A PCB safety adsorption area dynamic generation method and system

Abstract

The application discloses a kind of PCB safety adsorption area dynamic generation method, comprising: PCB board image is collected by industrial camera;Image is handled, and PCB edge contour, copper foil circuit area, hollow area, component area and forbidden suction mark area are identified;According to the recognition result, region coordinate model is established, and PCB board surface is divided into adsorbable area and non-adsorbable area;In adsorbable area, suction cup can be placed area, safety margin, suction center point position and suction quantity are dynamically calculated, and suction coordinate information is generated;Robot executes gripping according to suction coordinate and priority level.The method of the application dynamically generates safe suction position, avoids suction cup adsorption on line dense area, effectively reduces PCB copper foil bruise, line breakage and other quality risks, and is especially suitable for the automated production of high-precision PCB such as HDI board, ultra-fine circuit board.The application also provides a kind of PCB safety adsorption area dynamic generation system.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, specifically to a method and system for dynamically generating a PCB safety adsorption area. Background Technology

[0002] Currently, most automated board handling equipment in the PCB industry uses a fixed suction cup coordinate system for gripping. This traditional method has the following problems: it cannot identify PCB circuit areas; it cannot identify restricted areas; the suction cup may directly adhere to areas with dense circuitry; it easily causes damage to copper foil; it easily leads to deformation or breakage of delicate circuits; it easily causes scratches on the solder mask; and it has poor compatibility with high-precision PCBs. Especially in products such as HDI boards, high-frequency and high-speed boards, ultra-fine circuit boards, thin boards, and high-layer boards, the traditional fixed suction method poses a significant quality risk.

[0003] Therefore, it is necessary to provide a new process to solve the above-mentioned technical problems. Summary of the Invention

[0004] The purpose of this invention is to provide a method and system for dynamically generating a safe adsorption area for PCBs. By automatically identifying the edge area, line area, and no-adsorption area of ​​the PCB using machine vision, a safe adsorption position is dynamically generated, so as to adsorb only the safe area of ​​the PCB and avoid adsorbing the delicate line area, thereby reducing the risk of PCB damage and improving the reliability and compatibility of automated board take-up and take-down systems.

[0005] The technical solution of this invention is:

[0006] A method for dynamically generating a PCB security adsorption area includes the following steps:

[0007] Step S1: Acquire an image of the PCB board to be adsorbed using an industrial camera to obtain a grayscale or color image of the PCB board.

[0008] Step S2: Perform image processing on the acquired PCB image to identify the edge contour of the PCB board, copper foil circuit area, hollow area, component area and preset no-sucking mark area;

[0009] Step S3: Based on the identification results of step S2, establish a regional coordinate model of the PCB board and divide the PCB board surface into a region that can be attracted and a region that cannot be attracted. The region that cannot be attracted includes at least a dense circuit region, a cutout region, a component region, and a region marked with a no-attraction sign.

[0010] Step S4: Within the adsorption area, based on the physical parameters of the suction cup, vacuum adsorption requirements, and PCB board weight parameters, dynamically calculate the area where the suction cup can be placed, the safety margin, the adsorption center point position, and the required adsorption quantity to generate a safe adsorption area.

[0011] Step S5: Generate adsorption coordinate information based on the calculation results of step S4. The adsorption coordinate information includes X coordinate, Y coordinate, adsorption angle, and adsorption priority.

[0012] S6. Send the adsorption coordinate information to the robot control system to control the robot to perform the PCB board grasping operation.

[0013] Further, in step S2, the image processing includes:

[0014] Based on edge extraction algorithms, the outline of the PCB board is identified.

[0015] Based on the region segmentation algorithm, copper foil circuit regions are identified and densely packed circuit regions are determined.

[0016] Based on image segmentation algorithm and connected component analysis algorithm, the hollow region is identified;

[0017] Based on feature recognition algorithms, the preset no-smoking marking areas and component areas are identified.

[0018] Furthermore, the method for identifying copper foil circuit regions and determining densely packed circuit regions specifically includes:

[0019] The copper foil line area is extracted using a grayscale threshold segmentation algorithm. Noise is removed by morphological processing. A sliding window is used to count the proportion of copper foil pixels in a local area. When the proportion of copper foil pixels in a local area is greater than a preset first threshold, the area is marked as a dense line area.

