Substrate holder, method for manufacturing such a substrate holder, and method for holding a substrate

Abstract

A substrate holder (1) for holding a substrate (7) during a process, for example during a bonding process, a lithography process, a coating process or a cleaning process, wherein the substrate holder (1) has a separation region (4) for separating regions with different pressure levels, which occur between the substrate holder (1) and the substrate (1) when holding the substrate (7), wherein the separation region (4) has a sealing device (5, 5', 5'', 5''') and a pin element (6) and / or a further pin element (6'), wherein the pin element (6') and / or the further pin element (6') and the sealing device (5, 5', 5'', 5''') are designed such that, in order to constitute a contactless sealing region, the pin element (6) and / or the further pin element (6') at least sectionally prevents contact between the sealing device (5, 5', 5'', 5''') and the substrate (1') in the separation region (4) when holding the substrate (1).

Description

Technical Field

[0001] The present invention relates to a substrate holder, a method for manufacturing such a substrate holder, and a method for holding a substrate. Background Technology

[0002] In recent years and decades, bonding technology has made significant progress. A key driver of this advancement is the pursuit of manufacturing functional units on different substrates, particularly wafers, and connecting them to each other using bonding methods. This allows different manufacturers to create different substrates with varying functionalities and then bond them together using bonding techniques.

[0003] In principle, different types of bonding methods exist. One bonding method is temporary bonding, in which a bonding adhesive, such as a polymer, is preferably used to connect a first substrate, i.e., the product substrate, to a second substrate, i.e., the carrier substrate. This bonding method is typically used so that the product substrate can be transported and stabilized for subsequent process steps. Methods are performed on the product substrate to subject it to chemical, mechanical, and thermal loads. If the product substrate is not stabilized by the carrier substrate, it will warp, break, or crack. After successful treatment of the product substrate, it can be separated from the carrier substrate again using one of several debonding methods.

[0004] Another bonding method is direct bonding. In direct bonding, two substrates are connected to each other directly via their substrate surfaces. Hydrophilic or hydrophobic dielectric substrate surfaces are used in most cases. This type of direct bonding is known by the name "fusion bonding". If the substrate surface does not have a continuous dielectric surface, but is interrupted by metallic regions, such as through-silicon vias (TSVs), it is also called a hybrid bonding surface. The fusion bonding method has achieved the greatest technological advancement to date in recent years because it enables heterogeneous integration.

[0005] One of the most important tools used to perform direct bonding is the chuck. The chuck has also undergone significant further development in recent decades.

[0006] Initially, the substrate holder consists of a single component or a group of components having a flat substrate holder surface. The substrate holder surface may have fixing elements, such as electrodes or vacuum holes, depending on whether the substrate holder is designed as an electrostatic substrate holder or a vacuum substrate holder. However, the characterizing feature is a flat substrate holder surface that is at most interrupted by fixing elements.

[0007] A further development involved designing the substrate holder such that the substrate to be secured rests on multiple pins, sometimes also called bumps. Instead of pin-element substrate holders, bump substrate holders are also called bump substrate holders. The term "pin element" (instead of bump element) will be used below to describe this component of the substrate holder. Pin elements typically refer to protrusions that can have different sizes and shapes. Pin elements are mostly cylindrical, with a small ratio of column axis length to column diameter. This compact shape is intended to ensure stability. Substrate securing is mostly achieved using a vacuum securing device. On the base plane where the pin elements are located, there are through-holes leading to the interior of the substrate holder's vacuum system. By correspondingly evacuating the space between the base plane and the substrate, i.e., the space between the pin elements, a vacuum can be created. Atmospheric pressure then presses the substrate onto and secures it to the pin elements. One reason for developing pin-element substrate holders is to avoid back-side contamination of the substrate. The smaller the support surface, the fewer particles may be transferred from the substrate holder to the back side of the substrate.

[0008] A further development of substrate holders lies in the so-called partitioned substrate holder. Partitioned substrate holders are mostly also pin-element substrate holders, however, characterized by the presence of distinct regions within the substrate holder, referred to as zones, which are separated from other zones by sealing devices. The fixing elements of such partitioned substrate holders are mostly vacuum fixing devices. Each zone can independently switch its fixing device, especially its vacuum fixing device, on and off, separate from the fixing devices of other zones. This allows for selective fixing of the substrate based on location. It is even feasible to determine the fixing strength by the fixing strength, particularly the height of the resulting negative pressure, i.e., determining the pressure at which the substrate is pressed against the substrate holder surface, or, in the case of a pin-element substrate holder, against the pin element surface. This controllability is crucial for influencing the bonding wave formed and moving between the two substrates, which has proven to have a very strong influence on the bonding result. By manipulating the feasibility of different zones, the bonding result can be decisively improved.

[0009] Therefore, the following problem has emerged in pin element substrate holders, especially in partitioned substrate holders: the morphology of the pin elements and / or sealing devices affects the bonding results. The morphology of the pin elements and / or sealing devices can be identified by mechanical deformation and / or plastic deformation and / or changes in the bonding interface and / or by run-out errors caused by the measurement system. However, the desired bonding result is a uniform, defect-free bond.

