A full-automatic rapid glue pressing machine

Abstract

The present application aims to provide a kind of full-automatic fast glue pressing machine. The present application includes pressing module, and the two sides of the pressing module are respectively provided with feeding module and discharging module, and the inlet and outlet of the pressing module are provided with carrying linear module, and the pressing module includes several groups of inlet and outlet linear modules driven in horizontal direction, and the several groups of inlet and outlet linear modules are distributed in layers, and the action end of the inlet and outlet linear modules is provided with feeding table, and the upper part of the inlet and outlet linear modules is provided with first lifting module, and the action end of the first lifting module is provided with pressing plate, and the pressing plate carries out pressure maintaining with the circuit board product of the feeding table, and the carrying linear module carries out feeding and discharging of circuit board product, and the feeding table adopts layer structure, and realizes uninterrupted feeding of circuit board product. The present application is applied to the technical field of circuit board manufacturing.

Description

Technical Field

[0001] This invention relates to the technical field of circuit board manufacturing, and in particular to a fully automatic high-speed adhesive bonding machine. Background Technology

[0002] Circuit boards, hailed as the "mother of electronic products," are the core carriers for achieving electrical connections between electronic components. Their applications have deeply penetrated various electronics-related fields, such as industrial equipment, automotive electronics, and consumer electronics. Circuit boards also find wide application in high-end fields like 5G communication equipment, AI servers, medical imaging instruments, and aerospace electronics. Circuit board production is a complex process integrating precision chemistry, machining, and optical imaging. The complete production of multilayer PCBs requires more than 20 processes. Key processes include material preparation, inner layer circuit fabrication, lamination and drilling, hole metallization, and outer layer circuit fabrication. High-temperature lamination is a crucial step in multilayer PCB manufacturing. The inner core board, prepreg, and outer copper foil are precisely stacked according to the design sequence and fed into a vacuum hot press. Under high temperature and pressure conditions exceeding 180°C, the multilayer board is fused together. The strength of this bond directly determines the structural strength, electrical performance, and long-term reliability of the circuit board.

[0003] Semi-finished circuit boards must be isolated using anti-static materials. The core purpose is to prevent electrostatic damage, avoid scratches on the board surface, and prevent component deformation due to pressure. The most commonly used anti-static material on the market is anti-static cardboard / spacer paper, which has anti-static and sulfur-free properties and is suitable for downstream processes such as OSP and immersion tinning. It can suppress static electricity accumulation and prevent metal layer corrosion. When storing semi-finished products in anti-static hollow board boxes, anti-static cardboard should be added between each layer for separation. However, in the existing technology, most of the loading and unloading is done manually. One person needs to operate two pressing machines, which is labor-intensive and has low loading efficiency. For example, Chinese patent CN119095291A discloses an automated pressing device for integrated circuit board processing. Although it can achieve automated pressing, the pressing efficiency is not high. It can only press one circuit board at a time. After the pressing process is completed, the machine needs to be stopped to wait for the next circuit board to be loaded, resulting in low work efficiency. Therefore, it is necessary to provide a fully automatic high-speed adhesive pressing machine with a compact structure, high working efficiency, and a double-layer feeding structure to achieve uninterrupted loading and unloading. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a fully automatic high-speed glue pressing machine with a compact structure, high working efficiency, and a double-layer feeding structure to achieve uninterrupted loading and unloading.

[0005] The technical solution adopted in this invention is as follows: This invention includes a pressing module, on both sides of which are respectively provided a feeding module and a discharging module. The inlet and outlet of the pressing module are provided with a conveying linear module. The pressing module includes several sets of horizontally driven feeding and discharging linear modules, which are arranged in layers. The moving end of the feeding and discharging linear module is provided with a feeding platform. A first lifting module is provided above the feeding and discharging linear module. The moving end of the first lifting module is provided with a pressure plate. The pressure plate maintains pressure with the circuit board products on the feeding platform. The conveying linear module loads and unloads the circuit board products. The feeding platform adopts a layered structure to realize uninterrupted feeding of circuit board products.

