Heat dissipation system and electronic device

Abstract

The application discloses a heat dissipation system and electronic equipment, and relates to the technical field of heat dissipation. The heat dissipation system comprises a first support crossbeam, a second support crossbeam, a plurality of first chip heat exchange structures and a plurality of memory heat exchange assemblies. A liquid inlet flow channel is formed in the first support crossbeam, and a plurality of independent liquid outlet flow channels are formed in the second support crossbeam. A heat exchange chamber is formed in each first chip heat exchange structure. The plurality of liquid outlet flow channels are in one-to-one correspondence with the heat exchange chambers of the plurality of first chip heat exchange structures. Each memory heat exchange assembly comprises a heat dissipation clamp. The heat dissipation clamp is connected with the liquid inlet flow channel and the corresponding liquid outlet flow channel. According to the heat dissipation system, the heat dissipation system can synchronously dissipate heat for a plurality of memory bars, the heat dissipation medium is distributed to the plurality of first chip heat exchange structures, the plurality of first chips can be synchronously and uniformly dissipated, the heat dissipation effect of the heat dissipation system can be improved, the heat dissipation effect of the electronic equipment can be improved, and the stability of the electronic equipment can be improved.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a heat dissipation system and an electronic device having the heat dissipation system. Background Technology

[0002] In related technologies, as users' demands for the computing power of electronic devices such as servers continue to increase, the heat generated by the chips in these devices during operation is also increasing, requiring more efficient heat dissipation methods. The current fan-based cooling system for servers is no longer sufficient to meet their cooling needs, and existing air-cooled servers suffer from low cooling efficiency and poor heat dissipation performance. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one objective of this invention is to provide a heat dissipation system that simultaneously cools multiple memory modules within an electronic device. The heat dissipation medium is distributed to multiple first-chip heat exchange structures, achieving synchronous and uniform heat dissipation for the multiple first chips. This improves the heat dissipation effect of the heat dissipation system, enhances the heat dissipation performance of the electronic device, and improves the stability of the electronic device.

[0004] The present invention also proposes an electronic device using the above-described heat dissipation system.

[0005] According to a first aspect of the present invention, a heat dissipation system includes: a first support beam, a second support beam, a plurality of first chip heat exchange structures, and a plurality of memory heat exchange components. Both the first and second support beams extend along a first direction and are arranged opposite to each other and spaced apart along a second direction. An inlet channel is formed within the first support beam, and a plurality of independent outlet channels are formed within the second support beam. The first and second directions are perpendicular. A heat exchange chamber is formed within each of the first chip heat exchange structures, and the heat exchange chamber communicates with the outlet of the heat dissipation system. The plurality of outlet channels are respectively connected to the heat exchange chambers of the plurality of first chip heat exchange structures in a one-to-one correspondence. Each memory heat exchange component includes a heat dissipation clip, which communicates with the inlet channel and the corresponding outlet channel.

[0006] According to the heat dissipation system of this application embodiment, by setting multiple memory heat exchange components and multiple liquid outlet channels corresponding one-to-one, and the multiple liquid outlet channels respectively corresponding to the heat exchange chambers of multiple first chip heat exchange structures, the heat dissipation system can dissipate heat and cool down both the memory modules and the first chips in the electronic device. The heat dissipation system can simultaneously dissipate heat and cool down multiple memory modules in the electronic device. The heat exchange medium flows through the heat dissipation fins and then flows to the corresponding first chip heat exchange structure, realizing the cascade utilization of the cooling capacity of the heat exchange medium. The heat dissipation medium is diverted to multiple first chip heat exchange structures to achieve synchronous and uniform heat dissipation for multiple first chips. This is beneficial to make the operating temperature of multiple first chips close, which is beneficial to improving the heat dissipation effect of the heat dissipation system, improving the heat dissipation effect of the electronic device, and improving the stability of the electronic device.

[0007] According to some embodiments of the present invention, a plurality of first chip heat exchange structures are arranged along the first direction, a plurality of liquid outlet channels are arranged along the first direction, and a plurality of first chip heat exchange structures and a plurality of liquid outlet channels are arranged in a one-to-one correspondence along the second direction.

[0008] According to some embodiments of the present invention, along the second direction, the first support beam and the second support beam are respectively located on opposite sides of the first chip heat exchange structure.

[0009] According to some embodiments of the present invention, a plurality of memory heat exchange components are arranged along the first direction, and the heat dissipation fins of each memory heat exchange component are connected between the first support beam and the second support beam. The end of the heat dissipation fin facing away from the second support beam is connected to the liquid inlet channel, and the end of the heat dissipation fin close to the second support beam is corresponding to and connected to the corresponding liquid outlet channel along the second direction.

[0010] According to some embodiments of the present invention, each of the memory heat exchange components includes a plurality of heat dissipation clips, and along the first direction, the plurality of heat dissipation clips of each memory heat exchange component are respectively located on both sides of the corresponding first chip heat exchange structure.

[0011] According to some embodiments of the present invention, the second support beam includes: a first beam and a second beam, the first beam and the second beam being arranged along the first direction and spaced apart to form a clearance space for clearance components between the first beam and the second beam, and the liquid outlet channel being formed in both the first beam and the second beam.

[0012] According to some embodiments of the present invention, the heat dissipation system further includes: a connecting member, one of the plurality of liquid outlet channels including a first channel and a second channel, the first channel being formed in the first beam, the second channel being formed in the second beam, the clearance space being located between the first channel and the second channel, and the connecting member connecting the first channel and the second channel.

[0013] According to some embodiments of the present invention, the connecting member is located between the first support beam and the second support beam. The connecting member is an arc-shaped connecting pipe. Along the second direction, the connecting member is opposite to the clearance space and protrudes toward the first support beam. The two ends of the connecting pipe are respectively connected to the first beam and the second beam.

[0014] According to some embodiments of the present invention, there are multiple liquid inlet channels, each extending along the first direction, and each liquid inlet channel is respectively connected to a plurality of memory heat exchange components. The first support beam has a liquid inlet, and the multiple liquid inlet channels are connected to the liquid inlet. And / or the heat dissipation system further includes a heat sink, which is used to cooperate with the second chip of the electronic device for heat exchange. At least one of the first support beam and the second support beam is fixedly provided with the heat sink.

