Physical vapor deposition chamber

CN122648874APending Publication Date: 2026-08-28MICROPOLARIS EQUIPMENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202611140815.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-07-30
Publication Date
2026-08-28

AI Technical Summary

Technical Problem

[0005]本发明要解决的技术问题在于,针对现有因腔室高度增加导致仅用底部烘烤灯时烘烤不充分、需延长烘烤时间而降低设备使用效率的缺陷,提供一种能够提高烘烤效率、缩短烘烤时间的物理气相沉积腔室

Benefits of technology

[0007]The beneficial effects of the physical vapor deposition chamber provided by this invention are as follows: Through the coordinated arrangement of the first and second baking components, comprehensive baking of the lower, middle, and upper regions of the process chamber is achieved, solving the problems of uneven temperature and incomplete baking in high aspect ratio process chambers. The second baking component radiates heat into the process chamber through openings in the process liner, significantly shortening the baking time and substantially improving equipment efficiency.

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Abstract

The present application provides a physical vapor deposition chamber, comprising: a process inner liner provided with at least one opening, arranged in a process chamber; at least one first baking assembly arranged in a lower region of the process chamber, below the process inner liner; at least one second baking assembly arranged between the process chamber and the process inner liner, distributed in a middle region and / or an upper region of the process chamber; and the opening is arranged corresponding to the second baking assembly. Through the cooperative arrangement of the first baking assembly and the second baking assembly, the present application realizes the comprehensive baking of the lower, middle and upper regions of the process chamber, solves the problem of uneven temperature and incomplete baking of the upper and lower regions of the high aspect ratio chamber.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more particularly to a physical vapor deposition chamber. Background Technology

[0002] After maintenance operations such as disassembly, cleaning, and component replacement are completed in a Physical Vapor Deposition (PVD) chamber, a chamber baking process is necessary. During maintenance, the interior of the chamber comes into contact with outside air, and components such as the chamber walls, target material, shielding parts, and liner readily absorb moisture, oxygen, volatile organic compounds, and various impurity gases. High-temperature baking combined with vacuum evacuation thoroughly removes moisture, residual gases, and contaminants adsorbed on the chamber walls and components, effectively reducing the moisture and oxygen content of the chamber's base vacuum. Simultaneously, it stabilizes the internal environment and temperature field of the chamber, reducing process defects such as abnormal gas discharge, film oxidation, film color difference, excessive particle size, and insufficient adhesion. This ensures the stability, repeatability, and product yield of subsequent coating processes, allowing the equipment to quickly return to standard production status.

[0003] Current baking lamps are installed at the bottom of the chamber, allowing for thorough baking throughout the chamber over a prolonged period. However, with technological advancements, the height of the chamber has increased from the original 90mm to over 600mm. This increased height makes it difficult to thoroughly bake the upper part of the chamber. Current designs can only increase baking time, which significantly reduces the chamber's production time and impacts efficiency.

[0004] In view of this, it is necessary to propose a physical vapor deposition chamber to solve the above problems. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a physical vapor deposition chamber that can improve baking efficiency and shorten baking time, addressing the shortcomings of existing chambers where insufficient baking is caused by using only bottom baking lamps due to increased chamber height.

[0006] This invention provides a physical vapor deposition chamber, including a process chamber, and further comprising: A process liner with at least one opening is disposed within the process chamber; At least one first baking component is disposed in the lower region of the process chamber, located below the process liner; At least one second baking component is disposed between the process chamber and the process liner, distributed in the middle and / or upper regions of the process chamber, and the opening is provided corresponding to the second baking component.

[0007] The beneficial effects of the physical vapor deposition chamber provided by this invention are as follows: Through the coordinated arrangement of the first and second baking components, comprehensive baking of the lower, middle, and upper regions of the process chamber is achieved, solving the problems of uneven temperature and incomplete baking in high aspect ratio process chambers. The second baking component radiates heat into the process chamber through openings in the process liner, significantly shortening the baking time and substantially improving equipment efficiency.

[0008] In one possible embodiment, the physical vapor deposition chamber further includes: at least one baffle movably disposed on the outer wall of the process liner, the baffle being configured to switch between a fully shielded state and a fully exposed state; in the fully shielded state, the baffle shields the opening to isolate the second baking assembly; in the fully shielded state, the baffle is moved aside to expose the second baking assembly through the opening, allowing heat radiation from the second baking assembly to enter the interior of the process chamber through the opening. The beneficial effect is that the movable baffle ensures that during process production stages where baking is not required, the baffle is in a fully shielded state to isolate the second baking assembly, preventing metal deposits during the process from contaminating the baking assembly, and ensuring the long-term stable operation and service life of the baking assembly.