[0010] One feasible solution to this problem is to reduce the spacing between the pin elements, i.e., increase the number of pin elements per unit area, or the pin element areal density. Reducing the spacing between the pin elements provides better support for the substrate, and the substrate rests more flatly on the pin elements. However, when the spacing between the pin elements is too small, it becomes impractical to fabricate corresponding sealing devices between the pin elements. This hinders the fabrication of partitioned substrate holders because it is impossible to maintain different pressure levels. In the prior art, this problem is solved by simply omitting the pin elements along the contour lines so that sealing devices can be embedded. However, this disrupts the uniformity of the pin element areal density. Summary of the Invention

[0011] The object of the present invention is to provide a substrate holder that, when holding a substrate, minimizes distortion of the processing results caused by the action of pin elements and / or sealing devices, while ensuring that the effect on the positional resolution of the holding is feasible.

[0012] This invention achieves this objective through a substrate holder according to claim 1, a method for manufacturing a substrate holder according to claim 14, and a method for holding a substrate according to claim 15. Advantageous improvements of the invention are given in the dependent claims. All combinations consisting of at least two features given in the specification, claims, and / or drawings also fall within the scope of the invention. Values ​​within the given numerical ranges and those falling within the mentioned limits should also be considered as limiting values ​​and can be claimed in any combination.

[0013] According to a first aspect of the invention, a substrate holder is provided for holding a substrate during a processing procedure, such as a bonding process, a photolithography process, a coating process, and / or a cleaning process, wherein the substrate holder has a separation region for separating areas with different pressure levels that occur between the substrate holder and the substrate during holding, wherein the separation region has at least one sealing device and pin elements and / or additional pin elements, wherein the pin elements and / or additional pin elements and the sealing device are designed such that, in order to form a contactless sealing region, when holding the substrate, the pin elements and / or additional pin elements at least partially prevent contact between the sealing device and the substrate in the separation region.

[0014] In contrast to substrate holders known from the prior art, the present invention proposes that the sealing device, at least partially, preferably over the entire separation region or over more than 30%, preferably more than 50%, and particularly preferably more than 70% of the separation region, just barely avoids contact with the substrate, in such a way that pin elements and / or additional pin elements maintain a distance between the substrate and the sealing device during retention. Simultaneously, the sealing device, while forming a contactless sealing region, ensures that different pressure levels can be generated in the region adjacent to the separation region. Therefore, the sealing device or sealing element should be understood as a structural or physical measure, particularly used in a volumetric manner to form a sealing labyrinth or gap seal, i.e., to increase flow resistance in the separation region. In particular, flow resistance is increased by providing pin elements, additional pin elements, and / or the sealing device. For this purpose, for example, the length and / or shape of the flow path is affected by the provision of the sealing device. Therefore, the separation region should be particularly understood as a separation region suitable for maintaining different pressure levels without, for example, achieving a completely airtight sealing device. More precisely, the separation zone is used to ensure that the desired pressure level can be maintained, supported, and / or achieved in the areas respectively adjacent to the separation zone. Therefore, a completely airtight seal between the two areas via the separation zone is not involved here.

[0015] By strategically spacing the substrate from multiple sealing devices or a single sealing device, it is advantageous to prevent the substrate from contacting the sealing devices planarly, and especially over a relatively large area. This advantageously further reduces the influence of the substrate holder on the substrate, thus making the process less affected by the sealing devices. Simultaneously, the pin elements, other pin elements, and sealing devices work together to increase flow resistance between areas with different pressure levels, resulting in the desired sealing effect. Therefore, the advantage is that the sealing devices themselves no longer mechanically act on the substrate. In contrast to the pin surface, i.e., the support surface for the pin elements or other pin elements, the sealing surface is retracted and does not contact the substrate. Measurements have shown that it is precisely the relatively wide sealing devices that act on the bonding interface during the bonding process, making this effect visible afterward through measurement. With the retracted sealing devices, they do not contact the substrate at all from the outset.

[0016] Specifically, it is proposed that the substrate holder extends substantially along the main extension plane, and the sealing device, pin element, and / or additional pin element constitutes a protrusion, the sealing device or the pin element protruding in a direction perpendicular to the main extension plane. Particularly preferably, it is proposed that the substrate holder has a base plane preferably hypothetically extending substantially parallel to the main extension plane, from which the pin element, additional pin element, and / or sealing device protrudes in a direction perpendicular to the main extension plane. The support surface of the pin element or additional pin element here preferably extends parallel to the base plane or the main extension plane. It is conceivable that the sealing device, when held, extends obliquely relative to the main extension plane on the side facing the substrate and / or has an uneven orientation. This provides greater freedom in the design of the sealing device, as parallel orientation is not required for placement. In the region formed between the substrate and the base plane when holding the substrate, a sealing labyrinth or labyrinth-type seal or gap seal is provided, particularly by correspondingly providing pin elements, additional pin elements, and / or sealing devices. This sealing labyrinth or labyrinth-type seal or gap seal is particularly suitable for ensuring different pressure levels in areas adjacent to the sealing or separating regions. Therefore, it is proposed to eliminate direct contact between the sealing device and the substrate, and to design the combination of pin elements and sealing devices as a labyrinth-type sealing device.

[0017] The described substrate holder is preferably used in bonding processes, particularly melt bonding, and most preferably in hybrid bonding. However, the use of the substrate holder is by no means limited to bonding. The substrate holder can also be used to hold substrates positioned for photolithography, particularly photolithography or imprint lithography. Applications in painting methods, cleaning methods, and / or similar methods are conceivable.

