Composite heat sink device

Abstract

This invention discloses a composite heat dissipation device for thermal contact with a heat source, comprising a three-dimensional heat transfer device and a loop radiator. The three-dimensional heat transfer device includes a vapor chamber and at least one vapor chamber heat pipe. The vapor chamber has a vapor chamber for thermal contact with the heat source. At least one vapor chamber heat pipe is disposed on the vapor chamber. The loop radiator is thermally coupled to the vapor chamber.

Description

Technical Field

[0001] This invention relates to a heat dissipation device, and more particularly to a composite heat dissipation device. Background Technology

[0002] During the operation of electronic devices, the heat generated by the processor needs to be dissipated quickly to maintain the operating temperature within the range recommended by the manufacturer. Using a vapor chamber to dissipate the heat generated by the processor in electronic devices is a common method. Specifically, a vapor chamber mainly consists of a cavity and a capillary structure. The cavity has a hollow chamber for filling with a working fluid. The capillary structure is arranged within the hollow chamber. The heated portion of the cavity is called the evaporation zone. The heat dissipation portion of the cavity is called the condensation zone. The liquid working fluid absorbs heat and vaporizes in the evaporation zone. The vaporized working fluid releases heat and condenses back into liquid working fluid in the condensation zone. Then, the liquid working fluid returns to the evaporation zone through the capillary structure, forming a heat dissipation cycle.

[0003] As technology advances, the operational efficiency of electronic devices increases, leading to greater heat generation. However, current vapor chambers still fall short in heat dissipation. In other words, current vapor chambers are ineffective at dissipating the high heat generated by electronic devices. Consequently, when the heat generated by the device becomes excessive, the cooling fluid within the vapor chamber may evaporate excessively, causing dry burning and diminishing the vapor chamber's heat dissipation function. Therefore, improving the heat dissipation efficiency of vapor chambers to meet the cooling requirements of high-heat-generating electronic devices is one of the problems that researchers must solve. Summary of the Invention

[0004] The present invention provides a composite heat dissipation device to improve the heat dissipation performance of the composite heat dissipation device in order to meet the heat dissipation requirements of electronic devices that generate high heat.

[0005] An embodiment of the present invention discloses a composite heat dissipation device for thermal contact with a heat source, comprising a three-dimensional heat transfer device and a loop radiator. The three-dimensional heat transfer device includes a vapor chamber and at least one vapor chamber heat pipe. The vapor chamber has a vapor chamber and is used for thermal contact with the heat source. At least one vapor chamber heat pipe is disposed on the vapor chamber. The loop radiator is thermally coupled to the vapor chamber. The loop radiator is connected to the vapor chamber so that the working fluid circulates between the loop radiator and the three-dimensional heat transfer device; or the loop radiator is not connected to the vapor chamber so that the working fluid circulates independently within the loop radiator and the three-dimensional heat transfer device respectively.

[0006] In the aforementioned composite heat dissipation device, the loop-type heat sink includes a loop-type cavity and at least one loop-type heat pipe. The loop-type cavity is thermally coupled to the heat spreader, and the at least one loop-type heat pipe is disposed in the loop-type cavity.

[0007] In the aforementioned composite heat dissipation device, the at least one loop heat pipe has an open end and a closed end, and the open end of the at least one loop heat pipe is disposed in the loop cavity.

[0008] In the aforementioned composite heat dissipation device, the at least one loop heat pipe has two open ends, and both open ends of the at least one loop heat pipe are disposed in the loop cavity.

[0009] In the aforementioned composite heat dissipation device, the heat exchange plate includes a first heat-conducting shell and a second heat-conducting shell. The first heat-conducting shell is used to make thermal contact with the heat source, and the second heat-conducting shell is disposed on the first heat-conducting shell so that the second heat-conducting shell and the first heat-conducting shell together surround the heat exchange chamber.

[0010] In the aforementioned composite heat dissipation device, the loop radiator includes at least one loop heat pipe, which forms a circulation channel and is thermally coupled to the heat spreader.

[0011] In the aforementioned composite heat dissipation device, the junction of the first heat-conducting shell and the second heat-conducting shell together forms at least one perforation, and the at least one loop heat pipe is located in the at least one perforation.

[0012] In the aforementioned composite heat dissipation device, the first heat-conducting shell includes a base plate and a first convex structure, the first convex structure protruding from the base plate in a direction away from the second heat-conducting shell.

[0013] In the aforementioned composite heat dissipation device, the first heat-conducting shell further includes a second convex structure, which protrudes from the first convex structure in a direction away from the second heat-conducting shell.

[0014] In the aforementioned composite heat dissipation device, the loop radiator includes at least one loop heat pipe, the opposite ends of which are respectively connected to the heat dissipation chamber of the heat exchange plate.

[0015] In the aforementioned composite heat dissipation device, the at least one loop heat pipe is a pulse heat pipe or a thermosiphon heat pipe.

[0016] The aforementioned composite heat dissipation device further includes a heat dissipation fin structure, which is thermally coupled to the at least one heat pipe.

[0017] In the aforementioned composite heat dissipation device, the heat dissipation fin structure is thermally coupled to the at least one loop heat pipe.

[0018] In the aforementioned composite heat dissipation device, the heat exchange plate includes a heat exchange cavity and a heat absorption cavity, the at least one heat exchange heat pipe is disposed in the heat exchange cavity of the heat exchange plate, and the heat absorption cavity protrudes from the heat exchange cavity.

