Stable uwb and ble antenna combination for modules

Abstract

The present disclosure relates to a stable UWB and BLE antenna combination for a module. Embodiments of a radio frequency (RF) device and methods of manufacturing the same are disclosed. The RF device includes a module substrate and a module conductive plane integrated with the module substrate. The module conductive plane defines a side edge that defines a first end and a second end disposed opposite the first end. The module conductive plane defines a first edge-enabled void isolator (EEVI), a second EEVI, and an edge-enabled void antenna (EEVA), each extending into the module conductive plane along the side edge of the module conductive plane. The first EEVI is positioned at the first end of the side edge and the second EEVI is positioned at the second end of the side edge. The EEVA is positioned between the first EEVI and the second EEVI along the side edge, with the first EEVI and the second EEVI isolating the RF device.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of Provisional Patent Application No. 63 / 859,242, filed on August 7, 2025, and Provisional Patent Application No. 63 / 798,825, filed on May 2, 2025, the disclosures of which are hereby incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure generally relates to radio frequency antenna devices. Background Technology

[0004] To simplify the integration of complex radio systems such as Ultra Wideband (UWB) and Bluetooth® Low Energy (BLE) into sub-products, manufacturers can utilize radio frequency (RF) radio modules. These modules contain all the complex RF circuitry and layout solutions, allowing customers to implement advanced wireless technologies. The integration process becomes even more convenient for product developers when these radio modules also include the necessary antennas.

[0005] However, incorporating antennas into compact radio modules presents several challenges. Smaller radio modules are more versatile and can fit into a wider range of sub-products, but they require smaller antennas, which are often performance-limited by the geometry of the products using them. For example, small antennas tend to have narrow bandwidths and are more prone to offset due to the external geometry of the conductive features in the overall system. More specifically, when a radio module with an integrated antenna is mounted on a main printed circuit board containing a ground plane, the proximity and geometry of the ground plane can significantly affect antenna performance. Because the antenna is small, any negative impact from the ground plane can have a substantial impact on its efficiency and overall functionality. Summary of the Invention

[0006] Implementation Scheme 1. A radio frequency (RF) device comprising: a module substrate; a module conductive plane integrated with the module substrate, wherein: the module conductive plane defines a side edge; the side edge defines a first end and a second end disposed opposite to the first end; the module conductive plane defines a first edge-enabled gap isolator (EEVI), a second EEVI, and an edge-enabled gap antenna (EEVA), each extending along the side edge of the module conductive plane into the module conductive plane; the first EEVI is positioned at the first end of the side edge; the second EEVI is positioned at the second end of the side edge; and the EEVA is positioned along the side edge between the first EEVI and the second EEVI.

[0007] Implementation Scheme 2. The RF device according to Implementation Scheme 1 further comprises: a main substrate; a main conductive plane integrated with the main substrate, wherein the main conductive plane is connected to the module conductive plane.

[0008] Implementation Scheme 3. The RF device according to Implementation Scheme 2, wherein: the side edge is a first side edge; the module conductive plane defines a second side edge and a third side edge; the second side edge extends from the first end of the first side edge; the third side edge extends from the second end of the first side edge; the first EEVI is located at the second side edge; and the second EEVI is located at the third side edge.

[0009] Implementation Scheme 4. The RF device according to Implementation Scheme 3 further comprises: a first side pad along the second side edge, the first side pad connecting the first EEVI to the main conductive plane; and a second side pad along the third side edge, the second side pad connecting the second EEVI to the main conductive plane.

[0010] Implementation Scheme 5. The RF device according to Implementation Scheme 2, wherein: the main substrate and the main conductive plane define a printed circuit board (PCB) side edge; the side edge of the module conductive plane is retracted relative to the PCB side edge.

[0011] Implementation Scheme 6. The RF device according to Implementation Scheme 2, wherein the module substrate is mounted on the main substrate.

[0012] Implementation Scheme 7. The RF device according to Implementation Scheme 1, wherein the EEVA is a first EEVA, and wherein: the module conductive plane defines a second EEVA and a third EEVI, the second EEVA and the third EEVI each extending along the side edge of the module conductive plane into the module conductive plane; the second EEVA and the third EEVI are positioned along the side edge between the first EEVI and the second EEVI; and the third EEVI is positioned along the side edge between the first EEVA and the second EEVA.

[0013] Implementation Scheme 8. The RF device according to Implementation Scheme 7, wherein the first EEVA is a Bluetooth® Low Power (BLE) antenna and the second EEVA is an Ultra Wideband (UWB) antenna.

[0014] Implementation Scheme 9. The RF device according to Implementation Scheme 1, wherein the conductive plane defines one or more passive matching elements formed in the void of the EEVA, the passive matching elements being configured to provide matching for the EEVA.

[0015] Implementation Scheme 10. The RF device according to Implementation Scheme 1 further includes a mounting area for mounting at least one electronic component, wherein the first EEVI, the second EEVI, and the EEVA are outside the mounting area.

[0016] Implementation Scheme 11. A method of manufacturing a radio frequency (RF) device, comprising: forming a module substrate; integrating a module conductive plane with the module substrate, wherein the module conductive plane defines a side edge, the side edge defining a first end and a second end disposed opposite to the first end; forming a first edge-enabled gap isolator (EEVI), a second EEVI, and an edge-enabled gap antenna (EEVA), each extending along the side edge of the module conductive plane into the module conductive plane, wherein the first EEVI is positioned at the first end of the side edge, the second EEVI is positioned at the second end of the side edge, and the EEVA is positioned along the side edge between the first EEVI and the second EEVI.

