Preparation process and structure of semiconductor coupler clamp jaw

Abstract

A preparation process and structure of a semiconductor coupler clamp jaw, comprising the following steps: S1, dividing a metal block for preparing the semiconductor coupler clamp jaw into two parts A and B; S2, forming a blind hole with a millimeter-level inner diameter size in a slanting direction on the metal block part A; and S3, forming a blind hole with a micrometer-level inner diameter size in a horizontal direction on the metal block part B. The present application effectively realizes heat exchange between the inside of the metal clamp jaw and the outside, avoids non-uniform thermal expansion of the metal clamp jaw due to local high temperature, avoids abnormal phenomena such as local elongation, warping, slight bending and torsional micro-deformation in the high-temperature area, avoids causing distortion of the clamping posture, and avoids causing micron-level deviation of the optical fiber alignment precision under the un-solidified UV glue.

Description

Technical Field

[0001] This invention relates to the field of semiconductor coupler processing technology, and in particular to a manufacturing process and structure that can effectively reduce the impact of semiconductor coupler grippers on coupled products. Background Technology

[0002] In the UV curing process of FA (fiber optic array) optical modules, the metal grippers are prone to uneven thermal deformation due to localized asymmetric heating and the thermal expansion characteristics of the material. This causes instability in clamping accuracy, affecting the alignment accuracy of the optical path and product consistency. The UV light source for FA curing provides localized directional illumination, failing to achieve uniform illumination across the entire gripper area. This results in one side or a localized area of ​​the gripper directly receiving UV light and thermal radiation and rapidly heating up, while the rest of the structure remains at room temperature, creating a significant temperature gradient. This temperature difference causes non-uniform thermal expansion of the grippers, with localized elongation, warping, slight bending, and torsional micro-deformation occurring in the high-temperature areas. Simultaneously, the light exposure conditions on the left and right sides of the grippers differ, leading to inconsistent temperature rise and expansion, ultimately causing clamping posture distortion and disrupting the parallel and centered clamping state. This results in micrometer-level shifts in the alignment accuracy of the fiber under the uncured UV adhesive.

[0003] Therefore, how to effectively reduce the uneven thermal deformation caused by the heat of the metal claws during the entire FA packaging process, and avoid the multiple problems of optical performance defects, structural defects and reduced mass production consistency of FA products, has always been a research hotspot in the field of FA coupler claw structure. Summary of the Invention

[0004] To address the aforementioned technical problems, the present invention aims to provide a structure that effectively reduces the impact of semiconductor coupler grippers on coupled products. This structure can effectively reduce uneven thermal deformation caused by heat on the metal grippers, avoiding multiple problems such as optical performance defects, structural defects, and decreased mass production consistency in FA products.

[0005] To achieve the above technical objectives and effects, a fabrication process for semiconductor coupler grippers is provided, comprising the following steps:

[0006] (1) The semiconductor coupler metal jaws are divided into two parts, A and B. During the use of the semiconductor coupler jaws, part A faces outward and directly receives the radiant heat from UV light; part B faces inward and is in direct contact with the FA optical module.

[0007] (2) A large number of blind holes with an inner diameter of millimeters are formed obliquely upward in part A of the metal jaws;

[0008] (3) A large number of blind holes with a horizontal inner diameter of micrometers are formed in part B of the metal gripper.

[0009] According to another aspect of the present invention, a semiconductor coupler gripper structure is provided, which is prepared by the above-described process.

[0010] The semiconductor coupler metal jaws are divided into two parts, A and B. During the use of the semiconductor coupler jaws, part A faces outward and directly receives the radiant heat from UV light; part B faces inward and is in direct contact with the FA optical module.

[0011] The metal gripper A portion is provided with a large number of blind holes with an inner diameter of millimeters at an angle upward;

[0012] The metal gripper B section is provided with a large number of blind holes with a horizontal inner diameter of micrometers.

[0013] In some embodiments, the heat absorbed by the metal gripper A portion is exchanged with the air through a large number of upward-sloping blind holes with an inner diameter of millimeters in this area, and the exchanged hot air is quickly discharged outside the metal gripper along the upward-sloping blind holes with an inner diameter of millimeters.

[0014] The metal gripper B section has a large number of blind holes with a horizontal inner diameter of micrometers to increase the contact area between the air and the inside of the metal block, so as to carry out effective heat exchange.