[0009] In one possible embodiment, the physical vapor deposition chamber further includes a drive mechanism connected to the baffle, the drive mechanism being configured to drive the baffle to move so that the baffle switches between a fully shielded state and a fully exposed state. The advantage is that by setting an independent drive mechanism, automated control of the baffle state switching is achieved.

[0010] In one possible embodiment, the driving mechanism includes a driving member disposed outside the process chamber and a transmission shaft connected to the driving member. The transmission shaft passes through the process chamber and is connected to a corresponding baffle. The driving member is configured to drive the transmission shaft to move, thereby causing the baffle to move. The advantage of this is that the driving member is disposed outside the process chamber to protect it.

[0011] In one possible embodiment, the opening has a first edge and a second edge disposed opposite to each other along the moving direction of the baffle. In the fully exposed state, the baffle does not block the first edge. The outer wall of the process liner is provided with at least one first position detection element corresponding to each first edge. The first position detection element is configured to detect whether the baffle is in the fully exposed state. The first position detection element is communicatively connected to a control system. The control system is configured to: allow the baking process to start when all the first position detection elements detect that the baffle is in the fully exposed state before baking starts; otherwise, prevent baking from starting and trigger an alarm. Its beneficial effect is that it solves the problem that the opening is partially or completely blocked due to the baffle not being fully moved to the fully exposed state, and the heat radiation from the second baking component cannot effectively enter the process chamber, thereby avoiding a decrease in heating efficiency and a prolongation of heating time.

[0012] In one possible embodiment, the opening has a first edge and a second edge disposed opposite to each other along the moving direction of the baffle. In the fully obscured state, the baffle obscures the second edge. The outer wall of the process liner is provided with at least one second position detection element corresponding to each second edge. The second position detection element is configured to detect whether the baffle is in the fully obscured state. The second position detection element is communicatively connected to a control system. The control system is configured to: before process start, allow process flow to start when all second position detection elements detect that the baffle is in the fully obscured state; otherwise, prevent process start and trigger an alarm. Its beneficial effect is that it solves the process risk and the risk of damage to the second baking component caused by the baffle not being fully moved to the fully obscured position.

[0013] In one possible embodiment, the second baking assembly includes a plurality of second baking elements spaced apart circumferentially along the process liner. The advantage of this arrangement is that it creates a uniform heat field circumferentially within the process chamber, avoiding problems such as localized baking or insufficient baking.

[0014] In one possible embodiment, the second baking element extends circumferentially along the process liner in an arc shape. The advantage of this is that the arc-shaped second baking element adapts to the curved surface of the process liner, providing more continuous and uniform circumferential heat radiation.

[0015] In some embodiments, each second baking assembly has 2-4 second baking elements; or, the central angle corresponding to the distance between two adjacent second baking elements in the circumferential direction is 25°-35°. The advantages are: based on the chamber size and temperature control accuracy requirements, the number and spacing of the second baking elements in the circumferential direction can be reasonably set, minimizing the number of second baking elements while ensuring uniform circumferential coverage baking, thereby simplifying the structure, reducing costs, and controlling complexity.

[0016] In some embodiments, the second baking element is positioned between 1 / 3 and 2 / 3 of the height of the process chamber. The advantage of this is that positioning the second baking element within this height range allows heat to be transferred bidirectionally upwards and downwards from the center, ensuring that the upper and middle regions are adequately baked.

[0017] In one possible embodiment, the first baking assembly includes a plurality of first baking elements spaced circumferentially along the process liner; the second baking assembly comprises a plurality of elements spaced axially along the process liner; the process chamber is divided into a plurality of baking zones distributed axially and / or circumferentially, each baking zone being equipped with a temperature sensor to detect the temperature of the corresponding baking zone; the physical vapor deposition chamber further includes a control system communicatively connected to the temperature sensor, the first baking assembly, and the second baking assembly, the control system independently adjusting the output power of the corresponding first baking assembly and / or the second baking assembly based on the baking zone temperatures detected by the plurality of temperature sensors, thereby adjusting the temperature of the corresponding baking zone and achieving temperature distribution regulation of the process chamber. Its beneficial effect is that, through zoned detection and independent control, a closed-loop temperature control system is formed, which can finely compensate for temperature deviations in any area within the process chamber, ensuring that the entire process chamber maintains ideal temperature uniformity during the baking process.

[0018] In one possible embodiment, the opening extends circumferentially along the process liner in an arc shape. The advantage of this is that the arc-shaped opening matches the shape of the arc-shaped second baking element, maximizing the efficiency of heat radiation transmission and reducing energy loss due to obstruction. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the physical vapor deposition chamber of the present invention in the state of full baffle obstruction.

[0020] Figure 2 This is a schematic diagram of the physical vapor deposition chamber of the present invention in the state of full baffle exposure.

