A magnetic core winding, a bridge, a radio frequency power supply and a semiconductor device

Abstract

The application discloses a magnetic core winding, a bridge, a radio frequency power supply and a semiconductor device. In order to solve the problem that the bridge is difficult to balance miniaturization and consistency under the condition of low frequency and high power, a magnetic core winding is provided. The magnetic core winding comprises a magnetic core and at least one printed circuit board winding, the printed circuit board winding is sleeved on the magnetic core and comprises a through coil and a coupling coil. The through coil comprises a plurality of first metal layers, the coupling coil comprises a plurality of second metal layers, the plurality of first metal layers and the plurality of second metal layers are arranged in an interleaved and laminated mode, and a dielectric layer is arranged between any two metal layers. In the application, the PCB winding is used to replace the manually wound winding, the coupling capacitance between the coils is quantitatively determined by the opposite area and the thickness of the dielectric layer and can be stably reproduced, and the error caused by manual winding is eliminated. The magnetic core provides high magnetic permeability magnetic paths for the two coils, improves the coupling coefficient and reduces the winding height, so that the miniaturization and consistency are balanced in the bridge of the low frequency and high power radio frequency power supply.

Description

Technical Field

[0001] This application relates to the field of radio frequency power supplies, and in particular to a magnetic core winding, a bridge circuit, a radio frequency power supply, and a semiconductor device. Background Technology

[0002] In the field of RF power supplies, a common practice is to combine multiple RF power signals before outputting them. This is often achieved using a 3dB bridge to implement 3dB combining / power splitting (input / output reversal for power distribution). Currently, common bridge designs operate in the hundreds of megahertz and gigahertz frequencies. For low-frequency bridges in the kilohertz to hundred megahertz range, larger inductance and capacitance values ​​are required. Especially for high-power RF power supplies, the 3dB bridge combiner also needs to have a large current-carrying capacity. Furthermore, the inductance and parasitic capacitance tolerances of such large inductors are difficult to control, leading to poor consistency in low-frequency bridges. This can alter the output characteristics of the RF power supply, thereby affecting the process consistency of semiconductor equipment.

[0003] Currently, there is a miniaturization solution for low-frequency bridges using a magnetic ring and hand-wound coils. However, this solution only addresses the miniaturization issue to a certain extent and does not solve the inconsistency problem inherent in low-frequency bridges. Specifically, hand-winding makes it difficult to control the inductance value and parasitic capacitance between the coils due to process variations, resulting in poor consistency (accuracy) between different bridges. This causes fluctuations in the bridge coupling splitting characteristics and isolation, affecting the stability of the RF power supply.

[0004] Therefore, those skilled in the art urgently need a bridge circuit to solve the problem that it is difficult to simultaneously achieve miniaturization and high precision consistency in the current 3dB bridge combiner for low-frequency, high-power RF power supplies. Summary of the Invention

[0005] This application discloses a magnetic core winding, a bridge circuit, an RF power supply, and a semiconductor device to solve the problem that a 3dB bridge for low-frequency, high-power RF power supplies is difficult to balance miniaturization and high-precision consistency.

[0006] In a first aspect, this application provides a magnetic core winding, comprising: a magnetic core and at least one printed circuit board winding; the printed circuit board winding is sleeved on the magnetic core; the printed circuit board winding includes a through coil and a coupling coil; the through coil includes a plurality of first metal layers, and the coupling coil includes a plurality of second metal layers; the plurality of first metal layers and the plurality of second metal layers are stacked together, wherein any first metal layer is adjacent to at least one second metal layer along the stacking direction, and any second metal layer is adjacent to at least one first metal layer along the stacking direction; a dielectric layer is disposed between any two metal layers.

[0007] In the magnetic core winding of this application, the traditional hand-wound winding is replaced by a printed circuit board winding with a first metal layer and a second metal layer. Multiple first metal layers and multiple second metal layers are stacked together, and a dielectric layer is provided between any two metal layers. This allows the trace width, the area of ​​the interlayer face-to-face, and the thickness of the interlayer dielectric layer to be precisely controlled by the manufacturing process. This eliminates the problem that the inductance value and the parasitic capacitance between coils are difficult to control due to the process discreteness in hand-wound winding. Thus, miniaturization and high precision consistency are achieved in the bridge of low-frequency, high-power RF power supply.

[0008] In one possible implementation, the dielectric layer includes: a first dielectric layer; the first dielectric layer is disposed between any group of adjacent first metal layers and second metal layers; the maximum thickness tolerance of the first dielectric layer is less than or equal to a preset tolerance threshold. In this implementation, the coupling capacitance between the through coil and the coupling coil is concentrated in the first dielectric layer between adjacent first metal layers and second metal layers. Since the facing area between the two coils can be precisely controlled by the printed circuit board manufacturing process, and the maximum thickness tolerance of the first dielectric layer is less than or equal to the preset tolerance threshold, the thickness variation of the dielectric layer between the two coils is limited to a small range, making the coupling capacitance between the through coil and the coupling coil approach the target capacitance value, and the coupling capacitance between different magnetic core windings remains consistent, thereby improving the consistency between different magnetic core windings.

[0009] In one possible implementation, any first metal layer is adjacent to a second metal layer along the stacking direction, and any second metal layer is adjacent to a first metal layer along the stacking direction. The dielectric layer further includes a second dielectric layer. The second dielectric layer is disposed between any two adjacent first metal layers along the stacking direction and between any two adjacent second metal layers along the stacking direction. The maximum thickness tolerance of the second dielectric layer is greater than that of the first dielectric layer. In this implementation, the adjacency of any first metal layer with a second metal layer and any second metal layer with a first metal layer ensures that each turn of the two coils is adjacently coupled to the turn of the other coil. At the same time, since the thickness variation of the dielectric layer between two adjacent first metal layers and between two adjacent second metal layers has a small impact on the coupling capacitance between the through coil and the coupled coil, a second dielectric layer with a larger maximum thickness tolerance is used between adjacent metal layers of the same type, while a first dielectric layer is used between adjacent first and second metal layers. This reduces the process difficulty of applying low tolerance requirements to all dielectric layers while ensuring the accuracy of coupling capacitance control, and reduces the manufacturing cost of the printed circuit board winding.

