Electronic component and component-embedded substrate having the same

Abstract

[Technical Problem] Ensuring electrodes of appropriate area in an electronic component with a built-in coil. [Solution] The electronic component (100) includes: a coil portion (111) with a magnetic body portion (M) embedded therein, and terminal electrodes (121, 122) exposed on the main surfaces (101, 102); and an interlayer insulating film (130) located between the coil portion (111) and the magnetic body portion (M). The conductor layer (L1) of the coil portion (111) includes terminal patterns (141, 142) and coil patterns (C11) exposed on the main surfaces (101, 102). The conductor layer (L2) of the coil portion (111) includes terminal patterns (143, 144) exposed on the main surfaces (101, 102). The interlayer insulating film (130) includes an insulating portion (131) covering the conductor layer (L1) in the X direction and an insulating portion (132) covering the conductor layer (L2) in the XY plane direction. At least one of the thicknesses (t2X, t2Y) of the insulating portion (132) is thicker than the thickness (t1X) of the insulating portion (131).

Description

Technical Field

[0001] This disclosure relates to an electronic component and a component-embedded substrate having the electronic component. Background Technology

[0002] Patent document 1 discloses a stacked coil array with built-in coil conductors. Existing technical documents Patent documents

[0003] Patent document 1: Japanese Patent Application Publication No. 2006-032425. Summary of the Invention The problem the invention aims to solve

[0004] In the stacked coil array described in Patent Document 1, the two ends of the coil conductor are connected to external electrodes disposed on the surface of the magnetic material layer. However, without adding external electrodes, the area of ​​the two ends of the coil conductor exposed on the surface of the magnetic material layer is small, making it difficult to ensure sufficient connection area when used, for example, in a substrate embedded in an embedded component.

[0005] This disclosure describes a technique for forming electrodes of appropriate area in an electronic component with a built-in coil. Technical means for solving problems

[0006] An electronic component according to one aspect of this disclosure includes: a magnetic body portion having a first main surface and a second main surface located on opposite sides in a first direction; a coil portion embedded in the magnetic body portion, with a first terminal electrode exposed on the first main surface and a second terminal electrode exposed on the second main surface; and an interlayer insulating film located between the coil portion and the magnetic body portion. The coil portion includes a first conductor layer and a second conductor layer stacked in a second direction orthogonal to the first direction. The first conductor layer includes: a first terminal pattern with its end face exposed on the first main surface, forming a first exposed portion of the first terminal electrode; a second terminal pattern with its end face exposed on the second main surface, forming a first exposed portion of the second terminal electrode; and a first coil pattern with one end electrically connected to the first terminal electrode and the other end electrically connected to the second terminal electrode. The second conductor layer includes: a third terminal pattern with its end face exposed on the first main surface, forming a second exposed portion of the first terminal electrode; and a fourth terminal pattern with its end face exposed on the second main surface, forming a second exposed portion of the second terminal electrode. The first terminal pattern and the second conductor layer include: a third terminal pattern with its end face exposed on the first main surface, forming a second exposed portion of the first terminal electrode; and a fourth terminal pattern with its end face exposed on the second main surface, forming a second exposed portion of the second terminal electrode. The third terminal pattern is interconnected via the first through-hole conductor, and the second terminal pattern and the fourth terminal pattern are interconnected via the second through-hole conductor. The interlayer insulating film includes: a first insulating portion disposed between the first conductor layer and the magnetic body portion in a third direction orthogonal to the first and second directions; and a second insulating portion covering the second conductor layer from at least the first and third directions. In the second insulating portion, at least one of the thickness of the first portion covering the third terminal pattern from the first direction in the first direction and the thickness of the second portion covering the third terminal pattern from the third direction in the third direction is thicker than the thickness of the third portion covering the first terminal pattern from the third direction in the third direction in the first insulating portion. In the second insulating portion, at least one of the thickness of the fourth portion covering the fourth terminal pattern from the first direction in the first direction and the thickness of the fifth portion covering the fourth terminal pattern from the third direction in the third direction is thicker than the thickness of the sixth portion covering the second terminal pattern from the third direction in the third direction in the first insulating portion. Invention Effects

[0007] According to this disclosure, a technique is provided for forming electrodes of appropriate area in an electronic component with a built-in coil. Attached Figure Description

[0008] [ Figure 1 ] Figure 1 This is a schematic perspective view showing the appearance of the electronic component 100 according to the first embodiment of the technology disclosed herein. [ Figure 2 ] Figure 2 It is along Figure 1 The diagram shows a rough cross-section of line AA. [ Figure 3 ] Figure 3 It is along Figure 1 The diagram shows a simplified cross-sectional view of the BB line. [ Figure 4 ] Figure 4 (a) and (b) are schematic top views used to illustrate the structure of terminal electrodes 121 and 122, respectively. [ Figure 5 ] Figure 5 This is a schematic cross-sectional view used to illustrate the structure of the component-integrated substrate 10 of the built-in electronic component 100. [ Figure 6 ] Figure 6 This is a schematic cross-sectional view used to illustrate the first modified example of the coil section 111. [ Figure 7 ] Figure 7 This is a schematic top view used to illustrate the structure of the terminal electrode 121 in the first modified example. [ Figure 8 ] Figure 8 This is a schematic cross-sectional view used to illustrate the second modified example of the coil section 111. [ Figure 9 ] Figure 9 This is a schematic top view used to illustrate the structure of the terminal electrode 121 in the second modified example. [ Figure 10 ] Figure 10 This is a schematic top view showing an example in which the width W8 is smaller than the widths W1 and W4 in the second variation. [ Figure 11 ] Figure 11 This is a schematic cross-sectional view used to illustrate the third modified example of the coil section 111. [ Figure 12 ] Figure 12 This is a schematic top view used to illustrate the structure of the terminal electrode 121 in the third modified example. [ Figure 13 ] Figure 13 This is a schematic top view showing an example in which the width W4 is smaller than the widths W1 and W10 in the third variation. [ Figure 14 ] Figure 14 This is a schematic cross-sectional view used to illustrate the fourth modified example of the coil section 111. [ Figure 15 ] Figure 15 This is a schematic top view used to illustrate the structure of the terminal electrode 121 in the fourth variation. [ Figure 16 ] Figure 16 This is a schematic cross-sectional view used to illustrate the fifth modified example of the coil section 111. [ Figure 17 ] Figure 17 This is a schematic perspective view showing the appearance of the electronic component 200 according to the second embodiment of the technology disclosed herein. [ Figure 18 ] Figure 18 It is along Figure 17 The diagram shows a rough cross-section of line AA. [ Figure 19 ] Figure 19 This is a schematic perspective view showing the appearance of the electronic component 300 according to the third embodiment of the technology disclosed herein. [ Figure 20 ] Figure 20 It is along Figure 19 The diagram shows a simplified cross-sectional view of the BB line. [ Figure 21 ] Figure 21 (a) to (c) are schematic top views showing the shapes of the conductor patterns located in conductor layers L1 to L3 respectively in the third embodiment. Detailed Implementation

[0009] Hereinafter, embodiments of the technology disclosed herein will be described in detail with reference to the accompanying drawings. Furthermore, for ease of explanation, the X, Y, and Z directions, which are orthogonal (or substantially orthogonal) to each other, will be defined below as illustrated in the figures. Also, sometimes the surface extending in the X and Y directions will be referred to as the XY surface, the surface extending in the X and Z directions as the XZ surface, and the surface extending in the Y and Z directions as the YZ surface.

[0010] <First Embodiment> Figure 1 This is a schematic perspective view showing the appearance of the electronic component 100 according to the first embodiment of the technology disclosed herein. Additionally, Figure 2 It is along Figure 1 The diagram shows a simplified cross-section of line AA. Figure 3 It is along Figure 1 The diagram shows a simplified cross-sectional view of the BB line.

[0011] exist Figures 1-3In the example shown, the electronic component 100 of the first embodiment includes: a magnetic body portion M; a plurality of coil portions 111 to 114 embedded in the magnetic body portion M; and an interlayer insulating film 130 located between the magnetic body portion M and the coil portions 111 to 114. The magnetic body portion M may also be made of a composite magnetic material, which is formed by curing magnetic particles made of a high permeability material such as ferrite or permalloy using a resin adhesive. The magnetic body portion M has: main surfaces 101 and 102 forming the XZ plane and located on opposite sides in the Y direction; side surfaces 103 and 104 forming the XY plane and located on opposite sides in the Z direction; and side surfaces 105 and 106 forming the YZ plane and located on opposite sides in the X direction. In this specification, the X direction is sometimes referred to as the third direction, the Y direction as the first direction, and the Z direction as the second direction. Additionally, for ease of explanation, the direction from the main surface 102 towards 101 is sometimes referred to as the +Y direction (the opposite of which is the -Y direction), the direction from the side surface 103 towards 104 is sometimes referred to as the +Z direction (the opposite of which is the -Z direction), and the direction from the side surface 105 towards 106 is sometimes referred to as the +X direction (the opposite of which is the -X direction). Details will be described later. In the electronic component 100 of the first embodiment, the interlayer insulating film 130 includes insulating portions 131 to 135.

[0012] Coil sections 111 to 114 are arranged sequentially in the X direction. The terminal electrodes 121 at one end of each coil section 111 to 114 are exposed from the main surface 101 of the magnetic body section M, and the terminal electrodes 122 at the other end are exposed from the main surface 102 of the magnetic body section M. Figure 1 In the manner shown, since the coil sections 111 to 114 have the same structure, the following description will focus on the coil section 111 and explain its structure.

