Cold plate type liquid cooling server

Abstract

The utility model provides a cold plate type liquid cooling server, which relates to the technical field of heat dissipation of liquid cooling data center servers and comprises a server body and a cold plate type liquid cooling system configured on the server body. The cold plate type liquid cooling system comprises a liquid cooling system and a cooling distribution device, and the cooling distribution device is used for performing cooling control on the liquid cooling system; a cooling distribution device of the cold plate type liquid cooling system communicates with the server body; the server body is used for acquiring a temperature parameter of a heat source assembly in the server body and sending the temperature parameter to a cooling distribution device of the cold plate type liquid cooling system; and the cooling distribution device is used for carrying out cooling control on the liquid cooling system according to the temperature parameters, so that heat dissipation dynamic regulation and control on parts of the liquid cooling part in the server can be realized, load balance of the heat dissipation parts is realized, and dynamic balance heat dissipation requirements and energy consumption are met.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of liquid-cooled data center servers, in particular to a cold plate type liquid-cooled server. Background Art

[0002] In recent years, against the backdrop of my country's dual carbon policy and the soaring thermal design parameters of chips, liquid-cooled data centers have continued to emerge. Liquid cooling uses liquid refrigerant as a carrier to dissipate heat from IT equipment in data centers, in order to achieve higher heat exchange efficiency than traditional air cooling and thus save more energy consumption.

[0003] For the current application of cold plate liquid cooling, although the infrastructure architecture has changed from air cooling to liquid cooling, for the IT equipment architecture, everyone still uses the air cooling architecture to transform into a liquid cooling architecture. The heat dissipation strategy for cold plate liquid cooling is basically the same as that for air cooling. Therefore, the BMC only monitors but does not control the components used for liquid cooling, and cannot achieve heat dissipation load balancing of the liquid cooling part. Utility Model Content

[0004] In view of this, an object of the present invention is to provide a cold plate type liquid cooling server to alleviate the above technical problems.

[0005] In the first aspect, an embodiment of the utility model provides a cold plate liquid cooling server, which includes: a server body, and a cold plate liquid cooling system configured on the server body; wherein the cold plate liquid cooling system includes a liquid cooling system and a cooling distribution device, and the cooling distribution device is used to control the cooling of the liquid cooling system; the cooling distribution device of the cold plate liquid cooling system communicates with the server body; the server body is used to obtain the temperature parameters of the heat source component inside the server body, and send the temperature parameters to the cooling distribution device of the cold plate liquid cooling system; the cooling distribution device is used to control the cooling of the liquid cooling system according to the temperature parameters.

[0006] In combination with the first aspect, an embodiment of the utility model provides a first possible implementation of the first aspect, wherein the server body includes multiple functional modules, the functional modules include a motherboard module, and a storage module, an IO module, a PCIE module, and a PSU module connected to the motherboard module; wherein the cooling distribution device of the cold plate liquid cooling system communicates with the BMC control component of the motherboard module.

[0007] In combination with the first possible implementation of the first aspect, the embodiment of the utility model provides a second possible implementation of the first aspect, wherein the cooling distribution device of the cold plate liquid cooling system communicates with the BMC control component via an I2C protocol.

[0008] In combination with the first possible implementation of the first aspect, the embodiment of the utility model provides a third possible implementation of the first aspect, wherein each heat source component in the server body is configured with a corresponding temperature sensor; the temperature sensor communicates with the BMC control component; the temperature sensor is used to collect temperature parameters of the heat source component and send the temperature parameters to the BMC control component; the BMC control component is used to send the temperature parameters to the cooling distribution device.

[0009] In combination with the third possible implementation of the first aspect, the embodiment of the utility model provides a fourth possible implementation of the first aspect, wherein the temperature sensor communicates with the BMC control component through an I2C protocol.

[0010] In combination with the third possible implementation of the first aspect, the embodiment of the utility model provides a fifth possible implementation of the first aspect, wherein the liquid cooling system includes a cooling plate arranged on the heat source component; and a cooling distribution device for regulating the heat dissipation of the cooling plate when the temperature parameter is higher than the temperature threshold.

