Semiconductor carrier film mechanism automatic take-out device and method

Abstract

The application provides a semiconductor carrier film mechanism automatic taking and placing device and method, which comprises a second linear module and a taking and placing module. The taking and placing module comprises a moving module, a first moving mechanism for driving a plugboard mechanism to move, a second moving mechanism for driving an adsorption mechanism to move and a third moving mechanism for driving a clamping jaw mechanism to move. The plugboard mechanism is arranged at a first height, the clamping jaw mechanism is arranged at a second height, the clamping jaw mechanism is located above or below the plugboard mechanism, the adsorption mechanism is arranged at a third height, the third height is greater than the first height, the taking and placing position of the plugboard mechanism is arranged opposite to a taking area, the taking and placing position of the clamping jaw mechanism is arranged opposite to a sorting area, and the taking and placing position of the adsorption mechanism corresponds to the upper side of the plugboard mechanism. The application has high efficiency in transmitting the carrier film mechanism in a semiconductor device and good protection effect on the carrier film mechanism.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to an automatic feeding device and method for semiconductor carrier film mechanisms. Background Technology

[0002] In the semiconductor device manufacturing process, the films or carriers that carry components such as chips or dies are important film carriers. They need to be frequently picked up and transferred between different workstations. As the integration of semiconductor components increases, the accuracy of the process and the production efficiency become more and more important. The picking and feeding operation of the film carrier is a key link connecting various processes, and its efficiency and reliability directly affect the capacity and product quality of the entire production line.

[0003] Existing material handling methods largely rely on manual assistance or semi-automated equipment. Manual operation is not only inefficient and unable to meet the needs of large-scale continuous production, but also prone to damage to the carrier film mechanism and the semiconductor components it carries due to improper operation during the handling process, affecting the product yield. Although some automated material handling equipment has replaced manual labor to a certain extent, its structure is relatively simple and its function is relatively limited, often only able to perform a single material handling or feeding action. At the same time, the carrier film mechanism itself is usually a thin sheet structure, which has high requirements for the contact and support methods during handling. Some methods use a single clamping method to fix and transfer the carrier film mechanism, and the clamping force is concentrated on a local area of ​​the carrier film mechanism, which can easily lead to deformation or even breakage of the edges of the carrier film mechanism. Moreover, when it is necessary to change to different sizes or types of carrier film mechanisms during production, it is often necessary to make many adjustments to the equipment or even replace parts, resulting in insufficient equipment versatility. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic feeding device and method for semiconductor film carrier mechanisms, which has high reliability in transporting semiconductor film carrier mechanisms, does not occupy too much equipment space, and provides good protection for the film carrier mechanism during the transport process.

[0005] To achieve the above objectives, the technical solution of the present invention is: an automatic feeding device for semiconductor carrier film mechanisms, used to transport and transfer carrier film mechanisms in the feeding area to the sorting area, including a second linear module, a frame, and a feeding / placing module. The frame is slidably disposed on the second linear module in the Z-axis direction, and the feeding / placing module is disposed on the frame. The feeding / placing module includes a moving module, which includes a first moving mechanism, a second moving mechanism, and a third moving mechanism disposed on the frame. The feeding / placing module also includes an insert plate mechanism, a gripper mechanism, and an adsorption mechanism. The insert plate mechanism is slidably disposed on the first moving mechanism in the Y-axis direction, the gripper mechanism is slidably disposed on the third moving mechanism in the Y-axis direction, and the adsorption mechanism is slidably disposed on the second moving mechanism in the Y-axis direction. The insert plate mechanism is disposed at a first height, the gripper mechanism is disposed at a second height, and the gripper mechanism is located above or below the insert plate mechanism. The adsorption mechanism is disposed at a third height, which is greater than the first height. The feeding / placing position of the insert plate mechanism is opposite to the feeding area, the feeding / placing position of the gripper mechanism is opposite to the sorting area, and the feeding / placing position of the adsorption mechanism corresponds to the area above the insert plate mechanism.

[0006] Furthermore, the second linear module is provided with the first linear module, and the second linear module can move along the X-axis direction on the first linear module; the frame includes a mounting frame, a first mounting plate and a second mounting plate, the first mounting plate and the second mounting plate are provided on the mounting frame, the first mounting plate is provided on the second linear module, the first mounting plate is located below the second mounting plate, and there is a gap between the first mounting plate and the second mounting plate.

[0007] The above configuration allows the first linear module to drive the second linear module, the insert plate mechanism, the gripper mechanism, and the adsorption mechanism to move in the X-axis direction. Thus, when the first linear module is working, the insert plate mechanism, the gripper mechanism, and the adsorption mechanism can transfer the film carrier mechanism in multiple material picking areas arranged in the X-axis direction.

[0008] Furthermore, the first moving mechanism includes a first driving device, a first driving wheel, a first synchronous belt, and two or more first transmission wheels; the first driving device is mounted on the frame, the first driving wheel is mounted on the output shaft of the first driving device, and first transmission wheels are respectively mounted at both ends of the frame; the first synchronous belt is sleeved between the first driving wheel and the first transmission wheels; a first linear guide rail is mounted on the frame, and a first slider is slidably mounted on the first linear guide rail; an insertion plate mechanism is mounted on the first slider, and the movement of the first synchronous belt drives the insertion plate mechanism to move; the second moving mechanism includes a second driving device, a second driving wheel, a second synchronous belt, and a second transmission wheel; the second driving device is mounted on the frame, the second driving wheel is mounted on the output shaft of the second driving device, and a second transmission wheel is mounted on the frame. The machine consists of a wheel, a second synchronous belt fitted between the second drive wheel and the second transmission wheel; a second linear guide rail is provided on the frame, and a second slider is slidably mounted on the second linear guide rail; an adsorption mechanism is mounted on the second slider, and the movement of the second synchronous belt drives the adsorption mechanism to move; the third moving mechanism includes a third drive device, a third drive wheel, a third synchronous belt, and two or more third transmission wheels; the third drive device is mounted on the frame, the third drive wheel is mounted on the output shaft of the third drive device, and third transmission wheels are respectively provided at both ends of the frame; a third synchronous belt is fitted between the third drive wheel and the third transmission wheel; a third linear guide rail is provided on the frame, and a third slider is slidably mounted on the third linear guide rail; a gripper mechanism is mounted on the third slider, and the movement of the third synchronous belt drives the gripper mechanism to move.

