Heat dissipation assembly of power device, power device and fan speed adjustment method

Abstract

This disclosure provides a heat dissipation assembly for a power device, the power device itself, and a method for adjusting fan speed. The heat dissipation assembly includes: a heat exchanger, a first fan, and a second fan. The heat exchanger is disposed outside the casing of the power device and includes multiple parallel heat dissipation pipes. Each heat dissipation pipe includes a first heat dissipation section and a second heat dissipation section, and the internal channel of the first heat dissipation section communicates with the interior of the casing. The first fan is disposed inside the casing, and the internal channel of the second heat dissipation section communicates with the first fan. The first fan drives the gas inside the casing to flow in an internal air duct, which includes the internal channels of the multiple heat dissipation pipes. The second fan is disposed outside the casing, with its inlet or outlet side opposite to the heat exchanger. The second fan drives the gas outside the casing to flow in an external air duct, which includes the external gaps between the multiple heat dissipation pipes. This reduces the space occupied by the heat exchanger within the power device casing and improves heat dissipation efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology for power electronic equipment, and particularly to a heat dissipation component for a power device, a power device, a method for adjusting the fan speed of the heat dissipation component, an electronic device, and a computer-readable storage medium. Background Technology

[0002] Current power devices all involve heat dissipation issues for internal heat-generating components. In practical applications, this is typically achieved through natural cooling using a fan or forced air cooling by placing a heat exchanger inside the device chassis. While natural cooling using a fan can meet certain cooling requirements, its cooling capacity is limited; forced air cooling using a heat exchanger requires significant internal space within the device chassis.

[0003] Therefore, it is crucial to improve the heat dissipation capacity of power devices and reduce the space occupied inside the device chassis. Summary of the Invention

[0004] This disclosure provides a heat dissipation component for a power device, a power device, a method for adjusting the fan speed of the heat dissipation component, an electronic device, and a computer-readable storage medium.

[0005] In a first aspect, this disclosure provides a heat dissipation assembly for a power device, comprising: a heat exchanger, a first fan, and a second fan; the heat exchanger is disposed outside the casing of the power device and includes a plurality of parallel heat dissipation pipes, each heat dissipation pipe including a first heat dissipation section and a second heat dissipation section, the internal channel of the first heat dissipation section communicating with the interior of the casing; the first fan is disposed inside the casing, and the internal channel of the second heat dissipation section communicating with the first fan, the first fan driving gas inside the casing to flow in an inner air duct, the inner air duct including the internal channels of the plurality of heat dissipation pipes; the second fan is disposed outside the casing, the air inlet side or air outlet side of the second fan being disposed opposite to the heat exchanger, the second fan driving gas outside the casing to flow in an outer air duct, the outer air duct including the external gaps of the plurality of heat dissipation pipes.

[0006] In some possible implementations, each of the heat pipes includes one or more internal channels, and there is an external gap between each of the heat pipes.

[0007] In some possible implementations, the heat dissipation assembly further includes an outer cavity disposed outside the housing and communicating with the internal channels of the plurality of heat dissipation pipes. The outer cavity is used to deflect the gas entering the outer cavity.

[0008] In some possible implementations, the heat dissipation assembly further includes a baffle disposed outside the housing and perpendicularly connected to the plurality of heat dissipation pipes, and the internal channel is used to deflect the gas entering the internal channel.

[0009] In some possible implementations, the heat exchanger is placed on the outlet side of the second fan; or, the heat exchanger is placed on the inlet side of the second fan.

[0010] In some possible implementations, the second heat sink is placed on the air intake side of the first fan; or, the second heat sink is placed on the air outlet side of the first fan.

[0011] In some possible implementations, the heat dissipation assembly further includes an inner cavity disposed inside the housing and communicating with the interior of the housing via the first fan.

[0012] In some possible implementations, the inner cavity is located on the air intake side of the first fan; or, the inner cavity is located on the air outlet side of the first fan.

[0013] In some possible implementations, the heat pipe is a flat tube structure.

[0014] In some possible implementations, the thickness parameter of the heat pipe is in the range of [0.3mm, 0.6mm]; the length parameter of the heat pipe is in the range of [100mm, 130mm]; the width parameter of the heat pipe is in the range of [3mm, 5mm]; and the external gap parameter of the heat pipe is in the range of [2mm, 5mm].

[0015] Secondly, this disclosure provides a power device, including: a housing and the aforementioned heat dissipation assembly; wherein, a heat-generating device is disposed inside the housing.

[0016] Thirdly, this disclosure provides a method for adjusting the fan speed of a heat dissipation component, comprising: acquiring a first enclosure temperature of a power device at a current moment and acquiring a second enclosure temperature of the power device at a previous moment, wherein the power device includes the aforementioned heat dissipation component; determining a target temperature range corresponding to the first enclosure temperature; determining a speed to be adjusted for a second fan in the heat dissipation component based on the target temperature range, the first enclosure temperature, and the second enclosure temperature, and adjusting the speed of the second fan to the speed to be adjusted.

[0017] In some possible implementations, determining the speed to be adjusted for the second fan in the heat dissipation assembly based on the target temperature range, the first enclosure temperature, and the second enclosure temperature includes: acquiring a temperature fluctuation range; determining the enclosure temperature difference based on the first enclosure temperature and the second enclosure temperature; if the enclosure temperature difference is not within the temperature fluctuation range, determining the speed to be adjusted for the second fan based on the target temperature range and the first enclosure temperature; and if the enclosure temperature difference is within the temperature fluctuation range, determining the current speed of the second fan as the speed to be adjusted.

[0018] In some possible implementations, the method further includes: acquiring multiple enclosure temperatures of the power device; determining the temperature rise rate of the power device based on the multiple enclosure temperatures; and adjusting the speed of the second fan to the speed threshold when the temperature rise rate reaches a preset temperature rate threshold.

