Heat exchange device and electronic device

Abstract

The application discloses a heat exchange device and electronic equipment, and relates to the technical field of heat exchange of electronic equipment, and comprises a frame, a vapor chamber assembly, an upper cover and a flow channel separator. The vapor chamber assembly comprises a base plate and fins. The base plate is arranged on one side of the frame. The inner cavities of the fins and the inner cavity of the base plate are communicated to jointly form a phase change cavity. The upper cover is arranged on the other side of the frame. The upper cover, the frame and the base plate jointly enclose a heat exchange cavity. The flow channel separator is arranged in the heat exchange cavity. The flow channel separator divides the heat exchange cavity into a plurality of sub-flow channels. At least part of the wall surface of the sub-flow channels is formed by the outer wall surface of the fins. The arrangement of the fins can effectively expand the heat diffusion area. The arrangement of the sub-flow channels can thin the thermal boundary layer and improve the liquid-side heat exchange capacity. The two work together to jointly reduce the total thermal resistance of the cold plate, so that the heat exchange device can simultaneously meet the demand of high heat flow density chips for heat diffusion capacity and liquid-side heat exchange capacity in a limited space.

Description

Technical Field

[0001] This application relates to the field of heat exchange technology for electronic devices, and more particularly to a heat exchange device and electronic device. Background Technology

[0002] As electronic devices continue to evolve towards higher integration and performance, their integration and performance density are increasing at an unprecedented rate. Simultaneously, electronic devices are constrained by multiple factors, including rack space, power supply and distribution, and total energy consumption, placing more stringent demands on the size, power consumption, and reliability of heat dissipation systems. Under such high heat flux density conditions, traditional forced air cooling technology, due to the low specific heat capacity and limited heat transfer coefficient of air, has reached near-engineering limits in terms of heat dissipation capacity and cannot effectively meet the thermal management needs of high-power devices.

[0003] Liquid cooling technology, with its inherent advantages of high specific heat capacity and high heat transfer coefficient of coolant, has become the mainstream solution for heat dissipation in various electronic devices such as servers, switching equipment, and storage devices. Liquid cooling plates are the core components that are directly attached to and perform heat exchange in liquid cooling systems. Their thermal resistance and heat dissipation capacity directly determine the maximum operating junction temperature of the chip, thereby affecting its performance release, service life, and overall system reliability.

[0004] From the perspective of heat transfer physics, the heat dissipation capacity of a liquid cooling plate is determined by two main factors: one is the heat diffusion capacity, which is insufficient and leads to difficulty in homogenizing local hot spots and a higher peak junction temperature; the other is the liquid-side heat transfer capacity, which is insufficient and limits the intensity of convective heat transfer. The two together constitute the main components of the total thermal resistance of the cooling plate. Any shortcoming will cause the chip junction temperature to rise. How to optimize these two factors simultaneously within a limited space is a core technical challenge that has long been faced in the field of liquid cooling plate design. Summary of the Invention

[0005] This application provides a heat exchange device and electronic equipment to at least solve the problem in the related art that it is impossible to simultaneously achieve heat diffusion capability and liquid-side heat exchange capability.

[0006] This application provides a heat exchange device, comprising: frame; A heat spreader assembly includes a substrate and fins. The substrate is disposed on one side of the frame and has a first side and a second side facing away from each other. The first side is formed as a heat-conducting surface. The fins are disposed on the second side and the inner cavity of the fins communicates with the inner cavity of the substrate to jointly form a phase change cavity that can be filled with a phase change medium. The upper cover is located on the other side of the frame. The upper cover, the frame and the substrate together enclose a heat exchange cavity, and the fins are located inside the heat exchange cavity. A flow channel separator is disposed within the heat exchange cavity, which divides the heat exchange cavity into multiple independent sub-flow channels. The heat exchange cavity has an inlet side and an outlet side. The sub-flow channels connect the inlet side and the outlet side. At least a portion of the wall surface of the sub-flow channels is formed by the outer wall surface of the fins.