[0013] In the electronic component 100 of the first embodiment, the coil portion 111 has two conductor layers L1 and L2 stacked in the Z direction. To prevent contact with the magnetic body portion M, the conductor layers L1 and L2 are covered by insulating portions 131 to 135 constituting the interlayer insulating film 130. In other words, insulating portions 131 to 135 are disposed between the conductor pattern formed on the conductor layers L1 and L2 and the magnetic body portion M. The conductor layers L1 and L2 are made of a good conductor such as copper (Cu). The interlayer insulating film 130 is made of an insulating material such as resin.

[0014] Conductor layer L1 is a conductor layer located at one end in the Z direction within the coil section 111. Conductor layer L1 can be formed first, for example, during manufacturing. Figure 3In the example shown, conductor layer L1 includes terminal patterns 141 and 142 and coil pattern C11. Terminal pattern 141 is a conductor pattern with its XZ end face exposed in the +Y direction on the main surface 101 of the magnetic body portion M, and its width in the X direction is W1. Terminal pattern 142 is a conductor pattern with its XZ end face exposed in the -Y direction on the main surface 102 of the magnetic body portion M, and its width in the X direction is W2. Widths W1 and W2 can also be the same. Coil pattern C11 is a straight conductor pattern within conductor layer L1 connecting terminal patterns 141 and 142, and its width W3 in the X direction can be smaller than or equal to widths W1 and W2. The inductance or DC resistance of coil pattern C11 can be adjusted by its width W3. For example, reducing the width W3 can increase the inductance, while increasing the width W3 can decrease the DC resistance. The coil pattern C11 is not limited to a straight conductor pattern, but can also be a winding conductor pattern or a shape in which a portion has a curved or bent portion.

[0015] Conductor layer L2 is a conductor layer located at the other end side in the Z direction within the coil section 111. Conductor layer L2 can be formed, for example, after conductor layer L1 during manufacturing. Figure 3 In the example shown, conductor layer L2 includes terminal patterns 143, 144. Figures 1 to 4 In the illustrated case, no conductor pattern corresponding to coil pattern C11 is provided in conductor layer L2. In this case, terminal patterns 143 and 144 are not connected to other conductor patterns within the layer in which conductor layer L2 is formed (hereinafter referred to as the surface of conductor layer L2. The same applies to other conductor layers.)

[0016] Terminal patterns 141 and 143 are interconnected via through-hole conductors 151 that penetrate the insulating portion 134 of the interlayer insulating film 130. Similarly, terminal patterns 142 and 144 are interconnected via through-hole conductors 152 that penetrate the insulating portion 134 of the interlayer insulating film 130. The through-hole conductors 151 and 152 can be formed simultaneously with conductor layer L2, or they can be formed after conductor layer L1 and before conductor layer L2. In the former case, through-hole conductor 151 is integrally formed with terminal pattern 143, and through-hole conductor 152 is integrally formed with terminal pattern 144.

[0017] Figure 4 (a) and (b) are schematic top views illustrating the structure of terminal electrodes 121 and 122, respectively. Figure 4 In the examples shown in (a) and (b), through-hole conductors 151 and 152 are integrally formed with terminal patterns 143 and 144, respectively.

[0018] exist Figure 4 In the example shown in (a), the terminal electrode 121 includes: a portion formed by the XZ end faces of terminal patterns 141 and 143 exposed from the main surface 101 of the magnetic body portion M; and a portion formed by the XZ end face of the through-hole conductor 151 exposed from the main surface 101 of the magnetic body portion M. The portions of terminal electrode 121 formed by the XZ end faces of terminal patterns 141 and 143 respectively constitute exposed portions A1 and A2. The portion of terminal electrode 121 formed by the XZ end face of the through-hole conductor 151 constitutes exposed portion A3. The terminal electrode 121 having this structure is surrounded on the main surface 101 of the magnetic body portion M by insulating portions 131 to 135 constituting an interlayer insulating film 130. The width of exposed portion A1 in the X direction is W1, and the width of exposed portion A2 in the X direction is W4. Widths W1 and W4 may be the same or different from each other. The width W6 of the exposed portion A3 in the X direction can be more than 3 / 4 of the width W1 or the width W4. This ensures sufficient area for the terminal electrode 121.

[0019] exist Figure 4 In the example shown in (b), the terminal electrode 122 includes: a portion formed by the XZ end faces of terminal patterns 142 and 144 exposed from the main surface 102 of the magnetic body portion M, and a portion formed by the XZ end face of the through-hole conductor 152 exposed from the main surface 102 of the magnetic body portion M. The portions of terminal electrode 122 formed by the XZ end faces of terminal patterns 142 and 144 respectively constitute exposed portions B1 and B2. The portion of terminal electrode 122 formed by the XZ end face of the through-hole conductor 152 constitutes exposed portion B3. The terminal electrode 122 having this structure is surrounded on the main surface 102 of the magnetic body portion M by insulating portions 131 to 135 constituting an interlayer insulating film 130. The width of exposed portion B1 in the X direction is W2, and the width of exposed portion B2 in the X direction is W5. Widths W2 and W5 may be the same or different from each other. Widths W4 and W5 may be the same or different from each other. The width W7 of the exposed portion B3 in the X direction can be more than 3 / 4 of the width W2 or the width W5. This ensures sufficient area for the terminal electrode 122. Widths W6 and W7 can be the same or different from each other.

[0020] The surface of terminal electrode 121 may be on the same plane as the main surface 101 of magnetic body part M, or it may be recessed from the main surface 101 of magnetic body part M. Similarly, the surface of terminal electrode 122 may be on the same plane as the main surface 102 of magnetic body part M, or it may be recessed from the main surface 102 of magnetic body part M.

[0021] The conductor layer L1 has a thickness of T1 in the Z direction, and the conductor layer L2 has a thickness of T2 in the Z direction. Thickness T2 is thicker than thickness T1, thereby increasing the area of ​​terminal electrodes 121 and 122. Thickness T2 can be more than twice the thickness T1. This allows for further increasing the area of ​​terminal electrodes 121 and 122. Thickness T2 can be less than four times the thickness T1. This facilitates the formation of conductor layer L2.

[0022] The conductor layer L1 is covered by an insulating portion 131 in the XY plane direction, i.e., in a direction perpendicular to the Z direction. In other words, an insulating portion 131 is disposed between the end face of the conductor pattern (terminal patterns 141, 142 and coil pattern C11) formed on the conductor layer L1 in the X direction and the magnetic body portion M. When the width W3 of the coil pattern C11 in the X direction is smaller than the widths W1 and W2 of the terminal patterns 141 and 142 in the X direction, an insulating portion 131 is disposed between the end face of the terminal pattern 141 in the -Y direction (the face opposite to the inner side of the magnetic body portion M) and the magnetic body portion M. In addition, an insulating portion 131 is disposed between the end face of the terminal pattern 142 in the +Y direction (the face opposite to the inner side of the magnetic body portion M) and the magnetic body portion M.

[0023] The conductor layer L2 is covered by insulating portions 132 in the XY plane direction, i.e., in the direction perpendicular to the Z direction. In other words, insulating portions 132 are disposed between the X-direction end face of the conductor pattern (terminal pattern 143, 144) formed on the conductor layer L2 and the magnetic body portion M. Insulating portions 132 are disposed between the -Y-direction end face (the face opposite to the inner side of the magnetic body portion M) of the terminal pattern 143 and the magnetic body portion M. In addition, insulating portions 132 are disposed between the +Y-direction end face (the face opposite to the inner side of the magnetic body portion M) of the terminal pattern 144 and the magnetic body portion M.

[0024] Conductor layer L1 is covered by insulating portion 133 in the -Z direction. In other words, insulating portion 133 is disposed between the end face of the conductor pattern formed on conductor layer L1 in the -Z direction and the magnetic body portion M. Insulating portion 134 is disposed between conductor layer L1 and conductor layer L2. Conductor layer L2 is covered by insulating portion 135 in the +Z direction. In other words, insulating portion 135 is disposed between the end face of the conductor pattern formed on conductor layer L2 in the +Z direction and the magnetic body portion M.

[0025] When the width W3 of the coil pattern C11 in the X direction is the same as the widths W1 and W2 of the terminal patterns 141 and 142 in the X direction, the conductor layer L1 is not covered by the insulating portion 131 from the Y direction, but is covered by the insulating portion 131 from the X direction.

[0026] The thickness of the insulating portion 131 in the XY plane direction (the direction perpendicular to the Z direction) is t1. More specifically, the thickness of the insulating portion 131 in the X direction between the end face of the terminal pattern 141 (or 142) in the X direction and the magnetic body portion M is t1X. Furthermore, when the width W3 of the coil pattern C11 in the X direction is smaller than the widths W1 and W2 of the terminal patterns 141 and 142 in the X direction, the thickness of the insulating portion 131 in the Y direction between the end face of the terminal pattern 141 (or 142) in the Y direction (the face opposite to the inner side of the magnetic body portion M) and the magnetic body portion M is t1Y (refer to...). Figure 2 The thickness t1 is approximately constant, meaning that the thickness t1X and the thickness t1Y can be approximately the same. Alternatively, the thickness t1X and the thickness t1Y can also be different.