[0018] It is conceivable that the sealing device is embedded between the pin elements without removing them. This maintains the pin element areal density, i.e., the number of pin elements per unit area. The sealing device is preferably retractable. For example, it is conceivable that the sealing device is integrated, for example, retrofitted into an existing arrangement. This improves the sealing performance, and / or allows for separation into individual zones while still being feasible. Accordingly, the retaining device can be retrofitted.

[0019] Preferably, the pin element and / or additional pin elements protrude relative to the sealing device. This ensures, with relatively simple means, that no contact between the substrate and the sealing device is caused. In particular, the support surfaces of the pin element and / or additional pin elements are located in a common plane extending parallel to the main extension plane.

[0020] Preferably, additional pin elements are integrated into the sealing device. This provides the advantage that when designing the separation area, i.e., when setting up the pin elements and the sealing device, it is not necessary to choose between the pin elements and the sealing device for their positioning. Therefore, it is feasible to design both in any number, distribution, and size. Preferably, the pin elements are arranged on a hexagonal grid. However, square grids, zentriert-rechteckig grids, right-angled grids, and oblique grids are also conceivable. These grid types are known from crystallography and group theory. An asymmetric, i.e., statistical distribution of the pin elements is also conceivable, although this is not preferred. Hexagonal grids are preferred because they ensure that each pin element has the same spacing only with its nearest neighbor. Therefore, it is advantageous to increase the density of pin elements or additional pin elements in the separation area, since the area or area of ​​the sealing device is also shared. Thus, the uniformity of the distribution of the support surfaces provided by the pin elements and additional pin elements can be improved, because the sealing device no longer hinders the placement of pin elements or additional pin elements in this area. Therefore, it is possible to achieve uniformity in the density of pin elements, and it is feasible to manufacture sealing devices in any arbitrary shape, at any arbitrary location, and in any arbitrary quantity.

[0021] Here, integration should be understood in particular as: additional pin elements, for example, are disposed on the sealing device, or additional pin elements are surrounded by the sealing device and preferably embedded in a recess in the sealing device, particularly preferably in a blind hole. For example, it is conceivable that the sealing device is constructed in a strip-like or annular strip-like manner. Preferably, in the separation region, a plurality of strip-like sealing devices extend parallel to each other. Particularly preferably, one or more rows of pin elements may be provided between the sealing devices, the row or multiple rows of pin elements extending substantially parallel to the sealing devices. Additional pin elements are embedded, for example, in the strip-like or annular strip-like sealing device. Thus, the area in which the sealing device itself is disposed can be advantageously used as a location for pin elements, i.e., additional pin elements.

[0022] Preferably, the substrate holder has a first region and a second region, wherein the first region is separated from the second region by a separation region. Thus, for example, it is feasible to achieve different pressure levels in the regions belonging to the first and second regions, wherein the separation region between the first and second regions ensures that the pressure levels between the regions separated by the separation region are not immediately rebalanced. It is conceivable that, in order to maintain the pressure levels during holding, corresponding vacuum sources or compressors ensure that these regions are subjected to corresponding negative pressures, particularly different negative pressures, in order to generate and / or maintain different pressure levels. The separation region essentially supports different pressure levels to achieve the desired purpose of selectively securing or releasing regions of the substrate.

[0023] Preferably, the separation regions, in order to form a sealed labyrinth, have multiple sealing devices, particularly multiple sealing devices each having at least one additional pin element, wherein the sealing devices are arranged sequentially along a direction extending from the first region to the second region. Therefore, the substrate holder typically has vacuum leakage between the various regions, but this vacuum leakage can preferably be reduced by the series connection of multiple sealing devices, making targeted and controlled suction of the substrate feasible or simplified. It is conceivable to implement different sealing devices and / or additional pin elements. This allows for the maintenance of different pressure levels. It has proven particularly advantageous to implement or arrange at least three sealing devices, preferably at least five, and particularly preferably at least eight, along a predetermined direction between the first and second regions. It is conceivable that different sealing devices exist between different regions. For example, it is conceivable that, viewed radially from the center of the substrate holder, the number of sealing devices, pin elements, and / or additional pin elements in each separation region increases and / or decreases.

[0024] Therefore, the substrate holder preferably has multiple zones. The zones can be arbitrarily shaped and separated by a sealing device or separation region described in this disclosure. Zoned substrate holders are known in the prior art and will not be described in detail here. Some substrate holders with zones are disclosed and described in documents WO 2022 002 345 A1, WO 2019 057 286 A1, and WO 2018028 801 A1, the contents of which are explicitly referenced here.

[0025] Specifically, it is proposed that the separation region has a self-closing orientation, such as a frame-shaped orientation. Preferably, it has an arcuate orientation, a (partially) segmented orientation, or a circular orientation. Preferably, the sealing device extends substantially along the orientation of the separation region. Thus, for example, it is feasible to separate regions or areas with different pressure levels that are concentrically arranged with respect to the center of the substrate holder from each other. Here, for example, it is feasible to control the bonding wave orientation in the radial direction, especially when the bonding wave orientation begins at the center of the substrate holder. It is also conceivable that the separation region surrounds a region forming a segment in an arrangement of checkerboard-patterned segments. Here, for example, the checkerboard-patterned arrangement can follow a specific orientation in a row, such as a circular orientation. Thus, for example, different effects on the bonding wave can be achieved at different positions viewed in the circumferential direction, at the same radial distance from the center of the substrate holder. This allows for more precise correction during substrate holding, especially within the range of the bonding process that generates the bonding wave.