[0007] Through this application, the heat generated by the electronic device is first transferred to the substrate. The phase change medium inside the substrate absorbs the heat and evaporates. The gaseous phase change medium flows into each fin along the interconnected inner cavity, condenses and releases heat on the inner wall of the fin cavity, and the condensate flows back to the substrate to complete the phase change heat transfer cycle. Through the phase change cycle, the non-uniform heat flow generated by the electronic device, especially local hot spots, is rapidly homogenized and diffused to a larger area. Moreover, the size of the fins can be flexibly designed according to actual needs to effectively expand the heat diffusion area. This can more quickly eliminate local hot spots, reduce the peak junction temperature of the chip, and effectively improve the heat diffusion capability. At the same time, the flow channel separator will... The heat exchange cavity is divided into multiple independent sub-channels. The coolant is confined to flow within each individual sub-channel and cannot flow freely between adjacent sub-channels. Compared to the scheme where the fin gaps form a single connected cavity, the hydraulic diameter of the sub-channels is reduced, the velocity distribution on the channel cross-section is more uniform, the velocity gradient near the fin wall is increased, and the thermal boundary layer is thinned, thereby improving the convective heat transfer coefficient and the liquid-side heat transfer capacity. Thus, through the synergistic effect of both, the total thermal resistance of the cold plate can be reduced, allowing the heat exchange device to simultaneously meet the requirements of high heat flux density chips for thermal diffusion and liquid-side heat transfer capacity within a limited space.

[0008] This application also provides an electronic device, including electronic components and a heat exchange device as described in any of the preceding claims, wherein the first surface of the substrate of the heat exchange device contacts the electronic components for heat exchange.

[0009] Through this application, since the first surface (i.e., the heat-conducting surface) of the substrate of the heat exchange device contacts and exchanges heat with the electronic components, the heat generated by the electronic components is conducted to the first surface of the substrate, and then diffused to the fins through the phase change cycle of the phase change medium in the inner cavity of the substrate and the inner cavity of the fins, and then carried away by the coolant flowing through the sub-channel, thereby controlling the temperature of the electronic components within the allowable range; thus, the heat dissipation problem of high-power electronic components can be effectively solved, the chip junction temperature can be reduced, and the performance release, service life and system reliability of electronic equipment can be improved. Attached Figure Description

[0010] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the structure of the heat exchange device provided in the embodiments of this application; Figure 2 An exploded view of the heat exchange device provided in the embodiments of this application; Figure 3 An exploded view of the heat exchange unit provided in an embodiment of this application; Figure 4 A schematic diagram of the framework provided in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the heat spreader assembly provided in the embodiments of this application; Figure 6 This is a schematic diagram of the flow channel separator provided in an embodiment of this application.

[0012] The above figures include the following reference numerals: 1. Frame; 11. Liquid inlet side; 12. Liquid outlet side; 2. Heat spreader assembly; 21. Base plate; 22. Fins; 23. First gap; 24. Second gap; 3. Top cover; 4. Flow channel separator; 41. Sub-flow channel; 5. Fastening plate; 51. Through hole; 6. Water inlet pipe; 61. Water inlet connector; 7. Water outlet pipe; 71. Water outlet connector; 8. Water distributor; 9. Water collector. Detailed Implementation

[0013] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0014] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are used only for the convenience of describing this application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similarity is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0015] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0016] Reference Figures 1 to 6 As shown, embodiments of this application provide a heat exchange device suitable for liquid cooling of high-power electronic components in various electronic devices such as servers, switching equipment, storage devices, and high-performance computers. The heat exchange device integrates a vapor chamber phase change heat transfer structure with a liquid cooling plate structure. The vapor chamber assembly 2 achieves efficient and uniform heat diffusion from the chip. Multiple independent sub-channels 41 are constructed within the heat exchange cavity through the flow channel separator 4, allowing the coolant to flow efficiently between the outer walls of the fins 22. This simultaneously solves the two core technical problems of "insufficient heat diffusion capacity" and "insufficient liquid-side heat transfer capacity" in high heat flux density chip heat dissipation.

[0017] The heat exchange device includes a frame 1, a heat spreader assembly 2, a top cover 3, and a flow channel separator 4. The frame 1 forms the external support skeleton of the heat exchange device, and its interior forms a receiving space. The heat spreader assembly 2 is located on one side of the frame 1, and the top cover 3 is located on the other side of the frame 1, so as to jointly construct the external outline of the heat exchange unit.