[0019] In some possible implementations, the method further includes: acquiring multiple enclosure temperatures of the power device within a preset time interval; and generating a temperature alarm message when all multiple enclosure temperatures reach a preset temperature threshold.

[0020] Fourthly, this disclosure provides an electronic device, including: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores one or more computer programs executable by the at least one processor, the one or more computer programs being executed by the at least one processor to enable the at least one processor to perform the method described above.

[0021] Fifthly, this disclosure provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method described above.

[0022] The heat dissipation assembly for the power device provided in this embodiment includes a heat exchanger, a first fan, and a second fan. Placing the heat exchanger outside the power device housing reduces the space occupied by the heat exchanger inside the housing. The internal channels of the heat exchanger's heat pipes form an inner air duct, and the external gaps of the heat exchanger's heat pipes form an outer air duct. This simplifies the air duct structure, reduces gas turning angles, and decreases wind resistance. Furthermore, the first fan drives the gas to flow in the inner air duct, and the second fan drives the gas to flow in the outer air duct, thereby improving heat dissipation efficiency and capacity.

[0023] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0024] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the embodiments of the present disclosure to explain the disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0025] Figure 1 A side cross-sectional view of a heat dissipation assembly for a power device provided in an embodiment of this disclosure;

[0026] Figure 2a This is a schematic diagram of the structure of a heat exchanger provided in an embodiment of the present disclosure;

[0027] Figure 2b This is a schematic diagram of another heat exchanger provided in an embodiment of the present disclosure;

[0028] Figure 2c This is a schematic diagram of the dimensions of a heat pipe provided in an embodiment of the present disclosure;

[0029] Figure 3a A side cross-sectional view of a heat dissipation assembly for a power device provided in an embodiment of this disclosure;

[0030] Figure 3b A side cross-sectional view of a heat dissipation assembly for another power device provided in an embodiment of this disclosure;

[0031] Figure 4a A schematic diagram of gas flow in an internal air duct provided in an embodiment of this disclosure;

[0032] Figure 4b A schematic diagram of gas flow in an external air duct provided in an embodiment of this disclosure;

[0033] Figure 5a A schematic diagram of another internal air duct gas flow provided in an embodiment of this disclosure;

[0034] Figure 5b A schematic diagram of another external air duct gas flow provided in an embodiment of this disclosure;

[0035] Figure 6 A schematic diagram of gas flow inside a box provided in an embodiment of this disclosure;

[0036] Figure 7 A schematic diagram of another gas flow inside a housing provided in an embodiment of this disclosure;

[0037] Figure 8 A schematic diagram of another type of gas flow in an internal air duct provided in an embodiment of this disclosure;

[0038] Figure 9 A top cross-sectional view of a power device provided in an embodiment of this disclosure;

[0039] Figure 10 A flowchart illustrating a method for adjusting the fan speed of a heat dissipation component according to an embodiment of this disclosure;

[0040] Figure 11 This is a block diagram of an electronic device provided in an embodiment of the present disclosure. Detailed Implementation

[0041] To enable those skilled in the art to better understand the technical solutions of this disclosure, exemplary embodiments of this disclosure are described below with reference to the accompanying drawings, including various details of the embodiments of this disclosure to aid understanding. These should be considered merely exemplary. Therefore, those skilled in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this disclosure. Similarly, for clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0042] Where there is no conflict, the various embodiments of this disclosure and the features thereof in the embodiments may be combined with each other.

[0043] As used herein, the term “and / or” includes any and all combinations of one or more related enumerated entries.

[0044] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. As used herein, the singular forms “a” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that when the terms “comprising” and / or “made of” are used in this specification, the presence of the stated feature, integral, step, operation, element, and / or component is specified, but the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof is not excluded. Words such as “connected” or “linked” are not limited to physical or mechanical connections but can include electrical connections, whether direct or indirect.

[0045] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined herein.

[0046] Currently, power equipment mainly employs two types of solutions for heat dissipation of internal heat-generating components. One is natural cooling with a fan, which is simple in structure and can meet heat dissipation requirements to a certain extent, but its heat dissipation capacity is significantly limited. When dealing with high-power equipment, it is difficult to provide sufficient heat dissipation efficiency and cannot ensure stable and efficient operation. The other commonly used solution is forced air cooling using a flat tube and finned air-to-air heat exchanger. In practical applications, this solution has problems such as occupying a large amount of internal space, affecting the compactness of component layout; complex air duct design, high air resistance, reducing heat dissipation efficiency; and high fin density, making cleaning and maintenance difficult, leading to excessive dust accumulation and affecting heat dissipation.

[0047] According to embodiments of this disclosure, placing the heat exchanger outside the power equipment enclosure reduces the space occupied by the heat exchanger within the enclosure, thus improving the utilization rate of the internal space. The internal channels and cavities of the heat exchanger's heat dissipation tubes form an inner air duct, while the external gaps between the heat exchanger's heat dissipation tubes form an outer air duct. This simplifies the air duct structure, reduces gas turning angles, and decreases wind resistance. Furthermore, the first fan drives the gas to flow in the inner air duct, and the second fan drives the gas to flow in the outer air duct, thereby improving heat dissipation efficiency and capacity. The heat exchanger's heat dissipation tubes preferably adopt a flat tube structure, which is easier to maintain and clean compared to the finned structures currently used in practical applications.

