Liquid supply structure, desktop processing device, processing system, control method, control device, and storage medium

Abstract

The application relates to a liquid supply structure, device, system, method, apparatus and medium. A processing device comprises a spindle mechanism and a worktable. The spindle mechanism comprises a carrier and a spindle. The spindle is installed on the carrier. An output end of the spindle is loaded with a cutter and drives the cutter to process a workpiece. The liquid supply structure is at least partially arranged on the carrier. The liquid supply structure comprises a liquid supply unit, a switching unit, a first nozzle group and a second nozzle group. The liquid supply unit provides cooling liquid. The switching unit is in communication with the liquid supply unit through a liquid supply pipeline and has a first working position and a second working position. The first nozzle group is connected to the first working position and comprises a plurality of first nozzles that are directed towards the cutter at different angles. The second nozzle group is connected to the second working position and comprises a second nozzle that is directed towards the worktable. The switching unit selectively connects the first working position or the second working position. When the first working position is connected, the cooling liquid is distributed to each first nozzle to cool the cutter. When the second working position is connected, the cooling liquid is supplied to the second nozzle to flush the worktable. Under the same working parameters, the liquid output and / or the jetting pressure of the second nozzle are greater than those of any first nozzle.

Description

Technical Field

[0001] This application relates to the field of machining equipment technology, specifically to a liquid supply structure, desktop machining equipment, machining system, control method, control device, and computer-readable storage medium. Background Technology

[0002] Desktop machining equipment (such as small CNC engraving machines and desktop CNC machines) is widely used for processing various types of raw materials. During machining operations, the spindle of these machines drives the cutting tool to rotate at high speed and cut the workpiece. The high-speed cutting friction generates significant cutting heat. To prevent tool wear and workpiece thermal deformation, cutting fluid is typically sprayed from nozzles for cooling, lubrication, and chip removal. Currently, most nozzles are fixed, only capable of delivering a constant pressure of cutting fluid, limiting their function to tool cooling. For desktop machining equipment, the limited worktable and lack of automatic chip removal mechanisms found in larger machine tools further exacerbate this limitation. Chips scattered on the worktable during machining cannot be promptly flushed away, requiring manual cleaning, which disrupts machining continuity and hinders further automation. Summary of the Invention

[0003] This application provides a liquid supply structure, a desktop processing device, a processing system, a control method, a control device, and a computer-readable storage medium.

[0004] In a first aspect, this application provides a fluid supply structure applied to a desktop machining equipment. The desktop machining equipment includes a spindle mechanism and a worktable for placing a workpiece. The spindle mechanism is configured to be disposed opposite to the worktable and includes a support member and a spindle. The spindle is mounted on the support member, and its output end is used to load a cutting tool and drive the cutting tool to move to machine the workpiece. At least a portion of the fluid supply structure is disposed on the support member. The fluid supply structure includes a fluid supply unit, a switching unit, a first nozzle group, and a second nozzle group. The fluid supply unit is used to supply coolant. The switching unit is connected to the fluid supply unit via a fluid delivery pipeline and has at least a first working position and a second working position. The first nozzle group is connected to the first working position via a first pipeline unit. The first nozzle group includes a plurality of first nozzles, each facing the cutting tool at a different angle. The second nozzle group is connected to the second working position via a second pipeline unit. The second nozzle group includes second nozzles, which are positioned facing the worktable. The switching unit is configured to selectively activate either the first working position or the second working position. When the first working position is activated, the coolant supplied by the liquid supply unit is diverted to each of the first nozzles after passing through the first working position, thereby cooling at least the cutting tool. When the second working position is activated, the coolant supplied by the liquid supply unit is supplied to the second nozzles after passing through the second working position, thereby rinsing the worktable. When the liquid supply unit operates with the same operating parameters, the liquid output per unit time of the second nozzle is greater than the liquid output per unit time of any of the first nozzles, and / or the injection pressure of the second nozzle is greater than the injection pressure of any of the first nozzles.

[0005] Secondly, this application provides a desktop machining apparatus. The desktop machining apparatus includes a worktable, a spindle mechanism, and a fluid supply structure according to any of the above embodiments. The worktable is used to place a workpiece. The spindle mechanism is disposed above the worktable and includes a support member and a spindle. The spindle is mounted on the support member, and its output end is used to load a cutting tool and drive the cutting tool to move to machine the workpiece. In the fluid supply structure, the first nozzle group faces the cutting tool, and the second nozzle group faces the worktable.

[0006] Thirdly, this application provides a control method applied to the aforementioned desktop machining equipment. The control method includes: acquiring a switching command; when the switching command is a machining command, controlling the switching unit to activate the first working position, causing the coolant provided by the supply unit to be diverted through the first pipeline unit to each of the first nozzles to cool the cutting tool; when the switching command is a cleaning command, controlling the switching unit to activate the second working position, causing the coolant provided by the supply unit to be supplied through the second pipeline unit to the second nozzles to flush the worktable.

[0007] Fourthly, this application provides a control device. The control device includes a processor and a memory. The memory stores a computer program. When the computer program is executed by the processor, it causes the processor to perform the control method described in any of the above embodiments.

[0008] Fifthly, this application provides a processing system. The processing system includes the control device described above.

[0009] Alternatively, the processing system includes the aforementioned desktop processing equipment, as well as a dust collection device and / or a gathering device. The dust collection device is connected to the desktop processing equipment and configured to collect chips generated during the processing of workpieces by the desktop processing equipment. The gathering device is connected to the desktop processing equipment and configured to collect the chips generated during the processing of workpieces by the desktop processing equipment and to recover the coolant used by the desktop processing equipment during workpiece processing, and to circulate the coolant back into the desktop processing equipment.

[0010] Sixthly, this application provides a computer-readable storage medium. The computer-readable storage medium stores a computer program. When executed by a processor, the computer program causes the processor to perform the control method of any of the above embodiments.

[0011] The coolant supply structure, desktop machining equipment, machining system, control method, control device, and computer-readable storage medium of this application, by at least partially mounted on the carrier of the spindle mechanism and connecting the two working positions of the switching unit to the first nozzle group and the second nozzle group respectively, allow the coolant to selectively flow to either the first or second nozzle group, achieving on-demand switching between tool cooling and worktable cleaning under the same coolant supply unit. When the switching unit is in the first working position, the coolant is diverted to multiple first nozzles facing the tool at different angles. Each first nozzle can simultaneously cover different parts of the tool and the cutting area from multiple directions, achieving not only comprehensive cooling of the tool but also more effectively flushing out accumulated debris in the hole during drilling. When the switching unit is in the second working position, the coolant is directly supplied to the second nozzle without diversion. The second nozzle flushes the worktable with a higher jet pressure or a larger unit time output, replacing manual cleaning and balancing comprehensive cooling with thorough cleaning. This eliminates the need for multiple pumps or multi-stage pressure regulating valves, resulting in a compact structure and low cost. Meanwhile, at least part of the liquid supply structure is located on the carrier, allowing the remaining components to be flexibly arranged in other positions of the desktop processing equipment, further improving the spatial adaptability and automation of the desktop processing equipment.

[0012] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0013] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein: Figure 1 This is a perspective view of a desktop processing device according to some embodiments of this application; Figure 2 yes Figure 1 A three-dimensional schematic diagram of the spindle mechanism in the desktop machining equipment shown; Figure 3 yes Figure 2 The bottom view of the spindle mechanism shown; Figure 4 This is a schematic diagram showing the relative arrangement of the spindle mechanism and the worktable in some embodiments of this application; Figure 5 This is a schematic diagram of the liquid supply structure and spindle mechanism in a desktop processing device according to some embodiments of this application. The carrier is the spindle box, and the liquid supply structure is installed inside the spindle box. Figure (a) shows the switching unit in the liquid supply structure in the first working position, and Figure (b) shows the switching unit in the liquid supply structure in the second working position. Figure 6This is a schematic diagram of the liquid supply structure and spindle mechanism in a desktop processing device according to some other embodiments of this application. The carrier is the spindle box, a part of the liquid supply structure is installed in the spindle box, and a part is installed outside the spindle box. Figure (a) shows the switching unit in the liquid supply structure in the first working position, and Figure (b) shows the switching unit in the liquid supply structure in the second working position. Figure 7 This is a schematic diagram of the liquid supply structure and spindle mechanism in a desktop processing device according to some embodiments of this application. The support is a mounting plate. Part of the liquid supply structure is mounted on the mounting plate and part is mounted outside the mounting plate. Figure (a) shows the switching unit in the liquid supply structure in the first working position, and Figure (b) shows the switching unit in the liquid supply structure in the second working position. Figure 8 yes Figure 1 A schematic diagram showing the first nozzle arranged at intervals around the spindle axis in a desktop machining equipment. Figure 9 This is a schematic diagram of the liquid supply structure and spindle mechanism in a desktop processing device according to some embodiments of this application. In the diagram, (a) shows the switching unit in the liquid supply structure in the first working position, (b) shows the switching unit in the liquid supply structure in one of the second working positions, and (c) shows the switching unit in the liquid supply structure in another second working position. Figure 10 This is a schematic diagram of the liquid supply structure and spindle mechanism in a desktop processing device according to some embodiments of this application, wherein the spray direction of at least two second nozzles of the liquid supply structure points to the same position on the worktable. Figure 11 This is a schematic diagram showing the distribution of multiple first nozzles and multiple second nozzles around the spindle in a desktop-level machining apparatus according to some embodiments of this application; Figures 12 to 21 This is a flowchart illustrating the control method of a desktop processing device according to some embodiments of this application; Figure 22 This is a schematic diagram of the structure of the control device according to some embodiments of this application; Figure 23 This is a schematic diagram of the processing system according to some embodiments of this application; Figure 24 This is a schematic diagram of the processing system according to other embodiments of this application; Figure 25 This is a schematic diagram showing the connection between the computer-readable storage medium and the processor according to this application.

[0014] The reference numerals in the detailed embodiments are as follows: 10,000 machining systems, 1,000 desktop machining devices, 3,000 dust collection devices, 5,000 collection devices, and 6,000 cutting tools; Liquid supply structure 100; Liquid supply unit 10; Switching unit 20, first working position A, second working position B; Infusion tubing 30; First nozzle group 40, first nozzle 41; First pipeline unit 50, main pipeline 51, branch pipeline 53; Second nozzle group 60, second nozzle 61; Second pipeline unit 70, liquid supply pipeline 71; Workbench 200; Main spindle mechanism 300, bearing component 301, main spindle 303, output end 3031; 400 gantry crane; First horizontal direction X, second horizontal direction Y, height direction Z, axis M1, radial direction R, control device 500, processor 501, memory 503, vision module 600, tool magazine 700. Detailed Implementation

[0015] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0016] In the description of this application, it should be understood that the terms "center", "length", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0017] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0018] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0019] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0020] Desktop machining equipment (such as small CNC engraving machines and desktop CNC machines) is widely used for processing various blanks. During machining operations, the spindle of these machines drives the cutting tool to rotate at high speed and cut the workpiece. The tool generates significant cutting heat due to high-speed friction. To prevent tool wear and workpiece thermal deformation, cutting fluid is typically sprayed directionally from nozzles for cooling, lubrication, and chip removal. Currently, most nozzles are fixed structures, only capable of delivering a constant pressure of cutting fluid, limiting their function to tool cooling. For desktop machining equipment, the limited worktable and lack of automatic chip removal mechanisms found in larger machine tools further exacerbate this limitation: chips scattered on the worktable cannot be promptly flushed away, requiring manual cleaning, disrupting machining continuity and hindering further automation. To address this issue, this application provides a fluid supply structure ( Figure 2 , Figure 5 , Figure 6 , Figure 7 , Figure 9 and Figure 10 As shown), desktop processing equipment ( Figure 1 As shown), processing system ( Figure 23 and Figure 24 As shown), control method ( Figures 12 to 21 As shown), control device ( Figure 22 (as shown) and computer-readable storage media ( Figure 25 (As shown).