[0019] In the aforementioned composite heat dissipation device, the loop-type radiator does not have a capillary structure.

[0020] The aforementioned composite heat dissipation device further includes a capillary structure disposed on the heat exchange plate.

[0021] The aforementioned composite heat dissipation device further includes at least one main heat column and at least one secondary heat column. The heat exchange plate has a thermal contact surface that is in thermal contact with the heat source. The at least one main heat column is located in the heat exchange chamber and corresponds to the area within the thermal contact surface of the heat exchange plate. The at least one secondary heat column is located in the heat exchange chamber and corresponds to the area outside the thermal contact surface of the heat exchange plate.

[0022] In the aforementioned composite heat dissipation device, the diameter of the at least one primary heat-conducting column is larger than the diameter of the at least one secondary heat-conducting column.

[0023] Another embodiment of the present invention discloses a composite heat dissipation device for thermal contact with a heat source, comprising a first heat-conducting shell, a second heat-conducting shell, a third heat-conducting shell, and a loop-type heat pipe. The first heat-conducting shell is used for thermal contact with the heat source. The second heat-conducting shell is stacked on top of the first heat-conducting shell, and together with the first heat-conducting shell, they surround a homogenized chamber. The loop-type chamber is not connected to the homogenized chamber. The loop-type heat pipe passes through the third heat-conducting shell and is connected to the loop-type chamber. The liquid cooling fluid located in the loop-type chamber vaporizes upon heating within the loop-type chamber and flows from the loop-type chamber into the loop-type heat pipe. The gaseous cooling fluid condenses within the loop-type heat pipe and flows back to the loop-type chamber, completing the cooling fluid's heat dissipation cycle to the heat source.

[0024] The aforementioned composite heat dissipation device further includes a heat pipe that passes through the third heat-conducting shell and the second heat-conducting shell and is connected to the heat-conducting chamber. When the heat generated by the heat source is transferred to the liquid cooling fluid in the heat-conducting chamber through the first heat-conducting shell, the liquid cooling fluid will vaporize and flow from the heat-conducting chamber into the heat pipe. The gaseous cooling fluid will condense in the heat pipe and then flow back to the heat-conducting chamber to complete the heat dissipation cycle of the cooling fluid to the heat source. There is no interference between the heat dissipation cycle in the loop chamber and the heat dissipation cycle in the heat-conducting chamber.

[0025] Another embodiment of the present invention discloses a composite heat dissipation device for thermal contact with a heat source, comprising a vapor chamber, a heat-absorbing chamber, and a loop heat pipe. The vapor chamber has a vapor chamber. The heat-absorbing chamber is thermally coupled to one side of the vapor chamber and is used for thermal contact with the heat source. The loop heat pipe passes through the vapor chamber and is connected to the vapor chamber. When heat generated by the heat source passes through the heat-absorbing chamber to the liquid cooling fluid located in the vapor chamber, the liquid cooling fluid vaporizes and flows from the vapor chamber into the loop heat pipe. The gaseous cooling fluid condenses in the loop heat pipe and then flows back to the vapor chamber to complete the cooling fluid heat dissipation cycle to the heat source.

[0026] In the aforementioned composite heat dissipation device, the at least one loop heat pipe is a pulse heat pipe or a thermosiphon heat pipe.

[0027] According to the composite heat dissipation device of the above embodiment, since the composite heat dissipation device is a composite three-dimensional heat transfer device and a loop radiator, the composite heat dissipation device can further dissipate heat from the heat source through the thermosiphon effect of the loop radiator, thus improving the heat dissipation efficiency to meet the heat dissipation requirements of high-heat heat sources. In this way, excessive evaporation of the cooling fluid in the composite heat dissipation device can be avoided, which would cause dry burning, thereby maintaining the service life of the composite heat dissipation device.

[0028] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Attached Figure Description

[0029] Figure 1 This is a perspective view of the composite heat dissipation device according to the first embodiment of the present invention.

[0030] Figure 2 for Figure 1 An exploded view of the composite heat dissipation device.

[0031] Figure 3 for Figure 1 A cross-sectional schematic diagram of a composite heat dissipation device.

[0032] Figure 4 for Figure 1 A cross-sectional schematic diagram showing the flow of cooling fluid within a composite heat dissipation device.

[0033] Figure 5 This is a perspective view of the composite heat dissipation device according to the second embodiment of the present invention.

[0034] Figure 6 for Figure 5 An exploded view of the composite heat dissipation device.

[0035] Figure 7for Figure 5 A cross-sectional schematic diagram of a composite heat dissipation device.

[0036] Figure 8 This is a perspective view of the composite heat dissipation device according to the third embodiment of the present invention.

[0037] Figure 9 for Figure 8 An exploded view of the composite heat dissipation device.

[0038] Figure 10 for Figure 8 A cross-sectional schematic diagram of a composite heat dissipation device.

[0039] Figure 11 This is a perspective view of the composite heat dissipation device according to the fourth embodiment of the present invention.

[0040] Figure 12 for Figure 11 An exploded view of the composite heat dissipation device.

[0041] Figure 13 for Figure 11 A cross-sectional schematic diagram of a composite heat dissipation device.

[0042] Figure 14 This is a perspective view of the composite heat dissipation device according to the fifth embodiment of the present invention.

