A cutting zone temperature control method and system for a PCB micro drill tool

Abstract

The application discloses a cutting area temperature control method and system of a PCB micro drill cutter, and relates to the technical field of data processing. In the method, first, the real-time infrared radiation image of the chip flute of the micro drill cutter is acquired, the high-temperature area is extracted and combined to obtain a chip distribution contour; then, the area ratio of the contour is calculated, and when the area ratio is greater than or equal to a preset critical index, a temperature measurement node is extracted to construct an initial temperature distribution matrix; subsequently, a temperature gradient vector is calculated, a directional heat conduction path pointing to the cutter handle and a thermal radiation intensity attenuation coefficient distribution are determined; according to the above, an initial vibration frequency is set, a vibration control signal is applied, and a cutter handle end temperature feedback value is collected; the frequency is continuously adjusted until the feedback value reaches a preset threshold value, and a target vibration control signal is locked and continuously output; when the chip area ratio decreases to below the critical index, the temperature control of the micro drill cutter is completed. The technical scheme provided by the application can improve the precision of the temperature control of the cutting area of the micro drill cutter.

Description

Technical Field

[0001] This application belongs to the field of data processing technology, specifically a method and system for controlling the temperature of the cutting zone of a PCB micro drill bit. Background Technology

[0002] As electronic products trend towards higher density and miniaturization, the aperture of printed circuit boards (PCBs) continues to shrink, making micro-hole machining a critical process in PCB manufacturing. Micro-drills, as the primary tools for PCB micro-hole machining, generate significant cutting heat during high-speed rotation. To meet the demands of different hole diameters, substrate types, and machining precision requirements, temperature control technology for micro-drilling is showing diversified development trends. In particular, intelligent temperature control systems based on dedicated integrated chips demonstrate significant advantages in real-time monitoring and precise control. Their heat dissipation efficiency and stability in high-speed, high-precision machining environments are crucial for ensuring machining quality and extending tool life.

[0003] Currently, temperature control in PCB micro-drilling primarily employs a continuous supply technology based on external cooling media. This involves applying high-pressure airflow or coolant to the cutting zone to remove cutting heat. This external cooling method optimizes heat dissipation by calculating parameters such as the flow rate, pressure, and temperature of the cooling media, directly reducing the temperature level in the cutting zone. It has been widely used in conventional diameter drilling. To further improve cooling efficiency, this method also enhances convective heat transfer by optimizing the cooling media injection angle and increasing the number of cooling channels.

[0004] However, due to the unique structure of micro-drills and the complexity of cutting conditions, temperature control scenarios in micro-hole machining are becoming increasingly complex and variable. In practical applications, temperature control methods based on external cooling media struggle to suppress the interference of factors such as chip accumulation in the chip flue and obstructed flow of the cooling medium on heat dissipation, and the accuracy of temperature control in the cutting zone of micro-drills is difficult to guarantee. Especially for micro-drills, the narrow space of the chip flue and the tendency for high-temperature chips generated during cutting to accumulate and form localized high-temperature areas mean that existing methods using a single external cooling method for temperature control can easily result in insufficient contact between the cooling medium and the cutting zone, or even prevent effective penetration into the chip accumulation area, thus reducing the accuracy of temperature control in the micro-drill cutting zone. Summary of the Invention

[0005] To address the above issues, this application provides a method and system for controlling the temperature of the cutting zone of a PCB micro-drill tool. This method solves the problem that existing temperature control methods based on external cooling media suffer from insufficient temperature control accuracy due to the accumulation of debris in the chip removal groove, which makes it difficult for the cooling media to effectively penetrate to the high-temperature area. This method can improve the accuracy of temperature control in the cutting zone of the micro-drill tool.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows: Acquire real-time infrared radiation images of the chip grooves within the micro-drill tool; The contour of the real-time infrared radiation image is extracted and high-temperature areas with temperatures exceeding a preset temperature threshold are merged to obtain the contour of the debris distribution area. The area ratio is calculated based on the outline of the debris distribution area. When the area ratio is greater than or equal to a preset critical index, the temperature data of the temperature measurement node is extracted to form an initial temperature distribution matrix. Calculate the temperature gradient vector based on the initial temperature distribution matrix, identify the node sequence pointing towards the tool holder based on the temperature gradient vector, and determine the directional heat conduction path and thermal radiation intensity attenuation coefficient distribution corresponding to the node sequence. The initial vibration frequency is determined based on the directional heat conduction path and the distribution of the thermal radiation intensity attenuation coefficient. A vibration control signal is applied along the directional heat conduction path according to the initial vibration frequency, and the temperature feedback value of the tool holder end is collected. When the temperature feedback value at the tool holder end is lower than the preset feedback threshold, the initial vibration frequency is adjusted until the temperature feedback value at the tool holder end reaches the preset feedback threshold, and the target vibration frequency is locked. Output the target vibration control signal of the target vibration frequency, and complete the temperature control of the micro-drill tool when the area ratio is less than the preset critical index.

[0007] By employing the aforementioned technical solution, the chip distribution area is accurately located by acquiring real-time infrared radiation images within the chip removal groove and extracting and merging the contours of high-temperature regions. This solves the problem that traditional external cooling methods cannot intuitively identify the chip accumulation location within the chip removal groove. When the area ratio of the chip distribution region reaches a preset critical index, the system extracts temperature data from the temperature measurement nodes to construct an initial temperature distribution matrix. Based on this matrix, it calculates a temperature gradient vector to identify the node sequence pointing towards the tool holder, thereby determining the directional heat conduction path and the distribution of the thermal radiation intensity attenuation coefficient. This path identification method based on temperature field analysis can accurately capture the direction of heat transfer inside the tool. The system calculates the initial vibration frequency based on the thermal radiation intensity attenuation coefficient distribution and applies a vibration control signal along the directional heat conduction path. This vibration effectively breaks up the local high-temperature region formed by chip accumulation, causing high-temperature chips to move towards the tool holder. This allows the cooling medium, which was originally blocked by chips, to penetrate deep into the cutting zone and fully contact the tool surface, significantly improving the actual heat exchange efficiency of the cooling medium. By collecting the temperature feedback value at the tool holder end and dynamically adjusting the vibration frequency based on this feedback value until a preset feedback threshold is reached, the system achieves adaptive optimization of vibration parameters. When the temperature feedback value at the tool holder end reaches the preset feedback threshold, the target vibration frequency is locked and the target vibration control signal is continuously output until the area ratio drops below the preset critical index. This temperature control method, which combines passive external cooling with active chip removal, solves the problem that the cooling medium cannot effectively penetrate to the high-temperature area due to chip accumulation in the chip removal groove. Compared with existing methods that simply rely on increasing the flow rate or pressure of the cooling medium, vibration control enables active intervention in the chip distribution state, thereby improving the accuracy of temperature control in the cutting zone of the micro-drill tool.

[0008] In a second aspect, embodiments of this application provide a temperature control system for the cutting zone of a PCB micro drill bit. The temperature control system for the cutting zone of the PCB micro drill bit includes: one or more processors and a memory; the memory is coupled to the one or more processors, and the memory is used to store computer program code, the computer program code including computer instructions, and the one or more processors call the computer instructions to cause the temperature control system for the cutting zone of the PCB micro drill bit to perform the method described in the first aspect and any possible implementation thereof.

[0009] In summary, one or more technical solutions provided in this application have at least the following technical effects or advantages: By acquiring real-time infrared radiation images of the chip grooves of a micro-drill tool and extracting and merging high-temperature areas, the contours of the chip distribution area can be accurately identified, thus achieving accurate monitoring of local high-temperature accumulation areas within the chip grooves. Furthermore, by calculating the area ratio of the chip distribution area contours and extracting temperature data from temperature measurement nodes when the ratio is greater than or equal to a preset critical index, an initial temperature distribution matrix is ​​constructed. Based on this, this application calculates the temperature gradient vector according to the initial temperature distribution matrix, and then identifies the node sequence pointing towards the tool holder to determine the directional heat conduction path and the distribution of the thermal radiation intensity attenuation coefficient, providing precise path guidance for the directional heat dissipation. Subsequently… The initial vibration frequency is determined by combining the directional heat conduction path and the distribution of the thermal radiation intensity attenuation coefficient. A vibration control signal is then applied along the directional heat conduction path. This vibration effectively disrupts the chip accumulation structure in the chip removal groove and promotes the removal of high-temperature chips, while simultaneously enhancing heat conduction along the directional heat conduction path towards the tool holder. The initial vibration frequency is dynamically adjusted in a closed loop by collecting the temperature feedback value at the tool holder end until the target vibration frequency is locked, ensuring optimal matching between vibration chip removal and heat conduction efficiency. Finally, the target vibration control signal at the target vibration frequency is continuously output until the area ratio is less than a preset critical index, effectively clearing the accumulated chips in the chip removal groove. The entire process eliminates the interference of chip accumulation in the narrow chip removal groove on heat dissipation, overcomes the shortcomings of existing methods based on external cooling media, which are difficult to effectively penetrate to the high-temperature region due to flow field obstruction, and improves the accuracy of temperature control in the cutting zone of micro-drill tools. Attached Figure Description

[0010] Figure 1 This is a schematic flowchart of a method for controlling the temperature of the cutting zone of a PCB micro-drill tool disclosed in an embodiment of this application; Figure 2 This is another schematic flowchart of a method for controlling the temperature of the cutting zone of a PCB micro-drill tool disclosed in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a system provided in an embodiment of this application.

[0011] In the diagram: 301, Central Processing Unit; 302, Read-Only Memory; 303, Random Access Memory; 304, Bus; 305, Input / Output Interface; 306, Input Section; 307, Output Section; 308, Storage Section; 309, Communication Section; 310, Driver; 311, Removable Media. Detailed Implementation

[0012] To enable those skilled in the art to better understand the technical solution, the present application will be described in detail below with reference to the embodiments. The description in this section is only exemplary and explanatory, and should not be used to limit the scope of protection of the present application in any way.

[0013] It should be noted that, in this document, the terms "comprising," "including," and any other variations are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Specific examples have been used in this document to illustrate the principles and implementation methods of the technical solutions of this application. The above examples are only for the purpose of helping to understand the methods and core ideas of this application. The above are merely preferred embodiments of this application. It should be pointed out that, due to the limitations of written expression and the objective existence of infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of this application, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes, or combinations, or the direct application of the concept and technical solutions of this application to other situations without modification, should all be considered within the scope of protection of this application.

