Integrated heat exchanger

Abstract

The utility model discloses an integrated heat spreader, which at least includes a metal upper cover plate, a metal lower cover plate, a working space, a capillary structure and a working fluid. The metal upper cover plate includes a condensation inner surface, the condensation inner surface has a plurality of upper grooves arranged in parallel to each other and a plurality of support structures protruding between the grooves. The metal lower cover plate includes a heat-absorbing outer surface and an evaporation inner surface, the heat-absorbing outer surface has at least one recessed space for accommodating a heat-releasing element, and the evaporation inner surface has a plurality of lower grooves arranged in parallel to each other. The working space is an airtight space formed by the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate being joined to each other, and the plurality of support structures extend from the condensation inner surface and abut between the lower grooves of the evaporation inner surface to support the working space. The capillary structure is located in the lower groove. The working fluid exists in the working space and the capillary structure.

Description

Technical Field

[0001] This utility model relates to a heat spreader, and more particularly to an integrated heat spreader. Background Technology

[0002] High-power electronic components are the next generation of semiconductor components. With the popularization of 5G communication and artificial intelligence, data center servers are required to operate at higher frequencies and have more functions. However, to meet the needs of high-speed communication and computing, high-power electronic components or chip processors inevitably generate a lot of heat due to their high power density. If the heat generated by the increasing heat cannot be effectively and timely dissipated, it will greatly affect the reliability of the electronic components and limit their application development. Therefore, it is necessary to adopt more efficient cooling systems or modules to accelerate heat dissipation and ensure the stable operation of the chip.

[0003] With the development of 5G communication, chiplet packaging is expected to become a new trend in advanced manufacturing processes. Therefore, major international companies such as Intel, TSMC, ASE, AMD, Arm, Microsoft, and Qualcomm have announced the formation of the UCIe (Universal Chiplet Interconnect Express) industry alliance to integrate multiple chiplets into a single package for faster computing speeds. It is anticipated that integrating multiple chiplets will generate more heat than before. If the cooling system does not keep pace with this integration, the accumulated heat cannot be dissipated effectively and promptly, potentially leading to instability in the overall chip system. Common cooling systems involve attaching a thermally conductive metal shell to the heat-generating electronic components, such as the CPU and GPU, using thermal paste. This allows heat to dissipate across the entire metal shell. Then, a finned heatsink is attached to the metal shell with thermal paste, and high-speed fans or water cooling are used to accelerate heat dissipation. However, with the rapid increase in the processing speed of electronic components today, the current heat dissipation efficiency is no longer sufficient to effectively and promptly remove the massive amounts of heat generated during electronic component operation. Therefore, the new generation of heat dissipation modules incorporates the most efficient heat dissipation plate currently available and places it between the aforementioned metal protective shell and the heat sink, thereby removing a large amount of heat generated by the electronic components quickly.

[0004] A vapor chamber heat exchanger utilizes the phase change of the working fluid within its sealed chamber for rapid heat dissipation, representing the most efficient heat transfer method currently available. It leverages the substantial latent heat of vaporization involved in the rapid vaporization and condensation of the working liquid within the near-vacuum chamber to achieve rapid heat dissipation. The thermal conductivity of a vapor chamber heat exchanger can reach 10000 W / (m²). 2With a temperature of ℃ or above, it can achieve a heat conduction efficiency that is dozens of times higher than that of traditional air convection or liquid convection, and the overall thickness of the heat spreader can be as low as about 3.0 mm. It is currently widely used in thin mobile devices and thin laptops.

[0005] However, when a large amount of heat is generated from electronic components, it must first be conducted and dispersed to the metal protective case using thermal paste. Then, the thermal paste further conducts the heat from the metal protective case to the heat spreader, where it quickly dissipates the heat. The thermal paste's heat dissipation efficiency is far lower than that of a typical metal protective case and heat spreader, becoming the largest thermal obstacle in the overall cooling system and severely reducing the heat dissipation efficiency of the heat spreader. Furthermore, to ensure close and smooth contact with the electronic components and effective heat transfer to the metal protective case, the material used for the metal protective case is mostly high-hardness, non-deformable aluminum-magnesium alloy or other alloys. Softer but highly thermally conductive pure copper cannot be used as the metal protective case, thus also contributing to the thermal resistance of the overall cooling system. In order to improve heat dissipation efficiency, and in view of the above-mentioned problems, this utility model proposes an integrated heat spreader. The heat spreader is made of pure copper with high hardness by cold forging. A recessed space is reserved on the heat-absorbing surface of the heat spreader to accommodate and directly contact electronic components. The original metal protective shell and the heat spreader are integrally forged from the same metal sheet to form an integrated heat spreader, eliminating the thermal resistance caused by the heterogeneous interface between electronic components and heat spreader, thereby improving heat dissipation efficiency.