[0015] An electronic device according to a second aspect of the present invention includes the heat dissipation system described in the above embodiments.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of a heat dissipation system according to an embodiment of this application from one angle; Figure 2 This is a schematic diagram of the heat dissipation system according to an embodiment of this application from another angle; Figure 3 This is a top view of a heat dissipation system according to an embodiment of this application; Figure 4 This is a partial cross-sectional view of a heat dissipation system according to an embodiment of this application; Figure 5 This is a side view of a heat dissipation system according to an embodiment of this application; Figure 6 yes Figure 5 Schematic diagram of the cross section at point AA; Figure 7 This is a schematic diagram of the first support beam according to an embodiment of this application; Figure 8 This is a schematic diagram of a first heat sink according to an embodiment of this application; Figure 9 This is a schematic diagram of a second heat sink according to an embodiment of this application.

[0018] Figure label: Cooling system 1, First support beam 10, liquid inlet channel 11, first liquid inlet channel 111, first sub-channel 1111, second sub-channel 1112, second liquid inlet channel 112, liquid inlet 12. Second support beam 20, liquid outlet channel 21, first channel 211, second channel 212, first beam 22, second beam 23, clearance space 24, connecting member 25. First chip heat exchange structure 30. Heat sink 40, Heat sink bracket 50, heat dissipation gap 51, clearance structure 52, positioning post 53, mounting part 54, mounting space 541, first heat sink bracket 55, second heat sink bracket 56. Liquid outlet 61, liquid outlet pipe 62, liquid inlet pipe 63, Connector 71, thermal pad 72, protective structure 73, moving handle 74. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] The following is for reference. Figures 1-9 A heat dissipation system 1 according to an embodiment of the present invention is described. The heat dissipation system 1 is applied in an electronic device.

[0021] According to the first aspect of the present invention, the heat dissipation system 1, such as Figures 1-9As shown, the heat dissipation system 1 may include: a first support beam 10, a second support beam 20, multiple first chip heat exchange structures 30, and multiple memory heat exchange components. The first support beam 10 and the second support beam 20 both extend along a first direction, and the first support beam 10 and the second support beam 20 are arranged opposite each other and at intervals along a second direction. An inlet channel 11 is formed in the first support beam 10, and multiple independent outlet channels 21 are formed in the second support beam 20. The first direction and the second direction are perpendicular. A heat exchange chamber is formed in the first chip heat exchange structure 30, and the heat exchange chamber is connected to the outlet 61 of the heat dissipation system 1. The multiple outlet channels 21 are respectively connected to the heat exchange chambers of the multiple first chip heat exchange structures 30 one by one. Each memory heat exchange component includes a heat dissipation clip 40. The multiple memory heat exchange components and the multiple outlet channels 21 are connected one by one. The heat dissipation clip 40 connects the inlet channel 11 and the corresponding outlet channel 21.

[0022] It should be noted that as users' demands for the computing power of servers and other electronic devices continue to increase, the chips in these devices generate more and more heat during operation, requiring more efficient heat dissipation methods. The current fan-based cooling system for servers is no longer sufficient to meet these cooling needs; existing air-cooled servers have low cooling efficiency and poor heat dissipation performance.

[0023] Based on this, this application proposes a heat dissipation system 1, in which the first support beam 10 and the second support beam 20 can both extend along a first direction, and the first support beam 10 and the second support beam 20 are arranged in parallel. When the heat dissipation system 1 is as follows... Figure 1 When setting the direction, the first direction is Figure 1 The X-direction. The first support beam 10 and the second support beam 20 are arranged opposite to each other and spaced apart along the second direction, when the heat dissipation system 1 is as follows. Figure 1 When setting the direction, the second direction is Figure 1 The first and second directions are perpendicular to each other. A liquid inlet channel 11 is formed within the first support beam 10, extending along the first direction, through which the heat exchange medium in the heat dissipation system 1 flows into the heat dissipation system 1. Multiple independent liquid outlet channels 21 are formed within the second support beam 20, each extending along the first direction and not interconnected. The liquid inlet channel 11 can communicate with all multiple liquid outlet channels 21, allowing the heat exchange medium within the liquid inlet channel 11 to flow into the multiple liquid outlet channels 21.

[0024] The first chip heat exchange structure 30 has a heat exchange chamber within it, and a heat exchange medium can flow within the chamber. The first chip heat exchange structure 30 can be used to heat exchange with a first chip in an electronic device. The first chip can be a processor within the electronic device, such as a CPU or GPU. The first chip heat exchange structure 30 can contact the corresponding first chip for heat exchange. The low-temperature heat exchange medium in the heat exchange chamber can absorb the heat generated by the first chip during operation, lowering the temperature of the first chip and thus achieving a cooling effect. The heat exchange chamber can be connected to the outlet 61 of the heat dissipation system 1. That is, the heat exchange medium, after heat exchange, can flow out of the heat dissipation system 1 through the outlet 61, achieving a continuous flow of the heat exchange medium into and out of the heat dissipation system 1, thus enabling the heat dissipation system 1 used in electronic devices to continuously cool the first chip. As an example, the outlet 61 can be connected to an outlet pipe 62. The heat exchange medium, after heat exchange, flows into the outlet pipe 62 through the outlet 61 and then out of the heat dissipation system 1.

[0025] Multiple liquid outlet channels 21 can be connected one-to-one with the heat exchange chambers of multiple first chip heat exchange structures 30. Each liquid outlet channel 21 has a corresponding heat exchange chamber of the first chip heat exchange structure 30. The heat exchange medium in each liquid outlet channel 21 can flow into the corresponding heat exchange chamber, thereby achieving the effect that the heat exchange medium flows evenly in each heat exchange chamber. The electronic device can be equipped with multiple first chips. The heat exchange medium can be diverted to multiple liquid outlet channels 21. The multiple liquid outlet channels 21 can be connected one-to-one with the heat exchange chambers of multiple first chip heat exchange structures 30. The heat exchange medium can flow into the heat exchange chambers of multiple first chip heat exchange structures 30 through the multiple liquid outlet channels 21. The multiple heat exchange chambers can be connected to the liquid outlet 61 of the heat dissipation system 1. The multiple heat exchange chambers are connected in parallel, thereby achieving the effect that the heat exchange medium flows through multiple heat exchange chambers and exchanges heat with multiple first chips. By setting multiple liquid outlet channels 21 to be connected one-to-one with the heat exchange chambers of multiple first chip heat exchange structures 30, the effect of multiple first chip heat exchange structures 30 simultaneously exchanging heat with multiple first chips can be achieved. This is beneficial for achieving the effect of synchronous cooling of multiple first cells in electronic devices, the effect of uniform cooling of multiple first chips, the effect of improving the cooling efficiency of the first chips, and the effect of improving the heat dissipation of electronic devices.