[0014] This application provides a method for controlling the temperature of the cutting zone of a PCB micro-drill tool, referring to... Figure 1 , Figure 1 This is a flowchart illustrating a method for controlling the cutting zone temperature of a PCB micro-drill tool according to an embodiment of this application. The method is applied to a system, which refers to a hardware and software integrated platform capable of executing a cutting zone temperature control program for a PCB micro-drill tool. The system can execute a cutting zone temperature control program for a PCB micro-drill tool. The method includes steps 101 to 107, as follows: Step 101: Obtain a real-time infrared radiation image of the chip groove of the micro-drill tool.

[0015] In this embodiment of the application, the micro-drill tool refers to a cutting tool used for micro-hole processing of PCB board, the chip removal groove refers to a spiral groove structure set on the surface of the micro-drill tool for discharging cutting chips, and the real-time infrared radiation image represents digital image data of the thermal radiation distribution inside the chip removal groove collected by an infrared detection device at the current moment.

[0016] Specifically, firstly, the infrared detection device installed in the working area of ​​the micro-drill tool is activated, and the optical lens of the infrared detection device is adjusted to align with the opening of the chip removal groove of the micro-drill tool. The detector array inside the infrared detection device begins to receive infrared radiation signals emitted from different spatial locations within the chip removal groove. Each detection unit in the detector array receives the radiation energy at its corresponding spatial location. The received infrared radiation signals undergo photoelectric conversion processing inside the detector, converting infrared radiation energy of different intensities into electrical signal values ​​of corresponding amplitudes. The converted electrical signals undergo analog-to-digital conversion and digitization processing, converting the continuously changing radiation intensity information into discrete pixel data. Each pixel carries two-dimensional spatial coordinate information and radiation intensity value information. Based on the correspondence between infrared radiation intensity and object surface temperature, the radiation intensity value of each pixel is mapped to the corresponding temperature value, generating a two-dimensional digital image containing temperature distribution information. The generated two-dimensional digital image is marked with a timestamp according to the acquisition time and stored as the real-time infrared radiation image at the current moment. This image reflects the spatial temperature distribution state within the chip removal groove at the current moment in the form of a pixel matrix.

[0017] Step 102: Extract the contours of the real-time infrared radiation image and merge the high-temperature areas whose temperatures exceed the preset temperature threshold to obtain the contours of the debris distribution area.

[0018] In this embodiment of the application, contour extraction refers to the image processing operation of identifying the boundary of the target object in the image. The preset temperature threshold represents the temperature critical value used to determine the high temperature state. The high temperature region refers to the set of pixels in the image whose temperature value exceeds the preset temperature threshold. The debris distribution region contour is used to represent the boundary curve of the space occupied by the accumulated debris in the chip removal groove.

[0019] Specifically, gradient calculations are performed on each pixel in the real-time infrared radiation image to obtain the grayscale change rate of each pixel in the horizontal and vertical directions. The gradient magnitude of each pixel is obtained by summing the squares of the horizontal and vertical gradients and taking the square root. Pixels with gradient magnitudes exceeding a preset gradient threshold are selected and marked as boundary pixels, which are then connected to form an initial contour line. The temperature values ​​of each pixel within the area enclosed by the initial contour line are obtained, and the temperature values ​​of each pixel are compared with the preset temperature threshold. Pixels with temperature values ​​exceeding the preset temperature threshold are selected, and the set of these pixels is marked as a high-temperature region. An initial contour line may contain one or more scattered high-temperature regions. Spatial proximity analysis is performed on each identified high-temperature region to calculate the shortest spatial distance between different high-temperature regions. Multiple high-temperature regions with a spatial distance less than a preset distance threshold are merged and integrated into a continuous region by connecting the boundary pixels. Boundary tracking is performed on the merged high-temperature region, and pixels along the outer perimeter of the region are connected sequentially to form a closed curve. This closed curve is the contour of the debris distribution region.

[0020] In one possible implementation, contour extraction is performed on the real-time infrared radiation image, and high-temperature regions with temperatures exceeding a preset temperature threshold are merged to obtain the contour of the debris distribution region. This specifically includes steps 1021-1023, as follows: Step 1021: Extract pixels in the real-time infrared radiation image whose gradient magnitude exceeds a preset gradient threshold to generate an initial contour.

[0021] In this embodiment, the gradient magnitude represents the intensity of the change in gray value of a pixel in the surrounding space. The preset gradient threshold is a critical value used to determine the gradient magnitude of boundary pixels. A pixel is used to represent the smallest unit with independent coordinates and numerical attributes in a digital image. The initial contour is a set of closed or open curves formed by connecting boundary pixels.

[0022] Specifically, for each pixel in a real-time infrared radiation image, the grayscale values ​​of that pixel and its surrounding neighboring pixels are read. The difference in grayscale value between that pixel and its right-hand neighbor is calculated as the horizontal gradient, and the difference in grayscale value between that pixel and its lower neighbor is calculated as the vertical gradient. The horizontal and vertical gradients are squared, and the sum of the two squares is then taken as the square root to obtain the gradient magnitude of that pixel. All pixels in the image are traversed, and the gradient magnitude of each pixel is compared to a preset gradient threshold. Pixels with gradient magnitudes greater than the preset threshold are selected and marked as boundary pixels. Spatial adjacency analysis is performed on the marked boundary pixels to determine if other boundary pixels exist within their eight-neighborhood. Spatially adjacent boundary pixels are connected sequentially according to their spatial position. Starting from a boundary pixel, the pixel is traced along the adjacency relationship until it returns to the starting point or cannot be traced further, forming a continuous pixel sequence. All continuous pixel sequences are saved as initial contours; multiple initial contours may exist in an image.

[0023] Step 1022: Obtain the temperature values ​​of each pixel within the initial contour, filter out target pixels whose temperature values ​​exceed the preset temperature threshold, and construct a high-temperature region based on the target pixels.

[0024] In this embodiment, the temperature value refers to the digital quantity representing the temperature state of the corresponding position of the pixel point obtained by converting infrared radiation intensity. The target pixel point represents the pixel point whose temperature value exceeds the preset temperature threshold within the initial contour. The high temperature region is used to represent a set of spatial regions composed of target pixels that are continuous or adjacent.

[0025] Specifically, the process iterates through all initial contours in the real-time infrared radiation image, performs region filling on each contour, and determines whether each pixel in the image is located inside the closed region enclosed by the initial contour. Point location is determined using a ray-mapping method: rays are emitted from the pixel to be determined towards the image boundary, and the number of intersections between the ray and the initial contour is counted. If the number of intersections is odd, the pixel is located inside the contour. All pixels located inside the initial contour are extracted, and their corresponding temperature values ​​in the real-time infrared radiation image are read. The temperature values ​​of each pixel are compared with a preset temperature threshold, and pixels with temperatures greater than the preset threshold are selected and marked as target pixels. Spatial connectivity analysis is performed on the marked target pixels. A region growing algorithm is used to check whether other target pixels exist in their four-neighbor or eight-neighbor regions starting from any target pixel. Spatially connected target pixels are grouped into the same pixel set. This process is repeated for all target pixels to complete the connectivity partitioning, forming one or more independent pixel sets. Each independent pixel set and its occupied spatial range are marked as a high-temperature region, and the coordinates and number of target pixels contained within each high-temperature region are recorded.

[0026] Step 1023: Calculate the spatial distance between each pixel cluster in the high-temperature region, and merge pixel clusters with a spatial distance less than a preset distance threshold to obtain the outline of the debris distribution region.

[0027] In this embodiment, a pixel cluster represents a collection of spatially connected target pixels within a high-temperature region. Spatial distance refers to the shortest straight-line distance between pixels on the boundaries of different pixel clusters. A preset distance threshold is used to represent the critical distance value for determining whether pixel clusters need to be merged. Patchwork and merging refers to the operation of integrating multiple scattered pixel clusters into a continuous region. The debris distribution region outline represents the closed curve formed by the outer boundary of the merged pixel cluster.

[0028] Specifically, all identified high-temperature regions are traversed, and each high-temperature region is treated as an independent pixel cluster. The boundary pixel set of each pixel cluster is extracted. For any two pixel clusters, pixels are extracted from their respective boundary pixel sets. The Euclidean distance between each boundary pixel of the first pixel cluster and each boundary pixel of the second pixel cluster is calculated by taking the square root of the sum of the squared differences in the x-coordinates and y-coordinates of the two pixel clusters. The minimum value among all calculated Euclidean distance values ​​is selected as the spatial distance between the two pixel clusters. The spatial distance between any two pixel clusters is calculated sequentially to construct a distance matrix between pixel clusters. All distance values ​​in the distance matrix are traversed, and pixel cluster pairs with values ​​less than a preset distance threshold are selected. The selected pixel cluster pairs are merged, integrating all target pixels contained in the two pixel clusters into the same set, and re-labeling the connected components to form a new pixel cluster. The outer boundary pixels of the merged pixel clusters are extracted, and the boundary pixels are connected sequentially according to their spatial position to form a closed curve. This closed curve is the outline of the debris distribution area.

[0029] Step 103: Calculate the area ratio based on the outline of the debris distribution area. When the area ratio is greater than or equal to the preset critical index, extract the temperature data of the temperature measurement nodes to form the initial temperature distribution matrix.

[0030] In this embodiment, the area ratio refers to the ratio of the actual area occupied by the chips to the total area of ​​the chip removal groove cross section. The preset critical index represents the area ratio threshold that triggers the temperature control process. The temperature measurement node refers to the measurement point set inside the micro-drill tool for collecting temperature data. The initial temperature distribution matrix is ​​used to represent the data set of the spatial location of the temperature measurement node and the corresponding temperature value.

[0031] Specifically, based on the pixel coordinates enclosed by the contour of the debris distribution area, the number of all pixels within the contour is counted and recorded as the number of debris pixels. The projection area of ​​the chip removal groove in the real-time infrared radiation image is obtained, and the total number of pixels within this projection area is counted and recorded as the total number of pixels in the chip removal groove. The actual physical cross-sectional size of the chip removal groove is obtained; this size is the true area of ​​the cross-section of the chip removal groove. This actual cross-sectional size is divided by the total number of pixels in the chip removal groove to obtain the physical area corresponding to a single pixel, i.e., the physical area per unit pixel. The number of debris pixels is multiplied by the physical area per unit pixel to obtain the actual area occupied by debris in the chip removal groove. The actual area occupied by debris is divided by the actual cross-sectional size of the chip removal groove to obtain the area percentage. The calculated area percentage is compared with a preset critical index. When the area percentage is greater than or equal to the preset critical index, it is determined that debris accumulation exists in the current chip removal groove. The temperature measurement value at the current moment is read from each temperature measuring node inside the micro-drill tool. The three-dimensional spatial coordinates of each temperature measuring node and the corresponding temperature value are organized into a matrix to form an initial temperature distribution matrix. Each row in the matrix records the position coordinates and temperature value of a temperature measuring node.