[0021] Please see Figures 1 to 5 The desktop machining equipment 1000 provided in this application includes a worktable 200, a spindle mechanism 300, and a fluid supply structure 100. The worktable 200 is used to place a workpiece. The spindle mechanism 300 is configured to be disposed opposite to the worktable 200. The spindle mechanism 300 includes a support member 301 and a spindle 303. The spindle 303 is mounted on the support member 301, and its output end 3031 is used to load a cutting tool 6000 and drive the cutting tool 6000 to move for machining the workpiece. At least a portion of the fluid supply structure 100 is disposed on the support member 301.

[0022] The desktop machining equipment 1000 is a compact device used to perform machining processes. Its structural design typically balances lightweight construction with high machining accuracy. Its core advantages include a small footprint and low energy consumption, making it well-suited for various flexible applications such as creative projects, model making, and handicraft workshops. The desktop machining equipment 1000 removes excess material through cutting, grinding, and other methods by using a tool 6000 and the workpiece (commonly known as a "blank") in relative motion, achieving the desired shape, dimensional accuracy, and surface quality. For example, the desktop machining equipment 1000 can be, but is not limited to, a lathe, milling machine, planer, grinder, drilling machine, and CNC machine tool. In some embodiments, the desktop machining equipment 1000 is a three-axis machining equipment, wherein the spindle 303 of the spindle mechanism 300 can move along a first horizontal direction X and a height direction Z, and the worktable 200 can move along a second horizontal direction Y; or the spindle 303 can move along three directions: the first horizontal direction X (left-right direction), the second horizontal direction Y (front-back direction), and the height direction Z (up-down direction). In other embodiments, the desktop machining equipment 1000 is a five-axis machining equipment. In addition to the three translational degrees of freedom, at least one of the spindle mechanism 300 and the worktable 200 can also provide two rotational degrees of freedom. For example, the worktable 200 can rotate about one or two of the A-axis, B-axis, and C-axis; or, the spindle mechanism 300 can rotate about a horizontal axis and / or a vertical axis, so that a five-axis relative motion is formed between the spindle mechanism 300 and the worktable 200. The worktable 200 can rotate to at least one machining posture, in which the spindle 303 can be positioned relative to the workpiece carried on the worktable 200 and perform machining on the workpiece.

[0023] The worktable 200 is a platform component in the desktop machining equipment 1000 used to support the workpiece to be processed. The worktable 200 is typically made of a metallic material, such as cast iron, cast steel, or stainless steel, to ensure sufficient rigidity and load-bearing capacity. The upper surface of the worktable 200 is the working surface, used to place the workpiece to be processed. In some embodiments, the worktable 200 can move along a second horizontal direction Y to coordinate with the movement of the spindle mechanism 300 to achieve machining of complex trajectories. The movement of the worktable 200 is achieved by transmission elements such as drive motors, lead screws, and guide rails to ensure the positional accuracy and smooth movement of the worktable 200; in other embodiments, the worktable 200 can rotate about one or both of the A-axis, B-axis, or C-axis. During the machining process, the chips cut from the workpiece will scatter and accumulate on the working surface of the worktable 200. If the chips are not cleaned in time, the accumulated chips will be driven by the tool 6000 and scratch the machined surface of the workpiece, or get embedded in the gap between the worktable 200 and the fixture used to hold the workpiece, affecting the positioning accuracy, or even accelerate the wear of the transmission components as the coolant flows into the guide rail gap. Therefore, the worktable 200 needs to be cleaned during the machining process or during the machining gap.

[0024] The spindle mechanism 300 is the actuating component in the desktop machining equipment 1000 used to drive the tool 6000 to rotate and realize cutting motion. In some embodiments, the spindle mechanism 300 is positioned above the machining area and can be mounted on the worktable 200 via a gantry 400, such as... Figure 1 As shown; in other embodiments, the spindle mechanism 300 is arranged horizontally, and when the worktable 200 rotates around axis A, axis B, or axis C to a preset posture, the spindle mechanism 300 can be positioned opposite to the worktable 200 to process the workpiece to be processed on the worktable 200, such as... Figure 4 As shown. The spindle mechanism 300 includes a support member 301 and a spindle 303. The support member 301 is a structural component in the spindle mechanism 300 used to mount and support the spindle 303. The spindle 303 is mounted on the support member 301, and the output end 3031 of the spindle 303 extends from the support member 301 to load the tool 6000 and drive the tool 6000 to rotate.

[0025] The support member 301 is a structural component in the spindle mechanism 300 used to mount and support the spindle 303. The support member 301 is typically made of a metallic material, such as aluminum alloy, cast iron, or steel, to ensure sufficient strength and rigidity to support the loads generated when the spindle 303 rotates at high speed. The support member 301 is provided with mounting holes or mounting seats, and the spindle 303 is mounted in the mounting holes of the support member 301 via bearing assemblies. The support member 301 is configured to connect to the drive system of the desktop machining equipment 1000 and move relative to the worktable 200 under the drive of the drive system. The support member 301 can have various different structural forms.

[0026] In some implementations, such as Figure 2 , Figure 5 and Figure 6 As shown, the support member 301 is the spindle box, which is a box structure with an internal cavity. At least a portion of the spindle 303 is housed in the internal cavity of the spindle box. The output end 3031 of the spindle 303 extends from the lower surface of the spindle box. The spindle box also houses auxiliary components such as the cooling system, vision system, and sensors of the spindle 303. In other embodiments, such as Figure 7 As shown, the support component 301 is a mounting plate, which is typically a plate-shaped component. The mounting plate is fixedly connected to the output end of the drive system of the desktop machining equipment 1000. The mounting plate is used to mount the spindle 303. The mounting plate is relatively simple and lightweight, making it suitable for applications where weight is a concern. It should be noted that the support component 301 is not limited to the two forms mentioned above. The support component 301 can also be any other structural form capable of supporting the spindle 303 and connecting it to the drive system. For example, the support component 301 can be a sleeve structure with a certain wall thickness, a shell structure with reinforcing ribs, or a structure integrally formed with the sliding seat that drives the spindle 303.

[0027] The spindle 303 is a rotating component in the spindle mechanism 300 used to drive the tool 6000 to rotate at high speed for cutting. The spindle 303 is mounted on the support member 301, and its output end 3031 is used to load the tool 6000. A clamping mechanism is provided at the output end 3031 of the spindle 303 to clamp and fix the tool holder of the tool 6000, allowing the tool 6000 to rotate synchronously with the spindle 303. Driven by the spindle driver, the spindle 303 rotates at high speed, thereby driving the tool 6000 to rotate at high speed, enabling the tool 6000 to perform cutting on the workpiece. The high-speed rotation of the spindle 303 generates a large amount of heat, and the cutting friction between the tool 6000 and the workpiece also generates a large amount of cutting heat. Therefore, timely cooling of the tool 6000 is necessary to prevent high-temperature wear of the tool 6000 or thermal deformation of the workpiece.

[0028] At least a portion of the fluid supply structure 100 is mounted on the support member 301. The fluid supply structure 100 is a liquid supply structure in the desktop machining equipment 1000 used to deliver coolant and cool the cutting tool 6000 and workpiece, as well as to clean the worktable 200. At least a portion of the fluid supply structure 100 is mounted on the support member 301; that is, some components of the fluid supply structure 100 are mounted on the support member 301 and move with the support member 301, while the remaining components of the fluid supply structure 100 are located at other positions in the desktop machining equipment 1000 and are connected to the components on the support member 301 via pipelines.

[0029] Please refer to the following: Figure 2 and Figure 5 In some embodiments, the liquid supply structure 100 includes a liquid supply unit 10, a switching unit 20, a first nozzle group 40, and a second nozzle group 60. The liquid supply unit 10 provides coolant. The switching unit 20 is connected to the liquid supply unit 10 via a liquid delivery line 30, and the switching unit 20 has at least a first working position A and a second working position B. The first nozzle group 40 is connected to the first working position A via a first pipeline unit 50, and the first nozzle group 40 includes a plurality of first nozzles 41, which are respectively directed toward the tool 6000 at different angles. The second nozzle group 60 is connected to the second working position B via a second pipeline unit 70, and the second nozzle group 60 includes second nozzles 61, which are directed toward the worktable 200. The switching unit 20 is configured to selectively activate either the first working position A or the second working position B. When the first working position A is activated, the coolant provided by the liquid supply unit 10 is diverted to each of the first nozzles 41 after passing through the first working position A, thereby cooling at least the tool 6000. Figure 5 As shown in Figure (a), Figure 6 As shown in Figure (a), Figure 7 Figure (a) shows and Figure 9 As shown in Figure (a), when the second working position B is activated, the coolant supplied by the liquid supply unit 10 is supplied to the second nozzle 61 after passing through the second working position B, thereby flushing the worktable 200, as shown in Figure (a). Figure 5 As shown in Figure (b), Figure 6 As shown in Figure (b), Figure 7 As shown in Figure (b) and Figure 9 As shown in Figures (b) and (c), when the liquid supply unit 10 is operating with the same operating parameters, the liquid output per unit time of the second nozzle 61 is greater than the liquid output per unit time of any of the first nozzles 41, and / or the injection pressure of the second nozzle 61 is greater than the injection pressure of any of the first nozzles 41.

[0030] The coolant supply unit 10 is the power source component in the coolant supply structure 100 used to supply coolant. The coolant supply unit 10 is used to draw coolant from the storage container and pressurize it for delivery to the switching unit 20. The coolant supply unit 10 can be configured as an independent pumping device, such as a centrifugal pump, gear pump, or plunger pump. The operating parameters of the coolant supply unit 10 include parameters that characterize its operating status, such as pump speed, drive power, or coolant supply level. The coolant supply unit 10 can be installed within the desktop processing equipment 1000 or externally within the desktop processing equipment 1000, and connected to the switching unit 20 via the coolant delivery line 30. When the coolant supply unit 10 operates with the same parameters, the total flow rate and total pressure of the coolant it outputs remain essentially stable.

[0031] It should be noted that even if the liquid supply unit 10 operates with the same operating parameters, the actual output flow rate and pressure of the liquid supply unit 10 may still be affected by factors such as the performance curve of the pumping components, pipeline resistance, nozzle orifice size and valve body flow resistance. Therefore, it is not required that the total flow rate and total pressure of the coolant remain absolutely constant.

[0032] The switching unit 20 is a reversing component in the coolant supply structure 100 used to control the coolant flow path. The switching unit 20 is connected to the coolant supply unit 10 via the supply line 30. The switching unit 20 has at least a first working position A and a second working position B. The switching unit 20 is configured to selectively activate either the first working position A or the second working position B, meaning that at any given time, coolant can only be supplied to one of the lines connected to either the first working position A or the second working position B, and cannot activate both lines simultaneously. The switching unit 20 can be configured as a reversing valve, such as a two-position three-way solenoid reversing valve or a two-position four-way solenoid reversing valve. When the valve core of the switching unit 20 is in different positions, the coolant output from the coolant supply unit 10 is guided to different output ports, thereby achieving the switching of the coolant flow path.

[0033] The first working position A is one working position of the switching unit 20. When the switching unit 20 is in the first working position A, the coolant supplied by the supply unit 10 flows into the first pipeline unit 50 through the first working position A, and then flows to the first nozzle group 40. The second working position B is another working position of the switching unit 20. When the switching unit 20 is in the second working position B, the coolant supplied by the supply unit 10 flows into the second pipeline unit 70 through the second working position B, and then flows to the second nozzle group 60.