[0017] Implementation Scheme 12. The method further includes: forming a main substrate; integrating a main conductive plane with the main substrate; and connecting the main conductive plane to the module conductive plane.

[0018] Implementation Scheme 13. A user element comprising a radio frequency (RF) device, the RF device comprising: a module substrate; a module conductive plane integrated with the module substrate, wherein: the module conductive plane defines a side edge; the side edge defines a first end and a second end disposed opposite to the first end; the module conductive plane defines a first edge-enabled gap isolator (EEVI), a second EEVI, and an edge-enabled gap antenna (EEVA), each extending along the side edge of the module conductive plane into the module conductive plane; the first EEVI is positioned at the first end of the side edge; the second EEVI is positioned at the second end of the side edge; and the EEVA is positioned along the side edge between the first EEVI and the second EEVI.

[0019] Implementation Scheme 14. The user element according to Implementation Scheme 13, wherein the RF device further comprises: a main substrate; a main conductive plane integrated with the main substrate, wherein the main conductive plane is connected to the module conductive plane.

[0020] Implementation Scheme 15. The user element according to Implementation Scheme 14, wherein: the side edge is a first side edge; the module conductive plane defines a second side edge and a third side edge; the second side edge extends from the first end of the first side edge; the third side edge extends from the second end of the first side edge; the first EEVI is located at the second side edge; and the second EEVI is located at the third side edge.

[0021] Implementation Scheme 16. The user component according to Implementation Scheme 15 further comprises: a first side pad along the second side edge, the first side pad connecting the first EEVI to the main conductive plane; and a second side pad along the third side edge, the second side pad connecting the second EEVI to the main conductive plane.

[0022] Implementation Scheme 17. The user element according to Implementation Scheme 14, wherein: the main substrate and the main conductive plane define a printed circuit board (PCB) side edge; and the side edge of the module conductive plane is retracted relative to the PCB side edge.

[0023] Implementation Scheme 18. The user element according to Implementation Scheme 14, wherein the module substrate is mounted on the main substrate.

[0024] Implementation Scheme 19. The user element according to Implementation Scheme 13, wherein the EEVA is a first EEVA, and wherein: the module conductive plane defines a second EEVA and a third EEVI, the second EEVA and the third EEVI each extending along the side edge of the module conductive plane into the module conductive plane; the second EEVA and the third EEVI are positioned along the side edge between the first EEVI and the second EEVI; and the third EEVI is positioned along the side edge between the first EEVA and the second EEVA.

[0025] Implementation Scheme 20. The user element according to Implementation Scheme 19, wherein the first EEVA is a Bluetooth® Low Power (BLE) antenna and the second EEVA is an Ultra Wideband (UWB) antenna.

[0026] In another respect, any of the foregoing aspects and / or the various individual aspects and features as described herein may be combined, individually or together, to obtain additional advantages. Unless otherwise indicated herein, any of the various features and elements disclosed herein may be combined with one or more other disclosed features and elements.

[0027] Those skilled in the art will understand the scope of this disclosure and recognize its other aspects after reading the following detailed description of the preferred embodiments in conjunction with the accompanying drawings. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate several aspects of this disclosure and, together with embodiments, serve to explain the principles of this disclosure.

[0029] Figure 1 It is an implementation scheme of a radio frequency (RF) device based on some implementation schemes.

[0030] Figure 2 It is an RF device according to some implementation schemes, which includes the above-mentioned Figure 1 The RF device described.

[0031] Figure 3 It is based on some implementation plans. Figure 1 The diagram shows a top view of the module's printed circuit board.

[0032] Figure 4 It is an installable RF antenna module according to some implementation schemes.

[0033] Figure 5 It is based on some implementation schemes shown. Figure 1 , Figure 2 and Figure 3 The graph shown illustrates the antenna efficiency versus frequency of an edge-enabled gap antenna (EEVA) capable of being used in ultra-wideband (UWB).

[0034] Figure 6 It is based on some implementation schemes shown. Figure 1 , Figure 2 and Figure 3 The graph shown is a curve of the S22 parameter (in decibels) of EEVA that can be used for UWB relative to frequency.

[0035] Figure 7 It is a Smith chart based on some implementation schemes, which shows Figure 1 , Figure 2 and Figure 3 The antenna impedance (as parameter S22) of EEVA that can be used for UWB is shown throughout the entire frequency scan range.

[0036] Figure 8 It is based on some implementation schemes shown. Figure 1 , Figure 2 and Figure 3 The graph shown is a curve of the radiated power (in decibels) of an EEVA that can be used for UWB relative to frequency.

[0037] Figure 9 This is a flowchart 900 illustrating a method for manufacturing an RF device according to some implementation schemes.

[0038] Figure 10 These are user components based on certain implementation schemes. Detailed Implementation

[0039] The embodiments described below represent the information necessary to enable those skilled in the art to practice the embodiments and demonstrate the best mode of practice. After reading the following description with reference to the accompanying drawings, those skilled in the art will understand the concepts of this disclosure and will appreciate the application of these concepts, even if not specifically set forth herein. It should be understood that these concepts and applications fall within the scope of this disclosure and the appended claims.

[0040] It will be understood that while the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0041] It should be understood that when an element, such as a layer, region, or substrate, is referred to as "on another element" or "extending to another element," it may be directly on or directly extended to the other element, or intermediate elements may also be present. Conversely, when an element is referred to as "directly on another element" or "directly extending to another element," no intermediate elements are present. Similarly, it should be understood that when an element, such as a layer, region, or substrate, is referred to as "above another element" or "extending above another element," it may be directly above or directly extended above the other element, or intermediate elements may also be present. Conversely, when an element is referred to as "directly above another element" or "extending directly above another element," no intermediate elements are present. It will also be understood that when an element is referred to as "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or intermediate elements may be present. Conversely, when an element is referred to as "directly connected" or "directly coupled" to another element, no intermediate elements are present.

