Processing method and squaring device for silicon rod edge scrap

Abstract

The application discloses a processing method and a square opening device for silicon rod edge skin materials, and the processing method comprises the following steps: fixing a plurality of silicon rod edge skin materials on a material plate; the plurality of silicon rod edge skin materials extend along a first direction, the plurality of silicon rod edge skin materials comprise a plurality of first edge skin materials and a plurality of second edge skin material groups, and the plurality of first edge skin materials and the plurality of second edge skin material groups are arranged at intervals along a second direction; adjusting the position of a cutting device according to required forming silicon rod parameters; and cutting the silicon rod edge skin materials along the first direction by the cutting device. The arrangement mode of the plurality of silicon rod edge skin materials on the material plate is optimized, the number of the plurality of silicon rod edge skin materials on the material plate is increased, the production efficiency of the silicon rod edge skin materials is effectively improved, meanwhile, the cutting device can adjust the position according to the forming silicon rod parameters, the practicability of the cutting device is improved, the cutting device can process the silicon rod edge skin materials with a relatively short length, the utilization rate of the silicon rod edge skin materials is improved, and the processing cost is saved.

Description

Technical Field

[0001] This invention relates to the field of silicon rod edge material processing technology, and in particular to a processing method and squaring equipment for silicon rod edge material. Background Technology

[0002] In the existing technology, the squaring equipment cannot process short silicon rod edge materials, and the squaring equipment cannot remove the arc top and arc edge at the same time, resulting in low utilization rate and low production efficiency of silicon rod edge materials. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of the present invention is to provide a method for processing silicon rod edge scrap that can improve the production efficiency of silicon rod edge scrap.

[0004] The second objective of this invention is to provide a squaring device that can improve the utilization rate of silicon rod edge material.

[0005] A method for processing silicon rod edge material according to a first aspect embodiment of the present invention includes: Multiple silicon rod edge pieces are fixed on a material plate: the multiple silicon rod edge pieces extend along a first direction, the multiple silicon rod edge pieces include multiple first edge pieces and multiple second edge piece groups, the multiple first edge pieces and the multiple second edge piece groups are spaced apart along a second direction, the multiple first edge pieces are arranged along the second direction adjacent to the edge region of the material plate, the multiple second edge piece groups are arranged along the second direction between the multiple first edge pieces, each second edge piece group includes two second edge pieces, both the first edge pieces and the second edge pieces have a first cut surface and a second cut surface, the area of ​​the first cut surface is larger than the area of ​​the second cut surface, the first cut surfaces of the two second edge pieces in the same second edge piece group are arranged along the second direction toward the side adjacent to each other, and the first cut surfaces of adjacent first edge pieces and second edge pieces are arranged along the second direction toward the side away from each other; Adjust the position of the cutting device according to the required silicon rod molding parameters; The cutting device cuts the silicon rod edge material along a first direction.

[0006] According to the processing method of silicon rod edge material according to the embodiments of the present invention, by optimizing the arrangement of multiple silicon rod edge materials on the material plate, the number of silicon rod edge materials on the material plate can be increased, effectively improving the production efficiency of silicon rod edge materials. At the same time, the cutting device can adjust its position according to the forming silicon rod parameters, improving the practicality of the cutting device. The cutting device can process silicon rod edge materials with shorter lengths, improving the utilization rate of silicon rod edge materials and saving processing costs.

[0007] In some embodiments, before fixing the plurality of silicon rod edge pieces onto the material plate, the method further includes: forming a plurality of first clearance grooves and a plurality of second clearance grooves on the material plate, wherein the plurality of second clearance grooves are uniformly and spaced apart along a third direction; wherein the plurality of first clearance grooves are spaced apart along a second direction, and the arc-shaped top of the silicon rod edge piece is disposed adjacent to the first clearance groove.

[0008] In some embodiments, before fixing the plurality of silicon rod edge strips onto the material plate, the method includes: using a measuring tool to detect and adjust the silicon rod edge strips so that the first cut surface is perpendicular to the material plate; the arcuate top of the silicon rod edge strips is at least partially located in the first clearance groove.

[0009] In some embodiments, the method of adjusting the position of the cutting device according to the required silicon rod forming parameters includes: the first cutting line of the cutting device is opposite to the first clearance groove along the first direction, and the second cutting line of the cutting device is opposite to the second clearance groove along the first direction.

[0010] In some embodiments, after fixing the plurality of silicon rod edge materials onto the material plate, the method includes: fixing the material plate with the silicon rod edge materials on it onto a base.

[0011] In some embodiments, the cutting device cuts the silicon rod edge material along a first direction, the method comprising: the first cutting line of the cutting device cutting the second cut surface along the first direction to remove the arc-shaped top of the silicon rod edge material; the second cutting line of the cutting device cutting the second cut surface along the first direction to remove the arc-shaped edge of the silicon rod edge material.

[0012] In some embodiments, after the cutting device cuts the silicon rod edge material along a first direction, the method includes: removing the arc-shaped top and the arc-shaped edge of the silicon rod edge material; and obtaining the shaped silicon rod.

[0013] In some embodiments, after removing the arc-shaped top and the arc-shaped edge of the silicon rod edge material and before obtaining the shaped silicon rod, the method includes: forming a semi-finished silicon rod after removing the arc-shaped top and the arc-shaped edge of the silicon rod edge material; performing a surface finishing process on the semi-finished silicon rod; bonding multiple surface-finished semi-finished silicon rods together; cutting the semi-finished silicon rod; polishing the semi-finished silicon rod; and obtaining the shaped silicon rod.