[0034] The infusion line 30 is a liquid delivery pipeline used to connect the liquid supply unit 10 and the switching unit 20. One end of the infusion line 30 is connected to the output end of the liquid supply unit 10, and the other end is connected to the input end of the switching unit 20. The infusion line 30 can be made of metal, plastic, or rubber tubing.

[0035] The first pipeline unit 50 is a liquid delivery pipeline assembly for connecting the first working position A of the switching unit 20 with the first nozzle group 40. One end of the first pipeline unit 50 is connected to the first working position A, and the other end is connected to a plurality of first nozzles 41. Coolant enters the first pipeline unit 50 after passing through the first working position A, and is then distributed within the first pipeline unit 50 to each of the first nozzles 41.

[0036] The second piping unit 70 is a liquid delivery pipe that connects the second working position B of the switching unit 20 to the second nozzle group 60. One end of the second piping unit 70 is connected to the second working position B, and the other end is connected to the second nozzle 61. Coolant enters the second piping unit 70 after passing through the second working position B and is directly supplied to the second nozzle 61.

[0037] The first nozzle assembly 40 is a spraying component assembly in the fluid supply structure 100 used to spray coolant onto the cutting tool 6000, such as onto the cutting edge of the cutting tool 6000. The first nozzle assembly 40 includes a plurality of first nozzles 41. The plurality of first nozzles 41 are directed towards the cutting tool 6000 at different angles. The first nozzles 41 are used to spray coolant onto the surface of the cutting tool 6000, cooling, lubricating, and removing chips. The plurality of first nozzles 41 are directed towards the cutting tool 6000 from different directions, allowing the coolant to cover multiple sides and cutting areas of the cutting tool 6000. The first nozzles 41 can be configured as fan-shaped nozzles, cylindrical nozzles, or adjustable-angle nozzles.

[0038] The second nozzle assembly 60 is a spraying component in the liquid supply structure 100 used to spray coolant onto the worktable 200. The second nozzle assembly 60 includes a second nozzle 61. The second nozzle 61 is positioned facing the worktable 200. The second nozzle 61 is used to spray coolant onto the surface of the worktable 200, flushing and cleaning the worktable 200 and removing accumulated chips. The second nozzle 61 can be configured as a fan-shaped nozzle or a narrow-angle nozzle to achieve a larger flushing coverage area or higher impact force.

[0039] At least a portion of the liquid supply structure 100 is disposed on the support member 301. In some examples, all components of the liquid supply structure 100 are disposed on the support member 301 and move with the support member 301. In other examples, some components of the liquid supply structure 100 are disposed on the support member 301 and move with the support member 301, while the remaining components of the liquid supply structure 100 are disposed at other locations in the desktop processing equipment 1000 and connected to the components on the support member 301.

[0040] In some implementations, such as Figure 5 As shown, the carrier 301 is the spindle box, and all components of the liquid supply structure 100 (including the liquid supply unit 10, switching unit 20, first nozzle group 40, second nozzle group 60, first pipeline unit 50, and second pipeline unit 70) are disposed inside or on the surface of the spindle box and move together with the spindle box. In other embodiments, such as Figure 6As shown, the carrier 301 is the spindle box. Some components of the liquid supply structure 100 (including the switching unit 20, the first nozzle group 40, the second nozzle group 60, the first pipeline unit 50, and the second pipeline unit 70) are located inside or on the surface of the spindle box and move with it. The liquid supply unit 10 is a cooling module located outside the desktop machining equipment 1000. The cooling module may include a liquid storage container, a pumping device, and a filter. The pumping device is used to deliver the coolant in the liquid storage container to the switching unit 20 via the liquid delivery pipeline 30. The switching unit 20, the first nozzle group 40, and the second nozzle group 60 are located on the carrier 301 and can move relative to the worktable 200 with the carrier 301. At least a portion of the liquid delivery pipeline 30 can be a flexible pipeline or a cable chain pipeline to accommodate the movement of the carrier 301. Therefore, it is possible to avoid increasing the weight of the support 301 and occupying internal space of the spindle mechanism 300 by placing the liquid supply unit 10 on the support 301, while still being able to control the flow of coolant to the first nozzle group 40 or the second nozzle group 60 through the switching unit 20 disposed on the support 301. In some other embodiments, such as Figure 7 As shown, the support member 301 is a mounting plate. The first nozzle group 40, the second nozzle group 60, a portion of the first pipeline unit 50, and a portion of the second pipeline unit 70 in the liquid supply structure 100 are mounted on the mounting plate and move with it. The liquid supply unit 10, the switching unit 20, and the liquid delivery pipeline 30 in the liquid supply structure 100 are located in other positions inside the body of the desktop machining equipment 1000 and do not move with the mounting plate. In this case, the portions of the first pipeline unit 50 and the second pipeline unit 70 that communicate with the switching unit 20 can be retractable corrugated pipes. The liquid supply unit 10 is connected to the switching unit 20 via the liquid delivery pipeline 30, and the switching unit 20 is connected to the first pipeline unit 50 and the second pipeline unit 70 on the mounting plate. The liquid supply structure 100 selectively delivers the coolant output from the liquid supply unit 10 to the first nozzle group 40 or the second nozzle group 60 through the switching unit 20 to achieve tool cooling and worktable cleaning functions, respectively.

[0041] Please see Figure 5 As shown in Figure (a), or Figure 6 As shown in Figure (a), or Figure 7 As shown in Figure (a), or Figure 9 As shown in Figure (a), when the switching unit 20 is in the first working position A, the coolant supplied by the liquid supply unit 10 flows into the switching unit 20 via the liquid delivery pipeline 30, and then flows into the first pipeline unit 50 via the first working position A. Within the first pipeline unit 50, the coolant is divided and flows to each of the first nozzles 41. After being ejected from each of the first nozzles 41, it is directed towards the cutting tool 6000, cooling, lubricating, and removing chips from the tool. At this time, the second working position B is in the off state, and the coolant does not flow to the second nozzle 61. Please refer to... Figure 5As shown in Figure (b), or Figure 6 As shown in Figure (b), or Figure 7 As shown in Figure (b), or Figure 9 As shown in Figure (a) or (b), when the switching unit 20 is activated at the second working position B, the coolant supplied by the liquid supply unit 10 flows into the switching unit 20 via the liquid delivery pipeline 30, and then flows into the second pipeline unit 70 via the second working position B. The coolant is then directly supplied to the second nozzle 61 via the second pipeline unit 70, and sprayed out from the second nozzle 61 towards the worktable 200 to flush and clean the worktable 200, removing the accumulated chips. At this time, the first working position A is in the off state, and the coolant does not flow to the first nozzle group 40. When the liquid supply unit 10 operates with the same operating parameters, because the coolant needs to be diverted to multiple first nozzles 41 when the first working position A is activated, while the coolant is concentratedly supplied to a single second nozzle 61 when the second working position B is activated, the liquid output per unit time of the second nozzle 61 is greater than that of any first nozzle 41, and / or the spray pressure of the second nozzle 61 is greater than that of any first nozzle 41.

[0042] The coolant supply structure 100 of this application is at least partially mounted on the support member 301 of the spindle mechanism 300, and the two working positions of the switching unit 20 are respectively connected to the first nozzle group 40 and the second nozzle group 60, so that the coolant can selectively flow to the first nozzle group 40 or the second nozzle group 60, realizing on-demand switching between tool cooling and table cleaning under the same coolant supply unit 10. When the switching unit 20 is in the first working position A, the coolant is diverted to multiple first nozzles 41 facing the tool 6000 at different angles. Each first nozzle 41 can simultaneously cover different parts and cutting areas of the tool 6000 from multiple directions, which not only achieves comprehensive cooling of the tool 6000, but also more effectively flushes out the debris accumulated in the hole during drilling. When the switching unit 20 activates the second working position B, the coolant is directly supplied to the second nozzle 61 without diversion. The second nozzle 61 flushes the worktable 200 with a higher injection pressure or a larger liquid output per unit time, replacing manual cleaning. This achieves both comprehensive cooling and thorough cleaning, eliminating the need for multiple pumps or multi-stage pressure regulating valves, resulting in a compact structure and low cost. Simultaneously, at least a portion of the liquid supply structure 100 is mounted on the support member 301, allowing the remaining components to be flexibly arranged in other locations within the desktop processing equipment 1000, further enhancing the spatial adaptability and automation level of the desktop processing equipment 1000.

[0043] In some embodiments, the switching unit 20 may also have a third working position. When the switching unit 20 switches to the third working position, the switching unit 20 cuts off the connection between the liquid supply unit 10 and the first pipeline unit 50 and the second pipeline unit 70, so that both the first nozzle group 40 and the second nozzle group 60 stop spraying coolant.

[0044] The third working position can be used for scenarios such as dry machining without coolant, tool changing, equipment maintenance, or equipment standby. The switching unit 20 can be a multi-position multi-way directional valve, a rotary distribution valve, or a valve group composed of multiple control valves. This application does not limit the specific valve body form of the switching unit 20.

[0045] Please see Figure 2 , Figure 3 , Figure 8 and Figure 11 In some embodiments, a plurality of first nozzles 41 are arranged at intervals around the axis M1 of the main shaft 303.

[0046] Specifically, a plurality of first nozzles 41 are arranged in a ring around the axis M1 of the main shaft 303, and adjacent first nozzles 41 are spaced apart by a predetermined angle in the circumferential direction. The plurality of first nozzles 41 are directed toward the tool 6000 at different angles, that is, the spray direction of each first nozzle 41 is directed toward the surface of the tool 6000, and the spray direction of each first nozzle 41 is directed toward different parts of the tool 6000 at different angles in space.

[0047] In some embodiments, the plurality of first nozzles 41 are arranged at uniform intervals along the circumference, that is, the included angle between any two adjacent first nozzles 41 and the axis M1 is equal. For example, when the number of first nozzles 41 is four, the four first nozzles 41 are arranged at 90° intervals along the circumference; when the number of first nozzles 41 is six, the six first nozzles 41 are arranged at 60° intervals along the circumference. In other embodiments, the plurality of first nozzles 41 may also be arranged at non-uniform intervals, for example, depending on the shape of the tool 6000 and the machining conditions, the first nozzles 41 may be arranged more densely in the direction of higher cutting load and more sparsely in other directions.

[0048] The liquid supply structure 100 of this application arranges multiple first nozzles 41 at intervals around the axis M1 of the spindle 303, so that the coolant sprayed from the multiple first nozzles 41 can simultaneously cover the circumferential surface of the tool 6000 from different directions, expand the coverage of the coolant, improve the uniformity and comprehensiveness of the cooling of the tool 6000, and reduce the possibility of the tool 6000, the workpiece to be processed, or the chips obstructing the coolant.

[0049] Please see Figure 8 In some embodiments, the second nozzle group 60 includes a second nozzle 61. The second nozzle 61 is arranged together with a plurality of first nozzles 41 around the axis M1 of the main shaft 303. In one example, as Figure 8 As shown in Figure (a), the second nozzle 61 and the plurality of first nozzles 41 are located on the same circumference centered on axis M1, and the second nozzle 61 is located between two adjacent first nozzles 41. In another example, as... Figure 8 As shown in Figure (b), the second nozzle 61 and a plurality of first nozzles 41 are arranged on circumferences of different radii along the radial direction R of the main axis 303, and the second nozzle 61 and one of the first nozzles 41 are located on the same radial line of the main axis 303. In another example, as... Figure 8 As shown in Figure (c), the second nozzle 61 and a plurality of first nozzles 41 are arranged on circumferences of different radii along the radial direction R of the main shaft 303, and the second nozzle 61 and each of the first nozzles 41 are located on different radial lines R of the main shaft 303.