[0026] Preferably, the lateral extension of the sealing device is greater than the lateral extension of the other pin element. In particular, the lateral extension is measured, for example, as a cross-section, i.e., the cross-sectional area, in a direction and / or plane parallel to the main extension plane. This ensures that the support surface of the other pin element is smaller than the extension of the sealing device in the area of ​​the sealing device. Preferably, the lateral extension is greater than three times, more preferably greater than ten times, or even greater than 20 times the lateral extension of the pin element.

[0027] Preferably, the pin elements and / or additional pin elements, as well as the sealing device or preferably the substrate holder, are designed in a manner that is particularly more than 50%, preferably more than 70%, and particularly preferably substantially entirely integral. Integral is also understood to mean a one-piece or integrated design of the substrate holder. Therefore, the substrate-fixing components of the substrate holder are preferably constructed integrally. The substrate holder should be understood, in particular, as a structural measure without, for example, a vacuum source connected to the substrate holder. The substrate holder may be referred to as a fixing component. Generally, the substrate holder must be conceived as a group of components having multiple associated components. However, since most other components of the substrate holder do not provide substantial added value to the inventive concept, the term "fixing component" can also be used as a synonym for the substrate holder. Integral means that the pin elements and sealing devices are not inserted but machined from a single solid component. Integral, integrated, or one-piece construction should be understood in particular to mean that further disassembly of the substrate holder without damaging it is not feasible. Any type of manufacturing technique can be used for this purpose. Although an integral construction is preferred, the substrate holder can also be designed such that the pin elements and / or sealing devices can be inserted, for example, in the sense of a kit. This structural approach particularly allows the pin elements and / or sealing devices to be made of materials different from those of the fixing components or the base.

[0028] Particularly preferred is the integration of multiple additional pin elements into a common sealing device. This allows a single common sealing device to be used for multiple additional pin elements. This has proven advantageous, for example, in the manufacture of substrate holders, as it eliminates the need for additional individual elements. Furthermore, this contributes to the stability of the substrate holder. Preferably, the additional pin elements are arranged in a row within the common sealing device, said row particularly preferably following substantially the direction of extension of the sealing device, especially when dealing with strip-shaped sealing devices. It is also conceivable that multiple rows of additional pin elements are integrated into the sealing device. Here, it is conceivable that the additional pin elements are centrally located or offset from the center of the sealing device in the radial direction or in a direction perpendicular to the direction of extension of the separation region.

[0029] Furthermore, it is preferably proposed that the corresponding pin spacing between adjacent pin elements or other pin elements on one side and other pin elements or pin elements on the other side is substantially constant along a predetermined direction. Thus, at least in the predetermined direction, a uniform distribution of the support surfaces provided by the pin elements and / or other pin elements can be achieved. Particularly preferably, the predetermined direction extends along a direction parallel to the planned bonding direction or perpendicular to the direction of the bonding wave. This simplifies control during the bonding process, for example. The pin element spacing is preferably a reduced amount. In particular, the support surfaces provided by the pin elements and / or other pin elements are arranged uniformly, especially equidistantly, from each other along the predetermined direction.

[0030] The pin element and / or other pin elements have at least three geometric parameters: pin element diameter or pin element cross-section, pin element height, and pin pitch.

[0031] Preferably, the pin spacing is between 0.1 mm and 10 mm, more preferably between 0.2 mm and 5 mm, more preferably between 0.5 mm and 2.5 mm, most preferably between 1.0 mm and 2.0 mm, and most preferably approximately 1.5 mm. This results in the advantage that, by reducing the pin spacing at the substrate holder, the substrate, fixed by pressure difference, experiences less local bending. Therefore, as the pin spacing decreases, it approaches a complete, ideal, and flat surface. This has a positive impact on the processing.

[0032] The substrate holder is designed to achieve the smallest possible pin element spacing. The pin element spacing is explained in particular in terms of the grid used to create the pin elements.

[0033] If the pin elements are manufactured along a square grid, the pin element spacing is preferably understood as the spacing between the pin elements along the mutually orthogonal sides of the square. Therefore, the pin element spacing is preferably not interpreted as the spacing between two pin elements along the diagonal of the square.

[0034] If the pin elements are manufactured along a hexagonal grid, which is the preferred embodiment, then the pin element spacing is understood as the spacing between a pin element and its six nearest neighbors. In this case, the highest possible symmetry is achieved.

[0035] If the pin elements are manufactured along a centered rectangular grid, a right-angled grid, or a beveled grid, or if the pin elements are even distributed in random locations, then only a statistical interpretation of the pin element spacing is meaningful.

[0036] The pin spacing is preferably approximately the same in all directions. In particular, those skilled in the art will understand "approximately" to mean that the difference between two pin spacings is less than 10%, preferably less than 5%, more preferably less than 1%, most preferably less than 0.1%, and most preferably less than 0.01%. It is also conceivable that the pin spacing in the tangential or circumferential direction differs from the pin spacing in the radial direction. In particular, it is conceivable that the pin positions are distributed along a hexagonal grid, which would result in a high degree of symmetry.

[0037] In pin elements that deviate from cylindrical symmetry, the term "pin element diameter" is used synonymously as a typical geometric dimension of the pin element's cross-section. For example, if the pin element has a square cross-section, the pin element diameter can be understood either as the length of its diagonal or its side length. Similar considerations apply to other geometric cross-sections. It is also conceivable that if the pin element is manufactured, for example, as a cone, the pin element has a diameter that decreases from bottom to top. The pin element diameter, or cross-section, is a measure of its width.