[0021] Figure 3 This is a logic block diagram of the physical vapor deposition chamber of the present invention.

[0022] Explanation of reference numerals in the attached drawings: 110, process chamber; 120, process liner; 210, opening; 211, first edge; 212, second edge; 220, first baking assembly; 221, first baking component; 230, second baking assembly; 231, second baking component; 240, baffle; 250, drive mechanism; 251, transmission shaft; 252, drive component; 260, temperature detection component; 271, first position detection component; 272, second position detection component; 280, control system; 290, alarm. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] For information on the problems with existing technologies, please refer to [link / reference]. Figure 1 , Figure 2 as well as Figure 3 Embodiments of the present invention provide a physical vapor deposition chamber, including a process chamber 110, and further comprising: a process kit 120 having at least one opening 210, at least one first baking assembly 220, at least one second baking assembly 230, and at least one baffle 240. The process kit 120 is disposed within the process chamber 110, and the first baking assembly 220 is disposed in the lower region of the process chamber 110, with the height of the first baking assembly 220 lower than the bottom end of the process kit 120. Since the bottom end of the process kit 120 is higher than the first baking assembly 220, the outer wall of the process kit 120 does not obstruct the heat radiation of the first baking assembly 220, and the heat radiation of the first baking assembly 220 can be directly projected into the lower space of the process chamber 110. Specifically, the first baking assembly 220 includes a plurality of first baking elements 221 arranged circumferentially along the process kit 120, and the plurality of first baking elements 221 are evenly distributed in the circumferential direction, for example, two, three, or four first baking elements 221 are evenly arranged in the circumferential direction. Each first baking element 221 is an independently controllable heating unit, and its output power can be adjusted separately. The first baking element 221 can be a baking lamp, an infrared heater, etc.

[0025] Please see Figure 1 , Figure 2 as well as Figure 3The second baking assembly 230 is disposed in the annular cavity between the inner wall of the process chamber 110 and the outer wall of the process liner 120. The second baking assembly 230 is distributed in the middle and / or upper regions of the process chamber 110. An opening 210 is correspondingly disposed to the second baking assembly 230. The height of the opening 210 is located within the height range of the middle and / or upper regions of the process chamber 110. The opening 210 is configured to expose the second baking assembly 230, and the heat radiation of the second baking assembly 230 can enter the interior of the process chamber 110 through the opening 210.

[0026] The first baking assembly 220 and the second baking assembly 230 perform synchronous baking in the lower, middle and / or upper regions of the process chamber 110, respectively. The target material, shielding parts and other components in the upper region can directly receive heat radiation from the second baking assembly 230, which greatly shortens the baking time.

[0027] Please see Figure 1 and Figure 2 The baffle 240 is movably disposed on the outer wall of the process liner 120. Specifically, the baffle 240 slides on the outer wall of the process liner 120. Guide members are respectively provided on both sides of the outer wall of the process liner 120 corresponding to the non-moving direction of the baffle 240. The baffle 240 slides on the guide members to limit the offset of the baffle 240 in the non-moving direction. The guide members can be guide rails, guide grooves, etc. The baffle 240 can move along the circumference or axial direction of the process liner 120. The baffle 240 is disposed in close contact with the outer wall of the process liner 120. The baffle 240 is corrosion resistant; for example, the material of the baffle 240 is set to be the same as the material of the process liner 120. The baffle 240 is configured to switch between a fully shielded state and a fully exposed state.

[0028] Please see Figure 1 During the process, the baffle 240 is in a fully shielded state. At this time, the baffle 240 moves to the position of the opening 210, completely covering and shielding the opening 210, physically isolating the second baking assembly 230 from the process space inside the process chamber 110. Metal particles or etching byproducts generated by sputtering are blocked by the baffle 240 and cannot be deposited on the surface of the second baking assembly 230, thus protecting the second baking assembly 230.

[0029] Please see Figure 2 During the baking process after maintenance, the baffle 240 is switched to a fully exposed state. At this time, the baffle 240 is removed from the opening 210, the opening 210 is fully opened, the second baking assembly 230 is exposed to the opening 210, and its heat radiation enters the process chamber 110 through the opening 210.

[0030] In one embodiment, please refer to Figure 1 , Figure 2 as well as Figure 3The second baking assembly 230 includes a plurality of second baking elements 231 spaced apart circumferentially along the process liner 120. These elements are evenly distributed circumferentially to achieve uniform baking along the process liner 120, resulting in uniform temperature distribution. Each second baking element 231 is an independently controllable heating unit, and its output power can be adjusted separately. The first baking element 221 may be a baking lamp, an infrared heater, etc.