[0010] In one possible implementation, the magnetic core includes a first magnetic component and a second magnetic component; the first magnetic component and the second magnetic component are two identical E-type magnetic components, which are arranged symmetrically relative to each other; the E-type magnetic component includes a first cover plate, two side posts and a center post, which are located on the same side of the first cover plate; at least one printed circuit board winding is provided, which consists of two windings; the two printed circuit board windings are respectively sleeved on the center post of the first magnetic component and the second magnetic component, or the center post and the side post, and the two printed circuit board windings are arranged symmetrically relative to each other; the same ports of the two printed circuit board windings are electrically connected to each other. In this embodiment, two E-type magnetic components are symmetrically arranged, and two printed circuit board windings are symmetrically mounted on the two E-type magnetic components, which makes the magnetic field distribution between the two printed circuit board windings uniform and achieves current sharing between the two printed circuit board windings. This avoids the situation where the current on the side with a stronger magnetic field is too large due to uneven magnetic field distribution, which would lead to an increase in total loss. This reduces the loss of the magnetic core winding and increases the power capacity. At the same time, the two printed circuit board windings increase the heat dissipation area and the effective current-carrying area, which is suitable for high-power scenarios. The corresponding ports of the two printed circuit board windings are electrically connected to realize the parallel connection of the two windings, so that the two windings share the current and further improve the current-carrying capacity of the magnetic core winding.

[0011] In one possible implementation, the same ports of the two printed circuit board windings are connected by at least one metal post. In this embodiment, the electrical connection between the same ports of the two printed circuit board windings is achieved through at least one metal post, resulting in a direct and reliable connection structure. Furthermore, the large current-carrying cross-sectional area of ​​the at least one metal post helps to reduce the connection impedance at the parallel connection point.

[0012] In one possible implementation, the magnetic core includes a first magnetic component and a second magnetic component; the first magnetic component is an E-type magnetic component, and the second magnetic component is an I-type magnetic component; the E-type magnetic component includes a first cover plate, two side posts, and a center post, with the two side posts and the center post disposed on the same side of the first cover plate; the I-type magnetic component includes a second cover plate, disposed on the side of the side posts and the center post away from the first cover plate; at least one printed circuit board winding is included, with the printed circuit board winding sleeved on the center post of the E-type magnetic component, or on the center post and the side posts. In this embodiment, the second cover plate of the E-type magnetic component and the I-type magnetic component together constitute the magnetic circuit of the magnetic core winding, and the printed circuit board winding is sleeved on the center post, or on the center post and the side posts. The structure is simple and easy to assemble, providing a specific magnetic core structure form for the miniaturization of low-frequency bridges.

[0013] In one possible implementation, an air gap is provided between the first magnetic component and the second magnetic component, the distance of which is determined based on the target inductance of the magnetic core winding. In this embodiment, after the printed circuit board winding and the magnetic core are determined, the inductance is jointly determined by the number of turns, the magnetic core material, and the distance of the air gap. By adjusting the distance of the air gap, the inductance of the magnetic core winding can be adjusted to the target inductance. This allows for flexible inductance adjustment and overcomes the problem of low flexibility in inductance adjustment caused by the lack of air gap design in existing magnetic ring winding schemes.

[0014] In one possible implementation, the winding direction of the through coil is the same as that of the coupling coil. In this embodiment, the through coil and the coupling coil are wound in the same direction, and the magnetic fields generated by the two coils can largely cancel each other out, thereby reducing the core loss of the magnetic core winding.

[0015] Secondly, this application provides a bridge circuit, including a magnetic core winding as provided in any embodiment of the first aspect; wherein the input terminal of the through coil is the through input terminal of the bridge, the output terminal of the through coil is the output terminal of the bridge, the input terminal of the coupling coil is the coupling input terminal of the bridge, and the output terminal of the coupling coil is the isolation terminal of the bridge. This bridge circuit includes the magnetic core winding provided in the first aspect, thus achieving the same technical effects as the magnetic core winding in the first aspect. Specifically, this bridge circuit achieves high-precision control of the coupling capacitance between coils with a smaller size, simultaneously achieving miniaturization and high-precision consistency of the low-frequency 3dB bridge combiner, suppressing fluctuations in the bridge coupling splitting characteristics and isolation, and ensuring that the output characteristics of the RF power supply do not change due to differences in bridge parameters.

[0016] In one possible implementation, the bridge further includes a first compensation capacitor and a second compensation capacitor; the first compensation capacitor is connected between the through input terminal and the isolation terminal, and the second compensation capacitor is connected between the coupled input terminal and the output terminal; the capacitance values ​​of the first and second compensation capacitors are determined based on the target capacitance value of the bridge and the coupling capacitance value between the through coil and the coupled coil. In this implementation, when the frequency band is low and the coupling capacitance between the coils formed by the magnetic core winding itself cannot meet the required capacitance value of the bridge while ensuring miniaturization, the difference between the target capacitance value and the coupling capacitance value is compensated by the first and second compensation capacitors. This allows the bridge to meet the capacitance requirements without increasing the area between adjacent first and second metal layers, improving the design flexibility of the bridge.

[0017] Thirdly, this application provides an RF power supply, including the bridge as provided in the second aspect. Since this RF power supply includes the aforementioned bridge, it can achieve the same technical effects as the bridge described above. Specifically, this RF power supply uses the bridge to synthesize and output multiple RF powers. The high consistency of the bridge ensures stable output characteristics of the RF power supply, preventing fluctuations due to differences in bridge parameters, thus improving the stability of low-frequency, high-power RF power supplies.

[0018] Fourthly, this application provides a semiconductor device including the radio frequency (RF) power supply as provided in the third aspect. Since this semiconductor device includes the aforementioned RF power supply, it can achieve the same technical effects as the RF power supply. Specifically, since this semiconductor device is powered by the aforementioned RF power supply, the stability of the RF power supply's output characteristics is improved, thereby helping to ensure the process consistency of the semiconductor device. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A structural diagram of a semiconductor device provided in an embodiment of this application; Figure 2 A schematic diagram of an equivalent bridge circuit and port connections is provided for an embodiment of this application; Figure 3 A structural diagram of an E+I type magnetic core provided in this application; Figure 4 A structural diagram of a double-E type magnetic core provided in this application; Figure 5 A perspective view of an E-type magnetic component provided in this application; Figure 6 A perspective view of a type I magnetic component provided in this application; Figure 7(a) is a top view of a printed circuit board winding provided in this application; Figure 7(b) is a front view of a printed circuit board winding provided in this application; Figure 8(a) is a schematic diagram of the first turn of a through coil provided in this application; Figure 8(b) is a schematic diagram of the second turn of a through coil provided in this application; Figure 8(c) is a schematic diagram of the third turn of a through coil provided in this application; Figure 8(d) is a schematic diagram of the fourth turn of a through coil provided in this application; Figure 9(a) is a schematic diagram of the first turn of a coupling coil provided in this application; Figure 9(b) is a schematic diagram of the second turn of a coupling coil provided in this application; Figure 9(c) is a schematic diagram of the third turn of a coupling coil provided in this application; Figure 9(d) is a schematic diagram of the fourth turn of a coupling coil provided in this application; Figure 10(a) is a schematic diagram of the first type of winding interleaved stacking distribution provided in this application; Figure 10(b) is a schematic diagram of the second type of winding interleaved stacking distribution provided in this application; Figure 11 An equivalent circuit diagram of a bridge circuit is provided in this application.

