Chip transfer apparatus

Abstract

The present application relates to chip transfer technology field, especially a kind of chip transfer equipment. The turnover device, including the base, R-axis motor and turnover head that are sequentially arranged, R-axis motor one end is fixed on the base, the other end is driven connection with turnover head, to drive turnover head to rotate according to preset angle;Turnover head includes the suction nozzle for sucking chip, and the partial area of the suction nozzle and R-axis motor are collinearly arranged with the rotation axis of R-axis motor as reference. So that the whole turnover device structure is more compact, and the turnover precision and stability are higher.

Description

Technical Field

[0001] This invention relates to the field of chip transfer technology, and in particular to a chip transfer device. Background Technology

[0002] The semiconductor industry has a need for chip transfer. Traditional transfer equipment has pain points such as non-compact equipment structure, insufficient positioning accuracy, lag in force control response, and poor motion stability, making it difficult to meet the high precision, high force control, and high stability requirements for chip handling during the transfer process. Summary of the Invention

[0003] To address the technical problems of existing chip transfer devices being too large and having low controllability, this invention provides a chip transfer device.

[0004] The present invention provides a chip transfer device for picking up and placing chips in different postures and angles. The device comprises a worktable, on which are arranged a wafer supply assembly, a transfer head assembly, a chip carrier assembly, and a vision recognition assembly. The transfer head assembly includes a transfer device and a flipping device. The vision recognition assembly is used to identify the position of chips located on the wafer supply assembly, the flipping device, and the chip carrier assembly. The flipping device picks up a chip from the wafer supply assembly, moves it to the vision recognition assembly for position identification, and the transfer device picks up the chip from the flipping device based on the identification result, and places the chip... The chip is transferred to the chip carrier assembly; the flipping device includes a moving component, and a base, an R-axis motor, and a flipping head arranged in sequence. One end of the R-axis motor is fixed to the base, and the other end is driven to the flipping head to directly drive the flipping head to rotate at a preset angle; the flipping head is stacked on the R-axis motor along the rotation axis of the R-axis motor, and the flipping head includes a suction nozzle for picking up the chip. A portion of the suction nozzle and the R-axis motor are collinear with the rotation axis of the R-axis motor as a reference; the moving component includes a second linear guide rail, and the base slides with the second linear guide rail to allow the flipping head to move horizontally.

[0005] Preferably, the base is provided with an R-axis limiting block, which is spaced apart from the R-axis motor; the R-axis motor is provided with a connector near the flip head, and the R-axis motor and the flip head are connected through the connector; a limiting protrusion is provided on the outer circumferential surface of the connector; a limiting post is provided on the side of the R-axis limiting block near the connector; the distance from the outer end face of the limiting protrusion to the outer circumferential surface of the connector is greater than the distance from the outer end face of the limiting post to the outer circumferential surface of the connector; the R-axis motor is a DD motor.

[0006] Preferably, the limiting protrusion includes a first limiting protrusion and a second limiting protrusion, the first limiting protrusion and the second limiting protrusion are spaced apart along the outer peripheral surface of the connector; when the connector changes from abutting against the limiting post by the first limiting protrusion to abutting against the limiting post by the second limiting protrusion, the connecting member rotates by 180°.

[0007] Preferably, the limiting post is an elastic structure.

[0008] Preferably, the flipping head includes a mounting base and a first drive motor. The mounting base is provided with a first linear guide rail, and the first drive motor drives the suction nozzle to slide along the length direction of the first linear guide rail. The first drive motor is a voice coil motor. The mounting base includes a first mounting plate and a second mounting plate that are slidably connected. The first linear guide rail is disposed on the side of the first mounting plate near the suction nozzle. The suction nozzle is fixed on the second mounting plate and slidably connected to the first mounting plate through the first linear guide rail. The side of the first mounting plate near the suction nozzle is also provided with a first reading head, and the second mounting plate is provided with a first grating ruler that cooperates with the first reading head at a position corresponding to the first reading head.

[0009] Preferably, the first mounting plate has two first limiting blocks on the side near the suction nozzle, and the two first limiting blocks are spaced apart along the length direction of the first linear guide rail. The second mounting plate has a second limiting block on the side near the first mounting plate, and the second limiting block is embedded between the two first limiting blocks. The limiting blocks are elastic structures.

[0010] Preferably, the first mounting plate is further provided with a spring mounting seat, on which a magnetic spring is mounted; the magnetic spring includes a spring stator and a spring mover, the spring mounting seat is provided with a mounting hole, the spring stator is fixed in the mounting hole, one end of the spring mover is fixed to the second mounting plate, and the other end is embedded in the mounting hole and movably cooperates with the mounting hole.

[0011] Preferably, the nozzle is provided with an air passage interface, and an air tube is connected to the air passage interface. The upper surface of the first mounting plate is provided with a through hole and a fixing point. One end of the air tube is connected to the air passage interface, and the other end is fixed to the fixing point and extends outward through the through hole to connect with an external air supply device. The air tube located at the air passage interface and the fixing point is arc-shaped.