[0043] Figure 15 for Figure 14 An exploded view of the composite heat dissipation device.

[0044] Figure 16 for Figure 15 A cross-sectional schematic diagram of a composite heat dissipation device.

[0045] Figure 17 This is a perspective view of the composite heat dissipation device according to the sixth embodiment of the present invention.

[0046] Figure 18 for Figure 17 An exploded view of the composite heat dissipation device.

[0047] Figure 19 for Figure 17 A cross-sectional schematic diagram of a composite heat dissipation device.

[0048] Figure 20 for Figure 17 A cross-sectional schematic diagram showing the flow of cooling fluid within a composite heat dissipation device.

[0049] In the attached figures, the following labels are used:

[0050] 10, 10A~10E: Composite heat dissipation device

[0051] 11,11A: Three-dimensional heat transfer device

[0052] 111, 111A: Heat spreader

[0053] 1111, 1111A: First heat-conducting shell

[0054] 11111: Base Plate

[0055] 11112: First convex hull structure

[0056] 11113: Second convex hull structure

[0057] 1112, 1112A: Second heat-conducting shell

[0058] 112: Heat pipe with uniform temperature

[0059] 113: Capillary structure

[0060] 12, 12A, 12B, 12D: Loop-type radiators

[0061] 121, 121A~121E: Loop-type heat pipe

[0062] 121B1, 121C1, 121D1: Open end

[0063] 121C2: Closed end

[0064] 122B, 122D: Loop-type cavity

[0065] 13: Dominant heat column

[0066] 14: Secondary heat-conducting column

[0067] 15: Temperature Equalization Chamber

[0068] 16: Heat absorption chamber

[0069] 17: Third heat-conducting shell

[0070] 18: Heat dissipation fin structure

[0071] A~V: Direction

[0072] H1: Heat source

[0073] H2: Perforation

[0074] P1: Thermal contact surface

[0075] S1: Temperature-controlled chamber

[0076] S2: Loop chamber Detailed Implementation

[0077] Please see Figures 1 to 3 . Figure 1 This is a perspective view of the composite heat dissipation device according to the first embodiment of the present invention. Figure 2 for Figure 1 An exploded view of the composite heat dissipation device. Figure 3 for Figure 1 A cross-sectional schematic diagram of a composite heat dissipation device.

[0078] The composite heat dissipation device 10 of this embodiment is used to make thermal contact with a heat source (not shown) and includes a three-dimensional heat transfer device 11 and a loop radiator 12. The three-dimensional heat transfer device 11 includes a heat spreader 111, a plurality of heat pipes 112 and a capillary structure 113.

[0079] The heat spreader 111 includes a first heat-conducting shell 1111 and a second heat-conducting shell 1112. The first heat-conducting shell 1111 is used to make thermal contact with a heat source. The second heat-conducting shell 1112 is disposed on the first heat-conducting shell 1111, so that the second heat-conducting shell 1112 and the first heat-conducting shell 1111 together surround a heat spreader chamber S1. The heat spreader chamber S1 is used to contain a cooling fluid (not shown).

[0080] In detail, the first heat-conducting shell 1111 includes a base plate 11111, a first convex structure 11112, and a second convex structure 11113. The first convex structure 11112 protrudes from the base plate 11111 in a direction away from the second heat-conducting shell 1112. The second convex structure 11113 has a thermal contact surface P1. The thermal contact surface P1 is in thermal contact with a heat source, so that the heat from the heat source is transferred to the cooling fluid through the thermal contact surface P1. The second convex structure 11113 protrudes from the first convex structure 11112 in a direction away from the second heat-conducting shell 1112.

[0081] These heat pipes 112 are disposed on the second heat-conducting shell 1112 and are connected to the heat-equalizing chamber S1. When the liquid cooling fluid absorbs heat from the heat source and vaporizes, it flows from the heat-equalizing chamber S1 into these heat pipes 112. A capillary structure 113 is disposed on the heat-equalizing plate 111. By providing the capillary structure 113, the gaseous cooling fluid can release heat from the heat source and condense, then flow back from these heat pipes 112 to the heat-equalizing chamber S1 via the capillary structure 113.

[0082] The loop-type radiator 12 includes multiple loop-type heat pipes 121. The loop-type radiator 12 is, for example, a pulse-type radiator, and the loop-type heat pipes 121 are, for example, pulse-type heat pipes (PHP). A pulse-type heat pipe is constructed by connecting multiple, for example, hollow U-shaped tubes in series, and it does not have capillary structures inside. In this way, the heat source can be further dissipated through the thermosiphon effect of the pulse-type heat pipe, thereby improving heat dissipation efficiency.

[0083] In this embodiment, the loop radiator 12 is a pulse radiator, and the loop heat pipe 121 is a pulse heat pipe, but this is not a limitation. In other embodiments, the loop radiator may also be, for example, a thermosiphon radiator, and these loop heat pipes may also be, for example, thermosiphon heat pipes. The so-called thermosiphon heat pipe has a capillary structure throughout the entire piping. When heated, the liquid cooling fluid partially vaporizes to form a gas-liquid mixture, and the capillary force of the capillary structure randomly distributes the liquid and gaseous cooling fluids within the loop heat pipe's piping. The density difference between the liquid and gaseous cooling fluids serves as the driving force for the heat dissipation cycle. Specifically, when heated, the liquid cooling fluid partially evaporates into a gaseous cooling fluid. The gaseous cooling fluid uses its vapor pressure to drive the liquid cooling fluid, thus providing the driving force for the heat dissipation cycle.

