Preparation method of display module, display module and equipment

Abstract

The application relates to the technical field of display, and provides a preparation method of a display module, the display module and equipment. The method comprises the following steps: providing a micro light-emitting diode chip array; providing a co-encapsulation optical substrate, the co-encapsulation optical substrate is provided with a light engine; absorbing a plurality of target micro light-emitting diode chips through a transfer array, the arrangement parameters of the plurality of target micro light-emitting diode chips correspond to the light channel arrangement parameters of the light engine; performing alignment calibration on the plurality of target micro light-emitting diode chips and the co-encapsulation optical substrate; performing bonding on the plurality of target micro light-emitting diode chips and the co-encapsulation optical substrate which have completed the alignment calibration, so as to obtain the display module, the plurality of target micro light-emitting diode chips are arranged in correspondence with the light channels of the light engine in the display module, so that the mounting precision of the plurality of target micro light-emitting diode chips is improved, and the preparation effect of the display module is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a method for preparing a display module, a display module, and equipment. Background Technology

[0002] With the rapid iteration of large-scale generative artificial intelligence (AI) models, AI data centers are placing extreme demands on the bandwidth, power consumption, and density of high-speed interconnects within servers. Traditional copper cable interconnects experience severe power consumption spikes and high-frequency signal attenuation issues after single-channel rates exceed 400G; pluggable optical modules face bottlenecks such as long electrical interconnect paths, high power consumption, and insufficient integration density. Co-packaged Optics (CPO) technology co-packages optical engines with computing chips, such as Application Specific Integrated Circuits (ASICs) and Graphics Processing Units (GPUs), onto the same substrate, significantly shortening the electrical interconnect path and becoming a core technology solution for next-generation high-speed interconnects for AI computing power.

[0003] MicroLEDs are integrated into computing chips using CPO (Content-Based Optical Assembly) technology to achieve high-speed optical interconnects between chips. The MicroLED CPO solution, with its extremely low power consumption of 1-2 pJ / bit (only 5% of traditional copper cable solutions) and ultra-high bandwidth density, has become the optimal solution for short-distance optical interconnects within AI cabinets. The core of MicroLED fabrication lies in the high-precision, high-yield mounting of MicroLED chips. Currently, the mainstream mounting technology in the industry is mass transfer technology.

[0004] Currently, the mainstream technical solutions for mass transfer of MicroLEDs in the industry are divided into two categories. The first category is the laser lift-off mass transfer process for display panel applications, and the second category is the single-chip pick-up and mounting process using a high-precision die bonder.

[0005] In the relevant technologies, both processes are developed for light-emitting diode (LED) display panel scenarios and cannot meet the core requirements of CPO optical interconnect scenarios. When using these two processes to mount MicroLED chips onto CPO substrates to obtain the corresponding CPO light engines, it is easy to cause poor mounting accuracy of MicroLED chips, which in turn leads to poor fabrication results of CPO light engines. Summary of the Invention

[0006] The main objective of this application is to provide a method for fabricating a display module, a display module, and an apparatus, aiming to solve the technical problem that poor mounting accuracy of MicroLED chips on a CPO substrate leads to poor fabrication results for the display module.

[0007] In a first aspect, embodiments of this application provide a method for manufacturing a display module, comprising: A micro light-emitting diode (LED) chip array is provided, the micro light-emitting diode chip array comprising a plurality of preset micro light-emitting diode chips, and each preset micro light-emitting diode chip having a first identifier; A co-packaged optical substrate is provided, wherein an optical engine is provided on the co-packaged optical substrate, and a second identifier is provided on the co-packaged optical substrate corresponding one-to-one with the optical channels included in the optical engine; Multiple target micro-light-emitting diode chips are adsorbed from multiple preset micro-light-emitting diode chips by a transfer array, and the arrangement parameters of the multiple target micro-light-emitting diode chips in the micro-light-emitting diode chip array correspond to the optical channel arrangement parameters of the light engine. Based on the first identifier of each of the multiple target micro LED chips and the second identifier of the co-packaged optical substrate, the multiple target micro LED chips and the co-packaged optical substrate are aligned and calibrated to obtain the multiple target micro LED chips and the co-packaged optical substrate that have completed the alignment calibration. The multiple target micro-light-emitting diode chips that have completed alignment and calibration are bonded to the co-packaged optical substrate to obtain a display module, wherein the multiple target micro-light-emitting diode chips in the display module are arranged correspondingly to the optical channels of the optical engine.

[0008] Secondly, embodiments of this application also provide a display module, including: A co-packaged optical substrate, wherein an optical engine is disposed on the co-packaged optical substrate; and... Multiple target micro-light-emitting diode chips are bonded to the co-packaged optical substrate, and the multiple target micro-light-emitting diode chips in the display module are arranged corresponding to the optical channels of the optical engine.

[0009] Thirdly, embodiments of this application also provide a display device, which includes the aforementioned display module.

[0010] In the process of fabricating the display module, a transfer array is used to adsorb multiple target micro-LED chips from multiple preset micro-LED chips included in the micro-LED chip array. This allows the arrangement parameters of the multiple target micro-LED chips in the micro-LED chip array to correspond with the optical channel arrangement parameters of the optical engine. The first identifier of each of the multiple target micro-LED chips and the second identifier of the co-packaged optical substrate are used for alignment calibration of the multiple target micro-LED chips and the co-packaged optical substrate. Then, the aligned and calibrated multiple target micro-LEDs and the co-packaged optical substrate are bonded to obtain the display module. This ensures that the multiple target micro-LED chips in the display module correspond one-to-one with the optical channels of the optical engine. When the arrangement parameters of multiple target micro-LED chips on the co-packaged optical substrate in the display module correspond to the arrangement parameters of the optical channel of the optical engine, and the multiple target micro-LED chips in the display module and the optical channels of the optical engine are set in a one-to-one correspondence, the multiple target micro-LED chips in the display module and the optical channels of the optical engine can be set in a corresponding manner. This is beneficial to improving the mounting accuracy of the multiple target micro-LED chips included in the display module, so that the display module can adapt to the core requirements of the CPO optical interconnect scenario, thereby improving the manufacturing effect of the display module. Attached Figure Description

[0011] Figure 1 This is a schematic flowchart illustrating a method for manufacturing a display module according to an embodiment of this application; Figure 2 This is a schematic flowchart of a method for manufacturing a display module according to an embodiment of this application; Figure 3 This is a schematic block diagram of the structure of a display module provided in an embodiment of this application; Figure 4 This is a schematic block diagram of the structure of a display device provided in an embodiment of this application.

[0012] Explanation of reference numerals in the attached figures: 10. Display device; 100. Display module; 110. Co-packaged optical substrate; 120. Target micro light-emitting diode chip. Detailed Implementation

[0013] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0014] The flowchart shown in the attached diagram is for illustrative purposes only and does not necessarily include all content and operations / steps, nor does it necessarily have to be performed in the order described. For example, some operations / steps can be broken down, combined, or partially merged, so the actual execution order may change depending on the actual situation.

[0015] When using two main technologies—laser-lift mass transfer for display panels and high-precision die bonder single-chip pick-up and mounting—to mount MicroLED chips onto CPO substrates to obtain CPO light engines (also known as display modules), the technology has consistently failed to overcome the technical impasse of the trade-off between mounting accuracy, transfer yield, and mass production efficiency. The shortcomings are as follows: (1) The mounting accuracy cannot meet the core requirements of single-mode fiber coupling: MicroLEDs in CPO optical engines need to achieve end-to-end coupling with single-mode optical fibers with a mode field diameter of only 9 to 10 micrometers. According to the Gaussian beam coupling theory, for every 1 micrometer increase in the lateral coaxiality deviation between the light-emitting center of the MicroLED chip and the fiber core, the coupling efficiency decreases by more than 35%. If the deviation exceeds 1.5 micrometers, it will lead to insufficient single-channel optical power and link failure. Therefore, the mounting accuracy must be within the range of -1 micrometer to 1 micrometer. However, the mounting accuracy of display panels using mass transfer technology is usually within the range of -5 micrometers to 5 micrometers, which cannot meet the requirements of CPO scenarios.

[0016] (2) Transfer yield cannot meet the high reliability and low failure requirements of CPO: A small number of dead pixels in the display panel can be resolved through subsequent repair or bright line compensation. However, the failure of a single MicroLED chip in the CPO light engine will cause the entire high-speed channel to fail, which places high demands on the transfer yield. The transfer yield of display processes in related technologies is usually low and cannot meet the high reliability requirements of CPO scenarios.

[0017] (3) Low selective pickup accuracy of CPO channel arrays: Display panels are uniformly arranged on the front, and a full-area transfer process can be used. However, CPO light engines generally have a specific array arrangement, such as a specific array of 8 / 16 / 32 / 64 channels. It is necessary to selectively pick up the corresponding position and number of MicroLED chips according to the channel requirements. The processes used in related technologies cannot achieve high-precision zoned selective pickup, and transfer molds need to be customized for different channel numbers, resulting in a long product development cycle.

[0018] (4) The processes used in the related technologies are incompatible with the CPO silicon-based packaging system, posing a risk of thermal damage: The display panel uses a glass substrate with large pad sizes and high tolerance for curing processes. In contrast, the CPO light engine uses a silicon substrate with small pad sizes and requires low-temperature curing to reduce the possibility of damaging the computing chip packaged on the same substrate. For example, the silicon substrate used in the CPO light engine includes a 2.5D silicon interposer substrate, with pad sizes only on the 10-micron level. The thermosetting curing method used in the related technologies is prone to substrate warping, poor bonding, and even thermal damage to the computing chip, making it unsuitable for CPO packaging requirements.

[0019] Therefore, there is an urgent need to improve the fabrication of CPO optical engines.

[0020] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0021] Please see Figure 1 , Figure 1 This is a schematic flowchart illustrating a method for manufacturing a display module according to an embodiment of this application. The display module can be applied to a display device. The display device may include a monitor, an electronic device with display function, etc., and is not limited thereto. For example, an electronic device with display function may include a mobile phone, a computer, a wearable device, etc., and is not limited thereto.

[0022] like Figure 1 As shown, the method for preparing the display module includes steps S101 to S105.

[0023] S101. A micro light-emitting diode (LED) chip array is provided, the micro light-emitting diode chip array includes multiple preset micro light-emitting diode chips, and each preset micro light-emitting diode chip has a first identifier.