[0038] The pin element height represents the distance from the base plane to the pin element surface, i.e., the support surface. The ratio between the pin element height and the pin element diameter should not be too large so as not to exceed the Euler buckling load.

[0039] The diameter of the pin element is between 0.01 mm and 5.0 mm, preferably between 0.05 mm and 1.0 mm, more preferably between 0.075 mm and 0.75 mm, most preferably between 0.1 mm and 0.5 mm, and most preferably about 0.3 mm.

[0040] The height of the pin element is between 0.01 mm and 2 mm, preferably between 0.02 mm and 1.5 mm, more preferably between 0.025 mm and 1.0 mm, most preferably between 0.03 mm and 0.5 mm, and most preferably between 0.1 mm and 0.15 mm.

[0041] A sealing device has at least three geometric parameters: sealing device width, sealing device height, and sealing device retraction. The sealing device width describes the width of the sealing device.

[0042] The sealing device width describes the width of the sealing device, particularly the width measured radially from the center of the substrate holder. The sealing device width is between 0.01 mm and 10 mm, preferably between 0.05 mm and 7.5 mm, more preferably between 0.075 mm and 5.0 mm, most preferably between 0.1 mm and 1.0 mm, and most preferably approximately 0.5 mm. The sealing device width can be wide enough to include multiple rows of pin elements. Therefore, the sealing device width can be greater than the pin element spacing.

[0043] The sealing device height specifies the distance from the base plane of the substrate holder to the surface of the sealing device. The sealing device height must be less than the pin element height to ensure that additional pin elements protrude.

[0044] The retraction amount of the sealing device describes the distance from the pin element surface to the sealing device surface. This is the distance that the tool, preferably a cutting tool, especially a milling cutter, removes material from the pin element height to create the sealing device height. The sum of the sealing device height and the sealing device retraction amount equals the pin element height. Therefore, giving either the sealing device height or the sealing device retraction amount would be redundant. Nevertheless, both are used: the former is for obtaining a quick estimate of the height, and the latter is for knowing how much material the tool must remove to create the sealing device surface.

[0045] The retraction of the sealing device is less than 100µm, preferably less than 10µm, more preferably less than 1µm, most preferably less than 100nm, and most preferably less than 10nm. Therefore, the sealing device should be as close as possible to the substrate, but not in contact with it.

[0046] The preferred embodiment proposes that all pin elements, regardless of their position at the substrate holder, have the same pin element height as other pin elements. This ensures that the substrate is always placed at the same height along the entire surface.

[0047] It is also conceivable that the height of the pin element varies with its position. For example, it is conceivable that the elastic properties of the pin element on the sealing device differ from those of the pin element outside the sealing device due to the sealing device below it. In this case, it might be desirable to make the pin element on the sealing device slightly larger or slightly smaller than other pin elements to account for the altered elastic properties.

[0048] The following describes some implementation methods by which a correspondingly high pin element density can be achieved.

[0049] In a first exemplary embodiment of the invention, the sealing device is designed such that it is positioned between pin elements without removing a single pin element.

[0050] In a second exemplary embodiment of the invention, the sealing device is designed such that a pin element is located on the sealing device. A pin element directly connected to the base plane is simply referred to as a pin element, and a pin element located on the sealing device is referred to as an additional pin element or sealing device pin element. The height of the pin element is preferably the same as the sum of the height of the sealing device and the height of the additional pin element. In other words, the tops of the pin element and the additional pin element are preferably in the same plane. The additional pin element creates a vacuum leak on the sealing device. Therefore, preferably, the height of the additional pin element must be as small as possible, and / or multiple sealing devices with additional pin elements must be sequentially generated, resulting in a separation area that acts as a separator.

[0051] In a third exemplary embodiment of the invention, all pin elements have the same height; however, some pin elements are surrounded by a sealing device, i.e., they also terminate at the base plane of the substrate holder. Preferably, the pin elements in the sealing device are produced by circular material removal. The tooling must operate with corresponding precision.

[0052] In a fourth exemplary embodiment of the invention, features of the second and third embodiments are combined. At least one sealing device for at least one separation region is wide enough that the sealing device includes at least two rows of pin elements. The pin elements of the pin element rows can then be produced according to the second embodiment, the third embodiment, or a combination of these embodiments.

[0053] Another subject of the invention is a method for manufacturing a substrate holder according to the invention, preferably by means of removing material to form pin elements, sealing devices, and / or additional pin elements. All the advantages and characteristics described for the substrate holder can be similarly applied to this method, and vice versa.

[0054] The substrate holder preferably comprises a material from one of the following material categories:

[0055] • Preferably made of ceramic, especially

[0056] o SiC, Si3N4

[0057] Pure metals, especially

[0058] o Aluminum

[0059] Pure metal alloys

[0060] Nickel-based alloys, copper-based alloys, aluminum-based alloys

[0061] • Metal-carbon alloys

[0062] o steel, especially

[0063] Free-cutting steel

[0064] Tool steel

[0065] In the preferred, integrated configuration, the pin element and the sealing device are made of the same material, as they are manufactured from the substrate holder.

[0066] The substrate holder is fabricated using at least one of the following manufacturing methods:

[0067] • Cutting processes, especially

[0068] milling

[0069] • Chemical processing, especially in combination with the following

[0070] o Photolithography, especially

[0071] • Photolithography

[0072] Imprint lithography

[0073] DMD Exposed

[0074] o Development

[0075] o Strippen

[0076] o cover

[0077] o Etching

[0078] Ion beam processing

[0079] • Sandblasting should be performed after pre-masking areas that should not be sandblasted.