[0026] The heat dissipation system 1 may further include multiple memory heat exchange components, each including a heat dissipation fin 40. Each memory heat exchange component may include one or more heat dissipation fins 40. The heat dissipation fins 40 connect the inlet channel 11 and the corresponding outlet channel 21, meaning that the heat exchange medium in the inlet channel 11 can flow into the outlet channel 21 through the heat dissipation fins 40. Multiple memory heat exchange components are connected in parallel between the inlet channel 11 and the corresponding outlet channel 21, with the heat exchange medium flowing through the heat dissipation fins 40. The heat dissipation fins 40 can be used to cooperate with the memory modules of electronic devices for heat exchange, with each heat dissipation fin 40 contacting and exchanging heat with the corresponding memory module. The low-temperature heat exchange medium within the heat dissipation fins 40 can absorb the heat generated by the memory module during operation, reducing the memory module temperature and thus achieving the effect of cooling the memory module. Multiple memory heat exchange components can be connected one-to-one with multiple liquid outlet channels 21. Each memory heat exchange component has a corresponding liquid outlet channel 21. The heat exchange medium in the heat dissipation fins 40 of each memory heat exchange component can flow into the corresponding liquid outlet channel 21. The heat exchange medium can further flow into the corresponding heat exchange chamber through the corresponding liquid outlet channel 21, thereby realizing the effect of the heat exchange medium after heat exchange with the memory module continuing to be used for heat exchange with the first chip, and realizing the cascade utilization of the cooling capacity of the heat exchange medium.

[0027] Multiple memory heat exchange components can each have a corresponding liquid outlet channel 21. The multiple liquid outlet channels 21 correspond one-to-one with the multiple first chip heat exchange structures 30. There can be at least one heat dissipation fin 40 in each memory heat exchange component, and the number of heat dissipation fins 40 in each memory heat exchange component can be the same, so that the flow rate of heat exchange medium flowing into the multiple heat exchange chambers is equal. This is beneficial to make the heat dissipation effect of the heat dissipation system 1 on the multiple first chips the same, and make the working temperature of the multiple first chips closer, which is beneficial to further improve the uniformity of cooling the multiple first chips.

[0028] It should be noted that the heat generated by the memory module is lower than that of the first chip. The heat exchange medium first flows through the heat sink 40 and exchanges heat with the memory module, then flows into the outlet channel 21 and into the heat exchange structure 30 of the first chip, where it finally cools the first chip. This series circuit design allows the same heat exchange medium to exchange heat with both the memory module and the first chip, achieving tiered utilization of the cooling capacity of the heat exchange medium and facilitating the full utilization of its cooling capacity.

[0029] In this embodiment, by setting multiple memory heat exchange components corresponding one-to-one with multiple liquid outlet channels 21, and the multiple liquid outlet channels 21 respectively corresponding to the heat exchange chambers of multiple first chip heat exchange structures 30, the heat dissipation system 1 can dissipate heat and cool down both the memory modules and the first chips in the electronic device. The heat dissipation system 1 can simultaneously dissipate heat and cool down multiple memory modules in the electronic device. The heat exchange medium flows through the heat dissipation fins 40 and then flows to the corresponding first chip heat exchange structure 30, realizing the cascade utilization of the cooling capacity of the heat exchange medium. The heat dissipation medium is diverted to multiple first chip heat exchange structures 30, realizing synchronous and uniform heat dissipation of multiple first chips. This is beneficial to make the operating temperature of multiple first chips close, which is beneficial to improve the heat dissipation effect of the heat dissipation system 1, which is beneficial to improve the heat dissipation effect of the electronic device, and which is beneficial to improve the stability of the electronic device.

[0030] As an example, a connector 71 connects the first support beam 10 and the second support beam 20. The connector 71 extends along a second direction, and its two ends along the second direction can be fixedly connected to the first support beam 10 and the second support beam 20 respectively. The connector 71 can be fixedly supported between the first support beam 10 and the second support beam 20, which is beneficial for achieving the connection effect between the first support beam 10 and the second support beam 20. The first support beam 10 and the second support beam 20 can be constructed as an integral structure, which is beneficial for improving the overall integrity of the heat dissipation system 1. There can be multiple connectors 71, which can be arranged opposite to each other and spaced apart along the first direction, which is beneficial for improving the connection strength between the first support beam 10 and the second support beam 20.

[0031] As an example, each heat sink 40 has a connecting channel, which can connect the liquid inlet channel 11 and the corresponding liquid outlet channel 21, thereby further realizing the effect of each heat sink 40 connecting the liquid inlet channel 11 and the corresponding liquid outlet channel 21.

[0032] As an example, each heat sink 40 can have a memory module on each side along the first direction. Each heat sink 40 can simultaneously contact and exchange heat with the two memory modules located on its sides, which helps to improve the structural compactness of multiple heat sinks 40 and multiple memory modules, and helps to improve the working efficiency of cooling multiple memory modules.

[0033] As an example, each heat sink 40 has a thermal pad 72 on both sides of its surface along the first direction. The thermal pad 72 can be an elastic pad with thermal conductivity. The two sides of the thermal pad 72 along the second direction can respectively contact the corresponding heat sink 40 and the corresponding memory module. The thermal pad 72 can fill the gap between the corresponding heat sink 40 and the corresponding memory module, thereby reducing the air between them. The thermal pad 72 can also conduct heat between the corresponding heat sink 40 and the corresponding memory module, which helps improve the heat exchange efficiency between them. Simultaneously, the thermal pad 72 also acts as insulation and buffer, providing some protection during memory module installation and removal, reducing the probability of memory module damage and the risk of short circuits.