[0021] Explanation of reference numerals in the attached figures: 1-Magnetic core winding; 11-Magnetic core; 12-Printed circuit board winding; 13-Metal pillar; 111 - First magnetic component; 112 - Second magnetic component; 113 - Air gap; 1111 - First cover plate; 1112 - Side post; 1113 - Center post; 1121 - Second cover plate; 121-Through coil; 122-Coupled coil; 123-Metallic via; 124-First metal layer; 125-Second metal layer; 126-First dielectric layer; 127-Second dielectric layer; 1231 - First group of metal vias; 1232 - Second group of metal vias; 1233 - Third group of metal vias; 1234 - Fourth group of metal vias; 1235 - Fifth group of metal vias; 1236 - Sixth group of metal vias; 2-Wheatstone bridge; Pin1 - Through input; Pin2 - Coupled input; Pin3 - Output; Pin4 - Isolation; C1 - First compensation capacitor; C2 - Second compensation capacitor; 3-RF power supply; 31-Power source; 32-Impedance matching network; 33-Load; 4-Semiconductor equipment; 41 - Process chamber. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0023] The solutions described in this application are applied to semiconductor equipment, such as physical deposition equipment, plasma-enhanced chemical vapor deposition equipment, ion implantation equipment, etching equipment, etc.

[0024] like Figure 1 As shown, in the semiconductor manufacturing field, processes such as etching and deposition require the excitation and maintenance of plasma within a process chamber. In semiconductor device 4, the plasma is generated by the RF power output from RF power supply 3. The RF power output from RF power supply 3 is impedance-transformed by impedance matching network 32 before being fed into process chamber 41. Because the impedance of the plasma changes in real time with the process, the fed-in RF power cannot be completely absorbed. The unabsorbed portion forms reflected power that returns to RF power supply 3 along the original path. In a traditional unbalanced architecture, the reflected power has no load to absorb it after returning, and it will reflect back and forth between RF power supply 3 and process chamber 41, causing power fluctuations and oscillations. If the reflected power is applied to the power transistor of RF power supply 3, it will also cause overshoot, which can damage RF power supply 3 in severe cases.

[0025] Therefore, RF power supplies often employ a balanced bridge circuit architecture. For example... Figure 1 As shown, the RF power supply 3 includes a power source 31, a bridge 2, an impedance matching network 32, and a load 33 (load resistor R). The outputs of the two power sources 31 are connected to the two input terminals Pin1 and Pin2 of the bridge 2, respectively. The bridge 2 combines them into one signal, which is then output through the impedance matching network 32. With this architecture, the reflected power returning from the process chamber 41 reaches the bridge 2 through the impedance matching network 32 and is then distributed to the two input terminals Pin1 and Pin2 of the bridge 2. Since the isolation terminal Pin4 of the bridge 2 is connected to the load resistor R, the two reflected signals are coupled through the bridge 2 and converged to the load resistor R, where they are absorbed and no longer return to the power source 31. This suppresses the power oscillation caused by the back-and-forth reflection of the reflected power, making the output of the RF power supply 3 more stable.

[0026] like Figure 2 As shown, Bridge 2 is a 3dB bridge, including two coupled inductors, a matching capacitor between the inductors, and a load resistor R for absorbing reflections. It has a through input terminal Pin1, a coupled input terminal Pin2, an output terminal Pin3, an isolation terminal Pin4, and a ground terminal. Ideally, the power at the output terminal is equal to the sum of the power at the two input terminals. When the input and output are reversed, Bridge 2 functions as a power divider, with the power input at the output terminal being equally distributed across the two input terminals.

[0027] The lower the frequency, the longer the signal wavelength, and the larger the inductance and capacitance values ​​required to achieve the combining effect. For high-power RF power supplies operating in the kilohertz to megahertz frequency band, the inductance and capacitance values ​​required by the bridge circuit are much larger than those for conventional frequency bands, and the inductor also needs to have a large current-carrying capacity. Therefore, the bridge circuit is often large and difficult to miniaturize. If the required inductance value is achieved by hand-winding, the relative position between the windings and the winding tension will fluctuate with the manufacturing process, making it difficult to guarantee the consistency between the windings.

[0028] To address the aforementioned issues, this application provides a magnetic core winding, a bridge circuit, a radio frequency power supply, and a semiconductor device.

[0029] In practical applications, such as Figure 1 As shown, the semiconductor device 4 provided in this application includes a radio frequency (RF) power supply 3 and a process chamber 41. The process chamber 41 contains a base for supporting the wafer and a spray head for introducing process gases, among other components. The energy provided by the RF power supply 3 is fed into the process chamber 41 through a matching network and electrodes, causing the process gases to ionize and form plasma. Furthermore... Figure 1 As shown, the RF power supply 3 provided in this application includes a power source 31, a bridge 2, an impedance matching network 32, and a load 33, with the connection relationship between the four as described above. The bridge 2 is used to couple and collect the reflected power returning from the process chamber 41 side to the load resistor R, where it is absorbed and no longer returns to the power source 31. This suppresses power oscillations caused by the back-and-forth reflection of reflected power, making the output of the RF power supply 3 more stable. Furthermore, as... Figure 2 and Figure 11 As shown, the magnetic core winding 1 provided in this application can be used as the aforementioned bridge 2, thereby achieving the aforementioned effects.

[0030] Example 1: like Figure 3 and Figure 4 As shown, this application embodiment provides a magnetic core winding 1, including a magnetic core 11 and at least one printed circuit board winding 12. The magnetic core winding 1 refers to an inductor formed by combining the printed circuit board winding 12 with the magnetic core 11, wherein the printed circuit board winding 12 serves as a conductive coil. Each printed circuit board winding 12 is sleeved on the magnetic core 11. Figure 3 and Figure 4 These are two different configuration schemes for the magnetic core 11 and the printed circuit board winding 12, which will be described in detail in subsequent embodiments.

[0031] Specifically, the magnetic core 11 provides a magnetic circuit for the printed circuit board winding 12 to enhance the coupling between the through coil 121 and the coupling coil 122. It should be noted that this embodiment does not limit the specific material of the magnetic core 11. The magnetic core 11 can be made of soft magnetic materials, such as manganese-zinc ferrite or metal powder core. Manganese-zinc ferrite has high permeability and low core loss, which is beneficial for achieving the target inductance in a smaller volume and reducing the core loss of the magnetic core winding 1. The printed circuit board winding 12 is fitted onto the magnetic core 11, meaning that the printed circuit board winding 12 has clearance holes for the cylinder of the magnetic core 11 to pass through, and the cylinder of the magnetic core 11 passes through these clearance holes, so that the printed circuit board winding 12 is arranged around the cylinder of the magnetic core 11.