[0011] In combination with the fifth possible implementation of the first aspect, the embodiment of the utility model provides a sixth possible implementation of the first aspect, wherein a liquid leakage sensor is arranged on the cooling plate, and the liquid leakage sensor communicates with the BMC control component; the liquid leakage sensor is used to detect liquid leakage on the cooling plate and send the liquid leakage detection information to the BMC control component; the BMC control component is used to send the liquid leakage detection information to the cooling distribution device to perform a liquid leakage alarm.

[0012] In combination with the fifth possible implementation of the first aspect, the embodiment of the utility model provides a seventh possible implementation of the first aspect, wherein the liquid cooling system includes a cooling pipe connected to the cooling plate, and a water pump and a heat exchanger installed in the cooling pipe; a cooling distribution device is used to regulate the flow rate of the water pump or the operating parameters of the heat exchanger when the temperature parameter is higher than the temperature threshold, so as to regulate the heat dissipation of the cooling plate.

[0013] In combination with the seventh possible implementation of the first aspect, the embodiment of the utility model provides an eighth possible implementation of the first aspect, wherein the heat exchanger includes a water exchange tank, and a fan or an external cooling tower / dry cooler connected to the water exchange tank.

[0014] In combination with the seventh possible implementation of the first aspect, the embodiment of the utility model provides a ninth possible implementation of the first aspect, wherein a temperature detection device is installed on the cooling pipe, for collecting the liquid temperature of the cooling pipe and sending the liquid temperature to the cooling distribution device; the cooling distribution device is used to regulate the flow rate of the water pump or the working parameters of the heat exchanger according to the liquid temperature.

[0015] In a second aspect, an embodiment of the utility model provides a data center, which is equipped with the cold plate liquid cooling server described in the first aspect.

[0016] The embodiments of the present invention bring the following beneficial effects:

[0017] The cold plate liquid cooling server provided by the utility model comprises: a server body, and a cold plate liquid cooling system configured on the server body; wherein the cold plate liquid cooling system comprises a liquid cooling system and a cooling distribution device, the cooling distribution device is used to control the cooling of the liquid cooling system; the cooling distribution device of the cold plate liquid cooling system communicates with the server body; the server body is used to obtain the temperature parameters of the heat source components inside the server body, and send the temperature parameters to the cooling distribution device of the cold plate liquid cooling system; the cooling distribution device is used to control the cooling of the liquid cooling system according to the temperature parameters. Based on this, the cooling distribution device is synchronized with the internal temperature of the server, and the cooling of the liquid cooling system can be directly controlled according to the temperature parameters of the heat source components inside the server body, so as to realize dynamic regulation of the heat dissipation of the liquid cooling parts inside the server, so as to realize load balancing of the heat dissipation components and meet the dynamic balance of heat dissipation requirements and energy consumption.

[0018] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by practicing the utility model. The purpose and other advantages of the utility model are realized and obtained by the structures specifically pointed out in the description, claims and drawings.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are some implementation methods of the utility model. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 A structural block diagram of a cold plate liquid cooling server provided by an embodiment of the utility model;

[0022] Figure 2 A structural block diagram of a server body provided by an embodiment of the utility model;

[0023] Figure 3A schematic diagram of the connection structure of a cooling distribution device, a BMC control component, and a temperature sensor provided in an embodiment of the utility model;

[0024] Figure 4 A schematic diagram of a cold plate liquid cooling system provided in an embodiment of the utility model.

[0025] Figure numerals: 100-server body; 101-mainboard module; 102-storage module; 103-IO module; 104-PCIE module, 105-PSU module; 200-cold plate liquid cooling system; 201-liquid cooling system; 202-cooling distribution device; 301-cooling plate; 302-cooling pipe; 303-water pump, 305-liquid reservoir; 401-heat water tank; 402-fan; 403-external cooling tower / dry cooler; 500-temperature sensor; 600-pressure sensor; 700-flow sensor; 800-quick connect connector. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0027] In the current cold plate liquid cooling strategy, the BMC only monitors but does not control the components used for liquid cooling, and the liquid cooling load balancing cannot be achieved. Based on this, the cold plate liquid cooling server provided by the embodiment of the utility model can effectively alleviate the above technical problems.

[0028] To facilitate understanding of this embodiment, a cold plate liquid cooling server disclosed in an embodiment of the utility model is first introduced in detail.

