A laser detection system, method, medium and computer program product
By focusing, collimating, shrinking, and combining the reflected laser beam, the problem of irregular propagation of the reflected laser beam in the laser detection system is solved, thereby improving the stability and accuracy of the detection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING OPTOKO MICROELECTRONICS TECH CO LTD
- Filing Date
- 2026-04-14
- Publication Date
- 2026-07-24
AI Technical Summary
In existing laser detection systems, the irregular propagation of reflected laser beams interferes with optical components and mechanical structures, resulting in poor detection stability, and stray light and laser speckle affect detection accuracy.
The reflected laser beam is collected by the focusing and collimating module, and its diameter is adjusted by the beam shrinking module to match the emitted laser beam. The optical path is changed by the reflector group and the beam is combined by the beam combiner. Finally, the beam is shaped by the beam shaping module to form a stable incident laser beam.
It improves the utilization efficiency of laser energy, reduces the influence of stray light and laser speckle, and enhances the stability and accuracy of laser detection.
Smart Images
Figure CN122448847A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor detection technology, and in particular relates to a laser detection system, method, medium and computer program product. Background Technology
[0002] Laser inspection is a high-precision inspection technology based on the principle of laser optics. It uses a laser beam of a specific wavelength and power to irradiate a target object (such as a wafer). By utilizing the interaction between the laser and the surface or internal structure of the target object, combined with optical imaging and signal analysis technology, it can accurately identify and determine surface defects and internal structural anomalies of the target object.
[0003] Taking dark-field optical inspection equipment as an example, as a commonly used device for semiconductor wafer defect detection, its working principle is to use an objective lens to receive the scattered and diffracted light generated after the laser irradiates the wafer, thereby highlighting the tiny defects on the wafer surface. However, in actual inspection, after the laser beam irradiates the wafer surface, in addition to the scattered and diffracted light used for imaging, a large number of reflected laser beams are generated. The reflected laser beams carry high laser energy and propagate randomly within the laser inspection system, interacting with optical components and mechanical structures. Moreover, their propagation lacks effective constraints and is prone to optical path interference with subsequent incident laser beams, resulting in poor stability of laser inspection. Summary of the Invention
[0004] This application provides a laser detection system, method, medium, and computer program product that can effectively utilize reflected laser beams and improve the stability of laser detection.
[0005] A first aspect of this application provides a laser detection system, the system comprising a focusing and collimating module, a beam shrinking module, a reflector group, a beam combiner, and a beam shaping module, including: The focusing and collimating module is used to collect the reflected laser beam generated after the wafer is irradiated by the incident laser beam; and to focus and collimate the reflected laser beam to obtain a first laser beam. The beam-shrinking module is used to shrink the first laser beam according to a preset beam-shrinking ratio to obtain a second laser beam with the same diameter as the emitted laser beam generated by the device's light source. The reflector group is used to change the optical path of the second laser beam so that the second laser beam and the emitted laser beam converge in the preset transmission area of the beam combiner. The beam combiner is used to combine multiple laser beams in the preset transmission area to obtain a third laser beam; and to transmit the third laser beam to the beam shaping module. The beam shaping module is used to shape the third laser beam according to preset detection requirements to obtain the incident laser beam, which is used to perform laser detection on the wafer.
[0006] A second aspect of this application provides a laser detection method, comprising: The control device outputs a laser beam from its light source and uses the emitted laser beam as the initial incident laser beam; The laser detection system provided in any one of the above embodiments of this application performs initial laser detection of the wafer based on the initial incident laser beam; The laser detection system is controlled to collect the reflected laser beam generated after the wafer is irradiated by the incident laser beam, and the reflected laser beam is fused with the emitted laser beam to obtain the incident laser beam for subsequent use. The laser inspection system is controlled to perform subsequent laser inspections of the wafer based on the incident laser beam used later.