[0032] Each printed circuit board winding 12 includes a through coil 121 and a coupling coil 122. The through coil 121 includes a plurality of first metal layers 124, and the coupling coil 122 includes a plurality of second metal layers 125. The plurality of first metal layers 124 and the plurality of second metal layers 125 are stacked together, wherein any first metal layer 124 is adjacent to at least one second metal layer 125 along the stacking direction, and any second metal layer 125 is adjacent to at least one first metal layer 124 along the stacking direction; a dielectric layer is disposed between any two metal layers. Adjacent means that there are no other metal layers between the first metal layer 124 and the second metal layer 125, but a dielectric layer may be present. The printed circuit board winding 12 is shown in Figures 7(a) and 7(b); wherein, Figure 7(a) is a top view of the printed circuit board winding 12, and Figure 7(b) is a front view of the printed circuit board winding 12.

[0033] It should be noted that the through coil 121 is a multi-turn inductor coil formed by connecting multiple conductive traces on the first metal layer 124 in series through vias. It is the main power path connecting the through input terminal Pin1 and the output terminal Pin3 in Bridge 2. The coupling coil 122 is a multi-turn inductor coil formed by connecting multiple conductive traces on the second metal layer 125 in series through metal vias 123. It is stacked alternately with the through coil 121, and signal coupling is achieved through the magnetic core 11 and the interlayer coupling capacitor. It is the sampling or coupling path connecting the coupling input terminal Pin2 and the isolation terminal Pin4 in Bridge 2. The through coil 121 and the coupling coil 122 are not independent physical entities, but rather two independent electrical circuits formed by etching specific conductive trace patterns on each metal layer and connecting traces belonging to the same coil in series using metal vias 123, based on multilayer wiring technology.

[0034] Specifically, the printed circuit board winding 12 is composed of multiple layers of metal foil traces and multiple layers of dielectric layers laminated alternately along the stacking direction. The stacking direction refers to the direction in which multiple metal layers and dielectric layers are stacked sequentially, i.e., the thickness direction of the printed circuit board winding 12. The metal layers, namely the first metal layer 124 and the second metal layer 125 mentioned above, refer to the conductive layers in the printed circuit board winding made of conductive materials (such as copper), used to form the coil turns. The thickness of the metal layer depends on the magnitude of the current flowing through it and can be selected according to requirements. Adjacent metal layers are separated by dielectric layers, which refer to the insulating material layers stacked between adjacent metal layers in the printed circuit board winding 12, used to achieve electrical isolation. Its thickness and tolerance directly affect the coupling capacitance between coils, so the thickness of the dielectric layer is determined according to the required coupling capacitance and withstand voltage requirements. The metal foil traces can be made of conductive materials such as copper or silver, and the dielectric layers can be made of commonly used insulating dielectric materials for printed circuit boards, such as epoxy resin substrates, prepregs, etc., and this embodiment does not impose any restrictions on this. The through coil 121 is formed by sequentially connecting metal foil traces distributed on multiple metal layers, which are collectively referred to as the first metal layer 124. The coupling coil 122 is formed by sequentially connecting metal foil traces distributed on multiple other metal layers, which are collectively referred to as the second metal layer 125. The metal foil traces on each metal layer constitute one or more turns of the coil to which it belongs. This embodiment does not limit the number of turns of the coil contained in a metal layer, but it should be noted that increasing the number of turns will reduce the power, with one turn providing the highest power. Therefore, the actual number of turns in a metal layer should be determined according to actual needs. In the RF power supply scenario of the semiconductor device targeted in this embodiment, the number of turns in a metal layer generally does not exceed two; otherwise, the power requirements cannot be met.

[0035] Since the first metal layer 124 and the second metal layer 125 are stacked along the stacking direction, and each first metal layer 124 is adjacent to at least one second metal layer 125, and each second metal layer 125 is adjacent to at least one first metal layer 124, the turns of the through coil 121 and the coupling coil 122 are staggered and opposite to each other along the stacking direction, and the turns of the two coils are staggered, so that the adjacent first metal layer 124 and the second metal layer 125 constitute the two plates of a parallel plate capacitor, thereby forming a coupling capacitor between the through coil 121 and the coupling coil 122.

[0036] It is understood that when the first metal layer 124 and the second metal layer 125 are stacked, each metal layer, except for the metal layers at the beginning and end, has two other adjacent metal layers along the stacking direction (the first and last metal layers are adjacent to only one other metal layer). However, in this application, it is only required that each first metal layer 124 is adjacent to at least one second metal layer 125, and each second metal layer 125 is adjacent to at least one first metal layer 124. There are various staggered stacking distributions of metal layers that meet this requirement, and two typical staggered stacking diagrams are shown in Figures 10(a) and 10(b). In Figure 10(a), each first metal layer 124 is adjacent to only one second metal layer 125, and each second metal layer 125 is also adjacent to only one first metal layer 124. In Figure 10(b), each first metal layer 124 outside the beginning and end layers is adjacent to two second metal layers 125, and each second metal layer 125 outside the beginning and end layers is also adjacent to two first metal layers 124. Similarly, when there is no limitation on the number of adjacent elements between all the first metal layers 124 or the second metal layer 125 and another metal layer, more staggered stacking distributions can be obtained, which will not be elaborated in this embodiment.

[0037] In the same coil, the turns distributed on different metal layers are connected in series through metal vias 123. The metal via 123 is a hole-shaped conductor that penetrates the dielectric layer and connects two adjacent metal layers; its walls are metallized to provide conductivity. The metal via 123 is used to electrically connect turns belonging to the same coil located on different physical layers, enabling cross-layer routing. It should be noted that a metal via 123 is required between adjacent turns of the same coil to achieve cross-layer series connection, while the input terminal of the first turn and the output terminal of the last turn serve as the external connection ports of the coil and do not require metal vias 123. As shown in Figures 10(a) and 10(b), taking a straight-through coil 121 and a coupling coil 122 each with four turns, and one turn per metal layer as an example, the printed circuit board winding 12 has a total of eight metal layers and seven dielectric layers. As shown in Figures 8(a) to 8(d) and 9(a) to 9(d), each coil requires three sets of metal vias 123 between its four turns, for a total of six sets of metal vias 123 (including the first set of metal vias 1231, the second set of metal vias 1232, the third set of metal vias 1233, the fourth set of metal vias 1234, the fifth set of metal vias 1235, and the sixth set of metal vias 1236). Figure 8(a) is a schematic diagram of the first turn of the through coil 121, Figure 8(b) is a schematic diagram of the second turn of the through coil 121, Figure 8(c) is a schematic diagram of the third turn of the through coil 121, and Figure 8(d) is a schematic diagram of the fourth turn of the through coil 121. Figure 9(a) is a schematic diagram of the first turn of the coupling coil 122, Figure 9(b) is a schematic diagram of the second turn of the coupling coil 122, Figure 9(c) is a schematic diagram of the third turn of the coupling coil 122, and Figure 9(d) is a schematic diagram of the fourth turn of the coupling coil 122.