[0031] In the first example, please refer to Figure 1 and Figure 2 The first baking element 221 and / or the second baking element 231 extend circumferentially along the process liner 120 in an arc shape. The arc-shaped baking element has a larger radiation area than the straight baking element. The radius of curvature of the arc-shaped second baking element 231 matches the radius of curvature of the process liner 120, allowing the second baking element 231 to be arranged closer to the outer wall of the process liner 120. The heat radiation emitted by the arc-shaped baking element spreads in a fan shape, achieving the maximum radiation area within the limited annular cavity space, and providing more continuous and uniform circumferential heat radiation.

[0032] In the second example, please refer to Figure 1 and Figure 2 Each second baking assembly 230 has 2-4 second baking elements 231, which can form sufficient heating in the circumference and complement each other's heat radiation coverage area, significantly improving the circumferential temperature uniformity. At the same time, it avoids the problems of structural complexity and limited installation space caused by using too many second baking elements 231.

[0033] In the third example, please refer to Figure 1 and Figure 2 The central angle corresponding to the distance between two adjacent second baking components 231 in the circumferential direction is 25°-35°. If the distance between adjacent second baking components 231 is too large, i.e., the corresponding central angle is too large, a weak area or blind zone of heat radiation coverage will be formed between adjacent second baking components 231, resulting in a lower temperature in that area and incomplete baking. Controlling the central angle within this range ensures that the heat radiation areas of adjacent second baking components 231 have appropriate overlap, making the heat field distribution in the circumferential direction more continuous and effectively eliminating heating blind zones. If the distance between adjacent second baking components 231 is too small, i.e., the corresponding central angle is too small, the heat radiation areas between adjacent second baking components 231 overlap significantly, forming local high temperatures in the overlapping area and wasting energy. This central angle range avoids excessive overlap while ensuring continuous coverage, achieving a better balance between energy utilization efficiency and heating uniformity.

[0034] In the fourth example, please refer to Figure 1 and Figure 2The second baking component 231 is positioned between 1 / 3 and 2 / 3 of the height of the process chamber 110. If the second baking component 231 is positioned too high (e.g., at 4 / 5 of the height of the process chamber 110), its heat radiation will be mainly concentrated in the upper region of the process chamber 110, while the middle region may still be insufficiently heated, and the upper region may be overheated, adversely affecting the target material or magnetron assembly. Conversely, if the position is too low (e.g., below 1 / 5 of the height), the baking range of it overlaps too much with that of the first baking component 220, failing to effectively solve the problem of insufficient baking in the upper region. This height range ensures sufficient heating of the upper and middle regions of the process chamber 110 while avoiding adverse effects on other components.

[0035] Furthermore, please refer to Figure 1 and Figure 2 The opening 210 extends circumferentially along the process liner 120 in an arc shape. The radius of curvature of the arc-shaped opening 210 matches the radius of curvature of the arc-shaped second baking piece 231, so that all or most of the heat radiation emitted by the second baking piece 231 can enter the process chamber 110 through the opening 210, maximizing the heat radiation transmission efficiency and reducing energy loss caused by insufficient size of the opening 210.

[0036] The correspondence between the opening 210 and the second baking component 231 can be flexibly set according to actual needs. In one example, the opening 210 and the second baking component 231 are set in a one-to-one correspondence, such as... Figure 1 and Figure 2 As shown. In another example, each opening 210 corresponds to multiple second baking elements 231, and the multiple second baking elements 231 share one opening 210, which can reduce the number of openings 210.

[0037] The correspondence between the baffle 240 and the second baking component 231 can be flexibly set according to actual needs. In one example, the baffle 240 is set in a one-to-one correspondence with the opening 210, and each opening 210 is covered and exposed by an independent baffle 240, such as... Figure 1 and Figure 2 As shown. In another example, each baffle 240 is provided with multiple openings 210. One baffle 240 can cover or expose multiple openings 210 at the same time, reducing the number of baffles 240 and the number of drive mechanisms 250, and simplifying the structure.

[0038] In one embodiment, please refer to Figure 3The process chamber 110 is divided into multiple baking zones distributed axially and / or circumferentially. Each baking zone is equipped with an independent temperature sensor 260, which can be a thermocouple or an infrared temperature probe, for real-time temperature monitoring of the corresponding baking zone. The physical vapor deposition chamber also includes a control system 280 that is communicatively connected to the temperature sensor 260, the first baking component 220, and the second baking component 230. During the baking process, the control system 280 receives real-time temperature data from each temperature sensor 260 and compares it with a preset target temperature distribution. Based on the comparison result, it independently adjusts the output power of at least one of the first baking component 220 and the second baking component 230 corresponding to each baking zone, thereby adjusting the temperature of the corresponding baking zone and achieving precise control of the overall temperature distribution of the process chamber 110. For example, when the control system 280 detects that the temperature of a certain upper baking zone is too low, it can increase the output power of the second baking component 231 in that baking zone, thereby achieving precise and uniform temperature control of the entire process chamber 110. This closed-loop feedback control method significantly improves the uniformity and efficiency of baking.