[0050] The liquid supply structure 100 of this application embodiment arranges a single second nozzle 61 and multiple first nozzles 41 in various layouts, such as spaced apart on the same circumference, arranged opposite each other on the same radial line on circumferences of different radii, or staggered on different radial lines on circumferences of different radii. This allows the first nozzle group 40 and the second nozzle group 60 to flexibly select the optimal arrangement scheme according to the space size below the spindle mechanism 300 and the size of the tool 6000. This optimizes space utilization and ensures that the cooling of the tool 6000 by the first nozzle group 40 at different circumferential angles and the effective scouring of the worktable 200 by the second nozzle 61 do not interfere with each other. At the same time, the staggered layout of different radial lines further avoids mutual interference between adjacent nozzles when spraying coolant.

[0051] Please see Figure 2 , Figure 3 , Figure 9 and Figure 11 In other embodiments, the second nozzle group 60 includes a plurality of second nozzles 61, each facing the worktable 200. The switching unit 20 has a plurality of second working positions B, with each of the second nozzles 61 corresponding to one of the second working positions B. The switching unit 20 is configured to selectively switch to one of the plurality of second working positions B, so that the liquid supply unit 10 is connected to the second nozzle 61 corresponding to the second working position B.

[0052] In some embodiments, a plurality of second nozzles 61 may be arranged at intervals around the axis M1 of the main shaft 303.

[0053] Specifically, a plurality of second nozzles 61 are arranged in a ring around the axis M1 of the main shaft 303, and adjacent second nozzles 61 are spaced apart by a predetermined angle in the circumferential direction. All the second nozzles 61 are positioned towards the worktable 200, meaning that the spray direction of each second nozzle 61 points towards the surface of the worktable 200. The plurality of second nozzles 61 can be arranged at uniform intervals in the circumferential direction, meaning that the included angle between any two adjacent second nozzles 61 and the axis M1 is equal. For example, when there are three second nozzles 61, the three second nozzles 61 are arranged at 120° intervals in the circumferential direction; when there are four second nozzles 61, the four second nozzles 61 are arranged at 90° intervals in the circumferential direction. In other embodiments, the plurality of second nozzles 61 can also be arranged at non-uniform intervals.

[0054] The switching unit 20 has multiple second working positions B, and multiple second nozzles 61 are arranged one-to-one with the multiple second working positions B. That is, each second nozzle 61 is connected to a corresponding second working position B of the switching unit 20 through an independent pipeline. The switching unit 20 is configured to selectively switch to one of the multiple second working positions B. That is, at any given time, the switching unit 20 can only activate one of the multiple second working positions B, so that the coolant provided by the liquid supply unit 10 is only supplied to the second nozzle 61 corresponding to the activated second working position B, and is not diverted to other second nozzles 61.

[0055] For example, such as Figure 9 As shown in Figure (b), the switching unit 20 activates the first of a plurality of second working positions B (shown on the left), supplying coolant to the second nozzle 61 corresponding to this first second working position B, while not supplying the other second nozzles 61. Figure 9As shown in Figure (c), the switching unit 20 activates the second second working position B (shown on the right) among multiple second working positions B. Coolant is supplied to the second nozzle 61 corresponding to this second second working position B, but not to the other second nozzles 61. The switching unit 20 can be configured as a multi-position directional valve, such as a three-position four-way directional valve, which has multiple output ports, each output port corresponding to a second working position B. The valve core guides the coolant output by the supply unit 10 to different output ports when in different positions. The connection relationship between the supply unit 10, the switching unit 20, and the second nozzles 61 is as follows: the supply unit 10 is connected to the input end of the switching unit 20 through the liquid delivery pipeline 30, and the multiple second working positions B of the switching unit 20 are respectively connected to the multiple second nozzles 61 one-to-one through multiple independent second pipeline units 70. When the switching unit 20 selectively activates one of the second working positions B, the coolant provided by the supply unit 10 flows into the corresponding second pipeline unit 70 through the second working position B, and then supplies the second nozzle 61 connected to the second pipeline unit 70. Additionally, it should be noted that when the tool 6000 needs to be cooled, the switching unit 20 activates the first working position A, and coolant is supplied to the first nozzle 41 corresponding to the first working position A, but not to all the second nozzles 61. When the worktable 200 needs to be cleaned, the switching unit 20 selectively activates one of the second working positions B, and coolant is supplied to the second nozzle 61 corresponding to the first second working position B, but not to the first nozzle 41 and the other second nozzles 61.

[0056] The liquid supply structure 100 of this embodiment corresponds one-to-one with multiple second nozzles 61 and multiple second working positions B of the switching unit 20, and allows the switching unit 20 to selectively switch to one of the second working positions B. This ensures that in cleaning mode, the coolant can be concentratedly supplied to a single second nozzle 61 corresponding to the currently activated second working position B without diversion. This guarantees that the second nozzle 61 can flush the worktable 200 with a high spray pressure, avoiding the problem of pressure drop and insufficient cleaning power caused by multiple second nozzles 61 being activated simultaneously. Furthermore, since the multiple second nozzles 61 are respectively directed towards the worktable 200, different areas of the worktable 200 can be flushed by selectively activating different second nozzles 61, thereby expanding the cleanable range of the liquid supply structure 100 and reducing cleaning blind spots that may exist when only one second nozzle 61 is provided.

[0057] Please see Figure 9 and Figure 11 In some embodiments, the spray directions of at least two second nozzles 61 are different from each other.

[0058] As previously described, a plurality of second nozzles 61 are disposed on the support member 301. At least two of the second nozzles 61 have different spray directions; that is, among the plurality of second nozzles 61, at least two second nozzles 61 have spray directions pointing towards the worktable 200 at different angles in space. The spray directions of each second nozzle 61 can point towards different areas of the worktable 200 or towards the same area of ​​the worktable 200, as long as it is ensured that the spray directions of at least two second nozzles 61 have different angles in space.

[0059] In some embodiments, the jetting direction of each second nozzle 61 is directed towards different positions on the worktable 200, such as... Figure 9 As shown in Figure (b), the jetting direction of the second nozzle 61 on the left is directed towards the position slightly to the left of the workpiece on the worktable 200, while Figure 9 As shown in Figure (c), the spray direction of the second nozzle 61 on the left is directed towards the right side of the workpiece on the worktable 200.

[0060] Please see Figure 10 In other embodiments, the spray direction of each second nozzle 61 points to the same position on the worktable 200. In this case, the spray direction angle of each second nozzle 61 is different; for example, the angle between the spray direction P1 and the axis M1 is smaller than the angle between the spray direction P2 and the axis M1. When the spindle mechanism 300 and the worktable 200 are at different relative heights, the landing position of each second nozzle 61 on the worktable 200 will also change accordingly. Figure 10 As shown in Figure (a), when the spindle mechanism 300 and the worktable 200 are at the first relative height, the two second nozzles 61 with different spray angles both point towards the same position on the workpiece. The steeper spray direction P1 forms a concentrated impact at this position, effectively flushing away stubbornly accumulated chips, while the more inclined spray direction P2 forms an oblique flush at this position, blowing and pushing the chips away from the workpiece or towards the chip discharge port. The combined effect of the two makes the cleaning effect of the target cleaning area more thorough. Figure 10 As shown in Figure (b), when the spindle mechanism 300 and the worktable 200 are at the second relative height, the two second nozzles 61 with different spray direction angles spray towards different positions of the workpiece. At this time, each second nozzle 61 covers a different cleaning area. Multiple areas can be rinsed with one positioning, which improves cleaning efficiency.

[0061] In some embodiments, the desktop machining equipment 1000 also includes a tool magazine 700. The tool magazine 700 may be mounted on the worktable 200 (e.g., Figure 9 (As shown), it can also be mounted on a support structure connected to the worktable 200. The tool magazine 700 is used to store multiple spare tools.

[0062] At least one second nozzle 61 has a spray range capable of covering at least a portion of the tool magazine 700. For example, the second nozzle 61 may be directed toward the outer surface of the tool magazine 700 or the connection area between the tool magazine 700 and the worktable 200. When chips accumulate in the tool magazine 700 or the connection area between the tool magazine 700 and the worktable 200, the spindle mechanism 300 may be controlled to move relative to the worktable 200, and the second nozzle 61, whose spray direction matches the area to be cleaned, may be selectively activated to flush the tool magazine 700 and its surrounding area.

[0063] By setting multiple second nozzles 61 with different spray directions, and coordinating the relative movement between the spindle mechanism 300 and the worktable 200, the possibility of the tool magazine 700 blocking a single second nozzle 61 and creating a cleaning blind spot can be reduced.

[0064] The liquid supply structure 100 of this application sets the spray directions of at least two second nozzles 61 to be different from each other, so that at least two second nozzles 61 can point at the same or different areas of the worktable 200 at different angles. With the control logic of one-to-one correspondence between the second nozzles 61 and the second working position B and selective conduction, as well as the relative movement between the spindle mechanism 300 and the worktable 200, the second nozzle 61 with the most matching spray direction can be selected for conduction according to the actual accumulation position of the chips. Furthermore, the landing position of the coolant on the worktable 200 can be adjusted by adjusting the relative height between the spindle mechanism 300 and the worktable 200. This not only achieves precise flushing of the chip accumulation area, but also allows the same area of ​​the worktable 200 to be cleaned multiple times by coolant from different directions, improving the flexibility and efficiency of cleaning.

[0065] Please see Figure 9 and Figure 11 In some implementations, the spray directions of all the second nozzles 61 are different from each other.

[0066] In the plurality of second nozzles 61, the spraying directions of any two second nozzles 61 are at different angles in space. The spraying directions of each second nozzle 61 can point to different areas of the worktable 200 or to the same area of ​​the worktable 200. Since the spraying direction angles of all the second nozzles 61 are different, when the relative height between the spindle mechanism 300 and the worktable 200 changes, the offset of the landing point corresponding to each spraying direction is also different, which can form a richer combination of landing points and make the cleaning strategy more flexible and diverse. When the tool magazine 700 blocks the spraying in one direction, it can switch to the second nozzle 61 with another spraying direction for cleaning, further reducing the possibility of cleaning blind spots.

[0067] The liquid supply structure 100 of this application sets the spray direction of all the second nozzles 61 to be different from each other, so that each second nozzle 61 can point to the same or different areas of the worktable 200 at different angles. With the relative movement between the spindle mechanism 300 and the worktable 200, the most matching second nozzle 61 can be selected from multiple directions for conduction according to the actual accumulation position of the chips, and the relative height can be adjusted to adjust the landing position, realizing fine coverage in multiple directions and angles, further reducing the rinsing blind spots, and improving the comprehensiveness and flexibility of cleaning.

[0068] Please see Figure 11 In Figure (a), in some embodiments, a plurality of first nozzles 41 and a plurality of second nozzles 61 are arranged alternately at intervals along the circumference of the main axis 303 and are located on the same circumference. That is, the first nozzles 41 and the second nozzles 61 are both located on a circumference with the same radius centered on the axis M1, and are arranged alternately along this circumferential direction. For example, in a scheme with six first nozzles 41 and six second nozzles 61, the first nozzles 41, the second nozzles 61, the first nozzles 41, the second nozzles 61... are arranged sequentially along the circumference with an included angle of 30° between adjacent nozzles, thereby forming an alternating ring distribution.