[0038] As shown in Figures 8(a), 8(d), 9(a), and 9(d), the printed circuit board winding 12 has four ports on its surface: a through input terminal Pin1, a coupling input terminal Pin2, a (through) output terminal Pin3, and a (coupling) isolation terminal Pin4. Specifically, the through input terminal Pin1 is the input terminal of the first turn of the through coil 121, the output terminal Pin3 is the output terminal of the fourth turn of the through coil 121, the coupling input terminal Pin2 is the input terminal of the first turn of the coupling coil 122, and the isolation terminal Pin4 is the output terminal of the fourth turn of the coupling coil 122. These ports are the interfaces for electrical connection between the printed circuit board winding 12 and external circuits (such as the power source 31 and the load 33), and can be pads or metal vias.

[0039] It should be noted that the number of metal layers is not limited to eight. Depending on the required inductance and coupling capacitance values, there can be six or other even-numbered metal layers. An even number of layers is used to ensure that the number of the first metal layer 124 and the second metal layer 125 are equal, guaranteeing symmetrical coupling between the through coil 121 and the coupling coil 122. Furthermore, each metal layer is not limited to one turn; two or more turns can be used. However, increasing the number of turns will decrease the coil's power handling capacity, so it needs to be determined based on actual power requirements. It should also be noted that the positions of the through coil 121 and the coupling coil 122 in the stack can be interchanged; the relative positions of the turns within the same coil can also be interchanged. These interchanges do not change the coupling relationship between the two coils.

[0040] As can be seen from the above structure, the magnetic core winding 1 provided in this embodiment replaces the traditional hand-wound winding with a printed circuit board winding 12. Since the metal foil traces are formed by the pattern transfer process of the printed circuit board, their line width and interlayer facing area are determined by the wiring pattern, and the thickness of the interlayer dielectric layer is determined by the lamination process. Both can be precisely controlled and have good batch repeatability. Here, the facing area refers to the area of ​​the overlapping portion of the projections of two adjacent metal layers along the lamination direction on a plane perpendicular to the lamination direction. The coupling capacitance between the through coil 121 and the coupling coil 122 is mainly distributed between the first metal layer 124 and the second metal layer 125 adjacent along the lamination direction. The capacitance value of this coupling capacitance is jointly determined by the facing area between the adjacent first metal layer 124 and the second metal layer 125 and the thickness of the dielectric layer between them. Since the facing area can be precisely set by means of the wiring pattern, and the thickness of the dielectric layer can also be controlled by the lamination process, the coupling capacitance is no longer a quantity that is discretely distributed with the fluctuation of the winding process, but becomes a parameter that can be quantitatively determined by the structural design and stably reproduced by the manufacturing process. As a result, the coupling capacitance between different magnetic core windings 1 tends to be consistent, and the dispersion of parasitic parameters between coils is significantly reduced, providing a structural and manufacturing basis for the consistency of magnetic core windings 1.

[0041] Based on this, since the printed circuit board winding 12 is fitted onto the magnetic core 11, the magnetic core 11 provides a high-permeability magnetic circuit for the through coil 121 and the coupled coil 122, thereby increasing the coupling coefficient between the two coils. The number of turns required to achieve the target inductance value at low frequencies is thus reduced, the winding length is correspondingly shortened, and the height of the magnetic core winding 1 is reduced accordingly, thereby reducing the volume of the magnetic core winding 1 while maintaining the inductance value. Furthermore, since the printed circuit board winding 12 uses sheet-like metal foil traces instead of circular cross-section windings, the surface area of ​​the metal foil traces is much larger than that of windings with the same cross-sectional area, effectively increasing the heat dissipation area; at the same time, the metal foil traces can carry a larger current while maintaining a lower current density, effectively increasing the current-carrying area, enabling the magnetic core winding 1 to adapt to high-power scenarios.

[0042] In summary, when the magnetic core winding 1 provided in this embodiment is applied to a low-frequency bridge, it can achieve precise control of the coupling capacitance between coils in a small volume, so that the parameters between different bridges remain consistent, thereby balancing the miniaturization and high precision consistency of the low-frequency bridge.

[0043] Example 2: Based on the magnetic core winding 1 provided in the above embodiments, this embodiment further explains the specific arrangement of the dielectric layer and the magnetic core 11. First, as shown in FIG10(a), the dielectric layer includes a first dielectric layer 126, which is disposed between any two adjacent first metal layers 124 and second metal layers 125, that is, disposed at a position adjacent to the metal layer of the through coil 121 and the metal layer of the coupling coil 122 along the stacking direction. The maximum thickness tolerance of the first dielectric layer 126 is less than or equal to a preset tolerance threshold, which is determined according to the accuracy requirements of the bridge 2 for the coupling capacitance between coils, for example, 1%, that is, the thickness deviation of the first dielectric layer 126 is controlled within 1% of its nominal thickness.

[0044] As can be seen from the above embodiments, the coupling capacitance between the through coil 121 and the coupling coil 122 is concentrated between the adjacent first metal layer 124 and second metal layer 125, and the dielectric layer at this location is the first dielectric layer 126. The capacitance value of the coupling capacitor is determined by the facing area and the thickness of the first dielectric layer 126. The facing area can be precisely set by the wiring pattern, and the maximum thickness tolerance of the first dielectric layer 126 is limited to within the tolerance threshold, so that the thickness of the first dielectric layer 126 remains consistent between the same layers of different magnetic core windings 1. Since the thickness variable is constrained to a small range, the deviation between the capacitance value of the coupling capacitor and the target capacitance value can also be controlled to a small range, ensuring the consistency of the coupling capacitance between different magnetic core windings 1 and improving the stability of the coupling bisector characteristics and isolation of the bridge 2. The target capacitance value refers to the preset coupling capacitance value that needs to be achieved between the through coil and the coupling coil to meet the electrical performance requirements of a specific application (such as a 3dB bridge).

[0045] Furthermore, in the staggered distribution where any first metal layer 124 and a second metal layer 125 are adjacent along the stacking direction, and any second metal layer 125 and a first metal layer 124 are adjacent along the stacking direction, as shown in Figure 10(a), the dielectric layer further includes a second dielectric layer 127. The second dielectric layer 127 is disposed between any two adjacent first metal layers 124 along the stacking direction, and between any two adjacent second metal layers 125 along the stacking direction, i.e., between two adjacent metal layers belonging to the same through coil 121 or the same coupling coil 122. The maximum thickness tolerance of the second dielectric layer 127 is greater than the maximum thickness tolerance of the first dielectric layer 126, for example, 10%, but this embodiment does not limit this value. It should be noted that the second dielectric layer 127 can use the same material as the first dielectric layer 126. Because it does not participate in determining the critical inter-coil coupling capacitance, its thickness tolerance requirement is relaxed to reduce manufacturing costs.

