Intelligent ring with double-electrode arc-shaped encapsulation structure

Abstract

A kind of double electrode arc seal glue structure's intelligent ring, it includes: ring body;Intelligent electrical component is fixed in the inside of the ring body;Seal glue layer is encapsulated in the inside of the ring body, and the intelligent electrical component is covered;The intelligent electrical component includes double sensor electrode;The double sensor electrode is embedded in the seal glue layer, and the electrode contact end of the double sensor electrode is exposed to the inner surface of the seal glue layer;The inner surface of the seal glue layer is continuous smooth circular arc surface, and the outer peripheral surface of the seal glue layer is adapted and closely adheres to the inner side wall of the ring body, the inner surface of the seal glue layer is set as continuous smooth circular arc surface, the convex platform and step structure in the prior art are completely cancelled, and the smooth wearing surface without convex and step is formed in the inside of the ring body.When wearing, the inner ring of the ring is in uniform contact with the finger, does not jam hand, does not press finger, does not cover sweat, and is more friendly for long-term wearing.

Description

Technical Field

[0001] This invention relates to smart rings, specifically a smart ring with a dual-electrode arc-shaped sealing structure. Background Technology

[0002] As an emerging type of smart wearable device, smart rings integrate a variety of sensors and electronic components, enabling functions such as heart rate monitoring, blood oxygen detection, motion tracking, and body temperature measurement. They have received widespread attention in recent years.

[0003] Existing smart rings typically consist of a metal ring body, smart electrical components disposed inside the ring body, and a sealing layer encapsulated inside the ring body. However, existing smart rings have many shortcomings in terms of sealing structure and electrode arrangement.

[0004] First, the inner surface of the sealing layer in existing smart rings typically adopts a platform structure design, where the sealing layer forms a raised platform of a certain height on the inside of the ring body. This platform is used to support components such as sensor electrodes. This platform structure results in obvious raised steps on the inner ring, which can easily cause the ring to get stuck or press on the fingers when worn, leading to poor comfort over long-term wear.

[0005] Secondly, regarding electrode placement, existing sensor electrodes are typically positioned above the sealing layer platform, with the electrode contact ends protruding from the platform surface. This placement results in a small contact area between the electrode and the finger, and the electrodes are prone to shifting during wear, affecting the stability and accuracy of signal acquisition. Furthermore, the protruding electrodes further exacerbate wearing discomfort. Summary of the Invention

[0006] In view of the above situation and to overcome the defects of the prior art, the present invention provides a smart ring with a dual-electrode arc-shaped sealing structure, which effectively solves the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: The present invention includes: The precept body; The intelligent electrical components are fixed to the inside of the ring body; An adhesive layer is encapsulated on the inner side of the ring body and covers the smart electrical components; The intelligent electrical component includes dual sensor electrodes; The dual sensor electrodes are embedded in the encapsulation layer, and the electrode contact ends of the dual sensor electrodes are exposed on the inner surface of the encapsulation layer. The inner surface of the sealing layer is a continuous and smooth arc surface, and the outer peripheral surface of the sealing layer is adapted to and closely fits the inner sidewall of the ring body to form a smooth wearing surface without protrusions or steps on the inner side of the ring body.

[0008] According to the above technical solution, the inner surface of the sealing layer is coplanar with the electrode contact end of the dual sensor electrode.

[0009] According to the above technical solution, the sealing layer is a transparent or semi-transparent colloid, and the sealing layer is seamlessly bonded to the inner wall of the ring.

[0010] According to the above technical solution, the ring body is made of metal.

[0011] According to the above technical solution, the metal material is any one of 18K gold, platinum, or silver.

[0012] According to the above technical solution, the sealing layer is formed by curing epoxy resin cold-mounted adhesive.

[0013] According to the above technical solution, the intelligent electrical component also includes a photoplethysmography (PPG) sensor, a six-axis gravity sensor, and a temperature sensor, all of which are integrated inside the encapsulation layer.

[0014] According to the above technical solution, an arc-shaped transition portion is formed at the inner surface edge of the sealing layer.