[0084] The two ends of these loop heat pipes 121 are respectively connected to the heat exchange chamber S1 of the heat exchange plate 111, so that the cooling fluid can circulate through the heat exchange plate 111 and these loop heat pipes 121 to dissipate heat from the heat source.

[0085] In this embodiment, since the composite heat dissipation device 10 consists of a composite three-dimensional heat transfer device 11 and a loop radiator 12, the composite heat dissipation device 10 can further dissipate heat from the heat source through the thermosiphon effect of the loop radiator 12, thus improving heat dissipation efficiency to meet the heat dissipation requirements of high-heat heat sources. In this way, excessive evaporation of the cooling fluid in the composite heat dissipation device 10 can be avoided, preventing dry burning and thus maintaining the service life of the composite heat dissipation device 10.

[0086] In this embodiment, the composite heat dissipation device 10 may further include multiple primary heat-conducting columns 13 and multiple secondary heat-conducting columns 14. These primary heat-conducting columns 13 are located in the temperature-equalizing chamber S1 and correspond to the area within the thermal contact surface P1, while these secondary heat-conducting columns 14 are located in the temperature-equalizing chamber S1 and correspond to the area outside the thermal contact surface P1. That is, the temperature of these primary heat-conducting columns 13 after heating is greater than the temperature of these secondary heat-conducting columns 14 after heating. By setting these primary heat-conducting columns 13 and these secondary heat-conducting columns 14, the efficiency of heat transfer can be further improved. The diameter of these primary heat-conducting columns 13 is, for example, smaller than the diameter of these secondary heat-conducting columns 14.

[0087] In this embodiment, the diameter of the primary heat-conducting pillars 13 is smaller than the diameter of the secondary heat-conducting pillars 14, but this is not a limitation. In other embodiments, the diameter of the primary heat-conducting pillars may also be greater than or equal to the diameter of the secondary heat-conducting pillars.

[0088] Please refer to the following: Figure 4 . Figure 4 for Figure 1A cross-sectional schematic diagram showing the flow of cooling fluid within the composite heat dissipation device. In this embodiment, when the heat generated by the heat source H1 is transferred through the first heat-conducting shell 1111 to the liquid cooling fluid located in the temperature-equalizing chamber S1, the liquid cooling fluid vaporizes and flows from the temperature-equalizing chamber S1 into the loop heat pipes 121 and the temperature-equalizing heat pipes 112 along directions A and B, respectively. Then, the gaseous cooling fluid condenses in the loop heat pipes 121 and the temperature-equalizing heat pipes 112 and flows back into the temperature-equalizing chamber S1 along directions C and D, respectively. In this way, the heat dissipation cycle of the cooling fluid to the heat source H1 is completed.

[0089] Please see Figures 5 to 7 . Figure 5 This is a perspective view of the composite heat dissipation device according to the second embodiment of the present invention. Figure 6 for Figure 5 An exploded view of the composite heat dissipation device. Figure 7 for Figure 5 A cross-sectional schematic diagram of a composite heat dissipation device.

[0090] The composite heat dissipation device 10A of this embodiment is similar to the composite heat dissipation device 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the composite heat dissipation device 10A includes a three-dimensional heat transfer device 11A and a single-loop radiator 12. The three-dimensional heat transfer device 11A includes a heat spreader 111A and a plurality of heat pipes 112.

[0091] The heat spreader 111A includes a first heat-conducting shell 1111A and a second heat-conducting shell 1112A. The first heat-conducting shell 1111A is used for thermal contact with a heat source. The second heat-conducting shell 1112A is disposed on the first heat-conducting shell 1111A, such that the second heat-conducting shell 1112A and the first heat-conducting shell 1111A together surround a heat spreader chamber S1. The heat spreader chamber S1 is used to contain a first cooling fluid (not shown). These heat spreader heat pipes 112 are disposed on the second heat-conducting shell 1112A and are connected to the heat spreader chamber S1.

[0092] The loop-type radiator 12A includes a loop-type heat pipe 121A. The loop-type heat pipe 121A is, for example, a pulsed heat pipe, but is not limited thereto. In other embodiments, the loop-type heat pipe may also be, for example, a thermosiphon heat pipe. The loop-type heat pipe 121A is used to contain a second cooling fluid (not shown). The freezing point of the first cooling fluid is, for example, greater than the freezing point of the second cooling fluid, and the filling ratio of the first cooling fluid in the temperature-equalizing chamber S1 is, for example, less than the filling ratio of the second cooling fluid in the loop-type heat pipe 121A.

[0093] The junction of the first heat-conducting shell 1111A and the second heat-conducting shell 1112A together forms multiple perforations H2, and these loop-type heat pipes 121A are respectively located in these perforations H2. The loop-type heat pipes 121A are not connected to the heat spreader chamber S1, so that the loop-type heat pipes 121A form a circulation channel and are thermally coupled to the heat spreader plate 111A. In other words, the first cooling fluid and the second cooling fluid will not mix. Thus, the heat dissipation circulation of the first cooling fluid and the heat dissipation circulation of the second cooling fluid will not interfere with each other.

