Wafer testing machine

Abstract

The utility model provides a wafer testing machine which comprises a rack, and a first linear mechanism, a testing mechanism, a dotting mechanism, a drying and heating mechanism, a feeding and pushing mechanism and a suction mechanism which are arranged on the rack, and in addition, a wafer bearing mechanism is further arranged on the first linear mechanism; wherein the wafer bearing mechanism comprises a sliding table, a rotatable test table arranged on the sliding table and a dotting drying table arranged on one side of the test table; the drying and heating mechanism is arranged at one end of the first linear mechanism, a heating chamber used for containing the dotting and drying table is arranged in the drying and heating mechanism, and a heat source is arranged in the heating chamber; and the suction mechanism is used for sucking the wafer from the feeding pushing mechanism at the angle of detecting the wafer at the feeding position and sucking the wafer to move between the test table and the dotting drying table. According to the invention, the wafer does not need to be transferred before the ink dots are cured, so that the suction mechanism can be prevented from being contaminated by the ink dots to affect the dotting marking result of the next wafer.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor equipment, and more specifically, to a wafer testing machine. Background Art

[0002] During the wafer manufacturing process, each chip on the wafer needs to be tested so that bad chips can be removed when each chip is subsequently cut and separated. Generally, the wafer testing and screening process is as follows: the whole wafer is tested to find bad chips; the bad chips found are dotted and marked, generally by transferring ink dots to the surface of the bad chips through a dot-marking mechanism; the dot-marked wafer is dried to solidify the ink dots.

[0003] In the relevant design, in order to prevent the high temperature from affecting the test mechanism during the wafer drying process, the wafer is generally transferred to the dotting drying table for drying through a transfer mechanism after the wafer is dotted. However, in the aforementioned process, due to the presence of unsolidified ink dots on the wafer, when there are many ink dots, the transfer mechanism is prone to pick up the unsolidified ink dots, causing contamination of the transfer mechanism; when the transfer mechanism transfers the next wafer, the stained ink dots on it are prone to contaminate the next wafer, thereby making the wafer detection and marking results inaccurate. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a wafer testing machine to solve the technical problem in the prior art that wafer marking results are easily inaccurate.

[0005] To achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present application is to provide a wafer testing machine, which includes:

[0006] frame;

[0007] At least one first linear mechanism disposed on the frame;

[0008] A wafer carrying mechanism, slidably disposed on the first linear mechanism, comprising a slide table, a rotatable test table both disposed on the slide table, and a dotting and drying table disposed on one side of the test table;

[0009] A testing mechanism, disposed on the frame, comprising a first transfer mechanism disposed across the first linear mechanism and a testing device disposed on the first transfer mechanism;

[0010] A dotting mechanism, arranged on the frame, comprising a second transfer mechanism arranged across the first linear mechanism and a dotting device arranged on the second transfer mechanism;

[0011] A drying and heating mechanism, which is arranged on the frame and located at one end of the first linear mechanism, wherein a heating chamber for accommodating the dotting and drying table is arranged, and a heat source is arranged in the heating chamber;

[0012] A loading and pushing mechanism, arranged on one side of the first linear mechanism, for carrying the wafer to move to the loading position;

[0013] A suction mechanism is arranged on the frame, comprising a third transfer mechanism arranged across the first linear mechanism and a suction device and a visual device arranged on the third transfer mechanism; the suction mechanism is used to detect the angle of the wafer at the loading position, suck the wafer from the loading and pushing mechanism, and suck the wafer to move between the test table and the dotting and drying table.

[0014] Optionally, there is a gap between the dotting and drying table and the testing table, and / or the dotting and drying table and the testing table are arranged at the same height.

[0015] Optionally, both the testing table and the dotting and drying table are provided with vacuum adsorption holes.

[0016] Optionally, the drying and heating mechanism includes a lifting mechanism, and the heat source and the heating chamber are both arranged on the lifting mechanism; the drying and heating mechanism includes a drying platform and a cover body, and the heat source is fixedly arranged on the cover body; the drying platform and the cover body are independently arranged on the lifting mechanism so as to be able to be lifted and lowered independently, and the drying platform and the cover body form the heating chamber when they are close to each other and closed.

[0017] Optionally, the heat source is a hot air device, and the blowing direction of the hot air device is from top to bottom.