[0009] With the above configuration, when the first driving device operates, it drives the first driving wheel to rotate, which in turn drives the first synchronous belt to move. The movement of the first synchronous belt then moves the first slider connected to the insertion plate mechanism along the first linear guide rail. When the second driving device operates, it drives the second driving wheel to rotate, which in turn drives the second synchronous belt to move. The movement of the second synchronous belt then moves the second slider connected to the adsorption mechanism along the second linear guide rail. When the third driving device operates, it drives the third driving wheel to rotate, which in turn drives the third synchronous belt to move. The movement of the third synchronous belt then moves the third slider connected to the gripper mechanism along the third linear guide rail. This ensures smooth and reliable movement of the insertion plate mechanism, adsorption mechanism, and gripper mechanism, improving the transfer reliability of the carrier film mechanism.

[0010] Furthermore, a first clamping mechanism is fixedly mounted on the first slider. The first clamping mechanism includes a first base plate and a first pressure plate. One surface of the first base plate is provided with a first anti-slip portion arranged in an alternating pattern. The first base plate is fixed to one end of the first pressure plate, with the first anti-slip portion facing the first pressure plate. The other end of the first pressure plate is fixedly connected to the first slider, and the first synchronous belt is pressed between the first base plate and the first pressure plate. A second clamping mechanism is fixedly mounted on the second slider. The second clamping mechanism includes a second base plate and a second pressure plate. One surface of the second base plate is provided with a second anti-slip portion arranged in an alternating pattern. The second base plate is fixed to one end of the second pressure plate, the second anti-slip part faces the second pressure plate, the other end of the second pressure plate is fixedly connected to the second slider, and the second synchronous belt is pressed between the second base plate and the second pressure plate; a third clamping mechanism is fixedly provided on the third slider, the third clamping mechanism includes a third base plate and a third pressure plate, one surface of the third base plate is provided with a third anti-slip part with alternating concave and convex shapes, the third base plate is fixed to one end of the third pressure plate, the third anti-slip part faces the third pressure plate, the other end of the third pressure plate is fixedly connected to the third slider, and the third synchronous belt is pressed between the third base plate and the third pressure plate.

[0011] The above configuration, by providing a first anti-slip part with alternating concave and convex shapes on one surface of the first base plate, with the first anti-slip part facing the first pressure plate, allows the first base plate and the first pressure plate to reliably clamp the first synchronous belt, thereby driving the insertion plate mechanism to move reliably. By providing a second anti-slip part with alternating concave and convex shapes on one surface of the second base plate, with the second anti-slip part facing the second pressure plate, the second base plate and the second pressure plate can reliably clamp the second synchronous belt, thereby driving the adsorption mechanism to move reliably. By providing a third anti-slip part with alternating concave and convex shapes on one surface of the third base plate, with the third anti-slip part facing the third pressure plate, the third base plate and the third pressure plate can reliably clamp the third synchronous belt, thereby driving the gripper mechanism to move reliably.

[0012] Furthermore, the insert plate mechanism includes a first connecting plate, a first fixing plate, and a material-picking insert plate. One end of the first connecting plate is fixedly connected to the first moving mechanism, and the other end of the first connecting plate extends outward. One end of the material-picking insert plate is fixedly connected to the upper surface of the other end of the first connecting plate. A first fixing plate is also provided on one end of the material-picking insert plate. The first fixing plate passes through the material-picking insert plate and is fixedly connected to the first connecting plate by fasteners. The other end of the material-picking insert plate extends outward and forks to form a material-picking arm. An adsorption hole is provided on the upper surface of the material-picking insert plate. A first limiting block is also provided between the material-picking arm and the first fixing plate. The first limiting block is fixedly provided on the material-picking insert plate.

[0013] The above configuration, by setting a first connecting plate, allows the first moving mechanism to transmit driving force to the first connecting plate, thereby enabling the insert plate mechanism to move under the action of the first moving mechanism. One end of the material-picking insert plate is fixedly connected to the first connecting plate, and a first fixing plate is set between the material-picking insert plate and the first connecting plate. Fasteners pass through the material-picking insert plate and are fixedly connected to the first connecting plate, which enhances the connection strength between the material-picking insert plate and the first connecting plate and prevents the material-picking insert plate from displacing or deflecting relative to the first connecting plate when carrying the film-carrying mechanism. The other end of the material-picking insert plate is forked to form a material-picking arm and is provided with an adsorption hole, which allows the material-picking insert plate to be lifted simultaneously from both sides of the film-carrying mechanism, improving the stability of the material-picking process. The adsorption hole is used to provide adsorption force to the film-carrying mechanism during and after lifting, preventing the film-carrying mechanism from sliding relative to the material-picking insert plate during the transfer process and improving the stability of material picking.

[0014] Furthermore, an air passage cover is provided on the bottom surface of the material pick-up plate. The coverage path of the air passage cover includes the position corresponding to the adsorption hole, and a vacuum passage is formed between the air passage cover and the material pick-up plate.

[0015] The above configuration involves setting an air passage cover on the bottom surface of the material picker plate, with the air passage cover covering the corresponding position of the adsorption hole. This creates a vacuum passage between the air passage cover and the material picker plate, thus integrating the vacuum passage inside the material picker plate. This prevents the external air pipe from getting tangled or interfering with other components during the movement of the material picker plate, improving the reliability of the material picker plate's movement.

[0016] Furthermore, the gripper mechanism includes a second connecting plate, a second fixing plate, and a gripper base plate. One end of the second connecting plate is fixedly connected to the third moving mechanism, and the other end of the second connecting plate extends outward. One end of the second fixing plate is fixedly connected to the second connecting plate, and the other end of the second fixing plate is fixedly connected to the gripper base plate. A gripper drive is provided on the second fixing plate, and gripper fingers are provided on the output shaft of the gripper drive.

[0017] The above configuration, through the setting of a second connecting plate, allows the third moving mechanism to transmit driving force to the second connecting plate, thereby enabling the gripper mechanism to move under the action of the third moving mechanism. The gripper drive drives the gripper fingers to perform gripping actions, achieving active gripping of the side of the carrier film mechanism. By coordinating the gripping method with the adsorption method of the adsorption mechanism, after the adsorption mechanism cancels the adsorption, the gripper mechanism can independently fix the carrier film mechanism, thereby realizing the transfer of the carrier film mechanism from the adsorption mechanism to the gripper mechanism, and providing a reliable fixing method for subsequent sorting and conveying.

[0018] Furthermore, the gripper base plate extends to one side, and the extended end of the gripper base plate is arc-shaped. The gripper fingers extend in the same direction as the gripper base plate, forming a gripping area between the gripper fingers and the gripper base plate. A second limiting block is provided on the gripper base plate, and the second limiting block is located on one side of the gripper fingers.