[0012] Preferably, the moving component includes a support frame, a second drive motor, and a second linear guide rail. The base is slidably connected to the second linear guide rail, and the second drive motor is drivenly connected to the base to drive the base to slide along the second linear guide rail. The support frame is provided with a second grating ruler, and the base is provided with a second reading head that cooperates with the second grating ruler on the side near the second grating ruler.

[0013] Preferably, after the visual recognition component positions the chip on the wafer supply component, the flipping head moves above the chip to adsorb the chip, and then moves above the chip carrier component to flip it at a preset angle.

[0014] Compared with the prior art, the chip transfer device provided by the present invention has the following advantages: 1. This invention provides a flipping device for automated chip handling, including material transfer and pick-up / placement. It adopts a modular assembly structure in which a base, an R-axis motor, and a flipping head are arranged in sequence. One end of the R-axis motor is fixed to the base, which provides stable support for the entire device and ensures the basic stability of the equipment operation. The other end of the R-axis motor is connected to the flipping head drive, which directly drives the flipping head to complete the rotation action according to a preset angle. This can fully meet the needs of core processes such as chip flipping and angle correction.

[0015] Secondly, by arranging the R-axis motor and the suction nozzle collinearly with the R-axis motor's rotation axis as the reference, the power transmission structure and the force form of chip adsorption are effectively optimized. This eliminates torque deviation, running wobbling, and positional offset problems caused by eccentric rotation, ensuring constant centrifugal force during chip flipping and preventing chip skew, falling, and damage from impacts. At the same time, the power transmission path is shortened, the overall layout structure is simplified, the overall structure is compact and integrated, and the space occupied is small. This improves the response speed and motion stability of the flipping action, meeting the process requirements of high-precision chip picking, flipping, and transfer, and significantly improving the stability of chip picking and placing operations and the overall work efficiency.

[0016] 2. In the flipping device provided in this embodiment of the invention, an R-axis limiting block and an R-axis motor are spaced apart on the base. The R-axis limiting block is provided with a limiting post, and one end of the R-axis motor is provided with a connector. The connector is provided with a limiting protrusion. The limiting post and the limiting protrusion form a mechanical limiting engagement mechanism, which can physically limit the rotation stroke of the R-axis motor and the flipping head, effectively preventing the motor from overshooting or exceeding its travel range, and avoiding the risk of the chip colliding with surrounding components or structural damage due to excessive flipping. By limiting the distance between the limiting protrusion and the limiting post, the limiting engagement is ensured to be precise and controllable, avoiding the problems of limiting failure or motion interference jamming.

[0017] Specifically, a DD motor with high torque, low vibration, high positioning accuracy, and fast response speed is used as the R-axis drive component to reduce the risk of scratches and chipping of precision chips caused by minor mechanical vibrations, and further improve the control accuracy of chip flipping angle and the stability of operation.

[0018] 3. The flipping device provided in this embodiment of the invention has a first limiting protrusion and a second limiting protrusion spaced apart on the outer periphery of the connector. When the two sets of limiting protrusions switch and cooperate with the limiting post, the connector can be precisely oriented to rotate 180°, perfectly matching the standardized operation requirements of flipping the chip on both sides. The standard flipping process can be completed without repeated calibration of angles through complex procedures. The bidirectional limiting protrusions work alternately to achieve bidirectional mechanical limiting of the flipping structure in both forward and reverse directions, eliminating defects such as single flipping angle deviation and reciprocating rotation misalignment, and effectively reducing the defect rate of subsequent material transfer and bonding caused by chip posture deviation. At the same time, the switching cooperation of the two sets of limiting protrusions and limiting post means that the R-axis motor can only rotate a maximum of 180°.

[0019] 4. The flipping device provided in this embodiment of the invention has an elastic structure design for the limiting post. When the limiting protrusion and the limiting post come into contact, a flexible buffer effect is formed, which effectively avoids the impact vibration, operating noise and wear of parts caused by hard metal collision. It can absorb the inertial impact force when flipping into place, weaken the transmission of vibration to the nozzle and chip, and prevent the precision chip from cracking, displacing and falling off due to impact.

[0020] 5. The flipping device provided in this embodiment of the invention is equipped with a split mounting base, on which a first linear guide rail is provided. A first drive motor drives the suction nozzle to slide along the length direction of the first linear guide rail. The first drive motor provides stable power output to the suction nozzle, realizing automated and precise displacement adjustment of the suction nozzle. It can adapt to chip picking and placing operations with different heights and spacings. At the same time, relying on the first linear guide rail, it provides high-precision guiding constraints for the linear sliding of the suction nozzle, ensuring high linearity and smooth operation of the suction nozzle lifting, translating picking and placing actions without jamming. In addition, with the high-precision cooperation of the first grating ruler and the first reading head to form a closed-loop detection, it can monitor the sliding stroke and displacement data of the suction nozzle in real time, accurately control the suction nozzle feed amount, and greatly improve the alignment accuracy of chip adsorption, picking, and placement. It effectively solves the problems of misalignment and crushing damage during the picking and placing of ultra-thin chips and micro chips, and meets the requirements of high-precision semiconductor chip processing technology.