[0039] In one embodiment, please refer to Figure 1 , Figure 2 as well as Figure 3 The physical vapor deposition chamber also includes a drive mechanism 250 connected to a baffle 240. The drive mechanism 250 is configured to move the baffle 240 to switch between a fully shielded state and a fully exposed state. Automatic switching of the baffle 240's state is achieved through an automatic drive mechanism. Specifically, the drive mechanism 250 is communicatively connected to a control system 280, which controls the drive mechanism 250 to move the baffle 240.

[0040] In one example, please refer to Figure 1 , Figure 2 as well as Figure 3 The drive mechanism 250 includes a drive member 252 located outside the process chamber 110 and a transmission shaft 251 connected to the drive end of the drive member 252. The transmission shaft 251 passes through the process chamber and is connected to a corresponding baffle 240. The drive member 252 is configured to drive the transmission shaft 251 to move, thereby moving the baffle 240. Specifically, the drive member 252 is a motor. The passage position of the transmission shaft 251 is sealed by a seal.

[0041] It should be noted that the specific structure and arrangement of the drive mechanism 250 are not limited here and can be flexibly configured according to process requirements. For example, the drive mechanism 250 can also be a cylinder, hydraulic cylinder, electric telescopic rod, linear module, etc., and can be directly installed on the outer wall of the process liner 120, or installed outside the process chamber 110 and extended into the process chamber 110 through a transmission component to connect with the corresponding baffle 240. Furthermore, please refer to... Figure 1 , Figure 2 as well as Figure 3 The drive mechanism 250 is set one-to-one with the baffle 240, and the movement adjustment is performed individually for each baffle 240; or, one drive mechanism 250 is set with multiple baffles 240, and one drive mechanism 250 drives multiple baffles 240 at the same time, which simplifies the number of drive mechanisms 250 and reduces the complexity of the structure and the space occupied.

[0042] Considering that in actual working conditions, the stroke control of the drive mechanism 250 may have errors, such as stepper motor step loss, mechanical backlash accumulation after long-term use, or jamming of the baffle 240 due to process deposits, etc., the actual position of the baffle 240 may deviate from the commanded position of the control system 280, thus failing to accurately reach or maintain the preset fully shielded or fully exposed state. To achieve more reliable detection of the position of the baffle 240, this invention incorporates a specific position detection design for the displacement of the baffle 240.

[0043] In one embodiment, please refer to Figure 1 and Figure 2 The opening 210 has a first edge 211 and a second edge 212 disposed opposite to each other along the moving direction of the baffle 240. When the baffle 240 is in a fully exposed state, the baffle 240 does not cover the first edge 211. When the baffle 240 switches from a fully exposed state to a fully covered state, it moves from the first edge 211 to the second edge 212. When the baffle 240 is in a fully covered state, the baffle 240 covers the opening 210 and covers the second edge 212, that is, the baffle 240 and the edge of the opening 210 form an effective overlap. This structure defines two clear physical boundaries, providing a benchmark for setting up highly reliable position detection, and its detection reliability is better than indirect position estimation methods that rely solely on the internal encoder counting or step counting of the drive motor.

[0044] In some embodiments, please refer to Figure 2 and Figure 3The outer wall of the process liner 120 is provided with at least one first position detection element 271 corresponding to each first edge 211. The first position detection element 271 is configured to detect whether the baffle 240 is in a fully exposed state. The first position detection element 271 is communicatively connected to the control system 280. The control system 280 is configured with a first detection control mechanism before baking starts: before baking starts, the detection signals of all first position detection elements 271 are acquired to determine whether all baffles 240 are in a fully exposed state. When all first position detection elements 271 detect that the corresponding baffle 240 is in a fully exposed state, it indicates that all openings 210 have been fully exposed, and the heat radiation of the second baking assembly 230 can enter the process chamber 110 to the fullest extent. At this time, the control system 280 allows the baking process to be started. If at least one baffle 240 is not fully exposed, it indicates that the opening 210 corresponding to that baffle 240 is not fully exposed, and the baffle 240 is blocking the first edge 211. This may be due to reasons such as baffle 240 jamming or a malfunction in the drive mechanism 250, preventing the baffle 240 from being completely removed. In this case, the control system 280 prevents baking from starting and triggers an alarm, reminding the engineer to calibrate or repair it in time. This first detection and control mechanism can effectively prevent heating from starting when the baffle 240 is not completely removed, avoiding problems such as reduced heating efficiency, prolonged baking time, or uneven temperature distribution in the process chamber 110 caused by partial obstruction leading to blocked heat radiation.