[0007] A third aspect of this application provides a laser detection device, comprising: The initial incident module is used to control the output of the emitted laser beam from the light source of the control device, and to use the emitted laser beam as the initial incident laser beam; The initial detection module is used to control the laser detection system provided in any of the above embodiments of this application to perform initial laser detection of the wafer based on the initial incident laser beam; The reflected light recovery module is used to control the laser detection system to collect the reflected laser beam generated after the wafer is irradiated by the incident laser beam, and to fuse the reflected laser beam with the emitted laser beam to obtain the incident laser beam for subsequent use. The laser inspection module is used to control the laser inspection system to perform subsequent laser inspections of the wafer based on the incident laser beam used later.
[0008] A fourth aspect of the embodiments of this application provides an electronic device, the device comprising: a memory and a program or instructions stored in the memory and executable on a processor, wherein when the program or instructions are executed by the processor, they implement the laser detection method provided by any aspect of the embodiments of this application described above.
[0009] A fifth aspect of the embodiments of this application provides a readable storage medium on which a program or instructions are stored, which, when executed by a processor, implement the laser detection method provided by any aspect of the embodiments of this application described above.
[0010] A sixth aspect of the embodiments of this application provides a computer program product, wherein instructions in the computer program product, when executed by a processor of an electronic device, cause the electronic device to perform the laser detection method provided in any aspect of the embodiments of this application described above.
[0011] The technical solution provided in this application has at least the following beneficial effects: In a laser detection system provided in this application, a focusing and collimating module collects the reflected laser beam generated after the wafer is irradiated by an incident laser beam. This reflected laser beam is then focused and collimated to obtain a collimated first laser beam. A beam-shrinking module then uses a preset beam-shrinking ratio to make the diameter of the first laser beam match that of the emitted laser beam output from the device's light source, forming a second laser beam. A reflector group then adjusts the propagation path of this second laser beam so that it intersects with the emitted laser beam in a preset transmission area of a beam combiner. The beam combiner then combines the two laser beams to generate a third laser beam, which is transmitted to a beam shaping module. This beam shaping module shapes the beam according to the detection requirements and outputs the incident laser beam used for laser detection. In other words, this application improves the utilization efficiency of laser energy and reduces the impact of stray light and laser speckle on laser detection by constraining the propagation state of the reflected laser beam and the fusion of the reflected and emitted laser beams, thereby improving the stability of laser detection. Attached Figure Description
[0012] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0013] Figure 1 This is a schematic diagram of the structure of a laser detection system provided in one embodiment of this application; Figure 2 This is a schematic diagram of the focusing and collimation module provided in one embodiment of this application; Figure 3 This is a schematic diagram of a beam-shrinking module provided in one embodiment of this application; Figure 4 This is a schematic diagram of another structure of the beam-shrinking module provided in one embodiment of this application; Figure 5 This is a schematic flowchart of a laser detection method provided in one embodiment of this application; Figure 6 This is a schematic diagram of the structure of a laser detection device provided in one embodiment of this application; Figure 7 This is a schematic diagram of a laser detection device provided in one embodiment of this application. Detailed Implementation
[0014] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.
[0015] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.
[0016] It should be noted that the acquisition, storage, use, and processing of data in the technical solution of this application all comply with the relevant provisions of national laws and regulations. In the embodiments of this application, certain existing industry solutions such as software, components, and models may be mentioned. These should be considered exemplary, intended only to illustrate the feasibility of implementing the technical solution of this application, and do not imply that the applicant has already used or necessarily used such solutions.
[0017] First, the terms and concepts involved in one or more embodiments of this application will be explained.
[0018] Laser inspection is a high-precision non-destructive testing technology based on the principles of laser optics. It involves irradiating a target object with a laser beam of a specific wavelength and power, and utilizing the interactions between the laser and the surface or internal structure of the target object, such as scattering, diffraction, and reflection, combined with optical imaging, signal acquisition and analysis techniques, to achieve accurate identification and judgment of surface defects and internal structural anomalies of the target object.