[0024] In the process of fabricating the display module, a micro-LED chip array can be fabricated. The micro-LED chip array includes multiple preset micro-LED chips, and each preset micro-LED chip has a first identifier.

[0025] In some embodiments, a micro-LED chip array is formed in a growth substrate. The micro-LED chip array includes a plurality of preset micro-LED chips. A first identifier is formed on each preset micro-LED chip. The absolute value of the coaxiality deviation between the center of the first identifier and the light emission center of the preset micro-LED chip is less than or equal to a first deviation threshold.

[0026] For example, the growth substrate may include a sapphire growth substrate, but it is not limited to this, and no limitation is made here.

[0027] For example, during the formation of the first mark on the preset micro-LED chip, the first mark can be prepared on the surface of the preset micro-LED chip. For instance, the first mark can be formed on the electrode surface of the preset micro-LED chip. The electrode surface indicates the surface in the preset micro-LED chip where electrodes are disposed. When the preset micro-LED chip has the first mark, the first mark can serve as a basis for subsequent alignment calibration of the target micro-LED chip and the co-packaged optical substrate, thereby improving the convenience and accuracy of subsequent alignment calibration. In response to the improved accuracy of subsequent alignment calibration of the target micro-LED chip and the co-packaged optical substrate, the bonding accuracy of the target micro-LED chip during subsequent bonding of the target micro-LED chip and the co-packaged optical substrate is improved, thereby improving the subsequent fabrication effect of the display module.

[0028] For example, if the absolute value of the coaxiality deviation between the center of the first identifier and the light-emitting center of the preset micro LED chip is less than or equal to a first deviation threshold, the first identifier and the light-emitting center of the preset micro LED chip are approximately coaxially arranged, or even coaxially arranged. The first deviation threshold can be in the range of 0.1 micrometers to 0.2 micrometers, such as 0.1 micrometers, 0.15 micrometers, 0.2 micrometers, etc. However, it is not limited to this; the first deviation threshold can be preset, or it can be set or adjusted by the user, and there are no restrictions here. When the first marker is arranged approximately coaxially, or even coaxially, with the light emission center of the preset micro-LED chip, the first marker serves as the basis for subsequent alignment and calibration of the target micro-LED chip and the co-packaged optical substrate. The first marker can be used as a basis for approximately aligning or aligning the light emission center of the target micro-LED chip with the center of the optical channel of the optical engine in the co-packaged optical substrate. This is beneficial for improving the light energy utilization efficiency of the display module when bonding the target micro-LED chip and the co-packaged optical substrate to obtain the display module, thereby improving the imaging quality of the display module and thus improving the fabrication effect of the display module.

[0029] For example, during the process of forming the first mark on the preset micro light-emitting diode chip, at least one of the following can be designed: the shape of the first mark, the material used to prepare the first mark, the size of the first mark, the thickness of the first white mark, etc.

[0030] For example, a first identifier may have a first identifier line segment and a second identifier line segment, and the first identifier line segment and the second identifier line segment are set at a preset angle. The preset angle can be pre-set, or it can be set or adjusted by the user, without limitation. When the first identifier line segment and the second identifier line segment are set at a preset angle, the first identifier may appear as a cross shape or an L shape, for example. Of course, it is not limited to this. The first identifier line segment of the first identifier may have a first line width, so that the first identifier line segment can appear as a rectangle. Correspondingly, the second identifier line segment of the first identifier may have a second line width, so that the second identifier line segment can appear as a rectangle, and thus, when the first identifier line segment and the second identifier line segment are set at a preset angle, the rectangle shape presented by the first identifier line segment and the rectangle shape presented by the second identifier line segment may be set at a preset angle. Without limitation.

[0031] For example, the material used to fabricate the first identifier can be the same as the electrode material of the preset micro-LED chip. For instance, if the electrode material of the preset micro-LED chip is a gold-tin (AuSn) eutectic material, the material used to fabricate the first identifier can also include AuSn eutectic material. Of course, the material used to fabricate the first identifier is not limited to AuSn eutectic material, and the material used to fabricate the first identifier can also be different from the electrode material of the preset micro-LED chip; this is not a limitation.

[0032] For example, the first identifier may have a first identifier size and a first identifier thickness. The first identifier size indicates the size of the projection of the first identifier onto a preset plane. The first identifier thickness indicates the size of the projection of the first identifier onto a plane perpendicular to the preset plane. The preset plane is parallel to the light-emitting surface of the preset micro-LED chip. The light-emitting surface of the preset micro-LED chip may also be referred to as the main light-emitting surface of the preset micro-LED chip.

[0033] Taking a preset micro LED chip located in a reference coordinate system as an example. The reference coordinate system can have an X-axis, a Y-axis, and a Z-axis. The X-axis is perpendicular to the Y-axis, and the Z-axis is perpendicular to the X-axis. Together with the Y-axis, they form a reference plane. The preset plane is parallel to the reference plane, and since the preset plane is parallel to the light-emitting surface of the preset micro LED chip, the light-emitting surface of the preset micro LED chip is also parallel to the reference plane. When a first mark is formed on the preset micro LED chip, the first mark can be projected onto the reference plane, and thus the size of the first mark is equivalent to the projected size of the first mark on the reference plane. The projected size of the first mark on the reference plane includes the first mark projected size on the X-axis and the second mark projected size on the Y-axis. The first mark projected size and the second mark projected size can be used to determine the projected area of ​​the first mark on the reference plane corresponding to the X-axis and Y-axis. For example, the projected area of ​​the first mark can be determined by the product of the first mark projected size and the second mark projected size. When the preset plane is parallel to the reference plane, the first sign projection size and the second sign projection size are equivalent to the first sign being projected onto the preset plane. Therefore, the first sign size may include at least one of the first sign projection size, the second sign projection size, and the first sign projection area.

[0034] Accordingly, when a first mark is formed on a preset micro LED chip, the first mark can be projected onto a plane perpendicular to the reference plane, and thus the thickness of the first mark is equivalent to the projected size of the first mark on the plane perpendicular to the reference plane. The projected size of the first mark on the plane perpendicular to the reference plane includes the third mark projected size of the first mark on the Z-axis. When the preset plane is parallel to the reference plane, the third mark projected size is equivalent to the first mark projected onto a plane perpendicular to the preset plane, and thus the thickness of the first mark can include the third mark projected size.

[0035] The first marker's projected size is, for example, within the range of 2 micrometers to 6 micrometers, such as 2 micrometers, 2.5 micrometers, 3 micrometers, 3.5 micrometers, 4 micrometers, 4.5 micrometers, 5 micrometers, 5.5 micrometers, 6 micrometers, etc. Of course, the first marker's projected size is not limited to this range, and is not restricted here. The second marker's projected size is, for example, within the range of 2 micrometers to 6 micrometers, such as 2 micrometers, 2.5 micrometers, 3 micrometers, 3.5 micrometers, 4 micrometers, 4.5 micrometers, 5 micrometers, 5.5 micrometers, 6 micrometers, etc. Of course, the second marker's projected size is not limited to this range, and is not restricted here.

[0036] The first identifier thickness can be determined based on the electrode thickness corresponding to the electrode of the preset micro LED chip. The first identifier thickness can be the same as or different from the electrode thickness. For example, the absolute value of the deviation between the first identifier thickness and the electrode thickness is less than or equal to a preset deviation threshold. The preset deviation threshold can be pre-set or set or adjusted by the user, and is not limited here.

[0037] For example, in the process of fabricating a micro LED chip array, at least one of the following can be designed: the light-emitting material of the preset micro LED in the micro LED chip array, the arrangement parameters of multiple preset micro LED chips in the micro LED chip array, the chip structure of the preset micro LED chips, the chip size of the preset micro LED chips, the chip thickness of the preset micro LED chips, etc.

[0038] For example, the pre-defined micro-LEDs in a micro-LED chip array can have corresponding light-emitting materials. The light-emitting material is used to realize the light-emitting function of the pre-defined micro-LED chips in the micro-LED chip array. The light-emitting material allows the pre-defined micro-LED chips to convert electrical energy into light of a specific color.

[0039] Micro-LED chip arrays include, for example, gallium nitride (GaN)-based micro-LED chip arrays. The term "gallium nitride-based micro-LED chip array" can be used to indicate that the light-emitting material of the predetermined micro-LED chips included in the micro-LED chip array is gallium nitride-based. Gallium nitride-based includes at least one of gallium nitride and gallium nitride-related compounds. Gallium nitride-related compounds include at least one of indium gallium nitride, aluminum indium gallium phosphide, etc. Of course, the light-emitting material is not limited to gallium nitride-based materials and is not restricted herein.

[0040] For example, the arrangement parameters of multiple preset micro LED chips in a micro LED chip array may include the arrangement pattern formed by the multiple preset micro LED chips on the micro LED chip array and the number of the multiple preset micro LED chips.

[0041] The arrangement pattern formed by multiple preset micro LED chips is, for example, a row-column matrix. In this case, the preset micro LED chips are arranged in a rectangular pattern along both the row and column directions, and the distance between the center points of any two adjacent preset micro LED chips is less than or equal to a preset spacing threshold. The distance between the center points of any two preset micro LED chips can also be called the pitch. The preset spacing threshold can be in the range of 10 micrometers to 20 micrometers. For example, the preset spacing threshold includes one of 10 micrometers, 15 micrometers, 18 micrometers, 20 micrometers, etc. Of course, the preset spacing threshold is not limited to this; it can be preset, or it can be set or adjusted by the user, without restriction.

[0042] Accordingly, the number of multiple preset micro LED chips can correspond to the arrangement pattern formed by the multiple preset micro LED chips. For example, when the arrangement pattern formed by the multiple preset micro LED chips is a row-column matrix of M rows × N columns, where M and N are both positive integers, it is equivalent to the micro LED chip array including M rows of preset micro LED chips, and the number of preset micro LED chips in each row is N. Therefore, the number of preset micro LED chips in the micro LED chip array is M × N.

[0043] For example, the micro LED chip array includes preset micro LED chips that can have corresponding chip structures. The chip structure can be used to indicate the electrode arrangement positions and current flow direction of the preset micro LED chips. Chip structures include, for example, one of the following: upright chip, flip chip, vertical chip, etc. Flip chips include, for example, flip chips with a vertical electrode structure, etc., without limitation.