[0034] As an example, each first chip heat exchange structure 30 can be provided with a three-way interconnection structure, which connects the corresponding liquid outlet channel 21, the corresponding heat exchange chamber and the liquid outlet 61. The liquid outlet 61 can be arranged in one of the multiple first chip heat exchange structures 30, thereby achieving the effect of converging the high-temperature heat exchange medium in multiple heat exchange chambers and flowing out of the heat dissipation system 1.

[0035] In some embodiments of the present invention, such as Figure 5 and Figure 6 As shown, multiple first chip heat exchange structures 30 are arranged along the first direction, multiple liquid outlet channels 21 are arranged along the first direction, and multiple first chip heat exchange structures 30 and multiple liquid outlet channels 21 are arranged in a one-to-one correspondence along the second direction.

[0036] Multiple first chip heat exchange structures 30 can be arranged along a first direction, and multiple liquid outlet channels 21 can extend along the first direction, and the multiple liquid outlet channels 21 can be arranged along the first direction and spaced apart. The multiple first chip heat exchange structures 30 and multiple liquid outlet channels 21 can be arranged one-to-one along a second direction, and each first chip heat exchange structure 30 can be arranged in relation to a corresponding liquid outlet channel 21 along the second direction. This can shorten the distance between the first chip heat exchange structure 30 and the corresponding liquid outlet channel 21, reduce the flow path length of the heat exchange medium from the liquid outlet channel 21 to the heat exchange chamber of the corresponding first chip heat exchange structure 30, improve the working efficiency of the heat exchange medium flowing into the heat exchange chamber of the first chip heat exchange structure 30, and further improve the heat dissipation efficiency of the heat dissipation system 1 when used to cool down the first chip. Furthermore, the arrangement of multiple first chip heat exchange structures 30 and multiple liquid outlet channels 21 in a one-to-one correspondence along the second direction can make the heat dissipation system 1 neat and orderly, which helps to reduce the probability of the internal structure of the heat dissipation system 1 being messy due to the intersecting, bending or excessive length of the connecting pipes between the first chip heat exchange structures 30 and the corresponding liquid outlet channels 21.

[0037] In some embodiments of the present invention, such as Figures 1-4 As shown, along the second direction, the first support beam 10 and the second support beam 20 are located on opposite sides of the first chip heat exchange structure 30, respectively.

[0038] The first support beam 10 has a liquid inlet channel 11, and the second support beam has a liquid outlet channel 21. Heat dissipation fins 40 connect the liquid inlet channel 11 and the corresponding liquid outlet channel 21. Multiple heat exchange components are included, meaning multiple heat dissipation fins 40 are provided between the first support beam 10 and the second support beam 20, further spacing the first support beam 10 and the second support beam 20 along a second direction. The heat exchange medium in the liquid outlet channel 21 flows into the heat exchange chamber of the first chip heat exchange structure 30. Along the second direction, the first support beam 10 and the second support beam 20 are located on opposite sides of the first chip heat exchange structure 30, which helps to fully utilize the space between the first support beam 10 and the second support beam 20, improves the overall structural compactness of the first support beam 10, the second support beam 20, and the first chip heat exchange structure 30, and enhances the utilization rate of the internal space of the electronic device.

[0039] In some embodiments of the present invention, such as Figure 4 and Figure 6 As shown, multiple memory heat exchange components are arranged along the first direction. The heat dissipation fins 40 of each memory heat exchange component are connected between the first support beam 10 and the second support beam 20. The end of the heat dissipation fin 40 away from the second support beam 20 is connected to the liquid inlet channel 11. The end of the heat dissipation fin 40 near the second support beam 20 is corresponding to and connected to the corresponding liquid outlet channel 21 along the second direction.

[0040] Multiple memory heat exchange components are arranged along a first direction. The heat dissipation fins 40 of each component are connected between the first support beam 10 and the second support beam 20. Each heat dissipation fin 40 connects the first support beam 10 and the second support beam 20, facilitating the integration of the first and second support beams into a single structure and improving the overall integrity of the heat dissipation system 1. Multiple memory heat exchange components are arranged, meaning multiple heat dissipation fins 40 are provided between the first and second support beams 10 and 20. These multiple heat dissipation fins 40 are connected in parallel between the inlet channel 11 and the corresponding outlet channel 21. The multiple heat dissipation fins 40 have identical structures, enabling automatic and uniform distribution of the heat exchange medium among them. This allows each heat dissipation fin 40 to receive an equal or similar flow rate of heat exchange medium without relying on additional flow control valves or complex active control logic.

[0041] The end of the heat dissipation fin 40 away from the second support beam 20 is connected to the liquid inlet channel 11. The heat exchange medium in the liquid inlet channel 11 can flow into the corresponding heat dissipation fin 40 through the end of the heat dissipation fin 40 away from the second support beam 20. The end of the heat dissipation fin 40 near the second support beam 20 is connected to the corresponding liquid outlet channel 21 along the second direction. The heat exchange medium in the heat dissipation fin 40 can flow into the corresponding liquid outlet channel 21 through the end of the heat dissipation fin 40 near the second support beam 20. This is conducive to further realizing the effect of connecting each heat dissipation fin 40 to the liquid inlet channel 11 and the corresponding liquid outlet channel 21. Since each heat sink 40 is independently connected in parallel between the liquid inlet channel 11 and the corresponding liquid outlet channel 21, the heat exchange medium in the liquid inlet channel 11 can flow into each heat sink 40 synchronously. Under the same operating conditions, multiple heat sinks 40 have the same cooling effect on the corresponding memory modules, thereby reducing the probability that the poor cooling effect of a certain memory module will cause uneven cooling of multiple memory modules by the heat dissipation system 1, which is beneficial to improving the heat dissipation uniformity of the heat dissipation system 1.

[0042] The inlet channel 11 and the corresponding outlet channel 21 are directly connected to both ends of the heat sink 40. No additional intermediate transition pipes are needed between each heat sink 40 and its corresponding inlet channel 11 and outlet channel 21. After the cooling medium flows out of the inlet channel 11, it directly enters the heat sink 40 to absorb heat with the shortest distance and is immediately discharged into the outlet channel 21. This helps to reduce the arrangement of pipes in the heat dissipation system 1, further improves the utilization rate of the internal space of electronic equipment, and can also significantly shorten the flow path of the heat exchange medium. This helps to improve the efficiency of the heat exchange medium flowing from the inlet channel 11 to the heat sink 40 and from the corresponding heat sink 40 to the corresponding outlet channel 21, and helps to improve the heat dissipation efficiency of the memory module.