[0014] According to a second aspect of the present invention, the squaring apparatus processes silicon rod edge material using the silicon rod edge material processing method described above. The squaring apparatus includes: a base, a material plate, and a cutting device. The material plate is disposed on the base and includes a plurality of first clearance grooves and a plurality of second clearance grooves, which are perpendicularly arranged. The cutting device includes a plurality of first cutting lines and a plurality of second cutting lines, which are perpendicular to each other. The plurality of first cutting lines and the plurality of first clearance grooves are respectively arranged opposite to each other along a first direction, and the plurality of second cutting lines and the plurality of second clearance grooves are respectively arranged opposite to each other along a first direction.

[0015] In some embodiments, the plurality of first cutting lines include a plurality of cutting line groups, the plurality of cutting line groups being spaced apart along a second direction, the cutting line groups being used to cut two silicon rod edge pieces whose arc-shaped tops are adjacent to each other; the cutting line groups are located between two adjacent second edge piece groups, and / or, the cutting line groups are located between adjacent first edge pieces and second edge piece groups.

[0016] In some embodiments, the plurality of cutting line groups include a first sub-cutting line and a second sub-cutting line, wherein the distance between the first sub-cutting line and the second sub-cutting line along the second direction is less than the distance between two adjacent cutting line groups.

[0017] In some embodiments, the squaring device further includes an adhesive member disposed between the silicon rod edge material and the material plate.

[0018] In some embodiments, the adhesive is a boilable adhesive stick.

[0019] In some embodiments, the distance between the first cut surface of the silicon rod edge material adjacent to the edge of the material plate along the second direction and the corresponding side edge of the material plate is L1, wherein L1 satisfies: 45mm≤L1≤50mm; and / or, along the second direction, the distance between the first cut surface of the silicon rod edge material and the adjacent first clearance groove is L2, wherein L2 satisfies: 45mm≤L2≤50mm; and / or, along the third direction, the distance between the silicon rod edge material adjacent to the edge of the material plate and the corresponding side edge of the material plate is L3, wherein L3 satisfies: 45mm≤L3≤50mm.

[0020] In some embodiments, one of the base and the material plate is provided with a limiting groove, and the other of the base and the material plate is provided with a limiting protrusion, the limiting protrusion cooperating with the limiting groove.

[0021] In some embodiments, the distance between the first cutting line and the second cutting line along the first direction is L4, wherein L4 satisfies: 20mm≤L4≤30mm.

[0022] In some embodiments, the depth of the first clearance groove is H1, wherein H1 satisfies: 20mm≤H1≤30mm; and / or, the depth of the second clearance groove is H2, wherein H2 satisfies: 20mm≤H2≤30mm.

[0023] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a flowchart of a method for processing silicon rod edge material according to an embodiment of the present invention; Figure 2 This is a schematic diagram of a material plate with silicon rod edge material fixedly placed on a base according to an embodiment of the present invention; Figure 3 This is a schematic diagram showing that a plurality of first clearance grooves and a plurality of second clearance grooves are formed on a material plate according to an embodiment of the present invention; Figure 4 This is a schematic diagram of a base according to an embodiment of the present invention; Figure 5 This is a schematic diagram of a cutting device according to an embodiment of the present invention cutting silicon rod edge material along a first direction; Figure 6 This is a schematic diagram of silicon rod edge material after being cut by a cutting device according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of a semi-finished silicon rod according to an embodiment of the present invention.

[0025] Figure label: 10. Silicon rod edge material; 11. First edge material; 12. Second edge material; 13. First cut surface; 14. Second cut surface; 15. Arc-shaped top; 16. Arc-shaped edge; 17. Semi-finished silicon rod; 18. Second edge material assembly; 20. Cutting device; 21. Material plate; 22. Base; 23. Limiting groove; 24. Limiting protrusion; 30. First clearance slot; 31. Clearance slot group; 32. First sub-clearance slot; 33. Second sub-clearance slot; 34. Second clearance slot; 40. First cutting line; 41. Cutting line group; 42. First sub-cutting line; 43. Second sub-cutting line; 44. Second cutting line; A. First direction; B. Second direction; C. Third direction. Detailed Implementation

[0026] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Figures 1-7 A method for processing silicon rod edge material 10 according to an embodiment of the present invention is described.

[0027] The processing method for silicon rod edge material 10 includes: Multiple silicon rod edge strips 10 are fixed on the material plate 21: the multiple silicon rod edge strips 10 extend along the first direction A, the multiple silicon rod edge strips 10 include multiple first edge strips 11 and multiple second edge strip groups 18, the multiple first edge strips 11 and multiple second edge strip groups 18 are spaced apart along the second direction B, the multiple first edge strips 11 are arranged along the second direction B adjacent to the edge area of ​​the material plate 21, the multiple second edge strip groups 18 are arranged along the second direction B between the multiple first edge strips 11, each second edge strip group 18 includes two second edge strips 12, the first edge strips 11 and the second edge strips 12 both have a first cut surface 13 and a second cut surface 14, the area of ​​the first cut surface 13 is larger than the area of ​​the second cut surface 14, the first cut surfaces 13 of the two second edge strips 12 of the same second edge strip group 18 are arranged along the second direction B toward the side adjacent to each other, the first cut surfaces 13 of adjacent first edge strips 11 and second edge strips 12 are arranged along the second direction B toward the side away from each other; Adjust the position of the cutting device 20 according to the required silicon rod molding parameters; The cutting device 20 cuts the silicon rod edge material 10 along the first direction A.

[0028] Figure 2 and Figure 6 The first direction A shown is the length direction of the silicon rod edge material 10, and the second direction B is the width direction of the material plate 21. The second direction B is perpendicular to the first direction A. The silicon rod edge material 10 includes a first cross-section 13 with a rectangular cross-section, an arc surface opposite to the first cross-section 13 along the second direction B, and two crescent-shaped end faces, i.e., second cross-sections 14, spaced apart along the first direction A. The connection between the first cross-section 13 and the arc surface is an arc-shaped edge 16, and the part of the arc surface located between the arc-shaped edges 16 on both sides of the silicon rod edge material 10 is an arc-shaped top 15. The second cross-sections 14 of multiple first edge materials 11 are respectively fixed to both ends of the material plate 21 along the second direction B, and the first edge materials 11 at both ends are along... Figure 2 The third direction C shown is spaced and aligned, and the third direction C is the length direction of the material plate 21. The third direction C and the second direction B are perpendicular to each other. The first cut surface 13 of the first edge material 11 located on one side edge of the material plate 21 along the second direction B and the first cut surface 13 of the first edge material 11 located on the other side edge of the material plate 21 are respectively located on the side away from each other.