[0019] Dark-field optical inspection equipment is a defect inspection device that uses an objective lens to receive only the scattered and diffracted light generated after laser irradiation of the wafer to form an image, suppressing the interference of specular reflection light, thereby highlighting the contrast of tiny defects on the wafer surface.
[0020] Stray light refers to irregularly propagating laser beams other than the incident laser beam in a laser detection system, which can interfere with the detection signal and imaging quality.
[0021] Laser speckle refers to the random, granular noise pattern formed by beam interference after a highly coherent laser irradiates a rough surface. This pattern can obscure defect information and reduce the clarity and accuracy of the inspection image.
[0022] A laser beam is a beam formed by the reflection of a portion of the laser light that is not absorbed or converted into scattered or diffracted light after the laser beam irradiates the surface of a target object.
[0023] The focusing and collimating module refers to the functional module in a laser detection system used to collect reflected laser beams and focus and collimate them.
[0024] A beam-shrinking module is a functional module in a laser detection system used to adjust the diameter of the laser beam.
[0025] A reflector assembly is an optical path adjustment component consisting of one or more planar reflectors. It is a device that changes the propagation direction of a laser beam by adjusting the installation angle of the reflectors, thereby achieving directional guidance of the laser beam.
[0026] A beam combiner is a device that allows multiple laser beams with different paths to converge and combine into one beam in a preset transmission area, ensuring the propagation stability of the combined laser beam.
[0027] The beam shaping module is a functional module that optimizes and adjusts parameters such as the shape, size, uniformity, and divergence angle of the laser beam according to preset detection requirements.
[0028] Laser inspection is a high-precision inspection technology based on the principle of laser optics. It uses a laser beam of a specific wavelength and power to irradiate a target object (such as a wafer). By utilizing the interaction between the laser and the surface or internal structure of the target object, combined with optical imaging and signal analysis technology, it can accurately identify and determine surface defects and internal structural anomalies of the target object.
[0029] Taking dark-field optical inspection equipment as an example, as a commonly used device for semiconductor wafer defect detection, its working principle is to use an objective lens to receive the scattered and diffracted light generated after the laser irradiates the wafer, thereby highlighting the tiny defects on the wafer surface. However, in actual inspection, after the laser beam irradiates the wafer surface, in addition to the scattered and diffracted light used for imaging, a large number of reflected laser beams are generated. The reflected laser beams carry high laser energy and propagate randomly within the laser inspection system, interacting with optical components and mechanical structures. Moreover, their propagation lacks effective constraints and is prone to optical path interference with subsequent incident laser beams, resulting in poor stability of laser inspection.
[0030] To address the aforementioned technical problems, this application provides a laser detection system, method, medium, and computer program product. In a laser detection system provided in this application, firstly, a focusing and collimating module collects the reflected laser beam generated after the wafer is irradiated by an incident laser beam, and focuses and collimates the reflected laser beam to obtain a first laser beam. Then, a beam-shrinking module, according to a preset beam-shrinking ratio, makes the diameter of the first laser beam match that of the emitted laser beam output by the device's light source, forming a second laser beam. Next, a reflector group adjusts the propagation path of the second laser beam so that it intersects with the emitted laser beam in a preset transmission area of a beam combiner. The beam combiner then combines the two laser beams to generate a third laser beam, which is transmitted to a beam shaping module. This beam shaping module shapes the beam according to the detection requirements and outputs the incident laser beam for laser detection. In other words, this application can constrain the propagation state of the reflected laser beam, causing the reflected laser beam to merge with the emitted laser beam, thereby improving the utilization efficiency of laser energy and reducing the impact of stray light and laser speckle on laser detection, thus improving the stability of laser detection.