[0045] In some embodiments, please refer to Figure 1 and Figure 3The outer wall of the process liner 120 is provided with at least one second position detection element 272 corresponding to each second edge 212. The second position detection element 272 is configured to detect whether the baffle 240 is in a fully blocked state. The second position detection element 272 is communicatively connected to the control system 280. The control system 280 is configured with a second detection control mechanism before process start: acquiring the detection signals of all second position detection elements 272 and determining whether all baffles 240 are in a fully blocked state. When all second position detection elements 272 detect that the corresponding baffle 240 is in a fully blocked state, it indicates that all baffles 240 have completely blocked the corresponding opening 210, and the edges of the baffles 240 block the opening 210 and the second edge 212, forming a seamless and effective overlap. At this time, the second baking assembly 230 and the process processing space inside the process chamber 110 are completely physically isolated, and the control system 280 allows the process flow to start. If at least one baffle 240 is not fully blocked, meaning at least one opening 210 is not completely blocked and the edge of the baffle 240 does not block the second edge 212, the process is prevented from starting and an alarm is triggered. This second detection and control mechanism effectively prevents the deposition process from starting when the baffle 240 is not completely closed, avoiding sputtered metal atoms from depositing onto the surface of the second baking assembly 230 through the gaps in the opening 210, thereby ensuring the heating performance and service life of the second baking assembly 230.

[0046] In another embodiment, please refer to Figure 1 , Figure 2 as well as Figure 3 The control system 280 detects whether the baffle 240 is in a fully exposed or fully obscured state using a first position detection element 271 and a second position detection element 272. The control system 280 is configured with both a first detection control mechanism and a second detection control mechanism. The control system 280 is configured as follows: before baking starts, if all first position detection elements 271 and second position detection elements 272 detect that the baffle 240 is in a fully exposed state, the baking process is allowed to start; otherwise, baking is prevented and an alarm is triggered. Similarly, before the process starts, if all first position detection elements 271 and second position detection elements 272 detect that the baffle 240 is in a fully obscured state, the process is allowed to start; otherwise, the process is prevented and an alarm is triggered. The first position detection elements 271 and second position detection elements 272 together constitute a dual verification mechanism for the position of the baffle 240, independently determining the baking start condition and the process start condition, ensuring that the baffle 240 is in the correct position in any operating mode of the process chamber 110, thereby comprehensively improving the automation level and long-term reliability of the equipment.

[0047] In the first specific example, please refer to Figure 1 and Figure 2The first position detection element 271 and / or the second position detection element 272 are limit switches and have contacts. For example, the baffle 240 has trigger protrusions at opposite ends along its moving direction. The control system 280 is configured such that: before process start, when the trigger protrusions at both ends of all baffles 240 make mechanical contact with the contacts of the corresponding first position detection element 271 and the corresponding second position detection element 272, respectively, the contacts are pressed and a trigger signal is output to the control system 280. The control system 280 determines that all baffles 240 are in a fully blocked state and allows the process to start; otherwise, it prevents the process from starting and triggers an alarm. Before baking starts, when the trigger protrusions at both ends of all baffles 240 do not make mechanical contact with the contacts of the corresponding first position detection element 271 and the corresponding second position detection element 272, the control system 280 determines that no trigger signal has been received, determines that all baffles 240 are in a fully exposed state, and allows the baking process to start; otherwise, it prevents the baking process from starting and triggers an alarm.

[0048] In the second specific example, please refer to Figure 1 and Figure 2 The first position detection element 271 and / or the second position detection element 272 are photoelectric sensors and have a transmitting end for emitting a light beam and a receiving end for receiving a light beam. The control system 280 is configured as follows: Before baking starts, if all baffles 240 are not blocking the corresponding light beam and all receiving ends receive the light beam, the control system 280 determines that all optical paths are connected and all baffles 240 are in a fully exposed state, allowing the baking process to start; otherwise, it prevents the baking process from starting and triggers an alarm. Before the process starts, if all baffles 240 block the light beams of the corresponding first position detection element 271 and second position detection element 272 and all receiving ends do not receive the light beam, the control system 280 determines that all optical paths are disconnected and all baffles 240 are in a fully blocked state, allowing the process to start; otherwise, it prevents the process from starting and triggers an alarm.

[0049] Specifically, please refer to Figure 3 The physical vapor deposition chamber also includes an alarm 290 connected to the control system 280 and used to issue alarm signals.

[0050] The technical effects of the physical vapor deposition chamber of the present invention will be explained in detail below.