[0046] It is readily apparent that the dielectric layers between two adjacent first metal layers 124 and between two adjacent second metal layers 125 belong to the same coil. Changes in thickness at these points primarily affect the interlayer capacitance within the same coil, while having a smaller impact on the coupling capacitance between the through coil 121 and the coupling coil 122. Therefore, using a first dielectric layer 126 with a smaller maximum thickness tolerance at locations significantly affecting coupling capacitance, and a second dielectric layer 127 with a larger maximum thickness tolerance between similar metal layers where the impact is less significant, ensures precise control over coupling capacitance without imposing low tolerance requirements on all dielectric layers. Since achieving low tolerances for all dielectric layers in current printed circuit board lamination processes is difficult, this differentiated approach reduces process complexity and manufacturing costs for the printed circuit board winding 12.

[0047] On the other hand, such as Figure 4 as well as Figure 5As shown, this embodiment provides a specific arrangement of the magnetic core 11. The magnetic core 11 includes a first magnetic component 111 and a second magnetic component 112. The first magnetic component 111 and the second magnetic component 112 are two identical E-type magnetic components, which are arranged symmetrically relative to each other. The symmetrical arrangement means that the central post 1113 and the two side posts 1112 of the two E-type magnetic components are respectively directly opposite each other. The E-type magnetic component includes a first cover plate 1111, two side posts 1112 and a central post 1113. The two side posts 1112 and the central post 1113 are located on the same side of the first cover plate 1111, and the central post 1113 is located between the two side posts 1112. There are two printed circuit board windings 12. The two windings 12 are respectively fitted onto the central post 1113 of the first magnetic component 111 and the second magnetic component 112, or respectively fitted onto the central post 1113 and the side post 1112 of the first magnetic component 111 and the second magnetic component 112, and the two windings 12 are arranged symmetrically. The same ports of the two windings 12 are electrically connected accordingly, that is, the two through input terminals Pin1 are connected, the two coupled input terminals Pin2 are connected, the two output terminals Pin3 are connected, and the two isolation terminals Pin4 are connected. This corresponding electrical connection means that, in order to increase the current carrying capacity and reduce losses, the two identical printed circuit board windings 12 are used in parallel to jointly undertake the task of power transmission and coupling. This parallel structure makes the total equivalent inductance the same as a single winding, but doubles the current carrying cross-sectional area and heat dissipation area.

[0048] Because the two E-type magnetic components are symmetrically arranged, and the two printed circuit board windings 12 are symmetrically mounted on the two E-type magnetic components, the magnetic field environment of the two printed circuit board windings 12 is the same, and the magnetic field is evenly distributed between the two printed circuit board windings 12. Therefore, the current distribution between the two printed circuit board windings 12 tends to be balanced, avoiding the situation where the current on the side with a stronger magnetic field is too large due to uneven magnetic field distribution, which would lead to an increase in total loss. This reduces the loss of the core winding 1 and increases the power capacity. At the same output power, the architecture of the dual E-type magnetic components and the parallel connection of the two printed circuit board windings 12 in this embodiment can reduce the loss of the core winding 1 by about 40% compared to the scheme using a single printed circuit board winding 12. At the same time, after the two printed circuit board windings 12 are connected in parallel, the heat dissipation area and the effective current-carrying area are both larger than those with a single printed circuit board winding 12, allowing the core winding 1 to adapt to larger power scenarios.

[0049] Furthermore, the same ports of the two printed circuit board windings 12 are connected by at least one metal post 13. Specifically, the metal post 13 can be disposed between two opposite side posts 1112 of the two printed circuit board windings 12, forming the shortest electrical connection path between the corresponding ports of the two printed circuit board windings 12. The metal post 13 can be a columnar conductor made of copper or other conductive materials, with its two ends welded or crimped to the corresponding ports on the two printed circuit board windings 12. The diameter and number of metal posts 13 can be determined according to the required current carrying capacity, and their function is to provide a current convergence and shunting node for the two parallel printed circuit board windings 12. Due to the large current-carrying cross-sectional area of ​​the metal post 13, the connection impedance at the parallel connection of the two printed circuit board windings 12 is small, reducing losses and heat generation at the parallel connection; at the same time, the connection structure of the columnar conductor is direct and reliable, the assembly process is simple, and it is convenient for the alignment and fixation of the two printed circuit board windings 12.

[0050] On the other hand, such as Figure 3 as well as Figure 6 As shown, this embodiment also provides another specific arrangement of the magnetic core 11. The magnetic core 11 includes a first magnetic component 111 and a second magnetic component 112. The first magnetic component 111 is an E-type magnetic component, and the second magnetic component 112 is an I-type magnetic component. The E-type magnetic component includes a first cover plate 1111, two side posts 1112, and a central post 1113. The two side posts 1112 and the central post 1113 are disposed on the same side of the first cover plate 1111. The I-type magnetic component includes a second cover plate 1121. The second cover plate 1121 is disposed on the side of the side posts 1112 and the central post 1113 away from the first cover plate 1111, that is, the second cover plate 1121 covers the end faces of the two side posts 1112 and the central post 1113. There is one printed circuit board winding 12, which is sleeved on the central post 1113 of the E-type magnetic component, or simultaneously sleeved on the central post 1113 and the side posts 1112.

[0051] In this design, the first cover plate 1111, two side posts 1112, and the middle post 1113 of the E-type magnetic component, together with the second cover plate 1121 of the I-type magnetic component, form a closed magnetic circuit. The printed circuit board winding 12 is arranged around the middle post 1113. The magnetic core 11 of this design consists of only two components. During assembly, the printed circuit board winding 12 is first fitted onto the middle post 1113, and then the second cover plate 1121 is attached to the end faces of the side posts 1112 and the middle post 1113 to complete the assembly. The structure is simple and easy to assemble, providing a specific magnetic core structure form for the miniaturization of low-frequency bridges.

[0052] Furthermore, this embodiment also provides an optional implementation scheme: in the above two configuration schemes of the magnetic core 11, an air gap 113 is left between the first magnetic component 111 and the second magnetic component 112. The distance of the air gap 113 is determined according to the target inductance of the magnetic core winding 1 (the expected inductance between the coils required to achieve a 3dB bridge). The air gap 113 can be configured by grinding a gap of a certain thickness on the end face of the center column 1113, or by inserting a non-magnetic spacer between the two magnetic components. Its function is to introduce a high reluctance region in the magnetic circuit, thereby reducing the effective permeability of the magnetic core 11, achieving the purpose of adjusting the inductance and preventing magnetic core saturation. The target inductance refers to the preset inductance value that the magnetic core winding 1 needs to achieve to meet the electrical performance requirements of a specific application (such as a 3dB bridge).