[0015] Beneficial effects: 1. More comfortable to wear: This invention sets the inner surface of the sealing layer as a continuous and smooth arc surface, completely eliminating the raised platforms and stepped structures in the prior art, forming a smooth wearing surface without protrusions or steps on the inside of the ring. When wearing, the inner ring of the ring makes even contact with the finger, without pinching, pressing, or causing sweating, making it more comfortable for long-term wear.

[0016] 2. More accurate sensing: The dual sensor electrodes of this invention are embedded inside the sealing layer, and the electrode contact ends are coplanar with the inner surface of the sealing layer. The continuous and smooth arc surface fits naturally with the finger, resulting in a larger electrode contact area and more stable contact. This effectively avoids signal deviation caused by electrode misalignment during wear, improving the stability and accuracy of sensor signal acquisition.

[0017] 3. More sophisticated appearance: This invention eliminates the platform and stepped structure of the inner ring, making the inner ring of the ring clean and smooth. The overall appearance is simpler and more beautiful, which is more in line with the aesthetic design concept of jewelry. It can perfectly adapt to the structure of high-end jewelry such as 18K gold, platinum, and diamond setting without compromising the integrity of the ring's appearance.

[0018] 4. Larger internal space and thinner ring: This invention eliminates the platform structure that occupies internal space, effectively increasing the internal wearing diameter of the ring and providing a larger internal diameter space under the same outer diameter conditions. At the same time, the overall thickness of the ring is reduced, achieving a thinner and lighter design.

[0019] 5. Lower cost and higher yield: This invention adopts an arc-shaped sealing structure, which simplifies mold design and assembly processes, reducing processing defects and alignment losses. The sealant layer fits seamlessly with the inner wall of the ring, providing excellent sealing performance and better waterproof and dustproof effects. Overall manufacturing costs are reduced, and product yield is improved.

[0020] 6. Enhanced adaptability: This invention is perfectly compatible with precious metals such as 18K gold, platinum, and silver, as well as jewelry decorative structures such as diamond inlay, making it suitable for the design and manufacturing of high-end smart jewelry products. Attached Figure Description

[0021] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 This is a three-dimensional structural diagram of the second perspective of the present invention; Figure 3 This is the front view of the present invention; Figure 4 This is a side view of the present invention; The numbers in the diagram are: 1. Ring body; 2. Sealing layer; 3. Dual sensor electrodes; 4. Arc-shaped transition section. Detailed Implementation

[0022] The following is in conjunction with the appendix Figure 1-4 The specific embodiments of the present invention will be described in further detail below.

[0023] Example 1, by Figure 1-4This invention provides a smart ring with a dual-electrode arc-shaped sealing structure, comprising a ring body 1, a sealing layer 2, and dual sensor electrodes 3. The ring body 1 has a ring-shaped structure with an inner space for accommodating a smart electrical component. The smart electrical component is fixed to the inner side of the ring body 1, and the sealing layer 2 encapsulates and covers the smart electrical component within the inner side of the ring body 1. The smart electrical component includes dual sensor electrodes 3, which are embedded in the sealing layer 2, with their electrode contact ends exposed on the inner surface of the sealing layer 2. The inner surface of the sealing layer 2 is a continuous, smooth arc-shaped surface, and the outer peripheral surface of the sealing layer 2 is adapted to and tightly fitted with the inner wall of the ring body 1, forming a smooth wearing surface without protrusions or steps on the inner side of the ring body 1. In this embodiment, the inner wall of the ring body 1 is an arc-shaped surface adapted to the outer peripheral surface of the sealing layer 2, and the two are seamlessly fitted by bonding or curing. The aforementioned "continuous and smooth arc surface" refers to the fact that the inner surface of the sealing layer 2 is a smooth arc in both the circumferential and axial directions of the ring, without any protrusions, depressions, edges, or step structures. The entire inner surface is a complete arc-shaped rotating surface, thereby ensuring that it matches the natural curvature of the human finger.