[0018] Reference Figure 3 and Figure 5 As shown, the heat spreader assembly 2 includes a substrate 21 and fins 22. The substrate 21 is disposed on one side of the frame 1 and has a first side and a second side facing away from each other. The first side faces outward and is formed as a smooth heat-conducting surface for direct contact and heat exchange with electronic components of electronic devices. The second side faces inward, and the fins 22 are disposed on the second side, with the inner cavity of the fins 22 communicating with the inner cavity of the substrate 21 to jointly form a phase change cavity that can be filled with a phase change medium. The phase change medium can be deionized water, methanol, acetone, or other working fluids known in the art suitable for phase change heat transfer. A liquid wick structure can also be provided in the phase change cavity. The liquid wick can be made of sintered metal powder, metal mesh, or porous material and covers the inner wall of the substrate 21 and the inner wall of the fins 22 to provide a capillary path for condensate return.

[0019] The upper cover 3 is located on the other side of the frame 1. Specifically, the upper cover 3 covers the top opening of the frame 1 and is fixedly connected to the frame 1. The upper cover 3, the frame 1, and the base plate 21 together enclose a heat exchange cavity, and the fins 22 are located inside the heat exchange cavity. The upper cover 3 is provided with a liquid inlet and a liquid outlet, which are respectively provided on the liquid inlet side 11 and the liquid outlet side 12 of the heat exchange cavity.

[0020] Reference Figure 3 and Figure 6 As shown, the flow channel separator 4 is disposed within the heat exchange cavity, dividing the heat exchange cavity into multiple independent sub-flow channels 41. The heat exchange cavity has an inlet side 11 and an outlet side 12, and the sub-flow channels 41 connect the inlet side 11 and the outlet side 12. At least a portion of the wall surface of the sub-flow channel 41 is formed by the outer wall surface of the fins 22. It can be understood that after the coolant enters from the inlet side 11, it is distributed to each sub-flow channel 41 and flows along the sub-flow channel 41 to the outlet side 12. The coolant can form an independent and orderly flow between the outer walls of the fins 22, and during the flow process, the coolant directly contacts the outer wall surface of the fins 22, carrying away the heat released by the condensation of the phase change medium in the inner cavity of the fins 22.

[0021] Through this application, the heat generated by the electronic device is first transferred to the substrate 21. The phase change medium in the substrate 21 absorbs the heat and evaporates. The gaseous phase change medium flows into each fin 22 along the interconnected inner cavity. It condenses and releases heat on the inner wall of the fin 22. The condensate flows back to the substrate 21 to complete the phase change heat transfer cycle. Through the phase change cycle, the non-uniform heat flow generated by the electronic device, especially the local hot spots, is quickly homogenized and diffused to a larger area. Moreover, the size of the fin 22 can be flexibly designed according to actual needs to effectively expand the heat diffusion area. This can eliminate local hot spots more quickly, reduce the peak junction temperature of the chip, and effectively improve the heat diffusion capability.

[0022] Meanwhile, the flow channel separator 4 divides the heat exchange cavity into multiple independent sub-flow channels 41. The coolant is confined to flow within each individual sub-flow channel 41 and cannot flow freely between adjacent sub-flow channels 41. Compared to the scheme where the fin gaps form a single connected cavity, the hydraulic diameter of the sub-flow channel 41 is reduced, the velocity distribution on the channel cross-section is more uniform, the velocity gradient near the outer wall of the fin 22 is increased, and the thermal boundary layer is thinned, thereby improving the convective heat transfer coefficient and the liquid-side heat transfer capacity. Thus, through the synergistic effect of both, the total thermal resistance of the cold plate can be reduced, enabling the heat exchange device to simultaneously meet the requirements of high heat flux density chips for thermal diffusion and liquid-side heat transfer capacity within a limited space.

[0023] In addition, the heat spreader assembly 2 is integrated with the liquid cooling channel, and the phase change condensation surface and the liquid cooling heat exchange surface are combined into one, namely the wall surface of the fin 22. There is no need to set an additional thermal interface material layer between the heat spreader and the cold plate, which shortens the heat transfer path and reduces the overall thermal resistance.