[0018] Optionally, the dotting device includes a base body and a voice coil motor arranged on the base body, a sliding rod is arranged on the base body and at least on one side of the voice coil motor, a driving rod connected to the voice coil motor is sleeved on the sliding rod, an ink fountain is arranged on the base body, and an ink outlet tube is arranged at the bottom of the ink fountain; an ink guide wire is fixedly arranged on the driving rod, the ink guide wire is partially located in the ink fountain and its bottom is passed through the ink outlet tube.

[0019] Optionally, the dotting device also includes an adjustment component, which includes two sliders that can be slid and adjusted along the longitudinal direction, and the seat body is fixedly set on one of the sliders; an adjustment plate is set on the side of one of the sliders, and an adjustment groove is set on the adjustment plate along the longitudinal direction; an adjustment screw is set on the side of the other slider, and the adjustment screw is passed through the adjustment groove.

[0020] Optionally, a fine-tuning mechanism is provided between the two sliders, and the fine-tuning mechanism comprises an adjusting screw provided on one of the sliders and an abutting block fixedly provided on the other slider, and the bottom of the adjusting screw abuts against the abutting block.

[0021] Optionally, the loading and pushing mechanism includes a pushing tray assembly and a loading platform assembly arranged at one end of the pushing tray assembly; the pushing tray assembly includes a second linear mechanism and a material tray arranged on the second linear mechanism; the loading platform assembly includes a positioning frame, and a blowing device arranged in a circular array on the positioning frame.

[0022] Optionally, a gantry is provided on the frame, the gantry spans across each of the first linear mechanisms, and the first transfer mechanism, the second transfer mechanism and the third transfer mechanism are all provided on the gantry.

[0023] The wafer testing machine provided in the embodiment of the present application has at least the following beneficial effects:

[0024] The suction mechanism is used to suck the wafer for loading and to move between the test bench and the loading bench. After the wafer test is completed, the suction mechanism sucks the wafer from the test bench to the dotting and drying bench, and the dotting device marks the defective chips on the wafer on the dotting and drying bench. The drying mechanism then heats and dries the wafer on the dotting and drying bench to solidify the ink dots. In this way, the wafer does not need to be transported before the ink dots are solidified, which can prevent the suction mechanism from being contaminated by ink dots and thus affecting the dotting and marking results of the next wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] Figure 1 A three-dimensional diagram of a wafer testing machine in some embodiments of the present application;

[0027] Figure 2 A front view of a wafer testing machine in some embodiments of the present application;

[0028] Figure 3 A three-dimensional diagram of a wafer carrying mechanism and a drying and heating mechanism in some embodiments of the present application;

[0029] Figure 4 A three-dimensional diagram of a dotting device in some embodiments of the present application;

[0030] Figure 5 A three-dimensional diagram of a dotting device in some embodiments of the present application;

[0031] Figure 6 A partial stereoscopic diagram of the dotting mechanism in some embodiments of the present application;

[0032] Figure 7 This is a three-dimensional diagram of the suction mechanism in some embodiments of the present application. DETAILED DESCRIPTION

[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0034] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0035] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly on the other element or indirectly on the other element.

[0036] When an element is referred to as being “connected to” another element, it can be directly connected to the other element or indirectly connected to the other element.

[0037] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0039] In the description of the present application, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0040] Please also read Figures 1 to 7 , the wafer testing machine provided in the embodiment of the present application is now described.

[0041] refer to Figure 1 to Figure 2 It can be understood that the wafer testing machine provided in the embodiment of the present application includes a frame 100, and a first linear mechanism 110, a testing mechanism 300, a dotting mechanism 400, a drying and heating mechanism 500, a loading and pushing mechanism 600 and a suction mechanism 700 arranged on the frame 100. In addition, a wafer carrying mechanism 200 is also arranged on the first linear mechanism 110.

[0042] There is at least one group of first linear mechanisms 110. When there are multiple groups, the first linear mechanisms 110 are arranged side by side, and the drying and heating mechanism 500 is also arranged at the same end of each first linear mechanism 110 corresponding to each first linear mechanism 110.

[0043] The loading and pushing mechanism 600 is disposed on one side of the first linear mechanism 110 and is used to carry the wafers to the loading position. In a specific operation process, the external transfer device transfers the whole stack of wafers to the loading and pushing mechanism 600, and then the loading and pushing mechanism 600 moves the wafers to the loading position.