[0027] The thickness of the insulating portion 132 in the XY plane direction (the direction perpendicular to the Z direction) is t2. More specifically, the thickness of the insulating portion 132 in the X direction between the end face of the terminal pattern 143 (or 144) in the X direction and the magnetic body portion M is t2X. Furthermore, the thickness of the insulating portion 132 in the X direction between the end face of the terminal pattern 143 (or 144) in the Y direction (the face opposite to the inner side of the magnetic body portion M) and the magnetic body portion M is t2Y (see reference). Figure 3 The thickness t2 is approximately constant, meaning that the thickness t2X and the thickness t2Y can be approximately the same. Alternatively, the thickness t2X and the thickness t2Y can also be different.

[0028] At least one of the thicknesses t2X and t2Y of the insulating portion 132 is greater than the thickness t1X of the insulating portion 131. Therefore, the insulating portion 132 functions as a buffer material against external forces applied to the terminal patterns 143 and 144 in the Y direction. That is, the terminal patterns 143 and 144 are independently disposed within the plane of the conductor layer L2 without being connected to other conductor patterns, and a magnetic element portion M exists between the terminal patterns 143 and 144. When an external force in the Y direction is applied to the terminal patterns 143 and 144 (e.g., an external force such as pressing the terminal patterns 143 and 144 in the Y direction), this external force is transmitted to the insulating portion 132. In this embodiment, by making at least one of the thicknesses t2X and t2Y of the insulating portion 132 thicker than the thickness t1X of the insulating portion 131, the insulation between the terminal patterns 143 and 144 and the magnetic element portion M can be ensured even when such external forces are applied. Therefore, high reliability can be ensured for terminal electrodes 121 and 122. Furthermore, regarding terminal patterns 141 and 142, the areas of exposed portions A1 and B1 are smaller than the areas of exposed portions A2 and B2, making them less susceptible to external forces. Therefore, by making the thickness t1X of the insulating portion 131 thinner than at least one of thicknesses t2X and t2Y, more magnetic element portions M can be arranged around the insulating portion 131.

[0029] Furthermore, the thicknesses t2X and t2Y of the insulating portion 132 can both be greater than the thickness t1X of the insulating portion 131. This further enhances the function of the insulating portion 132 as a cushioning material, thereby further improving the reliability of the product.

[0030] The thickness t1X (141) of the portion of the insulating portion 131 covering the terminal pattern 141 in the X direction and the thickness t1X (142) of the portion covering the terminal pattern 142 in the X direction may be the same or different. The thickness t1Y (141) of the portion of the insulating portion 131 covering the terminal pattern 141 in the Y direction and the thickness t1Y (142) of the portion covering the terminal pattern 142 in the Y direction may be the same or different.

[0031] The thickness t2X (143) of the portion of the insulating portion 132 covering the terminal pattern 143 in the X direction and the thickness t2X (144) of the portion covering the terminal pattern 144 in the X direction may be the same or different. The thickness t2Y (143) of the portion of the insulating portion 132 covering the terminal pattern 143 in the Y direction and the thickness t2Y (144) of the portion covering the terminal pattern 144 in the Y direction may be the same or different.

[0032] The thickness t2 of the insulating portion 132 can be more than twice the thickness t1 of the insulating portion 131. This improves its function as a buffer material against external forces. Alternatively, the thickness t2 of the insulating portion 132 can be less than three times the thickness t1 of the insulating portion 131. This allows for the arrangement of a sufficiently large magnetic element portion M around the insulating portions 131 and 132, according to the characteristics required for the electronic component 100.

[0033] The insulating portion 133 has a thickness of t3 in the Z direction, the insulating portion 134 has a thickness of t4 in the Z direction, and the insulating portion 135 has a thickness of t5 in the Z direction. Thicknesses t3 to t5 can be the same, or they can be partially or completely different from each other. For example, thickness t3 can be thicker than thicknesses t4 and t5. Thicknesses t3 to t5 can be thinner than thickness t1. Therefore, magnetic element portions M of sufficient volume can be arranged around each insulating portion according to the characteristics required for the electronic component 100.

[0034] As explained above, the electronic component 100 of this embodiment constitutes a coil array with four built-in coil sections 111 to 114. The spacing between the coil sections 111 to 114 in the X direction can be constant, or it can be as follows: Figure 1 and Figure 2As shown, the spacing between coil portions 112 and 113 in the X direction is wider than the spacing between coil portions 111 and 112 in the X direction and the spacing between coil portions 113 and 114 in the X direction. If the spacing between coil portions 112 and 113 in the X direction is widened, the coupling between coil portions 112 and 113 can be reduced.

[0035] Figure 5 This is a schematic cross-sectional view illustrating the structure of the component-integrated substrate 10 of the electronic component 100 in this embodiment.

[0036] Figure 5 The component's embedded substrate 10 shown includes sequentially stacked insulating layers 11-15, a plurality of wiring patterns 20 formed on the surfaces of the insulating layers 11-15, and an electronic component 100 embedded in the insulating layer 13. The wiring patterns 20 include: four wiring patterns 21 located between insulating layers 13 and 14; and four wiring patterns 22 located between insulating layers 12 and 13. The four wiring patterns 21 are respectively disposed at positions overlapping with the terminal electrodes 121 of the coil portions 111-114, and are respectively connected to the corresponding terminal electrodes 121 via substrate through-hole conductors 31. Similarly, the four wiring patterns 22 are respectively disposed at positions overlapping with the terminal electrodes 122 of the coil portions 111-114, and are respectively connected to the corresponding terminal electrodes 122 via substrate through-hole conductors 32.

[0037] Thus, the electronic component 100 of this embodiment can be used by embedding it in the component-integrated substrate 10. When the electronic component 100 is used by embedding it in the component-integrated substrate 10, the end faces of the terminal patterns 141 and 143 exposed from the main surface 101 of the magnetic body portion M are directly used as terminal electrodes 121, and the end faces of the terminal patterns 142 and 144 exposed from the main surface 102 of the magnetic body portion M are directly used as terminal electrodes 122. Furthermore, in this embodiment, not only the end face of the conductor layer L1 with the coil pattern C11 is exposed, but also the end face of the conductor layer L2 without the coil pattern is exposed, so sufficient area can be ensured for the terminal electrodes 121 and 122. Moreover, when the thickness T2 of the conductor layer L2 is thicker than the thickness T1 of the conductor layer L1, the number of conductor layers can be reduced compared to the case of stacking multiple thin conductor layers. That is, the number of steps in the manufacturing process can be reduced, and terminal electrodes 121 and 122 with sufficient area can be formed. Furthermore, when the thickness T1 of conductor layer L1 is thinner than the thickness T2 of conductor layer L2, miniaturization of the electronic component 100 in the Z direction can be achieved. Additionally, by adjusting the shape of the coil pattern C11 formed in conductor layer L1, the inductance of each coil portion can be adjusted according to the characteristics required for the electronic component 100.

[0038] When the end face of the magnetic body portion M, which exposes not only the terminal patterns 141 and 143 but also the end face of the through-hole conductor 151, is exposed on the main surface 101 of the magnetic body portion M, the terminal electrode 121 is not divided into multiple parts by the insulating portion 134 of the interlayer insulating film 130. Similarly, when the end face of the magnetic body portion M, which exposes not only the end face of the terminal patterns 142 and 144 but also the end face of the through-hole conductor 152, is exposed on the main surface 102 of the magnetic body portion M, the terminal electrode 122 is not divided into multiple parts by the insulating portion 134 of the interlayer insulating film 130. In other words, in this case, the terminal electrode 121 and the terminal electrode 122 are each formed as continuous terminal faces.

[0039] Furthermore, since the terminal electrodes 121 and 122 are surrounded by the interlayer insulating film 130 on the main surfaces 101 and 102 of the magnetic body portion M, the insulation withstand voltage between adjacent terminal electrodes 121 in the X direction and between adjacent terminal electrodes 122 in the X direction can also be improved. Additionally, when the surface of the terminal electrode 121 is more recessed than the main surface 101 of the magnetic body portion M, the connection reliability between the terminal electrode 121 and the substrate via conductor 31 is improved. Similarly, when the surface of the terminal electrode 122 is more recessed than the main surface 102 of the magnetic body portion M, the connection reliability between the terminal electrode 122 and the substrate via conductor 32 is improved.

[0040] Furthermore, since at least one of the thicknesses t2X and t2Y of the insulating portion 132 covering the conductor layer L2 is thicker than the thickness t1X of the insulating portion 131 covering the conductor layer L1, the effects of stress (external force) applied to the terminal electrodes 121 and 122 during the formation of the substrate through-hole conductors 31 and 32 are mitigated. As a result, the reliability of the product is also improved.

[0041] Figure 6 This is a schematic cross-sectional view used to illustrate the first modified example of the coil section 111, corresponding to the direction along... Figure 1 The cross-section of the BB line is shown. Additionally... Figure 7 This is a schematic top view used to illustrate the structure of the terminal electrode 121 in the first modified example.

[0042] Figure 6 and Figure 7 The first variation shown differs from the one using the addition of a conductor layer L3. Figure 3 , Figure 4 (a) and Figure 4 The coil section 111 described in (b) is different. The conductor layer L3 is a conductor layer located on the other end side in the Z direction. The conductor layer L3 can be formed after the conductor layer L2 during manufacturing.