[0043] In some embodiments of the present invention, each memory heat exchange component includes a plurality of heat dissipation clips 40, and along the first direction, the plurality of heat dissipation clips 40 of each memory heat exchange component are respectively located on both sides of the corresponding first chip heat exchange structure 30.

[0044] Each memory heat exchange component includes multiple heat dissipation fins 40, which are arranged opposite each other and spaced apart along a first direction. Each heat dissipation fin 40 extends along a second direction, and the multiple heat dissipation fins 40 of each memory heat exchange component are connected in parallel between the liquid inlet channel 11 and the corresponding liquid outlet channel 21. Along the first direction, the multiple heat dissipation fins 40 of each memory heat exchange component are respectively located on both sides of the corresponding first chip heat exchange structure 30. That is, one side of each first chip heat exchange structure 30 along the first direction may be provided with a portion of the heat dissipation fins 40 within the corresponding memory heat exchange component, and the other side of each first chip heat exchange structure 30 along the first direction may be provided with another portion of the heat dissipation fins 40 within the corresponding memory heat exchange component. By setting multiple heat dissipation fins 40 of each memory heat exchange component to be located on both sides of the corresponding first chip heat exchange structure 30 along the first direction, the heat exchange medium in the heat dissipation fins 40 on both sides of the first chip heat exchange structure 30 converges from both sides to the center along the first direction, which can further shorten the path length of the heat exchange medium flowing into the first chip heat exchange structure 30. This helps to reduce the probability that the length of the liquid outlet channel 21 is too long due to the concentration of multiple heat dissipation fins 40 on one side of the corresponding first chip heat exchange structure 30. It also helps to further shorten the transmission path of the heat exchange medium, making the overall flow channel layout of the liquid outlet channel 21 more compact and efficient.

[0045] Furthermore, on the motherboard of an electronic device, the first chip is usually located in the central area, and the memory slots are symmetrically distributed on both sides of the first chip along the first direction. That is, the heat dissipation system 1 can correspond to the arrangement of the first chip and the memory in the electronic device, so that the heat dissipation fins 40 can better cooperate with the memory in heat exchange, and the heat dissipation structure 30 of the first chip can better cooperate with the heat dissipation of the first chip. This can achieve the effect of making full use of the existing space of the motherboard of the electronic device without occupying other areas inside the electronic device. This is conducive to reducing the encroachment or interference on other electronic components inside the electronic device and further improving the utilization rate of the internal space of the electronic device.

[0046] As an example, when the number of heat dissipation fins 40 in the corresponding memory heat exchange component is even, the multiple heat dissipation fins 40 of each memory heat exchange component can be evenly distributed on both sides of the corresponding first chip heat exchange structure 30. When the number of heat dissipation fins 40 in the corresponding memory heat exchange component is odd, the difference between the number of heat dissipation fins 40 on one side of the corresponding first chip heat exchange structure 30 along the first direction and the number of heat dissipation fins 40 on the other side of the corresponding first chip heat exchange structure 30 along the first direction is one. This is beneficial because the distance, pipe length, and flow resistance characteristics between the heat dissipation fins 40 on both sides of the corresponding first chip heat exchange structure 30 and the corresponding first chip heat exchange structure 30 are basically the same. This is beneficial because the heat dissipation fins 40 on both sides of the corresponding first chip heat exchange structure 30 can obtain the same flow rate of heat exchange medium. This is beneficial because the thermal environment around the first chip heat exchange structure 30 is more uniform, and the heat exchange medium distribution in the heat exchange chamber of the first chip heat exchange structure 30 is more uniform.

[0047] In some embodiments of the present invention, such as Figure 6 As shown, the second support beam 20 may include: a first beam 22 and a second beam 23, the first beam 22 and the second beam 23 are arranged along a first direction and spaced apart, so as to form a clearance space 24 for clearance components between the first beam 22 and the second beam 23, and liquid outlet channels 21 are formed in both the first beam 22 and the second beam 23.

[0048] The first beam 22 and the second beam 23 can be arranged along a first direction and spaced apart, so that the second support beam 20 avoids other components inside the electronic device. A clearance space 24 can be formed between the first beam 22 and the second beam 23 to avoid components. The components avoided by the second support beam 20 can be arranged in the clearance space 24, thereby reducing the probability of interference between the second support beam 20 and the corresponding components. This is beneficial for further enabling the heat dissipation fins 40 in the heat dissipation system 1 to cooperate with the memory module for heat exchange, and for further enabling the first chip heat exchange structure 30 to cooperate with the first chip for heat exchange, thereby improving the reliability of the heat dissipation system 1. Both the first beam 22 and the second beam 23 have liquid outlet channels 21. Each liquid outlet channel 21 in the first beam 22 and the second beam 23 has a corresponding first chip heat exchange structure 30. The liquid outlet channels 21 in the first beam 22 and the second beam 23 are connected to the corresponding first chip heat exchange structure 30.

[0049] As an example, if the clearance space 24 and the gap between two of the first chip heat exchange structures 30 in the plurality of first chip heat exchange structures 30 are set opposite each other along the second direction, the clearance space 24 will not occupy the position where the second support beam 20 is provided with the liquid outlet channel 21. This can make the first beam 22 and the second beam 23 both form independent and complete liquid outlet channels 21, which is beneficial to simplifying the structure of the second support beam 20 and the arrangement of the liquid outlet channels 21.

[0050] As an example, if the clearance space 24 and one of the multiple first chip heat exchange structures 30 are arranged opposite each other along the second direction, the clearance space 24 occupies the position of the liquid outlet channel 21 in the second support beam 20. The clearance space 24 disconnects a certain liquid outlet channel 21 of the heat dissipation system 1. A part of the corresponding liquid outlet channel 21 is located in the first beam 22, and another part of the corresponding liquid outlet channel 21 is located in the second beam 23. A connecting structure is required to connect the two parts of the corresponding liquid outlet channel 21 located in the first beam 22 and the second beam 23, thereby reducing the probability of affecting the flow of the heat exchange medium from the corresponding liquid outlet channel 21 to the corresponding first chip heat exchange structure 30, which is beneficial to improving the reliability of the heat dissipation system 1.