[0044] For example, the micro LED chip array includes preset micro LED chips that may have corresponding chip sizes and chip thicknesses. The chip size indicates the dimensions of the preset micro LED chip's projection onto a preset plane. The chip thickness indicates the dimensions of the preset micro LED chip's projection onto a plane perpendicular to the preset plane.

[0045] Taking a preset micro-LED chip located in a reference coordinate system as an example. The reference coordinate system can have an X-axis, a Y-axis, and a Z-axis, with the X-axis perpendicular to the Y-axis and the Z-axis perpendicular to the reference plane formed by the X and Y axes. The preset plane is parallel to the reference plane, and since the preset plane is parallel to the light-emitting surface of the preset micro-LED chip, the light-emitting surface of the preset micro-LED chip is also parallel to the reference plane. When the micro-LED chip array includes the preset micro-LED chip, the preset micro-LED chip can be projected onto the reference plane, and thus the chip size is equivalent to the projected size of the preset micro-LED chip on the reference plane. The projected size of the preset micro-LED chip on the reference plane includes a first chip projection size on the X-axis and a second chip projection size on the Y-axis. The first and second chip projection sizes can be used to determine the first chip projection area of ​​the preset micro-LED chip on the reference plane corresponding to the X and Y axes. For example, the first chip projection area can be determined by the product of the first and second chip projection sizes. When the preset plane is parallel to the reference plane, the first chip projection size and the second chip projection size are essentially obtained by projecting the preset micro LED chip onto the preset plane. Therefore, the chip size can include at least one of the first chip projection size, the second chip projection size, and the first chip projection area.

[0046] Accordingly, when the micro-LED chip array includes a preset micro-LED chip, the preset micro-LED chip can be projected onto a plane perpendicular to the reference plane, and thus the chip thickness is equivalent to the projected size of the preset micro-LED chip on the plane perpendicular to the reference plane. The projected size of the preset micro-LED chip on the plane perpendicular to the reference plane includes the third chip projection size of the preset micro-LED chip on the Z-axis. When the preset plane is parallel to the reference plane, the third chip projection size is equivalent to the size obtained by projecting the preset micro-LED chip onto a plane perpendicular to the preset plane, and thus the chip thickness can include the third chip projection size.

[0047] The first chip's projected size is, for example, within the range of 10 to 20 micrometers, such as 10, 12, 15, 16, 18, or 20 micrometers. Of course, the first chip's projected size is not limited to this range and is not restricted here. The second chip's projected size is, for example, within the range of 15 to 20 micrometers, such as 15, 18, or 20 micrometers. Of course, the second chip's projected size is not limited to this range and is not restricted here. The third chip's projected size is, for example, within the range of 5 to 10 micrometers, such as 5, 6, 8, or 10 micrometers. Of course, the third chip's projected size is not limited to this range and is not restricted here.

[0048] Based on this, in the process of fabricating a micro LED chip array, the pre-defined micro LED chips included in the micro LED chip array can be designed, as can the first identifier of the pre-defined micro LED chips, which is beneficial to improving the fabrication flexibility of the micro LED chip array.

[0049] S102. A co-packaged optical substrate is provided, wherein an optical engine is provided on the co-packaged optical substrate, and a second identifier is provided on the co-packaged optical substrate corresponding one-to-one with the optical channels included in the optical engine.

[0050] In the process of fabricating a display module, a co-packaged optical substrate can be obtained. The co-packaged optical substrate is equipped with a light engine. The light channel of the light engine can be used to indicate optically functional pathways located inside the co-packaged optical substrate. The light channel is essentially a passive optical structure. The target micro-LED chip is essentially an active excitation source. During the fabrication of the display module, the target micro-LED chips need to be matched one-to-one with the light channels of the light engine so that the light emitted by the target micro-LED chips is transmitted within the corresponding light channels. The arrangement of multiple target micro-LED chips and the co-packaged optical substrate in the display module enables the display function of the display module.

[0051] When a co-packaged optical substrate is obtained, a second identifier can be set on the co-packaged optical substrate that corresponds one-to-one with the optical channels included in the optical engine.

[0052] For example, during the formation of the second mark on the co-packaged optical substrate, a second mark can be prepared on the surface of the co-packaged optical substrate, corresponding one-to-one with the position of the optical channel included in the optical engine. The second mark can serve as a basis for subsequent alignment calibration of the target micro-LED chip and the co-packaged optical substrate, thereby improving the convenience and accuracy of subsequent alignment calibration. In response to the improved accuracy of subsequent alignment calibration of the target micro-LED chip and the co-packaged optical substrate, when the display module is subsequently fabricated, the target micro-LED chip included in the display module can be positioned one-to-one with the optical channel of the optical engine. This improves the mounting accuracy of the target micro-LED chip during subsequent bonding of the target micro-LED chip and the co-packaged optical substrate, thus improving the overall fabrication effect of the display module.

[0053] S103. Multiple target micro-light-emitting diode chips are adsorbed from multiple preset micro-light-emitting diode chips through a transfer array. The arrangement parameters of the multiple target micro-light-emitting diode chips in the micro-light-emitting diode chip array correspond to the arrangement parameters of the optical channel of the light engine.

[0054] With access to the micro-LED array and the co-packaged optical substrate, the optical channel arrangement parameters of the optical engine on the co-packaged optical substrate can be determined.

[0055] In the process of fabricating the display module, based on the consideration of setting a one-to-one correspondence between the target micro-LED chips and the optical channels of the light engine, multiple target micro-LED chips can be adsorbed from multiple preset micro-LED chips using a transfer array. The arrangement parameters of the multiple target micro-LED chips in the micro-LED chip array correspond to the arrangement parameters of the optical channels of the light engine. The adsorption method of the transfer array on the target micro-LED chips can include one of the following adsorption methods: electrostatic adsorption, van der Waals force adsorption, vacuum adsorption, etc., and is not limited here.

[0056] For example, the transfer array includes multiple preset transfer units corresponding one-to-one with multiple preset micro LED chips, the number of optical channels of the optical engine includes the optical channel arrangement pattern of the optical engine and the number of optical channels of the optical engine, and the arrangement parameters of the multiple target micro LED chips include the arrangement pattern formed by the multiple target micro LED chips and the number of the multiple target micro LED chips.

[0057] In some embodiments, multiple target transfer units are determined from multiple preset transfer units based on the optical channel arrangement pattern and the number of optical channels. The arrangement pattern formed by the multiple target transfer units in the transfer array corresponds to the optical channel arrangement pattern, and the number of multiple target transfer units corresponds to the number of optical channels. Multiple target micro-light-emitting diode chips are adsorbed from multiple preset micro-light-emitting diode chips through the multiple target transfer units, so that the arrangement pattern formed by the multiple target micro-light-emitting diode chips in the micro-light-emitting diode chip array corresponds to the optical channel arrangement pattern, and the number of multiple target micro-light-emitting diode chips corresponds to the number of optical channels.

[0058] For example, each preset transfer unit in the transfer array can be used as an individual control unit. Thus, when multiple target micro-LED chips are adsorbed from multiple preset micro-LED chips through the transfer array, a partitioned addressing control method can be used to select multiple target transfer units from multiple preset transfer units and control multiple target transfer units simultaneously, so that multiple target transfer units can adsorb the corresponding target micro-LED chips from multiple preset micro-LED chips.

[0059] Accordingly, in the process of selecting multiple target transfer units from multiple preset transfer units, the selection of multiple target transfer units can be made by combining the optical channel arrangement pattern and the number of optical channels of the optical engine provided on the co-package substrate.

[0060] Taking an 8-channel optical engine as an example, the optical channel arrangement pattern of the optical engine is presented as a 4x2 matrix, and the number of optical channels in the optical engine is 8. Based on the optical channel arrangement pattern and the number of optical channels, 8 target transfer units can be selected from multiple preset transfer units included in the transfer array; that is, the number of target transfer units corresponds to the number of optical channels. The arrangement pattern formed by the 8 target transfer units in the transfer array is presented as a 4x2 matrix, which corresponds to the optical channel arrangement pattern.

[0061] Taking a 32-channel optical engine as an example, the optical channel arrangement pattern of the optical engine is presented as an 8x4 matrix, and the number of optical channels in the optical engine is 32. Based on the optical channel arrangement pattern and the number of optical channels, 32 target transfer units can be selected from multiple preset transfer units included in the transfer array; that is, the number of target transfer units corresponds to the number of optical channels. The arrangement pattern formed by the 32 target transfer units in the transfer array is presented as an 8x4 matrix, corresponding to the optical channel arrangement pattern. And so on.

[0062] When multiple target transfer units are determined, multiple target micro-light-emitting diode chips can be selectively adsorbed from multiple preset micro-light-emitting diode chips through multiple target transfer units, so that the arrangement pattern of multiple target micro-light-emitting diode chips in the micro-light-emitting diode chip array corresponds to the arrangement pattern of light channels, and the number of multiple target micro-light-emitting diode chips corresponds to the number of light channels.

[0063] Taking eight target transfer units selected based on the optical channel arrangement pattern and number of optical channels of an 8-channel optical engine as an example, these eight target transfer units can be simultaneously controlled to adsorb corresponding target micro-LED chips from multiple preset micro-LED chips. At this time, the sum of the number of target micro-LED chips adsorbed by each of the eight target transfer units is eight, corresponding to the number of optical channels in the optical engine. Correspondingly, the arrangement pattern of the target micro-LED chips adsorbed by each of the eight target transfer units corresponds to the arrangement pattern presented by the eight target transfer units, that is, it corresponds to the optical channel arrangement pattern of the optical engine.

[0064] Taking 32 target transfer units selected based on the optical channel arrangement pattern and number of optical channels of a 32-channel optical engine as an example, these 32 target transfer units can be simultaneously controlled to adsorb corresponding target micro-LED chips from multiple preset micro-LED chips. At this time, the sum of the number of target micro-LED chips adsorbed by each of the 32 target transfer units is 32, corresponding to the number of optical channels in the optical engine. Correspondingly, the arrangement pattern of the target micro-LED chips adsorbed by each of the 32 target transfer units corresponds to the arrangement pattern presented by the 32 target transfer units, that is, it corresponds to the optical channel arrangement pattern of the optical engine. And so on.