[0024] Specifically, the ring body 1 is made of metal. The metal material provides the ring with sufficient structural strength and wear resistance, while also facilitating a jewelry-grade appearance. The metal can be any of 18K gold, platinum, or silver. 18K gold has suitable hardness and good ductility, making it suitable for crafting intricate jewelry structures such as diamond settings; platinum has excellent corrosion resistance and stable chemical properties, making it suitable for long-term wear; silver has high conductivity and cost-effectiveness. The outer surface of the ring body 1 can be decorated with patterns, engravings, or gemstone settings as needed to achieve a seamless integration of the smart ring and jewelry. Before the sealing layer 2 is poured in, the inner wall of the ring body 1 undergoes pretreatment processes such as degreasing, oil removal, and drying to remove oil and impurities from the inner wall surface, ensuring a strong bond between the sealing layer 2 and the inner wall of the ring body 1, preventing the sealing layer 2 from loosening or delaminating during use.

[0025] Furthermore, the sealing layer 2 is formed by curing epoxy resin cold-mounting colloid. Epoxy resin cold-mounting colloid possesses excellent flowability, wetting properties, and curing performance. In its uncured state, it can fully flow and fill every corner of the inner accommodating space of the ring 1, completely encapsulating the intelligent electrical components. The cured epoxy resin colloid exhibits high hardness, good electrical insulation, and excellent sealing performance, effectively isolating external moisture, dust, and oxygen, protecting the internal electronic components from environmental corrosion. After curing, the epoxy resin cold-mounting colloid also possesses a certain degree of mechanical strength, providing mechanical support and protection for the internal electronic components, preventing displacement or damage when subjected to external impacts. The sealing layer 2 is formed using a cold-mounting process with a low curing temperature (typically within the range of room temperature to 60°C), avoiding thermal damage to heat-sensitive components (such as batteries and chips) in the intelligent electrical components caused by high-temperature curing, ensuring product reliability and lifespan. The sealant layer 2 is seamlessly bonded to the inner wall of the ring body 1, meaning there are no gaps or air bubbles between the outer circumference of the sealant layer 2 and the inner sidewall of the ring body 1, forming an integrated sealing structure that effectively prevents moisture and dust from seeping in from the joints, achieving a waterproof and dustproof rating of IP67 or higher.

[0026] Furthermore, the sealing layer 2 is a transparent or semi-transparent colloid. The advantages of using a transparent or semi-transparent colloid are twofold: firstly, during manufacturing, it facilitates observation of the positioning and packaging quality of internal electronic components through the sealing layer 2, allowing for timely detection and correction of defects such as component misalignment and residual bubbles, thus improving product yield; secondly, when the finished ring is worn, the intricate internal electronic structure can be observed through the transparent or semi-transparent sealing layer 2, creating a unique technological aesthetic visual effect and enhancing the product's perceived quality and recognizability. The light transmittance of the transparent or semi-transparent colloid can be adjusted according to actual needs, for example, by adding appropriate amounts of light diffusing agents or colorants to achieve different transparency and color effects to meet the requirements of different design styles.

[0027] Specifically, such as Figure 2 and Figure 3As shown, the inner surface of the sealing layer 2 is coplanar with the electrode contact ends of the dual-sensor electrodes 3. "Coplanar arrangement" means that the exposed surface of the electrode contact ends of the dual-sensor electrodes 3 and the inner surface of the sealing layer 2 are on the same geometric plane. The electrode contact ends neither protrude from nor are recessed into the inner surface of the sealing layer 2, but are flush with it. This coplanar arrangement allows the electrode contact ends and the inner surface of the sealing layer 2 to form a complete, continuous, smooth arc surface. During wear, the electrode contact ends can achieve full face-to-face contact with the skin of the finger, resulting in a large contact area and uniform contact pressure, which helps reduce contact impedance and improve the acquisition quality of ECG and bioimpedance signals. Simultaneously, the coplanar arrangement avoids the local pressure or scratching sensation caused by protruding electrodes, further enhancing wearing comfort. The surface of the electrode contact ends can also be textured or coated (such as gold, silver, or silver chloride plating) to further reduce contact impedance and improve biocompatibility.