[0048] Figure 1 This is a side cross-sectional view of a heat dissipation assembly for a power device provided in an embodiment of this disclosure. Figure 1 As shown, the heat dissipation assembly of the power device includes: a heat exchanger 10, a first fan 11, and a second fan 12; the heat exchanger 10 is disposed outside the casing of the power device and includes a plurality of parallel heat dissipation pipes 101, each heat dissipation pipe 101 including a first heat dissipation part and a second heat dissipation part, the internal channel of the first heat dissipation part communicating with the interior of the casing; the first fan 11 is disposed inside the casing, and the internal channel of the second heat dissipation part communicating with the first fan 11, the first fan 11 being used to drive the gas inside the casing to flow in an inner air duct, the inner air duct including the internal channels of the plurality of heat dissipation pipes 101; the second fan 12 is disposed outside the casing, the air inlet side or air outlet side of the second fan 12 being disposed opposite to the heat exchanger 10, the second fan 12 being used to drive the gas outside the casing to flow in an outer air duct, the outer air duct including the external gaps of the plurality of heat dissipation pipes 101.

[0049] Specifically, Figure 1The enclosure shown is for a power device. The heat exchanger 10 of the heat dissipation assembly is located outside the enclosure, which reduces the space occupied inside the enclosure. The heat exchanger 10 consists of parallel heat dissipation pipes 101 with internal channels. Based on the gas flow direction within the heat exchanger 10, each heat dissipation pipe 101 can be divided into a first heat dissipation section and a second heat dissipation section. Figure 1 As shown, the portion of the internal channel of the heat dissipation pipe 101 that directly communicates with the interior of the housing is the first heat dissipation section, and the portion of the internal channel of the heat dissipation pipe 101 that communicates with the first fan 11 is the second heat dissipation section, which is also connected to the interior of the housing via the first fan 11. The first fan 11 and the second fan 12 are respectively located inside and outside the housing. The first fan 11 can be connected to the housing of the power device perpendicular to the internal channel of the heat dissipation pipe 101, and the second fan 12 can be arranged parallel to the internal channel of the heat dissipation pipe 101 and opposite to the heat exchanger 10. The first fan 11 can be used to drive the gas inside the housing to flow in the internal air duct formed by the internal channel of the heat dissipation pipe 101, and the second fan 12 can be used to drive the gas outside the housing to flow in the external air duct formed by the external gap of the heat dissipation pipe 101.

[0050] By placing the heat exchanger outside the power equipment enclosure, the space occupied by the heat exchanger inside the enclosure can be reduced, thus improving the utilization rate of the internal space. The heat dissipation efficiency is improved by using a first fan to drive the gas to flow in the inner air duct and a second fan to drive the gas to flow in the outer air duct.

[0051] In some possible implementations, the heat dissipation tubes are flat tube structures. Specifically, the heat exchanger consists of parallel-arranged flat tubes.

[0052] In some possible implementations, each of the heat pipes includes one or more internal channels, and there is an external gap between each of the heat pipes.

[0053] Figure 2a This is a schematic diagram of a heat exchanger provided in an embodiment of this disclosure. Figure 2a As shown, each heat exchanger tube 101 includes multiple internal channels, and there are external gaps between each heat exchanger tube 101. In practical applications, the heat exchanger and the power equipment housing can be connected through the chassis connection port 21.

[0054] Figure 2b This is a schematic diagram of another heat exchanger provided in an embodiment of this disclosure. Figure 2b As shown, each heat pipe 101 includes an internal channel, that is, the interior of each heat pipe 101 forms an integral channel, and there are external gaps between each heat pipe 101.

[0055] In practical applications, the size of the heat exchanger's heat dissipation tubes is not fixed. Different tube sizes can be set for different application scenarios. Specifically, the tube size can be determined based on simulation algorithms and the actual application scenario. See [link / reference] Figure 2c , Figure 2c This is a schematic diagram of the dimensions of a heat pipe provided in an embodiment of the present disclosure, such as... Figure 2c As shown, the specific dimensional parameters of the heat pipes include the thickness, width, length, and external gap between each heat pipe.

[0056] In the embodiments provided in this disclosure, during the simulation of the thickness, width, length of the heat exchanger tubes, and the external gap between each heat exchanger tube, the maximum allowable manufacturing length A of the heat exchanger can be obtained first. Based on the minimum heat exchanger tube thickness that the factory can process and industry experience parameters, the range of heat exchanger tube thickness B is obtained. Correspondingly, based on the minimum heat exchanger tube width that the factory can process and industry experience parameters, the width C of the heat exchanger tube is obtained. Since the heat dissipation components are installed on power equipment in practical applications, and the space reserved for the heat exchanger varies in different practical application scenarios, the height D of the heat exchanger, i.e., the length of the heat exchanger tubes, can be determined based on the actual reserved space range of the heat exchanger. Furthermore, the range of the external gap E between the heat exchanger tubes can be determined based on the number of heat exchanger tubes in the heat exchanger and industry experience parameters.

[0057] After obtaining the maximum length A of the heat exchanger, the range of the thickness B of the heat dissipation pipes, the range of the width C of the heat dissipation pipes, the height D of the heat exchanger, and the range of the external gap E between the heat dissipation pipes, the thickness, length, width, and external gap of the heat dissipation pipes can be initially set. Simulation is then performed based on a simulation algorithm to obtain the temperature drop within the chamber based on the currently set parameters. In practical applications, to measure the heat dissipation effect of the heat dissipation components, a cooling threshold is often preset. Based on this, the temperature drop within the chamber can be compared with the preset cooling threshold to determine whether the currently set parameters need adjustment. If the temperature drop does not reach the cooling threshold, the thickness, length, width, and external gap parameters of the heat dissipation pipes are adjusted, and simulation is performed based on the adjusted parameters to obtain the temperature drop within the chamber in the next round, until the temperature drop reaches the cooling threshold.