[0042] For example, relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe the relationship of one element, layer, or region to another element, layer, or region illustrated in the figures. It should be understood that these terms, and those discussed above, are intended to encompass different orientations of the device other than those depicted in the figures.

[0043] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms “a / an” and “the” are intended to also include the plural forms. It will also be understood that, when used herein, the terms “comprises,” “comprising,” “includes,” and / or “including” specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0044] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It should be further understood that the terms used herein are to be interpreted as having the same meaning as in the context of this specification and related art, and should not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0045] The embodiments of this disclosure are illustrated herein with reference to schematic diagrams. Therefore, the actual dimensions of layers and elements may differ, and variations in shape are expected due to (for example) manufacturing techniques and / or tolerances. For instance, areas shown or described as square or rectangular may have rounded or curved features, and areas shown as straight lines may have some irregularities. Therefore, the areas shown in the figures are schematic, and their shapes are not intended to be the precise shapes of the areas of the apparatus, nor are they intended to limit the scope of this disclosure. Additionally, the size of structures or areas may be particularly exaggerated relative to other structures or areas for illustrative purposes, and is therefore provided to illustrate the general structure of the subject matter of this disclosure, and may or may not be drawn to scale. Common elements in the figures may be presented herein using common element reference numerals and will not be described further thereafter.

[0046] This disclosure describes embodiments of a radio frequency (RF) device comprising an edge-enabled gap structure (EEVC) formed along the side edge of a module conductive plane on a printed circuit board. These EEVCs include an edge-enabled gap antenna (EEVA) that acts as an integrated antenna element (e.g., a Bluetooth® Low Power and Ultra Wideband antenna) and an edge-enabled gap isolator (EEVI) placed in critical locations to minimize electromagnetic coupling and interference to the EEVA. In some embodiments, the RF device also has side pads along its edges, which are designed to electrically and mechanically connect the module's conductive plane to the conductive plane of the main printed circuit board while maintaining high-frequency signal integrity.

[0047] A key aspect of the design is the placement of two EEVIs: one EEVI is placed at each end of the side edge of the module's conductive plane, which has an EEVC. These EEVIs at each end of the side edge act as initial conductive plane interruptions for currents traveling along the side edge and can be considered as series inductors by the EEVA (antenna). The EEVIs at the ends of the side edges provide isolation for the EEVA, ensuring that edge currents and antenna performance are less affected by the shape, size, or layout of the main printed circuit board when the RF module is mounted. This isolation allows the RF module to be used as a universal solution on any main printed circuit board without requiring special consideration for external connection components or placement tolerances, thus maintaining antenna impedance and overall RF performance regardless of the motherboard geometry. The module may contain one or more EEVAs and one or more EEVIs. In one possible implementation, the module contains one or more EEVAs and one, but most likely at least two EEVIs. In some implementations, the EEVA may be another type of antenna (e.g., a FEEST antenna).

[0048] Figure 1 This is an implementation of a radio frequency (RF) device 100 according to some implementation schemes.

[0049] RF device 100 is an RF module that includes an EEVC along the geometric periphery of a module conductive plane 102. The module conductive plane 102 is formed as part of a printed circuit board 104. More specifically, the printed circuit board 104 includes a module substrate 106 and the module conductive plane 102, wherein the module conductive plane 102 is integrated with the module substrate 106. The printed circuit board 104 includes the module substrate 106, which forms the body of the printed circuit board 104. In some embodiments, the module substrate 106 is formed of epoxy laminate, glass, fiberglass, Teflon, metal, and any other acceptable material for providing surface mount technology. In some embodiments, conductive structures are formed within the module substrate 106 to form connections between electronic components (see electronic component 118) mounted on the printed circuit board 104. In some embodiments, the module conductive plane 102 is a ground plane configured to reference a ground voltage.

[0050] exist Figure 1 In this embodiment, the module conductive plane 102 is formed on the top surface 103 of the module substrate 106 of the printed circuit board 104. In other embodiments, the module conductive plane 102 may be formed on the bottom surface of the module substrate 106. In yet another embodiment, the module conductive plane 102 is formed as a conductive layer within the module substrate 106. In some embodiments, the module conductive plane 102 may be a ground plane.

[0051] In some embodiments, the module conductive plane 102 is a ground plane for providing ground voltage to some or all of the electronic components mounted on the printed circuit board 104. Various EEVC devices are formed within the module conductive plane 102 and extend from the side edge 107 of the module conductive plane 102 (and the printed circuit board 104) toward the centerline 105.

[0052] The EEVC formed by the module conductive plane 102 includes edge-enabled gap antennas (EEVA) 108, 110 and edge-enabled gap isolators (EEVI) 112, 114, 116 (collectively referred to as EEVC 108, 110, 112, 114, 116). Each of EEVC 108, 110, 112, 114, 116 defines an EEVC gap extending into the module conductive plane 102, wherein the EEVC gap of each of EEVC 108, 110, 112, 114, 116 defines an EEVC perimeter extending into the module conductive plane 102.