[0065] Based on this, when multiple target micro-LED chips are adsorbed from multiple pre-set micro-LED chips using a transfer array, the arrangement parameters of the multiple target micro-LED chips in the micro-LED chip array can correspond to the optical channel arrangement parameters of the optical engine. This eliminates the need to customize transfer molds for different channel numbers of the optical engine during the display module fabrication process. This improves the selectivity and ease of adsorption of the target micro-LED chips, thereby enhancing the ease of subsequent transfer and ultimately improving the fabrication ease of the display module. Correspondingly, when the arrangement pattern of the multiple target micro-LED chips corresponds to the optical channel arrangement pattern of the optical engine, and the number of target micro-LED chips corresponds to the number of optical channels in the optical engine, the subsequent bonding of the target micro-LEDs and the co-package substrate improves the mounting accuracy of the multiple target micro-LED chips included in the display module. This allows the display module to meet the core requirements of CPO optical interconnect scenarios, thereby improving the fabrication effect of the display module.

[0066] In some embodiments, the first chip projection size of the preset micro light-emitting diode chip projected onto the preset plane is larger than the first transfer unit projection size of the preset transfer unit projected onto the preset plane, and the second chip projection size of the preset micro light-emitting diode chip projected onto the preset plane is larger than the second transfer unit projection size of the preset transfer unit projected onto the preset plane, and the preset plane is parallel to the light-emitting surface of the preset micro light-emitting diode chip.

[0067] For example, the preset transfer unit may have a transfer unit size. The transfer unit size may include at least one of the following: a first transfer unit projection size, a second transfer unit projection size, and a first transfer unit projection area on a preset plane. The method for determining the first transfer unit projection size of the preset transfer unit can refer to the method for determining the first chip projection size of the preset micro-LED chip, and the method for determining the second transfer unit projection size of the preset transfer unit can refer to the method for determining the second chip projection size of the preset micro-LED chip; these details will not be repeated here. Accordingly, when determining the first transfer unit projection size and the second transfer unit projection size, the first transfer unit projection area of ​​the preset transfer unit can also be determined based on the first transfer unit projection size and the second transfer unit projection size. The method for determining the first transfer unit projection area can refer to the method for determining the first chip projection area of ​​the preset micro-LED chip; these details will not be repeated here.

[0068] When the projected size of the first chip is larger than the projected size of the first transfer unit, and the projected size of the second chip is larger than the projected size of the second transfer unit, the projected area of ​​the first chip can be larger than the projected area of ​​the first transfer unit. This reduces the likelihood that the preset transfer unit will obscure the first mark on the preset micro-LED chip during the process of adsorbing the corresponding preset micro-LED chip through the preset transfer unit. Correspondingly, with the reduced likelihood of the preset transfer unit obscuring the first mark on the preset micro-LED chip, the likelihood of the target transfer unit obscuring the second mark on the target micro-LED chip is also reduced. Consequently, during the subsequent alignment and calibration of multiple target micro-LED chips and the co-packaged optical substrate, the interference caused by the target transfer unit to the alignment and calibration process can be reduced, thereby improving the convenience and accuracy of the subsequent alignment and calibration of multiple target micro-LED chips and the co-packaged optical substrate.

[0069] For example, the projected area of ​​the first transfer unit can account for 60%-80% of the projected area of ​​the first chip, but it is not limited to this, and no restriction is made here.

[0070] In some embodiments, a transfer substrate is provided, on which a third identifier is provided that corresponds one-to-one with a first identifier of a plurality of preset micro-light-emitting diode chips; based on the first identifier of each of the plurality of preset micro-light-emitting diode chips and the third identifier of the transfer substrate, the plurality of preset micro-light-emitting diode chips are transferred from the growth substrate where the micro-light-emitting diode chip array is located to the transfer substrate; through a transfer array, a plurality of target micro-light-emitting diode chips are adsorbed from the plurality of preset micro-light-emitting diode chips transferred to the transfer substrate, and the arrangement parameters of the plurality of target micro-light-emitting diode chips on the transfer substrate correspond to the arrangement parameters of the light channel.

[0071] In the process of adsorbing multiple target micro-light-emitting diode chips from multiple preset micro-light-emitting diode chips through a transfer array, in order to reduce the difficulty of adsorbing the target micro-light-emitting diode chips by the transfer array, multiple preset micro-light-emitting diode chips can be transferred from the growth substrate to the transfer substrate first, and then the target micro-light-emitting diode chips can be adsorbed by the adsorption transfer substrate.

[0072] For example, during the adsorption of the transfer substrate, the transfer array can perform partitioned addressing control on multiple preset transfer units to select multiple target transfer units, and then adsorb the corresponding target micro-LED chips through these target transfer units. Correspondingly, other preset transfer units besides the target transfer units do not need to adsorb preset micro-LED chips other than the target micro-LED chips, thus achieving selective pickup of the multiple preset micro-LED chips included in the micro-LED chip array.

[0073] The arrangement parameters of the multiple target transfer units in the transfer array correspond to the arrangement parameters of the optical channel, thereby making the arrangement parameters of the multiple target micro light-emitting diode chips on the transfer substrate correspond to the arrangement parameters of the optical channel.

[0074] In some embodiments, a pre-debonding process is performed on the transfer substrate and multiple preset micro LED chips to obtain multiple preset micro LED chips after processing; multiple target micro LED chips are adsorbed from the multiple preset micro LED chips after processing by a transfer array, and the arrangement parameters of the multiple target micro LED chips in the multiple preset micro LED chips correspond to the arrangement parameters of the optical channel of the optical engine.

[0075] For example, during the transfer of multiple pre-defined micro-LED chips from a growth substrate to a transfer substrate, to further reduce the difficulty of adsorption of the target micro-LED chips by the transfer array, a pre-de-adhesion treatment can be performed on the transfer substrate and the multiple pre-defined micro-LED chips. This reduces the adhesion force between each pre-defined micro-LED chip and the growth substrate, resulting in multiple pre-defined micro-LED chips after treatment. During the pre-de-adhesion treatment of the transfer substrate and the multiple pre-defined micro-LED chips, light with a wavelength within a preset wavelength range can be used to irradiate both the transfer substrate and the multiple pre-defined micro-LED chips, thereby reducing the adhesion force between each pre-defined micro-LED chip and the growth substrate. Light with a wavelength within the preset wavelength range can include ultraviolet (UV) light. The preset wavelength range can include the wavelength range of ultraviolet light. For example, the wavelength of ultraviolet light includes 365 nanometers. When the transfer substrate and the multiple pre-defined micro-LED chips are pre-de-adhesion treated with ultraviolet light, the adhesion force between each pre-defined micro-LED chip and the growth substrate can be reduced to, for example, 0.01 Newtons per centimeter (N / cm).

[0076] For example, the transfer substrate may have an adhesive layer, through which the transfer substrate can bond multiple preset micro-light-emitting diode chips included in the micro-light-emitting diode chip array.

[0077] Taking a UV-debonded temporary substrate as an example, the adhesive layer thickness on the surface of the UV-debonded temporary substrate is greater than or equal to 10 micrometers and less than or equal to 20 micrometers. The UV debonding wavelength corresponding to the UV-debonded temporary substrate includes, for example, 365 nanometers. After multiple preset micro-LED chips transferred to the UV-debonded temporary substrate are irradiated with light of wavelength 365 nanometers, the adhesion force between each preset micro-LED chip and the growth substrate can be reduced to less than or equal to 0.01 N / cm. Of course, the transfer substrate is not limited to this, and no limitation is made here.

[0078] The transfer substrate can be fabricated with a third identifier that corresponds one-to-one with the first identifier of each of the multiple preset micro LED chips. The absolute value of the dimensional tolerance of the third identifier is less than or equal to a preset dimensional tolerance threshold. The preset dimensional tolerance threshold includes, for example, 0.1 micrometers. Of course, it is not limited to this, and no limitation is made here.

[0079] In response to the reduced adhesion between each of the multiple pre-defined micro-LED chips and the growth substrate, the transfer array can achieve adsorption of multiple target micro-LED chips using a smaller adsorption force. Accordingly, based on considerations of adsorption stability, the transfer array can achieve stable adsorption of multiple target micro-LED chips using adsorption forces with a smaller increase in adsorption force.

[0080] Based on this, when multiple target micro-LED chips are adsorbed from multiple pre-processed micro-LED chips using a transfer array, it is beneficial to improve the ease and stability of adsorption of the target micro-LED chips by the transfer array.

[0081] During the process of adsorbing multiple target micro-LED chips from multiple preset micro-LED chips using a transfer array, the failure status of each target micro-LED chip can be detected. This allows for subsequent display module fabrication processes, such as alignment and bonding of the target micro-LEDs and the co-packaged optical substrate, to obtain the display module, provided that all target micro-LED chips are functioning correctly. The improved selectivity and ease of adsorption of target micro-LED chips via the transfer array allows for timely replacement of the target micro-LED chips in case of failure, thus improving the transfer yield and meeting the high reliability requirements of CPO (Consumer-on-Producer) scenarios.

[0082] S104. Based on the first identifier of each of the multiple target micro LED chips and the second identifier of the co-packaged optical substrate, the multiple target micro LED chips and the co-packaged optical substrate are aligned and calibrated to obtain the multiple target micro LED chips and the co-packaged optical substrate that have completed the alignment and calibration.

[0083] When multiple target micro-LED chips are adsorbed using a transfer array, alignment calibration can be performed on the target micro-LED chips and the co-packaged optical substrate based on the first identifier of each target micro-LED chip and the second identifier of the co-packaged optical substrate. This results in multiple target micro-LED chips and the co-packaged optical substrate that have completed alignment calibration. When these aligned target micro-LED chips and the co-packaged optical substrate are subsequently bonded to obtain a display module, the optical channels of the optical engines of the target micro-LED chips and the co-packaged optical substrate in the display module can be set up in a one-to-one correspondence. This improves the mounting accuracy of the multiple target micro-LED chips and thus enhances the fabrication effect of the display module.

[0084] For example, during the alignment and calibration of multiple target micro-LED chips and co-packaged optical substrates, a dual-vision recognition system can be used to simultaneously identify a first identifier of the target micro-LED chips and a second identifier of the co-packaged optical substrate. The dual-vision recognition system can include a first camera and a second camera, the arrangement of which can correspond to the arrangement of the target micro-LED chips and the co-packaged optical substrate.