[0029] Multiple second edge material groups 18 are spaced apart along the second direction B between the first edge material groups 11 at both ends of the material plate 21 along the second direction B and aligned with the first edge material groups 11 along the second direction B. The multiple second edge material groups 18 are spaced apart and aligned along the third direction C. The first cut surfaces 13 of the two second edge material groups 18 are spaced apart along the second direction B towards each other. The first cut surfaces 13 of the two adjacent second edge material groups 18 are spaced apart along the second direction B towards the direction away from each other. In this application, the first edge material groups 11 and the second edge material groups 12 are vertically arranged on the material plate 21 along the length direction or axial direction to facilitate cutting.

[0030] Then, adjust the relative position of the cutting device 20 and the silicon rod edge material 10 according to the actual needs of the formed silicon rod, and run the cutting device 20 so that the cutting device 20 moves towards the silicon rod edge material 10 along the first direction A to cut the arc-shaped edges 16 and arc-shaped tops 15 of multiple silicon rod edge materials 10.

[0031] In this embodiment, the silicon rod edge material 10 and the material plate 21 can be fixed by adhesive bonding, and the cutting device 20 is suitable for cutting silicon rod edge material 10 with a length of less than or equal to 500 mm along the first direction A.

[0032] According to the processing method of silicon rod edge material 10 of the present invention, by optimizing the arrangement of multiple silicon rod edge material 10 on the material plate 21, the number of silicon rod edge material 10 on the material plate 21 can be increased, effectively improving the production efficiency of silicon rod edge material 10. At the same time, the cutting device 20 can adjust its position according to the forming silicon rod parameters, improving the practicality of the cutting device 20. In addition, since the cutting device 20 cuts the silicon rod edge material 10 along the length direction of the silicon rod edge material 10, it is convenient to process silicon rod edge material 10 with different length parameters, improving the utilization rate of silicon rod edge material 10 and saving processing costs.

[0033] According to some embodiments of the present invention, such as Figure 3 and Figure 6 As shown, before fixing multiple silicon rod edge pieces 10 onto the material plate 21, the method further includes: opening multiple first clearance grooves 30 and multiple second clearance grooves 34 on the material plate 21, the multiple second clearance grooves 34 being evenly and spaced along a third direction C; the multiple first clearance grooves 30 being spaced along a second direction B, and the arc-shaped top 15 of the silicon rod edge pieces 10 being adjacent to the first clearance grooves 30.

[0034] Multiple second clearance grooves 34 extend along the second direction B and are spaced apart along the third direction C. The spacing between any two second clearance grooves 34 along the third direction C is the same. Multiple first clearance grooves 30 include multiple clearance groove groups 31. Multiple clearance groove groups 31 extend along the third direction C and are spaced apart along the second direction B. The clearance groove groups 31 are located between two adjacent second side material groups 18 and between adjacent first side material groups 11 and second side material groups 18. The clearance groove group 31 includes a first sub-clearance groove 32 and a second sub-clearance groove 33. Multiple first sub-clearance grooves 32 and multiple second sub-clearance grooves 33 are alternately arranged along the second direction B. The spacing between the first sub-clearance grooves 32 and the second sub-clearance grooves 33 in the clearance groove group 31 along the second direction B is less than the minimum spacing between two adjacent clearance groove groups 31, that is, less than the spacing between the adjacent first sub-clearance grooves 32 and second sub-clearance grooves 33 of two adjacent clearance groove groups 31. In this embodiment, the spacing between two adjacent second clearance grooves 34 along the third direction C and the spacing between the first sub-clearance groove 32 and the second sub-clearance groove 33 in the clearance groove group 31 along the second direction B can be adjusted according to the required molding silicon rod parameters.

[0035] Therefore, by opening multiple first clearance grooves 30 and multiple second clearance grooves 34 on the material plate 21, it is convenient to position multiple silicon rod edge pieces 10 on the material plate 21, thereby improving positioning accuracy and operating efficiency. At the same time, it is convenient to avoid the mutual clearance between different cutting lines of the cutting device 20, and to facilitate the complete removal of the arc-shaped top 15 and arc-shaped edge 16 of the silicon rod edge pieces 10 by the cutting device 20.

[0036] According to some embodiments of the present invention, such as Figure 2 As shown, before fixing multiple silicon rod edge pieces 10 onto the material plate 21, the method includes: using a measuring tool to detect and adjust the silicon rod edge pieces 10 so that the first cut surface 13 is set perpendicular to the material plate 21; the arc-shaped top 15 of the silicon rod edge pieces 10 is at least partially located in the first clearance groove 30.

[0037] Before fixing the second cut surfaces 14 of the multiple first edge strips 11 onto the material plate 21, a right-angle ruler or other measuring tool for measuring perpendicularity should be used to check whether the first cut surfaces 13 are perpendicular to the material plate 21, and the silicon rod edge strips 10 should be adjusted according to the actual situation. In this embodiment, the arc-shaped edges 16 of the silicon rod edge strips 10 along the third direction C protrude from the adjacent second clearance grooves 34, and the arc-shaped tops 15 of the silicon rod edge strips 10 protrude from the adjacent first clearance grooves 30 along the second direction B. That is, at least a portion of the projection of the arc-shaped edges 16 of the silicon rod edge strips 10 lies in the plane where the second clearance grooves 34 are located, and at least a portion of the projection of the arc-shaped tops 15 of the silicon rod edge strips 10 lies in the plane where the first clearance grooves 30 are located.