[0058] To further improve the accuracy of determining the various dimensional parameters of the heat pipes, after the temperature drop reaches the cooling threshold, individual parameters such as the thickness, length, width, and external clearance of the heat pipes can be adjusted and optimized. During the adjustment and optimization of individual parameters, if the individual parameter reaches its maximum or minimum value within its parameter range, and the temperature drop inside the enclosure is relatively high, or the temperature inside the enclosure shows a downward trend, then the individual parameter is set to its maximum or minimum value. Similarly, the thickness, length, width, and external clearance parameters of the heat pipes can all be adjusted and their corresponding values ​​determined using the above method for adjusting individual parameters.

[0059] Table 1 below shows the cooling simulation results obtained by combining the heat pipe size parameters provided in the embodiments of this disclosure.

[0060] Table 1

[0061]

[0062] Table 1 above shows the seven combinations of heat pipe size parameters and the simulation results of the temperature drop corresponding to each combination. In this embodiment, the thickness of the heat pipe is preferably 0.3mm, 0.4mm, 0.5mm, or 0.6mm; the length of the heat pipe is preferably 100mm, 110mm, 120mm, or 130mm; the width of the heat pipe is preferably 3mm, 4mm, or 5mm; and the external gap of the heat pipe is preferably 2mm, 3mm, 4mm, or 5mm.

[0063] Based on this, in some possible implementations, the thickness parameter of the heat pipe is in the range of [0.3mm, 0.6mm]; the length parameter of the heat pipe is in the range of [100mm, 130mm]; the width parameter of the heat pipe is in the range of [3mm, 5mm]; and the external gap parameter of the heat pipe is in the range of [2mm, 5mm].

[0064] Furthermore, regarding the thickness of the heat pipe, increasing the thickness can improve the mechanical strength of the heat pipe, thereby reducing the risk of deformation. However, increasing the thickness of the heat pipe will increase the thermal resistance. Specifically, for every 0.1 mm increase in the thickness of the heat pipe, the thermal resistance will increase by approximately 5%-8%. In addition, increasing the thickness of the heat pipe will also increase the amount of material used, thereby increasing the cost and weight of the heat pipe.

[0065] Regarding the width of the heat exchanger, the heat exchange area of ​​the heat exchanger can be increased by increasing the width of the heat exchanger. Specifically, for every 1% increase in the width of the heat exchanger, the heat dissipation can be increased by approximately 6%-8%, and the air flow distribution will be more uniform. However, if the width of the heat exchanger is too large, it will lead to a decrease in the hydraulic diameter of the heat exchanger and an increase in flow resistance.

[0066] Regarding the length of the heat pipe, the heat exchange time of the gas can be extended by increasing the length of the heat pipe, and the contact time between the gas and the heat pipe can be increased. However, increasing the length of the heat pipe will cause the pressure drop to increase non-linearly. Specifically, for every 20% increase in the length of the heat pipe, the pressure drop will increase by about 30%-40%. Moreover, if the length of the heat pipe is too long, the volume of the heat pipe will increase, which is not conducive to compact design.

[0067] Regarding the external gap between heat pipes, reducing the external gap between heat pipes can enhance turbulence and increase the heat transfer coefficient of the heat pipes by about 15% to 25%, but it will also significantly increase the wind resistance. In this case, a higher power second fan is required. Conversely, increasing the external gap between heat pipes can reduce wind resistance, but the heat transfer coefficient of the heat pipes will also decrease.

[0068] Based on this, in practical applications, the thickness, width, length and external gap of the heat pipe can be set according to the actual application scenario to cope with different application scenarios and improve heat dissipation efficiency and heat dissipation effect. This disclosure does not limit these aspects.

[0069] The internal channels of the heat dissipation pipes form an internal air duct for the air to flow inside the enclosure, while the external gaps of the heat dissipation pipes form an external air duct for the air to flow outside the enclosure. This simplifies the structure of the air duct and reduces the air resistance of the air flowing in the air duct, thereby improving the heat dissipation efficiency of the power equipment.

[0070] In some possible implementations, the heat dissipation assembly further includes an outer cavity disposed outside the housing and communicating with the internal channels of the plurality of heat dissipation pipes. The outer cavity is used to deflect the gas entering the outer cavity.

[0071] See also Figure 2a ,like Figure 2a As shown, the heat dissipation assembly also includes an outer cavity 20, which is located outside the housing and communicates with the internal channel of the heat dissipation pipe 101. The outer cavity 20 and the internal channel of the heat dissipation pipe 101 can form an internal air duct for the heat dissipation assembly. After the gas enters the outer cavity 20 through the internal channel of the heat dissipation pipe 101, the gas can be diverted in the outer cavity 20.

[0072] In some possible implementations, the heat exchanger is placed on the outlet side of the second fan; or, the heat exchanger is placed on the inlet side of the second fan.

[0073] In some possible implementations, the second heat sink is placed on the air intake side of the first fan; or, the second heat sink is placed on the air outlet side of the first fan.

[0074] In practical applications, the heat exchanger can be located on the exhaust side of the second fan, while the second heat dissipation unit is located on the intake side of the first fan. Alternatively, the heat exchanger can be located on the intake side of the second fan, while the second heat dissipation unit is located on the exhaust side of the first fan.

[0075] Furthermore, Figure 3a This is a side cross-sectional view of a heat dissipation assembly for a power device provided in an embodiment of this disclosure. Figure 3a As shown, the heat dissipation assembly also includes an inner cavity 30. In some possible implementations, the heat dissipation assembly further includes an inner cavity 30, which is disposed inside the housing and communicates with the interior of the housing via the first fan 11.