[0053] Printed circuit board 104 is used to mount various electronic components 118 and distribute signals among the various electronic components mounted on mounting area 120. Examples of electronic components 118 that can be mounted on printed circuit board 104 include microprocessors, transceiver circuit systems, digital processing circuit systems, analog circuit systems, front-end circuit systems, digital signal processors, filters, amplifiers, power conditioning circuit systems, and / or the like. According to some embodiments, these electronic components 118 are provided as integrated circuits formed on semiconductors packaged in electronic circuit packages. As shown, electronic components 118 are covered by overmolding 121. In some embodiments, overmolding 121 may have electromagnetic shielding. Overmolding 121 is typically formed of materials such as thermoplastic elastomers (TPE), silicone, or other engineered polymers. These materials are chosen because of their flexibility, durability, electrical insulation, and resistance to harsh environmental factors such as humidity, dust, and extreme temperatures. To meet the Federal Communications Commission (FCC) requirements for RF transmission, the overmolding is integrated with the electromagnetic shielding. This shielding is typically achieved by applying a conductive layer (such as a metallized coating, conductive ink, or a nano-reinforced polymer containing materials such as carbon nanotubes or graphene) over or inside the overmolding member 121. In yet another embodiment, the overmolding member 121 is replaced by an electromagnetic shielding member, and therefore the overmolding member 121 is not provided. Figure 1 The encapsulation molding 121 will be replaced by an electromagnetic shield. In some embodiments, the electromagnetic shield is formed of a conductive material (e.g., metal) and forms a radio frequency (RF) shield.

[0054] In this embodiment, the centerline 105 and the side edge 107 are both parallel to each other and parallel to the Y-axis. The side edge 107 defines a first end 124 and a second end 126. The Y-axis defines a first horizontal dimension of the printed circuit board 104. A second horizontal dimension of the printed circuit board 104 is defined by an X-axis orthogonal to the Y-axis. The side edge 128 of the module conductive plane 102 (and the printed circuit board 104) extends from the first end 124 of the side edge 107. In this embodiment, the side edge 128 is parallel to the X-axis and therefore orthogonal to the side edge 107. The side edge 130 of the module conductive plane 102 (and the printed circuit board 104) extends from the second end 126 of the side edge 107. In this embodiment, the side edge 130 is parallel to the X-axis and therefore orthogonal to the side edge 107. Furthermore, in this embodiment, the side edge 130 is opposite to the side edge 128 (i.e., on the opposite side).

[0055] EEVCs 108, 110, 112, 114, and 116 are formed by voids using the module conductive plane 102. The voids have defined geometries (e.g., polygons, ellipses, meandering paths, and isolation islands) and defined thicknesses (e.g., 33 micrometers or less). In some embodiments, the EEVC voids of EEVCs 108, 110, 112, 114, and 116 are filled with the module substrate 106, while in other embodiments, the EEVC voids are empty. The remaining material surrounding the voids of the module conductive plane 102 provides the conductive material for EEVCs 108, 110, 112, 114, and 116. Each of EEVCs 108, 110, 112, 114, and 116 extends from its side edge 107 toward the centerline 105 into the module conductive plane 102. Due to the skin effect of the module conductive plane 102, current flows through the geometric perimeter of the module conductive plane 102, which has an EEVC gap. The module conductive plane 102 has a geometric perimeter 132. In the following text, the geometric perimeter 132 refers to a continuous line forming the boundary of the module conductive plane 102. For example, the geometric perimeter 132 may refer to the four edges of a rectangular conductive plane or a circle defining the circumference of a circular conductive plane.

[0056] According to embodiments of this disclosure, EEVCs 108, 110, 112, 114, and 116 are formed in the module conductive plane 102 by creating EEVC gaps on the module conductive plane 102 or on a conductive plane inserted into the module conductive plane 102. The EEVC gaps extend from the geometric periphery toward the centerline 105 of the module conductive plane 102. The EEVC gaps can have any geometric shape. Figure 1In this structure, the EEVC gap of EEVA 108 forms part of a rectangle. Similarly, the EEVC gap of EEVA 110 also forms part of a rectangle. The EEVC gaps of each of EEVI 112, 114, and 116 form a meandering path, causing EEVI 112, 114, and 116 to form curled sections.

[0057] Regarding EEVA 108 and 110, they are connected to the RF port, as explained in further detail below. The RF port is configured to receive outgoing RF signals. The outgoing RF signal corresponds to a defined wavelength bandwidth that is proportional to the speed and negatively correlated with the frequency of the outgoing RF signal. Regarding EEVA 112, 114, and 116, they are not connected to the RF port.

[0058] EEVI 112 is positioned at the first end 124 of side edge 107, and EEVI 116 is positioned at the second end 126 of side edge 107. EEVA 110, EEVI 114, and EEVA 108 are each positioned along side edge 107 between EEVI 112 and EEVI 116. By being located at the first end 124 and the second end 126 of side edge 107, EEVI 112 and 116 provide isolation to EEVA 108 and 110, allowing RF device 100 to be used as a module. EEVI 112 and 116 are initial conductive plane interruptions; current along side edge 107 passes through them but not through EEVA 108 and 110. EEVA 108 and 110 treat these EEVI 112 and 116 as series inductors. For this reason, when RF device 100 is mounted to another printed circuit board, the edge current has a smaller impact on other conductive plane interruptions. Similarly, EEVI 112, 116 thus provide the necessary isolation, allowing the RF device 100 to be utilized without particularly considering the influence of external connection components. The shape of the printed circuit board to which the RF device 100 is mounted is unknown, and the module conductive plane 102 may reduce antenna impedance. EEVI 112, 116 also ensure that module placement tolerances have a negligible impact on performance, and therefore allow the antenna to be designed to mount the RF device on any main printed circuit board, regardless of the shape of the main printed circuit board.

[0059] In this embodiment, EEVA 108 is a Bluetooth® Low Power (BLE) antenna, and EEVA 110 is an Ultra Wideband (UWB) antenna. EEVA 110 is positioned along side edge 107 between EEVI 112 and EEVI 114. EEVI 114 is positioned along side edge 107 between EEVA 110 and EEVA 108. EEVI 114 provides isolation between EEVA 110 and EEVA 108 along side edge 107. EEVA 108 is positioned along side edge 107 between EEVI 114 and EEVI 116.

