Electronic component

Abstract

The technical problem of the present application is to increase the capacitance generated between two coils in an electronic component having a structure in which a plurality of coil patterns are stacked. The solution is that the electronic component (100) has conductor layers (L1-L4) in which coil patterns (31-34) are formed, respectively, and which are embedded in a bulk (10). One end (31A) of the coil pattern (31) is connected to one end (33A) of the coil pattern (33), and one end (32A) of the coil pattern (32) is connected to one end (34A) of the coil pattern (34). The coil pattern (31) has a widened portion (51) in which the pattern width is widened, and the coil pattern (32) has a widened portion (52) in which the pattern width is widened. The widened portion (51) and the widened portion (52) overlap in the Z direction.

Description

Technical Field

[0001] This disclosure relates to electronic components. Background Technology

[0002] Patent document 1 discloses a common-mode noise filter having a structure in which first, second, third and fourth vortex-shaped conductors are stacked in sequence, and the inner peripheral end of the first vortex-shaped conductor is connected to the inner peripheral end of the third vortex-shaped conductor, and the inner peripheral end of the second vortex-shaped conductor is connected to the inner peripheral end of the fourth vortex-shaped conductor.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-248917 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] The characteristics of this electronic component vary with the capacitance generated between the two coils in a pair.

[0008] In this disclosure, a technique is introduced to improve the capacitance generated between a pair of coils in an electronic component having a structure formed by stacking multiple coil patterns.

[0009] Technical means to solve the problem

[0010] An electronic component according to one aspect of this disclosure includes: a body; a coil portion embedded in the body, formed by alternating layers of multiple interlayer insulating films and multiple conductor layers; and first, second, third, and fourth terminal electrodes. The multiple conductor layers include a first conductor layer with a first coil pattern, a second conductor layer with a second coil pattern, a third conductor layer with a third coil pattern, and a fourth conductor layer with a fourth coil pattern. The multiple interlayer insulating films include: a first interlayer insulating film located between the first conductor layer and the second conductor layer, a second interlayer insulating film located between the second conductor layer and the third conductor layer, and a third conductor layer located between the third conductor layer and the fourth conductor layer. The third interlayer insulating film has one end of the first coil pattern electrically connected to one end of the third coil pattern, one end of the second coil pattern electrically connected to one end of the fourth coil pattern, the other end of the first coil pattern electrically connected to the first terminal electrode, the other end of the second coil pattern electrically connected to the second terminal electrode, the other end of the third coil pattern electrically connected to the third terminal electrode, and the other end of the fourth coil pattern electrically connected to the fourth terminal electrode. The first coil pattern has a first widening portion with an increased pattern width, and the second coil pattern has a second widening portion with an increased pattern width. When viewed from the stacking direction, the first widening portion and the second widening portion overlap through the first interlayer insulating film.

[0011] Invention Effects

[0012] According to this disclosure, a technique is provided to improve the capacitance generated between a pair of coils in an electronic component having a structure formed by stacking multiple coil patterns. Attached Figure Description

[0013] Figure 1 This is a general perspective view showing the appearance of an electronic component 100 according to one embodiment of the technology disclosed herein.

[0014] Figure 2 This is a rough cross-sectional view of electronic component 100.

[0015] Figure 3 This is a general plan view used to illustrate the structure of conductor layer L1.

[0016] Figure 4 This is a general plan view used to illustrate the structure of conductor layer L2.

[0017] Figure 5 This is a general plan view used to illustrate the structure of conductor layer L3.

[0018] Figure 6 This is a general plan view used to illustrate the structure of conductor layer L4.

[0019] Figure 7 This is the equivalent circuit diagram of electronic component 100. Detailed Implementation

[0020] Hereinafter, embodiments of the technology disclosed herein will be described in detail with reference to the accompanying drawings.

[0021] Figure 1 This is a general perspective view showing the appearance of an electronic component 100 according to one embodiment of the technology disclosed herein.

[0022] Figure 1The illustrated electronic component 100 is a four-terminal chip coil component, having a body 10 and terminal electrodes 21-24 exposed on the surface of the body 10. The body 10 has side surfaces 11 and 12 forming the YZ plane and located opposite each other, side surfaces 13 and 14 forming the XZ plane and located opposite each other, and a mounting surface 15 and a top surface 16 forming the XY plane and located opposite each other. The mounting surface 15 and each side surface 11-14 can be orthogonal, or they can have an angle that differs from orthogonality by a certain range (e.g., the range of manufacturing error based on orthogonality). The mounting surface 15 is the surface opposite to the circuit board during mounting, and the four terminal electrodes 21-24 are exposed. When viewed from above in the Z direction, the X direction is the long side direction and the Y direction is the short side direction of the body 10. Terminal electrodes 21 and 22 are adjacent in the X direction, and terminal electrodes 23 and 24 are adjacent in the X direction. Terminal electrodes 21 and 23 are adjacent in the Y direction, and terminal electrodes 22 and 24 are adjacent in the Y direction.

[0023] Figure 2 This is a rough cross-sectional view of electronic component 100.

[0024] exist Figure 2 In the example shown, four conductor layers L1 to L4 are embedded inside the body 10. Interlayer insulating films 90 to 94 and conductor layers L1 to L4 are alternately stacked in the Z direction, which is the stacking direction, thereby forming the coil portion 20. Interlayer insulating film 91 is located between conductor layer L1 and conductor layer L2. Interlayer insulating film 92 is located between conductor layer L2 and conductor layer L3. Interlayer insulating film 94 is located between conductor layer L3 and conductor layer L4.

[0025] Figures 3-6 These are approximate planar diagrams used to illustrate the structure of conductor layers L1 to L4.

[0026] exist Figure 3 In the example shown, the conductor pattern disposed on conductor layer L1 includes coil pattern 31 and connecting patterns 61, 62, and 65. Coil pattern 31 is a conductor pattern wound with approximately one turn. One end 31A of coil pattern 31 is connected to the upper conductor layer L2 via via conductor 713. The other end 31B of coil pattern 31 is connected to the upper conductor layer L2 via via conductor 71. Connecting patterns 61, 62, and 65 are connected to the upper conductor layer L2 via via conductors 72, 74, and 73, respectively.