[0038] Therefore, by using measuring tools to detect and adjust the silicon rod edge material 10, it can be ensured that the first cut surface 13 of the silicon rod edge material 10 is perpendicular to the material plate 21, and that the silicon rod edge material 10 is fixed on the material plate 21 along the first direction A, maintaining the verticality and horizontality of the silicon rod edge material 10 vertically set on the material plate 21, thereby improving the yield of the silicon rod edge material 10 after cutting.

[0039] According to some embodiments of the present invention, such as Figure 3 and Figure 5 As shown, the position of the cutting device 20 is adjusted according to the required silicon rod molding parameters. The method includes: the first cutting line 40 of the cutting device 20 is opposite to the first clearance groove 30 along the first direction A, and the second cutting line 44 of the cutting device 20 is opposite to the second clearance groove 34 along the first direction A.

[0040] The cutting device 20 includes a plurality of first cutting lines 40 and a plurality of second cutting lines 44. The plurality of first cutting lines 40 extend along a third direction C and are spaced apart along a second direction B. The plurality of first cutting lines 40 are positioned above the material plate 21 along a first direction A and are positioned opposite to a plurality of first clearance grooves 30. The plurality of second cutting lines 44 extend along the second direction B and are spaced evenly along a third direction C. The plurality of second cutting lines 44 are positioned above the material plate 21 along the first direction A and are positioned opposite to a plurality of second clearance grooves 34.

[0041] Therefore, by adjusting the position of the cutting device 20 so that the first cutting line 40 is opposite to the first clearance groove 30 along the first direction A, and the second cutting line 44 is opposite to the second clearance groove 34 along the first direction A, the positioning efficiency of the first cutting line 40 and the second cutting line 44 of the cutting device 20 is improved, ensuring that the arc-shaped edge 16 and arc-shaped top 15 of the silicon rod edge material 10 are completely removed, thereby improving the cutting accuracy and reliability of the cutting device 20.

[0042] According to some embodiments of the present invention, such as Figure 2 As shown, after fixing multiple silicon rod edge strips 10 onto the material plate 21, the method includes: fixing the material plate 21 with silicon rod edge strips 10 onto the base 22.

[0043] In this embodiment, the material plate 21 includes a first surface and a second surface, which are spaced apart along a first direction A. The first surface is adapted to fix silicon rod edge strips 10, and the second surface is adapted to cooperate with the base 22. After multiple silicon rod edge strips 10 are fixed on the material plate 21, the material plate 21 with multiple silicon rod edge strips 10 is placed on the base 22 along the first direction A, so that the second surface of the material plate 21 cooperates with the base 22 along the first direction A to fix the material plate 21.

[0044] Therefore, by fixing the material plate 21 with silicon rod edge material 10 on the base 22, the distance between the silicon rod edge material 10 on the material plate 21 and the cutting device 20 can be shortened, the cutting efficiency can be improved, and at the same time, the limiting of the material plate 21 in the second direction B is increased, so as to avoid the material plate 21 from shaking during the cutting process and improve the stability and reliability of the cutting process.

[0045] According to some embodiments of the present invention, such as Figure 5 As shown, the cutting device 20 cuts the silicon rod edge material 10 along the first direction A. The method includes: the first cutting line 40 of the cutting device 20 cuts the second cutting surface 14 along the first direction A to remove the arc-shaped top 15 of the silicon rod edge material 10; the second cutting line 44 of the cutting device 20 cuts the second cutting surface 14 along the first direction A to remove the arc-shaped edge 16 of the silicon rod edge material 10.

[0046] The first cutting line 40 sequentially cuts the second cut surface 14 on the side away from the material plate 21 and the second cut surface 14 fixed on the material plate 21 along the first direction A, and then runs into the first clearance groove 30 to remove the arc-shaped top 15 of the silicon rod edge material 10; the second cutting lines 44 on both sides adjacent to the silicon rod edge material 10 sequentially cut the second cut surface 14 on the side away from the material plate 21 and the second cut surface 14 fixed on the material plate 21 along the first direction A, and then run into the second clearance groove 34 to remove the arc-shaped edge 16 of the silicon rod edge material 10 along the third direction C.

[0047] Optionally, the first cutting line 40 and the second cutting line 44 are spaced apart along the first direction A.

[0048] Therefore, by cutting the two second cut surfaces 14 of the silicon rod edge material 10 along the first direction A through the first cutting line 40 and the second cutting line 44 of the cutting device 20, the cutting device 20 can simultaneously remove the arc-shaped top 15 and arc-shaped edge 16 of the silicon rod edge material 10, thereby improving the cutting efficiency of the silicon rod edge material 10 and the production efficiency of the cutting device 20.

[0049] According to some embodiments of the present invention, after the cutting device 20 cuts the silicon rod edge material 10 along the first direction A, the method includes: removing the arc-shaped top 15 and arc-shaped edge 16 of the silicon rod edge material 10; and obtaining a shaped silicon rod.

[0050] That is, the first cutting line 40 and the second cutting line 44 of the cutting device 20 cut the second cut surface 14 on the side of the silicon rod edge material 10 away from the material plate 21 and the second cut surface 14 fixed on the material plate 21 in sequence along the first direction A toward the material plate 21, and respectively run to a certain depth of the first clearance groove 30 and the second clearance groove 34 to remove the arc-shaped top 15 and arc-shaped edge 16 of the silicon rod edge material 10. Then, the first cutting line 40 and the second cutting line 44 run along the first direction A toward the side away from the material plate 21 until they are reset. Then, the arc-shaped top 15 and arc-shaped edge 16 are placed in a special circulating material box. The silicon rod edge material 10 with the arc-shaped top 15 and arc-shaped edge 16 removed can be processed to obtain a shaped silicon rod.