[0060] The module conductive plane 102 is formed such that one or more passive matching elements 134 are formed in the EEVC gap of the EEVA 110. The passive matching elements 134 are configured to provide matching for the EEVA 110. The passive matching elements 134 enable the EEVA 110 (which is...) Figure 1 The UWB antenna in the image has a higher bandwidth. EEVA 110 is isolated by EEVI 112, 114, which have a rolled-up structure so that EEVA 108 (and any other EEVAs that may be formed on the module conductive plane 102) does not have significant electromagnetic coupling. In some embodiments, without the passive matching element 134, EEVA 110 can only cover the frequency band associated with channel 9 (CH9) or higher. In some embodiments, EEVA 110 is approximately 1 / 12 the wavelength at 6.25 GHz.

[0061] exist Figure 1 In this circuit board, printed circuit board 104 includes side pads 136 (not all labeled for clarity) along side edge 128. Additionally, printed circuit board 104 includes side pads 138 (not all labeled for clarity) along side edge 130. Side pads 136 and 138 can be used to connect the module conductive plane 102 to the main printed circuit board. Figure 1 Conductive plane (not shown in the image) Figure 1(Not shown in the diagram) and assists in mounting the RF device 100 to the main printed circuit board. Side pads 136, 138 are patterned along side edges 128, 130, where notches are formed along side edges 128, 130 and filled with a conductive material (e.g., a metal, such as copper, gold, and / or nickel). The size and dimensions of side pads 136, 138 are generally minimized to reduce parasitic capacitance and maintain signal integrity at high frequencies. In some embodiments, side pads 136, 138 are connected to the main printed circuit board using wires or flat conductors directly soldered to the appropriate structure of the side pads 136, 138 and the main printed circuit board. This establishes both an electrical connection and a supportive mounting attachment between the printed circuit board 104 and the main printed circuit board. However, any suitable connection mechanism can be used to connect the side pads 136, 138 to the main printed circuit board.

[0062] Figure 2 It is an RF device 200, which includes the above-mentioned... Figure 1 The described RF device 100.

[0063] RF device 200 includes RF device 100 mounted to main printed circuit board 202. Main printed circuit board 202 includes a main substrate 204 and a main conductive plane 206, wherein the main conductive plane 206 is integrated with the main substrate 204. The main substrate 204 forms the body of the main printed circuit board 202. In some embodiments, the main substrate 204 is formed of epoxy laminate, glass, glass fiber, Teflon, metal, and any other acceptable material for providing surface mount technology. In some embodiments, conductive structures are formed within the main substrate 204 to form connections between electronic components (see electronic component 118) mounted on the main printed circuit board 202. In some embodiments, no electronic components are directly mounted on the main printed circuit board 202. In some embodiments, the main conductive plane 206 is a ground plane configured to reference a ground voltage.

[0064] exist Figure 2 In this embodiment, the main conductive plane 206 is formed on the top surface 208 of the module substrate 106 of the printed circuit board 104. In other embodiments, the main conductive plane 206 may be formed on the bottom surface of the main substrate 204. In yet another embodiment, the main conductive plane 206 is formed as a conductive layer within the main substrate 204. In some embodiments, the main conductive plane 206 may be a ground plane.

[0065] exist Figure 2In this embodiment, side pads 136 and 138 extend to and cover a portion of the main conductive plane 206 of the main printed circuit board 202. In this embodiment, conductors 209 (not all labeled for clarity) connect the side pads 136 and 138 to the main conductive plane 206. The side pads 136 and 138 connect to the module conductive plane 102, and thereby connect the module conductive plane 102 to the main conductive plane 206.

[0066] EEVI 112 is positioned at the first end 124 of side edge 107, and EEVI 116 is positioned at the second end 126 of side edge 107. EEVA 110, EEVI 114, and EEVA 108 are each positioned along side edge 107 between EEVI 112 and EEVI 116. By being located at the first end 124 and the second end 126 of side edge 107, EEVI 112 and 116 provide isolation for EEVA 110 and 108, allowing RF device 100 to be used as a module. EEVI 112 and 116 are initial conductive plane interruptions; current along side edge 107 passes through them but not through EEVA 108. EEVA 108 treats these EEVI 112 and 116 as series inductors. For this reason, since module conductive plane 102 is connected to main conductive plane 206, the edge current is less affected by the interruptions. Similarly, EEVI 112, 116 thus provide the necessary isolation, allowing the RF device 100 to be used without particularly considering the influence of the main printed circuit board 202. The shape of the main printed circuit board 104 on which the RF device 100 is mounted reduces antenna impedance. EEVI 112, 116 ensure that module placement tolerances have a negligible impact on performance, and therefore allow the RF device 100 to be mounted on the main printed circuit board 202 regardless of the shape of the main printed circuit board 202.

[0067] exist Figure 2 In the main printed circuit board 202, including a main substrate 204 and a main conductive plane 206, a side edge 210 is defined. When the RF device 100 is mounted to the main conductive plane 206, the side edge is parallel to a side edge 107 of the RF device 100, as shown in the RF device 200. A portion of the main printed circuit board 202 is cut off relative to the side edge 210. The side edge 107 of the printed circuit board 104, including the module substrate 106 and the module conductive plane 102, is retracted relative to the side edge 210 of the main printed circuit board 202.

[0068] Figure 3 It is based on some implementation plans. Figure 1 The top view of the module printed circuit board 104 shown.