[0006] In addition to being used for heat dissipation of single electronic components, the integrated heat spreader of this invention can also be used to accommodate multiple chip packages integrated into 5G communication in the future. Multiple accommodating spaces conforming to the chip shape can be reserved on the heat-absorbing surface of the heat spreader, and the protective shell of multiple chips and the heat spreader can be directly integrated into one piece. The heat spreader can directly contact the chipset to accelerate the heat conduction efficiency, and there is no need to use thermal paste as a medium. It can be used for heat dissipation of multiple chips in mobile devices.

[0007] Furthermore, the integrated heat spreader of this invention uses a cold forging process to shape metal sheets (e.g., copper), followed by CNC finishing. Since the metal does not require preheating and annealing during the forging process, the internal grain structure of the forged metal does not suffer from porosity or enlarged structure due to annealing, thus preventing a decrease in thermal conductivity. Conversely, the cold-forged metal, without a heating process, maintains a relatively dense internal grain structure. Moreover, the forged metal exhibits improved rigidity and density, and testing shows further increases in its thermal conductivity and thermal diffusivity. Utility Model Content

[0008] The purpose of this invention is to provide an integrated heat spreader.

[0009] One embodiment of this utility model proposes an integrated heat spreader, comprising at least a metal upper cover plate, a metal lower cover plate, a working space, a capillary structure, and a working fluid. The metal upper cover plate includes a heat dissipation outer surface and a condensation inner surface. The condensation inner surface has a frame of appropriate height around its perimeter, with upper channel grooves on the frame. The condensation inner surface has a plurality of parallel upper grooves and a plurality of supporting structures protruding between the grooves. The metal lower cover plate includes a heat absorption outer surface and an evaporation inner surface. The heat absorption outer surface has at least one recessed space for accommodating a heat dissipation element. The evaporation inner surface has a frame of appropriate height around its perimeter, with lower channel grooves on the frame. The evaporation inner surface has a plurality of parallel lower grooves. The working space is an airtight space formed by the interlocking upper and lower edges of a metal upper cover and a metal lower cover. The condensing inner surface of the upper cover and the evaporating inner surface of the lower cover face each other, and the upper and lower grooves are aligned and overlapped. A plurality of supporting structures protrude from the condensing inner surface and abut against the lower grooves on the evaporating inner surface to support the working space. An exhaust channel, formed by the corresponding interlocking of upper and lower channel grooves, is used to evacuate air from the working space. A capillary structure is located within the lower groove. The working fluid exists within the working space and the capillary structure.

[0010] The metal upper cover plate, including the supporting structure, is integrally forged from a metal sheet using a cold forging method, and the metal lower cover plate is integrally forged from a metal sheet using a cold forging method.

[0011] The metal sheet is made of pure copper, and the upper and lower cover plates have a Vickers hardness of approximately 90HV to 120HV.

[0012] The metal sheet is made of pure copper, and the upper and lower cover plates have a thermal conductivity of approximately 400 W / (m·K) to 430 W / (m·K).

[0013] The upper cover and the lower cover have a thermal diffusivity of approximately 90 mm. 2 / sec~120mm 2 / sec.

[0014] The supporting structure is columnar.

[0015] There are multiple recessed spaces, which are used to accommodate multiple electronic components.

[0016] Each of these recessed spaces has the same or different shapes and volumes, and is used to simultaneously accommodate multiple electronic components of the same or different shapes and volumes.

[0017] The recessed space is recessed from the heat-absorbing outer surface toward the evaporating inner surface, but does not protrude from the corresponding evaporating inner surface.