[0080] Laser processing

[0081] Casting

[0082] Suppression

[0083] Forging

[0084] • Hot stamping

[0085] • Imprinting, followed by thermosetting or electromagnetic curing.

[0086] 3D printing

[0087] The processing method used is preferably to produce pin elements and sealing devices from semi-finished products through material removal, casting, or plasticizing processes.

[0088] The following manufacturing methods remove material from a semi-finished product to produce a substrate holder: all cutting processes, especially milling; all chemical processing, especially etching methods; ion beam processing; sandblasting; and laser processing.

[0089] The casting manufacturing method produces a substrate holder from a solidified melt.

[0090] The manufacturing methods include pressing, forging, and hot stamping, which plasticize the semi-finished product, preferably a circular disc, by applying the material, especially repeatedly or for a longer period of time, to the semi-finished product using molds and / or forging tools.

[0091] In the embossing manufacturing method, the embossing material is embossed and then thermally cured and / or cured by means of electromagnetic radiation.

[0092] In 3D printing manufacturing, components are constructed by using lasers to solidify and sinter powder point by point. This method is also commonly referred to as additive manufacturing.

[0093] Another subject of the invention is a method for holding a substrate by means of a substrate holder according to the invention, preferably within the scope of a processing procedure. All the advantages and characteristics described for the substrate holder can be similarly applied to the subject of this method, and vice versa. Attached Figure Description

[0094] Other advantages, features, and details of the invention will become apparent from the following description of preferred embodiments and from the accompanying drawings. The drawings show:

[0095] Figure 1 Showing top view and enlarged view of the prior art,

[0096] Figure 2 Showing a top view and enlarged view of the substrate holder,

[0097] Figure 3 Partial top and side views of the first embodiment are shown.

[0098] Figure 4 Partial top and side views of the second embodiment are shown.

[0099] Figure 5 Partial top and side views of the third embodiment are shown.

[0100] Figure 6 Partial top and side views of the fourth embodiment are shown, as well as

[0101] Figure 7 This shows a partial side view of the application. Detailed Implementation

[0102] In the accompanying drawings, the same components or components with the same function are indicated by the same reference numerals.

[0103] Figure 1The diagram shows schematic, non-scaled top and side views of the separation region 4, which includes various sealing devices 5. PA This is an exemplary separation region 4 as known from the prior art. For manufacturing the sealing device 5 PA Along the sealing device 5 PA All pin elements 6 are removed. This disrupts the uniformity of the pin element surface density. Here, the sealing device 5... PA Having the same height as pin element 6, it produces the negative effects mentioned above.

[0104] Figure 2 A schematic, non-scale, simplified top view of a substrate holder 1 is shown, comprising multiple zones 2, 2', particularly a first zone 2 and another zone 2', each zone having a fixing element 3, particularly a vacuum fixing device. Zones 2, 2' are separated from each other by a separation region 4. The separation region 4 typically includes at least one sealing device 5 (in... Figure 2 The example shown is based on Figure 4 The sealing device 5', but it is also conceivable that... Figure 3 or Figures 5 to 7 Alternative sealing devices 5', 5'', 5''' are used. In special cases, the separation region 4 may also have only a single sealing device 5. The sealing devices 5 of the separation region 4 are not shown in the (unenlarged) top view for space reasons. Therefore, enlarged view B shows a schematic, non-scaled, simplified enlarged top view of the separation region 4, which has three sealing devices 5' that separate the first region 2 from the second region 2'. In the illustrated embodiment, there are two rows of pin elements 6 between each sealing device 5'. It can also be seen that there are additional pin elements 6' in the region of the sealing device 5', which are preferably configured to protrude from the substrate holder or sealing device 5' on the side facing the substrate 7 during operation. Thus, the additional pin elements 6' are integrated into the sealing device 5'. In this way, the separation region 4 thus created cannot hermetically vacuum seal the two regions 2 together when the substrate 7 (not shown) is placed on it. Due to the dimensions of the pin element 6 and / or other pin elements 6' detailed below and / or the preferred use of multiple sealing devices 5' for each separation zone 4, a sealing device labyrinth is created, which at least makes the passage of fluid, especially gas, between the two zones 2 difficult or slow. This increases flow resistance. Consequently, adjacent zones 2 can operate at different vacuum or pressure levels. On the other hand, the distance between the pin element 6 and / or other pin elements 6' can be further minimized. With this design, it is advantageous to manufacture or place the sealing devices 5' between the pin elements 6, and especially to make economical use of structural space as much as possible.

[0105] Figure 3 The diagram shows a schematic, non-scaled top and side view of a separation region 4 in a first exemplary embodiment of the invention, the separation region including a sealing device 5. The pin elements 6 are arranged in a hexagonal grid, which has the advantage that each pin element 6 has the same spacing p as its nearest neighbor. p (English: pin pitch). This pin element arrangement achieves exceptionally high uniformity and isotropy. The sealing device 5 is manufactured between the pin elements 6 on one hand, and on the other hand, has a non-zero, but preferably very small, retraction amount s. r (English: seal recess). Contrary to existing technology, instead of removing the pin elements 6, the sealing device 5 is placed between the pin elements 6. In the illustrated embodiment, the sealing device 5 is designed in a strip shape, wherein the strip-shaped sealing device 5 has a substantially straight orientation. However, a wavy or other orientation of the sealing device 5 is also conceivable. For example, the sealing device 5 meanders slightly around the pin elements 6, i.e., not as... Figure 3 It is as straight as in the middle. However, this additional illustration is omitted. Since it is not necessary to remove pin element 6, the pin element surface density can remain constant in the separation region 4. Figure 3 In certain special cases, separation zone 4 has only one sealing device 5. It is conceivable that separation zone 4 may have multiple such sealing devices 5.