[0069] Show Figure 3To more clearly illustrate EEVI 112, 114, 116 and EEVA 108, 110, and Figure 1 Additional features not explicitly shown. Printed circuit board 104 includes EEVI 112, 114, 116 and EEVA 108, 110 located in the module conductive plane 102, as described above regarding... Figure 1 As described above. Figure 3 As shown more clearly, the module conductive plane 102 contains a passive matching element 134 within the EEVC gap of the EEVA 110. In this example, the EEVA 110 is formed by an L-shaped segment 302 that partially surrounds the EEVC gap of the EEVA 110. One leg 304 of the L-shaped segment 302 is parallel to the Y-axis and positioned along the side edge 107. The other leg 306 of the L-shaped segment 302 is parallel to the X-axis and is connected to the end of the leg 304. The leg 306 extends into the module conductive plane 102. An RF port 308 is connected to the farthest end of the leg 306, away from the leg 304. RF signals can be transmitted through electronic components (e.g., Figure 1 The electronic component 108 shown transmits and receives data between itself and the EEVA 110.

[0070] Passive matching element 134 is formed by the module conductive plane 102 and, for EEVA 110, presents as a matching network consisting of passive capacitors and passive inductors. Passive matching element 134 provides matching for EEVA 110 and enables EEVA to have a higher bandwidth.

[0071] The module conductive plane 102 provides legs 312, 314, 316, and 318 for the EEVA 108. Leg 314 is parallel to the Y-axis and positioned along side edge 107. Leg 312 is connected to one end of leg 314 and extends parallel to the X-axis into the module conductive plane 102. An RF port 320 is connected to the furthest end of leg 312 away from segment 314. In this manner, the EEVA 108 is configured to transmit RF signals to electronic components (e.g., Figure 1 The electronic component 108 shown is used to receive RF signals. Leg 316 extends from the other end of leg 314 into the module's conductive plane 102. Leg 316 is parallel to the X-axis. Leg 318 is connected to the end of leg 316 away from leg 314. Leg 318 is parallel to the Y-axis but is less long than leg 314. Therefore, legs 312, 314, 316, and 318 partially enclose the EEVC gap of EEVA 108.

[0072] The module conductive plane 102 is formed as a curled portion 322 forming EEVI 112, wherein the EEVC gap of EEVI 112 is formed as a tortuous path defined by the curled portion 322. In this embodiment, the curled portion 322 is a rectangular curled portion. In other embodiments, the curled portion 322 may have any other shape, such as a circular or elliptical curled portion. EEVI 112 is not connected to an RF port. Therefore, no conductor is formed to connect EEVI 112 to an RF port.

[0073] The module conductive plane 102 is formed as a curled portion 324 forming EEVI 114, wherein the EEVC gap of EEVI 114 is formed as a tortuous path defined by the curled portion 324. In this embodiment, the curled portion 324 is a rectangular curled portion. In other embodiments, the curled portion 324 may have any other shape, such as a circular or elliptical curled portion. EEVI 114 is not connected to an RF port. Therefore, no conductor is formed to connect EEVI 114 to an RF port.

[0074] The module conductive plane 102 is formed as a curled portion 326 forming EEVI 116, wherein the EEVC gap of EEVI 116 is formed as a tortuous path defined by the curled portion 326. In this embodiment, the curled portion 326 is a rectangular curled portion. In other embodiments, the curled portion 326 may have any other shape, such as a circular or elliptical curled portion. EEVI 116 is not connected to an RF port. Therefore, no conductor is formed to connect EEVI 116 to an RF port.

[0075] Figure 4 It is an installable RF antenna module 400 according to some implementation schemes.

[0076] The mountable RF antenna module 400 includes a frame 402 and a mounting bracket as described above. Figure 2 The RF device 200 is described above. More specifically, the main printed circuit board 202 is mounted to the frame 402. The RF device 100 is mounted to the RF device 200. In this embodiment, screws 404 are provided for mounting the RF antenna module to the chassis of the user component (in...). Figure 4 (Not explicitly shown). However, the mountable RF antenna module 400 can be mounted into the chassis of the user component using any suitable mounting mechanism.

[0077] Figure 5 It is based on some implementation schemes shown. Figure 1 , Figure 2 and Figure 3 The figure 500 shows the antenna efficiency of the EEVA 110 relative to frequency.

[0078] As described above, the EEVA 110 is a UWB antenna. Graph 500 shows that the EEVA 110 has an antenna efficiency greater than -2 dB at frequencies above 6 GHz and close to -1 dB at frequencies above 6.5 GHz to 8.25 GHz. Due to the EEVA 112, 116 and passive matching element 134, the EEVA 110 can cover not only the frequencies in CH9 but also the frequencies in CH5 (by consistently maintaining antenna efficiency in these bands).

[0079] Figure 6 It is based on some implementation schemes shown. Figure 1 , Figure 2 and Figure 3 The graph 600 shows the S22 parameter (in decibels) of the EEVA 110 relative to frequency.

[0080] As shown in graph 600, the antenna's S22 parameter remains above −12.5 dB at frequencies slightly above 6 GHz and up to a maximum of 8.6 GHz. It should be noted that a lower S22 parameter generally indicates better performance. Graph 600 also shows that at RF port 308 (… Figure 3 The reflection generated at (shown in the image) is low throughout the CH5 and CH9 frequency bands. Due to EEVI 112, 116 and passive matching element 134, EEVA 110 can cover not only the frequencies in CH9 but also the frequencies in CH5 (by maintaining antenna efficiency throughout these bands).

[0081] Figure 7 It is a Smith chart 700 based on some implementation schemes, which shows Figure 1 , Figure 2 and Figure 3 The antenna impedance of the EEVA110 shown is the S22 parameter across the entire frequency scan range.