[0029] In one possible implementation, an embodiment of the utility model provides a cold plate liquid cooling server, wherein the cold plate liquid cooling server uses a working fluid as a medium for intermediate heat transfer, transferring heat from a hot zone to a distant place for cooling. In this technology, the working liquid is separated from the object to be cooled, and the working liquid does not directly contact the electronic device. Instead, the heat of the object to be cooled is transferred to the refrigerant through high-efficiency heat conduction components such as liquid cold plates. Therefore, the cold plate liquid cooling technology is also called indirect liquid cooling technology. This technology directs the coolant directly to the heat source. At the same time, since the specific heat of liquid is greater than that of air, the heat dissipation speed is much greater than that of air. Therefore, the cooling efficiency is much higher than that of air cooling. The heat transferred per unit volume, that is, the heat dissipation efficiency, is as high as 1000 times, which can effectively solve the heat dissipation problem of high-density servers, reduce the energy consumption of the cooling system and reduce noise.

[0030] Based on the above-mentioned implementation principle, the cold plate liquid cooling server provided in the embodiment of the utility model includes: a server body, and a cold plate liquid cooling system configured on the server body; wherein the cold plate liquid cooling system includes a liquid cooling system and a cooling distribution device, and the cooling distribution device is used to control the cooling of the liquid cooling system.

[0031] Specifically, a liquid cooling system is a cooling solution that transfers heat from computer components to the surrounding environment. It is a technology that dissipates heat through liquid. The basic components include a water pump, a radiator, a cooling medium, and pipes that run through the entire system. When the computer components begin to heat up, the cooling medium will flow through the pipes and take away the heat. Subsequently, the cooling medium will reach the radiator, quickly dissipate the heat through the airflow generated by the fan, and return to the water pump for circulation. The entire cycle can be repeated to ensure that the computer components are always kept within a suitable temperature range. Among them, the liquid cooling system includes two important components: the primary side and the secondary side of the liquid cooling. The primary side of the liquid cooling refers to the part responsible for transferring heat from the heat source (such as CPU, GPU, etc.) to the coolant. The secondary side of the liquid cooling refers to the part responsible for transferring heat from the coolant to the environment. The cooling distribution device, also known as the cooling distribution unit, is a device in the cooling system used to distribute coolant (such as water or other fluids) to different parts of the machine or process that needs to be cooled. They are usually found in large cooling systems that need to adjust the temperature of various different components. In actual use, it is a power unit CDU in the secondary side liquid cooling circulation system.

[0032] For ease of understanding, Figure 1The structural block diagram of a cold plate liquid cooling server is shown, including a server body 100 and a cold plate liquid cooling system 200, and the cold plate liquid cooling system 200 includes a liquid cooling system 201 and a cooling distribution device 202. In order to achieve load balancing of the liquid cooling part, the cooling distribution device 202 of the cold plate liquid cooling system 200 of the embodiment of the utility model communicates with the server body 100; the server body 100 is used to obtain the temperature parameters of the heat source components inside the server body 100, and send the temperature parameters to the cooling distribution device 202 of the cold plate liquid cooling system 200; the cooling distribution device 202 is used to control the cooling of the liquid cooling system 201 according to the temperature parameters. Based on this, the cooling distribution device (CDU) is synchronized with the internal temperature of the server, and the cooling of the liquid cooling system can be directly controlled according to the temperature parameters of the heat source components inside the server body, so as to realize dynamic regulation of the heat dissipation of the liquid cooling part components inside the server, so as to realize load balancing of the heat dissipation components and meet the dynamic balance of heat dissipation requirements and energy consumption.