[0018] The upper metal cover and the lower metal cover are joined together by welding.

[0019] The working fluid is pure water.

[0020] The air pressure in this workspace is less than 1x10. -3 torr. Attached Figure Description

[0021] Figures 1-3 This is a schematic diagram of a common heat dissipation module.

[0022] Figure 4 and Figures 5A-5B This is a schematic diagram of an integrated heat spreader structure according to an embodiment of the present invention.

[0023] Figures 6A-6B This is a schematic diagram of the metal top cover structure of an integrated heat spreader according to an embodiment of the present invention.

[0024] Figures 7A-7B This is a schematic diagram of the metal lower cover plate structure of an integrated heat spreader according to an embodiment of the present invention.

[0025] Figures 8A-8B This is a schematic diagram of the metal lower cover structure of the integrated heat spreader according to another embodiment of the present invention.

[0026] Figure 9 This is a schematic diagram of the application of the metal lower cover plate of the integrated heat spreader, which is another embodiment of the present invention.

[0027] Explanation of reference numerals in the attached drawings: 10, 20, 30 - Prior art heat dissipation modules; 80 - Schematic diagram of the heat spreader of this utility model; 100 - Substrate; 200 - Electronic components; 300 - Metal protective shell; 400 - Thermal paste; 500 - Heat sink; 600 - Heat spreader (prior art); 800 - Metal upper cover plate; 810 - Heat dissipation outer surface; 820 - Condensation inner surface; 830 - Upper groove; 840 - Support structure; 880 - Upper frame; 881 - Upper channel groove; 900, 901 - Metal lower cover plate; 910 - Heat absorption outer surface; 920 - Evaporation inner surface; 930 - Lower groove; 940 - Recessed space; 980 - Lower frame; 981 - Lower channel groove; 1010 - Welding groove; 1020 - Working space; 1040 - Capillary structure; 1080 - Air extraction channel. Detailed Implementation

[0028] The following description, with reference to the accompanying drawings, illustrates embodiments of the integrated heat spreader of this invention. For clarity and ease of illustration, the dimensions and proportions of the components in the drawings may be exaggerated or reduced. In the following description and / or claims, technical terms used should be interpreted in the sense commonly understood by those skilled in the art. For ease of understanding, the same elements in the following embodiments are indicated by the same symbols. In this specification, the term "about" generally refers to an actual value within plus or minus 10%, 5%, 1%, or 0.5% of a specific value or range. The term "about" here means that the actual value falls within the acceptable standard error of the average value, as determined by those skilled in the art to which this invention pertains. Except as otherwise expressly stated, ranges, quantities, values, and percentages used herein are all modified by the term "about." Therefore, unless otherwise stated, the values ​​or parameters disclosed in this specification and claims are approximate values ​​and are subject to change as needed.

[0029] Please see Figure 1 It is a typical heat dissipation module 10 used for electronic components such as CPUs or GPUs, including: a substrate 100, electronic components 200, a metal protective shell 300 and a heat sink 500; wherein, the heat-generating electronic components 200 are first attached to the metal protective shell 300 with thermal paste 400, and then the heat sink 500 is attached to the outer surface of the metal protective shell 300 with thermal paste 400 to accelerate heat dissipation.

[0030] With the increasing computing power of electronic components, conventional heat dissipation modules are no longer efficient enough. Therefore, to further improve heat dissipation capabilities, the new generation of heat dissipation modules incorporates a vapor chamber 600, which has a heat dissipation efficiency dozens of times higher than traditional convection cooling. Common designs include... Figure 2 The heat dissipation module 20 shown inserts a heat spreader 600 between the metal protective shell 300 and the heat sink 500 of a traditional heat dissipation module. Thermal paste 400 is applied between the heat spreader 600 and the metal protective shell 300 or the heat sink 500 to ensure tight adhesion. However, compared to traditional heat dissipation modules, this approach adds an extra layer of thermal paste 400 with a lower thermal conductivity within the heat dissipation system, causing the overall heat dissipation system to be unable to achieve its heat dissipation efficiency due to the additional thermal resistance.