[0024] In some embodiments, continue to refer to Figure 5 As shown, the fins 22 extend from the second surface away from the substrate 21 along the thickness direction of the substrate 21. That is, the substrate 21 closes the bottom of the frame 1, and the fins 22 extend upward from the second surface of the substrate 21 into the heat exchange cavity; the top cover 3 closes the top of the frame 1, leaving a space between it and the top of the fins 22 to facilitate the flow of coolant. The flow channel separator 4 is embedded in the heat exchange cavity and fits against the outer wall surface of the fins 22 to form a sub-flow channel 41, through which coolant enters from the inlet side 11 and fully contacts the outer wall surface of the fins 22.

[0025] It should be noted that the thickness direction of substrate 21 refers to the direction from the first surface to the second surface, that is, the direction perpendicular to the plane of substrate 21. The fins 22 extend outward from the second surface along this thickness direction, that is, they grow vertically away from substrate 21. The extension height of the fins 22 can be freely designed according to heat dissipation requirements, and its height is not constrained by the overall thickness of the cold plate. Therefore, a larger liquid-side heat transfer area and heat transfer height can be obtained with the same cold plate bottom area, extending the contact path between the coolant and the fins 22, thus further improving the liquid-side heat transfer capacity and meeting the heat dissipation requirements of high heat flux density chips. Of course, the fins 22 can also extend at a certain angle to the second surface; this application does not limit this.

[0026] In practice, the fin 22 is hollow inside, and its inner cavity is connected to the inner cavity of the substrate 21, together forming part of the phase change cavity. The outer wall surface of the fin 22 is exposed in the heat exchange cavity and cooperates with the flow channel separator 4 to define the sub-flow channel 41. The outer contour cross-sectional shape of the fin 22 can be rectangular, trapezoidal, circular, elliptical, rhomboid, or streamlined. The outer wall surface of the fin 22 constitutes the heat exchange surface in contact with the coolant.

[0027] In some embodiments, refer to Figure 6 As shown, the flow channel separator 4 is formed by bending a sheet multiple times. The cross-sectional shape of the flow channel separator 4 is serpentine, meaning the cross-section presents a continuous bending profile, including multiple alternating protrusions and grooves. The flow channel separator 4 is embedded in the gaps between the fins 22, and the grooved portion together with the outer wall of the fin 22 forms a sub-flow channel 41. Because the flow channel separator 4 is bent multiple times along the height direction of the fin 22, multiple sub-flow channels 41 are formed in the gaps between the fins 22, arranged in layers along the height direction of the fin 22. That is, the flow channel separator 4 can divide the heat exchange cavity into multiple sub-flow channels 41 arranged in layers along the height direction of the fin 22. The coolant is distributed from the inlet side 11 to each layered sub-flow channel 41. Since the sub-flow channels 41 are independent of each other, the coolant is constrained to flow within its own channel, resulting in a more uniform flow velocity distribution and an increased velocity gradient near the wall, thereby improving the convective heat transfer coefficient.

[0028] Specifically, the serpentine shape can be S-shaped, wavy, sawtooth-shaped, or continuously bent, with the bending parts facing different directions alternately, thereby forming multiple independent channels within the heat exchange cavity.

[0029] Furthermore, the inner cavity of fin 22 and sub-channel 41 are along the first direction (refer to...) Figure 5 The coolant extends in the same direction as the Y direction. The first direction is the direction of extension from the liquid inlet side 11 to the liquid outlet side 12. The coolant flows in from the liquid inlet side 11 along the first direction and flows in the sub-channel 41, and finally flows out from the liquid outlet side 12. The fins 22 themselves extend along the first direction, and the hollow cavity inside them also extends along the first direction.

[0030] Multiple fins 22 along the second direction (refer to) Figure 5 The fins are spaced apart in the X direction, and the second direction intersects with the first direction. Preferably, they are perpendicular, that is, multiple fins 22 are arranged in parallel in the second direction perpendicular to the coolant flow direction, a first gap 23 is formed between adjacent fins 22, and a second gap 24 is formed between the outermost fin 22 and the inner wall of the frame 1. Each gap is provided with a flow channel separator 4, thereby forming multiple parallel sub-flow channels 41 in the second direction.