[0019] The above configuration, with the gripper base plate extending to one side and set in an arc shape, allows the extended end of the gripper base plate to adapt to the edge shape of the film carrier mechanism, providing support during clamping and preventing deformation of the edge of the film carrier mechanism due to concentrated force. By setting the gripper fingers to extend in the same direction as the gripper base plate, a clamping area is formed between the gripper fingers and the gripper base plate. By setting a second limiting block, the film carrier mechanism is limited during the gripping process of the gripper fingers, preventing displacement due to incomplete clamping and improving the accuracy of clamping and positioning.

[0020] Furthermore, the adsorption mechanism includes a third connecting plate and a third fixing plate. One end of the third connecting plate is fixedly connected to the second moving mechanism, and the other end of the third connecting plate is connected to the third fixing plate. The third fixing plate extends outward and is provided with a lifting drive. The output end of the lifting drive is connected to a guide shaft. The guide shaft is arranged along the Z-axis direction, and an adsorption plate is provided on the guide shaft. Connecting arms extend outward around the adsorption plate. The extended end of the connecting arm is provided with a mounting groove arranged along the length direction of the connecting arm. A fourth fixing plate is provided on the mounting groove, and an adsorption assembly is provided on the fourth fixing plate. The adsorption end of the adsorption assembly is set downward.

[0021] The above configuration, through the setting of a third connecting plate, allows the second moving mechanism to transmit driving force to the third connecting plate, enabling the adsorption mechanism to move under the action of the second moving mechanism. The output end of the lifting drive is connected to a guide shaft, which is set along the Z-axis. An adsorption plate is set on the guide shaft, allowing the adsorption plate to move up and down along the Z-axis under the drive of the lifting drive, thereby lowering the adsorption component from the standby height to the height where it contacts the film carrier mechanism on the insertion plate mechanism, and raising or lowering it after adsorption is completed. By setting mounting grooves on the connecting arms around the adsorption plate, a fourth fixing plate is set on the connecting arms through the mounting grooves, allowing the fourth fixing plate to be adjusted in position along the length of the mounting groove. This allows the position of the adsorption component to be adjusted according to different sizes of film carrier mechanisms, improving the versatility of the device.

[0022] The present invention also provides an automatic feeding method for a semiconductor carrier film mechanism, which is implemented by the above-mentioned automatic feeding device for a semiconductor carrier film mechanism, and includes the following steps: S1. The second linear module drives the insert mechanism to move in the Z-axis direction, so that the insertion position of the insert mechanism is aligned with the carrier film mechanism to be taken out in the material picking area.

[0023] S2. The first moving mechanism drives the insert plate mechanism to move toward the material picking area and position the insert plate mechanism below the carrier film mechanism to be picked up. The second linear module drives the insert plate mechanism to lift the carrier film mechanism to be picked up in the material picking area.

[0024] S3. The first moving mechanism moves in the opposite direction, and the insert plate mechanism drives the carrier film mechanism to be removed from the material taking area.

[0025] S4. The adsorption mechanism moves downward and adsorbs the carrier film mechanism on the insert plate mechanism through the adsorption mechanism. S5. The gripper mechanism holds one side of the carrier film mechanism and cancels the adsorption mechanism's adsorption of the carrier film mechanism.

[0026] S6. The second moving mechanism drives the gripper mechanism to transport the film carrier mechanism to the sorting area.

[0027] The beneficial effects of this invention are as follows: By setting a second linear module and a pick-and-place module on the second linear module, the pick-and-place module can move linearly along the Z-axis direction via the second linear module. The insert plate mechanism, gripper mechanism, and adsorption mechanism are slidably mounted on the first moving mechanism, the third moving mechanism, and the second moving mechanism, respectively. This allows the first moving mechanism to drive the insert plate mechanism to move linearly along the Y-axis, the third moving mechanism to drive the gripper mechanism to move linearly along the Y-axis, and the second moving mechanism to drive the adsorption mechanism to move linearly along the Y-axis. By setting the insert plate mechanism at a first height, the gripper mechanism at a second height, and the adsorption mechanism at a third height, the various mechanisms will not interfere with each other during linear movement. By setting the pick-and-place position of the insert plate mechanism opposite to the material picking area, the insert plate mechanism can enter the material picking area and lift out the mold carrier mechanism in the material picking area. After the carrier mold is lifted out by the reverse movement of the mechanism, it is adsorbed by the adsorption mechanism. Through adsorption, damage to the carrier mold by other structures can be avoided as much as possible. The adsorption movement is highly stable, and the structure is simple and reliable. Then, the adsorbed carrier mold is clamped by the gripper mechanism and transported to the sorting area, realizing the automatic feeding process of the carrier mold. Through the coordinated action of the insert plate mechanism, gripper mechanism and adsorption mechanism, the carrier mold can complete the feeding process through the integrated pick-and-place module, shortening the feeding cycle of a single carrier mold. The wear on the carrier mold during the transportation process is small. It can adapt to carrier molds of different specifications, and has high transportation efficiency and a simple and reliable structure. Since the insert plate mechanism, gripper mechanism and adsorption mechanism all move in the Y-axis direction, the movement in the X-axis direction occupies little space, so it does not occupy too much equipment space. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of the present invention.

[0029] Figure 2 This is a schematic diagram of the pick-and-place module of the present invention from one perspective.

[0030] Figure 3 This is a schematic diagram of the pick-and-place module of the present invention from another perspective.

[0031] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0032] Figure 5 This is a schematic diagram of the insert plate mechanism of the present invention.

[0033] Figure 6 This is a bottom view of the insert plate mechanism of the present invention.

[0034] Figure 7 This is a schematic diagram of the gripper mechanism of the present invention.

[0035] Figure 8 This is a schematic diagram of the adsorption mechanism of the present invention.

[0036] Figure 9 This is a schematic diagram of the mold carrier mechanism.