[0076] Specifically, the inner cavity 30 is located inside the housing and can form an internal air duct with the internal channel of the heat dissipation pipe 101 and the outer cavity 20. When the heat dissipation assembly has the inner cavity 30, the inner cavity 30 communicates with the interior of the housing via the first fan 11, and the first fan 11 is connected to the inner cavity 30 parallel to the internal channel of the heat dissipation pipe 101. In practical applications, the first fan 11 can be partially embedded in the inner cavity 30 or placed outside the inner cavity 30. In this way, the first fan 11 can blow air from inside the housing into the internal channel of the heat dissipation pipe 101 through the inner cavity 30, or air from outside the housing can enter the inner cavity 30 through the internal channel of the heat dissipation pipe 101 and then be blown into the housing by the first fan 11.

[0077] In practical applications, heat dissipation components can also be used as follows: Figure 3b The settings shown are as follows. Figure 3b A side cross-sectional view of a heat dissipation assembly for another power device provided in an embodiment of this disclosure. (See figure) Figure 3b As shown, the heat exchanger 10 is vertically connected to the housing along the height direction of the housing, and the second fan 12 is located below the heat exchanger 10. By placing the heat exchanger 10 on the air outlet side of the second fan 12 or on the air inlet side of the second fan 12, the air outlet or air inlet of the second fan 12 can be directly facing the external air duct of the heat exchanger 10.

[0078] This embodiment of the disclosure, by placing the heat exchanger on the exhaust side or intake side of the second fan, allows cold air to enter the heat exchanger from its bottom. This solves the problem of poor airflow and reduced heat dissipation in environments where power equipment operates in confined spaces, is close to walls, or is near cabinets, where proximity to obstacles hinders airflow. By drawing in cold air from the bottom of the heat exchanger and expelling hot air from its top, the natural convection principle of rising hot air creates a highly efficient airflow circulation, improving heat dissipation efficiency. After being exhausted from the top or side of the heat exchanger, the hot air is less likely to be re-drawn in by the intake of the second fan located at the bottom, reducing hot air backflow and the likelihood of hot air circulating within the power equipment, thus maintaining a lower operating temperature. Simultaneously, intake from the bottom of the heat exchanger allows the second fan to draw in cooler air, reducing the intake of hotter air heated by the heat exchanger, thereby lowering the operating temperature of the second fan, reducing its workload, and extending its service life.

[0079] In some possible implementations, the inner cavity is located on the air intake side of the first fan; or, the inner cavity is located on the air outlet side of the first fan.

[0080] Accordingly, the inner cavity can be located on the air inlet side of the first fan or on the air outlet side of the first fan. When the heat exchanger is located on the air outlet side of the second fan, the inner cavity is located on the air inlet side of the first fan; when the heat exchanger is located on the air inlet side of the second fan, the inner cavity is located on the air outlet side of the first fan.

[0081] Figure 4a This is a schematic diagram of gas flow in an internal air duct provided by an embodiment of the present disclosure. Figure 4b This is a schematic diagram of gas flow in an external air duct according to an embodiment of this disclosure. Taking a heat dissipation assembly including an inner cavity and an outer cavity as an example, the heat dissipation process of the heat dissipation assembly is explained. See below... Figure 4a and Figure 4bAs shown, after the heat-generating components of the power device dissipate heat and generate hot air, the hot air inside the enclosure enters the inner air duct through the internal channel of the heat dissipation pipe in the first heat dissipation section. Simultaneously, cold air outside the enclosure is blown into the external gap of the heat dissipation pipe by the second fan. During this process, the heat of the hot air is transferred to the inner surface of the heat dissipation pipe's internal channel through convection heat transfer, and then to the outer surface of the heat dissipation pipe's internal channel through wall heat conduction, transferring the heat to the cold air blown in by the second fan, thus achieving the first cooling of the hot air. The first-cooled hot air enters the outer cavity through the internal channel of the heat dissipation pipe, undergoes gas reversal in the outer cavity, and then enters the internal channel of the heat dissipation pipe in the second heat dissipation section. Based on the same method as the first cooling, the hot air undergoes a second cooling. The second-cooled hot air enters the inner cavity and is blown back into the enclosure by the first fan, forming a circulation, thereby achieving heat dissipation.

[0082] The heat dissipation component provided in this embodiment is not directly connected to the external environment, has high airtightness, and improves the stability and reliability of the heat dissipation component.

[0083] The above explains the heat dissipation process of the heat dissipation assembly when the heat exchanger is located on the exhaust side of the second fan and the inner cavity is located on the intake side of the first fan. For the gas flow during heat dissipation when the heat exchanger is located on the intake side of the second fan and the inner cavity is located on the exhaust side of the first fan, please refer to [link to relevant documentation]. Figure 5a and Figure 5b . Figure 5a This is a schematic diagram of another internal air duct gas flow provided in an embodiment of this disclosure. Figure 5b This is a schematic diagram of another external airflow path provided in an embodiment of this disclosure. Similar to the case described above where the heat exchanger is located on the outlet side of the second fan and the inner cavity is located on the inlet side of the first fan, the heat dissipation process of the heat dissipation component is as follows: after the heat-generating device of the power equipment dissipates heat and generates hot air, the hot air inside the housing is blown into the inner airflow path by the first fan through the internal channel of the heat dissipation pipe of the second heat dissipation unit. After heat dissipation is completed, the hot air enters the housing through the internal channel of the heat dissipation pipe of the first heat dissipation unit. The specific heat dissipation process can be found in the above description, and will not be repeated here.

[0084] It should be noted that when the heat dissipation component includes an outer cavity, the internal channel of the heat pipe can be one or more. In this disclosure, the implementation of multiple internal channels is preferred.