[0031] With this configuration, the coolant enters the heat exchange cavity from the inlet side 11 and is distributed to each sub-channel 41. Since the sub-channels 41 extend along the first direction, the coolant flows along this direction, continuously carrying away heat from the fins 22 along the way, avoiding localized heat exchange dead zones caused by intersecting or perpendicular flow directions, and improving the uniformity of temperature distribution. Furthermore, the large surface area of ​​each fin 22 is exposed in the corresponding sub-channel 41, and the coolant flows through the large surface area of ​​each fin 22 along the first direction, thus forming multiple parallel heat exchange surfaces in the second direction. Therefore, the coolant can simultaneously contact the large surfaces of multiple fins 22, and the effective heat exchange area increases linearly with the number and height of the fins, breaking through the traditional limitation of heat exchange area imposed by the thickness of the cold plate.

[0032] In some embodiments, the ends of the bent portions on the flow channel separator 4 are fitted against the outer wall surface of the fin 22, meaning the protruding portions of the serpentine cross-section can contact the outer wall surface of the fin 22. Specifically, the flow channel separator 4 is formed by bending a sheet multiple times to create a serpentine cross-section, with each bend having an end facing the outer wall surface of the fin 22. In this embodiment, these bent ends are tightly fitted against the outer wall surface of the fin 22; the fitting method can be surface contact or line contact.

[0033] Specifically, at least a portion of the bent ends of the flow channel partition 4 includes a first bent end located on one side of the flow channel partition 4 and a second bent end located on the other side. Specifically, the flow channel partition 4 is disposed in a first gap 23 (or a second gap 24 between the fins 22 and the inner wall of the frame 1) between two adjacent fins 22. The protruding end facing one fin 22 forms the first bent end, which is in contact with the outer wall surface of that fin 22. The protruding end facing the other fin 22 (or the inner wall of the frame 1) forms the second bent end, which is in contact with the outer wall surface of the other fin 22 (or the inner wall surface of the frame 1). A sealing contact is formed between the first bent end and the outer wall surface of one fin 22, and a sealing contact is formed between the second bent end and the outer wall surface of the other fin 22 (or the inner wall surface of the frame 1). The outer wall surfaces of the fins 22 constitute the two main heat exchange walls of the sub-flow channel 41, and the first or second bent end constitutes the upper and lower boundaries or lateral boundaries of the sub-flow channel 41, respectively. As a result, the space within the first gap 23 (or the second gap 24) is fully occupied by the flow channel separator 4, and the originally single large cavity is divided into multiple sub-flow channels 41 arranged in layers along the height direction of the fin 22, so that the gap space is fully utilized.

[0034] It should be noted that after the first and second bent ends are fitted against the outer wall surface of the fin 22 or the inner wall surface of the frame 1, the flow channel separator 4 is reliably positioned within the gap, enhancing the overall rigidity and stability of the structure and reducing vibration caused by coolant flow. Simultaneously, when the flow channel separator 4 is made of a thermally conductive material, the fit between the bent ends and the outer wall surface of the fin 22 can also form an auxiliary heat conduction path, further reducing the interfacial thermal resistance between the outer wall surface of the fin 22 and the coolant.

[0035] In some embodiments, the number of fins 22 is set to multiple, a first gap 23 is formed between adjacent fins 22, and a second gap 24 is formed between the fins 22 near the inner wall of the frame 1 and the inner wall of the frame 1. A flow channel separator 4 is provided at the first gap 23 and / or the second gap 24. That is, the flow channel separator 4 can be provided only in the first gap 23, that is, the gap between adjacent fins 22; or it can be provided only in the second gap 24, that is, the gap between the outermost fin 22 and the inner wall of the frame 1; or it can be provided in both the first gap 23 and the second gap 24.