[0106] Figure 4 Schematic, non-scaled top and side views of the separation region 4 in a second exemplary embodiment of the invention are shown, the separation region comprising three sealing devices 5'. In this case, pin elements 6, 6' are arranged along a square grid. Other grids, particularly hexagonal grids, are also conceivable. This embodiment has pin elements 6 directly connected to the base plane of the substrate holder 1, and additional pin elements 6' on the sealing devices 5'. This compact construction, compared to... Figure 3 Compared to the solution where only the pin elements 6 are arranged between the sealing devices 5, as exemplarily shown in the example, a narrower spacing p between the pin elements 6 and the other pin elements 6' can be selected. p (English: pin pitch). Preferably, the pin pitch between the two pin elements 6 and the pitch between pin element 6 and the other pin element 6' are the same. The pin elements 6 and the other pin elements 6' are equidistant, particularly along the radial direction from the center of the substrate holder or along the planned bonding direction. This maintains the uniformity of the pin element distribution of the pin elements 6, 6' on the sealing device 5'. However, it is also conceivable that the pin pitch between the two pin elements 6 and the pin pitch between pin element 6 and the other pin element 6' are different. The pin elements 6 and the other pin elements 6' have a pin element diameter p. d(Pitch diameter) and / or cross-sectional area, the cross-sectional area being determined, for example, by a contact surface or support surface, with pin element 6 or another pin element 6' contacting substrate 7 with said contact surface or support surface, and / or the cross-sectional area being measured in a direction perpendicular to the extension direction of pin element 6 or another pin element 6'. If pin element 6 and / or another pin element 6' have a geometry that deviates from a circular shape, the pin element diameter p should be reinterpreted accordingly. d For example, if the geometry is a square, then the parameter p d It is the side length of the square or the length of its diagonal. Pin element 6 has a pin element height p. h (English: pitch height). Sealing devices have a width of s. w (English: seal width) and height s h (English: seal height) and recesses, indentations, or retractions. r (English: seal recess). Therefore, height s h This can also be interpreted as the height of the pin element 6' relative to the surface of the sealing device 5'. In particular, Figure 4 The implementation variant has proven particularly advantageous because it can be manufactured relatively simply.

[0107] Figure 5 Schematic, non-scaled top and side views of the separation region 4 in a third exemplary embodiment of the invention are shown, the separation region being formed by three sealing devices 5''. Renaming of dimensions is omitted. These dimensions can be derived from... Figure 4 As described in the description, this embodiment only has pin elements 6 directly connected to the base plane of the substrate holder 1 and a sealing device 5''. However, additional pin elements 6 within the sealing device 5'' extend to the base plane of the substrate holder 1 and are completely surrounded by the sealing device 5''. These additional pin elements are integrated into the sealing device 5''. This embodiment has the advantage that the mechanical, and especially elastic, properties of all pin elements 6 are identical because the geometric parameters of the pin elements are consistent. The manufacturing tools required for this must be able to cut out areas from the sealing device 5''.

[0108] Figure 6 Schematic, non-scaled top and side views of the separation region 4 in a fourth exemplary embodiment of the invention are shown, the separation region including three sealing devices 5'', 5'''. It can be seen that the sealing devices 5''' extend across three rows of pin elements, thereby implementing such that the two outer rows of pin elements, according to the second embodiment (see...),... Figure 4The material is manufactured according to the third embodiment of the invention (see [reference]). Figure 5 Manufacturing. Therefore, the fourth embodiment according to the invention is a combination of two other embodiments. Furthermore, it should be indicated that the sealing device 5''' can extend across multiple rows of pin elements. Correspondingly, the sealing device 5''' has different sealing device widths s w In the fourth embodiment, it is not necessarily necessary to combine the second and third embodiments. It is also conceivable that the width s of the sealing device... w It includes at least two rows of pin elements, the pin elements of which are designed only according to the second embodiment. Similarly, a sealing device comprising a sealing device width s of at least two rows of pin elements is conceivable. w The pin element 6 or other pin element 6' in the pin element row is designed only according to the third embodiment. The distinguishing feature is then only the width s of the sealing device. w Furthermore, it should be noted that different sealing devices, exemplarily sealing devices 5'', 5''', can also be combined within a single separation region 4. For the sake of overview, illustrations of all possible combinations are omitted. Those skilled in the art will recognize and understand how embodiments and parameters can be combined with each other to manufacture arbitrary sealing devices and separation regions.

[0109] All pin elements 6, 6' and sealing devices 5, 5', 5'', 5''' shown in the accompanying drawings are either integrally shown or designed as an integrated or monolithic unit, i.e., made from the same component. For completeness, it is mentioned again that the sealing devices 5, 5', 5'', 5''' and / or pin elements 6, 6' could theoretically also be individual components inserted into the substrate holder 1. This type of implementation can be used with a lower density of pin elements and sealing devices. Furthermore, by selecting the individual sealing devices 5, 5', 5'', 5''' and / or pin elements 6, 6', different materials from the substrate holder 1 can be used.