[0094] like Figure 7 As shown. In this embodiment, when the heat generated by the heat source H1 is transferred through the first heat-conducting shell 1111A to the liquid cooling fluid located in the temperature-equalizing chamber S1, the liquid first cooling fluid vaporizes and flows from the temperature-equalizing chamber S1 into the temperature-equalizing heat pipes 112 along direction E. Then, the gaseous first cooling fluid condenses in the temperature-equalizing heat pipes 112 and flows back to the temperature-equalizing chamber S1 along direction F. In addition, the second cooling fluid located in the loop heat pipe 121A vaporizes after being heated near the temperature-equalizing chamber S1 in the loop heat pipe 121A, and condenses in the loop heat pipe 121A away from the temperature-equalizing chamber S1, circulating along directions G and H. In this way, the heat dissipation cycle of the cooling fluid to the heat source H1 is completed.

[0095] Please see Figures 8 to 10 . Figure 8 This is a perspective view of the composite heat dissipation device according to the third embodiment of the present invention. Figure 9 for Figure 8 An exploded view of the composite heat dissipation device. Figure 10 for Figure 8 A cross-sectional schematic diagram of a composite heat dissipation device.

[0096] The composite heat dissipation device 10B of this embodiment is similar to the composite heat dissipation device 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the composite heat dissipation device 10B includes a three-dimensional heat transfer device 11 and a single-loop radiator 12B. The three-dimensional heat transfer device 11 includes a heat spreader 111 and a plurality of heat pipes 112.

[0097] The heat spreader 111 includes a first heat-conducting shell 1111 and a second heat-conducting shell 1112. The first heat-conducting shell 1111 is used to make thermal contact with a heat source. The second heat-conducting shell 1112 is disposed on the first heat-conducting shell 1111, so that the second heat-conducting shell 1112 and the first heat-conducting shell 1111 together surround a heat spreader chamber S1. The heat spreader chamber S1 is used to contain a first cooling fluid (not shown). These heat spreader heat pipes 112 are disposed on the second heat-conducting shell 1112 and are connected to the heat spreader chamber S1.

[0098] A loop-type radiator 12B is used to contain a second cooling fluid (not shown) and includes a loop-type cavity 122B and a plurality of loop-type heat pipes 121B. The loop-type cavity 122B is thermally coupled to a second heat-conducting shell 1112. These loop-type heat pipes 121B are, for example, pulsed heat pipes. The freezing point of the first cooling fluid is, for example, greater than the freezing point of the second cooling fluid, and the filling ratio of the first cooling fluid in the temperature-equalizing chamber S1 is, for example, less than the filling ratio of the second cooling fluid in these loop-type heat pipes 121B.

[0099] Each of these loop heat pipes 121B has two open ends 121B1. Both open ends 121B1 are disposed in the loop cavity 122B. That is, the second cooling fluid can circulate through the two open ends 121B1 within the loop cavity 122B and these loop heat pipes 121B for heat dissipation circulation.

[0100] like Figure 10 As shown. In this embodiment, when the heat generated by the heat source H1 is transferred through the first heat-conducting shell 1111 to the liquid cooling fluid located in the temperature-equalizing chamber S1, the liquid first cooling fluid vaporizes and flows from the temperature-equalizing chamber S1 into the temperature-equalizing heat pipes 112 along direction I. Then, the gaseous first cooling fluid condenses in the temperature-equalizing heat pipes 112 and flows back to the temperature-equalizing chamber S1 along direction J. Furthermore, the liquid second cooling fluid located in the loop radiator 12B vaporizes after being heated in the loop cavity 122B and flows from the loop cavity 122B into the loop heat pipes 121B along direction K. Then, the gaseous second cooling fluid condenses in the loop heat pipes 121B and flows back to the loop cavity 122B along direction L. In this way, the cooling fluid's heat dissipation cycle for the heat source H1 is completed.

[0101] Please see Figures 11 to 13 . Figure 11 This is a perspective view of the composite heat dissipation device according to the fourth embodiment of the present invention. Figure 12 for Figure 11 An exploded view of the composite heat dissipation device. Figure 13 for Figure 11 A cross-sectional schematic diagram of a composite heat dissipation device.

[0102] The composite heat dissipation device 10C of this embodiment is similar to the composite heat dissipation device 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the composite heat dissipation device 10C includes a first heat-conducting shell 1111, a second heat-conducting shell 1112, a third heat-conducting shell 17, a plurality of loop heat pipes 121C, and a plurality of uniformly heated heat pipes 112.

[0103] A first heat-conducting shell 1111 is used for thermal contact with a heat source (not shown). A second heat-conducting shell 1112 is stacked on top of the first heat-conducting shell 1111, and together they surround a homogenizing chamber S1. The homogenizing chamber S1 is used to contain a cooling fluid (not shown). A third heat-conducting shell 17 is stacked on top of the second heat-conducting shell 1112, and together they surround a loop-type chamber S2. The loop-type chamber S2 is used to contain a second cooling fluid (not shown). These loop-type chambers S2 are not connected to the homogenizing chamber S1. That is, the first cooling fluid and the second cooling fluid will not mix. In this way, the heat dissipation circulation of the first cooling fluid and the heat dissipation circulation of the second cooling fluid will not interfere with each other.