[0020] Furthermore, the method for identifying the hollowed-out area specifically includes:

[0021] The preprocessed PCB image is segmented by grayscale thresholding, and pixel regions with grayscale values ​​lower than the preset threshold are extracted as candidate regions for cutout.

[0022] Perform connected component analysis on the hollow candidate regions and calculate the geometric parameters of each connected component;

[0023] Mark connected regions whose geometric parameters satisfy preset conditions as hollow regions;

[0024] The geometric parameters include area, aspect ratio and / or perimeter, and connected regions with an area greater than a preset area threshold and an aspect ratio within a preset range are marked as hollow areas.

[0025] Furthermore, in step S3, the method for establishing the region coordinate model of the PCB board specifically includes:

[0026] A planar coordinate system is established with the preset corner point of the PCB board as the origin. The PCB board surface is discretized into grid cells, and each grid cell is labeled with either an adsorption property or a non-adsorption property.

[0027] Furthermore, in step S4, the method for dynamically calculating the location of the adsorption center point includes: using the diameter of the suction cup as a constraint, the optimal distribution location of the adsorption point is determined by using the maximum coverage algorithm or the greedy algorithm within the adsorption area.

[0028] Furthermore, when dynamically calculating the location of the adsorption center point, the adsorption point is selected first within the edge area of ​​the PCB board. When the adsorption space in the edge area is insufficient, the selection is then expanded to the inner adsorption area.

[0029] Furthermore, in step S4, the method for calculating the required adsorption quantity includes:

[0030] The required number of suction cups is calculated using the formula N ≥ (G × Sf) / (P × μ), where G is the weight of the PCB board, Sf is the safety factor, P is the rated suction force of a single suction cup, and μ is the adsorption reliability factor.

[0031] Further, in step S5, the adsorption priority is determined according to the following rules:

[0032] The closer the adsorption point is to the corner of the PCB board, the higher its priority.

[0033] The farther away from densely populated areas of lines, the higher the priority of adsorption points;

[0034] The farther the adsorption point is from the hollow area, the higher its priority.

[0035] Furthermore, it also includes a safety verification step: after generating the adsorption coordinate information, it verifies whether the distance between each adsorption point is greater than the safety distance threshold, and verifies whether all adsorption points are located within the adsorption area. If any verification fails, the adsorption coordinates are recalculated.

[0036] This invention also provides a dynamic generation system for a PCB safety adsorption area, comprising:

[0037] Industrial cameras are used to capture images of PCB boards;

[0038] The image processing module is used to process PCB images and identify the edge contours, copper foil circuit areas, cutout areas, component areas, and preset no-sucking marking areas of the PCB board.

[0039] The region modeling module is used to establish a region coordinate model of the PCB board based on the recognition results, dividing the PCB board surface into adsorption-compatible and non-adsorption-compatible regions.

[0040] The adsorption calculation module is used to dynamically calculate the placeable area of ​​the suction cup, the safety margin, the position of the adsorption center point, and the required adsorption quantity within the adsorption area, and to generate the safe adsorption area and adsorption coordinate information.

[0041] The robot control module is used to control the robot to perform grasping operations based on the adsorption coordinate information.

[0042] Robots are used to perform PCB board gripping.

[0043] A vacuum adsorption mechanism, installed at the end of the robot, is used to adsorb PCB boards according to the adsorption coordinate information.

[0044] Compared with existing technologies, the PCB safety adsorption area dynamic generation method and system provided by this invention have the following advantages:

[0045] I. The PCB safety adsorption area dynamic generation method and system of the present invention automatically identifies the PCB edge area, circuit area and no-adsorption area through machine vision, and dynamically generates a safe adsorption position, so as to adsorb only the safe area of ​​the PCB and avoid adsorbing the fine circuit area, effectively reducing quality problems such as copper foil crushing, fine circuit breakage, board surface scratches, and PCB deformation; by avoiding no-adsorption areas such as cutout areas, circuit areas and component areas, the stability and reliability of vacuum adsorption can be improved.

[0046] II. The PCB safety adsorption area dynamic generation method and system of the present invention does not require fixed suction cup coordinates, and can automatically generate adsorption positions according to the size, circuit distribution and shape structure of different PCBs, which greatly improves equipment compatibility.