[0069] Please see Figure 11 In Figure (b), in some embodiments, a plurality of first nozzles 41 and a plurality of second nozzles 61 are arranged on circumferences of different radii along the radial direction R of the main axis 303, and the first nozzles 41 and second nozzles 61 are spaced apart from each other on the same radial line R of the main axis 303. That is, the radius of the circumference where the first nozzle 41 is located is different from the radius of the circumference where the second nozzle 61 is located; the first nozzle 41 is located on the inner circle and the second nozzle 61 is located on the outer circle, or the first nozzle 41 is located on the outer circle and the second nozzle 61 is located on the inner circle. On the same radial line R, the first nozzles 41 and the second nozzles 61 are arranged in the same radial direction, and there is a predetermined radial distance between them.

[0070] Please see Figure 11 In Figure (c), in some embodiments, a plurality of first nozzles 41 and a plurality of second nozzles 61 are arranged on circumferences of different radii along the radial direction R of the main axis 303, and the first nozzles 41 and the second nozzles 61 are located on different radial lines R of the main axis 303. That is, the first nozzles 41 and the second nozzles 61 are located on circumferences of different radii, and the radial lines R on which the first nozzles 41 are located and the radial lines R on which the second nozzles 61 are located are offset from each other in the circumferential direction, that is, they are not on the same radial extension line.

[0071] The liquid supply structure 100 of this application embodiment uses various layout methods to arrange the first nozzle 41 and the second nozzle 61 in alternating circumferential arrangements on the same circumference, opposite arrangements on the same radial line on circumferences of different radii, or staggered arrangements on different radial lines on circumferences of different radii. This allows the first nozzle group 40 and the second nozzle group 60 to flexibly select the optimal arrangement scheme according to the space size below the spindle mechanism 300 and the size of the tool 6000. This optimizes the space utilization and ensures that the expansion of the circumferential coverage of the first nozzle group 40 on the tool 6000 and the wide coverage of the second nozzle group 60 on the worktable 200 do not interfere with each other. At the same time, the staggered arrangement of different radial lines further avoids mutual interference between adjacent nozzles when spraying coolant.

[0072] Please see Figure 9 In some embodiments, the first piping unit 50 includes a main pipe 51 and a plurality of branch pipes 53. One end of the main pipe 51 is connected to the first working position A of the switching unit 20, and the other end is connected to the plurality of branch pipes 53 respectively. The end of each branch pipe 53 away from the main pipe 51 is connected to a first nozzle 41 respectively. The switching unit 20 has a plurality of second working positions B, and the second piping unit 70 includes a plurality of liquid supply pipes 71. A plurality of second nozzles 61 are connected to the plurality of second working positions B one-to-one through the plurality of liquid supply pipes 71, and each second nozzle 61 is connected to the switching unit 20 through its corresponding second working position B.

[0073] Specifically, the first piping unit 50 consists of a main pipe 51 and multiple branch pipes 53. The main pipe 51 is a central pipe, one end of which is connected to the first working position A of the switching unit 20, and the other end is connected to multiple branch pipes 53 through connectors, forming a multi-branching structure. The multiple branch pipes 53 extend from the end of the main pipe 51 in different directions, and the end of each branch pipe 53 is connected to a first nozzle 41. After the coolant flows into the main pipe 51 through the first working position A, it is distributed to each branch pipe 53 at the connection between the main pipe 51 and the branch pipes 53, and then flows to each first nozzle 41.

[0074] The second piping unit 70 includes multiple supply lines 71. The switching unit 20 has multiple second working positions B, and multiple second nozzles 61 are connected to the multiple second working positions B one-to-one through the multiple supply lines 71. That is, each second working position B is connected to a corresponding second nozzle 61 through an independent supply line 71, and the supply lines 71 are independent of each other, with no flow diversion structure. When the switching unit 20 activates one of the multiple second working positions B, the coolant flows through that second working position B into the corresponding supply line 71, and is then directly supplied to the second nozzle 61 connected to that supply line 71. The coolant will not be diverted to other supply lines 71.

[0075] The liquid supply structure 100 of this embodiment sets the first pipeline unit 50 as a diversion structure of the main pipeline 51 and multiple branch pipelines 53, so that the coolant can be diverted to each first nozzle 41 after the first working position A is connected by the switching unit 20; while the second pipeline unit 70 consists of multiple independent liquid supply pipelines 71, and each second working position B is connected to the corresponding second nozzle 61 through an independent liquid supply pipeline 71, so that the coolant can be concentratedly supplied to the corresponding single second nozzle 61 after the second working position B is connected by the switching unit 20 without diversion, ensuring that the second nozzle 61 flushes the worktable 200 with a high spray pressure, realizing independent high-pressure spraying of multiple second nozzles 61, and allowing flexible selection of the corresponding nozzle for precise cleaning according to the area to be cleaned.

[0076] Please see Figures 5 to 7 In some embodiments, the first piping unit 50 includes a main pipe 51 and a plurality of branch pipes 53. One end of the main pipe 51 is connected to the first working position A of the switching unit 20, and the other end is connected to the plurality of branch pipes 53 respectively. The end of each branch pipe 53 away from the main pipe 51 is connected to a first nozzle 41 respectively. The second nozzle group 60 includes a second nozzle 61, and the second piping unit 70 includes a liquid supply pipe 71, one end of which is connected to the second working position B of the switching unit 20, and the other end is connected to the second nozzle 61.

[0077] Specifically, the first pipeline unit 50 consists of a main pipeline 51 and multiple branch pipelines 53, and its structure is the same as that in the aforementioned embodiment, so it will not be described again here. The difference is that the second nozzle group 60 in this embodiment includes only one second nozzle 61, rather than multiple second nozzles 61. The second pipeline unit 70 includes a liquid supply pipeline 71, one end of which is connected to the second working position B of the switching unit 20, and the other end is connected to the second nozzle 61. Since there is only one second nozzle 61, the first nozzle group 40 achieves liquid supply to multiple first nozzles 41 through the diversion structure of the main pipeline 51 and multiple branch pipelines 53, while the second nozzle group 60 achieves direct liquid supply to a single second nozzle 61 through a single liquid supply pipeline 71.

[0078] The liquid supply structure 100 of this embodiment sets the first pipeline unit 50 as a diversion structure of the main pipeline 51 and multiple branch pipelines 53, so that the coolant is diverted to each first nozzle 41 after passing through the switching unit 20 to the first working position A. Each first nozzle 41 cools the tool 6000 at a lower pressure. At the same time, the second pipeline unit 70 is a single liquid supply pipeline 71, so that the coolant is directly supplied to the second nozzle 61 after passing through the switching unit 20 to the second working position B without diversion. The second nozzle 61 flushes the worktable 200 at a higher pressure, which takes into account both the comprehensiveness of cooling and the thoroughness of cleaning. There is no need to add an additional pressure regulating valve or throttling element. The structure is simple and the cost is controllable.

[0079] Please see Figure 7 In some embodiments, the second nozzle 61 is oriented toward the axis M1 of the spindle 303, and the spray direction of the second nozzle 61 is directed below the tool 6000.

[0080] Specifically, the second nozzle 61 is mounted on the support member 301, and its spray direction is configured to face the axis M1 of the spindle 303 and point towards the working area below the tool 6000. The spray direction of the second nozzle 61 forms a certain angle with the axis M1 of the spindle 303. The fact that the spray direction of the second nozzle 61 points below the tool 6000 means that the spray path of the second nozzle 61 does not pass through the tool 6000 itself, but rather through the space between the tool 6000 and the worktable 200. In the machining state, the coolant sprayed from the second nozzle 61 is directly sprayed onto the workpiece surface, cooling the workpiece surface. Simultaneously, the coolant, after being reflected off the workpiece surface, can cover the tool tip area, achieving indirect cooling of the tool tip. In the cleaning state, since the spray path of the second nozzle 61 is not obstructed by the tool 6000, the coolant can directly spray onto the surface of the worktable 200, performing high-pressure flushing cleaning of the worktable 200.

[0081] The liquid supply structure 100 of this application sets the second nozzle 61 towards the axis M1 of the spindle 303 and towards the machining area below the tool 6000, so that the spray path of the second nozzle 61 avoids the obstruction of the tool 6000, ensuring that the coolant can be sprayed directly onto the workpiece surface at a high pressure. In the machining state, after the coolant is sprayed onto the workpiece surface, it can not only cool and clean the workpiece surface, but also reflect off the workpiece surface to the tool tip, achieving synchronous cooling of the tool tip. In the cleaning state, since the spray path is not obstructed by the tool 6000, the second nozzle 61 can directly wash the worktable 200 surface with a high-pressure jet, ensuring thorough cleaning. Thus, the second nozzle 61 can work effectively in both machining and cleaning modes without adjusting the spray direction, achieving a balance between structural simplification and functional reuse.

[0082] Please refer to the following: Figure 5 and Figure 12 ,or Figure 6 and Figure 12 ,or Figure 7 and Figure 12 ,or Figure 9 and Figure 12 This application also provides a control method applied to the aforementioned desktop processing equipment 1000. The control method includes: Step 02: Obtain the switching command.

[0083] Step 03: When the switching command is a machining command, the control switching unit 20 turns on the first working position A, so that the coolant provided by the liquid supply unit 10 is diverted to each of the first nozzles 41 through the first pipeline unit 50 to cool the tool 6000.

[0084] Step 07: When the switching command is a cleaning command, the control switching unit 20 turns on the second working position B, so that the coolant provided by the liquid supply unit 10 is supplied to the second nozzle 61 through the second pipeline unit 70 to flush the worktable 200.

[0085] Specifically, the switching command is a signal generated or received by the control device 500 to instruct the fluid supply structure 100 to switch operating modes. The switching command can originate from a manual command issued by the operator via an input device (e.g., a touchscreen), or it can originate from a command automatically generated by the control device 500 based on machining progress, machining time, or sensor signals. The switching commands include at least two types: machining commands and cleaning commands. Machining commands instruct the fluid supply structure 100 to enter machining mode, causing coolant to flow to the first nozzle group 40 to cool the tool 6000. Cleaning commands instruct the fluid supply structure 100 to enter cleaning mode, causing coolant to flow to the second nozzle group 60 to rinse and clean the worktable 200. After receiving the switching command, the control device 500 executes the corresponding control action according to the type of switching command. When the switching command is a machining command, the control device 500 controls the switching unit 20 to activate the first working position A. The coolant provided by the liquid supply unit 10 flows into the first pipeline unit 50 through the first working position A. After being split within the first pipeline unit 50, it flows to each of the first nozzles 41. After being sprayed from each of the first nozzles 41, it is directed towards the cutting tool 6000 to cool, lubricate, and remove chips. At this time, the second working position B is in the off state. When the switching command is a cleaning command, the control device 500 controls the switching unit 20 to activate the second working position B. The coolant provided by the liquid supply unit 10 flows into the second pipeline unit 70 through the second working position B. After being directly supplied to the second nozzles 61 through the second pipeline unit 70, it is sprayed towards the worktable 200 to flush and clean the worktable 200. At this time, the first working position A is in the off state.

[0086] The control method of this application obtains a switching command and controls the switching unit 20 to selectively activate the first working position A or the second working position B according to the command type, so that the coolant can be switched to the tool cooling circuit or the worktable cleaning circuit under the same supply unit 10 according to the actual working conditions, realizing the on-demand switching of the two functions under the single supply unit architecture.

[0087] Please refer to the following: Figure 9 and Figure 13In some embodiments, the second nozzle group 60 includes a plurality of second nozzles 61, and the second working position B includes a plurality of second nozzles 61, each second nozzle 61 corresponding to one second working position B. Step 07 includes: Step 071: Control switching unit 20 turns on one of the multiple second working positions B, so that the coolant provided by the liquid supply unit 10 is supplied to the second nozzle 61 corresponding to the second working position B through the second pipeline unit 70, so as to flush the worktable 200.