[0043] exist Figure 6 and Figure 7 In the example shown, conductor layer L3 includes terminal patterns 145 and 146. Terminal patterns 145 and 146 are independently disposed within the surface of conductor layer L3 without being connected to other conductor patterns. That is, conductor layer L3 does not contain a conductor pattern corresponding to coil pattern C11; only terminal patterns 145 and 146 exist. Conductor layer L3 is covered from the XY plane direction by insulating portions 136 of interlayer insulating film 130. In other words, insulating portions 136 are disposed between the X-direction end face of the conductor patterns (terminal patterns 145 and 146) formed in conductor layer L3 and the magnetic body portion M. Insulating portions 136 are disposed between the -Y-direction end face of terminal pattern 145 (the face opposite the inner side of magnetic body portion M) and the magnetic body portion M. Additionally, insulating portions 136 are disposed between the +Y-direction end face of terminal pattern 146 (the face opposite the inner side of magnetic body portion M) and the magnetic body portion M. Furthermore, the conductor layer L3 is covered by the insulating portion 137 of the interlayer insulating film 130 from the +Z direction. In other words, the insulating portion 137 is disposed between the end face of the terminal pattern 145 and the terminal pattern 146 in the +Z direction and the magnetic body portion M, respectively.

[0044] Terminal patterns 143 and 145 are interconnected via through-hole conductors 153 formed through insulating portions 135 of the interlayer insulating film 130. Similarly, terminal patterns 144 and 146 are interconnected via through-hole conductors 154 formed through insulating portions 135 of the interlayer insulating film 130. Through-hole conductors 153 and 154 can be formed simultaneously with conductor layer L3, or they can be formed after conductor layer L2 and before conductor layer L3. In the former case, through-hole conductor 153 is integrally formed with terminal pattern 145, and through-hole conductor 154 is integrally formed with terminal pattern 146.

[0045] The XZ end faces of terminal pattern 145 and through-hole conductor 153 can be exposed from the main surface 101 of magnetic body portion M to form part of terminal electrode 121. Similarly, the XZ end faces of terminal pattern 146 and through-hole conductor 154 can be exposed from the main surface 102 of magnetic body portion M to form part of terminal electrode 122. The portion of terminal electrode 121 formed by the XZ end face of terminal pattern 145 constitutes exposed portion A4. The portion of terminal electrode 121 formed by the XZ end face of through-hole conductor 151 constitutes exposed portion A5. The same applies to terminal electrode 122.

[0046] The exposed portion A4 has a width of W8 in the X direction. Width W8 can be the same as or different from widths W1 and W4. The exposed portion A5 has a width of W9 in the X direction. Width W9 can be the same as or different from width W6.

[0047] The conductor layer L3 has a thickness T3 in the Z direction. Thickness T3 is thicker than thickness T1, thereby increasing the area of ​​terminal electrode 121. Thickness T3 can be the same as or different from thickness T2.

[0048] The thickness of the insulating portion 136 in the XY plane direction (the direction perpendicular to the Z direction) is t6. More specifically, the thickness of the insulating portion 136 in the X direction between the end face of the terminal pattern 145 (or 146) in the X direction and the magnetic body portion M is t6X. Furthermore, the thickness of the insulating portion 136 in the Y direction between the end face of the terminal pattern 145 (or 146) in the Y direction (the face opposite to the inner side of the magnetic body portion M) and the magnetic body portion M is t6Y. At least one of the thicknesses t6X and t6Y is greater than the thickness t1X, thereby the insulating portion 136 functions as a buffer material against external forces applied to the terminal pattern 145 in the Y direction.

[0049] Furthermore, the thicknesses t6X and t6Y of the insulating portion 136 can both be greater than the thickness t1X of the insulating portion 131. This further enhances the function of the insulating portion 136 as a buffer material, thereby further improving product reliability. Thicknesses t6X and t6Y can be the same. Thickness t6X can be the same as or different from thickness t2X. Thickness t6Y can be the same as or different from thickness t2Y. The thickness of the portion of the insulating portion 136 covering the terminal pattern 145 in the X direction can be the same as or different from the portion covering the terminal pattern 146 in the X direction. The thickness of the portion of the insulating portion 136 covering the terminal pattern 145 in the Y direction can be the same as or different from the portion covering the terminal pattern 146 in the Y direction. The thickness of the insulating portion 137 in the Z direction is t7. Thickness t7 can be the same as or different from thicknesses t3 to t5.

[0050] like Figure 6 and Figure 7 As illustrated in the first modified example, the conductor layers L2 and L3 without coil patterns are more numerous than the conductor layer L1 with coil pattern C11. This allows for a further increase in the area of ​​the terminal electrodes 121 and 122.

[0051] Figure 8 This is a schematic cross-sectional view used to illustrate the second modified example of the coil section 111, corresponding to the direction along... Figure 1 The cross-section of the BB line is shown. Additionally... Figure 9 This is a schematic top view used to illustrate the structure of the terminal electrode 121 in the second modified example.

[0052] Figure 8 and Figure 9The second variation shown differs from the first in that the thickness T2 of conductor layer L2 is thinner than the thickness T3 of conductor layer L3. Figure 6 and Figure 7 This differs from the first variation shown. The thickness T2 of conductor layer L2 can be the same as or different from the thickness T1 of conductor layer L1. For example... Figure 8 and Figure 9 As illustrated in the second variation, when a conductor layer L3 with a thickness T3 is added, the thickness T2 of conductor layer L2 can be smaller than the thickness T3 of conductor layer L3. Furthermore, the thickness T2 of conductor layer L2 can be approximately the same as the thickness T1 of conductor layer L1. Moreover, as... Figure 10 As shown, the widths W1 and W4 can also be approximately the same, and the width W8 can be smaller than both the widths W1 and W4. This allows the thickness t6X of the insulating portion 136 in the X direction to be increased.

[0053] Figure 12 This is a schematic cross-sectional view used to illustrate the third modified example of the coil section 111, corresponding to the direction along... Figure 1 The cross-section of the BB line is shown. Additionally... Figure 13 This is a schematic top view used to illustrate the structure of the terminal electrode 121 in the third modified example.

[0054] Figure 12 and Figure 13 The third variation shown differs from the one using the addition of a conductor layer L0. Figure 3 , Figure 4 (a) and Figure 4 The coil portion 111 described in (b) is different. The conductor layer L0 is a conductor layer located at one end side in the Z direction. The conductor layer L0 can be formed first during manufacturing, for example. Alternatively, the conductor layer L0 can be formed after the conductor layers L1 and L2 described above, by removing the magnetic material on the end face side of the conductor layer L1 in the -Z direction, and then forming it to substantially overlap with the conductor layer L1.

[0055] exist Figure 12 and Figure 13 In the example shown, conductor layer L0 includes terminal patterns 147 and 148 and coil pattern C12. Terminal pattern 147 is a conductor pattern whose XZ end face in the +Y direction is exposed on the main surface 101 of the magnetic body portion M. Terminal pattern 148 is a conductor pattern whose XZ end face in the -Y direction is exposed on the main surface 102 of the magnetic body portion M. Coil pattern C12 is a straight conductor pattern within conductor layer L0 connecting terminal patterns 147 and 148. The planar shape of coil pattern C12 may be the same as or different from the planar shape of coil pattern C11. Furthermore, coil pattern C12 is not limited to a straight conductor pattern; it may also be a serpentine conductor pattern or a shape in which a portion has a bend or fold.

[0056] The conductor layer L0 is covered by insulating portions 138 of the interlayer insulating film 130 in the XY plane direction (a direction perpendicular to the Z direction). In other words, insulating portions 138 are respectively disposed between the end face of the conductor pattern (terminal patterns 147, 148, coil pattern C12) formed on the conductor layer L0 in the X direction and the magnetic body portion M. When the width of the coil pattern C12 in the X direction is smaller than the width of the terminal patterns 147, 148 in the X direction, an insulating portion 138 is disposed between the end face of the terminal pattern 147 in the -Y direction (the face opposite to the inner side of the magnetic body portion M) and the magnetic body portion M. In addition, an insulating portion 138 is disposed between the end face of the terminal pattern 148 in the +Y direction (the face opposite to the inner side of the magnetic body portion M) and the magnetic body portion M. The conductor layer L0 is covered by insulating portions 139 of the interlayer insulating film 130 in the -Z direction. In other words, an insulating portion 139 is disposed between the end face of the conductor pattern formed in the conductor layer L0 in the -Z direction and the magnetic body portion M.

[0057] Terminal patterns 141 and 147 are interconnected via through-hole conductors 155 formed through insulating portions 133 of the interlayer insulating film 130. Similarly, terminal patterns 142 and 148 are interconnected via through-hole conductors 156 formed through insulating portions 133 of the interlayer insulating film 130. Through-hole conductors 155 and 156 can be formed simultaneously with conductor layer L1, or they can be formed after conductor layer L0 and before conductor layer L1. In the former case, through-hole conductor 155 is integrally formed with terminal pattern 141, and through-hole conductor 156 is integrally formed with terminal pattern 142.

[0058] The XZ end faces of terminal pattern 147 and through-hole conductor 155 can be exposed from the main surface 101 of magnetic body portion M to form part of terminal electrode 121. Similarly, the XZ end faces of terminal pattern 148 and through-hole conductor 156 can be exposed from the main surface 102 of magnetic body portion M to form part of terminal electrode 122. The portion of terminal electrode 121 formed by the XZ end face of terminal pattern 147 constitutes exposed portion A4. The portion of terminal electrode 121 formed by the XZ end face of through-hole conductor 155 constitutes exposed portion A5. The same applies to terminal electrode 122.

[0059] The exposed portion A4 has a width of W10 in the X direction. Width W10 can be the same as or different from widths W1 and W4. For example, ... Figure 13 As shown, width W1 can also be approximately the same as width W10, and width W4 can be smaller than both width W1 and width W10. The exposed portion A5 has a width of W11 in the X direction. Width W11 can be the same as or different from width W6.