[0051] Therefore, after the silicon rod edge material 10 is cut along the first direction A by the cutting device 20, the arc-shaped top 15 and arc-shaped edge 16 of the silicon rod edge material 10 can be removed on the same equipment, which effectively improves the production efficiency of the silicon rod edge material 10.

[0052] According to some embodiments of the present invention, such as Figure 1 As shown, after removing the arc-shaped top 15 and arc-shaped edge 16 of the silicon rod edge material 10 and before obtaining the shaped silicon rod, the method includes: forming a semi-finished silicon rod 17 after removing the arc-shaped top 15 and arc-shaped edge 16 of the silicon rod edge material 10; performing a surface finishing process on the semi-finished silicon rod 17; bonding multiple surface-finished semi-finished silicon rods 17 together; cutting the semi-finished silicon rod 17; polishing the semi-finished silicon rod 17; and obtaining the shaped silicon rod.

[0053] After the cutting device 20 cuts the silicon rod edge material 10 along the first direction A, it removes the arc-shaped top 15 and arc-shaped edge 16 of the silicon rod edge material 10 to obtain a semi-finished silicon rod 17. The semi-finished silicon rod 17 is then surface-finished by grinding and smoothing the cut surface using a surface-finishing machine. After surface-finishing, the semi-finished silicon rod 17 needs to be cleaned and dried by a cleaning machine. After drying, multiple semi-finished silicon rods 17 are bonded together. The multiple semi-finished silicon rods 17 are arranged along the thickness direction and bonded together in sequence. After bonding, they are cured. After curing, the bonding and cutting machine cuts the semi-finished silicon rods 17 along the arrangement direction of the multiple semi-finished silicon rods 17 according to the forming silicon rod parameters. After cutting, the semi-finished silicon rods 17 are polished by a grinding machine to obtain a formed silicon rod.

[0054] Therefore, by sequentially performing surface finishing, bonding, cutting and polishing on the semi-finished silicon rod 17, burrs and surface scratches on the semi-finished silicon rod 17 can be removed, thereby improving the production quality and yield of the shaped silicon rod.

[0055] According to a second aspect embodiment of the present invention, the squaring device processes silicon rod edge material 10 using the processing method of silicon rod edge material 10 described above. The squaring device includes: a base 22, a material plate 21, and a cutting device 20. The material plate 21 is disposed on the base 22 and includes a plurality of first clearance grooves 30 and a plurality of second clearance grooves 34, which are arranged perpendicularly. The cutting device 20 includes a plurality of first cutting lines 40 and a plurality of second cutting lines 44, which are perpendicular to each other. The plurality of first cutting lines 40 and the plurality of first clearance grooves 30 are respectively arranged opposite to each other along a first direction A, and the plurality of second cutting lines 44 and the plurality of second clearance grooves 34 are respectively arranged opposite to each other along the first direction A.

[0056] In this embodiment, the specific positions of multiple first clearance grooves 30 and multiple second clearance grooves 34 are first adjusted according to the required silicon rod molding parameters. A measuring tool is used to detect and adjust the silicon rod edge material 10 so that it is perpendicular to the material plate 21. Multiple silicon rod edge materials 10 are fixed on the material plate 21 according to a certain arrangement direction. The arc-shaped edges 16 of the silicon rod edge material 10 along the third direction C protrude from the adjacent second clearance grooves 34, and the arc-shaped tops 15 of the silicon rod edge material 10 protrude from the adjacent first clearance grooves 30 along the second direction B. Then, the material plate 21 is placed on the base 22 along the first direction A. Multiple first cutting lines 40 and multiple second cutting lines 44 are respectively arranged opposite to the multiple first clearance grooves 30 and multiple second clearance grooves 34 along the first direction A. When the cutting device 20 is in its initial state, multiple first cutting lines 40 and multiple second cutting lines 44 are all arranged above the material plate 21 along the first direction A, and the multiple first cutting lines 40 along the first direction A... When the cutting device 20 is in operation, the first cutting line 40 and the second cutting line 44 are positioned above the multiple second cutting lines 44. According to the preset process line speed, cutting position, and feed speed, the first cutting line 40 and the second cutting line 44 cut the second cut surface 14 on the side of the silicon rod edge material 10 away from the material plate 21 and the second cut surface 14 fixed on the material plate 21 in the direction of the first cutting line speed, cutting position, and feed speed, until they penetrate a certain distance into the multiple first clearance grooves 30 and the multiple second clearance grooves 34, so as to completely remove the arc-shaped top 15 and arc-shaped edge 16 of the multiple silicon rod edge material 10 and form multiple semi-finished silicon rods 17. Then, the multiple first cutting lines 40 and the multiple second cutting lines 44 all run to the initial position in the direction of the first cutting line A away from the material plate 21, place the arc-shaped top 15 and arc-shaped edge 16 in a special circulating material box, and perform surface finishing, bonding, cutting and polishing treatment on the semi-finished silicon rods 17 in sequence to obtain the shaped silicon rod.

[0057] Therefore, by using the processing method of silicon rod edge material 10 in the above embodiment, the squaring equipment can simultaneously remove the arc-shaped tops 15 and arc-shaped edges 16 of multiple silicon rod edge materials 10, effectively improving the processing efficiency of silicon rod edge materials 10. At the same time, it can process silicon rod edge materials 10 with shorter lengths, improving the utilization rate of silicon rod edge materials 10 and saving processing costs.

[0058] In this application, the squaring equipment may use a material plate 21 with a specification of 1230mm×1230mm.

[0059] According to some embodiments of the present invention, such as Figure 5 As shown, the plurality of first cutting lines 40 include a plurality of cutting line groups 41, which are spaced apart along the second direction B. The cutting line groups 41 are used to cut two adjacent silicon rod edge skins 10 of the arc-shaped top 15. The cutting line groups 41 are located between two adjacent second edge skin groups 18, or the cutting line groups 41 are located between adjacent first edge skins 11 and second edge skin groups 18.