[0047] Third, the PCB safety adsorption area dynamic generation method and system of the present invention requires manual adjustment of the adsorption position, which reduces the machine adjustment time, manual intervention and line change time, and adapts to the needs of flexible production; the method of the present invention is particularly suitable for high-value and high-precision PCB products such as HDI boards, high-frequency and high-speed boards, ultra-fine circuit boards and high-layer boards. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a schematic diagram of the image processing flow in the method of the present invention;

[0050] Figure 2 This is a schematic diagram of the safe adsorption region and the no-adsorption region in the method of the present invention;

[0051] Figure 3 This is a schematic diagram of the adsorption center point within the safe adsorption area in the method of the present invention;

[0052] Figure 4 This is a schematic diagram of the process of safe suction adsorption in the method of the present invention;

[0053] Figure 5 This is a schematic diagram of the PCB safety adsorption area dynamic generation system of the present invention. Detailed Implementation

[0054] To enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, and to make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be further described below.

[0055] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

[0056] Example 1

[0057] Please refer to the following: Figures 1 to 4 ,in Figure 1 This is a schematic diagram of the image processing flow in the method of the present invention; Figure 2 This is a schematic diagram illustrating the generation of the safe adsorption region and the restricted adsorption region in the method of the present invention; Figure 3 This is a schematic diagram of the adsorption center point within the safe adsorption area in the method of the present invention; Figure 4 This is a schematic diagram of the process of safe adsorption by the suction cup in the method of the present invention.

[0058] A method for dynamically generating a PCB security adsorption area includes the following steps:

[0059] Step S1: Acquire an image of the PCB board to be adsorbed using an industrial camera, obtaining a grayscale or color image of the PCB board. The specific method is as follows:

[0060] The PCB board to be adsorbed is placed on the worktable below the industrial camera, which then takes a picture of the PCB board to obtain a grayscale or color image. A ring-shaped LED light source provides uniform front illumination to clearly show the contrast between the copper foil traces and the substrate.

[0061] Step S2 involves image processing of the acquired PCB image to identify the PCB board's edge contours, copper foil circuit areas, cutout areas, component areas, and preset no-sucking marking areas, such as... Figure 1 and Figure 2 As shown. The specific methods for PCB image processing are as follows:

[0062] Edge contour extraction: The Canny edge detection algorithm is used to extract the edge contour of the PCB board. First, the image is denoised by Gaussian filtering, then the gradient magnitude and direction are calculated, and the complete PCB outline is obtained through double threshold detection and edge connection.

[0063] Copper foil circuit identification and dense circuit region determination: An adaptive threshold segmentation algorithm is used to separate the copper foil region (high grayscale value) from the substrate region (low grayscale value). Morphological dilation and erosion operations are performed on the segmented binary image to remove noise and small isolated points. A sliding window (e.g., a 5mm×5mm window) is used to traverse the board area, and the proportion of copper foil pixels to the total pixels in each window is counted. When this proportion exceeds a preset threshold (e.g., 60%), the window area is marked as a dense circuit region.

[0064] Hollow Area Recognition: Gray-scale threshold segmentation is performed on the pre-processed PCB image, and pixel areas with gray values ​​lower than a preset threshold are extracted as hollow candidate areas; connected component analysis is performed on the hollow candidate areas to calculate geometric parameters such as area, aspect ratio, and perimeter of each connected component; connected components with an area greater than a preset area threshold and an aspect ratio within a preset range are marked as hollow areas and included in the non-snagging area.

[0065] Preset no-smoking label area and component area recognition: Among them, the component area recognition adopts a template matching algorithm: standard template images of various components are pre-created, and feature points of the image to be recognized and the template image are extracted by ORB or SURF algorithm and the feature points are matched. The position and type of the component area are determined according to the matching result; the recognition of the no-smoking label area includes: extracting the preset color label area by color space conversion and threshold segmentation, and / or recognizing the preset shape of the no-smoking label by shape matching algorithm, and / or recognizing the character type no-smoking label by OCR.

[0066] No-absorption area generation: Combine densely packed circuit areas, cutout areas, areas with mounted components, and preset no-absorption marking areas to define a no-absorption area (non-absorbent area).

[0067] Step S3: Based on the identification results of step S2, establish a regional coordinate model of the PCB board, dividing the PCB board surface into adsorption-compatible and non-adsorption-compatible areas. The specific method is as follows:

[0068] Establish a planar coordinate system with the bottom left corner of the PCB board as the origin, and discretize the PCB board surface into grid cells of a preset size (e.g., 5mm × 5mm). Traverse all grid cells and, based on the identification results of step S2, label each grid cell with attribute values:

[0069] Adsorbable area: This grid contains no lines, no holes, no components, and is at a distance greater than the safety margin from any non-adsorbable element;

[0070] Non-absorbent areas: These areas contain wiring, cutouts, components, or "no-absorbent" markings.

