the first positioning hole (12) of the positive electrode copper plate (3), and the second positioning post (11) is inserted into the second positioning hole (13) of the negative electrode copper plate (4) and the second isolation member (6) in sequence.
6. The step-by-step injection molding process for positive and negative copper plates of an automotive battery according to claim 1, characterized in that, The front of the first isolation member (5) is in contact with the positive copper plate (3), and a positioning groove (22) is provided on its back. The second isolation member (6) has a raised positioning part (23) on the side facing the negative copper plate (4). The shape of the positioning part (23) matches the shape of the positioning groove (22). The positioning part (23) is embedded in the positioning groove (22). An independent partition cavity is formed between the positioning part (23) and the first isolation member (5). The plate (7) of the negative copper plate (4) is placed in the partition cavity.
7. The step-by-step injection molding process for positive and negative copper plates of an automotive battery according to claim 1, characterized in that, A limiting device is provided between the copper plate isolation component and the second mold (2) to limit the displacement of the copper plate isolation component in the horizontal direction.
8. The step-by-step injection molding process for positive and negative copper plates of an automotive battery according to claim 7, characterized in that, The limiting device includes a limiting groove (14) formed on the first isolation member (5) and a limiting member formed on the second mold (2); the limiting member is provided with a limiting part (15) that is adapted to the shape of the limiting groove (14), and the limiting part (15) is inserted into the limiting groove (14); the limiting device also includes a limiting slot (16) formed on the limiting member, and the first isolation member (5) is inserted into the limiting slot (16).
9. The step-by-step injection molding process for positive and negative copper plates of an automotive battery according to claim 1, characterized in that, The second mold (2) is provided with multiple cavities for molding insulating shells, and each cavity has two glue inlets on the same side.
10. The step-by-step injection molding process for positive and negative copper plates of an automotive battery according to claim 4, characterized in that, Both the positive electrode copper plate (3) and the negative electrode copper plate (4) are provided with side plates (17) perpendicular to the plate body (7). The side plates (17) are parallel to the side pieces (8) and are located at both ends of the plate body (7). The second mold (2) is provided with mounting slots (18) corresponding to the positions of the side plates (17). The side plates (17) of the positive electrode copper plate (3) and the negative electrode copper plate (4) are respectively inserted into the corresponding mounting slots (18). The negative electrode copper plate (4) is also provided with a vertical plate (19) perpendicular to the side plates (17). The second mold (2) is provided with a mounting slot (20) corresponding to the position of the vertical plate (19). The vertical plate (19) is inserted into the mounting slot (20).