[0032] In one possible implementation, the area percentage is calculated based on the contour of the debris distribution area. When the area percentage is greater than or equal to a preset critical index, the temperature data of the temperature measurement nodes is extracted to form an initial temperature distribution matrix. This specifically includes steps 1031-1033, as follows: Step 1031: Obtain the pixel coordinates of the debris distribution area outline, and count the number of debris pixels contained in the debris distribution area outline based on the pixel coordinates.

[0033] In this embodiment, pixel coordinates represent the two-dimensional position information of a pixel in the image plane, consisting of two values: the horizontal coordinate and the vertical coordinate. The number of debris pixels refers to the total number of all pixels within the area enclosed by the outline of the debris distribution region.

[0034] Specifically, the process iterates through all boundary pixels on the debris distribution area contour, reading the x-coordinate and y-coordinate values ​​of each boundary pixel in the real-time infrared radiation image, and storing these values ​​in a coordinate array. The minimum and maximum x-coordinate values ​​of all boundary pixels are extracted from the coordinate array and used as the horizontal boundary range of the debris distribution area contour. Similarly, the minimum and maximum y-coordinate values ​​of all boundary pixels are extracted from the coordinate array and used as the vertical boundary range of the debris distribution area contour. Within the rectangular area defined by the horizontal and vertical boundary ranges, each pixel in the rectangular area is traversed sequentially. For each traversed pixel, a ray is emitted from its position towards the horizontal boundary of the image, and the number of intersections between the ray and the debris distribution area contour is counted. The parity of the number of intersections is determined; if the number of intersections is odd, the pixel is considered to be inside the debris distribution area contour and is marked as a debris pixel. After the traversal is complete, the number of all pixels marked as debris is summed to obtain the number of debris pixels contained within the outline of the debris distribution area.

[0035] Step 1032: Obtain the total number of chip removal groove pixels corresponding to the chip removal groove in the real-time infrared radiation image; divide the actual cross-sectional size of the chip removal groove by the total number of chip removal groove pixels to obtain the physical area per unit pixel; multiply the number of debris pixels by the physical area per unit pixel to obtain the actual area occupied by the debris; divide the actual occupied area by the actual cross-sectional size of the chip removal groove to obtain the area percentage value.

[0036] In this embodiment, the total number of pixels in the chip removal groove represents the total number of pixels in the projected area of ​​the chip removal groove in the image. The physical area per unit pixel refers to the area value of the real physical world corresponding to a single pixel in the image. The actual occupied area of ​​the debris is used to represent the real physical space area occupied by the debris in the chip removal groove. The area ratio value refers to the ratio of the actual occupied area of ​​the debris to the actual cross-sectional size of the chip removal groove.

[0037] Specifically, the boundary coordinates of the projection area of ​​the chip removal groove in the real-time infrared radiation image are read from the calibration data of the infrared detection equipment, and the range of the projection area is determined based on the boundary coordinates. All pixels within the projection area are traversed, and the total number of pixels is accumulated to obtain the total number of pixels in the chip removal groove. The actual physical dimensions of the chip removal groove cross-section are obtained from the design parameters of the micro-drill tool; this dimension represents the actual cross-sectional area of ​​the chip removal groove in square millimeters. The actual cross-sectional dimension of the chip removal groove is divided by the total number of pixels in the chip removal groove to obtain the physical area per pixel, which represents the actual physical area represented by one pixel in the image. The number of chip pixels obtained is multiplied by the physical area per pixel to obtain the actual area occupied by the chips, which represents the actual space occupied by the chips within the chip removal groove. The actual area occupied by the chips is divided by the actual cross-sectional dimension of the chip removal groove to obtain a decimal between 0 and 1; this decimal is the area percentage value, reflecting the proportion of the chip removal groove cross-section occupied by the chips.

[0038] Step 1033: If the area ratio exceeds the preset critical index, it is determined that a chip accumulation phenomenon has occurred, and the temperature data of each temperature measuring node inside the micro-drill tool at the current moment is extracted to form an initial temperature distribution matrix.

[0039] In this embodiment of the application, the phenomenon of debris accumulation refers to the state in which the amount of debris accumulated in the chip discharge trough reaches the point where temperature control is required. Temperature data represents the temperature value measured by the temperature measuring node at a specific moment and its corresponding spatial location information. The initial temperature distribution matrix is ​​used to represent the data structure that organizes the position coordinates and temperature values ​​of each temperature measuring node in matrix form.

[0040] Specifically, the calculated area percentage is compared with a pre-set critical index to determine if the area percentage exceeds the critical index. If the area percentage exceeds the critical index, the amount of chips accumulated in the chip removal groove exceeds the safe range for normal operation, confirming chip accumulation. The current system clock timestamp is read and used as the current time marker. Temperature reading commands are sent to each pre-positioned temperature measurement node inside the micro-drill tool via the communication bus. Each temperature measurement node starts its temperature measurement circuit upon receiving the command. Each temperature measurement node converts the measured analog temperature signal into a digital signal and returns the digitized temperature value via the communication bus. The temperature values ​​returned by each temperature measurement node are received, and the three-dimensional spatial coordinates of each temperature measurement node inside the micro-drill tool are read from the temperature measurement node configuration table. A blank matrix is ​​created with the number of rows equal to the total number of temperature measurement nodes and four columns, used to store the horizontal, vertical, axial coordinates, and temperature values ​​of the temperature measurement nodes. The three-dimensional spatial coordinates and temperature values ​​of each temperature measurement node are sequentially filled into the corresponding rows of the matrix according to the node number, completing the construction of the initial temperature distribution matrix.

[0041] Step 104: Calculate the temperature gradient vector based on the initial temperature distribution matrix, and identify the node sequence pointing towards the tool holder based on the temperature gradient vector, and determine the directional heat conduction path and thermal radiation intensity attenuation coefficient distribution corresponding to the node sequence.

[0042] In this embodiment, the temperature gradient vector represents the direction and rate of temperature change in space, the tool holder direction refers to the axial direction from the drill tip of the micro-drill tool to the end of the tool holder, the node sequence is used to represent the ordered set of temperature measuring nodes arranged along the tool holder direction, the directional heat conduction path refers to the heat conduction channel formed along the node sequence, and the thermal radiation intensity attenuation coefficient distribution represents the numerical set of heat transfer efficiency at each segment of the directional heat conduction path.

[0043] Specifically, the spatial coordinates and temperature values ​​of adjacent temperature measuring nodes are extracted from the initial temperature distribution matrix. The temperature difference and three-dimensional spatial distance between two adjacent temperature measuring nodes are calculated, and the temperature difference is divided by the spatial distance to obtain the temperature change rate. The temperature change rate is multiplied by the unit direction vector from the low-temperature node to the high-temperature node to obtain the temperature gradient vector at that location. The temperature gradient vectors at all temperature measuring node locations are calculated sequentially. The geometric axis of the micro-drill tool is obtained, and the direction from the drill tip to the tool holder is used as the axial reference vector. The spatial angle between the temperature gradient vector at each temperature measuring node and the axial reference vector is calculated. Temperature measuring nodes with spatial angles less than a preset angle threshold are selected, and these nodes are arranged in order of spatial position along the axis from the drill tip to the tool holder to form a node sequence. Adjacent temperature measuring nodes in the node sequence are connected sequentially with line segments. All connecting line segments are connected end to end to form a continuous broken line as a directional heat conduction path. The length of each connecting line segment is accumulated to obtain the total length of the directional heat conduction path. Calculate the temperature difference and average temperature at the two ends of each connecting segment along the directional heat conduction path. Divide the temperature difference by the average temperature to obtain the relative temperature change rate. Then divide the relative temperature change rate by the physical length of the connecting segment to obtain the thermal radiation intensity attenuation coefficient corresponding to that connecting segment. Arrange the thermal radiation intensity attenuation coefficients of each connecting segment into a numerical sequence according to the node sequence, forming a thermal radiation intensity attenuation coefficient distribution.

[0044] Step 105: Determine the initial vibration frequency based on the directional heat conduction path and the distribution of thermal radiation intensity attenuation coefficient, apply a vibration control signal along the directional heat conduction path according to the initial vibration frequency, and collect the temperature feedback value at the end of the tool holder.

[0045] In this embodiment, the initial vibration frequency represents the starting frequency parameter of vibration control determined according to the characteristics of the heat conduction path, the vibration control signal refers to the electrical signal used to drive the vibration actuator to generate mechanical vibration, and the tool holder end temperature feedback value is used to represent the temperature measurement value collected at the temperature measurement point at the end of the tool holder after vibration is applied.

[0046] Specifically, the total length of the directional heat conduction path is obtained. Attenuation coefficients are extracted from the thermal radiation intensity attenuation coefficient distribution. All attenuation coefficients are multiplied by the length of their corresponding connecting segments, summed, and then divided by the total length of the directional heat conduction path to obtain the weighted average attenuation coefficient. The total length of the directional heat conduction path is multiplied by the weighted average attenuation coefficient to obtain the path thermal resistance characteristic. A pre-established vibration frequency mapping table is consulted, which records the mapping relationship between different path thermal resistance characteristics and their corresponding initial vibration frequencies. The calculated path thermal resistance characteristic is used to find the corresponding initial vibration frequency value in the mapping table. A periodically changing electrical signal is generated based on the initial vibration frequency, and the frequency of this electrical signal is consistent with the initial vibration frequency. The three-dimensional spatial coordinates of each temperature measuring node are extracted from the node sequence and organized into a spatial coordinate sequence according to the node sequence order. The generated electrical signal is sequentially output to the vibration actuators at the corresponding positions on the directional heat conduction path according to the positions indicated by the spatial coordinate sequence. Each vibration actuator generates mechanical vibration at the corresponding frequency after receiving the electrical signal. Temperature acquisition is initiated at the temperature measurement point set at the end of the tool holder. Temperature is measured according to the preset temperature feedback sampling cycle, and the temperature value at the end of the tool holder after applying the vibration control signal is obtained as the temperature feedback value at the end of the tool holder.

[0047] In one possible implementation, the initial vibration frequency is determined based on the distribution of the directional heat conduction path and the thermal radiation intensity attenuation coefficient. A vibration control signal is then applied along the directional heat conduction path according to the initial vibration frequency, and the temperature feedback value at the tool holder end is collected. Specifically, this includes steps 1051-1053, as follows: Step 1051: Calculate the path thermal resistance characteristic based on the length of the directional heat conduction path and the distribution of the thermal radiation intensity attenuation coefficient; determine the initial vibration frequency corresponding to the path thermal resistance characteristic based on the preset vibration frequency mapping table.