[0104] These loop heat pipes 121C are, for example, pulse heat pipes, but are not limited thereto. In other embodiments, these loop heat pipes may also be, for example, thermosiphon heat pipes. These loop heat pipes 121C are integrally formed on the third heat-conducting shell 17. Each of these loop heat pipes 121C has an open end 121C1 and a closed end 121C2. The open end 121C1 is disposed in and communicates with the loop chamber S2, so that the second cooling fluid circulates within the loop chamber S2. These heat pipes 112 pass through the third heat-conducting shell 17 and the second heat-conducting shell 1112, and communicate with the heat-conducting chamber S1, so that the first cooling fluid circulates within the heat-conducting chamber S1.

[0105] In this embodiment, the loop heat pipes 121C are integrally formed and disposed on the third heat-conducting shell 17, but this is not a limitation. In other embodiments, the loop heat pipes and the third heat-conducting shell may also be, for example, separable individual components, and the loop heat pipes may be disposed on the third heat-conducting shell.

[0106] like Figure 13 As shown. In this embodiment, when the heat generated by the heat source H1 is transferred through the first heat-conducting shell 1111 to the liquid cooling fluid located in the temperature-equalizing chamber S1, the liquid first cooling fluid vaporizes and flows from the temperature-equalizing chamber S1 into the temperature-equalizing heat pipes 112 along direction M. Then, the gaseous first cooling fluid condenses in the temperature-equalizing heat pipes 112 and flows back to the temperature-equalizing chamber S1 along direction N. Furthermore, the liquid second cooling fluid located in the loop chamber S2 vaporizes after being heated in the loop chamber S2 and flows from the loop chamber S2 into the loop heat pipes 121C along direction O. Then, the gaseous second cooling fluid condenses in the loop heat pipes 121C and flows back to the loop chamber S2 along direction P. In this way, the heat dissipation cycle of the cooling fluid to the heat source H1 is completed.

[0107] Please see Figures 14 to 16 . Figure 14 This is a perspective view of the composite heat dissipation device according to the fifth embodiment of the present invention. Figure 15 for Figure 14 An exploded view of the composite heat dissipation device. Figure 16 for Figure 14 A cross-sectional schematic diagram of a composite heat dissipation device.

[0108] The composite heat dissipation device 10D of this embodiment is similar to the composite heat dissipation device 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the composite heat dissipation device 10D includes a three-dimensional heat transfer device 11, a single-loop radiator 12, and a heat dissipation fin structure 18. The three-dimensional heat transfer device 11 includes a heat spreader 111 and a plurality of heat pipes 112.

[0109] The heat spreader 111 includes a first heat-conducting shell 1111 and a second heat-conducting shell 1112. The first heat-conducting shell 1111 is used to make thermal contact with a heat source. The second heat-conducting shell 1112 is disposed on the first heat-conducting shell 1111, so that the second heat-conducting shell 1112 and the first heat-conducting shell 1111 together surround a heat spreader chamber S1. The heat spreader chamber S1 is used to contain a first cooling fluid (not shown). These heat spreader heat pipes 112 are disposed on the second heat-conducting shell 1112 and are connected to the heat spreader chamber S1, so that the first cooling fluid circulates within the heat spreader chamber S1.

[0110] A loop-type radiator 12D accommodates a second cooling fluid (not shown) and includes a loop-type cavity 122D and multiple loop-type heat pipes 121D. The loop-type cavity 122D is thermally coupled to a second heat-conducting shell 1112. The loop-type cavity 122D is not connected to the homogenizing chamber S1. That is, the first cooling fluid and the second cooling fluid do not mix. In this way, the heat dissipation circulation of the first cooling fluid and the heat dissipation circulation of the second cooling fluid do not interfere with each other. In addition, the loop-type cavity 122D has a through-hole 122D1. The second cooling fluid can be injected into the loop-type cavity 122D through the through-hole 122D1.

[0111] The freezing point of the first cooling fluid is, for example, greater than that of the second cooling fluid, and the filling ratio of the first cooling fluid in the temperature equalization chamber S1 is, for example, less than the filling ratio of the second cooling fluid in these loop heat pipes 121D. These loop heat pipes 121D are, for example, pulse heat pipes, but are not limited thereto. In other embodiments, these loop heat pipes may also be, for example, thermosiphon heat pipes. Each of these loop heat pipes 121D has two open ends 121D1. Both open ends 121D1 are disposed in the loop cavity 122D to allow the second cooling fluid to circulate within the loop cavity 122D.

[0112] The heat dissipation fin structure 18 is thermally coupled to the vapor chamber heat pipes 112 and the loop heat pipes 121D. In this way, the heat dissipation fin structure 18 can further dissipate heat from the heat dissipation areas formed by the vapor chamber heat pipes 112 and the heat dissipation areas formed by the loop heat pipes 121D.

[0113] In this embodiment, the heat dissipation fin structure 18 is thermally coupled to the vapor chamber heat pipes 112 and the loop heat pipes 121, but is not limited thereto. In other embodiments, the heat dissipation fin structure may be thermally coupled only to the vapor chamber heat pipes or only to the loop heat pipes.