[0021] 6. In the flipping device provided in the embodiment of the present invention, two first limiting blocks are arranged at intervals along the length direction of the first linear guide rail on the first mounting plate, and a second limiting block is arranged on the second mounting plate and embedded between the two first limiting blocks, thereby forming a bidirectional mechanical limit on the linear sliding stroke of the suction nozzle, preventing the suction nozzle from sliding beyond its travel and causing the guide rail to derail, thus improving the safety of equipment operation. The limiting block adopts an elastic structure as a whole, and achieves flexible buffering during the sliding limiting and holding process, reducing component wear and vibration interference caused by hard contact, and ensuring the smoothness and stability of the suction nozzle sliding movement.

[0022] 7. In the flipping device provided in the embodiment of the present invention, a spring mounting seat is provided on the first mounting plate and a magnetic spring is assembled thereon. The magnetic spring is composed of a spring stator and a spring mover. The stator is fixed inside the mounting hole, and the mover moves synchronously with the second mounting plate. The magnetic force of the magnetic spring provides flexible buffering and pressure adaptive compensation for the linear sliding action of the suction nozzle. During the chip adsorption, bonding, placement and docking stages, it can adapt to small pitch errors and assembly deviations.

[0023] 8. In the flipping device provided in the embodiments of the present invention, the suction nozzle is provided with an air passage interface and an external air supply pipe, which can stably connect to the external air supply equipment and provide a continuous and balanced air source power for the vacuum adsorption of the chip; the air pipe between the air passage interface and the fixed point adopts an arc-shaped layout, which reserves the movement length for the flipping device, and avoids problems such as air passage blockage, air pipe aging and cracking, and negative pressure airflow fluctuation caused by pipe pulling, bending and squeezing during the movement.

[0024] 9. The flipping device provided in this embodiment of the invention is equipped with a moving component consisting of a support frame, a second drive motor, and a second linear guide rail. The base slides in conjunction with the second linear guide rail. The second drive motor drives the base and the entire flipping device to move horizontally, allowing the flipping device to flexibly shuttle back and forth between multiple workstations such as chip loading, visual inspection, and material transfer, realizing automated flow connection of multiple workstations, reducing manual handling intervention, and comprehensively improving the automation level of the chip transfer process. A second grating ruler is provided on the support frame, and a matching second reading head is mounted on the base. The two work together to form a high-precision displacement closed-loop detection, accurately collecting the device's movement position data in real time, accurately controlling the docking accuracy of multiple workstations, and ensuring accurate alignment of the flipping device with each functional component.

[0025] 10. This embodiment of the invention also provides a chip transfer device, which uses a workbench as a support base and integrates a wafer supply component, a transfer head component, a chip carrier component, and a vision recognition component. The transfer head component integrates the transfer device and the aforementioned flipping device to form an integrated fully automatic chip transfer production device. The functional modules are compactly laid out, effectively optimizing the utilization rate of workshop space. During operation, the flipping device autonomously picks up the chip from the wafer supply component and moves the chip to the vision recognition component to complete the position, posture, and appearance visual detection. The transfer device accurately connects and picks up the chip after flipping based on the visual recognition feedback data, and finally transfers it in an orderly manner to the chip carrier component to complete the discharge collection.

[0026] It has the same beneficial effects as the aforementioned flipping device, which will not be elaborated here. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of a flipping device provided in an embodiment of the present invention. Figure 1 .

[0029] Figure 2 This is a schematic diagram of the structure of a flipping device provided in an embodiment of the present invention. Figure 2 .

[0030] Figure 3 This is a schematic diagram of the structure of a flipping device provided in an embodiment of the present invention. Figure 3 .

[0031] Figure 4 This is a front view of the connector and R-axis limiting block provided in an embodiment of the present invention.

[0032] Figure 5 This is a schematic diagram of the structure of a flipping head provided in an embodiment of the present invention. Figure 1 .

[0033] Figure 6 This is a schematic diagram of the structure of a flipping head provided in an embodiment of the present invention. Figure 2 .

[0034] Figure 7 This is a schematic diagram of the frame of a chip transfer device provided in an embodiment of the present invention.