[0060] In this embodiment, the cutting line group 41 is disposed between two adjacent second edge material groups 18 and between adjacent first edge material groups 11 and second edge material groups 18. Multiple cutting line groups 41 extend along a third direction C and are spaced apart along a second direction B. The cutting line group 41 is suitable for cutting two adjacent arc-shaped tops 15 of two adjacent silicon rod edge material groups 10. Therefore, by setting the cutting line group 41, it is convenient to simultaneously cut the arc-shaped tops 15 of multiple silicon rod edge material groups 10, effectively improving cutting efficiency.

[0061] According to some embodiments of the present invention, such as Figure 5 As shown, the multiple cutting line groups 41 include a first sub-cutting line 42 and a second sub-cutting line 43. The distance between the first sub-cutting line 42 and the second sub-cutting line 43 along the second direction B is smaller than the distance between two adjacent cutting line groups 41.

[0062] Multiple first cutting lines 40 and multiple first clearance grooves 30 are arranged opposite to each other along the first direction A, that is, multiple cutting line groups 41 and multiple clearance groove groups 31 are arranged opposite to each other along the first direction A. The distance between the first sub-cutting line 42 and the second sub-cutting line 43 in the cutting line group 41 along the second direction B is smaller than the distance between two adjacent sub-cutting lines in two adjacent cutting line groups 41 along the second direction B.

[0063] Therefore, by setting the spacing between the first sub-cutting line 42 and the second sub-cutting line 43 along the second direction B to be smaller than the spacing between two adjacent cutting line groups 41, the number of silicon rod edge pieces 10 placed on the material plate 21 can be increased, thereby improving the production efficiency of the squaring equipment.

[0064] According to some embodiments of the present invention, the squaring device further includes an adhesive component disposed between the silicon rod edge material 10 and the material plate 21.

[0065] That is, the adhesive is disposed along the first direction A between the second cut surface 14 of the silicon rod edge material 10 and the material plate 21 on the side adjacent to the material plate 21, and the size of the adhesive is adapted to the size of the second cut surface 14. Thus, by disposing the adhesive between the silicon rod edge material 10 and the material plate 21, the connection strength between the silicon rod edge material 10 and the material plate 21 can be effectively improved, and the silicon rod edge material 10 can be prevented from shaking when the cutting device 20 cuts the silicon rod edge material 10.

[0066] Furthermore, the adhesive is a water-boiling type adhesive stick.

[0067] According to some embodiments of the present invention, the distance between the first cut surface 13 of the silicon rod edge material 10, i.e. the first edge material 11, adjacent to the edge of the material plate 21 along the second direction B and the corresponding side edge of the material plate 21 is L1, and L1 satisfies: 45mm≤L1≤50mm.

[0068] When the distance between the first cut surface 13 of the first edge material 11 and the corresponding side edge of the material plate 21 is less than 45mm, the distance is too small, which may cause the first cutting line 40 to fail to completely remove the arc-shaped top 15 of the first edge material 11. When the distance between the first cut surface 13 of the first edge material 11 and the corresponding side edge of the material plate 21 is greater than 50mm, the distance is too large, which may cause the first cutting line 40 to cut too much of the first edge material 11, easily resulting in waste. For example, L1 = 47.5mm.

[0069] Therefore, by limiting the distance range between the first cut surface 13 of the silicon rod edge material 10 adjacent to the edge of the material plate 21 along the second direction B and the corresponding side edge of the material plate 21, it can be ensured that the first cutting line 40 completely removes the arc-shaped top 15, while avoiding waste and saving production costs.

[0070] Optionally, along the second direction B, the distance between the first cut surface 13 of the silicon rod edge material 10 and the adjacent first clearance groove 30 is L2, where L2 satisfies: 45mm≤L2≤50mm.

[0071] Along the second direction B, when the distance between the first cut surface 13 of the silicon rod edge material 10 and the adjacent first clearance groove 30 is less than 45mm, the distance is too small, which may cause the first cutting line 40 to cut too much of the silicon rod edge material 10, easily resulting in waste. When the distance between the first cut surface 13 of the silicon rod edge material 10 and the adjacent first clearance groove 30 is greater than 50mm, the distance is too large, which may cause the first cutting line 40 to be unable to completely remove the arc-shaped top 15 of the silicon rod edge material 10, resulting in a low yield of the formed silicon rod. For example, L2 = 49mm.

[0072] Therefore, by limiting the distance range between the first cut surface 13 of the silicon rod edge material 10 along the second direction B and the adjacent first clearance groove 30, the first cutting line 40 can be prevented from cutting the silicon rod edge material 10 too much, thereby improving the utilization rate of the silicon rod edge material 10 and saving costs. At the same time, it ensures that the first cutting line 40 completely removes the arc-shaped top 15, thereby improving the production yield.

[0073] Optionally, the distance between the silicon rod edge material 10 adjacent to the edge of the material plate 21 along the third direction C and the corresponding side edge of the material plate 21 is L3, where L3 satisfies: 45mm≤L3≤50mm.

[0074] When the distance between the silicon rod edge material 10 adjacent to the edge of the material plate 21 along the third direction C and the corresponding side edge of the material plate 21 is less than 45mm, the distance is too small, which may cause the second cutting line 44 to cut too much silicon rod edge material 10, resulting in waste of silicon rod edge material 10. When the distance between the silicon rod edge material 10 adjacent to the edge of the material plate 21 along the third direction C and the corresponding side edge of the material plate 21 is greater than 50mm, the distance is too large, which may cause the second cutting line 44 to be unable to completely remove the arc-shaped edge 16 of the silicon rod edge material 10. For example, L3 = 48.5mm.