[0031] To avoid increasing thermal resistance, please refer to Figure 3Another design for the heat dissipation module 30 involves directly attaching the heat spreader 600 to the electronic component 200 using thermal paste 400. When heat is generated from the electronic component 200, the heat is transferred through the thermal paste 200 to the heat spreader 600, which has a higher heat dissipation efficiency. After absorbing heat, the working fluid inside the heat spreader 600 quickly vaporizes to form steam. Since a heat sink 500 is connected above the heat spreader 600, when the steam rises rapidly and comes into contact with the cooler surface of the heat sink 500, the steam condenses and releases a large amount of heat through a phase change. This large amount of heat is then conducted to the heat sink 500 through the thermal paste 400, and then carried away by air convection. Since the total thickness of the heat spreader 600 is generally only about 3mm, the biggest problem with this approach is that the heat spreader 600, made of relatively soft pure copper, is prone to deformation and warping under long-term use. This causes the electronic component 200 and the heat spreader 600 to lose their complete seal, resulting in ineffective heat transfer and increased thermal resistance. Inspired by this, the creator of this invention uses cold forging and reserves space for electronic components on the heat-absorbing surface of the heat-absorbing plate under the heat-absorbing plate to produce a heat-absorbing plate with high hardness, resistance to deformation, and the ability to cover electronic components 200, thereby improving heat dissipation efficiency.

[0032] Please see Figure 4 and Figures 5A-5BThe integrated heat spreader 80, as an embodiment of the present invention, includes at least: a metal upper cover plate 800, including a heat dissipation outer surface 810 and a condensation inner surface 820, the condensation inner surface 820 having an upper frame 880 of appropriate height around its periphery, the upper frame 880 having an upper channel groove 881, and the condensation inner surface 820 having a plurality of parallel upper grooves 830 and a plurality of support structures 840 protruding between the grooves; and a metal lower cover plate 900, including a heat absorption outer surface 910 and an evaporation inner surface 920, the heat absorption outer surface 910 having at least one recessed space 940 for accommodating a heat dissipation element, the evaporation inner surface 920 having a lower frame 980 of appropriate height around its periphery, the lower frame 980 having a lower channel groove 981, and the evaporation inner surface 920 having a plurality of parallel lower grooves 930. The working space 1020 is an airtight space formed by the interlocking of the upper frame 880 of the upper metal cover plate 800 and the lower frame 980 of the lower metal cover plate 900. The condensing inner surface 820 of the upper metal cover plate 800 and the evaporating inner surface 920 of the lower metal cover plate 900 are opposite to each other, and the upper groove 830 and the lower groove 930 are arranged to map and overlap each other. The plurality of support structures 840 protrude from the condensing inner surface 820 and abut against the lower groove 930 of the evaporating inner surface 920 to support the working space 1020. The air extraction channel 1080 is formed by the corresponding interlocking of the upper channel groove 881 and the lower channel groove 981 and can be used to extract air from the working space 1020. The capillary structure 1040 is located in the lower groove 930. The working fluid exists in the working space 1020 and the capillary structure 1040. In one embodiment, the upper frame 880 and lower frame 980 of the integrated heat spreader 80 are further provided with a welding groove 1010 for welding the upper metal cover plate 800 and the lower metal cover plate 900 together to form the heat spreader 80.

[0033] Please see Figure 6A and Figure 6B The metal top cover plate 800 of the integrated heat spreader of this utility model is characterized in that the shape and structural features of the metal top cover plate, such as the support structure, are directly formed on the same piece of metal by cold forging rather than sintering or external attachment. That is to say, the shape and structural features of the metal top cover plate are integrally forged from the same metal sheet and then modified by general CNC machining. Further, in this embodiment, the plurality of support structures 840 on the inner cooling surface 820 of the integrated heat spreader 800 are directly formed on the inner cooling surface 820 by cold forging and are inseparable from the inner cooling surface 820 of the metal top cover plate 800. They are not sintered together after the metal top cover plate 800 is formed, unlike the general practice of sintering after forming and then externally attaching the support structure 840 to the inner cooling surface 820.