[0051] In some embodiments of the present invention, such as Figure 6 As shown, the heat dissipation system 1 may further include: a connecting member 25, one of the multiple liquid outlet channels 21 including a first channel 211 and a second channel 212, the first channel 211 being formed on the first beam 22, the second channel 212 being formed on the second beam 23, a clearance space 24 being located between the first channel 211 and the second channel 212, and the connecting member 25 connecting the first channel 211 and the second channel 212.

[0052] When the clearance space 24 and one of the multiple first chip heat exchange structures 30 are arranged opposite each other along the second direction, and the clearance space 24 occupies the position in the second support beam 20 where the liquid outlet channel 21 is provided, one of the multiple liquid outlet channels 21 includes a first channel 211 and a second channel 212. The first channel 211 is formed in the first beam 22, and the second channel 212 is formed in the second beam 23. The first channel 211 and the second channel 212 are connected to the same first chip heat exchange structure 30. The clearance space 24 is located between the first channel 211 and the second channel 212. Other components in the electronic device are provided in the clearance space 24. The clearance space 24 disconnects the first channel 211 and the second channel 212. The connecting member 25 (i.e. the connecting structure in the above embodiment) can connect the first flow channel 211 and the second flow channel 212, so that the corresponding liquid outlet flow channel 21 including the first flow channel 211 and the second flow channel 212 is always open, so that the heat exchange medium in the multiple heat dissipation clips 40 connected thereto can flow smoothly through the corresponding liquid outlet flow channel 21 to the corresponding first chip heat exchange structure 30. This helps to reduce the probability of the liquid outlet flow channel 21 being disconnected and the heat exchange medium being unable to flow into the first chip heat exchange structure 30, and helps to further improve the reliability of the heat dissipation system 1.

[0053] In some embodiments of the present invention, such as Figure 6As shown, the connecting member 25 is located between the first support beam 10 and the second support beam 20. The connecting member 25 is an arc-shaped connecting pipe. Along the second direction, the connecting member 25 is opposite to the clearance space 24 and protrudes towards the first support beam 10. The two ends of the connecting pipe are respectively connected to the first beam 22 and the second beam 23.

[0054] The connecting member 25 is located between the first support beam 10 and the second support beam 20, and the connecting member 25 and the first support beam 10 are correspondingly arranged along the second direction. The connecting member 25 is an arc-shaped connecting pipe. Along the second direction, the connecting member 25 is opposite to the clearance space 24 and protrudes towards the first support beam 10. The connecting member 25 avoids the clearance space 24, which helps to reduce the probability of interference between the connecting member 25 and the components located in the clearance space 24, and helps to further improve the utilization rate of the internal space of the electronic device. The two ends of the connecting pipe are respectively connected to the first beam 22 and the second beam 23. The connecting pipe connects the first flow channel 211 and the second flow channel 212, thereby ensuring that the corresponding liquid outlet flow channel 21, including the first flow channel 211 and the second flow channel 212, is always open. This helps the heat exchange medium to flow smoothly through the corresponding liquid outlet flow channel 21 to the corresponding first chip heat exchange structure 30, and helps to further improve the reliability of the heat dissipation system 1.

[0055] In some embodiments of the present invention, such as Figures 1-9 As shown, there are multiple liquid inlet channels 11, each extending along a first direction. Each liquid inlet channel 11 is connected to a corresponding memory heat exchange component. The first support beam 10 has a liquid inlet 12, and the multiple liquid inlet channels 11 are connected to the liquid inlet 12. The heat dissipation system also includes a heat sink 50, which is used to cooperate with the second chip of the electronic device for heat exchange. At least one of the first support beam 10 and the second support beam 20 is fixedly provided with the heat sink 50.

[0056] There can be multiple liquid inlet channels 11, or the heat dissipation system can also include a heat sink 50. Alternatively, there can be multiple liquid inlet channels 11, and the heat dissipation system can also include a heat sink 50. In this embodiment, we will use the example of multiple liquid inlet channels 11 and the heat dissipation system also including a heat sink 50 for illustration.

[0057] There can be multiple liquid inlet channels 11, and each of the multiple liquid inlet channels 11 can extend along the first direction. The multiple liquid inlet channels 11 are respectively connected to multiple memory heat exchange components, so that the heat exchange medium in the multiple liquid inlet channels 11 can flow into the heat dissipation fins 40 in the corresponding memory heat exchange components. This is beneficial to improving the efficiency of the heat exchange medium flowing to the multiple memory heat exchange components and reducing the probability of uneven distribution of the heat exchange medium when it is distributed to the multiple memory heat exchange components. The first support beam 10 has a liquid inlet 12, and multiple liquid inlet channels 11 are connected to the liquid inlet 12. The multiple liquid inlet channels 11 are connected in parallel. The heat exchange medium in the heat dissipation system 1 flows into the multiple liquid inlet channels 11 through the liquid inlet 12. The heat exchange medium in the multiple liquid inlet channels 11 flows into the corresponding memory heat exchange components. The heat exchange medium in each memory heat exchange component flows into the corresponding liquid outlet channel 21 and then flows into the heat exchange chamber of the corresponding first chip heat exchange structure 30. This further achieves the effect of uniformly flowing the heat exchange medium to each memory heat exchange component, which is beneficial to further improve the heat dissipation uniformity of the heat dissipation system 1.

[0058] As an example, the inlet 12 can be connected to an inlet pipe 63, through which the heat exchange medium can flow into the inlet 12.

[0059] As an example, the length of the flow channel segment directly connected to the corresponding memory heat exchange component of each liquid inlet channel 11 can be the same. By controlling the cross-sectional size of different liquid inlet channels 11 and whether there are turbulence parts inside, the flow rate of the heat exchange medium in different liquid inlet channels 11 can be changed so that the time for the heat exchange medium to flow from the liquid inlet 12 to the inlet of multiple heat dissipation fins 40 in multiple liquid inlet channels 11 is equal. This is beneficial to further achieve the effect of uniform flow of heat exchange medium to each heat dissipation fin 40, and to further improve the heat dissipation uniformity of the heat dissipation system 1.