[0037] Explanation of icon numbers: 11-First linear module; 12-Second linear module; 120-Fourth slider; 13-Frame; 131-Mounting bracket; 132-First mounting plate; 133-Second mounting plate; 134-Connecting block; 2-Pick-and-place module; 3-Moving module; 31-First moving mechanism; 311-First drive device; 312-First synchronous belt; 313-First transmission wheel; 314-First linear guide rail; 315-First slider; 32-Second moving mechanism; 321-Second Drive unit; 322-Second drive wheel; 323-Second synchronous belt; 324-Second transmission wheel; 325-Second linear guide rail; 326-Second slider; 33-Third moving mechanism; 331-Third drive wheel; 332-Third synchronous belt; 333-Third transmission wheel; 334-Third linear guide rail; 335-Third slider; 34-First clamping mechanism; 341-First base plate; 3411-First anti-slip part; 342-First pressure plate; 35-Second clamping mechanism 351-Second base plate; 3511-Second anti-slip part; 352-Second pressure plate; 36-Third clamping mechanism; 361-Third base plate; 3611-Third anti-slip part; 362-Third pressure plate; 4-Insertion plate mechanism; 41-First connecting plate; 42-First fixing plate; 43-Material picking insert plate; 431-Material picking arm; 4311-Suction hole; 44-First limiting block; 45-Anti-fall frame; 46-Air passage cover plate; 5-Gripper mechanism; 51-Second connecting plate; 52-Third clamping mechanism; 53-Fixed plate; 54-Gripper drive; 55-Gripper finger; 56-Gripping area; 57-Second limiting block; 6-Adsorption mechanism; 61-Third connecting plate; 62-Third fixed plate; 63-Lifting drive; 631-Guide shaft; 64-Adsorption plate; 641-Connecting arm; 6411-Mounting groove; 6412-Fourth fixed plate; 6413-Adsorption assembly; 70-Film carrier mechanism; 71-Ring; 72-Film; 73-Semiconductor device. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0039] like Figure 9 As shown, the automatic feeding device for semiconductor film carrier mechanism of the present invention includes a ring 71 and a film 72. In this embodiment, the ring 71 refers to a metal ring or plastic ring for holding the film 72. The film 72 can be a blue film or other film that carries a semiconductor device 73. In this embodiment, the semiconductor device 73 is a chip.

[0040] like Figures 1 to 8As shown, an automatic feeding device for semiconductor film carrier mechanism is used to transport the film carrier mechanism 70 in the feeding area to the sorting area. It includes a first linear module 11, a second linear module 12, a frame 13, and a pick-and-place module 2. The first linear module 11 is arranged along the X-axis direction, and the second linear module 12 is arranged along the Z-axis direction. The bottom of the second linear module 12 is slidably connected to the first linear module 11 through a fourth slider 120. The frame 13 is fixedly installed on the slider of the second linear module 12. The pick-and-place module 2 is arranged on the frame 13. Under the drive of the second linear module 12, the frame 13 and the pick-and-place module 2 move up and down along the Z-axis direction. Under the drive of the first linear module 11, the second linear module 12, the frame 13, and the pick-and-place module 2 move as a whole along the X-axis direction. The pick-and-place module 2 includes a moving module 3, an insert plate mechanism 4, a gripper mechanism 5, and an adsorption mechanism 6. The moving module 3 includes a first moving mechanism 31, a second moving mechanism 32, and a third moving mechanism 33. The insert plate mechanism 4 is slidably disposed on the first moving mechanism 31 in the Y-axis direction. The gripper mechanism 5 is slidably disposed on the third moving mechanism 33 in the Y-axis direction. The adsorption mechanism 6 is slidably disposed on the second moving mechanism 32 in the Y-axis direction. The insert plate mechanism 4 is disposed at a first height position, the gripper mechanism 5 is disposed at a second height position, and the adsorption mechanism 6 is disposed at a third height position. In this embodiment, the third height is higher than the second height in the vertical direction, and the second height is higher than the first height in the vertical direction. The pick-and-place position of the insert plate mechanism 4 is arranged opposite to the picking area in the horizontal direction. The pick-and-place position of the gripper mechanism 5 is arranged opposite to the sorting area in the horizontal direction. The pick-and-place position of the adsorption mechanism 6 corresponds to the area directly above the insert plate mechanism 4 in the vertical direction.

[0041] like Figure 2 and Figure 3 As shown, the frame 13 includes a mounting bracket 131, a first mounting plate 132, and a second mounting plate 133. Two mounting brackets 131 are provided. The first mounting plate 132 and the second mounting plate 133 are respectively mounted on the mounting bracket 131. The first mounting plate 132 is mounted on the slider of the second linear module 12 via a connecting block 134. The first mounting plate 132 is positioned below the second mounting plate 133, and there is a gap between the first mounting plate 132 and the second mounting plate 133.

[0042] like Figures 2 to 4As shown, the first moving mechanism 31 includes a first driving device 311, a first driving wheel (not shown in the figure), a first synchronous belt 312, and two or more first transmission wheels 313. The structure of the first moving mechanism 31 is the same as that of the third moving mechanism 33. In this embodiment, the first driving device 311 is a driving cylinder, which is mounted on the first mounting plate 132. The first driving wheel is disposed on the output shaft of the first driving device 311. The first transmission wheels 313 are mounted on both ends of the first mounting plate 132 via bearings and shafts, respectively. Of course, the first transmission wheels are mounted on both sides of the first driving wheel via bearings and shafts, respectively. The axis of the first transmission wheels located on both sides of the first driving wheel is higher than the axis of the first transmission wheels located at both ends and lower than the axis of the first driving wheel. The first synchronous belt 312 is sleeved between the first driving wheel and the first transmission wheels. A first linear guide rail 314 extending along the Y-axis direction is fixed to the first mounting plate 132 by bolts, and a first slider 315 is slidably disposed on the first linear guide rail 314.

[0043] like Figures 2 to 4 As shown, the second moving mechanism 32 includes a second driving device 321, a second driving wheel 322, a second synchronous belt 323, and a second transmission wheel 324. In this embodiment, the second driving device 321 is a driving cylinder, and the second driving device 321 is mounted on the second mounting plate 133. The second driving wheel 322 is mounted on the output shaft of the second driving device 321. The second transmission wheel 324 is mounted on the end of the second mounting plate 133 away from the second driving wheel 322 via a bearing and a shaft. The second synchronous belt 323 is sleeved between the second driving wheel 322 and the second transmission wheel 324. A second linear guide rail 325 is mounted on the second mounting plate 133, and a second slider 326 is slidably mounted on the second linear guide rail 325. The adsorption mechanism 6 is mounted on the second slider 326.

[0044] like Figures 2 to 4As shown, the third moving mechanism 33 includes a third driving device (not shown in the figure), a third driving wheel 331, a third synchronous belt 332, and two or more third transmission wheels 333. In this embodiment, the third driving device is a driving cylinder, which is mounted on the first mounting plate 132. The third driving wheel 331 is mounted on the output shaft of the third driving device. At both ends of the first mounting plate 132 and above the first transmission wheel, the third transmission wheel 333 is mounted via bearings and shafts. The third transmission wheel 333 is mounted on both sides of the third driving wheel 331 on the first mounting plate 132 via bearings and shafts. The axis of the third transmission wheel on both sides of the third driving wheel 331 is higher than the axis of the third driving wheel 331 and lower than the axis of the third transmission wheel at both ends. The third synchronous belt 332 is sleeved between the third driving wheel 331 and the third transmission wheel 333. A third linear guide rail 334 extending along the Y-axis is provided on the first mounting plate 132. A third slider 335 is slidably mounted on the third linear guide rail 334. A gripper mechanism is mounted on the third slider 335. The movement of the third synchronous belt drives the gripper mechanism to move.