[0060] The conductor layer L0 has a thickness of T4 in the Z direction. Thickness T4 is thinner than thickness T2. Thickness T4 can be the same as or different from thickness T1.

[0061] The thickness of the insulating portion 138 in the XY plane direction (the direction perpendicular to the Z direction) is t8. More specifically, the thickness of the insulating portion 138 in the X direction between the end face of the terminal pattern 147 (or 148) in the X direction and the magnetic body portion M is t8X. Furthermore, when the width of the coil pattern C12 in the X direction is less than the width of the terminal pattern 147 (or 148) in the X direction, the thickness of the insulating portion 138 in the Y direction between the end face of the terminal pattern 147 (or 148) in the Y direction (the face opposite to the inner side of the magnetic body portion M) and the magnetic body portion M is t8Y (not shown). The thickness t8X and the thickness t8Y can be the same or different.

[0062] Thickness t8 is thinner than at least one of thicknesses t2X and t2Y. Thickness t8 may be the same as or different from thickness t1. Thickness t8 may also be thinner than both thicknesses t2X and t2Y. The thickness of the insulating part 139 in the Z direction is t9. Thickness t9 may be the same as or different from thicknesses t3 to t5.

[0063] like Figure 12 and Figure 13 As illustrated in the third variation, coil patterns C11 and C12 can also be formed in multiple conductor layers L1 and L0, respectively. Furthermore, compared to conductor layers L1 and L0 with coil patterns, the number of conductor layers L2 without coil patterns can be reduced. This reduces the DC resistance of the coil section 111.

[0064] Figure 14 This is a schematic cross-sectional view used to illustrate the fourth modified example of the coil section 111, corresponding to the section along... Figure 1 The cross-section of the BB line is shown. Additionally... Figure 15 This is a schematic top view used to illustrate the structure of the terminal electrode 121 in the fourth variation.

[0065] Figure 14 and Figure 15 The fourth variation shown differs from the one using the addition of a conductor layer L0. Figure 3 , Figure 4 (a) and Figure 4 The coil portion 111 described in (b) is different. The conductor layer L0 is a conductor layer located at one end side in the Z direction. The conductor layer L0 can be formed first, for example, during manufacturing. Alternatively, the conductor layer L0 can be formed after the conductor layers L1 and L2 described above, by removing the magnetic element portion M on the end face side of the conductor layer L1 in the -Z direction, and then forming it to substantially overlap with the conductor layer L1. Figure 14 and Figure 15 In the example shown, conductor layer L0 includes terminal patterns 149 and 1410. Terminal patterns 149 and 1410 are provided independently within the surface of conductor layer L0 without being connected to other conductor patterns. That is, there is no conductor pattern corresponding to coil pattern C11 in conductor layer L0, only terminal patterns 149 and 1410.

[0066] The conductor layer L0 is covered by insulating portions 1310 of the interlayer insulating film 130 in the XY plane direction. In other words, insulating portions 1310 are disposed between the X-direction end face of the conductor pattern (terminal pattern 149, 1410) formed on the conductor layer L0 and the magnetic body portion M. Insulating portions 1310 are disposed between the -Y-direction end face (the face opposite to the inner side of the magnetic body portion M) of the terminal pattern 149 and the magnetic body portion M. Additionally, insulating portions 1310 are disposed between the +Y-direction end face (the face opposite to the inner side of the magnetic body portion M) of the terminal pattern 1410 and the magnetic body portion M. The conductor layer L0 is covered by insulating portions 1311 of the interlayer insulating film 130 in the -Z direction. In other words, insulating portions 1311 are disposed between the -Z-direction end face of the conductor pattern formed on the conductor layer L0 and the magnetic body portion M.

[0067] Terminal patterns 141 and 149 are interconnected via through-hole conductors 157 that penetrate the insulating portion 133 of the interlayer insulating film 130. Similarly, terminal patterns 142 and 1410 are interconnected via through-hole conductors 158 that penetrate the insulating portion 133 of the interlayer insulating film 130. The through-hole conductors 157 and 158 can be formed simultaneously with conductor layer L1, or they can be formed after conductor layer L0 and before conductor layer L1. In the former case, through-hole conductor 157 is integrally formed with terminal pattern 141, and through-hole conductor 158 is integrally formed with terminal pattern 142.

[0068] The XZ end faces of terminal pattern 149 and through-hole conductor 157 can be exposed from the main surface 101 of magnetic body portion M to form part of terminal electrode 121. Similarly, the XZ end faces of terminal pattern 1410 and through-hole conductor 158 can be exposed from the main surface 102 of magnetic body portion M to form part of terminal electrode 122. The portion of terminal electrode 121 formed by the XZ end face of terminal pattern 149 constitutes exposed portion A4. The portion of terminal electrode 121 formed by the XZ end face of through-hole conductor 157 constitutes exposed portion A5. The same applies to terminal electrode 122.

[0069] The exposed portion A4 has a width of W12 in the X direction. Width W12 can be the same as or different from widths W1 and W4. The exposed portion A5 has a width of W13 in the X direction. Width W13 can be the same as or different from width W6.

[0070] The conductor layer L0 has a thickness T5 in the Z direction. Thickness T5 is thicker than thickness T1, thereby increasing the area of ​​terminal electrode 121. Thickness T5 can be the same as or different from thickness T2.

[0071] The insulation portion 1310 has a thickness of t10 in the XY plane direction (the direction perpendicular to the Z direction). More specifically, the insulation portion 1310 disposed between the X-direction end face of the terminal pattern 149 (or 1410) and the magnetic body portion M has a thickness of t10X in the X direction. Furthermore, the insulation portion 1310 disposed between the Y-direction end face (the face opposite the inner side of the magnetic body portion M) of the terminal pattern 149 (or 1410) and the magnetic body portion M has a thickness of t10Y in the Y direction. At least one of the thicknesses t10X and t10Y is greater than the thickness t1X, thereby the insulation portion 1310 functions as a buffer material against external forces applied to the terminal pattern 149 in the Y direction.

[0072] Furthermore, the thicknesses t10X and t10Y of the insulating portion 1310 can both be greater than the thickness t1X of the insulating portion 131. This further enhances the function of the insulating portion 1310 as a buffer material, thus further improving product reliability. Thickness t10X and thickness t10Y can be the same. Thickness t10X can be the same as or different from thickness t2X. Thickness t10X can be the same as or different from thickness t10Y. The thickness of the portion of the insulating portion 1310 covering the terminal pattern 149 in the X direction can be the same as or different from the portion covering the terminal pattern 1410 in the X direction. The thickness of the portion of the insulating portion 1310 covering the terminal pattern 149 in the Y direction can be the same as or different from the portion covering the terminal pattern 1410 in the Y direction. The thickness of the insulating portion 1311 in the Z direction is t11. Thickness t11 can be the same as or different from thicknesses t3 to t5.

[0073] like Figure 14 and Figure 15 As illustrated in the fourth variation, the conductor layer L1 with the coil pattern C11 can also be sandwiched between conductor layers L0 and L2 without the coil pattern. This allows the coil pattern C11 to be positioned closer to the center in the Z direction of the magnetic body portion M.

[0074] Figure 16 This is a schematic cross-sectional view used to illustrate the fifth modified example of the coil section 111, corresponding to the section along... Figure 1 The cross-section of the BB line is shown.

[0075] Figure 16 The fifth variation shown omits the terminal pattern 146, which is consistent with... Figure 6This differs from the first variation shown. Specifically, only the terminal pattern 145 exists in the conductor layer L3. As a result, the terminal electrode 121 exposed from the main surface 101 of the magnetic body portion M is composed of three layers of terminal patterns 141, 143, and 145, and two through-hole conductors 151 and 153 connecting them. Conversely, the terminal electrode 122 exposed from the main surface 102 of the magnetic body portion M is composed of two layers of terminal patterns 142 and 144, and one through-hole conductor 152 connecting them. Consequently, in the fifth variation, the dimension of the terminal electrode 121 in the Z direction is larger than the dimension of the terminal electrode 122 in the Z direction.

[0076] like Figure 16 As illustrated in the fifth variation, the dimensions of terminal electrode 121 and terminal electrode 122 do not necessarily have to be the same; they can be designed to have different dimensions depending on the required characteristics, etc.

[0077] <Second Implementation> Figure 17 This is a schematic perspective view showing the appearance of the electronic component 200 according to the second embodiment of the technology disclosed herein. Additionally, Figure 18 It is along Figure 17 The diagram shows a schematic cross-section of line AA. Along... Figure 17 The cross section of the BB line shown is... Figure 3 same.

[0078] exist Figure 17 and Figure 18 In the example shown, the electronic component 200 of the second embodiment differs from the electronic component 100 of the first embodiment in that the coil pattern C11 included in the coil portions 111 and 112 is offset in the -X direction, and the coil pattern C11 included in the coil portions 113 and 114 is offset in the +X direction. Since the other basic structures are the same as those of the electronic component 100 of the first embodiment, the same symbols are used for the same elements, and repeated descriptions are omitted.

[0079] exist Figure 17 and Figure 18 In the example shown, the edge position of the coil pattern C11 in the -X direction of the coil portions 111 and 112 coincides with the edge position of the terminal patterns 141 to 144 in the -X direction. Conversely, the edge position of the coil pattern C11 in the +X direction of the coil portions 113 and 114 coincides with the edge position of the terminal patterns 141 to 144 in the +X direction.