[0035] Explanation of reference numerals in the attached diagram: 100. Chip transfer equipment; 10. Transfer head assembly; 101. Transfer device; 102. Flipping device; 20. Worktable; 30. Wafer supply assembly; 40. Chip carrier assembly; 50. Vision recognition assembly; 1. Tilting assembly; 11. Base; 111. R-axis limiting block; 1111. Limiting post; 12. R-axis motor; 13. Tilting head; 131. Suction nozzle; 1311. Air passage interface; 1312. Adsorption section; 1313. Connecting section; 132. Mounting base; 1321. First mounting plate; 13211. First limiting block; 13212. Spring mounting base; 13213. Mounting hole; 13214 13215. Through hole; 1322. Fixing point; 1322. Second mounting plate; 13221. Second limiting block; 133. First drive motor; 134. First linear guide rail; 135. First reading head; 136. First grating ruler; 137. Air tube; 14. Connector; 141. First limiting protrusion; 142. Second limiting protrusion; 15. Magnetic spring; 151. Spring stator; 152. Spring mover; 2. Moving component; 21. Support frame; 22. Second drive motor; 23. Second linear guide rail; 24. Second reading head; 25. Second grating ruler. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0037] In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information.

[0038] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also recognize that the embodiments described in the specification are optional embodiments, and the actions and modules involved are not necessarily essential to the invention.

[0039] In various embodiments of the present invention, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0040] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0041] Please see Figure 1 and Figure 2 This invention provides a flipping device 102 for picking up and placing chips in different postures and angles. It includes a base 11, an R-axis motor 12 and a flipping head 13 arranged in sequence. One end of the R-axis motor 12 is fixed to the base 11 and the other end is driven to the flipping head 13 to drive the flipping head 13 to rotate at a preset angle. The flipping head 13 includes a suction nozzle 131 for picking up chips. A portion of the suction nozzle 131 and the R-axis motor 12 are arranged collinearly with the rotation axis of the R-axis motor 12 as a reference.

[0042] Specifically, the flipping head 13 is stacked on the R-axis motor 12 along the rotation axis of the R-axis motor 12, and the suction nozzle 131 is coplanar with the rotation axis of the R-axis motor 12. When the R-axis motor 12 rotates, it directly drives the suction nozzle 131 to rotate.

[0043] It should be noted that in many chip manufacturing processes, the front or back of the chip is required to be facing up at different stages. For example, in flip chip technology, the chip needs to be facing down to align with the substrate. In this process, a flipping device 102 is needed to flip the chip.

[0044] Understandably, the flipping device 102 provided in this embodiment is used for the transfer and pick-up / placement of chips in automated operation. It adopts a modular assembly structure in which the base 11, the R-axis motor 12 and the flipping head 13 are arranged in sequence. The base 11 can provide stable support for the whole device and ensure the basic stability of the equipment operation. The R-axis motor 12 is driven by the flipping head 13 and directly drives the flipping head 13 to complete the rotation action according to the preset angle, which can fully meet the use requirements of core processes such as chip flipping and angle correction.

[0045] Specifically, the flipping device 102 includes a flipping component 1, which includes a base 11, an R-axis motor 12, and a flipping head 13 arranged in sequence. The rotation center axes of the R-axis motor 12 and the suction nozzle 131 are collinear. The driving force of the R-axis motor 12 is directly transmitted to the suction nozzle 131 through the shortest path, eliminating torque deviation, running wobbling, and positional offset problems caused by eccentric rotation, ensuring constant centroid during chip flipping, and avoiding chip adsorption tilting, falling, and damage from impacts.

[0046] The flipping device 102 in this embodiment has a simplified overall component layout, a compact structure, and a small space occupation volume. The flipping action response speed and motion stability meet the process requirements of high-precision pick-up and place, flipping and transfer of semiconductor chips. It can also be flexibly adapted to semiconductor miniaturization equipment and the side-by-side layout of multiple equipment in production lines, making the equipment more adaptable and versatile.

[0047] In some embodiments, the suction nozzle 131 is specifically L-shaped, with one end connected to the R-axis motor 12 along the rotation axis of the R-axis motor 12, and the other end perpendicular to the length direction of the R-axis motor 12. It is used to adsorb chips. The coaxial design makes the suction nozzle 131 subjected to uniform and reasonable force. Long-term reciprocating flipping operation is less likely to cause problems such as uneven wear of parts and loose connections, effectively extending the overall service life of the device.

[0048] Specifically, the nozzle 131 includes a connecting section 1313 and an adsorption section 1312 connected to each other. The connecting section 1313 and the adsorption section 1312 are perpendicular to each other, and the central axis of the connecting section 1313 is parallel to the rotation axis of the R-axis motor.

[0049] Please combine Figure 3 and Figure 4 The base 11 is provided with an R-axis limiting block 111, which is spaced apart from the R-axis motor 12. The R-axis motor 12 is provided with a connector 14 near the flip head 13. The R-axis motor 12 and the flip head 13 are connected by the connector 14. A limiting protrusion is provided on the outer circumferential surface of the connector 14. A limiting post 1111 is provided on the side of the R-axis limiting block 111 near the connector 14. The distance from the outer end face of the limiting protrusion to the outer circumferential surface of the connector 14 is greater than the distance from the outer end face of the limiting post 1111 to the outer circumferential surface of the connector 14.