[0085] Taking the arrangement of multiple target micro-LED chips along the Z-axis with a co-packaged optical substrate under the adsorption and movement of a transfer array as an example, the first camera can also be arranged along the Z-axis with a second camera, so that the dual-vision recognition system can identify a first identifier through the first camera and simultaneously identify a second identifier through the second camera. For example, when multiple target micro-LED chips are arranged along the Z-axis with the co-packaged optical substrate, the multiple target micro-LED chips can be located above the co-packaged optical substrate, and thus, when the first camera and second camera are arranged along the Z-axis, the first camera can be located above the second camera. Of course, this is not a limitation and is not set here.

[0086] The first identifier of the target micro-LED chip and the second identifier of the co-packaged optical substrate, identified synchronously, can be used for three-axis pre-alignment calibration of the target micro-LED chip and the co-packaged optical substrate (X-axis, Y-axis, and θ-axis). This allows for alignment calibration of multiple target micro-LED chips and co-packaged optical substrates, resulting in a fully aligned target micro-LED chip and co-packaged optical substrate. The θ-axis can be used to indicate the rotation axis around the Z-axis.

[0087] In some embodiments, a first image is obtained by acquiring the first identifier of each of the multiple target micro-LED chips using a first camera, and a second image is obtained by acquiring the second identifier of the co-packaged optical substrate using a second camera. First position information of the multiple first identifiers on the first image is determined, and second position information of the second identifiers on the second image is determined. Based on the first and second position information, the pose offset of the multiple target micro-LED chips and the co-packaged optical substrate is obtained by least-squares fitting. Motion compensation is performed on at least one of the multiple target micro-LED chips and the co-packaged optical substrate according to the pose offset until the pose offset of the multiple target micro-LED chips and the co-packaged optical substrate is less than or equal to a preset offset threshold, thus obtaining the multiple target micro-LED chips and the co-packaged optical substrate that have completed alignment calibration.

[0088] For example, when a first image is obtained by capturing the first identifier of each of multiple target micro-LED chips using a first camera, the first image may include multiple first identifiers. Similarly, when a second identifier of a co-packaged optical substrate is captured using a second camera, since the second identifier corresponds one-to-one with the optical channels included in the optical engine, and the number of optical channels is multiple, the second image may include multiple second identifiers.

[0089] When the first image includes multiple first identifiers, first position information of the multiple first identifiers on the first image can be determined. This first position information can also be called a first position set, but is not limited to this terminology. Similarly, when the second image includes multiple second identifiers, second position information of the multiple second identifiers on the second image can be determined. This second position information can also be called a second position set, but is not limited to this terminology. It is understood that the first and second cameras have been pre-calibrated.

[0090] Given the first and second position information, the first and second position information can be unified to the same coordinate system, and a rigid body transformation residual equation from the first to the second position information can be established. The least squares solution of this rigid body transformation residual equation is then obtained using the least squares method to obtain the rotation matrix and translation vector corresponding to the first identifier in the first image and the second identifier in the second image. Based on the rotation matrix and translation vector, the X-axis offset, Y-axis offset, and θ-axis rotation angle between the first identifier in the first image and the second identifier in the second image can be determined. The X-axis offset, Y-axis offset, and θ-axis rotation angle can be used as pose offsets for multiple target micro-LED chips and co-packaged optical substrates, allowing for motion compensation of at least one of the multiple target micro-LED chips and co-packaged optical substrates until the pose offsets of the multiple target micro-LED chips and co-packaged optical substrates are less than or equal to a preset offset threshold, resulting in multiple target micro-LED chips and co-packaged optical substrates that have completed alignment calibration.

[0091] For example, when the pose offset includes an X-axis offset, motion compensation can be performed on at least one of the multiple target micro-LED chips and the co-packaged optical substrate along the X-axis until the X-axis offset of the multiple target micro-LED chips and the co-packaged optical substrate is less than or equal to a first offset threshold. When the pose offset includes a Y-axis offset, motion compensation can be performed on at least one of the multiple target micro-LED chips and the co-packaged optical substrate along the Y-axis until the Y-axis offset of the multiple target micro-LED chips and the co-packaged optical substrate is less than or equal to a second offset threshold. Similarly, when the pose offset includes a θ-axis rotation angle, motion compensation can be performed on the rotation angle of at least one of the multiple target micro-LED chips and the co-packaged optical substrate about the θ-axis until the θ-axis rotation angle of the multiple target micro-LED chips and the co-packaged optical substrate is less than or equal to a third offset threshold.

[0092] When the pose offset of multiple target micro LED chips and co-packaged optical substrates is less than or equal to a preset offset threshold, it can be determined that the alignment calibration of multiple target micro LED chips and co-packaged optical substrates has been completed, and multiple target micro LED chips and co-packaged optical substrates that have completed alignment calibration can be obtained.

[0093] S105. Bond the multiple target micro-LED chips that have completed alignment and calibration to the co-packaged optical substrate to obtain a display module. The multiple target micro-LED chips in the display module are set to correspond to the optical channels of the optical engine.

[0094] Having obtained multiple target micro-LED chips and a co-packaged optical substrate that have completed alignment calibration, the multiple target micro-LED chips and the co-packaged optical substrate can be bonded to obtain a display module.

[0095] Based on the correspondence between the arrangement parameters of multiple target micro-LED chips and the optical channel arrangement parameters of the optical engine, the arrangement parameters of the multiple target micro-LED chips on the co-packaged optical substrate in the display module can be made to correspond with the optical channel arrangement parameters of the optical engine. Accordingly, based on the alignment calibration of the multiple target micro-LED chips and the co-packaged optical substrate using a first identifier and a second identifier, and the second identifier being set in a one-to-one correspondence with the optical channel of the optical engine, the multiple target micro-LED chips in the display module and the optical channel of the optical engine can be set in a one-to-one correspondence.

[0096] When the arrangement parameters of multiple target micro-LED chips on the co-packaged optical substrate in the display module correspond to the arrangement parameters of the optical channel of the optical engine, and the multiple target micro-LED chips in the display module and the optical channels of the optical engine are set in a one-to-one correspondence, the multiple target micro-LED chips in the display module and the optical channels of the optical engine can be set in a corresponding manner. This is beneficial to improving the mounting accuracy of the multiple target micro-LED chips included in the display module, so that the display module can adapt to the core requirements of the CPO optical interconnect scenario, and thus improve the manufacturing effect of the display module.

[0097] In some implementations, multiple target micro-LED chips are mounted onto corresponding pads on a co-packaged optical substrate; the multiple target micro-LED chips and pads are then cured using a pulsed laser to obtain a display module.

[0098] For example, multiple target micro-LED chips can be mounted along the Z-axis onto corresponding pads on a co-packaged optical substrate. A pulsed laser is then used to cure the multiple target micro-LED chips and the pads, thereby obtaining a display module. The pulsed laser can include a nanosecond pulsed laser. The curing method can include in-situ eutectic curing. Of course, it is not limited to these methods, and no restrictions are imposed here.

[0099] Of course, the fabrication method of the display module is not limited to this. For example, after bonding multiple target micro light-emitting diode chips that have completed alignment and calibration with a co-packaged optical substrate to obtain a display module, the display module can also be passively coupled to a single-mode fiber array and encapsulated with epoxy resin, etc., to obtain the final display module. No restrictions are imposed here.

[0100] For example, such as Figure 2 As shown, the method for preparing the display module may include steps S1 to S4.

[0101] S1, Chip preprocessing.

[0102] The chip preprocessing process includes providing a miniature light-emitting diode chip array and a co-packaged optical substrate.

[0103] Accordingly, in addition to providing a micro LED chip array and a co-packaged optical substrate, a transfer substrate can also be used to facilitate the subsequent transfer of the micro LED chip array.

[0104] The relevant description of chip preprocessing can be found above and will not be repeated here.

[0105] S2, Selective Picking.

[0106] The selective pickup process involves adsorbing multiple target micro-LED chips via a transfer array. The arrangement parameters of the multiple target micro-LED chips in the micro-LED chip array correspond to the optical channel arrangement parameters of the optical engine provided on the co-packaged optical substrate.

[0107] The transfer array includes multiple preset transfer units, which correspond one-to-one with the multiple preset micro-light-emitting diode chips included in the micro-light-emitting diode chip array.

[0108] Each preset transfer unit employs independent addressing control, enabling selective pickup of target miniature LED chips with any number of channels and any arrangement pattern. For example, the transfer array can be adapted to the full range of 800G / 1.6T / 3.2T CPO optical engines with 8 / 16 / 32 channels. Of course, it is not limited to this, and no restrictions are set here.

[0109] When performing partitioned independent addressing control on multiple preset transfer units included in the transfer array, the pick-up control voltage of the target transfer unit can be set to be greater than or equal to 50V and less than or equal to 200V, so that the room-temperature static pick-up holding force of the target transfer unit on the corresponding target micro-LED chip is greater than or equal to 10 gf. However, this is not limited to this. Before adsorbing multiple target micro-LED chips from the multiple preset micro-LED chips transferred to the intermediate substrate via the transfer array, a pre-de-adhesion treatment can be performed on the intermediate substrate and the multiple preset micro-LED chips. The pre-de-adhesion time is greater than or equal to 5 seconds and less than or equal to 30 seconds, so as to reduce the adhesion force between each preset micro-LED chip and the growth substrate. For example, the adhesion force between each preset micro-LED chip and the growth substrate decreases to greater than or equal to 0.1N / cm and less than or equal to 0.5N / cm. This reduction in adhesion force between each preset micro-LED chip and the intermediate substrate helps to improve the single-batch pick-up yield of the multiple target micro-LED chips by the transfer array.

[0110] The relevant description of selective picking can be found above, and will not be repeated here.

[0111] S3, Pre-alignment calibration.

[0112] The pre-alignment calibration process includes aligning and calibrating multiple target micro LED chips and the co-packaged optical substrate based on the first identifier of each of the multiple target micro LED chips and the second identifier of the co-packaged optical substrate, to obtain multiple target micro LED chips and the co-packaged optical substrate that have completed alignment calibration.

[0113] In some implementations, a dual-vision recognition system can be used to simultaneously identify a first identifier of the target micro-LED chip and a second identifier of the co-packaged optical substrate, thereby aligning and calibrating multiple target micro-LED chips and co-packaged optical substrates. The dual-vision recognition system includes a first camera and a second camera. For example, the optical resolution of the dual-vision recognition system is less than or equal to 0.1 micrometers, and the absolute value of the repeatability accuracy of the dual-vision recognition system is less than or equal to 0.2 micrometers. However, this is not a limitation and is not set forth herein.