[0085] Accordingly, Figure 6 This is a schematic diagram of gas flow inside a box according to an embodiment of the present disclosure. Figure 7 This is a schematic diagram of another gas flow inside a housing provided in an embodiment of this disclosure. The gas flow process inside the housing can be seen in [reference needed]. Figure 6 and Figure 7 ,in, Figure 6The illustration specifically shows the gas flow process inside the housing when the heat exchanger 10 is located on the outlet side of the second fan 12 and the inner cavity 30 is located on the inlet side of the first fan 11. Figure 7 Specifically, the flow process of gas inside the housing is shown when the heat exchanger 10 is located on the air inlet side of the second fan 12 and the inner cavity 30 is located on the air outlet side of the first fan 11.

[0086] In some possible implementations, the heat dissipation assembly further includes a baffle disposed outside the housing and perpendicularly connected to the plurality of heat dissipation pipes, and the internal channel is used to deflect the gas entering the internal channel.

[0087] See also Figure 2b ,like Figure 2b As shown, the heat dissipation assembly also includes a baffle 22, which is disposed on the outside of the housing and vertically connected to the heat dissipation pipe 101. In this way, the gas can be diverted within the internal channel of the heat dissipation pipe 101 after entering it. Figure 8 This is a schematic diagram of another type of gas flow in an internal air duct provided in an embodiment of this disclosure. Figure 8 Specifically, this illustrates the gas flow process within the inner air duct when the heat exchanger is located on the outlet side of the second fan and the inner cavity is located on the inlet side of the first fan. The gas flow pattern in the outer air duct is different from... Figure 4b The same applies, and will not be repeated here.

[0088] By using baffles instead of an outer cavity, the gas can be redirected within the internal channels of the heat dissipation pipe, further simplifying the air duct structure and reducing costs.

[0089] It should be noted that when the heat dissipation component includes a baffle, the internal channel of the heat pipe can be one or more. In this disclosure, the implementation of one internal channel is preferred.

[0090] According to the embodiments of this disclosure, the heat exchanger can reduce the space occupied by the internal space of the power equipment housing, improve the utilization rate of the internal space of the housing, and simplify the air duct structure, so that the gas turning angle is reduced during the airflow in the air duct, thereby reducing wind resistance and improving heat dissipation efficiency.

[0091] Figure 9 This is a top cross-sectional view of a power device provided in an embodiment of this disclosure. Figure 9 As shown, an embodiment of this disclosure provides a power device, including: a housing 90 and the above-mentioned heat dissipation assembly; wherein, a heat-generating device 91 is disposed inside the housing.

[0092] See Figure 10 , Figure 10A flowchart is shown below illustrating a method for adjusting the fan speed of a heat dissipation assembly according to an embodiment of the present disclosure, which specifically includes the following steps:

[0093] Step 1002: Collect the first enclosure temperature of the power device at the current moment, and obtain the second enclosure temperature of the power device at the previous moment.

[0094] The power device includes the heat dissipation components described above.

[0095] Step 1004: Determine the target temperature range corresponding to the temperature of the first chamber.

[0096] Step 1006: Based on the target temperature range, the first cabinet temperature, and the second cabinet temperature, determine the speed to be adjusted for the second fan in the heat dissipation assembly, and adjust the speed of the second fan to the speed to be adjusted.

[0097] The first enclosure temperature refers to the temperature inside the power equipment enclosure at the current moment; the second enclosure temperature refers to the temperature inside the power equipment enclosure at a previous moment. The previous moment can be any moment preceding the current moment. For example, among moments t0, t1, t2, t3, and t4, if the current moment is t4, then the previous moment can be any of t0, t1, t2, or t3. In practical applications, a certain time interval can be set to collect the enclosure temperature of the power equipment. Based on this, the specific previous moment can be determined according to the time interval for collecting the enclosure temperature.

[0098] The target temperature range refers to one of several pre-set temperature ranges, specifically the temperature range to which the first enclosure temperature belongs. The speed to be adjusted is used to adjust the speed of the second fan, that is, the adjusted speed of the second fan.

[0099] Specifically, a temperature sensor can be used to collect the first enclosure temperature of the power device at the current moment based on a preset time interval, and to obtain the second enclosure temperature of the power device at the previous moment. A target temperature range to which the first enclosure temperature belongs is determined. Based on the target temperature range, the first enclosure temperature, and the second enclosure temperature, the speed of the second fan to be adjusted is determined, and the speed of the second fan is adjusted to the determined speed to be adjusted.

[0100] This embodiment of the invention collects the temperature inside the power device enclosure and adjusts the speed of the second fan located outside the enclosure based on the temperature inside the enclosure, thereby reducing the energy consumption of the second fan and extending its service life.

[0101] Further, in a specific embodiment provided in this disclosure, determining the speed to be adjusted for the second fan in the heat dissipation assembly based on the target temperature range, the first enclosure temperature, and the second enclosure temperature includes:

[0102] Obtain the temperature fluctuation range;

[0103] The temperature difference between the boxes is determined based on the temperatures of the first and second boxes.

[0104] If the temperature difference of the enclosure is not within the temperature fluctuation range, the speed of the second fan to be adjusted is determined based on the target temperature range and the temperature of the first enclosure.

[0105] If the temperature difference of the enclosure is within the temperature fluctuation range, the current speed of the second fan is determined as the speed to be adjusted.

[0106] The temperature fluctuation range refers to the range of temperature fluctuations within the power equipment enclosure. This range can be customized based on the specific application; for example, it can be set to [-2, 2]. The enclosure temperature difference specifically refers to the difference between the temperatures of the first and second enclosures, used to measure the change in internal temperature between two consecutive temperature measurements.

[0107] In practical applications, the temperature inside the power equipment enclosure changes in real time, and the temperature fluctuations vary. In order to reduce the frequency of adjusting the speed of the second fan and extend its service life, the speed of the second fan can be adjusted according to the preset temperature fluctuation range.