[0045] A first clamping mechanism 34 is fixedly mounted on the first slider 315. The first clamping mechanism 34 includes a first base plate 341 and a first pressure plate 342. One surface of the first base plate 341 is provided with a first anti-slip part 3411 with alternating concave and convex shapes. The first base plate 341 is fixed to one end of the first pressure plate 342, with the first anti-slip part 3411 facing the first pressure plate 342. The other end of the first pressure plate 342 is fixedly connected to the first slider 315. The first synchronous belt 312 is pressed between the first base plate 341 and the first pressure plate 342. An insert plate mechanism is connected to the first slider 315.

[0046] When the first drive device 311 operates, it drives the first drive wheel to rotate. The first drive wheel, under the action of the first transmission wheel 313, drives the first synchronous belt 312 to move. Since the first synchronous belt 312 is clamped by the first base plate 341 and the first pressure plate 342, the movement of the first synchronous belt 312 causes the first slider 315 to slide along the Y-axis direction on the first linear guide rail 314. The movement of the first slider 315 then drives the insertion plate mechanism 4 to move along the Y-axis direction. In the above structure, the first moving mechanism can also be a gear and rack, lead screw and nut, or other structures. By providing the first anti-slip part 3411, the frictional force on the first synchronous belt 312 is increased, making the movement of the insertion plate mechanism driven by the first synchronous belt 312 more reliable.

[0047] A second clamping mechanism 35 is fixedly installed on the second slider 326. The second clamping mechanism 35 includes a second base plate 351 and a second pressure plate 352. One surface of the second base plate 351 is provided with a second anti-slip part 3511 with alternating concave and convex shapes. The second base plate 351 is fixed to one end of the second pressure plate 352, and the second anti-slip part 3511 faces the second pressure plate 352. The other end of the second pressure plate 352 is fixedly connected to the second slider 326. The second synchronous belt 323 is pressed between the second base plate 351 and the second pressure plate 352.

[0048] When the second drive device 321 operates, it drives the second drive wheel 322 to rotate. The second drive wheel 322, under the action of the second transmission wheel 324, drives the second synchronous belt 323 to move. Since the second synchronous belt 323 is clamped by the second base plate 351 and the second pressure plate 352, the movement of the second synchronous belt 323 causes the second slider 326 to slide along the Y-axis direction on the second linear guide rail 325. The movement of the second slider 326 then drives the adsorption mechanism 6 to move along the Y-axis direction. In the above structure, the second moving mechanism can also be a gear and rack, lead screw and nut, or other structures. By providing the second anti-slip part 3511, the frictional force on the second synchronous belt 323 is increased, making the movement of the adsorption mechanism driven by the second synchronous belt 323 more reliable.

[0049] like Figure 3 and Figure 4 As shown, a third clamping mechanism 36 is fixedly installed on the third slider 335. The third clamping mechanism 36 includes a third base plate 361 and a third pressure plate 362. One surface of the third base plate 361 is provided with a third anti-slip part 3611 with alternating concave and convex shapes. The third base plate 361 is fixed to one end of the third pressure plate 362, and the third anti-slip part 3611 faces the third pressure plate 362. The other end of the third pressure plate 362 is fixedly connected to the third slider 335. The third synchronous belt 332 is pressed between the third base plate 361 and the third pressure plate 362.

[0050] When the third drive device is working, it drives the third drive wheel 331 to rotate. Under the action of the third transmission wheel 333, the third drive wheel 331 drives the third synchronous belt 332 to move. Since the third synchronous belt 332 is clamped by the third base plate 361 and the third pressure plate 362, the movement of the third synchronous belt 332 will cause the third slider 335 to slide along the Y-axis on the third linear guide rail 334. The movement of the third slider 335 drives the gripper mechanism 5 to move along the Y-axis. In the above structure, the third moving mechanism can also be a gear and rack, lead screw and nut, or other structures. By providing the third anti-slip part 3611, the frictional force on the third synchronous belt 332 is increased, making the movement of the gripper mechanism driven by the third synchronous belt 332 more reliable.

[0051] like Figure 5and Figure 6 As shown, the insert mechanism 4 includes a first connecting plate 41, a first fixing plate 42, and a material-taking insert 43. One end of the first connecting plate 41 is fixedly connected to the first slider 315 via a connecting assembly. The other end of the first connecting plate 41 extends outward along the X-axis. One end of the material-taking insert 43 is fixedly connected to the upper surface of the other end of the first connecting plate 41 via a connecting assembly. A first fixing plate 42 is also provided on one end of the material-taking insert 43. The first fixing plate 42 passes through the material-taking insert 43 via a connecting assembly and is fixedly connected to the first connecting plate 41, forming a three-layer clamping structure to enhance the connection strength. The other end of the material-taking insert 43 extends outward along the Y-axis, and the extended end... The forked structure forms two picking arms 431. An adsorption hole 4311 is provided on the upper surface of the picking plate. In this embodiment, an adsorption hole 4311 is provided at the free end of the picking arm 431. An adsorption hole 4311 is provided on the upper surface of the picking plate near the first fixing plate 42. The adsorption hole 4311 is connected to the outside through an internal air passage. A first limiting block 44 is also provided between the picking arm 431 and the first fixing plate 42. The first limiting block 44 is fixedly installed on the upper surface of the picking plate 43 and is used to limit the maximum picking depth of the picking arm 431 when it is inserted to pick up materials, so as to avoid the plate mechanism 4 going too deep and causing it to collide with other stacked mold carrier mechanisms.

[0052] An air passage cover 46 is provided on the bottom surface of the material pick-up plate 43. The projection of the coverage path of the air passage cover 46 on the horizontal plane at least covers the area where the adsorption hole 4311 is located. The air passage cover 46 is connected to the bottom surface of the material pick-up plate 43 by welding, bonding or interference fit, so that a closed vacuum passage is formed between the air passage cover 46 and the bottom surface of the material pick-up plate 43. One end of the vacuum passage is connected to the adsorption hole 4311, and the other end is connected to an external negative pressure source through a pipe joint. A fall arrestor 45 is also provided on the bottom surface of the other end of the first connecting plate 41. One end of the fall arrestor 45 is fixedly connected to the bottom surface of the first connecting plate 41, and the other end of the fall arrestor 45 first extends outward along the X-axis direction, and then bends upward to form an upward-curving structure.