[0114] For example, during the pre-alignment calibration process, at least three sets of first identifiers of the diagonally distributed target micro-LED chips and second identifiers of the co-packaged optical substrate can be simultaneously acquired using a dual-vision recognition system. Least squares fitting is then used to complete the three-axis calibration (X-axis, Y-axis, and θ-axis) to reduce alignment deviations caused by factors such as warping of the co-packaged optical substrate and deformation of the target transfer unit. This results in multiple target micro-LED chips and the co-packaged optical substrate that have completed alignment calibration. For instance, after alignment calibration, the absolute value of the positional deviation between the pads of the multiple target micro-LED chips and the co-packaged optical substrate is less than or equal to 0.5 micrometers. However, this is not a limitation and is not set here.

[0115] The relevant description of pre-alignment calibration can be found above, and will not be repeated here.

[0116] S4. Mounting and in-situ curing.

[0117] The mounting and in-situ curing process includes bonding multiple target micro LED chips that have completed alignment and calibration to a co-packaged optical substrate to obtain a display module. In the display module, multiple target micro LED chips are set to correspond to the optical channels of the light engine.

[0118] For example, the co-package optical substrate includes a 2.5D silicon interposer substrate. The co-package optical substrate may have a redistribution layer, such as a thick copper RDL (Radio Deposition Layer). However, it is not limited to this, and no limitation is made here. The pads of the co-package optical substrate may include AuSn eutectic pads. The pad dimensions match the electrode dimensions of the target micro-LED chip. The absolute value of the dimensional tolerance of the pads in the co-package optical substrate is less than or equal to 0.5 micrometers. However, the co-package optical substrate is not limited to this, and no limitation is made here.

[0119] During the process of mounting multiple target micro LED chips onto the corresponding pads of the co-packaged optical substrate, the mounting pressure for each target micro LED chip is controlled to be greater than or equal to 5 gf and less than or equal to 20 gf. The substrate preheating temperature during the mounting process is controlled to be greater than or equal to 80°C and less than or equal to 120°C.

[0120] Taking the curing of multiple target micro-LED chips and pads using nanosecond pulsed lasers as an example, the wavelength of the nanosecond pulsed laser includes, for example, 808 nanometers, with a single pulse energy greater than or equal to 5 millijoules (mJ) and less than or equal to 20 mJ. The spot size matches the pad size, and each pad is irradiated by the laser more than or equal to 1 time and less than or equal to 3 times. The total curing time is less than or equal to 5 seconds. After curing, the shear strength of the interface between the target micro-LED chips and the pads is greater than or equal to 30 megapascals (MPa). Furthermore, the overall substrate temperature does not exceed 150°C during the curing process. Of course, this is not a limitation and is not set here.

[0121] Of course, this is not the only option. After mounting and in-situ curing are completed, the resulting display module can be tested to assess the effectiveness of the manufacturing process. No limitations are imposed here.

[0122] The present application will be further described in detail below with reference to specific embodiments and comparative examples. Those skilled in the art can easily understand other advantages and effects of the present application based on the content disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application.

[0123] It should be noted that the process methods in this embodiment that do not specify specific conditions are all performed in accordance with conventional technical conditions in the field, and the raw materials and equipment used are all commercially available conventional products.

[0124] Example 1 This embodiment provides a mass transfer and mounting process for MicroLED chips on a CPO substrate, used for mounting MicroLED chip arrays in an 8-channel 1.6T CPO light engine. The specific steps are as follows: S1. Chip Pre-processing: A GaN-based micro-LED chip array with a pitch of 15 micrometers is fabricated on a 4-inch sapphire growth substrate. The micro-LED chip array includes pre-defined micro-LED chips (hereinafter referred to as chips) with a vertical electrode flip-chip structure. The chip dimensions, including the first chip's projected area, are 12 micrometers × 18 micrometers, and the chip thickness is 8 micrometers. A first mark is fabricated on the positive and negative electrode surfaces of each chip. The first mark is cross-shaped and made of AuSn eutectic material. The mark dimensions, including the mark's projected area, are 3 micrometers × 3 micrometers. The absolute value of the coaxiality deviation between the center of the first mark and the light-emitting center of the chip is less than or equal to 0.2 micrometers. The thickness of the first mark is consistent with the electrode thickness of the chip. Simultaneously, a UV-release temporary carrier board is prepared. The adhesive layer thickness of the carrier board is 15 micrometers. A third mark, corresponding one-to-one with the first mark of the chip, is fabricated on the carrier board's mounting surface. The absolute value of the dimensional tolerance of the third mark is less than or equal to 0.1 micrometers.

[0125] Based on the consideration of fabricating an 8-channel 1.6T CPO optical engine, the optical engine provided on the co-packaged optical substrate includes 8 optical channels.

[0126] S2. Selective Pickup: A transfer array comprising multiple preset transfer units is employed. Each preset transfer unit has a specific size. The first transfer unit, including its size, has a projected area of ​​8 micrometers × 12 micrometers, representing 70% of the chip size. The preset transfer units utilize partitioned independent addressing control. Based on the optical channel layout parameters of the 8-channel CPO optical engine, a 120V pickup control voltage is applied to the 8 target transfer units corresponding to the layout parameters. Before pickup, 365nm ultraviolet light is used to pre-de-adhere the temporary carrier for 15 seconds, reducing the adhesion between the chip and the growth substrate to 0.3N / cm. After pickup, the holding force of a single chip is 15gf, and the pickup yield of 8 chips per batch is relatively high.

[0127] S3. Pre-alignment calibration: A dual-vision recognition system is employed. The optical resolution of the dual-vision recognition system is 0.08 micrometers, and the absolute value of its repeatability is less than or equal to 0.2 micrometers. The vision recognition system includes a first camera and a second camera. The first and second cameras can be arranged along the Z-axis, such as the first camera being above the second camera. The first camera identifies the first identifier of the eight chips adsorbed by the eight target transfer units in the transfer array. The second camera identifies the second identifier on the co-packaged optical substrate, which corresponds one-to-one with the optical channels of the optical engine. The second identifier can be located in the pad area of ​​the co-packaged optical substrate. Four sets of diagonally distributed identifier pairs composed of the first and second identifiers are simultaneously acquired. Least squares fitting is used to complete the three-axis calibration (X-axis, Y-axis, θ-axis) to obtain the aligned chip and co-packaged optical substrate. After alignment calibration, the absolute value of the positional deviation between the chip and the optical channel of the optical engine, such as the positional deviation between the chip and the corresponding pad, is less than or equal to 0.4 micrometers.

[0128] S4. Mounting and In-situ Curing: After alignment and calibration, the chip can be vertically mounted onto the corresponding pads of the co-packaged optical substrate. The pad size matches the chip electrode. The mounting pressure of a single chip is controlled at 12gf. During the mounting process, the CPO substrate is preheated to 100℃. After mounting, an 808nm nanosecond pulsed laser is used to cure the pads in situ. The single pulse energy is 12mJ, the spot size matches the pad, each pad is irradiated twice, and the total curing time is 3s. After curing, the shear strength of the pad interface is 38MPa. The mounting of the 8-channel micro LED chip array is completed to obtain an 8-channel CPO optical engine.

[0129] The test results of this embodiment show that the number of components mounted per hour (UPH) is 18,000, and the absolute value of the final mounting accuracy is 0.8 micrometers, improving the overall transfer yield. After conducting high and low temperature cycling tests on the prepared 8-channel CPO optical engine (the temperature range of the high and low temperature cycling test was -40℃ to 125℃, and the number of cycles was 1000), the decrease in pad interface shear strength was small, the absolute value of chip mounting accuracy offset was less than or equal to 0.2 micrometers, and the decrease in channel coupling efficiency was small, achieving the effect of reducing channel failure. After conducting high temperature and high humidity tests on the prepared 8-channel CPO optical engine (85℃ / 85% relative humidity RH, the test duration was 500 hours), the insulation resistance was greater than or equal to 10¹²Ω, achieving the effect of reducing electromigration failure, thus facilitating the meeting of the mass production requirements of the 1.6TCPO optical engine.

[0130] Example 2 This embodiment provides a mass transfer and mounting process for MicroLED chips on a CPO substrate, used for mounting a MicroLED chip array in a 32-channel 3.2T CPO light engine. The specific steps are as follows: S1. Chip Pre-processing: A GaN-based micro-LED chip array with a pitch of 18 micrometers is fabricated on a 6-inch sapphire growth substrate. The chips have a vertical electrode flip-chip structure, and the chip dimensions, including the first chip projection area, are 15 micrometers × 15 micrometers, with a chip thickness of 6 micrometers. A first mark is fabricated on the positive and negative electrode surfaces of each chip. The first mark is L-shaped, and the marking material is AuSn eutectic alignment marker. The mark dimensions, including the mark projection area, are 4 micrometers × 4 micrometers. The absolute value of the coaxiality deviation between the center of the first mark and the light-emitting center of the chip is less than or equal to 0.2 micrometers. Simultaneously, a UV-release temporary carrier is prepared with an adhesive layer thickness of 12 micrometers. A third mark is fabricated on the surface of the carrier, and the absolute value of the dimensional tolerance of the third mark is less than or equal to 0.1 micrometers.

[0131] Based on the consideration of fabricating a 32-channel 3.2T CPO optical engine, the optical engine provided on the co-packaged optical substrate includes 32 optical channels.

[0132] S2. Selective Pickup: A transfer array comprising multiple preset transfer units is employed. The first preset transfer unit has a projected area of ​​10 μm × 10 μm, representing 67% of the chip size. Preset transfer units are independently addressed in partitions. Based on the optical channel layout parameters of the 32-channel CPO optical engine, a 150V pickup voltage is applied to the 32 corresponding target transfer units with the same layout parameters. UV pre-debonding is performed for 20 seconds before pickup, reducing the adhesion force between the chip and the growth substrate to 0.2 N / cm. After pickup, the holding force of a single chip is 18 gf, and the pickup yield of 32 chips in a single batch is relatively high.