[0088] Specifically, in embodiments where the second nozzle group 60 includes multiple second nozzles 61, the switching unit 20 has multiple second working positions B, and each second nozzle 61 is connected to a corresponding second working position B via an independent liquid supply line 71. When a cleaning function is required, the control device 500 controls the switching unit 20 to activate one of the multiple second working positions B, rather than activating all second working positions B simultaneously. When the switching unit 20 activates a certain second working position B, the coolant provided by the liquid supply unit 10 flows through that second working position B into the corresponding liquid supply line 71, and then supplies the second nozzle 61 connected to that liquid supply line 71. Since the switching unit 20 activates only one second working position B at a time, the coolant is concentratedly supplied to a single second nozzle 61 and is not diverted at other second nozzles 61.

[0089] The control method of this application, when the second nozzle group 60 includes multiple second nozzles 61 and each nozzle corresponds to an independent working position, controls the switching unit 20 to selectively turn on one of the working positions, so that all the coolant provided by the liquid supply unit 10 is concentrated to supply a single second nozzle 61 without diversion, ensuring that the second nozzle 61 can flush the worktable 200 with a higher spray pressure, and avoiding the problem of insufficient pressure of each nozzle caused by multiple second nozzles 61 being turned on at the same time.

[0090] Please refer to the following: Figure 5 and Figure 14 ,or Figure 6 and Figure 14 ,or Figure 7 and Figure 14 ,or Figure 9 and Figure 14 In some implementations, the control method further includes: Step 04: Based on the area to be cleaned on the workbench 200, determine the target nozzle from a plurality of second nozzles 61, wherein the spray angle of the target nozzle is directed toward the area to be cleaned.

[0091] Step 071 includes: Step 0711: Control switching unit 20 turns on the second working position B corresponding to the target nozzle, so that the coolant provided by the liquid supply unit 10 is supplied to the target nozzle through the second pipeline unit 70 to flush the area to be cleaned on the worktable 200.

[0092] Specifically, the area to be cleaned is the chip accumulation area on the surface of the workbench 200 that needs to be flushed and cleaned. The control device 500 can determine the location of the area to be cleaned through visual recognition, machine learning prediction, or other methods. Once the area to be cleaned on the workbench 200 is determined, the control device 500 selects a second nozzle 61 from a plurality of second nozzles 61 whose spray direction points towards the area to be cleaned as the target nozzle. Since the spray directions of each second nozzle 61 are different from each other, different second nozzles 61 correspond to different areas of the workbench 200. The control device 500 determines the target nozzle based on the matching relationship between the location of the area to be cleaned and the spray directions of each second nozzle 61. After determining the target nozzle, the control device 500 controls the switching unit 20 to activate the second working position B corresponding to the target nozzle. The coolant provided by the liquid supply unit 10 flows into the corresponding liquid supply pipeline 71 through the second working position B, and then supplies it to the target nozzle. After being sprayed from the target nozzle, it is directed towards the area to be cleaned.

[0093] The control method of this application determines the target nozzle from multiple second nozzles 61 according to the area to be cleaned on the workbench 200, and controls the switching unit 20 to turn on the working position corresponding to the target nozzle, so that the cleaning action can accurately point to the location of the chips, avoiding the rinsing deviation caused by blindly switching nozzles, and improving the accuracy and efficiency of cleaning.

[0094] Please refer to the following: Figure 5 and Figure 15 ,or Figure 6 and Figure 15 ,or Figure 7 and Figure 15 ,or Figure 9 and Figure 15 In some implementations, when the switching command is a cleaning command, the control method further includes: Step 06: Control the spindle mechanism 300 to move relative to the worktable 200, so as to drive the second nozzle 61 to flush and clean the worktable 200.

[0095] Specifically, the desktop machining equipment 1000 has a drive system that enables relative movement between the spindle mechanism 300 and the worktable 200. For example, the spindle mechanism 300 can move along a first horizontal direction X and a vertical direction Z, and the worktable 200 can move along a second horizontal direction Y. The control device 500 enables relative movement between the spindle mechanism 300 and the worktable 200 by controlling the drive system of the spindle mechanism 300 and / or the drive system of the worktable 200. In cleaning mode, the second nozzle 61 is fixed to the carrier 301 and moves with the carrier 301. When the spindle mechanism 300 and the worktable 200 move relative to each other, the position of the second nozzle 61 relative to the worktable 200 changes, thereby enabling coolant to be sprayed onto different areas of the worktable 200.

[0096] The control method of this application controls the relative movement of the spindle mechanism 300 and the worktable 200 under the cleaning command, so as to drive the second nozzle 61 to flush and clean the worktable 200. By utilizing the existing degrees of freedom of motion of the spindle mechanism 300 and the worktable 200 in the desktop processing equipment 1000, the second nozzle 61 and the worktable 200 can form a relative sweeping motion covering the entire plane of the worktable 200, so as to achieve comprehensive flushing and cleaning of the worktable 200 surface. There is no need to set up an additional independent cleaning drive mechanism, which simplifies the equipment structure and improves the automated cleaning capability of the desktop processing equipment 1000.

[0097] Please refer to the following: Figure 5 and Figure 16 ,or Figure 6 and Figure 16 ,or Figure 7 and Figure 16 ,or Figure 9 and Figure 16 In some implementations, step 06 includes: Step 061: Control the spindle mechanism 300 and the worktable 200 to move relative to each other along a predetermined path, so as to drive the spray range of the second nozzle 61 to cover the area to be cleaned on the worktable 200. The predetermined path is an arc path, a serpentine path, a spiral path or a grid path.

[0098] Specifically, the predetermined path is a pre-set relative motion trajectory between the spindle mechanism 300 and the worktable 200. An arc-shaped path refers to the spindle mechanism 300 moving relative to the worktable 200 along an arc-shaped trajectory. A serpentine path refers to moving along an S-shaped trajectory. A spiral path refers to moving along a spiral trajectory. A grid path refers to moving row by row and column by column in two mutually perpendicular directions. The control device 500 selects a path from the above paths based on the shape and size of the worktable 200 and the spray coverage of the second nozzle 61, and controls the drive system of the spindle mechanism 300 and / or the worktable 200 to move along that path.

[0099] The control method of this application controls the spindle mechanism 300 and the worktable 200 to move relative to each other along a predetermined path under the cleaning command, so as to drive the second nozzle 61 to traverse the worktable 200. By utilizing the coordinated operation of the existing degrees of freedom of motion, such as the movement of the spindle mechanism 300 along the first horizontal direction X and the movement of the worktable 200 along the second horizontal direction Y, a relative sweeping motion in a two-dimensional plane is formed between the second nozzle 61 and the worktable 200. This results in a programmed and regular path covering the entire surface of the worktable 200, ensuring the comprehensiveness and repeatability of cleaning and avoiding missed cleaning areas. At the same time, the multiple selectable modes of bow-shaped path, serpentine path, spiral path or grid path allow the operator to select the optimal movement strategy according to the shape of the worktable 200, the characteristics of debris distribution and cleaning time requirements, further improving the flexibility and efficiency of self-cleaning.

[0100] Please refer to the following: Figure 5 and Figure 17 ,or Figure 6 and Figure 17 ,or Figure 7 and Figure 17 ,or Figure 9 and Figure 17 In some implementations, when the switching command is a cleaning command, the control method further includes: Step 051: Acquire image information from workbench 200; Step 052: Based on the image information, determine the area to be cleaned on the workbench 200, including the chip accumulation area; and, Step 053: Determine the target cleaning position of the spindle mechanism 300 based on the area to be cleaned.

[0101] Step 06 includes: Step 063: Control the spindle mechanism 300 to move to the target cleaning position so that the second nozzle 61 can flush and clean the area to be cleaned.

[0102] Specifically, the desktop machining equipment 1000 also includes a vision module 600, which is used to acquire image information from the worktable 200. The vision module 600 may include an industrial camera, webcam, or other image acquisition device. After acquiring the image information, the control device 500 processes and analyzes the image information, identifies the area of ​​chip accumulation in the image, and determines the area to be cleaned. After the area to be cleaned is determined, the control device 500 calculates the position to which the second nozzle 61 needs to move based on the position of the area to be cleaned on the worktable 200; this position is the target cleaning position. The control device 500 controls the spindle mechanism 300 to move to the target cleaning position. At this position, the switching unit 20 activates the second working position B, and the coolant sprayed by the second nozzle 61 is directed towards the area to be cleaned.

[0103] The control method of this application acquires image information of the worktable 200 under a cleaning command, determines the area to be cleaned on the worktable 200 based on the image information, determines the target cleaning position of the spindle mechanism 300 based on the area to be cleaned, and then controls the spindle mechanism 300 to move to the target cleaning position so that the second nozzle 61 is aligned with the area to be cleaned for rinsing and cleaning. This achieves precise positioning cleaning based on visual feedback, which greatly shortens the cleaning time and saves coolant consumption compared to traversing the entire worktable.

[0104] Please refer to the following: Figure 5 and Figure 18 ,or Figure 6 and Figure 18 ,or Figure 7 and Figure 18 ,or Figure 9 and Figure 18 In some implementations, the cleaning instruction is generated via steps 011, 012 and 013.

[0105] Step 011: Acquire image information from workbench 200; Step 012: Identify the chips on the worktable 200 based on image information and determine the chip accumulation parameters; and, Step 013: When the accumulation parameters reach the preset cleaning threshold, a cleaning instruction is generated.

[0106] Specifically, the control device 500 continuously or periodically acquires image information of the worktable 200 through the vision module 600. The accumulation parameter is a quantitative indicator characterizing the degree of chip accumulation on the worktable 200, and can be at least one of the chip accumulation thickness, accumulation area, and accumulation volume. In some embodiments, the vision module 600 is a three-dimensional vision module 600, capable of acquiring three-dimensional image information of the worktable 200. The control device 500 performs three-dimensional reconstruction based on the three-dimensional image information to obtain depth information of the worktable 200 surface, and determines the chip accumulation thickness based on the depth information. The preset cleaning threshold is a pre-set threshold used to determine whether a cleaning command needs to be triggered. When the accumulation parameter reaches or exceeds the preset cleaning threshold, the control device 500 generates a cleaning command.

[0107] The control method of this application acquires image information of the workbench 200 during the cleaning instruction generation process, identifies chips on the workbench 200 based on the image information, and determines the chip accumulation parameters. This makes the generation of the cleaning instruction not only dependent on the presence of chips, but also based on the actual degree of chip accumulation. The cleaning instruction is triggered only when the accumulation parameters reach the preset cleaning threshold, avoiding processing interruptions and coolant waste caused by frequent cleaning when there are only a few chips, and also avoiding the impact on processing quality caused by cleaning only after excessive chip accumulation. This achieves precise control of the cleaning timing and further improves the automation and intelligence level of the desktop processing equipment 1000.

[0108] Please refer to the following: Figure 5 and Figure 19 ,or Figure 6 and Figure 19 ,or Figure 7 and Figure 19 ,or Figure 9 and Figure 19 In other embodiments, the cleaning instruction is generated via steps 014, 015, 017 and 019.

[0109] Step 014: Obtain the machining process data generated by the process planning module. The machining process data includes at least one of the following: tool path and tool parameters, workpiece material, spindle speed, feed rate, and depth of cut. Step 015: Based on the processing technology data, determine the expected chip generation per unit time during the processing; Step 017: Based on the expected chip generation per unit time, determine the expected cumulative chip generation during the processing; and, Step 019: When the expected cumulative amount of chips reaches the preset cleaning threshold, a cleaning instruction is generated.