[0053] like Figure 7 As shown, the gripper mechanism 5 includes a second connecting plate 51, a second fixing plate 52, and a gripper base plate 53. One end of the second connecting plate 51 is fixedly connected to the third slider 335, and the other end of the second connecting plate 51 extends outward along the X-axis. One end of the second fixing plate 52 is fixedly connected to the other end of the second connecting plate 51, and the other end of the second fixing plate 52 is fixedly connected to the gripper base plate 53. A gripper drive 54 is fixedly mounted on the second fixing plate 52. In this embodiment, the gripper drive 54 is a thin cylinder. A gripper finger 55 is mounted on the output shaft of the gripper drive 54. The gripper finger 55 performs gripping or releasing actions under the drive of the gripper drive 54.

[0054] The gripper base plate 53 extends toward the sorting area, and the extended end of the gripper base plate 53 is arc-shaped. The arc-shaped structure is adapted to the edge contour of the film carrier mechanism 70. The gripper fingers 55 extend in the same direction as the gripper base plate 53 and are located above the gripper base plate 53. A clamping area 56 for accommodating the edge of the film carrier mechanism 70 is formed between the gripper fingers 55 and the gripper base plate 53. A second limiting block 57 is also provided on the gripper base plate 53. The second limiting block 57 is located on one side of the gripper fingers 55 and is used to limit the edge of the film carrier mechanism 70 during the clamping process to prevent the gripper mechanism 5 from clamping the film carrier mechanism too much in the Y-axis direction, so that the edge of the film carrier mechanism is clamped too deeply and collides with the gripper mechanism 5, or the gripper fingers 55 and the gripper base plate 53 clamp the film or the semiconductor device 73 on the film carrier mechanism. In this embodiment, a spring and a sensor are also provided on one end of the second fixing plate 52. The spring is fixed on the extension end of the second connecting plate 51 by a fixing component and abuts against one end of the second fixing plate 52. When the gripper finger 55 grips the film carrier mechanism, if the non-gripping end of the film carrier mechanism touches a foreign object, the resistance it receives will be transmitted in reverse to the second fixing plate 52, thereby compressing the spring. When the sensor detects that the spring is compressed, it will issue an alarm signal.

[0055] like Figure 8 As shown, the adsorption mechanism 6 includes a third connecting plate 61 and a third fixing plate 62. One end of the third connecting plate 61 is fixedly connected to the second slider 326, and the other end of the third connecting plate 61 is fixedly connected to the third fixing plate 62. The third fixing plate 62 extends outward in a horizontal direction. A lifting drive 63 is fixedly mounted on the upper surface of the third fixing plate 62. In this embodiment, the lifting drive 63 is a cylinder. The output end of the lifting drive 63 passes through the third fixing plate 62 and is connected to a guide shaft 631. The guide shaft 631 is arranged along the Z-axis direction. An adsorption plate 64 is fixedly mounted on the lower end of the guide shaft 631. The adsorption plate 64 has four peripheries... Multiple connecting arms 641 are provided extending outward from the edge. Each connecting arm 641 has an extension end with a mounting groove 6411 extending along the length of the connecting arm 641. A fourth fixing plate 6412 is fixedly installed in the mounting groove 6411 by bolts. The fixed position of the fourth fixing plate 6412 in the mounting groove 6411 can be adjusted along the length of the connecting arm 641. An adsorption component 6413 is fixedly installed on each fourth fixing plate 6412. The adsorption end of the adsorption component 6413 is set vertically downward and is used to contact the upper surface of the film carrier mechanism 70 to generate an adsorption effect. The adsorption component 6413 is a vacuum suction cup.

[0056] It should be noted that in this invention, the X-axis, Y-axis, and Z-axis directions are defined by... Figure 1 The coordinate system shown is defined.

[0057] The present invention also provides an automatic feeding method for a semiconductor carrier film mechanism, which is implemented by the above-mentioned automatic feeding device for a semiconductor carrier film mechanism, and includes the following steps: S1. Based on the position of the material picking area, the first linear module 11 drives the second linear module 12, the frame 13, and the pick-and-place module 2 to move in the X-axis direction, so that the pick-and-place position of the insert mechanism 4 is aligned with the corresponding material picking area of ​​the material picking mechanism that needs to be removed from the carrier film in the Y-axis direction. Generally, there are more than two material picking areas in the X-axis direction. If there is only one material picking area in the X-axis direction, the first linear module 11 is not required. In this invention, the pick-and-place position refers to the position between the outer sides of the two picking arms 431.

[0058] S2. The second linear module 12 drives the frame 13 to move in the Z-axis direction. The frame 13 then drives the insert plate mechanism 4, the gripper mechanism 5 and the adsorption mechanism 6 to move in the Z-axis direction, so that the pick-up and put-down position of the insert plate mechanism 4 is aligned with the carrier film mechanism 70 to be taken out in the pick-up area.

[0059] S3. The first moving mechanism 31 drives the insertion plate mechanism 4 to move towards the material picking area, positioning the material picking insertion plate 43 below the carrier film mechanism 70 to be picked up. At this time, there is a gap between the upper surface of the material picking insertion plate 43 and the lower surface of the carrier film mechanism 70 to prevent the material picking insertion plate 43 from colliding with the carrier film mechanism 70 during insertion. It should be noted that there is a gap between adjacent carrier film mechanisms in the Z-axis direction of the material picking area, and this gap is greater than the thickness of the material picking insertion plate 43. Then, the second linear module 12 drives the insertion plate mechanism 4 to lift the carrier film mechanism 70 to be picked up in the material picking area. In this step, when the upper surface of the material picking insertion plate 43 rises to contact the lower surface of the carrier film mechanism 70, a vacuum is drawn through the adsorption hole 4311, and the carrier film mechanism adsorbs it under vacuum.

[0060] S4. The first moving mechanism 31 moves in the opposite direction, and the inserting plate mechanism 4 drives the carrier film mechanism 70 to be taken out from the material taking area.

[0061] S5. The adsorption mechanism 6 moves downwards and adsorbs the film carrier mechanism 70 on the material picking plate through the adsorption component 6413, thus releasing the adsorption of the film carrier mechanism by the adsorption hole 4311. During this process, the gripper mechanism 5 and the adsorption mechanism 6 are misaligned in the Y-axis direction to facilitate the adsorption of the film carrier mechanism 70 on the material picking plate by the adsorption mechanism 6. The optimal method is that the gripper mechanism 5 moves along the Y-axis direction to the side closer to the material picking area under the action of the third moving mechanism.