[0053] Specifically, after the number of turns of the printed circuit board winding 12 and the material of the magnetic core 11 are determined, the inductance of the magnetic core winding 1 is mainly determined by the magnetic reluctance of the magnetic circuit. The distance of the air gap 113 directly affects the magnetic reluctance of the magnetic circuit. By increasing or decreasing the distance of the air gap 113, the inductance of the magnetic core winding 1 can be adjusted to the target inductance. The air gap 113 can be set at the middle post 1113, that is, a gap is left between the end face of the middle post 1113 of the first magnetic component 111 and the second magnetic component 112; or it can be set at the side post 1112, that is, a gap is left between the end face of the side post 1112 of the first magnetic component 111 and the second magnetic component 112.

[0054] Compared to the closed magnetic rings used in traditional magnetic winding schemes, where there is no air gap in the magnetic circuit and the inductance is mainly determined by the material and size of the magnetic ring, making it difficult to adjust once the ring is formed, this embodiment introduces an air gap 113 into the magnetic circuit. The inductance can be adjusted by changing the distance of the air gap 113, providing flexible adjustment. Furthermore, it eliminates the need to replace the magnetic core 11 or change the existing structure of the printed circuit board winding 12, facilitating the adaptation of different inductance requirements based on the same magnetic core 11 and printed circuit board winding 12.

[0055] Furthermore, this embodiment also provides an optional implementation: the winding direction of the through coil 121 is the same as the winding direction of the coupling coil 122. That is, in the same printed circuit board winding 12, if viewed from the same direction, each turn of the through coil 121 and each turn of the coupling coil 122 are wound in the same direction of rotation (such as clockwise or counterclockwise). Since the winding directions of the two coils are the same, and the port definition methods are consistent, it can be ensured that the magnetic field directions generated by the two coils in the magnetic core 11 are consistent, thereby obtaining the maximum coupling coefficient and improving the utilization rate of the magnetic core 11. As a result, the alternating magnetic induction intensity in the magnetic core 11 is reduced, and the core loss of the magnetic core winding 1 is correspondingly reduced, which is beneficial for controlling temperature rise and improving efficiency in high-power scenarios.

[0056] Example 3: like Figure 2 and Figure 11 As shown, this application embodiment provides a bridge 2, including the magnetic core winding 1 as provided in the above embodiment. In the bridge 2, the input terminal of the through coil 121 is the through input terminal Pin1 of the bridge 2, the output terminal of the through coil 121 is the output terminal Pin3 of the bridge 2, the input terminal of the coupling coil 122 is the coupling input terminal Pin2 of the bridge 2, and the output terminal of the coupling coil 122 is the isolation terminal Pin4 of the bridge 2. That is, the through coil 121 is connected in series between the through input terminal Pin1 and the output terminal Pin3, and the coupling coil 122 is connected in series between the coupling input terminal Pin2 and the isolation terminal Pin4. The two coils are coupled to each other by means of the magnetic core 11, and the interlayer structure forms a coupling capacitance between the coils, thereby forming a three dB bridge. The connection relationship here is as follows: the through coil 121 serves as the main power path, carrying the power transmission from the through input terminal Pin1 to the output terminal Pin3; the coupling coil 122 serves as the coupling path, coupling a portion of the energy from the main path and outputting or absorbing reflected power from the isolation terminal Pin4.

[0057] Since Bridge 2 uses the magnetic core winding 1 provided in the above embodiment, the coupling capacitance between its coils is quantitatively determined by the structural design of the PCB winding, and can be stably reproduced by the PCB manufacturing process. Therefore, Bridge 2 achieves high-precision control of the coupling capacitance in a small volume. As a result, the coupling splitting characteristic and isolation of Bridge 2 do not fluctuate due to the dispersion of winding parameters. The combining ratio of the two input power at the output terminal Pin 3 remains stable, and the ability of the isolation terminal Pin 4 to collect and absorb reflected power also remains stable, thereby suppressing the parameter drift problem commonly found in low-frequency 3dB bridge combiners.

[0058] Furthermore, such as Figure 11 As shown, Bridge 2 also includes a first compensation capacitor C1 and a second compensation capacitor C2. The first compensation capacitor C1 is connected between the through input terminal Pin1 and the isolation terminal Pin4, and the second compensation capacitor C2 is connected between the coupled input terminal Pin2 and the output terminal Pin3. The two external first compensation capacitors C1 and second compensation capacitor C2 are connected in parallel with the inherent coupling capacitance between the coils, together forming all the matching capacitors required by Bridge 2, used to achieve impedance matching and coupling between the ports.

[0059] It should be noted that the matching capacitance between the two inductors in Bridge 2 at this time is composed of the interlayer coupling capacitance between the through coil 121 and the coupling coil 122, as well as the external first compensation capacitor C1 and the second compensation capacitor C2. Therefore, the capacitance values ​​of the first compensation capacitor C1 and the second compensation capacitor C2 are determined according to the target capacitance value of Bridge 2 and the coupling capacitance value between the through coil 121 and the coupling coil 122. Specifically, Bridge 2 needs to reach the target capacitance value to achieve 3 dB coupling, but the coupling capacitance value formed by the interlayer structure between the through coil 121 and the coupling coil 122 is often less than the target capacitance value. At this time, the first compensation capacitor C1 and the second compensation capacitor C2 are used to make up the difference between the two, that is, the capacitance values ​​of both are the difference between the target capacitance value and the coupling capacitance value.

[0060] With the above configuration, when the frequency band is low and the inter-coil coupling capacitance formed by the magnetic core winding 1 itself cannot meet the capacitance value required by the bridge 2 while ensuring miniaturization, the difference between the target capacitance value and the coupling capacitance value can be compensated by the external first compensation capacitor C1 and second compensation capacitor C2, without increasing the facing area between the adjacent first metal layer 124 and second metal layer 125 or reducing the thickness of the first dielectric layer 126. Therefore, the bridge 2 can meet the capacitance requirements without sacrificing size, improving the design flexibility of the bridge 2. When the coupling capacitance value already meets the requirements, the first compensation capacitor C1 and second compensation capacitor C2 can also be omitted.

[0061] Example 4: On the other hand, such as Figure 1 As shown in the embodiments, this application also provides an RF power supply 3, including the bridge 2 provided in the above embodiments. The RF power supply 3 further includes a power source 31, an impedance matching network 32, and a load 33, where the load 33 is a load resistor. The power source 31 is an RF signal generator. The impedance matching network 32 is used to match the output impedance of the bridge 2 with the dynamic impedance of the process chamber 41 to achieve maximum power transmission. The load 33 is used to absorb the power reflected back from the process chamber 41 and coupled to the isolation terminal Pin 4 via the bridge 2. The outputs of the two power sources 31 are respectively connected to the two input terminals of the bridge 2, namely the through input terminal Pin 1 and the coupling input terminal Pin 2. After being combined into one by the bridge 2, the output is sent to the impedance matching network 32 via the output terminal Pin 3, and then fed into the process chamber 41 after impedance transformation by the impedance matching network 32. The isolation terminal Pin 4 of the bridge 2 is connected to the load 33.