[0036] This application provides flow channel separators 4 in the first gap 23 between multiple fins 22 and / or the second gap 24 between the fins 22 and the inner wall of the frame 1. This allows full utilization of all available space in the heat exchange cavity, forming a network of sub-flow channels 41 covering the outer wall of all fins 22. This not only further increases the liquid-side heat exchange area but also allows the coolant to flow through the outer wall of each fin 22, avoiding the problem of insufficient cooling in local areas, improving the uniformity of temperature distribution, and reducing the peak junction temperature of the chip.

[0037] In some embodiments, the flow channel separator 4 is made of a thermally conductive material and has good thermal conductivity. Specifically, the thermally conductive material can be a metal such as copper, copper alloy, aluminum, aluminum alloy, or stainless steel, or it can be a high thermal conductivity composite material.

[0038] When the flow channel partition 4 is in contact with or adheres to the outer wall of the fin 22, the heat from the fin 22 can be directly transferred to the flow channel partition 4 through contact heat conduction. The flow channel partition 4 then transfers the heat to the coolant flowing through the sub-flow channel 41. Therefore, the flow channel partition 4 not only serves to separate the flow channels but also participates in heat exchange as an auxiliary heat exchange surface. That is, the surface of the flow channel partition 4 can be in direct contact with the coolant, and a heat conduction path can also be formed inside it. In this embodiment, the flow channel partition 4 is formed by bending a sheet material, and the sheet material itself is a thermally conductive material. Therefore, the entire flow channel partition 4 has a thermally conductive function. Of course, only the bent end of the flow channel partition 4 can be made of a thermally conductive material, while the other parts are made of a non-thermally conductive material. However, it is preferable that the entire part is made of a thermally conductive material to simplify the manufacturing process.

[0039] In practice, the phase change medium inside the fin 22 condenses and releases heat. This heat is conducted through the fin 22 wall to the outer wall. Part of the heat is directly transferred to the coolant flowing through the sub-channel 41, while the other part is transferred to the channel separator 4 through contact heat conduction, and then transferred to the coolant from the surface of the channel separator 4. The channel separator 4 not only performs the function of channel separation, but also participates in heat exchange as a secondary heat exchange surface, further increasing the effective heat exchange area and reducing the interfacial thermal resistance between the outer wall of the fin 22 and the coolant, thereby improving the overall heat exchange efficiency.

[0040] In some embodiments, refer to Figure 3 As shown, the number of fins 22 is set to multiple, and the ends of the multiple fins 22 away from the substrate 21 are fixedly connected by a fastening plate 5. Specifically, the fastening plate 5 and the top of the fins 22 can be fixedly connected by brazing, welding, bonding or mechanical fastening, so that the tops of the multiple fins 22 are connected as one, forming a stable fin array, enhancing structural stability and preventing the fins 22 from deforming or vibrating under the impact of coolant flow.

[0041] The fastening plate 5 has multiple through holes 51. The ends of multiple fins 22 away from the substrate 21 are inserted into the multiple through holes 51 one by one. The through holes 51 allow the ends of the fins 22 to pass through the fastening plate 5, facilitating assembly and positioning. At the same time, the fastening plate 5 can form a tight fit with the ends of the fins 22 through the through holes 51, enhancing the connection strength. During assembly, the through holes 51 of the fastening plate 5 are aligned with the ends of the fins 22, so that the ends of the fins 22 are inserted into the through holes 51, and then the fastening plate 5 is sealed and fixed to the ends of the fins 22.

[0042] A space for coolant flow is formed between the snap-fit ​​plate 5 and the upper cover 3. In other words, the coolant can flow through this space and exchange heat with the surface of the snap-fit ​​plate 5, thereby effectively dissipating heat from the top of the fins 22, preventing the top of the fins 22 from becoming a heat exchange dead zone due to its distance from the substrate 21, and improving the temperature uniformity of the fins 22 in the height direction.

[0043] When the snap-fit ​​plate 5 is made of thermally conductive material, it can also serve as an auxiliary heat exchange surface, further increasing the effective heat exchange area on the liquid side, reducing the interfacial thermal resistance between the top of the fin 22 and the coolant, thereby improving the overall heat exchange efficiency and meeting the requirements of high heat flux density chips for heat diffusion capability and liquid side heat exchange capability.