[0028] Furthermore, the coplanarity of the electrode contact ends of the dual-sensor electrodes 3 on the inner surface of the sealing layer 2 is controlled within ±0.05mm. This coplanarity control is achieved through precise mold positioning during the injection molding process, ensuring that the height difference between the electrode contact ends and the inner surface of the sealing layer 2 does not exceed ±0.05mm. Within this accuracy range, the human finger cannot perceive the interface difference between the electrode and the adhesive when wearing the device, and a uniform electrical contact interface can be formed between the electrode and the skin, which is beneficial for improving the consistency and repeatability of bioelectrical signal acquisition. The spacing between the two electrodes of the dual-sensor electrodes 3 is set to 8mm to 15mm. This spacing range is determined based on the anatomical characteristics of the human finger and the optimal electrode spacing requirements for electrocardiogram signal acquisition—too small a spacing will result in too low a signal amplitude, while too large a spacing may exceed the distance limit between the two effective contact areas on a single finger. In this embodiment, the dual-sensor electrodes 3 are arranged on opposite sides of the inner surface of the sealing layer 2 along the circumference of the ring, with an arc length distance of 10mm ± 1mm ​​between the two electrodes. This spacing can obtain an electrocardiogram signal with suitable amplitude and a good signal-to-noise ratio.

[0029] Furthermore, the intelligent electrical components also include a photoplethysmography (PPG) sensor, a six-axis gravity sensor, and a temperature sensor. The PPG sensor detects physiological parameters such as heart rate and blood oxygen saturation. It includes a light emitter and a light receiver, both encapsulated within an adhesive layer 2, with their working surfaces facing the inner surface of the adhesive layer 2. The light signal emitted by the emitter passes through the transparent or translucent adhesive layer 2 and is projected onto the finger skin. After reflection and scattering by the finger tissue, it is received by the light receiver. By analyzing the intensity changes of the received light signal, physiological information such as heart rate and blood oxygen can be extracted. The six-axis gravity sensor (IMU sensor, i.e., inertial measurement unit, including a three-axis accelerometer and a three-axis gyroscope) detects the wearer's motion state, posture, and activity level, enabling functions such as step counting, motion recognition, and sleep monitoring. The temperature sensor detects the wearer's body temperature, with its sensing surface positioned close to the inner surface of the adhesive layer 2 to reduce the heat conduction path and improve the real-time temperature response. The aforementioned photoplethysmography (PPG) sensor, six-axis gravity sensor, and temperature sensor are all integrated within the encapsulation layer 2. Electrical connections are achieved via flexible or rigid circuit boards, and together with the main control chip and communication module (such as a Bluetooth module), they form a complete intelligent electrical system. All electronic components are completely encapsulated by the encapsulation layer 2, isolating them from the external environment and ensuring electrical safety and long-term reliability.

[0030] Furthermore, the light emitter and light receiver of the photoplethysmography (PPG) sensor are respectively located at two different positions inside the encapsulation layer 2, with a center-to-center distance of 3mm to 6mm between them. This distance range is determined as follows: if the distance is too small, the proportion of direct light received by the light receiver (i.e., light signal not fully modulated by the finger tissue) is too large, affecting the extraction of the AC component of the pulse wave signal; if the distance is too large, the propagation path of the light signal in the finger tissue is too long, resulting in excessive signal attenuation at the receiver and a reduced signal-to-noise ratio. In this embodiment, the light emitter uses a combination of green LEDs (light-emitting diodes, wavelength 520nm-540nm) and red / infrared LEDs (wavelengths 660nm and 940nm), where the green LED is used for heart rate monitoring, and the red and infrared LEDs are used for blood oxygen saturation monitoring. The optical receiver uses a photodiode or an ambient light sensor (ALS), with its photosensitive surface facing the inner surface of the encapsulation layer 2, and the center line of the photosensitive surface is at a certain angle (such as 30° to 60°) to the center line of the optical emitter, so as to avoid specular reflection light from directly entering the receiver and improve signal quality.