[0050] Specifically, the R-axis motor 12 is a DD motor, which integrates a high-resolution encoder to provide accurate position feedback, thereby ensuring high-precision rotation of the R-axis. Furthermore, the rotor of the DD motor is rigidly connected to the external load, eliminating transmission back and achieving contactless power transmission.

[0051] The R-axis limit block 111 is spaced apart from the R-axis motor 12. There is an assembly gap between the connector 14 and the R-axis limit block 111, which provides ample space for the rotation of the connector 14 and facilitates heat dissipation after the R-axis motor 12 has been working continuously. This prevents the motor from slowing down and reducing its accuracy due to high temperature, and ensures the stability of the equipment during long-term mass production.

[0052] It should be noted that the distance from the outer end face of the limiting protrusion to the outer peripheral surface of the connector 14 is greater than the distance from the outer end face of the limiting post 1111 to the outer peripheral surface of the connector 14. This makes the limiting post 1111 located on the movement trajectory of the limiting protrusion. That is, after the connector 14 rotates by the corresponding angle, the limiting protrusion on it will abut against the limiting post 1111. The limiting post 1111 and the limiting protrusion form a mechanical limiting engagement mechanism, which can physically limit the rotation stroke of the R-axis motor 12 and the flipping head 13, effectively preventing the motor from overshooting and overtraveling, and avoiding the risk of the chip colliding with surrounding components and structural damage due to excessive flipping.

[0053] Specifically, the limiting post 1111 is an elastic structure.

[0054] Optionally, the limiting post 1111 may be made of one or more materials, including but not limited to urethane, rubber, silicone, polyurethane, etc. The limiting post 1111 forms a flexible buffer effect at the moment of contact with the limiting protrusion, effectively avoiding the impact vibration, operating noise and component wear caused by hard metal collision.

[0055] At the same time, the elastic structure can absorb the inertial impact force when flipping into place, weaken the transmission of vibration to the nozzle 131 and the chip, and prevent quality defects such as cracks, displacement, and detachment of the precision chip caused by impact.

[0056] Furthermore, the limiting protrusions include a first limiting protrusion 141 and a second limiting protrusion 142, which are spaced apart along the outer peripheral surface of the connector 14; when the connector 14 changes from being abutted against the limiting post 1111 by the first limiting protrusion 141 to being abutted against the limiting post 1111 by the second limiting protrusion 142, the connector 14 rotates by 180°.

[0057] Understandably, the connector 14 is provided with a first limiting protrusion 141 and a second limiting protrusion 142 at intervals around its outer periphery. When the two sets of limiting protrusions switch and engage with the limiting post 1111, the connector 14 can be precisely rotated 180° to achieve precise positioning. This perfectly matches the standardized operation requirements for flipping the chip to both sides. The standard flipping process can be completed without repeated calibration of the angle using a complex procedure. The bidirectional symmetrical limiting structure unifies the forward and reverse motion logic of the equipment, achieving bidirectional mechanical limiting of the flipping structure in both forward and reverse directions. This eliminates defects such as single flipping angle deviation and reciprocating rotation misalignment, effectively reducing the defect rate of subsequent material transfer and bonding caused by chip posture deviation.

[0058] In some embodiments, the first limiting protrusion 141 and the second limiting protrusion 142 are specifically bolts fixed on the connector 14. Through the abutting cooperation of the first limiting protrusion 141 and the second limiting protrusion 142, the connector 14 can only rotate up to 180°, so as to avoid the R-axis motor 12 rotating too many times, causing the internal wiring to become excessively tangled and affecting the operation of the R-axis motor 12.

[0059] Optionally, the suction nozzle 131 in this embodiment can be rotated at multiple angles under the drive of the R-axis motor 12, including but not limited to 30°, 45°, 60°, 90°, 120°, 180°, etc., which can be set according to actual process requirements.

[0060] Further, please refer to Figure 5 and Figure 6 The flip head 13 includes a mounting base 132 and a first drive motor 133. The mounting base 132 is provided with a first linear guide rail 134. The first drive motor 133 drives the suction nozzle 131 to slide along the length direction of the first linear guide rail 134. The mounting base 132 includes a first mounting plate 1321 and a second mounting plate 1322 that are slidably connected. The first linear guide rail 134 is disposed on the side of the first mounting plate 1321 near the suction nozzle 131. The suction nozzle 131 is fixed on the second mounting plate 1322 and is slidably connected to the first mounting plate 1321 through the first linear guide rail 134. The side of the first mounting plate 1321 near the suction nozzle 131 is also provided with a first reading head 135. The second mounting plate 1322 is provided with a first grating ruler 136 that cooperates with the first reading head 135 at the corresponding position.