[0006] As can be seen from the above scheme, the feeding module is used to feed the electrostatic paperboard and the circuit boards to be pressed. The handling module includes a feeding arm and a unloading arm. The feeding arm rotates the circuit boards to be pressed to the feeding table of the pressing module. The feeding table adopts a double-layer structure to achieve uninterrupted loading and unloading. The pressing module is used to press the circuit boards. The unloading arm transfers the pressed circuit boards to the unloading module. The unloading module stacks the pressed circuit boards. A preferred embodiment is that the driving direction of the feeding / discharging linear module is taken as the Y-axis direction, and the driving direction of the conveying linear module is taken as the X-axis direction. The number of feeding / discharging linear modules is two, and the two sets of feeding / discharging linear modules include a first linear module and a second linear module. The first linear module is provided with a first feeding platform at its operating end, and the second linear module is provided with a second feeding platform at its operating end. The width of the first feeding platform in the X-axis direction is greater than the width of the second feeding platform in the X-axis direction.

[0007] In a preferred embodiment, the fully automatic high-speed adhesive pressing machine further includes a second lifting module, which is disposed below the pressing module, and the actuating end of the second lifting module is connected to the first linear module.

[0008] In a preferred embodiment, the moving end of the conveying linear module is provided with a third lifting module and a fourth lifting module. The moving end of the third lifting module is provided with a first suction cup, and the moving end of the fourth lifting module is provided with a second suction cup. The first suction cup serves as the feeding tray for the circuit board product, and the second suction cup serves as the discharging tray for the circuit board product.

[0009] In a preferred embodiment, the feeding module includes a fifth lifting module and a sixth lifting module, which are arranged side by side. The fifth lifting module serves as the material receiving station for circuit board products, and the sixth lifting module serves as the recycling component for electrostatic paperboard.

[0010] In a preferred embodiment, the feeding module further includes a first transverse module, the first transverse module being driven in the Y-axis direction, a second transverse module being provided at the actuating end of the first transverse module, the second transverse module being driven in the X-axis direction, a rotary table being provided at the actuating end of the second transverse module, and a third suction cup being provided at the actuating end of the rotary table.

[0011] In a preferred embodiment, the feeding module further includes a third transverse moving module, the driving direction of the third transverse moving module is the Y-axis direction, the actuating end of the third transverse moving module is provided with a seventh lifting module, and the actuating end of the seventh lifting module is provided with a fourth suction cup.

[0012] In a preferred embodiment, the fully automatic high-speed adhesive bonding machine further includes a camera module, which is positioned above the first transverse module.

[0013] In a preferred embodiment, the unloading module further includes an eighth lifting module and a ninth lifting module, which are arranged side by side. The eighth lifting module serves as a stacking station for circuit board products, and the ninth lifting module serves as a replacement station for electrostatic paperboard.

[0014] In a preferred embodiment, the unloading module further includes a fourth transverse moving module, the driving direction of the fourth transverse moving module is the Y-axis direction, the actuating end of the fourth transverse moving module is provided with a tenth lifting module, and the actuating end of the tenth lifting module is provided with a fifth suction cup. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a three-dimensional structural diagram of the present invention from another angle; Figure 3 This is a three-dimensional structural diagram of the pressing module; Figure 4 This is a three-dimensional structural diagram of the feeding platform; Figure 5 This is a three-dimensional structural diagram of the first transverse module. Detailed Implementation

[0016] like Figures 1 to 5As shown, in this embodiment, the present invention includes a pressing module 1, with a feeding module 2 and a discharging module 3 respectively arranged on both sides of the pressing module 1. A conveying linear module 4 is provided at the inlet and outlet of the pressing module 1. The pressing module 1 includes several sets of horizontally driven feeding and discharging linear modules 5, which are arranged in layers. A feeding platform 6 is provided at the actuating end of the feeding and discharging linear module 5. A first lifting module 7 is provided above the feeding and discharging linear module 5. A pressure plate 8 is provided at the actuating end of the first lifting module 7. The pressure plate 8 maintains pressure with the circuit board products on the feeding platform 6. The conveying linear module 4 loads and unloads the circuit board products. The feeding platform 6 adopts a layered structure to realize uninterrupted feeding of circuit board products.