[0108] Specifically, after determining the temperatures of the first and second enclosures of the power equipment, the temperature fluctuation range is obtained, and the enclosure temperature difference is determined based on the first and second enclosure temperatures. If the determined enclosure temperature difference is not within the temperature fluctuation range, it indicates that the temperature fluctuation inside the power equipment enclosure is large. In this case, the speed of the second fan needs to be adjusted. Specifically, the speed of the second fan to be adjusted can be determined based on the target temperature range and the first enclosure temperature. In practical applications, the enclosure temperature can be divided into low-temperature, medium-temperature, and high-temperature ranges, and different speed boost coefficients can be set for different temperature ranges. For example, the speed boost coefficient for the low-temperature range can be 2%, and the speed boost coefficient for the medium-temperature range can be 3%, etc. If the enclosure temperature difference is determined to be outside the temperature fluctuation range, the speed of the second fan can be adjusted according to the speed boost coefficient corresponding to the target temperature range.

[0109] Using the previous example, if the target temperature range is determined to be the low temperature range, and the speed increase factor corresponding to the low temperature range is 2%, then for every 1 degree increase in the cabinet temperature, the speed of the second fan will be increased by 2%.

[0110] If the determined temperature difference of the enclosure is within the temperature fluctuation range, it means that the temperature fluctuation inside the power equipment enclosure is small. In order to reduce the frequency of adjusting the speed of the second fan, there is no need to adjust the speed of the second fan at this time. That is, the current speed of the second fan is determined as the speed to be adjusted for the second fan.

[0111] It should be noted that if the temperature inside the power equipment enclosure reaches the preset high temperature range, the speed of the second fan can be directly adjusted to 100%.

[0112] The method provided in this disclosure can adjust the speed of the second fan according to the temperature inside the power device enclosure, thereby reducing the energy consumption of the second fan.

[0113] Since the temperature inside the power equipment enclosure fluctuates constantly, and the rates of temperature rise and fall vary, the rate of temperature rise inside the enclosure can be detected to prevent overheating and provide overload protection for the power equipment. The specific implementation method is as follows:

[0114] Based on this, in one specific embodiment provided in this disclosure, the method further includes:

[0115] The temperatures of multiple enclosures of the power device are obtained;

[0116] The temperature rise rate of the power device is determined based on the temperatures of the multiple enclosures.

[0117] When the temperature rise rate reaches a preset temperature rate threshold, the speed of the second fan is adjusted to the speed threshold.

[0118] The preset temperature rate threshold specifically refers to the upper limit of the temperature rate that the internal temperature of the enclosure can reach, as preset. This preset temperature rate threshold can be customized in practical applications. The speed threshold refers to the upper limit corresponding to the speed of the second fan, for example, a speed of 100%.

[0119] Specifically, the system acquires multiple enclosure temperatures of the power device and determines the temperature rise rate based on these temperatures. If the temperature rise rate reaches a preset threshold, the speed of the second fan can be adjusted to match this threshold to lower the enclosure temperature. For example, if the detected temperature rise rate inside the power device enclosure is greater than or equal to 5 degrees Celsius per second, the speed of the second fan can be adjusted to 100%. Thus, by adjusting the speed of the second fan, the internal temperature of the power device enclosure is reduced, achieving heat dissipation.

[0120] In addition, air pressure sensor data can be obtained from the air pressure sensor, and the speed of the second fan can be adjusted according to the air pressure sensor data. For example, if the air pressure sensor data reaches more than 2000 meters, the speed can be increased by 5% for every 500 meters increase in altitude.

[0121] Furthermore, in one specific embodiment provided in this disclosure, the method further includes:

[0122] The power device's multiple enclosure temperatures within a preset time interval are obtained;

[0123] When the temperatures of all the multiple enclosures reach the preset temperature threshold, a temperature alarm message is generated.

[0124] The preset temperature threshold specifically refers to the upper limit of the internal temperature of the enclosure, set in advance. Temperature alarm messages are used to alert users that the internal temperature of the power equipment enclosure is too high.

[0125] Specifically, the system can acquire the temperatures of multiple enclosures of the power equipment within a preset time interval. If all acquired enclosure temperatures reach the preset temperature threshold, it indicates that the temperature inside the power equipment enclosure is continuously exceeding the set temperature threshold within the preset time interval. At this time, a temperature alarm message can be generated to alert relevant personnel that the temperature inside the power equipment enclosure is too high and to take appropriate action on the power equipment.

[0126] Additionally, a custom baseline temperature threshold can be set, such as 25 degrees Celsius, so that the second fan can be activated after the internal temperature of the enclosure reaches the baseline temperature threshold; a custom full-speed temperature threshold can also be set, such as 65 degrees Celsius, to force the second fan to run at 100% speed.

[0127] The method provided in this disclosure can dynamically adjust the speed of the second fan located outside the power equipment enclosure in a timely manner based on the temperature inside the enclosure, thereby reducing the energy consumption of the second fan and extending its service life.

[0128] Figure 11 This is a block diagram of an electronic device provided in an embodiment of the present disclosure.

[0129] See Figure 11 This disclosure provides an electronic device 1100, which includes: at least one processor 1101; at least one memory 1102; and one or more I / O interfaces 1103 connected between the processor 1101 and the memory 1102; wherein the memory 1102 stores one or more computer programs that can be executed by the at least one processor 1101, and the one or more computer programs are executed by the at least one processor 1101 to enable the at least one processor 1101 to execute the above-described method for adjusting the fan speed of a heat dissipation component.

[0130] The modules in the aforementioned electronic devices can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0131] This disclosure also provides a computer-readable storage medium storing a computer program thereon, wherein the computer program, when executed by a processor / processor core, implements the above-described method for adjusting the fan speed of a heat dissipation component. The computer-readable storage medium may be volatile or non-volatile.