[0061] It should be noted that the first mounting plate 1321 and the second mounting plate 1322 are L-shaped. The first mounting plate 1321 is provided with a first linear guide rail 134 on the side away from the R-axis motor 12. The second mounting plate 1322 is slidably connected to the first linear guide rail 134 on one side. The suction nozzle 131 is fixed on the side of the second mounting plate 1322 away from the first linear guide rail 134. The first drive motor 133 drives the suction nozzle 131 to slide along the length direction of the first linear guide rail 134. The first linear guide rail 134 provides high-precision guiding constraints for the linear sliding of the suction nozzle 131, ensuring that the lifting, translating and picking-up actions of the suction nozzle 131 have high linearity and run smoothly without jamming.

[0062] In some embodiments, the first drive motor 133 is a voice coil motor, which can achieve higher acceleration, faster response and higher positioning accuracy compared with traditional motors. The magnitude of the output force is controlled by calibrating the magnitude of the constant current, ensuring the high precision of the force control system. The first drive motor 133 provides stable power output for the sliding of the suction nozzle 131, realizing the automatic and precise displacement adjustment of the suction nozzle 131, which can be adapted to chip picking and placing operations with different heights and different spacings.

[0063] Specifically, the first mounting plate 1321 is provided with a first reading head 135 on the side opposite to the R-axis motor 12, and the second mounting plate 1322 is provided with a first grating ruler 136. The first reading head 135 and the first grating ruler 136 are positioned correspondingly. When the second mounting plate 1322 drives the suction nozzle 131 to slide relative to the first mounting plate 1321, the first reading head 135 and the first grating ruler 136 cooperate to detect the sliding stroke and displacement data of the suction nozzle 131 in real time, accurately control the feed amount of the suction nozzle 131, greatly improve the alignment accuracy of chip adsorption, picking and placing, effectively solve the problems of misalignment and crushing damage during the picking and placing of ultra-thin chips and micro chips, and meet the requirements of high-precision semiconductor chip processing technology.

[0064] Furthermore, the first mounting plate 1321 is provided with two first limiting blocks 13211 on the side near the suction nozzle 131. The two first limiting blocks 13211 are spaced apart along the length direction of the first linear guide rail 134. The second mounting plate 1322 is provided with a second limiting block 13221 on the side near the first mounting plate 1321. The second limiting block 13221 is embedded between the two first limiting blocks 13211.

[0065] Understandably, the second limiting block 13221 is integrally formed on the side of the second mounting plate 1322 away from the nozzle 131. By embedding the second limiting block 13221 between the two first limiting blocks 13211, a bidirectional mechanical limit is formed on the linear sliding stroke of the nozzle 131, preventing the nozzle 131 from sliding beyond its travel and causing the guide rail to derail, thereby improving the safety of equipment operation.

[0066] Specifically, the limiting block is an elastic structure, which can be made of one or more materials including but not limited to urethane, rubber, silicone, polyurethane, etc. It forms a flexible buffer effect at the moment the limiting block comes into contact with the first mounting plate 1321, effectively avoiding the impact vibration, operating noise and component wear caused by hard metal collision.

[0067] Furthermore, the first mounting plate 1321 is also provided with a spring mounting seat 13212, on which a magnetic spring 15 is mounted; the magnetic spring 15 includes a spring stator 151 and a spring mover 152, the mounting seat 132 is provided with a mounting hole 13213, the spring stator 151 is fixed in the mounting hole 13213, one end of the spring mover 152 is fixed on the second mounting plate 1322, and the other end is embedded in the mounting hole 13213 and movably cooperates with the mounting hole 13213.

[0068] It should be noted that the first mounting plate 1321 has a spring mounting seat 13212 for mounting the magnetic spring 15 on the side opposite to the suction nozzle 131. The magnetic spring 15 works by magnetic coupling, without mechanical contact friction, operates without noise, has a compact structure and is resistant to aging, and is suitable for semiconductor cleanroom operation environments.

[0069] Specifically, the spring stator 151 and the spring mover 152 are coaxially mounted, and the direction of their magnetic force is consistent with the sliding direction.

[0070] In some embodiments, a constant force magnetic spring 15 is provided on the spring mounting base 13212.

[0071] In this embodiment, the magnetic spring 15 balances the weight of the suction nozzle 131 and provides flexible buffering and pressure adaptive compensation for the linear sliding motion of the suction nozzle 131. This allows the suction nozzle 131 to adapt to small pitch errors and assembly deviations during the chip adsorption, bonding, and placement docking stages. This reduces the load on the first drive motor 133 while ensuring that the moving part will not fall down and damage the chip when the power is off.

[0072] Furthermore, the nozzle 131 is provided with an air passage interface, and an air pipe 137 is connected to the air passage interface 1311. The upper surface of the first mounting plate 1321 is provided with a through hole 13214 and a fixing point 13215. One end of the air pipe 137 is connected to the air passage interface 1311, and the other end is fixed to the fixing point 13215 and extends outward through the through hole 13214 to connect with an external air supply device. The air pipe 137 located at the air passage interface 1311 and the fixing point 13215 is arc-shaped.