[0033] In actual use, the server body usually includes multiple functional modules, specifically, Figure 2 A structural block diagram of a server body is shown, wherein the functional modules in the embodiment of the utility model include a mainboard module 101, and a storage module 102, an IO module 103, a PCIE module 104, and a PSU module 105 connected to the mainboard module; that is, in the embodiment of the utility model, the main functions of the server body are modularized, therefore, the cold plate liquid cooling server in the embodiment of the utility model is actually a modular cold plate liquid cooling server. In actual use, the above-mentioned motherboard module 101 is usually the core control module of the server body. Therefore, a BMC control component is configured in the motherboard module 101 as a board-level management controller of the server body; the above-mentioned storage module 102 constitutes the memory of the server body and can be expanded according to actual use requirements; the above-mentioned IO module 103 is used to provide multiple communication interfaces of the server body, such as providing an external access interface of the IPMI protocol, etc.; the above-mentioned PCIE module 104 is used to adopt a high-speed serial computer expansion bus standard to achieve high-speed data transmission of the server body; the above-mentioned PSU module 105 communicates with an external power supply system to obtain electrical energy to power the server body.

[0034] Further, based on the above Figure 2In the server body shown, the cooling distribution device of the cold plate liquid cooling system communicates with the BMC control component of the mainboard module. Each heat source component in the server body is equipped with a corresponding temperature sensor; the temperature sensor communicates with the BMC control component; the temperature sensor is used to collect the temperature parameters of the heat source component and send the temperature parameters to the BMC control component; the BMC control component is used to send the temperature parameters to the cooling distribution device. Among them, the liquid cooling system includes a cooling plate 301 arranged on the heat source component; the cooling distribution device is used to regulate the heat dissipation of the cooling plate 301 when the temperature parameter is higher than the temperature threshold.

[0035] In a specific implementation, the cooling plate covers the internal heat source part of the server, such as the CPU, DIMM (Dual-Inline-Memory-Modules, Chinese name dual inline memory module), VR (variable resistor electronic component), GPU (Graphics Processing Unit) and other components. The internal temperature sensor data of the IC is obtained by the server BMC, and the BMC obtains the temperature information through the MCU (Microcontroller Unit) to communicate with the PLC in the cooling distribution device CDU in the cold plate liquid cooling system 200. The server and CDU equipment of the embodiment of the utility model can be physically connected via a cable or through a transit MCU component. Among them, the cooling distribution device of the cold plate liquid cooling system of the embodiment of the utility model communicates with the BMC control component through the I2C protocol. The temperature sensor communicates with the BMC control component through the I2C protocol. Refer to Figure 3 The schematic diagram of the connection structure of the cooling distribution device, BMC control component and temperature sensor is shown.

[0036] Furthermore, the liquid cooling system includes a cooling pipe 302 connected to the cooling plate, and a water pump 303 and a heat exchanger installed in the cooling pipe; a cooling distribution device is used to adjust the flow rate of the water pump or the working parameters of the heat exchanger when the temperature parameter is higher than the temperature threshold, so as to regulate the heat dissipation of the cooling plate. The heat exchanger of the embodiment of the utility model includes a water exchange tank 401, and a fan 402 or an external cooling tower / dry cooler 403 connected to the water exchange tank 401.

[0037] Specifically, the cooling plate and the cooling pipe are connected by a quick-connect joint 800, such as Figure 4The schematic diagram of the cold plate liquid cooling system is shown. The main components corresponding to the CDU are: liquid reservoir 305, heat exchanger, water pump 303, flow sensor 700, pressure sensor 600, temperature sensor 500; the inlet and outlet pipes of the cooling pipe are respectively installed with pressure sensors and temperature sensors, and the side close to the water pump is the inlet pipe of the cooling pipe. Fans and external cooling towers / dry coolers provide different common modes of heat exchange for CDU, which can be selected according to the use environment. CDU transports liquid of a certain temperature to the cooling plate covering the heat-generating components in the server through a drip-free quick-connect connection to take away the heat of the internal components of the server, and then returns to CDU for heat exchange. CDU can adjust the temperature and cleanliness (particle and compound composition) of the cold liquid. The temperature of the cold liquid is controlled by means of a heat exchanger. It is worth noting that the temperature control of the cold liquid can also be obtained by bypassing the exchanger. If the cold liquid in the TCS or DECS is a refrigerant or a non-conductive fluid, the CDU can also be designed to adjust the cold liquid. The rack-level or facility-level cooling liquid delivered to the CDU can be the refrigerant provided by the DX system. The function of the CDU depends mainly on the cooling liquid being conditioned and the level at which the CDU is located (for example, inside the datacom equipment or inside the rack / cabinet, or at the facility level or outside the rack). In all cases, the CDU always has a water pump and compressor to circulate the fluid through the cooling liquid loop.