[0075] Therefore, by limiting the distance range between the silicon rod edge material 10 adjacent to the edge of the material plate 21 along the third direction C and the corresponding side edge of the material plate 21, it is ensured that the second cutting line 44 completely removes the arc edge 16 of the silicon rod edge material 10, while avoiding cutting too much silicon rod edge material 10 by the second cutting line 44, thus avoiding waste and saving production costs.

[0076] Optionally, L1 satisfies: 45mm≤L1≤50mm, while L2 satisfies: 45mm≤L2≤50mm, and L3 satisfies: 45mm≤L3≤50mm. This further ensures that the first cutting line 40 completely removes the arc-shaped top 15 and the second cutting line 44 completely removes the arc-shaped edge 16, while also saving production costs.

[0077] According to some embodiments of the present invention, such as Figure 3 and Figure 4 As shown, one of the base 22 and the material plate 21 is provided with a limiting groove 23, and the other of the base 22 and the material plate 21 is provided with a limiting protrusion 24. The limiting protrusion 24 and the limiting groove 23 cooperate with each other.

[0078] For example, a limiting groove 23 is provided in the middle area of ​​one side surface of the base 22 adjacent to the material plate 21. The limiting groove 23 extends along the third direction C. A plurality of limiting protrusions 24 are provided at intervals along the second direction B on the second surface of the material plate 21. The plurality of limiting protrusions 24 extend along the third direction C. The limiting protrusions 24 located in the middle area of ​​the second surface and the limiting groove 23 of the base 22 form a snap-fit ​​engagement with each other along the first direction A.

[0079] Therefore, by setting a limiting groove 23 on one of the base 22 and the material plate 21, and setting a limiting protrusion 24 on the other of the base 22 and the material plate 21, it is convenient to fix the material plate 21 on the base 22, thereby improving the connection strength and reliability between the material plate 21 and the base 22, and improving the stability and reliability of the cutting process.

[0080] According to some embodiments of the present invention, the distance between the first cutting line 40 and the second cutting line 44 along the first direction A is L4, and L4 satisfies: 20mm≤L4≤30mm.

[0081] When the distance between the first cutting line 40 and the second cutting line 44 along the first direction A is less than 20mm, the distance between the first cutting line 40 and the second cutting line 44 along the first direction A is too small, which may cause interference between the first cutting line 40 and the second cutting line 44. When the distance between the first cutting line 40 and the second cutting line 44 along the first direction A is greater than 30mm, the distance between the first cutting line 40 and the second cutting line 44 along the first direction A is too large, which may cause the first cutting line 40 or the second cutting line 44 to fail to completely remove the arc-shaped top 15 or arc-shaped edge 16 of the silicon rod edge material 10 along the first direction A. For example, L4 = 25mm.

[0082] Therefore, by limiting the spacing range between the first cutting line 40 and the second cutting line 44 along the first direction A, interference between the first cutting line 40 and the second cutting line 44 can be avoided, improving the safety and reliability of the squaring equipment. At the same time, it ensures that the first cutting line 40 and the second cutting line 44 completely remove the arc-shaped top 15 and arc-shaped edge 16 of the silicon rod edge material 10 along the first direction A, thereby improving the production yield.

[0083] According to some embodiments of the present invention, the depth of the first clearance groove 30 is H1, and H1 satisfies: 20mm≤H1≤30mm.

[0084] Along the first direction A, when the depth of the first clearance groove 30 is less than 20mm, the depth of the first clearance groove 30 is too small, which may cause wear between the first clearance groove 30 and the first cutting line 40, reducing the service life of the cutting equipment; when the depth of the first clearance groove 30 is greater than 30mm, the depth of the first clearance groove 30 is too large, which may reduce the structural strength of the material plate 21 and reduce the stability of the cutting process. For example, H1=25mm.

[0085] Optionally, the depth of the second clearance groove 34 is H2, where H2 satisfies: 20mm ≤ H2 ≤ 30mm. When the depth of the second clearance groove 34 is less than 20mm, it is too shallow and may cause wear between the second clearance groove 34 and the second cutting line 44, reducing the service life of the cutting equipment. When the depth of the second clearance groove 34 is greater than 30mm, it is too deep and may reduce the structural strength of the material plate 21 and decrease the stability of the cutting process. For example, H2 = 25mm.

[0086] Optionally, H1 satisfies: 20mm≤H1≤30mm, and H2 satisfies: 20mm≤H2≤30mm.

[0087] Therefore, by limiting the depth range of the first clearance groove 30 and the second clearance groove 34, wear between the first clearance groove 30 and the first cutting line 40 and between the second clearance groove 34 and the second cutting line 44 can be avoided, thereby improving the structural strength of the material plate 21, extending the service life of the cutting equipment and the squaring equipment, and improving the stability of the cutting process.

[0088] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0089] In the description of this invention, "first feature" and "second feature" may include one or more of the features. In the description of this invention, "a plurality of" means two or more. In the description of this invention, "above" or "below" the second feature may include direct contact between the first and second features, or it may include contact between the first and second features not being in direct contact but through another feature between them. In the description of this invention, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicating that the first feature is at a higher horizontal level than the second feature.

[0090] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0091] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A method for processing silicon rod edge material, characterized in that, The methods include: Multiple silicon rod edge pieces are fixed on a material plate: the multiple silicon rod edge pieces extend along a first direction, the multiple silicon rod edge pieces include multiple first edge pieces and multiple second edge piece groups, the multiple first edge pieces and the multiple second edge piece groups are spaced apart along a second direction, the multiple first edge pieces are arranged along the second direction adjacent to the edge region of the material plate, the multiple second edge piece groups are arranged along the second direction between the multiple first edge pieces, each second edge piece group includes two second edge pieces, both the first edge pieces and the second edge pieces have a first cut surface and a second cut surface, the area of ​​the first cut surface is larger than the area of ​​the second cut surface, the first cut surfaces of the two second edge pieces in the same second edge piece group are arranged along the second direction toward the side adjacent to each other, and the first cut surfaces of adjacent first edge pieces and second edge pieces are arranged along the second direction toward the side away from each other; Adjust the position of the cutting device according to the required silicon rod molding parameters; The cutting device cuts the silicon rod edge material along a first direction.