[0044] refer to Figure 1 to Figure 2 and Figure 7 It can be understood that the suction device 720 and the visual device 730 are both fixedly arranged on the third transfer mechanism 710; at the same time, the third transfer mechanism 710 can be a two-axis motion mechanism (that is, it can move laterally to cross each first linear mechanism 110 and can move longitudinally to approach or move away from the table of the rack 100).

[0045] The visual device 730 may be a CCD camera, which is used to detect the initial angular position of the wafer to be sucked on the loading position to provide angle data for the position adjustment of the wafer before detection. It should be understood that since the wafer detection is to detect each chip thereon, and since each chip is arranged in a matrix on the wafer, it is necessary to ensure that the angular position of each wafer is consistent during detection so that the test device 320 can accurately and quickly detect each chip.

[0046] The suction device 720 may be a vacuum suction component, which is used to suck the wafer to transfer the wafer from the loading and pushing mechanism 600 to the test station 220 , or to transfer the wafer back and forth between the test station 220 and the dotting and drying station 230 .

[0047] refer to Figures 1 to 3 The wafer carrying mechanism 200 is slidably arranged on the first linear mechanism 110, and includes a slide 210, a test table 220 and a dot-marking and drying table 230 arranged on the slide 210. Among them, the test table 220 can be rotatably arranged. For example, a rotating motor is arranged in the test table 220 so that it can carry the wafer to rotate, so that the wafer to be tested can be rotated to the correct angle to be tested according to the angle deviation detected by the visual device 730. Specifically, the test table 220 is provided with test components, which are used to detect whether each chip on the wafer can be powered on normally and other performance; the dot-marking and drying table 230 is used to carry the wafer that has been tested for marking and dotting and for heating and drying the ink dots.

[0048] By setting the test table 220 and the dotting and drying table 230 separately, the wafer does not need to be transported after marking and dotting, and can be directly transferred from the dotting and drying table 230 to the drying and heating mechanism 500 for heating and drying. This can avoid the problem that when the suction mechanism 700 sucks the wafer with unsolidified ink dots, the suction end of the suction mechanism 700 is contaminated with ink dots and the next wafer is contaminated when it sucks the next wafer.

[0049] refer to Figure 1 to Figure 2 The test mechanism 300 includes a first transfer mechanism 310 arranged across the first linear mechanisms 110 and a test device 320 arranged on the first transfer mechanism 310. It can be understood that the first transfer mechanism 310 is a two-axis motion mechanism (i.e., it can move laterally to cross each first linear mechanism 110 and can move longitudinally to approach or move away from the table of the rack 100), and the first transfer mechanism 310 is used to drive the test device 320 to move between different first linear mechanisms 110 to test the wafers on the wafer carrying mechanisms 200 on different first linear mechanisms 110.

[0050] refer to Figure 2 , Figures 4 to 6 The dotting mechanism 400 also includes a second transport mechanism 410 arranged across each first linear mechanism 110 and a dotting device 420 arranged on the second transport mechanism 410. The second transport mechanism 410 is a two-axis motion mechanism (i.e., it can move horizontally to cross each first linear mechanism 110 and can move vertically to approach or move away from the table of the rack 100). The dotting device 420 is used to transfer ink dots to the surface of the wafer to mark the defective chips.

[0051] refer to Figures 1 to 3 The drying and heating mechanism 500 is disposed at the same end of each first linear mechanism 110, and is provided with a heating chamber 510 for accommodating the dotting and drying table 230, and a heat source 520 is disposed in the heating chamber 510. It should be understood that when the wafer is heated and dried, the dotting and heating table enters the heating chamber 510 and the test table 220 is located outside the heating chamber 510, so that the high temperature of the heating chamber 510 can be prevented from affecting the test components and motors in the test table 220.

[0052] In summary, in the wafer testing machine of the embodiment of the present application, the wafer does not need to be transported before the ink dots are solidified, so that the suction mechanism 700 can be prevented from being contaminated by ink dots and thus affecting the dot marking result of the next wafer.

[0053] refer to Figure 3In some embodiments, there is a gap between the dotting and drying table 230 and the test table 220. In this way, when the dotting and drying table 230 carries the wafer for heating and drying in the heating chamber 510, the heat can be blocked from being transferred from the dotting and drying table 230 to the test table 220 to the greatest extent, thereby preventing the test components in the test table 220 from being damaged by high temperature.