[0031] Furthermore, the distance between the temperature sensor's sensing surface and the inner surface of the sealing layer 2 is 0.2mm to 1.0mm. The temperature sensor uses a negative temperature coefficient thermistor (NTC thermistor) or a digital temperature sensing chip (such as the DS18B20 or TMP117). Its sensing surface is positioned close to the inner surface of the sealing layer 2 to shorten the heat conduction path and reduce the thermal response time constant. Testing has shown that within the above distance range, the temperature sensor's thermal response time to changes in the wearer's body temperature can be controlled within 3 seconds, meeting the requirements for real-time body temperature monitoring. The thickness of the adhesive between the temperature sensor and the inner surface of the sealing layer 2 should not be too thin (otherwise the sensing surface may be exposed when subjected to force) nor too thick (otherwise the thermal conduction delay will increase). A thickness range of 0.2mm to 1.0mm ensures both mechanical protection and thermal response speed.

[0032] Specifically, such as Figure 3 As shown, an arc-shaped transition portion 4 is formed at the inner surface edge of the sealing layer 2. The arc-shaped transition portion 4 is located at the junction area between the inner surface of the sealing layer 2 and the inner wall of the ring body 1. Its function is to eliminate the edges and steps at the edge of the inner surface of the sealing layer 2, allowing the inner surface of the sealing layer 2 to smoothly transition to the inner wall of the ring body 1. The radius of curvature of the arc-shaped transition portion 4 is set to 0.5mm to 2.0mm. The determination of this radius of curvature range is based on the following: if the radius of curvature is too small, the transition is not smooth enough, and there is still a noticeable boundary, which may adversely affect wearing comfort; if the radius of curvature is too large, it will occupy too much internal space, reducing the effective wearing inner diameter of the ring. In this embodiment, the radius of curvature of the arc-shaped transition portion 4 is preferably 1.0mm. At this radius of curvature, the finger will not be scratched or stuck by the inner surface edge during wearing and removing, and the entire inner ring of the ring presents a complete streamlined and smooth experience. The curved transition section 4 further eliminates the boundary between the sealing layer 2 and the ring body 1, making the entire inner ring of the ring present a smooth, integrated texture in both visual and tactile senses, which meets the aesthetic requirements of high-end jewelry products.

[0033] Furthermore, the present invention also provides a method for manufacturing the smart ring with the above-mentioned dual-electrode arc-shaped sealing structure, the method comprising the following steps: Step 1: Provide ring body 1 and pre-treat its inner wall. Pre-treatment includes ultrasonic cleaning to degrease and remove oil from ring body 1. The cleaning medium is an environmentally friendly metal cleaning agent (such as a water-based cleaner or alcohol solvent). The cleaning time is 5 to 15 minutes, and the cleaning temperature is 40°C to 60°C. After cleaning, rinse with deionized water and dry in clean hot air at 80°C to 100°C to ensure the inner wall surface of ring body 1 is free of oil, dust, and residual moisture. After drying, surface activation treatment is performed on the inner wall of ring body 1 using plasma treatment or silane coupling agent coating to enhance the chemical bonding and physical adhesion between the sealant layer 2 and the inner wall of ring body 1. The plasma treatment uses an oxygen or argon gas atmosphere, with a treatment power of 100W to 300W and a treatment time of 2 to 8 minutes.

[0034] Step Two: Fix the intelligent electrical components to the predetermined positions inside the ring body 1. The intelligent electrical components include dual-sensor electrodes 3, a photoplethysmography (PPG) sensor, a six-axis gravity sensor, a temperature sensor, a main control chip, a battery, and a communication module. Each component is pre-assembled on a flexible or rigid circuit board to form a complete electrical module. This electrical module is fixed to the predetermined positions inside the ring body 1 using adhesive bonding or mechanical snap-fit, ensuring that the electrode contact ends of the dual-sensor electrodes 3 face the geometric center of the ring body 1, and that the working surfaces of each sensor face the inner opening of the ring body 1. A dedicated positioning fixture is used during the fixing process to ensure the spatial positioning accuracy of each component.