[0082] As shown in Smith chart 700, the antenna impedance of the EEVA 110 remains relatively close to the center of the Smith chart throughout the 6.25–8.25 GHz frequency range. This demonstrates relatively good antenna operation within the CH5 and CH9 bands.

[0083] Figure 8 It is based on some implementation schemes shown. Figure 1 , Figure 2 and Figure 3 The graph 800 shows the radiated power (in decibels) of EEVA 110 relative to frequency.

[0084] like Figure 8As shown, the radiated power remains close to 0 dB throughout the CH5 and CH9 frequency bands. This demonstrates that the EEVA 110 has high power output when operating throughout the CH5 and CH9 frequency bands.

[0085] We noticed that Figure 1 , Figure 2 and Figure 3 The EEVA 108 also exhibits consistent antenna efficiency across the entire Bluetooth® band due to the EEVI 112 and 116, regardless of the surrounding materials (wood, concrete, metal) presented to the EEVA 108.

[0086] Figure 9 This is a flowchart 900 illustrating a method for manufacturing an RF device according to some implementation schemes.

[0087] In some implementations, the manufactured RF device is Figure 2 The RF device 200 shown is included. Figure 1 and Figure 3 The RF device 100 shown and Figure 2 The main printed circuit board 202 is shown. Flowchart 900 includes boxes 902 to 912. Those skilled in the art will understand the manufacturing and processing details of flowchart 900. The process begins at box 902.

[0088] At frame 902, a module substrate is formed. An example of a module substrate is... Figure 1 , Figure 2 and Figure 3 The module substrate 106 is shown. The process then proceeds to block 904.

[0089] At frame 904, a module conductive plane is integrated with a module substrate, wherein the module conductive plane defines a side edge, the side edge defining a first end and a second end disposed opposite to the first end. An example of a module conductive plane is... Figure 1 , Figure 2 and Figure 3 The module's conductive plane 102 is shown. An example of a side edge is... Figure 1 , Figure 2 and Figure 3 The side edge 107 is shown. An example of the first end is... Figure 1 , Figure 2 and Figure 3 The first end 124 is shown, and an example of the second end is... Figure 1 , Figure 2 and Figure 3 The second end 126 is shown in the diagram. The process then proceeds to box 906.

[0090] At frame 906, a first EEVI, a second EEVI, and an EEVA are formed, each extending along a side edge of the module's conductive plane into the conductive plane. The first EEVI is located at a first end of the side edge, the second EEVI is located at a second end of the side edge, and the EEVA is located along the side edge between the first EEVI and the second EEVI. An example of the first EEVI is... Figure 1 , Figure 2 and Figure 3 The example shown is EEVI 112. A second example of EEVI is... Figure 1 , Figure 2 and Figure 3 The example shown is EEVI 116. Examples of EEVA are EEVA 108 and EEVA 110.

[0091] At frame 908, a main substrate is formed. An example of a main substrate is... Figure 2 The main substrate 204 is shown in the diagram. The process then proceeds to block 910.

[0092] At box 910, the main conductive plane is integrated with the main substrate. An example of the main conductive plane is... Figure 2 The main conductive plane 206 is shown. The process then proceeds to box 912.

[0093] At box 912, the main conductive plane is connected to the module conductive plane. An example of this is achieved by connecting side pads 136 and 138 via wire 209. Figure 2 The main conductive plane 206 is shown in the diagram.

[0094] Figure 10 These are user components based on certain implementation schemes.

[0095] refer to Figure 10The above concepts can be implemented in various types of user element 1000, such as mobile terminals, smartwatches, tablets, computers, navigation devices, access points, and similar wireless communication devices that support wireless communication (e.g., cellular, wireless local area network (WLAN), Bluetooth®, and near field communication). User element 1000 will generally include a control system 1002, a baseband processor 1004, a transmission circuit system 1006, a receiving circuit system 1008, an antenna switching circuit system 1010, multiple antennas 1012, and a user interface circuit system 1014. In a non-limiting example, the control system 1002 may be a field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC). In this respect, the control system 1002 may include at least a microprocessor, embedded memory circuitry, and a communication bus interface. The receiving circuit system 1008 receives radio frequency signals from one or more base stations via antennas 1012 and through the antenna switching circuit system 1010. Low-noise amplifiers and filters cooperate to amplify and eliminate broadband interference from the received signals for processing. Then, a down-conversion and digitization circuitry system (not shown) down-converts the filtered received signal to an intermediate or baseband frequency signal, which is then digitized into one or more digital streams using an analog-to-digital converter (ADC).

[0096] The baseband processor 1004 processes the digitized received signal to extract the information or data bits transmitted in the received signal. This processing typically includes demodulation, decoding, and error correction operations, which will be discussed in more detail below. The baseband processor 1004 is typically implemented in one or more digital signal processors (DSPs) and application-specific integrated circuits (ASICs).

[0097] For transmission, baseband processor 1004 receives digitized data representing voice, data, or control information from control system 1002, which is encoded for transmission. The encoded data is output to transmission circuitry system 1006, where a digital-to-analog converter (DAC) converts the digitally encoded data into an analog signal, and a modulator modulates the analog signal onto a carrier signal at one or more desired transmission frequencies. A power amplifier amplifies the modulated carrier signal to a level suitable for transmission, and the modulated carrier signal is passed to antenna 1012 via antenna switching circuitry system 1010. Multiple antennas 1012, along with replicated transmission circuitry system 1006 and receiver circuitry system 1008, can provide spatial diversity.