[0110] Figure 7 A fourth embodiment according to the present invention is shown (see Figure 6A schematic, non-scaled side view of separation region 4, comprising three sealing devices 5'', 5''', on which a substrate 7 is placed. On the left side of the side view is region 2 with pressure p1 generated by a vacuum clamping device. On the right side of the side view is region 2' with pressure p2 generated by a vacuum clamping device. These two pressures p1 and p2 do not necessarily have to be the same. However, separation region 4 creates a sealing device labyrinth, which significantly hinders fluid flow from one region to another. If the pumps used for regions 2, 2' operate efficiently enough, the desired pressures p1 and p2 can be checked, controlled in both open and closed loops. Preferably, however, the substrate 7 does not contact the sealing device surfaces of the sealing devices 5'', 5''' at any time, and the pin spacing of the pin elements 6, 6' can not only be designed to be minimal but ideally also uniform.

[0111] List of reference numerals

[0112] 1. Substrate holder

[0113] 2,2' zone

[0114] 3. Fixing elements

[0115] 4. Separation area

[0116] 5 PA , 5, 5', 5'', 5''' Sealing equipment

[0117] 6, 6' pin components, additional pin components

[0118] 7 Substrate

[0119] ph pin component height

[0120] pd pin component diameter

[0121] PP pin spacing

[0122] sw, sw' Width of sealing equipment

[0123] sh sealing equipment height

[0124] SR sealing equipment retraction amount

Claims

1. A substrate holder (1) for holding a substrate (7) during a processing procedure, such as a bonding process, a photolithography process, a coating process, and / or a cleaning process, wherein the substrate holder (1) has a separation region (4) for separating regions with different pressure levels, the pressure levels occurring between the substrate holder (1) and the substrate (7) when holding the substrate (7), wherein the separation region (4) has at least: -- Sealing device (5, 5', 5'', 5'''), and -- Pin element (6) and / or additional pin element (6'). in -- The pin element (6') and / or the other pin element (6') and -- The sealing device (5, 5', 5'', 5''') Designed such that, in order to form a contactless sealing area, while holding the substrate (1), the pin element (6) and / or the additional pin element (6') at least partially prevent contact between the sealing device (5, 5', 5'', 5''') and the substrate (1) in the separation area (4).

2. The substrate holder (1) according to claim 1, wherein the pin element (6) and / or the additional pin element (6') protrude relative to the sealing device (5, 5', 5'', 5''').

3. The substrate holder (1) according to any one of the preceding claims, wherein the additional pin element (6') is integrated into the sealing device (5, 5', 5'', 5''').

4. The substrate holder (1) according to claim 3, wherein the additional pin element (6') is disposed on the sealing device (5, 5', 5'', 5''') in order to integrate the additional pin element (6') into the sealing device (5, 5', 5''', 5''').

5. The substrate holder (1) according to claim 3 or 4, wherein, in order to integrate the additional pin element (6') into the sealing device (5, 5', 5'', 5'''), the additional pin element (6') is at least partially, preferably circumferentially, and particularly preferably completely circumferentially surrounded by the sealing device (5, 5', 5'', 5'''), and is preferably embedded in a recess in the sealing device (5, 5', 5'', 5''').

6. The substrate holder (1) according to any one of the preceding claims, wherein the substrate holder (1) has a first region (2) and a second region (2'), wherein the first region (2) is separated from the second region (2') by the separation region (4).

7. The substrate holder (1) according to claim 6, wherein the separation region (4) has a plurality of sealing devices (5, 5', 5'', 5'''), particularly a plurality of sealing devices each having an additional pin element (6'), wherein the sealing devices (5, 5', 5'', 5''') are arranged sequentially along a direction extending from the first region (2) to the second region (2').

8. The substrate holder (1) according to any one of the preceding claims, wherein the separation region (4) has a self-closing orientation, such as a frame-shaped orientation.

9. The substrate holder (1) according to any one of the preceding claims, wherein the lateral extension of the sealing device (5, 5', 5'', 5''') is greater than the lateral extension of the additional pin element (6').

10. The substrate holder (1) according to any one of the preceding claims, wherein - The pin element (6) and / or the additional pin element (6') and the sealing device (5, 5', 5'', 5'''), or - Preferably, the substrate holder (1) Overall design.

11. The substrate holder (1) according to any one of the preceding claims, wherein a plurality of additional pin elements (6') are integrated in a common sealing device (5, 5', 5'', 5''').

12. The substrate holder (1) according to any one of the preceding claims, wherein the pin element spacing is between 0.1 mm and 10 mm, preferably between 0.2 mm and 5 mm, more preferably between 0.5 mm and 2.5 mm, most preferably between 1.0 mm and 2.0 mm, and most preferably about 1.5 mm.

13. The substrate holder (1) according to any one of the preceding claims, wherein the corresponding pin spacing between adjacent pin elements (6) or other pin elements (6') on one side and other pin elements (6') or pin elements (6) on the other side is substantially constant along a predetermined direction.

14. A method for manufacturing a substrate holder (1) according to any one of the preceding claims, preferably by means of removing material to form a pin element (6), a sealing device (5, 5', 5'', 5''') and / or an additional pin element (6').

15. A method for holding a substrate (7) by means of a substrate holder (1) according to any one of claims 1 to 13, preferably within the scope of a processing procedure.

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