A semiconductor wafer double-side coating device and a coating method

By designing the reaction chamber, connecting pipes, isolation chamber, and communication mechanism, the problem of insufficient uniformity in silicon wafer coating in the coating device was solved, realizing continuous operation and efficient processing of batch double-sided coating of semiconductor silicon wafers, and ensuring coating quality and sealing performance.

CN122446154APending Publication Date: 2026-07-24HUAIAN DONGXU ELECTRONIC MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HUAIAN DONGXU ELECTRONIC MATERIALS CO LTD
Filing Date
2026-06-02
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

When existing coating equipment processes multiple silicon wafers simultaneously, it results in insufficient coating uniformity on some wafers and poor airflow control, leading to insufficient gas contact on the outer silicon wafers and affecting coating quality.

Method used

The design incorporates a reaction chamber, connecting pipes, isolation chamber, and communication mechanism. Uniform gas distribution is achieved through valve plates and opening/closing components, ensuring uniform film deposition on the surface of each silicon wafer. The isolation chamber provides sealed protection, and the connecting pipes are reliably sealed to the isolation chamber. The mounting bracket and linear actuator control the valve plate's attitude to guide gas flow.

Benefits of technology

It enables continuous batch double-sided coating of semiconductor silicon wafers, improves coating uniformity and processing efficiency, solves the problem of uneven coating in traditional equipment, and ensures coating quality and sealing.

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Abstract

The application relates to the technical field of semiconductor processing, in particular to a semiconductor silicon wafer double-face coating device and a coating method, wherein the coating device comprises a reaction chamber and a connecting pipe; two mounting seats are arranged in the reaction chamber; at least two clamping grooves for bearing silicon wafers are arranged on the mounting seats; one isolation cabin is connected to each end of the reaction chamber; a docking assembly for connecting the connecting pipe and the isolation cabin is arranged on the isolation cabin; a communication mechanism is arranged between the isolation cabin and the reaction chamber; the communication mechanism comprises a valve plate and an opening and closing assembly for controlling the opening and closing of the valve plate; and in the working state, when the connecting pipe is connected to the isolation cabin through the docking assembly, the opening and closing assembly controls the valve plate to open. The application realizes the function of batch double-face coating of semiconductor silicon wafers, achieves the effect of continuous coating operation, and solves the technical problem that the traditional coating device causes the insufficient coating uniformity of part of the silicon wafers when synchronously processing multiple silicon wafers.
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Citation Information

Patent Citations

  • A semiconductor silicon wafer coating device and method thereof

    CN118007104B