[0133] S3. Pre-alignment calibration: A dual-vision recognition system with an optical resolution of 0.05μm is employed to simultaneously acquire six sets of identifier pairs composed of the first and second identifiers, distributed diagonally. The X-axis, Y-axis, and θ-axis three-axis calibration is completed using the least squares method, resulting in a properly aligned chip and co-packaged optical substrate. After alignment calibration, the absolute value of the positional deviation between the chip and the corresponding pads of the optical engine's optical channel is less than or equal to 0.3 micrometers.

[0134] S4. Mounting and In-situ Curing: After alignment and calibration, the mounting pressure is controlled at 10 gf / chip, and the CPO substrate is preheated to 110°C. 808 nm nanosecond pulsed laser is used for curing, with a single pulse energy of 10 mJ. Each pad is irradiated once, and the total curing time is 2 seconds. After curing, the pad shear strength is 35 MPa. The mounting of the 32-channel micro LED chip array is completed to obtain the 32-channel CPO light engine.

[0135] The test results of this embodiment show that with a UPH of 16,000 chips, the absolute value of the final mounting accuracy is 0.7 micrometers, improving the overall transfer yield. After high and low temperature cycling tests (the temperature range of the high and low temperature cycling test is -40℃ to 125℃, and the number of cycles is 1000), the decrease in pad interface shear strength is small, and the absolute value of chip mounting accuracy offset is less than or equal to 0.2 micrometers, reducing the decrease in channel coupling efficiency and achieving the effect of reducing channel failure. After high temperature and high humidity tests (85℃ / 85% RH, 500 hours), the insulation resistance is greater than or equal to 10¹²Ω, achieving the effect of reducing electromigration failure, which is conducive to meeting the mass production requirements of the 3.2T CPO optical engine.

[0136] Example 3 This embodiment provides a method for fabricating a CPO optical engine. After the mass transfer mounting process described in Embodiment 1 is used to complete the mounting of an 8-channel MicroLED chip array, the passive coupling of a single-mode fiber array and epoxy encapsulation are completed to obtain a 1.6T CPO optical engine.

[0137] The test results of this embodiment show that the single-channel transmission rate is 200Gbps, the total bandwidth is 1.6Tbps, the unit transmission power consumption is 1.5pJ / bit, which improves the coupling efficiency and the working life is greater than or equal to 10,000 hours, thus helping to meet the high-speed interconnection requirements of AI servers.

[0138] Example 4 (Verification of the lower limit of the numerical range) This embodiment verifies the feasibility of the lower limit of the core parameters of this application. The specific steps are as follows: S1. Chip Pre-processing: A GaN-based micro-LED chip array with a pitch of 20 micrometers is fabricated on a 4-inch sapphire growth substrate. The chip dimensions include a first chip projection area of ​​20 micrometers × 20 micrometers and a chip thickness of 10 micrometers. A first identifier is fabricated on the chip, which is cross-shaped and made of AuSn eutectic material. The identifier dimensions include at least one of the first and second identifier projection dimensions, which is 5 micrometers. The absolute value of the coaxiality deviation corresponding to the first identifier is less than or equal to 0.2 micrometers. A transfer substrate is also provided, with an adhesive layer thickness of 20 micrometers. The absolute value of the dimensional tolerance of the third identifier on the transfer substrate is less than or equal to 0.1 micrometers.

[0139] S2. Selective Pickup: The transfer unit size of the preset transfer unit included in the transfer array is 80% of the chip size, such as the first transfer unit projection size. A 50V pickup control voltage is applied, and UV pre-debonding is performed for 30s before pickup, reducing the adhesion force between the chip and the growth substrate to 0.5N / cm. After pickup, the holding force of a single chip is 10gf, and the single batch pickup yield is relatively high.

[0140] S3. Pre-alignment calibration: The dual vision system has an optical resolution of 0.1 micrometers and an absolute value of repeatability accuracy of less than or equal to 0.2 micrometers. It simultaneously acquires three sets of identifier pairs corresponding to the first and second identifiers to complete the triaxial calibration. The absolute value of the pre-alignment deviation is less than or equal to 0.5 micrometers.

[0141] S4. Mounting and In-situ Curing: After alignment and calibration, the mounting pressure is controlled at 5gf / particle, and the CPO substrate is preheated to 80℃. An 808nm nanosecond pulsed laser is used with a single pulse energy of 5mJ. Each pad is irradiated 3 times, and the total curing time is 5s. The shear strength of the cured pad is 30MPa.

[0142] The test results of this embodiment show that the UPH is 15,000 pieces, and the absolute value of the final mounting accuracy is 1.0 micrometer, which improves the overall transfer yield and helps to meet the core technical indicators of this application.

[0143] Example 5 (Verification of the upper limit of the numerical range) This embodiment verifies the feasibility of the upper limit of the core parameters of this application. The specific steps are as follows: S1. Chip Pre-processing: A GaN-based micro-LED chip array with a pitch of 10 micrometers is fabricated on a 6-inch sapphire growth substrate. The chip dimensions include a first chip with a projected area of ​​10 micrometers × 15 micrometers and a chip thickness of 5 micrometers. A first identifier is fabricated on the chip, which is L-shaped and made of AuSn eutectic material. The identifier size is 3 micrometers, and the absolute value of the coaxiality deviation corresponding to the first identifier is less than or equal to 0.2 micrometers. A transfer substrate is also provided, with an adhesive layer thickness of 10 micrometers. The absolute value of the dimensional tolerance of the third identifier on the transfer substrate is less than or equal to 0.1 micrometers.

[0144] S2. Selective Pickup: The transfer unit size of the preset transfer unit included in the transfer array is 60% of the chip size, such as the first transfer unit projection size. A 200V pickup control voltage is applied, and UV pre-debonding is performed for 5 seconds before pickup. The adhesion force between the chip and the growth substrate is reduced to 0.1N / cm. After pickup, the holding force of a single chip is 22gf, and the single batch pickup yield is relatively high.

[0145] S3. Pre-alignment calibration: The dual vision system has an optical resolution of 0.05 micrometers and an absolute value of repeatability accuracy of less than or equal to 0.2 micrometers. It simultaneously acquires 6 sets of identifier pairs corresponding to the first and second identifiers to complete the triaxial calibration. The absolute value of the pre-alignment deviation is less than or equal to 0.3 micrometers.

[0146] S4. Mounting and In-situ Curing: After alignment and calibration, the mounting pressure is controlled at 20gf / particle, and the CPO substrate is preheated to 120℃. An 808nm nanosecond pulsed laser is used with a single pulse energy of 20mJ. Each pad is irradiated once, and the total curing time is 2s. The shear strength of the cured pad is 42MPa.

[0147] The test results of this embodiment show that the UPH is 17,000 units, and the absolute value of the final mounting accuracy is 0.6 micrometers, which improves the overall transfer yield and helps to meet the core technical indicators of this application.

[0148] Comparative Example 1 (Existing display full-surface mass transfer process) This comparative example uses the existing laser lift-off mass transfer process for display panels to mount the same 8-channel MicroLED chip array as in Example 1. The specific process is: full-surface laser lift-off transfer, visual alignment, and thermosetting curing. The remaining chip parameters and substrate parameters are the same as in Example 1.

[0149] The comparative test results show that the absolute value of the mounting accuracy is 6 micrometers, the overall transfer yield is low, the UPH is 5000 units, which cannot meet the accuracy and yield requirements of the CPO optical engine. The subsequent fiber coupling efficiency is only 42%, and the channel failure rate is high.

[0150] Comparative Example 2 (Existing high-precision single-chip die bonding process) This comparative example uses existing high-precision die bonder mounting technology to mount the same 8-channel MicroLED chip array as in Example 1, with the remaining chip parameters and substrate parameters being the same as in Example 1.

[0151] The comparative test results show that the absolute value of the mounting accuracy is 2 micrometers, the overall transfer yield is low, the UPH is only 1200 pieces, the mass production efficiency is extremely low, and it cannot meet the needs of large-scale production.

[0152] Comparative Example 3 (removal of core features from laser in-situ curing) This comparative example excludes the core feature of "mounting and in-situ curing" of the present invention, while the remaining process steps and all parameters are completely consistent with Example 1. Instead, it uses the existing technology of hot pressing eutectic curing (curing temperature is 280°C and duration is 30s).

[0153] The comparative test results show that the absolute value of the mounting accuracy is 3 micrometers, the overall transfer yield is 99.1%, the substrate warpage is greater than or equal to 5 micrometers, the thermal damage rate of the peripheral computing chip is 62.5%, and the fiber coupling efficiency is only 58%, which cannot meet the low temperature compatibility requirements of CPO packaging.

[0154] Comparative Example 4 (Selective core feature picking without partition addressing) This comparative example excludes the core feature of "selective picking" of the present invention, but the remaining process steps and all parameters are completely consistent with Example 2, and adopts the existing whole-surface transfer process.

[0155] The results of this comparative test show that it is impossible to achieve accurate picking of a specific 32-channel array, the channel misalignment rate is high, the single-batch picking yield is low, and it cannot meet the customized requirements of CPO channelized arrays.

[0156] Conclusions of the comparison between the examples and comparative examples: This application achieves three core indicators simultaneously—"improved mounting accuracy, improved transfer yield, and increased UPH"—through the collaborative design of core technical features. It effectively solves the technical deadlock of "the inability to simultaneously achieve mounting accuracy, transfer yield, and mass production efficiency" that related technologies cannot overcome. It far surpasses related processes in terms of mounting accuracy, transfer yield, mass production efficiency, and CPO scenario adaptability. This is conducive to breaking through the mass production mounting bottleneck of CPO light engines under the MicroLED CPO solution and has extremely high industrial application value.

[0157] Compared with related technologies, this application overcomes the technical bottleneck of "the inability to simultaneously achieve mounting accuracy, transfer yield, and mass production efficiency" through the collaborative design of core technical features, and has the following significant beneficial effects: ① Improved the mounting accuracy of target micro LED chips during the manufacturing process of display modules (such as CPO optical engines), enabling display modules to be adapted to CPO single-mode fiber coupling requirements.

[0158] Corresponding technical features: a collaborative design of a first identifier on the preset micro LED chip (the center of the first identifier is coaxial with the light emission center of the preset micro LED chip), alignment calibration, and in-situ laser curing without displacement.

[0159] Results achieved: Compared with related processes, the final mounting accuracy is improved, which helps to solve the problems of low coupling efficiency and channel failure caused by insufficient accuracy of related processes, thereby improving the coupling efficiency of single-mode fiber.