[0051] 1. The first baking component 220 bakes the lower area of ​​the process chamber 110, and the second baking component 230 bakes the middle and / or upper areas of the process chamber 110, realizing synchronous baking in different areas. This effectively solves the bottleneck problem of insufficient temperature in the upper part of the high aspect ratio process chamber 110, and can significantly shorten the baking time and improve equipment utilization.

[0052] 2. By setting a movable baffle 240, it is switched to a fully exposed state during baking, allowing the heat radiation of the second baking component 230 to enter the process chamber 110 through the opening 210; during the process, it is switched to a fully shielded state, completely isolating the second baking component 230 from the process environment, preventing contaminants from depositing on its surface, and extending the service life of the second baking component 230.

[0053] 3. By dividing the process chamber 110 into multiple baking zones and independently setting temperature detection elements 260, the control system 280 independently adjusts the output power of the corresponding first baking element 221 and / or second baking element 231 according to the real-time temperature of each baking zone, so as to achieve precise control of the temperature distribution of the process chamber 110 and ensure uniform temperature distribution.

[0054] 4. By setting the first position detection element 271 and the second position detection element 272, the position of the baffle 240 is directly detected and interlocked before baking starts and before the process starts, respectively, to prevent the baking efficiency from decreasing or the second baking component 230 from being contaminated due to the baffle 240 not being in place.

[0055] 5. The second baking assembly 230 is located outside the process reaction space and does not occupy any process reaction space. It does not occupy any assembly, movement, or disassembly margin for core process components such as the target material, shielding components, and wafer carrier. The second baking assembly 230 is fixedly installed, and its position does not shift with the change of operating conditions. It does not require support from rotating, lifting, or folding mechanisms. The design concept of this invention is to achieve heat radiation on / off control by opening corresponding openings 210 on the process liner 120 and cooperating with the movement of the baffle 240. It does not occupy the process reaction space at all and does not have the problem of metal robotic arms blocking or diverting process gases.

[0056] 6. The second baking assembly 230 is completely separated from the internal process components by the process liner 120, without occupying the core process space of the wafer sputtering process, and there are no issues of metal robotic arms blocking or diverting process gases. The process liner 120 isolates the second baking assembly 230, preventing distortion of the plasma electric field and magnetic field within the cavity, ensuring uniform film thickness and stable deposition rate. Simultaneously, there is no mechanical scraping or collision interference between the second baking assembly 230 and the heater, shielding ring, or target material. The opening 210 is not an optional additional design, but a core essential feature supporting the baking function of the second baking assembly 230. The baffle 240 is responsible for closing the opening 210 in process mode. The two work together to achieve dynamic switching between baking conduction and process isolation modes, resolving the conflicting needs of improving heating effect and avoiding contamination of the baked parts.

[0057] 7. In this invention, the process liner 120 itself constitutes the first static barrier, confining most sputtered particles within the internal process area. During process mode, the baffle slides to a fully shielded state, completely closing the liner opening and forming the second dynamic barrier. The process liner 120 and the baffle 240 together form a continuous, gapless shield, preventing sputtered particles from penetrating to the annular cavity side. This has the following technical effects: A. No metal deposition on the surface of the second baking component 230, which does not affect the thermal radiation efficiency output and maintains a stable baking time, thus ensuring equipment capacity; B. The second baking component 230 is not subject to sputtering, eliminating wafer particle defects caused by deposit shedding; C. The second baking component 230 is free from metal deposition corrosion, significantly extending its service life, eliminating the need for frequent disassembly and replacement, and reducing maintenance costs. This invention completely blocks sputtered particles spatially through the absolute isolation of the process liner 120 and the baffle 240.

[0058] 8. This invention eliminates the need for multi-stage lifting, rotating, and folding motion mechanisms, significantly reducing potential failure points and resulting in high equipment reliability and low maintenance costs. Even in extreme cases where the baffle 240 becomes stuck or incompletely sealed, the worst-case scenario is that only a small number of sputtered particles deposit through the gaps onto the surface of the second baking component 230 within the annular cavity, causing a decrease in the radiation efficiency and a shortened lifespan of the second baking component 230. The second baking component 230 is a low-cost spare part and does not affect the internal process at all; the wafer film quality and core process components remain undamaged, eliminating the risk of batch scrapping.