[0035] Step 3: Mix components A and B of the epoxy resin cold-mounting colloid according to a predetermined ratio (e.g., a mass ratio of 2:1 or 3:1, the specific ratio depending on the selected colloid type). Use a vacuum mixer to degas and stir under a vacuum of -0.08MPa to -0.1MPa at a speed of 300rpm to 600rpm for 3min to 8min, until all air bubbles are removed from the colloid. Inject the degassed epoxy resin cold-mounting colloid into the inner receiving space of ring 1 through the injection port, allowing the colloid to fully fill the receiving space and encapsulate the intelligent electrical components under gravity or low-pressure assistance. The injection process is carried out under vacuum, with an injection temperature of 25℃±5℃, an injection pressure of 0.1MPa to 0.3MPa, and an injection speed of 1mL / min to 5mL / min. During the injection process, air in the receiving space is discharged through the vent holes on ring 1 to prevent air bubbles from being mixed into the colloid.

[0036] Step 4: A precision mold is used to shape the inner surface of the sealant layer 2. This precision mold has an arc-shaped shaping surface that matches the desired shape of the inner surface of the sealant layer, with a surface roughness Ra ≤ 0.4 μm. The mold is pressed into the uncured colloid from the open end of the ring 1. A shaping pressure of 0.05 MPa to 0.2 MPa is applied to the colloid through the arc-shaped shaping surface of the mold, forming a continuous and smooth arc surface on the inner surface of the colloid. Simultaneously, a precision positioning structure on the mold ensures that the electrode contact ends of the dual sensor electrodes 3 are precisely exposed on the inner surface of the sealant layer 2 after shaping, and the coplanarity between the electrode contact ends and the inner surface of the sealant layer 2 is controlled within ±0.05 mm. A release agent (such as a polytetrafluoroethylene coating or silicone oil) can be applied to the shaping surface of the mold to prevent the colloid from adhering to the mold surface, facilitating demolding.

[0037] Step 5: Curing of the sealant layer 2 is performed while maintaining the mold setting pressure. Curing can be done at room temperature or with heat, preferably using a staged heat curing method. This involves first curing at 40℃±2℃ for 4 to 6 hours, then increasing the temperature to 60℃±2℃ for another 2 to 4 hours, and finally allowing it to cool naturally to room temperature. The advantages of staged heat curing are: slow curing at low temperatures allows for gradual release of internal stress, reducing stress concentration caused by curing shrinkage; and the high-temperature stage promotes full cross-linking of the sealant, leading to a more complete curing reaction and improved curing degree and mechanical properties. After curing, a seamless, integrated sealing structure is formed between the sealant layer 2 and the inner wall of the ring 1. Testing showed that the volume shrinkage rate under the above curing conditions was controlled within 0.5% to 1.5%, effectively ensuring the tight adhesion between the sealant layer 2 and the inner wall of the ring 1. After demolding, the surface quality of the sealant layer 2 is inspected to ensure there are no defects such as bubbles, cracks, or shrinkage cavities.

[0038] Step Six: Perform finishing on the inner surface of the cured sealant layer 2. Finishing is achieved using ultra-precision grinding or polishing to remove any tiny burrs or flash that may have formed during the shaping process, ensuring a surface roughness of Ra≤0.8μm. This guarantees the smoothness and finish of the inner surface meet the requirements for wearing comfort and aesthetics. After finishing, pneumatic cleaning or ultrasonic cleaning is used to remove surface dust. After passing inspection, the surface is packaged and shipped. The above finishing steps may also include cleaning and activation treatment of the electrode contact surface to remove any oxide or contamination layers that may have formed during manufacturing, ensuring the electrical performance of the electrodes.