[0027] exist Figure 4In the example shown, the conductor pattern disposed on conductor layer L2 includes coil pattern 32, connection patterns 66-68, and relay pattern 82. Coil pattern 32 is a conductor pattern wound with approximately one turn. One end 32A of coil pattern 32 is connected to the upper conductor layer L3 via via conductor 715. The other end 32B of coil pattern 32 is connected to connection pattern 61 located on conductor layer L1 via via conductor 72, and is connected to the upper conductor layer L3 via via conductor 76. Connection pattern 66 is connected to the other end 31B of coil pattern 31 located on conductor layer L1 via via conductor 71, and is connected to the upper conductor layer L3 via via conductor 75. Connection patterns 67 and 68 are connected to connection patterns 65 and 62 located on conductor layer L1 via via conductors 73 and 74, respectively, and are connected to the upper conductor layer L3 via via conductors 77 and 78. The relay pattern 82 is connected to one end 31A of the coil pattern 31 located in the conductor layer L1 via the via conductor 713, and is connected to the upper conductor layer L3 via the via conductor 714.

[0028] exist Figure 5 In the example shown, the conductor pattern disposed on conductor layer L3 includes coil pattern 33, connection patterns 69, 610, 611, and relay pattern 81. Coil pattern 33 is a conductor pattern wound with approximately one turn. One end 33A of coil pattern 33 is connected to relay pattern 82 located on conductor layer L2 via via conductor 714. The other end 33B of coil pattern 33 is connected to connection pattern 67 located on conductor layer L2 via via conductor 77, and is connected to the upper conductor layer L4 via via conductor 711. Connection pattern 610 is connected to the other end 32B of coil pattern 32 located on conductor layer L2 via via conductor 76, and is connected to the upper conductor layer L4 via via conductor 710. Connection patterns 69 and 611 are connected to connection patterns 66 and 68 located on conductor layer L2 via via conductors 75 and 78, respectively, and are connected to the upper conductor layer L4 via via conductors 79 and 712. The relay pattern 81 is connected to one end 32A of the coil pattern 32 located in the conductor layer L2 via the via conductor 715, and is connected to the upper conductor layer L4 via the via conductor 716.

[0029] exist Figure 6In the example shown, the conductor pattern disposed on conductor layer L4 includes coil pattern 34 and connection patterns 63, 64, and 612. Coil pattern 34 is a conductor pattern wound with approximately one turn. One end 34A of coil pattern 34 is connected to relay pattern 81 located on conductor layer L3 via via conductor 716. The other end 34B of coil pattern 34 is connected to connection pattern 610 located on conductor layer L3 via via conductor 712, and is connected to terminal electrode 24 via via conductor 717. Connection pattern 64 is connected to the other end 33B of coil pattern 33 located on conductor layer L3 via via conductor 711, and is connected to terminal electrode 23 via via conductor 718. Connection patterns 63 and 612 are connected to connection patterns 69 and 610 located on conductor layer L3 via via conductors 79 and 710, respectively, and are connected to terminal electrodes 21 and 22 via via conductors 719 and 720.

[0030] With this structure, one end 31A of coil pattern 31 and one end 33A of coil pattern 33 are connected to each other via relay pattern 82. The other end 31B of coil pattern 31 is connected to terminal electrode 21 via connecting patterns 66, 69, and 63 that overlap in the stacking direction. The other end 33B of coil pattern 33 is connected to terminal electrode 23 via connecting pattern 64. Furthermore, one end 32A of coil pattern 32 and one end 34A of coil pattern 34 are connected to each other via relay pattern 81. The other end 32B of coil pattern 32 is connected to terminal electrode 22 via connecting patterns 610 and 612 that overlap in the stacking direction. The other end 34B of coil pattern 34 is connected to terminal electrode 24.

[0031] Viewed from the stacking direction, connecting patterns 61, 610, and 612 are arranged in the Y direction with connecting patterns 62, 68, and 611. Viewed from the stacking direction, connecting patterns 66, 69, and 63 are arranged in the Y direction with connecting patterns 65, 67, and 64. Viewed from the stacking direction, connecting patterns 61, 610, and 612 are arranged in the X direction with connecting patterns 66, 69, and 63. Viewed from the stacking direction, connecting patterns 62, 68, and 611 are arranged in the X direction with connecting patterns 65, 67, and 64. Furthermore, relay patterns 81 and 82 are arranged in the X direction when viewed from the stacking direction.

[0032] Figure 7 This is an equivalent circuit diagram of the electronic component 100 in this embodiment.

[0033] like Figure 7 As shown, coil patterns 31 and 33 are connected in series between terminal electrodes 21 and 23, thereby forming coil C1. Furthermore, coil patterns 32 and 34 are connected in series between terminal electrodes 22 and 24, thereby forming coil C2. Figures 3-6In the example shown, the winding direction of coil C1 starting from terminal electrode 21 is opposite to the winding direction of coil C2 starting from terminal electrode 22. Therefore, for example, when terminal electrodes 21 and 22 are connected to a pair of differential signal lines respectively, and terminal electrodes 23 and 24 are connected to the power supply circuit, the differential component (signal component) flowing in the differential signal lines will not flow into the power supply circuit through electronic component 100, while the DC power component will flow through electronic component 100.

[0034] like Figures 3-6 As shown, the body 10 includes a magnetic material portion 17 made of magnetic material and a resin material portion 18 made of non-magnetic resin material. The magnetic material portion 17 may be composed of a composite magnetic component, which includes a metallic magnetic filler made of magnetic materials such as iron (Fe) or permalloy and a resin binder. The resin material portion 18 may be composed of a resin material containing inorganic fillers such as silica and a resin binder.