[0015] The main advantages of this invention are: by forming a large number of blind holes on both the inner and outer sides of the metal gripper (the blind holes on the inner and outer sides have different sizes), heat exchange between the inside of the metal gripper and the outside is effectively realized, avoiding non-uniform thermal expansion of the metal gripper due to local high temperature, avoiding abnormalities such as local elongation, warping, slight bending and torsion in the high temperature area, avoiding the occurrence of clamping posture distortion, and avoiding micron-level offset in the alignment accuracy of the optical fiber under uncured UV adhesive. Attached Figure Description

[0016] Figure 1 This is a schematic diagram showing the structure of the semiconductor coupler's metal grippers divided into two parts, A and B.

[0017] Figure 2 This is a schematic diagram of a structure in which an upwardly angled blind hole is formed in part A of the metal gripper.

[0018] Figure 3 This is a schematic diagram of a structure in which a horizontal blind hole is formed in part B of the metal gripper.

[0019] Figure 4 This is a schematic diagram of the side views of parts A and B of the metal gripper. Detailed Implementation

[0020] The invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] (1) Divide the metal jaws of the semiconductor coupler into two parts, A and B, to obtain the following: Figure 1 The structure is shown. In the process of using the semiconductor coupler gripper, part A faces outward (i.e., directly receives the radiant heat from UV light), and part B faces inward (i.e., is in direct contact with the FA optical module).

[0022] (2) A large number of blind holes with an inner diameter of millimeters are formed obliquely upward in part A of the metal jaws, resulting in the following: Figure 2 The structure shown.

[0023] (3) A large number of blind holes with a horizontal inner diameter of micrometers are formed in part B of the metal gripper, resulting in the following: Figure 3 The structure is shown. Numerous blind holes are formed on both parts A and B of the metal grippers; therefore, the side views of parts A and B are as shown. Figure 4 As shown.

[0024] This invention involves forming blind holes with an upward-sloping inner diameter of millimeters on part A of the semiconductor coupler gripper metal block, and forming blind holes with a horizontal inner diameter of micrometers on part B of the metal gripper. During the full-process packaging of the FA optical module, UV light radiation directly acts on part A of the metal gripper (facing outwards). The heat absorbed by part A can be exchanged with the air through the numerous upward-sloping, millimeter-diameter blind holes in this area. The exchanged hot air is then rapidly discharged outside the metal gripper along these blind holes. Similarly, the numerous horizontal, micrometer-diameter blind holes on part B of the metal gripper (facing inwards) effectively increase the contact area between the air and the interior of the metal block, facilitating effective heat exchange. Since the blind holes formed on the contact portion (part B) between the metal gripper and the FA optical module are at the micrometer level, they do not affect the normal handling of the FA optical module by the metal gripper. The present invention effectively achieves heat exchange between the inside of the metal gripper and the outside environment through blind holes in parts A and B of the metal gripper, avoiding non-uniform thermal expansion of the metal gripper due to local high temperature, avoiding abnormalities such as local elongation, warping, slight bending and torsion in high temperature areas, avoiding the occurrence of clamping posture distortion, and always maintaining the metal gripper in a parallel and centered clamping state, thus avoiding micron-level offset in the alignment accuracy of the optical fiber under uncured UV adhesive.

[0025] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A fabrication process for semiconductor coupler grippers, characterized in that, Includes the following steps: (1) The semiconductor coupler metal jaws are divided into two parts, A and B. During the use of the semiconductor coupler jaws, part A faces outward and directly receives the radiant heat from UV light; part B faces inward and is in direct contact with the FA optical module. (2) A large number of blind holes with an inner diameter of millimeters are formed obliquely upward in part A of the metal jaws; (3) A large number of blind holes with a horizontal inner diameter of micrometers are formed in part B of the metal gripper.

2. A semiconductor coupler gripper structure, characterized in that: Prepared by the process described in claim 1.

3. The semiconductor coupler gripper structure according to claim 2, characterized in that: The semiconductor coupler metal jaws are divided into two parts, A and B. During the use of the semiconductor coupler jaws, part A faces outward and directly receives the radiant heat from UV light; part B faces inward and is in direct contact with the FA optical module. The metal gripper A portion is provided with a large number of blind holes with an inner diameter of millimeters at an angle upward; The metal gripper B section is provided with a large number of blind holes with a horizontal inner diameter of micrometers.

4. The semiconductor coupler gripper structure according to claim 3, characterized in that: The heat absorbed by the metal gripper A portion is exchanged with the air through a large number of upward-sloping blind holes with an inner diameter of millimeters. The exchanged hot air is then rapidly discharged outside the metal gripper along the upward-sloping blind holes with an inner diameter of millimeters.

5. The semiconductor coupler gripper structure according to claim 3, characterized in that: The metal gripper B section has a large number of blind holes with a horizontal inner diameter of micrometers to increase the contact area between the air and the inside of the metal block, so as to carry out effective heat exchange.

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