[0031] For example, the laser inspection system provided in this application embodiment can be applied to the production line of a semiconductor manufacturing company to monitor defects such as surface scratches, micro-impurities, and structural flaws on wafers in real time during the semiconductor manufacturing process. In practical applications, the laser inspection system emits a laser beam through a light source, which is processed by a beam combiner and a beam shaping module to form an incident laser beam that meets the inspection standards, illuminating the wafer to be inspected. Subsequently, a focusing and collimating module collects the laser beam reflected from the wafer, which is then processed by beam reduction, optical path adjustment, and beam combining before being re-integrated into the inspection optical path to form a closed loop. The incident laser beam output by the beam shaping module continuously scans and inspects the wafer. Simultaneously, the laser inspection system can also synchronously acquire imaging data and defect identification signals to obtain inspection results containing information such as the location, size, and type of wafer defects. The inspection results are transmitted in real time and stored in a data storage device. Operators can use the inspection results to evaluate the wafer's production quality in real time, such as determining whether the wafer meets factory standards, locating the causes of defects in the production process, and adjusting production line process parameters to improve chip yield.
[0032] It should be noted that the application scenarios described in the above embodiments of this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. Those skilled in the art will understand that with the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems. The laser detection system provided by the embodiments of this application can be applied to various application scenarios that require the recycling of reflected laser beams.
[0033] The laser detection system provided by the embodiments of the present application will be introduced below. In practical applications, as a hardware carrier, the laser detection system of the embodiments of the present application depends on the drive of a control program. The execution entity of this control program can be a terminal device, such as a desktop computer, a laptop computer, etc., or a remote device similar to a server. Of course, an execution entity in the form of software can also be adopted, such as a client installed in a terminal device, a software program, etc. The specific type of the execution entity corresponding to the technical solution provided by the embodiments of the present application is not strictly limited here and can be flexibly selected according to the actual application scenario and actual needs.
[0034] For example, in the local detection scenario of a semiconductor production line, the control program can run directly on the industrial computer supporting the laser detection device, and in real time drive hardware units such as a focusing and collimating module, a beam shrinking module, and a beam combining mirror to complete the collection, processing, and combination of laser beams. In the remote monitoring and batch detection scenario, the control program can be deployed on a cloud server, and control instructions are sent to the on-site laser detection system through a communication protocol to drive the system to complete wafer detection and transmit back data. Regardless of the execution entity adopted, through the instruction scheduling of the control program, the coordinated work of each hardware module of the laser detection system is realized, and the entire process of wafer laser detection is completed.
[0035] The specific embodiments of the laser detection system, method, medium, and computer program product provided by the embodiments of the present application will be introduced below. First, a laser detection system will be introduced.
[0036] Figure 1 is a schematic structural diagram of a laser detection system provided by an embodiment of the present application. As Figure 1 shown, the system 100 includes a focusing and collimating module 101, a beam shrinking module 102, a mirror group 103, a beam combining mirror 104, and a beam shaping module 105. Among them, the focusing and collimating module is used to collect the reflected laser beam generated after the wafer is irradiated by the incident laser beam; perform focusing and collimating processing on the reflected laser beam to obtain a first laser beam. The beam shrinking module is used to shrink the first laser beam according to a preset shrinking ratio to obtain a second laser beam with the same diameter as the emitted laser beam generated by the device light source. The mirror group is used to change the optical path of the second laser beam so that the second laser beam intersects with the emitted laser beam at a preset transmission area of the beam combining mirror. The beam combining mirror is used to combine multiple laser beams in the preset transmission area to obtain a third laser beam; transmit the third laser beam to the beam shaping module. The beam shaping module is used to shape the third laser beam according to preset detection requirements to obtain an incident laser beam, and the incident laser beam is used to perform laser detection on the wafer.