[0034] Please see Figure 7A and Figure 7B This invention relates to an integrated heat spreader plate, specifically the metal lower cover 900. In this embodiment, the integrated heat spreader plate is characterized by its shape and structural features, all formed directly on a single sheet of metal using cold forging. This includes the recessed space 940 on the heat-absorbing outer surface 910 of the metal lower cover 900, which is then further refined using CNC machining. Furthermore, the recessed space 940 on the heat-absorbing outer surface 910 of the cold-forged metal lower cover 900 is recessed from the heat-absorbing outer surface 910 towards the evaporation inner surface 920 but does not protrude from the corresponding evaporation inner surface 920. This differs from general stamping processes where, when one side is recessed, the corresponding side will have a corresponding protrusion.

[0035] Generally, the method for manufacturing the one-piece molded top cover of the integrated heat spreader of this utility model can employ etching or composite processing (e.g., integrating stamping and milling) combined with sintering. The advantage of etching is its ability to create more complex structures, generally used for products difficult to manufacture using traditional processing methods. Composite processing, on the other hand, utilizes mostly mature manufacturing methods, requiring minimal development for production. However, etching processes are time-consuming and can result in uneven surfaces requiring secondary processing, while composite processing requires more steps and time for manufacturing.

[0036] The integrated heat spreader of this invention employs cold forging to create the shape and structure of the upper metal cover plate 800 and the lower metal cover plate 900. Unlike etching or composite machining processes, cold forging involves placing the metal sheet (or block) to be processed in a master mold, and then continuously forging the metal sheet at room temperature using a male mold to shape it. Those skilled in the art will understand that this cold forging process does not require preheating and annealing of the metal as in conventional stamping processes. Therefore, the internal grain structure of the forged metal will not suffer from reduced thermal conductivity due to annealing, which can lead to porosity or enlarged microstructure. Metals that have undergone cold forging retain a relatively dense internal grain structure due to the absence of a heating process, and internal defects such as porosity are reduced. The surface of the forged metal is smoother, allowing for closer contact with electronic components and reducing thermal resistance from poor contact. It also has the advantages of increased rigidity and density, and is less prone to deformation. Tests have shown that the thermal conductivity and thermal diffusivity of the forged metal are higher than those before forging, meaning that the heat dissipation efficiency of the integrated heat spreader of this invention is higher than that of conventional processes.

[0037] In one embodiment of the present invention, the integrated heat spreader plate, wherein the metal upper cover plate 800 and the metal lower cover plate 900 are integrally formed from metal sheets (e.g., pure copper) with high thermal conductivity and thermal diffusivity through cold forging to form the above-mentioned structure.

[0038] In another embodiment, the upper metal cover plate 800 and the lower metal cover plate 900 of the integrated heat spreader are made of pure copper with high thermal conductivity and thermal diffusivity. The upper metal cover plate 800 and the lower metal cover plate 900 manufactured by cold forging have a Vickers hardness of about 90HV to 120HV, for example, about 95HV to 120HV, 100HV to 120HV, 105HV to 120HV, 110HV to 120HV, 115HV to 120HV, and preferably 115HV to 117HV.

[0039] In another embodiment, the upper metal cover plate 800 and the lower metal cover plate 900 of the integrated heat spreader are made of pure copper with high thermal conductivity and thermal diffusivity, and the upper metal cover plate 800 and the lower metal cover plate 900 manufactured by cold forging have a thermal conductivity of about 400 W / (m·K) to 430 W / (m·K), for example, about 405 W / (m·K) to 430 W / (m·K), 410 W / (m·K) to 430 W / (m·K), and preferably 420 W / (m·K) to 430 W / (m·K).

[0040] In another embodiment, the upper metal cover 800 and lower metal cover 900 of the integrated heat spreader are made of pure copper with high thermal conductivity and thermal diffusivity, and the upper metal cover 800 and lower metal cover 900 manufactured by cold forging have a thermal diffusivity of approximately 90 mm. 2 / sec~120mm 2 / sec, for example, with a thermal diffusivity of approximately 95 mm 2 / sec~120mm 2 / sec, 100mm 2 / sec~120mm 2 / sec, 105mm 2 / sec~120mm 2 / sec, 110mm 2 / sec~120mm 2 / sec, 115mm 2 / sec~120mm 2 / sec, preferably 115mm 2 / sec~117mm 2 / sec.