[0062] S6. The adsorption component 6413 is lifted by the lifting drive 63 until the film carrier mechanism 70 and the clamping area 56 are on the same horizontal plane. Then, the third moving mechanism drives the gripper mechanism 5 to move in the Y-axis direction, so that one side of the film carrier mechanism on the adsorption component is inserted into the clamping area 56. The gripper mechanism 5 clamps one side of the film carrier mechanism 70 and cancels the adsorption of the adsorption component 6413 on the film carrier mechanism 70.

[0063] S7. The third moving mechanism 33 drives the gripper mechanism 5 to transport the film carrier mechanism 70 into the sorting area.

[0064] In this invention, the material handling area and the sorting area are located on both sides of the automatic material handling device of the semiconductor carrier film mechanism of this invention in the Y-axis direction.

[0065] The above steps begin with the second linear module 12 and the first moving mechanism 31 driving the inserting plate mechanism 4 to move along the Z and Y axes, aligning the pick-up and placement position of the picking plate 43 at the front end of the inserting plate mechanism 4 with the location of the carrier film mechanism 70 to be retrieved in the picking area along the Y axis. Then, the first moving mechanism drives the picking plate 43 to continue moving towards the inside of the picking area along the Y axis, inserting the two picking arms 431 into the gap between the stacked carrier film mechanisms 70. As the picking plate 43 penetrates deeper, the edge of the carrier film mechanism touches the first limiting block 44, indicating insertion. Once in place, the second linear module lifts the film carrier mechanism 70 upwards via the picking arm 431, causing it to detach from the support surface in the picking area. Then, the first moving mechanism moves in the opposite direction along the Y-axis, causing the picking plate 43, along with the film carrier mechanism 70, to exit the picking area and move to the transfer area outside the picking area. Next, the second moving mechanism 32 moves the adsorption mechanism 6 along the Y-axis, positioning it directly above the film carrier mechanism 70. Finally, the lifting drive 63 drives the adsorption plate 64 downwards along the Z-axis via the guide shaft 631. This process involves the adsorption end of the adsorption component 6413 contacting the upper surface of the film carrier mechanism 70 and generating negative pressure adsorption, thereby adsorbing and fixing the film carrier mechanism 70 onto the adsorption component 6413. Simultaneously, the adsorption holes release the film carrier mechanism from the adsorption. Then, the lifting drive 63 raises the adsorption plate and adsorption component, aligning the film carrier mechanism 70 with the clamping area 56 in the Y-axis direction. Next, the second or third moving mechanism inserts one side of the film carrier mechanism into the clamping area 56. Finally, the clamping drive 54 in the clamping mechanism 5 drives the clamping fingers 55 to move, thus clamping... The claw fingers 55 grip the side of the film carrier mechanism 70. After the gripper mechanism 5 completes the gripping, the adsorption component 6413 releases the adsorption of the film carrier mechanism 70, allowing the film carrier mechanism 70 to be transferred from the adsorption mechanism 6 to the gripper mechanism 5. Then, the lifting drive 63 drives the adsorption plate and adsorption component to rise, and the third moving mechanism drives the gripper mechanism 5 to move along the Y-axis, conveying the film carrier mechanism 70 held by the gripper mechanism 5 to the sorting area along the Y-axis. After reaching the predetermined position in the sorting area, the gripper fingers 55 are released, completing the automatic feeding process of the film carrier mechanism 70.

[0066] The device and method of the present invention, through the coordinated action of the insert plate mechanism 4, the gripper mechanism 5 and the adsorption mechanism 6, transports the mold carrier mechanism from the material picking area to the sorting area. On the one hand, the pick-and-place module 2 as a whole achieves movement and alignment in the X and Z axis directions through the first linear module 11 and the second linear module 12, which makes the space utilization of the entire device high. Moreover, the pick-and-place module 2 completes the movement in the Y axis direction by itself, which makes the transport and transfer efficiency high. On the other hand, the gripper mechanism 5 only clamps the mold carrier mechanism when it is transported to the sorting area, which further reduces the rigid contact of the mold carrier mechanism during the transport and transfer process, so as to minimize the damage to the mold carrier mechanism and the semiconductor device 73 on the mold carrier mechanism.

Claims

1. An automatic feeding device for semiconductor film carrier mechanisms, used to transport and transfer film carrier mechanisms from a picking area to a sorting area, comprising a second linear module, a frame, and a picking and placing module, wherein the frame is slidably disposed on the second linear module in the Z-axis direction, and the picking and placing module is disposed on the frame; the picking and placing module includes a moving module, the moving module comprising a first moving mechanism, a second moving mechanism, and a third moving mechanism disposed on the frame, characterized in that: The pick-and-place module further includes an insert plate mechanism, a gripper mechanism, and an adsorption mechanism. The insert plate mechanism is slidably mounted on a first moving mechanism in the Y-axis direction, the gripper mechanism is slidably mounted on a third moving mechanism in the Y-axis direction, and the adsorption mechanism is slidably mounted on a second moving mechanism in the Y-axis direction. The insert plate mechanism is set at a first height, the gripper mechanism is set at a second height, and the gripper mechanism is located above or below the insert plate mechanism. The adsorption mechanism is set at a third height, which is greater than the first height. The pick-and-place position of the insert plate mechanism is opposite to the material picking area, the pick-and-place position of the gripper mechanism is opposite to the sorting area, and the pick-and-place position of the adsorption mechanism corresponds to the area above the insert plate mechanism. The first moving mechanism includes a first driving device, a first driving wheel, a first synchronous belt, and two or more first transmission wheels; the second moving mechanism includes a second driving device, a second driving wheel, a second synchronous belt, and a second transmission wheel; the third moving mechanism includes a third driving device, a third driving wheel, a third synchronous belt, and two or more third transmission wheels.

2. The automatic feeding device for a semiconductor carrier film mechanism according to claim 1, characterized in that: The second linear module is provided with the first linear module, and the second linear module can move along the X-axis direction on the first linear module; the frame includes a mounting frame, a first mounting plate and a second mounting plate, the first mounting plate and the second mounting plate are provided on the mounting frame, the first mounting plate is provided on the second linear module, the first mounting plate is located below the second mounting plate, and there is a gap between the first mounting plate and the second mounting plate.