[0062] In this architecture, the reflected power returning from the process chamber 41 reaches the bridge 2 via the impedance matching network 32 and is distributed to the through input pin 1 and the coupled input pin 2. Since the isolation pin 4 is connected to the load 33, the two reflected signals are coupled through the bridge 2 and converge at the load 33, where they are absorbed and no longer return to the power source 31. This avoids power fluctuations and oscillations caused by the reflected power reflecting back and forth between the RF power supply 3 and the process chamber 41, and also prevents overshoot caused by the reflected power being applied to the power transistor of the power source 31. Furthermore, because the bridge 2 included in this RF power supply 3 has high consistency, its coupling splitting characteristics and isolation are stable, and the reflected power can be stably converged to the load 33 for absorption. This ensures that the output characteristics of the RF power supply 3 do not fluctuate due to differences in the bridge 2 parameters, improving the stability of the low-frequency, high-power RF power supply.

[0063] Example 5: On the other hand, such as Figure 1 As shown, this application embodiment provides a semiconductor device 4, including the radio frequency (RF) power supply 3 provided in the above embodiment. The semiconductor device 4 also includes a process chamber 41, which contains a base for supporting a wafer and a spray head for introducing process gases. RF power is fed into the process chamber 41 through a matching network and electrodes, causing the process gases to ionize and form plasma. The output terminal of the RF power supply 3 is connected to the process chamber 41 to provide RF power to the process chamber 41 to excite and maintain plasma within the process chamber 41, thereby enabling processes such as etching or deposition. Because the RF power supply 3 uses the aforementioned bridge 2, the stability of its output characteristics is improved. The RF power obtained by the process chamber 41 does not fluctuate due to the dispersion of the bridge 2 parameters. This semiconductor device 4 can maintain consistent process conditions between different devices and during different operations of the same device, which is beneficial for ensuring the process consistency of the semiconductor device 4.

[0064] In summary, the magnetic core winding 1, bridge 2, RF power supply 3, and semiconductor device 4 provided in the embodiments of this application replace the hand-wound winding with a printed circuit board winding 12, eliminating the process dispersion of coil parameters from the manufacturing basis, and achieving miniaturization by enhancing coupling with magnetic core 11. Ultimately, miniaturization and high precision consistency are simultaneously achieved in the 3dB bridge combiner of low-frequency, high-power RF power supply.

[0065] The above-described preferred embodiments have further illustrated the purpose, technical solutions, and advantages of this application. It should be understood that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A magnetic core winding, characterized in that, Includes: a magnetic core and at least one printed circuit board winding; Each of the printed circuit board windings is sleeved on the magnetic core; The printed circuit board winding includes a through coil and a coupling coil; The through coil includes multiple first metal layers, and the coupling coil includes multiple second metal layers; the multiple first metal layers and the multiple second metal layers are stacked together, wherein any first metal layer is adjacent to at least one second metal layer along the stacking direction, and any second metal layer is adjacent to at least one first metal layer along the stacking direction; a dielectric layer is disposed between any two adjacent metal layers.

2. The magnetic core winding according to claim 1, characterized in that, The dielectric layer includes: a first dielectric layer; The first dielectric layer is disposed between any group of adjacent first metal layers and second metal layers; The maximum thickness tolerance of the first dielectric layer is less than or equal to a preset tolerance threshold.

3. The magnetic core winding according to claim 2, characterized in that, Any first metal layer is adjacent to a second metal layer along the stacking direction, and any second metal layer is adjacent to a first metal layer along the stacking direction; The dielectric layer further includes: a second dielectric layer; the second dielectric layer is disposed between any two adjacent first metal layers along the stacking direction, and between any two adjacent second metal layers along the stacking direction; the maximum thickness tolerance of the second dielectric layer is greater than that of the first dielectric layer.

4. The magnetic core winding according to any one of claims 1 to 3, characterized in that, The magnetic core includes a first magnetic component and a second magnetic component; wherein the first magnetic component and the second magnetic component are two identical E-type magnetic components, and the two E-type magnetic components are arranged symmetrically relative to each other; The E-type magnetic component includes a first cover plate, two side posts and a central post, with the two side posts and the central post disposed on the same side of the first cover plate; At least one of the printed circuit board windings consists of two windings; the two printed circuit board windings are respectively sleeved on the central post of the first magnetic component and the second magnetic component, or the central post and the side post, and the two printed circuit board windings are arranged symmetrically relative to each other; the same ports of the two printed circuit board windings are electrically connected to each other.

5. The magnetic core winding according to claim 4, characterized in that, The same ports of the two printed circuit board windings are connected by at least one metal post.

6. The magnetic core winding according to any one of claims 1 to 3, characterized in that, The magnetic core includes a first magnetic component and a second magnetic component; wherein the first magnetic component is an E-type magnetic component and the second magnetic component is an I-type magnetic component; The E-type magnetic component includes a first cover plate, two side posts and a central post, with the two side posts and the central post disposed on the same side of the first cover plate; The type I magnetic component includes a second cover plate, which is disposed on the side of the side post and the middle post away from the first cover plate; The at least one printed circuit board winding is one, and the printed circuit board winding is sleeved on the central column of the E-type magnetic component, or the central column and the side column.

7. The magnetic core winding according to claim 4 or 6, characterized in that, An air gap is provided between the first magnetic component and the second magnetic component, and the distance of the air gap is determined according to the target inductance of the magnetic core winding.

8. The magnetic core winding according to any one of claims 1 to 7, characterized in that, The winding direction of the through coil is the same as that of the coupling coil.

9. A bridge circuit, characterized in that, Includes the magnetic core winding as described in any one of claims 1 to 8; The input terminal of the through coil is the through input terminal of the bridge, the output terminal of the through coil is the output terminal of the bridge, the input terminal of the coupling coil is the coupling input terminal of the bridge, and the output terminal of the coupling coil is the isolation terminal of the bridge.

10. The bridge according to claim 9, characterized in that, Also includes: First compensation capacitor and second compensation capacitor; The first compensation capacitor is connected between the through input terminal and the isolation terminal, and the second compensation capacitor is connected between the coupling input terminal and the output terminal; The capacitance values ​​of the first compensation capacitor and the second compensation capacitor are determined based on the target capacitance value of the bridge and the coupling capacitance value between the through coil and the coupling coil.

11. A radio frequency power supply, characterized in that, Including the bridge as described in claim 9 or 10.

12. A semiconductor device, characterized in that, Includes the radio frequency power supply as described in claim 11.

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