[0038] In the embodiment of the utility model, the program is compiled through the PLC controller, and the PID speed regulation of the water pump and the heat exchanger is performed through PWM. In the utility model, the cooling distribution device performs heat dissipation regulation according to the component specification requirements corresponding to the internal heat source temperature information of the server. Regarding the PID speed regulation of the water pump and fan in the CDU, the cooling distribution device in the utility model regulates the flow rate of the water pump or the working parameters of the heat exchanger when the temperature parameter of the heat source component is higher than the temperature threshold. Specifically, taking the heat exchanger as a fan as an example, it is divided into two modes: constant temperature speed regulation and constant pressure speed regulation. The two speed regulation modes are as follows:

[0039] The first control mode: Control the speed of the water pump to perform temperature control. When the temperature is normal, read the flow rate, and monitor the temperature after controlling the flow rate according to the target flow rate. If the temperature is lower than the required value, the fan will not work. If it is higher than the required value, the fan speed will increase, thus realizing the control of the working parameters of the heat exchanger. Among them, flow sensors and pressure sensors are also installed on the cooling pipe. During the control process, abnormal speed regulation may be involved: due to abnormal temperature parameter acquisition of the server, or abnormal acquisition of the flow sensor and pressure sensor, the temperature and flow cannot be obtained, and the fan is controlled to run at the highest speed. When the fan reaches the maximum speed and still does not meet the required temperature, the cooling distribution device controls the flow rate of the water pump, and the flow regulation starts, and the flow rate does not exceed the set maximum flow rate, so that the temperature parameters of the heat source components meet the temperature threshold.

[0040] The second control mode: Control the fan speed to perform temperature control. When the temperature is normal, read the fan speed and perform temperature monitoring according to the target air volume control. If the temperature is lower than the required value, the water pump will not work. If it is higher than the required value, the water pump speed will increase, that is, the water pump flow rate is regulated. This involves abnormal speed regulation: when the temperature and flow cannot be obtained, the water pump runs at the highest speed. When the water pump still does not meet the required temperature at the highest speed, the fan is started for regulation. Specifically, a temperature detection device 500 is installed on the cooling pipe, which is used to collect the liquid temperature of the cooling pipe and send the liquid temperature to the cooling distribution device. Based on this, it is determined whether the current liquid temperature meets the cooling demand. In the specific implementation, the cooling distribution device is used to regulate the flow rate of the water pump or the working parameters of the heat exchanger according to the liquid temperature.

[0041] Furthermore, a leakage sensor (not shown in the figure) is arranged on the cooling plate, and the leakage sensor communicates with the BMC control component; the leakage sensor is used to detect leakage of the cooling plate and send the leakage detection information to the BMC control component; the BMC control component is used to send the leakage detection information to the cooling distribution device to issue a leakage alarm.

[0042] In a specific implementation, the leakage sensor is integrated on the cooling plate inside the server to detect the risk point of leakage inside the server, and the BMC control component receives the leakage alarm information. After receiving the alarm information, the BMC control component can control the server to shut down to avoid damage to the server. Among them, in the utility model, the cooling distribution device is connected to the BMC control component, and the alarm information can be reported to enable the system operation and maintenance personnel to conduct maintenance.

[0043] Furthermore, the server also includes a fan module. In the utility model, for the water-cooled plate covering components, only the temperature sensor readings of the corresponding components are displayed through the BMC, and the fan module is not speed-controlled according to the temperature parameters. The liquid cooling system is cooled and regulated by the cooling distribution device, which can reduce energy consumption while achieving balanced heat dissipation load of the liquid cooling part.

[0044] In summary, the cold plate liquid cooling server provided by the embodiment of the utility model has the following beneficial effects:

[0045] 1) Improve the energy efficiency of the plate liquid cooling system, realize load balancing of heat dissipation components using cold plate liquid cooling, and dynamically balance heat dissipation requirements and energy consumption.

[0046] 2) Improve the reliability of server operation and reduce the possibility of equipment overheating by implementing communication and control regulation between the server and the infrastructure.

[0047] 3) Improve the reliability of the liquid cooling system. The leakage detection function reports to the system-side CDU and server nodes at the same time, and can control the operation of the power component water pump and fan at the same time.