[0037] In one or more embodiments of the present application, the present application realizes the recycling and reuse of the reflected laser beam based on the above laser detection system, thereby forming a closed-loop optical path operation logic, specifically as follows: First, the emitted laser beam generated by the device's light source is transmitted to a preset transmission area on a beam combiner. After passing through the beam combiner, it enters the beam shaping module. After being shaped according to the detection requirements, the beam shaping module produces an incident laser beam that meets the laser detection requirements. This incident laser beam is used to perform laser detection on the wafer.
[0038] Secondly, after the wafer is irradiated by the incident laser beam, a reflected laser beam is generated. This reflected laser beam is collected by the focusing and collimating module, and after focusing and collimating, a first laser beam with high parallelism is output. This first laser beam enters the beam shrinking module, which shrinks the first laser beam according to a preset beam shrinking ratio to output a second laser beam with the same diameter as the emitted laser beam.
[0039] Subsequently, the propagation path of the second laser beam is changed by the angle adjustment of the reflector group, guiding the second laser beam to converge with the emitted laser beam on the preset transmission area of the beam combiner, so that the beam combiner can combine the multiple laser beams in the preset transmission area, and perform beam combining processing on the second laser beam and the emitted laser beam to obtain the third laser beam.
[0040] Finally, the third laser beam is transmitted again to the beam shaping module to participate in the generation of subsequent incident laser beams, thereby realizing the recycling and reuse of the reflected laser beam and forming a stable closed-loop laser detection system.
[0041] It should be noted that this application does not limit the specific structure of each module in the laser detection system. The structure can be set according to actual needs. For example, the focusing and collimating module can be selected based on the energy intensity and diffusion range of the reflected laser beam, choosing an integrated microlens array structure or an off-axis optical path structure combined with a spherical mirror. The beam shrinking module can adopt a prism group refraction beam shrinking scheme or a beam compression configuration based on fiber coupling to adapt to different beam shrinking ratio requirements. The mirror group can be a piezoelectric ceramic mirror with angle fine adjustment function, or a lightweight structure with a hollow mirror to meet different optical path adjustment accuracy and equipment space constraints. The beam combiner can adopt a grating diffraction type beam combiner structure to achieve synchronous beam combining of multi-wavelength lasers. The beam shaping module can adopt a spot shaping scheme based on binary optical elements.
[0042] In the aforementioned laser detection system, this application constrains the irregular propagation state of the reflected laser beam through a closed-loop design of collecting, collimating, beam contracting, optical path control, and beam combining for reuse. This avoids the risk of damage to internal optical components and mechanical parts by the reflected laser beam and reduces the interference of stray light on detection accuracy. At the same time, by combining the reflected and emitted laser beams, the utilization efficiency of laser energy is improved, and the impact of laser speckle on imaging quality is reduced, thereby improving the stability and detection accuracy of the laser detection system.
[0043] In one or more embodiments of this application, the focusing and collimating module includes a focusing lens and a collimating lens. The focusing lens is used to collect the reflected laser beam and focus it to obtain a focused laser beam. The collimating lens is used to convert the focused laser beam into a parallel beam to obtain a first laser beam.
[0044] In this embodiment, the present application uses the synergistic cooperation of a focusing lens and a collimating lens to first converge and constrain the irregularly propagating reflected laser beam, thereby reducing the loss of laser energy. Then, it converts the reflected laser beam into a parallel beam that meets the requirements of beam shrinkage through collimation processing, thereby improving the stability of the recovery and reuse of the reflected laser beam.
[0045] To improve the beam quality of the reflected laser beam and ensure the stability of subsequent beam shrinking and combining processes, in one or more embodiments of this application, the focusing and collimating module may further include a field stop, which is used to filter out stray light from the edges of the focused laser beam to define the illumination area of the focused laser beam.
[0046] To improve the collimation accuracy of the reflected laser beam and ensure the stability of subsequent beam shrinking and combining, in one or more embodiments of this application, the focusing and collimating module may further include an aperture stop, which is used to control the beam angle and luminous flux of the focused laser beam transmitted onto the collimating lens. The aperture stop is located at the focal point of the focusing lens.