[0039] Furthermore, in step three of the above manufacturing method, the epoxy resin cold-mounting colloid can be a room-temperature curing epoxy resin system or a UV-curing epoxy resin system. When using a UV-curing epoxy resin system, the curing treatment in step five uses ultraviolet irradiation with a wavelength of 365nm or 395nm, an irradiation intensity of 50mW / cm² to 200mW / cm², and an irradiation time of 30s to 180s. UV curing offers advantages such as fast curing speed and low curing temperature (close to room temperature), making it particularly suitable for encapsulating temperature-sensitive smart electrical components, further reducing the risk of thermal damage. When using a room-temperature curing epoxy resin system, the curing temperature is 20℃ to 30℃, and the curing time is 12h to 48h. This method requires no additional heating or light equipment, has a wide process window, is easy to operate, and has low equipment costs. Both curing methods can be flexibly selected according to actual production conditions and product requirements.

[0040] Furthermore, as an alternative to any of the above embodiments, the sealing layer 2 can also be formed by curing a biocompatible silicone material. Biocompatible silicone materials have low hardness (Shore A hardness of 20 to 50), excellent flexibility, and skin-friendliness, resulting in a softer and more comfortable feel against the skin when worn, making them suitable for users with sensitive skin or applications requiring prolonged continuous wear. The silicone material is cured at room temperature or by heating, with a curing time of 2 to 24 hours. The bonding force between the silicone sealing layer and the inner wall of the metal ring body 1 can be enhanced by applying a primer (such as a silane primer or a titanate primer). After curing, the silicone material exhibits excellent elasticity and resilience; when the ring is subjected to external pressure, the sealing layer 2 can produce slight elastic deformation to buffer the external force, further improving wearing comfort.

[0041] Furthermore, based on any of the above embodiments, the ratio between the radius of curvature of the inner surface of the sealing layer 2 and the outer diameter of the ring body 1 is set to 0.75 to 0.95. This ratio range is determined as follows: a ratio that is too low (i.e., the radius of curvature is too small relative to the outer diameter) means that the inner surface curvature of the sealing layer 2 is large and the arc surface is steep, resulting in poor matching with the natural curvature of most human fingers, a smaller contact area, and reduced comfort when worn; a ratio that is too high (i.e., the radius of curvature is too large relative to the outer diameter) means that the inner surface is close to a plane, also resulting in poor matching with the natural curvature of the fingers, and reducing the effective inner diameter of the ring under the same outer diameter conditions. In this embodiment, based on the average diameter of the middle finger of Asian adult males (approximately 18mm to 20mm) and the average diameter of the middle finger of females (approximately 16mm to 18mm), the radius of curvature of the inner surface of the sealing layer 2 is set to 8mm to 10mm and 7mm to 9mm, respectively, so that the inner ring of the ring matches the finger shape of most users, achieving optimal fit and comfort. Meanwhile, the aforementioned setting of the radius of curvature also helps to increase the contact area between the electrode and the skin of the finger, thereby improving the signal-to-noise ratio and stability of the sensor signal.

[0042] Furthermore, the electrode contact end of the dual-sensor electrode 3 is provided with a micro-protrusion structure. This micro-protrusion structure has a height of 0.02mm to 0.08mm and a width of 0.1mm to 0.5mm. Multiple micro-protrusion structures are arranged in an array, with a spacing of 0.3mm to 0.8mm between adjacent micro-protrusion structures. The purpose of the micro-protrusion structure is that, when worn, it can pierce or squeeze away the stratum corneum and sweat film on the surface of the finger skin, forming a more direct electrical contact interface between the electrode contact end and the deep skin tissue. This further reduces skin contact impedance and improves the acquisition quality of ECG and bioimpedance signals. The height of the micro-protrusion structure does not exceed 0.08mm to avoid stinging or discomfort; the height is not less than 0.02mm to ensure its functional effectiveness. The micro-protrusion structure can be formed on the surface of the electrode contact end through processes such as electroforming, laser etching, or chemical etching.