[0048] In this embodiment, the length of the directional heat conduction path represents the spatial distance from the debris accumulation location to the tool holder end along a specified direction. The thermal radiation intensity attenuation coefficient distribution refers to the numerical sequence of the intensity attenuation of heat at various points along the transmission path. The path thermal resistance characteristic is used to represent the overall resistance encountered by heat during the transmission along the directional heat conduction path. The preset vibration frequency mapping table refers to the pre-established data table of the correspondence between the path thermal resistance characteristic and the initial vibration frequency. The initial vibration frequency represents the basic frequency parameter used to generate the micro-vibration control signal.

[0049] Specifically, the spatial coordinates of each node on the directional heat conduction path are read, the Euclidean distance between adjacent nodes is calculated, and the sum of the distances between all adjacent nodes is obtained to get the total length of the directional heat conduction path. The attenuation coefficient values ​​at each location point in the thermal radiation intensity attenuation coefficient distribution are extracted, and each attenuation coefficient value is multiplied by the distance between the corresponding location point to obtain the local thermal resistance component. All locations on the directional heat conduction path are traversed, and the local thermal resistance components corresponding to each location point are accumulated to obtain the total thermal resistance of the path. The total thermal resistance of the path is divided by the total length of the directional heat conduction path to obtain the average thermal resistance per unit length, which is the path thermal resistance characteristic quantity. A preset vibration frequency mapping table is opened, which contains multiple rows of records. Each row stores a range of path thermal resistance characteristic quantity values ​​and its corresponding initial vibration frequency value. The records in the mapping table are traversed row by row, comparing whether the calculated path thermal resistance characteristic quantity falls within the range of the current record. When the path thermal resistance characteristic quantity falls within the range of a certain record, the initial vibration frequency value corresponding to that record is read and used as the frequency parameter for subsequently generating the micro-vibration control signal.

[0050] Step 1052: Generate a micro-vibration control signal according to the initial vibration frequency, and output the micro-vibration control signal along the spatial coordinate sequence corresponding to the directional heat conduction path.

[0051] In this embodiment, the micro-vibration control signal refers to a periodic electrical signal generated at a specific frequency to drive the vibration actuator, and the spatial coordinate sequence represents an array formed by arranging the position coordinates of each control node on the directional heat conduction path in three-dimensional space in sequence.

[0052] Specifically, the initial vibration frequency is configured as the frequency parameter of the waveform generator, the waveform type is set to a sine wave or square wave, and the signal amplitude is set to a preset standard voltage value. The waveform generator is started to generate a periodic electrical signal with a frequency equal to the initial vibration frequency; this electrical signal is the micro-vibration control signal. The three-dimensional spatial coordinates of each control node on the directional heat conduction path are read, and the coordinates of each node are stored in a spatial coordinate sequence array according to the order of their positions on the path. The three-dimensional coordinates of the first node are extracted sequentially from the spatial coordinate sequence array, and the corresponding vibration actuator address number is determined based on these coordinates. The micro-vibration control signal is sent to the vibration actuator corresponding to this address number via the communication bus. Upon receiving the signal, the vibration actuator begins mechanical vibration according to the signal frequency. After waiting for a preset signal output time interval, the three-dimensional coordinates of the next node are extracted from the spatial coordinate sequence array, and the above signal sending process is repeated. This process is repeated sequentially, traversing all node coordinates in the spatial coordinate sequence and outputting micro-vibration control signals to the corresponding vibration actuators, completing the sequential signal output process along the directional heat conduction path.

[0053] Step 1053: Collect the temperature feedback value of the tool holder end after outputting the micro-vibration control signal at the temperature measurement point position of the tool holder end according to the preset temperature feedback sampling period.

[0054] In this embodiment, the temperature measuring point at the end of the tool holder refers to a fixed position point for temperature measurement that is pre-set at the end of the micro-drill tool holder. The preset temperature feedback sampling period refers to the time interval between two adjacent temperature data acquisition operations. The temperature feedback value at the end of the tool holder is used to represent the temperature value measured at the temperature measuring point at the end of the tool holder after the output micro-vibration control signal is applied.

[0055] Specifically, the system reads the three-dimensional spatial coordinates of the temperature measurement point at the tool holder end in the tool coordinate system from the micro-drill tool's structural parameter configuration file, and locates the corresponding temperature sensor device based on this coordinate information. It reads the preset temperature feedback sampling period value stored in the system configuration; this value represents the sampling time interval in seconds or milliseconds. The temperature feedback acquisition task is initiated, and the current system clock time is recorded as the start time of the acquisition task. A temperature reading command is sent to the temperature sensor at the temperature measurement point at the tool holder end; the temperature sensor converts the sensed analog temperature signal into a digital signal and returns it. The system receives the digital temperature value returned by the temperature sensor and records this value as the current temperature feedback value at the tool holder end. After recording, the current system clock time is read, and the time difference between this time and the previous acquisition time is calculated. It is determined whether the time difference has reached the preset temperature feedback sampling period; if not, it enters a waiting state until the time difference equals the preset temperature feedback sampling period. When the time difference reaches the preset temperature feedback sampling period, the temperature reading and recording operation is repeated, and the temperature data is continuously collected periodically according to the preset temperature feedback sampling period. The collected temperature feedback values ​​at each moment are stored in the temperature feedback data sequence.

[0056] Step 106: When the temperature feedback value at the tool holder end is lower than the preset feedback threshold, adjust the initial vibration frequency until the temperature feedback value at the tool holder end reaches the preset feedback threshold, and lock the target vibration frequency.

[0057] In this embodiment, the preset feedback threshold represents the target temperature value that the tool holder end temperature should reach, and the target vibration frequency refers to the vibration frequency parameter corresponding to when the tool holder end temperature feedback value reaches the preset feedback threshold.

[0058] Specifically, the collected temperature feedback value at the tool holder end is compared with a preset feedback threshold. If the temperature feedback value is less than the preset threshold, the chip removal and heat conduction effects at the current initial vibration frequency are deemed insufficient. A preset frequency adjustment step size is obtained, and the current initial vibration frequency is added to the frequency adjustment step size to obtain the increased vibration frequency value. A new periodic electrical signal is generated based on the increased vibration frequency value, and this signal is output to each vibration actuator at the corresponding position on the directional heat conduction path according to a spatial coordinate sequence, driving each vibration actuator to generate mechanical vibration at the increased vibration frequency. Temperature values ​​are collected again at the temperature measurement point at the tool holder end according to the temperature feedback sampling period to obtain a new temperature feedback value at the tool holder end. The new temperature feedback value is compared with the preset feedback threshold. If the new temperature feedback value is still less than the preset threshold, the current vibration frequency is added to the frequency adjustment step size again, and the above vibration signal output and temperature acquisition process is repeated. The iterative operation of increasing the vibration frequency and acquiring temperature feedback continues until a collected temperature feedback value at the tool holder end is greater than or equal to the preset feedback threshold. The vibration frequency value corresponding to the temperature feedback value at the tool holder end reaching or exceeding the preset feedback threshold is recorded as the target vibration frequency, and the adjustment of the vibration frequency is stopped.

[0059] In one possible implementation, when the tool holder end temperature feedback value is lower than a preset feedback threshold, the initial vibration frequency is adjusted until the tool holder end temperature feedback value reaches the preset feedback threshold, and the target vibration frequency is locked. This specifically includes steps 1061-1062, as follows: Step 1061: Compare the temperature feedback value at the tool holder end with the preset feedback threshold; if the temperature feedback value at the tool holder end is less than the preset feedback threshold, then increase the initial vibration frequency of the micro-vibration control signal by adjusting the step size according to the preset frequency.

[0060] In this embodiment, the preset feedback threshold refers to the critical temperature value used to determine whether the temperature at the end of the tool holder has reached the heat dissipation requirement, and the preset frequency adjustment step size represents the fixed frequency increase amount each time the vibration frequency is incrementally adjusted.

[0061] Specifically, the latest acquired temperature feedback value at the toolholder end is extracted from the temperature feedback data sequence. This value represents the temperature measured at the toolholder end temperature measurement point at the current moment. The preset feedback threshold value is read from the system configuration parameters. This threshold, in degrees Celsius, represents the target control range for the toolholder end temperature. The toolholder end temperature feedback value is compared with the preset feedback threshold to determine if the feedback value is less than the threshold. If the feedback value is less than the threshold, it is determined that the heat dissipation effect at the current vibration frequency does not meet the expected standard, and the vibration frequency needs to be adjusted. The preset frequency adjustment step size is read from the system configuration parameters. This value, in Hertz, represents the increment of each frequency adjustment. The currently used initial vibration frequency value is read and added to the preset frequency adjustment step size to obtain the adjusted new vibration frequency value. The calculated new vibration frequency value is updated in the frequency parameter configuration of the waveform generator, replacing the original initial vibration frequency. The waveform generator is reconfigured to generate periodic electrical signals according to the new vibration frequency value, thereby increasing the operating frequency of the micro-vibration control signal. Save the updated vibration frequency value as the benchmark parameter for the next round of temperature feedback comparison and frequency adjustment.

[0062] Step 1062: Output a vibration control signal according to the improved vibration frequency and collect the tool holder end temperature feedback value for comparison until the tool holder end temperature feedback value is greater than or equal to the preset feedback threshold; lock the vibration frequency corresponding to the tool holder end temperature feedback value being greater than or equal to the preset feedback threshold as the target vibration frequency.

[0063] In this embodiment, the improved vibration frequency refers to the new vibration frequency value obtained after frequency adjustment step increment. The vibration control signal refers to the periodic electrical signal generated according to the adjusted frequency for driving the vibration actuator. The target vibration frequency is used to represent the optimal vibration frequency parameter that makes the temperature at the end of the tool holder reach the heat dissipation requirement.

[0064] Specifically, the adjusted vibration frequency value is read and configured into the frequency parameters of the waveform generator. The waveform generator is started to generate a periodic electrical signal with a frequency equal to the increased vibration frequency, which serves as the new vibration control signal. Vibration control signals are output sequentially to the vibration actuators corresponding to each node on the directional heat conduction path according to the spatial coordinate sequence. After waiting for the preset temperature feedback sampling period, a read command is sent to the temperature sensor at the tool holder end temperature measurement point to collect the current tool holder end temperature feedback value. The collected tool holder end temperature feedback value is compared with a preset feedback threshold to determine whether the tool holder end temperature feedback value is greater than or equal to the preset feedback threshold. If the tool holder end temperature feedback value is still less than the preset feedback threshold, the current vibration frequency value is added to the preset frequency adjustment step size to obtain a new vibration frequency value, and the above vibration control signal output and temperature acquisition comparison process is repeated. The cycle of increasing vibration frequency, signal output, temperature acquisition, and comparison is continuously performed until the collected tool holder end temperature feedback value is greater than or equal to the preset feedback threshold. When the temperature feedback value at the tool holder end is greater than or equal to the preset feedback threshold for the first time, the vibration frequency value currently in use is read, the value is marked and stored as the target vibration frequency, and the frequency parameter is locked as the standard working frequency for subsequent heat dissipation control.