[0044] Furthermore, the snap-fit ​​plate 5 does not seal the top of the heat exchange cavity; the sealing of the heat exchange cavity is achieved by the upper cover 3 and the frame 1. The snap-fit ​​plate 5 only serves to fix and assist in heat dissipation, resulting in a simple structure that does not affect the normal flow of coolant within the heat exchange cavity. Specifically, the heat exchange cavity has connecting grooves formed near the inlet side 11 and near the outlet side 12. These connecting grooves also extend from the substrate 21 to the upper cover 3 along the thickness direction of the substrate 21 to connect the cavities above and below the snap-fit ​​plate 5, allowing the coolant entering the heat exchange cavity to enter the sub-flow channel 41 and the space between the snap-fit ​​plate 5 and the upper cover 3.

[0045] Furthermore, referring to Figure 4 As shown, the ends of multiple fins 22 near the substrate 21 can also be fixedly connected by a snap-fit ​​structure to enhance the structural stability of the fins 22.

[0046] In some embodiments, refer to Figure 1 and Figure 2 As shown, the frame 1, the heat exchange plate assembly 2, and the top cover 3 constitute a heat exchange unit. The number of heat exchange units is set to at least one. That is, the heat exchange device can be composed of one or more heat exchange units, and multiple heat exchange units can be arranged side by side, stacked, or in an array.

[0047] The heat exchange device also includes an inlet pipe 6, an outlet pipe 7, a water distributor 8, and a water collector 9. The inlet pipe 6 is connected to the water distributor 8, which has at least one water outlet. The at least one water outlet is connected to the liquid inlet side 11 of the heat exchange cavity of at least one heat exchange unit. The water collector 9 has at least one water outlet, which is connected to the liquid outlet side 12 of the heat exchange cavity of at least one heat exchange unit. The water collector 9 is connected to the outlet pipe 7.

[0048] During operation, the coolant enters the inlet pipe 6 through the inlet connector 61 and flows into the distributor 8. The distributor 8 distributes the coolant to the inlet side 11 of each heat exchange unit, then into each sub-channel 41. After flowing over the outer wall of the fins 22, it flows out from the outlet side 12 and into the collector 9. Finally, it is discharged from the outlet pipe 7 through the outlet connector 71. Multiple heat exchange units can correspond to multiple electronic components or different heat-generating areas of the same electronic component. By connecting multiple heat exchange units in parallel or in a modular manner, the heat dissipation area and capacity can be expanded as needed, improving the uniformity of coolant distribution and reducing system pressure drop. This is suitable for the liquid cooling needs of high-power, multi-heat-source electronic equipment.

[0049] In some embodiments, the second surface is provided with an open cavity, which is a cavity space formed by recessing inward from the second surface of the substrate 21. Its opening faces the heat exchange cavity side, and the fins 22 grow vertically from the bottom surface of the open cavity, that is, the bottom surface of the open cavity can form the growth substrate of the fins 22. In this way, the relative extension height of the fins 22 can be increased without increasing the overall thickness of the substrate 21, thereby increasing the volume and evaporation area of ​​the phase change cavity, which is conducive to the full evaporation and circulation of the phase change medium, thereby improving the heat diffusion capability of the heat spreader and effectively solving the problems of difficulty in homogenizing local hot spots and high peak junction temperature of the chip.

[0050] Embodiments of this application also provide an electronic device, including a heat exchange device according to any of the above embodiments, wherein the first surface of the substrate 21 of the heat exchange device contacts and exchanges heat with electronic components.

[0051] The electronic device provided in this application includes the heat exchange device of any of the above embodiments, and therefore has the beneficial effects of the heat exchange device of any of the above embodiments, which will not be repeated here.

[0052] Through this application, since the first surface (i.e., the heat-conducting surface) of the substrate 21 of the heat exchange device contacts and exchanges heat with the electronic components, the heat generated by the electronic components is conducted to the first surface of the substrate 21, and then diffused to the fins 22 through the phase change cycle of the phase change medium in the inner cavity of the substrate 21 and the inner cavity of the fins 22. It is then carried away by the coolant flowing through the sub-channel 41, thereby controlling the temperature of the electronic components within the allowable range. Thus, the heat dissipation problem of high-power electronic components can be effectively solved, the chip junction temperature can be reduced, and the performance release, service life and system reliability of electronic devices can be improved.