[0041] Those skilled in the art will understand that the aforementioned Vickers hardness, thermal conductivity, and thermal diffusivity values ​​represent physical properties of pure copper after cold forging. These physical properties differ from those of materials processed by other methods and are one of the key technical features of this invention. In one embodiment of the integrated heat spreader of this invention, the upper metal cover 800 and lower metal cover 900 are made of pure copper, and the material properties after cold forging were measured by a third-party measurement unit (Yuanhe Company) to determine their Vickers hardness, thermal conductivity, and thermal diffusivity. The obtained values ​​are compared with the material properties after traditional composite processing (combining traditional stamping and CNC processes), as shown in Table 1 below.

[0042] Table 1

[0043] Cold forging method Traditional composite processing Vickers hardness (HV) 115～117 85～87 Thermal conductivity (W / m·K) Approximately 430 Approximately 395 <![CDATA[Thermal diffusivity (mm 2 / sec)]]> 115～117 85～87

[0044] As can be clearly seen from the values ​​measured in Table 1, those skilled in the art should understand that integrated heat sinks produced by cold forging possess superior physical properties for heat dissipation due to the characteristics of the process, offering significant advantages over traditional composite processing methods. It should be understood that the degree of improvement in these physical properties is related to the number of forging passes and the force applied during the cold forging process; the more passes and the greater the force, the higher the aforementioned values ​​will be. Therefore, after cold forging, the aforementioned values ​​will all be superior to those obtained through conventional processing.

[0045] Please see Figure 8A and Figure 8B This is another embodiment of the integrated heat spreader of this utility model, namely, a metal lower cover plate 901, wherein the heat-absorbing outer surface 910 of the metal lower cover plate 901 further includes a plurality of recessed spaces 940, which are recessed from the heat-absorbing outer surface 910 toward the evaporating inner surface 920 but do not protrude from the evaporating inner surface 920, for accommodating a plurality of electronic components. Please refer to... Figure 9 This is another embodiment of the integrated heat spreader of this invention, a metal lower cover plate 901, as shown in the figure. The plurality of recessed spaces 940 have the same or different shapes and volumes. They can be customized according to the size and shape of each small chip in the chipset on the circuit board to simultaneously accommodate various electronic components of the same or different shapes and volumes. For example, an integrated heat spreader that can simultaneously accommodate a 5G server chipset (such as...) Figure 8A(As shown in the diagram). When external electronic components are housed in a plurality of recessed spaces 940 of the heat-absorbing outer surface 910, a thermally conductive material with good thermal conductivity can be further added between the electronic components and the heat-absorbing outer surface 910 to reduce the thermal resistance caused by slight unevenness of the contact surface. For example, thermal paste or graphite sheets can be added to allow the electronic components to be tightly fitted to the heat-absorbing outer surface 910, thereby improving heat dissipation efficiency. It should be understood that in any embodiment of the integrated heat spreader of this utility model, the metal lower cover plates 900 and 901 are integrally forged using a cold forging method. In one embodiment, pure copper with a high thermal diffusivity and high thermal conductivity is integrally forged using a cold forging method. Therefore, the hardness and rigidity of the manufactured pure copper metal lower cover plate are higher than those manufactured by conventional processing methods, and it is less prone to deformation.

[0046] In one embodiment of the integrated heat spreader of this utility model, the supporting structure is columnar.

[0047] In one embodiment of the integrated heat exchanger of this utility model, the working fluid is pure water.

[0048] In one embodiment of the integrated heat spreader of this utility model, the air pressure in the working space is less than 1 x 10⁻⁶. -3 torr, 1x10 -4 torr, 1x10 -5 torr.

[0049] Of course, the above embodiments are only for illustrative purposes and are not intended to limit the scope of this utility model. Any equivalent modifications or changes made to the integrated heat spreader based on the above embodiments should still be included within the protection scope of this utility model.