[0047] In this embodiment, the beam interface is smallest at the focal point of the focusing lens, and all the main rays pass through this point. An aperture stop is set at the focal point. The divergence angle of the outgoing beam can be accurately controlled by the size of the aperture stop, so that the beam passing through the aperture stop enters the collimating lens at a controllable angle.
[0048] Figure 2 This is a schematic diagram of the focusing and collimation module provided in an embodiment of this application, as shown below. Figure 2 As shown, the propagation path of the laser beam in the focusing and collimating module 101 is as follows: first, the laser beam is received and converged by the focusing lens 201 to obtain the focused laser beam; then, it passes through the field stop 202 and the aperture stop 203 in sequence. The field stop filters out stray light from the edge that deviates from the main optical path, thus defining the effective illumination area; the aperture stop adjusts the beam divergence angle to control the light flux; and finally, it is collimated by the collimating lens 204 to obtain the first laser beam.
[0049] Figure 3 This is a schematic diagram of a beam-shrinking module provided in an embodiment of this application, as shown below. Figure 3As shown, in one or more embodiments of this application, the beam-shrinking module 102 includes a first convex lens 301 and a first concave lens 302. The first convex lens and the first concave lens are confocal; the first convex lens is used to receive and focus the first laser beam; the first concave lens is used to collimate the first laser beam that has not converged to the focal point after passing through the first convex lens, thus obtaining a second laser beam.
[0050] Figure 4 This is another structural schematic diagram of the beam-shrinking module provided in the embodiments of this application, as shown below. Figure 4 As shown, in one or more embodiments of this application, the beam-shrinking module 102 includes a second convex lens 401 and a third convex lens 402. The second and third convex lenses are confocal; the second convex lens receives the first laser beam and focuses it to converge at the focal point; the third convex lens collimates the diverging first laser beam after passing through the focal point to obtain the second laser beam.
[0051] In the two structures of the above-mentioned beam-converging module, the confocal structure of convex and concave lenses does not require a long beam divergence propagation distance, occupies less space, and the concave lens can directly collimate the incompletely converged beam, which can reduce the loss of the beam over long distances. In contrast, in the biconvex lens confocal structure, all lenses are positive lenses, and their optical performance is less affected by environmental factors. Furthermore, devices such as apertures and energy detectors can be set at the focal position according to actual needs, which provides high flexibility.
[0052] To improve beam quality and ensure the stability of subsequent beam combining, in one or more embodiments of this application, a spatial filter may be provided at the focal position between the second convex lens and the third convex lens. This spatial filter is used to handle stray light in the first laser beam.
[0053] Based on a laser detection system, this application also provides specific embodiments of the laser detection method.
[0054] Figure 5 This is a schematic flowchart of a laser detection method provided in an embodiment of this application. Figure 5 As shown, the method includes steps S500 to S503: S500: The control device outputs a laser beam from its light source and uses the emitted laser beam as the initial incident laser beam.
[0055] S501: Control the laser detection system to perform initial laser detection of the wafer based on the initial incident laser beam.
[0056] S502: Control the laser detection system to collect the reflected laser beam generated after the wafer is irradiated by the incident laser beam, and fuse the reflected laser beam with the emitted laser beam to obtain the incident laser beam for subsequent use.
[0057] S503: Control the laser detection system to perform subsequent laser detection of the wafer according to the incident laser beam to be used later.
[0058] In the aforementioned laser detection method, this application employs a closed-loop logic design encompassing initial incidence, detection triggering, and reflected light recovery and fusion. First, the emitted laser beam from the device's light source is used as the initial incident laser beam to complete the first laser detection of the wafer. Then, the laser detection system collects the reflected laser beam generated after the wafer is irradiated. This reflected laser beam is then processed and fused with the emitted laser beam to generate the incident laser beam for subsequent laser detection. In other words, this application achieves the recovery and reuse of the reflected laser beam, improving the utilization rate of laser energy. Furthermore, the construction of a closed-loop optical path reduces the interference of stray light and laser speckle on laser detection, improving the stability of laser detection.