[0053] In practice, electronic devices can be servers, switching equipment, storage devices, high-performance computers, etc.; electronic components can be high-power chips such as processors, graphics processors, application-specific integrated circuits, and field-programmable gate arrays, or other electronic components that require heat dissipation. The first surface of the substrate 21 can be directly attached to the surface of the electronic component, or it can be indirectly contacted through thermal interface materials such as thermal grease or thermal pads.

[0054] The above provides a detailed description of a heat exchange device and electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat exchange device, characterized in that, include: Framework (1); The heat spreader assembly (2) includes a substrate (21) and fins (22). The substrate (21) is disposed on one side of the frame (1). The substrate (21) has a first side and a second side facing away from each other. The first side is formed as a heat-conducting surface. The fins (22) are disposed on the second side, and the inner cavity of the fins (22) is connected to the inner cavity of the substrate (21) to jointly form a phase change cavity that can be filled with a phase change medium. The top cover (3) is located on the other side of the frame (1). The top cover (3), the frame (1) and the substrate (21) together enclose a heat exchange cavity, and the fins (22) are located inside the heat exchange cavity. A flow channel separator (4) is disposed in the heat exchange cavity. The flow channel separator (4) divides the heat exchange cavity into multiple independent sub-flow channels (41). The heat exchange cavity has an inlet side (11) and an outlet side (12). The sub-flow channel (41) connects the inlet side (11) and the outlet side (12). At least part of the wall surface of the sub-flow channel (41) is formed by the outer wall surface of the fin (22).

2. The heat exchange device according to claim 1, characterized in that, The fins (22) extend from the second surface away from the substrate (21) along the thickness direction of the substrate (21).

3. The heat exchange device according to claim 1, characterized in that, The flow channel partition (4) is formed by bending a sheet multiple times. The cross-sectional shape of the flow channel partition (4) is serpentine. The flow channel partition (4) divides the heat exchange cavity into multiple sub-flow channels (41) arranged in layers along the height direction of the fins (22).

4. The heat exchange device according to claim 3, characterized in that, The end of the bent portion of the flow channel separator (4) is fitted to the outer wall surface of the fin (22).

5. The heat exchange device according to any one of claims 1 to 4, characterized in that, The number of fins (22) is set to multiple, a first gap (23) is formed between adjacent fins (22), a second gap (24) is formed between the fins (22) near the inner wall of the frame (1) and the inner wall of the frame (1), and the flow channel separator (4) is provided at the first gap (23) and / or the second gap (24).

6. The heat exchange device according to any one of claims 1 to 4, characterized in that, The flow channel separator (4) is made of thermally conductive material.

7. The heat exchange device according to any one of claims 1 to 4, characterized in that, The number of fins (22) is set to multiple, and the ends of the multiple fins (22) away from the substrate (21) are fixedly connected by a fastening plate (5).

8. The heat exchange device according to claim 7, characterized in that, The fastening plate (5) has multiple through holes (51), and the ends of the multiple fins (22) away from the substrate (21) are inserted into the multiple through holes (51) in a corresponding manner. A space for coolant to flow is formed between the fastening plate (5) and the upper cover (3).

9. The heat exchange device according to any one of claims 1 to 4, characterized in that, The frame (1), the heat exchange plate assembly (2), and the top cover (3) constitute a heat exchange unit, and the number of the heat exchange units is set to at least one; The heat exchange device further includes an inlet pipe (6), an outlet pipe (7), a water distributor (8), and a water collector (9). The inlet pipe (6) is connected to the water distributor (8). The water distributor (8) has at least one water outlet, and at least one water outlet is connected to the liquid inlet side (11) of the heat exchange cavity of at least one heat exchange unit. The water collector (9) has at least one water outlet, and at least one water outlet is connected to the liquid outlet side (12) of the heat exchange cavity of at least one heat exchange unit. The water collector (9) is connected to the outlet pipe (7).

10. An electronic device, characterized in that, It includes electronic components and a heat exchange device as described in any one of claims 1 to 9, wherein the first surface of the substrate (21) of the heat exchange device contacts the electronic components for heat exchange.

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