[0035] exist Figures 3-6 In the example shown, the conductor patterns formed on conductor layers L1 to L4 are all covered by resin material portions 18. That is, the resin material portions 18 are disposed between the conductor patterns formed on conductor layers L1 to L4 and the magnetic material portions 17, but do not contact the magnetic material portions 17. On the other hand, most of the inner diameter region surrounded by coil patterns 31 to 34 when viewed from the coil axis direction, and most of the outer region located between coil patterns 31 to 34 and the sides 13 and 14 of the body 10, are composed of magnetic material portions 17. In contrast, no magnetic material portions 17 are provided in the outer region located between coil patterns 31 to 34 and the sides 11 and 12 of the body 10; this region is entirely composed of resin material portions 18.

[0036] exist Figure 3 In the example shown, the coil pattern 31 is provided with widened portions 51 and 55, where the pattern width is locally increased. Figure 4 In the example shown, the coil pattern 32 is provided with widened portions 52 and 56, where the pattern width is locally increased. Figure 5 In the example shown, the coil pattern 33 is provided with widened portions 53 and 57, where the pattern width is locally increased. Figure 6 In the example shown, the coil pattern 34 is provided with widening portions 54 and 58 whose pattern width is locally increased.

[0037] Widening portions 51, 52, 57, and 58 are located at the ends of coil patterns 31-34 in the -X direction. Widening portion 51 is located between one end 31A and the other end 31B of coil pattern 31, and is sandwiched in the Y direction by connecting patterns 61 and 62. Widening portion 52 is located on the side of one end 32A of coil pattern 32. Widening portion 52 is sandwiched in the Y direction by connecting pattern 68 and interval 41, wherein interval 41 is located on the -Y direction side of the other end 32B of coil pattern 32, and the other end 32B of coil pattern 32 is connected to widening portion 52 via widening portion 56. Widening portion 57 is located between one end 33A and the other end 33B of coil pattern 33, and is sandwiched in the Y direction by connecting patterns 610 and 611. Widening portion 58 is located on the side of one end 34A of coil pattern 34. The widening portion 58 is sandwiched between the connecting pattern 612 and the interval 44 from the Y direction, wherein the interval 44 is located on the +Y direction side of the other end 34B of the coil pattern 34, and the other end 34B of the coil pattern 34 is connected to the widening portion 58 via the widening portion 54.

[0038] Widened portions 51 and 52 overlap in the Z-direction, which is the lamination direction, separated by an interlayer insulating film 91. This increases the capacitance between coil pattern 31 and coil pattern 32 in this portion. Widened portions 52 and 57 overlap in the Z-direction, which is the lamination direction, separated by an interlayer insulating film 92. This increases the capacitance between coil pattern 32 and coil pattern 33 in this portion. Widened portions 57 and 58 overlap in the Z-direction, which is the lamination direction, separated by an interlayer insulating film 93. This increases the capacitance between coil pattern 33 and coil pattern 34 in this portion.

[0039] exist Figure 3 In the example shown, the outer peripheral edge of the -X direction end constituting the widened portion 51 extends linearly in the Y direction. As shown by the dashed line A1, the outer peripheral edge of the widened portion 51 can be aligned with the edge of the connecting patterns 61 and 62 located on the side 11. Figure 4 In the example shown, the outer peripheral edge of the -X direction end constituting the widened portion 52 extends linearly in the Y direction. As shown by dashed line A2, the outer peripheral edge of the widened portion 52 can be aligned with the edge of the connecting pattern 68 and interval 41 located on side 11. Figure 5 In the example shown, the outer peripheral edge of the -X direction end constituting the widened portion 57 extends linearly in the Y direction. As shown by dashed line A3, the outer peripheral edge of the widened portion 57 can be aligned with the edge of the connecting patterns 610 and 611 located on the side 11. Figure 6In the example shown, the outer peripheral edge of the -X direction end constituting the widened portion 58 extends in a straight line in the Y direction. As shown by the dashed line A4, the outer peripheral edge of the widened portion 58 can be aligned with the edge of the connecting pattern 612 and the interval 44 located on the side 11. If the widened portions 51, 52, 57, and 58 are formed in such a pattern shape, the capacitance generated between the coil patterns 31, 33 and the coil patterns 32, 34 will be further increased.

[0040] Furthermore, the section 41 of coil pattern 32 overlaps with the widened portion 51 of coil pattern 31 across the interlayer insulating film 91, and overlaps with the widened portion 57 of coil pattern 33 across the interlayer insulating film 92. The section 44 of coil pattern 34 overlaps with the widened portion 57 of coil pattern 33 across the interlayer insulating film 93. As a result, the capacitance generated between coil patterns 31, 33 and coil patterns 32, 34 will be further increased.

[0041] Furthermore, the widened portion 51 of the coil pattern 31 has a protrusion 98 that protrudes toward the inner diameter region of the coil pattern 31, and this portion overlaps with the relay pattern 81 in the stacking direction. As a result, the capacitance generated between the coil pattern 31 and the coil pattern 32 will be further increased.

[0042] Widening portions 55, 56, 53, and 54 are located at the ends of coil patterns 31-34 in the +X direction. Widening portion 55 is located at one end 31A of coil pattern 31. Widening portion 55 is sandwiched in the Y direction by connecting pattern 65 and interval 43, wherein interval 43 is located in the -Y direction on the other end 31B of coil pattern 31, and connects the other end 31B of coil pattern 31 to widening portion 51. Widening portion 56 is located between one end 32A and the other end 32B of coil pattern 32, sandwiched in the Y direction by connecting patterns 66 and 67. Widening portion 53 is located at one end 33A of coil pattern 33. Widening portion 53 is sandwiched in the Y direction by connecting pattern 69 and interval 42, wherein interval 42 is located in the +Y direction on the other end 33B of coil pattern 33, and connects the other end 33B of coil pattern 33 to widening portion 57. The widened portion 54 is located between one end 34A and the other end 34B of the coil pattern 34, and is sandwiched from the Y direction by the connecting patterns 63 and 64.

[0043] Widening portions 55 and 56 overlap in the Z-direction, which is the lamination direction, separated by an interlayer insulating film 91. This increases the capacitance between coil pattern 31 and coil pattern 32 in this portion. Widening portions 56 and 53 overlap in the Z-direction, which is the lamination direction, separated by an interlayer insulating film 92. This increases the capacitance between coil pattern 32 and coil pattern 33 in this portion. Widening portions 53 and 54 overlap in the Z-direction, which is the lamination direction, separated by an interlayer insulating film 93. This increases the capacitance between coil pattern 33 and coil pattern 34 in this portion.