[0017] like Figures 1 to 5 As shown, in this embodiment, the driving direction of the feeding and discharging linear module 5 is taken as the Y-axis direction, and the driving direction of the conveying linear module 4 is taken as the X-axis direction. There are two sets of feeding and discharging linear modules 5. The two sets of feeding and discharging linear modules 5 include a first linear module 51 and a second linear module 52. The first linear module 51 is provided with a first feeding platform 9 at its operating end, and the second linear module 52 is provided with a second feeding platform 10 at its operating end. The width of the first feeding platform 9 in the X-axis direction is greater than the width of the second feeding platform 10 in the X-axis direction.

[0018] like Figures 1 to 5 As shown, in this embodiment, the fully automatic high-speed glue pressing machine further includes a second lifting module 12, which is disposed below the pressing module 1, and the actuating end of the second lifting module 12 is connected to the first linear module 51.

[0019] like Figures 1 to 5 As shown, in this embodiment, the moving end of the conveying linear module 4 is provided with a third lifting module 13 and a fourth lifting module 14. The moving end of the third lifting module 13 is provided with a first suction cup 15, and the moving end of the fourth lifting module 14 is provided with a second suction cup 16. The first suction cup 15 serves as the feeding tray for the circuit board product, and the second suction cup 16 serves as the discharging tray for the circuit board product.

[0020] like Figures 1 to 5 As shown, in this embodiment, the feeding module 2 includes a fifth lifting module 17 and a sixth lifting module 18, which are arranged side by side. The fifth lifting module 17 serves as the material receiving station for circuit board products, and the sixth lifting module 18 serves as the recycling component for electrostatic paperboard.

[0021] like Figures 1 to 5As shown, in this embodiment, the feeding module 2 further includes a first transverse module 19, the driving direction of the first transverse module 19 is the Y-axis direction, the actuating end of the first transverse module 19 is provided with a second transverse module 20, the driving direction of the second transverse module 20 is the X-axis direction, the actuating end of the second transverse module 20 is provided with a rotary table, and the actuating end of the rotary table is provided with a third suction cup 22.

[0022] like Figures 1 to 5 As shown, in this embodiment, the feeding module 2 further includes a third transverse module 23, the driving direction of the third transverse module 23 is the Y-axis direction, the actuating end of the third transverse module 23 is provided with a seventh lifting module 24, and the actuating end of the seventh lifting module 24 is provided with a fourth suction cup 25.

[0023] like Figures 1 to 5 As shown, in this embodiment, the fully automatic high-speed glue pressing machine also includes a camera module 26, which is disposed above the first transverse module 19.

[0024] like Figures 1 to 5 As shown, in this embodiment, the unloading module 3 further includes an eighth lifting module 27 and a ninth lifting module 28. The eighth lifting module 27 and the ninth lifting module 28 are arranged side by side. The eighth lifting module 27 serves as a stacking station for circuit board products, and the ninth lifting module 28 serves as a replacement station for electrostatic paperboard.

[0025] like Figures 1 to 5 As shown, in this embodiment, the unloading module 3 further includes a fourth transverse module 29, the driving direction of the fourth transverse module 29 is the Y-axis direction, the actuating end of the fourth transverse module 29 is provided with a tenth lifting module 30, and the actuating end of the tenth lifting module 30 is provided with a fifth suction cup 31.

[0026] Although the embodiments of the present invention are described with reference to actual solutions, they do not constitute a limitation on the meaning of the present invention. Modifications to the embodiments and combinations with other solutions based on this specification will be obvious to those skilled in the art.