[0098] Upon consideration, any of the foregoing aspects, and / or the various individual aspects and features as described herein, may be combined to obtain additional advantages. Unless otherwise indicated herein, any embodiment of the various embodiments disclosed herein may be combined with one or more other disclosed embodiments.

[0099] Those skilled in the art will understand improvements and modifications to the preferred embodiments of this disclosure. All such improvements and modifications are considered to be within the scope of the concepts disclosed herein and the claims below.

Claims

1. A radio frequency (RF) device, comprising: Module substrate; The module's conductive plane is integrated with the module substrate, wherein: The conductive plane of the module defines the side edge; The side edge defines a first end and a second end disposed opposite to the first end; The module conductive plane defines a first edge-enabled gap isolator EEVI, a second EEVI, and an edge-enabled gap antenna EEVA, each extending along the side edge of the module conductive plane into the module conductive plane; The first EEVI is located at the first end of the side edge; The second EEVI is positioned at the second end of the side edge; and The EEVA is positioned between the first EEVI and the second EEVI along the side edge.

2. The RF device according to claim 1, further comprising: Main substrate; A main conductive plane is integrated with the main substrate, wherein the main conductive plane is connected to the module conductive plane.

3. The RF device according to claim 2, wherein: The side edge is the first side edge; The conductive plane of the module defines the second side edge and the third side edge; The second side edge extends from the first end of the first side edge; The third side edge extends from the second end of the first side edge; The first EEVI is positioned at the second side edge; and The second EEVI is located at the third side edge.

4. The RF device according to claim 3, further comprising: A first side pad, along the edge of the second side, connects the first EEVI to the main conductive plane; The second side pad, along the edge of the third side, connects the second EEVI to the main conductive plane.

5. The RF device according to claim 2, wherein: The main substrate and the main conductive plane define the side edges of the printed circuit board (PCB). The side edge of the conductive plane of the module is retracted relative to the side edge of the PCB.

6. The RF device of claim 2, wherein the module substrate is mounted on the main substrate.

7. The RF device of claim 1, wherein the EEVA is a first EEVA, and wherein: The module conductive plane defines a second EEVA and a third EEVI, each extending along the side edge of the module conductive plane into the module conductive plane; The second EEVA and the third EEVI are positioned along the side edge between the first EEVI and the second EEVI; and The third EEVI is positioned between the first EEVA and the second EEVA along the side edge.

8. The RF device of claim 7, wherein the first EEVA is a Bluetooth® Low Power (BLE) antenna and the second EEVA is an Ultra Wideband (UWB) antenna.

9. The RF device of claim 1, wherein the conductive plane defines one or more passive matching elements formed in the voids of the EEVA, the passive matching elements being configured to provide matching to the EEVA.

10. The RF device of claim 1, further comprising a mounting area for mounting at least one electronic component, wherein the first EEVI, the second EEVI, and the EEVA are outside the mounting area.

11. A method of manufacturing a radio frequency (RF) device, comprising: Forming a module substrate; The module conductive plane is integrated with the module substrate, wherein the module conductive plane defines a side edge, the side edge defines a first end and a second end disposed opposite to the first end; A first edge-enabled gap isolator (EEVI), a second EEVI, and an edge-enabled gap antenna (EEVA) are formed, each extending along the side edge of the module conductive plane into the module conductive plane, wherein the first EEVI is located at the first end of the side edge, the second EEVI is located at the second end of the side edge, and the EEVA is located along the side edge between the first EEVI and the second EEVI.

12. The method of claim 11, further comprising: Forming the main substrate; Integrate the main conductive plane with the main substrate; as well as Connect the main conductive plane to the module conductive plane.

13. A user element comprising a radio frequency (RF) device, the RF device including: Module substrate; The module's conductive plane is integrated with the module substrate, wherein: The conductive plane of the module defines the side edge; The side edge defines a first end and a second end disposed opposite to the first end; The module conductive plane defines a first edge-enabled gap isolator EEVI, a second EEVI, and an edge-enabled gap antenna EEVA, each extending along the side edge of the module conductive plane into the module conductive plane; The first EEVI is located at the first end of the side edge; The second EEVI is positioned at the second end of the side edge; and The EEVA is positioned between the first EEVI and the second EEVI along the side edge.

14. The user element of claim 13, wherein the RF device further comprises: Main substrate; A main conductive plane is integrated with the main substrate, wherein the main conductive plane is connected to the module conductive plane.

15. The user element according to claim 14, wherein: The side edge is the first side edge; The conductive plane of the module defines the second side edge and the third side edge; The second side edge extends from the first end of the first side edge; The third side edge extends from the second end of the first side edge; The first EEVI is positioned at the second side edge; and The second EEVI is located at the third side edge.

16. The user element according to claim 15, further comprising: A first side pad, along the edge of the second side, connects the first EEVI to the main conductive plane; The second side pad, along the edge of the third side, connects the second EEVI to the main conductive plane.

17. The user element according to claim 14, wherein: The main substrate and the main conductive plane define the side edges of the printed circuit board (PCB); and The side edge of the conductive plane of the module is retracted relative to the side edge of the PCB.

18. The user element of claim 14, wherein the module substrate is mounted on the main substrate.

19. The user element of claim 13, wherein the EEVA is a first EEVA, and wherein: The module conductive plane defines a second EEVA and a third EEVI, each extending along the side edge of the module conductive plane into the module conductive plane; The second EEVA and the third EEVI are positioned along the side edge between the first EEVI and the second EEVI; and The third EEVI is positioned between the first EEVA and the second EEVA along the side edge.

20. The user element of claim 19, wherein the first EEVA is a Bluetooth® Low Power (BLE) antenna and the second EEVA is an Ultra Wideband (UWB) antenna.

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