[0044] exist Figure 3 In the example shown, the outer peripheral edge of the +X direction end of the widened portion 55 extends in a straight line in the Y direction. As shown by the dashed line B1, the outer peripheral edge of the widened portion 55 can be aligned with the edge of the connecting pattern 65 and the section 43 located on the side 12. Figure 4 In the example shown, the outer peripheral edge of the +X direction end of the widened portion 56 extends in a straight line in the Y direction. As shown by dashed line B2, the outer peripheral edge of the widened portion 56 can be aligned with the edge of the connecting patterns 66 and 67 located on the side 12. Figure 5 In the example shown, the outer peripheral edge of the +X direction end of the widened portion 53 extends in a straight line in the Y direction. As shown by dashed line B3, the outer peripheral edge of the widened portion 53 can be aligned with the edge of the connecting pattern 69 and the section 42 located on the side 12. Figure 6 In the example shown, the outer peripheral edge of the +X direction end of the widened portion 54 extends in a straight line in the Y direction. As shown by the dashed line B4, the outer peripheral edge of the widened portion 54 can be aligned with the edge of the connecting patterns 63 and 64 located on the side 12. If the widened portions 53 to 56 are formed in such a pattern shape, the capacitance generated between the coil patterns 31 and 33 and the coil patterns 32 and 34 will be further increased.

[0045] Furthermore, the section 43 of coil pattern 31 overlaps with the widened portion 56 of coil pattern 32 across the interlayer insulating film 91. The section 42 of coil pattern 33 overlaps with the widened portion 56 of coil pattern 32 across the interlayer insulating film 92, and overlaps with the widened portion 54 of coil pattern 34 across the interlayer insulating film 93. As a result, the capacitance generated between coil patterns 31, 33 and coil patterns 32, 34 will be further increased.

[0046] Furthermore, the widened portion 54 of the coil pattern 34 has a protrusion 99 that protrudes toward the inner diameter region of the coil pattern 34, and this portion overlaps with the relay pattern 82 in the stacking direction. As a result, the capacitance generated between the coil pattern 33 and the coil pattern 34 will be further increased.

[0047] Thus, in the electronic component 100 of this embodiment, the coil patterns 31 and 33 constituting coil C1 and the coil patterns 32 and 34 constituting coil C2 are alternately stacked with interlayer insulating films 91 and 93, and widening portions 51 and 58 are provided on the coil patterns 31 and 34, thereby increasing the capacitance between coil C1 and coil C2. As a result, the desired capacitance can be obtained without using additional capacitor components or the like.

[0048] Furthermore, the widened portions 51 to 58 are located at both ends of the X direction, which is the long side direction and the arrangement direction of the connecting patterns 81 and 82. The magnetic material portion 17 of the body 10 does not exist in this area, so the inductance will hardly decrease due to the widened portions 51 to 58.

[0049] That is, the connecting patterns 61 and 62 are arranged in the Y direction with the resin material portion 18 between them and the magnetic material portion 17, so the volume of the magnetic material portion 17 will not be reduced due to the widening portion 51 between them. Similarly, the other end 31B of the connecting pattern 65 and the coil pattern 31 are arranged in the Y direction with the resin material portion 18 between them and the magnetic material portion 17, so the volume of the magnetic material portion 17 will not be reduced due to the widening portion 55 between them.

[0050] In contrast, the other ends 31B of the connecting pattern 61 and the coil pattern 31 are arranged in the X direction, separated by the magnetic material portion 17 and the resin material portion 18, without any widening portion between them. The patterns between the connecting pattern 61 and the other ends 31B of the coil pattern 31 are formed with approximately the same width. Therefore, the volume of the magnetic material portion 17 located between them can be sufficiently ensured. Similarly, the connecting patterns 62 and 65 are arranged in the X direction, separated by the magnetic material portion 17 and the resin material portion 18, without any widening portion between them. The patterns between the connecting patterns 62 and 65 are formed with approximately the same width. Therefore, the volume of the magnetic material portion 17 located between them can be sufficiently ensured.

[0051] Furthermore, the other ends 32B of the connecting pattern 68 and the coil pattern 32 are arranged in the Y direction with the resin material portion 18 in between, not separated by the magnetic material portion 17. Therefore, the volume of the magnetic material portion 17 is not reduced due to the widening portion 52 between them. Similarly, the connecting pattern 66 and the connecting pattern 67 are arranged in the Y direction with the resin material portion 18 in between, not separated by the magnetic material portion 17. Therefore, the volume of the magnetic material portion 17 is not reduced due to the widening portion 56 between them.

[0052] In contrast, the other ends 32B of the connecting pattern 66 and the coil pattern 32 are arranged in the X direction, separated by the magnetic material portion 17 and the resin material portion 18, without any widening portion between them. The patterns between the connecting pattern 66 and the other ends 32B of the coil pattern 32 are formed with approximately the same width. Therefore, the volume of the magnetic material portion 17 located between them can be sufficiently ensured. Similarly, the connecting patterns 67 and 68 are arranged in the X direction, separated by the magnetic material portion 17 and the resin material portion 18, without any widening portion between them. The patterns between the connecting pattern 67 and the connecting pattern 68 are formed with approximately the same width. Therefore, the volume of the magnetic material portion 17 located between them can be sufficiently ensured.

[0053] Furthermore, the other ends 33B of the connecting pattern 69 and the coil pattern 33 are arranged in the Y direction with the resin material portion 18 separated from the magnetic material portion 17, so the volume of the magnetic material portion 17 is not reduced due to the widening portion 53 of the pattern width being provided between them. Similarly, the connecting pattern 610 and the connecting pattern 611 are arranged in the Y direction with the resin material portion 18 separated from the magnetic material portion 17, so the volume of the magnetic material portion 17 is not reduced due to the widening portion 57 of the pattern width being provided between them.