[0054] Furthermore, the dotting and drying table 230 and the testing table 220 are arranged at the same height. By arranging the dotting and drying table 230 and the testing table 220 at the same level, it is convenient for the suction device 720 to transfer the wafers after inspection.

[0055] Furthermore, the dotting and drying table 230 may be made of a material with good thermal insulation performance to further prevent heat from being transferred to the test table 220 , thereby better protecting the test components on the test table 220 from high temperature.

[0056] In a further embodiment, vacuum adsorption holes are provided on both the test table 220 and the dotting and drying table 230. By providing the vacuum adsorption holes, the wafer can be better adsorbed and fixed during the testing, dotting and drying processes, thereby improving the testing accuracy and dotting accuracy.

[0057] refer to Figure 3 In some embodiments, the drying and heating mechanism 500 includes a lifting mechanism 530, and the heat source 520 and the heating chamber 510 are both arranged on the lifting mechanism 530; the drying and heating mechanism 500 includes a drying platform 541 and a cover 542, and the heat source 520 is fixedly arranged on the cover 542. The drying platform 541 and the cover 542 are both independently arranged on the lifting mechanism 530 so as to be able to be lifted and lowered independently, that is, in each drying and heating mechanism 500, the lifting mechanism 530 is provided with two groups, and each group of the lifting mechanism 530 is used to independently drive the drying platform 541 or the cover 542. The lifting mechanism 530 can be a cylinder and a slide rail assembly.

[0058] In this way, when the drying platform 541 and the cover body 542 are close to each other, the cover body 542 can enclose the surface of the drying platform 541 to form a closed heating chamber 510, thereby reducing the heat loss during drying and heating to improve the drying efficiency; and when the drying platform 541 and the cover body 542 are away from each other, the opening between the two becomes larger, thereby facilitating the entry and exit of the drying platform 230.

[0059] Furthermore, the heat source 520 is preferably a hot air device, which includes a blowing device and an electric heating wire, and the blowing direction of the hot air device is from top to bottom. In this way, the hot air can be blown directly to the ink dots on the upper surface of the wafer, and the heat utilization rate of the hot air is high, thereby accelerating the drying efficiency.

[0060] refer to Figures 4 to 6 In some embodiments, the dotting device 420 includes a base 421 and a voice coil motor 422 disposed on the base 421, a slide bar 423 is disposed on the base 421 and at least one side of the voice coil motor 422, a driving rod 424 connected to the voice coil motor 422 is sleeved on the slide bar 423, an ink fountain 425 is disposed on the base 421, and an ink outlet tube 4251 is disposed at the bottom of the ink fountain 425; an ink guide wire 426 is fixedly disposed on the driving rod 424, and it should be understood that the ink guide wire 426 The diameter of 26 is slightly smaller than the diameter of the ink outlet tube 4251, so that the ink guide wire 426 is partially located in the ink fountain 425 and its bottom can pass through the ink outlet tube 4251. When the driving rod 424 reciprocates under the driving ring of the voice coil motor 422, the ink guide wire 426 reciprocates in the ink outlet tube 4251, so that the ink in the ink fountain 425 can flow along the gap between the ink guide wire 426 and the ink outlet tube 4251 to the bottom of the ink guide wire 426, so as to be transferred to the chip on the wafer by the ink guide wire 426.

[0061] By setting the linear moving device of the driving rod 424 to a voice coil motor 422, the mover of the voice coil motor 422 is made to move back and forth in a longitudinal straight line by changing the direction of the current, so that the linear movement of the driving rod 424 is smoother; at the same time, the voice coil motor 422 generates less heat during continuous operation, and can still maintain stable performance after long-term high-frequency operation, thereby providing better performance guarantee for dotting operations.

[0062] Furthermore, two slide bars 423 are provided on the base 421, and the two slide bars 423 are respectively provided on both sides of the voice coil motor 422, and the driving rod 424 is simultaneously sleeved on the two slide bars 423. By providing two slide bars 423, the stability of the driving rod 424 when moving in the longitudinal direction can be further improved. When the voice coil motor 422 reciprocates at a high frequency, the shaking of the driving rod 424 is small, so that the ink guide wire 426 can reciprocate stably in a straight line in the ink outlet tube 4251, so as to achieve accurate dotting of defective chips on the wafer.