[0060] As an example, there can be two liquid inlet channels 11, and the liquid inlet 12 can be located at the center of the first support beam 10 along the first direction. Both liquid inlet channels 11 extend along the first direction and have the same length. That is, after the heat exchange medium flows into the heat dissipation system 1 from the liquid inlet 12, it can flow into the liquid inlet channels 11 located on both sides of it along the first direction, which can directly achieve the effect of uniformly flowing the heat exchange medium into the two memory heat exchange components.

[0061] As an example, such as Figure 7As shown, there can be two liquid inlet channels 11, and the liquid inlet 12 can be located on the side of the first support beam 10 near the end along the first direction. The two liquid inlet channels 11 can be referred to as the first liquid inlet channel 111 and the second liquid inlet channel 112. The first liquid inlet channel 111 includes a first sub-channel 1111 and a second sub-channel 1112 that are connected. The first sub-channel 1111 is connected to the second sub-channel 1112 and the liquid inlet 12. The first sub-channel 1111 is not directly connected to the inlet of the multiple heat dissipation fins 40 of the corresponding memory heat exchange component. The first sub-channel 1111 can play a guiding role. The first sub-channel 1111 and the second inlet channel 112 are arranged along a second direction. The lengths of the second sub-channel 1112 and the second inlet channel 112 along a first direction are equal. That is, after the heat exchange medium flows into the heat dissipation system 1 from the inlet 12, it can flow into the first sub-channel 1111 and the second inlet channel 112 respectively. The heat exchange medium flows through the first sub-channel 1111 to the second sub-channel 1112. The second sub-channel 1112 and the corresponding internal heat exchange components are arranged opposite each other along the second direction. In addition, the diameter of the connection between the inlet 12 and the first sub-channel 1111 can be set to be larger than the diameter of the connection between the inlet 12 and the second inlet channel 112, so that the speed at which the heat exchange medium enters the first sub-channel 1111 is greater than the speed at which the heat exchange medium enters the second inlet channel 112. This makes the time for the heat exchange medium to flow from the inlet 12 to the inlet of the multiple heat dissipation fins 40 of the corresponding internal heat exchange components in the first and second inlet channels 111 and 112 equal.

[0062] At least one of the first support beam 10 and the second support beam 20 may be fixedly fitted with a heat sink 50. The first support beam 10 may be fixedly fitted with a heat sink 50, or the second support beam 20 may be fixedly fitted with a heat sink 50, or both the first support beam 10 and the second support beam 20 may be fixedly fitted with heat sink 50. This embodiment of the application uses the example of both the first support beam 10 and the second support beam 20 being fixedly fitted with heat sink 50 for illustration. Along a third direction, the heat sink 50 may be located on one side of the first support beam 10 and the second support beam 20. The heat sink 50 may be arranged opposite to multiple first chip heat exchange structures 30 and heat sink clips 40 along a second direction. When the heat dissipation system 1 is as follows... Figure 1 When setting the direction, the third direction is... Figure 1In the Z-direction, the first direction, the second direction, and the third direction are perpendicular to each other, and the third direction can be parallel to the height direction of the heat sink 50. The heat sink 50 can be located between the first support beam 10 and the second chip of the electronic device, and the heat sink 50 can also be located between the second support beam 20 and the second chip of the electronic device. The heat sink 50 can be used for heat exchange with the second chip of the electronic device, which can be the power supply module of the electronic device. By setting the heat sink 50 fixed on both the first support beam 10 and the second support beam 20, it is beneficial to improve the heat dissipation efficiency of the second chip, and further improve the heat dissipation efficiency and heat dissipation effect of the electronic device.

[0063] When the heat dissipation system 1 is set in the up-down direction, the third direction is parallel to the up-down direction of the heat dissipation system 1. The heat sink 50 can be located on the lower side of the first support beam 10 and the second support beam 20. The heat sink 50 can be fixed to the lower surface of the first support beam 10 and the second support beam 20 by bolt connection. The second chip can be located below the heat sink 50. The lower surface of the heat sink 50 can contact the second chip for heat exchange. The heat generated by the second chip when it is working can be conducted to the heat sink 50, so that the heat dissipation system 1 can also dissipate heat and cool down the second chip.

[0064] As an example, the heat sink 50 can have multiple heat dissipation gaps 51, which can penetrate the heat sink 50 along a second direction. The multiple heat dissipation gaps 51 can be arranged opposite each other and spaced apart along a first direction. The lower surface of the heat sink 50 is in direct contact with the second chip. Heat is transferred from the surface of the second chip to the lower surface of the heat sink 50 through the contact interface, and then conducted through the interior of the heat sink 50 to the gap surfaces of each heat dissipation gap 51. When a fan or system airflow flows through the heat dissipation gap 51 along the second direction, the heat on the heat sink 50 can be carried away by the airflow. This improves the heat dissipation efficiency of the heat sink 50, which is beneficial for improving the heat dissipation efficiency of the second chip.

[0065] As an example, the heat sink 50 fixed to the first support beam 10 can form a first heat exchange channel. One end of the first heat exchange channel can be connected to the liquid inlet channel 11, and the other end can be connected to the liquid outlet 61 of the heat dissipation system 1, allowing the heat exchange medium to flow into the first heat exchange channel. The heat sink 50 fixed to the second support beam 20 can form a second heat exchange channel. One end of the second heat exchange channel can be connected to the liquid outlet channel 21, and the other end can be connected to the liquid outlet 61 of the heat dissipation system 1, allowing the heat exchange medium to flow into the second heat exchange channel. When the heat sink 50 and the second chip are in heat exchange cooperation, the heat exchange medium can absorb the heat generated by the second chip during operation, lowering the temperature of the second chip and thus achieving the effect of cooling the second chip. By setting heat sinks 50 fixed to both the first support beam 10 and the second support beam 20, and providing heat exchange channels within each heat sink 50, it is beneficial to further improve the heat dissipation efficiency of the second chip.