[0071] Connected regions composed of adsorbable grid cells are used as candidate adsorption regions.

[0072] Step S4: Within the adsorption area, based on the suction cup's physical parameters, vacuum adsorption requirements, and PCB board weight parameters, dynamically calculate the suction cup's placement area, safety margin, adsorption center point position, and required adsorption quantity to generate a safe adsorption area. Figure 3 As shown. The specific method is as follows:

[0073] Determine the adsorption constraint conditions:

[0074] Suction cup diameter: Determined based on the actual suction cup selected.

[0075] Safety margin: The distance between the edge of the suction cup and the edge of the circuit should not be less than a preset value (e.g., 5mm), and the distance between the center of the suction cup and the edge of the board should not be less than a preset value (e.g., 20mm).

[0076] Suction cup placement area: refers to the set of local locations within the suction cup area that can completely accommodate the end face of a suction cup, constrained by the suction cup diameter. Using a suction cup diameter of 30mm as a constraint, in the meshed model of the suction cup area, a disk region with the grid center as its center and a radius equal to the suction cup radius is searched. If this disk entirely falls within the suction cup grid and its distance from any non-suction cup grid is greater than the safety margin, then the center position is marked as a candidate suction cup placement point.

[0077] Required number of suction cups: Calculated using the formula N ≥ (G × Sf) / (P × μ). For example, assuming the PCB weight G = 1.5 kg, the rated suction force of a single suction cup P = 50 N, the safety factor Sf = 1.8, and the adsorption reliability factor μ = 0.8, then N ≥ (1.5 × 9.8 × 1.8) / (50 × 0.8) ≈ 0.66, and N must be at least 1. To ensure the stability of the PCB board's posture during gripping and transfer, this embodiment uses adsorption points symmetrically arranged at the four corners, i.e., N = 4.

[0078] It should be noted that when determining the final number of adsorption points, in addition to meeting the minimum number calculated by the above load-bearing formula, the geometric shape and posture stability requirements of the PCB board must also be considered. The final adsorption number is the larger of the minimum number required for load-bearing and the minimum number required for stable support. For conventional rectangular PCBs, stable support usually requires at least 4 adsorption points distributed in a quadrilateral pattern; for irregularly shaped PCBs, the minimum number of adsorption points required for stable support can be determined separately based on their geometric characteristics and center of gravity position.

[0079] Methods for dynamically calculating the location of adsorption center points include: using the suction cup diameter as a constraint, and employing a maximum coverage algorithm or a greedy algorithm within the adsorption area to determine the optimal distribution location of adsorption points. The rules for the optimal distribution location of adsorption points are as follows:

[0080] (1) Prioritize selecting candidate adsorption points in the edge areas near the four corners of the PCB board;

[0081] (2) Sorted from highest to lowest priority: corner edge region > side edge region > internal adsorption region;

[0082] (3) For each candidate adsorption point, check whether it meets the following conditions: the suction cup falls completely within the adsorption grid and the distance between each suction cup is not less than the safety distance threshold (such as twice the diameter of the suction cup).

[0083] (4) If the corner edge area cannot provide enough adsorption points, then supplement the adsorption areas on the side and inside.

[0084] Step S5: Generate adsorption coordinate information based on the calculation results of step S4. The adsorption coordinate information includes X coordinate, Y coordinate, adsorption angle, and adsorption priority.

[0085] The adsorption priority is determined according to the following rules:

[0086] The closer the adsorption point is to the corner of the PCB board, the higher its priority (set as level 1, as the primary positioning point to contact the PCB first).

[0087] The farther away from densely populated areas of lines, the higher the priority of adsorption points;

[0088] The farther the adsorption point is from the hollow area, the higher its priority;

[0089] The remaining adsorption points are classified into Level 2 and Level 3 according to their safety level.

[0090] Generate the coordinate information of the adsorption points, including the X coordinate, Y coordinate, adsorption angle, and adsorption priority. For example, the coordinate information of four adsorption points is generated as follows:

[0091]

[0092] The adsorption angle is the deflection angle of the suction cup's central axis relative to the normal of the PCB board surface, used to describe the suction cup's adsorption posture in space. When the PCB board surface is tilted or warped, the adsorption angle is dynamically calculated based on the board surface tilt angle detected by the vision system to ensure that the suction cup is parallel and adhered to the board surface. When the PCB board surface has good flatness, the adsorption angle can be set to 0°.