[0059] 9. The process liner is one of the core components of the physical vapor deposition chamber. Its core functions include: physically shielding sputtered particles, protecting the inner wall of the chamber from metal deposition contamination, constraining the plasma distribution boundary, and maintaining the uniformity of the electric and magnetic fields within the chamber. Based on these functions, there has long been a clear technical bias in the field: the process liner should maintain a continuous, closed, and complete structure, and should not have unnecessary openings. Precisely based on this common understanding, existing process liners are conventionally designed with closed structures, and rarely have actively created functional openings. This invention achieves a fixed external baking solution through the matching design of opening 210 and baffle 240, which is not something that can be achieved simply by choosing between "fixed or movable". Furthermore, the annular cavity between the process chamber 110 and the process liner 120 is traditionally used only as a structural gap and wiring space in the field, and has never been used as a functional area for arranging baking components, which is a generally neglected idle space in the industry. Moving the second baking component 230 entirely to the annular cavity interlayer is a redefinition and creative utilization of the cavity space function, and is not a conventional design choice in the field.

[0060] In the description of this invention, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0061] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0062] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0063] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the present invention. Furthermore, the present invention described herein may have other embodiments and can be implemented or carried out in various ways. Unless otherwise defined, the technical or scientific terms used herein should be understood in their ordinary sense by one of ordinary skill in the art to which this invention pertains.

Claims

1. A physical vapor deposition chamber, comprising a process chamber, characterized in that, Also includes: A process liner with at least one opening is disposed within the process chamber; At least one first baking component is disposed in the lower region of the process chamber, located below the process liner; At least one second baking component is disposed between the process chamber and the process liner, and is distributed in the middle region and / or upper region of the process chamber, and the opening is provided corresponding to the second baking component; At least one baffle is movably disposed on the outer wall of the process liner and configured to switch between a fully shielded state and a fully exposed state; In the fully shielded state, the baffle blocks the opening to isolate the second baking assembly; in the fully exposed state, the baffle moves away to expose the second baking assembly through the opening, allowing the heat radiation from the second baking assembly to enter the process chamber through the opening.

2. The physical vapor deposition chamber according to claim 1, characterized in that, It also includes a drive mechanism connected to the baffle, the drive mechanism being configured to drive the baffle to move so that the baffle switches between the fully blocked state and the fully exposed state.

3. The physical vapor deposition chamber according to claim 2, characterized in that, The driving mechanism includes a driving component located outside the process chamber and a transmission shaft connected to the driving component. The transmission shaft passes through the process chamber and is connected to the corresponding baffle. The driving component is configured to drive the transmission shaft to move, thereby causing the baffle to move.

4. The physical vapor deposition chamber according to claim 1, characterized in that, The opening has a first edge and a second edge that are disposed opposite to each other along the moving direction of the baffle, and in the fully exposed state, the baffle does not cover the first edge; The outer wall of the process liner is provided with at least one first position detection element for each of the first edges. The first position detection element is configured to detect whether the baffle is in the fully exposed state. The first position detection element is communicatively connected to a control system. The control system is configured to: allow the baking process to start when all the first position detection elements detect that the baffle is in the fully exposed state before baking starts; otherwise, prevent baking from starting and trigger an alarm.

5. The physical vapor deposition chamber according to claim 1, characterized in that, The opening has a first edge and a second edge that are disposed opposite to each other along the moving direction of the baffle, and in the fully blocked state, the baffle blocks the second edge; The outer wall of the process liner is provided with at least one second position detection element for each second edge. The second position detection element is configured to detect whether the baffle is in the fully blocked state. The second position detection element is communicatively connected to a control system. The control system is configured to allow the process to start before the process starts when all the second position detection elements detect that the baffle is in the fully blocked state. Otherwise, prevent the process from starting and trigger an alarm.

6. The physical vapor deposition chamber according to claim 1, characterized in that, The second baking assembly includes a plurality of second baking elements spaced circumferentially along the process liner.

7. The physical vapor deposition chamber according to claim 6, characterized in that, The second baking component extends circumferentially along the process liner in an arc shape; or, Each of the second baking components has 2-4 second baking pieces; or... The central angle corresponding to the distance between two adjacent second baking parts in the circumferential direction is 25°-35°; or, The second baking component is positioned between 1 / 3 and 2 / 3 of the height of the process chamber.

8. The physical vapor deposition chamber according to claim 6, characterized in that, The first baking assembly includes a plurality of first baking elements spaced apart circumferentially along the process liner; the second baking assembly comprises a plurality of elements spaced apart axially along the process liner. The process chamber is divided into multiple baking zones distributed along the axial and / or circumferential directions. Each baking zone is equipped with a temperature detection element to detect the temperature of the corresponding baking zone. The physical vapor deposition chamber also includes a control system that is communicatively connected to the temperature detection element, the first baking element, and the second baking element. The control system independently adjusts the output power of the corresponding first baking element and / or the second baking element based on the baking zone temperatures detected by the multiple temperature detection elements, thereby adjusting the temperature of the corresponding baking zone and realizing the temperature distribution regulation of the process chamber.

9. The physical vapor deposition chamber according to any one of claims 1-8, characterized in that, The opening extends circumferentially along the process lining in an arc shape.