[0059] Based on laser detection methods, this application also provides specific embodiments of laser detection devices.
[0060] like Figure 6 As shown in the figure, a laser detection device 600 provided in this application embodiment includes an initial incident module 601, an initial detection module 602, a reflected light recovery module 603, and a laser detection module 604.
[0061] The initial incident module 601 is used to control the output of the emitted laser beam from the device light source and to use the emitted laser beam as the initial incident laser beam. The initial detection module 602 is used to control the laser detection system to perform initial laser detection of the wafer based on the initial incident laser beam. The reflected light recovery module 603 is used to control the laser detection system, collect the reflected laser beam generated after the wafer is irradiated by the incident laser beam, and fuse the reflected laser beam with the emitted laser beam to obtain the incident laser beam for subsequent use. The laser detection module 604 is used to control the laser detection system to perform subsequent laser detection of the wafer according to the incident laser beam used later.
[0062] Based on a laser detection method, this application also provides a specific embodiment of a laser detection device.
[0063] Figure 7 A schematic diagram of the hardware structure of a laser detection device provided in an embodiment of this application is shown.
[0064] The laser detection device may include a processor 701 and a memory 702 storing computer program instructions.
[0065] Specifically, the processor 701 may include a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement the embodiments of this application.
[0066] Memory 702 may include mass storage for data or instructions. For example, and not limitingly, memory 702 may include a hard disk drive (HDD), floppy disk drive, flash memory, optical disk, magneto-optical disk, magnetic tape, or Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, memory 702 may include removable or non-removable (or fixed) media. Where appropriate, memory 702 may be internal or external to the integrated gateway disaster recovery device. In a particular embodiment, memory 702 is non-volatile solid-state memory.
[0067] The processor 701 reads and executes computer program instructions stored in the memory 702 to implement any of the laser detection methods in the above embodiments.
[0068] In one example, the electronic device may also include a communication interface 703 and a bus 710. Wherein, as... Figure 7 As shown, the processor 701, memory 702, and communication interface 703 are connected through bus 710 and complete communication with each other.
[0069] The communication interface 703 is mainly used to realize communication between various modules, devices, units and / or equipment in the embodiments of this application.
[0070] Bus 710 includes hardware, software, or both, that couples the components of the electronic device together. For example, and not limitingly, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an Infinite Bandwidth Interconnect, a Low Pin Count (LPC) bus, a memory bus, a Microchannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses, or combinations of two or more of these. Where appropriate, bus 710 may include one or more buses. Although specific buses are described and illustrated in embodiments of this application, any suitable bus or interconnect is contemplated herein.
[0071] Furthermore, in conjunction with the wafer morphology scanning signal processing method in the above embodiments, this application embodiment can provide a computer storage medium for implementation. This computer storage medium stores computer program instructions; when these computer program instructions are executed by a processor, they implement any of the laser detection methods in the above embodiments.
[0072] In addition, in conjunction with the laser detection method in the above embodiments, this application embodiment can provide a computer program product for implementation. When the instructions in the computer program product are executed by the processor of an electronic device, the electronic device performs a laser detection method as provided in any aspect of the above embodiments of this application.
[0073] It should be clarified that this application is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of this application is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order of steps, after understanding the spirit of this application.
[0074] The functional blocks shown in the above-described structural diagram can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, they can be, for example, electronic circuits, application-specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of this application are programs or code segments used to perform the required tasks. Programs or code segments can be stored on a machine-readable medium or transmitted over a transmission medium or communication link via data signals carried on a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, radio frequency (RF) links, etc. Code segments can be downloaded via computer networks such as the Internet, intranets, etc.
[0075] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.