[0054] In contrast, the other ends 33B of the connecting pattern 611 and the coil pattern 33 are arranged in the X direction, separated by the magnetic material portion 17 and the resin material portion 18, without any widening portion between them. In other words, the patterns between the connecting pattern 611 and the other ends 33B of the coil pattern 33 are formed with approximately the same width. Therefore, the volume of the magnetic material portion 17 located between them can be sufficiently ensured. Similarly, the connecting patterns 69 and 610 are arranged in the X direction, separated by the magnetic material portion 17 and the resin material portion 18, without any widening portion between them. In other words, the patterns between the connecting pattern 69 and the connecting pattern 610 are formed with approximately the same width. Therefore, the volume of the magnetic material portion 17 located between them can be sufficiently ensured.

[0055] Furthermore, the connecting patterns 63 and 64 are arranged in the Y direction with the resin material portion 18 between them, not separated by the magnetic material portion 17, so the volume of the magnetic material portion 17 is not reduced due to the widening portion 54 between them. Similarly, the other ends 34B of the connecting pattern 612 and the coil pattern 34 are arranged in the Y direction with the resin material portion 18 between them, not separated by the magnetic material portion 17, so the volume of the magnetic material portion 17 is not reduced due to the widening portion 58 between them.

[0056] In contrast, the other ends 34B of the connecting pattern 64 and the coil pattern 34 are arranged in the X direction, separated by the magnetic material portion 17 and the resin material portion 18, without any widening portion between them. In other words, the patterns between the connecting pattern 64 and the other ends 34B of the coil pattern 34 are formed with approximately the same width. Therefore, the volume of the magnetic material portion 17 located between them can be sufficiently ensured. Similarly, the connecting pattern 63 and the connecting pattern 612 are arranged in the X direction, separated by the magnetic material portion 17 and the resin material portion 18, without any widening portion between them. In other words, the patterns between the connecting pattern 63 and the connecting pattern 612 are formed with approximately the same width. Therefore, the volume of the magnetic material portion 17 located between them can be sufficiently ensured.

[0057] The above describes the implementation of the technology disclosed herein, but the technology disclosed herein is not limited to the above implementation. Of course, various changes can be made without departing from its spirit, and these changes are also included within the scope of the technology disclosed herein.

[0058] For example, the electronic component 100 in the above embodiment has 4 conductor layers, but the number of conductor layers is not particularly limited and can be 6 or more.

[0059] The technology disclosed herein includes the following structural examples, but is not limited thereto.

[0060] An electronic component according to one aspect of this disclosure includes: a body; a coil portion embedded in the body, formed by alternating layers of multiple interlayer insulating films and multiple conductor layers; and first, second, third, and fourth terminal electrodes, wherein the multiple conductor layers include a first conductor layer with a first coil pattern, a second conductor layer with a second coil pattern, a third conductor layer with a third coil pattern, and a fourth conductor layer with a fourth coil pattern; and the multiple interlayer insulating films include a first interlayer insulating film located between the first conductor layer and the second conductor layer, a second interlayer insulating film located between the second conductor layer and the third conductor layer, and a third interlayer insulating film located between the third conductor layer and the fourth conductor layer. A three-layer interlayer insulating film is used. One end of the first coil pattern is electrically connected to one end of the third coil pattern, one end of the second coil pattern is electrically connected to one end of the fourth coil pattern, and the other end of the first coil pattern is electrically connected to the first terminal electrode, the other end of the second coil pattern is electrically connected to the second terminal electrode, the other end of the third coil pattern is electrically connected to the third terminal electrode, and the other end of the fourth coil pattern is electrically connected to the fourth terminal electrode. The first coil pattern has a first widening portion with an increased pattern width, and the second coil pattern has a second widening portion with an increased pattern width. When viewed from above in the stacking direction, the first and second widening portions overlap through the first interlayer insulating film. Accordingly, the capacitance generated between the first and second coil patterns increases.

[0061] In the aforementioned electronic component, the second widening portion may be located at one end of the second coil pattern. Since one end of the second coil pattern is connected to one end of the fourth coil pattern, it is easy to provide the second widening portion.

[0062] In the aforementioned electronic component, the third conductor layer may include a first relay pattern electrically connecting one end of the second coil pattern to one end of the fourth coil pattern, wherein the first widening portion and the first relay pattern have overlapping portions when viewed from a top view in the stacking direction. Accordingly, the capacitance generated between the first coil pattern and the second coil pattern is further increased.

[0063] In the aforementioned electronic component, the portion of the first widened section that overlaps with the first relay pattern may protrude toward the inner diameter region of the first coil pattern. Accordingly, the area of ​​the first widened section can be further increased without increasing the overall dimensions of the component.

[0064] In the aforementioned electronic component, the second coil pattern may further include a first section connecting the other end of the second coil pattern to the second widening portion, wherein the first widening portion and the first section overlap in a plan view from the stacking direction, separated by a first interlayer insulating film. Accordingly, the capacitance generated between the first coil pattern and the second coil pattern is further increased.

[0065] In the aforementioned electronic component, the third coil pattern may have a third widened portion with an increased pattern width, and the fourth coil pattern may have a fourth widened portion with an increased pattern width. When viewed from above in the stacking direction, the third and fourth widened portions overlap through a third interlayer insulating film. This results in an increased capacitance between the third and fourth coil patterns.

[0066] In the aforementioned electronic component, the third widening portion may be located at one end of the third coil pattern. Since one end of the third coil pattern is connected to one end of the first coil pattern, it is easy to provide the third widening portion.

[0067] In the aforementioned electronic component, the second conductor layer may include a second relay pattern electrically connecting one end of the first coil pattern to one end of the third coil pattern, and the fourth widening portion and the second relay pattern may overlap when viewed from a top view in the stacking direction. Accordingly, the capacitance generated between the third and fourth coil patterns is further increased.

[0068] In the aforementioned electronic component, the portion of the fourth widening section that overlaps with the second relay pattern when viewed from above in the stacking direction may protrude toward the inner diameter region of the fourth coil pattern. Accordingly, the area of ​​the fourth widening section can be further increased without increasing the overall dimensions of the substrate.