[0063] In a further embodiment, a spring is connected between the slide bar 423 and the driving rod 424. By sleeved on the slide bar 423, when the voice coil motor 422 pulls the driving rod 424 to move downward, the spring can make the driving rod 424 move more smoothly and softly; when the voice coil motor 422 pushes the driving rod 424 to move upward to reset, the spring can also push the driving rod 424 to move upward.

[0064] Furthermore, the dotting device 420 also includes an adjustment component, which includes two sliders 427 that can be slidably adjusted in the longitudinal direction, and the seat body 421 is fixedly arranged on one of the sliders 427. Specifically, an adjustment plate 4291 is arranged on one of the sliders 427, and an adjustment slot is arranged on the adjustment plate 4291 in the longitudinal direction, and an adjustment screw 4292 is rotatably arranged on the other slider 427, and the adjustment screw 4292 is inserted into the adjustment slot and the nut can abut against the adjustment plate 4291. In this way, when the relative position of the two sliders 427 needs to be adjusted, the adjustment screw 4292 is first loosened and then the two sliders 427 are pushed to move relative to each other, thereby achieving position adjustment.

[0065] Furthermore, a fine adjustment mechanism 428 is provided between the two sliders 427, and the fine adjustment mechanism 428 includes an adjusting screw 4281 provided on one of the sliders 427 and an abutment block 4282 fixedly provided on the other slider 427, and the bottom of the adjusting screw 4281 abuts against the abutment block 4282. Specifically, a fine adjustment scale is provided on the adjusting screw 4281, and by turning the adjusting screw 4281, the abutment block 4282 is pushed to move longitudinally, so that the abutment block 4282 pushes one of the sliders 427 to move relative to the other slider 427. In this way, high-precision fine adjustment between the two sliders 427 can be achieved, so that the distance between the bottom end of the ink guide wire 426 and the upper surface of the wafer can be fine-tuned in real time according to the thickness of the wafer.

[0066] It is understandable that in the actual fine-tuning process, the adjusting screw 4292 is first loosened to release the two sliders 427 from the locked state, and then the adjusting screw 4281 is turned to push the abutment block 4282 so that the abutment block 4282 drives one of the sliders 427 to move relative to the other slider 427, thereby achieving fine-tuning.

[0067] refer to Figure 1 to Figure 2 and Figure 7 On the basis of any of the above embodiments, the loading and pushing mechanism 600 includes a pushing tray assembly 610 and a loading platform assembly 620 arranged at one end of the pushing tray assembly 610; the pushing tray assembly 610 includes a second linear mechanism and a material tray arranged on the second linear mechanism; the loading platform assembly 620 includes a positioning frame 621, and blowing devices 622 arranged in a circular array on the positioning frame 621, and each blowing device 622 is used to blow air toward the center of the positioning frame 621.

[0068] It should be understood that a positioning space for accommodating a whole wafer is enclosed in the positioning frame 621, and the diameter of the positioning space is larger than the diameter of the tray. At the same time, it should also be understood that since the wafers are relatively thin, when stacking the wafers, two adjacent wafers are very likely to be pressed together and adsorbed together under the action of pressure, making it difficult to separate the two wafers. Therefore, a blowing device 622 is provided on the positioning frame 621, and the blowing device 622 blows toward the center of the positioning frame 621 to separate the two wafers that are adsorbed and pressed together.

[0069] The material tray is used to receive the wafer stack to be inspected delivered from the external transfer mechanism. The second linear mechanism is used to move the material tray to the positioning space on the positioning frame 621, and then the suction device 720 sucks a single wafer above the material tray; after the suction is completed, each blowing device 622 on the positioning frame 621 blows toward the center of the positioning frame 621 (that is, blows toward the wafer sucked by the suction device 720) to separate at least two mutually adsorbed wafers sucked by the suction device 720 to ensure that the suction device 720 only sucks one wafer at a time.

[0070] In some embodiments, a gantry is provided on the frame 100, the gantry spans across the first linear mechanisms 110, and the first transfer mechanism 310, the second transfer mechanism 410, and the third transfer mechanism 710 are all provided on the gantry. In this way, the first linear mechanism 110, the first transfer mechanism 310, the second transfer mechanism 410, and the third transfer mechanism 710 are all provided on the gantry, which can make assembly simpler and facilitate inspection and maintenance.