[0076] The aspects of this disclosure have been described above with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this disclosure. It should be understood that each block in the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that these instructions, executable via the processor of the computer or other programmable data processing apparatus, enable the implementation of the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field-programmable logic circuit. It is also understood that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can also be implemented by special-purpose hardware performing the specified functions or actions, or can be implemented by a combination of special-purpose hardware and computer instructions.
[0077] The above description is merely a specific implementation of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.
Claims
1. A laser detection system, characterized in that, The system includes a focusing and collimation module, a beam shrinking module, a mirror assembly, a beam combiner, and a beam shaping module, including: The focusing and collimating module is used to collect the reflected laser beam generated after the wafer is irradiated by the incident laser beam; and to focus and collimate the reflected laser beam to obtain a first laser beam. The beam-shrinking module is used to shrink the first laser beam according to a preset beam-shrinking ratio to obtain a second laser beam with the same diameter as the emitted laser beam generated by the device's light source. The reflector group is used to change the optical path of the second laser beam so that the second laser beam and the emitted laser beam converge in the preset transmission area of the beam combiner. The beam combiner is used to combine multiple laser beams in the preset transmission area to obtain a third laser beam; and to transmit the third laser beam to the beam shaping module. The beam shaping module is used to shape the third laser beam according to preset detection requirements to obtain the incident laser beam, which is used to perform laser detection on the wafer.
2. The system as described in claim 1, characterized in that, The focusing and collimating module includes at least a focusing lens and a collimating lens, including: The focusing lens is used to collect the reflected laser beam and focus the reflected laser beam to obtain a focused laser beam. The collimating lens is used to convert the focused laser beam into a parallel beam to obtain the first laser beam.
3. The system as described in claim 2, characterized in that, The focusing and collimating module also includes a field stop, comprising: The field stop is used to filter out stray light from the edges of the focused laser beam in order to define the illumination area of the focused laser beam.
4. The system as described in claim 3, characterized in that, The focusing and collimating module further includes an aperture stop, which is located at the focal point of the focusing lens and includes: The aperture stop is used to adjust the divergence angle of the focused laser beam, thereby controlling the beam angle and luminous flux transmitted from the focused laser beam to the collimating lens.
5. The system as described in claim 1, characterized in that, The beam-shrinking module includes a first convex lens and a first concave lens, wherein the first convex lens and the first concave lens are confocal, including: The first convex lens is used to receive the first laser beam and focus the first laser beam; The first concave lens is used to collimate the first laser beam, which has not converged to a focal point after passing through the first convex lens, to obtain the second laser beam.
6. The system as described in claim 1, characterized in that, The beam-shrinking module includes at least a second convex lens and a third convex lens, wherein the second convex lens and the third convex lens are confocal, including: The second convex lens is used to receive the first laser beam and focus the first laser beam so that the first laser beam converges at the focal point; The third convex lens is used to collimate the first laser beam that diverges after passing through the focal point to obtain the second laser beam.
7. The system as described in claim 6, characterized in that, The beam-shrinking module further includes a spatial filter located at the focal point of the second convex lens and the third convex lens, comprising: The spatial filter is used to filter out stray light passing through the first laser beam.
8. A laser detection method, characterized in that, include: The control device outputs a laser beam from its light source and uses the emitted laser beam as the initial incident laser beam; Control the laser inspection system according to any one of claims 1-7 to perform initial laser inspection of the wafer based on the initial incident laser beam; The laser detection system is controlled to collect the reflected laser beam generated after the wafer is irradiated by the incident laser beam, and the reflected laser beam is fused with the emitted laser beam to obtain the incident laser beam for subsequent use. The laser inspection system is controlled to perform subsequent laser inspections of the wafer based on the incident laser beam used later.
9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a program or instructions that, when executed by a processor, implement the laser detection method as described in claim 8.
10. A computer program product, characterized in that, When the instructions in the computer program product are executed by the processor of the electronic device, the electronic device performs the laser detection method as described in claim 8.