[0132] This disclosure also provides a computer program product, including computer-readable code, or a non-volatile computer-readable storage medium carrying computer-readable code, wherein when the computer-readable code is run in a processor of an electronic device, the processor in the electronic device executes the above-described method for adjusting the fan speed of a heat dissipation component.

[0133] Those skilled in the art will understand that the functional modules / units in the systems and devices disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. In hardware implementations, the division between functional modules / units mentioned in the above description does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed collaboratively by several physical components. Some or all physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable storage medium, which may include computer storage media (or non-transitory media) and communication media (or transient media).

[0134] Example embodiments have been disclosed herein, and while specific terminology has been used, it is for general illustrative purposes only and should not be construed as limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in conjunction with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of this disclosure as set forth by the appended claims.

Claims

1. A heat dissipation component for a power device, characterized in that, include: Heat exchanger, first fan and second fan; The heat exchanger is disposed outside the housing of the power equipment and includes multiple heat dissipation pipes arranged in parallel. Each heat dissipation pipe includes a first heat dissipation part and a second heat dissipation part. The internal channel of the first heat dissipation part communicates with the interior of the housing. The first fan is disposed inside the housing, and the internal channel of the second heat dissipation part is connected to the first fan. The first fan is used to drive the gas inside the housing to flow in the internal air duct, and the internal air duct includes the internal channels of the plurality of heat dissipation pipes. The second fan is disposed outside the housing, with its air inlet or outlet side opposite to the heat exchanger. The second fan is used to drive the gas outside the housing to flow in the external air duct, which includes the external gaps of the plurality of heat dissipation pipes.

2. The heat dissipation assembly as described in claim 1, characterized in that, Each of the heat pipes includes one or more internal channels, and there is an external gap between each of the heat pipes.

3. The heat dissipation assembly as described in claim 2, characterized in that, It also includes an outer cavity, which is disposed outside the housing and communicates with the internal channels of the plurality of heat dissipation pipes. The outer cavity is used to redirect the gas entering the outer cavity.

4. The heat dissipation assembly as described in claim 2, characterized in that, It also includes a baffle, which is disposed outside the housing and vertically connected to the plurality of heat dissipation pipes, and the internal channel is used to deflect the gas entering the internal channel.

5. The heat dissipation assembly as described in claim 1, characterized in that, The heat exchanger is placed on the air outlet side of the second fan; or, the heat exchanger is placed on the air inlet side of the second fan.

6. The heat dissipation assembly as described in claim 1, characterized in that, The second heat dissipation unit is placed on the air inlet side of the first fan; or, the second heat dissipation unit is placed on the air outlet side of the first fan.

7. The heat dissipation assembly as described in claim 1, characterized in that, It also includes an inner cavity, which is disposed inside the housing and communicates with the interior of the housing via the first fan.

8. The heat dissipation assembly as described in claim 7, characterized in that, The inner cavity is located on the air inlet side of the first fan; or, the inner cavity is located on the air outlet side of the first fan.

9. The heat dissipation assembly as described in any one of claims 1-8, characterized in that, The heat dissipation pipe has a flat tube structure.

10. The heat dissipation assembly according to any one of claims 1-9, characterized in that, The thickness of the heat pipe ranges from [0.3mm to 0.6mm]. The length of the heat pipe is in the range of [100mm, 130mm]; The width parameter range of the heat pipe is [3mm, 5mm]; The external clearance parameter range of the heat pipe is [2mm, 5mm].

11. A power device, characterized in that, include: The enclosure and the heat dissipation assembly as described in any one of claims 1-10 above; The housing contains a heating element.

12. A method for adjusting the fan speed of a heat dissipation component, characterized in that, include: The power device acquires a first enclosure temperature at the current moment and a second enclosure temperature at the previous moment, wherein the power device includes a heat dissipation component as described in any one of claims 1-10. Determine the target temperature range corresponding to the temperature of the first enclosure; Based on the target temperature range, the first enclosure temperature, and the second enclosure temperature, the speed to be adjusted for the second fan in the heat dissipation assembly is determined, and the speed of the second fan is adjusted to the speed to be adjusted.

13. The method as described in claim 12, characterized in that, Based on the target temperature range, the first enclosure temperature, and the second enclosure temperature, the adjustment speed of the second fan in the heat dissipation assembly is determined, including: Obtain the temperature fluctuation range; The temperature difference between the boxes is determined based on the temperatures of the first and second boxes. If the temperature difference of the enclosure is not within the temperature fluctuation range, the speed of the second fan to be adjusted is determined based on the target temperature range and the temperature of the first enclosure. If the temperature difference of the enclosure is within the temperature fluctuation range, the current speed of the second fan is determined as the speed to be adjusted.

14. The method as described in claim 12, characterized in that, The method further includes: The temperatures of multiple enclosures of the power device are obtained; The temperature rise rate of the power device is determined based on the temperatures of the multiple enclosures. When the temperature rise rate reaches a preset temperature rate threshold, the speed of the second fan is adjusted to the speed threshold.

15. The method as described in claim 12, characterized in that, The method further includes: The power device's multiple enclosure temperatures within a preset time interval are obtained; When the temperatures of all the multiple enclosures reach the preset temperature threshold, a temperature alarm message is generated.

16. An electronic device, characterized in that, include: At least one processor; as well as A memory communicatively connected to the at least one processor; wherein, The memory stores one or more computer programs that can be executed by the at least one processor to enable the at least one processor to perform the method as described in any one of claims 12-15.

17. A computer-readable storage medium having a computer program stored thereon, characterized in that, The computer program, when executed by a processor, implements the method as described in any one of claims 12-15.

Images