[0080] As illustrated in the electronic component 200 of the second embodiment, the shapes of the coil portions 111 to 114 do not necessarily have to be exactly the same. In addition, according to the structure of the electronic component 200 of the second embodiment, the coupling between the coil portion 112 and the coil portion 113 can be further reduced.

[0081] Furthermore, the structures of various modifications of the electronic component 100 described in the first embodiment can be applied to the electronic component 200 of the second embodiment.

[0082] <Third Implementation> Figure 19 This is a schematic perspective view showing the appearance of the electronic component 300 according to the third embodiment of the technology disclosed herein. Additionally, Figure 20 It is along Figure 19 The diagram shows a simplified cross-sectional view of the BB line.

[0083] exist Figure 19 and Figure 20 In the example shown, the electronic component 300 of the third embodiment differs from the electronic component 100 of the first embodiment in that conductor layer L1 includes terminal patterns 1411, 1412 and coil pattern C21, conductor layer L2 includes terminal patterns 1413, 1414 and coil pattern C22, and conductor layer L3 includes terminal patterns 1415, 1416. Since the other basic structures are the same as those of the electronic component 100 of the first embodiment, the same symbols are used for the same elements, and repeated descriptions are omitted.

[0084] Figure 21 (a) to (c) are schematic top views showing the shapes of the conductor patterns located in conductor layers L1 to L3 respectively in the third embodiment.

[0085] exist Figure 21 In the example shown in (a), conductor layer L1 includes terminal patterns 1411, 1412 and a coil pattern C21 connected at one end to terminal pattern 1411. Terminal pattern 1412 is disposed independently within the surface of conductor layer L1 without being connected to other conductor patterns. Coil pattern C21 is a loop conductor pattern wound with approximately 3 / 4 turns.

[0086] exist Figure 21 In the example shown in (b), conductor layer L2 includes terminal patterns 1413, 1414 and a coil pattern C22 connected at one end to terminal pattern 1414. Terminal pattern 1413 is disposed independently within the surface of conductor layer L2 without being connected to other conductor patterns. Coil pattern C22 is a loop conductor pattern wound with approximately 3 / 4 turns. The other end of coil pattern C22 is connected to the other end of coil pattern C21 via through-hole conductor 161. Thus, coil pattern C21 and coil pattern C22 are connected in series between terminal patterns 1411 and terminal pattern 1414.

[0087] exist Figure 21In the example shown in (c), conductor layer L3 includes terminal patterns 1415 and 1416. Terminal patterns 1415 and 1416 are provided independently within the plane of conductor layer L3 without being connected to other conductor patterns. That is, conductor layer L3 does not have conductor patterns corresponding to coil patterns C21 and C22, and only terminal patterns 1415 and 1416 exist.

[0088] Terminal pattern 1413 is connected to terminal pattern 1411 via through-hole conductor 159. Terminal pattern 1414 is connected to terminal pattern 1412 via through-hole conductor 1510. Terminal pattern 1415 is connected to terminal pattern 1413 via through-hole conductor 1511. Terminal pattern 1416 is connected to terminal pattern 1414 via through-hole conductor 1512. Terminal patterns 1411, 1413, 1415 and through-hole conductors 159, 1511 form terminal electrode 121 by being exposed from the main surface 101 of the magnetic body portion M. Terminal patterns 1412, 1414, 1416 and through-hole conductors 1510, 1512 form terminal electrode 122 by being exposed from the main surface 102 of the magnetic body portion M.

[0089] In this embodiment, the thickness of the conductor layer L3 without coil patterns in the Z direction is also greater than the respective thicknesses of the conductor layers L1 and L2 with coil patterns C21 and C22 in the Z direction. This increases the area of ​​the terminal electrodes 121 and 122.

[0090] In this embodiment, the interlayer insulating film 130 includes insulating portions 1312 to 1318. The conductor layer L1 is covered by the insulating portions 1312 in the XY plane direction. In other words, insulating portions 1312 are respectively disposed between the X-direction end face of the conductor pattern (terminal pattern 1411, 1412 and coil pattern C21) formed on the conductor layer L1 and the magnetic body portion M, and between the Y-direction end face and the magnetic body portion M.

[0091] The conductor layer L2 is covered by the insulating portion 1313 in the XY plane direction. In other words, the insulating portion 1313 is disposed between the end face of the conductor pattern (terminal pattern 1413, 1414 and coil pattern C22) formed in the conductor layer L2 in the X direction and the magnetic body portion M, and between the end face of the conductor pattern (terminal pattern 1413, 1414 and coil pattern C22) formed in the conductor layer L2 and the magnetic body portion M.

[0092] The conductor layer L3 is covered by the insulating portion 1314 in the XY plane direction. In other words, the insulating portion 1314 is disposed between the end face of the conductor pattern (terminal pattern 1415, 1416) formed in the conductor layer L3 in the X direction and the magnetic body portion M, and between the end face of the conductor pattern (terminal pattern 1415, 1416) formed in the conductor layer L3 and the magnetic body portion M.

[0093] The conductor pattern formed on conductor layer L1 is covered by insulating portion 1315 from the -Z direction. Insulating portion 1316 exists between conductor layer L1 and conductor layer L2. Insulating portion 1317 exists between conductor layer L2 and conductor layer L3. The conductor pattern formed on conductor layer L3 is covered by insulating portion 1318 from the +Z direction.

[0094] In this embodiment, the thickness of the insulating portion 1314 in the XY plane direction is also greater than the thickness of the insulating portions 1312 and 1313 in the XY plane direction. As a result, the insulating portion 1314 functions as a buffer material against external forces applied to the terminal patterns 1415 and 1416 in the Y direction.

[0095] As exemplified by the electronic component 300 of the third embodiment, the coil pattern included in the coil section does not necessarily have to be a straight line; it can also be a loop. Furthermore, in this embodiment, since the coil patterns C21 and C22 formed on the two conductor layers L1 and L2 are connected in series, a larger inductance can be obtained.

[0096] Furthermore, the structures of various modifications of the electronic component 100 described in the first embodiment can be applied to the electronic component 300 of the second embodiment.

[0097] The above describes the implementation of the technology disclosed herein, but the technology disclosed herein is not limited to the above implementation. Various modifications can be made without departing from its spirit, and it is self-evident that these modifications are also included within the scope of the technology disclosed herein.

[0098] For example, in the embodiments described above, the end faces (XZ end faces) of the through-hole conductors (e.g., through-hole conductors 151-159, 1510-1512) that connect the terminal patterns in the Z direction are exposed from the main surface (101, 102) of the magnetic body portion M, but the technology disclosed herein is not limited to this. That is, the end faces of such through-hole conductors may also be formed so that they are not exposed from the main surface of the magnetic body portion M.

[0099] The technology disclosed herein includes, but is not limited to, the following structural examples.

[0100] An electronic component according to one aspect of this disclosure includes: a magnetic body portion having a first main surface and a second main surface located opposite each other in a first direction; a coil portion embedded in the magnetic body portion, with a first terminal electrode exposed on the first main surface and a second terminal electrode exposed on the second main surface; and an interlayer insulating film located between the coil portion and the magnetic body portion. The coil portion includes a first conductor layer and a second conductor layer stacked in a second direction orthogonal to the first direction. The first conductor layer includes: a first terminal pattern with its end face exposed on the first main surface, forming a first exposed portion of the first terminal electrode; a second terminal pattern with its end face exposed on the second main surface, forming a first exposed portion of the second terminal electrode; and a first coil pattern with one end electrically connected to the first terminal electrode and the other end electrically connected to the second terminal electrode. The second conductor layer includes: a third terminal pattern with its end face exposed on the first main surface, forming a second exposed portion of the first terminal electrode; and a fourth terminal pattern with its end face exposed on the second main surface, forming a second exposed portion of the second terminal electrode. The first terminal pattern and the second conductor layer include: a third terminal pattern with its end face exposed on the first main surface, forming a second exposed portion of the first terminal electrode; and a fourth terminal pattern with its end face exposed on the second main surface, forming a second exposed portion of the second terminal electrode. The three terminal patterns are interconnected via a first through-hole conductor, and the second and fourth terminal patterns are interconnected via a second through-hole conductor. The interlayer insulating film includes: a first insulating portion disposed between the first conductor layer and the magnetic body portion in a third direction orthogonal to the first and second directions; and a second insulating portion covering the second conductor layer from at least the first and third directions. In the second insulating portion, at least one of the thickness of the first portion covering the third terminal pattern from the first direction in the first direction and the thickness of the second portion covering the third terminal pattern from the third direction in the third direction is thicker than the thickness of the third portion covering the first terminal pattern from the third direction in the third direction in the first insulating portion. In the second insulating portion, at least one of the thickness of the fourth portion covering the fourth terminal pattern from the first direction in the first direction and the thickness of the fifth portion covering the fourth terminal pattern from the third direction in the third direction in the third direction is thicker than the thickness of the sixth portion covering the second terminal pattern from the third direction in the third direction in the first insulating portion. This allows for an increase in the area of ​​the first and second terminal electrodes and improves product reliability.

[0101] In the aforementioned electronic component, the thickness of the second conductor layer in the second direction may also be greater than the thickness of the first conductor layer in the second direction. This allows for a further increase in the area of ​​the first and second terminal electrodes.

[0102] In the aforementioned electronic components, the thickness of the first part in the first direction and the thickness of the second part in the third direction may both be greater than the thickness of the third part in the third direction. This further improves the reliability of the product.