[0069] In the aforementioned electronic component, the third coil pattern may further include a second section connecting the other end of the third coil pattern to the third widening portion, and the fourth widening portion and the second section overlap in the lamination direction, separated by a third interlayer insulating film. Accordingly, the capacitance generated between the third coil pattern and the fourth coil pattern is further increased.

[0070] In the aforementioned electronic component, the first conductor layer may include: a first connection pattern electrically connected to the second terminal electrode; and a second connection pattern electrically connected to the fourth terminal electrode, with a first widening portion located between the first connection pattern and the second connection pattern. Accordingly, the area of ​​the first widening portion can be increased while ensuring the coil diameter of the first coil pattern.

[0071] In the aforementioned electronic component, the fourth conductor layer may include: a third connection pattern electrically connected to the first terminal electrode; and a fourth connection pattern electrically connected to the third terminal electrode, with the fourth widening portion located between the third connection pattern and the fourth connection pattern. Accordingly, the area of ​​the fourth widening portion can be increased while ensuring the coil diameter of the fourth coil pattern.

[0072] In the aforementioned electronic component, the first and second connecting patterns may be arranged in a first direction when viewed from the stacking direction, the third and fourth connecting patterns may be arranged in the first direction when viewed from the stacking direction, the first and third connecting patterns may be arranged in a second direction orthogonal to the first direction when viewed from the stacking direction, the second and fourth connecting patterns may be arranged in a second direction when viewed from the stacking direction, and the first and second relay patterns may be arranged in a second direction when viewed from the stacking direction. Accordingly, the first to fourth widened portions can be positioned on the outer side in the second direction when viewed from the first and second relay patterns.

[0073] In the aforementioned electronic component, the body may include a magnetic material portion made of magnetic material and a resin material portion made of non-magnetic resin material. The first conductor layer further includes a fifth connection pattern electrically connected to the third terminal electrode. The second conductor layer includes a sixth connection pattern electrically connected to the first terminal electrode, a seventh connection pattern electrically connected to the third terminal electrode, and an eighth connection pattern electrically connected to the fourth terminal electrode. The other ends of the fifth connection pattern and the first coil pattern are arranged in a first direction, and the other ends of the first connection pattern and the first coil pattern are arranged in a second direction. The second connection pattern and the fifth connection pattern are arranged in a second direction, and the other ends of the eighth connection pattern and the second coil pattern are arranged in a first direction. The sixth connection pattern and the seventh connection pattern are arranged in a first direction, and the other ends of the sixth connection pattern and the second coil pattern are arranged in a second direction. The seventh connection pattern and the eighth connection pattern are arranged in a second direction. In the first direction, a resin material portion is disposed between the first connection pattern and the second connection pattern instead of a magnetic material portion. In the first direction, a portion of the material section is provided between the fifth connecting pattern and the other end of the first coil pattern, where no magnetic material section is provided but a portion of resin material is provided. In the second direction, a portion of magnetic material and a portion of resin material are provided between the first connecting pattern and the other end of the first coil pattern. In the second direction, a portion of magnetic material and a portion of resin material are provided between the second connecting pattern and the fifth connecting pattern. In the first direction, a portion of resin material is provided between the eighth connecting pattern and the other end of the second coil pattern, where no magnetic material section is provided. In the first direction, a portion of resin material is provided between the sixth connecting pattern and the seventh connecting pattern, where no magnetic material section is provided but a portion of resin material is provided. In the second direction, a portion of magnetic material and a portion of resin material are provided between the sixth connecting pattern and the other end of the second coil pattern. In the second direction, a portion of magnetic material and a portion of resin material are provided between the seventh connecting pattern and the eighth connecting pattern. Accordingly, the volume of the magnetic material section is not reduced due to the provision of the first and second widening portions with wide pattern widths.

[0074] In the aforementioned electronic component, the third conductor layer may include a ninth connection pattern connected to the first terminal electrode, a tenth connection pattern connected to the second terminal electrode, and an eleventh connection pattern connected to the fourth terminal electrode. The fourth conductor layer may also include a twelfth connection pattern connected to the second terminal electrode. The third and fourth connection patterns are arranged in a first direction, and the other ends of the twelfth connection pattern and the fourth coil pattern are arranged in a first direction. The other ends of the fourth connection pattern and the fourth coil pattern are arranged in a second direction. The third and twelfth connection patterns are arranged in a second direction, and the other ends of the ninth connection pattern and the third coil pattern are arranged in a first direction. The tenth and eleventh connection patterns are arranged in a first direction, and the other ends of the eleventh connection pattern and the third coil pattern are arranged in a second direction. The ninth and tenth connection patterns are arranged in a second direction. In the first direction, a portion of a resin material portion is disposed between the third and fourth connection patterns instead of a magnetic material portion. In the first direction, a portion of resin material is disposed between the other end of the twelfth connecting pattern and the fourth coil pattern instead of a magnetic material portion. In the second direction, a portion of magnetic material and a portion of resin material are disposed between the other end of the fourth connecting pattern and the fourth coil pattern. In the second direction, a portion of magnetic material and a portion of resin material are disposed between the third connecting pattern and the twelfth connecting pattern. In the first direction, a portion of resin material is disposed between the other end of the ninth connecting pattern and the third coil pattern instead of a magnetic material portion. In the first direction, a portion of resin material is disposed between the tenth and eleventh connecting patterns instead of a magnetic material portion. In the second direction, a portion of magnetic material and a portion of resin material are disposed between the other end of the eleventh connecting pattern and the third coil pattern. In the second direction, a portion of magnetic material and a portion of resin material are disposed between the ninth and tenth connecting patterns. Accordingly, the volume of the magnetic material portion is not reduced due to the provision of the widened third and fourth extensions.

[0075] In the aforementioned electronic components, the first coil pattern may further have a fifth widening portion located at one end; the second coil pattern may further have a sixth widening portion located between the sixth and seventh connecting patterns; the third coil pattern may further have a seventh widening portion located between the tenth and eleventh connecting patterns; and the fourth coil pattern may further have an eighth widening portion located at one end. When viewed from above in the stacking direction, the fifth and sixth widening portions overlap with a first interlayer insulating film; the second and seventh widening portions overlap with a second interlayer insulating film; the third and sixth widening portions overlap with a second interlayer insulating film; and the seventh and eighth widening portions overlap with a third interlayer insulating film. Accordingly, the capacitance generated between the first and second coil patterns is further increased, the capacitance generated between the second and third coil patterns is further increased, and the capacitance generated between the third and fourth coil patterns is further increased.