[0065] Step 107: Output the target vibration control signal of the target vibration frequency. When the area ratio is less than the preset critical index, complete the temperature control of the micro-drill tool.

[0066] In this embodiment, the target vibration control signal refers to an electrical signal generated according to the target vibration frequency and used to continuously drive the vibration actuator.

[0067] Specifically, a periodic electrical signal is continuously generated based on the locked target vibration frequency as the target vibration control signal. This target vibration control signal is continuously output to each vibration actuator along the spatial coordinate sequence corresponding to the directional heat conduction path. An infrared detection device is activated to continuously acquire infrared radiation images of the chip removal trough at a preset initial acquisition frequency. The continuously acquired infrared radiation images are processed to extract the actual occupied area of ​​the chip distribution region contour in each frame. The difference in actual occupied area between two adjacent frames is calculated, and this difference is divided by the time interval between adjacent frames to obtain the area reduction rate. The difference between the area reduction rate and the preset standard area reduction rate is calculated, and this difference is divided by the preset standard area reduction rate to obtain the deviation rate. The preset initial acquisition frequency is compensated and adjusted according to the deviation rate; when the deviation rate is positive, the acquisition frequency is decreased, and when the deviation rate is negative, the acquisition frequency is increased to obtain the target acquisition frequency. The infrared radiation image at the current moment is acquired according to the target acquisition frequency. Contour extraction and area calculation are performed on this image to obtain the current chip distribution region contour. The area percentage at the current moment is calculated based on the current chip distribution region contour. The current area percentage is compared with the preset critical index. When the current area percentage is less than the preset critical index, it is determined that the chip accumulation phenomenon in the chip removal trough has been eliminated, the target vibration control signal is stopped, and the temperature control process is completed.

[0068] In one possible implementation, a target vibration control signal with a target vibration frequency is output. When the area ratio is less than a preset critical index, the temperature control of the micro-drill tool is completed. Specifically, this includes steps 1071-1073, as follows: Step 1071: Output the target micro-vibration control signal of the target vibration frequency, and continuously acquire infrared radiation images in the chip removal groove according to the preset initial acquisition frequency. Calculate the area reduction rate of the chip distribution area contour based on the infrared radiation images.

[0069] In this embodiment, the target micro-vibration control signal represents a periodic electrical signal generated according to the target vibration frequency to drive the vibration actuator. The preset initial acquisition frequency refers to the reciprocal of the initial time interval for the image acquisition device to acquire the infrared radiation image. The chip removal groove represents a spiral groove structure on the surface of the micro-drill tool used to carry and transport chips. The infrared radiation image refers to the image data of the thermal radiation distribution in the chip removal groove area captured by the infrared imaging device. The chip distribution area contour is used to represent the boundary curve of the chip location in the infrared radiation image. The area reduction rate represents the rate at which the area enclosed by the chip distribution area contour decreases over time.

[0070] Specifically, the target vibration frequency value is read and configured into the frequency parameters of the waveform generator to generate a periodic electrical signal with a frequency equal to the target vibration frequency as the target micro-vibration control signal. The target micro-vibration control signal is then output sequentially to the vibration actuators corresponding to each node on the directional heat conduction path according to the spatial coordinate sequence. The preset initial acquisition frequency value in the system configuration is read; this value, expressed in Hertz, represents the number of image acquisitions per second. The time interval between two adjacent image acquisitions is calculated by the reciprocal of the preset initial acquisition frequency. The infrared imaging device is activated, aligned with the chip removal groove area, and the current system clock time is recorded as the start time of image acquisition. An image capture command is sent to the infrared imaging device to acquire the current infrared radiation image within the chip removal groove, and the image data is stored in the image sequence. Threshold segmentation is performed on the infrared radiation image to extract pixel regions with temperatures higher than the background temperature, identifying the location of debris. Edge detection processing is performed on the extracted pixel regions to obtain the boundary curves of the debris distribution area as contours. The number of pixels enclosed by the contours is calculated and multiplied by the actual area corresponding to a single pixel to obtain the total area of ​​the debris distribution area. After a waiting period, image acquisition and area calculation are repeated to obtain the area values ​​of the debris distribution region at multiple consecutive time points. The difference between the area values ​​at adjacent time points is calculated and divided by the time interval to obtain the area reduction rate.

[0071] In one possible implementation, the area reduction rate of the debris distribution region contour is calculated based on the infrared radiation image, specifically including steps 10711-10712, as follows: Step 10711: Obtain the actual occupied area of ​​the debris distribution region outline in two adjacent infrared radiation images.

[0072] In this embodiment of the application, two adjacent infrared radiation images refer to two consecutive thermal radiation distribution images of the chip removal groove area acquired in chronological order. The outline of the chip distribution area represents the closed boundary curve of the chip location identified by edge detection in the infrared radiation image. The actual occupied area is used to represent the size of the closed area enclosed by the outline of the chip distribution area in the real physical space.

[0073] Specifically, infrared radiation image data sorted by acquisition time is read from the image sequence storage area, and two frames with adjacent timestamps are extracted as the objects to be processed. Pixel traversal is performed on the first frame of the infrared radiation image. Each pixel in the image is judged according to a preset temperature threshold; pixels with temperatures above the threshold are marked as foreground regions, and pixels with temperatures below the threshold are marked as background regions. Morphological closing operations are performed on the marked binarized image to fill small holes inside the foreground regions, making the debris distribution area a continuous closed region. An edge detection algorithm is run to scan the boundary between the foreground and background regions in the binarized image, extracting the coordinate sequence of the boundary pixels, and connecting these coordinate points to form the outline of the debris distribution area. The number of all foreground pixels within the area enclosed by the outline is counted, and the actual physical size corresponding to a single pixel is obtained by reading the calibration parameters of the infrared imaging device. The number of pixels is multiplied by the actual area of ​​a single pixel to obtain the actual area occupied by the debris distribution area outline in the first frame of the image. The same processing flow is followed for the second frame of the infrared radiation image, performing threshold segmentation, morphological processing, edge detection, and area calculation to obtain the actual area occupied by the debris distribution area outline in the second image. The actual occupied area values ​​calculated for each of the two frames are stored in the data buffer to obtain the actual occupied area of ​​the debris distribution region outline in the two adjacent frames.

[0074] Step 10712: Based on the actual occupied area, calculate the difference in actual occupied area between two adjacent frames of infrared radiation images; divide the difference in actual occupied area by the time interval between adjacent frames to obtain the area reduction rate.

[0075] In this embodiment, the actual occupied area difference represents the numerical difference between the actual occupied areas of the debris distribution region outline in two adjacent infrared radiation images, and the adjacent frame time interval refers to the time difference between the acquisition times of two adjacent infrared radiation images.

[0076] Specifically, the actual area occupied by the debris distribution region outline corresponding to the first frame of the infrared radiation image is read from the data buffer and recorded as the first frame area. The actual area occupied by the debris distribution region outline corresponding to the second frame of the infrared radiation image is read from the data buffer and recorded as the second frame area. The first frame area and the second frame area are subtracted to obtain the difference in the actual occupied area between the two adjacent frames of the infrared radiation image. This difference represents the amount of reduction in the debris distribution region area. The system clock timestamp corresponding to the acquisition of the first frame of the infrared radiation image is read and recorded as the first frame timestamp. The system clock timestamp corresponding to the acquisition of the second frame of the infrared radiation image is read and recorded as the second frame timestamp. The second frame timestamp is subtracted from the first frame timestamp to obtain the time interval between adjacent frames. This time interval represents the time difference between the two image acquisitions in seconds or milliseconds. The calculated difference in the actual occupied area is used as the dividend, and the time interval between adjacent frames is used as the divisor to perform a division operation. The result of the division operation is the area reduction rate, which represents the rate at which the debris distribution region area decreases over time in square millimeters per second. The calculated area reduction rate is stored in the system cache and used as an input parameter for subsequent frequency compensation calculations.

[0077] Step 1072: Compensate the preset initial acquisition frequency based on the deviation rate between the area reduction rate and the preset standard area reduction rate to obtain the target acquisition frequency.

[0078] In this embodiment, the preset standard area reduction rate refers to the amount of reduction in area of ​​the debris distribution area per unit time under ideal heat dissipation conditions. The deviation rate represents the relative difference between the actual measured area reduction rate and the preset standard area reduction rate. The acquisition frequency compensation refers to the numerical increment of the preset initial acquisition frequency adjusted according to the deviation rate. The target acquisition frequency is used to represent the final working frequency used for infrared radiation image acquisition after compensation and adjustment.

[0079] Specifically, the system reads the preset standard area reduction rate from the system configuration parameters. This value represents the standard reduction rate of the debris area in square millimeters per second. The calculated actual area reduction rate is then read. The difference between the actual area reduction rate and the preset standard area reduction rate is calculated to obtain the absolute deviation. The absolute deviation is divided by the preset standard area reduction rate to obtain the deviation rate, which is a dimensionless relative quantity. The sign of the deviation rate is determined: a positive deviation rate indicates that the actual reduction rate is faster than the standard rate, while a negative deviation rate indicates that the actual reduction rate is slower than the standard rate. The preset acquisition frequency compensation coefficient is read, which represents the proportional relationship between the deviation rate and the frequency adjustment amount. The absolute value of the deviation rate is multiplied by the acquisition frequency compensation coefficient to obtain the compensation amount required to adjust the acquisition frequency. When the deviation rate is negative, the preset initial acquisition frequency is added to the compensation amount to increase the image acquisition frequency. When the deviation rate is positive, the preset initial acquisition frequency is subtracted from the compensation amount to decrease the image acquisition frequency. The calculated and adjusted acquisition frequency value is stored as the target acquisition frequency and used as the working parameter for subsequent infrared radiation image acquisition.

[0080] Step 1073: Acquire the infrared radiation image at the current moment according to the target acquisition frequency, and calculate the area ratio value at the current moment based on the infrared radiation image at the current moment; when the area ratio value at the current moment is less than the preset critical index, stop outputting the target vibration control signal.