[0103] In the aforementioned electronic component, the thickness of the first part in the first direction may be equal to the thickness of the second part in the third direction. This simplifies the fabrication of the second insulating part.

[0104] In the aforementioned electronic component, the thickness of the first part in the first direction may also be equal to the thickness of the fourth part in the first direction. This simplifies the fabrication of the second insulating part.

[0105] In the aforementioned electronic component, the thickness of the second part in the third direction may also be equal to the thickness of the fifth part in the third direction. This simplifies the fabrication of the second insulating part.

[0106] In the aforementioned electronic component, the end face of the first through-hole conductor may be exposed on the first main surface, and the end face of the second through-hole conductor may be exposed on the second main surface. This allows for a further increase in the area of ​​the first and second terminal electrodes.

[0107] In the aforementioned electronic component, one end of the first coil pattern may be connected to the first terminal pattern within the first conductor layer, and the other end of the first coil pattern may be connected to the second terminal pattern within the first conductor layer. Thus, the first coil pattern can be configured, for example, in a straight line shape.

[0108] In the aforementioned electronic components, the third terminal pattern can also be independently disposed within the surface of the second conductor layer without being connected to other conductor patterns. Thus, the third terminal pattern functions as an auxiliary pattern.

[0109] In the aforementioned electronic components, the fourth terminal pattern can also be independently provided within the surface of the second conductor layer without being connected to other conductor patterns. Thus, the fourth terminal pattern functions as an auxiliary pattern.

[0110] In the aforementioned electronic components, the second conductor layer may also consist only of the third and fourth terminal patterns. Thus, the third and fourth terminal patterns function as auxiliary patterns.

[0111] In the aforementioned electronic component, the coil portion may further include a third conductor layer, with the second conductor layer located between the first and third conductor layers in the second direction. The third conductor layer includes a fifth terminal pattern with its end face exposed on the first main surface and a sixth terminal pattern with its end face exposed on the second main surface. The third terminal pattern and the fifth terminal pattern are interconnected via a third through-hole conductor with its end face exposed on the first main surface, and the fourth terminal pattern and the sixth terminal pattern are interconnected via a fourth through-hole conductor with its end face exposed on the second main surface. The interlayer insulating film further includes a third insulating portion covering the third conductor layer from at least the first and third directions. The thickness of the third conductor layer in the second direction is greater than the thickness of the first conductor layer in the second direction. In the third insulating portion, at least one of the thickness of the seventh portion covering the fifth terminal pattern from the first direction and the thickness of the eighth portion covering the fifth terminal pattern from the third direction in the third direction is greater than the thickness of the third portion in the third direction. In the third insulating portion, at least one of the thickness of the ninth portion covering the sixth terminal pattern from the first direction and the thickness of the tenth portion covering the sixth terminal pattern from the third direction in the third direction is greater than the thickness of the sixth portion in the third direction. This allows for a further increase in the area of ​​the first and second terminal electrodes. Alternatively, the second conductor layer may be composed only of the third and fourth terminal patterns, and the third conductor layer may be composed only of the fifth and sixth terminal patterns. In this case, the third to sixth terminal patterns function as auxiliary patterns.

[0112] Alternatively, in this case, the thickness of the 7th part in the 1st direction and the thickness of the 8th part in the 3rd direction may both be greater than the thickness of the 3rd part in the 3rd direction. This further improves the reliability of the product. Furthermore, in this case, the thickness of the 7th part in the 1st direction may be equal to the thickness of the 8th part in the 3rd direction. This simplifies the fabrication of the 3rd insulating portion. Additionally, the thickness of the 3rd conductor layer in the 2nd direction may be greater than the thickness of the 2nd conductor layer in the 2nd direction. This allows for a further increase in the area of ​​the 1st and 2nd terminal electrodes.

[0113] In the aforementioned electronic component, the coil portion may further include a third conductor layer, with the first conductor layer located between the second and third conductor layers in the second direction. The third conductor layer includes a fifth terminal pattern with its end face exposed on the first main surface and a sixth terminal pattern with its end face exposed on the second main surface. The first and fifth terminal patterns are interconnected via a third through-hole conductor with its end face exposed on the first main surface, and the second and sixth terminal patterns are interconnected via a fourth through-hole conductor with its end face exposed on the second main surface. The interlayer insulating film further includes a third insulating portion covering the third conductor layer from at least the first and third directions. The thickness of the third conductor layer in the second direction is greater than the thickness of the first conductor layer in the second direction. In the third insulating portion, at least one of the thickness of the seventh portion covering the fifth terminal pattern from the first direction and the thickness of the eighth portion covering the fifth terminal pattern from the third direction in the third direction is greater than the thickness of the third portion in the third direction. In the third insulating portion, at least one of the thickness of the ninth portion covering the sixth terminal pattern from the first direction and the thickness of the tenth portion covering the sixth terminal pattern from the third direction in the third direction is greater than the thickness of the sixth portion in the third direction. This allows for a further increase in the area of ​​the first and second terminal electrodes. Alternatively, the second conductor layer may be composed only of the third and fourth terminal patterns, and the third conductor layer may be composed only of the fifth and sixth terminal patterns. Thus, the third to sixth terminal patterns function as auxiliary patterns.

[0114] Alternatively, in this case, the thickness of the 7th part in the 1st direction and the thickness of the 8th part in the 3rd direction may both be greater than the thickness of the 3rd part in the 3rd direction. This further improves the reliability of the product. Furthermore, in this case, the thickness of the 7th part in the 1st direction may be equal to the thickness of the 8th part in the 3rd direction. This simplifies the fabrication of the 3rd insulating part.

[0115] In the aforementioned electronic component, the coil portion may further include a third conductor layer. The first conductor layer is located between the second and third conductor layers in the second direction. The third conductor layer includes: a fifth terminal pattern with its end face exposed on the first main surface; a sixth terminal pattern with its end face exposed on the second main surface; and a second coil pattern with one end electrically connected to the first terminal electrode and the other end electrically connected to the second terminal electrode. The first and fifth terminal patterns are interconnected via a third through-hole conductor with its end face exposed on the first main surface, and the second and sixth terminal patterns are interconnected via a fourth through-hole conductor with its end face exposed on the second main surface. The interlayer insulating film further includes a third insulating portion covering the third conductor layer from at least the third direction. The thickness of the second conductor layer in the second direction is greater than the thickness of the third conductor layer in the second direction. At least one of the thickness of the first portion in the first direction and the thickness of the second portion in the third direction is greater than the thickness of the seventh portion of the third insulating portion covering the fifth terminal pattern from the third direction in the third direction. At least one of the thickness of the fourth portion in the first direction and the thickness of the fifth portion in the third direction is greater than the thickness of the eighth portion of the third insulating portion covering the sixth terminal pattern from the third direction in the third direction in the third direction. This increases the design freedom of the coil portion. In this case, it is also possible that the thickness of both the first portion in the first direction and the thickness of the second portion in the third direction are greater than the thickness of the seventh portion in the third direction. This further improves the reliability of the product.

[0116] In this case, one end of the first coil pattern can be connected to the first terminal pattern within the first conductor layer, the other end of the first coil pattern can be connected to the second terminal pattern within the first conductor layer, one end of the second coil pattern can be connected to the fifth terminal pattern within the third conductor layer, and the other end of the second coil pattern can be connected to the sixth terminal pattern within the third conductor layer. This further reduces the DC resistance of the coil section. Alternatively, one end of the first coil pattern can be connected to the first terminal pattern within the first conductor layer, the other end of the first coil pattern can be connected to the other end of the second terminal pattern, and one end of the second coil pattern can be connected to the fifth terminal pattern within the third conductor layer. This further increases the inductance of the coil section.

[0117] In the aforementioned electronic components, a magnetic element portion may be embedded within a plurality of coil portions arranged in the third direction. This allows for the provision of a so-called coil array.

[0118] In the aforementioned electronic components, the width of the third terminal pattern in the third direction may also be smaller than the width of the first terminal pattern in the third direction. This further improves the reliability of the product.

[0119] The component-embedded substrate of this disclosure is a component-embedded substrate in which the aforementioned electronic components are embedded, and includes: a first wiring pattern; a second wiring pattern; a first substrate through-hole conductor connecting the first wiring pattern to a first terminal electrode; and a second substrate through-hole conductor connecting the second wiring pattern to a second terminal electrode. This ensures sufficient contact area between the first terminal electrode and the first substrate through-hole conductor, and also ensures sufficient contact area between the second terminal electrode and the second substrate through-hole conductor.

[0120] This application claims the benefit of Japanese Patent Application No. 2024-011756, filed on January 30, 2024, the entire disclosure of which is incorporated herein by reference. Explanation of reference numerals in the attached figures 10 components with built-in substrate 11-15 Insulation layer Wiring patterns 20-22 31, 32 Substrate through-hole conductors 100, 200, 300 electronic components 101, 102 main surface Side view, 103-106 Coil section 111-114 Terminal electrodes 121 and 122 130-layer interlayer insulation film Insulation parts 131-139, 1310-1318 Terminal patterns 141-149, 1410-1416 151-159, 1510-1512, 161 Through-hole conductors Exposed areas A1~A5, B1~B3 C11, C12, C21, C22 coil patterns L0~L3 conductor layers M is the magnetic body part.