[0050] It's worth noting that most existing heat dissipation modules add a metal protective shell between the heat spreader and the electronic components. This is mainly because, in pursuit of thinner electronic products, the thickness of current heat spreaders is only about 3mm, and they are mostly made of pure copper, which has good thermal conductivity but is relatively soft. To prevent deformation under prolonged high temperatures and thus affecting heat dissipation efficiency, the metal protective shell is usually made of aluminum-magnesium alloy, which has higher rigidity but lower thermal conductivity than pure copper. Furthermore, the metal protective shell needs to transfer heat to the heat spreader using thermal paste for dissipation. Compared to the integrated heat spreader of this invention, which directly replaces the metal protective shell with a metal bottom cover, eliminating the thermal resistance of aluminum-magnesium alloy and thermal paste, this invention offers significantly better heat dissipation efficiency than traditional heat dissipation modules. In addition, compared with other conventional processing methods, cold forging can give the material a finer grain structure and reduce internal defects such as pores. As a result, the material can obtain high strength, deformation resistance and fatigue resistance and other excellent mechanical properties. It can also improve the thermal conductivity and heat diffusion efficiency of the material. The integrated heat sink made by it will be superior to the heat dissipation modules with similar structures in terms of heat dissipation efficiency, durability and reliability.

[0051] This invention, by breaking through the existing technology, has indeed achieved the desired improved effect, and is not something that those familiar with the art would easily conceive of.

[0052] The above description is merely illustrative and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this utility model should be included within the scope of the claims.

Claims

1. An integrated heat spreader, characterized in that, At least including: A metal top cover includes a heat dissipation outer surface and a condensation inner surface. The condensation inner surface is provided with an upper frame of appropriate height around its perimeter. The upper frame is provided with an upper channel groove. The condensation inner surface has a plurality of upper grooves arranged in parallel with each other and a plurality of support structures protruding between the grooves. A metal lower cover plate includes a heat-absorbing outer surface and an evaporating inner surface. The heat-absorbing outer surface has at least one recessed space for accommodating a heat-releasing element. The evaporating inner surface has a lower frame of appropriate height around its periphery. The lower frame has a lower channel groove, and the evaporating inner surface has a plurality of lower grooves arranged in parallel to each other. A workspace is an airtight space formed by the upper frame of the upper metal cover and the lower frame of the lower metal cover. The condensing inner surface of the upper metal cover and the evaporating inner surface of the lower metal cover are opposite to each other, and the upper groove and the lower groove are aligned and mirror each other. A plurality of support structures protrude from the condensing inner surface and abut against the lower grooves of the evaporating inner surface to support the workspace. A capillary structure is located within the lower trench; A working fluid exists in the working space and the capillary structure.

2. The integrated heat spreader as described in claim 1, characterized in that, The metal upper cover plate, including the supporting structure, is integrally forged from a single metal sheet using a cold forging method, and the metal lower cover plate is integrally forged from a single metal sheet using a cold forging method.

3. The integrated heat spreader as described in claim 2, characterized in that, The metal sheet is made of pure copper, and the upper and lower cover plates have a Vickers hardness of approximately 90 HV to 120 HV.

4. The integrated heat spreader as described in claim 2, characterized in that, The metal sheet is made of pure copper, and the upper and lower cover plates have a thermal conductivity of approximately 400 W / (m·K) to 430 W / (m·K).

5. The integrated heat spreader as described in claim 2, characterized in that, The upper and lower cover plates have a thermal diffusivity of approximately 90 mm. 2 / sec~120mm 2 / sec.

6. The integrated heat spreader as described in claim 2, characterized in that, The supporting structure is columnar.

7. The integrated heat spreader as described in claim 2, characterized in that, There are multiple recessed spaces to accommodate multiple electronic components.

8. The integrated heat spreader as described in claim 7, characterized in that, Each of these recessed spaces has the same or different shapes and volumes, and is used to simultaneously accommodate multiple electronic components of the same or different shapes and volumes.

9. The integrated heat spreader as described in claim 2, characterized in that, The recessed space is recessed from the heat-absorbing outer surface toward the evaporating inner surface, but does not protrude from the corresponding evaporating inner surface.

10. The integrated heat spreader as described in claim 2, characterized in that, The upper metal cover plate and the lower metal cover plate are joined together by welding.

11. The integrated heat spreader as described in claim 2, characterized in that, The working fluid is pure water.

12. The integrated heat spreader as described in claim 2, characterized in that, The air pressure in this workspace is less than 1 x 10⁻⁶. -3 torr.

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