[0093] After generating the adsorption coordinate information, the system checks whether the distance between each adsorption point is greater than the safe distance threshold (e.g., 60mm) and whether all adsorption points are located within the adsorption area. If any check fails, the adsorption coordinates are recalculated. Once the checks pass, the final adsorption scheme is output.

[0094] S6. The adsorption coordinate information is sent to the robot control system to control the robot to perform the PCB board gripping operation. The specific method is as follows:

[0095] The adsorption coordinate information is sent to the robot controller via a communication protocol (such as TCP / IP). The robot controller then drives the robot to the respective adsorption points based on this coordinate information, performing the adsorption action sequentially according to priority: the adsorption point with priority 1 contacts the PCB board first and establishes initial positioning, and the remaining adsorption points then complete the adsorption process sequentially. Figure 4 As shown. After confirming that the vacuum pressure of all suction cups has reached the set value, the robot moves the PCB board to the target position and releases the vacuum to complete the board placement operation.

[0096] Example 2

[0097] A dynamic generation system for a PCB safety adsorption area, comprising:

[0098] Industrial camera 1 is used to acquire images of the PCB board;

[0099] Image processing module 2 is used to process PCB images and identify the edge contours, copper foil circuit areas, cutout areas, component areas, and preset no-sucking marking areas of the PCB board.

[0100] Region modeling module 3 is used to establish a region coordinate model of the PCB board based on the recognition results, and to divide the PCB board surface into adsorption-compatible and non-adsorption-compatible regions.

[0101] Adsorption calculation module 4 is used to dynamically calculate the placeable area of ​​the suction cup, the safety margin, the position of the adsorption center point and the required adsorption quantity within the adsorption area, and generate the safe adsorption area and adsorption coordinate information.

[0102] Robot control module 5 is used to control the robot to perform grasping operations based on the adsorption coordinate information;

[0103] Robot 6 is used to perform PCB board gripping;

[0104] A vacuum adsorption mechanism 7, installed at the end of the robot, is used to adsorb PCB boards according to adsorption coordinate information. The vacuum adsorption mechanism includes multiple independently controllable suction cups, the position of which can be dynamically adjusted according to the adsorption coordinate information generated by the adsorption calculation module, so as to complete the adsorption action of the PCB boards sequentially according to the adsorption priority.

[0105] The method and system for dynamically generating a safe adsorption area for PCBs provided by this invention can be widely applied to automated production scenarios such as PCB automatic board handling equipment, robot loading and unloading systems, and intelligent adsorption positioning devices. It is particularly suitable for the production and manufacturing of high-precision PCBs such as HDI boards, high-frequency and high-speed boards, ultra-fine circuit boards, thin boards, and high-layer boards, and has good industrial practical value and application prospects.

[0106] The embodiments of the present invention have been described in detail above, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and spirit of the present invention still fall within the protection scope of the present invention.

Claims

1. A method for dynamically generating a PCB safety adsorption area, characterized in that, Includes the following steps: Step S1: Acquire an image of the PCB board to be adsorbed using an industrial camera to obtain a grayscale or color image of the PCB board. Step S2: Perform image processing on the acquired PCB image to identify the edge contour of the PCB board, copper foil circuit area, hollow area, component area and preset no-sucking mark area; Step S3: Based on the identification results of step S2, establish a regional coordinate model of the PCB board and divide the PCB board surface into a region that can be attracted and a region that cannot be attracted. The region that cannot be attracted includes at least a dense circuit region, a cutout region, a component region, and a region marked with a no-attraction sign. Step S4: Within the adsorption area, based on the physical parameters of the suction cup, vacuum adsorption requirements, and PCB board weight parameters, dynamically calculate the area where the suction cup can be placed, the safety margin, the adsorption center point position, and the required adsorption quantity to generate a safe adsorption area. Step S5: Generate adsorption coordinate information based on the calculation results of step S4. The adsorption coordinate information includes X coordinate, Y coordinate, adsorption angle, and adsorption priority. S6. Send the adsorption coordinate information to the robot control system to control the robot to perform the PCB board grasping operation.