Claims

1. An electronic component, wherein, have: The magnetic body has a first main surface and a second main surface located on opposite sides of each other in the first direction; A coil portion, embedded in the magnetic body portion, with a first terminal electrode exposed on the first main surface and a second terminal electrode exposed on the second main surface; and An interlayer insulating film is located between the coil portion and the magnetic element portion. The coil portion comprises a first conductor layer and a second conductor layer stacked in a second direction orthogonal to the first direction. The first conductor layer includes: a first terminal pattern with its end face exposed on the first main surface, forming a first exposed portion of the first terminal electrode; a second terminal pattern with its end face exposed on the second main surface, forming a first exposed portion of the second terminal electrode; and a first coil pattern with one end electrically connected to the first terminal electrode and the other end electrically connected to the second terminal electrode. The second conductor layer includes: a third terminal pattern with its end face exposed on the first main surface, forming a second exposed portion of the first terminal electrode; and a fourth terminal pattern with its end face exposed on the second main surface, forming a second exposed portion of the second terminal electrode. The first terminal pattern and the third terminal pattern are interconnected via the first through-hole conductor. The second terminal pattern and the fourth terminal pattern are interconnected via the second through-hole conductor. The interlayer insulating film includes: a first insulating portion disposed between the first conductor layer and the magnetic body portion in a third direction orthogonal to the first and second directions; and a second insulating portion covering the second conductor layer at least from the first and third directions. In the second insulating portion, at least one of the thickness of the first portion covering the third terminal pattern in the first direction and the thickness of the second portion covering the third terminal pattern in the third direction is thicker than the thickness of the third portion covering the first terminal pattern in the third direction. In the second insulating portion, at least one of the thickness of the fourth portion covering the fourth terminal pattern from the first direction in the first direction and the thickness of the fifth portion covering the fourth terminal pattern from the third direction in the third direction is thicker than the thickness of the sixth portion covering the second terminal pattern from the third direction in the third direction.

2. The electronic component according to claim 1, wherein, The thickness of the second conductor layer in the second direction is greater than the thickness of the first conductor layer in the second direction.

3. The electronic component according to claim 1, wherein, The thickness of the first part in the first direction and the thickness of the second part in the third direction are both greater than the thickness of the third part in the third direction.

4. The electronic component according to claim 3, wherein, The thickness of the first part in the first direction is equal to the thickness of the second part in the third direction.

5. The electronic component according to claim 1, wherein, The thickness of the first part in the first direction is equal to the thickness of the fourth part in the first direction.

6. The electronic component according to claim 1, wherein, The thickness of the second part in the third direction is equal to the thickness of the fifth part in the third direction.

7. The electronic component according to claim 1, wherein, The end face of the first through-hole conductor is exposed on the first main surface. The end face of the second through-hole conductor is exposed on the second main surface.

8. The electronic component according to claim 1, wherein, One end of the first coil pattern is connected to the first terminal pattern within the first conductor layer. The other end of the first coil pattern is connected to the second terminal pattern within the first conductor layer.

9. The electronic component according to claim 8, wherein, The third terminal pattern is set independently within the plane of the second conductor layer without being connected to other conductor patterns.

10. The electronic component according to claim 9, wherein, The fourth terminal pattern is set independently within the plane of the second conductor layer without being connected to other conductor patterns.

11. The electronic component according to claim 10, wherein, The second conductor layer consists only of the third terminal pattern and the fourth terminal pattern.

12. The electronic component according to claim 1, wherein, The coil section also includes a third conductor layer. The second conductor layer is located between the first conductor layer and the third conductor layer in the second direction. The third conductor layer includes: a fifth terminal pattern with its end face exposed on the first main surface, and a sixth terminal pattern with its end face exposed on the second main surface. The third terminal pattern and the fifth terminal pattern are interconnected via a third through-hole conductor exposed on the first main surface. The fourth terminal pattern and the sixth terminal pattern are interconnected via a fourth through-hole conductor exposed on the second main surface. The interlayer insulating film further includes a third insulating portion that covers the third conductor layer from at least the first direction and the third direction. The thickness of the third conductor layer in the second direction is greater than the thickness of the first conductor layer in the second direction. In the third insulating portion, at least one of the thickness of the seventh portion covering the fifth terminal pattern in the first direction and the thickness of the eighth portion covering the fifth terminal pattern in the third direction is thicker than the thickness of the third portion in the third direction. In the third insulating portion, at least one of the thickness of the 9th portion covering the pattern of the 6th terminal from the first direction in the first direction and the thickness of the 10th portion covering the pattern of the 6th terminal from the third direction in the third direction is thicker than the thickness of the 6th portion in the third direction.

13. The electronic component according to claim 12, wherein, The thickness of the 7th part in the 1st direction and the thickness of the 8th part in the 3rd direction are both greater than the thickness of the 3rd part in the 3rd direction.

14. The electronic component according to claim 13, wherein, The thickness of the 7th part in the 1st direction is equal to the thickness of the 8th part in the 3rd direction.

15. The electronic component according to claim 12, wherein, The second conductor layer is composed only of the third terminal pattern and the fourth terminal pattern. The third conductor layer consists only of the fifth terminal pattern and the sixth terminal pattern.

16. The electronic component according to claim 12, wherein, The thickness of the third conductor layer in the second direction is greater than the thickness of the second conductor layer in the second direction.

17. The electronic component according to claim 1, wherein, The coil section also includes a third conductor layer. The first conductor layer is located between the second conductor layer and the third conductor layer in the second direction. The third conductor layer includes: a fifth terminal pattern with its end face exposed on the first main surface, and a sixth terminal pattern with its end face exposed on the second main surface. The first terminal pattern and the fifth terminal pattern are interconnected via a third through-hole conductor exposed on the first main surface. The second terminal pattern and the sixth terminal pattern are interconnected via a fourth through-hole conductor exposed on the second main surface. The interlayer insulating film further includes a third insulating portion that covers the third conductor layer from at least the first direction and the third direction. The thickness of the third conductor layer in the second direction is greater than the thickness of the first conductor layer in the second direction. In the third insulating portion, at least one of the thickness of the seventh portion covering the fifth terminal pattern in the first direction and the thickness of the eighth portion covering the fifth terminal pattern in the third direction is thicker than the thickness of the third portion in the third direction. In the third insulating portion, at least one of the thickness of the 9th portion covering the pattern of the 6th terminal from the first direction in the first direction and the thickness of the 10th portion covering the pattern of the 6th terminal from the third direction in the third direction is thicker than the thickness of the 6th portion in the third direction.

18. The electronic component according to claim 17, wherein, The thickness of the 7th part in the 1st direction and the thickness of the 8th part in the 3rd direction are both greater than the thickness of the 3rd part in the 3rd direction.

19. The electronic component according to claim 18, wherein, The thickness of the 7th part in the 1st direction is equal to the thickness of the 8th part in the 3rd direction.

20. The electronic component according to claim 17, wherein, The second conductor layer is composed only of the third terminal pattern and the fourth terminal pattern. The third conductor layer consists only of the fifth terminal pattern and the sixth terminal pattern.

21. The electronic component according to claim 1, wherein, The coil section also includes a third conductor layer. The first conductor layer is located between the second conductor layer and the third conductor layer in the second direction. The third conductor layer includes: a fifth terminal pattern with its end face exposed on the first main surface; a sixth terminal pattern with its end face exposed on the second main surface; and a second coil pattern with one end electrically connected to the first terminal electrode and the other end electrically connected to the second terminal electrode. The first terminal pattern and the fifth terminal pattern are interconnected via a third through-hole conductor exposed on the first main surface. The second terminal pattern and the sixth terminal pattern are interconnected via a fourth through-hole conductor exposed on the second main surface. The interlayer insulating film further includes a third insulating portion that covers the third conductor layer from the third direction. The thickness of the second conductor layer in the second direction is greater than the thickness of the third conductor layer in the second direction. At least one of the thickness of the first portion in the first direction and the thickness of the second portion in the third direction is thicker than the thickness of the seventh portion of the third insulating portion that covers the fifth terminal pattern in the third direction in the third direction. At least one of the thickness of the fourth portion in the first direction and the thickness of the fifth portion in the third direction is thicker than the thickness of the eighth portion of the third insulating portion that covers the pattern of the sixth terminal in the third direction.

22. The electronic component according to claim 21, wherein, The thickness of the first part in the first direction and the thickness of the second part in the third direction are both greater than the thickness of the seventh part in the third direction.

23. The electronic component according to claim 21, wherein, One end of the first coil pattern is connected to the first terminal pattern within the first conductor layer. The other end of the first coil pattern is connected to the second terminal pattern within the first conductor layer. One end of the second coil pattern is connected to the fifth terminal pattern within the third conductor layer. The other end of the second coil pattern is connected to the sixth terminal pattern within the third conductor layer.

24. The electronic component according to claim 21, wherein, One end of the first coil pattern is connected to the first terminal pattern within the first conductor layer. The other end of the first coil pattern is connected to the other end of the second terminal pattern. One end of the second coil pattern is connected to the fifth terminal pattern within the third conductor layer.

25. The electronic component according to claim 1, wherein, The plurality of coil portions arranged in the third direction are embedded in the magnetic element portion.

26. The electronic component according to claim 1, wherein, The width of the third terminal pattern in the third direction is smaller than the width of the first terminal pattern in the third direction.

27. A component with a built-in substrate, wherein, For a component-embedded substrate in which the electronic components of any one of claims 1 to 26 are embedded, have: First wiring pattern; Second wiring pattern; The first substrate through-hole conductor connects the first wiring pattern to the first terminal electrode; as well as The second substrate through-hole conductor connects the second wiring pattern to the second terminal electrode.

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