[0071] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A wafer testing machine, characterized in that: include: frame; At least one first linear mechanism disposed on the frame; A wafer carrying mechanism, slidably disposed on the first linear mechanism, comprising a slide table, a rotatable test table both disposed on the slide table, and a dotting and drying table disposed on one side of the test table; A testing mechanism, arranged on the frame, comprising a first transfer mechanism arranged across the first linear mechanism and a testing device arranged on the first transfer mechanism; A dotting mechanism, arranged on the frame, comprising a second transfer mechanism arranged across the first linear mechanism and a dotting device arranged on the second transfer mechanism; A drying and heating mechanism, which is arranged on the frame and located at one end of the first linear mechanism, wherein a heating chamber for accommodating the dotting and drying table is arranged, and a heat source is arranged in the heating chamber; A loading and pushing mechanism, arranged on one side of the first linear mechanism, for carrying the wafer to move to the loading position; A suction mechanism is arranged on the frame, comprising a third transfer mechanism arranged across the first linear mechanism and a suction device and a visual device arranged on the third transfer mechanism; the suction mechanism is used to detect the angle of the wafer at the loading position, suck the wafer from the loading and pushing mechanism, and suck the wafer to move between the test table and the dotting and drying table.

2. The wafer testing machine according to claim 1, wherein: There is a gap between the dotting and drying table and the testing table, and / or the dotting and drying table and the testing table are arranged at the same height.

3. The wafer testing machine according to claim 1 or 2, characterized in that: The testing table and the dotting and drying table are both provided with vacuum adsorption holes.

4. The wafer testing machine according to claim 1, wherein: The drying and heating mechanism includes a lifting mechanism, and the heat source and the heating chamber are both arranged on the lifting mechanism; the drying and heating mechanism includes a drying platform and a cover body, and the heat source is fixedly arranged on the cover body; the drying platform and the cover body are both independently arranged on the lifting mechanism so as to be able to be lifted and lowered independently, and the drying platform and the cover body form the heating chamber when they are close to each other and closed.

5. The wafer testing machine according to claim 1 or 4, characterized in that: The heat source is a hot air device, and the blowing direction of the hot air device is from top to bottom.

6. The wafer testing machine according to claim 1, wherein: The dotting device includes a base body and a voice coil motor arranged on the base body, a sliding rod is arranged on the base body and at least on one side of the voice coil motor, a driving rod connected to the voice coil motor is sleeved on the sliding rod, an ink fountain is arranged on the base body, and an ink outlet tube is arranged at the bottom of the ink fountain; an ink guide wire is fixedly arranged on the driving rod, the ink guide wire is partially located in the ink fountain and its bottom is penetrated by the ink outlet tube.

7. The wafer testing machine according to claim 6, characterized in that: The dotting device also includes an adjustment component, which includes two sliders that can be slid and adjusted along the longitudinal direction, and the seat body is fixedly set on one of the sliders; an adjustment plate is set on the side of one of the sliders, and an adjustment groove is set on the adjustment plate along the longitudinal direction; an adjustment screw is set on the side of the other slider, and the adjustment screw is passed through the adjustment groove.

8. The wafer testing machine according to claim 7, wherein: A fine-tuning mechanism is arranged between the two sliders, and the fine-tuning mechanism comprises an adjusting screw arranged on one of the sliders and an abutting block fixedly arranged on the other slider, and the bottom of the adjusting screw abuts against the abutting block.

9. The wafer testing machine according to any one of claims 1, 2, 4, 6 to 8, characterized in that: The feeding and pushing mechanism includes a pushing tray assembly and a feeding platform assembly arranged at one end of the pushing tray assembly; the pushing tray assembly includes a second linear mechanism and a material tray arranged on the second linear mechanism; the feeding platform assembly includes a positioning frame and a blowing device arranged in a circular array on the positioning frame.

10. The wafer testing machine according to any one of claims 1, 2, 4, 6 to 8, characterized in that: A gantry is arranged on the frame, and the gantry spans across each of the first linear mechanisms. The first transfer mechanism, the second transfer mechanism and the third transfer mechanism are all arranged on the gantry.

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