[0073] Understandably, the suction nozzle 131 is equipped with an air passage interface 1311 for an external air pipe 137. The other end of the air pipe 137 is connected to an external air supply device to provide a continuous and balanced air source for the vacuum adsorption of chips, so that the suction nozzle 131 can uniformly and controllably adsorb and clamp various chips, preventing chips from falling off during transportation.

[0074] In some embodiments, one end of the air tube 137 is connected to the air passage interface 1311, and the other end extends outward through the through hole 13214 to communicate with an external air supply device. The first mounting plate 1321 has a fixing point 13215 near the nozzle 131. The air tube 137 is fixed to the fixing point 13215 by means of rope, buckle or Velcro, so as to make the wiring neat and scientific and avoid the air tube 137 from being scattered and tangled.

[0075] Specifically, the air pipe 137 between the air inlet 1311 and the fixing point 13215 has an arc-shaped routing, which provides a flexible length for the flipping device 102 to flip. This adapts to the sliding and flipping of the suction nozzle 131, avoiding problems such as air blockage caused by pipe pulling, bending and squeezing during movement, aging and cracking of the air pipe 137, and fluctuations in negative pressure airflow.

[0076] Please refer to the previous document. Figure 1 and Figure 2 The flipping device 102 includes a moving component 2, which includes a support frame 21, a second drive motor 22, and a second linear guide rail 23. The base 11 is slidably connected to the second linear guide rail 23, and the second drive motor 22 is drivenly connected to the base 11 to drive the base 11 to slide along the second linear guide rail 23. The support frame 21 is provided with a second grating ruler 25, and the base 11 is provided with a second reading head 24 that cooperates with the second grating ruler 25 on the side near the second grating ruler 25.

[0077] It should be noted that the base 11 slides with the second linear track, and the second drive motor 22 drives the base 11 and the entire flipping head 13 to move horizontally, so that the flipping device 102 can flexibly shuttle back and forth between multiple work stations such as chip loading, visual inspection, and material transfer and unloading, realizing automated flow connection of multiple work stations.

[0078] Specifically, the support frame 21 and the base 11 are respectively equipped with a second grating ruler 25 and a second reading head 24, which together form a high-precision displacement closed-loop detection, collect the device's movement position data in real time, accurately control the multi-station docking accuracy, and ensure that the flipping device 102 is accurately aligned with each functional component.

[0079] Please see Figure 7The second embodiment of the present invention also provides a chip transfer device 100, including a worktable 20. The worktable 20 is provided with a wafer supply component 30, a transfer head component 10, a chip carrier component 40 and a vision recognition component 50. The transfer head component 10 includes a transfer device 101 and a flipping device 102. The flipping device 102 picks up a chip from the loading component and moves it to the vision recognition component 50 for position recognition. Based on the recognition result, the transfer device 101 picks up the chip on the flipping device 102 and transfers the chip to the chip carrier component 40.

[0080] Understandably, the chip transfer equipment 100 in this embodiment uses the workbench 20 as its support base and integrates a wafer supply component 30, a transfer head component 10, a chip carrier component 40, and a vision recognition component 50. The transfer head component 10 integrates the transfer device 101 and the aforementioned flipping device 102 to form an integrated fully automatic chip transfer production equipment. The functional modules are compactly laid out, effectively optimizing the utilization of workshop space. During operation, the flipping device 102 autonomously picks up the chip from the wafer supply component 30 and moves it to the vision recognition component 50 to complete the visual detection of position, posture, and appearance. The transfer device 101 accurately connects to the chip after flipping based on the visual recognition feedback data and finally transfers it to the chip carrier component 40 in an orderly manner to complete the discharge collection.

[0081] Specifically, the visual recognition component 50 is used to identify the position of the chip on the wafer supply component 30, the flipping device 102, and the chip carrier component 40. After the visual recognition component 50 positions the chip on the wafer supply component 30, the second drive motor 22 drives the flipping head 13 to move above the chip. The first drive motor 133 controls the suction nozzle 131 to move down to a preset position and open the vacuum suction of the chip. Then, the first drive motor 133 drives the flipping head 13 to rise to its original position. The second drive motor 22 drives the flipping head 13 to move above the chip carrier component 40. At the same time, the R-axis motor 12 drives the suction nozzle 131 to rotate at a preset angle, such as 180°. After the flipping head 13 moves and the suction nozzle 131 rotates into position, the visual recognition component 50 takes a picture of the chip to position it. Other material handling structures remove the chip from the suction nozzle 131. The second drive motor 22 drives the flipping head 13 back to the wafer supply component 30. At the same time, the R-axis motor 12 drives the suction nozzle 131 to rotate back to its original angle and start the next cycle.