[0081] In this embodiment of the application, the infrared radiation image at the current moment represents the thermal radiation distribution image of the chip removal groove area acquired at a specific time point according to the target acquisition frequency. The area ratio value refers to the ratio between the area enclosed by the outline of the chip distribution area at the current moment and the total area of ​​the chip removal groove. The preset critical index represents the area ratio threshold for determining that the chip removal has reached the completed state.

[0082] Specifically, the target acquisition frequency value obtained after compensation is read, and the image acquisition time interval corresponding to this frequency is calculated. This time interval is equal to the reciprocal of the target acquisition frequency. After waiting for the time interval, an image capture command is sent to the infrared imaging device to acquire the infrared radiation image of the chip removal groove area at the current moment. Threshold segmentation processing is performed on the infrared radiation image at the current moment to extract pixel areas with temperatures higher than the background temperature and identify the chip distribution location. Edge detection is performed on the extracted pixel areas to obtain the boundary curve of the chip distribution area contour. The number of pixels in the area enclosed by the contour is counted and multiplied by the actual area corresponding to a single pixel to obtain the total area value of the chip distribution area at the current moment. The total area value of the chip removal groove is read from the structural parameters of the micro-drill tool. The total area of ​​the chip distribution area at the current moment is divided by the total area of ​​the chip removal groove to obtain the area percentage value at the current moment, which is a decimal between 0 and 1. The value of the preset critical index is read from the system configuration parameters. This value represents the area percentage threshold for determining whether chip removal is complete. The area percentage value at the current moment is compared with the preset critical index. When the area ratio at the current moment is less than the preset critical index, it is determined that the debris removal has been completed, a stop command is sent to the waveform generator, the generation and output of the target vibration control signal are terminated, and the working status of all vibration actuators is turned off.

[0083] In the above embodiments, the temperature field distribution of the tool surface and the preliminary location of the heat transfer path were achieved by collecting debris accumulation temperature data and constructing an initial temperature distribution matrix. To further improve the accuracy of heat conduction path identification and the precision of thermal radiation attenuation characteristic quantification, this application also provides a method for controlling the cutting zone temperature of a PCB micro-drill tool. This method calculates the temperature gradient vector at adjacent temperature measurement nodes, obtains the axial reference vector and calculates the spatial angle to filter temperature measurement nodes with angles less than a preset angle threshold, arranges the filtered nodes in spatial order to form a node sequence, connects the nodes sequentially with line segments to construct a directional heat conduction path, and calculates the thermal radiation intensity attenuation coefficient by dividing the temperature difference by the average temperature, then dividing by the physical length, and mapping and combining the results according to the node sequence to form an attenuation coefficient distribution. This accurately identifies the optimal path for heat transfer along the tool holder direction and the differences in thermal conductivity of each path segment, providing accurate geometric information of the heat conduction path and thermal radiation attenuation characteristic data for subsequent calculation of path thermal resistance characteristics and determination of the target vibration frequency. The following is combined with... Figure 2 Another method for controlling the cutting zone temperature of a PCB micro drill bit in this application embodiment is described: Please see Figure 2 This is another flowchart illustrating a method for controlling the temperature of the cutting zone of a PCB micro-drill tool in an embodiment of this application.

[0084] Step 201: Obtain the temperature difference and spatial distance between adjacent temperature measurement nodes in the initial temperature distribution matrix, and calculate the temperature gradient vector at the temperature measurement node based on the temperature difference and spatial distance.

[0085] In this embodiment, the initial temperature distribution matrix represents a data matrix formed by arranging the temperature values ​​of each temperature measuring node in the chip removal groove according to their spatial position. Adjacent temperature measuring nodes refer to pairs of temperature measuring nodes that are spatially adjacent in the initial temperature distribution matrix. The temperature difference is used to represent the magnitude of the temperature difference between adjacent temperature measuring nodes. The spatial distance represents the Euclidean distance between the position coordinates of adjacent temperature measuring nodes in three-dimensional space. The temperature gradient vector is a three-dimensional vector that characterizes the direction and rate of temperature change at the temperature measuring node position.

[0086] Specifically, the three-dimensional spatial coordinates and temperature value of a temperature measuring node are read from the initial temperature distribution matrix. Other temperature measuring nodes in the initial temperature distribution matrix are traversed, and the Euclidean distance between each node and the current temperature measuring node is calculated. Nodes with distances less than a preset neighborhood threshold are selected as adjacent temperature measuring nodes. For each pair of adjacent temperature measuring nodes, the temperature values ​​of the two nodes are subtracted to obtain the temperature difference between the two pairs. The three-dimensional spatial coordinates of the adjacent temperature measuring node pair are read, and the coordinate component differences between the two coordinate points in the x-axis, y-axis, and z-axis directions are calculated. The differences in the coordinate components in each of the three directions are squared, and the square root of the sum of the three squared values ​​is taken to obtain the spatial distance between the adjacent temperature measuring nodes. The temperature difference is divided by the spatial distance to obtain the rate of temperature change along the direction connecting the two adjacent nodes. The three directional components of the spatial distance are divided by the total spatial distance to obtain the unit direction vector of the connecting direction. The rate of temperature change is multiplied by the three components of the unit direction vector to obtain the temperature gradient component vector in that direction. Repeat the above calculation for all adjacent nodes of the current temperature measuring node to obtain temperature gradient component vectors in multiple directions. Sum and average the temperature gradient component vectors in all directions to obtain the temperature gradient vector at the current temperature measuring node.

[0087] Step 202: Obtain the axial reference vector pointing from the drill tip of the micro-drill to the tool holder, and calculate the spatial angle between the temperature gradient vector and the axial reference vector.

[0088] In this embodiment, the drill tip of the micro-drill tool refers to the tapered tip of the front end of the micro-drill tool used for cutting, the tool holder refers to the cylindrical rod-shaped part of the rear end of the micro-drill tool used for clamping and fixing, the axial reference vector is used to represent the spatial direction vector from the drill tip position to the tool holder position, and the spatial angle represents the three-dimensional spatial angle between the temperature gradient vector and the axial reference vector.

[0089] Specifically, the three-dimensional spatial coordinates of the drill tip are read from the micro-drill tool's structural parameter configuration file. These coordinates represent the position of the drill tip's foremost vertex in the tool coordinate system. The three-dimensional spatial coordinates of the tool holder's end point are read, representing the position of the tool holder's end center point in the tool coordinate system. The three coordinate components of the tool holder end point are subtracted from the corresponding coordinate components of the drill tip to obtain the three components of the direction vector from the drill tip to the tool holder. The sum of the squares of the three components of the direction vector is calculated, and the square root of the sum is taken to obtain the magnitude of the direction vector. The three components of the direction vector are divided by the magnitude to obtain the normalized axial reference vector. The three component values ​​of the temperature gradient vector obtained above are read. The temperature gradient vector and the axial reference vector are dot-producted, i.e., the three components of the temperature gradient vector are multiplied by the corresponding components of the axial reference vector and then summed to obtain the dot product result. The sum of the squares of the three components of the temperature gradient vector is calculated and the square root is taken to obtain the magnitude of the temperature gradient vector. The dot product result is divided by the magnitude of the temperature gradient vector and then by the magnitude of the axial reference vector to obtain the cosine of the angle between the two vectors. Perform an inverse cosine function operation on the cosine value to obtain the radian value of the spatial angle. Multiply the radian value by 180 and divide by the value of pi to convert it into a spatial angle expressed in degrees.

[0090] Step 203: Select temperature measuring nodes with a spatial angle less than a preset angle threshold, and arrange the selected temperature measuring nodes in order of their spatial positions pointing towards the tool holder to obtain a node sequence; connect the temperature measuring nodes in the node sequence with line segments in sequence, and determine the spatial continuous polyline formed by all the connecting line segments as the directional heat conduction path, and accumulate the length of each connecting line segment to obtain the length of the directional heat conduction path.

[0091] In this embodiment, the preset angle threshold refers to the critical angle value used to determine whether the temperature gradient vector points to the tool holder direction. Pointing to the tool holder direction means arranging along the spatial direction from the drill tip to the tool holder. The node sequence is used to represent the set of temperature measuring nodes arranged in spatial order. The line segment connection means connecting the spatial coordinates of adjacent temperature measuring nodes with straight line segments in sequence. The continuous spatial polyline represents a spatial curve composed of multiple line segments connected end to end. The directional heat conduction path refers to the spatial path through which heat is transferred from the drill tip to the tool holder.

[0092] Specifically, the preset angle threshold value is read from the system configuration parameters. All temperature measurement nodes in the initial temperature distribution matrix are traversed, and the spatial angle value corresponding to each temperature measurement node is read. The spatial angle value of each temperature measurement node is compared with the preset angle threshold, and temperature measurement nodes with spatial angles smaller than the preset angle threshold are selected. The three-dimensional coordinates and temperature data of these nodes are stored in the candidate node set. The three component values ​​of the axial reference vector are read, and the projection component of the axial reference vector on the tool axial direction is calculated. All temperature measurement nodes in the candidate node set are traversed, and the projection value of each node coordinate on the axial direction is calculated. The candidate nodes are sorted in ascending order of projection value, so that the temperature measurement nodes are arranged in spatial order from the drill tip to the tool holder, and the sorted node sequence is stored as a node sequence array. The three-dimensional coordinates of the first temperature measurement node are extracted from the node sequence array as the starting point, and the three-dimensional coordinates of the second temperature measurement node are extracted as the ending point. The two points are connected to form the first line segment. The coordinate pairs of subsequent adjacent temperature measurement nodes in the node sequence are extracted sequentially, and the line segment connection operation is repeated until all temperature measurement nodes are connected. Combine all connecting segments sequentially to form a continuous spatial polygonal line from the drill tip to the tool holder; this polygonal line is the directional heat conduction path. Calculate the square root of the sum of the squared differences between the coordinates of the two endpoints of each connecting segment in three directions to obtain the length of each segment. Sum the lengths of all connecting segments to obtain the total length of the directional heat conduction path.

[0093] Step 204: Calculate the thermal radiation intensity attenuation coefficient corresponding to each connecting segment on the directional heat conduction path, and map and combine the thermal radiation intensity attenuation coefficients of each connecting segment according to the arrangement order of the node sequence to obtain the thermal radiation intensity attenuation coefficient distribution.

[0094] In this embodiment of the application, the connecting line segment represents the spatial straight line segment between adjacent temperature measuring nodes in the node sequence, the thermal radiation intensity attenuation coefficient refers to the intensity attenuation ratio per unit length of thermal radiation during the transmission along the connecting line segment, the mapping combination is used to represent the process of establishing a corresponding relationship between the thermal radiation intensity attenuation coefficients of each connecting line segment according to the node sequence order, and the thermal radiation intensity attenuation coefficient distribution represents the numerical sequence formed by arranging the thermal radiation intensity attenuation coefficients at each position on the directional heat conduction path in spatial order.