[0076] In the aforementioned electronic components, the first coil pattern may further include a third section connecting the other end of the first coil pattern to the first widening portion; the fourth coil pattern may further include a fourth section connecting the other end of the fourth coil pattern to the fourth widening portion; the sixth widening portion and the third section, when viewed from the stacking direction, overlap with each other through a first interlayer insulating film; the sixth widening portion and the second section, when viewed from the stacking direction, overlap with each other through a second interlayer insulating film; the seventh widening portion and the first section, when viewed from the stacking direction, overlap with each other through a second interlayer insulating film; and the seventh widening portion and the fourth section, when viewed from the stacking direction, overlap with each other through a third interlayer insulating film. Accordingly, the capacitance generated between the first coil pattern and the second coil pattern is further increased, the capacitance generated between the second coil pattern and the third coil pattern is further increased, and the capacitance generated between the third coil pattern and the fourth coil pattern is further increased.

[0077] This application claims priority to Japanese Patent Application No. 2024-046260, filed on March 22, 2024, the entire disclosure of which is incorporated herein by reference.

[0078] Explanation of reference numerals in the attached figures

[0079] 10 body

[0080] 11-14 Side View

[0081] 15 mounting surfaces

[0082] 16. Top surface

[0083] 17. Magnetic Materials Department

[0084] 18. Resin Materials Department

[0085] 20 Coil Section

[0086] 21-24 terminal electrodes

[0087] Coil patterns 31-34

[0088] 31A, 32A, 33A, 34A (one end)

[0089] 31B, 32B, 33B, 34B (the other end)

[0090] 41-44 range

[0091] 51-58 Widened section

[0092] Connection patterns 61-69, 610-612

[0093] 71~79, 710~720 Via conductors

[0094] 81, 82 Connecting patterns

[0095] 90-94 layer interlayer insulating film

[0096] 98, 99 protrusions

[0097] 100 Electronic Components

[0098] C1 and C2 coils

[0099] L1 to L4 conductor layers.

Claims

1. An electronic component, comprising: body; The coil section, which is embedded in the body, is composed of alternating layers of multiple interlayer insulating films and multiple conductor layers; and First, second, third, and fourth terminal electrodes, The plurality of conductor layers include a first conductor layer having a first coil pattern, a second conductor layer having a second coil pattern, a third conductor layer having a third coil pattern, and a fourth conductor layer having a fourth coil pattern. The plurality of interlayer insulating films include a first interlayer insulating film located between the first conductor layer and the second conductor layer, a second interlayer insulating film located between the second conductor layer and the third conductor layer, and a third interlayer insulating film located between the third conductor layer and the fourth conductor layer. One end of the first coil pattern is electrically connected to one end of the third coil pattern. One end of the second coil pattern is electrically connected to one end of the fourth coil pattern. The other end of the first coil pattern is electrically connected to the first terminal electrode. The other end of the second coil pattern is electrically connected to the second terminal electrode. The other end of the third coil pattern is electrically connected to the third terminal electrode. The other end of the fourth coil pattern is electrically connected to the fourth terminal electrode. The first coil pattern has a first widening portion that increases the pattern width. The second coil pattern has a second widening portion with an increased pattern width. The first widened portion and the second widened portion have portions that overlap each other across the first interlayer insulating film when viewed from the stacking direction.

2. The electronic component according to claim 1, wherein, The second widening portion is located at one end of the second coil pattern.

3. The electronic component according to claim 2, wherein, The third conductor layer includes a first relay pattern that electrically connects one end of the second coil pattern to one end of the fourth coil pattern. The first widened portion and the first relay pattern have overlapping portions when viewed from above in the stacking direction.

4. The electronic component according to claim 3, wherein, The portion of the first widened portion that overlaps with the first relay pattern protrudes toward the inner diameter region of the first coil pattern.

5. The electronic component according to claim 1, wherein, The second coil pattern also has a first section connecting the other end of the second coil pattern to the second widening portion. The first widened portion and the first interval have portions that overlap with each other across the first interlayer insulating film when viewed from the stacking direction.

6. The electronic component according to claim 1, wherein, The third coil pattern has a third widening portion with an increased pattern width. The fourth coil pattern has a fourth widening portion with an increased pattern width. The third and fourth widened portions have overlapping portions separated by the third interlayer insulating film when viewed from the stacking direction.

7. The electronic component according to claim 6, wherein, The third widening portion is located at one end of the third coil pattern.

8. The electronic component according to claim 7, wherein, The second conductor layer includes a second relay pattern that electrically connects one end of the first coil pattern to one end of the third coil pattern. The fourth widening portion and the second relay pattern have overlapping portions when viewed from above in the stacking direction.

9. The electronic component according to claim 8, wherein, When viewed from the stacking direction, the portion of the fourth widened section that overlaps with the second relay pattern protrudes toward the inner diameter region of the fourth coil pattern.

10. The electronic component according to claim 6, wherein, The third coil pattern also has a second section that connects the other end of the third coil pattern to the third widening portion. The fourth widening portion and the second region overlap in the stacking direction, separated by the third interlayer insulating film.

11. The electronic component according to any one of claims 6 to 10, wherein, The first conductor layer includes a first connection pattern electrically connected to the second terminal electrode and a second connection pattern electrically connected to the fourth terminal electrode. The first widening portion is located between the first connecting pattern and the second connecting pattern.

12. The electronic component according to claim 11, wherein, The fourth conductor layer includes a third connection pattern electrically connected to the first terminal electrode, and a fourth connection pattern electrically connected to the third terminal electrode. The fourth widening portion is located between the third connecting pattern and the fourth connecting pattern.