[0110] Specifically, the process planning module is a functional module within the control device 500 of the desktop machining equipment 1000, used to generate machining process data. This data includes various parameters related to chip generation during machining. Based on the machining process data and material cutting performance parameters, the control device 500 calculates the expected amount of chips generated per unit time. During machining, chips are continuously generated and accumulate. The control device 500 calculates the expected cumulative chip amount based on the expected chip generation per unit time and the machining duration. When the expected cumulative chip amount reaches a preset cleaning threshold, the control device 500 generates a cleaning command.

[0111] The control method of this application acquires processing technology data and determines the expected chip generation per unit time based on the processing technology data. Then, it determines the expected chip accumulation based on the expected chip generation per unit time. When the expected chip accumulation reaches a preset cleaning threshold, a cleaning command is generated. This makes the generation of the cleaning command independent of real-time detection by the vision sensor, but is triggered before the chip accumulation reaches the threshold. This achieves predictive active cleaning based on process parameters, avoids chip accumulation caused by untimely cleaning, reduces the dwell time of debris on the workbench 200, and further improves the automated cleaning capability of the desktop processing equipment 1000.

[0112] Please refer to the following: Figure 5 and Figure 20 ,or Figure 6 and Figure 20 ,or Figure 7 and Figure 20 ,or Figure 9 and Figure 20 In some implementations, the control method further includes the following during the execution of cleaning instructions: Step 08: During the execution of the cleaning command, keep the tool 6000 loaded at the output end 3031 of the spindle 303.

[0113] Specifically, during the cleaning instruction execution, the desktop machining equipment 1000 is in cleaning mode. In cleaning mode, the switching unit 20 activates the second working position B, and the second nozzle 61 sprays coolant onto the worktable 200 to flush and clean it. During the cleaning process, the control device 500 controls the spindle 303 to maintain the loaded tool 6000, i.e., it does not perform the unloading operation of the tool 6000. The tool 6000 remains loaded on the output end 3031 of the spindle 303, forming a shield and protection for the output end 3031 of the spindle 303, preventing high-pressure coolant and splashed debris from entering the output end 3031 of the spindle 303.

[0114] The control method of this application, under the cleaning command, controls the spindle 303 to maintain the loaded tool 6000, so that the tool 6000 forms a shield to protect the output end 3031 of the spindle 303, preventing high-pressure coolant and splashed debris from splashing into the output end 3031 of the spindle 303, and preventing contamination or damage to the precision structure of the output end 3031 of the spindle 303.

[0115] Please refer to the following: Figure 5 and Figure 21 ,or Figure 6 and Figure 21 ,or Figure 7 and Figure 21 ,or Figure 9 and Figure 21In some implementations, the control method further includes steps 091 and 093.

[0116] Step 091: During the machining process, in response to the chip removal command, the control switching unit 20 switches from the first working position A to the second working position B, so that the coolant provided by the liquid supply unit 10 is supplied to the second nozzle 61 through the second pipeline unit 70, and the second nozzle 61 sprays coolant into the machining area between the tool 6000 and the worktable 200 or onto the worktable 200.

[0117] Step 093: After chip removal is completed, the control switching unit 20 switches from the second working position B to the first working position A, so that the coolant provided by the liquid supply unit 10 is diverted to multiple first nozzles 41 through the first pipeline unit 50 to restore the cooling of the tool 6000.

[0118] Specifically, the chip removal command is a command triggered during the machining process to perform a chip removal operation midway. The chip removal command can be automatically generated by the control device 500 based on the degree of chip accumulation, or it can be manually triggered by the operator. In long-duration machining scenarios, chips are continuously generated and accumulate on the worktable 200. When the chips accumulate to a certain level, the control device 500 responds to the chip removal command and controls the switching unit 20 to switch from the first working position A to the second working position B. After the switch is completed, the coolant provided by the liquid supply unit 10 no longer flows to the first nozzle group 40, but is supplied to the second nozzle 61 via the second pipeline unit 70. The second nozzle 61 sprays coolant into the machining area between the tool 6000 and the worktable 200, or onto the worktable 200, to flush away the accumulated chips. After the chip removal operation is completed, the control device 500 controls the switching unit 20 to switch back from the second working position B to the first working position A, so that the coolant is again diverted through the first pipeline unit 50 to the multiple first nozzles 41, restoring cooling to the tool 6000.

[0119] The control method of this application, in response to a chip removal command during processing, controls the switching unit 20 to switch from the first working position A to the second working position B, causing the second nozzle 61 to spray coolant onto the processing area or the working table 200 between the tool 6000 and the worktable 200. This allows for chip removal of the processing area or the worktable 200 without stopping the machine during processing. After chip removal is completed, the control switching unit 20 switches back from the second working position B to the first working position A, allowing the first nozzle 41 to resume cooling of the tool 6000, ensuring immediate recovery of the cooling function after chip removal. Thus, the desktop processing equipment 1000 of this application can flexibly perform chip removal during long-term processing without stopping the processing process, based on the chip accumulation situation, and seamlessly switch back to the cooling mode after chip removal is completed. This ensures both processing continuity and efficiency, while avoiding the impact of excessive chip accumulation on processing quality.

[0120] Please see Figure 22 This application also provides a control device 500. The control device 500 includes a processor 501 and a memory 503. The memory 503 stores a computer program, which, when executed by the processor 501, causes the processor 501 to perform the control method described in any of the above embodiments.

[0121] Specifically, the control device 500 is a device in the desktop processing equipment 1000 used to perform logical operations and control operations. The control device 500 can be located inside the desktop processing equipment 1000 or externally, and can communicate with the controlled components of the desktop processing equipment 1000 via wired or wireless means. The processor 501 is a device in the control device 500 used to execute computer programs and perform data processing and logical operations. The processor 501 may include one or more processing units, such as a central processing unit, a digital signal processor, an application-specific integrated circuit (ASIC), or a field-programmable gate array (FPGA). The processor 501 is communicatively connected to the memory 503 via a bus and can read computer program instructions stored in the memory 503. The memory 503 is a storage medium in the control device 500 used to store data and computer programs. The memory 503 may include volatile memory and / or non-volatile memory, such as random access memory (RAM), read-only memory (ROM), flash memory, hard disk, or solid-state drive (SSD). The memory 503 stores a computer program. When the computer program is executed by the processor 501, it causes the processor 501 to perform the control method of any of the above embodiments, including but not limited to steps 02, 03, 07, 071, 0711, 04, 06, 061, 051 to 053, 063, 011 to 013, 014 to 019, 08, 091 and 093.

[0122] The control device 500 of this application executes the computer program stored in the memory 503 through the processor 501, and can automatically control the switching unit 20, the relative movement of the spindle mechanism 300 and the worktable 200, the generation of cleaning instructions, and the mid-process chip removal without manual intervention. The complete control process from processing cooling to worktable cleaning and mid-process chip removal can be completed without manual intervention, further improving the automation level of the desktop processing equipment 1000.

[0123] Please see Figure 23 This application also provides a processing system 10000. The processing system 10000 includes the control device 500 of the above embodiments. The control device 500 includes a processor 501 and a memory 503. The memory 503 stores a computer program, which, when executed by the processor 501, causes the processor 501 to execute the control method of any of the above embodiments.

[0124] The machining system 10000 of this application is equipped with a control device 500. The processor 501 of the control device 500 executes the computer program stored in the memory 503. It can automatically control the switching unit 20, the relative movement of the spindle mechanism 300 and the worktable 200, the generation of cleaning instructions, and the mid-process chip removal without manual intervention. The entire control process from machining cooling to worktable cleaning and mid-process chip removal can be completed without manual intervention, which further improves the automation level of the machining system 10000.

[0125] Please see Figure 24 In other embodiments, the machining system 10000 includes a desktop machining device 1000, a dust collection device 3000, and / or a collection device 5000. The desktop machining device 1000 is any of the desktop machining devices described above, and includes a fluid supply structure 100. The fluid supply structure 100 is used to spray coolant into the machining area between the tool 6000 and the workpiece during machining to cool, lubricate, and remove chips from the tool 6000. The dust collection device 3000 is connected to the desktop machining device 1000 and configured to collect chips generated during the machining of the workpiece by the desktop machining device 1000. The collection device 5000 is connected to the desktop machining device 1000 and configured to collect chips generated during the machining of the workpiece by the desktop machining device 1000 and to recover the coolant used during the machining of the workpiece by the desktop machining device 1000, and to circulate the coolant back into the desktop machining device 1000.

[0126] Specifically, the machining system 10000 is a system composed of a desktop machining device 1000 and other devices that directly or indirectly perform machining to assist the desktop machining device 10000. The various components of the machining system 10000 are connected and interact with each other through pipes, cables or wireless communication to exchange materials, energy or signals.

[0127] The desktop machining equipment 1000 includes a coolant supply structure 100. In machining mode, the coolant supply structure 100, via a switching unit 20, activates a first working position A, allowing coolant to be distributed through a first piping unit 50 to multiple first nozzles 41. Each first nozzle 41 sprays coolant onto a cutting tool 6000, cooling, lubricating, and removing chips. In cleaning mode, the coolant supply structure 100, via a switching unit 20, activates a second working position B, allowing coolant to be supplied through a second piping unit 70 to second nozzles 61. The second nozzles 61 spray coolant onto a worktable 200, cleaning the worktable 200. After use, the coolant sprayed by the coolant supply structure 100 mixes with chips generated during machining, forming waste liquid containing chips. This waste liquid is discharged through the chip discharge port of the desktop machining equipment 1000.

[0128] The dust collection device 3000 is used to collect chips generated by the desktop machining equipment 1000 during machining. The dust collection device 3000 is connected to the chip discharge port 101 of the desktop machining equipment 1000. The dust collection device 3000 creates an airflow by driving air movement; the airflow flows from the chip discharge port 101 of the desktop machining equipment 1000 to the dust collection device 3000, carrying the chips into the dust collection device 3000. The dust collection device 3000 includes a dust collection bag or a dust collection box. The dust collection device 3000 is suitable for dry machining scenarios, i.e., machining methods that do not use coolant for cooling, such as the machining of materials like wood and plastics. In dry machining scenarios, the coolant supply structure 100 does not spray coolant into the machining area; the chips generated during machining are directly drawn and collected by the dust collection device 3000 through the chip discharge port 101.

[0129] The collection device 5000 is used to collect chips and recover coolant generated during machining by the desktop machining equipment 1000. The collection device 5000 is connected to the chip discharge port 101 of the desktop machining equipment 1000. During machining, the coolant supply structure 100 sprays coolant into the machining area. The used coolant, mixed with chips, flows into the chip discharge space of the desktop machining equipment 1000 under gravity and is discharged through the chip discharge port 101 to the collection device 5000. The collection device 5000 includes a filter and a reservoir. The filter separates the coolant mixed with chips into solid and liquid components, trapping the chips within the filter and sending the filtered coolant into the reservoir. The reservoir is connected to the supply unit 10 via a return pipe, allowing the filtered coolant to be recycled back into the supply structure 100 for reuse. The collection device 5000 is suitable for wet machining scenarios, i.e., machining methods that require coolant for cooling and lubrication, such as the machining of metal materials.

[0130] It is understood that the machining system 10000 may consist only of the desktop machining equipment 1000 and the dust collection equipment 3000, suitable for applications requiring only dry machining. The machining system 10000 may also consist only of the desktop machining equipment 1000 and the collection equipment 5000, suitable for applications requiring only wet machining. The machining system 10000 may also simultaneously include the desktop machining equipment 1000, the dust collection equipment 3000, and the collection equipment 5000. Users can select the appropriate chip removal path based on the material of the workpiece and the machining method, making the machining system 10000 compatible with both dry dust removal and wet recycling operating modes. This application does not impose any restrictions on this.