[0095] Specifically, the coordinates of the two endpoints of the first connecting segment are extracted from the data of the connecting segments of the directional heat conduction path. The temperature values ​​corresponding to the temperature measurement nodes at the two endpoints are read, and the temperature drop of the segment is obtained by subtracting the temperature of the endpoint from the starting temperature. The length of the connecting segment is read. The average temperature gradient of the segment is obtained by dividing the temperature drop by the segment length. The thermal radiation coefficient and thermal conductivity parameters of the micro-drilling tool material are read from the material property database. The average temperature gradient is multiplied by the thermal radiation coefficient and divided by the thermal conductivity to obtain the thermal radiation intensity attenuation coefficient corresponding to the connecting segment. The above calculation process is repeated for the second, third, and finally the last connecting segment on the directional heat conduction path, calculating the thermal radiation intensity attenuation coefficient for each segment. An array structure is created to store the distribution data of the thermal radiation intensity attenuation coefficients. Following the node sequence order, the thermal radiation intensity attenuation coefficient of the first connecting segment is stored in the first position of the array, the coefficient of the second connecting segment is stored in the second position, and so on, until all connecting segment coefficients are stored. The array is labeled as the distribution of thermal radiation intensity attenuation coefficient. The position index of each element in the array corresponds to the arrangement order of the temperature measurement nodes in the node sequence, and the value of each element in the array represents the degree of thermal radiation intensity attenuation at the corresponding position.

[0096] In one possible implementation, the thermal radiation intensity attenuation coefficient corresponding to each connecting segment on the directional heat conduction path is calculated, specifically including steps 2041-2042, as follows: Step 2041: Obtain the temperature difference and average temperature of the temperature measuring nodes at both ends of the connecting line segment on the directional heat conduction path, and collect the physical length of the connecting line segment.

[0097] In this embodiment, the temperature measuring nodes at both ends of the connecting line segment are the starting and ending temperature measuring nodes of a certain line segment in the specified heat conduction path. The temperature difference represents the temperature difference between the starting and ending temperature measuring nodes of the connecting line segment. The average temperature is the average temperature obtained by summing the temperature values ​​of the temperature measuring nodes at both ends of the connecting line segment and dividing by 2. The physical length is used to represent the actual distance of the connecting line segment in three-dimensional space.

[0098] Specifically, the identification information of the starting and ending temperature measurement nodes of a connecting segment is read from the node sequence data of the directional heat conduction path. The corresponding temperature value of the starting temperature measurement node is found in the initial temperature distribution matrix based on its identification, and recorded as the starting temperature. The corresponding temperature value of the ending temperature measurement node is found in the initial temperature distribution matrix based on its identification, and recorded as the ending temperature. The starting temperature and the ending temperature are subtracted to obtain the temperature difference between the two temperature measurement nodes of the connecting segment. The starting temperature and the ending temperature are added together and divided by 2 to obtain the average temperature of the two temperature measurement nodes of the connecting segment. The three-dimensional spatial coordinates of the starting temperature measurement node are read, including the x-axis, y-axis, and z-axis coordinate components. The three-dimensional spatial coordinates of the ending temperature measurement node are read, including the x-axis, y-axis, and z-axis coordinate components. The x-component of the starting temperature measurement node is subtracted from the x-component of the ending temperature measurement node to obtain the distance component in the x-direction, and this distance component is squared. The y-component of the starting temperature measurement node is subtracted from the y-component of the ending temperature measurement node to obtain the distance component in the y-direction, and this distance component is squared. Subtracting the z-component of the starting point's coordinate from the z-component of the ending point's coordinate yields the z-direction distance component, which is then squared. The square root of the sum of the squared distance components in all three directions is then taken to obtain the physical length of the connecting line segment. The temperature difference, average temperature, and physical length are stored in a data buffer as input parameters for subsequent calculations of the thermal radiation intensity attenuation coefficient.

[0099] Step 2042: Divide the temperature difference by the average temperature to obtain the relative temperature change rate; divide the relative temperature change rate by the physical length to obtain the thermal radiation intensity attenuation coefficient corresponding to the connecting line segment.

[0100] In this embodiment, the relative temperature change rate represents the ratio between the temperature difference at both ends of the connecting line segment and the average temperature, and the thermal radiation intensity attenuation coefficient refers to the attenuation ratio coefficient of thermal radiation intensity per unit physical length on the connecting line segment.

[0101] Specifically, the temperature difference between the two ends of the connecting line segment is read from the data buffer. This value represents the temperature difference at both ends in degrees Celsius. The average temperature value between the two ends of the connecting line segment is read. This value represents the average temperature level at both ends in degrees Celsius. The temperature difference is used as the dividend, and the average temperature value is used as the divisor. A division operation is performed to obtain the relative temperature change rate. This relative temperature change rate is a dimensionless value, representing the relative relationship between the temperature change amplitude and the average temperature level. The physical length of the connecting line segment is read. This value represents the spatial distance of the connecting line segment in millimeters. A division operation is performed with the relative temperature change rate as the dividend and the physical length as the divisor. The result of the division operation is the thermal radiation intensity attenuation coefficient corresponding to the connecting line segment. This coefficient is in units of the reciprocal of millimeters, representing the degree of attenuation of thermal radiation intensity per unit length of the line segment. The calculated thermal radiation intensity attenuation coefficient value is then associated with the current position index of the connecting line segment and stored in the thermal radiation intensity attenuation coefficient distribution array. Repeat the above calculation process of dividing the temperature difference by the average temperature and then by the physical length for other connecting segments on the directional heat conduction path to obtain the thermal radiation intensity attenuation coefficient for each connecting segment. Combine the thermal radiation intensity attenuation coefficients of all connecting segments according to the arrangement order of the node sequence to form a complete thermal radiation intensity attenuation coefficient distribution.

[0102] It should be noted that the preset temperature threshold is determined by statistically analyzing the infrared temperature distribution characteristics of normal and abnormally accumulated debris during large-scale PCB micro-drilling processes. At least 1000 sets of valid processing samples were collected, and the temperature range of debris under normal chip removal and the temperature range of debris when accumulation occurred were recorded respectively. The statistical boundary point of temperature distribution under the two conditions was calculated, and this boundary point was adjusted upward by 5% to 10% as the initial value of the preset temperature threshold. It was then adjusted through actual processing verification to achieve a debris accumulation detection accuracy of over 95%.

[0103] The preset critical index is determined by analyzing the critical relationship between the cross-sectional area of ​​the chip evacuation groove and the area occupied by chips. A stepped chip accumulation experiment was conducted using micro-drilling tools of different specifications. As the chip area gradually increased from 0% to 100%, the chip evacuation efficiency and tool temperature rise corresponding to each area percentage node were recorded. The inflection point where the chip evacuation efficiency began to decrease significantly or the tool temperature rose rapidly was identified. A safety margin of 3% to 8% was subtracted from the area percentage value corresponding to this inflection point to determine the preset critical index.

[0104] The preset distance threshold is adjusted based on the spatial aggregation characteristics of debris pixel clusters. Statistical analysis of pixel cluster distances is performed on multiple sets of infrared radiation images acquired during actual processing. Typical distances between pixel clusters belonging to the same debris block but separated due to image noise or temperature inhomogeneity are measured. The median and interquartile range of these distances are calculated. The median plus 1 to 1.5 times the interquartile range is set as the preset distance threshold to ensure that the dispersed parts of the same debris are effectively merged while avoiding the erroneous merging of different debris.

[0105] The preset angle threshold is adjusted based on the directional characteristics of the main heat conduction path inside the micro-drill tool. Using finite element thermal simulation or measured temperature distribution data, the deviation between the main heat conduction direction from the drill tip to the shank and the axial reference vector is analyzed. The angle range between the temperature gradient vector of the effective heat conduction path and the axial direction is statistically analyzed. The angle value corresponding to the 90th percentile of the statistical distribution is taken as the baseline value of the preset angle threshold, and then adjusted by ±5 to 10 degrees based on different tool materials and structural characteristics.

[0106] The preset vibration frequency mapping table is tuned by establishing a correspondence between the path thermal resistance characteristic and the optimal vibration frequency. Several representative values ​​of the path thermal resistance characteristic, ranging from low to high, are selected. A vibration frequency scanning experiment is conducted for each value point to test the effect of different frequencies from 50Hz to 5000Hz on chip removal efficiency and the temperature rise rate at the tool holder end. The vibration frequency that achieves the ideal temperature feedback at the tool holder end is recorded. A piecewise linear mapping or polynomial fitting relationship is established between the path thermal resistance characteristic and the corresponding optimal vibration frequency to form the preset vibration frequency mapping table.

[0107] The preset temperature feedback sampling period is tuned based on the dynamic characteristics of the temperature response at the tool holder end. After applying vibration control signals of different frequencies, a high-speed temperature acquisition device is used to monitor the temperature change process at the tool holder end. The rise time constant from the initial state to the steady state is analyzed, and one-tenth to one-fifth of this time constant is used as the candidate range for the preset temperature feedback sampling period. The selected period value can capture the temperature change trend in a timely manner without generating redundant data due to excessively fast sampling.

[0108] The preset feedback threshold is tuned based on the target temperature control at the tool holder end. According to the thermal stability requirements of the micro-drill tool material and the thermal sensitivity characteristics of the PCB substrate, the maximum allowable temperature limit at the tool holder end is determined. A safety margin of 10 to 20 degrees Celsius is subtracted from this upper limit temperature as the initial value of the preset feedback threshold. Multiple rounds of machining experiments are conducted to verify whether the tool life and machining quality meet the requirements under this threshold setting. Based on the verification results, fine adjustments are made within ±5 degrees Celsius from the initial value.

[0109] The preset frequency adjustment step size is set based on the sensitivity of the vibration frequency to the chip removal effect. Under different path thermal resistance characteristics, the response amplitude of the temperature feedback value at the tool holder end is tested when the vibration frequency changes by a certain value. The sensitivity coefficient of the temperature feedback to the frequency change is calculated. The frequency change that makes the temperature feedback value change between 0.5 degrees Celsius and 2 degrees Celsius after a single adjustment is determined as the preset frequency adjustment step size, ensuring that it can quickly approach the target vibration frequency without overshooting due to an excessively large step size.