[0114] like Figure 16 As shown. In this embodiment, when the heat generated by the heat source H1 is transferred through the first heat-conducting shell 1111 to the liquid cooling fluid located in the temperature-equalizing chamber S1, the liquid first cooling fluid vaporizes and flows from the temperature-equalizing chamber S1 into the temperature-equalizing heat pipes 112 in direction Q. Then, the gaseous first cooling fluid condenses in the temperature-equalizing heat pipes 112 and flows back to the temperature-equalizing chamber S1 in direction R. In addition, the liquid second cooling fluid located in the loop radiator 12D vaporizes after being heated in the loop cavity 122D and flows from the loop cavity 122D into the loop heat pipes 121D in direction S. Then, the gaseous second cooling fluid condenses in the loop heat pipes 121D and flows back to the loop cavity 122D in direction T. In this way, the cooling fluid heat dissipation cycle for the heat source H1 is completed.

[0115] Please see Figures 17 to 20 . Figure 17 This is a perspective view of the composite heat dissipation device according to the sixth embodiment of the present invention. Figure 18 for Figure 17 An exploded view of the composite heat dissipation device. Figure 19 for Figure 17 A cross-sectional schematic diagram of a composite heat dissipation device. Figure 20 for Figure 17 A cross-sectional schematic diagram showing the flow of cooling fluid within a composite heat dissipation device.

[0116] The composite heat dissipation device 10E of this embodiment is similar to the composite heat dissipation device 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the composite heat dissipation device 10E includes a temperature equalization cavity 15, a heat absorption cavity 16, and a plurality of loop heat pipes 121E.

[0117] The vapor chamber 15 has a vapor chamber S1. The vapor chamber S1 is used to contain a first cooling fluid (not shown). A heat-absorbing chamber 16 is thermally coupled to one side of the vapor chamber 15, and the vapor chamber 15 and the heat-absorbing chamber 16 are not connected. The heat-absorbing chamber 16 is used to make thermal contact with a heat source so that the heat generated by the heat source is transferred to the vapor chamber 15 through the heat-absorbing chamber 16. These loop heat pipes 121E are, for example, pulse heat pipes, but are not limited thereto; in other embodiments, these loop heat pipes may also be, for example, thermosiphon heat pipes. These loop heat pipes 121E pass through the vapor chamber 15. These loop heat pipes 121E are used to contain a second cooling fluid (not shown). These loop heat pipes 121E are not connected to the vapor chamber S1 so that the loop heat pipes 121E form a circulation channel. That is, the first cooling fluid and the second cooling fluid do not mix. In this way, the heat dissipation circulation of the first cooling fluid and the heat dissipation circulation of the second cooling fluid will not interfere with each other. In this embodiment, the heat absorption cavity 16 is thermally coupled to one side of the temperature equalization cavity 15, and the temperature equalization cavity 15 and the heat absorption cavity 16 are not connected. This structural design can also be applied to the first to fifth embodiments described above.

[0118] like Figure 20 As shown. In this embodiment, when the heat generated by the heat source H1 is transferred to the liquid cooling fluid located in the temperature equalization chamber S1 through the heat absorption cavity 16, the liquid cooling fluid vaporizes and flows from the temperature equalization chamber S1 into these loop-type heat pipes 121E in the direction U. Then, the gaseous cooling fluid condenses in these loop-type heat pipes 121E and flows back to the temperature equalization chamber S1 in the direction V. In this way, the heat dissipation cycle of the cooling fluid to the heat source H1 is completed.

[0119] According to the composite heat dissipation device of the above embodiment, since the composite heat dissipation device is a composite three-dimensional heat transfer device and a loop radiator, the composite heat dissipation device can further dissipate heat from the heat source through the thermosiphon effect of the loop radiator, thus improving the heat dissipation efficiency to meet the heat dissipation requirements of high-heat heat sources. In this way, excessive evaporation of the cooling fluid in the composite heat dissipation device can be avoided, which would cause dry burning, thereby maintaining the service life of the composite heat dissipation device.

[0120] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the appended claims.

Claims

1. A composite heat dissipation device, characterized in that, The composite heat dissipation device, used for thermal contact with a heat source, includes: A three-dimensional heat transfer device, comprising: A temperature-equalizing plate having a temperature-equalizing chamber and used for thermal contact with the heat source; and At least one heat pipe is disposed on the heat exchange plate; and A single-loop radiator is thermally coupled to the vapor chamber. The loop-type radiator is connected to the temperature equalization chamber so that the working fluid circulates between the loop-type radiator and the three-dimensional heat transfer device; or The loop radiator is not connected to the temperature equalization chamber so that the working fluid circulates independently in the loop radiator and the three-dimensional heat transfer device.

2. The composite heat dissipation device as described in claim 1, characterized in that, The loop-type radiator includes a loop-type cavity and at least one loop-type heat pipe. The loop-type cavity is thermally coupled to the vapor chamber, and the at least one loop-type heat pipe is disposed in the loop-type cavity.

3. The composite heat dissipation device as described in claim 2, characterized in that, The at least one-loop heat pipe has an open end and a closed end, and the open end of the at least one-loop heat pipe is disposed in the loop cavity.

4. The composite heat dissipation device as described in claim 2, characterized in that, The at least one-loop heat pipe has two open ends, and both open ends of the at least one-loop heat pipe are disposed in the loop cavity.

5. The composite heat dissipation device as described in claim 1, characterized in that, The heat spreader includes a first heat-conducting shell and a second heat-conducting shell. The first heat-conducting shell is used to make thermal contact with the heat source, and the second heat-conducting shell is disposed on the first heat-conducting shell so that the second heat-conducting shell and the first heat-conducting shell together surround the heat spreader chamber.