[0131] The processing system 10000 of this application is equipped with a dust collection device 3000 and / or a collection device 5000 connected to the desktop processing equipment 1000. The dust collection device 3000 achieves negative pressure suction and collection of chips, preventing chips from scattering in the working environment, contaminating the equipment, and affecting the health of the operators. The collection device 5000 realizes the collection, filtration, separation, and recycling of coolant mixed with chips, enabling the coolant supply structure 100 to reuse the recovered coolant for subsequent processing, reducing coolant consumption and waste liquid treatment costs. Users can flexibly select the dust collection device 3000 and / or the collection device 5000 according to the processing material, making the processing system 10000 compatible with both dry dust removal and wet recycling working states, further improving the application flexibility of the processing system 10000.

[0132] Please see Figure 25 This application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program, which, when executed by the processor 501, causes the processor 501 to perform the control method described in any of the above embodiments.

[0133] Specifically, a computer-readable storage medium is any medium capable of storing a computer program and being read by a computer. The computer-readable storage medium can be a non-volatile storage medium, such as a read-only memory, flash memory, hard disk, solid-state drive, optical disk, or magnetic tape. When the computer program stored in the computer-readable storage medium is executed by the processor 501, the processor 501 performs the control method of any of the above embodiments, including but not limited to steps 02 to 03, step 07, step 071, step 0711, step 04, step 06, step 061, steps 051 to 053, step 063, steps 011 to 013, steps 014 to 019, step 08, step 091, and step 093. The computer-readable storage medium can exist independently of the desktop processing device 1000, or it can be disposed within the desktop processing device 1000 or the control device 500. In some embodiments, the computer-readable storage medium is a removable storage medium such as a USB flash drive, portable hard disk, optical disk, or memory card. In other embodiments, the computer-readable storage medium is a storage device on a server or cloud storage space, and the computer program is acquired and executed by the processor 501 by means of network download or online execution.

[0134] The computer-readable storage medium of this application stores a computer program, enabling the above-mentioned control method to be independently copied, distributed, and deployed to different desktop processing equipment 1000 in the form of a computer program, without having to rewrite the control logic for each desktop processing equipment 1000, thus facilitating the standardized application and mass promotion of the liquid supply structure 100 control method.

[0135] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification. At the same time, other implementation methods can be derived from the above embodiments, so that structural and logical substitutions and changes can be made without departing from the scope of this disclosure.

[0136] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A fluid supply structure applied to a desktop machining equipment, the desktop machining equipment including a spindle mechanism and a worktable for placing a workpiece, the spindle mechanism being configured to be disposed opposite to the worktable, and including a support member and a spindle, the spindle being mounted on the support member, the output end of the spindle being used to load a cutting tool and drive the cutting tool to move to machine the workpiece; characterized in that, At least a portion of the liquid supply structure is disposed on the carrier, and the liquid supply structure includes: The coolant supply unit is used to supply coolant. The switching unit is connected to the supply unit via an infusion pipeline and has at least a first working position and a second working position; A first nozzle group is connected to the first working position via a first piping unit. The first nozzle group includes a plurality of first nozzles, each of which faces the cutting tool at a different angle. The second nozzle assembly is connected to the second working position via a second pipeline unit and includes a second nozzle, which is positioned toward the worktable. The switching unit is configured to selectively turn on the first working bit or the second working bit; When the first working position is turned on, the coolant provided by the liquid supply unit is diverted to each of the first nozzles after passing through the first working position, thereby cooling at least the cutting tool; when the second working position is turned on, the coolant provided by the liquid supply unit is supplied to the second nozzles after passing through the second working position, thereby rinsing the worktable. When the liquid supply unit operates with the same operating parameters, the liquid output per unit time of the second nozzle is greater than the liquid output per unit time of any of the first nozzles, and / or the spray pressure of the second nozzle is greater than the spray pressure of any of the first nozzles.

2. The liquid supply structure according to claim 1, characterized in that, Multiple first nozzles are arranged at intervals around the axis of the main shaft.

3. The liquid supply structure according to claim 1, characterized in that, The second nozzle group includes a plurality of second nozzles, which are arranged at intervals around the axis of the main shaft. The switching unit has a plurality of second working positions, and the plurality of second nozzles are arranged in a one-to-one correspondence with the plurality of second working positions. The switching unit is configured to selectively switch to one of the plurality of second working positions so that the liquid supply unit is connected to the second nozzle corresponding to the second working position.

4. The liquid supply structure according to claim 3, characterized in that, The injection directions of at least two of the second nozzles are different from each other.

5. The liquid supply structure according to claim 4, characterized in that, The spray directions of all the second nozzles are different from each other.

6. The liquid supply structure according to claim 3, characterized in that, A plurality of first nozzles and a plurality of second nozzles are arranged alternately at intervals along the circumference of the main axis and are located on the same circumference; or, A plurality of first nozzles and a plurality of second nozzles are arranged radially along the main shaft on circumferences of different radii, and on the same radial line of the main shaft, the first nozzles and the second nozzles are arranged at intervals relative to each other; or, The first nozzles and the second nozzles are respectively arranged on circumferences of different radii along the radial direction of the main shaft, and the first nozzles and the second nozzles are located on different radial lines of the main shaft.

7. The liquid supply structure according to claim 3, characterized in that, The first pipeline unit includes a main pipeline and multiple branch pipelines. One end of the main pipeline is connected to the first working position of the switching unit, and the other end is connected to multiple branch pipelines. The end of each branch pipeline away from the main pipeline is connected to the first nozzle. The switching unit has multiple second working positions. The second pipeline unit includes multiple liquid supply pipelines. Multiple second nozzles are connected to multiple second working positions one-to-one through multiple liquid supply pipelines. Each second nozzle is connected to the switching unit through its corresponding second working position.

8. The liquid supply structure according to claim 1, characterized in that, The first pipeline unit includes a main pipeline and multiple branch pipelines. One end of the main pipeline is connected to the first working position of the switching unit, and the other end is connected to the multiple branch pipelines respectively. The end of each branch pipeline away from the main pipeline is connected to the first nozzle. The second nozzle group includes a second nozzle. The second pipeline unit includes a liquid supply pipeline. One end of the liquid supply pipeline is connected to the second working position of the switching unit, and the other end is connected to the second nozzle.

9. The liquid supply structure according to any one of claims 1 to 8, characterized in that, The second nozzle is oriented towards the axis of the spindle, and the spray direction of the second nozzle is directed downwards from the cutting tool.

10. A desktop processing device, characterized in that, include: A workbench is used to place workpieces. A spindle mechanism, disposed above the worktable, includes a support member and a spindle. The spindle is mounted on the support member, and its output end is used to load a cutting tool and drive the cutting tool to move in order to process the workpiece; and, The liquid supply structure according to any one of claims 1 to 9, wherein the first nozzle group in the liquid supply structure faces the cutting tool and the second nozzle group faces the worktable.

11. A control method applied to the desktop processing equipment of claim 10, characterized in that, The control method includes: Obtain the switching instruction; When the switching command is a machining command, the switching unit is controlled to turn on the first working position, so that the coolant provided by the liquid supply unit is diverted to each of the first nozzles through the first pipeline unit to cool the cutting tool; When the switching command is a cleaning command, the switching unit is controlled to turn on the second working position, so that the coolant provided by the liquid supply unit is supplied to the second nozzle through the second pipeline unit to flush the worktable.

12. The control method according to claim 11, characterized in that, The second nozzle group includes multiple second nozzles, and the second working position includes multiple second nozzles, with each second nozzle corresponding to one second working position; controlling the switching unit to activate the second working position, so that the coolant provided by the liquid supply unit is supplied to the second nozzles through the second pipeline unit to flush the worktable, includes: The switching unit is controlled to activate one of the multiple second working positions, so that the coolant provided by the liquid supply unit is supplied to the second nozzle corresponding to the second working position through the second pipeline unit to flush the worktable.

13. The control method according to claim 12, characterized in that, Also includes: Based on the area to be cleaned on the workbench, a target nozzle is determined from a plurality of second nozzles, wherein the spray angle of the target nozzle is directed toward the area to be cleaned; The control unit activates one of the plurality of second working positions, causing the coolant provided by the supply unit to be supplied via the second pipeline unit to the second nozzle corresponding to that second working position, so as to flush the worktable, including: The switching unit is controlled to activate the second working position corresponding to the target nozzle, so that the coolant provided by the liquid supply unit is supplied to the target nozzle through the second pipeline unit to flush the area to be cleaned on the worktable.

14. The control method according to claim 11, characterized in that, When the switching command is a cleaning command, the control method further includes: The spindle mechanism is controlled to move relative to the worktable, so as to drive the second nozzle to flush and clean the worktable.

15. The control method according to claim 14, characterized in that, The control of the spindle mechanism to move relative to the worktable, thereby driving the second nozzle to flush and clean the worktable, includes: The spindle mechanism is controlled to move relative to the worktable along a predetermined path, so as to drive the spray range of the second nozzle to cover the area to be cleaned on the worktable. The predetermined path is an arc path, a serpentine path, a spiral path, or a grid path.

16. The control method according to claim 14, characterized in that, When the switching command is a cleaning command, the control method further includes: Acquire image information of the workbench; Based on the image information, the area to be cleaned on the workbench is determined, the area to be cleaned including the chip accumulation area; and, Determine the target cleaning position of the spindle mechanism based on the area to be cleaned; The control of the relative movement between the spindle mechanism and the worktable to drive the second nozzle to flush and clean the worktable includes: The spindle mechanism is controlled to move to the target cleaning position so that the second nozzle can flush and clean the area to be cleaned.

17. The control method according to claim 11, characterized in that, The cleaning instruction is generated through the following steps: Acquire image information of the workbench; Based on the image information, identify the chips on the worktable and determine the chip accumulation parameters; and, When the accumulation parameter reaches the preset cleaning threshold, the cleaning instruction is generated.

18. The control method according to claim 11, characterized in that, The cleaning instruction is generated through the following steps: Acquire machining process data generated by the process planning module. The machining process data includes at least one of the following: tool path and tool parameters, workpiece material, spindle speed, feed rate, and depth of cut. Based on the processing technology data, determine the expected chip generation per unit time during the processing; Based on the expected chip generation per unit time, determine the expected cumulative chip generation during the processing; and, When the expected cumulative amount of chips reaches the preset cleaning threshold, the cleaning instruction is generated.

19. The control method according to claim 11, characterized in that, During the execution of the cleaning command, the tool remains loaded at the output end of the spindle.

20. The control method according to claim 11, characterized in that, The control method further includes: During machining, in response to a chip removal command, the switching unit is controlled to switch from the first working position to the second working position, so that the coolant provided by the supply unit is supplied to the second nozzle through the second pipeline unit, and the second nozzle sprays the coolant into the machining area between the tool and the worktable or onto the worktable; and... After chip removal is completed, the switching unit is controlled to switch from the second working position to the first working position, so that the coolant provided by the liquid supply unit is diverted to multiple first nozzles through the first pipeline unit to restore cooling to the tool.

21. A control device, characterized in that, The control device includes a processor and a memory, the memory storing a computer program, which, when executed by the processor, causes the processor to perform the control method according to any one of claims 11 to 20.

22. A processing system, characterized in that, Includes the control device as described in claim 21; or, includes: The desktop-level processing equipment as described in claim 10; A dust collection device, connected to the desktop machining equipment, and configured to collect chips generated during the machining of workpieces by the desktop machining equipment; and / or A collection device is connected to the desktop machining equipment and configured to collect chips generated by the desktop machining equipment during workpiece processing and to recover the coolant used by the desktop machining equipment during workpiece processing, and to circulate the coolant back into the desktop machining equipment.

23. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, causes the processor to perform the control method according to any one of claims 11 to 20.

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