[0043] Specifically, in use, the smart ring of this invention is worn on the finger by the user, with the continuous, smooth, arc-shaped surface of the sealing layer 2 closely adhering to the finger surface. The electrode contact ends of the dual-sensor electrodes 3 are in stable contact with the finger skin for collecting electrocardiogram (ECG) signals and / or bioelectrical impedance analysis (BIA) signals. The photoplethysmography (PPA) sensor emits light signals to the finger through the sealing layer 2 and receives reflected or transmitted light modulated by the finger tissue for detecting heart rate and blood oxygen saturation. The six-axis gravity sensor detects the wearer's movement state and posture changes for step counting, activity statistics, and sleep quality analysis. The temperature sensor detects the wearer's body temperature. The main control chip processes and analyzes the signals from each sensor and transmits the processing results to an external terminal device (such as a smartphone, tablet, or cloud server) for display and storage via a communication module. Because the inner surface of the sealing layer 2 is a continuous and smooth arc surface without any protrusions or steps, users will not feel discomfort such as hand pinching, finger pressure or sweating during long-term wear. The sensor electrodes always maintain stable contact with the skin, and the continuity and accuracy of signal acquisition are effectively guaranteed.

[0044] In summary, this invention effectively solves the technical problems of existing smart ring platform-type sealing structures, such as uncomfortable wearing, inaccurate sensing, poor appearance, and high cost, by setting the inner surface of the sealing layer 2 as a continuous and smooth arc surface and embedding the dual sensor electrodes 3 into the sealing layer 2 with their electrode contact ends coplanar with the inner surface of the sealing layer 2. The shape, structure, positional relationship of each component in the technical solution of this invention, as well as the parameters of each step of the manufacturing method, have been described in detail above. Those skilled in the art can completely reproduce the technical solution of this invention based on the above description and achieve the expected technical effects. The technical features described in the above specific embodiments can be arbitrarily combined without conflict, and the combined technical solution still falls within the protection scope of this invention.

Claims

1. A smart ring with a dual-electrode arc-shaped sealing structure, characterized in that, include: Precept Body (1); The intelligent electrical component is fixed to the inside of the ring body (1); The sealing layer (2) is encapsulated on the inside of the ring body (1) and covers the smart electrical components; The intelligent electrical component includes dual sensor electrodes (3); The dual sensor electrode (3) is embedded in the sealant layer (2), and the electrode contact end of the dual sensor electrode (3) is exposed on the inner surface of the sealant layer (2); The inner surface of the sealing layer (2) is a continuous and smooth arc surface, and the outer peripheral surface of the sealing layer (2) is adapted to and closely fits the inner sidewall of the ring body (1) to form a smooth wearing surface without protrusions or steps on the inner side of the ring body (1).

2. The smart ring with a dual-electrode arc-shaped sealing structure according to claim 1, characterized in that: The inner surface of the sealing layer (2) is coplanar with the electrode contact end of the dual sensor electrode (3).

3. The smart ring with a dual-electrode arc-shaped sealing structure according to claim 1, characterized in that: The sealing layer (2) is a transparent or semi-transparent colloid, and the sealing layer (2) is seamlessly bonded to the inner wall of the ring body (1).

4. The smart ring with a dual-electrode arc-shaped sealing structure according to claim 1, characterized in that: The ring body (1) is made of metal.

5. The smart ring with a dual-electrode arc-shaped sealing structure according to claim 4, characterized in that: The metal material is any one of 18K gold, platinum, or silver.

6. The smart ring with a dual-electrode arc-shaped sealing structure according to claim 1, characterized in that: The sealing layer (2) is formed by curing epoxy resin cold-mounted adhesive.

7. The smart ring with a dual-electrode arc-shaped sealing structure according to claim 1, characterized in that: The intelligent electrical components also include a photoplethysmography (PPG) sensor, a six-axis gravity sensor, and a temperature sensor, all of which are integrated inside the encapsulation layer (2).

8. The smart ring with a dual-electrode arc-shaped sealing structure according to claim 1, characterized in that: An arc-shaped transition portion (4) is formed at the inner surface edge of the sealing layer (2).

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