3. The automatic feeding device for a semiconductor carrier film mechanism according to claim 1, characterized in that: A first drive unit is mounted on the frame, a first drive wheel is mounted on the output shaft of the first drive unit, and first transmission wheels are respectively mounted at both ends of the frame. A first synchronous belt is fitted between the first drive wheel and the first transmission wheel. A first linear guide rail is mounted on the frame, and a first slider is slidably mounted on the first linear guide rail. An insertion plate mechanism is mounted on the first slider, and the movement of the first synchronous belt drives the insertion plate mechanism. A second drive unit is mounted on the frame, a second drive wheel is mounted on the output shaft of the second drive unit, and a second transmission wheel is mounted on the frame. A second synchronous belt is fitted between the second drive wheel and the second transmission wheel. Between; a second linear guide rail is provided on the frame, and a second slider is slidably arranged on the second linear guide rail; an adsorption mechanism is arranged on the second slider, and the movement of the second synchronous belt drives the adsorption mechanism to move; a third drive device is arranged on the frame, a third drive wheel is arranged on the output shaft of the third drive device, and a third transmission wheel is arranged at both ends of the frame respectively, and a third synchronous belt is sleeved between the third drive wheel and the third transmission wheel; a third linear guide rail is provided on the frame, and a third slider is slidably arranged on the third linear guide rail; a gripper mechanism is arranged on the third slider, and the movement of the third synchronous belt drives the gripper mechanism to move.

4. The automatic feeding device for a semiconductor carrier film mechanism according to claim 3, characterized in that: A first clamping mechanism is fixedly mounted on the first slider. The first clamping mechanism includes a first base plate and a first pressure plate. One surface of the first base plate is provided with a first anti-slip portion arranged in an alternating pattern. The first base plate is fixed to one end of the first pressure plate, with the first anti-slip portion facing the first pressure plate. The other end of the first pressure plate is fixedly connected to the first slider. A first synchronous belt is pressed between the first base plate and the first pressure plate. A second clamping mechanism is fixedly mounted on the second slider. The second clamping mechanism includes a second base plate and a second pressure plate. One surface of the second base plate is provided with a second anti-slip portion arranged in an alternating pattern. The plate is fixed to one end of the second pressure plate, the second anti-slip part faces the second pressure plate, the other end of the second pressure plate is fixedly connected to the second slider, and the second synchronous belt is pressed between the second base plate and the second pressure plate; a third clamping mechanism is fixedly provided on the third slider, the third clamping mechanism includes a third base plate and a third pressure plate, one surface of the third base plate is provided with a third anti-slip part with alternating concave and convex shapes, the third base plate is fixed to one end of the third pressure plate, the third anti-slip part faces the third pressure plate, the other end of the third pressure plate is fixedly connected to the third slider, and the third synchronous belt is pressed between the third base plate and the third pressure plate.

5. The automatic feeding device for a semiconductor carrier film mechanism according to claim 1, characterized in that: The insert plate mechanism includes a first connecting plate, a first fixing plate, and a material picking insert plate. One end of the first connecting plate is fixedly connected to the first moving mechanism, and the other end of the first connecting plate extends outward. One end of the material picking insert plate is fixedly connected to the upper surface of the other end of the first connecting plate. A first fixing plate is also provided on one end of the material picking insert plate. The first fixing plate passes through the material picking insert plate and is fixedly connected to the first connecting plate by fasteners. The other end of the material picking insert plate extends outward and forks to form a material picking arm. An adsorption hole is provided on the upper surface of the material picking insert plate. A first limiting block is also provided between the material picking arm and the first fixing plate. The first limiting block is fixedly provided on the material picking insert plate.

6. The automatic feeding device for a semiconductor carrier film mechanism according to claim 5, characterized in that: An air passage cover is provided on the bottom surface of the material pick-up plate. The coverage path of the air passage cover includes the position corresponding to the adsorption hole, and a vacuum passage is formed between the air passage cover and the material pick-up plate.

7. The automatic feeding device for a semiconductor carrier film mechanism according to claim 1, characterized in that: The gripper mechanism includes a second connecting plate, a second fixing plate, and a gripper base plate. One end of the second connecting plate is fixedly connected to the third moving mechanism, and the other end of the second connecting plate extends outward. One end of the second fixing plate is fixedly connected to the second connecting plate, and the other end of the second fixing plate is fixedly connected to the gripper base plate. A gripper drive is provided on the second fixing plate, and gripper fingers are provided on the output shaft of the gripper drive.

8. The automatic feeding device for a semiconductor carrier film mechanism according to claim 7, characterized in that: The gripper base plate extends to one side, and the extended end of the gripper base plate is arc-shaped. The gripper fingers extend in the same direction as the gripper base plate, and a gripping area is formed between the gripper fingers and the gripper base plate. A second limiting block is provided on the gripper base plate, and the second limiting block is located on one side of the gripper fingers.

9. The automatic feeding device for a semiconductor carrier film mechanism according to claim 1, characterized in that: The adsorption mechanism includes a third connecting plate and a third fixed plate. One end of the third connecting plate is fixedly connected to the second moving mechanism, and the other end of the third connecting plate is connected to the third fixed plate. The third fixed plate extends outward and is equipped with a lifting drive. The output end of the lifting drive is connected to a guide shaft, which is arranged along the Z-axis. An adsorption plate is arranged on the guide shaft. Connecting arms extend outward around the adsorption plate. The extended ends of the connecting arms are equipped with mounting grooves along the length of the connecting arms. A fourth fixed plate is arranged on the mounting grooves. An adsorption assembly is arranged on the fourth fixed plate, with the adsorption end of the adsorption assembly facing downward.

10. An automatic feeding method for a semiconductor carrier film mechanism, implemented by an automatic feeding device for a semiconductor carrier film mechanism as described in any one of claims 1-9, characterized in that: Includes the following steps: S1. The second linear module drives the insert mechanism to move in the Z-axis direction, so that the insertion position of the insert mechanism is aligned with the carrier film mechanism to be taken out in the material picking area. S2. The first moving mechanism drives the inserting plate mechanism to move toward the material picking area and position the inserting plate mechanism below the carrier film mechanism to be picked up. The second linear module drives the inserting plate mechanism to lift the carrier film mechanism to be picked up in the material picking area. S3. The first moving mechanism moves in the opposite direction, and the insert plate mechanism drives the carrier film mechanism to be removed from the material taking area. S4. The adsorption mechanism moves downward and adsorbs the carrier film mechanism on the insert plate mechanism through the adsorption mechanism. S5. The gripper mechanism holds one side of the carrier film mechanism and cancels the adsorption mechanism's adsorption of the carrier film mechanism. S6. The second moving mechanism drives the gripper mechanism to transport the film carrier mechanism to the sorting area.

Images