Claims

1. A fully automatic high-speed adhesive pressing machine, comprising a pressing module (1), wherein a feeding module (2) and a discharging module (3) are respectively provided on both sides of the pressing module (1), and a conveying linear module (4) is provided at the inlet and outlet of the pressing module (1), characterized in that: The pressing module (1) includes several sets of horizontally driven feeding and discharging linear modules (5). The several sets of feeding and discharging linear modules (5) are arranged in layers. The feeding and discharging linear modules (5) are equipped with a feeding platform (6) at their operating ends. A first lifting module (7) is arranged above the feeding and discharging linear modules (5). A pressure plate (8) is arranged at the operating end of the first lifting module (7). The pressure plate (8) and the circuit board products on the feeding platform (6) are pressed together. The conveying linear module (4) loads and unloads the circuit board products. The feeding platform (6) adopts a layered structure to realize uninterrupted feeding of the circuit board products.

2. The fully automatic high-speed adhesive bonding machine according to claim 1, characterized in that, Taking the driving direction of the feed and discharge linear module (5) as the Y-axis direction and the driving direction of the transport linear module (4) as the X-axis direction, the feed and discharge linear module (5) consists of two groups. The two groups of feed and discharge linear modules (5) include a first linear module (51) and a second linear module (52). The first linear module (51) is provided with a first feeding platform (9) at its operating end, and the second linear module (52) is provided with a second feeding platform (10) at its operating end. The width of the first feeding platform (9) in the X-axis direction is greater than the width of the second feeding platform (10) in the X-axis direction.

3. The fully automatic high-speed adhesive bonding machine according to claim 2, characterized in that, The fully automatic high-speed glue pressing machine also includes a second lifting module (12), which is located below the pressing module (1), and the actuating end of the second lifting module (12) is connected to the first linear module (51).

4. The fully automatic high-speed adhesive bonding machine according to claim 3, characterized in that, The moving end of the linear conveying module (4) is provided with a third lifting module (13) and a fourth lifting module (14). The moving end of the third lifting module (13) is provided with a first suction cup (15), and the moving end of the fourth lifting module (14) is provided with a second suction cup (16). The first suction cup (15) serves as the feeding tray for the circuit board product, and the second suction cup (16) serves as the discharging tray for the circuit board product.

5. The fully automatic high-speed adhesive bonding machine according to claim 4, characterized in that, The feeding module (2) includes a fifth lifting module (17) and a sixth lifting module (18). The fifth lifting module (17) and the sixth lifting module (18) are arranged side by side. The fifth lifting module (17) serves as the material receiving station for circuit board products, and the sixth lifting module (18) serves as the recycling component for electrostatic paperboard.

6. The fully automatic high-speed adhesive bonding machine according to claim 5, characterized in that, The feeding module (2) further includes a first transverse module (19), the driving direction of the first transverse module (19) is the Y-axis direction, the action end of the first transverse module (19) is provided with a second transverse module (20), the driving direction of the second transverse module (20) is the X-axis direction, the action end of the second transverse module (20) is provided with a rotary table, and the action end of the rotary table is provided with a third suction cup (22).

7. The fully automatic high-speed adhesive bonding machine according to claim 6, characterized in that, The feeding module (2) also includes a third transverse module (23), the driving direction of the third transverse module (23) is the Y-axis direction, the action end of the third transverse module (23) is provided with a seventh lifting module (24), and the action end of the seventh lifting module (24) is provided with a fourth suction cup (25).

8. The fully automatic high-speed adhesive bonding machine according to claim 7, characterized in that, The fully automatic high-speed glue pressing machine also includes a camera module (26), which is positioned above the first transverse module (19).

9. The fully automatic high-speed adhesive bonding machine according to claim 8, characterized in that, The unloading module (3) also includes an eighth lifting module (27) and a ninth lifting module (28). The eighth lifting module (27) and the ninth lifting module (28) are arranged side by side. The eighth lifting module (27) serves as a stacking station for circuit board products, and the ninth lifting module (28) serves as a replacement station for electrostatic paperboard.

10. The fully automatic high-speed adhesive bonding machine according to claim 9, characterized in that, The unloading module (3) also includes a fourth transverse module (29), the driving direction of the fourth transverse module (29) is the Y-axis direction, the action end of the fourth transverse module (29) is provided with a tenth lifting module (30), and the action end of the tenth lifting module (30) is provided with a fifth suction cup (31).

Images