[0082] The foregoing has provided a detailed description of a chip transfer device disclosed in the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip transfer device for picking up and placing chips in different postures and angles, characterized in that: The device includes a worktable, on which a wafer supply assembly, a transfer head assembly, a chip carrier assembly, and a vision recognition assembly are provided. The transfer head assembly includes a transfer device and a flipping device. The vision recognition assembly is used to identify the position of the chip on the wafer supply assembly, the flipping device, and the chip carrier assembly. The flipping device picks up a chip from the wafer supply assembly, moves it to the vision recognition assembly for position recognition, and the transfer device picks up the chip from the flipping device based on the recognition result and transfers the chip to the chip carrier assembly. The flipping device includes a moving component, and a base, an R-axis motor and a flipping head arranged in sequence. One end of the R-axis motor is fixed to the base, and the other end is driven to the flipping head to directly drive the flipping head to rotate at a preset angle. The flipping head is stacked on the R-axis motor along the rotation axis of the R-axis motor. The flipping head includes a suction nozzle for picking up chips. A portion of the suction nozzle and the R-axis motor are collinear with the rotation axis of the R-axis motor as a reference. The moving component includes a second linear guide rail, and the base slides with the second linear guide rail to allow the flipping head to move horizontally.

2. The chip transfer equipment as described in claim 1, characterized in that: The base is provided with an R-axis limiting block, which is spaced apart from the R-axis motor; The R-axis motor is provided with a connector near the flip head. The R-axis motor and the flip head are connected through the connector. A limit protrusion is provided on the outer circumferential surface of the connector. A limit post is provided on the side of the R-axis limit block near the connector. The distance from the outer end face of the limit protrusion to the outer circumferential surface of the connector is greater than the distance from the outer end face of the limit post to the outer circumferential surface of the connector. The R-axis motor is a DD motor.

3. The chip transfer equipment as described in claim 2, characterized in that: The limiting protrusion includes a first limiting protrusion and a second limiting protrusion, and the first limiting protrusion and the second limiting protrusion are spaced apart along the outer peripheral surface of the connector; When the connector changes from being pressed against the first limiting protrusion and the limiting post to being pressed against the second limiting protrusion and the limiting post, the connector rotates by 180°.

4. The chip transfer equipment as described in claim 2, characterized in that: The limiting post is an elastic structure.

5. The chip transfer equipment as described in claim 1, characterized in that: The flipping head includes a mounting base and a first drive motor. The mounting base is provided with a first linear guide rail. The first drive motor drives the suction nozzle to slide along the length direction of the first linear guide rail. The first drive motor is a voice coil motor. The mounting base includes a first mounting plate and a second mounting plate that are slidably connected. The first linear guide rail is disposed on the side of the first mounting plate near the nozzle. The nozzle is fixed on the second mounting plate and is slidably connected to the first mounting plate through the first linear guide rail. The first mounting plate is also provided with a first reading head on the side near the suction nozzle, and the second mounting plate is provided with a first grating ruler at the position corresponding to the first reading head, which cooperates with the first reading head.

6. The chip transfer equipment as described in claim 5, characterized in that: The first mounting plate has two first limiting blocks on the side near the suction nozzle, and the two first limiting blocks are spaced apart along the length direction of the first linear guide rail. The second mounting plate has a second limiting block on the side near the first mounting plate, and the second limiting block is embedded between the two first limiting blocks. The limiting block is an elastic structure.

7. The chip transfer equipment as described in claim 5, characterized in that: The first mounting plate is also provided with a spring mounting seat, on which a magnetic spring is mounted; The magnetic spring includes a spring stator and a spring mover. The spring mounting base is provided with a mounting hole. The spring stator is fixed in the mounting hole. One end of the spring mover is fixed to the second mounting plate, and the other end is embedded in the mounting hole and movably cooperates with the mounting hole.

8. The chip transfer equipment as described in claim 5, characterized in that: The nozzle is provided with an air passage interface, and an air tube is connected to the air passage interface. The upper surface of the first mounting plate is provided with a through hole and a fixing point. One end of the air tube is connected to the air passage interface, and the other end is fixed to the fixing point and extends outward through the through hole to connect with an external air supply device. The air pipe located at the air inlet and the fixed point is arc-shaped.

9. The chip transfer equipment as described in claim 1, characterized in that: The moving component includes a support frame, a second drive motor, and a second linear guide rail. The base is slidably connected to the second linear guide rail, and the second drive motor is drivenly connected to the base to drive the base to slide along the second linear guide rail. The support frame is provided with a second grating ruler, and the base is provided with a second reading head that cooperates with the second grating ruler on the side near the second grating ruler.

10. The chip transfer equipment as described in claim 1, characterized in that: After the visual recognition component positions the chip on the wafer supply component, the flipping head moves above the chip to adsorb the chip, and then moves above the chip carrier component to flip it at a preset angle.

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