[0110] The preset initial acquisition frequency is adjusted based on the expected rate of change of the contour area of ​​the debris distribution region. The typical time period required for the debris area to recover from its accumulated state to a normal state after the application of the target vibration control signal is statistically analyzed. This time period is divided into 20 to 50 sampling points, and the corresponding sampling frequency is the reference value for the preset initial acquisition frequency. Based on this, and considering the performance limitations of the image acquisition equipment and the real-time requirements of data processing, a frequency not lower than the reference value and stably supported by the equipment is selected as the preset initial acquisition frequency.

[0111] The preset standard area reduction rate is calibrated using measured data from multiple sets of ideal chip removal processes. Under conditions of good micro-drill tool condition and optimal vibration control parameters, at least 50 sets of data from the entire process from chip accumulation to complete removal are collected. The actual occupied area of ​​the chip distribution region contour in each set of data is recorded as a function of time. All curves are fitted and the average area reduction rate is calculated. This average value is used as the preset standard area reduction rate to determine whether the current chip removal efficiency has reached the expected level during subsequent real-time monitoring.

[0112] The following describes a temperature control system for the cutting zone of a PCB micro-drill tool in this application from a hardware processing perspective. Please refer to [link to relevant documentation]. Figure 3 This is a schematic diagram of the cutting zone temperature control system of a PCB micro drill bit in an embodiment of this application.

[0113] It should be noted that, Figure 3 The structure of the temperature control system for the cutting zone of a PCB micro-drill tool shown is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of this application.

[0114] like Figure 3As shown, a temperature control system for the cutting zone of a PCB micro-drill tool includes a central processing unit (CPU) 301, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 302 or a program loaded from a storage section 308 into a random access memory (RAM) 303, such as executing the method described in the above embodiment. The RAM 303 also stores various programs and data required for system operation. The CPU 301, ROM 302, and RAM 303 are interconnected via a bus 304. An input / output (I / O) interface 305 is also connected to the bus 304.

[0115] The following components are connected to I / O interface 305: input section 306 including audio input devices, push-button switches, etc.; output section 307 including a liquid crystal display (LCD) and audio output devices, indicator lights, etc.; storage section 308 including a hard disk, etc.; and communication section 309 including a network interface card such as a LAN (Local Area Network) card, modem, etc. Communication section 309 performs communication processing via a network such as the Internet. Drive 310 is also connected to I / O interface 305 as needed. Removable media 311, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., are installed on drive 310 as needed so that computer programs read from them can be installed into storage section 308 as needed.

[0116] The above description is merely a specific embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A method for controlling the temperature of the cutting zone of a PCB micro-drill tool, characterized in that, The method includes: Acquire real-time infrared radiation images of the chip grooves within the micro-drill tool; The contour of the real-time infrared radiation image is extracted and high-temperature areas with temperatures exceeding a preset temperature threshold are merged to obtain the contour of the debris distribution area. The area ratio is calculated based on the outline of the debris distribution area. When the area ratio is greater than or equal to a preset critical index, the temperature data of the temperature measurement node is extracted to form an initial temperature distribution matrix. Calculate the temperature gradient vector based on the initial temperature distribution matrix, identify the node sequence pointing towards the tool holder based on the temperature gradient vector, and determine the directional heat conduction path and thermal radiation intensity attenuation coefficient distribution corresponding to the node sequence. The initial vibration frequency is determined based on the directional heat conduction path and the distribution of the thermal radiation intensity attenuation coefficient. A vibration control signal is applied along the directional heat conduction path according to the initial vibration frequency, and the temperature feedback value of the tool holder end is collected. When the temperature feedback value at the tool holder end is lower than the preset feedback threshold, the initial vibration frequency is adjusted until the temperature feedback value at the tool holder end reaches the preset feedback threshold, and the target vibration frequency is locked. Output the target vibration control signal of the target vibration frequency, and complete the temperature control of the micro-drill tool when the area ratio is less than the preset critical index.

2. The method according to claim 1, characterized in that, The step of extracting contours from the real-time infrared radiation image and merging high-temperature regions with temperatures exceeding a preset temperature threshold to obtain the contour of the debris distribution region includes: Extract pixels from the real-time infrared radiation image whose gradient magnitude exceeds a preset gradient threshold to generate an initial contour; The temperature values ​​of each pixel within the initial contour are obtained, and target pixels whose temperature values ​​exceed the preset temperature threshold are selected. The high-temperature region is then constructed based on the target pixels. Calculate the spatial distance between each pixel cluster in the high-temperature region, and merge the pixel clusters whose spatial distance is less than a preset distance threshold to obtain the outline of the debris distribution region.

3. The method according to claim 1, characterized in that, The step of calculating the area proportion value based on the outline of the debris distribution area, and extracting the temperature data of the temperature measurement nodes to form an initial temperature distribution matrix when the area proportion value is greater than or equal to a preset critical index, includes: Obtain the pixel coordinates of the outline of the debris distribution area, and count the number of debris pixels contained in the outline of the debris distribution area based on the pixel coordinates; Obtain the total number of chip removal groove pixels corresponding to the chip removal groove in the real-time infrared radiation image; Divide the actual cross-sectional size of the chip removal groove by the total number of pixels in the chip removal groove to obtain the physical area per unit pixel. Multiply the number of debris pixels by the physical area of ​​the unit pixel to obtain the actual area occupied by the debris; Divide the actual occupied area by the actual cross-sectional size of the chip removal groove to obtain the area ratio value; If the area ratio exceeds the preset critical index, it is determined that a chip accumulation phenomenon has occurred, and the temperature data of each temperature measuring node inside the micro-drill tool at the current moment is extracted to form the initial temperature distribution matrix.

4. The method according to claim 1, characterized in that, The step of calculating the temperature gradient vector based on the initial temperature distribution matrix, identifying the node sequence pointing towards the tool holder based on the temperature gradient vector, and determining the directional heat conduction path and thermal radiation intensity attenuation coefficient distribution corresponding to the node sequence includes: Obtain the temperature difference and spatial distance between adjacent temperature measurement nodes in the initial temperature distribution matrix, and calculate the temperature gradient vector at the temperature measurement node based on the temperature difference and spatial distance; Obtain the axial reference vector pointing from the drill tip of the micro-drill tool to the tool holder, and calculate the spatial angle between the temperature gradient vector and the axial reference vector; Temperature measurement nodes with spatial angles less than a preset angle threshold are selected, and the selected temperature measurement nodes are arranged sequentially according to their spatial positions pointing towards the tool holder to obtain the node sequence. The temperature measuring nodes in the node sequence are connected sequentially by line segments. The spatial continuous polyline formed by all the connecting line segments is determined as the directional heat conduction path. The length of the directional heat conduction path is obtained by accumulating the length of each connecting line segment. The thermal radiation intensity attenuation coefficients corresponding to each connecting segment on the directional heat conduction path are calculated respectively, and the thermal radiation intensity attenuation coefficients of each connecting segment are mapped and combined according to the arrangement order of the node sequence to obtain the thermal radiation intensity attenuation coefficient distribution.

5. The method according to claim 4, characterized in that, The calculation of the thermal radiation intensity attenuation coefficient corresponding to each connecting segment on the directional heat conduction path includes: Obtain the temperature difference and average temperature of the temperature measuring nodes at both ends of the connecting line segment on the directional heat conduction path, and collect the physical length of the connecting line segment; Divide the temperature difference by the average temperature to obtain the relative temperature change rate; Dividing the relative temperature change rate by the physical length yields the thermal radiation intensity attenuation coefficient corresponding to the connecting line segment.

6. The method according to claim 1, characterized in that, The step of determining the initial vibration frequency based on the directional heat conduction path and the distribution of the thermal radiation intensity attenuation coefficient, applying a vibration control signal along the directional heat conduction path according to the initial vibration frequency, and acquiring the tool holder end temperature feedback value includes: The thermal resistance characteristic of the path is calculated based on the length of the directional heat conduction path and the distribution of the thermal radiation intensity attenuation coefficient. Based on a preset vibration frequency mapping table, the initial vibration frequency corresponding to the path thermal resistance characteristic is determined. A micro-vibration control signal is generated according to the initial vibration frequency, and the micro-vibration control signal is output along the spatial coordinate sequence corresponding to the directional heat conduction path; The temperature feedback value at the end of the tool holder is collected and output after the micro-vibration control signal is output at the temperature measurement point at the end of the tool holder according to the preset temperature feedback sampling period.

7. The method according to claim 1, characterized in that, The step of adjusting the initial vibration frequency when the temperature feedback value at the tool holder end is lower than a preset feedback threshold, until the temperature feedback value at the tool holder end reaches the preset feedback threshold, and locking the target vibration frequency, includes: The temperature feedback value at the end of the tool holder is compared with the preset feedback threshold. If the temperature feedback value at the end of the tool holder is less than the preset feedback threshold, the initial vibration frequency of the micro-vibration control signal is increased by adjusting the step size according to the preset frequency. The vibration control signal is output according to the improved vibration frequency and the temperature feedback value of the tool holder end is collected and compared until the temperature feedback value of the tool holder end is greater than or equal to the preset feedback threshold. The vibration frequency corresponding to the temperature feedback value at the tool holder end being greater than or equal to the preset feedback threshold is locked as the target vibration frequency.

8. The method according to claim 1, characterized in that, The output of the target vibration control signal at the target vibration frequency, when the area ratio is less than the preset critical index, completes the temperature control of the micro-drill tool, including: Output the target micro-vibration control signal of the target vibration frequency, and continuously acquire the infrared radiation image in the chip removal groove according to the preset initial acquisition frequency. Calculate the area reduction rate of the chip distribution area contour based on the infrared radiation image. The target acquisition frequency is obtained by compensating the preset initial acquisition frequency based on the deviation rate between the area reduction rate and the preset standard area reduction rate. The infrared radiation image at the current moment is acquired according to the target acquisition frequency, and the area ratio at the current moment is calculated based on the infrared radiation image at the current moment. When the area ratio at the current moment is less than the preset critical index, the output of the target vibration control signal is stopped.

9. The method according to claim 8, characterized in that, The calculation of the area reduction rate of the debris distribution region contour based on the infrared radiation image includes: Obtain the actual area occupied by the outline of the debris distribution region in two adjacent infrared radiation images; Based on the actual occupied area, calculate the difference in actual occupied area between two adjacent frames of infrared radiation images; The area reduction rate is obtained by dividing the difference in actual occupied area by the time interval between adjacent frames.

10. A temperature control system for the cutting zone of a PCB micro-drill tool, characterized in that, The cutting zone temperature control system of the PCB micro drill bit includes: one or more processors and a memory; the memory is coupled to the one or more processors, the memory is used to store computer program code, the computer program code includes computer instructions, and the one or more processors call the computer instructions to cause the cutting zone temperature control system of the PCB micro drill bit to perform the method as described in any one of claims 1-9.

Images