[0160] ② It improves the transfer yield of the target micro LED chip during the manufacturing process of the display module, making the display module adaptable to the high reliability and low failure requirements of CPO.

[0161] Corresponding technical features: UV pre-debonding stress release, low-stress adsorption and non-destructive pickup, and full-process yield control of laser local eutectic curing without warping.

[0162] Results achieved: Compared with related processes, it improves the single-batch pickup yield and the overall transfer yield, which helps to solve the problem of light engine failure caused by insufficient yield of related processes, and thus enables the display module to meet the high reliability and low failure requirements of CPO scenarios.

[0163] ③ Flexible selective picking, adaptable to the development of a full range of CPO products.

[0164] Corresponding technical features: Transfer array with partitioned independent addressing control.

[0165] Results achieved: It can selectively pick up preset micro LED chips with different channel numbers and different arrangements without the need for customized transfer molds. It is compatible with CPO optical engines with different optical channel arrangement parameters, such as CPO optical engines with 8~128 channels and 800G~12.8T, etc., without any restrictions, which greatly shortens the product development cycle.

[0166] ④ Full-process low-temperature compatibility reduces the risk of thermal damage and is compatible with CPO packaging systems. Corresponding technical features: nanosecond pulsed laser in-situ eutectic curing, which only heats the pad interface locally.

[0167] Results achieved: The overall substrate temperature does not exceed 150℃ during the curing process, which is suitable for the packaging requirements of 2.5D silicon interposer substrates, thereby reducing thermal damage to computing chips packaged on the same substrate. It is also compatible with existing CPO packaging and testing lines, which helps to reduce investment in new equipment.

[0168] ⑤ Significant advantages in mass production efficiency and cost, which are conducive to promoting large-scale commercialization. Corresponding technical features: a collaborative design for the entire process of synchronous transfer of the entire batch of arrays and rapid in-situ curing.

[0169] Achieved results: The UPH is greater than or equal to 15,000 chips, which is higher than the UPH of the high-precision single-chip bonding process and the mass transfer process for display involved in the related technologies. Furthermore, the single-chip mounting cost in this application is lower than the single-chip mounting cost of the high-precision process involved in the related technologies, making it suitable for the large-scale mass production of CPO optical engines.

[0170] Please see Figure 3 , Figure 3 This is a schematic block diagram of the structure of a display module 100 provided in an embodiment of this application.

[0171] like Figure 3 As shown, the display module 100 includes a co-packaged optical substrate 110, on which a light engine is provided; and a plurality of target micro light-emitting diode chips 120 bonded to the co-packaged optical substrate 110, wherein the plurality of target micro light-emitting diode chips 120 in the display module 100 are configured to correspond to the light channels of the light engine.

[0172] For a description of the display module 100, please refer to the corresponding description of the preparation method of the display module in the foregoing embodiments, which will not be repeated here.

[0173] Please see Figure 4 , Figure 4 This is a schematic block diagram of the structure of a display device 10 provided in an embodiment of this application.

[0174] like Figure 4 As shown, the display device 10 includes the aforementioned display module 100.

[0175] For a description of the display device 10, please refer to the corresponding description of the preparation method of the display module in the foregoing embodiments, which will not be repeated here.

[0176] It should be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in this specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations. It should be noted that, herein, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Without further limitation, an element defined by the phrase “comprising one…” does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0177] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above descriptions are merely specific implementations of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for manufacturing a display module, characterized in that, include: A micro light-emitting diode (LED) chip array is provided, the micro light-emitting diode chip array comprising a plurality of preset micro light-emitting diode chips, and each preset micro light-emitting diode chip having a first identifier; A co-packaged optical substrate is provided, wherein an optical engine is provided on the co-packaged optical substrate, and a second identifier is provided on the co-packaged optical substrate corresponding one-to-one with the optical channels included in the optical engine; Multiple target micro-light-emitting diode chips are adsorbed from multiple preset micro-light-emitting diode chips by a transfer array, and the arrangement parameters of the multiple target micro-light-emitting diode chips in the micro-light-emitting diode chip array correspond to the optical channel arrangement parameters of the light engine. Based on the first identifier of each of the multiple target micro LED chips and the second identifier of the co-packaged optical substrate, the multiple target micro LED chips and the co-packaged optical substrate are aligned and calibrated to obtain the multiple target micro LED chips and the co-packaged optical substrate that have completed the alignment calibration. The multiple target micro-light-emitting diode chips that have completed alignment and calibration are bonded to the co-packaged optical substrate to obtain a display module, wherein the multiple target micro-light-emitting diode chips in the display module are arranged correspondingly to the optical channels of the optical engine.

2. The preparation method according to claim 1, characterized in that, The transfer array includes multiple preset transfer units corresponding one-to-one with multiple preset micro LED chips. The optical channel arrangement parameters of the optical engine include the optical channel arrangement pattern of the optical engine and the number of optical channels of the optical engine. The arrangement parameters of the multiple target micro LED chips include the arrangement pattern formed by the multiple target micro LED chips and the number of the multiple target micro LED chips. The process of using a transfer array to adsorb multiple target micro-light-emitting diode (LED) chips from a plurality of preset micro-LED chips, wherein the arrangement parameters of the multiple target micro-LED chips in the LED chip array correspond to the optical channel arrangement parameters of the light engine, includes: Based on the optical channel arrangement pattern and the number of optical channels, multiple target transfer units are determined from the multiple preset transfer units. The arrangement pattern formed by the multiple target transfer units in the transfer array corresponds to the optical channel arrangement pattern, and the number of the multiple target transfer units corresponds to the number of optical channels. Multiple target micro-light-emitting diode chips are adsorbed from multiple preset micro-light-emitting diode chips through multiple target transfer units, so that the arrangement pattern of the multiple target micro-light-emitting diode chips in the micro-light-emitting diode chip array corresponds to the arrangement pattern of the light channels, and the number of multiple target micro-light-emitting diode chips corresponds to the number of light channels.

3. The preparation method according to claim 2, characterized in that, The first chip projection size of the preset micro light-emitting diode chip projected onto the preset plane is larger than the first transfer unit projection size of the preset transfer unit projected onto the preset plane, and the second chip projection size of the preset micro light-emitting diode chip projected onto the preset plane is larger than the second transfer unit projection size of the preset transfer unit projected onto the preset plane, wherein the preset plane is parallel to the light-emitting surface of the preset micro light-emitting diode chip.

4. The preparation method according to claim 1, characterized in that, The step of adsorbing multiple target micro-light-emitting diode chips from multiple preset micro-light-emitting diode chips via a transfer array includes: A transit substrate is provided, wherein the transit substrate is provided with a third identifier that corresponds one-to-one with the first identifier of each of the plurality of preset micro light-emitting diode chips; Based on the first identifier of each of the multiple preset micro light-emitting diode chips and the third identifier of the transfer substrate, the multiple preset micro light-emitting diode chips are transferred from the growth substrate where the micro light-emitting diode chip array is located to the transfer substrate; Through the transfer array, multiple target micro-light-emitting diode chips are adsorbed from the multiple preset micro-light-emitting diode chips transferred to the transfer substrate, and the arrangement parameters of the multiple target micro-light-emitting diode chips on the transfer substrate correspond to the arrangement parameters of the light channel.

5. The preparation method according to claim 4, characterized in that, The process of adsorbing multiple target micro-light-emitting diode chips from multiple preset micro-light-emitting diode chips transferred to the transfer substrate via the transfer array includes: The transfer substrate and the plurality of preset micro light-emitting diode chips are pre-debonded to obtain the plurality of preset micro light-emitting diode chips after processing. The transfer array is used to adsorb multiple target micro-light-emitting diode chips from the multiple pre-set micro-light-emitting diode chips after processing. The arrangement parameters of the multiple target micro-light-emitting diode chips in the multiple pre-set micro-light-emitting diode chips correspond to the arrangement parameters of the optical channel of the optical engine.

6. The preparation method according to claim 1, characterized in that, The provided micro-LED chip array includes multiple preset micro-LED chips, and each preset micro-LED chip has a first identifier, including: The micro-light-emitting diode chip array is formed in a growth substrate, and the micro-light-emitting diode chip array includes a plurality of preset micro-light-emitting diode chips; A first identifier is formed on each of the preset micro LED chips, and the absolute value of the coaxiality deviation between the center of the first identifier and the light emission center of the preset micro LED chip is less than or equal to a first deviation threshold.

7. The preparation method according to any one of claims 1 to 6, characterized in that, The step of aligning and calibrating the multiple target micro-LED chips and the co-packaged optical substrate based on the first identifier of each of the multiple target micro-LED chips and the second identifier of the co-packaged optical substrate to obtain the aligned target micro-LED chips and the co-packaged optical substrate includes: A first image is obtained by capturing the first identifier of each of the multiple target micro LED chips using a first camera, and a second image is obtained by capturing the second identifier of the co-packaged optical substrate using a second camera. Determine the first position information of multiple first identifiers on the first image, and determine the second position information of the second identifier on the second image; Based on the first position information and the second position information, the pose offset of the multiple target micro LED chips and the co-packaged optical substrate is obtained by least squares fitting. Based on the pose offset, motion compensation is performed on at least one of the multiple target micro LED chips and the co-packaged optical substrate until the pose offset of the multiple target micro LED chips and the co-packaged optical substrate is less than or equal to a preset offset threshold, thereby obtaining the multiple target micro LED chips and the co-packaged optical substrate that have completed alignment calibration.

8. The preparation method according to any one of claims 1 to 6, characterized in that, The process of bonding multiple target micro-light-emitting diode chips that have completed alignment calibration to the co-packaged optical substrate to obtain a display module includes: Multiple target micro LED chips are mounted onto corresponding pads on the co-packaged optical substrate; A display module is obtained by curing multiple target micro-light-emitting diode chips and the pads using pulsed laser.

9. A display module, characterized in that, include: A co-packaged optical substrate, wherein an optical engine is provided on the co-packaged optical substrate; as well as, Multiple target micro-light-emitting diode chips are bonded to the co-packaged optical substrate, and the multiple target micro-light-emitting diode chips in the display module are arranged corresponding to the optical channels of the optical engine.

10. A display device, characterized in that, The display device includes the display module as described in claim 9.

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