[0066] As an example, along the first direction, the heat sink 50 may have multiple clearance structures 52. The clearance structures 52 may be located on one side of the clearance structure 52 along the second direction. The clearance structures 52 may be recessed toward the interior of the heat sink 50 along the second direction. The clearance structures 52 may be used to avoid components located around the heat sink 50, such as fixing bolts, wire harnesses, etc., which helps to reduce the probability of the heat sink 50 conflicting with other components in the electronic device.

[0067] As an example, the heat sink 50 may have at least one positioning post 53 extending in a third direction. The positioning post 53 can be assembled with positioning holes on other components to achieve the positioning and installation of the heat sink 50, which helps to improve the reliability of the various components in the heat dissipation system 1 when they are installed in electronic devices.

[0068] As an example, the heat sink 50 may have a mounting portion 54 having a mounting space 541 that extends in a third direction. A fixing bolt may be inserted through the bottom of the mounting portion 54 and at least partially located within the mounting space 541. The fixing bolt may be used to fix the heat sink 50 to other components, thereby fixing the heat sink 50 inside the electronic device.

[0069] As an example, the heat sink 50 includes a first heat sink 55 and a second heat sink 56. The first heat sink 55 is fixedly connected to the first support beam 10, and the second heat sink 56 is fixedly connected to the second support beam 20. According to the structure of the second chip, the height dimension of the first heat sink 55 along the third direction is greater than the height dimension of the second heat sink 56 along the third direction. The heat sink 50 is adapted to the surrounding environment of the heat dissipation system 1.

[0070] As an example, the heat dissipation system 1 may have a protective structure 73, which is fixed to the connector 71 and covers the first chip heat exchange structure 30. The protective structure 73 can be used to protect the first chip heat exchange structure 30, thereby reducing the probability of damage to the first chip heat exchange structure 30.

[0071] As an example, the heat dissipation structure may also include a movable handle 74, which is disposed on the upper surface of the protective structure 73 and fixedly connected to the protective structure 73. By holding the movable handle 74, the heat dissipation system 1 can be moved as a whole, thereby facilitating the movement and installation of the heat dissipation system 1.

[0072] An electronic device according to a second aspect of the present invention includes the heat dissipation system 1 described in the above embodiments.

[0073] According to the embodiments of this application, the use of the heat dissipation system 1 in the above embodiments of the electronic device is beneficial to improving the heat dissipation effect of the electronic device and improving the stability of the electronic device.

[0074] Other configurations and operations of the heat dissipation system 1 for electronic devices according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0075] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0076] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipation system, characterized in that, include: The first support beam (10) and the second support beam (20) extend along a first direction and are arranged opposite to each other and spaced apart along a second direction. The first support beam (10) has an inlet channel (11) and the second support beam (20) has multiple independent outlet channels (21). The first direction and the second direction are perpendicular. Multiple first chip heat exchange structures (30) are provided, each with a heat exchange chamber. The heat exchange chamber is connected to the liquid outlet (61) of the heat dissipation system (1). Multiple liquid outlet channels (21) are connected to the heat exchange chambers of the multiple first chip heat exchange structures (30) respectively. Multiple memory heat exchange components, each of the memory heat exchange components including a heat dissipation fin (40), the heat dissipation fin (40) being connected to the liquid inlet channel (11) and the corresponding liquid outlet channel (21).

2. The heat dissipation system according to claim 1, characterized in that, Multiple first chip heat exchange structures (30) are arranged along the first direction, multiple liquid outlet channels (21) are arranged along the first direction, and multiple first chip heat exchange structures (30) and multiple liquid outlet channels (21) are arranged in a one-to-one correspondence along the second direction.

3. The heat dissipation system according to claim 2, characterized in that, Along the second direction, the first support beam (10) and the second support beam (20) are located on opposite sides of the first chip heat exchange structure (30).

4. The heat dissipation system according to claim 3, characterized in that, Multiple memory heat exchange components are arranged along the first direction. The heat dissipation fins (40) of each memory heat exchange component are connected between the first support beam (10) and the second support beam (20). The end of the heat dissipation fin (40) away from the second support beam (20) is connected to the liquid inlet channel (11). The end of the heat dissipation fin (40) near the second support beam (20) is connected to the corresponding liquid outlet channel (21) along the second direction.

5. The heat dissipation system according to claim 4, characterized in that, Each of the memory heat exchange components includes a plurality of heat dissipation clips (40), and along the first direction, the plurality of heat dissipation clips (40) of each memory heat exchange component are respectively located on both sides of the corresponding first chip heat exchange structure (30).

6. The heat dissipation system according to claim 2, characterized in that, The second support beam (20) includes a first beam (22) and a second beam (23), the first beam (22) and the second beam (23) are arranged along the first direction and spaced apart to form a clearance space (24) for clearance components between the first beam (22) and the second beam (23), and the liquid outlet channel (21) is formed in both the first beam (22) and the second beam (23).

7. The heat dissipation system according to claim 6, characterized in that, The heat dissipation system (1) further includes: a connecting member (25), one of the plurality of liquid outlet channels (21) including a first channel (211) and a second channel (212), the first channel (211) being formed on the first beam (22), the second channel (212) being formed on the second beam (23), the clearance space (24) being located between the first channel (211) and the second channel (212), and the connecting member (25) connecting the first channel (211) and the second channel (212).

8. The heat dissipation system according to claim 7, characterized in that, The connecting member (25) is located between the first support beam (10) and the second support beam (20). The connecting member (25) is an arc-shaped connecting pipe. Along the second direction, the connecting member (25) is opposite to the clearance space (24) and protrudes toward the first support beam (10). The two ends of the connecting pipe are respectively connected to the first beam (22) and the second beam (23).

9. The heat dissipation system according to any one of claims 1-8, characterized in that, There are multiple liquid inlet channels (11), each extending along the first direction. Each liquid inlet channel (11) is connected to one of the multiple memory heat exchange components. The first support beam (10) has a liquid inlet (12), and each of the multiple liquid inlet channels (11) is connected to the liquid inlet (12). And / or The heat dissipation system further includes a heat sink (50), which is used to cooperate with the second chip of the electronic device for heat exchange, and at least one of the first support beam (10) and the second support beam (20) is fixedly provided with the heat sink (50).

10. An electronic device, characterized in that, Includes the heat dissipation system (1) according to any one of claims 1-9.

Images