2. The method for dynamically generating a PCB safety adsorption area according to claim 1, characterized in that, In step S2, the image processing includes: Based on edge extraction algorithms, the outline of the PCB board is identified. Based on the region segmentation algorithm, copper foil circuit regions are identified and densely packed circuit regions are determined. Based on image segmentation algorithm and connected component analysis algorithm, the hollow region is identified; Based on feature recognition algorithms, the preset no-smoking marking areas and component areas are identified.

3. The method for dynamically generating a PCB safety adsorption area according to claim 2, characterized in that, The method for identifying copper foil circuit regions and determining densely packed circuit regions specifically includes: The copper foil line area is extracted using a grayscale threshold segmentation algorithm. Noise is removed by morphological processing. A sliding window is used to count the proportion of copper foil pixels in a local area. When the proportion of copper foil pixels in a local area is greater than a preset first threshold, the area is marked as a dense line area.

4. The method for dynamically generating a PCB safety adsorption area according to claim 2, characterized in that, The method for identifying the hollowed-out area specifically includes: The preprocessed PCB image is segmented by grayscale thresholding, and pixel regions with grayscale values ​​lower than the preset threshold are extracted as candidate regions for cutout. Perform connected component analysis on the hollow candidate regions and calculate the geometric parameters of each connected component; Mark connected regions whose geometric parameters satisfy preset conditions as hollow regions; The geometric parameters include area, aspect ratio and / or perimeter, and connected regions with an area greater than a preset area threshold and an aspect ratio within a preset range are marked as hollow areas.

5. The method for dynamically generating a PCB safety adsorption area according to claim 1, characterized in that, In step S3, the method for establishing the region coordinate model of the PCB board specifically includes: A planar coordinate system is established with the preset corner point of the PCB board as the origin. The PCB board surface is discretized into grid cells, and each grid cell is labeled with either an adsorption property or a non-adsorption property.

6. The method for dynamically generating a PCB safety adsorption area according to claim 1, characterized in that, In step S4, the method for dynamically calculating the location of the adsorption center point includes: using the diameter of the suction cup as a constraint, the optimal distribution location of the adsorption point is determined by using the maximum coverage algorithm or the greedy algorithm within the adsorption area. Furthermore, when dynamically calculating the location of the adsorption center point, the adsorption point is selected first within the edge area of ​​the PCB board. When the adsorption space in the edge area is insufficient, the selection is then expanded to the inner adsorption area.

7. The method for dynamically generating a PCB safety adsorption area according to claim 1, characterized in that, In step S4, the method for calculating the required adsorption quantity includes: The required number of suction cups is calculated using the formula N ≥ (G × Sf) / (P × μ), where G is the weight of the PCB board, Sf is the safety factor, P is the rated suction force of a single suction cup, and μ is the adsorption reliability factor.

8. The method for dynamically generating a PCB safety adsorption area according to claim 1, characterized in that, In step S5, the adsorption priority is determined according to the following rules: The closer the adsorption point is to the corner of the PCB board, the higher its priority. The farther away from densely populated areas of lines, the higher the priority of adsorption points; The farther the adsorption point is from the hollow area, the higher its priority.

9. The method for dynamically generating a PCB safety adsorption area according to claim 1, characterized in that, It also includes a safety verification step: after generating the adsorption coordinate information, it verifies whether the distance between each adsorption point is greater than the safety distance threshold, and verifies whether all adsorption points are located within the adsorption area. If any verification fails, the adsorption coordinates are recalculated.

10. A dynamic generation system for a PCB safety adsorption area, characterized in that, include: Industrial cameras are used to capture images of PCB boards; The image processing module is used to process PCB images and identify the edge contours, copper foil circuit areas, cutout areas, component areas, and preset no-sucking marking areas of the PCB board. The region modeling module is used to establish a region coordinate model of the PCB board based on the recognition results, dividing the PCB board surface into adsorption-compatible and non-adsorption-compatible regions. The adsorption calculation module is used to dynamically calculate the placeable area of ​​the suction cup, the safety margin, the position of the adsorption center point, and the required adsorption quantity within the adsorption area, and to generate the safe adsorption area and adsorption coordinate information. The robot control module is used to control the robot to perform grasping operations based on the adsorption coordinate information. Robots are used to perform PCB board gripping. A vacuum adsorption mechanism, installed at the end of the robot, is used to adsorb PCB boards according to the adsorption coordinate information.

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