6. The composite heat dissipation device as described in claim 5, characterized in that, The loop-type radiator includes at least one loop-type heat pipe, which forms a circulation channel and is thermally coupled to the vapor chamber.

7. The composite heat dissipation device as described in claim 6, characterized in that, The junction of the first heat-conducting shell and the second heat-conducting shell together forms at least one perforation, and the at least one loop heat pipe is located in the at least one perforation.

8. The composite heat dissipation device as described in claim 5, characterized in that, The first heat-conducting shell includes a base plate and a first convex structure that protrudes from the base plate in a direction away from the second heat-conducting shell.

9. The composite heat dissipation device as described in claim 8, characterized in that, The first heat-conducting shell further includes a second convex structure that protrudes from the first convex structure in a direction away from the second heat-conducting shell.

10. The composite heat dissipation device as described in claim 1, characterized in that, The loop-type radiator includes at least one loop-type heat pipe, the opposite ends of which are respectively connected to the heat exchange chamber of the heat exchange plate.

11. The composite heat dissipation device as described in claim 2, 6, or 10, characterized in that, The at least one loop heat pipe is a pulse heat pipe or a thermosiphon heat pipe.

12. The composite heat dissipation device as described in claim 2, characterized in that, It further includes a heat dissipation fin structure that is thermally coupled to the at least one heat pipe.

13. The composite heat dissipation device as described in claim 12, characterized in that, The heat dissipation fin structure is thermally coupled to the at least one loop heat pipe.

14. The composite heat dissipation device as described in claim 1, characterized in that, The heat exchange plate includes a heat exchange cavity and a heat absorption cavity. At least one heat exchanger is disposed in the heat exchange cavity of the heat exchange plate, and the heat absorption cavity protrudes from the heat exchange cavity.

15. The composite heat dissipation device as described in claim 1, characterized in that, This loop-type radiator does not have a capillary structure.

16. The composite heat dissipation device as described in claim 1, characterized in that, The three-dimensional heat transfer device further includes a capillary structure disposed on the heat exchange plate.

17. The composite heat dissipation device as described in claim 1, characterized in that, It further includes at least one main heat column and at least one secondary heat column. The heat exchange plate has a thermal contact surface that is in thermal contact with the heat source. The at least one main heat column is located in the heat exchange chamber and corresponds to the area within the thermal contact surface of the heat exchange plate. The at least one secondary heat column is located in the heat exchange chamber and corresponds to the area outside the thermal contact surface of the heat exchange plate.

18. The composite heat dissipation device as described in claim 17, characterized in that, The diameter of the at least one primary heat-conducting column is larger than the diameter of the at least one secondary heat-conducting column.

19. A composite heat dissipation device, characterized in that, The composite heat dissipation device, used for thermal contact with a heat source, includes: A first heat-conducting shell is used to make thermal contact with the heat source; A second heat-conducting shell is stacked on the first heat-conducting shell, and together with the first heat-conducting shell, they form a uniform temperature chamber. A third heat-conducting shell is stacked on top of the second heat-conducting shell, and together with the second heat-conducting shell, they surround a loop-type chamber, which is not connected to the uniform temperature chamber; and A primary heat pipe is disposed in the third heat-conducting shell and connected to the primary heat-conducting chamber; In this process, the liquid cooling fluid located in the loop chamber will vaporize after being heated in the loop chamber and flow from the loop chamber into the loop heat pipe. The gaseous cooling fluid will condense in the loop heat pipe and flow back to the loop chamber to complete the cooling fluid's heat dissipation cycle to the heat source.

20. The composite heat dissipation device as described in claim 19, characterized in that, It also includes a heat pipe that passes through the third heat-conducting shell and the second heat-conducting shell and is connected to the heat-conducting chamber. When the heat generated by the heat source is transferred to the liquid cooling fluid in the temperature-equalizing chamber through the first heat-conducting shell, the liquid cooling fluid will vaporize and flow from the temperature-equalizing chamber into the temperature-equalizing heat pipe. The gaseous cooling fluid will condense in the temperature-equalizing heat pipe and then flow back to the temperature-equalizing chamber to complete the heat dissipation cycle of the cooling fluid to the heat source. There is no interference between the heat dissipation cycle in the loop chamber and the heat dissipation cycle in the temperature-equalizing chamber.

21. A composite heat dissipation device, characterized in that, The composite heat dissipation device, used for thermal contact with a heat source, includes: A homogenized cavity, having a homogenized chamber; A heat-absorbing cavity, thermally coupled to one side of the temperature-equalizing cavity, and used for thermal contact with the heat source; and A primary heat pipe is inserted into the temperature-equalizing cavity and connected to the temperature-equalizing chamber. When the heat generated by the heat source passes through the heat absorption cavity to the liquid cooling fluid located in the temperature equalization chamber, the liquid cooling fluid will vaporize and flow from the temperature equalization chamber into the loop heat pipe. The gaseous cooling fluid will condense in the loop heat pipe and then flow back to the temperature equalization chamber to complete the cooling fluid heat dissipation cycle to the heat source.

22. The composite heat dissipation device as described in claim 21, characterized in that, The at least one loop heat pipe is a pulse heat pipe or a thermosiphon heat pipe.

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