13. The electronic component according to claim 12, wherein, The first connecting pattern and the second connecting pattern are arranged in a first direction when viewed from above from the stacking direction. The third and fourth connecting patterns are arranged in the first direction when viewed from above from the stacking direction. The first connecting pattern and the third connecting pattern are arranged in a second direction orthogonal to the first direction when viewed from the stacking direction. The second connecting pattern and the fourth connecting pattern are arranged in the second direction when viewed from the stacking direction. The first relay pattern and the second relay pattern are arranged in the second direction when viewed from above from the stacking direction.

14. The electronic component according to claim 13, wherein, The body comprises a magnetic material portion made of magnetic material and a resin material portion made of non-magnetic resin material. The first conductor layer also includes a fifth connection pattern electrically connected to the third terminal electrode. The second conductor layer includes a sixth connection pattern electrically connected to the first terminal electrode, a seventh connection pattern electrically connected to the third terminal electrode, and an eighth connection pattern electrically connected to the fourth terminal electrode. The other ends of the fifth connecting pattern and the first coil pattern are arranged in the first direction. The other ends of the first connecting pattern and the first coil pattern are arranged in the second direction. The second connection pattern and the fifth connection pattern are arranged in the second direction. The other ends of the eighth connecting pattern and the second coil pattern are arranged in the first direction. The sixth connecting pattern and the seventh connecting pattern are arranged in the first direction. The other ends of the sixth connecting pattern and the second coil pattern are arranged in the second direction. The seventh connecting pattern and the eighth connecting pattern are arranged in the second direction. In the first direction, a portion of the resin material portion is disposed between the first connection pattern and the second connection pattern instead of the magnetic material portion. In the first direction, a portion of the resin material portion is disposed between the other end of the fifth connecting pattern and the first coil pattern, instead of the magnetic material portion. In the second direction, a portion of the magnetic material portion and a portion of the resin material portion are disposed between the other end of the first connecting pattern and the first coil pattern. In the second direction, a portion of the magnetic material portion and a portion of the resin material portion are disposed between the second connection pattern and the fifth connection pattern. In the first direction, a portion of the resin material portion is disposed between the other end of the eighth connecting pattern and the second coil pattern, instead of the magnetic material portion. In the first direction, a portion of the resin material portion is disposed between the sixth connecting pattern and the seventh connecting pattern instead of the magnetic material portion. In the second direction, a portion of the magnetic material portion and a portion of the resin material portion are disposed between the other end of the sixth connecting pattern and the second coil pattern. In the second direction, a portion of the magnetic material portion and a portion of the resin material portion are disposed between the seventh connection pattern and the eighth connection pattern.

15. The electronic component according to claim 14, wherein, The third conductor layer includes a ninth connection pattern connected to the first terminal electrode, a tenth connection pattern connected to the second terminal electrode, and an eleventh connection pattern connected to the fourth terminal electrode. The fourth conductor layer also includes a twelfth connection pattern connected to the second terminal electrode. The third connection pattern and the fourth connection pattern are arranged in the first direction. The other ends of the twelfth connecting pattern and the fourth coil pattern are arranged in the first direction. The other ends of the fourth connecting pattern and the fourth coil pattern are arranged in the second direction. The third connecting pattern and the twelfth connecting pattern are arranged in the second direction. The other ends of the ninth connecting pattern and the third coil pattern are arranged in the first direction. The tenth connecting pattern and the eleventh connecting pattern are arranged in the first direction. The other ends of the eleventh connecting pattern and the third coil pattern are arranged in the second direction. The ninth connecting pattern and the tenth connecting pattern are arranged in the second direction. In the first direction, a portion of the resin material portion is disposed between the third connecting pattern and the fourth connecting pattern instead of the magnetic material portion. In the first direction, a portion of the resin material portion is disposed between the other end of the twelfth connecting pattern and the fourth coil pattern, instead of the magnetic material portion. In the second direction, a portion of the magnetic material portion and a portion of the resin material portion are disposed between the other end of the fourth connecting pattern and the fourth coil pattern. In the second direction, a portion of the magnetic material portion and a portion of the resin material portion are disposed between the third connecting pattern and the twelfth connecting pattern. In the first direction, a portion of the resin material portion is disposed between the other end of the ninth connecting pattern and the third coil pattern, instead of the magnetic material portion. In the first direction, a portion of the resin material portion is disposed between the tenth connecting pattern and the eleventh connecting pattern instead of the magnetic material portion. In the second direction, a portion of the magnetic material portion and a portion of the resin material portion are disposed between the other end of the eleventh connecting pattern and the third coil pattern. In the second direction, a portion of the magnetic material portion and a portion of the resin material portion are disposed between the ninth connection pattern and the tenth connection pattern.

16. The electronic component according to claim 15, wherein, The first coil pattern also has a fifth widening portion located at one end. The second coil pattern also has a sixth widening portion located between the sixth connecting pattern and the seventh connecting pattern. The third coil pattern also has a seventh widening portion located between the tenth connecting pattern and the eleventh connecting pattern. The fourth coil pattern also has an eighth widening portion located at one end. The fifth and sixth widened portions, when viewed from above in the stacking direction, have portions that overlap with the first interlayer insulating film. The second widened portion and the seventh widened portion, when viewed from the lamination direction, have portions that overlap with the second interlayer insulating film. The third and sixth widened portions, when viewed from above in the stacking direction, have portions that overlap with the second interlayer insulating film. The seventh and eighth widened portions have portions that overlap with the third interlayer insulating film when viewed from the stacking direction.

17. The electronic component according to claim 16, wherein, The first coil pattern also has a third section connecting the other end of the first coil pattern to the first widening portion. The fourth coil pattern also has a fourth section that connects the other end of the fourth coil pattern to the fourth widening portion. The sixth widening portion and the third interval, when viewed from the stacking direction, have overlapping portions separated by the first interlayer insulating film. The sixth widening portion and the second interval, when viewed from the stacking direction, have overlapping portions separated by the second interlayer insulating film. The seventh widened portion and the first interval, when viewed from the stacking direction, have overlapping portions separated by the second interlayer insulating film. The seventh widening portion and the fourth interval have portions that overlap with the third interlayer insulating film when viewed from the stacking direction.

Images