[0048] Furthermore, based on the above embodiments, the embodiments of the utility model also provide a data center, which is equipped with the cold plate liquid cooling server provided in the above embodiments.

[0049] The data center provided by the embodiment of the utility model has the same technical features as the cold plate liquid cooling server provided by the above embodiment, so it can also solve the same technical problems and achieve the same technical effects.

[0050] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the data center described above can refer to the corresponding process in the aforementioned embodiment, and will not be repeated here.

[0051] In addition, in the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0053] Finally, it should be noted that the above embodiments are only specific implementation methods of the utility model, which are used to illustrate the technical solution of the utility model, rather than to limit it. The protection scope of the utility model is not limited thereto. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art should understand that any technician familiar with the technical field can still modify the technical solution recorded in the above embodiments within the technical scope disclosed by the utility model, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solution of the embodiment of the utility model, and should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model shall be based on the protection scope of the claims.

Claims

1. A cold plate liquid cooling server, characterized in that: The cold plate liquid cooling server comprises: a server body, and a cold plate liquid cooling system configured on the server body; Wherein, the cold plate type liquid cooling system comprises a liquid cooling system and a cooling distribution device, and the cooling distribution device is used to perform cooling control on the liquid cooling system; The cooling distribution device of the cold plate liquid cooling system communicates with the server body; The server body is used to obtain the temperature parameters of the heat source components inside the server body, and send the temperature parameters to the cooling distribution device of the cold plate type liquid cooling system; The cooling distribution device is used to control the cooling of the liquid cooling system according to the temperature parameter.

2. The cold plate liquid cooling server according to claim 1, characterized in that: The server body includes a plurality of functional modules, wherein the functional modules include a mainboard module, and a storage module, an IO module, a PCIE module, and a PSU module connected to the mainboard module; Wherein, the cooling distribution device of the cold plate liquid cooling system communicates with the BMC control component of the mainboard module.

3. The cold plate liquid cooling server according to claim 2, characterized in that: The cooling distribution device of the cold plate liquid cooling system communicates with the BMC control component via the I2C protocol.

4. The cold plate liquid cooling server according to claim 2, characterized in that: Each of the heat source components in the server body is configured with a corresponding temperature sensor; The temperature sensor communicates with the BMC control component; The temperature sensor is used to collect the temperature parameters of the heat source component and send the temperature parameters to the BMC control component; The BMC control component is used to send the temperature parameter to the cooling distribution device.

5. The cold plate liquid cooling server according to claim 4, characterized in that: The temperature sensor communicates with the BMC control component via the I2C protocol.

6. The cold plate liquid cooling server according to claim 4, characterized in that: The liquid cooling system includes a cooling plate disposed on the heat source assembly; The cooling distribution device is used to regulate the heat dissipation of the cooling plate when the temperature parameter is higher than a temperature threshold.

7. The cold plate liquid cooling server according to claim 6, characterized in that: The cooling plate is provided with a liquid leakage sensor, and the liquid leakage sensor communicates with the BMC control component; The liquid leakage sensor is used to detect liquid leakage on the cooling plate and send the liquid leakage detection information to the BMC control component; The BMC control component is used to send the leakage detection information to the cooling distribution device to issue a leakage alarm.

8. The cold plate liquid cooling server according to claim 6, characterized in that: The liquid cooling system includes a cooling pipe connected to the cooling plate, and a water pump and a heat exchanger installed in the cooling pipe; The cooling distribution device is used to adjust the flow rate of the water pump or the working parameter of the heat exchanger when the temperature parameter is higher than the temperature threshold, so as to adjust the heat dissipation of the cooling plate.

9. The cold plate liquid cooling server according to claim 8, characterized in that: The heat exchanger includes a water exchange tank, and a fan or an external cooling tower / dry cooler connected to the water exchange tank.

10. The cold plate liquid cooling server according to claim 8, characterized in that: The cooling pipeline is provided with a temperature detection device for collecting the liquid temperature of the cooling pipeline and sending the liquid temperature to the cooling distribution device; The cooling distribution device is used to adjust the flow rate of the water pump or the working parameters of the heat exchanger according to the liquid temperature.

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