2. The method for processing silicon rod edge material according to claim 1, characterized in that, Before fixing the multiple silicon rod edge pieces onto the material plate, the method further includes: Multiple first clearance grooves and multiple second clearance grooves are formed on the material plate, and the multiple second clearance grooves are evenly and spaced apart along a third direction; Multiple first clearance grooves are spaced apart along the second direction, and the arc-shaped top of the silicon rod edge material is located adjacent to the first clearance groove.

3. The method for processing silicon rod edge material according to claim 2, characterized in that, Before fixing the multiple silicon rod edge pieces onto the material plate, the method includes: The silicon rod edge material is inspected and adjusted using measuring tools so that the first cut surface is perpendicular to the material plate; The arc-shaped top of the silicon rod edge material is at least partially located in the first clearance groove.

4. The method for processing silicon rod edge material according to claim 2, characterized in that, The method for adjusting the position of the cutting device according to the required silicon rod forming parameters includes: The first cutting line of the cutting device is opposite to the first clearance groove along the first direction, and the second cutting line of the cutting device is opposite to the second clearance groove along the first direction.

5. The method for processing silicon rod edge material according to claim 1, characterized in that, After fixing multiple silicon rod edge pieces onto the material plate, the method includes: The material plate containing the silicon rod edge material is fixedly placed on the base.

6. The method for processing silicon rod edge material according to claim 1, characterized in that, The cutting device cuts the silicon rod edge material along a first direction, the method comprising: The first cutting line of the cutting device cuts the second cut surface along the first direction to remove the arc-shaped top of the silicon rod edge material; The second cutting line of the cutting device cuts the second cut surface along the first direction to remove the arc-shaped edge of the silicon rod edge material.

7. The method for processing silicon rod edge material according to claim 6, characterized in that, After the cutting device cuts the silicon rod edge material along the first direction, the method includes: Remove the arc-shaped top and the arc-shaped edge of the silicon rod edge material; The shaped silicon rod is obtained.

8. The method for processing silicon rod edge material according to claim 7, characterized in that, After removing the arcuate top and the arcuate edge of the silicon rod edge material and before obtaining the shaped silicon rod, the method includes: A semi-finished silicon rod is formed after the arc-shaped top and the arc-shaped edge of the silicon rod edge material are removed; The semi-finished silicon rod is then surface-trimmed. The multiple surface-trimmed semi-finished silicon rods are bonded together; Cut the semi-finished silicon rod; The semi-finished silicon rod is polished. The shaped silicon rod is obtained.

9. A square root extraction device, characterized in that, The squaring equipment processes silicon rod edge material using the processing method for silicon rod edge material as described in any one of claims 1-8, including: Base; A material plate is disposed on the base. The material plate includes a plurality of first clearance grooves and a plurality of second clearance grooves, wherein the first clearance grooves and the second clearance grooves are arranged perpendicularly. A cutting device, comprising a plurality of first cutting lines and a plurality of second cutting lines, wherein the plurality of first cutting lines and the plurality of second cutting lines are perpendicular to each other, the plurality of first cutting lines and the plurality of first clearance grooves are respectively arranged opposite to each other along a first direction, and the plurality of second cutting lines and the plurality of second clearance grooves are respectively arranged opposite to each other along the first direction.

10. The square root extraction device according to claim 9, characterized in that, The plurality of first cutting lines include a plurality of cutting line groups, which are spaced apart along a second direction. The cutting line groups are used to cut two silicon rod edge pieces whose arc-shaped tops are adjacent to each other. The cutting line group is located between two adjacent second edge material groups, and / or, The cutting line group is located between adjacent first edge material and second edge material groups.

11. The square root extraction device according to claim 10, characterized in that, The plurality of cutting line groups include a first sub-cutting line and a second sub-cutting line, wherein the distance between the first sub-cutting line and the second sub-cutting line along the second direction is less than the distance between two adjacent cutting line groups.

12. The square root extraction device according to claim 9, characterized in that, Also includes: An adhesive component is disposed between the silicon rod edge material and the material plate.

13. The square-opening device according to claim 12, characterized in that, The adhesive is a water-boiling type adhesive stick.

14. The square root extraction device according to claim 9, characterized in that, The distance between the first cross-section of the silicon rod edge material adjacent to the edge of the material plate along the second direction and the corresponding side edge of the material plate is L1, wherein L1 satisfies: 45mm ≤ L1 ≤ 50mm; and / or, Along the second direction, the distance between the first cut surface of the silicon rod edge material and the adjacent first clearance groove is L2, wherein L2 satisfies: 45mm ≤ L2 ≤ 50mm; and / or, The distance between the silicon rod edge material adjacent to the edge of the material plate along a third direction and the corresponding side edge of the material plate is L3, wherein L3 satisfies: 45mm≤L3≤50mm.

15. The square root extraction device according to claim 9, characterized in that, One of the base and the material plate is provided with a limiting groove, and the other of the base and the material plate is provided with a limiting protrusion, which cooperates with the limiting groove.

16. The square root extraction device according to claim 9, characterized in that, The distance between the first cutting line and the second cutting line along the first direction is L4, and L4 satisfies: 20mm≤L4≤30mm.

17. The square root extraction device according to claim 9, characterized in that, The depth of the first clearance groove is H1, wherein H1 satisfies: 20mm ≤ H1 ≤ 30mm; and / or, The depth of the second clearance groove is H2, and H2 satisfies: 20mm≤H2≤30mm.

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